- All sections
- H - Electricity
- H05K - Printed circuitscasings or constructional details of electric apparatusmanufacture of assemblages of electrical components
- H05K 7/04 - Arrangements of circuit components or wiring on supporting structure on conductive chassis
Patent holdings for IPC class H05K 7/04
Total number of patents in this class: 343
10-year publication summary
|
29
|
19
|
38
|
33
|
57
|
12
|
5
|
4
|
4
|
0
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Samsung Electronics Co., Ltd. | 153573 |
16 |
| Samsung Display Co., Ltd. | 37753 |
10 |
| LG Electronics Inc. | 74953 |
10 |
| Mitsubishi Electric Corporation | 47556 |
9 |
| Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | 5455 |
9 |
| Wistron Corporation | 2397 |
8 |
| Boe Technology Group Co., Ltd. | 42901 |
8 |
| Apple Inc. | 58049 |
6 |
| LG Display Co., Ltd. | 14241 |
5 |
| Canon Inc. | 42224 |
4 |
| Hon Hai Precision Industry Co., Ltd. | 4015 |
4 |
| Robert Bosch GmbH | 43554 |
4 |
| Yazaki Corporation | 6952 |
4 |
| Shenzhen China Star Optoelectronics Technology Co., Ltd. | 8474 |
4 |
| Motorola Mobility LLC | 2777 |
4 |
| Hewlett Packard Enterprise Development LP | 10864 |
4 |
| Toshiba Client Solutions Co., Ltd | 508 |
4 |
| Eaton Intelligent Power Limited | 6154 |
4 |
| Sumitomo Electric Industries, Ltd. | 16071 |
3 |
| Denso Corporation | 25165 |
3 |
| Other owners | 220 |