- All sections
- H - Electricity
- H05K - Printed circuitscasings or constructional details of electric apparatusmanufacture of assemblages of electrical components
- H05K 7/12 - Resilient or clamping means for holding component to structure
Patent holdings for IPC class H05K 7/12
Total number of patents in this class: 644
10-year publication summary
|
58
|
57
|
54
|
57
|
45
|
38
|
29
|
37
|
21
|
4
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Mitsubishi Electric Corporation | 44904 |
22 |
| Sumitomo Wiring Systems, Ltd. | 10025 |
20 |
| Samsung Electronics Co., Ltd. | 139302 |
19 |
| Hewlett-Packard Development Company, L.P. | 27447 |
14 |
| Sumitomo Electric Industries, Ltd. | 14990 |
12 |
| AutoNetworks Technologies, Ltd. | 6332 |
12 |
| Shenzhen China Star Optoelectronics Technology Co., Ltd. | 8482 |
10 |
| Plum Laboratories, Inc. | 29 |
10 |
| Apple Inc. | 52845 |
9 |
| Yazaki Corporation | 6479 |
9 |
| Panasonic Intellectual Property Management Co., Ltd. | 29800 |
9 |
| Wistron Corporation | 2340 |
9 |
| Denso Corporation | 23803 |
8 |
| Huawei Technologies Co., Ltd. | 106915 |
8 |
| Murata Manufacturing Co., Ltd. | 23743 |
8 |
| Hewlett Packard Enterprise Development LP | 10650 |
8 |
| Dell Products L.P. | 13117 |
7 |
| Shinko Electric Industries Co., Ltd. | 1185 |
7 |
| Ademco Inc. | 1406 |
7 |
| Intel Corporation | 46153 |
6 |
| Other owners | 430 |