Abstract

The invention relates to a radio frequency transceiver device (1) comprising at least one conductive wire (3) that forms an antenna and is electrically connected to at least one electronic chip (2), the conductive wire (3) extending longitudinally in non-contiguous turns around a ribbon (4).

IPC Classes  ?

• G06K 19/02 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
• G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier

Abstract

The invention relates to a radio frequency transceiver device (1) comprising a non-conductive support (4) and a second antenna (3) made of an electrically conductive material, the second antenna (3) extending longitudinally in non-contiguous turns in or around the support (4) in such a way as to define an inner space of the second antenna (3). An electronic circuit (2), which is formed by a chip (2a) and a first antenna (2b) electrically connected to the chip (2a), is fully incorporated into the support (4) and is located in the inner space of the second antenna (3).

IPC Classes  ?

• G06K 19/02 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
• G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier

Abstract

The invention relates to a device (1) for manufacturing a strip (4) of electronic tags, the manufacturing process comprising the successive insertion of segments of wire, each bearing an electronic device between a lower tape (3b) and an upper tape (3a), each of which continuously unwinds from a reel (2b, 2a). The device comprises a sealing station that has a sealing zone and a guide device (11) arranged upstream of the sealing zone (Zc). The guide device also comprises a presser foot (11b) arranged in line with the assembly zone (Za) in order to apply a controlled pressure to the assembly formed of the upper tape (3a), the segment of wire, and the lower tape (3b).

IPC Classes  ?

• G06K 19/02 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
• G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier

Abstract

A radiofrequency transceiver device comprises an electronic circuit including a chip and a first antenna electrically connected to the chip, a textile-core thread formed of a non-conductive material, and a second antenna formed of a textile element in an electrically conducting material and disposed in non-contiguous turns around and along the textile-core thread. The electronic circuit is disposed relative to the second antenna so as to allow the electromagnetic coupling of the first and second antenna. A label may comprise the radiofrequency transceiver device. A particular method may be used to manufacture such a device.

IPC Classes  ?

• G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
• H01Q 1/08 - Means for collapsing antennas or parts thereof
• H01Q 1/27 - Adaptation for use in or on movable bodies
• H01Q 9/16 - Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
• H04B 1/40 - Circuits

Abstract

The invention relates to an adjustable presser foot (6) for a sewing machine having at least one needle moving vertically back and forth in order to sew a seam on a textile piece while securing an electronic tag (1) in the form of a strip to the textile piece by means of stitches. The presser foot (6) comprises a sole, guide means for guiding the electronic tag (1) substantially parallel to the feed direction of the textile piece and adjustment means for adjustably positioning the guide means laterally relative to the feed direction of the textile piece.

IPC Classes  ?

• D05B 29/08 - Presser feet comprising relatively-movable parts
• D05B 35/06 - Work-feeding or work-handling elements for sewing machines, not otherwise provided for for attaching bands, ribbons, strips, or tapes or for binding

Abstract

The invention relates to a functional chip (100) of which at least two electrical connection pads (11a, 11b) are intended for being connected to wire elements (40a, 40b). Said chip comprises: —a substrate (10) comprising a microelectronic component electrically connected to the two electrical connection pads arranged on a front face of said substrate (10), —a cover (20) comprising a first portion (21) assembled to the front face of the substrate (10), said first portion (21) forming a spacer between the two electrical connection pads; the cover (20) further comprising a second portion (22) spaced apart from the front face of the substrate (10) and extending opposite each electrical connection pad only partially, so as to allow access to said pads, along an axis (z) normal to the front face of the substrate (10). The invention likewise relates to a method for manufacturing such a functional chip.

IPC Classes  ?

• H01L 23/66 - High-frequency adaptations
• H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
• H01L 23/544 - Marks applied to semiconductor devices, e.g. registration marks, test patterns

Abstract

The invention relates to a method for making a textile part (A; A1, A2), comprising a step of forming a stitched seam (c1, c2, c3; C). The stitched seam step also aims to secure an electronic tag (1) to the textile part (A; A1, A2). The electronic tag (1) is formed from a strip comprising a wired electronic device comprising a chip (3a) associated with at least one antenna wire (3b), the chip (3a) and the antenna wire (3b) being arranged inside the stitched seam (c1, c2, c3; C). The invention also relates to the textile part provided with the tag.

IPC Classes  ?

• G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
• H01Q 7/00 - Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop

Abstract

The invention relates to a radiofrequency transceiver device (1) comprising an electronic circuit (2) comprising a chip and a first antenna electrically connected to the chip, a textile-core thread (4) formed of a non-conductive material, and a second antenna formed of a textile element (3) in an electrically conducting material and disposed in non-contiguous turns around and along the textile-core thread (4). The electronic circuit (2) is disposed relative to the second antenna so as to allow the electromagnetic coupling of the first and second antenna. The invention also relates to a label incorporating the radiofrequency transceiver device (1) and to its method of manufacture.

IPC Classes  ?

• H01Q 1/08 - Means for collapsing antennas or parts thereof
• H01Q 1/22 - SupportsMounting means by structural association with other equipment or articles
• H01Q 1/27 - Adaptation for use in or on movable bodies
• H01Q 9/16 - Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
• D02G 3/44 - Yarns or threads characterised by the purpose for which they are designed
• G06K 19/02 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
• D02G 3/36 - Cored or coated yarns or threads

Abstract

A system for inserting a wire into a semiconductor chip system includes positioning members for deploying and moving a length of the wire between a first end and a second end of a workspace. A handling device of the system is configured to handle the semiconductor chip, and is capable of placing the chip in an insertion position in which a groove of the chip is placed opposite the wire. A positioning member of the system is configured to arrange a longitudinal section of the wire along the groove, in forced abutment against a pad of the chip made of a bonding material having a melting point. A heating member of the system is configured to heat a zone comprising the pad to a processing temperature above the melting point to melt the pad and provoke insertion of the wire into the groove.

IPC Classes  ?

• G05B 19/4097 - Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by using design data to control NC machines, e.g. CAD/CAM
• G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier

Abstract

The invention relates to a flexible and deformable electronic tag (1) comprising: - a first wire element (2) incorporating a wired electronic device (2a), the first wire element (2) being arranged in a serpentine pattern in a main plane to define a plurality of loops (b); - at least one flexible wire element (3) arranged in a longitudinal direction (d) in the main plane; the first wire element (2) and the flexible wire element (3) being held together at a plurality of junctions (j).

IPC Classes  ?

• G06K 19/02 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
• G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier

Abstract

The invention relates to a functional chip (100) of which at least two electrical connection pads (11a, 11b) are intended for being connected to wire elements (40a, 40b). Said chip comprises: - a substrate (10) comprising a microelectronic component electrically connected to the two electrical connection pads arranged on a front face of said substrate (10), - a cover (20) comprising a first portion (21) assembled to the front face of the substrate (10), said first portion (21) forming a spacer between the two electrical connection pads; the cover (20) further comprising a second portion (22) spaced apart from the front face of the substrate (10) and extending opposite each electrical connection pad only partially, so as to allow access to said pads, along an axis (z) normal to the front face of the substrate (10). The invention likewise relates to a method for manufacturing such a functional chip.

IPC Classes  ?

• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
• H01L 23/498 - Leads on insulating substrates
• H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Abstract

The invention relates to a method for making a textile part (A; A1, A2), comprising a step of forming a stitched seam (c1, c2, c3; C). The stitched seam step also aims to secure an electronic tag (1) to the textile part (A; A1, A2). The electronic tag (1) is formed from a strip comprising a wired electronic device comprising a chip (3a) associated with at least one antenna wire (3b), the chip (3a) and the antenna wire (3b) being arranged inside the stitched seam (c1, c2, c3; C). The invention also relates to the textile part provided with the tag.

IPC Classes  ?

• G06K 19/02 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine

Abstract

A radiofrequency transmission/reception device includes a first and a second conductive wire element, a first far-field transmission/reception chip and a second near-field transmission/reception chip. The first and the second wire element combine with the characteristic impedance of the second transmission/reception chip in order to form a coupling device associated with the first transmission/reception chip at the operating frequency of the first chip. The first and the second wire element combine with the characteristic impedance of the first transmission/reception chip in order to form a coupling device associated with the second transmission/reception chip at the operating frequency of the second chip.

IPC Classes  ?

• H01Q 5/342 - Individual or coupled radiating elements, each element being fed in an unspecified way for different propagation modes
• H01Q 5/321 - Individual or coupled radiating elements, each element being fed in an unspecified way using frequency dependent circuits or components, e.g. trap circuits or capacitors within a radiating element or between connected radiating elements
• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
• H01Q 7/06 - Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
• H01Q 9/16 - Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
• H04B 5/00 - Near-field transmission systems, e.g. inductive or capacitive transmission systems
• H04B 7/24 - Radio transmission systems, i.e. using radiation field for communication between two or more posts

Abstract

A method for joining a microelectronic chip to at least one wire element comprises a first step of applying a cover to a first face of the microelectronic chip, the cover being configured to form, with the first face, at least one temporary side groove. The method additionally comprises a step of inserting the wire element into the temporary groove. The method further comprises a step of attaching the wire element to the microelectronic chip. The method additionally comprises a step of removing the cover from the microelectronic chip.

IPC Classes  ?

• H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping

Abstract

A method for inserting a wire into a longitudinal groove of a semiconductor chip for the assembly thereof, the groove containing a pad made of a bonding material having a set melting point, comprises: in a positioning step, placing a longitudinal section of the wire along the groove, in forced abutment against the pad; and, in an insertion step, exposing a zone containing at least one portion of the pad to a processing temperature higher than the melting point of the bonding material and for a sufficient time to make the pad at least partially melt, and causing the wire to be inserted into the groove. The present disclosure also relates to a piece of equipment allowing the insertion method to be implemented.

IPC Classes  ?

• G05B 19/4097 - Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by using design data to control NC machines, e.g. CAD/CAM
• G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier

Abstract

The invention relates to a textile covered wire (11) comprising a main core (12) and at least a first primary covering wire (13a) wound in turns around the main core (12). According to the invention, the first primary covering wire (13a) comprises at least one conductive wire element (3; 3a, 3b) electrically connected to at least one electronic chip (2). The invention also relates to a method for producing such a wire.

IPC Classes  ?

• D02G 3/44 - Yarns or threads characterised by the purpose for which they are designed

Abstract

The invention concerns a patch antenna for electrically coupling an RFID device to a tester, the RFID device being capable of communicating at an operating wavelength. The antenna comprises a planar dielectric substrate, a resonant transmission line arranged on a first face of the substrate and a coupler for linking the resonant transmission line to the tester. The transmission line comprises a half-wave main line having a first end and a second end, first and second impedance adjustment circuits electrically connected respectively to the first and second ends of the main line to impose a voltage node at these ends when a signal having the operating wavelength propagates in the transmission line. The invention also concerns a piece of test equipment provided with such a patch antenna.

IPC Classes  ?

• H01Q 1/22 - SupportsMounting means by structural association with other equipment or articles
• H01Q 9/42 - Resonant antennas with feed to end of elongated active element, e.g. unipole with folded element, the folded parts being spaced apart a small fraction of the operating wavelength

Abstract

The invention relates to a method for joining a microelectronic chip (1) to at least one wire element (7a, 7b). The joining method comprises: • a first step of applying a cover (5) to a first face of the microelectronic chip (1), the cover (5) being configured to form, with the first face (11), at least one temporary side groove; • a step of inserting the wire element (7a, 7b) into the temporary groove; • a step of attaching the wire element (7a, 7b) to the microelectronic chip (1); • a step of removing the cover (5) from the microelectronic chip (1).

IPC Classes  ?

• H01L 23/00 - Details of semiconductor or other solid state devices
• G06K 19/02 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
• H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
• H01L 21/58 - Mounting semiconductor devices on supports
• H01L 23/488 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of soldered or bonded constructions
• H01L 23/49 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of soldered or bonded constructions wire-like
• H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
• H01L 21/50 - Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups or
• H01L 23/58 - Structural electrical arrangements for semiconductor devices not otherwise provided for
• H01L 25/00 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices

Abstract

The invention relates to a radiofrequency transmission/reception device (10) comprising a first and a second conductive wire element (4a, 4b), a first far-field transmission/reception chip (21) and a second near-field transmission/reception chip (22). The first and the second wire element (4a, 4b) combining with the characteristic impedance of the second transmission/reception chip (22) in order to form a coupling device associated with the first transmission/reception chip (21) at the operating frequency of the first chip (21). The first and the second wire element (4a, 4b) combining with the characteristic impedance of the first transmission/reception chip (21) in order to form a coupling device associated with the second transmission/reception chip (22) at the operating frequency of the second chip (22).

IPC Classes  ?

• H01L 23/66 - High-frequency adaptations
• H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
• H04B 1/00 - Details of transmission systems, not covered by a single one of groups Details of transmission systems not characterised by the medium used for transmission
• H04B 5/00 - Near-field transmission systems, e.g. inductive or capacitive transmission systems
• G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
• H01Q 1/22 - SupportsMounting means by structural association with other equipment or articles
• H01Q 5/30 - Arrangements for providing operation on different wavebands

Abstract

The invention relates to a method for inserting a wire (7a, 7b) into a longitudinal groove of a semiconductor chip (1) for the assembly thereof, the groove containing a pad (6a, 6b) made of a bonding material having a set melting point, the method comprising: in a positioning step, placing a longitudinal section of the wire (7a, 7b) along the groove, in forced abutment against the pad (6a, 6b); and, in an insertion step, exposing a zone containing at least one portion of the pad (6a, 6b) to a processing temperature higher than the melting point of the bonding material and for a sufficient time to make the pad (6a, 6b) at least partially melt, and causing the wire (7a, 7b) to be inserted into the groove. The invention also relates to a piece of equipment allowing the insertion method to be implemented.

IPC Classes  ?

• H01L 23/00 - Details of semiconductor or other solid state devices

Goods & Services

Microelectronic, optoelectronic and micromechanical components for the production of primary wired structures for holding chips. Textile fibers including microelectronic, optoelectronic and micromechanical components. Assembling of microelectronic, optoelectronic and micromechanical components for textile use or production. Research and development of new products and new processes for others; engineering services (design and development of wired electronic solutions made with dedicated integrated circuits including circuit design); professional consulting in the field of microelectronics, optoelectronics and micromechanics in the field of microtechnology and nanotechnology; materials testing (electromagnetic adaptation of radio solutions implemented in the form of wires); laboratory research for others in the field of microelectronics, optoelectronics, micromechanics in the field of microtechnology and nanotechnology.

Goods & Services

Assembly of products for others in the nature of assembling of microelectronic, optoelectronic and micromechanical components for textile use or production Microelectronic, optoelectronic and micro mechanical components for the production of primary wired structures for holding chips for use as computation, communication and information storage hardware, namely, microprocessors, micro controllers, digital memory and network interfaces for computers and transmitters of electronic signals; RFID semiconductor chips; signal emitters, namely, light emitting, sound or ultrasound emitting devices in the nature of semiconductor chips; Radio frequency emitters, namely, radio frequency generators for supplying radio frequency energy; temperature sensors, electric sensors in the nature of capacitive sensors, resistive sensors, biometric sensors and chemical sensors, pressure sensors, attitude and motion sensors; energy harvesting hardware, namely, photovoltaic cells, radio-frequency rectifiers Textile fibers including microelectronic, optoelectronic and micromechanical components Research and development of new products, new engineering processes, and new manufacturing processes for others; engineering services including design and development of wired electronic solutions made with dedicated integrated circuits including circuit design; professional consulting in the field of microelectronics, optoelectronics and micromechanics in the field of microtechnology and nanotechnology; materials testing including electromagnetic adaptation of radio solutions implemented in the form of wires; laboratory research for others in the field of microelectronics, optoelectronics, micromechanics in the field of microtechnology and nanotechnology

Goods & Services

Microelectronic, optoelectronic and micromechanical components for creating primary wire structures for supporting chips. Textile fibres, including microelectronic, optoelectronic and micromechanical components. Assembly of microelectronic, optoelectronic and micromechanical components for creating primary wire structures for supporting chips or for textile use. Research and development of new products and new processes, for others; Engineering (design and implementation of wire electronics solutions based on dedicated integrated circuits, including the design of the aforesaid circuits); Professional consultancy relating to microelectronics, optoelectronics and micromechanics in the field of microtechnology and nanotechnology; Material testing (electromagnetic adaptation of wireless solutions implemented in the form of wires); Laboratory research, for others, relating to microelectronics, optoelectronics and micromechanics in the field of microtechnology and nanotechnology.