A method for separating a semiconductor component from a carrier, the semiconductor component being held in a material-bonded manner in a connection plane on a carrier by a metalliferous connective agent. The connective agent is liquified and the semiconductor component is taken hold of by a holding tool. The holding tool is oscillated. The holding tool is displaced and the semiconductor component is separated from the carrier. Furthermore, a device for separating a semiconductor component held in a material-bonded manner on a carrier by a connective agent, in which the device comprises a holding tool and at least one drive.
A method of increasing a volume and a height of a solder bump present on a contact pad of a substrate is provided, including the steps: a) placing a solder ball having a predetermined volume in a capillary which is placed over the solder bump, b) liquefying the solder ball by applying laser energy from the laser source to the solder ball through the capillary, c) ejecting the liquefied solder ball from the capillary onto the solder bump by applying pressurized gas to the liquefied solder ball through the capillary, and d) melting the solder bump by transferring thermal and kinetic energy to the solder bump from the ejected liquefied solder ball and merging the liquefied solder ball with the melted solder bump.
A method of forming a plurality of solder contact pins on a contact pad layout of a substrate including the steps of arranging a plurality of first solder balls at an arranging layout of a transporting tool, the arranging layout of the transporting tool corresponding to the contact pad layout of the substrate, placing the transporting tool opposite the substrate such that the plurality of first solder balls is associated with the plurality of contact pads, melting the plurality of first solder balls and releasing the plurality of first solder balls to the plurality of contact pads so as to form a plurality of solder bumps arranging a plurality of second solder balls at the arranging positions and releasing the plurality of second solder balls from the transporting tool so as to form a plurality of monolithic solder contact pins on the plurality of contact pads.
A method and device for producing contact metallizations on terminal faces of wafers by a manipulator unit for handling the wafers and a plurality of work stations each having a processing space for receiving the wafers, the plurality of work stations including a depositing station, which has a processing space for receiving a solution of contact metal dissolved in a carrier liquid for deposition on the terminal faces of the wafers, detecting a measured value of an object property of a wafer or of a work station by a sensor, and determining a prioritization of equipping the processing spaces or a dwell time of the wafers in a processing space by querying the measured value in a databank or by means of inference using a statistic model while entering the measured value, generating a control dataset for the manipulator unit; and handling the wafers according to the control dataset.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
A bonding head for holding a substrate to be soldered includes a laser source, a vacuum source, a main body and a holding nozzle. A laser duct extends through the main body to a laser exit. The vacuum source creates a vacuum in the laser duct. The laser source directs the laser beam through the laser duct towards the laser exit. The holding nozzle is connected to the main body. A nozzle duct extends through the holding nozzle from a nozzle entry to a nozzle exit. The nozzle entry is adjacent to the laser exit. The holding nozzle is configured to hold the substrate at the nozzle exit when the vacuum source creates the vacuum in the laser duct. The laser beam passes through the nozzle duct and is directed towards the substrate. The holding nozzle is configured to hold the substrate over a mounting face of a second substrate.
B23K 26/04 - Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
B23K 26/14 - Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beamNozzles therefor
H01L 23/00 - Details of semiconductor or other solid state devices
6.
RINSING STATION AND DEVICE FOR PRODUCING CONTACT METALLIZATIONS
A rinsing station (10) includes a basin (12) forming a processing chamber (11) and serving to receive a rinsing liquid, in particular containing deionized water, for rinsing a wafer (14) receivable in the processing chamber, the basin having at least one inlet (15) for feeding the rinsing liquid into the basin. The inlet is designed as a nozzle arrangement (16), the nozzle arrangement having at least one nozzle (17) by means of which the rinsing liquid can be applied being directed onto the wafer, the nozzle being designed as a fan nozzle or a full-cone nozzle or a hollow-cone nozzle.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
7.
Apparatus and Method for Establishing a Contact Connection
An apparatus and method for establishing a contact connection between at least one connection contact of a substrate and at least one connection contact of a semiconductor component, a conductor material web being formed on the substrate and the semiconductor component. The apparatus includes a joining tool for positioning and joining the semiconductor component on/to the substrate, a beam channel for optical radiation being formed within the joining tool, a laser device for applying laser radiation to the substrate and/or to the semiconductor component, a detection device for detecting optical radiation, and a substrate receptacle on which the substrate is fixed in place and with which at least one underside of the substrate can be brought into contact. An optical window having an optically transparent window body is incorporated in the substrate receptacle for the unobstructed passage of optical radiation into and/or out of the substrate, the optical window being disposed in a beam path of the laser device and/or in a beam path of the detection device.
A method for electrically contacting terminal faces of two substrates, the first substrate being positioned against the terminal faces of the second substrate, and a first laser radiation being applied to at least one of the substrates on the rear side in a first application phase, and a second laser radiation being applied to at least one of the substrates in a second application phase and a solder material arranged between the substrates being fused to establish an electrical contact between the terminal faces of the substrates, and the application in the first application phase being carried out with a first laser radiation, which has a wavelength that differs from the second laser radiation, and the switch from the first application phase to the second application phase being controlled by a control device A laser arrangement for applying laser energy to at least one substrate is proposed.
An apparatus for repairing a test-contact arrangement includes: a movable arm at whose end effector at least one heat-conductive receptacle is formed, at which a heat-absorption surface is formed; a control device configured for controlling a movement of the arm; a heating device configured for heating the heat-absorption surface; and a temperature measuring device configured for measuring a radiation temperature of a solder material of the solder connection. The receptacle is configured for receiving at least one heat-conductive blade element, and the control device is configured for moving the blade element via a movement of the arm in relation to the test-contact arrangement to sever the at least one solder connection so that at least one solder bridge to be repaired is removable.
A package comprises at least two contacts for microtechnology, the contacts each having a contact surface, the contacts being connected to at least one support structure and the contacts being spaced apart from each other and disposed in such a manner that the contact surfaces are disposed in one plane and are oriented in the same direction. The support structure is made of a connective material being separable and/or destroyable by a laser. Furthermore, a method for handling such a package and a tool for implementing such a method are provided.
H01R 43/02 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
A method for soldering an electronic component to a circuit board involves jetting liquefied solder. A laser beam melts a solid solder ball to produce a liquefied solder ball before the ball is jetted. The liquefied solder ball is jetted towards a through hole in the circuit board such that a portion of the liquefied solder ball flows into an annular gap between a pin and sides of the through hole. The pin is attached to the electronic component and passes through the through hole. As the liquefied solder ball is jetted towards the through hole, the laser beam is directed at the ball so as to keep it liquefied. How much of the solder ball remains outside the through hole after liquefied solder has flowed into the annular gap is determined. The filling degree of the annular gap is determined based on how much solder remains outside the hole.
B23K 31/12 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to investigating the properties, e.g. the weldability, of materials
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
TEST CONTACT, TABLE DEVICE, TEST CONTACT HOLDING DEVICE, AND METHOD FOR RECEIVING A TEST CONTACT IN A SIMPLIFIED MANNER WITH AN ACTIVE PRE-ALIGNMENT PROCESS USING ELECTROMAGNETIC MANIPULATION
The invention relates to a test contact (10) comprising a contact tip (11) and a contact body (12). The test contact (10) has an alignment direction (13), and the test contact (10) comprises a core (14) made of a ferromagnetic material. The core is arranged below the center of gravity (15) of the test contact (10) in the alignment direction (13). The invention additionally relates to a table device (20) for handling a test contact (10), to a method for handling a test contact (10) by means of the table device (20), to a test contact holding device comprising a test contact receiving area (40) for handling a test contact (10), and to a method for handling a test contact (10) by means of the test contact holding device comprising the test contact receiving area (40).
A bonding head for holding a substrate to be soldered includes a laser source, a vacuum source, a main body and a holding nozzle. A laser duct extends through the main body to a laser exit. The vacuum source creates a vacuum in the laser duct. The laser source directs the laser beam through the laser duct towards the laser exit. The holding nozzle is connected to the main body. A nozzle duct extends through the holding nozzle from a nozzle entry to a nozzle exit. The nozzle entry is adjacent to the laser exit. The holding nozzle is configured to hold the substrate at the nozzle exit when the vacuum source creates the vacuum in the laser duct. The laser beam passes through the nozzle duct and is directed towards the substrate. The holding nozzle is configured to hold the substrate over a mounting face of a second substrate.
B23K 37/00 - Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
B23K 37/04 - Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
B23Q 3/08 - Work-clamping means other than mechanically-actuated
A device for handling a test contact in which the device includes a contact head provided with a test contact receptacle at its contact end, the test contact receptacle having a positioning unit having at least two, preferably three, positioning surfaces for coming into positioning contact with a test contact and for positioning the test contact relative to the contact end of the contact head. The at least one positioning surface of the positioning unit being formed as a base contact surface and at least one more positioning surface of the positioning unit being formed as an edge contact surface. Furthermore, a manufacturing system is also provided for manufacturing a test contact arrangement for testing semiconductor components.
A chip comprising a non-conductive substrate layer and at least one conductor path disposed on the substrate layer, the solder contact surface being at least partially formed on the conductor path, and a method for producing the solder contact surface on the chip including the steps of: applying a sinter paste to a contact location at least partially located on the conductor path, the sinter paste comprising particles of at least one soft-solderable and conductive material and at least one solvent; and evaporating the solvent.
A soldering apparatus includes an application device, a conveying device and an application nozzle. The application device has a laser duct extending straight from a laser entry at the top to a laser exit at the bottom and a drop duct that extends from a drop entry at the top to a drop exit at the bottom of the application device. The conveying device separately conveys solder bodies to the drop entry. The application nozzle temporarily holds solder bodies received from the drop exit. The laser and drop ducts are interconnected over their entire lengths from the top to the bottom of the application device. The drop entry and laser entry are side by side and form a common entry. The drop exit and laser exit are spatially coincident and form a common exit that is smaller than the common entry. The application nozzle is connected to the common exit.
The invention relates to a depositing station comprising a basin arrangement (11) having a basin (13) forming a processing chamber (12) and serving to receive a solution of a metal, in particular nickel, zinc, palladium, gold or the like, dissolved in a liquid, for a, preferably electroless, deposition on an object receivable in the processing chamber, in particular on a terminal face of a wafer receivable in the processing chamber, the basin having at least one inlet (17) for introducing the solution into the basin, the basin having a perforation (18) which forms at least part of the inlet of the basin and which is configured to homogeneously introduce the solution into the processing chamber. Furthermore, the invention relates to a device for producing contact metallizations on terminal faces of wafers, comprising at least one depositing station.
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
18.
METHOD AND DEVICE FOR SEPARATING A SEMICONDUCTOR COMPONENT FROM A CARRIER
The invention relates to a method for separating a semiconductor component (21) from a carrier (22), wherein the semiconductor component (21) is integrally bondedly held in a bonding plane (24) on a carrier (22) by means of a metal-containing bonding medium (23), comprising the following steps: a. liquefying the bonding medium (23) and taking hold of the semiconductor component (21) by means of a holding tool (11); b. oscillating the holding tool (11); and c. moving the holding tool (11) and separating the semiconductor component (21) from the carrier (22). Furthermore, the invention relates to a device (10) for separating a semiconductor component (21) integrally bondedly held on a carrier (22) by means of a bonding medium (23), comprising a holding tool (11) and at least one drive.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
19.
DEVICE AND METHOD FOR ESTABLISHING A CONTACT CONNECTION
The invention relates to a device (01) for establishing a contact connection between at least one connection contact (18) of a substrate (04) and at least one connection contact (19) of a semiconductor component (03), wherein a conductor material path is formed on the substrate (04) and the semiconductor component (03) is preferably a chip. The device has a joining tool (02) for positioning and joining the semiconductor component (03) on/to the substrate (04), a beam channel (20) for optical radiation being formed inside the joining tool (02), and has a laser apparatus (07) for applying laser radiation to the substrate (04) and/or the semiconductor component (03), and has a detection apparatus (14, 17) for detecting optical radiation, and has a substrate support (05) on which the substrate (04) can be fixed in place and with which at least one bottom side (41) of the substrate (04) can be brought into contact. An optical window (06) having an optically transparent window body is incorporated in the substrate support (05) for the unobstructed passage of optical radiation into and/or out of the substrate (04), wherein the optical window (06) is located in a beam path (10) of the laser apparatus (07) and/or in a beam path (15, 16) of the detection apparatus (14, 17). The invention further relates to a method for establishing a contact connection between at least one connection contact (18) of a conductor material path and at least one connection contact (19) of a semiconductor component (03), in particular a chip.
B23K 26/03 - Observing, e.g. monitoring, the workpiece
H01R 43/02 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
A method for forming a contact connection between a chip-and a conductor material formed on a non-conductive substrate, the chip being arranged on the substrate or on another conductor material track, a sinter paste consisting of at least 40% silver or copper being applied to respective chip contact surfaces of the chip and the conductor material track, a contact conductor being immersed in the sinter paste on the chip contact surface and in the sinter paste on the conductor material track, and the contact connection being formed by sintering the sinter paste by means of laser energy.
A method for electrolessly depositing a metal layer onto a substrate, including the following chronological steps:
a) treating the substrate surface to be plated with an etching solution;
b) treating the substrate surface to be plated with a polyelectrolyte or an organosilane compound;
c) treating the surface to be plated with a solution containing metal particles;
d) treating the surface to be plated with a solution containing at least one salt of the metal to be deposited onto the substrate.
The invention relates to a device for repairing a test contact assembly, comprising a test contact carrier (14) and a plurality of test contacts (16), which are arranged spaced apart from one another on at least one contact surface (18) of the test contact carrier (4) and of which at least two are connected by at least one solder connection (22) via a solder bridge to be repaired, wherein the device comprises the following: a moving cantilever arm (24) with at least one heat-conducting receiving means (28) on the end effector (26) thereof, on which a heat absorption surface (30) is formed; a control unit (32) which is designed to control a movement of the cantilever arm (24); a heating unit (34) which is designed to heat the heat absorption surface (30); and a temperature measuring unit (36) which is designed to measure a radiation temperature of a solder material of the solder connection (22), wherein the receiving means (28) is designed to receive at least one heat-conductive blade element (40), and the control unit (32) is designed to move the blade element (40) via a movement of the cantilever arm (24) relative to the test contact assembly, in order to cut through the at least one solder connection (22) such that the at least one solder bridge to be repaired can be removed.
A laser soldering system and a method for monitoring a laser soldering process by means of a monitoring device of the laser soldering system, wherein a solder ball is dispensed onto a solderable surface of a substrate by means of a solder ball feeding device of the laser soldering system, wherein the solder ball is at least partially melted by means of a laser device of the laser soldering system, wherein, during the laser soldering process, a light signal is formed which is detected by means of an optical detection unit of the monitoring device, wherein the light signal is dispersed into a spectrum of the light signal by means of a spectroscope device of the monitoring device, wherein the spectrum is analyzed by means of a processing device of the monitoring device, and it is identified on the basis of a composition of the spectrum whether or not a burning of the substrate has occurred during the laser soldering process.
G01N 21/71 - Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light thermally excited
G01N 21/84 - Systems specially adapted for particular applications
G01N 21/88 - Investigating the presence of flaws, defects or contamination
06 - Common metals and ores; objects made of metal
07 - Machines and machine tools
40 - Treatment of materials; recycling, air and water treatment,
42 - Scientific, technological and industrial services, research and design
Goods & Services
Contact metallizations for micro compounds made from
soldering material, insofar as included in this class. Machines, in particular automatic machines, regarding micro
periphery; machines, in particular automatic machines, for
the application of connecting material on substrates;
machines, in particular automatic machines, for producing
micro compounds, in particular for forming substrate units
from one or more substrates, in particular chips, combined
to a module. Material processing of substrates used in the field of
microelectronics, in particular semiconductor substrates and
flexible substrates. Development of contact metallizations for connection
technology; development of connecting technologies for
producing micro compounds; technological consultancy, in
particular regarding the production of micro compounds.
06 - Common metals and ores; objects made of metal
07 - Machines and machine tools
40 - Treatment of materials; recycling, air and water treatment,
42 - Scientific, technological and industrial services, research and design
Goods & Services
Contact metallizations for micro compounds made from
soldering material, insofar as included in this class. Machines, in particular automatic machines, regarding micro
periphery; machines, in particular automatic machines, for
the application of connecting material on substrates;
machines, in particular automatic machines, for producing
micro compounds, in particular for forming substrate units
from one or more substrates, in particular chips, combined
to a module. Material processing of substrates used in the field of
microelectronics, in particular semiconductor substrates and
flexible substrates. Development of contact metallizations for connection
technology; development of connecting technologies for
producing micro compounds; technological consultancy, in
particular regarding the production of micro compounds.
06 - Common metals and ores; objects made of metal
07 - Machines and machine tools
40 - Treatment of materials; recycling, air and water treatment,
42 - Scientific, technological and industrial services, research and design
Goods & Services
Contact metallizations for micro compounds made from
soldering material, insofar as included in this class. Machines, in particular automatic machines, regarding micro
periphery; machines, in particular automatic machines, for
the application of connecting material on substrates;
machines, in particular automatic machines, for producing
micro compounds, in particular for forming substrate units
from one or more substrates, in particular chips, combined
to a module. Material processing of substrates used in the field of
microelectronics, in particular semiconductor substrates and
flexible substrates. Development of contact metallizations for connection
technology; development of connecting technologies for
producing micro compounds; technological consultancy, in
particular regarding the production of micro compounds.
06 - Common metals and ores; objects made of metal
07 - Machines and machine tools
40 - Treatment of materials; recycling, air and water treatment,
42 - Scientific, technological and industrial services, research and design
Goods & Services
Contact metallizations for micro compounds made from
soldering material, insofar as included in this class. Machines, in particular automatic machines, regarding micro
periphery; machines, in particular automatic machines, for
the application of connecting material on substrates;
machines, in particular automatic machines, for producing
micro compounds, in particular for forming substrate units
from one or more substrates, in particular chips, combined
to a module. Material processing of substrates used in the field of
microelectronics, in particular semiconductor substrates and
flexible substrates. Development of contact metallizations for connection
technology; development of connecting technologies for
producing micro compounds; technological consultancy, in
particular regarding the production of micro compounds.
28.
Press-forming device for depositing solder and producing individual solder bodies
A press-forming device for forming individual solder bodies from a wire of soldering material includes a press-forming mechanism and a separation means. The press-forming mechanism forms a continuous strand of preformed solder sections from the wire by using two notched rollers that rotate in opposite directions and that press opposite notches into the wire. The preformed solder sections are disposed equidistantly along the strand and are connected to each other by connecting links disposed at the notches. The separation means forms individual solder bodies by separating the preformed solder sections one by one at the connecting links. The separation means separates individual preformed solder sections using a cutting mechanism that moves in a direction perpendicular to the length direction of the strand. Individual solder bodies are transported to a solder jetting section where they are liquefied by a laser beam and jetted from the solder jetting section by gas pressure.
B23K 31/12 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to investigating the properties, e.g. the weldability, of materials
29.
Laser-assisted soldering apparatus and solder deposition machine
A laser-assisted soldering apparatus includes a solder jetting section and a laser coupling unit. The solder jetting section includes a jetting nozzle and a solder body holding capillary adapted to hold a solder body that is being liquefied by a laser beam. The laser coupling unit includes an optical window, a laser entry, a laser passage, a fastening section, and a laser exit. The laser passage extends from the laser entry to the laser exit and is aligned with the solder body holding capillary. The optical window is transparent to the laser beam. The fastening section is fastened to the solder jetting section. A first pressure gas feeding passage merges into the laser passage between the optical window and the fastening section. The solder jetting section includes a second pressure gas feeding passage that merges into the solder body holding capillary between the laser exit and the jetting nozzle.
06 - Common metals and ores; objects made of metal
07 - Machines and machine tools
40 - Treatment of materials; recycling, air and water treatment,
42 - Scientific, technological and industrial services, research and design
Goods & Services
Soldering materials in the nature of soft solder, solder wire and solder balls for the contact metallization for micro compounds Automatic machines, namely, automatic soldering machines with respect to micro periphery; machines, namely, automatic soldering machines, for the application of connecting material on substrates; machines, namely, automatic soldering machines, for producing micro compounds, in particular for forming substrate units from one or more substrates, specifically being chips, combined to a module Material processing, namely, jointing, in particular soldering, laser soldering, welding, glueing of substrates used in the field of microelectronics, in particular semiconductor substrates and flexible substrates; metallization of contacts for producing micro compounds made of soldering material Development of contact metallization technology for connection technology; development of connecting technologies for producing micro compounds; technological consultancy in the field of the production of micro compounds
06 - Common metals and ores; objects made of metal
07 - Machines and machine tools
40 - Treatment of materials; recycling, air and water treatment,
42 - Scientific, technological and industrial services, research and design
Goods & Services
Soldering materials in the nature of soft solder, solder wire and solder balls for the contact metallization for micro compounds Automatic machines, namely, automatic solder placing and solder ball placing machines with respect to micro periphery; machines, namely, automatic solder placing and solder ball placing machines, for the application of connecting material on substrates; machines, namely, automatic solder placing and solder ball placing machines, for producing micro compounds, in particular for forming substrate units from one or more substrates, specifically being chips, combined to a module Material processing, namely, jointing, in particular soldering, laser soldering, welding, glueing of substrates used in the field of microelectronics, in particular semiconductor substrates and flexible substrates; metallization of contacts for producing micro compounds made of soldering material Development of contact metallization technology for connection technology; development of connecting technologies for producing micro compounds; technological consultancy in the field of the production of micro compounds
40 - Treatment of materials; recycling, air and water treatment,
42 - Scientific, technological and industrial services, research and design
Goods & Services
Automatic machines, namely automatic plating machines with respect to micro periphery; machines, namely, automatic plating machines, for the application of connecting material on substrates; machines, namely, automatic plating machines, for producing micro compounds, in particular for forming substrate units from one or more substrates, specifically being chips, combined to a module Material processing, namely, jointing, in particular soldering, laser soldering, welding, glueing of substrates used in the field of microelectronics, in particular semiconductor substrates and flexible substrates; metallization of contacts for producing micro compounds made of soldering material Development of contact metallization technology for connection technology; development of connecting technologies for producing micro compounds; technological consultancy in the field of the production of micro compounds
06 - Common metals and ores; objects made of metal
07 - Machines and machine tools
40 - Treatment of materials; recycling, air and water treatment,
42 - Scientific, technological and industrial services, research and design
Goods & Services
Soldering materials in the nature of soft solder, solder wire and solder balls for the contact metallization for micro compounds Automatic machines, namely, automatic bonding machines with respect to micro periphery; machines, namely, automatic bonding machines, for the application of connecting material on substrates; machines, namely, automatic bonding machines, for producing micro compounds, in particular for forming substrate units from one or more substrates, specifically being chips, combined to a module Material processing, namely, jointing, in particular soldering, laser soldering, welding, glueing of substrates used in the field of microelectronics, in particular semiconductor substrates and flexible substrates; metallization of contacts for producing micro compounds made of soldering material Development of contact metallization technology for connection technology; development of connecting technologies for producing micro compounds; technological consultancy in the field of the production of micro compounds
34.
Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole
A method for soldering an electronic component to a circuit board involves jetting liquefied solder. A laser beam melts a solid solder ball to produce a liquefied solder ball before the ball is jetted. The liquefied solder ball is jetted towards a through hole in the circuit board such that a portion of the liquefied solder ball flows into an annular gap between a pin and sides of the through hole. The pin is attached to the electronic component and passes through the through hole. As the liquefied solder ball is jetted towards the through hole, the laser beam is directed at the ball so as to keep it liquefied. How much of the solder ball remains outside the through hole after liquefied solder has flowed into the annular gap is determined. The filling degree of the annular gap is determined based on how much solder remains outside the hole.
B23K 1/00 - Soldering, e.g. brazing, or unsoldering
B23K 31/00 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups
B23K 31/12 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to investigating the properties, e.g. the weldability, of materials
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
A plating bath for electroless plating of a substrate with nickel. The plating bath includes a nickel ion source and a stabilizing system comprising an iodate ion source and a heavy metal ion source. The substrate can be a copper or aluminum substrate.
A device for removing a defective electronic component from a circuit board includes a vacuum suction nozzle, a laser beam emitter and an infrared temperature sensor. The vacuum suction nozzle has a suction opening at which suction is generated. The suction opening is dimensioned to be larger than the defective electronic component. The laser beam emitter is oriented so as to emit a laser beam out the suction opening towards the electronic component on the circuit board. The temperature sensor measures the temperature of the electronic component based on infrared radiation emitted from around the electronic component. A method for removing the defective electronic component from the circuit board includes positioning the suction opening over the electronic component and directing the laser beam through the suction opening and onto the electronic component so as to heat and detach the electronic component, which is then sucked into the vacuum suction nozzle.
B23K 26/12 - Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure
B23K 26/03 - Observing, e.g. monitoring, the workpiece
B23K 26/38 - Removing material by boring or cutting
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H05K 3/30 - Assembling printed circuits with electric components, e.g. with resistor
37.
Method for removing and repositioning electronic components connected to a circuit board
A device for removing or repositioning defective and erroneously placed electronic components from circuit boards includes a vacuum suction nozzle, a laser beam and a temperature sensor. The vacuum nozzle has an adaptor tip at which suction is generated. The adaptor tip is larger than the defective or erroneously positioned electronic component. The laser beam is emitted out of the suction opening towards the electronic component on the circuit board. The temperature sensor measures the temperature of the electronic component based on infrared radiation emitted from around the electronic component. A method for removing or repositioning the defective or erroneously placed electronic component from the circuit board positions the adaptor tip over the electronic component and directs the laser beam through the suction opening and onto the electronic component so as to heat and detach the electronic component, which is then removed or repositioned and remounted on the circuit board.
The invention relates to a method for electrolessly depositing a metal layer onto a substrate, comprising the following chronological work steps: a) treating, with an etching solution, the substrate surface to be coated; b) treating, with a polyelectrolyte or an organosilane compound, the substrate surface to be coated; c) treating, with a solution containing metal particles, the surface to be coated; and d) treating, with a solution containing at least one salt of the metal to be deposited onto the substrate, the surface to be coated.
The invention relates to a laser soldering system (10) and to a method for monitoring a laser soldering process using a monitoring device (13) of the laser soldering system (10). A soldering globule (21) is dispensed onto a substrate (19) surface (20) which can be soldered by means of a soldering globule feed device (11) of the laser soldering system (10), and the soldering globule (21) is at least partly melted by a laser device of the laser soldering system (10). During the laser soldering process, a light signal (23) is produced which is detected by an optical detection device (14) of the monitoring device (13), wherein the light signal (23) is separated into a spectrum of the light signal (23) by a spectroscope device (15) of the monitoring device (13), and the spectrum is analyzed by a processing device (16) of the monitoring device (13). A quality of the spectrum is used to detect whether a burning (22) of the substrate has occurred or not during the laser soldering process.
B23K 26/03 - Observing, e.g. monitoring, the workpiece
B23K 31/12 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to investigating the properties, e.g. the weldability, of materials
40.
Method and device including laser heating of gripper for repairing a test contact arrangement
A method for repairing a test contact arrangement in which a test contact which is disposed on a test contact carrier by means of solder material and is incorrectly positioned is gripped at a body edge by means of a gripping tool in a gripping contact phase, an absorption surface which is realized on an outer surface of the gripping tool is treated with laser radiation during the gripping contact phase, and the gripping tool performs a movement on at least one axis when the temperature is at the softening point of the solder material, in such a manner that the incorrect position is corrected by means of the movement to bring the test contact into a desired position.
B23K 37/047 - Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work moving work to adjust its position between soldering, welding or cutting steps
B23K 1/00 - Soldering, e.g. brazing, or unsoldering
The invention relates to a method for fusing a solder material deposit by means of laser energy, in which laser radiation emitted from a first laser source is applied to the solder material deposit in a first application phase by means of a first laser device (11) and laser radiation emitted from a second laser source is applied to the solder material deposit in a second application phase by means of a second laser device (12), said first laser source having a lower laser power than the second laser source, a switch being made from the first application phase to the second application phase by means of a switching device (30) and said switch being triggered by a temperature sensor, by means of which the temperature of the solder material deposit is measured at least during the first application phase.
A semiconductor-chip stack package includes a plurality of semiconductor chips disposed in a stack arrangement and at least one connecting substrate which connects the semiconductor chips. The semiconductor chips include a chip terminal face on a chip edge extending at least partially as a side terminal face in a side surface of the semiconductor chip. The side surfaces of the semiconductor chips provided with the side terminal face are arranged in a shared side surface plane S of the semiconductor-chip stack arrangement. The connecting substrate is arranged with a contact surface parallel to the side surface plane S of the semiconductor chips. Substrate terminal faces are formed on the contact surface for connecting a connection conductor structure formed in the connecting substrate and which are connected to the side terminal faces via a connecting material in a connection plane V1 parallel to the contact surface.
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 23/36 - Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
The invention relates to a plating bath for the electroless plating of a substrate, in particular a copper or aluminium substrate, with nickel, the bath comprising a nickel ion source and a stabilisation system having an iodation source and a heavy metal ion source.
C23C 18/32 - Coating with one of iron, cobalt or nickelCoating with mixtures of phosphorus or boron with one of these metals
C23C 18/34 - Coating with one of iron, cobalt or nickelCoating with mixtures of phosphorus or boron with one of these metals using reducing agents
C23C 18/36 - Coating with one of iron, cobalt or nickelCoating with mixtures of phosphorus or boron with one of these metals using reducing agents using hypophosphites
The invention relates to a solder ball feeding device, comprising a solder ball reservoir for receiving an amount of solder balls and a metering device for dispensing a metered feeding amount of solder balls to a discharge device, wherein the metering device comprises an ultrasound device and a dispensing nozzle with a dispensing cannula, the ultrasound device serving to apply vibrations to the dispensing nozzle, and the solder ball reservoir or the dispensing nozzle of the solder ball reservoir being provided with a pressure connection which serves to introduce a pressurized gas into the solder ball feeding device.
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
B23K 1/00 - Soldering, e.g. brazing, or unsoldering
A method and a device for establishing a wire connection between a first contact surface and at least one further contact surface. A contact end of a wire is positioned in a contact position relative to the first contact surface with a wire guiding tool. Subsequently, a mechanical, electrically conductive connection is established between the first contact surface and the contact end with a first solder material connection, and subsequently the wire guiding tool is moved to the further contact surface thus forming a wire section and establishing a further mechanical, electrically conductive connection between the wire section end and the further contact surface with a further solder material connection.
The invention relates to a method for repairing a test contact arrangement (10) in which a test contact (21) arranged with incorrect positioning on a test contact carrier (12) by means of solder material (16) is gripped at an edge (30) of the body by means of a gripping tool (23) in a gripping contact phase, laser radiation is applied during the gripping contact phase to an absorption area (33) formed on an outer surface (32) of the gripping tool (23) and, when the temperature is at the softening point of the solder material (16), an at least single-axis movement of the gripping tool (23) is performed in such a way that a correction of the incorrect positioning is carried out by means of the movement to bring the test contact (21) into a desired positioning.
The invention relates to a semiconductor chip stack pack (10) comprising a plurality of semiconductor chips (11) arranged in a stack arrangement (18), and at least one connecting substrate (19) connecting the semiconductor chips (11) to one another, wherein the semiconductor chips (11), at at least one chip edge (12), are provided with at least one chip connection area extending at least partly as side connection area (13) in a side area (23) of the semiconductor chip (11), said side area being formed at the chip edge (12), wherein the side areas (23) of the semiconductor chips (11) that are provided with the side connection area (13) are arranged in a common side area plane S of the semiconductor chip stack arrangement (18), wherein the connecting substrate (19) is arranged with a contact surface (20) parallel to the side area plane S of the semiconductor chips (11) and has substrate connection areas (21) configured for connecting a connecting conductor structure formed in the connecting substrate (19) on the contact surface (20), said substrate connection areas being electrically conductively connected to the side connection areas (13) by means of connecting material in a connecting plane V1 parallel to the contact surface (20).
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
H01L 23/485 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
06 - Common metals and ores; objects made of metal
07 - Machines and machine tools
40 - Treatment of materials; recycling, air and water treatment,
42 - Scientific, technological and industrial services, research and design
Goods & Services
Common metals and their alloys, metal materials for building
and construction; transportable buildings of metal;
non-electric cables and wires of common metal; metal
containers for storage or transport; contact metallisations
for micro joints of soldering materials, included in this
class (welding and soldering materials). Machines, machine tools and power tools for the manufacture
of transponders and semiconductor wafers, and integrated
circuits affixed thereto; machines, machine tools and power
tools in the field of microperipheric technologies;
machines, machine tools and power tools for applying
connecting materials onto substrates; machines, machine
tools and power tools for manufacturing micro-connections;
machines, machine tools and power tools to build up
substrate units composed of one substrate or several
substrates combined together to form a module, in particular
chips; motors and engines, other than for land vehicles;
couplings and transmission components, other than for land
vehicles; devices in relation to micro-peripheral
technologies (machines for manufacture and processing of
semi-conductors); apparatus for applying connecting
materials onto substrates; apparatus for manufacturing
micro-connections, in particular for building up substrate
units composed of one substrate or several substrates
combined together to form a module, in particular chips. Treatment of materials in relation to substrates used in the
field of microelectronics, in particular semiconductor
substrates and flexible substrates. Industrial analysis and research services; design and
development of computer hardware and software; development
of contact pad metallisations for connection technology,
development of connection technologies for the manufacture
of micro-connections; technological consultancy, in
particular regarding the manufacture of micro-connections.
06 - Common metals and ores; objects made of metal
07 - Machines and machine tools
40 - Treatment of materials; recycling, air and water treatment,
42 - Scientific, technological and industrial services, research and design
Goods & Services
Contact metallizations for micro compounds made from
soldering material, insofar as included in class 06. Machines, in particular automatic machines, regarding micro
periphery; machines, in particular automatic machines, for
the application of connecting material on substrates;
machines, in particular automatic machines, for producing
micro compounds, in particular for forming substrate units
from one or more substrates, in particular chips, combined
to a module. Material processing of substrates used in the field of
microelectronics, in particular semiconductor substrates and
flexible substrates. Development of contact metallizations for connection
technology; development of connecting technologies for
producing micro compounds; technological consultancy, in
particular regarding the production of micro compounds.
The invention relates to a method for placing and contacting a contact element formed in particular as a test contact of a test contact arrangement, wherein in said method, for forming a heat transfer surface, a contact head provided with a contact element holding device, with the contact element received in the contact element holding device, is placed between the contact element and a contact material deposit arranged on a contact surface of a contact carrier in the direction of a feeding axis against a contact surface of the connecting material deposit, and, for realizing an at least partial fusing of the connecting material deposit and for producing a materially bonded connection between the contact element and the connecting material deposit, thermal energy is introduced into the connecting material deposit by means of treating the contact element with thermal energy, the temperature T of the contact element being measured while the contact element is being treated and the duration of the treatment being defined as a function of a determined temperature gradient dT/dt of the temperature T of the contact element.
The invention relates to a method and a device for producing a wire connection between a first contact surface and at least one further contact surface (42), in which a contact end of a wire is positioned by means of a wire guidance tool in a contact position opposite the first contact surface and subsequently a mechanical, electrically conducting link is formed between the first contact surface and the contact end by means of a first soldered material joint (38), and subsequently the wire guidance tool is moved, forming a section of wire to the further contact surface (42), and a further mechanical, electrically conducting link is formed between the end of the wire section (45) and the further contact surface (42) by means of a further soldered material joint (48). The invention further relates to a component arrangement having a plurality of electronic components, particularly in the form of chips.
H01R 43/02 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
A device for the placing and contacting of a test contact of a test contact arrangement arranged on a contact carrier featuring a contact head having at least one transmission channel for transmitting thermal energy and transferring a vacuum. The contact head is provided with a test contact receptacle at its contact end in the area of a channel mouth, the test contact receptacle having a receiving gap formed between two parallel receiving cheeks for receiving the test contact and connected with the transmission channel. The receiving cheeks have contact surfaces at their contact ends for contacting a solder deposit arranged on the contact carrier to produce a heat conducting contact with the solder material of the solder deposit.
The invention relates to a method for melting a solder material deposit by means of laser energy, wherein laser radiation emitted by a first laser source is applied to the solder material deposit by means of a first laser device (11) in a first application phase and laser radiation emitted by a second laser source is applied to the solder material deposit by means of a second laser device (12) in a second application phase, the first laser source having a lesser laser power than the second laser source, a switch being made from the first application phase to the second application phase by means of a switching device (30) and the switching being triggered by a temperature sensor, by means of which the temperature of the solder material deposit is measured at least during the first application phase.
40 - Treatment of materials; recycling, air and water treatment,
06 - Common metals and ores; objects made of metal
07 - Machines and machine tools
42 - Scientific, technological and industrial services, research and design
Goods & Services
Treatment of materials by thermal, optical and mechanical interaction in relation to substrates used in the field of microelectronics, in particular semiconductor substrates and flexible substrates, namely, optical radiation, laser radiation Common metals and their alloys, unwrought or semi-wrought; transportable buildings of metal; non-electric cables and wires of common metal; metal containers for storage and transport; contact metallizations for micro joints of soldering in the nature of solder pastes, soft solder films, foils, fluids and powder Machines, machine tools and power tools for manufacturing of multifunctional-microelectromechanical and microoptoelectromechanical systems for the manufacture of transponders and semiconductor wafers and integrated circuits affixed thereto; bonding machines and bonding machine tools for assembly of electrical, mechanical and optical components for the manufacture of transponders, sensors and semiconductor wafers, and integrated circuits affixed thereto; machines, machine tools and power tools in the field of microperipheric technologies, namely, autogenous soldering machines, electric welding machines, gas welding machines, electric brazing machines, sintering machines for chemical processing, all for manufacturing micro and non-scale structures by the transformation of solder, welding, brazing, adhesive-bonding or sintering materials; machines, machine tools and power tools for applying connecting materials in form of pre-forms, pastes, films, foils, fluids or powder onto substrates by using chemical, electro-chemical and physical deposition techniques, namely, machinery for applying coatings ultrasonically to medical and industrial apparatus; machines, machine tools and power tools for manufacturing microconnections, by chemical or physical deposition, mechanical-, thermal- or optical transformation; machines for electrical, optical and mechanical bonding to build up substrate units composed of one substrate or several substrates combined together to form a module, in particular chips; motors and engines, other than for land vehicles; machine couplings and transmission components, other than for land vehicles; devices in relation to micro-peripheral technologies, namely, machines for manufacture and processing of semi-conductors; apparatus, namely, electrostatic coating machines for applying connecting materials onto substrates, by using chemical, electro-chemical and physical deposition, dispense, placement and mechanical-, thermal- and optical transformation for manufacturing microconnections, in particular for building up substrate units composed of one substrate or several substrates combined together to form a module, in particular chips Industrial analysis of goods or services of others to assure compliance with industry standards and scientific research services; design and development of computer hardware and software; product development in the field of contact pad metallizations for connection technology; development of new technology for others in the field of the manufacture of microconnections; technological consultancy, in the technology field of the manufacture of microconnections
06 - Common metals and ores; objects made of metal
07 - Machines and machine tools
40 - Treatment of materials; recycling, air and water treatment,
42 - Scientific, technological and industrial services, research and design
Goods & Services
Common metals and their alloys, Materials of metal for building and construction; Transportable buildings of metal; Non-electric cables and wires of common metal; Metal containers for storage or transport; Contact metallisations for micro joints of soldering materials, included in class 6 (welding and soldering materials). Machines, machine tools and power tools for use in the manufacture of transponders and semi-conductor boards and integrated circuits installed thereon; Machines, machine tools and power tools in relation to micro-peripheral technology; Machines, machine tools and power tools for applying joining materials to substrates; Machines, machine tools and power tools for use in the manufacture of micro joints; Machines, machine tools and power tools for constructing substrate units composed of one or a plurality of substrates, in particular chips, assembled to form a module; Motors and engines and propulsion mechanisms, other than for land vehicles; Machine coupling and transmission components (except for land vehicles); Devices in relation to micro-peripheral technology (machines for the manufacture and processing of semi-conductors); Devices for applying joining materials to substrates (welding and soldering tools and apparatus); Devices for use in the manufacture of micro joints, in particular in the construction of substrate units composed of one or a plurality of substrates, in particular chips, assembled to form a module. Treatment of materials in relation to substrates for use in the microelectronics sector, in particular semi-conductor substrates and flexible substrates. Scientific and technological services and research and design relating thereto; Industrial analysis and research services; Design and development of computer hardware and software; Development of contact metallisations for joining technology, development of joining technologies for use in the manufacture of micro joints; Technological consultancy, in particular relating to the manufacture of micro joints.
A method for forming solder deposits on elevated contact metallizations of terminal faces of a substrate formed in particular as a semiconductor component includes bringing wetting surfaces of the contact metallizations into physical contact with a solder material layer. The solder material is arranged on a solder material carrier. At least for the duration of the physical contact, a heating of the substrate and a tempering of the solder material layer takes place. Subsequently a separation of the physical contact between the contact metallizations wetted with solder material and the solder material layer takes place.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 23/00 - Details of semiconductor or other solid state devices
57.
METHOD FOR PLACING AND MAKING CONTACT WITH A TEST CONTACT
The invention relates to a method for placing and making contact with a contact element which is in the form of a test contact of a test contact arrangement, in particular, in which a contact head provided with a contact element holding device is placed, with the contact element accommodated in the contact element holding device, for the purpose of forming a heat transfer area between the contact element and a connecting material depot arranged on a contact area of a contact carrier, against a contact surface of the connecting material depot in the direction of an infeed axis, and, in order to at least partially melt the connecting material depot and to produce a material bond between the contact element and the connecting material depot, thermal energy is introduced into the connecting material depot by applying thermal energy to the contact element, wherein the temperature T of the contact element is measured during the application and the application duration is defined on the basis of a determined temperature gradient dT/dt of the temperature T of the contact element.
A device for the application of solder material deposits includes a conveying device for conveying solder material deposits from a reservoir at an upper housing part toward an application device at a lower housing part. The conveying device can be moved from a receiving position P1 to a transfer position P2, in which the solder material deposit is exposed to a pressure gas via a pressure bore formed in the upper housing part and from which the solder material deposit is transferred to an application nozzle in an application position P3. The application device includes an application duct formed in the lower housing and forms a lower section of a transmission duct which serves to transmit laser radiation to the solder in the application nozzle. The application duct is inclined at an application angle α with respect to the rotation axis.
The invention concerns a method for producing a chip module having a carrier substrate and at least one chip arranged on the carrier substrate, as well as a contact conductor arrangement for connecting chip pads to contacts arranged on a contact face of the chip module, in which method the front face of the chip which is provided with the chip pads is secured to the carrier substrate and then the contact conductor arrangement is formed by structuring of a contact material layer of the carrier substrate.
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
The invention relates to a device for positioning and contacting a test contact (5) of a test contact arrangement that is arranged on a contact carrier (19), wherein the device comprises a contact head (10) having at least one transmission channel for transmitting thermal energy and transferring negative pressure, wherein the contact head is provided with a test contact receiving element (11) on the contact end thereof in the region of a channel opening, wherein the test contact receiving element comprises a receiving gap (14) configured between two parallel receiving cheeks (12, 13) for receiving the test contacts and connected to the transmission channel, wherein the receiving cheeks comprise contact surfaces (21) on the contact ends thereof provided for contacting with a solder deposit (20) arranged on the contact carrier, said contact surfaces producing a heat-conducting contact with the solder material of the solder deposit.
The invention relates to a device (10) for the separate application of solder material deposits (11), in particular solder balls, comprising a conveying device (19) for separately conveying the solder material deposits from a solder material reservoir (12) toward an application device (33), the conveying device having transport holders that are formed as passage holes and that can each be moved from a receiving position, in which a solder material deposit is received from the solder material reservoir, into a transfer position P2, in which the solder material deposit is exposed to a pressure gas, and from which the solder material deposit is transferred to an application opening of an application nozzle (36) of the application device into an application position P3, wherein a detector device (69) is provided that serves to trigger a treatment of the solder material deposit arranged in the application position P3 with laser radiation emitted by a laser device, wherein the detector device has a reflection sensor (70) that detects reflection radiation (72) that is reflected by the solder material deposit arranged in the application position P3.
An arrangement for applying metal nanoparticles onto a wafer or another substrate, is characterized by a metal or semiconductor part arranged in a liquid reservoir, laser or particle emitter for removing nanoparticles from the metal or semiconductor part in the liquid inside the liquid reservoir, and means for applying the removed metal particle containing liquid onto the substrate.
B22F 3/00 - Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sinteringApparatus specially adapted therefor
B22F 7/04 - Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting of composite layers with one or more layers not made from powder, e.g. made from solid metal
63.
Device for the separate application of solder material deposits
The invention relates to a device (10) for the separate application of solder material deposits (11), in particular solder balls, comprising a conveying device (19) for separately conveying the solder material deposits from a solder material reservoir (12) toward an application device (33), the conveying device having transport holders that are formed as passage holes and that can each be moved from a receiving position, in which a solder material deposit is received from the solder material reservoir, into a transfer position P2, in which the solder material deposit is exposed to a pressure gas and from which the solder material deposit is transferred to an application opening (37) of an application nozzle (36) of the application device into an application position P3, wherein a first detector device (69) for triggering a treatment of the solder material deposit arranged in the application position P3 with laser radiation emitted by a laser device and a second detector device (80) for locating the solder material deposit are provided.
The invention relates to a chip arrangement (10) and a method for forming a contact connection (11) between a chip (18), in particular a power transistor or the like, and a conductor material strip (14), said conductor material strip being formed on a non-conductive substrate (12) and the chip being arranged on the substrate or on a conductor material strip (15). A silver paste (29) or copper paste is applied to a chip contact surface (25) of the chip and of the conductor material strip (28), a contact conductor (30) is dipped into the silver paste or the copper paste on the chip contact surface and into the silver paste or the copper paste on the conductor material strip, and a solvent contained in the silver paste or the copper paste is at least partially evaporated by heating. The silver paste or the copper paste is then sintered by means of laser energy, thereby forming the contact connection.
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H01L 23/488 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of soldered or bonded constructions
The invention relates to a device (10) for the separate application of solder material deposits, in particular solder balls, comprising a conveying device for separately conveying the solder material deposits from a solder material reservoir toward an application device (33), the conveying device having transport holders that are formed as passage holes and that can each be moved from a receiving position P1, in which a solder material deposit is received from the solder material reservoir, into a transfer position P2, in which the solder material deposit is exposed to a pressure gas and from which the solder material deposit is transferred to the application device into an application position P3, wherein a removal device (46) for removing a solder material deposit from a transport holder arranged in a removal position P4 is arranged downstream of the transfer position in the conveying direction, the removal device being connected to a detector device for triggering the removal function, said detector device checking the condition of the transport holder in the transfer position.
An arrangement (10) for the reproducible application of small amounts of liquid onto a target surface, comprising a liquid reservoir (28, 38) with an opening (24) which can be positioned above the target surface, a plunger (52, 60) which is arranged so as to be movable in an opening direction, and a drive (14) for moving the plunger, is distinguished by the fact that the opening (50) is formed in a projecting, tapering tip or nozzle (48), and the plunger (52, 60) extends all the way through the liquid (70) situated in the liquid reservoir (28, 38) and into the tip or nozzle (48), such that during a plunger movement in an opening direction, liquid portions in the opening region are moved outward through the opening by the plunger.
The invention relates to a solder sphere feeding device (40) comprising a solder sphere reservoir (20) for receiving a quantity of solder spheres and a metering device (31) for dispensing a metered quantity of solder spheres (16) to a delivery device, wherein the metering device (31) comprises an ultrasonic system (32) and a dispensing mouthpiece (21) with a dispensing tubule (43), the ultrasonic system (32) applies vibrations to the dispensing mouthpiece (21), and the solder sphere reservoir (20) or the dispensing mouthpiece (21) of the solder sphere reservoir (20) is provided with a pressure line (23) for injecting a gas under pressure into the solder sphere feeding device (40).
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
The invention relates to a device (10) for the individual application of solder material depots (11), in particular solder balls, said apparatus comprising a conveyor device to convey the solder material depots individually from a solder material reservoir (12) that is arranged on an upper housing part (14) of the apparatus to an application device (33) that is arranged on a lower housing part (20) of the apparatus, wherein the conveyor device is designed as a conveyor disc (19) that is arranged in a receiving area (21) between the lower housing part and the upper housing part and that is conveyed around an axis of rotation (28), which conveyor disc has transport receptacles (18) designed as through-holes, each of which transport receptacle being moveable from a receiving position P1, in which a solder material depot is received from the solder material reservoir, to a transfer position P2, in which compressed gas is applied to the solder material depot via a pressure bore (42) that is formed in the upper housing part, and from which transfer position the solder material depot is transferred to an application nozzle (36) of the application device, into an application position P3, wherein the application device has an application conduit (35) formed in the lower housing part, which simultaneously forms a lower section (63) of a transmission conduit (64) that transmits laser radiation to the solder material depot located in the application nozzle, wherein an upper section (65) of the transmission conduit extends through the upper housing part, and the application conduit is inclined with respect to the axis of rotation at an application angle α.
The invention relates to a chip arrangement (18) comprising a terminal substrate (12) and a plurality of semiconductor substrates (1) which are arranged on the terminal substrate, in particular chips, wherein terminal faces (5) arranged on a contact surface of the chips (1) are connected to terminal faces on a contact surface (14) of the terminal substrate (12), wherein the chips (1) extend parallel with a lateral edge and transversally with their contact surface to the contact surface of the terminal substrate (12), wherein vias (13) are arranged in the terminal substrate, which connect external contacts (15) arranged on an external contact side to terminal faces formed as internal contacts (14) on the contact surface of the terminal substrate, wherein terminal faces of the chips, which are arranged adjacent to the lateral edge, are connected to the internal contacts of the terminal substrate by way of a re-melted solder material deposit (16). Furthermore, the invention relates to a method for producing a chip arrangement (18).
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 25/00 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices
B23K 1/00 - Soldering, e.g. brazing, or unsoldering
H01L 23/00 - Details of semiconductor or other solid state devices
B23K 26/14 - Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beamNozzles therefor
The invention concerns a method for producing a chip module (72, 73, 89, 90) having a carrier substrate (30, 81) and at least one chip (33) arranged on the carrier substrate, as well as a contact conductor arrangement (45) for connecting chip pads (34) to contacts (69, 70, 71) arranged on a contact face (56) of the chip module, in which method the front face of the chip which is provided with the chip pads is secured to the carrier substrate and then the contact conductor arrangement is formed by structuring of a contact material layer (31, 80) of the carrier substrate.
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
71.
APPARATUS FOR THE ISOLATED APPLICATION OF SOLDER MATERIAL DEPOSITS
The invention relates to an apparatus (10) for the isolated application of solder material deposits (11), in particular solder balls, comprising a conveying device (19) for the solder material deposits to be conveyed individually from a solder material reservoir (12) to an application device (33), wherein the conveying device has transporting receptacles that are formed as through-holes and can each be moved from a receiving position, in which a solder material deposit is accepted from the solder material reservoir, into a transfer position P2, in which the solder material deposit is exposed to compressed gas and from which the solder material deposit is transferred into an application position P3 on an application opening of an application mouthpiece (36) of the application device, wherein a detector device (69) is provided, serving for triggering exposure of the solder material deposit arranged in the application position P3 to a laser radiation emitted by a laser device, wherein the detector device has a reflection sensor (70), which senses a reflection radiation (72) that is reflected by the solder material deposit arranged in the application position P3.
The invention relates to an apparatus (10) for the isolated application of solder material deposits (11), in particular solder balls, comprising a conveying device (19) for the solder material deposits to be conveyed individually from a solder material reservoir (12) to an application device (33), wherein the conveying device has transporting receptacles that are formed as through-holes and can each be moved from a receiving position, in which a solder material deposit is accepted from the solder material reservoir, into a transfer position P2, in which the solder material deposit is exposed to compressed gas and from which the solder material deposit is transferred into an application position P3 on an application opening (37) of an application mouthpiece (36) of the application device, wherein a first detector device (69), for triggering exposure of the solder material deposit arranged in the application position P3 to a laser radiation emitted by a laser device, and a second detector device (80), for localizing the solder material deposit, are provided.
The invention relates to an apparatus (10) for the individual application of deposits of soldering material, in particular solder balls, comprising a feeding device for the individual feeding of the deposits of soldering material from a soldering material reservoir to an application device (33), wherein the feeding device has transporting receptacles formed as through-holes, which can in each case be moved from a receiving position P1, in which a deposit of soldering material is received from the soldering material reservoir, into a transfer position P2, in which the deposit of soldering material is subjected to compressed gas and from which the deposit of soldering material is transferred to the application device, into an application position P3, wherein a removal device (46) for removing a deposit of soldering material from a transporting receptacle arranged in a removal position P4 is arranged downstream of the transfer position in the feeding direction, wherein, for initiating the removing function, the removal device is connected to a detector device, which checks the state of the transporting receptacle in the transfer position.
The invention relates to a chip assembly (18) having a connection substrate (12) and a plurality of semiconductor substrates (1) arranged on the connection substrate, in particular chips, wherein connection surfaces (5) arranged on a contact surface of the chips (1) are connected to connection surfaces on a contact surface (14) of the connection substrate (12), wherein a side edge of the chips (1) extends parallel to the contact surface of the connection substrate (12), and the contact surface of the chips (1) extends transversely to the contact surface of the connection substrate (12), through-connections (13) arranged in the connection substrate connect outside contacts (15) arranged on an outside contact side to the contact surfaces designed as inside contacts (14) on the contact surface of the connection substrate, and connection surfaces of the chips (1) adjacent to the side edge are connected to the inside contacts of the connection substrate via a remelted solder material depot (16). The invention further relates to a method for manufacturing a chip assembly (18).
H01L 23/488 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of soldered or bonded constructions
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
06 - Common metals and ores; objects made of metal
07 - Machines and machine tools
40 - Treatment of materials; recycling, air and water treatment,
42 - Scientific, technological and industrial services, research and design
Goods & Services
Contact metalizations for microconnections made from
soldering material, included in class 6. Mechanical apparatuses, in particular automatic machines,
with regard to microperipheric technologies; mechanical
apparatuses, in particular automatic machines, for the
application of connecting materials on substrates;
mechanical apparatuses, in particular automatic machines,
for manufacturing microconnections, in particular for the
production of substrate units from one or more substrates
joined as one module, in particular chips. Material treatment of substrates used in the field of
microelectronics, in particular semiconductor substrates and
flexible substrates. Development of contact metalizations for connection systems,
development of connection systems for manufacturing
microconnections; technology consulting services, in
particular with regard to manufacturing microconnections.
06 - Common metals and ores; objects made of metal
07 - Machines and machine tools
40 - Treatment of materials; recycling, air and water treatment,
42 - Scientific, technological and industrial services, research and design
Goods & Services
Contact metalizations for microconnections made from soldering material, included in class 6, namely, soldering wire of metal for microconnections Mechanical apparatuses, in particular automatic machines, with regard to microperipheric technologies, namely, semiconductor wafer processing machines; mechanical apparatuses, in particular automatic machines, for the application of connecting materials on substrates; mechanical apparatuses, in particular automatic machines, for manufacturing microconnections, in particular for the production of substrate units from one or more substrates joined as one module, in particular chips Material treatment of substrates used in the field of microelectronics, in particular semiconductor substrates and flexible substrates [ Development of contact metallizations for connection systems, namely, new product development for others regarding contact metallization; development of connection systems for manufacturing microconnections, namely, development of new technology for others in the field of computer systems for microconnection manufacturing; technology consulting services, in particular with regard to manufacturing microconnections, namely, consulting services in the field of designing of machines for manufacturing microconnections and in the field of development of new technology regarding microconnection manufacturing and applicability ]
77.
Method and device for electrically contacting terminal faces of two substrates by laser soldering using a gaseous flux medium
A method for electrically contacting terminal faces of two substrates, such as a chip and a carrier substrate, includes two successive phases. In a first phase, the chip is positioned with its terminal faces against terminal faces of the substrate and laser energy is applied to the chip at the rear. In a second phase, a flux medium is applied and laser energy is applied to the rear of the chip to cause reflow. The device for performing the second phase of the method comprises a carrier table and a housing, which form a housing interior with a top side of the carrier table which receives the component arrangement, and a laser light source, which is oriented so that the laser radiation impinges on the rear side of the first substrate.
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 25/00 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices
78.
Diode array and method for producing a diode array
A diode arrangement includes a diode and two electrodes. Each electrode is connected to the diode in an electrically conductive manner via a soldered connection on one of two oppositely arranged contact surfaces of the diode. The contact surfaces of the diode are formed substantially by the surfaces of a lower side and an upper side of the diode and are contacted with the contact extensions of the electrodes via the soldered connection. The contact extensions forming counter contact surfaces are substantially congruent with the contact surfaces of the diode.
The present invention relates to a method for the electrical bonding of connection areas of two substrates (6, 7), more particularly of a chip (6) and of a carrier substrate (7), two wafers or a plurality of superposed chips and a substrate. The method according to the invention is performed in two successive phases, in a first phase, the chip (6) being positioned with its connection areas against connection areas of the substrate (7) and rearward application of laser energy (5) to the chip (6), and, in a subsequent second phase, in a housing (3), a flux medium (for example a nitrogen-formic acid mixture) being applied and at the same time a reflow being performed by means of rearward application of laser energy (5) to the chip (6), and a process of purging the housing interior subsequently being performed. The invention also concerns a device for performing the second phase of the method according to the invention. The device according to the invention for performing the second phase of the method comprises a support table (1) and a housing (3), which together with a top of the support table (1) forms a housing interior, in which the component arrangement is positioned, and a laser light source (5), which is oriented such that the laser radiation impinges on the first substrate (6) on the rear side.
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
80.
METHOD AND DEVICE FOR FORMING SOLDER DEPOSITS ON RAISED CONTACT METALLIZATION STRUCTURES
The invention relates to a method for forming solder deposits (34) on raised contact metallization structures (24) of connection surfaces (23) of a substrate (19) designed in particular as a semiconductor component, wherein wetting surfaces (26) of the contact metallization structures (24) are brought in contact with a solder material layer (15) arranged on a solder material carrier (13), the substrate (19) is heated and the temperature of the solder material layer (15) is controlled at least during the duration of the contact, and subsequently the contact metallization structures (24) wetted with solder material (34) and the solder material layer (15) are separated, thus making it possible to prevent the formation of contact bridges between adjoining contact metallization structures (24) resulting from the surface tension of fused solder material when the wetting surfaces (26) of the contact metallization structures (24) and the solder material layer (15) are separated.
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H01L 23/485 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
A device for positioning and contacting test contacts on a contact carrier for producing a test contact arrangement includes at least one contact head having at least one transmission channel for transmitting thermal energy. The contact head being equipped with a equipped with a test contact receptacle. The test contact receptacle includes a positioning device with at least two positioning faces for the positioned abutment against a test contact and the positioning of the test contact with an absorption region for absorbing the thermal energy in the channel mouth.
The invention relates to a test contact arrangement (15) for testing semiconductor components, comprising at least one test contact (10) which is arranged in a test contact frame (13) and is designed in the type of a cantilever arm and which has a fastening base (12) and a contact arm (30) which is provided with a contact tip (11) and which is connected to the fastening base, wherein the fastening base is inserted with a fastening projection (16) thereof into a frame opening (14) of the test contact frame in such a manner that a lower edge (17) of the fastening projection is essentially aligned flush with a lower side (18) of the test contact frame.
The invention relates to a diode array (10) comprising a diode (11) and two electrodes (14, 15). Each of said electrodes is connected to the diode in an electrically conductive manner by means of a soldered connection on one of the two opposite contact surfaces of said diode. The contact surfaces of the diode are formed substantially by the surfaces of an underside (19) and an upper side (18) of the diode, and these make contact with the connection extensions (12, 13) of the electrodes via the soldered connection. Said connection extensions and the contact surfaces of the diode form substantially congruent counter contact surfaces (24, 25).
The invention relates to a contact structure (24) and to a method for producing a contact structure for semiconductor substrates (21) or the like, in particular for terminal faces of semiconductor substrates, comprising a base contact part (22) arranged on a terminal face (20) of the semiconductor substrate and at least one connecting contact part (23) arranged on the base contact part, wherein the connecting contact part is formed from a connecting contact material (34) which has a lower melting point than a base contact material of the base contact part.
The invention relates to a contact array (47, 48, 49, 50, 55, 56, 57) for substrate contacting, in particular for contacting connecting surfaces of a semiconductor substrate (21), comprising at least one inner contact (25) of the contact array that is formed on a substrate surface by a base connecting surface of the substrate, a passivation layer (34, 35) covering at least the outside edge region and the periphery of the inner contact, at least one lower contact strip (36) extending laterally away from the inner contact (25) on the passivation layer (34, 35), and an upper further contact strip (37, 38, 39) extending on the lower contact strip, wherein the further contact strip is formed by a contact metallization, which substantially consists of a nickel (Ni) layer (37) or a layer structure (38 & 39) containing nickel and palladium (Pd).
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H01L 23/485 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
86.
Transfer device for receiving and transferring a solder ball arrangement
The present invention relates to a transfer device (10) for receiving and transferring a solder ball arrangement (28). Said transfer device comprises a discharge container (11) and a transfer substrate (12) that interacts with the discharge container in order to obtain a flat solder ball arrangement and that can be subjected to a negative pressure. The discharge container comprises an at least partially perforated base wall (14) and the transfer substrate has a hole pattern for receiving the solder ball arrangement. The discharge container comprises an ultrasound device (37) for subjecting said discharge container to ultrasound vibrations.
The present invention relates to a method and to a device for separating solder material deposits (12) from a substrate (10), in which a receiving sleeve (19) having a receiving opening (22) is positioned to overlap with a solder material deposit arranged on the substrate in such a manner that an opening edge (21) of the receiving opening is brought into abutment against the substrate in an essentially sealing manner, the solder material deposit is subjected to thermal energy and a sleeve lumen (23) that is defined by the receiving sleeve and that is disposed transverse to a longitudinal axis (30) of the receiving sleeve is subjected to an air flow (28) that is directed to an output device (29) of the receiving sleeve.
The invention relates to a device for positioning and contacting test contacts (20) on a contact carrier for producing a test contact arrangement, comprising at least one contact head having at least one transmission channel (24) for transmitting thermal energy and a test contact holding device. According to the invention, said contact head is provided on the contact end thereof and in the region of a channel opening with a test contact receiving element, wherein said test contact receiving element comprises a positioning device with at least two positioning surfaces for the positioned support to a test contact and the positioning of the test contact with an absorption region for absorbing the thermal energy in the channel opening.
The invention relates to a method and a device for contacting a solder ball formation, in which a plurality of contact mouthpieces arranged in a formation is used to pick up a solder ball formation with a composition reflecting the relative arrangement of the contact mouthpieces from a solder ball reservoir comprising a multitude of randomly distributed solder balls, the solder ball formation is placed on contact points by means of the contact mouthpieces for subsequently contacting, and subsequently the solder balls are impinged with laser energy by means of the contact mouthpieces for thermal connection with the contact points.
B23K 9/16 - Arc welding or cutting making use of shielding gas
B23K 31/00 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
90.
CONTACT STRUCTURE AND METHOD FOR PRODUCING A CONTACT STRUCTURE
The invention relates to a contact structure (24) and to a method for producing a contact structure for semiconductor substrates (21) or the like, in particular for connection areas of semiconductor substrates, having a base contact part (22) arranged on a connection area (20) of the semiconductor substrate and at least one connecting contact part (23) arranged on the base contact part, wherein the connecting contact part is formed from a connecting contact material (34) which has a lower melting point than a base contact material of the base contact part.
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H01L 23/485 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
The invention relates to a device for applying an electronic component having terminal faces, to a substrate, also having terminal faces, wherein the component is removed from a feeding device by means of an application device. An application device subsequently positions the component on the substrate in such a manner that the component terminal faces which extend from a contact side of the component up to a component rear side and the substrate terminal faces are in an overlapping position. A direct application of laser energy subsequently contacts the terminal faces to the component terminal faces. The application device has a contact nozzle with a component accommodating area for accommodating the component. The contact nozzle has a vacuum opening coupled to a vacuum duct and an emission opening for applying laser radiation to the component. The emission opening includes two emission windows which are spaced apart from one another by a component contact surface and each of the two emission windows is assigned to one of the terminal faces of the component. The component contact surface is formed by two front surfaces of two support bars which are arranged so as to be located opposite one another and which are embodied in the vacuum duct.
B23P 19/00 - Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformationTools or devices therefor so far as not provided for in other classes
The invention relates to a test contact arrangement (15) for testing semiconductor components, comprising at least one test contact (10) arranged in a test contact frame (13) of the type of a cantilever arm, a fastening base (12) and a contact arm (30) which is provided with a contact tip (11) and connected to the fastening base. According to the invention, the fastening base is inserted with its fastening projection (16) into a frame opening (14) of the test contact frame in such a manner that a lower edge (17) of the fastening projection is essentially aligned flush with a lower side (18) of the test contact frame.
The invention relates to a method for manufacturing a contact arrangement (10) between a microelectronic component (11) and a carrier substrate (12) and to an assembly unit (24) manufactured by this method, whereby thermal energy required in the connecting areas is achieved by exposing the back of the component to laser energy, a mechanical connecting contact (23) is formed between opposing connecting surfaces (17, 18) of the component and the carrier substrate, and at least one electrically conducting connecting contact (22) is formed between terminal faces (13, 15) of the carrier substrate and of the component arranged at an angle to one another by t least partially melting solder material, whereby the assembly unit manufactured by this method has at least one contact arrangement.
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
94.
METHOD AND DEVICE FOR REMOVING SOLDER MATERIAL DEPOSITS FROM A SUBSTRATE
The invention relates to a method and to a device for separating solder material deposits (12) from a substrate (10), in which a receiving sleeve (19) having a receiving opening (22) is introduced into the covering having a solder material deposit arranged on the substrate in such a manner that an opening edge (21) of the receiving opening is arranged in an essentially sealing manner against the substrate. The solder material deposit is subjected to thermal energy and a sleeve lumen (23) that is defined by the receiving sleeve and that is transversal to a longitudinal axis (30) of the receiving sleeve is subjected to an air flow (28) that is directed to an output device (29) of the receiving sleeve.
B23K 26/14 - Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beamNozzles therefor
The invention relates to a transfer device (10) for receiving and transferring a solder ball arrangement (28). Said device comprises a discharge container (11) and a transfer substrate (12) that interacts with the discharge container in order to obtain a flat solder ball arrangement and that can be subjected to a negative pressure. The discharge container comprises one at least partially perforated base wall (14) and the transfer substrate has a hole pattern for receiving the solder ball arrangement. The discharge container comprises an ultrasound device (37) for subjecting said discharge container to ultrasound vibrations.
Method and device for drying circuit substrates (13), in particular semiconductor substrates, in which a circuit surface (30) of the circuit substrate is flushed using a flushing liquid (10) in a flushing step and the circuit surface is dried in a subsequent drying step, the circuit substrate being moved in the flushing step in the direction of its planar extension transversely and in relation to a liquid level (28) of the flushing liquid in such a way that a liquid meniscus forms at a transition area between the circuit surface and the liquid level, which changes because of the relative movement, and thermal radiation (36) is applied to the transition area wetted by the liquid meniscus in the drying step.
F26B 3/30 - Drying solid materials or objects by processes involving the application of heat by radiation, e.g. from the sun from infrared-emitting elements
97.
Method and device for transferring a chip to a contact substrate
A method and device for transferring a chip (18) situated on a transfer substrate (26) to a contact substrate (50), and for contacting the chip with the contact substrate, in which the chip, the back side (19) of which is attached adhesively to a support surface of the transfer substrate facing the contact substrate, is charged with laser energy from behind through the transfer substrate, and the chip contacts (59, 60) thereof that are arranged opposite a contact surface (58) of the contact substrate are brought into contact with substrate contacts (56, 57) arranged on the contact surface by means of a pressing device (45, 46) from behind through the transfer substrate, and a thermal bond is created between the chip contacts and the substrate contacts.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 23/00 - Details of semiconductor or other solid state devices
98.
METHOD AND DEVICE FOR CONTACTING, POSITIONING AND IMPINGING A SOLDER BALL FORMATION WITH LASER ENERGY
The invention relates to a method and to a device for contacting a solder ball formation, wherein a plurality of contact mouthpieces (22) arranged in a formation pick up a solder ball formation, which formation is composed according to a relative arrangement of the contact mouthpieces (26), from the solder ball reservoir (26) comprising a plurality of randomly distributed solder balls (27), the contact mouthpieces (22) place the solder ball formation on contact points for subsequent contacting and the contact mouthpieces (22) impinge the solder balls (27) with laser energy to thermally connect the contact points.
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
99.
METHOD FOR JOINING ALIGNED DISCRETE OPTICAL ELEMENTS
FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V. (Germany)
PACTECH PACKAGING TECHNOLOGIES GMBH (Germany)
Inventor
Beckert, Erik
Banse, Henrik
Zakel, Elke
Fettke, Matthias
Abstract
The invention relates to a method for joining aligned discrete optical elements. The object of the invention is to provide a method by means of which the optical elements can be joined in the aligned state, wherein a thermal connection having long-term stability can be produced at little expense and with high positioning accuracy. Surface regions to be joined to the optical element can be provided with at least one thin metallic layer by means of the method according to the invention for joining aligned discrete optical elements, wherein the regions are subsequently wetted using a liquid solder in a contactless dosed manner. The solder that is free of flux is applied to the surface regions to be joined via a nozzle using a pressurized gas stream.
