The present invention is a transfer method for transferring a plurality of microstructures provided on a substrate from the substrate by laser irradiation, wherein at least the spaces between adjacent microstructures are filled with a polymer material, the method comprising: a first laser irradiation step for emitting a laser beam through the substrate toward the microstructures; and a second laser irradiation step for emitting a laser beam through the substrate toward the polymer material. In the first laser irradiation step, the laser directed toward the microstructures irradiates regions corresponding to the microstructures. As a result, it is possible to suppress the occurrence of chipping or cracking in the microstructures when transferring the microstructures from the substrate.
H01L 21/50 - Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups or
B23K 26/57 - Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 33/48 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the semiconductor body packages
2.
LASER MACHINING METHOD, SUBSTRATE MANUFACTURING METHOD, AND LASER MACHINING DEVICE
A laser machining method according to the present invention is for forming a recess and/or a through-hole in a workpiece using a laser beam, and involves: irradiating the workpiece with a laser beam having an optical axis inclined with respect to a normal line of a workpiece surface of the workpiece; and performing laser machining while rotating the optical axis of the laser beam using the normal line of the workpiece surface as a rotation axis, to form a recess and/or a through-hole in the workpiece. Thus, even when a recess and/or a through-hole is formed at a high resolution, it is possible to prevent the formed recess and/or through-hole from having a tapered shape, and accordingly it becomes possible to form a complex and extremally-fine pattern.
The present invention is an ablation processing method for forming a processed recessed-part on a surface of a substrate by ablation processing by irradiation energy of a laser beam, in which the ablation processing is performed such that an angle formed between a side wall surface of the processed recessed-part on an opening side of the processed recessed-part and a surface of the substrate is 80° or more and 90° or less. As a result, it is possible to provide a substrate used for a high-performance semiconductor package substrate capable of achieving high density and low resistance of wiring resistance.
The present invention provides a laser processing device that comprises: a laser device for oscillating laser light; a reduced projection optical system; and a substrate stage, and performs laser processing by irradiating a substrate disposed on the substrate stage with a laser. The laser processing device has a shutter between the reduced projection optical system and the substrate stage. Accordingly, it is possible to provide a laser processing device capable of suppressing the effects of dimensional changes in the reduced projection optical system due to temperature changes in the reduced projection optical system, and suppressing a decrease in the throughput of the laser processing.
The present invention provides a transfer method for transferring a structure to a transfer destination, the transfer method comprising: preparing a release plate including a base material, a resin layer provided on the base material and having a transfer laser transmittance of 90% or more, and a structure held on the surface of the resin layer on the opposite side from the base material; causing the transfer laser to be incident on the base material from the surface of the base material on the opposite side from the resin layer; and causing the incident transfer laser to be transmitted through the base material and the resin layer and thermally decompose at least a portion of the resin layer at the interface where the structure and the resin layer are in contact, thereby transferring the structure from the release plate to the transfer destination. This makes it possible to provide a transfer method whereby a structure can be transferred to a transfer destination at high precision.
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
G09F 9/33 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
6.
TRANSFER METHOD, TRANSFER UNIT, RELEASE PLATE, RELEASE PLATE PRECURSOR SUBSTRATE, METHOD FOR MANUFACTURING DISPLAY DEVICE, AND METHOD FOR MANUFACTURING MOUNTING BOARD
The present invention discloses a transfer method for transferring a structure to a transfer destination, the transfer method comprising: preparing a release plate that includes a base material, a resin layer provided on the base material, and a structure retained on the surface of the resin layer on the opposite side from the base material, in which the retained thickness of the portion of the resin layer located between the base material and the structure is a thickness for which a transfer laser has a transmittance of at least 50%; and transferring the structure from the release plate to a transfer destination by causing the transfer laser to be incident on the base material from the surface of the base material on the opposite side from the resin layer, with an energy density such that at least a portion of the resin layer remains on the base material. This provides a transfer method that allows for a reduction in residue originating from the resin layer (retention layer) on the structure after transfer.
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
G09F 9/33 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
7.
LASER LIFT-OFF METHOD, METHOD FOR MANUFACTURING RECEPTOR SUBSTRATE, LASER LIFT-OFF APPARATUS, AND PHOTOMASK
The present disclosure provides a laser lift-off method for transferring objects to be transferred from a first substrate provided with the objects to be transferred onto a second substrate by virtue of laser lift-off.
B23K 37/04 - Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
G02B 27/09 - Beam shaping, e.g. changing the cross-sectioned area, not otherwise provided for
8.
PROCESSING APPARATUS, PROCESSING METHOD, AND MANUFACTURING METHOD OF SUBSTRATE
The present disclosure provides a processing apparatus that forms protrusions and recesses on a substrate surface by ablation processing using a laser beam.
A microfluidic device includes: a microfluidic chip with a flow path formed inside; a cover and a base, each in contact with a surface of the microfluidic chip; a chip holder including a fixture for securing the microfluidic chip to the cover and the base; and a connector with one end in contact with a surface of the microfluidic chip and the other end serving as a fluid supply or discharge port. The flatness of the surfaces of the microfluidic chip is 50 μm or less, and the planarity of the surfaces of the cover and base is 50 μm or less. By this structure, the microfluidic chip is hardly deformed, and damage to the microfluidic chip is suppressed. In addition, liquid tightness at a connection portion with the flow path of the microfluidic chip is high, and liquid leakage hardly occurs.
The present invention relates to a laser irradiation device that comprises: a first optical functional unit including a laser light source; and a second optical functional unit for installing a mask having a pattern corresponding to a laser irradiation region of an object to be irradiated, and that serves for irradiating the object to be irradiated with laser light through the mask installed in the second optical functional unit, wherein the mask includes an effective area having the pattern corresponding to the laser irradiation region of the object to be irradiated, has a rectangular shape with the shortest side of the four sides that are the outer edge of the mask being 1000 mm or more in length, and is arranged so that the normal line of the surface on which the pattern is formed in the second optical functional unit is oriented in a substantially horizontal direction. As a result, it is possible to provide a laser irradiation device in which the influence of deflection due to the weight of the mask can be suppressed, laser irradiation can be performed with high accuracy, and adhesion of dust to the mask surface can be suppressed, so that defects due to dust are less likely to occur and the height thereof is low.
The present invention provides a laser irradiation device comprising a first optical function part provided with a laser light source, and a second optical function part for installing a mask having a pattern that corresponds to a laser irradiation region of an object being irradiated, the laser irradiation device irradiating the object being irradiated with the laser through the mask installed in the second optical function part, wherein: the mask includes an effective area having a pattern that corresponds to a laser irradiation region of the object being irradiated; the ratio (length/thickness) of the length of the longest side among four sides, which are the outer edges of the quadrangular mask, and the thickness of the effective area in a laser transmission direction is 100 or greater; and the mask is disposed in the second optical function part such that two sides facing each other from among the four sides that are the outer edges of the mask are substantially perpendicular to the surface where the laser irradiation device is installed. There is thereby provided a laser irradiation device in which the influence of deflection due to the weight of the mask can be suppressed, laser irradiation can be performed with high accuracy, and adhesion of dust to the mask surface can be suppressed, as a result of which defects due to dust are less likely to occur and the height of the laser irradiation device is low.
The present invention is a processing device for forming ruggedness on a substrate surface by ablation processing using a laser beam. The processing device: includes a first optical function unit comprising a shaping optical system which shapes the irradiation shape of a laser beam from a laser light source into a rectangular shape, a second optical function unit comprising a mask which includes an effective area having a pattern, and a substrate stage which holds the substrate, wherein the mask includes a mask irradiation area which is a portion of the effective area of the mask and is irradiated with the laser beam passed through the first optical function unit, the substrate includes a substrate irradiation area onto which the pattern is projected by the laser beam passed through the mask, and the substrate irradiation area is smaller than a to-be-processed area of the substrate; and is configured to perform surface ruggedness processing of the to-be-processed area of the substrate by subjecting the mask and the substrate stage to sweeping irradiation while superimposing a portion of the substrate irradiation area during a processing operation of the substrate. As a result, a processing device capable of performing fine ruggedness processing over the to-be-processed area of the substrate with high accuracy is provided.
The present invention is a printed wiring substrate exposure apparatus for forming a printed wiring exposure pattern by exposing a resist film formed on the surface of a substrate to irradiation energy from a laser beam, said printed wiring substrate exposure apparatus being configured, at the time of exposure of the substrate, to perform pattern exposure on an exposure region of the substrate by sweeping irradiation of a mask and a substrate stage while causing a portion of a substrate irradiation area to overlap therewith. Thus provided is an exposure apparatus capable of accurately performing fine pattern exposure spanning the exposure region of the substrate.
The present invention is a laser irradiation device that includes a first optical function part including a laser light source, and a second optical function part for the installation of a mask having a pattern corresponding to a laser irradiation region of an irradiation target, the laser irradiation device being used for irradiating the irradiation target with a laser through the mask installed on the second optical function part, wherein the mask includes an effective area having a pattern corresponding to the laser irradiation region of the irradiation target, the ratio (length/thickness) of the length of the shortest side among the four sides forming the outer edge of the rectangular mask to the thickness of the effective area in a laser transmission direction is 100 or more, and the mask is positioned in the second optical function part so that two opposing sides among the four sides forming the outer edge of the mask are substantially perpendicular to a surface on which the laser irradiation device is installed. Thus, the present invention provides a low-height laser irradiation device in which the effects of deformation due to the dead weight of the mask are suppressed, laser irradiation can be performed with high accuracy, and defects due to dust are less likely to occur because it is possible to suppress the adhesion of dust to the mask surface.
The present invention is a laser irradiation device comprising a first optical functional unit having a laser light source and a second optical functional unit for installing a mask having a pattern corresponding to a laser irradiation region of an object to be irradiated. The laser irradiation device irradiates a laser onto the object to be irradiated through the mask installed by the second optical functional unit. The mask includes an effective area having a pattern corresponding to the laser irradiation region of the object to be irradiated, is rectangular in shape with the length of the longest of the four sides forming the outer edge of the mask being 800 mm or longer, and is disposed such that a normal line to the plane on which the pattern is formed in the second optical functional unit is oriented approximately horizontally. Through the foregoing, provided is a laser irradiation device that has a low height, is capable of irradiating a laser with high accuracy due to suppressing the effect of curvature caused by the weight of the mask, and is capable of suppressing adhesion of dust to the mask surface, making it difficult for defects caused by dust to occur.
The present invention relates to a transport method for transporting a plurality of objects from a point-of-departure substrate to a destination substrate using a laser, the method including a transport step for transporting the plurality of objects from the point-of-departure substrate to the destination substrate through a first optical system using the laser, the transport step involving transporting the objects so that surplus objects remaining on the point-of-departure substrate are obtained without being transported, and the method furthermore including, after the transport step, a repair step for assessing in advance whether any location where objects are missing is included on the destination substrate and, in cases where such a location is included, irradiating the surplus objects on the point-of-departure substrate with the laser through a second optical system and transporting the surplus objects to the location where objects are missing. This makes it possible to provide a transport method with which objects can be transported at high yield.
The present invention is a transfer method for using laser to transfer a plurality of objects to a target substrate from a start substrate, the transfer method comprising a transfer step for transferring the plurality of objects by means of the laser via a first optical system to the destination substrate from the start substrate, wherein: in the transfer step, the transfer is performed so that a surplus object, which is not transferred but remains on the start substrate, can be obtained; after the transfer step, it is determined in advance whether an object-missing spot is included on the target substrate; and when the object-missing spot is included, a repair step is added for transferring the surplus object to the object-missing spot by irradiating the surplus object on the start substrate with laser via a second optical system. Accordingly, a transfer method capable of transferring objects at high yield can be provided.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/52 - Mounting semiconductor bodies in containers
18.
FILM FORMING APPARATUS AND METHOD OF FORMING CRYSTALLINE SEMICONDUCTOR FILM USING THE SAME
A film forming apparatus including an atomizer configured to atomize a raw material solution to generate a raw material mist, a carrier gas supplier configured to supply a carrier gas that carries the raw material mist, a mist supplier configured to supply a mixture gas in which the raw material mist and the carrier gas are mixed to a surface of a substrate, a stage configured to hold the substrate, a heater configured to heat the substrate, and an exhaust unit directly or indirectly connected to the stage through piping. Thus, a film forming apparatus that can form a crystalline semiconductor film with favorable crystal orientation stably and with high productivity, and a method of forming a crystalline semiconductor film are provided.
C23C 16/44 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
C23C 16/448 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
C23C 16/455 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into the reaction chamber or for modifying gas flows in the reaction chamber
C23C 16/458 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
C23C 16/46 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
The present invention is a transfer device for transferring an object provided on a starting substrate from the starting substrate to a destination substrate using a laser, the transfer device comprising: a laser light source configured to oscillate a laser; a first optical system; a second optical system having a different optical configuration from the optical configuration of the first optical system; and a switching mechanism configured to switch the optical path of the laser between the optical path to the first optical system and the optical path to the second optical system. The first optical system is configured to transfer the object to the destination substrate surface by sequentially irradiating the laser from the back side of the starting substrate, and the second optical system is configured to remove the object from the starting substrate or to transfer the object to the destination substrate surface by selectively irradiating the laser from the back side of the starting substrate. This makes is possible to provide a transfer device that can transfer the object with a minimal footprint and capital investment, and with high productivity.
The present invention is an ablation processing method for forming recesses in the surface of a substrate by ablation processing with the irradiation energy of a laser beam, wherein: an irradiation region in one shot of the laser beam on the substrate is made to be smaller than a to-be-processed region of the substrate, and the substrate is irradiated with a plurality of shots of the laser beam, thereby performing laser beam irradiation on the entire surface of the to-be-processed region of the substrate in the region to be processed; and in the plurality of shots of irradiation, a portion of the irradiation region in each shot is superimposed on the irradiation region of other shots in a first direction of the substrate and a second direction orthogonal to the first direction, such that recesses having a depth within a defined range are formed in the to-be-processed region of the substrate while moving the laser beam irradiation region relative to the substrate in the first direction and the second direction. The foregoing makes it possible to obtain recesses of the target depth with a simple procedure while avoiding film penetration caused by excessive processing.
The present invention provides a laser processing method for using a laser to form a recess and/or through-hole in a workpiece, wherein processing is performed while the laser intensity distribution on a surface to be processed of the workpiece has an irradiation shape where the intensity of a section on the outside of the intensity distribution is greater than the intensity of a section on the inside. This makes it possible to provide a laser processing method which can prevent a recess and/or through-hole to be formed from assuming a tapered shape, and by extension, can form a complex pattern with high definition, even when forming the recess and/or through-hole with high resolution.
A transfer apparatus includes the first plate-like member in which the micro structures are detachably held via the temporary adhesion layer, the second plate-like member having a sticky layer which faces the first plate-like member and is elastically deformable in a thickness direction, a pressure part which presses one of the first plate-like member and the second plate-like member toward another one of the first plate-like member and the second plate-like member in the thickness direction such that the temporary adhesion layer and the sticky layer become parallel to each other at least locally, a denaturing/peeling part which changes properties of the temporary adhesion layer such that an adhesive force of the temporary adhesion layer is reduced, and a controlling part which controls operations of the pressure part and the denaturing/peeling part.
The present invention is a laser lift-off method in which an object to be transferred is transferred from a first substrate provided with the object to be transferred to a second substrate using laser lift-off, wherein the laser lift-off method comprises a collective transfer step for collectively irradiating the interfaces between a plurality of the objects to be transferred and the first substrate with a laser, separating the plurality of objects to be transferred from the first substrate, and collectively transferring said objects to the second substrate. In the collective transfer step, only a portion of the interface between each of the plurality of the objects to be transferred and the first substrate is exposed to the laser. As a result, it is possible to provide a laser lift-off method capable of minimizing the incidence of damage to the objects to be transferred when said objects are transferred.
H01L 21/52 - Mounting semiconductor bodies in containers
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
H01L 21/50 - Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups or
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H01L 33/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof
24.
PROCESSING DEVICE, PROCESSING METHOD, AND SUBSTRATE MANUFACTURING METHOD
The present invention is a processing device for forming ruggedness on a substrate surface by ablation processing using a laser beam, the processing device including: a first optical function part comprising a shaping optical system that shapes the irradiation shape of a laser beam from a laser light source into a rectangular shape; a second optical function part comprising a mask that includes an active area having a pattern; and a substrate stage that holds a substrate. The mask includes a mask irradiation area which is a portion of the active area of the mask and is irradiated by a laser beam that has passed through the first optical function part. The substrate includes a substrate irradiation area onto which the pattern is projected by a laser beam that has passed through the mask. The substrate irradiation area is smaller than a to-be-processed region of the substrate. When the substrate is subjected to a processing operation, the mask and the substrate stage are subjected to sweep irradiation while superimposing a portion of the substrate irradiation area, and the to-be-processed region of the substrate is subjected to surface ruggedness processing. As a result, provided is a processing device capable of accurately performing fine ruggedness processing along a to-be-processed region of a substrate.
The present invention provides a film forming apparatus which is characterized by comprising: an atomizing means for producing a starting material mist by atomizing a starting material solution; a means for supplying a carrier gas that carries the starting material mist; a mist supply means for supplying a mixed gas, which is obtained by mixing the starting material mist with the carrier gas, to the surface of a base material; a stage on which the base material is placed; a heating means for heating the base material; and a gas discharge means which is directly or indirectly connected to the stage by piping. Consequently, the present invention provides: a film forming apparatus which is capable of stably forming a crystalline semiconductor film having good crystal orientation with high productivity; and a method for forming a crystalline semiconductor film.
H01L 21/365 - Deposition of semiconductor materials on a substrate, e.g. epitaxial growth using reduction or decomposition of a gaseous compound yielding a solid condensate, i.e. chemical deposition
H01L 21/368 - Deposition of semiconductor materials on a substrate, e.g. epitaxial growth using liquid deposition
26.
WORKPIECE SEPARATION DEVICE AND WORKPIECE SEPARATION METHOD
The present invention prevents smoke-like or soot-like decomposition products generated in denaturation of a separation layer associated with laser irradiation from adhering to the irradiating port. Provided is a workpiece separation device provided with: an optical system that emits laser light toward a separation layer; an optical path for the laser light traveling from the optical system toward a workpiece; and a partition part that is provided partway on the optical path, characterized in that the partition part has an gas flow layer that is formed between an irradiating port of the optical system and a denaturation space portion in which the separation layer is disposed.
The purpose of the present invention is to perform batch energization testing in a plurality of arranged semiconductor light-emitting elements regardless of any misalignment in individual electrodes to screen for semiconductor light-emitting elements having faulty energization. The present invention provides an energization testing device characterized in comprising: a retainer plate provided facing a plurality of semiconductor light-emitting elements in the thickness direction; a joining layer that is provided along the facing surface of the retainer plate and that is capable of elastically deforming in the thickness direction; a plurality of semiconductor light-emitting elements that are detachably held on the facing surface of the retainer plate with the joining layer interposed therebetween; an energizing jig that is provided facing the electrodes of the plurality of semiconductor light-emitting elements in the thickness direction; a drive unit that moves the retainer plate and/or the energizing jig closer to each other in the thickness direction; and a control unit that performs operation control of the energizing jig and the drive unit, the energizing jig having a plurality of electrically conductive parts projecting in the thickness direction toward the electrodes of the plurality of semiconductor light-emitting elements and an energizing test circuit unit to which the plurality of electrically conductive parts are electrically connected, and, in the control unit, the approaching movement of the drive unit applying thickness-direction pressure to the plurality of electrically conductive parts toward the electrodes of the plurality of electrically conductive parts and joining the electrodes of the plurality of semiconductor light-emitting elements and the plurality of electrically conductive parts, and the electrodes being energized from the plurality of electrically conductive parts due to the operation of the plurality of electrically conductive parts of the energizing jig and the energizing test circuit unit.
Provided are a device and a method capable of accurately bonding display substrates on each of which a display body component pattern is formed up to the vicinity of substrate ends without using special alignment marks, wiring, or the like. This display substrate bonding device bonds a first substrate on which a display body component pattern is formed up to the vicinity of substrate ends and a second substrate on which a display body component pattern is formed up to the vicinity of substrate ends, and is characterized by comprising an imaging means, an image recognition means, and an alignment adjustment means, the image recognition means calculating a first reference point of the first substrate and a second reference point of the second substrate from a feature of the first substrate and a feature of the second substrate, images of which are captured by the imaging means, and the alignment adjustment means performing preliminary processing in a state where the positions of the two substrates are displaced from each other in a planar direction so that the first reference point and the second reference point can be simultaneously viewed, and thereafter bonding the two substrates while completing alignment.
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
A workpiece-separating device includes: a holding member which detachably holds one of the workpiece and the supporting body; a laser irradiation part which irradiates the separating layer with the laser beam through the other of the supporting body and the workpiece of the laminated body being held by the holding member; and a controlling part which controls an operation of the laser irradiation part, wherein the laser irradiation part has a laser scanner which moves the spot like laser beam along the laminated body, an entire irradiated face of the separating layer in an area of the laser beam irradiated from the laser scanner toward the laminated body is divided into a plurality of irradiation areas each having a band shape that is elongated in one of two directions intersecting a light irradiation direction from the laser irradiation part.
B23K 26/57 - Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/268 - Bombardment with wave or particle radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
B23K 26/082 - Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
According to the present invention, regardless of plastic deformation such as the warping and recesses and protrusions of a first plate-like part, a micro structure is transferred from a temporary attachment layer to an adhesive layer of a second plate-like part without causing posture collapse. The present invention provides a transfer apparatus including a first plate-like part on which a micro structure is detachably held via a temporary attachment layer, a second plate-like part including an adhesive layer that faces the first plate-like part and is elastically deformable in a thickness direction, a pressing unit that presses one of the first plate-like part and the second plate-like part towards the other in the thickness direction such that the temporary attachment layer and the adhesive layer become at least locally parallel to each other, a modification separation unit that alters the temporary attachment layer to decrease the adhesion of the temporary attachment layer, and a controller that controls operations of the pressing unit and the modification separation unit. The transfer apparatus is characterized in that the controller performs control such that the surface of the micro structure is pressed by the pressing unit into the adhesive layer and the temporary attachment layer is altered by the modification separation unit in a state in which the surface of the micro structure is embedded in the adhesive layer.
H01L 21/50 - Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups or
H01L 21/52 - Mounting semiconductor bodies in containers
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
31.
WORKPIECE SEPARATION DEVICE AND WORKPIECE SEPARATION METHOD
The present invention reliably separates a support body from a workpiece by irradiating the entirety of an irradiation surface of a separation layer with a uniform laser light spot without being affected by a temporary decrease in output from a laser light source. This workpiece separation device is characterized by being provided with a laser irradiation unit for performing irradiation with laser light generated from a laser light source onto a separation layer of a laminate, a laser redirection unit for guiding laser light to a laser light discarding area, which is positioned offset from the optical path of laser light traveling toward the laminate from the laser light source via the laser irradiation unit, and a control unit for controlling the operations of the laser irradiation unit and the laser redirection unit, and is characterized in that the laser irradiation unit has a laser scanner that moves a laser light spot along the laminate and performs aligned irradiation in which irradiated laser light beams from the laser scanner toward the irradiation surface of the separation layer are arranged such that portions in the laser light spots overlap each other on a plane intersecting with this light irradiation direction, and that the control unit performs control such that before the start of irradiation of laser light from the laser scanner by starting the laser light source, laser light is guided to the laser light discarding area by the operation of the laser redirection unit, and then after the operation of the laser redirection unit, aligned irradiation is performed by the operation of the laser scanner so as to cover the entire irradiation surface with said aligned irradiation without leaving a portion unirradiated.
B23K 26/57 - Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
B23K 26/082 - Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
32.
WORKPIECE SEPARATION DEVICE AND WORKPIECE SEPARATION METHOD
The purpose of the present invention is to selectively irradiate a partial bonding site between a support body and a solidified layer with light and easily separate the support body from the solidified layer. The present invention comprises a holding member that detachably holds one of a workpiece side and a support body of a laminate, a light-radiating unit that irradiates a separation layer with light through the other of the support body and the workpiece side of the laminate, an isolation member that isolates and moves the other of the support body and the workpiece side of the laminate in the thickness direction with respect to the one of the workpiece side and the support body of the laminate, and a control unit that actuates and controls the light-radiating unit and the isolation member. The laminate has the separation layer, which is layered along the surface of the support body, and a solidified layer that is layered along the separation layer. The control unit performs a control such that total irradiation, in which the entire surface of the separation layer is irradiated with light by the light-radiating unit, and selective irradiation, in which only a bonding site between the surface of the support body and the solidified layer is partially irradiated with light, are performed.
The present invention presses a surface of a workpiece to smoothly peel off the surface of the workpiece from an adhesive surface of an adhesive part, with a relatively small deflection, even if the workpiece has a thin-plate shape, which is easily deformed. Provided is a workpiece adhesive chuck device characterized by including: a facing surface that is provided so as to be relatively movable in such a direction as to approach or separate from a thin-plate workpiece W; an adhesive part that is provided on the facing surface so as to face a surface of the workpiece; a plurality of peeling parts that are respectively provided on the facing surface at an inner side and an outer side of the adhesive part so as to be elastically deformable; a peeling drive unit that deforms the plurality of peeling parts so as to respectively protrude toward the workpiece; and a control unit that controls the operation of the peeling drive unit. The workpiece adhesive chuck device is characterized in that: the adhesive part has an adhesive surface that is formed in a ring shape or a frame shape and that adhesively holds the surface of the workpiece in a detachable manner through contact with the surface of the workpiece; the plurality of peeling parts have a plurality of pressing surfaces that are deformed so as to protrude toward a plurality of non-adhesive sections that are adjacent to each other in the surface of the workpiece with an adhered section adhesively held by the adhesive surface being sandwiched therebetween, to press the plurality of non-adhesive sections; and the control unit performs control such that a space section S1, which expands from both ends of the adhered section continuing from the plurality of non-adhesive sections, is formed between the adhesive surface and the adhered section through pressing of the plurality of pressing surfaces against the plurality of non-adhesive sections.
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
B29C 65/78 - Means for handling the parts to be joined, e.g. for making containers or hollow articles
Semiconductor substrates manufacturing machines; semiconductor manufacturing machines; electronic component feeder machines for processing electronic components of electronic circuits used in electronic circuit board manufacturing machines; machines for manufacturing electronic parts; mounting machines specifically adapted for mounting electronic components of light-emitting diodes (LEDs) during the manufacturing of semiconductor devices; power operated automatic mounting machines that automatically mount electronic parts, namely, integrated circuit chips, to printed wiring circuit boards; manufacturing machines for memory chips; manufacturing machines for laminated semiconductor chips; power operated machines that mount integrated circuit chips to circuit boards; transfer machines for semiconductor chips, namely, machines specifically adapted for transferring electronic components of light-emitting diodes (LEDs) from one substrate to another via laser beam; processing equipment for semiconductor wafer; laser processing machines for processing glass pieces; laser processing machines for processing plastics; laser processing machines for processing ceramics; laser processing machines for processing printed circuit boards; machines for processing printed circuit boards; laser processing machines for processing circuits or chips as parts of semi-conductors; semiconductor and printed circuit board manufacturing machines using laser; machines for peeling electronic components from substrate boards by irradiating the electronic components laminated on the substrate with laser; substrate restraining jig for semiconductor manufacturing machines; laser lift-off machines used for stripping chip parts; manufacturing equipment and machines used for the production of micro-LED displays; replacement parts for all of the aforementioned goods
Semiconductor substrates manufacturing machines; semiconductor manufacturing machines; electronic component feeder machines for processing electronic components of electronic circuits used in electronic circuit board manufacturing machines; machines for manufacturing electronic parts; mounting machines specifically adapted for mounting electronic components of light-emitting diodes (LEDs) during the manufacturing of semiconductor devices; power operated automatic mounting machines that automatically mount electronic parts, namely, integrated circuit chips, to printed wiring circuit boards; manufacturing machines for memory chips; manufacturing machines for laminated semiconductor chips; power operated machines that mount integrated circuit chips to circuit boards; transfer machines for semiconductor chips, namely, machines specifically adapted for transferring electronic components of light-emitting diodes (LEDs) from one substrate to another via laser beam; processing equipment for semiconductor wafer; laser processing machines for processing glass pieces; laser processing machines for processing plastics; laser processing machines for processing ceramics; laser processing machines for processing printed circuit boards; machines for processing printed circuit boards; laser processing machines for processing circuits or chips as parts of semi-conductors; semiconductor and printed circuit board manufacturing machines using laser; machines for peeling electronic components from substrate boards by irradiating the electronic components laminated on the substrate with laser; substrate restraining jig for semiconductor manufacturing machines; laser lift-off machines used for stripping chip parts; manufacturing equipment and machines used for the production of micro-LED displays; replacement parts for all of the aforementioned goods
The present invention separates a concavo-convex joining part between a first plate-shaped member and a second plate-shaped member without shape deformation. Provided is a separator that separates a concavo-convex joining part between a first plate-shaped member and a second plate-shaped member joined to each other in a concavo-convex shape. A separation absorbing part that is provided between a rear side of the concavo-convex joining part and a first indoor surface of a chamber in one of the first plate-shaped member and the second plate-shaped member accommodated in a pressurizing chamber formed inside the chamber has a displacement portion that contacts the first indoor surface of the chamber so as to be deformable and movable to a rear side and in a thickness direction of one of the first plate-shaped member and the second plate-shaped member. A retention part that is provided between a rear side of the concavo-convex joining part and a second indoor surface of the chamber in the other of the first plate-shaped member and the second plate-shaped member accommodated in the pressurizing chamber has a fixed portion that contacts the second indoor surface of the chamber so as not to be movable to a rear side and in a thickness direction of the other of the first plate-shaped member and the second plate-shaped member. A pressure difference is generated between a control part and an airtight first depressurizing space part that is provided between the first indoor surface and the separation absorbing part of the chamber due to an increase in an internal pressure of the pressurizing chamber accompanied by an operation of a positive pressure regulating part that supplies a positive pressure fluid to the pressurizing chamber, and one of the first plate-shaped member and the second plate-shaped member moves to the first depressurizing space part together with the displacement portion of the separation absorbing part.
The present invention performs reverse operations of joining or additional pressing of separated recessed and protruding portions and separation of joined recessed and protruding portions, through a change in control of the internal pressure difference. The present invention provides a microstructure manufacturing device characterized by comprising: a transformer room that is formed inside a chamber and in which a first plate-shaped member and a second plate-shaped member are accommodated so as to be freely put in and out; a variable part that is provided between a first non-opposing surface of the first plate-shaped member, which is accommodated in the transformer room, and a first indoor surface of the chamber; a holding part that is provided between a second non-opposing surface of the second plate-shaped member, which is accommodated in the transformer room, and a second indoor surface of the chamber; a first space that is provided in an airtight manner between the first indoor surface of the chamber and the variable part so as to be separated from the transformer room; a room-pressure adjustment unit that increases the internal pressure of one of the transformer room and the first space so as to be higher than the internal pressure of the other; and a control unit that controls the operation of the room-pressure adjustment unit. The microstructure manufacturing device is also characterized in that: the variable part has a displacement portion that abuts against the first non-opposing surface of the first plate-shaped member in such a manner as to be able to freely deform or move in the thickness direction thereof with respect to the first indoor surface of the chamber; the holding part has a holding portion that supports the second non-opposing surface of the second plate-shaped member with respect to the second indoor surface of the chamber; and the control unit performs a control such that the first plate-shaped member, together with the displacement portion of the variable part, moves toward the second plate-shaped member or the first space as a result of the pressure difference between the transformer room and the first space due to the operation of the room-pressure adjustment unit.
The present invention allows post-cleaning processing to proceed efficiently in parallel with immersion cleaning of a surface of a workpiece assembled into at least one or more puddle jigs. This workpiece cleaning device is characterized by comprising a puddle jig provided separably in the thickness direction of a workpiece and having an immersion liquid inlet, a setting mechanism for sandwiching the workpiece with the puddle jig in the thickness direction, and for assembling the puddle jig detachably with the inlet facing a surface of the workpiece, an immersion liquid supply mechanism for supplying an immersion liquid to the inlet of the puddle jig assembled into the puddle jig by the setting, and a post-cleaning processing mechanism for performing post-cleaning processing installed in a post-cleaning processing region formed separately from an immersion cleaning region in which the immersion liquid supply mechanism is installed, wherein the puddle jig includes a storage portion which allows the immersion liquid, being supplied from the immersion liquid supply mechanism to the inlet, to be stored in contact with the surface of the workpiece, at least one puddle jig with the storage portion being disposed in the immersion cleaning region.
A workpiece-separating device includes a holding member configured to detachably hold one of a workpiece or a supporting body of a laminated body and a light irradiation part configured to perform light irradiation on a separating layer, the holding member including: a stage facing one of the workpiece or the supporting body, a fixed supporting part projecting from the stage toward the laminated body and including a still suction pad immovable in a projection direction, and a movable supporting part projecting from the stage toward the laminated body and including a response suction pad that is movable in a projection direction and elastically deformable, a plurality of the fixed supporting parts and a plurality of the movable supporting parts disposed in a dispersed manner, and the plurality of response suction pads project toward the laminated body further than the plurality of still suction pads.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
40.
WORKPIECE SEPARATION DEVICE AND WORKPIECE SEPARATION METHOD
According to the present invention, even in the case of occurrence of an unreleased portion which results from no modification by a modification/release device, a workpiece is reliably released from a supporting body by breaking the unreleased portion. This workpiece separation device is characterized by comprising: a holding member that removably holds a workpiece; a release member that faces the outer edge of a temporary attachment layer disposed between the workpiece held by the holding member and a supporting body; a drive unit that moves the release member toward the outer edge of the temporary attachment layer; a separation member that pulls one of the workpiece or the supporting body away from the other in the thickness direction; and a control unit that controls movements of the drive unit and the separation member. The temporary attachment layer has an unreleased portion that occurs at the outer edge of the temporary attachment layer and that is not modified by a modification/release device. The release member has a breaking blade that abuts against at least a portion in the circumferential direction of the outer edge of the temporary attachment layer. The control unit is controlled such that the breaking blade of the release member breaks the unreleased portion due to movement of the drive unit, and performs control so as to separate, due to movement of the separation member, the workpiece from the supporting body at the unreleased portion that has been broken by the breaking blade.
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
41.
Workpiece-separating device and workpiece-separating method
A workpiece-separating device includes: a holding member that detachably holds a workpiece of a laminated body in which the workpiece that includes a circuit board and a supporting body through which laser beams pass are laminated with each other via a separating layer that peelably alters due to at least absorption of the laser beams; a light irradiation part that irradiates the laser beams toward the separating layer through the supporting body of the laminated body held by the holding member; a driving part that relatively moves a light irradiation position of irradiation from the light irradiation part with respect to the supporting body and the separating layer of the laminated body held by the holding member in at least a direction crossing a light irradiation direction of irradiation from the light irradiation part; and a controlling part that operates and controls the light irradiation part and the driving part.
B23K 26/082 - Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
B23K 26/0622 - Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
B23K 26/57 - Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
B23K 26/06 - Shaping the laser beam, e.g. by masks or multi-focusing
According to the present invention, spot-shaped laser light is radiated uniformly over an entire laminated body to detach a supporting body efficiently from the workpiece. The workpiece separating device is characterized by being provided with a holding member which detachably holds either the workpiece or the supporting body, a laser radiating unit for radiating laser light toward a separation layer, through the other of the supporting body and the workpiece of the laminated body that is being held by the holding member, and a control unit for controlling the operation of the laser radiating unit, wherein: the laser radiating unit includes a laser scanner for moving the spot-shaped laser light along the laminated body; in the region of the laser light radiated from the laser scanner toward the laminated body, the entire radiated surface of the separation layer is divided into a plurality of strip-shaped radiation regions that are elongated in either of two directions that intersect the direction of light radiation from the laser radiating unit, and the radiation from the laser scanner onto each divided radiation region is aligned radiation, arranged such that some of the spot-shaped laser light overlaps on a plane intersecting the direction of light radiation; and the control unit performs control such that aligned radiation is performed by means of the operation of the laser scanner with respect to one radiation region among the plurality of radiation regions, aligned radiation is performed with respect to the next radiation region after the entire one radiation region among the plurality of radiation regions has been filled without a gap by the aligned radiation, and, thereafter, aligned radiation is repeated in the same way for each radiation region, such that ultimately all the plurality of radiation regions have been subjected to aligned radiation.
B23K 26/082 - Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
B23K 26/57 - Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/268 - Bombardment with wave or particle radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
43.
Substrate processing apparatus and substrate processing method
According to one embodiment, a substrate processing apparatus and a substrate processing method that can improve the quality of substrates are provided. The substrate processing apparatus according to one embodiment includes: a table 20 configured to support a processing target W including a substrate W1, a ring W2 surrounding a surrounding of the substrate W1, and a dicing tape W3 adhered to a lower surface of the substrate W1 and a lower surface of the ring W2, and a liquid supplier 50 configured to eject a liquid which does not mix with a processing liquid for processing the substrate W1 and which has a specific gravity heavier than the processing liquid to one of an upper surface of the ring W2 of the processing target W supported by the table 20 rotating by the rotation mechanism 30, an outer circumference end portion of the substrate W1 of the processing target W supported by the table 20 rotating by the rotation mechanism 30, and between the substrate W1 and the ring W2 of the processing target W supported by the table 20 rotating by the rotation mechanism in accordance with a rotation number of the table 20 to supply the liquid between the substrate W1 and the ring W2 of the processing target W.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
44.
Workpiece-separating device and workpiece-separating method
A workpiece-separating device includes: a holding member that detachably holds a workpiece among a layered body in which the workpiece that includes a circuit board and a supporting body that allows laser beams to pass therethrough are layered with each other via a separating layer that peelably alters with absorption of the laser beams; a laser irradiation part that performs irradiation of Gaussian beams pulse-oscillated as the laser beams toward the separating layer through the supporting body of the layered body held by the holding member; and a controlling part that controls an operation of the laser irradiation part, wherein the controlling part controls a distance between centers of the adjacent Gaussian beams of the laser beams pulse-oscillated from the laser irradiation part to be less than three times of a standard deviation when a relationship between a beam diameter and irradiation intensity is assumed as a normal distribution.
H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
B23K 26/04 - Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
H01L 21/268 - Bombardment with wave or particle radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
B23K 26/57 - Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
45.
WORKPIECE SEPARATION DEVICE AND WORKPIECE SEPARATION METHOD
In order to uniformly irradiate a separation layer of a laminate, this workpiece separation device is characterized in that a laminate, in which a workpiece including a circuit board and a supporter that transmits a laser beam are laminated via a separation layer that degenerates to be peelable by absorbing the laser beam, is provided with a holding member that holds the workpiece in an attachable/detachable manner, a laser irradiation unit that irradiates the separation layer with Gaussian beams pulse-generated as the laser beam by passing through a support body of the laminate held by the holding member; and a control unit that controls the operation of the laser irradiation unit, wherein the intervals between the centers of the adjacent Gaussian beams are controlled to be smaller than three times the standard deviation when the relationship between the beam diameters and the irradiation intensity in the beam profile of the Gaussian beams is assumed as a normal distribution.
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
B23K 26/04 - Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
B23K 26/57 - Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
46.
WORKPIECE SEPARATION DEVICE AND WORKPIECE SEPARATION METHOD
The purpose of the present invention is to easily peel a support body off a workpiece by irradiating the support body with uniform laser light regardless of the size of a laminated body and the thickness of the workpiece. The present invention is provided with: a holding member for attachably/detachably holding a workpiece in a laminated body in which the workpiece, including a circuit board, and a support body that transmits laser light are laminated with a separation layer interposed therebetween, said separation layer becoming peelable at least by absorbing laser light; a light radiation unit for radiating laser light towards the separation layer through the support body of the laminated body held by the holding member; a drive unit for relatively moving, at least in a direction intersecting the direction of light radiated from the light radiation unit, the position of light that is radiated from the light radiation unit to the support body and the separation layer of the laminated body held by the holding member; and a control unit for controlling the operation of the light radiation unit and the drive unit. The entire radiation surface of the separation layer irradiated with light from the light radiation unit is partitioned into a plurality of radiation areas. The control unit performs control so that laser light from the light radiation unit is radiated on each of the plurality of radiation areas at a time by moving, by means of the drive unit, the laser light relative to the plurality of radiation areas, thus eventually irradiating all of the plurality of radiation areas.
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
B23K 26/082 - Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
B23K 26/57 - Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
47.
WORKPIECE SEPARATION DEVICE AND WORKPIECE SEPARATION METHOD
The purpose of the present invention is to easily peel a support body off a workpiece by irradiating the support body with uniform laser light regardless of the size of a laminated body and the thickness of the workpiece. A workpiece separation device according to the present invention is characterized in that: the workpiece separation device is provided with a holding member for attachably/detachably holding a workpiece in a laminated body in which the workpiece, including a circuit board, and a support body that transmits laser light are laminated with a separation layer interposed therebetween, said separation layer becoming peelable at least by absorbing laser light, a light radiation unit for radiating laser light towards the separation layer through the support body of the laminated body held by the holding member, a drive unit for relatively moving, at least in a direction intersecting the direction of light radiated from the light radiation unit, the position of light that is radiated from the light radiation unit to the support body and the separation layer of the laminated body held by the holding member, and a control unit for controlling the operation of the light radiation unit and the drive unit; the light radiation unit has a laser scanner for moving the optical axis of spot-shaped laser light generated by a light source comprising a laser oscillator and is configured to sweep relative to the laminated body; the entire radiation surface of the separation layer irradiated with light from the light radiation unit is partitioned into a plurality of radiation areas; and the control unit performs control so that one radiation area of the plurality of radiation areas is filled entirely with many beams of laser light without a gap by arranging, at least through the operation of the laser scanner, radiation of laser light from the light radiation unit to the one radiation area of the plurality of radiation areas in two directions intersecting the light radiation direction, and thereafter irradiating the next radiation area with laser light is repeated in the same manner, thus eventually irradiating all of the plurality of radiation areas.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
B23K 26/08 - Devices involving relative movement between laser beam and workpiece
B23K 26/082 - Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
B23K 26/57 - Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
The purpose of the present invention is to inhibit entry of a gas and a fine resin component into a space between a workpiece and a holding part of a first moulding die, while the workpiece is being held by the holding part of the first moulding die. The present invention is provided with: a first moulding die provided with a holding part for a workpiece having semiconductor elements mounted thereto; a second moulding die which faces a placement surface of the workpiece held on the holding part of the first moulding die, said placement surface having the semiconductor elements mounted thereto, and which is provided with a cavity to which an uncured resin is supplied; a closed chamber which can be opened and closed, and which is formed between the first moulding die and the second moulding die; a drive unit which causes the first moulding die and/or the second moulding die to move towards each other relatively in the direction in which the first moulding die and the second moulding die face each other; a pressure adjustment unit which discharges or supplies air between the closed chamber and an external space, to adjust the internal pressure from ambient atmosphere to a reduced pressure atmosphere having a prescribed degree of vacuum; and a control unit which operates and controls the drive unit and the pressure adjustment unit. The holding part of the first moulding die is provided with a smooth surface which is in surface contact with a non-placement surface of the workpiece at the opposite side to the placement surface. The control unit implements control such that the placement surface of the workpiece and the semiconductor elements are immersed in the uncured resin in the cavity by the drive unit while the pressure of the closed chamber is in a state of having been reduced by the pressure adjustment unit, and a moulded article is formed by curing the uncured resin.
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
The purpose of the present invention is to inhibit the entry of a foaming gas and a fine resin component into a space between a workpiece and a holding part of a first moulding die, while the workpiece is being held by the holding part of the first moulding die. The present invention is provided with: a first moulding die provided with a holding part for a workpiece having semiconductor elements mounted thereto; a second moulding die which is provided facing a placement surface of the workpiece held on the holding part of the first moulding die, said placement surface having the semiconductor elements mounted thereto, and which is provided with a cavity to which an uncured resin is supplied; a closed chamber which can be opened and closed, and which is formed between the first moulding die and the second moulding die; a drive unit which causes the first moulding die and/or the second moulding die to move towards each other relatively in the direction in which the first moulding die and the second moulding die face each other; a pressure adjustment unit which discharges or supplies air between the closed chamber and an external space, to adjust the internal pressure from ambient atmosphere to a reduced pressure atmosphere having a prescribed degree of vacuum; and a control unit which operates and controls the drive unit and the pressure adjustment unit. The holding part of the first moulding die is provided with a smooth surface which faces a non-placement surface of the workpiece at the opposite side to the placement surface. The smooth surface comprises a material which is capable of elastic deformation, and elastically deforms into a recessed shape along the non-placement surface, while the non-placement surface of the workpiece is in a state of being held by the smooth surface. The control unit implements control such that the placement surface of the workpiece and the semiconductor elements are immersed in the uncured resin in the cavity by the drive unit while the pressure of the closed chamber is in a state of having been reduced by the pressure adjustment unit, and a moulded article is formed by curing the uncured resin.
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
The present invention stably molds in a manner such that pressure from a plunger compresses uncured resin without the resin penetrating to the plunger side and without producing internal air bubbles (voids). The present invention is equipped with: a first molding die having a pressing section for a workpiece having a semiconductor element mounted thereon; a second molding die having a cavity to which uncured resin is supplied and provided so as to face the workpiece mounting surface on which the semiconductor element is mounted; an openable/closable sealed chamber formed between the first molding die and the second molding die; a drive unit for moving the first molding die and/or the second molding die in a manner such that the first and second molding dies become closer relative to one another in the direction in which the dies face one another; a pressurization mechanism having a plunger for applying pressure to the uncured resin inside the cavity in the sealed chamber; and a control unit for controlling the operation of the drive unit and the plunger. Therein, the pressurization mechanism has an uncured resin overflow channel provided so as to be continuous with the cavity inside the sealed chamber, a plunger provided so as to be capable of moving and projecting toward the overflow channel, and a deformable separation part provided between the plunger and the uncured resin inside the overflow channel. Furthermore, the control unit controls the drive unit so as to immerse the workpiece mounting surface and semiconductor element in the uncured resin inside the cavity, and while in a state where the uncured resin in the cavity flows into the overflow channel in response to the immersion, causes the plunger to move and project into the overflow channel via the separation part.
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
B29C 43/34 - Feeding the material to the mould or the compression means
B29C 43/36 - Moulds for making articles of definite length, i.e. discrete articles
In order to accommodate various molded article type changes by merely exchanging a second molding die, the present invention is equipped with: a first molding die having a pressing section for a workpiece having a semiconductor element mounted thereon; a second molding die having a cavity to which an uncured resin is supplied and provided so as to face the workpiece mounting surface on which the semiconductor element is mounted; an openable/closable sealing chamber formed between the first molding die and the second molding die; a drive unit for moving the first molding die and/or the second molding die in a manner such that the first and second molding dies become closer relative to one another in the direction in which the dies face one another; a pressurization mechanism having a plunger for applying pressure to the uncured resin inside the cavity in the sealed chamber; and a control unit for controlling the operation of the drive unit and the plunger. Therein, the pressurization mechanism has an uncured resin overflow channel provided in the second molding die inside the sealed chamber so as to be continuous with the cavity, and a plunger provided in the second molding die so as to be capable of moving and projecting toward the overflow channel. The first molding die has a first covering section provided so as to face the cavity, a second covering section provided so as to face the overflow channel, and a third covering section provided so as to face the plunger. The first covering section, the second covering section, and the third covering section are continuously formed with one another. The control unit controls the drive unit so as to immerse the workpiece mounting surface and the semiconductor element in the uncured resin inside the cavity, by moving the first and second molding dies so as to approach one another, and while in a state where the uncured resin inside the cavity has flowed into the overflow channel in response to the immersion, causes the plunger to move and project into the overflow channel toward the third covering section.
The purpose of the present invention is to resin-seal a workpiece while the workpiece is being adhesively held securely in a high-vacuum state of not more than about 100 Pa. A resin-sealing device is provided with: a first molding mold including a holding surface for a workpiece on which a semiconductor element is mounted; a second molding mold including a cavity into which uncured resin is supplied, the cavity facing a mounting surface of the workpiece, being held on the holding surface of the first molding mold, on which the semiconductor element is mounted; a openable and closable depressurization chamber formed between the first molding mold and the second molding mold; a drive unit which causes one or both of the first molding mold and the second molding mold to move relatively closer to one another in the opposing direction of the first molding mold and the second molding mold so as to form the depressurization chamber; a pressure adjustment unit which performs an internal pressure adjustment from atmospheric atmosphere to a depressurized atmosphere having a predetermined vacuum degree by evacuating or supplying air into the depressurization chamber and an external space; and a control unit which controls the operation of the drive unit and the pressure adjustment unit. The holding surface of the first molding mold includes an adhesive portion which is in detachable contact with a non-mounting surface on the opposite side from the workpiece mounting surface. The control unit implements a control such that, in a state in which the depressurization chamber has been evacuated to a high vacuum of about 100 Pa or less by the pressure adjustment unit, the workpiece mounting surface is dipped in the uncured resin in the cavity by the drive unit.
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
B29C 33/18 - Moulds or coresDetails thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels against the mould wall using vacuum
A positional deviation between a first workpiece and a second workpiece due to a change in gas pressure and a change in temperature in a bonding space is prevented. A vacuum bonding apparatus is provided with: a first holding member having a first workpiece holding surface for a first workpiece; a second holding member facing the first workpiece holding surface across a bonding space and having a second workpiece holding surface for a second workpiece; a separation drive section that causes one or both of the first holding member and the second holding member to relatively move toward each other; a room pressure regulation section that discharges gas from the bonding space to an external space to regulate the bonding space from an ambient atmosphere to a depressurized atmosphere; and a control section that operates and controls the separation drive section and the room pressure regulation section. One or both of the first workpiece holding surface and the second workpiece holding surface have a plurality of convex parts formed to face and detachably contact non-bonding surfaces of one or both of the first workpiece and the second workpiece, and a plurality of concave groove parts formed adjacent to the plurality of convex parts to face the non-bonding surfaces. The plurality of convex parts and the plurality of concave groove parts are disposed in an arrangement that has isotropy in directions in which the plurality of convex parts and the plurality of concave groove parts intersect each other on the non-bonding surfaces throughout one or both of the first workpiece holding surface and the second workpiece holding surface. In a state in which the non-bonding surfaces are in contact with the plurality of convex parts, the plurality of concave groove parts serve as ventilation paths through which the bonding space and the external space communicate with each other. The control section performs control to cause gas to flow in a similar manner in each intersecting direction on the non-bonding surfaces through the ventilation paths when the bonding space is depressurized and opened to the ambient atmosphere by the room pressure regulation section.
B32B 37/10 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using direct action of vacuum or fluid pressure
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
The abrasion of a first workpiece holding surface and a second workpiece holding surface with time is prevented, while the contact areas of the first workpiece holding surface and the second workpiece holding surface with respect to a workpiece are minimized. The present invention pertains to an apparatus for manufacturing a lamination device in which a pair of workpieces is held by a first holding member and a second holding member, respectively, and is positioned and laminated to each other by the relative approaching movements between the first holding member and the second holding member, wherein one of or both the first workpiece holding surface of the first holding member and the second workpiece holding surface of the second holding member are provided with a hard covering layer opposed to one of or both the pair of workpieces and having a front surface thereof formed in a concavo-convex shape by a material harder than those of the first holding member, the second holding member, and the pair of workpieces, and the hard covering layer has a plurality of supporting projections projecting from one of or both the first workpiece holding surface and the second workpiece holding surface toward one of or both the pair of workpieces in a chevron shape and brought into point-contact with one of or both smooth surfaces of the pair of workpieces.
B32B 37/10 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using direct action of vacuum or fluid pressure
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
55.
Method of producing polishing head and polishing apparatus
A method of producing a polishing head including: a backing pad, for holding a workpiece back surface, stuck on a lower portion of a rigid body; and a ring template, for holding a workpiece edge, disposed on a lower surface of the backing pad. This polishing head brings a front surface of the workpiece into sliding contact with a polishing pad attached on a turn table while holding the workpiece back surface on the lower surface of the backing pad. The method includes sticking the backing pad on the lower portion of the rigid body with a double-sided tape under a reduced pressure without heating; and sticking the template on the backing pad with a double-sided tape or a liquid or paste reaction curable adhesive containing no solvent under a reduced pressure without heating. This method can polish the workpiece into a very flat workpiece.
Provided is a sealing structure wherein a sealing member is not used between a pressure chamber or through holes and a delivery member, and the delivery member can be moved contactlessly without limit. When a workpiece is brought into a pressure chamber (1), a control unit (7) opens a closing member (6) so as to open through holes (12) in the pressure chamber (1), thereby making a delivery member (5) movable. Either or both of a first workpiece (W1) and a second workpiece (W2) are received by the delivery member (5) and delivered from the delivery member (5) to either or both of a first holding member (2) and a second holding member (3). Thereafter, the control unit withdraws the delivery member (5) from the through holes (12) in the pressure chamber (1) and then closes the closing member (6) so as to close the through holes (12) airtight. Thus, pressure can be reduced in the pressure chamber (1) to a high degree of vacuum state, and the first workpiece (W1) and the second workpiece (W2) are bonded.
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
57.
PHOTO-ALIGNMENT IRRADIATION DEVICE AND METHOD FOR ADJUSTING APERTURE OF PHOTO-ALIGNMENT IRRADIATION DEVICE
[Problem] To measure the integrated amount of light emitted through an aperture in a photo-alignment irradiation device equipped with a partially-shielding member for adjusting the blocked amount of light emitted through the aperture to determine the amount of light blocked by the partially-shielding member. [Solution] A photo-alignment irradiation device according to the present invention is characterized by performing alignment processing during which a substrate is irradiated with polarized light emitted through the aperture while a scanning unit moves a polarized light irradiation unit and a stage relative to each other, and measurement processing during which a photosensor receives the polarized light emitted through the aperture at each position of the partially-shielding member while the scanning unit moves the stage and the polarized light irradiation unit relative to each other, and the integrated amount of light is measured by temporally integrating illuminance measured by the photosensor.
The purpose of a manufacturing method for a bonded device according to the present invention is to control the extension of the outer periphery of an adhesive sandwiched between a first substrate and a second substrate and fill the entirety of the inside of a display area with the adhesive. After a first substrate (1), second substrate (2), or both are supplied with an adhesive (3) such that the adhesive (3) is disposed within a display area (D), in the periphery (3a) of the adhesive (3), a filled portion (3b) excluding a specific portion (3a′) is semi-cured such that the viscosity thereof is higher than the viscosity of other portions while the adhesiveness thereof is maintained. Thereafter, the first substrate (1) and second substrate (2) are caused to overlap so that the adhesive (3) is sandwiched therebetween, and the resulting capillary action, natural flow, or pressurized flow occurring between the first substrate (1) and second substrate (2) causes the specific portion (3a′), which is not semi-cured, in the periphery (3a) of the adhesive (3) to extend toward an unfilled area (D1) further to the outside than the periphery (3a) of the adhesive (3) and spread throughout the entirety of the inside of the display area (D).
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
59.
METHOD FOR MANUFACTURING POLISHING HEAD, AND POLISHING DEVICE
The present invention is a method for manufacturing a polishing head provided with: a backing pad for holding the reverse surface of a workpiece, the backing pad being affixed to the lower part of a rigid body; and a ring-shaped template for holding an edge part of the workpiece on the lower surface of the backing pad; the polishing head bringing the obverse surface of the workpiece into sliding contact with an abrasive cloth adhered on a surface plate, and polishing the obverse surface of the workpiece, while holding the reverse surface of the workpiece on the lower surface of the backing pad. The method for manufacturing a polishing head is characterized in having: a backing pad affixing step for affixing the backing pad onto the lower part of the rigid body using a double-sided tape under reduced pressure without heating the backing pad; and a template affixing step for affixing, after the backing pad affixing step, the template onto the backing pad using a double-sided tape or a reaction-curing solvent-free liquid or paste adhesive under reduced pressure without heating the template. A method for manufacturing a polishing head capable of polishing a workpiece having a high degree of flatness is thereby provided.
The purpose of the present invention is to easily and surely separate a plate-like workpiece that has been subjected to adhesive separation in vacuum, from a separation part in atmosphere ambient air. Separation parts (2) are elastically deformed in vacuum ambient air to protrude toward a plate-like workpiece (W) held by adhesion by an adhesion part (1), so that pressing surfaces (2a) are brought into contact with a surface (W1) of the plate-like workpiece (W), whereby the plate-like workpiece (W) is separated from the adhesion part (1). Thereafter, while the pressing surfaces (2a) of the separation parts (2) remain in contact with the surface (W1) of the plate-like workpiece (W), peripheries of the plate-like workpiece (W) are made open to atmosphere, whereby air flows through flow paths (2p) from an outer space (S2) to an inner space (S1) of the separation parts (2). Consequently, vacuum break occurs between the inner space (S1) of the separation parts (2) and the plate-like workpiece (W).
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
The purpose of the present invention is to drive a rotor in a contactless state without core deviation. A plurality of metal bellows (11, 11') having accordion-shaped sections (11a, 11a') are disposed concentrically one inside the other an expansion/contraction section (10), the inner peripheral ends (11b, 11b') and the outer peripheral ends (11c, 11c') of the accordion-shaped sections (11a, 11a') of the metal bellows (11, 11') are fixed by the expansion/contraction deformation of the metal bellows (11, 11'). The entirety of the expansion/contraction section (10) does not deform at all in the X,Y or θ direction other than the direction of expansion/contraction deformation (the Z direction), and thus a rotor (40) disposed across one end of the metal bellows (11, 11') with a rising/falling section (20) interposed therebetween can move reciprocally, without core deviation, in the X, Y and θ directions other than the direction of expansion/contraction deformation (the Z direction) within the central space (12) of the expansion/contraction section (10) and a through-hole (31) in a base section (30).
F15B 15/10 - Fluid-actuated devices for displacing a member from one position to anotherGearing associated therewith characterised by the construction of the motor unit the motor being of diaphragm type
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
62.
MANUFACTURING METHOD FOR DISPLAY DEVICE AND MANUFACTURING APPARATUS THEREFOR
The purpose of the invention is to add a function over substantially the entire surface of a large plate-shaped workpiece without any gaps by an imprinting method even with a mold member having a relatively small area. An indented pattern (2a) formed in a size corresponding to a positive integer multiple of the size of a pixel (B1) of a display device (B) is transferred by the imprinting method to a predetermined position on a transfer surface (1a) of a plate-shaped workpiece (1), and this transfer is repeatedly performed over substantially the entire transfer surface (1a) such that the transfers border each other. Consequently, since the positions of the indented pattern (2a) transferred by the imprinting method are disposed in the block areas of pixels (B1) and the boundaries of functional indented parts (1e) in adjacent unit transfer blocks are disposed at the block boundaries (B2) of pixels (B1), a great number of functional indented parts (1e) are consecutively formed over the entire transfer surface (1a) irrespective of the size of the plate-shaped workpiece (1).
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
A photo-orienting illumination device comprising: a polarizing means (3) comprising a plurality of unit polarizers (31a-f) arranged adjacent in the adjacency direction; and a scanning means that scans in a prescribed scanning direction ultraviolet rays from a polarized light irradiation means (2) on to a substrate (9) mounted on a stage (4), by moving at least either the stage (4) or the polarized light irradiation means (2). The photo-orienting illumination device has good orienting characteristics as a result of the adjacent surfaces of the unit polarizers (31a-f) and the adjacency direction of the unit polarizers (31a-f) being inclined relative to the scanning direction.
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
A photo-orienting illumination device having good orienting characteristics and comprising: a polarizing means (3) comprising a plurality of unit polarizers (31a-f) arranged adjacent in the adjacency direction; a scanning means that scans in a prescribed scanning direction ultraviolet rays from a polarized light irradiation means (2) on to a substrate (9) mounted on a stage (4), by moving at least either the stage (4) or the polarized light irradiation means (2); and polarizing direction detection means (6a-f) that enable the detection, for each unit polarizer (31a-f), of the polarizing direction of the ultraviolet light emitted from the unit polarizers (31a-f).
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
In the present invention, wafers are placed in a transport tray and transported, and without being transferred the wafers are bonded to one another. A transport tray (1) that holds either a first wafer (W1) or a second wafer (W2) on an inner plate (1a) is conveyed to a bonding position (P1) on a substrate assembly line, and at the bonding position (P1), the transport tray is made to face the remaining first wafer (W1) or second wafer (W2) and the pressing force applied by a press unit (B) bonds the first wafer (W1) and the second wafer (W2) to one another. While a wafer set (W) constituted by the bonded first wafer (W1) and second wafer (W2) is held in the inner plate (1a), the transport tray (1) is taken out of the bonding position (P1).
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
B65G 49/06 - Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
66.
THIN PLATE-SHAPED WORKPIECE ADHESION AND RETENTION METHOD, THIN PLATE-SHAPED WORKPIECE ADHESION AND RETENTION DEVICE, AND MANUFACTURING SYSTEM
The present invention adheres and retains a thin plate-shaped workpiece and corrects any bending under the weight of the workpiece itself, without damaging the workpiece. In a thin plate-shaped workpiece (W) of which part is supported by a lattice-shaped support member (1), an adhesion means (2) is moved so as to approach, in a direction which intersects with the thin plate-shaped workpiece (W), a non-supported portion (W1) which has bent and deformed downward due to the weight of the workpiece itself, and part of an adhesion surface (2a) of the adhesion means (2) is brought into contact with the non-supported portion (W1). Then, the adhesion surface (2a) is moved so as to gradually increase the contact area between the adhesion surface (2a) and the non-supported portion (W1). Thus, the adhesion surface (2a) is gradually brought into contact, over a staggered time period and in a partial manner in keeping with the bending of the non-supported portion (W1) under the weight of the workpiece itself, and as this happens the external load on the thin plate-shaped workpiece is suppressed to an extremely low level, and approximately the entirety of the adhesion surface (2a) is brought into contact with, adhered to and retained against the non-supported portion (W1). Then, the adhesion means (2) is moved in the opposite direction to the abovementioned approaching direction, up until a position in which the adhesion surface (2a) is in the same plane as a supported portion (W2) in the thin plate-shaped workpiece, which is supported by a support member (1). Thus, bending, under the weight of the workpiece itself, in the non-supported portion (W1) is reduced, and the entire thin plate-shaped workpiece is adhered and retained in a planar shape.
B65G 49/06 - Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 51/50 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
H05B 33/10 - Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
67.
APPARATUS FOR BONDING WORK PIECES, AND PRESS-CURING APPARATUS
This apparatus for bonding work pieces uniformly pressurizes the whole board-like work pieces with a simple structure, irrespective of the size of the board-like work pieces. A plurality of pressing films (1) dispersedly disposed to face board-like work pieces (W) are deformed to protrude by means of pressure of a fluid, thereby, by means of leading edge portions (1a), pressing a pressure equalizing plate (2) in the direction, in which the board-like work pieces (W) are brought close to each other. Irrespective of whether or not a pressure equalizing plate (2) portion is a contact portion or non-contact portion with the leading edge portions (1a) of the pressing films (1), one whole board-like work piece (W) is pressurized in parallel by means of the smooth surface (2a) of the pressure equalizing plate using rigidity of the pressure equalizing plate (2), conforming to the shape of the other work piece (W) with a seal member (S) therebetween.
B30B 15/34 - Heating or cooling presses or parts thereof
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
68.
PHOTO-ALIGNMENT EXPOSURE APPARATUS AND PHOTO-ALIGNMENT EXPOSURE METHOD
[PROBLEM] To provide a photo-alignment exposure apparatus and a photo-alignment exposure method, whereby an alignment film having excellent characteristics can be formed. [SOLUTION] A photo-alignment exposure apparatus (1) of the present invention is characterized in being provided with: a radiation optical system (11), which includes a polarization light radiating means (12) and a polarization control element (14), and which radiates a beam to a substrate (2) having an alignment film on the surface; and a scanning means (15), which moves at least the substrate (2) or a part of the radiation optical system (11), and scans the substrate (2) in the predetermined scanning direction with the beam. The photo-alignment exposure apparatus is also characterized in that the polarization light radiating means (12) outputs linear polarization light to the polarization control element (14), the polarization control element (14) has unit polarization control regions disposed in the direction that orthogonally intersects the scanning direction, and the polarization direction of the beam radiated from the unit polarization control regions periodically changes by the predetermined number of unit polarization control regions, and within the period, the polarization direction is substantially symmetric with respect to the flat surface that is parallel to the scanning direction and is substantially symmetric with respect to the flat surface that orthogonally intersects the substrate.
An electro-optical panel and a substrate are bonded in a completely bubble-free state and with a uniform gap. First, opposing surfaces (1A,2A) of the electro-optical panel (1) and the substrate (2) are positioned on each other in direction Z so as to sandwich a liquid adhesive (3) in a vacuum atmosphere. Then, by causing the liquid adhesive (3) to naturally extend between the electro-optical panel (1) and the substrate (2), localized vacuums in the liquid adhesive (3) are eliminated, and the layer thickness of the liquid adhesive (3) becomes substantially uniform in the direction Z throughout the opposing surfaces (1A,2A) of the electro-optical panel (1) and the substrate (2). Thereafter, either one of the elecro-optical panel (1) or the substrate (2) is positioned by mutually sliding in direction XYθ with respect to another in an atmosphere. This process of positioning may comprise only causing either one of the electro-optical panel (1) or the substrate (2) to smoothly glide along the interface of the liquid adhesive (3), and, since pressure is not applied, the liquid adhesive (3) is not subject to flow deformation and does not trap air.
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
C09J 5/00 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
70.
STUCK DEVICE, METHOD FOR MANUFACTURING SAME, AND STICKING APPARATUS FOR STUCK DEVICE
Disclosed is a stuck device wherein a first board and a second board are reliably stuck together with a two-liquid mixing and curing-type adhesive obtained by mixing a main liquid adhesive and a second liquid adhesive at a predetermined rate. As the first board (1) and the second board (2) are stuck together, fine dots of the main liquid adhesive (3a) and the second liquid adhesive (3b) arranged dispersed on the facing surfaces (1a, 2a) of the first board (1) and the second board (2) respectively extend, the interfaces thereof coming into contact with each other to interconnect. This forms between the first board (1) and the second board (2) a continuous layer of two-liquid mixed portion (3c) wherein the main liquid adhesive (3a) and the second liquid adhesive (3b) are mixed at the predetermined rate. Therefore, the two-liquid mixed portion (3c) starts curing, sticking the facing surfaces (1a, 2a) of the first board (1) and the second board (2) together.
B29C 65/54 - Applying the adhesive between pre-assembled parts
C09J 5/04 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers involving separate application of adhesive ingredients to the different surfaces to be joined
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
71.
LAMINATE STRUCTURE, PROCESS FOR PRODUCING SAME, AND WORK-LAMINATING DEVICE
Hardening of a primary liquid ingredient and a secondary liquid ingredient which have been discontinuously disposed on platy works is initiated by merely stacking the platy works. The opposed surfaces are thereby bonded to each other without fail. Two platy works (1 and 2) are stacked, whereby a primary liquid ingredient (3a) and a secondary liquid ingredient (3b) which have been dispersedly disposed are spread and connected to each other to form a two-liquid mixed part (3c). The primary liquid ingredient (3a) and secondary liquid ingredient (3b) which have mixed begin to harden, whereby the opposed surfaces (1a and 2a) of the platy works (1 and 2) are bonded.
B29C 65/54 - Applying the adhesive between pre-assembled parts
C09J 5/00 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
Provided is a work transfer apparatus by which a board-like work is easily transferred to and from a work transfer means only by partially sliding and bending a flexible sheet. The work transfer apparatus is provided with a pressing means (4) which presses a part of a flexible sheet (2) arranged on a work holding table (5b, 8) toward board-like works (A, B), and a control means (6), which controls operation so that the flexible sheet (2) is pressed by the pressing means (4) to be partially slid and bent, and that a slid and bent portion (2b) reaches the board-like works (A, B) transferred by means of the work transfer means (3). Thus, at the time of carrying in the work, the partially slid and bent portion (2b) of the flexible sheet (2) abuts to at least the board-like work (B) carried in by the work transfer means (3), and the board-like works are permitted to be received. At the time of carrying out the work, bonded board-like works (A, B) are pushed and transferred to a work carry-out start position of the work transfer means (3) by means of the partially slid and bent portion (2b) and the board-like works are permitted to be carried out.
B65G 49/06 - Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
A flexible sheet is expanded while holding a predetermined shape. In a first space (S1) formed on the back of a flexible sheet (1), a gas supply means (3) for supplying a gas toward the flexible sheet (1) and a ventilation member (4) arranged between the flexible sheet (1) and the gas supply means (3) to cover the entire surface of the flexible sheet (1) are provided. Since the ventilation member (4) is provided with a pressure distribution means (4a) for distributing and passing through the gas from the gas supply means (3), the gas from the gas supply means (3) is distributed at a preset ratio when the gas passes through the pressure distribution means (4a) of the ventilation member (4), even if the gas is partially non uniformly supplied from the gas supply means (3) toward the ventilation member (4), and a pressure based on such passing ratio acts on each position of the flexible sheet (1) to cause expansion and deformation of the flexible sheet.
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
74.
POLISHING HEAD, AND POLISHING DEVICE AND POLISHING METHOD
The invention discloses a polishing head for holding a workpiece when said workpiece is to be polished by rubbing it against polishing cloths adhered to surface plates, said polishing head being characterized by possessing at least a carrier to hold the aforementioned workpiece, a first pressure-regulating mechanism to press the outside periphery of said carrier, and a second pressure-regulating mechanism to press the center of said carrier, whereby the aforementioned first pressure-regulating mechanism and the aforementioned second pressure-regulating mechanism can each press the aforementioned carrier independently. Thus, when the aforementioned workpiece is polished by rubbing it against the aforementioned polishing cloths, said carrier can vary the pressure against the aforementioned workpiece at the inside and outside within the plane of said carrier, and the aforementioned wafer can be rubbed against the aforementioned polishing cloths with different pressures at the inside and outside within the plane of said wafer. Thus, a polishing head is provided with which the overall shape of the workpiece can be freely controlled by polishing.
The surface potential of work adsorption plane is suppressed to a safety level. A combination of voltages of mutually different polarities are applied to first electrode part (1) and second electrode part (2) so as to eliminate any surface potential imbalance attributed to an areal asymmetry between these electrode parts (1,2), thereby avoiding any bias of work absorption plane (4) toward the potential of the electrode close thereto while ensuring a potential difference between these electrode parts (1,2) required for electrostatic adsorptive power.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
B65G 49/06 - Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
Removal force and removal electrostatic charge of a work are reduced. Since a planar work (B) bonded in a vacuum chamber (S) is separated from a holding plate (2) in vacuum, atmospheric pressure is not applied to the planar works (A, B). Thus, the work is separated with a small removal force, and since minute unevenness exists on the surfaces thereof and they are not in strong contact, generation of static electricity incident to removal is moderate. When the chamber (S) is opened to the atmosphere subsequently under the separated state, generation of static electricity is retarded between the planar works (A, B) and the work side surfaces(1a, 2a) of the holding plates (1, 2).
B65G 49/06 - Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
The proof strength of a main seal is increased while a reduced pressure area is secured with a saved space when a gap is formed by the atmospheric pressure. Since a gap forming space (6) is vacuated by a pressure regulating valve means (7) when both substrates (1, 5) are joined to each other, both substrates (1, 5) are compressed by the atmospheric pressure and the cell gaps are uniformed. Sealing materials (4) are diffused and extended accordingly, and after a set time for opening to the atmospheric pressure has elapsed, the extended ends of the sealing materials (4) reach the inner surfaces of the main seals (2). When the extension pressure of the sealing material acts on the main seal, the atmospheric pressure is introduced into the vacuum part of the gap forming space (6) by the pressure regulating valve means (7), and the pressure in the vacuum part is changed into a pressure equal to or near the atmospheric pressure. Since the pressure in the vacuum part is balanced with the extension pressure of the sealing material (4), the main seal (2) will not burst.
A work is easily peeled off in the peeling direction by a peeling means. An adhesive member (2) is so disposed that the adhesive force per unit area of the adhesive member (2) is increased in the direction of peeling of a work (W) relative to the adhesive member (2) in connection with the operation of the peeling means (3), whereby peeling-off of the work (A) from the adhesive member (2) can be started by a small peeling force in connection with the operation of the peeling means (3), and the peeling can be smoothly advanced. When the work is peeled off in the direction different from the advancement direction of the peeling, a force far larger than the peeling force by the operation of the peeling means (3) is required.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
B65G 49/06 - Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
79.
WORK TRANSFERRING METHOD, ELECTROSTATIC CHUCK DEVICE, AND BOARD JOINING METHOD
An electrostatic chuck device enabling even a thin work with low rigidity to be releasedly placed without causing deformation and displacement during the movement. An electrostatic chuck (2) is attached to a holding plate (1) by an attaching means (3). A work (A) is chucked and held by the attached electrostatic chuck (2). The electrostatic chuck (2) and the work (A) are integrally separated from the holding plate (1) by a separating means (4). Since the work (A) is not brought into a free state, it can be transferred to the release position without being affected by the gravity. When only the electrostatic chuck (2) is re-attached to the holding plate (1) by the attaching means (3) after the electrostatic attracting function of the electrostatic chuck (2) is stopped, the electrostatic chuck (2) is separated from the surface of the work (A) moved to the release position, and the work (A) is left at the release position and placed.
B65G 49/06 - Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
80.
CHUCK DEVICE FOR SUBSTRATE BONDING MACHINE AND METHOD OF NEUTRALIZING CHARGES ON SUBSTRATE
An electrostatic chuck is replaceably installed on the substrate-side surface of a holding plate without any modification on the surface. Electrostatic chucks (2) formed in a thin plate-like shape or a membrane-like shape are respectively detachably attracted to the substrate-side surfaces (la, la') of the holding plates (1, 1'). Because the substrate-side surfaces (la, la') of the holding plates (1, 1') are formed integrally with the thin sheet-like or membrane-like electrostatic chucks (2), the substrates (A, B) are detachably held by electrostatic attracting force of the thin sheet-like or membrane-like electrostatic chucks (2), and the thin sheet-like electrostatic chucks (2) can be easily detached from the substrate-side surfaces (la, la') of the holding plates (1, 1').
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
B65G 49/06 - Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
⏧PROBLEMS] Required flatness on the holding surface side is achieved even if rubber is used as an elastic material. ⏧MEANS FOR SOLVING PROBLEMS] Recessed air gaps (2) are arranged scattered in a holding surface (1), and the openings of the air gaps (2) are individually covered by fixation plates (3). At substantially the center of each fixation plate (3), a surface receiving plate (4) formed of an elastic material with a size smaller than that of each air gap (2) is installed, projecting toward a substrate (D) to integrate the fixation plate (3) and the surface receiving plate (4). Since the surface receiving plates (4) arranged in a scattered manner are individually made to be in contact with the substrate to evenly support the substrate (D) surface, if there is a variation in the thickness of the plates (4) formed of an elastic material, a surface receiving plate (4’) having an increased thickness is in contact with the substrate (D). As a result, the surface receiving plate (4’) or the associated fixation plate (3) is elastically deformed toward the air gap (2) to allow the elastic deformation to be released into the air gap (2), thereby the plate (4’) with the increased thickness sags down to the air gap (2) side to be flush with the other surface receiving plates (4).
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
