- All sections
- H - Electricity
- H05K - Printed circuitscasings or constructional details of electric apparatusmanufacture of assemblages of electrical components
- H05K 5/06 - Hermetically-sealed casings
Patent holdings for IPC class H05K 5/06
Total number of patents in this class: 2616
10-year publication summary
|
200
|
219
|
256
|
253
|
208
|
182
|
191
|
173
|
192
|
43
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Samsung Electronics Co., Ltd. | 152716 |
205 |
| Robert Bosch GmbH | 43449 |
74 |
| Nitto Denko Corporation | 8434 |
54 |
| Hitachi Astemo, Ltd. | 6398 |
39 |
| Apple Inc. | 57718 |
37 |
| Mitsubishi Electric Corporation | 47483 |
35 |
| Kyocera Corporation | 14215 |
35 |
| Huawei Technologies Co., Ltd. | 119240 |
29 |
| Sumitomo Wiring Systems, Ltd. | 10735 |
27 |
| TouchTunes Music Company, LLC | 210 |
24 |
| Yazaki Corporation | 6907 |
23 |
| Medtronic, Inc. | 9780 |
22 |
| Hitachi Automotive Systems, Ltd. | 3954 |
21 |
| TreeFrog Developments, Inc. | 95 |
20 |
| Siemens AG | 24299 |
19 |
| Denso Corporation | 25099 |
19 |
| Continental Automotive GmbH | 4647 |
19 |
| Murata Manufacturing Co., Ltd. | 25398 |
18 |
| Mitsubishi Electric Mobility Corporation | 1123 |
17 |
| LG Electronics Inc. | 74757 |
16 |
| Other owners | 1863 |