Abstract

In one example, a method of image processing includes acquiring a plurality of input image frames, detecting at least one object of interest in individual image frames of the plurality of image frames, for the individual image frames, producing a respective bounding box corresponding to the at least one object of interest, the bounding box describing coordinates of a boundary of the object of interest within a respective individual image frame, temporally averaging corresponding pixel values of pixels within the bounding box over the plurality of image frames to produce a plurality of averaged pixel values, and producing an output image in which pixels within an area of the output image described by coordinates of the bounding box are replaced with the averaged pixel values.

IPC Classes  ?

• G06T 7/246 - Analysis of motion using feature-based methods, e.g. the tracking of corners or segments
• G06T 5/00 - Image enhancement or restoration
• G06T 5/20 - Image enhancement or restoration using local operators
• G06T 7/60 - Analysis of geometric attributes
• G06V 10/82 - Arrangements for image or video recognition or understanding using pattern recognition or machine learning using neural networks

Abstract

An adaptive filter protocol stored on a non-transitory computer readable medium that is operatively in communication with a processor of a platform. The adaptive filter protocol includes a first processing loop that is operatively in communication with at least one receiving device of the platform for receiving at least one input signal. The adaptive filter protocol also includes a second processing loop that is operatively in communication with the first processing loop and has a deterministic gradient descent optimization logic and an interpolation logic. When the at least one receiving device receives the at least one input signal, the adaptive filter protocol enables the processor to generate a refined match filter parameters that substantially correlates with the initial parameters of the at least one input signal upon completing a plurality of refining cycles of the second processing loop.

IPC Classes  ?

• H04L 27/34 - Amplitude- and phase-modulated carrier systems, e.g. quadrature-amplitude modulated carrier systems
• G06N 3/084 - Backpropagation, e.g. using gradient descent
• H04L 27/148 - Demodulator circuitsReceiver circuits with demodulation using spectral properties of the received signal, e.g. by using frequency selective- or frequency sensitive elements using filters, including PLL-type filters

Abstract

A communications circuit includes a first circuit block and a second circuit block. The first circuit block includes a first splitter, a first signal path coupled to a first output of the first splitter, a second signal path coupled to a second output of the first splitter, and a first switch configured to couple the second signal path to a third signal path or to couple a fourth signal path to the third signal path. The second circuit block includes a second splitter, a fifth signal path coupled to a first output of the second splitter, a sixth signal path coupled to a second output of the second splitter, and a second switch configured to couple the sixth signal path to the third signal path or to couple a seventh signal path to the third signal path. The third signal path extends between the first and second circuit blocks.

IPC Classes  ?

• H04B 1/403 - Circuits using the same oscillator for generating both the transmitter frequency and the receiver local oscillator frequency
• H03F 3/195 - High-frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only in integrated circuits

Abstract

A communications circuit includes a first circuit block and a second circuit block. The first circuit block includes a first splitter, a first signal path coupled to a first output of the first splitter, a second signal path coupled to a second output of the first splitter, and a first switch configured to couple the second signal path to a third signal path or to couple a fourth signal path to the third signal path. The second circuit block includes a second splitter, a fifth signal path coupled to a first output of the second splitter, a sixth signal path coupled to a second output of the second splitter, and a second switch configured to couple the sixth signal path to the third signal path or to couple a seventh signal path to the third signal path. The third signal path extends between the first and second circuit blocks.

IPC Classes  ?

• H04B 1/3805 - Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving with built-in auxiliary receivers
• H04B 1/04 - Circuits

Abstract

A computer program product and corresponding method for targeting one or more points in a three dimensional (3D) model is provided. The computer program product including least one non-transitory computer readable storage medium in operative communication with a computer processing unit (CPU), the storage medium having instructions stored thereon that, when executed by the CPU, implement a process to register the 3D model with a stereoscopic image pair. The steps performed include inputting a first image and a second image that define a stereoscopic image pair into an object targeting program, wherein an object is shown in the first image and the second image, inputting a three dimensional (3D) model of the object into the object targeting program, registering the 3D model to the stereoscopic image pair, and targeting a point associated with or near the object based on the 3D model having been registered to the stereoscopic image pair.

IPC Classes  ?

• G06T 7/33 - Determination of transform parameters for the alignment of images, i.e. image registration using feature-based methods
• G06T 7/60 - Analysis of geometric attributes
• G06T 7/73 - Determining position or orientation of objects or cameras using feature-based methods
• G06V 20/64 - Three-dimensional objects

Abstract

An ultra-wideband radio frequency (RF) apparatus for combining and/or dividing RF signals. RF apparatus includes a circuit board, a communication cable that operably engages with the circuit board, at least two transmission lines that are formed on the circuit board and operably engages with the communication cable, and at least two connectors that operably engages with the at least two transmission lines. The RF apparatus is operable in a first configuration and a second configuration. When the RF apparatus is provided in the first configuration, the RF apparatus is operable to divide a first RF signal into at least two RF signals. When the RF apparatus is provided in the second configuration, the RF apparatus is operable to combine the at least two RF signals into a second RF signal. The RF apparatus is capable of achieving a low insertion loss less than 1 dB over a bandwidth greater than 20:1.

IPC Classes  ?

• H04B 1/10 - Means associated with receiver for limiting or suppressing noise or interference
• H04B 1/04 - Circuits

Abstract

An antenna assembly includes a first flexible layer including a conductive ground plane on a first layer of dielectric material, and a second flexible layer including a first array of conductive patches on a second layer of dielectric material. The antenna assembly further includes a second array of conductive patches on a third layer of dielectric material. The first, second, and third flexible layers are rollable or foldable, to provide a stowed position for the antenna assembly and a deployed position for the antenna assembly. In an example, the first array of conductive patches includes at least a first patch and a second patch, and the second array of conductive patches includes at least a third patch and a fourth patch. In the deployed position, the first patch is above the third patch and the ground plane, and the second patch is above the fourth patch and the ground plane.

IPC Classes  ?

• H01Q 21/06 - Arrays of individually energised antenna units similarly polarised and spaced apart
• H01Q 9/04 - Resonant antennas
• H01Q 1/08 - Means for collapsing antennas or parts thereof
• H01Q 1/12 - SupportsMounting means
• H01Q 21/065 -
• H01Q 1/087 -
• H01Q 21/0006 -
• H01Q 9/0457 -

Abstract

An antenna assembly includes a first flexible layer including a conductive ground plane on a first layer of dielectric material, and a second flexible layer including a first array of conductive patches on a second layer of dielectric material. The antenna assembly further includes a second array of conductive patches on a third layer of dielectric material. The first, second, and third flexible layers are rollable or foldable, to provide a stowed position for the antenna assembly and a deployed position for the antenna assembly. In an example, the first array of conductive patches includes at least a first patch and a second patch, and the second array of conductive patches includes at least a third patch and a fourth patch. In the deployed position, the first patch is above the third patch and the ground plane, and the second patch is above the fourth patch and the ground plane.

IPC Classes  ?

• H01Q 21/06 - Arrays of individually energised antenna units similarly polarised and spaced apart
• H01Q 1/08 - Means for collapsing antennas or parts thereof
• H01Q 9/04 - Resonant antennas

Abstract

A method of manufacturing an antenna assembly includes additively manufacturing an element that is monolithic and that includes (i) a ground plane, (ii) a patch above the ground plane, and (iii) a structure having a lower end in contact with the ground plane and an upper end in contact with the patch. The method further includes applying a dielectric material between the ground plane and the patch. In an example, the dielectric material is dielectric foam. The method further includes removing a section of the ground plane around the lower end of the structure, such that the structure extends through the ground plane and not in contact with the ground plane. The method further includes connecting an inner conductor of a coaxial cable connector to the lower end of the structure, and an outer portion of the coaxial cable connector to the ground plane.

IPC Classes  ?

• H01Q 9/04 - Resonant antennas
• H01Q 1/22 - SupportsMounting means by structural association with other equipment or articles
• H01Q 1/36 - Structural form of radiating elements, e.g. cone, spiral, umbrella

Abstract

An attenuator circuit includes a differential input having first and second inputs, and a differential output having first and second outputs. The attenuator circuit further includes a first transistor coupled between the first input and the first output, a second transistor coupled between the second input and the second output, a third transistor coupled between the first input and the second output, and a fourth transistor coupled between the second input and the first output. During a pass-through state, the first and second transistors are enabled, and the third and fourth transistors may be disabled. During an attenuation state, the first, second, third, and fourth transistors are all disabled. An attenuator network (e.g., T or Pi network) may have its differential input terminals coupled to the first and second inputs of the differential input, and its differential output terminals coupled to the first and second outputs of the differential output.

IPC Classes  ?

• H03H 7/25 - Frequency-independent attenuators comprising an element controlled by an electric or magnetic variable
• H03H 11/24 - Frequency-independent attenuators

Abstract

An antenna assembly includes a ground plane including conductive material, and a dielectric material above the ground plane. A patch antenna is on the dielectric material. In an example, a plurality of features extends from an upper surface or a lower surface of the dielectric material and within the dielectric material, wherein the plurality of features comprises voids filled with gas or are vacuum. Additionally, or alternatively, the dielectric material is doped with a dopant. In an example, the antenna assembly further includes a first aperture and a second aperture on the ground plane and below the patch antenna, and another dielectric material below the first and second apertures. In some such cases, a first feed line is below the first aperture, and a second feed line is below the second aperture.

IPC Classes  ?

• H01Q 9/04 - Resonant antennas
• H01Q 21/06 - Arrays of individually energised antenna units similarly polarised and spaced apart
• H01Q 25/00 - Antennas or antenna systems providing at least two radiating patterns

Abstract

A method of manufacturing an antenna assembly includes additively manufacturing an element that is monolithic and that includes (i) a ground plane, (ii) a patch above the ground plane, and (iii) a structure having a lower end in contact with the ground plane and an upper end in contact with the patch. The method further includes applying a dielectric material between the ground plane and the patch. In an example, the dielectric material is dielectric foam. The method further includes removing a section of the ground plane around the lower end of the structure, such that the structure extends through the ground plane and not in contact with the ground plane. The method further includes connecting an inner conductor of a coaxial cable connector to the lower end of the structure, and an outer portion of the coaxial cable connector to the ground plane.

IPC Classes  ?

• H01Q 9/04 - Resonant antennas
• B22F 10/40 - Structures for supporting workpieces or articles during manufacture and removed afterwards
• B29C 64/10 - Processes of additive manufacturing
• H01Q 21/06 - Arrays of individually energised antenna units similarly polarised and spaced apart

Abstract

An antenna assembly includes a ground plane including conductive material, and a dielectric material above the ground plane. A patch antenna is on the dielectric material. In an example, a plurality of features extends from an upper surface or a lower surface of the dielectric material and within the dielectric material, wherein the plurality of features comprises voids filled with gas or are vacuum. Additionally, or alternatively, the dielectric material is doped with a dopant. In an example, the antenna assembly further includes a first aperture and a second aperture on the ground plane and below the patch antenna, and another dielectric material below the first and second apertures. In some such cases, a first feed line is below the first aperture, and a second feed line is below the second aperture.

IPC Classes  ?

• H01Q 9/04 - Resonant antennas

Abstract

The present disclosure relates generally to a method of use for a field flattening interference filter. More particularly, the present disclosure relates a field flattening bandpass interference filter with the cut-on edge of the pass band at the system wavelength at a normal angle of incidence. Further discussed is a method to extend the field flattening design to work at multiple system wavelengths through the optimized design of a multi-band interference filter.

IPC Classes  ?

• G02B 5/28 - Interference filters
• G02B 5/20 - Filters

Abstract

Techniques to passively suppress or otherwise reduce stimulated Brillouin scattering (SBS) in a pumped fiber laser system. The system can be co-pumped with a tandem pumping technique, and counter-pumped with the direct diode pumping method. In an example, a pumped fiber laser system includes a fiber, a tandem pump, and a direct diode pump. The fiber has a core, an inner cladding around the core, and an outer cladding around the inner cladding. The tandem pump co-pumps light of a first wavelength in the inner cladding from a first end of the fiber, and the direct diode pump counter-pumps light of a second wavelength in the outer cladding from a second end of the fiber. A longitudinal temperature gradient can form along the fiber laser in response to this hybrid-pumping, which can combine both tandem and direct diode pumping.

IPC Classes  ?

• H01S 3/067 - Fibre lasers
• H01S 3/094 - Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light
• H01S 3/0941 - Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light of a semiconductor laser, e.g. of a laser diode
• H01S 3/16 - Solid materials
• H01S 3/23 - Arrangement of two or more lasers not provided for in groups , e.g. tandem arrangement of separate active media

Abstract

Integrated capacitor structures are described. In an example, an interconnect structure includes a first layer of conductive material and a second layer of conductive material. The first layer includes a first horizontal portion having a first opening and extending along a first horizontal plane, and a first vertical portion. The second layer includes a second horizontal portion having a second opening and extending along a second horizontal plane, and a second vertical portion. The interconnect structure also includes a dielectric extending along a third horizontal plane between the first and second horizontal portions, and having one or more openings. The first vertical component extends upward from the first horizontal portion, through one opening in the dielectric and the second opening of second layer, and the second vertical component extends downward from the second horizontal portion, through another opening in the dielectric and the first opening of first layer.

Abstract

Techniques are provided for jammer detection. A methodology implementing the techniques according to an embodiment includes steering a beam in a specified direction to generate a power measurement, the specified direction selected from a plurality of directions, such that the method comprises scanning through the plurality of directions. The method also includes adaptively steering a null in the specified direction and measuring a gain of the received signal in the null direction. The method further includes calculating a difference between the power measurement and the measured gain and generating a difference-based detection that the received signal is associated with a jammer at the specified direction. The difference-based detection is based on a comparison of the power difference to a power difference threshold value. The power difference threshold value is based on a desired probability of false alarm and probability of detection, and/or desired angular resolution.

IPC Classes  ?

• H04K 3/00 - Jamming of communicationCounter-measures
• H04N 5/232 - Devices for controlling television cameras, e.g. remote control
• G01S 3/786 - Systems for determining direction or deviation from predetermined direction using adjustment of orientation of directivity characteristics of a detector or detector system to give a desired condition of signal derived from that detector or detector system the desired condition being maintained automatically
• G01S 19/21 - Interference related issues
• G01S 19/23 - Testing, monitoring, correcting or calibrating of a receiver element

Abstract

A feed forward guidance kit for a ballistic device that includes at least one optical imaging sensor, a processor that is operatively in communication with the at least one optical imaging sensor, and a feed forward guidance protocol that is stored on a computer readable medium and that is operatively in communication with the processor. When the at least one optical imaging sensor initially intercepts an aircraft at an initial location during combat, the feed forward guidance protocol instructs the processor to proactively calculate an anticipated second position of the aircraft as an orientation of the aircraft changes from an initial orientation to a translated orientation.

Abstract

Techniques are provided for jammer detection. A methodology implementing the techniques according to an embodiment includes steering a beam in a specified direction to generate a power measurement, the specified direction selected from a plurality of directions, such that the method comprises scanning through the plurality of directions. The method also includes adaptively steering a null in the specified direction and measuring a gain of the received signal in the null direction. The method further includes calculating a difference between the power measurement and the measured gain and generating a difference-based detection that the received signal is associated with a jammer at the specified direction. The difference-based detection is based on a comparison of the power difference to a power difference threshold value. The power difference threshold value is based on a desired probability of false alarm and probability of detection, and/or desired angular resolution.

IPC Classes  ?

• H04K 3/00 - Jamming of communicationCounter-measures
• H01Q 3/26 - Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elementsArrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the distribution of energy across a radiating aperture
• H04B 7/0426 - Power distribution

Abstract

Hybrid MB/ML techniques for automated printed circuit board (PCB) defect detection. In one example, a PCB inspection system implements a hybrid solution using model based (MB) and machine learning (ML) technologies to detect possible defects in a PCB via an automated image capture device and processing methodology. The processing methodology fuses features from MB and ML at the latent representation. An autoencoder can be used to learn the fused data by training a neural network to produce a reconstructed image that can be compared to an original image to generate a reconstruction error value. The system produces an output indicating detection of a defect in one or more features of interest based on the reconstruction error value transgressing a threshold value.

IPC Classes  ?

• G06T 7/00 - Image analysis
• G06V 10/44 - Local feature extraction by analysis of parts of the pattern, e.g. by detecting edges, contours, loops, corners, strokes or intersectionsConnectivity analysis, e.g. of connected components
• G06V 10/774 - Generating sets of training patternsBootstrap methods, e.g. bagging or boosting
• G06V 10/82 - Arrangements for image or video recognition or understanding using pattern recognition or machine learning using neural networks

Abstract

A collet for multiple wire elements is disclosed. In an example, the collet has a body made of a polymeric material and extends along a central axis from a first end to a second end. The body defines a first passageway extending axially through the body, the first passageway in communication with the environment via a first insertion opening extending along an entire length of the first passageway. The body defines a second passageway extending axially through the body and in communication with the environment along an entire length of the second passageway via a second insertion opening, the second passageway spaced circumferentially from the first passageway. When installed, the collet frictionally engages wire elements when a first wire element is seated in the first passageway and a second wire element is seated in the second passageway.

IPC Classes  ?

• H02G 3/04 - Protective tubing or conduits, e.g. cable ladders or cable troughs
• H02G 1/06 - Methods or apparatus specially adapted for installing, maintaining, repairing, or dismantling electric cables or lines for laying cables, e.g. laying apparatus on vehicle

Abstract

Various countermeasure expendables and methods of using said countermeasure expendables are provided herein. A countermeasure expendable comprising a canister. The countermeasure expendable includes at least one countermeasure payload operably engaged inside the canister, the at least one countermeasure payload having a volume of countermeasure material. The countermeasure expendable includes a squib operably engaged inside of the canister, wherein the squib is configured to propel the at least one countermeasure payload outside of the canister. The countermeasure expendable includes at least one time delaying assembly operably engaged with the at least one countermeasure payload, wherein the time delaying assembly is configured to dispense the volume of countermeasure material from the at least one countermeasure payload at a predetermined time interval.

IPC Classes  ?

• F42B 12/70 - Projectiles, missiles or mines characterised by the warhead, the intended effect, or the material characterised by the warhead or the intended effect for dispensing materialsProjectiles, missiles or mines characterised by the warhead, the intended effect, or the material characterised by the warhead or the intended effect for producing chemical or physical reactionProjectiles, missiles or mines characterised by the warhead, the intended effect, or the material characterised by the warhead or the intended effect for signalling for dispensing discrete solid bodies for dispensing radar chaff or infrared material
• F42B 5/15 - Cartridges, i.e. cases with propellant charge and missile for dispensing gases, vapours, powders, particles or chemically-reactive substances for creating a screening or decoy effect, e.g. using radar chaff or infrared material

Abstract

A panoramic Mid-Wavelength Infrared (MWIR) lens has a plurality of optical elements, wherein each optical element from the plurality of elements is formed from a material that transmits in at least the MWIR band from 3 μm to 5 μm. The plurality of optical element are arranged in a manner that provides a 360 degree azimuth angle and an elevation angle that is within +/−20° from a 90° horizon. The panoramic MWIR lens is configured to be connected to a cooled Dewar, wherein the Dewar includes a cold shield and an image plane to detect light in the MWIR band transmitted through the plurality of optical elements.

IPC Classes  ?

• G02B 13/06 - Panoramic objectivesSo-called "sky lenses"
• G02B 7/02 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses
• G02B 9/64 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having more than six components
• G02B 13/14 - Optical objectives specially designed for the purposes specified below for use with infrared or ultraviolet radiation

Abstract

A panoramic Mid-Wavelength Infrared (MWIR) lens has a plurality of optical elements, wherein each optical element from the plurality of elements is formed from a material that transmits in at least the MWIR band from 3μm to 5μm. The plurality of optical element are arranged in a manner that provides a 360 degree azimuth angle and an elevation angle that is within +/- 20° from a 90° horizon. The panoramic MWIR lens is configured to be connected to a cooled Dewar, wherein the Dewar includes a cold shield and an image plane to detect light in the MWIR band transmitted through the plurality of optical elements.

IPC Classes  ?

• G02B 13/06 - Panoramic objectivesSo-called "sky lenses"
• G02B 9/64 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having more than six components
• G02B 13/14 - Optical objectives specially designed for the purposes specified below for use with infrared or ultraviolet radiation
• G02B 13/18 - Optical objectives specially designed for the purposes specified below with lenses having one or more non-spherical faces, e.g. for reducing geometrical aberration

Abstract

An integrated circuit structure includes (i) a first layer including a first metal, (ii) a second layer above and in contact with the first layer, the second layer including a resistive material, and (iii) a third layer above and in contact with the second layer, the third layer including a second metal. In an example, the resistive material is different from one or both the first metal and the second metal. An interconnect component is above and in contact with the second layer. In an example, the interconnect component is a solder bump or a solder ball. In an example, a resistivity of the resistive material of the second layer is at least 20%, or at least 50% greater than a resistivity of each of the first and third layers. In an example, the resistive material includes a third metal different from the first and second metals and/or a metalloid.

IPC Classes  ?

• H01L 23/00 - Details of semiconductor or other solid state devices

Abstract

An integrated circuit structure includes (i) a first layer including a first metal, (ii) a second layer above and in contact with the first layer, the second layer including a resistive material, and (iii) a third layer above and in contact with the second layer, the third layer including a second metal. In an example, the resistive material is different from one or both the first metal and the second metal. An interconnect component is above and in contact with the second layer. In an example, the interconnect component is a solder bump or a solder ball. In an example, a resistivity of the resistive material of the second layer is at least 20%, or at least 50% greater than a resistivity of each of the first and third layers. In an example, the resistive material includes one or more of (i) a third metal different from the first and second metals, (ii) a metalloid, and (iii) the third metal and at least one of oxygen and nitrogen.

IPC Classes  ?

• H01L 23/64 - Impedance arrangements
• H01L 23/485 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts

Abstract

A microelectronics device structure includes a device having (i) a lower surface, (ii) an upper surface opposite the lower surface, and (iii) a side surface extending between the lower surface and the upper surface. The integrated circuit structure further includes a conductive line having (i) a first section on the upper surface, (ii) a second section on the side surface, and (iii) a third section on the lower surface. In an example, the first section and the second section of the conductive line is a monolithic conductive structure, with no seam or interface between the first section and the second section. Additionally or alternatively, in an example, the second section and the third section of the conductive line is a monolithic conductive structure, with no seam or interface between the second section and the third section.

IPC Classes  ?

• H01L 23/498 - Leads on insulating substrates
• H01L 23/49 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of soldered or bonded constructions wire-like
• H01L 23/492 - Bases or plates
• H01L 23/495 - Lead-frames
• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Abstract

A method includes forming a plurality of islands of first material on a plurality of first sections of a layer. A plurality of second sections of the layer are not covered by the first material. The method further includes depositing a second material on (i) the islands of first material and (ii) the second sections of the layer that are not covered by the islands of first material. The method further includes evaporating and/or sublimating the islands of first material and removing remnants of the second material that were on the islands of the first material. In an example, the second material remains on the second sections of the layer, to thereby form a pattern of the second material on the layer. In an example, the first material is a monomer, and the second material is a conductor or a dielectric or a semiconductor.

IPC Classes  ?

• H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or
• H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof

Abstract

A microelectronics device structure includes a device having (i) a lower surface, (ii) an upper surface opposite the lower surface, and (iii) a side surface extending between the lower surface and the upper surface. The integrated circuit structure further includes a conductive line having (i) a first section on the upper surface, (ii) a second section on the side surface, and (iii) a third section on the lower surface. In an example, the first section and the second section of the conductive line is a monolithic conductive structure, with no seam or interface between the first section and the second section. Additionally or alternatively, in an example, the second section and the third section of the conductive line is a monolithic conductive structure, with no seam or interface between the second section and the third section.

IPC Classes  ?

• H01L 23/00 - Details of semiconductor or other solid state devices

Abstract

A method of enhanced processing used to discriminate between ADS-B messages with a duplicate announced address comprising: receiving ADS-B messages that comprise information for display by a display of traffic information from at least two targets on a receiver; identifying the ADS-B messages having the duplicate announced address with one of the at least two targets using at least one discriminator by assigning a weighting factor to the at least one discriminator and, where the integration of the at least one discriminator and weighting factor exceeds a predetermined threshold value, considering the ADS-B messages that were subject to the at least one discriminator as being discriminated messages associated with one of the at least two targets; and displaying information provided by the discriminated messages on a display of traffic information as if the discriminated messages had been initially associated with only one of the at least two targets.

IPC Classes  ?

• G08G 5/00 - Traffic control systems for aircraft

Abstract

A method for discriminating between spoofed and valid ADS-B tracks includes applying a plurality of spoofing detection tests to an ADS-B waveform, applying weighting factors to the resulting test scores, and combining the weighted scores to obtain a confidence level indicating whether the ADS-B track is valid or spoofed. The detection tests can include power level validation, Doppler offset, ADS-B rules-based analysis, multi-band detection, track origination detection, and antenna diversity. The selection of applied detection tests and/or weighting factors can be adjusted and/or selected from corresponding libraries, according to operating conditions. Tracks can be displayed together with confidence level indications, and/or excluded from display if their confidence levels are below an adjustable threshold. Weighting factors can be chosen and/or updated by a machine learning model according to success in detecting simulated and/or actual spoofed tracks. A spoofing attack can be declared according to the number of spoofed tracks detected.

IPC Classes  ?

• H04W 12/122 - Counter-measures against attacksProtection against rogue devices
• H04L 9/40 - Network security protocols

Abstract

A method includes forming a plurality of islands of first material on a plurality of first sections of a layer. A plurality of second sections of the layer are not covered by the first material. The method further includes depositing a second material on (i) the islands of first material and (ii) the second sections of the layer that are not covered by the islands of first material. The method further includes evaporating and/or sublimating the islands of first material and removing remnants of the second material that were on the islands of the first material. In an example, the second material remains on the second sections of the layer, to thereby form a pattern of the second material on the layer. In an example, the first material is a monomer, and the second material is a conductor or a dielectric or a semiconductor.

IPC Classes  ?

• H01L 21/32 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to form insulating layers thereon, e.g. for masking or by using photolithographic techniquesAfter-treatment of these layersSelection of materials for these layers using masks
• H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device
• H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or

Abstract

A signal acquisition and tracking device includes an input configured to receive a global navigation satellite system (GNSS) signal, a software-based processor configured to execute software instructions to acquire the GNSS signal via the input and to generate, based on the acquired signal, one or more signal tracking parameters, and a hardware logic circuit operatively coupled to the processor. The logic circuit is configured to track the GNSS signal independently of the processor using the one or more signal tracking parameters generated by the processor. In some examples, the processor is configured to pull in and center the GNSS signal in time and frequency, and the logic circuit is further configured to track the pulled in and centered GNSS signal independently of the processor. In some examples, the processor acquires the signal and then hands-off control to the logic circuit for subsequent tracking of the signal.

IPC Classes  ?

• G01S 19/30 - Acquisition or tracking of signals transmitted by the system code related
• G01S 19/37 - Hardware or software details of the signal processing chain

Abstract

A multi-bit, asynchronous e-fuse macro, the macro comprising: an input output enable, a power on reset, a write address, an input write enable, a ground clamp enable, and a write clock; a plurality of e-fuse bits; a supply voltage configured to allow programming at least one of the e-fuse bits; at least one fuse output; and self-timing and control circuitry configured to perform signaling, wherein each of the inputs is in electrical communication with the e-fuse macro.

IPC Classes  ?

• G11C 11/56 - Digital stores characterised by the use of particular electric or magnetic storage elementsStorage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
• G11C 17/16 - Read-only memories programmable only onceSemi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM using electrically-fusible links
• G11C 17/18 - Auxiliary circuits, e.g. for writing into memory

Abstract

A low profile, broadband radiator operates as a dielectric rod antenna (DRA) but is conformally mounted to a conducting sheet along its axis of symmetry. The new device exploits the imaging theory of electromagnetics to split the DRA in half while maintaining its full-height TEM feed, HE11 waveguide, and radiation taper characteristics. The disclosed device is attractive for applications requiring directed energy on or near the axis of the antenna, i.e. ‘end-fire’, and for high shock and velocity environments. Bandwidth extension is realized by adding one or more cores of higher dielectric material and by modifying the feed and mode formation regions. A second polarization is generated by configuring the feed for odd-mode transmission and creating a flared notch radiator within a metallized split launcher.

IPC Classes  ?

• H01Q 9/04 - Resonant antennas
• H01Q 13/08 - Radiating ends of two-conductor microwave transmission lines, e.g. of coaxial lines, of microstrip lines

Abstract

A peripheral sharing device includes an optical switch, a first signal interface, and a plurality of second signal interfaces. The first signal interface is coupled to the optical switch via a first optical fiber cable. The first signal interface is configured to be coupled to at least one peripheral device, such as a keyboard, pointing device, or video display. A first one of the second signal interfaces is coupled to the optical switch via a second optical fiber cable. A second one of the second signal interfaces is coupled to the optical switch via a third optical fiber cable. The first one of the second signal interfaces is configured to be coupled to a first computing device, and the second one of the second signal interfaces is configured to be coupled to a second computing device.

IPC Classes  ?

• G06F 3/14 - Digital output to display device
• G06F 3/023 - Arrangements for converting discrete items of information into a coded form, e.g. arrangements for interpreting keyboard generated codes as alphanumeric codes, operand codes or instruction codes
• H04Q 11/00 - Selecting arrangements for multiplex systems

Abstract

A navigation device includes a display, an electromagnetic radiation (EMR) receiver, and one or more processors operatively coupled to the display and the EMR receiver. The one or more processors are configured to cause the display, in a first mode of operation, to graphically render a navigation view. The navigation view includes (i) a first informational element relating to a geographic location of the navigation device and (ii) one or both of a compass rose and a geographic map. The one or more processors are further configured to cause the display, in a second mode of operation and responsive to receiving an EMR signal via the EMR receiver, to render an informational view including a second informational element, where the informational view at least partially obscures the navigation view.

IPC Classes  ?

• G06F 3/14 - Digital output to display device
• G01C 21/36 - Input/output arrangements for on-board computers
• G06F 3/02 - Input arrangements using manually operated switches, e.g. using keyboards or dials
• G06T 11/60 - Editing figures and textCombining figures or text

Abstract

A system and method are disclosed for a low F-number precision variable-focus telescope that includes a telescope housing containing an optical system. There is a first temperature sensing device to detect a temperature of the telescope housing, a second temperature sensing device to detect an ambient temperature around the telescope housing, and a pressure sensing device to detect ambient pressure around the telescope housing. A controller is in operative communication with the first temperature-sensing device, the second temperature sensing device, and the pressure sensing device. The control regulates the heater to maintain the telescope at a desired temperature to achieve diffraction limited performance in response to signals from the first temperature-sensing device, the second temperature sensing device, and the pressure sensing device.

IPC Classes  ?

• G02B 23/16 - HousingsCapsMountingsSupports, e.g. with counterweight
• G02B 7/02 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses
• G02B 27/62 - Optical apparatus specially adapted for adjusting optical elements during the assembly of optical systems
• G05D 23/19 - Control of temperature characterised by the use of electric means

Abstract

A system and method are disclosed for a low F-number precision variable-focus telescope that includes a telescope housing containing an optical system. There is a first temperature sensing device to detect a temperature of the telescope housing, a second temperature sensing device to detect an ambient temperature around the telescope housing, and a pressure sensing device to detect ambient pressure around the telescope housing. A controller is in operative communication with the first temperature-sensing device, the second temperature sensing device, and the pressure sensing device. The control regulates the heater to maintain the telescope at a desired temperature to achieve diffraction limited performance in response to signals from the first temperature-sensing device, the second temperature sensing device, and the pressure sensing device.

IPC Classes  ?

• G02B 23/16 - HousingsCapsMountingsSupports, e.g. with counterweight
• G02B 7/04 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
• G05D 23/275 - Control of temperature characterised by the use of electric means with sensing element expanding, contracting, or fusing in response to changes of temperature
• H04N 23/52 - Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements

Abstract

A computer firmware product improves computer processing efficiency by implementing a process to replicate at least one field index in multiple register destinations. A translation table contains data in a plurality of fields and a plurality of register destination addresses for a firmware event. The firmware product pushes data associated with one field to at least two different register destination addresses. The firmware product recompiles the translation table with the updated data pushed from one field to the two different register destination addresses. Then, the firmware product performs a function based on the translation table with the updated data pushed from the one field to the two different register destination addresses by solely changing the translation table.

IPC Classes  ?

• G06F 9/54 - Interprogram communication
• G06F 8/41 - Compilation
• G06F 16/27 - Replication, distribution or synchronisation of data between databases or within a distributed database systemDistributed database system architectures therefor

Abstract

A liquid-cooled printed circuit board chassis, such as a Eurocard chassis, is manufactured without brazing by 3D printing a plurality of components, smoothing and completing the components by subtractive manufacture, and then aligning and assembling the final chassis, all without application of heat. Horizontal cooling channels 3D printed within the chassis components are in thermal contact with board slots, and are divided into subchannels by closely spaced internal walls that function as thermal baffles. The baffles are tilted at oblique angles to increase their cooling efficiency, and to enable AM manufacture without temporary support structures. Elastomer seals between components can connect the cooling channels to vertical connecting channels. EMI seals can be formed between the components by EMI gaskets. The components can be aligned by alignment pins, and joined together by bolts, screws, and/or adhesives. An intermediate horizontal extension can be included to accommodate shorter printed circuit boards.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• H05K 5/00 - Casings, cabinets or drawers for electric apparatus
• H05K 7/18 - Construction of rack or frame
• B33Y 10/00 - Processes of additive manufacturing
• B33Y 40/20 - Post-treatment, e.g. curing, coating or polishing
• B33Y 80/00 - Products made by additive manufacturing

Abstract

An interposer that enables implementation of a flip-chip die in a wirebonded chip-and-wire circuit assembly includes an insulating substrate having a solder bump pad array on its upper surface that is compatible with the solder bump array of a flip-chip die. Wirebond pads provided along upper edges of the substrate are interconnected to at least some of the solder bump pads. Bonding the interposer to the circuit assembly housing floor, or through an opening to an underlying motherboard, places the wirebond pads proximate attachment points of adjacent wirebond dies, enabling wirebonding therebetween. Attachment pads on the interposer lower surface, in combination with interconnecting traces and vias, can enable connection directly through the housing opening to the underlying motherboard. Support components can be included within an edge cavity created beneath an overhang of a multi-layer substrate. A heat absorbing plate can be attached to the top of the flip-chip die.

IPC Classes  ?

• H01L 23/498 - Leads on insulating substrates
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
• H01L 23/12 - Mountings, e.g. non-detachable insulating substrates
• H01L 23/367 - Cooling facilitated by shape of device
• H01L 23/495 - Lead-frames
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components

Abstract

A chassis configured to hold a cards of at least two form factors comprising: slots disposed in an inner portion the chassis, wherein the slots are aligned with one another and configured to act as card guides; a mid-height structure disposed adjacent a side wall of the chassis, the mid-height structure comprising a second plurality of slots and a third plurality of slots disposed on top and bottom surfaces of the mid-height structure that are substantially parallel to top and bottom walls of the chassis; and a plurality of cooling channels disposed within the walls of the chassis as well as within the mid-height structure, wherein the second and third plurality of slots are configured to align with at least a subset of the plurality of slots disposed in the top and bottom chassis walls and to act as card guides.

IPC Classes  ?

• H05K 7/00 - Constructional details common to different types of electric apparatus
• H05K 7/14 - Mounting supporting structure in casing or on frame or rack
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

A liquid-cooled printed circuit board chassis, such as a Eurocard chassis, is manufactured without brazing by 3D printing a plurality of components, smoothing and completing the components by subtractive manufacture, and then aligning and assembling the final chassis, all without application of heat. Horizontal cooling channels 3D printed within the chassis components are in thermal contact with board slots, and are divided into subchannels by closely spaced internal walls that function as thermal baffles. The baffles are tilted at oblique angles to increase their cooling efficiency, and to enable AM manufacture without temporary support structures. Elastomer seals between components can connect the cooling channels to vertical connecting channels. EMI seals can be formed between the components by EMI gaskets. The components can be aligned by alignment pins, and joined together by bolts, screws, and/or adhesives. An intermediate horizontal extension can be included to accommodate shorter printed circuit boards.

IPC Classes  ?

• H05K 7/14 - Mounting supporting structure in casing or on frame or rack
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• G06F 1/20 - Cooling means
• H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
• B33Y 80/00 - Products made by additive manufacturing

Abstract

A chassis configured to hold a cards of at least two form factors comprising: slots disposed in an inner portion the chassis, wherein the slots are aligned with one another and configured to act as card guides; a mid-height structure disposed adjacent a side wall of the chassis, the mid-height structure comprising a second plurality of slots and a third plurality of slots disposed on top and bottom surfaces of the mid-height structure that are substantially parallel to top and bottom walls of the chassis; and a plurality of cooling channels disposed within the walls of the chassis as well as within the mid-height structure, wherein the second and third plurality of slots are configured to align with at least a subset of the plurality of slots disposed in the top and bottom chassis walls and to act as card guides.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• G06F 1/18 - Packaging or power distribution
• G06F 1/20 - Cooling means

Abstract

An interposer that enables implementation of a flip-chip die in a wirebonded chip-and-wire circuit assembly includes an insulating substrate having a solder bump pad array on its upper surface that is compatible with the solder bump array of a flip-chip die. Wirebond pads provided along upper edges of the substrate are interconnected to at least some of the solder bump pads. Bonding the interposer to the circuit assembly housing floor, or through an opening to an underlying motherboard, places the wirebond pads proximate attachment points of adjacent wirebond dies, enabling wirebonding therebetween. Attachment pads on the interposer lower surface, in combination with interconnecting traces and vias, can enable connection directly through the housing opening to the underlying motherboard. Support components can be included within an edge cavity created beneath an overhang of a multi-layer substrate. A heat absorbing plate can be attached to the top of the flip-chip die.

IPC Classes  ?

• H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
• H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group

Abstract

Techniques are provided for non-integer interpolation for signal sampling. A system implementing the techniques according to an embodiment includes a memory configured to store frequency values associated with an input signal sampled at a first clock rate. The system also includes a clock phase detector configured to detect phase alignment between a first clock signal associated with the first clock rate and a second clock signal associated with a second clock rate. The system further includes a read circuit configured to adjust an interpolation time interval in response to the detected phase alignment and to read the frequency values from the memory at the adjusted interpolation time interval. The system further includes a phase accumulator configured to accumulated phase as a sum of the frequency values read from the memory. The system further includes a waveform generator configured to generate an output waveform sample based on the accumulated phase.

IPC Classes  ?

• H04L 7/00 - Arrangements for synchronising receiver with transmitter

Abstract

A shock absorbing apparatus that includes a baseplate adapted to be mounted on a platform, a flexure member that operably engages with the baseplate, and a mounting plate that operably engages with the flexure member. The mounting plate is free from direct engagement with the baseplate and is moveable between a neutral position and a translated position with respect to the baseplate. The mounting plate is also adapted to hold a device. The flexure member is adapted to absorb shock forces caused by a ballistic shock event or a projectile motion event in proximity to or applied on the platform.

IPC Classes  ?

• F16F 15/02 - Suppression of vibrations of non-rotating, e.g. reciprocating, systemsSuppression of vibrations of rotating systems by use of members not moving with the rotating system

Abstract

A hybrid electronic warfare and communications system (EW/COMM) eliminates the space, power, weight, and cost of a dedicated communication system by exchanging messages with other nodes in a network as phase modulations of radar jamming signals. Some embodiments impose message phase modulations onto CW jamming signals, while other embodiments interleave message phase modulations with pseudorandom phase modulations of the jamming signals. Message chip rates can be matched to pseudorandom phase modulation chip rates. Messages are thereby obfuscated as either phase noise or random phase modulation of the jamming signals. Messages can be encoded as BPSK or QPSK modulations. Messages can be preceded by pre-established headers known to other nodes, and distinguished thereby from random noise modulations. Some embodiments include a dedicated COMMS module and/or antenna, while other embodiments implement the communications function mostly or entirely in software. Messages can be encrypted before transmission and decrypted after reception.

IPC Classes  ?

• G01S 7/38 - Jamming means, e.g. producing false echoes
• G01S 7/02 - Details of systems according to groups , , of systems according to group
• H04K 3/00 - Jamming of communicationCounter-measures

Abstract

A Global Positioning System (GPS) digital antenna controller is provided, comprising antenna electronics, a code generator, and an interface. The antenna electronics can be configured to receive a GPS signal. The code generator can be configured to generate a pilot code signal that is synchronized to the DAE local clock reference. The interface can be configured to send the GPS signal and the code signal to a GPS receiver. A system may comprise the GPS digital antenna controller and GPS receiver. The GPS receiver can comprise a second code generator and a processor configured to resolve a timing difference based on the pilot code signal and a second code signal of the second code generator. The controller may be remote from the receiver. The interface may comprise an asynchronous data interface (e.g., Ethernet, USB, Infiniband, or Firewire). To resolve the timing difference may involve GPS code and carrier tracking.

Abstract

A Global Positioning System (GPS) digital antenna controller is provided, comprising antenna electronics, a code generator, and an interface. The antenna electronics can be configured to receive a GPS signal. The code generator can be configured to generate a pilot code signal that is synchronized to the DAE local clock reference. The interface can be configured to send the GPS signal and the code signal to a GPS receiver. A system may comprise the GPS digital antenna controller and GPS receiver. The GPS receiver can comprise a second code generator and a processor configured to resolve a timing difference based on the pilot code signal and a second code signal of the second code generator. The controller may be remote from the receiver. The interface may comprise an asynchronous data interface (e.g., Ethernet, USB, Infiniband, or Firewire). To resolve the timing difference may involve GPS code and carrier tracking.

IPC Classes  ?

• G01S 19/13 - Receivers
• G01S 19/07 - Cooperating elementsInteraction or communication between different cooperating elements or between cooperating elements and receivers providing data for correcting measured positioning data, e.g. DGPS [differential GPS] or ionosphere corrections

Abstract

A neuromorphic focal plane array ROIC device for temporal and spatial synchronous and asynchronous image event processing comprising a plurality of pixels, each pixel comprising an input section comprising a Sample and Hold (SH) component; a low offset buffer/comparator section comprising a Switched Capacitor Filter (SCF); and a digital event output section comprising an analog pixel bus whereby temporal and spatial image data are synchronously and asynchronously processed.

IPC Classes  ?

• H04N 25/78 - Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
• H04N 25/707 - Pixels for event detection

Abstract

A system and method is provided to characterize optical properties (Scattering, attenuation, de-polarization) of a light-transmitting medium and local environment, by determining a scattering rate of light through a medium, wherein determining the scattering rate of light through the medium is accomplished by utilizing polarized light transmitted from an optical source. The system and method performs a function based on the characterized optical properties of the medium, wherein the function is one of, for example: detection of objects embedded in the medium, object ranging through the medium, or deblurring of images acquired through the medium.

IPC Classes  ?

• G01S 17/89 - Lidar systems, specially adapted for specific applications for mapping or imaging
• G01J 4/04 - Polarimeters using electric detection means
• G01S 7/4861 - Circuits for detection, sampling, integration or read-out
• G06T 5/73 - DeblurringSharpening

Abstract

Techniques for jointly estimating geolocations of a plurality of emitting targets. An example method includes acquiring a plurality of bearing measurements, establishing a search grid based on the bearing measurements, performing a joint maximum likelihood optimization procedure on the bearing measurements over the search grid to produce an estimated geolocation solution by solving a nonlinear multi-target geolocation description function for all targets associated with a current rank, repeating the joint maximum likelihood optimization procedure set successive ranks until a maximum rank is reached, evaluating the estimated geolocation solution sets for each rank to determine a number of targets, based on the number of targets, selecting the corresponding geolocation solution set for the rank corresponding to the number of targets, and processing the selected corresponding geolocation solution set to produce a geolocation result that includes an estimated location of each target.

IPC Classes  ?

• G01S 5/02 - Position-fixing by co-ordinating two or more direction or position-line determinationsPosition-fixing by co-ordinating two or more distance determinations using radio waves

Abstract

Techniques are provided for estimation of relative velocity between a receiver platform and a transmitter platform. A methodology implementing the techniques according to an embodiment includes measuring a first time of arrival, a first phase, and a frequency of a first radar pulse received from the transmitter platform. The method also includes measuring a second time of arrival and a second phase of a second radar pulse received from the transmitter platform. The method further includes calculating a relative velocity between the receiver platform and the transmitter platform based on a difference between the first time of arrival and the second time of arrival, a difference between the first phase and the second phase, and the frequency. The method further includes calculating an angle of arrival of the first and second received radar pulses based on a ratio of the calculated relative velocity to a velocity of the receiver platform.

IPC Classes  ?

• G01S 11/04 - Systems for determining distance or velocity not using reflection or reradiation using radio waves using angle measurements
• G01S 7/02 - Details of systems according to groups , , of systems according to group

Abstract

A microelectronic component includes a substrate having at least one electrical pad, a resilient material on the substrate, and a conductive element on or in the resilient material and coupled to the at least one conductive pad. The resilient material may include, for instance, a compressible polymer. The conductive elements configured to be placed in contact with at least one test probe, where the resilient material is configured to be compressed by the at least one electrical probe into a deformed shape and where the resilient material is configured to return from the deformed shape to a non-deformed shape subsequent to a removal of the conductive element from contact with the at least one electrical probe.

IPC Classes  ?

• H01L 21/66 - Testing or measuring during manufacture or treatment
• G01R 1/067 - Measuring probes

Abstract

High power monolithic microwave integrated circuit (MMIC) differential single pole double throw switches utilizing a series of transistors formed by a gallium nitride (GaN) foundry process. The differential switches of the present disclosure allow for larger power handling capability and wideband operation while further providing differential amplitude and phase matching.

IPC Classes  ?

• H04B 1/44 - Transmit/receive switching
• H03K 17/56 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components by the use, as active elements, of semiconductor devices

Abstract

A low SWAP-C apparatus and method enable determining precise location and orientation in a GPS-denied environment. A camera image of a scene is registered to a synthetic image predicted according to an initial estimate of location and orientation and a 3D model of the environment to obtain an accurate cross-plane location estimate perpendicular to the camera pointing direction, and an approximate downrange location in the pointing direction. A range sensor is then used to correct and refine the downrange estimate. The steps can be iterated until a required accuracy is attained. The camera can be an electro-optical or infrared imaging system. The range sensor can be a laser range finder or a LIDAR. The initial location estimate can be based on inertial measurements and/or earlier GPS readings. The registration can include applying a photogrammetric bundle-adjustment process. The disclosure is applicable to navigation, weapons pointing, and situational awareness.

IPC Classes  ?

• G01S 17/89 - Lidar systems, specially adapted for specific applications for mapping or imaging
• G01C 3/08 - Use of electric radiation detectors
• G01C 21/16 - NavigationNavigational instruments not provided for in groups by using measurement of speed or acceleration executed aboard the object being navigatedDead reckoning by integrating acceleration or speed, i.e. inertial navigation
• G06T 7/70 - Determining position or orientation of objects or cameras

Abstract

An apparatus includes a lower plate, an upper plate above the lower plate, and a plurality of vias extending from the lower plate to the upper plate. The lower plate, the upper plate, and the plurality of vias include conductive material. A post including conductive material extends from the lower plate and towards the upper plate. An inner plate including conductive material is above and in contact with the post, where the post and the inner plate are separated from the upper plate by dielectric material. The plurality of vias are arranged to at least in part wrap around the post. A signal line extends between the lower and upper plates and at least in part wraps around the post, where the signal line extends through an opening between a first via and a second via of the plurality of vias. In an example, the apparatus is a resonator structure.

IPC Classes  ?

• H01P 7/06 - Cavity resonators
• H01P 1/20 - Frequency-selective devices, e.g. filters
• H01Q 9/04 - Resonant antennas

Abstract

Ultrashort pulsed laser systems are described. In one example, a pulsed laser system includes a source laser configured to emit a pulsed source laser beam, a splitter configured to split the source laser beam into first and second input laser beams, a first amplifier module configured to amplify the first input laser beam using chirped pulse amplification (CPA) and to produce, at a first output port, a first output laser beam in a first spectral range based on soliton self-frequency shift (SSFS) in the first amplifier module, a second amplifier module configured to amplify the second input laser beam using CPA and to produce an intermediate beam based on SSFS in the second amplifier module, and a mid-infrared fiber configured to receive the intermediate beam and to produce, at a second output port, a second output laser beam in a second spectral range based SSFS in the mid-infrared fiber.

IPC Classes  ?

• H01S 3/00 - Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
• G02F 1/35 - Non-linear optics
• G02F 1/365 - Non-linear optics in an optical waveguide structure
• H01S 3/067 - Fibre lasers
• H01S 3/094 - Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light
• H01S 3/0941 - Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light of a semiconductor laser, e.g. of a laser diode
• H01S 3/13 - Stabilisation of laser output parameters, e.g. frequency or amplitude
• H01S 3/16 - Solid materials

Abstract

An optical detection system uses high-resolution holographic filters for target detection within a very-large field of view image acquired with a reflector. The holographic filter acts as an optical computer, mixing phase and amplitude information of known targets with light from the scene, automatically enhancing portions of the image that match threat objects or other object of interest. A lens forming a Fourier transform of the entire scene is used, and within that transform, the holographic information of a target or multiple targets is added. By acting as an inverse optical transfer function, the hologram gathers the target information to single point, and removes non-target background. Amplification is done by using a laser-illuminated hologram to create a phase-amplitude filter in a photorefractive material at the transform plane. By mixing the hologram and the scene at the transform plane, the matching is enhanced regardless of target location in the scene.

IPC Classes  ?

• G03H 1/22 - Processes or apparatus for obtaining an optical image from holograms
• G03H 1/00 - Holographic processes or apparatus using light, infrared, or ultraviolet waves for obtaining holograms or for obtaining an image from themDetails peculiar thereto
• G03H 1/02 - Holographic processes or apparatus using light, infrared, or ultraviolet waves for obtaining holograms or for obtaining an image from themDetails peculiar thereto Details
• H04N 23/20 - Cameras or camera modules comprising electronic image sensorsControl thereof for generating image signals from infrared radiation only
• H04N 23/61 - Control of cameras or camera modules based on recognised objects
• H04N 23/695 - Control of camera direction for changing a field of view, e.g. pan, tilt or based on tracking of objects
• H04N 23/698 - Control of cameras or camera modules for achieving an enlarged field of view, e.g. panoramic image capture
• H04N 23/90 - Arrangement of cameras or camera modules, e.g. multiple cameras in TV studios or sports stadiums

Abstract

An apparatus includes a lower plate, an upper plate above the lower plate, and a plurality of vias extending from the lower plate to the upper plate. The lower plate, the upper plate, and the plurality of vias include conductive material. A post including conductive material extends from the lower plate and towards the upper plate. An inner plate including conductive material is above and in contact with the post, where the post and the inner plate are separated from the upper plate by dielectric material. The plurality of vias are arranged to at least in part wrap around the post. A signal line extends between the lower and upper plates and at least in part wraps around the post, where the signal line extends through an opening between a first via and a second via of the plurality of vias. In an example, the apparatus is a resonator structure.

IPC Classes  ?

• H01P 1/208 - Cascaded cavitiesCascaded resonators inside a hollow waveguide structure
• H01P 1/205 - Comb or interdigital filtersCascaded coaxial cavities
• H01P 7/08 - Strip line resonators

Abstract

Techniques are provided for adaptive anti-jam filtering in radio frequency (RF) based systems. In one example, an adaptive filter includes a filtering device coupled between an input port and an output port, and including at least one infinite impulse response (IIR) filter, the filtering device configured to receive an input signal via the input port and to provide a filtered output signal at the output port, and an analysis module coupled between the input port and the filtering device, the analysis module being configured to receive the input signal via the input port, to determine a set of filter coefficients for the at least one IIR filter based on detecting at least one interfering signal in the input signal, and to provide the a set of filter coefficients to the filtering device to update a configuration of the at least one IIR filter using the a set of filter coefficients.

IPC Classes  ?

• G01S 7/36 - Means for anti-jamming
• G01S 13/78 - Systems using reradiation of radio waves, e.g. secondary radar systemsAnalogous systems wherein pulse-type signals are transmitted discriminating between different kinds of targets, e.g. IFF-radar, i.e. identification of friend or foe
• H03H 17/02 - Frequency-selective networks
• H04B 1/12 - Neutralising, balancing, or compensation arrangements
• H04B 1/10 - Means associated with receiver for limiting or suppressing noise or interference

Abstract

Techniques are provided for an Identification Friend or Foe (IFF) transponder. A system implementing the techniques according to an embodiment includes an antenna array configured to operate in an omnidirectional mode and a steered directional mode. The system also includes a receiver configured to receive signals provided through the antenna array while operating in the omnidirectional mode and a detector configured to detect an IFF interrogation message in the received signals. The system further includes an angle of arrival (AOA) estimator configured to operate the antenna array in the steered directional mode to estimate an AOA of the IFF interrogation message. The system further includes a transmitter configured to operate the antenna array in the steered directional mode to transmit an IFF response message in the estimated AOA direction. The transmit power of the IFF response message may be based on, for example, the steering gain of the antenna array.

IPC Classes  ?

• G01S 13/78 - Systems using reradiation of radio waves, e.g. secondary radar systemsAnalogous systems wherein pulse-type signals are transmitted discriminating between different kinds of targets, e.g. IFF-radar, i.e. identification of friend or foe
• G01S 17/74 - Systems using reradiation of electromagnetic waves other than radio waves, e.g. IFF, i.e. identification of friend or foe
• H01Q 3/26 - Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elementsArrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the distribution of energy across a radiating aperture
• G01S 15/74 - Systems using reradiation of acoustic waves, e.g. IFF, i.e. identification of friend or foe

Abstract

Techniques are provided for an Identification Friend or Foe (IFF) transponder. A system implementing the techniques according to an embodiment includes an antenna array configured to operate in an omnidirectional mode and a steered directional mode. The system also includes a receiver configured to receive signals provided through the antenna array while operating in the omnidirectional mode and a detector configured to detect an IFF interrogation message in the received signals. The system further includes an angle of arrival (AOA) estimator configured to operate the antenna array in the steered directional mode to estimate an AOA of the IFF interrogation message. The system further includes a transmitter configured to operate the antenna array in the steered directional mode to transmit an IFF response message in the estimated AOA direction. The transmit power of the IFF response message may be based on, for example, the steering gain of the antenna array.

IPC Classes  ?

• G01S 13/78 - Systems using reradiation of radio waves, e.g. secondary radar systemsAnalogous systems wherein pulse-type signals are transmitted discriminating between different kinds of targets, e.g. IFF-radar, i.e. identification of friend or foe
• G01S 13/76 - Systems using reradiation of radio waves, e.g. secondary radar systemsAnalogous systems wherein pulse-type signals are transmitted

Abstract

A mid-wave infrared (MWIR) lens assembly that may include a first set of optical elements, wherein each optical element of the first set of optical elements is a positive optical power. MWIR lens assembly may also include a second set of optical elements, wherein each optical element of the second set of optical elements is a negative optical power. MWIR lens assembly may also include that at least one optical element of the first set of optical elements is formed of a first optical glass material, at least another optical element of the first set of optical elements is formed of a second optical glass material, and at least one optical element of the second set of optical elements is formed of a third optical glass material wherein the second optical glass material is different than the first optical glass material and the third optical glass material.

IPC Classes  ?

• G02B 13/14 - Optical objectives specially designed for the purposes specified below for use with infrared or ultraviolet radiation
• G02B 13/18 - Optical objectives specially designed for the purposes specified below with lenses having one or more non-spherical faces, e.g. for reducing geometrical aberration

Abstract

Techniques for reducing a likelihood of detection of an imaging system by another imaging system are provided. For example, a mechanism may be used to interrupt an optical path between pulse biased thermal sensors and an aperture of the system when the pulsed biased thermal sensors are pulse biased. For example, emissions may be directed to a beam dump. Other techniques may include a mechanism for linearly moving the thermal sensor array or rotating a mirror.

IPC Classes  ?

• A61B 5/11 - Measuring movement of the entire body or parts thereof, e.g. head or hand tremor or mobility of a limb
• A61B 5/00 - Measuring for diagnostic purposes Identification of persons
• A61B 5/113 - Measuring movement of the entire body or parts thereof, e.g. head or hand tremor or mobility of a limb occurring during breathing
• A61B 5/349 - Detecting specific parameters of the electrocardiograph cycle
• A61N 1/39 - Heart defibrillators
• G01J 5/08 - Optical arrangements
• G01J 5/0804 - Shutters
• G01J 5/0813 - Planar mirrorsParallel phase plates
• H04N 23/23 - Cameras or camera modules comprising electronic image sensorsControl thereof for generating image signals from infrared radiation only from thermal infrared radiation
• H04N 25/21 - Circuitry of solid-state image sensors [SSIS]Control thereof for transforming only infrared radiation into image signals for transforming thermal infrared radiation into image signals
• G01J 5/00 - Radiation pyrometry, e.g. infrared or optical thermometry

Abstract

Techniques to provide compression and/or decompression. A method includes obtaining a first set of control points specifying a first set of compression ratios corresponding to respective first regions of a compression domain, and minimum and maximum uncompressed values within the compression domain. The method can further include scaling the first set of control points based on the minimum and maximum uncompressed values to obtain a scaled set of control points, wherein a first scaled control point is located at the minimum uncompressed value, and a last scaled control point is located at the maximum uncompressed value. The method can further include adjusting at least one scaled control point such that a first slope does not exceed 1. The method can further include compressing or decompressing between the compression domain and a range of compressed values, wherein a respective compression ratio corresponds to a respective slope of the set of slopes.

IPC Classes  ?

• H04L 67/5651 - Reducing the amount or size of exchanged application data
• H04L 69/04 - Protocols for data compression, e.g. ROHC
• H04W 28/06 - Optimising, e.g. header compression, information sizing
• H04W 80/00 - Wireless network protocols or protocol adaptations to wireless operation

Abstract

A method for radiation hardening synchronous Dynamic Random Access Memory (DRAM), where Error Detection And Correction (EDAC) is implemented on-chip. Each bank includes a plurality of interleaved single chip Static Random Access Memory (SRAM) cells with bit registers configured to interface with the interleaved SRAM cells. A first column multiplexer (MUX) configured to select which bit register is accessed. A second column multiplexer is configured to select an accessed byte with the WRITE burst or a READ burst from the selected bit registers of the first column multiplexer. EDAC logic is configured to check Error Correction Code (ECC) during a READ burst and generate ECC during an WRITE burst for SRAM writeback during a PRECHARGE command.

IPC Classes  ?

• G06F 11/10 - Adding special bits or symbols to the coded information, e.g. parity check, casting out nines or elevens
• G01R 31/3177 - Testing of logic operation, e.g. by logic analysers
• H03M 13/29 - Coding, decoding or code conversion, for error detection or error correctionCoding theory basic assumptionsCoding boundsError probability evaluation methodsChannel modelsSimulation or testing of codes combining two or more codes or code structures, e.g. product codes, generalised product codes, concatenated codes, inner and outer codes
• G11C 11/419 - Read-write [R-W] circuits
• G11C 11/418 - Address circuits
• G11C 11/4096 - Input/output [I/O] data management or control circuits, e.g. reading or writing circuits, I/O drivers or bit-line switches

Abstract

A chaff dispensing system that is provided on an aircraft and includes a container, a dispensing assembly, a controller, and a volume of chaff material. The container has a first end, a second end, and a chamber that extends between the first and second ends, and the second end defines an ejection port. The dispensing assembly is operably engaged to the container. The controller is electrically connected to the dispensing assembly. The volume of chaff material is disposed inside the chamber of the container. The volume of chaff material is dispensed by the dispensing assembly operably through the controller in metered volumes of chaff material. In addition, a first volume of chaff material may be metered at a first time and a second volume chaff material may be metered at a second time in which the second volume of chaff material is different than the first volume of chaff material.

IPC Classes  ?

• B64D 1/02 - Dropping, ejecting, or releasing articles

Abstract

An antenna assembly includes a balanced antenna feed configured to receive a differential signal and a ground plane. The assembly further includes a first conductive dipole arm in planar alignment with a surface of the ground plane and a second conductive dipole arm in planar alignment with the surface of the ground plane and adjacent to the first conductive dipole arm. The assembly further includes a first feedline in electrical communication with the first conductive dipole arm and the balanced antenna feed and a second feedline in electrical communication with the second conductive dipole arm and the balanced antenna feed. The assembly further includes a conductive wall (“H-wall”) in electrical communication with the ground plane and having an end adjacent to, and physically separate from, the second conductive dipole arm. The H-wall has an axial length orthogonal to the ground plane.

IPC Classes  ?

• H01Q 5/48 - Combinations of two or more dipole type antennas
• H01Q 21/12 - Parallel arrangements of substantially straight elongated conductive units

Abstract

An antenna assembly includes an antenna feed configured to receive a signal over a wide bandwidth, a ground plane, and an antenna element. The antenna element includes first and second conductive dipole arms each in planar alignment with a surface of the ground plane and adjacent to each other. The antenna assembly further includes a conductive wall (“H-wall”) in electrical communication with the ground plane and having an end adjacent to, and physically separate from, the second conductive dipole arm, where an axial length of the H-wall being orthogonal to the ground plane, and a resistive surface having an attenuation effect on the reflected signal from the ground plane.

IPC Classes  ?

• H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support
• H01Q 1/48 - Earthing meansEarth screensCounterpoises

Abstract

A device includes a frame and at least one printed circuit board attached to the frame. The frame includes an integrated aperture antenna array and an antenna feed in electrical communication with the at least one printed circuit board. The integrated aperture antenna array further includes a first conductive dipole arm in planar alignment with a surface of the frame; a second conductive dipole arm in planar alignment with the surface of the frame and adjacent to the first conductive dipole arm; a first feedline in electrical communication with the first conductive dipole arm and the antenna feed; a second feedline in electrical communication with the second conductive dipole arm and the surface of the frame; and a shorting arm in electrical communication with second conductive dipole arm and the frame.

IPC Classes  ?

• H01Q 1/24 - SupportsMounting means by structural association with other equipment or articles with receiving set
• H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support
• H01Q 1/46 - Electric supply lines or communication lines
• H01Q 21/00 - Antenna arrays or systems

Abstract

A system for enhancing a coupling laser beam to create a larger beam radius thus increasing sensitivity inside the system. The system includes a coupling laser source to emit a coupling laser defining a first power level. The system also includes a resonant optical cavity that is optically aligned with the coupling laser source and the probe laser source. The resonant optical cavity enhances the coupling laser to a second power level that is greater than the first power level inside of the resonant optical cavity. The power increase of the coupling level also increases the sensitivity of the atomic receiver system by increasing the diameter of the coupling laser inside of the resonant optical cavity. The system also includes at least one photodetector positioned outside of and optically aligned with the resonant optical cavity for monitoring a resonance condition of the coupling laser circulating within the resonant optical cavity.

IPC Classes  ?

• G01R 29/08 - Measuring electromagnetic field characteristics

Abstract

An antenna assembly includes an antenna feed configured to receive a signal over a wide bandwidth, a ground plane, and an antenna element. The antenna element includes first and second conductive dipole arms each in planar alignment with a surface of the ground plane and adjacent to each other. The antenna assembly further includes a conductive wall ("H-wall") in electrical communication with the ground plane and having an end adjacent to, and physically separate from, the second conductive dipole arm, where an axial length of the H-wall being orthogonal to the ground plane, and a resistive surface having an attenuation effect on the reflected signal from the ground plane.

IPC Classes  ?

• H01Q 9/00 - Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
• H01Q 5/48 - Combinations of two or more dipole type antennas
• H01Q 1/22 - SupportsMounting means by structural association with other equipment or articles
• B22F 10/00 - Additive manufacturing of workpieces or articles from metallic powder
• H01Q 21/06 - Arrays of individually energised antenna units similarly polarised and spaced apart
• H01Q 21/08 - Arrays of individually energised antenna units similarly polarised and spaced apart the units being spaced along, or adjacent to, a rectilinear path
• B33Y 80/00 - Products made by additive manufacturing

Abstract

An antenna assembly includes at least one conductive dipole arm and an adjacent conductive wall ("H-wall"), which enables efficient radiation from the conductive dipole arm without added losses. A single-ended antenna feed is configured to receive a single-ended signal. The antenna assembly further includes a ground plane and a conductive dipole arm in planar alignment with a surface of the ground plane. The conductive wall is electrically coupled with the ground plane and has an end adjacent to, and physically separate from, the conductive dipole arm, an axial length of the H-wall being orthogonal to the ground plane. The antenna assembly further includes a feedline electrically coupled with the conductive dipole arm and the single-ended antenna feed.

IPC Classes  ?

• H01Q 9/00 - Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
• H01Q 5/48 - Combinations of two or more dipole type antennas
• H01Q 1/22 - SupportsMounting means by structural association with other equipment or articles
• B22F 10/00 - Additive manufacturing of workpieces or articles from metallic powder
• H01Q 21/06 - Arrays of individually energised antenna units similarly polarised and spaced apart
• H01Q 21/08 - Arrays of individually energised antenna units similarly polarised and spaced apart the units being spaced along, or adjacent to, a rectilinear path
• B33Y 80/00 - Products made by additive manufacturing

Abstract

An antenna assembly includes at least one conductive dipole arm and an adjacent conductive wall (“H-wall”), which enables efficient radiation from the conductive dipole arm without added losses. A single-ended antenna feed is configured to receive a single-ended signal. The antenna assembly further includes a ground plane and a conductive dipole arm in planar alignment with a surface of the ground plane. The conductive wall is electrically coupled with the ground plane and has an end adjacent to, and physically separate from, the conductive dipole arm, an axial length of the H-wall being orthogonal to the ground plane. The antenna assembly further includes a feedline electrically coupled with the conductive dipole arm and the single-ended antenna feed.

IPC Classes  ?

• H01Q 21/24 - Combinations of antenna units polarised in different directions for transmitting or receiving circularly and elliptically polarised waves or waves linearly polarised in any direction
• B33Y 10/00 - Processes of additive manufacturing
• B33Y 80/00 - Products made by additive manufacturing
• H01Q 1/48 - Earthing meansEarth screensCounterpoises
• H01Q 5/25 - Ultra-wideband [UWB] systems, e.g. multiple resonance systemsPulse systems
• H01Q 9/16 - Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole

Abstract

An antenna assembly includes an antenna feed, a ground plane, a first antenna element, a second antenna element, and a shorting post that is shared between the first and second antenna elements. The first antenna element includes a first conductive dipole arm in planar alignment with a surface of the ground plane and a second conductive dipole arm in planar alignment with the surface of the ground plane and adjacent to the first conductive dipole arm. The second antenna element includes a third conductive dipole arm in planar alignment with the surface of the ground plane and adjacent to the second conductive dipole arm, and a fourth conductive dipole arm in planar alignment with the surface of the ground plane and adjacent to the third conductive dipole arm. The shorting post is in electrical communication with the ground plane, the second conductive dipole arm and the third conductive dipole arm.

IPC Classes  ?

• H01Q 1/08 - Means for collapsing antennas or parts thereof
• H01Q 1/14 - SupportsMounting means for wire or other non-rigid radiating elements
• H01Q 1/48 - Earthing meansEarth screensCounterpoises
• H01Q 21/06 - Arrays of individually energised antenna units similarly polarised and spaced apart
• H01Q 21/29 - Combinations of different interacting antenna units for giving a desired directional characteristic

Abstract

An antenna assembly includes a single-ended antenna feed configured to receive a single-ended signal and a ground plane. The assembly further includes a first conductive dipole arm in planar alignment with a surface of the ground plane and a second conductive dipole arm in planar alignment with the surface of the ground plane and adjacent to the first conductive dipole arm. The assembly further includes a first feedline in electrical communication with the first conductive dipole arm and the single-ended antenna feed and a second feedline in electrical communication with the second conductive dipole arm and the ground plane. The assembly further includes a shorting arm in electrical communication with the ground plane and the second conductive dipole arm.

IPC Classes  ?

• H01Q 21/06 - Arrays of individually energised antenna units similarly polarised and spaced apart
• H01Q 21/20 - Arrays of individually energised antenna units similarly polarised and spaced apart the units being spaced along, or adjacent to, a curvilinear path
• H01Q 21/24 - Combinations of antenna units polarised in different directions for transmitting or receiving circularly and elliptically polarised waves or waves linearly polarised in any direction
• H01Q 9/28 - Conical, cylindrical, cage, strip, gauze or like elements having an extended radiating surface Elements comprising two conical surfaces having collinear axes and adjacent apices and fed by two-conductor transmission lines
• H01Q 21/00 - Antenna arrays or systems

Abstract

A power amplifier has multiple stages, wherein one stage includes nonuniform distributed power amplifier circuitry and an electrically subsequent stage includes reactively match power amplifier circuitry. There is a non 50 Ohm intermediate impedance between the distributed and reactively matched stages. The ratio of periphery between the subsequent reactively matched stage and the prior distributed stage being less than or equal to 2:1.

IPC Classes  ?

• H03F 3/60 - Amplifiers in which coupling networks have distributed constants, e.g. with waveguide resonators
• H03F 1/02 - Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation
• H03F 3/213 - Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only in integrated circuits
• H03F 1/56 - Modifications of input or output impedances, not otherwise provided for
• H03F 3/193 - High-frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only with field-effect devices
• H03F 3/195 - High-frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only in integrated circuits
• H03F 3/68 - Combinations of amplifiers, e.g. multi-channel amplifiers for stereophonics
• H03F 1/42 - Modifications of amplifiers to extend the bandwidth
• H04B 1/04 - Circuits

Abstract

A device includes a frame and at least one printed circuit board attached to the frame. The frame includes an integrated aperture antenna array and an antenna feed in electrical communication with the at least one printed circuit board. The integrated aperture antenna array further includes a first conductive dipole arm in planar alignment with a surface of the frame; a second conductive dipole arm in planar alignment with the surface of the frame and adjacent to the first conductive dipole arm; a first feedline in electrical communication with the first conductive dipole arm and the antenna feed; a second feedline in electrical communication with the second conductive dipole arm and the surface of the frame; and a shorting arm in electrical communication with second conductive dipole arm and the frame.

IPC Classes  ?

• H01Q 9/00 - Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
• H01Q 5/48 - Combinations of two or more dipole type antennas
• H01Q 1/22 - SupportsMounting means by structural association with other equipment or articles
• B22F 10/00 - Additive manufacturing of workpieces or articles from metallic powder
• H01Q 21/06 - Arrays of individually energised antenna units similarly polarised and spaced apart
• H01Q 21/08 - Arrays of individually energised antenna units similarly polarised and spaced apart the units being spaced along, or adjacent to, a rectilinear path
• B33Y 80/00 - Products made by additive manufacturing

Abstract

A power amplifier has multiple stages, wherein one stage includes nonuniform distributed power amplifier circuitry and an electrically subsequent stage includes reactively match power amplifier circuitry. There is a non 50 Ohm intermediate impedance between the distributed and reactively matched stages. The ratio of periphery between the subsequent reactively matched stage and the prior distributed stage being less than or equal to 2:1.

IPC Classes  ?

• H03F 3/24 - Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages
• H03F 1/56 - Modifications of input or output impedances, not otherwise provided for
• H03F 3/195 - High-frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only in integrated circuits

Abstract

Image sensor systems are disclosed that include charge coupled device (CCD) pixels integrated with CMOS readout circuitry via separately bonded substrates. According to some embodiments, columns of image sensing pixels on a first substrate are arranged with overlapping gate structures to facilitate charge transfer between the pixels. At least one pixel is coupled to a first conductive pad that contacts (or is melded with) a second conductive pad from a second substrate bonded to the first substrate. The second substrate includes a readout circuit using one or more CMOS devices coupled to the second conductive pad to receive the accumulated charge from a given column of pixels. The resulting photodetector signal from the accumulated charge can be, for instance, amplified via a source follower component and ultimately read out to a column amplifier, and subjected to further processing and/or use in a given downstream system.

IPC Classes  ?

• H01L 27/144 - Devices controlled by radiation
• H01L 27/146 - Imager structures
• H01L 27/148 - Charge coupled imagers
• H01L 29/765 - Charge-coupled devices
• H01L 29/768 - Charge-coupled devices with field effect produced by an insulated gate
• H01L 27/02 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
• H01L 27/14 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy
• H01L 27/142 - Energy conversion devices
• H01L 29/76 - Unipolar devices
• H01L 29/762 - Charge transfer devices

Abstract

A method of image enhancement, the method comprising: obtaining image data representing an image comprising a plurality of pixels, each having a pixel intensity value, the image further comprising a region of interest; analyzing image data associated with the region of interest and gathering relevant statistics thereon; analyzing image data associated with the image as a whole and gathering relevant statistics thereon; accumulating a histogram based on the intensity value of pixels in the image as a whole; defining histogram bins of interest that correspond to a range of pixel intensity values from within the region of interest; attenuating histogram bins outside of the bins of interest OR multiplying bins of interest by a scaling factor; using the attenuated or scaled histogram to create a cumulative distribution function; and using the cumulative distribution function to produce a contrast enhanced image.

IPC Classes  ?

• G06T 5/40 - Image enhancement or restoration using histogram techniques
• G06T 7/11 - Region-based segmentation
• G06V 10/25 - Determination of region of interest [ROI] or a volume of interest [VOI]
• G06V 10/42 - Global feature extraction by analysis of the whole pattern, e.g. using frequency domain transformations or autocorrelation
• G06V 10/50 - Extraction of image or video features by performing operations within image blocksExtraction of image or video features by using histograms, e.g. histogram of oriented gradients [HoG]Extraction of image or video features by summing image-intensity valuesProjection analysis
• G06T 5/50 - Image enhancement or restoration using two or more images, e.g. averaging or subtraction
• G06T 5/70 - DenoisingSmoothing
• G06T 5/90 - Dynamic range modification of images or parts thereof

Abstract

Systems and methods of image enhancement comprising: obtaining image data; analyzing the image data and gathering relevant statistics thereon, at least within a first region of interest and a second region of interest; using the gathered statistics corresponding to the first region of interest, configuring a first contrast enhancement module to perform contrast enhancement of at least a first portion of the image data; using the gathered statistics corresponding to the second region of interest, configuring a second contrast enhancement module to perform contrast enhancement of at least a second portion of the image data; and combining the contrast-enhanced image data to form a complete image.

IPC Classes  ?

• G06T 1/00 - General purpose image data processing
• G06T 7/11 - Region-based segmentation
• G06T 5/94 - Dynamic range modification of images or parts thereof based on local image properties, e.g. for local contrast enhancement

Abstract

An antenna assembly includes a ground plane having a first aperture slot and a second aperture slot. The first and second aperture slots are non-intersecting and substantially symmetrical with each other about an imaginary plane of symmetry that divides the ground plane into two substantially symmetrical halves, and that is orthogonal to the ground plane. The antenna assembly includes a first patch antenna above the ground plane, and a second patch antenna above the first patch antenna. The first patch antenna is separated from the ground plane, and the second patch antenna is separated from the first patch antenna. The imaginary plane also divides the first patch antenna into two substantially symmetrical halves, and divides the second patch antenna into two substantially symmetrical halves. A first feed line and a second feed line are at least in part below the first aperture slot and the second aperture slot, respectively.

IPC Classes  ?

• H01Q 1/10 - Telescopic elements
• H01Q 1/48 - Earthing meansEarth screensCounterpoises
• H01Q 13/08 - Radiating ends of two-conductor microwave transmission lines, e.g. of coaxial lines, of microstrip lines
• H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support
• H01Q 9/16 - Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole

Abstract

Techniques for wireless initialization of GNSS receivers. An example system includes a source node and at least one GNSS receiver configured to track GNSS satellites and to provide navigation outputs, the GNSS receiver including a first wireless interface configured to implement a secure wireless communications protocol. The source node may include a second wireless interface configured for communications according to the secure wireless communications protocol, a data storage device storing GNSS configuration data that includes information for initializing the GNSS receiver, and at least one processor coupled to the first wireless interface and to the data storage device, and configured to execute instructions that control the source node to establish, via the second wireless interface, a secure wireless link with the at least one GNSS receiver using the secure wireless communications protocol, and transfer the GNSS configuration data to the GNSS receiver over the secure wireless link.

IPC Classes  ?

• G01S 19/23 - Testing, monitoring, correcting or calibrating of a receiver element
• G01S 19/06 - Cooperating elementsInteraction or communication between different cooperating elements or between cooperating elements and receivers providing aiding data employing an initial estimate of the location of the receiver as aiding data or in generating aiding data
• H04B 7/185 - Space-based or airborne stations
• H04B 1/06 - Receivers

Abstract

An antenna assembly includes a first dielectric material, a ground plane above the first dielectric material, and two or more patch antennas above the ground plane. In an example, the ground plane has a first aperture slot, and a second aperture slot that is non-intersecting with the first aperture slot. The antenna assembly further includes a second dielectric material separating the two or more patch antennas from the ground plane. In an example, the first dielectric material comprises a printed circuit board (PCB). In some examples, the ground plane and the two or more patch antennas are manufactured using additive manufacturing techniques (such as three-dimensional printing techniques), and in some such examples, the second dielectric material includes dielectric foam. For example, the dielectric foam supports the two or more patch antennas above the ground plane.

IPC Classes  ?

• E04F 21/02 - Implements for finishing work on buildings for applying plasticised masses to surfaces, e.g. plastering walls
• B05C 17/015 - Hand tools or apparatus using hand-held tools, for applying liquids or other fluent materials to, for spreading applied liquids or other fluent materials on, or for partially removing applied liquids or other fluent materials from, surfaces for discharging material through an outlet orifice by pressure with pneumatically actuated piston or the like
• E04F 21/06 - Implements for applying plaster, insulating material, or the like

Abstract

A method of manufacturing an antenna assembly includes additively manufacturing an element that is a monolithic structure and that includes (i) a ground plane including one or more aperture slots, (ii) a patch antenna above the ground plane, and (hi) a sacrificial support feature to support the patch antenna above the ground plane. The method further includes applying a dielectric material between the ground plane and the patch antenna. In an example, applying the dielectric material between the ground plane and the patch antenna includes providing a dielectric foam between the ground plane and the patch antenna, where the dielectric foam at least in part supports the patch antenna above the ground plane. The method further includes removing at least a section of the sacrificial support feature, such that any remnant of the support feature does not physically couple the ground plane to the patch antenna.

IPC Classes  ?

• B22F 10/40 - Structures for supporting workpieces or articles during manufacture and removed afterwards

Abstract

Systems and methods of image enhancement comprising: obtaining image data; analyzing the image data and gathering relevant statistics thereon, at least within a first region of interest and a second region of interest; using the gathered statistics corresponding to the first region of interest, configuring a first contrast enhancement module to perform contrast enhancement of at least a first portion of the image data; using the gathered statistics corresponding to the second region of interest, configuring a second contrast enhancement module to perform contrast enhancement of at least a second portion of the image data; and combining the contrast-enhanced image data to form a complete image

IPC Classes  ?

• G06T 5/00 - Image enhancement or restoration

Abstract

A method of producing a pair of simultaneous artificial specklegram images. The method includes steps of: reflecting a target illumination beam off of a target surface via a transmitter optical component of a shearography system; directing a first reference beam from the transmitter optical component to a receiving optical component of the shearography system; directing a second reference beam from the transmitter optical component to the receiving optical component; receiving a reflected beam from the target surface with the receiving optical component; interfering the reflected beam with the first reference beam and the second reference beam; communicating a first data set relating to the pair of simultaneous artificial specklegram images from the receiving optical component to a processor; and processing the first data set to generate the pair of simultaneous artificial specklegram images.

IPC Classes  ?

• G01B 9/02098 - Shearing interferometers
• G01B 9/02 - Interferometers

Abstract

A method of image enhancement, the method comprising: obtaining image data representing an image comprising a plurality of pixels, each having a pixel intensity value, the image further comprising a region of interest; analyzing image data associated with the region of interest and gathering relevant statistics thereon; analyzing image data associated with the image as a whole and gathering relevant statistics thereon; accumulating a histogram based on the intensity value of pixels in the image as a whole; defining histogram bins of interest that correspond to a range of pixel intensity values from within the region of interest; attenuating histogram bins outside of the bins of interest OR multiplying bins of interest by a scaling factor; using the attenuated or scaled histogram to create a cumulative distribution function; and using the cumulative distribution function to produce a contrast enhanced image.

IPC Classes  ?

• G06T 5/40 - Image enhancement or restoration using histogram techniques
• G06T 5/00 - Image enhancement or restoration

Abstract

An antenna assembly includes a first dielectric material, a ground plane above the first dielectric material, and two or more patch antennas above the ground plane. In an example, the ground plane has a first aperture slot, and a second aperture slot that is non-intersecting with the first aperture slot. The antenna assembly further includes a second dielectric material separating the two or more patch antennas from the ground plane. In an example, the first dielectric material comprises a printed circuit board (PCB). In some examples, the ground plane and the two or more patch antennas are manufactured using additive manufacturing techniques (such as three-dimensional printing techniques), and in some such examples, the second dielectric material includes dielectric foam. For example, the dielectric foam supports the two or more patch antennas above the ground plane.

IPC Classes  ?

• H01Q 9/04 - Resonant antennas
• H01Q 1/48 - Earthing meansEarth screensCounterpoises
• H01Q 21/06 - Arrays of individually energised antenna units similarly polarised and spaced apart

Abstract

An antenna assembly includes a ground plane having a first aperture slot and a second aperture slot. The first and second aperture slots are non-intersecting and substantially symmetrical with each other about an imaginary plane of symmetry that divides the ground plane into two substantially symmetrical halves, and that is orthogonal to the ground plane. The antenna assembly includes a first patch antenna above the ground plane, and a second patch antenna above the first patch antenna. The first patch antenna is separated from the ground plane, and the second patch antenna is separated from the first patch antenna. The imaginary plane also divides the first patch antenna into two substantially symmetrical halves, and divides the second patch antenna into two substantially symmetrical halves. A first feed line and a second feed line are at least in part below the first aperture slot and the second aperture slot, respectively.

IPC Classes  ?

• H01Q 9/04 - Resonant antennas
• H01Q 1/48 - Earthing meansEarth screensCounterpoises
• H01Q 21/24 - Combinations of antenna units polarised in different directions for transmitting or receiving circularly and elliptically polarised waves or waves linearly polarised in any direction

Abstract

Techniques for wireless initialization of GNSS receivers. An example system includes a source node and at least one GNSS receiver configured to track GNSS satellites and to provide navigation outputs, the GNSS receiver including a first wireless interface configured to implement a secure wireless communications protocol. The source node may include a second wireless interface configured for communications according to the secure wireless communications protocol, a data storage device storing GNSS configuration data that includes information for initializing the GNSS receiver, and at least one processor coupled to the first wireless interface and to the data storage device, and configured to execute instructions that control the source node to establish, via the second wireless interface, a secure wireless link with the at least one GNSS receiver using the secure wireless communications protocol, and transfer the GNSS configuration data to the GNSS receiver over the secure wireless link.

IPC Classes  ?

• G01S 19/25 - Acquisition or tracking of signals transmitted by the system involving aiding data received from a cooperating element, e.g. assisted GPS
• H04W 12/037 - Protecting confidentiality, e.g. by encryption of the control plane, e.g. signalling traffic

Abstract

Techniques are provided for off-axis projectile guidance. λ methodology implementing the techniques according to an embodiment includes determining a maximum acceleration capability of the projectile based on flight data, control surface positions, and aerodynamic coefficients. The method also includes estimating a range from the projectile to a target. The method further includes calculating a first flight path to provide an offset radar viewing angle to the target that is offset from a longitudinal axis of the projectile and calculating a second flight path to provide for interception of the target by the projectile. The calculations are based on the maximum acceleration capability and the range from the projectile to the target. The method further includes guiding the projectile on the first flight path for an initial period of time and then guiding the projectile on the second flight path until target interception.

IPC Classes  ?

• F41G 7/22 - Homing guidance systems

Abstract

An interferometry system and method thereof detects movements of the surface of a body of water in response to acoustic waves generated from a sub-surface source interacting with the surface. Movements of the surface of the body of water are viewed over multiple interferometric images that can be pieced together to generate an interferometric movie or video. The interferometric movie or video depicts the movement of the acoustic wave propagating through the viewing area. Once the movement of the acoustic wave propagating through the viewing area is known, then back propagation techniques are employed to determine or triangulate the location of the sub-surface source that generated the acoustic wave.

IPC Classes  ?

• G01V 1/38 - SeismologySeismic or acoustic prospecting or detecting specially adapted for water-covered areas
• G01V 1/22 - Transmitting seismic signals to recording or processing apparatus
• G01V 1/28 - Processing seismic data, e.g. for interpretation or for event detection
• G01V 1/34 - Displaying seismic recordings

Abstract

A radio frequency (RF) bridge that may include a body having an interfacing surface and a bonding surface extending from the interfacing surface. RF bridge may also include an interconnect operably engaged with the body. The interconnect may have at least one electrical connection positioned at the interfacing surface and at least another electrical connection positioned at the interfacing surface adjacent with the at least one electrical connection. The interconnect extends curvilinearly between the at least one electrical connection and the at least another electrical connection creating a curvilinear signal path.

IPC Classes  ?

• H01L 23/66 - High-frequency adaptations
• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 23/535 - Arrangements for conducting electric current within the device in operation from one component to another including internal interconnections, e.g. cross-under constructions
• H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
• H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group

Abstract

A semiconductor package that may comprise a mixed signal die having a first surface operably engaged with an interconnect and a second surface opposite to the first surface, and at least one set of input/output (IO) connections on the mixed signal die. The at least one set of IO connections is configured to be electromagnetically shielded in a non-linear geometry from at least another set of IO connections that is different from the at least one set of IO connections.

IPC Classes  ?

• H01L 23/552 - Protection against radiation, e.g. light
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 25/00 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices
• H01L 25/10 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices having separate containers
• H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or