rhmaxmax, where the first grains (15) have a mean grain form factor, preferably determined as the arithmetic mean value, of less than 0.5, preferably less than 0.4 and more preferably less than 0.3, and where the first grains are oriented isotropically in the ceramic element.
C04B 35/581 - Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxides based on borides, nitrides or silicides based on aluminium nitride
The invention relates to a support substrate (1), in particular a metal-ceramic substrate, as a support for electric components in the form of a printed circuit board, comprising: - at least one metal layer (10) and - an insulation element (30), in particular a ceramic element, a glass element, a glass-ceramic element, and/or a high temperature-resistant plastic element, wherein the at least one metal layer (10) and the insulation element (30) extend along a main extension plane (HSE) and are arranged one over the other along a stacking direction (S) which runs perpendicularly to the main extension plane (HSE). A binding layer (12) is formed between the at least one metal layer (10) and the insulation element (30) in the completed support substrate (1), and a contact layer (13) of the binding layer (12) - comprises preferably a titanium-nitrogen compound and/or a titanium-silicon compound and - has a first thickness, which is measured in the stacking direction (S) and which is averaged over a plurality of measurement points within one or more specified surfaces (F) that run/runs parallel to the main extension plane (HSE), said thickness equaling less than 900 nm, preferably less than 700 nm, preferably less than 500 nm.
H05K 3/02 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
3.
COOLING DEVICE AND METHOD FOR PRODUCING SUCH A COOLING DEVICE
The invention relates to a cooling device (1) for cooling an assembly of electrical or electrical components (4, 4'), in particular laser diodes, having a main body (2), wherein the main body (2) has a component region (BB) with a first connection region (A1) on an outer side, on which connection region a first component (4) can be mounted, and a second connection region (A2), on which a second component (4) can be mounted, wherein the first connection region (A1) and the second connection region (A2) are offset in height relative to one another in an offset direction (V), wherein the main body (2) has a cooling duct system, wherein the cooling duct system comprises a first cooling portion (41) for cooling the first connection region (A1) and a second cooling portion (42) for cooling the second connection region (A2), wherein the first cooling portion (41) and the second cooling portion (42) are designed in such a way that a first cooling effect of the first cooling portion (41) on the first connection region (A1) and a second cooling effect of the second cooling portion (42) on the second connection region (A2) deviate from a mean value of the first cooling effect and the second cooling effect by less than 15%, preferably less than 10% and particularly preferably less than 5% of the mean value of the first cooling effect and the second cooling effect.
A metal-ceramic substrate, which can be used as a circuit board and comprises - a ceramic element and - at least one component metallization bonded to the ceramic element, wherein: the component metallization is structured in order to form conductor tracks; the ceramic element comprises magnesium oxide; and a magnesium oxide proportion is greater than 60 wt.-%, preferably greater than 80% and especially preferably greater than 95 wt.-%.
C04B 35/04 - Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on magnesium oxide, calcium oxide or oxide mixtures derived from dolomite based on magnesium oxide
C04B 37/02 - Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
H01L 21/00 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
5.
PROCESS FOR PRODUCING A METAL-CERAMIC SUBSTRATE, AND A METAL-CERAMIC SUBSTRATE PRODUCED USING SUCH A PROCESS
A process for producing a metal-ceramic substrate (1) for use as a circuit board, comprising - providing a silicon wafer (40), preferably a doped or non-doped silicon wafer (40, - nitriding the silicon wafer (40) in order to produce a silicon nitride layer (31), - bonding a metal layer (10) to the silicon nitride layer (31), and - structuring the metal layer (10) in order to form a metallized layer.
The invention relates to a method for producing a metal-ceramic substrate (1), which is designed as a printed circuit board, having the steps of: - providing a starting block (2) which comprises silicon, - separating (104) a wafer (4) from the starting block (2), in particular from the completely nitrided, partially nitrided, or non-nitrided starting block (2), - nitriding (105a) the wafer (4), if the wafer (4) has a first density, and/or the starting block (2), if the starting block (2) has a first density, - carrying out at least one sintering step (105b) in order to set a second density in the nitrided wafer (4) and/or the nitrided starting block (2), wherein the second density is greater than the first density, and - connecting (107) a metal layer (10) to the nitrided and sintered wafer (30) in order to form a metal-ceramic substrate (1).
C04B 35/584 - Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxides based on borides, nitrides or silicides based on silicon nitride
C04B 35/591 - Fine ceramics obtained by reaction sintering
C04B 35/626 - Preparing or treating the powders individually or as batches
C04B 37/02 - Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
METHOD FOR PRODUCING A METAL-CERAMIC SUBSTRATE, CERAMIC ELEMENT AND METAL LAYER FOR SUCH A METHOD, AND METAL-CERAMIC SUBSTRATE PRODUCED BY SUCH A METHOD
A method for producing a metal-ceramic substrate (1), comprising – providing at least one first metal layer (10) for forming a component metallization and a ceramic element (30), – bonding the at least one first metal layer (10) to the ceramic element (30) by means of a direct bonding method, more particularly a DCB method or a DAB method, to form a common first bonding layer (12) between the ceramic element (30) and the at least one metal layer (10), a first agent for promoting formation of spinel being provided in a region intended for the formation of the first bonding layer (12) in order to improve adhesive strength between the at least one first metal layer (10) and the ceramic element (30) for the bonding by means of the direct bonding method.
A method of manufacturing a metal-ceramic substrate (1), comprising:
providing a ceramic element (30) and at least one metal layer (10), wherein the ceramic element (30) and the at least one metal layer (10) extend along a main extension plane (HSE); and
bonding the ceramic element (30) to the at least one metal layer (10) to form a metal-ceramic substrate (1), in particular by means of a direct metal bonding process, hot isostatic pressing and/or a soldering process,
wherein a structuring, preferably for forming an isolation of metal sections (10′), and/or a recess, preferably for forming a solder stop, is realized in the at least one metal layer (10) by means of a laser process and a chemical process, in particular an etching process.
H01L 23/373 - Cooling facilitated by selection of materials for the device
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups
9.
METHOD FOR MACHINING A METAL-CERAMIC SUBSTRATE, SYSTEM FOR SUCH A METHOD AND METAL-CERAMIC SUBSTRATES PRODUCED USING SUCH A METHOD
A method of processing a metal-ceramic substrate (1), including
providing a metal-ceramic substrate (1), wherein the metal-ceramic substrate (1) comprises at least one metal layer (21) and one ceramic element (11), which extend along a main extension plane (HSE) and are arranged one above the other along a stacking direction (S) extending perpendicularly to the main extension plane (HSE), and
forming a recess (15), in particular a through recess (15), in the metal-ceramic substrate (1) by processing by means of laser light (10), in particular of an ultrashort pulse (UKP) laser.
Printed circuit board (100) for electrical components (5) and/or conducting paths (4), comprising
a base body (2) extending along a main extension plane (HSE), and
an insert (1) integrated in the base body (2),
wherein the insert (1) comprises a metal-ceramic substrate (15), an electrical and/or electronic component (5), and an encapsulation (10) enclosing at least the electrical and/or electronic component (5).
A method for machining a metal-ceramic substrate (1), in particular for producing a predetermined breaking point, comprising:
providing a metal-ceramic substrate (1) and
forming a predetermined breaking point (7) in the metal-ceramic substrate (1) wherein the predetermined breaking point (7) has along a direction (V) thereof at least a first portion (A1) having a first depth (T1) and at least a second portion (A2) having a second depth (T2), wherein a second depth (T2) is realized, which is different from the first depth (T1).
Proposed is an electronics module (100), in particular a power electronics module, comprising - a metal-ceramic substrate (1) which serves as a carrier and has a ceramic element (10) and a primary component metallization (21) and preferably a cooling side metallization (20), - an insulation layer (40) which is directly or indirectly connected to the primary component metallization (21), and - a secondary component metallization (22), said secondary component metallization being connected to the side of the insulation layer (40) which faces away from the ceramic element (10) and in particular being insulated with respect to the primary component metallization (21) by the insulation layer (40), wherein the ceramic element (10) has a first size (L, D) and the insulation layer (40) has a second size (L1, D1), and wherein, to form an island-like insulation layer (40) on the primary component metallization (21), a ratio of the second size (L1, ID1) to the first size (L, D) has a value that is less than 0.4, preferably less than 0.22 and particularly preferably less than 0.15 or even less than 0.1, and wherein, as viewed in a direction running perpendicularly to the main plane of extent (HSE), an outer side (A) of the secondary component metallization (22) and an outer side (A) of the first component metallization (21) end substantially at a common height.
H01L 23/373 - Cooling facilitated by selection of materials for the device
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 23/50 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements for integrated circuit devices
13.
PRINTED CIRCUIT BOARD, METAL-CERAMIC SUBSTRATE AS AN INSERT, AND METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD
The invention relates to a printed circuit board (100) for electrical components (5) and/or conductor tracks (4), comprising - a base body (2) which extends along a main extension plane (HSE), and - an insert (1) which, in a mounted state, is integrated into the base body (2), wherein the insert (1) is a metal-ceramic substrate (10), wherein the metal-ceramic substrate (1) is at least in some sections covered, in particular surrounded, by an insulation element (8) on a side surface (SF) facing the main body (2) in the mounted state.
The present invention relates to a method for producing a metal-ceramic substrate (1) comprising: —providing a ceramic element (30) and at least one metal layer (10), wherein the ceramic element (30) and the at least one metal layer (10) extend along a main extension plane (HSE), —joining the ceramic element (30) to the at least one metal layer (10) to form a metal-ceramic substrate (1), in particular by means of a direct metal joining method, a hot isostatic pressing method and/or a soldering method, and —machining the at least one metal layer (10) by means of a machine tool (40) and/or laser light in order to define a geometry, at least in some portions, of a side face (15) of the at least one metal layer (10) not running parallel to the main extension plane (HSE).
The invention relates to a process for producing a metal-ceramic substrate (1), comprising: —providing a ceramic element (10), a metal ply (40) and at least one metal layer (30), —forming an ensemble (18) of the ceramic element (10), the metal ply (40) and the at least one metal layer (30), —forming a gas-tight container (30) surrounding the ceramic element (10), wherein the at least one metal layer (30) is arranged between the ceramic element (10) and the metal ply (40) in the container, and—forming the metal-ceramic substrate (1) by hot isostatic pressing.
The invention relates to a metal-ceramic substrate (1) as carrier for electric components, in particular in the form of a printed circuit board, comprising: - a ceramic element (20) and - at least one metal layer (10, 20), wherein the at least one metal layer (10) and the ceramic element (20) extend along a main extension plane (HSE) and are arranged one above the other in a stacking direction (S) running perpendicularly to the main extension plane (HSE), wherein a binding layer (12) is formed between the at least one metal layer (10, 20) and the ceramic element (30) in the manufactured metal-ceramic substrate (1), and wherein an adhesion promoter layer of the binding layer (12) has a surface resistance which is greater than 5 Ohm/sq, preferably greater than 10 Ohm/sq, particularly preferably greater than 20 Ohm/sq, wherein a via (15) is formed in the ceramic element (30).
The invention relates to a carrier substrate (1) for electrical components (4), comprising: - a heat sink (20), and - a ceramic element (71), wherein the ceramic element (71) is bonded at least in some sections to the heat sink (20), wherein in the finished carrier substrate (1) a bonding layer without solder material is formed between the heat sink (20) and the ceramic element (71), and wherein an adhesion promoter layer of the bonding layer has a sheet resistance greater than 5 ohms/square, preferably greater than 10 ohms/square and particularly preferably greater than 20 ohms/square.
H01L 23/373 - Cooling facilitated by selection of materials for the device
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
H01L 23/467 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing gases, e.g. air
18.
CARRIER ELEMENT FOR ELECTRICAL COMPONENTS, AND METHOD FOR PRODUCING A CARRIER ELEMENT OF THIS TYPE
The invention relates to a carrier element (1) for electrical components (4), wherein the carrier element (1) comprises a metal cooling body (20) for dissipating heat emitted by the electrical component during operation, wherein the cooling body (20) has a metal grain size distribution with an average grain size, wherein the average grain size is in the region of between 10 and 800 μm, preferably between 100 and 700 μm, and particularly preferably between 300 und 600 μm, characterised in that the cooling body (20) comprises an oxide-containing corrosion-protection layer (30) at least in sections.
H01L 23/373 - Cooling facilitated by selection of materials for the device
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups
F28F 19/02 - Preventing the formation of deposits or corrosion, e.g. by using filters by using coatings, e.g. vitreous or enamel coatings
A support substrate (1), in particular a metal-ceramic substrate, as a support for electric components, comprising: —at least one metal layer (10) and—an insulating element (30), in particular a ceramic element, a glass element, a glass ceramic element, and/or a high temperature-resistant plastic element. The at least one metal layer (10) and the insulating element (30) extend along a main extension plane (HSE) and are arranged one over the other in a stacking direction (S) running perpendicularly to the main extension plane (HSE), wherein in a completed support substrate (1), a binding layer (12) is formed between the at least one metal layer (10) and the insulating element (30), and an adhesive layer (13) of the binding layer (12) has a surface resistance which is greater than 5 Ohm/sq.
The invention relates to a process for producing a metal-ceramic substrate (1), comprising:
providing a ceramic element (10) and a metal layer,
providing a gas-tight container (25) that encloses the ceramic element (10), the container (25) preferably being formed from the metal layer or comprising the metal layer,
forming the metal-ceramic substrate (1) by connecting the metal layer to the ceramic element (10) by means of hot isostatic pressing, wherein, for the purpose of forming the metal-ceramic substrate (1), an active metal layer (15) or a contact layer comprising an active metal is arranged at least in some sections between the metal layer and the ceramic element (10) for supporting the connection of the metal layer to the ceramic element (10).
Metal-ceramic substrate (1), which is provided as a printed circuit board for mounting electrical components, comprising: - a component metallization (10) and a backside metallization (20) and - a ceramic element (30), which is arranged between the component metallization (10) at the backside metallization (20) along a stacking direction (S), wherein the component metallization (10) has a first metal portion (11) and a second metal portion (12), wherein the first metal portion (11) and the second metal portion (12) are separated from one another by an insulating portion (15), and wherein the backside metallization (20) has a material weakening (25), in particular a material cut-out, which, seen in the stacking direction (S), is arranged congruent with the insulating portion (15).
wherein the ceramic element (10) has a first size (L1, D1) and the insulation layer (40) has a second size (L2, D2) and a ratio of the second size (L2, D2) to the first size (L1, D1) has a value smaller than 0.8, to form an island-like insulation layer (40) on the primary component metallization (21).
Solder material, method for producing a solder material of this type and use of a solder material of this type in order to connect a metal layer to a ceramic layer
A solder material (30) for bonding a metal layer (20) to a ceramic layer (10), in particular for forming a metal-ceramic substrate as a carrier for electrical components, comprising:
a base material and
an active metal,
wherein the solder material (30) is a foil comprising the base material in a first layer (31) and the active metal in a second layer (32), and
wherein the foil has a total thickness (GD) which is less than 50 μm, preferably less than 25 μm and particularly preferably less than 15 μm.
wherein the first primary structuring (21) and the second primary structuring (31), as viewed in the stacking direction (S), run congruently at least in portions.
A method of manufacturing a cooling element, including:
providing at least one first metal layer and at least one second metal layer,
oxidizing the at least one first metal layer and/or the at least one second metal layer,
structuring the at least one first metal layer and/or the at least one second metal layer to form at least one recess,
joining the at least one first metal layer and the at least one second metal layer to form the cooling element, wherein, in the joined state, at least a partial section of a cooling channel in the cooling element is formed by the recess in the at least one first metal layer and/or the at least one second metal layer, and wherein,
prior to the joining, an inner side of the recess is provided at least in sections free of an oxidized surface.
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
H01L 23/373 - Cooling facilitated by selection of materials for the device
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups
B23K 1/00 - Soldering, e.g. brazing, or unsoldering
B23K 35/30 - Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
B23K 35/34 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material comprising compounds which yield metals when heated
B23K 35/36 - Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
The invention relates to a carrier substrate (1), in particular a metal ceramic substrate, comprising an insulation layer (11) and a metal layer (12), wherein, in a primary direction (P) running parallel to the main extension plane (HSE), the metal layer (12) terminates, at least in some regions, in a flank profile (2), particularly an etched flank profile, wherein, when seen in the primary direction (P), the flank profile (2) extends from a first edge (15) on a top side (31) of the metal layer (12) facing away from the insulation layer (11) to a second edge (16) on a bottom side (32) of the metal layer (12) facing the insulation layer (11), characterised in that, when seen in the primary direction (P), the flank profile (2) has at least one first section (A1) having a straight extension and at least one second section (A2) with a curved extension.
H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
C04B 37/02 - Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
H01L 23/373 - Cooling facilitated by selection of materials for the device
The present invention relates to a method for producing a metal-ceramic substrate (1) comprising: - providing a ceramic element (30) and at least one metal layer (10), wherein the ceramic element (30) and the at least one metal layer (10) extend along a main extension plane (HSE), - joining the ceramic element (30) to the at least one metal layer (10) to form a metal-ceramic substrate (1), in particular by means of a direct metal joining method, a hot isostatic pressing method and/or a soldering method. A structuring, preferably for forming an insulation of metal sections (10') and/or a recess, preferably for forming a solder stop is provided in the at least one metal layer (10) by means of a laser method and a chemical method, in particular an etching.
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups
29.
Method for producing a metal-ceramic substrate, and metal-ceramic substrate produced using such a method
Method of manufacturing a metal-ceramic substrate (1) which, in the finished state, has a ceramic layer (11) and a metal layer (12) extending along a main extension plane (HSE) and arranged one above the other along a stacking direction (S) extending perpendicularly to the main extension plane (HSE) comprising providing the metal layer (12) and the ceramic layer (11) and bonding the metal layer (12) to the ceramic layer (11) in regions to form a first region (B1), which has a materially bonded connection between the metal layer (12) and the ceramic layer (11), and a second region (B2), in which the metal layer (12) and the ceramic layer (11) are arranged one above the other without a materially bonded connection, as seen in the stacking direction (S).
H05K 3/02 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
B23K 1/00 - Soldering, e.g. brazing, or unsoldering
C04B 37/02 - Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
H05K 3/38 - Improvement of the adhesion between the insulating substrate and the metal
Disclosed is a printed circuit board (100) for electrical components (5) and/or conductor tracks (4), comprising: - a main part (2) which extends along a main plane of extent (HSE), and - an insert (1) which is integrated into the main part (2), the insert (1) comprising a metal-ceramic substrate (15), an electrical and/or electronic component (5), and an enclosure (10) which surrounds at least the electrical and/or electronic component (5).
The invention relates to a method for processing a metal-ceramic substrate (1), comprising: - providing a metal-ceramic substrate (1) and - forming a predetermined breaking recess (7) in the metal-ceramic substrate (1), the predetermined breaking recess (7) having along its direction of extension (V) a first portion (A1) with a first depth (T1) and a second portion (A2) with a second depth (T2), wherein a second depth (T2) is achieved, which differs from the first depth (T1).
B23K 26/0622 - Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
B23K 26/364 - Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
B23K 26/359 - Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
Electronic module (1) including
an encapsulation (20),
a carrier substrate (10) enclosed by the encapsulation (20) and having a component side (25) which has a first metallization layer (15) and on which at least one first electronic component (30) is arranged,
wherein at least one second metallization layer (35) for at least one second electronic component (31), in particular for controlling the first electronic component (30), is provided on an outer side (A) of the encapsulation (2),
wherein the encapsulation (20) has at least one plated-through hole (5) for electrical connection, in particular for direct electrical connection, of the first electronic component (30) and the second electronic component (31).
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices
33.
ADAPTER ELEMENT FOR CONNECTING AN ELECTRONICS COMPONENT TO A HEAT SINK ELEMENT, SYSTEM COMPRISING AN ADAPTER ELEMENT OF THIS KIND, AND METHOD FOR PRODUCING AN ADAPTER ELEMENT OF THIS KIND
An adapter element (10) for connecting an electronic component (30) to a heat sink element (20), including an insulation layer (15) extending along a main extension plane (HSE), and at least a first web element (11) and a second web element (12), which are arranged next to each other in a direction parallel to the main extension plane (HSE), forming a free area (13), which, in the assembled state, are arranged between the insulating layer (15) and the electronic component (30) in a direction running perpendicular to the main extension plane (HSE), and on whose front sides (18) facing away from the insulating layer (15) the electronic component (30) is arranged in the assembled state, wherein a distance (A) between the first web element (11) and the second web element (12), measured in a plane parallel to the main extension plane (HSE), is smaller than 350 μm.
A method for manufacturing a cooling element (1) for an electrical or electronic component, in particular a semiconductor element, the manufactured cooling element (1) having a cooling fluid channel system through which a cooling fluid can be passed during operation, comprising
providing at least a first metal layer (11)
realizing at least one recess (21, 22) in the at least one first metal layer (11), and
forming at least a partial section of the cooling fluid channel system by means of the at least one recess (21, 22),
wherein at least a first part (21) of the at least one recess (21, 22) in the at least first metal layer (11) is realized by erosion, in particular spark erosion.
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
35.
PROCESS FOR PRODUCING A METAL-CERAMIC SUBSTRATE AND METAL-CERAMIC SUBSTRATE PRODUCED USING SUCH A PROCESS
The present invention relates to a process for producing a metal-ceramic substrate (1) comprising: • - providing a metal layer (10) and a ceramic element (20), • - forming at least one first recess (21) on a first side (S1) of the metal layer (10) and • - joining the metal layer (10) and the ceramic element (20), preferably using a soldering process or a direct bonding process, wherein the ceramic element (20) is bonded to the first side (S1) of the metal layer (10), wherein upon forming the at least one first recess (10) on a second side (S2) opposite the first side (S1) a first residual metal partial layer (31) extending parallel to the main extension plane (HSE) is left behind, wherein after the joining of the metal layer (10) and the ceramic layer (20) the first residual metal partial layer (31) is removed at least in regions to reveal an insulation trench, wherein a ratio of the first thickness (D1) of the first residual metal partial layer (31) to the thickness (D) of the metal layer (10) is greater than 0.1, preferably greater than 0.25 and particularly preferably greater than 0.4 or even greater than 0.5, to counter sagging of the metal-ceramic substrate (1) during joining of the metal layer (10) and the ceramic element (20).
The invention relates to a printed circuit board (100) for electrical components (5) and/or conductor tracks (4), comprising - a base body (2) which extends along a main extension plane (HSE), and - an insert (1) which is integrated into the base body (2), wherein the insert (1) is a metal-ceramic substrate (10) and cooperates with the base body (2) in a form-fitting and preferably a bonded manner in a direction that is perpendicular to the main extension plane (HSE).
The invention relates to a method for producing a support substrate (1), in particular a metal-ceramic substrate, having the steps of: - providing an insulating element (10), in particular a ceramic element or a glass element, and at least one metal layer (20), said insulating element (10) and at least one metal layer (20) extending along a main extension plane (20), - providing a soldering material (30), - forming a stack in which the insulating element (10), the at least one metal layer (20), and the soldering material (30) are arranged one over the other in a stack direction (S) running perpendicularly to the main extension plane (HSE), wherein the soldering material (30) is arranged between the insulating element (10) and the at least one metal layer (10), and - attaching the at least one metal layer (20) to the insulating element (10) via the soldering material (30), said at least one metal layer (20) comprising an active metal.
The invention relates to a process for producing a metal-ceramic substrate (1), comprising: - providing a ceramic element (10), a metal ply (40) and at least one metal layer (30), - forming an ensemble (18) of the ceramic element (10), the metal ply (40) and the at least one metal layer (30), - forming a gas-tight container (30) surrounding the ceramic element (10), wherein the at least one metal layer (30) is arranged between the ceramic element (10) and the metal ply (40) in the container, and - forming the metal-ceramic substrate (1) by hot isostatic pressing.
The invention relates to a power module (1) for electrical components (19), said module comprising: - a ceramic layer (30), a primary metal layer (10) and a secondary metal layer (20), the primary metal layer (10) and the secondary metal layer (20) being provided on opposite sides of the ceramic layer (30), the ceramic layer (30) having a first ceramic portion (31) and a second ceramic portion (32) spaced apart from the first ceramic portion (31) by a gap (5), and a metal-free region being formed below and above the gap (5) which serves as an expansion joint.
The present invention relates to a method for producing a metal-ceramic substrate (1) comprising: - providing a ceramic element (30) and at least one metal layer (10), wherein the ceramic element (30) and the at least one metal layer (10) extend along a main extension plane (HSE), - joining the ceramic element (30) to the at least one metal layer (10) to form a metal-ceramic substrate (1), in particular by means of a direct metal joining method, a hot isostatic pressing method and/or a soldering method, and - machining the at least one metal layer (10) by means of a machine tool (40) and/or laser light in order to define a geometry, at least in some portions, of a side face (15) of the at least one metal layer (10) not running parallel to the main extension plane (HSE).
A carrier substrate (1) that includes an insulation layer (11) and a metal layer (12), wherein a flank profile (2), in particular an etching flank profile, at least zonally borders the metal layer (12) in a primary direction (P) extending parallel to the main extension plane (HSE), wherein, viewed in the primary direction (P), the flank profile (2) extends from a first edge (15) on an upper side (31) of the metal layer (12), which faces away from the insulation layer (11), to a second edge (16) on a lower side (32) of the metal layer (12), which faces the insulation layer (11), characterized in that the flank profile (2), viewed in the primary direction (P), has at least one local maximum (21) and at least one local minimum (22).
A method of processing a metal-ceramic substrate (1), comprising: processing the metal-ceramic substrate (1) by irradiating the metal-ceramic substrate (1) with laser light, in particular for forming a predetermined breaking point (5); wherein a surface topography of the metal-ceramic substrate (1) is measured at least in regions in a first measuring step preceding the irradiation and/or in a second measuring step following the irradiation.
B23K 26/364 - Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
B23K 26/402 - Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
B23K 26/03 - Observing, e.g. monitoring, the workpiece
B23K 26/0622 - Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
G01B 11/22 - Measuring arrangements characterised by the use of optical techniques for measuring depth
G01B 11/06 - Measuring arrangements characterised by the use of optical techniques for measuring length, width, or thickness for measuring thickness
B23Q 7/02 - Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting by means of drums or rotating tables or discs
43.
SUPPORT SUBSTRATE AND METHOD FOR PRODUCING A SUPPORT SUBSTRATE
The invention relates to a method for producing a support substrate (1), in particular a metal-ceramic substrate, according to one of the previous claims, having the steps of: - providing at least one metal layer (10) and an insulating element (30), in particular a ceramic element (30), a glass element, a glass-ceramic element, and/or a high temperature-resistant plastic element, said at least one metal layer (10) and insulating element (30) extending along a main extension plane (HSE), - arranging the at least one metal layer (10) and the insulating element (30) one over the other in a stacking direction (S) running perpendicularly to the main extension plane (HSE), wherein an active metal layer (15) is arranged between the at least one metal layer (10) and the insulating element (30), and - binding the at least one metal layer (10) to the insulating element (30) via the active metal layer (15), thereby forming a binding layer (13) between the at least one metal layer (10) and the insulating element (30), a structured binding layer (12) being formed in particular during the binding process.
H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
H05K 3/02 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices
H05K 3/04 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
H05K 3/38 - Improvement of the adhesion between the insulating substrate and the metal
B32B 17/06 - Layered products essentially comprising sheet glass, or fibres of glass, slag or the like comprising glass as the main or only constituent of a layer, next to another layer of a specific substance
The invention relates to a support substrate (1), in particular a metal-ceramic substrate, as a support for electric components, comprising: - at least one metal layer (10) and - an insulating element (30), in particular a ceramic element, a glass element, a glass ceramic element, and/or a high temperature-resistant plastic element. The at least one metal layer (10) and the insulating element (30) extend along a main extension plane (HSE) and are arranged one over the other in a stacking direction (S) running perpendicularly to the main extension plane (HSE), wherein in a completed support substrate (1), a binding layer (12) is formed between the at least one metal layer (10) and the insulating element (30), and an adhesive layer (13) of the binding layer (12) has a surface resistance which is greater than 5 Ohm/sq, preferably greater than 10 Ohm/sq, particularly preferably greater than 20 Ohm/sq.
B32B 17/06 - Layered products essentially comprising sheet glass, or fibres of glass, slag or the like comprising glass as the main or only constituent of a layer, next to another layer of a specific substance
The invention relates to a support substrate (1), in particular as a support for electric components, comprising: - at least one metal layer (10) and - an insulating element (30). The at least one metal layer (10) and the insulating element (30) extend substantially parallel to a main extension plane (HSE) and are arranged one over the other in a stacking direction (S) running perpendicularly to the main extension plane (HSE), and a coding (18) is formed within the support substrate (10).
The invention relates to a process for producing a metal-ceramic substrate (1), comprising: - providing a ceramic element (10) and a metal layer, - providing a gas-tight container (25) that encloses the ceramic element (10), the container (25) preferably being formed from the metal layer or comprising the metal layer, - forming the metal-ceramic substrate (1) by connecting the metal layer to the ceramic element (10) by means of hot isostatic pressing, wherein, for the purpose of forming the metal-ceramic substrate (1), an active metal layer (15) or a contact layer comprising an active metal is arranged at least in some sections between the metal layer and the ceramic element (10) for supporting the connection of the metal layer to the ceramic element (10).
Described is an electronics module (100), more particularly a power electronics module, comprising - a metal-ceramic substrate (1) which serves as a carrier and has a ceramic element (10) and a primary component metallisation (21) and preferably a cooling part metallisation (20), - an insulation layer (40) which is directly or indirectly connected to the primary component metallisation (21) and - a secondary component metallisation (22) which is connected to the side of the insulation layer (40) facing away from the metal-ceramic substrate (1), wherein the ceramic element (10) is a first size (L1, D1) and the insulation layer (40) is a second size (L2, D2) and wherein, to form an island-like insulation layer (40) on the primary component metallisation (21), a ratio of the second size (L2, D2) to the first size (L1, D1) has a value that is less than 0.8, preferably less than 0.6 and particularly preferably less than 0.4.
H01L 23/373 - Cooling facilitated by selection of materials for the device
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
Method for producing a cooling element (1), in particular a micro cooling element, comprising: - providing at least one first metal layer (11) and at least one second metal layer (12), - oxidising (101) the at least one first metal layer (11) and/or the at least one second metal layer (12), - structuring (102) the at least one first metal layer (11) and/or the at least one second metal layer (12) to form at least one recess (21, 22), - connecting (103) the at least one first metal layer (11) and the at least one second metal layer (12) to form the cooling element (1), in particular by bonding, wherein, when the metal layers are joined, at least one partial section of a cooling channel is formed in the cooling element (1) by the recess (21, 22) in the at least one first metal layer (11) and/or the at least one second metal layer (12), and wherein, before the connection step (103), an inner side of the recess (21, 22) is provided free of an oxidised surface at least in portions, preferably entirely.
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
H01L 23/373 - Cooling facilitated by selection of materials for the device
F28F 3/08 - Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
F28F 21/08 - Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
wherein the cooling structure (20) has on its outer side (A) facing the distribution structure (40) an inlet opening (31) and an outlet opening (32) separate from the inlet opening (31), wherein the inlet opening (31) and the outlet opening (32) are connected to each other via the fluid channel (30) and the fluid channel (30) is configured such that, when the cooling structure is installed, the fluid is guided from the inlet opening (31) in the direction of the component side (5) and is redirected within the cooling structure (20).
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
50.
METAL-CERAMIC SUBSTRATE AND METHOD FOR PRODUCING A METAL-CERAMIC SUBSTRATE OF THIS TYPE
The invention relates to a carrier substrate (1) for electrical components, in particular a metal-ceramic substrate for electrical components, comprising: an insulation layer (10), wherein the insulation layer (10) preferably has a material containing a ceramic or a composite containing at least one ceramic layer; a component metallisation (20) formed on a component side (BS) and having a first primary structure (21); and a cooling part metallisation (30) formed on a cooling side (KS) opposite the component side (BS) and having a second primary structure (31); wherein the insulation layer (10), the component metallisation (20) and the cooling part metallisation (30) are arranged on top of one another along a stacking direction (S), and wherein at least sections of the first primary structure (21) and the second primary structure (31) are congruent when viewed in the stacking direction (S).
The invention relates to a method for producing a metal-ceramic substrate (1), in which at least one ceramic layer (10) and at least one metal layer (20) are arranged on top of one another along a stacking direction (S), comprising the following steps: providing the at least one ceramic layer (10); forming an interface metallisation (15) on the ceramic layer (10), wherein the interface metallisation (15) comprises an active metal layer (31) and a wetting metal layer (32); and attaching the at least one metal layer (20) to the interface metallisation (15), in particular by means of a direct metal joining method, e.g. a DCB or DAB method, or an active soldering method, to form the metal-ceramic substrate (1), wherein the active metal layer (31) and/or the wetting metal layer (32) are exposed to an application of energy (40) in order to form the interface metallisation (15).
H01L 23/373 - Cooling facilitated by selection of materials for the device
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups
52.
SOLDER MATERIAL, METHOD FOR PRODUCING A SOLDER MATERIAL OF THIS TYPE AND USE OF A SOLDER MATERIAL OF THIS TYPE IN ORDER TO CONNECT A METAL LAYER TO A CERAMIC LAYER
The invention relates to a solder material (30) for connecting a metal layer (20) to a ceramic layer (10), in particular to form a metal-ceramic substrate as a carrier for electrical components, comprising a base material and an active metal, wherein the solder material (30) is a foil containing the base material in a first layer (31) and the active metal in a second layer (32), and wherein the foil has a total thickness (GD) of less than 50 µm, preferably less than 25 µm and particularly preferably less than 15 µm.
H05K 3/02 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
54.
METHOD FOR PRODUCING A METAL-CERAMIC SUBSTRATE, AND METAL-CERAMIC SUBSTRATE PRODUCED USING SUCH A METHOD
The invention relates to a method for producing a metal-ceramic substrate (20), in which at least one first metal layer (20), at least one ceramic element (10), and at least one second metal layer (22) are arranged one above the other in a stacking direction (S), the at least one ceramic element (20) being arranged between the at least one first metal layer (20) and the at least one second metal layer (22) in the stacking direction (S), and the at least one first metal layer (20) differing materially from the at least one second metal layer (22), said method comprising: • - providing the at least one ceramic element (10); • - forming a first interface metallisation (15) on a first side (S1) of the at least one ceramic element (10), the first interface metallisation (15) comprising a first active metal layer (31) and a first wetting metal layer (32), • - forming a second interface metallisation (16) on a second side (S2) of the at least one ceramic element (10), opposite the first side (S1) of the at least one ceramic element (10), the second interface metallisation (16) comprising a second active metal layer (41) and a second wetting metal layer (42), • wherein the first interface metallisation (15) and/or the second interface metallisation (16) is exposed to an energy input (40), preferably using a laser.
This application relates to a method for machining a metal-ceramic substrate (1), comprising: providing a metal-ceramic substrate (1), said metal-ceramic substrate (1) comprising at least one metal layer and a ceramic element, which extend along a main extension plane (HSE) and are arranged one above the other in a stacking direction (S) extending perpendicular to the main extension plane (HSE); and forming a recess (15), more particularly a through-recess (15), in the metal-ceramic substrate (1) by means of machining using laser light (10), more particularly of an ultra shortpulse (USP) laser.
a metallisation layer (12) bonded to the insulating layer (11) over a bonding area (A), the bonding area (A) being delimited by at least one edge (K) in a plane parallel to the main extension plane (HSE), characterized in that the edge (K) is at least partially covered with a filling material (2) and an edge region (RB) of the metallisation layer (12) adjoining the edge has a material weakening.
H05K 3/02 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
The invention relates to a method for producing a metal-ceramic substrate (1), having the steps of: - providing at least one ceramic layer (10), at least one metal layer (20), and at least one solder layer (30), in particular in the form of at least one solder foil, - coating the at least one ceramic layer (10) and/or the at least one metal layer (20) and/or the at least one solder layer (30) with at least one active metal layer (40), - arranging the at least one solder layer (30) between the at least one ceramic layer (10) and the at least one metal layer (20) along a stacking direction (S), thereby forming a solder system (35) which comprises the at least one solder layer and the at least one active metal layer (40), wherein the solder material of the at least one solder layer (30) is free of melting point-lowering materials, and - attaching the at least one metal layer (20) to the at least one ceramic layer (10) via the solder system (35) using an active soldering method.
C23C 14/00 - Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
C23C 16/00 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (CVD) processes
C23C 22/00 - Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
B23K 35/30 - Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
B23K 35/34 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material comprising compounds which yield metals when heated
B23K 35/36 - Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
C04B 37/00 - Joining burned ceramic articles with other burned ceramic articles or other articles by heating
C04B 37/02 - Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
The invention relates to a method and a system for machining a metal-ceramic substrate (1), having the steps of: - providing a metal-ceramic substrate (1), and - forming a predetermined breaking line (7) and/or a separating line in order to separate the metal-ceramic substrate (1) using laser light (10) of an ultrashort pulse laser, wherein the metal-ceramic substrate (1) is stationary while forming the predetermined breaking line (7) and/or the separating line, and the laser light (10) for forming the predetermined breaking line (7) and/or the separating line is moved over the metal-ceramic substrate (1), in particular by means of a mirror element (30) and a lens (20) with a long focal length.
B23K 26/359 - Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
B23K 26/53 - Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
B23K 26/082 - Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
B23K 26/364 - Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
B23K 26/0622 - Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
B23K 26/06 - Shaping the laser beam, e.g. by masks or multi-focusing
B23K 26/16 - Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
The present invention proposes a carrier substrate (1) for electrical components (13), the carrier substrate (1) having a component side (4) and a cooling side (5) which is opposite the component side (4) and has a cooling structure (30), the carrier substrate (1) comprising a primary layer (10) which faces the component side (4) and is produced from ceramic for electrical insulation, and a secondary layer (20) which faces the cooling side (5) for stiffening the carrier substrate (1), characterized in that a metallic intermediate layer (15) is arranged between the primary layer (10) and the secondary layer (20) for heat transfer from the component side (4) to the cooling side (5), the metallic intermediate layer (15) being thicker than the primary layer (10) and/or the secondary layer (20).
The invention relates to a method for producing a cooling element (1) for an electric or electronic component, in particular a semiconductor element, the completed cooling element (1) having a cooling fluid channel system through which a cooling fluid can be conducted during operation. The method has the steps of: - providing at least one first metal layer (11), - providing at least one recess (21, 22) in the at least one first metal layer (11), and - forming at least one sub-section of the cooling channel system using the at least one recess (21, 22), wherein at least one first part (21) of the at least one recess (21, 22) in the at least first metal layer (11) is produced by an erosion process, in particular a spark erosion process.
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
61.
Soldering material for active soldering and method for active soldering
A soldering material (1) for active soldering, in particular for active soldering of a metallization (3) to a carrier layer (2) comprising ceramics, wherein the soldering material comprises copper and is substantially silver-free.
B23K 1/00 - Soldering, e.g. brazing, or unsoldering
B23K 35/30 - Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
B23K 35/02 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
C22C 9/02 - Alloys based on copper with tin as the next major constituent
C22C 9/05 - Alloys based on copper with manganese as the next major constituent
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
B23K 103/00 - Materials to be soldered, welded or cut
62.
ADAPTER ELEMENT FOR CONNECTING AN ELECTRONICS COMPONENT TO A HEAT SINK ELEMENT, SYSTEM COMPRISING AN ADAPTER ELEMENT OF THIS KIND, AND METHOD FOR PRODUCING AN ADAPTER ELEMENT OF THIS KIND
Adapter element (10) for connecting an electronics component (30), which has a first connection region (31), a second connection region (32) and at least one active element region (5) which is arranged between the first connection region (31) and the second connection region (32), to a heat sink element (20), comprising: • - an insulation layer (15) which runs along a plane of main extent (HSE), and • - at least one first web element (11) and one second web element (12), • -- which are arranged next to one another in a direction that runs parallel in relation to the plane of main extent (HSE), so as to form a clearance (13), • -- which, in the mounted state, are arranged between the insulation layer (15) and the electronics component (30), in a direction that runs perpendicularly in relation to the plane of main extent (HSE) , and • -- on the end sides (18) of which, which end sides are averted from the insulation layer (15), the electronics component (30) is arranged in the mounted state, wherein a distance (A) between the first web element (11) and the second web element (12), which distance is measured parallel in relation to the plane of main extent, is less than 350 μm.
H01L 23/12 - Mountings, e.g. non-detachable insulating substrates
H01L 23/373 - Cooling facilitated by selection of materials for the device
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
C04B 41/90 - Coating or impregnating for obtaining at least two superposed coatings having different compositions at least one coating being a metal
63.
METHOD FOR PRODUCING A METAL-CERAMIC SUBSTRATE, AND METAL-CERAMIC SUBSTRATE PRODUCED USING SUCH A METHOD
The invention relates to a method for producing a metal-ceramic substrate (1) which, when complete, comprises a ceramic layer (11) and a metal layer (12), which extend along a main extension plane (HSE) and are arranged one on top of the other in a stacking direction (S) that extends perpendicularly to the main extension plane (HSE), the method comprising the steps: -- providing the metal layer (12) and the ceramic layer (11), and -- connecting the metal layer (12) in some regions to the ceramic layer (11) to form a first region (B1), which has an integral bond between the metal layer (12) and the ceramic layer (11), and a second region (B2) in which, when viewed in the stacking direction (S), the metal layer (12) and the ceramic layer (11) are arranged one on top of the other without integral bond. A predetermined breaking line is preferably provided.
joining the first metal layer (11) and the second metal layer (12) to form the semi-finished metal product (2), wherein, chronologically before the first metal layer (11) is joined to the second metal layer (12) by means of different temperature treatments, a grain growth in the first metal layer (11) and/or the second metal layer (12) is initiated in such a way that in the produced semi-finished metal product (2), in particular in the produced metal-copper substrate, a first grain size in the first metal layer (11) differs from a second grain size in the second metal layer (12).
The invention relates to a method for producing a composite ceramic (10), having the steps of: - providing a first layer (31) made of a first ceramic material, - arranging the first layer (32) in a furnace (20), wherein the first layer (31) is at least partly surrounded by a pulverulent or pasty second layer (32) made of a second ceramic material in the furnace (20), and - carrying out a hot pressing method in order to form the composite ceramic (10) which has a first layer (11) made of the first ceramic material and a second layer (12) made of the second ceramic material in the finished state.
Process for producing a metal-ceramic substrate (1) comprising: - providing at least one metal layer (12) made of a first metal material and at least one ceramic layer (10) made of a first ceramic material; - providing (101) at least one powder mixture comprising - the first metal material and/or a second metal material and - the first ceramic material and/or a second ceramic material, wherein the at least one powder mixture is preferably in the form of a composite powder; - arranging the at least one powder mixture between the at least one metal layer (12) and the at least one ceramic layer (10) to form a buffer layer (11) between the at least one metal layer (12) and the at least one ceramic layer (10) in the fabricated metal-ceramic substrate (1) and - performing a direct metal bonding process, in particular a direct copper bonding process (105) to form the metal-ceramic substrate, wherein the metal layer and the ceramic layer are joined by the buffer layer (1).
wherein the first stabilising layer (11) is offset relative to the outer face (20) towards the interior of the base body (2) by a distance (A) along a direction parallel to the primary direction (P).
A method for encapsulating at least one carrier substrate (10), in particular a carrier substrate (10) equipped with at least one electronic element (5), comprising the steps of - positioning the at least one carrier substrate (10) between a first mold half (11) and a second mold half (12) - forming a closed cavity (7) by means of the first mold half (11) and the second mold half (12), the cavity (7) at least partially surrounding the at least one carrier substrate (10), - introducing at least one insert element (13), which is displaceably mounted in the first mold half (11) and/or in the second mold half (12), into the cavity (7), and - filling the cavity (7), which is reduced by the inserted portion of the at least one insert element, with a material in order to form an encapsulation (8) of the at least one carrier substrate (10).
The invention relates to a method for encapsulating at least one carrier substrate (10), in particular a carrier substrate (10) populated with at least one electronic element (5), said method comprising: - positioning the at least one carrier substrate (10) between a first tool half (11) and a second tool half (12); - forming a cavity (7) by means of the first tool half (11) and the second tool half (12), the cavity (7) at least partially surrounding the at least one carrier substrate (10); - inserting at least one stamp element (13), which is mounted displaceably in particular in the first tool half (11) and/or in the second tool half (12), into the cavity (7); - in each case partially filling the reduced cavity (7) around the inserted part of the at least one stamp element (13) by means of a material for forming an encapsulation (8) of the at least one carrier substrate (10), wherein, before the filling, at least one intermediate element (2, 22, 32) is arranged in the cavity (7), and the at least one stamp element (13) is brought into contact with the at least one intermediate element (2, 22, 32).
Method for producing an electronic module (1), comprising: - providing (101) a carrier substrate (10) populated with a first electronic component (30), the carrier substrate (10) having a primary layer (11), a secondary layer (12) and a metal intermediate layer (16) arranged between the primary layer (11) and the secondary layer (12), the primary layer (11) having at least one first cut-out (41); - at least partially encapsulating (102) the populated carrier substrate (10) with an encapsulation (20); - creating a second cut-out (42) in the encapsulation (20); and - forming (103) a via (5) in order to provide an electrical connection between a second electronic component (31) on an exterior (A) of the encapsulation (20) and the metal intermediate layer (16), the first cut-out (41) in the primary layer (16) and the second cut-out (42) in the encapsulation (20) being jointly filled with an electrically conductive material and/or brought into electrical contact with one another in a work step.
H01L 23/373 - Cooling facilitated by selection of materials for the device
H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
71.
METHOD FOR ENCAPSULATING AT LEAST ONE CARRIER SUBSTRATE; ELECTRONIC MODULE AND MOLD FOR ENCAPSULATING A CARRIER SUBSTRATE
A method for encapsulating at least one carrier substrate (10) equipped with at least one electronic element (5), comprising the steps of - positioning the at least one carrier substrate (10) between a first mold half (11) and a second mold half (12) - forming a closed cavity (7) by means of the first mold half (11) and the second mold half (12), the cavity (7) at least partially surrounding the at least one carrier substrate (10); - introducing at least one insert element (13), which is displaceably mounted in the first mold half (11) and/or in the second mold half (12), into the cavity (7); and - filling the cavity (7) with a material in order to form an encapsulation (8) of the at least one carrier substrate (10), wherein, prior to the filling step, the insert element (13) is made to abut the at least one electronic element (5) in such a way that, after the filling step, at least one terminal of the electronic element (5) is exposed.
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01L 23/16 - Fillings or auxiliary members in containers, e.g. centering rings
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
72.
COOLING DEVICE FOR A FIRST ELECTRONICS MODULE AND AT LEAST ONE SECOND ELECTRONICS MODULE, SUPPLY DEVICE FOR A COOLING DEVICE OF THIS TYPE AND METHOD FOR COOLING A FIRST ELECTRONICS MODULE AND AT LEAST ONE SECOND ELECTRONICS MODULE
The invention relates to a cooling device (1) for cooling a first electronics module (21) and at least one second electronics module (22), comprising a first cooling channel assembly (31) which is assigned to the first electronics module in a first section (91), and at least one second cooling channel assembly (32) which is assigned to the second electronics module in a second section (92), wherein the first cooling channel assembly (91) has at least one first inlet opening (51) and the second cooling channel assembly (32) has at least one second inlet opening (52), wherein a coolant fluid can be introduced into the first cooling channel assembly (31) via the first inlet opening (51) and into the second cooling channel assembly (32) via the second inlet opening (52), wherein a supply device (10) is provided which can be coupled to the first cooling channel assembly (31) and the second cooling channel assembly (32), and which has a first supply channel (41) and at least one second supply channel (42) that is separate from the first supply channel (41), designed in such a way that the first supply channel (41) guides the coolant fluid to the first inlet opening (51) and the second supply channel (42) guides the coolant fluid to the second inlet opening (52).
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
73.
CARRIER SUBSTRATE FOR ELECTRICAL, MORE PARTICULARLY ELECTRONIC, COMPONENTS, AND METHOD FOR PRODUCING A CARRIER SUBSTRATE
The invention relates to a carrier substrate (1), comprising an insulation layer (11) and a metal layer (12), wherein, in a primary direction (P) running parallel to the main extension plane (HSE), the metal layer (12) terminates, at least in some regions, in a flank profile (2), more particularly an etched flank profile, wherein, seen in the primary direction (P), the flank profile (2) extends from a first edge (15) on a top side (31) of the metal layer (12) facing away from the insulation layer (11) to a second edge (16) on a bottom side (32) of the metal layer (12) facing the insulation layer (11), characterised in that, seen in the primary direction (P), the flank profile (2), has a local maximum (21) and a local minimum (22).
H01L 23/373 - Cooling facilitated by selection of materials for the device
H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
C04B 37/02 - Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
74.
METHOD FOR MACHINING A METAL-CERAMIC SUBSTRATE, SYSTEM FOR CARRYING OUT SAID METHOD, AND METAL-CERAMIC SUBSTRATE MANUFACTURED USING SAID METHOD
The invention relates to a method for machining a metal-ceramic substrate (1), comprising: machining the metal-ceramic substrate (1) by irradiating the metal-ceramic substrate (1) with laser light, in particular for forming a setpoint breaking point (5); wherein at least regions of a surface topography of the metal-ceramic substrate (1) are measured in a first measuring step preceding the irradiation and/or in a second measuring step following the irradiation.
B23K 26/03 - Observing, e.g. monitoring, the workpiece
B23K 26/0622 - Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
B23K 26/08 - Devices involving relative movement between laser beam and workpiece
B23K 26/359 - Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
B23K 26/364 - Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
B23K 26/38 - Removing material by boring or cutting
B23K 26/402 - Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
The invention relates to a method for producing metal-ceramic substrates (1), having the steps of: - providing a metal-ceramic base substrate (10), - providing the metal-ceramic base substrate (10) with a first individual identifying mark (21); - cutting (40) the metal-ceramic base substrate (10) into individual metal-ceramic substrates (1); and - providing at least one of the metal-ceramic substrates (1) with a second individual identifying mark (22).
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
H05K 3/02 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
76.
SYSTEM FOR COOLING A METAL-CERAMIC SUBSTRATE, A METAL-CERAMIC SUBSTRATE AND METHOD FOR PRODUCING SAID SYSTEM
The invention relates to a system for cooling a metal-ceramic substrate (1) having a component side (5) and a cooling side (6) opposite the component side (5), comprising - a metallic cooling structure (20) having at least one integrated fluid channel (30) for conducting a fluid within the cooling structure (20) and - a distribution structure (40), particularly made of plastic, for supplying the fluid to the fluid channel (30), wherein the cooling structure (20) has, on the outer side (A) thereof facing the distribution structure (40), an inlet opening (31) and an outlet opening (32), which is separate from the inlet opening (31), wherein the inlet opening (31) and the outlet opening (32) are connected to each other via the fluid channel (30), and the fluid channel (30) is designed such that the fluid in the installed cooling structure is conducted from the inlet opening (31) toward the component side (5) and deflected within the cooling structure (20).
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
H01L 23/373 - Cooling facilitated by selection of materials for the device
Electronics module (1), comprising - an encapsulation (20), - a carrier substrate (10) which is at least partially embedded into the encapsulation (20) and has a components side (25) which has a first metallization layer (15) and is arranged on the at least one first electronic component (30), wherein at least one second metallization layer (35) for at least one second electronic component (31), in particular for controlling the first electronic component (30), is provided on an outer side (A) of the encapsulation (2), wherein the encapsulation (20) has at least one plated-through hole (5) for electrical connection, in particular for direct electrical connection, of the first electronic component (30) and the second electronic component (31).
H01L 25/10 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices having separate containers
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices the devices being of types provided for in two or more different main groups of groups , or in a single subclass of , , e.g. forming hybrid circuits
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices the devices being of types provided for in two or more different subgroups of the same main group of groups , or in a single subclass of ,
H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 25/00 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices
78.
METAL-CERAMIC SUBSTRATE AND METHOD FOR PRODUCING A METAL-CERAMIC SUBSTRATE
The invention relates to a metal-ceramic substrate (1) comprising an insulation layer (11) which comprises ceramic and has a first thickness (D1), and a metallization layer (12) which is bonded to the insulation layer (11) and has a second thickness (D2), the second thickness (D2) being greater than 250 μm and the first thickness (D1) being less than 300 μm, the first thickness (D1) and the second thickness (D2) being dimensioned in such a way that the ratio of the value of the difference between the coefficient of thermal expansion of the metallization layer (12) and the coefficient of thermal expansion of the metal-ceramic substrate (1) to the coefficient of thermal expansion of the metal-ceramic substrate (1) assumes a value less than 0.25, preferably less than 0.2, and particularly preferably less than 0.15, or even less than 0.1.
The invention relates to a metal-ceramic substrate (1) comprising - an insulation layer (11) extending along a main extension plane (HSE) and having a ceramic, and - a metallization layer (12) that is attached to the insulation layer (11) via an attachment face (A), wherein the attachment face (A) is delimited, in a plane extending parallel to the main extension plane (HSE), by at least one edge (K), characterized in that the edge (K) is covered at least partially with a filling material (2) and a peripheral region (RB), adjoining the edge, of the metallization layer (12) has a material weakening.
The invention relates to a compound ceramic (10) for a printed circuit board, comprising - a core layer (1) made from a first ceramic material and - a surface layer (2) made from a second ceramic material for covering the core layer (1), wherein the surface layer (2) is directly integrally bonded to the core layer (1) and a ratio of a surface layer thickness (DD1) to a core layer thickness (DP) has a value less than 1, preferably less than 0.5 and particularly preferably less than 0.2.
The invention relates to a method for producing a semi-finished metal product (2), in particular a copper semi-finished product, for a metal copper substrate, in particular for a copper-ceramic substrate, having the steps of: - providing a first metal layer (11), in particular a first copper layer, and a second metal layer (12), in particular a second copper layer, and - connecting the first metal layer (11) and the second metal layer (12) in order to form a semi-finished metal product (2), wherein a grain growth is initiated in the first metal layer (11) and/or the second metal layer (12) by means of different temperature treatments temporally before the first metal layer (11) is connected to the second metal layer (12) such that a first grain size in the first metal layer (11) differs from a second grain size in the second metal layer (12) in the completed semi-finished metal product (2), in particular in the completed metal copper substrate.
The invention relates to a cooling device (1) for cooling an electrical component (4), in particular a laser diode, comprising: a base body (2) having at least one outer side (20) and at least one integrated cooling channel (5), in particular a micro-cooling channel, a connection surface (21) on the outer side (20) of the base body (2) for connecting the electrical component (4) to the base body (2) and a first stabilization layer (11), wherein the first stabilization layer (11) and the connection surface (21) are arranged along a primary direction (P), one atop the other at least in part, and wherein the first stabilization layer (11) is offset relative to the outer side (20) into the inside of the base body (2) by a distance (A) along a direction extending parallel to the primary direction (P).
ADAPTER ELEMENT FOR CONNECTING A COMPONENT, SUCH AS A LASER DIODE, TO A HEAT SINK, A SYSTEM COMPRISING A LASER DIODE, A HEAT SINK AND AN ADAPTER ELEMENT AND METHOD FOR PRODUCING AN ADAPTER ELEMENT
The invention relates to an adapter element (10) for connecting a component, such as a laser diode (4), to a heat sink (7), said adapter element comprising: when mounted, a first metal layer (11) facing the component (4) and a second metal layer (12) facing the heat sink (7); and an interlayer (13), provided between the first metal layer (11) and the second metal layer (12), said interlayer comprising ceramic material, the first metal layer (11) and/or the second metal layer (12) being thicker than 40 μm, preferably thicker than 70 μm and particularly preferably thicker than 100 μm.
The invention relates to a soldering material (1) for active soldering, in particular for active soldering a support layer (2) comprising a metallization (3) on a ceramic, the soldering material comprises copper and essentially does not contain any silver.
The invention relates to a method for producing a via in a carrier layer (1) produced from a ceramic, comprising: providing the carrier layer (1), creating a through-hole (2) in the carrier layer, at least partially filling the through-hole with a paste, and carrying out a connecting method for connecting a metallization to the carrier layer, in particular an active solder method or a DCB method, the via being created from the paste in the through-hole when the connecting method is carried out.
H05K 1/09 - Use of materials for the metallic pattern
H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
The invention relates to a substrate (1) for electrical circuits, comprising at least one paper ceramic layer (2) having a top side and bottom side (2a, 2b), which has a pore structure consisting of a plurality of pore-shaped cavities, characterized in that the pore-shaped cavities of the pore structure, at least in the region of the top and/or bottom side (2a, 2b) of the paper ceramic layer (2), are filled, using an infiltration method, with a metal or a metal alloy such that at least one metallization layer (3, 4) having a layer thickness (d2, d3) between 0.1 to 10 μιτι forms on the top and/or bottom side (2a, 2b). The invention further relates to a method for producing such a substrate, and modules derived therefrom, in particular power modules.
H01L 23/373 - Cooling facilitated by selection of materials for the device
B32B 9/06 - Layered products essentially comprising a particular substance not covered by groups comprising such substance as the main or only constituent of a layer, next to another layer of a specific substance of paper or cardboard
H01L 23/08 - Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
H01L 23/10 - Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
B32B 15/12 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of paper or cardboard
B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
A method for producing a composite material comprising a planar base material to which an additional layer is applied on one side or both sides via a solder layer, characterized by: providing the base material, wherein the base material has a first surface on at least one side; providing the additional layer and arranging the solder layer between a second surface of the additional layer and the first surface such that when the additional layer is deposited on the first surface, the first surface of the base material is covered by the solder layer in a planar manner; wherein a thickness of the solder layer between the base material and the additional layer is smaller than 12 μm; heating the base material and the additional layer on the first surface to at least partially melt the solder layer; and connecting the base material to the at least one additional layer.
B32B 9/00 - Layered products essentially comprising a particular substance not covered by groups
B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
B32B 15/12 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of paper or cardboard
B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
B32B 29/00 - Layered products essentially comprising paper or cardboard
B32B 5/12 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments characterised by the relative arrangement of fibres or filaments of adjacent layers
B32B 5/20 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by features of a layer containing foamed or specifically porous material foamed in situ
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 9/04 - Layered products essentially comprising a particular substance not covered by groups comprising such substance as the main or only constituent of a layer, next to another layer of a specific substance
B32B 9/06 - Layered products essentially comprising a particular substance not covered by groups comprising such substance as the main or only constituent of a layer, next to another layer of a specific substance of paper or cardboard
C25D 11/00 - Electrolytic coating by surface reaction, i.e. forming conversion layers
C25D 11/04 - Anodisation of aluminium or alloys based thereon
The invention relates to a substrate (1) for electrical circuits comprising at least one first composite layer (2) which is produced by means of roll cladding and, after said roll cladding, has at least one copper layer (3) and an aluminium layer (4) attached thereon, wherein at least the surface side of the aluminium layer (4) facing away from the copper layer (3) is anodized for the generation of an anodic or insulating layer (5) made of aluminium oxide, and wherein the anodic or insulating layer (5) made of aluminium oxide is connected to a metal layer (7) or at least one second composite layer (2′) or at least one paper-ceramic layer (11) via at least one adhesive layer (6, 6′).
B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
B32B 9/00 - Layered products essentially comprising a particular substance not covered by groups
B32B 5/12 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments characterised by the relative arrangement of fibres or filaments of adjacent layers
B32B 5/20 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by features of a layer containing foamed or specifically porous material foamed in situ
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 9/04 - Layered products essentially comprising a particular substance not covered by groups comprising such substance as the main or only constituent of a layer, next to another layer of a specific substance
B32B 9/06 - Layered products essentially comprising a particular substance not covered by groups comprising such substance as the main or only constituent of a layer, next to another layer of a specific substance of paper or cardboard
B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
B32B 15/12 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of paper or cardboard
B32B 29/00 - Layered products essentially comprising paper or cardboard
C25D 11/04 - Anodisation of aluminium or alloys based thereon
The invention relates to a carrier substrate (1) for electric components (13), comprising a ceramic primary layer (10) and a metal layer (2, 15, 30) which is joined to the primary layer (10) and which has cavities (5) on the side facing the primary layer (10).
The invention relates to a carrier substrate (1) for electric components (13), comprising a component side (4) and, on the side opposite the component side (4), a cooling side (5) having a cooling structure (30); the carrier substrate (1) has a ceramic primary layer (10) facing the component side (4) in order to provide electric insulation, and a secondary layer (20) facing the cooling side (5) in order to reinforce the carrier substrate (1). The invention is characterized in that in order to allow for heat transfer from the component side (4) to the cooling side (5), an intermediate metal layer (15) which is thicker than the primary layer (10) and/or the secondary layer (20) is placed between the primary layer (10) and the secondary layer (20).
A busbar is described, having at least one base body (1) which is plate-shaped in some sections, with a top (1.1) and a bottom (1.2), comprising a conductor layer (2, 2a) and at least one first and second insulation layer (3, 4), connected to the conductor layer (2, 2a), and with a plurality of connectors (5, 5', 5''), wherein at least one connector (5, 5', 5'') comprises at least one connection area (6) and a through-passage opening (7), positioned centrally in the connection area (6) and extending along a central axis MA, and wherein in the connection area (6) the first and second insulation layer (3, 4) are removed over some of the surface area, in which the connection area (6) is segmented into a plurality of connection segments (6a, 6b, 6c, 6d, 6e, 6f,) separated from each other by means of slots (9a, 9b, 9c, 9, 9',) which extend in a star shape with respect to the central axis MA and which are convex at least at the free ends. The connection segments (6a, 6b, 6c, 6d, 6e, 6f) are produced by introduction of the slots (9a, 9b, 9c) into the connection area (6) by means of laser radiation and by a deformation of the connection area (6) along the central axis MA.
The invention relates to a substrate (1, 10) for electrical circuits, comprising at least one metal layer (2, 3, 14) and a paper ceramic layer (11), which is joined face to face with the at least one metal layer (2, 3, 14) and has a top side and bottom side (11a, 11b), wherein the paper ceramic layer (11) has a large number of cavities in the form of pores. Especially advantageously, the at least one metal layer (2, 3, 14) is connected to the paper ceramic layer (11) by means of at least one glue layer (6, 6a, 6b), which is produced by applying at least one glue (6a', 6a'', 6b', 6b'') to the metal layer (2, 3, 14) and/or to the paper ceramic layer (11), wherein the cavities in the form of pores in the paper ceramic layer (11) are filled at least at the surface by means of the applied glue (6a', 6a'', 6b', 6b'').
B32B 5/12 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments characterised by the relative arrangement of fibres or filaments of adjacent layers
B32B 5/20 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by features of a layer containing foamed or specifically porous material foamed in situ
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 9/00 - Layered products essentially comprising a particular substance not covered by groups
B32B 9/04 - Layered products essentially comprising a particular substance not covered by groups comprising such substance as the main or only constituent of a layer, next to another layer of a specific substance
B32B 9/06 - Layered products essentially comprising a particular substance not covered by groups comprising such substance as the main or only constituent of a layer, next to another layer of a specific substance of paper or cardboard
The invention relates to a substrate (1) for electrical circuits comprising at least one first composite layer (2) which is produced by means of roll cladding and, after said roll cladding, has at least one copper layer (3) and an aluminium layer (4) attached thereon, wherein at least the surface side of the aluminium layer (4) facing away from the copper layer (3) is anodised for the generation of an anodic or insulating layer (5) made of aluminium oxide, and wherein the anodic or insulating layer (5) made of aluminium oxide is connected to a metal layer (7) or at least one second composite layer (2') or at least one paper-ceramic layer (11) via at least one adhesive layer (6, 6').
B32B 5/12 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments characterised by the relative arrangement of fibres or filaments of adjacent layers
B32B 5/20 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by features of a layer containing foamed or specifically porous material foamed in situ
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 9/00 - Layered products essentially comprising a particular substance not covered by groups
B32B 9/04 - Layered products essentially comprising a particular substance not covered by groups comprising such substance as the main or only constituent of a layer, next to another layer of a specific substance
B32B 9/06 - Layered products essentially comprising a particular substance not covered by groups comprising such substance as the main or only constituent of a layer, next to another layer of a specific substance of paper or cardboard
Method for producing a composite material (5), in particular for a circuit board, wherein the composite material (5) comprises a planar base material (1), in particular a ceramic, to which an additional layer (2), in particular a metallisation, is applied on one side or both sides by means of a solder layer (3), characterised by: - providing the base material (1), wherein the base material (1) has a first surface (A1) on at least one side; - providing the additional layer (2) and arranging the solder layer (3) between a second surface (A2) of the additional layer (2) and the first surface (A1) in such a way that when the additional layer (3) is deposited on the first surface (A1), the first surface (A1) of the base material (1) is covered by the solder layer (3) in a planar manner; wherein a thickness of the solder layer (3) between the base material (1) and the additional layer (2) is smaller than 12 µm, in particular smaller than 7 µm; - heating the base material (1) and the additional layer (2) arranged on the first surface (A1) to at least partially melt the solder layer (3) and connecting the base material (1) to the at least one additional layer (2).
Adhesive bond for bonding a composite material, in particular for circuit boards, consisting of a ceramic and a metallized layer to be bonded to the ceramic, wherein the adhesive bond has at least two layers (10, 20) and wherein a first layer (10) has an adhesive based on polyimide or based on epoxy and a second layer (20) has an adhesive based on epoxy or based on polyimide.
B32B 9/00 - Layered products essentially comprising a particular substance not covered by groups
B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
C04B 37/02 - Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
H05K 3/38 - Improvement of the adhesion between the insulating substrate and the metal
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 27/28 - Layered products essentially comprising synthetic resin comprising copolymers of synthetic resins not wholly covered by any one of the following subgroups
The invention relates to a method for producing a metal-ceramic substrate including first and second metallizations and at least one ceramic layer incorporated between the first and second metallizations. Advantageously, first and second metal layers and the at least one ceramic layer are stacked superposed, and in such a way that the free edge sections, of the first and second metal layers respectively, project beyond the edges of the at least one ceramic layer and the first and second metal layers are deformed toward each other in the region of the projecting free edge sections and directly connected to each other in order to form a gas-tight, sealed metal container enclosing a container interior for receiving the at least one ceramic layer. Subsequently, the metal layers forming the metal container with the at least one ceramic layer received in the container interior are hot isostatically pressed together in a treatment chamber at a gas pressure between 500 and 2000 bar and at a process temperature between 300° C. and the melting temperature of the metal layers for producing a preferably flat connection of at least one of the metal layers and the at least one ceramic layer, and at least the projecting free edge sections, which are connected to each other, of the metal layers for forming the first and second metallization are subsequently removed.
C08B 37/00 - Preparation of polysaccharides not provided for in groups ; Derivatives thereof
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups
C04B 37/02 - Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
H01L 23/373 - Cooling facilitated by selection of materials for the device
H05K 3/02 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
H05K 3/38 - Improvement of the adhesion between the insulating substrate and the metal
The invention relates to a metal-ceramic substrate and to a method for the production thereof, the substrate including at least one ceramic layer having first and second surface sides, at least one of the surface sides of which is provided with a metallization, wherein the ceramic material forming the ceramic layer contains aluminum oxide, zirconium dioxide and yttrium oxide. The ceramic layer contains aluminum oxide, zirconium dioxide and yttrium oxide in the following proportions, in each case in relation to the total weight thereof: zirconium dioxide between 2 and 15 percent by weight; yttrium oxide between 0.01 and 1 percent by weight; and aluminum oxide between 84 and 97 percent by weight, wherein the average grain size of the aluminum oxide used is between 2 and 8 micrometers and the ratio of the length of the grain boundaries of the aluminum oxide grains to the total length of all the grain boundaries is greater than 0.6.
The invention relates to a method for producing a metal-ceramic substrate (1) comprising a first and second metallization (3, 4) and at least one ceramic layer (2) incorporated between the first and second metallizations (3, 4). Advantageously, a first and a second metal layer (5, 6) and the ceramic layer (2) are stacked superposed, and in such a way that the free edge sections (5a, 6a), of the first and second metal layer (5, 6) respectively, project beyond the edges of the ceramic layer (2) and the first and second metal layers (5, 6) are deformed toward each other in the region of the projecting free edge sections (5a, 6a) and directly connected to each other in order to form a gas-tight, sealed metal container (7) enclosing a container interior (8) for receiving the ceramic layer (2). Subsequently, the metal layers (5, 6) forming the metal container (7) with the ceramic layer (2) received in the container interior are hot isostatically pressed together in a treatment chamber at a gas pressure between 500 and 2000 bar and at a process temperature between 300 ºC and the melting temperature of the metal layers (5, 6) for producing a preferably flat connection of at least one of the metal layers (5, 6) and the ceramic layer (2), and at least the projecting free edge sections (5a, 6a), which are connected to each other, of the metal layers (5, 6) for forming the first and second metallization (3, 4) are subsequently removed.
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups
The invention relates to a cooling arrangement (1) for cooling a surface of an electric circuit or component along a cooling plane (KE), comprising N thin plate-like layers (S1 - SN) which are made of metal and/or ceramic, are arranged one over the other, and are connected face to face so as to form a stack, comprising at least one first cover layer (S1) which extends along the cooling plane (KE) and forms a cooling surface (KF), comprising at least one second cover layer (S11) which lies opposite the first cover layer (S1), and comprising at least three intermediate layers (S2 - S10) which are received between the first and second cover layer (S1, S11). The intermediate layers (S2 - S10) are provided with openings (2a) and/or elongated through-holes (2b, 2c, 2d) such that a plurality of looped flow channels (3) and/or double-loop flow channels (6) arranged parallel to one another are formed in the interior of the stack in order to conduct a preferably liquid coolant. In an especially advantageous manner, the looped flow channels (3) and/or the double-loop flow channels (6) are designed to simultaneously supply and discharge the coolant along a flow path (SW) running substantially perpendicular to the cooling plane (KE).
H01L 23/373 - Cooling facilitated by selection of materials for the device
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
H01L 23/427 - Cooling by change of state, e.g. use of heat pipes
