- All sections
- H - Electricity
- H05K - Printed circuitscasings or constructional details of electric apparatusmanufacture of assemblages of electrical components
- H05K 5/06 - Hermetically-sealed casings
Patent holdings for IPC class H05K 5/06
Total number of patents in this class: 2560
10-year publication summary
|
180
|
200
|
219
|
256
|
253
|
208
|
182
|
191
|
171
|
171
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Samsung Electronics Co., Ltd. | 148584 |
196 |
| Robert Bosch GmbH | 42941 |
74 |
| Nitto Denko Corporation | 8350 |
54 |
| Hitachi Astemo, Ltd. | 6378 |
39 |
| Apple Inc. | 55916 |
37 |
| Kyocera Corporation | 14013 |
35 |
| Mitsubishi Electric Corporation | 46757 |
34 |
| Sumitomo Wiring Systems, Ltd. | 10518 |
28 |
| Huawei Technologies Co., Ltd. | 114984 |
27 |
| TouchTunes Music Company, LLC | 208 |
24 |
| Yazaki Corporation | 6750 |
23 |
| Medtronic, Inc. | 9849 |
22 |
| Hitachi Automotive Systems, Ltd. | 3955 |
21 |
| Continental Automotive GmbH | 4752 |
20 |
| TreeFrog Developments, Inc. | 95 |
20 |
| Siemens AG | 24363 |
19 |
| Denso Corporation | 24663 |
18 |
| Murata Manufacturing Co., Ltd. | 24907 |
18 |
| Mitsubishi Electric Mobility Corporation | 1093 |
17 |
| LG Electronics Inc. | 73818 |
16 |
| Other owners | 1818 |