The present application provides a resin composition, and the resin composition comprises the following components: (A) a resin containing unsaturated bonds, (B) an initiator, and (C) an inorganic filler which has been subjected to surface treatment by a silane coupling agent; the silane coupling agent contains a structure shown in formula (I). In the present application, the inorganic filler is subjected to surface treatment by a silane coupling agent containing the structure shown in formula (I), which can improve the binding force at the interface between the inorganic filler and the unsaturated resin matrix, and the prepared insulating adhesive film has excellent dielectric properties, good dielectric stability, and a small change amplitude of ΔDf (10 GHz) after HAST, which can be applied to a high-frequency and high-speed printed circuit board prepared by a semi-additive process or additive process.
A resin composition and the use thereof. The resin composition comprises the following components, in percentages by weight: 40-70% of a crosslinkable and curable resin and 30-60% of a filler. The filler is silicon dioxide prepared by means of an organosilicone hydrolysis method; the average particle size D50 of the silicon dioxide is 0.1-3 μm; and the particle size ratio D100:D10 of the silicon dioxide is less than or equal to 2.5. By means of the composition, a prepared adhesive film and resin-coated copper foil have a higher elongation rate, a higher peel strength, low CTE, low Df, better drilling processability and higher electrical strength. A finer line processing capability can be achieved, which can be applied to a printed circuit board material of a multilayer laminate, in particular a printed circuit board material of a multilayer laminate of thin lines.
The present invention provides a resin composition and an application thereof, the resin composition comprising the following components by weight percentage: 15-39% cross-linkable curable resin and 61-85% filler, the filler being silicon dioxide prepared by means of organosilicon hydrolysis, the average particle diameter D50 of the silicon dioxide being 0.1-3 μm, the ratio of D100:D10 thereof being less than or equal to 2.5, and the purity of the silicon dioxide being greater than 99.9%. The resin composition of the present invention can make prepared adhesive films and resin-coated copper foils have relatively high tensile strength and peel strength, relatively good drilling processability, controllable fluidity, good filling ability, and higher electric strength, and can achieve finer line processing ability; it is a printed circuit board material applicable to multilayer laminates, especially a printed circuit board material for multilayer laminates of thin lines.
Resin composition, insulating resin film and use thereof. The resin composition comprises the following components in parts by mass: 50-90 parts of a hydrogenated hydrocarbon resin and 10-50 parts of a benzocyclobutene resin; the benzocyclobutene resin comprises at least one structural unit A and at least one structural unit B. The hydrogenated hydrocarbon resin and the benzocyclobutene resin with a specific structure are both total-hydrocarbon structures, having low dielectric constant Dk, dielectric loss tangent Df, and water absorption rate. The benzocyclobutene resin can be thermally cured to obtain the high cross-linking density, high glass transition temperature, and excellent heat resistance. The resin composition and the insulating resin film prepared therewith have ultra-low dielectric constant and loss tangent, excellent dielectric properties, heat resistance, damp heat resistance, adhesion strength, and excellent mechanical properties such as flexibility, satisfying the performance requirements of electronic components being high frequency, high speed, and high integration.
C08L 53/02 - Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers of vinyl aromatic monomers and conjugated dienes
C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
C08L 9/00 - Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
C08L 25/16 - Homopolymers or copolymers of alkyl-substituted styrenes
C09D 109/00 - Coating compositions based on homopolymers or copolymers of conjugated diene hydrocarbons
C09D 125/16 - Homopolymers or copolymers of alkyl- substituted styrenes
C09D 153/02 - Vinyl aromatic monomers and conjugated dienes
Thermosetting resin composition and insulating adhesive film. The thermosetting resin composition comprises 30-70 parts of epoxy resin, 5-500 parts of a modified spherical silica powder, and 30-70 parts of a curing agent; the modified spherical silica powder comprises an amino-modified spherical silica powder with a D50 particle size of 0.1-2.0 μm and a coefficient of variation of ≥35% in particle size distribution. By using modified spherical silica powder in epoxy resin system and controlling its D50 particle size and coefficient of variation in particle size distribution, the resin composition can reduce melt viscosity of high-filling system and achieve a low melt viscosity in an insulating adhesive film conducive to the filling of fine circuits. The resin composition for preparation of a build-up adhesive FC-BGA film of a high-filling system has strong bite-etching resistance, low surface roughness after Desmear treatment, high adhesive force with electroless copper and low dielectric loss.
A benzocyclobutene resin, a resin composition comprising same, and a use thereof. The benzocyclobutene resin comprises at least one first structural unit and at least one second structural unit. The first structural unit has a structure represented by formula I, and the second structural unit has a structure represented by formula IIA and/or by formula IIB. The benzocyclobutene resin is an all-carbon hydrogen structure. By means of designing a polymer structure, the benzocyclobutene resin has a sufficiently low dielectric constant Dk and a dielectric loss tangent Df, a small polarity and a low water absorption rate, and has improved heat curing activity, crosslinking efficiency and crosslinking density. The benzocyclobutene resin has a high glass transition temperature and excellent dielectric properties, heat resistance and damp heat resistance. Furthermore, the benzocyclobutene resin has high modulus and mechanical mechanical properties, has excellent process processability, and can fully meet various performance requirements of a high-frequency high-speed PCB on a resin material.
C08F 279/02 - Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group on to polymers of conjugated dienes
C08F 212/32 - Monomers containing only one unsaturated aliphatic radical containing two or more rings
C08L 51/08 - Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
7.
FLUORINE-CONTAINING RESIN-BASED COMPOSITE MATERIAL AND USE THEREOF
Provided are a fluorine-containing resin-based composite material and the use thereof. Preparation raw materials of the fluorine-containing resin-based composite material comprise the following components in parts by weight: 45-65 parts of a fluorine-containing polymer, 20-65 parts of heat-conducting particles A and 1-5 parts of heat-conducting particles B, wherein the heat-conducting particles A comprise boron nitride and silicon nitride; and the heat-conducting particles B are titanium dioxide particles. The provided fluorine-containing resin-based composite material has relatively good heat dissipation and dielectric properties and a relatively high peel strength, same also has a relatively low production cost, and can satisfy the use requirements of people for high-frequency and high-thermal-conductivity copper-clad plates.
C08L 27/12 - Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogenCompositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
C08L 27/14 - Homopolymers or copolymers of vinyl fluoride
C08L 27/16 - Homopolymers or copolymers of vinylidene fluoride
C08L 27/18 - Homopolymers or copolymers of tetrafluoroethene
C08L 27/20 - Homopolymers or copolymers of hexafluoropropene
Provided in the present invention are a resin composition and the use thereof. The resin composition comprises the following components in parts by weight: 10-90 parts of a component A which is a prepolymer of a maleimide compound having a structure represented by formula (I) and an amine compound (a1) containing at least two primary amino groups per molecule; 3-30 parts of a component B which is a maleimide compound having a structure represented by formula (II); and 5-70 parts of a component C which is a polyphenyl ether compound having an unsaturated functional group. The amine compound (a1) at least comprises a siloxane compound containing at least two primary amino groups per molecule. The mass ratio of the siloxane compound to the maleimide compound having the structure represented by formula (II) in the resin composition is 1:0.2 to 1:10. The present invention can solve the problems of large changes on the dielectric dissipation factor after cured resin compositions absorb moisture and high water absorption rates, thereby satisfying the requirement for stability of electrical performances after high-speed packaging substrates absorb moisture.
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 15/088 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising polyamides
C08G 73/00 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen or carbon, not provided for in groups
A benzocyclobutene resin, a resin composition, and the use thereof. The benzocyclobutene resin comprises at least one structural unit A and at least one structural unit B, wherein the structural unit A has a structure as represented by Formula I, and the structural unit B has a structure as represented by Formula II. The benzocyclobutene resin has a pure carbon-hydrogen structure and has a sufficiently low dielectric constant Dk and a dielectric loss angle tangent Df. Moreover, the benzocyclobutene resin has a high glass transition temperature, low water absorption, good heat resistance and damp-heat resistance, good dielectric properties, a high modulus and high mechanical properties, and good levels of processability, such that various performance requirements of a high-performance PCB for a resin material can be satisfied.
C07C 13/44 - Polycyclic hydrocarbons or acyclic hydrocarbon derivatives thereof with condensed rings with a bicyclo ring system containing eight carbon atoms
C08F 112/34 - Monomers containing two or more unsaturated aliphatic radicals
The present invention relates to a thermosetting resin composition and application thereof, said thermosetting resin composition comprising: A: a styrene-butadiene-styrene triblock copolymer having a star-shaped structure; B: a linear olefin resin containing 1,2-ethylene, and a modifier thereof, C: at least one resin or small molecule compound substituted with an acrylic group; taking the total mass of component A, component B, and component C as 100%, the added amount of said component A is 3%-85%, the added amount of said component B is 10%-95%, and the added amount of said component C is 1%-70%. The resin composition provided by the present invention does not undergo phase separation under initiator conditions, and has high heat resistance and a relatively low dielectric constant and dielectric loss tangent value, and is capable of providing the desired dielectric properties and thermal reliability of a copper-clad plate.
C08L 47/00 - Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bondsCompositions of derivatives of such polymers
C08L 53/02 - Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers of vinyl aromatic monomers and conjugated dienes
Resin composition, resin adhesive film, and application thereof. The resin composition comprises the following components in parts by weight: 80-120 parts an epoxy resin, 1-20 parts a carbodiimide compound, 30-130 parts a phenolic resin, 20-250 parts a modified polymer, and 50-500 parts silicon dioxide; where the modified polymer is selected from a polyethersulfone or a polyamide-imide resin. By means of selection and compounding of components, the present resin composition has a uniquely advantageous film forming property, effectively solves the problem of a semi-cured resin adhesive film being prone to cracking or fracture, has outstanding heat resistance, a high glass transition temperature, a high modulus, good strength and toughness, and can to form a high strength stable bond with a metal film, has uniquely advantageous reliability, can amply satisfy printed circuit board and chip packaging performance requirements, and is suitable in a variety of chip packaging processes.
A laminate coated with asymmetric metal foils, and a printed circuit board including same. The laminate comprises one or at least two stacked low-modulus prepregs, and a metal foil, coated on one side of the one or at least two stacked low-modulus prepregs, or metal foils having different thicknesses coated on two sides of the one or at least two stacked low-modulus prepregs. The modulus of elasticity of the low-modulus prepreg is 22 GPa or less after the low-modulus prepreg is cured. A low-modulus prepreg having a modulus of elasticity of 22 GPa or less after curing is selected as an insulating material for a laminate coated with asymmetric metal foils, such that the resultant laminate and a printed circuit board manufactured therefrom have a relatively low A-state warpage and a warpage which is obtained after reflow soldering processing, thereby ensuring the reliability of the printed circuit board.
A magnetic dielectric resin composition, and a prepreg and a copper clad laminate comprising same. The magnetic dielectric resin composition comprises a resin and a magnetic filler. The absolute value of the temperature drift coefficient of the magnetic filler under the conditions of −55° C. to 150° C. is 0-1000 ppm/° C. Preparation raw materials of the magnetic filler comprise a combination of iron oxide and a metal oxide. By means of mutual synergy of the resin and the specific magnetic filler, and on the premise of ensuring good dielectric properties, the magnetic dielectric resin composition has a high magnetic permeability, a low magnetic loss, and a proper cut-off frequency, and can also reduce a temperature drift coefficient and improve stability. The copper clad laminate comprising the magnetic dielectric resin composition has a high relative magnetic permeability, a low magnetic loss, a low temperature drift coefficient, and a superior thermal stability, and can fully satisfy application requirements for copper clad laminate in the preparation of high-performance and miniaturized electronic products.
C08L 101/12 - Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
14.
FLUORINE-CONTAINING RESIN COPPER-CLAD LAMINATE AND MULTI-LAYER CIRCUIT BOARD
Provided in the present invention are a fluorine-containing resin copper-clad laminate and a multi-layer circuit board. The fluorine-containing resin copper-clad laminate comprises copper foil, one or a combination of at least one prepreg layer of fluorine-containing resin fiberglass cloth and at least one resin film layer of fluorine-containing resin, and at least one prepreg layer of fluorine-containing resin non-woven fabric, the prepreg of the fluorine-containing resin non-woven fabric comprising fluorine-containing resin adhesive non-woven fabric and a fluorine-containing resin composition. The fluorine-containing resin copper-clad laminate in the present invention has an excellent dielectric property and a relatively low size expansion and shrinkage rate, can meet the requirements of a high-frequency electronic circuit substrate for comprehensive properties such as a low dielectric constant, low dielectric loss, low insertion loss, high reliability, and accordingly can serve as a circuit board to be applied to an electronic product.
B32B 17/02 - Layered products essentially comprising sheet glass, or fibres of glass, slag or the like in the form of fibres or filaments
B32B 9/04 - Layered products essentially comprising a particular substance not covered by groups comprising such substance as the main or only constituent of a layer, next to another layer of a specific substance
B32B 15/14 - Layered products essentially comprising metal next to a fibrous or filamentary layer
The present invention provides a non-woven fabric prepreg, a metal-foil-clad plate and a printed circuit board. The non-woven fabric prepreg comprises a fluorine-containing resin binder non-woven fabric and a fluorine-containing resin composition, wherein the fluorine-containing resin binder non-woven fabric comprises a binder and inorganic fibers, and the binder is a fluorine-containing resin emulsion; and the fluorine-containing resin composition comprises, in parts by weight, 30-100 parts of a fluorine-containing resin emulsion, and 0-70 parts of an inorganic filler. The non-woven fabric prepreg and a copper-clad plate containing the non-woven fabric prepreg of the present invention have good dielectric properties and a low thermal expansion coefficient, such that the copper-clad plate can meet the performance requirements of the high-frequency communication field on a copper-clad plate material.
C08L 27/12 - Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogenCompositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
A resin composition, and a resin film, a prepreg, a laminated board, a copper-clad board, and a printed circuit board which comprise same. The resin composition comprises a combination of thermosetting polyphenylene ether resin, vinyl organic silicon resin, and a fully hydrogenated elastomeric polymer; and based on 100 parts by weight of the sum of the addition amounts of the thermosetting polyphenylene ether resin, the vinyl organic silicon resin, and the fully hydrogenated elastomeric polymer, the addition amount of the fully hydrogenated elastomer polymer is 20-50 parts by weight. The copper-clad board prepared from the resin composition has the characteristics of low dielectric constant, low dielectric loss, excellent thermal-oxidative aging resistance, high glass transition temperature, high heat resistance, high peel strength, low water absorption rate, and the like, and can be applied to scenes such as automobile radars in worse use environments.
The present invention provides a resin composition and use thereof. The resin composition comprises a combination of resin and hollow glass microspheres, said hollow glass microspheres comprising the following components in percentage by mass: 89-93% of silicon dioxide, 5-10% of boron oxide, 0.3-1% of calcium oxide and 0.05-0.5% of sodium oxide. The hollow glass microspheres with specific components are compounded with the resin, so that the resin composition has low-dielectric-constant/low-dielectric-loss performance and good compressive strength, thereby meeting process requirements of glue mixing dispersion and lamination, and avoiding microsphere breakage risk. The resin composition and a metal foil-clad plate containing the resin composition have excellent low-dielectric-constant/low-dielectric-loss performance, and the temperature coefficient of dielectric constant is small, thus fully meeting the performance requirements of a high-frequency and high-speed substrate.
Provided are a low dielectric loss non-woven fabric, a preparation method thereof and use thereof. The low dielectric loss non-woven fabric is composed of an inorganic fiber and a binder, and the binder is any one or a combination of at least two of a fluorine-containing resin emulsion, a polyolefin emulsion, a polyphenylene ether resin or a cyanate ester resin. The non-woven fabric of the present application has good dielectric properties and obvious strengthening effect, and can meet various performance requirements for copper clad laminate materials in the field of high-frequency communication.
B29C 70/50 - Shaping or impregnating by compression for producing articles of indefinite length, e.g. prepregs, sheet moulding compounds [SMC] or cross moulding compounds [XMC]
B29C 70/88 - Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced
B29C 70/54 - Component parts, details or accessoriesAuxiliary operations
C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
19.
Fluorine-containing resin composition, and resin vanish, fluorine-containing dielectric sheet, laminate, copper clad laminate and printed circuit board containing the same
The present invention relates to a fluorine-containing resin composition, and a resin vanish, a fluorine-containing dielectric sheet, a laminate, a copper clad laminate and a printed circuit board containing the same. The fluorine-containing resin composition comprises 30 wt. %-70 wt. % of a fluorine-containing polymer, 30 wt. %-70 wt. % of an inorganic filler which includes the following particle size distribution: D10 is greater than 1.5 μm; and D50 is 10-15 μm. In the present invention, the selection of an inorganic filler with a specific particle size distribution can ensure that the boards prepared by the fluorine-containing resin composition have excellent dielectric properties and voltage resistance performance, even if the inorganic filler is added in a large amount.
Provided are a thermosetting resin composition, and a prepreg, a laminate and a printed circuit board using same. The thermosetting resin composition comprises a resin component comprising a modified cycloolefin copolymer and other unsaturated resins. The modified cycloolefin copolymer is a reaction product of maleic anhydride and a cycloolefin copolymer; the cycloolefin copolymer is a copolymerization product of a monomer A and a monomer B; the monomer A is selected from one of or a combination of at least two of norbornene, cyclopentadiene, dicyclopentadiene, tricyclopentadiene, and (I); and the monomer B is selected from one of or a combination of at least two of C2-C3 olefins and C2-C3 alkynes. The laminate prepared by using the provided thermosetting resin composition has good dielectric properties, peel strength and thermal resistance, and can satisfy the current requirements of properties for printed circuit board substrates in the field of high-frequency and high-speed communications.
B32B 3/10 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. apertured or formed of separate pieces of material
C08L 51/06 - Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
B32B 5/02 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments
B32B 5/26 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous one layer being a fibrous or filamentary layer another layer also being fibrous or filamentary
H05K 3/02 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
ff, better drilling processability and higher electrical strength. A finer line processing capability can be achieved, which can be applied to a printed circuit board material of a multilayer laminate, in particular a printed circuit board material of a multilayer laminate of thin lines.
C08L 61/06 - Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
C08L 79/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
C08L 79/04 - Polycondensates having nitrogen-containing heterocyclic rings in the main chainPolyhydrazidesPolyamide acids or similar polyimide precursors
The present invention provides a resin composition and an application thereof, the resin composition comprising the following components by weight percentage: 15-39% cross-linkable curable resin and 61-85% filler, the filler being silicon dioxide prepared by means of organosilicon hydrolysis, the average particle diameter D50 of the silicon dioxide being 0.1-3 μm, the ratio of D100:D10 thereof being less than or equal to 2.5, and the purity of the silicon dioxide being greater than 99.9%. The resin composition of the present invention can make prepared adhesive films and resin-coated copper foils have relatively high tensile strength and peel strength, relatively good drilling processability, controllable fluidity, good filling ability, and higher electric strength, and can achieve finer line processing ability; it is a printed circuit board material applicable to multilayer laminates, especially a printed circuit board material for multilayer laminates of thin lines.
C09J 161/06 - Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
C09J 179/04 - Polycondensates having nitrogen-containing heterocyclic rings in the main chainPolyhydrazidesPolyamide acids or similar polyimide precursors
Provided are a thermosetting resin composition and a prepreg, laminate and printed circuit board using same. The thermosetting resin composition comprises a resin component, the resin component comprising a modified cyclic olefin copolymer having a structure as shown in formula I and another unsaturated resin. By introducing a methacrylate end group having a certain polarity into a cyclic olefin copolymer, a modified cyclic olefin copolymer is formed. The modified cyclic olefin copolymer can form a thermosetting material by means of cross-linking with itself or another unsaturated resin, whereby the bonding property can be significantly improved while retaining the excellent dielectric properties of the cyclic olefin copolymer itself. The laminate prepared using the thermosetting resin composition has good dielectric properties, a good peel strength and a good heat resistance, and can meet all the performance requirements for printed circuit board substrates in the current high-frequency and high-speed communication field.
C08L 47/00 - Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bondsCompositions of derivatives of such polymers
B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
C08J 5/04 - Reinforcing macromolecular compounds with loose or coherent fibrous material
B32B 5/02 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments
B32B 5/26 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous one layer being a fibrous or filamentary layer another layer also being fibrous or filamentary
B32B 15/14 - Layered products essentially comprising metal next to a fibrous or filamentary layer
Provided by the present invention a resin composition and an application thereof, the resin composition comprises the following components: (A) a thermosetting resin, the thermosetting resin comprising a combination of at least two among a thermosetting polyphenylene ether, a polyfunctional vinyl aromatic polymer, a thermosetting hydrocarbon resin, and an auxiliary crosslinking agent containing at least two unsaturated functional groups; and (B) silicon dioxide, the silicon dioxide being prepared by means of organosilicon hydrolysis, the purity of the silicon dioxide being ≥99.9%, the average particle size being 0.1-3 μm, and the diameter distance being <1; the mass percentage of the silicon dioxide in the resin composition is 20-70%. The described resin composition has a low dielectric constant and low dielectric loss, and the rate of change of the dielectric loss after moisture absorption is also low, the water absorption rate is low, and thermal stability is high; a prepreg prepared by the described resin composition can fully meet the performance requirements of a high-frequency, high-speed copper foil substrate.
C08L 53/02 - Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers of vinyl aromatic monomers and conjugated dienes
B32B 17/04 - Layered products essentially comprising sheet glass, or fibres of glass, slag or the like in the form of fibres or filaments bonded with or embedded in a plastic substance
B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
B32B 27/04 - Layered products essentially comprising synthetic resin as impregnant, bonding, or embedding substance
25.
FLUORINE-CONTAINING RESIN-BASED RESIN COMPOSITION AND APPLICATION THEREOF
The present invention provides a fluorine-containing resin-based resin composition and an application thereof. The fluorine-containing resin-based resin composition comprises, in parts by weight, 20-70 parts of polytetrafluoroethylene emulsion and 30-70 parts of silicon dioxide; the silicon dioxide is prepared by means of an organic silicon hydrolysis method; and the purity of the silicon dioxide is greater than 99.99%. The fluorine-containing resin-based resin composition and a plate containing same have excellent insulation performance and dielectric performance, lower dielectric constant and dielectric loss, and high breakdown voltage, such that a copper-clad plate has excellent dielectric performance and voltage resistance, and fully satisfies various performance requirements of a high-frequency communication device on copper-clad plate materials.
B32B 27/20 - Layered products essentially comprising synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
B32B 27/18 - Layered products essentially comprising synthetic resin characterised by the use of special additives
B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
B32B 15/085 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising polyolefins
B32B 33/00 - Layered products characterised by particular properties or particular surface features, e.g. particular surface coatingsLayered products designed for particular purposes not covered by another single class
26.
Thermosetting epoxy resin composition and prepreg, laminated board and printed circuit board using thermosetting epoxy resin composition
Provided are a thermosetting epoxy resin composition and a prepreg, laminated board and printed circuit board using the thermosetting epoxy resin composition. The thermosetting epoxy resin composition comprises the following components in parts by weight: 2-10 parts of a phosphorus-containing anhydride, 5-40 parts of a phosphorus-free anhydride, 5-45 parts of an epoxy resin, 40-70 parts of a filler, and 0-15 parts of a phosphorus-containing flame retardant, with the total part by weight of all these components being 100 parts, wherein the phosphorus-containing anhydride has a structure as represented by formula I or II, and the epoxy resin is selected from one of or a combination of at least two of a bisphenol A epoxy resin, a bisphenol F epoxy resin and a biphenyl epoxy resin. The thermosetting epoxy resin composition also has good heat resistance, discoloration resistance and dimensional stability after curing while ensuring V-0 grade flame resistance, and can be used for the preparation of printed circuit board substrates in the field of LEDs.
B32B 15/092 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising epoxy resins
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 15/14 - Layered products essentially comprising metal next to a fibrous or filamentary layer
B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
C08G 59/42 - Polycarboxylic acidsAnhydrides, halides, or low-molecular-weight esters thereof
C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
C08K 5/5313 - Phosphinic compounds, e.g. R2=P(:O)OR'
C08K 5/5377 - Phosphinous compounds, e.g. R2=P—OR'
C08K 5/5419 - Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
B32B 5/02 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments
B32B 5/26 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous one layer being a fibrous or filamentary layer another layer also being fibrous or filamentary
27.
Resin composition, prepreg, laminate, metal foil-clad laminate, and printed circuit board
A resin composition, comprising: a modified maleimide resin (A), an active ester resin (B), and an epoxy resin (C); the modified maleimide resin (A) is obtained by means of reacting a maleimide compound (M) having at least two maleimide groups/molecules with an amine compound (N1) having at least one primary amine group/molecule and an amine compound (N2) having at least two primary amine groups/molecules, and the molecular weight distribution is: molecules having a molecular weight between 1000 and 4500 account for 25-60% the total number of molecules.
Provided are a laminate coated with asymmetric metal foils, and a printed circuit board including same. The laminate coated with asymmetric metal foils comprises one or at least two stacked low-modulus prepregs, and a metal foil which is coated on one side of the one or at least two stacked low-modulus prepregs, or metal foils having different thicknesses which are coated on two sides of the one or at least two stacked low-modulus prepregs. The modulus of elasticity of the low-modulus prepreg is 22 GPa or less after the low-modulus prepreg is cured. By means of the present invention, a low-modulus prepreg having a modulus of elasticity of 22 GPa or less after curing is selected as an insulating material for a laminate coated with asymmetric metal foils, such that the resultant laminate coated with asymmetric metal foils and a printed circuit board manufactured therefrom have a relatively low A-state warpage and a warpage which is obtained after reflow soldering processing, thereby ensuring the reliability of the printed circuit board.
B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
B32B 27/12 - Layered products essentially comprising synthetic resin next to a fibrous or filamentary layer
29.
RESIN COMPOSITION AND RESIN FILM, PREPREG, LAMINATED BOARD, COPPER-CLAD BOARD AND PRINTED CIRCUIT BOARD COMPRISING SAME
A resin composition, and a resin film, a prepreg, a laminated board, a copper-clad board, and a printed circuit board which comprise same. The resin composition comprises a combination of thermosetting polyphenylene ether resin, vinyl organic silicon resin, and a fully hydrogenated elastomer polymer; and based on 100 parts by weight of the sum of the addition amounts of the thermosetting polyphenylene ether resin, the vinyl organic silicon resin, and the fully hydrogenated elastomer polymer, the addition amount of the fully hydrogenated elastomer polymer is 20-50 parts by weight. The copper-clad board prepared from the resin composition has the characteristics of low dielectric constant, low dielectric loss, excellent thermo-oxidative aging resistance, high glass transition temperature, high heat resistance, high peel strength, low water absorption rate, and the like, and can be applied to scenes such as automobile radars in worse use environments.
C08L 83/07 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
C08L 53/02 - Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers of vinyl aromatic monomers and conjugated dienes
B32B 27/04 - Layered products essentially comprising synthetic resin as impregnant, bonding, or embedding substance
The present invention relates to a thermosetting resin composition and application thereof, said thermosetting resin composition comprising: A: a styrene–butadiene–styrene triblock copolymer having a star-shaped structure; B: a linear olefin resin containing 1,2-ethylene, and a modifier thereof; C: at least one resin or small molecule compound substituted with an acrylic group; taking the total mass of component A, component B, and component C as 100%, the added amount of said component A is 3%–85%, the added amount of said component B is 10%–95%, and the added amount of said component C is 1%–70%. The resin composition provided by the present invention does not undergo phase separation under initiator conditions, and has high heat resistance and a relatively low dielectric constant and dielectric loss tangent value, and is capable of providing the desired dielectric properties and thermal reliability of a copper-clad plate.
C08L 53/02 - Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers of vinyl aromatic monomers and conjugated dienes
C08L 9/00 - Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
B32B 17/04 - Layered products essentially comprising sheet glass, or fibres of glass, slag or the like in the form of fibres or filaments bonded with or embedded in a plastic substance
B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
B32B 27/04 - Layered products essentially comprising synthetic resin as impregnant, bonding, or embedding substance
B32B 27/28 - Layered products essentially comprising synthetic resin comprising copolymers of synthetic resins not wholly covered by any one of the following subgroups
Provided are a resin composition, a resin adhesive film, and an application thereof. The resin composition comprises the following components in parts by weight: 80-120 parts an epoxy resin, 1-20 parts a carbodiimide compound, 30-130 parts a phenolic resin, 20-250 parts a modified polymer, and 50-500 parts silicon dioxide; where the modified polymer is selected from a polyethersulfone or a polyamide-imide resin. By means of selection and compounding of components, the present resin composition has a uniquely advantageous film forming property, effectively solves the problem of a semi-cured resin adhesive film being prone to cracking or breaking, has outstanding heat resistance, a high glass transition temperature, a high modulus, good strength and toughness, and can to form a high strength stable bond with a metal film, has uniquely advantageous reliability, can amply satisfy printed circuit board and chip packaging performance requirements, and is suitable in a variety of chip packaging processes.
The present invention provides a resin composition and an adhesive film and a cover film comprising same. The resin composition comprises the following components in parts by weight: 40-80 parts of a polyamide imide resin, 10-40 parts of an epoxy resin, 5-30 parts of a phenoxy resin, and 5-20 parts of a phosphorus-containing flame retardant. By means of the screening and synergistic compounding of the components, the glass transition temperature and heat resistance of the resin composition are significantly improved, and at the same time, the resin composition has excellent adhesion performance and flame retardancy. The adhesive film and the cover film comprising the resin composition both have a glass transition temperature reaching above 160 °C, have outstanding heat resistance, stability and reliability, a high peel strength, good adhesion properties and flame retardancy, can fully meets processing and application requirements of flexible circuit substrates, and are especially suitable for preparing flexible copper clad laminates and flexible printed circuit boards having high temperature resistance and high reliability.
kff; the heat resistance performance, interlayer adhesion force and peel strength performance are excellent; and the CAF resistance performance is excellent.
C08L 53/02 - Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers of vinyl aromatic monomers and conjugated dienes
C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 15/082 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising vinyl resinsLayered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising acrylic resins
B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
B32B 27/28 - Layered products essentially comprising synthetic resin comprising copolymers of synthetic resins not wholly covered by any one of the following subgroups
The present invention relates to a thermosetting resin composition, a resin adhesive liquid containing same, a prepreg, a laminate, a copper clad laminate and a printed circuit board. The thermosetting resin composition comprises the following components: a thermosetting polyphenylene ether resin, an unsaturated butadiene styrene resin, a polyfunctional vinyl aromatic copolymer, an initiator, a silane coupling agent and a filler. The polyfunctional vinyl aromatic copolymer is a copolymer obtained by copolymerizing a divinyl aromatic compound (a), styrene (b), and a monovinyl aromatic compound (c) other than styrene. On the basis of 100 parts by weight of the sum of the amounts of the thermosetting polyphenylene ether resin and the unsaturated butadiene styrene resin, the amount of the multifunctional vinyl aromatic copolymer is 5-25 parts by weight. The board prepared by the thermosetting resin composition provided by the present invention has a relatively high glass transition temperature and a relatively low coefficient of thermal expansion, and has comprehensive properties such as a low dielectric constant, a low dielectric loss, high flame retardancy, and a high peel strength.
B32B 27/12 - Layered products essentially comprising synthetic resin next to a fibrous or filamentary layer
B32B 9/00 - Layered products essentially comprising a particular substance not covered by groups
B32B 9/04 - Layered products essentially comprising a particular substance not covered by groups comprising such substance as the main or only constituent of a layer, next to another layer of a specific substance
The present invention relates to a resin composition and the use thereof. The resin composition comprises, in parts by weight, the following components: a thermosetting polyphenylene ether resin, a crosslinking agent, an epoxy silane oligomer, and a free radical initiator, wherein the crosslinking agent comprises a polyolefin resin with an unsaturated double bond; and the epoxy silane oligomer has a structure as represented by formula I. In the present invention, by means of the addition of the epoxy silane oligomer to a polyphenylene ether + polyolefin resin system, not only can the peeling strength and the interlayer bonding force be effectively improved, but the peeling strength and interlayer bonding force of a plate are also not affected by a temperature change during processing due to the fact that the epoxy silane oligomer is not readily volatile, such that the stability of the peeling strength and the interlayer bonding force are ensured, while the dielectric properties and the heat resistance of the plate are not affected.
C08L 9/00 - Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
C08L 83/00 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon onlyCompositions of derivatives of such polymers
C08K 5/5435 - Silicon-containing compounds containing oxygen containing oxygen in a ring
C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
B32B 17/04 - Layered products essentially comprising sheet glass, or fibres of glass, slag or the like in the form of fibres or filaments bonded with or embedded in a plastic substance
B32B 17/06 - Layered products essentially comprising sheet glass, or fibres of glass, slag or the like comprising glass as the main or only constituent of a layer, next to another layer of a specific substance
B32B 33/00 - Layered products characterised by particular properties or particular surface features, e.g. particular surface coatingsLayered products designed for particular purposes not covered by another single class
The present invention relates to a halogen-free flame-retardant resin composition and an application thereof. The composition comprises the following components in parts by weight of solid components: (A): 1-40 parts by weight of epoxy resin; (B) 1-30 parts by weight of phosphorus-containing benzoxazine resin having a terminal group containing unsaturated bonds; and (C) 30-80 parts by weight of maleimide compound. The present invention also provides a prepreg, resin film or resin-coated copper foil, insulating board, metal foil-clad laminate, and printed circuit board prepared using the resin composition. According to the halogen-free flame-retardant resin composition in the present invention, dielectric properties of the resin composition is effectively improved while ensuring that the resin composition has high Tg and high heat resistance; and the prepreg and the laminate for use in a printed circuit have excellent performance and high size stability.
C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
B32B 27/04 - Layered products essentially comprising synthetic resin as impregnant, bonding, or embedding substance
B32B 17/02 - Layered products essentially comprising sheet glass, or fibres of glass, slag or the like in the form of fibres or filaments
B32B 17/12 - Layered products essentially comprising sheet glass, or fibres of glass, slag or the like next to a fibrous or filamentary layer
B32B 15/14 - Layered products essentially comprising metal next to a fibrous or filamentary layer
B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
B32B 37/06 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
B32B 37/10 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using direct action of vacuum or fluid pressure
A thermosetting resin composition, and a resin glue solution, a prepreg, a high-frequency circuit substrate, and a printed circuit board containing same. The thermosetting resin composition contains the following solid components in parts by weight: (A) 1-40 parts of epoxy resin; (B) 1-40 parts of a maleic anhydride modifier; (C) 30-80 parts of a maleimide compound; and (D) 1-40 parts of an active ester, wherein the maleic anhydride modifier contains polybutadiene or hydrogenated polybutadiene segments. According to the thermosetting resin composition, the dielectric properties of a resin composition is effectively improved while it is ensured that the resin composition has a high Tg value and excellent moisture resistance.
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
C08L 79/04 - Polycondensates having nitrogen-containing heterocyclic rings in the main chainPolyhydrazidesPolyamide acids or similar polyimide precursors
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
B32B 27/18 - Layered products essentially comprising synthetic resin characterised by the use of special additives
B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
A fluorine-containing resin composition and a resin glue solution comprising same, a fluorine-containing dielectric sheet, a laminated board, a copper clad board, and a printed circuit board. The fluorine-containing resin composition comprises the following components: 30wt%-70wt% of a fluorine-containing polymer, and 30wt%-70wt% of an inorganic filler; and the inorganic filler comprises the following particle size distribution: D10 is greater than 1.5 μm and D50 is 10-15 μm. By selecting the inorganic filler having specific particle size distribution, even though the addition amount of the inorganic filler is large, it also can be ensured that the board made of the fluorine-containing resin composition has excellent dielectric properties and voltage resistance.
C08K 7/00 - Use of ingredients characterised by shape
B32B 27/06 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance
B32B 15/085 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising polyolefins
A resin composition and a resin glue solution containing same, a prepreg, a laminated board, a copper-clad plate and a printed circuit board. The resin composition comprises the following components in percentage by weight: 10-50 wt% of polyolefin resin, 5-40 wt% of boron nitride filler, 5-40 wt% of ceramic filler, and 30-70 wt% of silicon dioxide. The ceramic filler comprises any one or a combination of at least two of calcium titanate, lithium titanate, potassium sodium titanate, strontium calcium titanate, calcium zirconate or magnesium zirconate. The resin composition has excellent comprehensive properties such as high thermal conductivity, high peel strength, and low dielectric loss, and can meet the performance requirements of high-frequency plates.
C08L 47/00 - Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bondsCompositions of derivatives of such polymers
C08L 53/02 - Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers of vinyl aromatic monomers and conjugated dienes
C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
B32B 17/04 - Layered products essentially comprising sheet glass, or fibres of glass, slag or the like in the form of fibres or filaments bonded with or embedded in a plastic substance
B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
B32B 27/20 - Layered products essentially comprising synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
The present disclosure discloses a resin composition, and a prepreg, a laminate and a printed circuit board containing the same. The resin composition comprises 100 parts by weight of a halogen-free epoxy resin, 11-37 parts by weight of an active ester resin, and 40-66 parts by weight of a compound represented by Formula (I), wherein n is 2-15; Ac represents an acetyl group. The prepreg, laminate and printed circuit board prepared from such resin composition have a low dielectric loss factor, good flame retardancy, and also have high interlaminar adhesion and a low CTE.
Provided are a maleimide-modified active ester, a preparation method therefor and the use thereof. Raw materials for preparing the active ester comprise: a diphenol compound having the structure as shown in formula A1, a diacyl compound having the structure as shown in formula A2 and a maleimide group-containing compound having the structure as shown in formula A3. The active ester is prepared from the three specific raw materials. The molecular structure of the active ester contains an active ester group and maleimide group, and the two functional groups cooperate with each other, such that the active ester has the characteristics of a highly reactive crosslinking site, a low water absorption rate, low dielectric loss, a low dielectric constant and a low thermal expansion coefficient, etc. An epoxy resin composition with the active ester serving as a curing agent and a circuit board comprising same exhibit excellent dielectric properties, heat resistance, resistance to heat and humidity and low thermal expansion coefficients after curing, and have good bonding forces with metal, and the application requirements for a high performance circuit board can be fully met.
Provided are a magnetic dielectric resin composition and an application thereof, the magnetic dielectric resin composition comprising resin and a magnetic filler, the magnetic filler being a composition of a positive temperature drift coefficient magnetic filler and a negative temperature drift coefficient magnetic filler. By means of the synergistic cooperation of two magnetic fillers, the magnetic dielectric resin composition, in one aspect, has a larger magnetic permeability and reduces magnetic loss and, in another aspect, may reduce the temperature drift coefficient and improve stability, such that same is suitable for the preparation of prepreg materials, laminates, copper clad laminates and printed circuits. A copper clad laminate that comprises the magnetic dielectric resin composition has the features of high relative magnetic permeability, low magnetic loss and a low temperature drift coefficient, and has good performance stability, and may fully satisfy requirements for applying a copper clad laminate in the preparation of a high-performance and miniaturized electronic product.
The present disclosure provides a resin composition, as well as a prepreg, a laminate and a printed circuit board containing the same. The resin composition comprises 48-54 parts by weight of a halogen-free epoxy resin, 16-31 parts by weight of a compound represented by Formula (I), wherein n is 2-15; Ac represents an acetyl group; and 15-32 parts by weight of a cyanate ester resin. The prepreg, laminate and printed circuit board prepared from the resin composition have a low coefficient of thermal expansion.
The present disclosure provides a resin composition, as well as a prepreg, a laminate and a printed circuit board containing the same. The resin composition comprises 48-54 parts by weight of a halogen-free epoxy resin, 16-31 parts by weight of a compound represented by Formula (I), wherein n is 2-15; Ac represents an acetyl group; and 15-32 parts by weight of a cyanate ester resin. The prepreg, laminate and printed circuit board prepared from the resin composition have a low coefficient of thermal expansion.
A magnetic dielectric resin composition, and a prepreg and a copper clad laminate comprising same. The magnetic dielectric resin composition comprises a resin and a magnetic filler. The absolute value of the temperature drift coefficient of the magnetic filler under the conditions of −55°C to 150°C is 0-1000 ppm/°C. Preparation raw materials of the magnetic filler comprise a combination of iron oxide and a metal oxide. By means of mutual synergy of the resin and the specific magnetic filler, and on the premise of ensuring good dielectric properties, the magnetic dielectric resin composition has a high magnetic permeability, a low magnetic loss, and a proper cut-off frequency, and can also reduce a temperature drift coefficient and improve stability. The copper clad laminate comprising the magnetic dielectric resin composition has a high relative magnetic permeability, a low magnetic loss, a low temperature drift coefficient, and a superior thermal stability, and can fully satisfy application requirements for copper clad laminate in the preparation of high-performance and miniaturized electronic products.
An epoxy resin composition, and a prepreg, a laminate, and a metal foil-clad laminate manufactured using same. The epoxy resin composition comprises epoxy resin (A), phenolic curing agent (B), high molecular weight resin (C), and an optional inorganic filler (D), the high molecular weight resin (C) having the structure shown in formula (1), formula (2), formula (3), and formula (4), the weight-average molecular weight being between 100,000 and 200,000, and the content of the epoxy resin (A) containing a naphthalene ring skeleton and the phenolic curing agent (B) containing a naphthalene ring skeleton being 0%. The present epoxy resin composition, and the prepreg, the laminate, and the metal foil-clad laminate manufactured using same have good heat resistance, low modulus, and a low coefficient of thermal expansion. The formulas are:
B32B 5/02 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments
B32B 15/12 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of paper or cardboard
B32B 15/14 - Layered products essentially comprising metal next to a fibrous or filamentary layer
B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
B32B 29/00 - Layered products essentially comprising paper or cardboard
B32B 29/02 - Layered products essentially comprising paper or cardboard next to a fibrous or filamentary layer
C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
C08K 3/013 - Fillers, pigments or reinforcing additives
C08L 33/08 - Homopolymers or copolymers of acrylic acid esters
C08L 33/20 - Homopolymers or copolymers of acrylonitrile
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
The thermosetting resin composition, a prepreg containing same, a metal foil-clad laminate and a printed circuit board; the resin composition comprises the following components: a combination of a bismaleimide resin and a benzoxazine resin or a prepolymer of a bismaleimide resin and a benzoxazine resin, an epoxy resin and an active ester. A metal foil-clad laminate prepared by using the resin composition provided by the present invention has a high glass transition temperature, a low thermal expansion coefficient, a high high-temperature modulus, a high peel strength, a low dielectric constant, a low dielectric loss factor, as well as good heat resistance and good processability.
C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
B32B 15/092 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising epoxy resins
C08L 45/00 - Compositions of homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic ring systemCompositions of derivatives of such polymers
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
C08L 79/04 - Polycondensates having nitrogen-containing heterocyclic rings in the main chainPolyhydrazidesPolyamide acids or similar polyimide precursors
Provided is a resin composition, a prepreg for a printed circuit and a metal-coated laminate. The resin composition includes: a silicone aryne resin, a polyphenylene ether resin with unsaturated bonds, and a butadiene polymer. The resin composition is used such that the prepared metal-coated laminate can have at least one of the following characteristics: a low dielectric loss factor, high heat resistance, and a low coefficient of thermal expansion.
C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
B32B 5/02 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments
B32B 15/14 - Layered products essentially comprising metal next to a fibrous or filamentary layer
B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
C08L 9/00 - Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
C08L 83/16 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon onlyCompositions of derivatives of such polymers in which all the silicon atoms are connected by linkages other than oxygen atoms
The present application provides a resin component, and a prepreg and a circuit material using the same. The resin component comprises unsaturated polyphenylene ether resin, polyolefin resin, terpene resin and an initiator. When the total weight of the unsaturated polyphenylene ether resin, polyolefin resin and terpene resin is defined as 100 parts by weight, the terpene resin is in an amount of 3-40 parts by weight. The polyolefin resin is one or a combination of at least two selected from the group consisting of unsaturated polybutadiene resin, SBS resin and styrene butadiene resin. The present application discloses that the resulting resin composition has good film-forming properties, adhesion and dielectric properties through the coordination of unsaturated polyphenylene ether resin, unsaturated polyphenylene ether resin, polyolefin resin and terpene resin, and the circuit boards using the same have higher interlayer peel strength and lower dielectric loss.
B32B 15/085 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising polyolefins
C08L 47/00 - Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bondsCompositions of derivatives of such polymers
C09D 147/00 - Coating compositions based on homolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bondsCoating compositions based on derivatives of such polymers
C09J 147/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bondsAdhesives based on derivatives of such polymers
C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
B32B 5/26 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous one layer being a fibrous or filamentary layer another layer also being fibrous or filamentary
49.
Circuit material and circuit board containing the same
The present application provides a circuit material and a circuit board containing the same. The circuit material comprises a conductive metal layer and a dielectric substrate layer, and an adhesive layer arranged therebetween, wherein the adhesive layer is made of a material which comprises an adhesive composition comprising a resin component and a non-resin component, wherein the resin component is composed of unsaturated polyphenylene ether resin, SBS resin and maleimide resin; and the non-resin component comprises an initiator; and the adhesive layer is obtained by applying the adhesive composition dissolved in a solvent onto the surface of the conductive metal layer or the dielectric substrate layer in the form of a solution, or by applying to a release material and removing the release material after partially curing or completely curing.
Provided is a boron nitride agglomerate. The boron nitride agglomerate is of a multi-stage structure formed by arranging flaky hexagonal boron nitride primary particles in three-dimensional directions through adhesion of an inorganic binder. Further provided is a method for preparing the boron nitride agglomerate. The method comprises: mixing flaky hexagonal boron nitride primary particles with an inorganic binder, and controlling the mass of the inorganic binder to account for 0.02-20% of the mass of the flaky hexagonal boron nitride primary particles, so as to obtain the boron nitride agglomerate. The boron nitride agglomerate provided can be added to thermosetting resin compositions, and resin sheets, resin composite metal foil, prepregs, laminates, metal foil-covered laminates, and printed wiring boards prepared using the same have higher boron nitride addition, high thermal conductivity, and high peel strength.
C04B 35/583 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxides based on borides, nitrides or silicides based on boron nitride
C08L 53/02 - Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers of vinyl aromatic monomers and conjugated dienes
The present invention relates to a resin composition and a prepreg sheet using same, and an insulating plate. The resin composition comprises a combination of a modified maleimide compound and a polymer containing an alkenyl group. The modified maleimide compound is prepared from compound (A) or an organometallic salt of an amino-containing silane, and compound (B) containing at least two maleimido groups. The resin composition provided by the present invention has a higher bonding strength, and can be used to prepare a laminate with a high peel strength, a low dielectric constant, a high heat resistance and a high flame retardancy, and the modified maleimide compound has a good compatibility with a resin and will not crystallize easily during processing.
Provided are a thermosetting resin composition, and a prepreg, a laminate and a printed circuit board using same. The thermosetting resin composition comprises a resin component comprising a modified cycloolefin copolymer and other unsaturated resins. The modified cycloolefin copolymer is a reaction product of maleic anhydride and a cycloolefin copolymer; the cycloolefin copolymer is a copolymerization product of a monomer A and a monomer B; the monomer A is selected from one of or a combination of at least two of norbornene, cyclopentadiene, dicyclopentadiene, tricyclopentadiene, and (I); and the monomer B is selected from one of or a combination of at least two of C2-C3 olefins and C2-C3 alkynes. The laminate prepared by using the provided thermosetting resin composition has good dielectric properties, peel strength and thermal resistance, and can satisfy the current requirements of properties for printed circuit board substrates in the field of high-frequency and high-speed communications.
C08L 51/06 - Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
C08L 47/00 - Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bondsCompositions of derivatives of such polymers
Provided are a thermosetting resin composition and a prepreg, laminate and printed circuit board using same. The thermosetting resin composition comprises a resin component, the resin component comprising a modified cyclic olefin copolymer having a structure as shown in formula I and another unsaturated resin. By introducing a methacrylate end group having a certain polarity into a cyclic olefin copolymer, a modified cyclic olefin copolymer is formed. The modified cyclic olefin copolymer can form a thermosetting material by means of cross-linking with itself or another unsaturated resin, whereby the bonding property can be significantly improved while retaining the excellent dielectric properties of the cyclic olefin copolymer itself. The laminate prepared using the thermosetting resin composition has good dielectric properties, a good peel strength and a good heat resistance, and can meet all the performance requirements for printed circuit board substrates in the current high-frequency and high-speed communication field.
C08F 232/04 - Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system having no condensed rings having one carbon-to-carbon double bond
C08F 232/06 - Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system having no condensed rings having two or more carbon-to-carbon double bonds
The present invention relates to a modified maleimide compound, a preparation method therefor and the use thereof. The modified maleimide compound is prepared from compound (A) or an organometallic salt of an amino-containing silane, and compound (B) containing at least two maleimido groups. The present invention comprises prepolymerizing compound (B) containing at least two maleimido groups with an amino-containing silane compound (A) or an organometallic salt of an amino-containing silane to obtain a modified maleimide compound containing a silane. When used in a resin composition of a composite material, the modified maleimide compound has a better compatibility with a low-polarity resin, avoids the volatilization of a silane coupling agent during drying of a prepreg, and can reduce the reactivity between bismaleimide and other resins, reduce the curing stress of the resin composition, increase the adhesive force between the resin composition and a reinforcing material or a conductive layer, and maintain a low dielectric loss and a high heat resistance.
C07F 7/18 - Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
C08G 77/26 - Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen nitrogen-containing groups
C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
55.
THERMOSETTING EPOXY RESIN COMPOSITION AND PREPREG, LAMINATED BOARD AND PRINTED CIRCUIT BOARD USING THERMOSETTING EPOXY RESIN COMPOSITION
Provided are a thermosetting epoxy resin composition and a prepreg, laminated board and printed circuit board using the thermosetting epoxy resin composition. The thermosetting epoxy resin composition comprises the following components in parts by weight: 2-10 parts of a phosphorus-containing anhydride, 5-40 parts of a phosphorus-free anhydride, 5-45 parts of an epoxy resin, 40-70 parts of a filler, and 0-15 parts of a phosphorus-containing flame retardant, with the total part by weight of all these components being 100 parts, wherein the phosphorus-containing anhydride has a structure as represented by formula I or II, and the epoxy resin is selected from one of or a combination of at least two of a bisphenol A epoxy resin, a bisphenol F epoxy resin and a biphenyl epoxy resin. The thermosetting epoxy resin composition also has good heat resistance, discoloration resistance and dimensional stability after curing while ensuring V-0 grade flame resistance, and can be used for the preparation of printed circuit board substrates in the field of LEDs.
C07F 9/6571 - Heterocyclic compounds, e.g. containing phosphorus as a ring hetero atom having phosphorus atoms, with or without nitrogen, oxygen, sulfur, selenium or tellurium atoms, as ring hetero atoms having phosphorus and oxygen atoms as the only ring hetero atoms
C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
B32B 17/02 - Layered products essentially comprising sheet glass, or fibres of glass, slag or the like in the form of fibres or filaments
B32B 15/14 - Layered products essentially comprising metal next to a fibrous or filamentary layer
B32B 27/04 - Layered products essentially comprising synthetic resin as impregnant, bonding, or embedding substance
Provided is a resin composition, comprising: a modified maleimide resin (A), an active ester resin (B), and an epoxy resin (C); the modified maleimide resin (A) is obtained by means of reacting a maleimide compound (M) having at least two maleimide groups/molecules with an amine compound (N1) having at least one primary amine group/molecule and an amine compound (N2) having at least two primary amine groups/molecules, and the molecular weight distribution is: molecules having a molecular weight between 1000 and 4500 account for 25-60% the total number of molecules.
Provided are an active ester with amino groups at two ends, a preparation method therefor, and a thermosetting resin composition thereof. The active ester with amino groups at two ends has a structure represented by structural formula (I). The active ester with amino groups at two ends has, on the main chain structure thereof, both an aromatic ester group and an aromatic amino functional group, and as a curing agent for an epoxy resin, the thermosetting resin composition thereof has a low dielectric constant and a low dielectric loss factor, and has good heat resistance, toughness and an excellent metal adhesion strength.
The present invention provides a diamine compound, a preparation method therefor, and a thermosetting resin composition. The diamine compound has a structure as represented by structural formula (I). The structure of the diamine compound has both an aromatic amine group and an aryl ester-based functional group. As a curing agent for epoxy resin, the thermosetting resin composition of the diamine compound is low in dielectric constant and dielectric loss factor, has good thermal resistance and toughness, and has excellent bond strength to metals.
C07C 229/52 - Compounds containing amino and carboxyl groups bound to the same carbon skeleton having amino and carboxyl groups bound to carbon atoms of six-membered aromatic rings of the same carbon skeleton
C07C 229/54 - Compounds containing amino and carboxyl groups bound to the same carbon skeleton having amino and carboxyl groups bound to carbon atoms of six-membered aromatic rings of the same carbon skeleton with amino and carboxyl groups bound to carbon atoms of the same non-condensed six-membered aromatic ring
C07C 227/04 - Formation of amino groups in compounds containing carboxyl groups
Disclosed are a resin composition for a metal substrate, a resin glue solution comprising same, and a metal-based copper foil-clad laminate. The resin composition comprises the following components based on 100% of the total weight of the resin composition: 5-40% of a main resin and 60-95% of a thermally conductive filler; and the main resin comprises 60-90% of a flexible epoxy resin and 10-40% of a phenoxy resin based on 100% of the total weight of the resin composition, wherein the flexible epoxy resin has a structure as represented by formula I. The resin composition has a low modulus, wherein same can alleviate the stress generated by the impact of heat and cold, and can withstand more than 1000 cycles of hot and cold cycle experiments.
The disclosure provides a copper clad laminate and a printed-circuit board. The copper clad laminate comprises a dielectric substrate layer and a copper foil layer. The copper foil layer is located on at least one surface of the dielectric substrate layer, wherein the copper foil layer comprises an iron element in a weight content of less than 10 ppm, a nickel element in a weight content of less than 10 ppm, a cobalt element in a weight content of less 10 ppm, and a molybdenum element in a weight content of 10 ppm. The copper clad laminate has a passive intermodulation PIM of less than -158dBc (700MHz/2600MHz).
The present disclosure provides a resin composition for a metal substrate, and a resin varnish and a metal base copper-clad laminate comprising the same. The resin composition comprises 5-40% of a main resin and 60-95% of a thermally conductive filler when the total weight of the resin composition is calculated as 100%, wherein the main resin comprises 60-90% of a flexible epoxy resin having a structure as shown in Formula I and 10-40% of a phenoxy resin when the total weight of the main resin is calculated as 100%. The resin composition provided by the present disclosure has a low modulus, can alleviate the stress generated by thermal shocks and can withstand more than 1000 thermal cycles.
B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 15/18 - Layered products essentially comprising metal comprising iron or steel
C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
B32B 15/092 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising epoxy resins
62.
RESIN COMPOSITION, PREPREG CONTAINING SAME, LAMINATE, AND PRINTED CIRCUIT BOARD
Provided in the present disclosure are a resin composition, a prepreg containing same, and a laminate and a printed circuit board. The resin composition comprises: 100 parts by weight of halogen-free epoxy resin; 11-37 parts by weight of active ester resin; and 40-66 parts by weight of the compound shown in formula (I), wherein n is 2-15 and Ac represents acetyl. The prepreg, the laminate, and the printed circuit board made using the present resin composition have a low dielectric loss factor and good flame retardancy, and also have high interlayer bonding and low CTE. (I)
C08L 67/03 - Polyesters derived from dicarboxylic acids and dihydroxy compounds the dicarboxylic acids and dihydroxy compounds having the hydroxy and the carboxyl groups directly linked to aromatic rings
C08L 67/00 - Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chainCompositions of derivatives of such polymers
The present disclosure provides a resin composition and prepreg containing same, and a laminate board and a printed circuit board. The resin composition contains: 48-54 parts by weight of halogen-free epoxy resin; 16-31 parts by weight of the compound represented by formula (I), wherein n is 2-15 and Ac represents acetyl; and 15-32 parts by weight of cyanate ester resin. The prepreg, laminate board, and printed circuit board made using the described resin composition have a low coefficient of thermal expansion.
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
C08L 79/04 - Polycondensates having nitrogen-containing heterocyclic rings in the main chainPolyhydrazidesPolyamide acids or similar polyimide precursors
64.
HALOGEN-FREE FLAME-RETARDANT THERMOSETTING RESIN COMPOSITION, PREPREG FOR PRINTED CIRCUITS AND METAL-CLAD LAMINATE
Provided in the present disclosure are a halogen-free flame-retardant thermosetting resin composition, a prepreg for printed circuits, and a metal-clad laminate. The halogen-free flame-retardant thermosetting resin composition comprises: a modified bismaleimide prepolymer; a benzoxazine resin; a phosphorus-containing epoxy resin; an anhydride compound; and a curing accelerator. By using the halogen-free flame-retardant thermosetting resin composition, the resulting metal-clad laminate can at least have one among the features of good adhesion, high heat resistance, high glass transition temperature (Tg), flame retardancy, low dielectric constant and loss, and so on.
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
C08L 79/04 - Polycondensates having nitrogen-containing heterocyclic rings in the main chainPolyhydrazidesPolyamide acids or similar polyimide precursors
C08G 59/58 - Amines together with other curing agents with polycarboxylic acids or with anhydrides, halides, or low-molecular-weight esters thereof
A vinyl thermosetting resin composition, a prepreg, a laminate, and a printed circuit board are provided. The vinyl thermosetting resin composition has a vinyl thermosetting resin, a curing agent, and hollow borosilicate microspheres with surfaces chemically modified by a vinyl polyphenylene ether resin. The laminate not only has excellent overall properties such as low dielectric constant, low dielectric loss, low water absorption rate, good heat resistance, and the like, but also has only small fluctuations in dielectric constants between batches, which can satisfy the requirements for dielectric constant stability and/or thickness consistency of a substrate.
C08L 53/02 - Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers of vinyl aromatic monomers and conjugated dienes
A thermosetting resin composition, a prepreg, a laminate, and a printed circuit board are provided. The thermosetting resin composition has a thermosetting polyphenylene ether resin, an unsaturated polyolefin resin, a curing agent, and hollow borosilicate microspheres with surfaces treated with a bromine-containing silane coupling agent. The laminate produced from the thermosetting resin composition satisfies the requirements for overall properties such as low dielectric constant, low dielectric loss, low water absorption rate, high peeling strength, and the like for a high-frequency electronic circuit substrate.
C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
B32B 15/14 - Layered products essentially comprising metal next to a fibrous or filamentary layer
C08L 25/10 - Copolymers of styrene with conjugated dienes
C08L 47/00 - Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bondsCompositions of derivatives of such polymers
Provided by the present invention are a thermosetting resin composition, a prepreg containing same, a metal foil-clad laminate and a printed circuit board; the resin composition comprises the following components: a combination of a bismaleimide resin and a benzoxazine resin or a prepolymer of a bismaleimide resin and a benzoxazine resin, an epoxy resin and an active ester. A metal foil-clad laminate prepared by using the resin composition provided by the present invention has a high glass transition temperature, a low thermal expansion coefficient, a high high-temperature modulus, a high peel strength, a low dielectric constant, a low dielectric loss factor, as well as good heat resistance and good processability.
C08L 79/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
C08L 61/34 - Condensation polymers of aldehydes or ketones with monomers covered by at least two of the groups , , and
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
C08K 5/12 - EstersEther-esters of cyclic polycarboxylic acids
C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 15/092 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising epoxy resins
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
B32B 27/20 - Layered products essentially comprising synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
B32B 27/28 - Layered products essentially comprising synthetic resin comprising copolymers of synthetic resins not wholly covered by any one of the following subgroups
The present invention provides a low-insertion loss, high-frequency and high-thermal conductive substrate and application thereof. The thermal conductive substrate comprises the following layers: a first low profile copper foil layer, a thin film resistive layer, a first resin layer, a first thermal conductive bonding sheet or thermal conductive adhesive film layer, a third thermal conductive bonding sheet layer, a second thermal conductive bonding sheet or thermal conductive adhesive film layer, a second resin layer, and a second low profile copper foil layer which are sequentially combined together from top to bottom. The thermal conductive substrate has higher heat conductivity and peel strength, lower dielectric constant and dielectric loss, lower insertion loss and higher integration level, and the reliability of the thermal conductive substrate is improved; and the low-insertion loss, high-frequency and high-thermal conductive substrate can be used as a circuit board to be applied to electronic products.
Provided in the present invention are a low insertion loss high-frequency heat conducting substrate and an application therefor, the low insertion loss high-frequency heat conducting substrate comprising the following layers bonded together in sequence from top to bottom: a first low-profile copper foil layer with a roughness of Rz≤5 μm; a thin film resistance layer; a first resin layer of a thickness of 2-20 μm; a high-frequency thermally conductive adhesive sheet with a dielectric constant lower than 3.8, a dielectric loss less than 0.0040, and a thermal conductivity of 0.5-1.5 W/mK; and a second low-profile copper foil layer with a thickness of 2-20 μm and a roughness of Rz≤5 μm; the substrate has high thermal conductivity and peel strength, a low dielectric constant and dielectric loss and low insertion loss, and a high degree of integration, increasing the reliability of the substrate, and can be used as a circuit board in electronic products.
Disclosed are a thermosetting resin composition, a prepreg made therefrom, a laminate clad with a metal foil, and a high-frequency circuit board, wherein the thermosetting resin composition contains thermosetting ingredients. The thermosetting ingredients include a phosphorus-containing monomer or a phosphorus-containing resin and a polyphenylene ether resin containing an unsaturated group, and the phosphorus-containing monomer or the phosphorus-containing resin has a structure as shown in formula I. By using the phosphorus-containing monomer or the phosphorus-containing resin as a cross-linking agent of the polyphenylene ether resin containing an unsaturated group and by means of a cross-linking reaction of a large number of unsaturated double bonds in the resin, the high-frequency dielectric properties and high-temperature-resistance required by a circuit substrate are provided.
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 27/28 - Layered products essentially comprising synthetic resin comprising copolymers of synthetic resins not wholly covered by any one of the following subgroups
C08G 79/04 - Phosphorus linked to oxygen or to oxygen and carbon
C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
C08K 5/5313 - Phosphinic compounds, e.g. R2=P(:O)OR'
C08L 43/02 - Homopolymers or copolymers of monomers containing phosphorus
C08J 5/04 - Reinforcing macromolecular compounds with loose or coherent fibrous material
71.
Thermosetting resin composition, prepreg made therefrom, laminate clad with metal foil, and high-frequency circuit board
Disclosed are a thermosetting resin composition, a prepreg made therefrom, a laminate clad with a metal foil, and a high-frequency circuit board, wherein the thermosetting resin composition contains thermosetting ingredients. The thermosetting ingredients include a phosphorus-containing monomer or a phosphorus-containing resin and another thermosetting resin containing an unsaturated group, and the phosphorus-containing monomer or the phosphorus-containing resin has a structure as shown in formula I. By using the phosphorus-containing monomer or the phosphorus-containing resin as a cross-linking agent of the other thermosetting resin containing an unsaturated group and by means of a cross-linking reaction of a large number of unsaturated double bonds in the resin, the high-frequency dielectric properties and high-temperature-resistance required by a circuit substrate are provided.
C08F 279/02 - Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group on to polymers of conjugated dienes
C08F 299/02 - Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
Provided is a resin composition, a prepreg for a printed circuit and a metal-coated laminate. The resin composition includes: a silicone aryne resin, a polyphenylene ether resin with unsaturated bonds, and a butadiene polymer. The resin composition is used such that the prepared metal-coated laminate can have at least one of the following characteristics: a low dielectric loss factor, high heat resistance, and a low coefficient of thermal expansion.
D06M 15/227 - Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds of hydrocarbons, or reaction products thereof, e.g. afterhalogenated or sulfochlorinated
C08L 9/00 - Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
A thermosetting resin composition, and a prepreg, laminated board and high frequency circuit substrate which contain the thermosetting resin composition, the thermosetting resin composition comprising the following components by weight: 5-15 parts of an aromatic poly carbodiimide, 30-70 parts of an epoxy resin, and 5-40 parts of hydroxyl-containing polyphosphoester and/or hydroxyl-containing phosphonate-carbonate copolymer. The melting point of the aromatic poly carbodiimide ranges from 100-160°C. The prepreg, laminated board and high frequency circuit substrate which are prepared from the thermosetting resin composition possess excellent dielectric properties, excellent heat resistance, a relatively low water absorption rate, excellent processing performance, and a flame resistance grade up to UL94 V-0.
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
C08L 79/00 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups
C08L 85/02 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbonCompositions of derivatives of such polymers containing phosphorus
B32B 27/06 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance
74.
RESIN COMPOSITION, PREPREG, LAMINATE, AND METAL FOIL-COATED LAMINATE
An epoxy resin composition, and a prepreg, a laminate, and a metal foil-coated laminate manufactured using same. The epoxy resin composition comprises epoxy resin (A), phenolic curing agent (B), high molecular weight resin (C), and an optional inorganic filler (D), the high molecular weight resin (C) having the structure shown in formula (1), formula (2), formula (3), and formula (4), the weight-average molecular weight being between 100,000 and 200,000, and the content of the epoxy resin (A) containing a naphthalene ring skeleton and the phenolic curing agent (B) containing a naphthalene ring skeleton being 0%. The present epoxy resin composition, and the prepreg, the laminate, and the metal foil-coated laminate manufactured using same have good heat resistance, low modulus, and a low coefficient of thermal expansion.
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
C08L 79/00 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups
A laminate and a preparation method therefor. The laminate has a metal base plate formed of a copper layer and an aluminium layer in close contact, a thermally conductive insulation layer on the copper layer of the metal base plate, and a copper foil layer on the thermally conductive insulation layer. The laminate can be used as a printed circuit board.
A resin composition, a prepreg used for a printed circuit, and a metal-clad laminate. The resin composition comprises: a silicon-containing arylacetylene resin, a cyanate ester compound, and a maleimide compound. By using the resin composition, the prepared metal-clad laminate may have at least one of characteristics such as a low dielectric loss factor, high heat resistance, and a low coefficient of thermal expansion.
C08L 83/16 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon onlyCompositions of derivatives of such polymers in which all the silicon atoms are connected by linkages other than oxygen atoms
C08L 79/04 - Polycondensates having nitrogen-containing heterocyclic rings in the main chainPolyhydrazidesPolyamide acids or similar polyimide precursors
C08L 79/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
Provided are a phosphorous and silicon containing flame retardant, a preparation method therefor, a flame retardant resin composition, a prepreg and a metal foil-cladding laminate. The phosphorous and silicon containing flame retardant has a structure as represented by formula (I), can function as a curing agent and a halogen-free flame retardant at the same time, and can achieve the flame retardant effect of UL94 V-0 at a lower phosphorus content. (I)
C07F 7/16 - Preparation thereof from silicon and halogenated hydrocarbons
C08L 23/00 - Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bondCompositions of derivatives of such polymers
C08L 83/00 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon onlyCompositions of derivatives of such polymers
B32B 27/18 - Layered products essentially comprising synthetic resin characterised by the use of special additives
B32B 27/06 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance
78.
THERMOSETTING RESIN COMPOSITION, PREPREG USING SAME, METAL FOIL-CLADDED LAMINATE, AND PRINTED CIRCUIT BOARD
Provided in the present invention are a thermosetting resin composition, a prepreg using same, a metal foil-cladded laminate, and a printed circuit board. The thermosetting resin composition comprises an epoxy resin, a phosphorous-containing bisphenol, and an ester curing agent having the structure of formula I. The present invention employs the ester curing agent having the structure of formula I and the phosphorous-containing bisphenol for co-curing of the epoxy resin, uses the phosphorous-containing bisphenol as a primary curing agent, provides a cured substance with great dielectric performance, high temperature resistance, and adhesion, also implements halogen-free flame retardation, combined with the ester curing agent of the structure of formula I, produces no polar groups such as a secondary hydroxyl, and significantly increases the glass transition temperature of the cured substance while ensuring great dielectric performance, and, with the cured substance containing a large amount of hydrophobic groups, significantly reduces the water absorption rate of the cured substance, thus increasing the stability of the dielectric constant and of the dielectric loss factor of the cured substance. The laminate manufactured and the metal foil-cladded laminate have great heat resistance, moisture resistance, peel strength, dielectric performance, and flame retardancy.
C08G 59/42 - Polycarboxylic acidsAnhydrides, halides, or low-molecular-weight esters thereof
C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
B32B 15/092 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising epoxy resins
B32B 27/06 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
B32B 27/18 - Layered products essentially comprising synthetic resin characterised by the use of special additives
gg, a high heat resistance, a high modulus, a high reliability, a low CTE, and a low water absorption, and maintains good mechanical properties and machining properties while also having an UL94-V0 flame retardant effect.
C08L 79/04 - Polycondensates having nitrogen-containing heterocyclic rings in the main chainPolyhydrazidesPolyamide acids or similar polyimide precursors
C08K 3/00 - Use of inorganic substances as compounding ingredients
Provided are a thermosetting resin composition and a prepreg, laminate and high-frequency circuit substrate containing same, wherein the thermosetting composition comprises the following components in parts by weight: 0.5-15 parts by weight of an aromatic polycarbodiimide; 30-60 parts by weight of an epoxy resin; 5-30 parts by weight of a hydroxy-containing active ester; and 10-30 parts by weight of a flame retardant. The use of the aromatic polycarbodiimide and hydroxy-containing active ester as co-curing agents for the epoxy resin avoids a step of hydroxy end-capping with an acyl chloride or phenol while ensuring the electrical properties of the finally obtained composition; therefore, the finally obtained curing system has a higher crosslinking density and a good heat and humidity resistance; and furthermore, the aromatic polycarbodiimide has the function of preventing the hydrolysis of ester groups, so that the hydrolysis resistance of the ester-cured epoxy resin can be improved.
C08G 59/68 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the catalysts used
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
B32B 5/26 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous one layer being a fibrous or filamentary layer another layer also being fibrous or filamentary
B32B 15/14 - Layered products essentially comprising metal next to a fibrous or filamentary layer
A resin composition, and a prepreg, a laminated board, a metal foil-clad laminated board and a printed circuit board made by the resin composition. The resin composition comprises an epoxy resin (A), a phenolic curing agent (B), and organic silicone rubber (C). The resin composition, and the prepreg, the laminated board and the metal foil-clad laminated board made by the resin composition have characteristics such as good heat resistance, low modulus, and low coefficient of thermal expansion, and can inhibit the phenomenon of cracks on a pad during a processing process for a printed circuit board.
The present invention provides a thermosetting resin composition and a prepreg using same, a laminate, and a metal foil-clad laminate. The thermosetting resin composition comprises epoxy resin, a styrene maleic anhydride oligomer, and an ester curing agent having a structure represented by formula I. According to the present invention, the ester curing agent having the structure represented by formula I and the styrene maleic anhydride oligomer are used cooperatively for curing the epoxy resin; no secondary hydroxyl or other polar groups are generated in the process of curing; moreover, a cured product contains a large amount of hydrophobic groups; high glass transition temperature of the cured product is guaranteed, and the water absorption rate, coefficient of thermal expansion and dielectric loss factor can be significantly reduced. The laminate and the metal foil-clad laminate prepared by using the thermosetting resin composition have good heat resistance, moisture resistance, peel strength, dielectric properties, and flame retardance.
A thermosetting resin composition and a prepreg and a metal foil-covered laminate made using same, the thermosetting resin composition comprising component (A): a solvent-soluble polyfunctional vinyl aromatic copolymer, the copolymer being a poly-functional vinyl aromatic copolymer having a stoctoal unit derived from monomers comprising divinyl aromatic compound (a) and ethyl vinyl aromatic compound (b); and component (B): a vinyl-containing organic silicone resin. The prepreg and metal foil-covered laminate made from the thermosetting resin composition have good toughness, and maintain a high glass transition temperature, a low water absorption, dielectric properties and humidity resistance, being suitable for the field of high-frequency and high-speed printed circuit boards and the processing of multilayer printed circuit boards.
B32B 5/02 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments
B32B 5/26 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous one layer being a fibrous or filamentary layer another layer also being fibrous or filamentary
C08G 77/00 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon
84.
Halogen-free epoxy resin composition and a prepreg and a laminate using the same
The present disclosure relates to a halogen-free epoxy resin composition and a prepreg and a laminate using the same. The halogen-free epoxy resin composition comprises: (A) a halogen-free epoxy resin; (B) an active ester resin; and (C) a reactive phosphorous-containing flame retardant. The prepreg and laminate made from the halogen-free epoxy resin composition have the advantages of high inter-laminar adhesive force, low coefficient of thermal expansion and high heat-humidity resistance, and can achieve the halogen-free flame retardant purpose.
B32B 5/26 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous one layer being a fibrous or filamentary layer another layer also being fibrous or filamentary
B32B 15/092 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising epoxy resins
B32B 17/04 - Layered products essentially comprising sheet glass, or fibres of glass, slag or the like in the form of fibres or filaments bonded with or embedded in a plastic substance
C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
Disclosed are a thermosetting resin composition, and a prepreg, a laminate and a high frequency circuit substrate which contain same. The thermosetting resin composition comprises the following components: 12-50 parts by weight of a cyanate ester resin; 30-60 parts by weight of an epoxy resin; and 10-28 parts by weight of a biphenyl phenolic resin. The prepreg and a copper-cladded substrate, which are prepared from the provided thermosetting resin composition, have a high glass transition temperature, excellent dielectric properties, a low water absorption, a high thermal resistance, a high peel strength, and a high interlaminar adhesive force and have a good processability.
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
C08L 79/04 - Polycondensates having nitrogen-containing heterocyclic rings in the main chainPolyhydrazidesPolyamide acids or similar polyimide precursors
B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
B32B 15/14 - Layered products essentially comprising metal next to a fibrous or filamentary layer
B32B 17/06 - Layered products essentially comprising sheet glass, or fibres of glass, slag or the like comprising glass as the main or only constituent of a layer, next to another layer of a specific substance
B32B 17/04 - Layered products essentially comprising sheet glass, or fibres of glass, slag or the like in the form of fibres or filaments bonded with or embedded in a plastic substance
B32B 33/00 - Layered products characterised by particular properties or particular surface features, e.g. particular surface coatingsLayered products designed for particular purposes not covered by another single class
The present invention relates to a method for preparing a benzoxazine-containing resin composition and a prepreg and a laminate made therefrom. The method for preparing a benzoxazine-containing resin composition is adding an acidic filler to a benzoxazine-containing resin composition. By adding an acidic filler to the benzoxazine-containing resin composition, the present invention promotes greatly the polymerization reaction of benzoxazine and epoxy resin, reduces the curing temperature required for polymerization of benzoxazine and epoxy resin. The laminate prepared from the benzoxazine-containing resin composition, to which an acidic filler is added, has high anti-stripping stability, high glass transition temperature, low water absorption, high heat resistance, high bending strength and good processability, and can achieve low coefficient of thermal expansion.
H05K 3/02 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
87.
RESIN COMPOSITION, PREPREG USED FOR PRINTED CIRCUIT AND METAL-CLAD PRESSING PLATE
Provided in the present disclosure are a resin composition, a prepreg used for a printed circuit and a metal-clad pressing plate. The resin composition comprises: a resin; and a filler, wherein the resin is a silicon aryne resin. By means of using the resin composition, an obtained metal-clad pressure plate may have at least one from among a low dielectric loss factor, high heat resistance, a low coefficient of thermal expansion, halogen-free and phosphorus-free flame retardance, and like characteristics.
C08G 77/60 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon in which all the silicon atoms are connected by linkages other than oxygen atoms
88.
RESIN COMPOSITION, PREPREG SHEET FOR PRINTED CIRCUIT, AND METAL-CLAD LAMINATE
Provided are a resin composition, a prepreg sheet for a printed circuit, and a metal-clad laminate. The resin composition comprises: a silicon arylacetylene resin; and a hydroxyl-terminated polyphenylether resin. The metal-clad laminate prepared by using the resin composition can at least have one of the following properties: a low dielectric loss factor, a high heat resistance, a low thermal expansion coefficient, halogen-free and phosphorus-free flame retardance, etc.
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
C08G 77/60 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon in which all the silicon atoms are connected by linkages other than oxygen atoms
Provided are a phosphorous-containing silicon active ester and a preparation method therefor, a flame retardant resin composition, a prepreg and a metal foil-clad laminate. The phosphorous-containing silicon active ester of the present invention has a structure represented by formula (I), can act both as an active ester curing agent and as a halogen-free flame retardant, and can achieve a flame retardant effect of UL94 V-0 at a lower level of phosphorus content.
C08G 77/00 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon
C08L 83/00 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon onlyCompositions of derivatives of such polymers
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
C08K 5/5415 - Silicon-containing compounds containing oxygen containing at least one Si—O bond
90.
RESIN COMPOSITION, PREPREG, LAMINATE, AND METAL FOIL CLAD LAMINATE
The present invention relates to an epoxy modified acrylate resin composition, prepreg prepared using same, a laminate, and a metal foil clad laminate. The resin composition of the present invention comprises epoxy modified acrylate resin (A), an inorganic filler (C) surface-treated with a silane coupling agent (B) having a structure represented by formula (I), epoxy resin (D), cyanate ester resin (E), and bismaleimide resin (F). By modifying the inorganic filler (C) with the silane coupling agent (B) having the structure represented by formula (I), the dispersity of the inorganic filler (C) in the epoxy modified acrylate resin (A) is improved, and the interlayer adhesion force of a laminate prepared whereby and the binding force of the laminate to a metal foil are high. The prepreg, the laminate, and the metal foil clad laminate have good heat resistance, heat and humidity resistance, and low thermal expansion coefficient and modulus, and are suitable for high-end packaging.
C08K 9/06 - Ingredients treated with organic substances with silicon-containing compounds
B32B 15/082 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising vinyl resinsLayered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising acrylic resins
91.
RESIN COMPOSITION, PREPREG, LAMINATE, AND METAL FOIL-COATED LAMINATE
The present invention provides a resin composition. The prepreg, the laminate, and the metal foil-coated laminate prepared by using the resin composition have good heat resistance, heat and humidity resistance, and low coefficient of thermal expansion and modulus. The present resin composition contains epoxy resin (A), cyanate resin (B), bismaleimide resin (C), high-molecular-weight resin (D) having structures represented by formula (1), formula (2), formula (3) and formula (4) and a weight-average molecular weight of 100,000-200,000, and inorganic filler (E).
The present invention provides a thermosetting resin composition, a prepreg, a laminate, and a printed circuit board. The thermosetting resin composition comprises: a thermosetting resin, an inorganic filler, and a porous molybdenum compound. By using the porous molybdenum compound as a solid lubricant, the problems of dispersion and sedimentation of a molybdenum compound can be effectively solved, so that the molybdenum compound can be evenly distributed in a prepreg; the porous molybdenum compound has better thermal conductivity, and can better conduct heat during drilling, and the melted resin can be prevented from adhering to a drilling tool; in addition, hole cracks can also be reduced, and the quality of the wall of a drilled hole can be obviously improved.
C08K 7/24 - Expanded, porous or hollow particles inorganic
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
C08L 79/04 - Polycondensates having nitrogen-containing heterocyclic rings in the main chainPolyhydrazidesPolyamide acids or similar polyimide precursors
C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
B32B 27/04 - Layered products essentially comprising synthetic resin as impregnant, bonding, or embedding substance
93.
PHOSPHOROUS-CONTAINING SILICON FLAME RETARDANT AND PREPARATION METHOD THEREFOR, FLAME RETARDANT RESIN COMPOSITION, PREPREG AND METAL FOIL-CLAD LAMINATE
Provided are a reactive phosphorous-containing silicon flame retardant, a preparation method therefor, a flame retardant resin composition, a prepreg and a metal foil-clad laminate. The reactive phosphorous-containing silicon flame retardant of the present invention has a structure represented by formula (I), can act both as a curing agent for a thermosetting resin and as a halogen-free flame retardant, and can achieve a flame retardant effect of UL94 V-0 at a lower level of phosphorus content.
C08G 77/00 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon
C08L 83/00 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon onlyCompositions of derivatives of such polymers
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
C08K 5/5415 - Silicon-containing compounds containing oxygen containing at least one Si—O bond
94.
EPOXY RESIN COMPOSITION, PREPREG, LAMINATE AND PRINTED CIRCUIT BOARD
The present invention relates to an epoxy resin composition, and a prepreg, a laminate and a printed circuit board using the same. The epoxy resin composition of the present invention comprises an epoxy resin (A), a maleimide compound (B) having the structure as represented by formula (I), and an active ester compound (C). A prepreg, a laminate (comprising a metal foil-clad laminate) and a printed wiring board produced by using the epoxy resin composition have a low dielectric constant (Dk)/dielectric loss tangent value (Df), high glass transition temperature (Tg), low water absorption, low coefficient of thermal expansion (CTE), excellent heat resistance and heat and humidity resistance, and like features.
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
C08L 67/00 - Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chainCompositions of derivatives of such polymers
C08L 25/14 - Copolymers of styrene with unsaturated esters
C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
B32B 15/14 - Layered products essentially comprising metal next to a fibrous or filamentary layer
B32B 17/06 - Layered products essentially comprising sheet glass, or fibres of glass, slag or the like comprising glass as the main or only constituent of a layer, next to another layer of a specific substance
The present invention relates to a maleimide resin composition and a prepreg, a laminate and a printed circuit board using same. The maleimide resin composition of the present invention comprises: a maleimide compound (A) with a structure of formula (I); an imidazole compound (B) with a structure of general formula (Ⅱ); an epoxy resin (C); and a thermosetting resin (D).
Provided is a boron nitride agglomerate. The boron nitride agglomerate is of a multi-stage structure formed by arranging flaky hexagonal boron nitride primary particles in three-dimensional directions through adhesion of an inorganic binder. Further provided is a method for preparing the boron nitride agglomerate. The method comprises: mixing flaky hexagonal boron nitride primary particles with an inorganic binder, and controlling the mass of the inorganic binder to account for 0.02%-20% of the mass of the flaky hexagonal boron nitride primary particles, so as to obtain the boron nitride agglomerate. The boron nitride agglomerate provided can be added to thermosetting resin compositions, and resin sheets, resin composite metal foil, prepregs, laminates, metal foil-covered laminates, and printed wiring boards prepared using the same have higher boron nitride addition, high thermal conductivity, and high peel strength.
Provided are a thermosetting resin composition and a statically bendable copper-clad plate and printed circuit board prepared therefrom. The thermosetting resin composition of the present invention contains: a thermosetting resin, a curing agent, and a toughening material, wherein based on 100 parts by weight of the thermosetting resin, the curing agent is 1-50 parts by weight and the toughening material is 20-60 parts by weight, and the toughening material comprises at least one of a rubber, a phenoxy resin, polyvinyl butyral (PVB), nylon, nanoparticles and an olefinic block copolymer. The copper-clad plate prepared from the thermosetting resin composition of the present invention has an elastic bending modulus of more than 10 GPa, a peel strength of more than 1.0 N/mm at 60ºC-200ºC, and a maximum stress value of more than 400 MPa and a fracture strain value of more than 4% after removing the copper foil.
A printed circuit board and a manufacturing method therefor. The printed circuit board comprises a bend formable copper-clad plate as a substrate, the copper-clad plate comprising a copper foil and a thermosetting resin composition impregnated base cloth adhered to the copper foil, the bending modulus of elasticity of said copper-clad plate being greater than 10 GPa, the peel strength between 60-200°C being greater than 1.0 N/mm, and has, after the copper foil is removed, a maximum stress value of greater than 400 MPa and a fracture strain value of greater than 4%. The printed circuit board having a bent structure may be formed by means of one or more stamping process.
Disclosed are a copper cladding plate bent in a static state, and a method for manufacturing same and a bend shaping method. The copper cladding plate comprises copper foil and a thermosetting resin composite dipped substrate adhered on the copper foil, wherein the flexural modulus of elasticity, of the copper cladding plate is greater than 10 GPa, the peeling strength at 60°C-200°C is greater than 1.0 N/mm, and after removing the copper foil, the maximum stress value is greater than 400 MPa and the fracture strain value is greater than 4%.The copper cladding plate can be shaped by punching one or more times to form a copper cladding plate having a bent structure.
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
B32B 17/04 - Layered products essentially comprising sheet glass, or fibres of glass, slag or the like in the form of fibres or filaments bonded with or embedded in a plastic substance
100.
THERMOSETTING RESIN COMPOSITION AND PREPREG AND METAL FOIL-COVERED LAMINATE MADE USING SAME
A thermosetting resin composition and a prepreg and a metal foil-covered laminate made using same, the thermosetting resin composition comprising component (A): a solvent-soluble polyfunctional vinyl aromatic copolymer, the copolymer being a polyfunctional vinyl aromatic copolymer having a structural unit derived from monomers comprising divinyl aromatic compound (a) and ethyl vinyl aromatic compound (b); and component (B): a vinyl-containing organic silicone resin. The prepreg and metal foil-covered laminate made from the thermosetting resin composition have good toughness, and maintain a high glass transition temperature, a low water absorption, dielectric properties and humidity resistance, being suitable for the field of high-frequency and high-speed printed circuit boards and the processing of multilayer printed circuit boards.
C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
B32B 27/04 - Layered products essentially comprising synthetic resin as impregnant, bonding, or embedding substance
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
