Abstract

Provided is a fixing kit for a precision substrate housing container, the fixing kit being easy to handle and making it possible for the precision substrate housing container to be fixed and unfixed in association with the opening/closing of a door set.　The kit is to be used when a precision substrate housing container 1 is housed in a semiconductor wafer housing container 10 for transport and comprises an adapter tray 20 that is housed in the body 11 of the semiconductor wafer housing container 10 and is for mounting the precision substrate housing container 1, a left/right pair of clamp mechanisms 30 that have respective clamp pieces 32 that are rotated to fix the precision substrate housing container 1 at a front part of the adapter tray 20, and an associative operation mechanism 40 that is installed on a door set 16 that opens/closes a front surface of the body 11 of the semiconductor wafer housing container 10. The associative operation mechanism 40 rotates the clamp pieces 32 of the left/right pair of clamp mechanisms 30 in response to the door set 16 opening/closing the body 11 of the semiconductor wafer housing container 10, thereby causing the clamp pieces 32 to contact or withdraw from the precision substrate housing container 1.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure

Abstract

Provided are: an easy-to-handle precision substrate storage container tray achieving a weight reduction for precision substrate storage containers, or able to eliminate concerns of deformation of or damage to a semiconductor wafer storage container, and able to facilitate insertion and removal; and a semiconductor wafer storage container.　This invention icomprises: an adapter 31 into which a precision substrate storage container 1 is loaded and which is stored in a body 11; a plurality of fixation tools 50 for fixing a flange section 2 of the precision substrate storage container 1; and a pair of fixation pieces able to make contact with support teeth 12 of two sides of the interior of the body 11. The adapter 31 is formed into a frame shape fitting to the flange section 2 of the precision substrate storage container 1, and a support piece 34 supporting a lower surface 5 of the precision substrate storage container 1 is formed in the adapter 31. Further, a relief groove facing the rear of the peripheral edge of a lower surface 5 of the precision substrate storage container 1 is formed in the support piece 34, loading pieces are made to protrude out from two side sections of the adapter 31, and the loading pieces are each enabled to make contact with support teeth 12 distinct from the support teeth 12 of the body 11 contacting the fixation pieces.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure

Abstract

In this diamond substrate processing method, a laser condensing part 190 is disposed so as to face a main surface 10a in the [001] plane of a substrate 10, and a first starting point 221 and a second starting point 222 each comprising a processing mark 21 are formed by emitting laser beams B to positions, set respectively in a first crystal plane 111 and a second crystal plane 112 forming a wedge-shaped structure in which the tip becomes thinner toward the main surface 10a, inside the substrate 10 within the crystal plane constituting the [111] plane. Starting points are formed at the processing marks 21 formed by irradiating the first starting point 221 and the second starting point 222 with the laser beams B in an overlapping manner. A processing mark is formed by emitting laser beams to between the first starting point 221 and the second starting point 222 such that the cleavages generated from the first starting point 221 and the second starting point 222 irradiated with the laser beams B in an overlapping manner extend along the first crystal plane 111 and the second crystal plane 112 and are connected at the tip of the wedge-shaped structure.

IPC Classes  ?

• C30B 29/04 - Diamond
• B23K 26/53 - Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
• C01B 32/28 - After-treatment, e.g. purification, irradiation, separation or recovery
• C30B 33/04 - After-treatment of single crystals or homogeneous polycrystalline material with defined structure using electric or magnetic fields or particle radiation
• H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting

Abstract

According to the present invention, a novel diamond substrate of which a main surface is a ｛100｝ plane is created from a single crystal diamond of which a main surface is a ｛100｝ plane. The present invention has: a step for performing preliminary processing on a first starting point 42a and a second starting point 42b respectively set on a first crystal plane 11a and a second crystal plane 11b that form a wedge-shaped structure 12 in which a tip tapers toward the main surface 10a inside a single crystal diamond block 10, among crystal planes forming a ｛111｝ plane; and a step for focusing laser beams B by means of a laser focusing unit 190 forming a first scanning line 41a and a second scanning line 41b due to processing marks from the first starting point 42a and the second starting point 42b in the first crystal plane 11a and the second crystal plane 11b toward the main surface 10a, and connecting the first scanning line 41a and the second scanning line 41b at the tip of the wedge-shaped structure 12 to constitute a scanning line unit 41.

IPC Classes  ?

• C30B 29/04 - Diamond
• C01B 32/28 - After-treatment, e.g. purification, irradiation, separation or recovery
• C30B 33/04 - After-treatment of single crystals or homogeneous polycrystalline material with defined structure using electric or magnetic fields or particle radiation

Abstract

Provided are a light transmission direction control sheet in which an air layer can be excluded without injecting an adhesive into a gap, and a method for manufacturing the same.　The light transmission direction control sheet 1 comprises first and second light transmissive resin films 2, 2A facing each other, and a pair of louver layers 3, 3A interposed between the first and second light transmissive resin films 2, 2A and bonded with an adhesive 6, the light transmission direction control sheet 1 being used in a module device 10 to control the optical path of a light beam, and the pair of louver layers 3, 3A being butted and closely contacted with each other without a gap. Since an air layer between the pair of louver layers 3, 3A is eliminated, irregular reflection of the light beam can be prevented. Therefore, an optical sensor 14 of the module device 10 does not malfunction or produce false detection. In addition, since it is not necessary to fill the air layer by injecting a filling adhesive into the gap, it is possible to eliminate the possibility of a part of the air layer remaining or the light transmission direction control sheet 1 being contaminated by the filling adhesive.

IPC Classes  ?

• G02B 5/00 - Optical elements other than lenses
• B32B 7/023 - Optical properties
• B32B 27/00 - Layered products essentially comprising synthetic resin
• G01S 7/481 - Constructional features, e.g. arrangements of optical elements

Abstract

[Problem] To provide a fire spread prevention sheet capable of realizing elastic deformation for efficiently absorbing expansion of a heat source while reflecting heat from the heat source, and a battery provided with the fire spread prevention sheet.　[Solution] The present invention relates to: a fire spread prevention sheet that is interposed between heat sources and is capable of preventing the spread of fire between the heat sources, wherein the fire spread prevention sheet has a laminate structure including a plurality of layers and is provided with a metal-film-equipped rubber sheet 17 that is provided with a metal film 13 on at least one thickness-direction surface of a first rubber sheet 11 located inside the fire spread prevention sheet in the thickness direction, the metal film 13 being in a state in which metal particles 15 are deposited; a method for manufacturing the fire spread prevention sheet; and a battery.

IPC Classes  ?

• H01M 50/204 - Racks, modules or packs for multiple batteries or multiple cells
• B32B 15/06 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of rubber
• B32B 25/04 - Layered products essentially comprising natural or synthetic rubber comprising rubber as the main or only constituent of a layer, next to another layer of a specific substance
• H01M 10/613 - Cooling or keeping cold
• H01M 10/625 - Vehicles
• H01M 10/658 - Means for temperature control structurally associated with the cells by thermal insulation or shielding
• A62B 17/00 - Protective clothing affording protection against heat or harmful chemical agents or for use at high altitudes

Abstract

A sponge roller is provided with a shaft body 2, and a foam elastic layer 3 provided on the outer circumference of the shaft body 2. An average cell diameter of the foam elastic layer 3 is 20-100 μm, and a difference between a maximum value and a minimum value of hardness A of five points of the foam elastic layer 3 is less than 2.5 points.

IPC Classes  ?

• G03G 15/00 - Apparatus for electrographic processes using a charge pattern
• F16C 13/00 - Rolls, drums, discs, or the likeBearings or mountings therefor
• G03G 15/20 - Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat

Abstract

Disclosed is a conductive composite dispersion liquid which comprises: a conductive composite body that contains a π-conjugated conductive polymer and a polyanion; water; a sugar alcohol that has 4 to 7 carbon atoms and 3 to 7 hydroxyl groups in each molecule, and a polyvinylpyrrolidone. This conductive composite dispersion liquid has a viscosity of less than 50 mPa∙s at 25°C.

IPC Classes  ?

• C08L 101/12 - Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
• B32B 27/18 - Layered products essentially comprising synthetic resin characterised by the use of special additives
• C08K 5/053 - Polyhydroxylic alcohols
• C08L 25/18 - Homopolymers or copolymers of aromatic monomers containing elements other than carbon and hydrogen
• C08L 39/06 - Homopolymers or copolymers of N-vinyl-pyrrolidones
• C08L 65/00 - Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chainCompositions of derivatives of such polymers
• H01G 9/00 - Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devicesProcesses of their manufacture
• H01G 9/028 - Organic semiconducting electrolytes, e.g. TCNQ

Abstract

A sponge roller 1 is provided with a shaft body 2, and a foam elastic layer 3 provided the outer circumference of the shaft body 2. An average cell diameter of the foam elastic layer 3 is 20-100 μm. In the foam elastic layer 3, distribution of an inclination value of an approximate straight line in a load-displacement curve of a rebound load measurement result obtained by a predetermined calculation method is 0.005 or less.

IPC Classes  ?

• G03G 15/00 - Apparatus for electrographic processes using a charge pattern
• F16C 13/00 - Rolls, drums, discs, or the likeBearings or mountings therefor
• G03G 15/20 - Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat

Abstract

Provided is a door for a substrate-accommodating container that can be expected to improve dimensional precision and stabilize cover position, and that can prevent a docking error with a loading port.　The door comprises: a door body 1 that fits to an open front surface of a container body which accommodates a semiconductor wafer; a cover 20 for the door body 1, and an attachment mechanism 30 for attaching the cover 20 to the door body 1. The door body 1 is provided with a closing plate 2 that closes the front surface of the container body, a peripheral wall 4 that forms a peripheral part of the closing plate 2, and a pair of spaces 7 that, between a center part 6 of the closing plate 2 and the peripheral wall 4, are divided. The cover 20 has a covering plate 21 which covers the spaces 7, and which is has a width that is less than the width of the spaces such that the covering plate 21 is slidable between the center part 6 and a side part of the peripheral wall 4. The attachment mechanism 30 is provided with cover attachment protruding pieces 31, 31A that are formed at both sides of an upper part and both sides of a lower part of the peripheral wall 4, and door body attachment protruding pieces 33 that are formed at both sides of an upper part and both sides of a lower part of the covering plate 21 and that are attached in manner overlapping the cover attachment protruding pieces 31, 31A.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• B65D 45/34 - Clamping or other pressure-applying devices for securing or retaining closure members for applying radial pressure, e.g. contractible bands encircling closure member lever-operated
• B65D 85/00 - Containers, packaging elements or packages, specially adapted for particular articles or materials
• B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
• B65D 85/86 - Containers, packaging elements or packages, specially adapted for particular articles or materials for electrical components

Abstract

Disclosed is a dry film (100) that is pressure-bonded to a surface of a substrate (10) with elements, in which a plurality of light emitting elements (12, 13, 14) are arranged on a substrate (11), the surface having the plurality of light emitting elements arranged thereon. The dry film is provided with a low-elasticity black curable resin layer (1), a low-elasticity transparent curable resin layer (2), and a high-elasticity transparent curable resin layer (3), which are sequentially stacked from the side that is directly disposed on the substrate with elements at the time of pressure bonding.

IPC Classes  ?

• G09F 9/30 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
• B32B 7/023 - Optical properties
• B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
• G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
• G09F 9/33 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
• H01L 33/56 - Materials, e.g. epoxy or silicone resin

Abstract

An object is to provide a fuel cell separator and a manufacturing method thereof realizing excellent strength, electrical conductivity, and gas barrier property. The present invention is related to a fuel cell separator and a manufacturing method thereof, the fuel cell separator comprising: a plate that contains graphite and resin and comprises, on surfaces thereof, grooves, serving as flow paths; and surface layer films, that cover the surfaces on both sides of the plate in a thickness direction thereof, including the grooves, and the surfaces of the plate other than the grooves, wherein the surface layer films, contain resin and carbon nanotubes.

IPC Classes  ?

• H01M 8/0213 - Gas-impermeable carbon-containing materials
• H01M 8/0221 - Organic resinsOrganic polymers
• H01M 8/0228 - Composites in the form of layered or coated products
• H01M 8/0247 - CollectorsSeparators, e.g. bipolar separatorsInterconnectors characterised by the form
• H01M 8/026 - CollectorsSeparators, e.g. bipolar separatorsInterconnectors characterised by the configuration of channels, e.g. by the flow field of the reactant or coolant characterised by grooves, e.g. their pitch or depth

Abstract

There is provided a heat-dissipating sheet that can achieve low hardness and high thermal conductivity, and a method for manufacturing the same. The present invention relates to a heat-dissipating sheet and a method for manufacturing the same. The heat-dissipating sheet includes a sheet-shaped rubbery elastic body, and an elongated thermally conductive filler, which has higher thermal conductivity than the rubbery elastic body and is embedded in the rubbery elastic body oriented obliquely with respect to a thickness direction thereof. The rubbery elastic body includes at least one hole that is oriented in parallel to the thickness direction of the rubbery elastic body or obliquely with respect to the thickness direction thereof. The thermally conductive filler has both end portions respectively exposed on surfaces of the rubbery elastic body.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• B29D 7/01 - Films or sheets
• B29K 19/00 - Use of rubber not provided for in a single one of main groups , as moulding material
• B29K 83/00 - Use of polymers having silicon, with or without sulfur, nitrogen, oxygen or carbon only, in the main chain, as moulding material
• B29K 105/16 - Fillers
• B29K 507/04 - Carbon

Abstract

Provided are a separator having excellent strength and electrical conductivity and a method for producing the same. The present invention is related to a separator for a fuel cell or fuel cells comprising a plate containing graphite, resin, and aramid fiber different from the resin and to a method for producing the same. The plate comprises, on surfaces thereof, grooves serving as flow paths. The aramid fiber is para-aramid fiber containing a meta-phenylene group.

IPC Classes  ?

• H01M 8/0213 - Gas-impermeable carbon-containing materials
• H01M 8/0221 - Organic resinsOrganic polymers
• H01M 8/0226 - Composites in the form of mixtures
• H01M 8/0228 - Composites in the form of layered or coated products
• H01M 8/026 - CollectorsSeparators, e.g. bipolar separatorsInterconnectors characterised by the configuration of channels, e.g. by the flow field of the reactant or coolant characterised by grooves, e.g. their pitch or depth

Abstract

There is provided a multilayer separator capable of stabilizing a gas barrier property at a high level. The present invention is related to a multilayer separator 1 and a method for producing the same, and the multilayer separator comprises: a plate that is a plate that contains graphite and resin and comprises, on surfaces thereof, grooves serving as flow paths; and at least one internal barrier layer, for a gas barrier, that is inside the plate in a thickness direction and divides the thickness direction into at least two areas.

IPC Classes  ?

• H01M 8/0228 - Composites in the form of layered or coated products
• H01M 8/0213 - Gas-impermeable carbon-containing materials
• H01M 8/0221 - Organic resinsOrganic polymers
• H01M 8/10 - Fuel cells with solid electrolytes

Abstract

This substrate storage container comprises a container main body that is capable of storing a substrate. The container main body comprises: a wall portion that demarcates a storage space for storing the substrate; a thin portion that is integrally formed with the wall portion and is thinner than the wall portion; and one or more parting lines that are provided on the outer surface of the wall portion and formed along the boundary between a mold main body and an insert, which are used for injection molding of the container main body. The one or more parting lines include a first parting line that passes through the thin portion.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• B29C 45/00 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor
• B29C 45/26 - Moulds
• B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure

Abstract

To provide a fire-spread prevention type cell unit having a battery cell with a fire-spread prevention sheet that easily deforms in response to overheating and expansion of battery cells and maintains the porosity of the sheet by enabling long-term elastic deformation, a method for manufacturing the same, and a battery. The present invention relates to a fire-spread prevention type cell unit including a battery cell and a fire-spread prevention sheet applied to a side located in the arrangement direction of the battery cell, wherein the fire-spread prevention sheet is a porous sponge sheet, and pores inside the fire-spread prevention sheet have an elongated shape with the lengthwise direction of the pores oriented in the thickness direction of the fire-spread prevention sheet, a method for manufacturing the same, and a battery.

IPC Classes  ?

• H01M 50/383 - Flame arresting or ignition-preventing means
• H01M 50/209 - Racks, modules or packs for multiple batteries or multiple cells characterised by their shape adapted for prismatic or rectangular cells
• H01M 50/293 - MountingsSecondary casings or framesRacks, modules or packsSuspension devicesShock absorbersTransport or carrying devicesHolders characterised by spacing elements or positioning means within frames, racks or packs characterised by the material

Abstract

Provided are: a light transmission direction control sheet which can realize an increase in transmittance and thinning of the sheet; and a method for manufacturing the same.　The present invention comprises: first and second louver layers 2, 2A; an interlayer adhesive layer 5 for the same; an obverse surface film layer 6 for the first louver layer 2; an obverse surface-side adhesive layer 7 for the first louver layer 2 and the obverse surface film layer 6; a reverse surface film layer 8 for the second louver layer 2A; and a reverse surface-side adhesive layer 9 for the second louver layer 2A and the reverse surface film layer 8. The first and second louver layers 2, 2A are laminated orthogonally. The first and second louver layers 2, 2A, are each formed by alternately arranging light transmission bands 3 and light-shielding bands 4. The light transmission bands 3 are formed of light transmissive silicone rubber, and the light-shielding bands 4 are formed of colored silicone rubber. The silicone rubbers have a hardness of 73-83. The interlayer layer 5, the obverse surface-side adhesive layer 7, and the reverse surface-side adhesive layer 9 are formed of adhesive silicone rubber having a hardness of 10-60. The interlayer layer 5 has a thickness of 10-30 μm.

IPC Classes  ?

• G02B 5/00 - Optical elements other than lenses
• F21S 2/00 - Systems of lighting devices, not provided for in main groups or , e.g. of modular construction
• F21V 5/00 - Refractors for light sources
• F21V 11/00 - Screens not covered by groups , , or

Abstract

To provide a fuel cell separator having excellent strength, electrical conductivity, and gas barrier property, the present invention provides a fuel cell separator comprising a plate that contains, as constituent materials thereof, graphite in a particulate or fiber form and resin in a particulate or fiber form; and a barrier layer having a better gas barrier property than that of the plate. The plate comprises, on a surface thereof, a groove serving as a flow path. The barrier layer covers at least a surface on a front side and a surface on a rear side of the plate including the groove and the surfaces of the plate other than the groove.

IPC Classes  ?

• H01M 8/0221 - Organic resinsOrganic polymers
• H01M 8/0247 - CollectorsSeparators, e.g. bipolar separatorsInterconnectors characterised by the form

Abstract

A push-button switch member (1) comprises a first push-button structure (2) that generates a sense of a first stage click and second push-button structures (3) that generate a sense of a second stage click, wherein: the first push-button structure (2) comprises a base portion (11), a first dome portion (12) that is formed above the base portion (11) and becomes deformed by being pressed to generate the sense of the first stage click, and a pressing first key top (13) that is formed above the first dome portion (12); at least two second push-button structures (3) are disposed inside the first dome portion (12); the at least two second push-button structures (3) each comprise a second dome portion (17) that becomes deformed by being continuously pressed to generate the sense of the second stage click; and the at least two second push-button structures (3) share, or each comprise, a pusher portion (18), which is formed below the second dome portion (17) and by which a ground resistance is established.

IPC Classes  ?

• H01H 13/14 - Operating parts, e.g. push-button
• H01H 13/52 - Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a single operating member the contact returning to its original state immediately upon removal of operating force, e.g. bell push switch

Abstract

A sensor sheet according to the present invention is provided with: a base material layer (11); sensor electrodes (14) which are each disposed on one or another surface of the base material layer (11); and a light diffusion layer (12) which is disposed on a surface of the base material layer (11), said surface being on the reverse side of the surface on which the sensor electrodes (14) are disposed, or alternatively disposed on at least one of the surfaces on which the sensor electrodes (14) are disposed. The light diffusion layer (12) is formed of a mixed material that contains at least a diffusing agent and a binder resin.

IPC Classes  ?

• G06F 3/041 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
• G06F 3/044 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
• H01H 36/00 - Switches actuated by change of magnetic field or of electric field, e.g. by change of relative position of magnet and switch, by shielding

Abstract

A panel accommodating container is provided with a container body that has an opening and accommodates a panel, a holding mechanism that is provided inside the container body and holds the panel, and a lid that closes the opening. The container body defines a storage space for accommodating the panel, and is provided with a pair of side walls facing each other in a first direction. The holding mechanism is provided with a support portion that supports an end portion of the panel in the first direction, and a pressing mechanism that pushes the end portion toward the support portion in a second direction that intersects the first direction.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• B65D 85/86 - Containers, packaging elements or packages, specially adapted for particular articles or materials for electrical components

Abstract

Provided is a substrate container equipped with a valve structure having improved valve opening/closing reliability. The substrate container comprises a container main body for accommodating a substrate, a lid for closing an opening of the container main body, and a valve structure (40) for controlling a gas flow through the container main body, wherein the valve structure (40) comprises: a block member (41) having communication passages (416, 417) formed therein which enable the inside of the container main body to communicate with the outside thereof via a valve hole (466); and an elastically deformable, platy valve member (45) for opening/closing the valve hole (466). In the valve structure (40), a valve seat (467) around the valve hole (466) and the sealing surface (452a) of the valve member (45) are in contact with each other while curving downstream along a gas-flow direction.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
• F16K 15/16 - Check valves with flexible valve members with tongue-shaped laminae
• F16K 24/00 - Devices, e.g. valves, for venting or aerating enclosures

Abstract

A substrate storage container includes a container body configured to store a substrate, a lid that closes the opening of the container body, a retainer that is attached to the lid, and a substrate support portion formed in the retainer. The substrate support portion has an arc shape in a cross-sectional view from the top-to-bottom direction perpendicular to the closing direction of the lid. The substrate support portion includes a pair of left and right substrate support portions configured to hold the substrate together with the container body to retain the substrate.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers

Abstract

The objective of the present invention is to provide: an anisotropically conductive connector that is even capable of a narrow-pitch arrangement in which compact electric/electronic components are accommodated, has excellent connection stability to an electrode, hardly damages the electrode of an electric/electronic component to which to connect, is capable of reducing the deposition of oxidized foreign matter so as to suppress an increase in a resistance value, and is easy to replace even if a conduction failure occurs during use; an anisotropically conductive connector having a frame; and an inspection apparatus. This anisotropically conductive connector is provided with: a strip-shaped insulating part that comprises an elastic material having insulation properties; and a plurality of silver wires that penetrate from the first surface to the second surface of the insulating part by extending in the thickness direction thereof, and that are arranged at a constant pitch in the length direction of the insulating part. Each among the plurality of silver wires is provided so as to be inclined with respect to the thickness direction of the insulating part.

IPC Classes  ?

• H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between their connecting locations

Abstract

The present invention provides: a viewing angle control element which is capable of eliminating the risk of warping or deformation even in cases where the thickness thereof is increased for the purpose of narrowing the visible range or in cases where the installation environment of an image display device is at a high temperature; and a method for producing this viewing angle control element.　The present invention provides a viewing angle control element 1 which is in a sheet form and comprises: a louver layer 2 in which a plurality of light transmission bands 3 and light blocking bands 4 are alternately arranged; a pair of bonding layers 5 which are respectively superposed on the both surfaces of the louver layer 2; and a pair of light-transmitting polycarbonate resin films 6 which are respectively superposed on and bonded to the pair of bonding layers 5. This viewing angle control element 1 is mounted on a passenger-side entertainment monitor on the dashboard of an automobile for the purpose of controlling the visible angle; the light transmission bands 3 of the louver layer 2 are formed of a light-transmitting silicone rubber; the light blocking bands 4 of the louver layer 2 are formed of a colored silicone rubber; and the light blocking band width of the light blocking bands 4 is set to 10 µm to 20 µm. Since the louver layer 2 is formed of the silicone rubbers, the risk of warping or deformation caused by heat can be eliminated.

IPC Classes  ?

• G02B 5/00 - Optical elements other than lenses
• B32B 7/023 - Optical properties
• B32B 27/00 - Layered products essentially comprising synthetic resin
• B32B 27/36 - Layered products essentially comprising synthetic resin comprising polyesters

Abstract

The present invention provides: a resin composition for forming a low-dielectric adhesive layer that has excellent 5G-compatible electrical properties (low-dielectric properties), ensures high adhesiveness, and exhibits a small linear coefficient of thermal expansion (CTE); and an adhesive composition containing said resin composition.　This adhesive composition contains a resin composition containing: a maleimide resin (A) having a molecular weight of 1,000 or more; a benzoxazine resin (B); and an alkenyl resin (C) having a 1-alkenyl group. In the resin composition, the mix ratio of the benzoxazine resin (B) and the alkenyl resin (C) is 1:10 to 10:1.

IPC Classes  ?

• C09J 201/06 - Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups containing oxygen atoms
• B32B 27/00 - Layered products essentially comprising synthetic resin
• B32B 27/34 - Layered products essentially comprising synthetic resin comprising polyamides
• C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
• C09J 179/02 - Polyamines
• C09J 201/02 - Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups
• H05K 1/03 - Use of materials for the substrate

Abstract

The present invention provides: a resin composition for forming a low-dielectric adhesive layer that has excellent 5G-compatible electrical properties (low-dielectric properties), ensures high adhesiveness, suppresses the occurrence of air bubbles, and exhibits a small linear coefficient of thermal expansion (CTE); and an adhesive composition containing said resin composition.　This adhesive composition contains a resin composition containing: a maleimide resin having a molecular weight of 1,000 or more; and a benzoxazine resin. The benzoxazine resin has a site represented by formula (1). (In formula (1), R represents a hydrocarbon group having 4 or more carbon atoms. The hydrocarbon group may have an unsaturated bond site.)

IPC Classes  ?

• C09J 201/06 - Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups containing oxygen atoms
• B32B 27/00 - Layered products essentially comprising synthetic resin
• B32B 27/34 - Layered products essentially comprising synthetic resin comprising polyamides
• C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
• C09J 179/02 - Polyamines
• C09J 179/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
• H05K 1/03 - Use of materials for the substrate

Abstract

[Problem] To provide a housing for an electronic control unit and a method for manufacturing the same, the housing capable of alleviating stress due to a thermal expansion difference between the housing composed of a resin and a heat sink.　[Solution] The present invention relates to a housing 1 for an electronic control unit capable of accommodating the electronic control unit and a method for manufacturing the same, the housing comprising: a tray 4 that has a recessed section 42 that can accommodate the electronic control unit, and is constituted mainly by a resin; and a lid body 2 that engages with the tray 4 so as to cover the recessed section 42, wherein the lid body 2 comprises: a heat sink 10 that has heat dissipation fins 12; a lid body housing 20 that is mainly constituted by a resin, engages with the tray 4, and surrounds the outer periphery of the heat sink 10 so that the heat dissipation fins 12 are exposed on the side opposite to the recessed section 42; and a seal member 30 that is constituted by a rubber elastic body and is disposed between the heat sink 10 and the lid body housing 20.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

[Problem] To provide a fuel cell separator which is superior in strength, electric conductivity, and gas barrier performance, and a method for manufacturing the same.　[Solution] The present invention pertains to a fuel cell separator 1 and a method for manufacturing the same, the fuel cell separator 1 comprising: a plate 2 that contains graphite and a resin and that has grooves 30, 32 serving as flow paths on surfaces 31 of the plate; and surface layer films 4, 5 that include the grooves 30, 32 and the surfaces 31 other than the grooves 30, 32, and that cover the surfaces 31 on both sides in the thickness direction of the plate 2. The surface layer films 4, 5 contain a resin and carbon nanotubes.

IPC Classes  ?

• H01M 8/0213 - Gas-impermeable carbon-containing materials
• H01M 8/0221 - Organic resinsOrganic polymers
• H01M 8/0228 - Composites in the form of layered or coated products

Abstract

An anticorrosion structure includes at least one of a metal bolt and a metal nut, and an anticorrosion member coating a portion, protruding beyond a connection surface, of a connecting part using at least one of the bolt and the nut, the anticorrosion member being formed of a silicone rubber obtained by curing a silicone rubber compound.

IPC Classes  ?

• C09D 183/04 - Polysiloxanes
• C09D 5/08 - Anti-corrosive paints
• F16B 33/00 - Features common to bolt and nut

Goods & Services

Medical apparatus and instruments, and their parts and fittings; silicone catheters; medical tubes; drainage tubes for medical purposes; feeding tubes for medical purposes; vessel loops; balloon catheters.

Abstract

A substrate storage container includes a container body configured to store substrates, a lid that closes an opening of the container body, and a valve unit that controls the flow of gas to the container body. The valve unit includes an elastic valve having a valve opening that connects a first passage communicating with the outside of the container body to a second passage communicating with the inside of the container body, a holding member that holds the elastic valve, and a clamping cap that is inserted in the elastic valve and secures the elastic valve to the holding member. The valve opening is tightly closed by the elastic force of the elastic valve.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• F16K 15/14 - Check valves with flexible valve members

Abstract

Provided is a substrate storage container capable of ensuring sealability of a lid body and smoothly moving a locking claw of a locking mechanism by making the locking mechanism metal-free.　Locking claws 40 are held between a pair of locking mechanism guide blocks of a lid body 10 to be linearly movable outward in the lid body, and are each provided with: a locking block 41 that can oscillate in the thickness direction of the lid body; a connection bar 44 connected to an advancing/retreating bar 34 of a locking mechanism 30; and a cam boss 46 to be fitted in a cam groove 17 of a corresponding one of the locking mechanism guide blocks. The locking block 41, the connection bar 44, and the cam boss 46 are integrally formed by a resin-containing molding material. A recess is formed in the locking block 41, and a resin pin 49 is provided so as to be suspended between opposing sides thereof. The resin pin 49 is fitted through a pressing resin roller 50. A pair of flat surfaces 47 are formed in a cam boss circumferential surface. The cam groove 17 is divided into a linear movement straight groove 19 that makes a sliding-contact with the flat surfaces 47 and that restrains oscillation of a corresponding one of the locking claws 40, and an oscillatory movement circular-arc groove that causes the corresponding one of the locking claws 40 to oscillate.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure

Abstract

Provided is a metal-clad laminate board (for example, a copper-clad laminate board (CCL)) that, while having good electric characteristics (dielectric characteristics) adapted to 5G, has an excellent bonding property (adhesive property) between a base material film (laminate) and a metal film and has excellent dimensional stability, and of which curling is suppressed.　Also, provided is a laminate for a printed wiring board that is used to form the above metal-clad laminate board.　The laminate comprises: a low CTE resin film that has a linear coefficient of thermal expansion (CTE) of 50 ppm/℃ or less and does not have a melting point at or below 300℃; and resin films (SPS resin films) made of a styrene-based polymer having a syndiotactic structure (SPS) that are laminated on both surfaces of the low CTE resin film.

IPC Classes  ?

• B32B 7/027 - Thermal properties
• B29C 63/02 - Lining or sheathing, i.e. applying preformed layers or sheathings of plasticsApparatus therefor using sheet or web-like material
• B29C 65/44 - Joining a heated non-plastics element to a plastics element
• B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
• B32B 27/30 - Layered products essentially comprising synthetic resin comprising vinyl resinLayered products essentially comprising synthetic resin comprising acrylic resin
• H05K 1/03 - Use of materials for the substrate

Abstract

A diffused light control sheet includes: a louver layer on which light-transmitting zones and light-shielding zones are arranged alternately; a transparent protective layer disposed on a first face of the louver layer; and a light-diffusing layer disposed on a second face of the louver layer, in which the light-diffusing layer has a haze of 93% or more as measured in accordance with JIS K 7136 (2000).

IPC Classes  ?

• G02B 5/02 - Diffusing elementsAfocal elements
• G02B 1/04 - Optical elements characterised by the material of which they are madeOptical coatings for optical elements made of organic materials, e.g. plastics
• F21V 3/06 - GlobesBowlsCover glasses characterised by materials, surface treatments or coatings characterised by the material

Abstract

[Problem] To increase the thermal conduction of a heat transfer member that is interposed between a heat source and a cooling member.　[Solution] The present invention relates to a heat transfer member 1 which is capable of transferring heat from a heat source to a cooling member by being interposed between the heat source and the cooling member, and which is provided with: an elastic sheet body 10 comprising an elastic sheet 11 that is elastically deformable at least in the thickness direction, and a highly lubricated layer 16 that is formed on at least one surface of the elastic sheet 11 in the thickness direction and has a higher lubricity than the elastic sheet 11; and a heat transfer film 20 which is provided so as to meander in a specific direction that is perpendicular to the thickness direction of the elastic sheet body 10 within the sheet surface, while being alternatively exposed in the front-side surface and the back-side surface of the elastic sheet body 10 in the thickness direction. The present invention also relates to: a method for producing a heat transfer member; and a battery.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

Provided is a metal-clad laminate (for example, copper-clad laminate (CCL) in which curling is suppressed and which excels in adhesiveness (adhesion) between a base material film (laminated body) and a metal film and dimensional stability while having good electrical properties (dielectric properties) compatible with 5G.　Also provided is a laminated body for a printed wiring board, which is used to form the metal-clad laminate.　This laminated body comprises: a low-CTE resin film having a coefficient of linear thermal expansion (CTE) of 50 ppm/°C or less; and a high-CTE resin film having a coefficient of linear thermal expansion (CTE) of greater than 50 ppm/°C and laminated on both sides of the low-CTE resin film, wherein the low-CTE resin film does not have a melting point at 300°C or less, the low-CTE resin film does not melt at a temperature obtained by adding 30°C to the melting point of the high-CTE resin film, the high-CTE resin film has a melting point of 250°C or higher, and the high-CTE resin film has a tensile elongation at break in the machine direction (MD direction) of 400% or less.

IPC Classes  ?

• B32B 7/027 - Thermal properties
• B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
• H05K 1/03 - Use of materials for the substrate

Abstract

A storage container with improved strength and airtightness, and a method for manufacturing the storage container are provided. The storage container includes, as a functional resin member, an insert component for a container body insert-molded with a molding material containing predetermined resin. The functional resin member is a side wall plate with support pieces. The side wall plate has a thick portion having at least a thickness of a side wall of the container body, and a thin joint portion formed around the thick portion, to be interposed into and joined to a peripheral wall of the container body. Most of the peripheral wall and the thin joint portion are engaged and joined to enlarge their contact area to eliminate a decrease of the mechanical strength and leakage around the peripheral edge of the side wall plate and prevent the peripheral wall from parting from the side wall plate.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• B65D 25/10 - Devices to locate articles in containers
• B65D 25/54 - Inspection openings or windows
• B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure

Abstract

A heat dissipation structure including a plurality of heat dissipating members, and a support plate for supporting the heat dissipating members. Each of the heat dissipating members includes a plurality of cushion members each having a hollow or a solid shape, and a heat conduction sheet covering an outer surface of the cushion members. The support plate includes a plurality of grooves for supporting the heat dissipating members in a direction orthogonal to a longitudinal direction of the heat dissipating members. Each of the grooves is a curved recess portion formed in a thickness direction, opened to the side of the heat dissipating member, formed to have a radius of curvature larger than a radius of curvature of the heat dissipating member, and to have a depth smaller than a circular conversion diameter of the heat dissipating member, and a battery provided with the heat dissipating structure.

IPC Classes  ?

• H01M 10/6554 - Rods or plates
• H01M 10/613 - Cooling or keeping cold
• H01M 10/6551 - Surfaces specially adapted for heat dissipation or radiation, e.g. fins or coatings
• H01M 10/653 - Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
• H01M 10/6556 - Solid parts with flow channel passages or pipes for heat exchange
• H01M 50/211 - Racks, modules or packs for multiple batteries or multiple cells characterised by their shape adapted for pouch cells
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Goods & Services

Medical devices, namely, silicone catheters, drainage tubes for medical purposes, tubes for enteral feeding for medical purposes, vessel loops in the nature of vascular loops for surgical use, and balloon catheters

Abstract

According to one embodiment, a substrate storage container comprises: a container body configured to store a substrate; a lid that closes a rectangular opening of the container body; and an annular gasket located between the container body and the lid. The container body has at least either one of a guide rib or a guide slit in an opening portion around the opening. The lid has at least either one of a guide slit or a guide rib that is engageable with the guide rib or the guide slit of the container body. The guide rib and the guide slit engage each other when the opening is closed with the lid and prevent the lid from tilting at a predetermined tilt angle or more with respect to an opening surface where the opening is formed.

IPC Classes  ?

• B65D 53/02 - Collars or rings
• B65D 43/02 - Removable lids or covers

Abstract

There is provided a metal-clad laminate in which the transmission loss of electrical signals can be reduced, a finer pitch of a circuit pattern is possible, a high precision and fine circuit can be formed, and the close adhesiveness of the metal film is excellent. The metal-clad laminate includes a coating film and a metal film laminated on a base material film in this order, wherein the metal film is a metal film formed by at least any formation method of plating, sputtering, and vapor deposition, and a surface roughness (Rz) of the coating film is 1 μm or less.

IPC Classes  ?

• H05K 1/03 - Use of materials for the substrate
• C23C 14/20 - Metallic material, boron or silicon on organic substrates
• C23C 14/34 - Sputtering

Abstract

The present invention is a thermoplastic polyurethane elastomer composition comprising a thermoplastic polyurethane elastomer, an inorganic flame retardant that is a metal hydroxide and/or a metal hydrate, a phosphorus flame retardant, and a melamine flame retardant, wherein 5 to 50 parts by mass of the inorganic flame retardant, 15 to 50 parts by mass of the phosphorus flame retardant, and 25 to 50 parts by mass of the melamine flame retardant are included at these proportions with respect to 100 parts by mass of the thermoplastic polyurethane elastomer, and the thermoplastic polyurethane elastomer is a carbonate thermoplastic polyurethane elastomer having a plurality of carbonate bonds in the molecular chain of the elastomer.

IPC Classes  ?

• C08L 75/04 - Polyurethanes
• C08K 3/016 - Flame-proofing or flame-retarding additives
• C08K 5/3477 - Six-membered rings
• C08K 5/521 - Esters of phosphoric acids, e.g. of H3PO4

Abstract

Provided is a substrate storage container eliminating the possibility of a decrease in connection strength between a slide member and a bending locking member or a fall-off of the bending locking member from the slide member, without using a metal pin. This substrate storage container comprises a lid (10) which is fitted in an open front face (2) of a container body (1) in which a semiconductor wafer can be stored, and a locking mechanism (20) for locking the fitted lid (10). The locking mechanism (20) is composed of: an operating reel (21) that is supported on the operation lid (10) and is rotated by an external operation; a connecting bar (24) that slides in an upper-lower direction of the lid (10) due to rotation of the operating reel (21); and a locking claw (27) that projects from an entrance/exit opening (12) in a peripheral edge portion of the lid (10) as the connecting bar (24) slides, and that can be locked in a locking pocket (4) of a front-face inner periphery portion of the container body (1). The locking claw (27) is rotatably connected to the tip-end portion of the connecting bar (24) by means of a resin pin (31) of φ1.5 mm or greater. Use of the resin pin (31) reduces generation of metal ions, and eliminates various adverse effects on the semiconductor wafer.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers

Abstract

The present invention provides a metal-clad laminated board in which a low-dielectric base film having poor adhesiveness can be closely adhered and the adhesion of a metal layer formed by a dry process such as deposition and sputtering or a wet process such as a plating treatment is good.　The present invention also provides a laminated body which is intended to be used for the formation of the metal-clad laminated board and comprises a base film and a resin layer formed on the base film.　The laminated body comprises a base film and a coating layer comprising a maleimide resin, in which the surface roughness (Rz) of the coating layer is 1 μm or less, and the laminated body has a relative permittivity of 3.5 or less and a dielectric dissipation factor of 0.005 or less under the condition including a frequency of 28 GHz.

IPC Classes  ?

• B32B 27/34 - Layered products essentially comprising synthetic resin comprising polyamides
• B32B 15/088 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising polyamides

Abstract

The purpose of the present invention is to provide an electrostatic capacitance type input device that combines: having a switch that is easy to handle and has a rotary dial or push button; and using an electrostatic capacitance touch sensor with a simple design. This electrostatic capacitance type input device comprises: an operation panel; a sensor sheet attached to the rear surface side of the operation panel; and a switch including at least one of a rotary dial and push button. A base material sheet of the sensor sheet is provided with a touch sensor electrode for detecting a touch operation on a surface of the operation panel by a change in electrostatic capacitance, and a detection electrode for detecting a switch operation on the switch by a change in electrostatic capacitance. The switch is provided with a conductor having a distance to the detection electrode that changes by the switch operation, and the switch operation on the switch is detected from a change in electrostatic capacitance caused by the change in distance between the detection electrode and the conductor.

IPC Classes  ?

• H01H 36/00 - Switches actuated by change of magnetic field or of electric field, e.g. by change of relative position of magnet and switch, by shielding
• G06F 3/041 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means

Abstract

Provided is a metal-clad laminated plate that has smooth-surfaced metal film that reduces electrical signal transmission loss. The metal-clad laminated plate has good metal film adhesion and can be used to create fine-pitched circuit patterns and form high-precision fine circuits.　The metal-clad laminated plate is obtained by laminating a coating film, a layer comprising an adhesion-imparting agent, and a metal film on a substrate film, in said order. The metal film is formed by at least one formation process out of plating, sputtering, and deposition and the surface roughness (Rz) of the coating film is 1 μm or less.

IPC Classes  ?

• B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
• B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
• H05K 1/03 - Use of materials for the substrate

Abstract

Provided is a metal-clad laminate which adheres even to a low-dielectric substrate film having poor adhesion, and which has good adhesion to a metal layer formed by a dry process such as vapor deposition or sputtering, or a wet process such as plating.　The present invention also provides a laminate which is used to form said metal-clad laminate, and in which a resin layer is formed on a substrate film.　The laminate has: a substrate film; and a layer composed of a resin composition containing a silane coupling agent, wherein the layer composed of the resin composition has a surface roughness (Rz) of at most 1 µm, and the laminate has a relative permittivity of at most 3.5 and a dielectric loss tangent of at most 0.005 under the frequency condition of 28 GHz.

IPC Classes  ?

• B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
• H05K 1/03 - Use of materials for the substrate

Abstract

[Problem] To provide a method for producing a dielectric film using a polymeric material and an organic compound having a polar group. [Solution] A method for producing a dielectric film, comprising a step in which a polymeric material and an organic compound having a polar group are dissolved in a solvent to prepare a mixture solution including the polymeric material and the organic compound having a polar group, a step in which the mixture solution is applied to a substrate, and a step in which the polymeric material applied to the substrate is cured to form a thin film, the method being characterized in that the mixture solution is prepared so that the cured thin film has an inner structure composed of separated phases which are a continuous phase comprising the polymeric material and a dispersed phase consisting mainly of the organic compound having a polar group.

IPC Classes  ?

• C08K 5/315 - Compounds containing carbon-to-nitrogen triple bonds
• C08L 83/04 - Polysiloxanes
• C08L 101/00 - Compositions of unspecified macromolecular compounds
• H01B 3/28 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances natural or synthetic rubbers
• C08J 5/18 - Manufacture of films or sheets
• H01L 41/09 - Piezo-electric or electrostrictive elements with electrical input and mechanical output
• H01L 41/193 - Macromolecular compositions

Abstract

[Problem] To provide a heat-dissipating sheet having reduced hardness and increased heat conductivity, and a method for manufacturing the same.　[Solution] The present invention relates to a heat-dissipating sheet 1 and a method for manufacturing the same. The heat-dissipating sheet 1 comprises a sheet-like rubbery elastic body 10, and an elongated heat-conductive filler 20 having higher heat conductivity compared to the rubber-like elastic body 10 and embedded in the rubber-like elastic body 10 oriented obliquely with respect to a thickness direction thereof. The rubber-like elastic body 10 includes at least one hole 14 which is oriented in parallel to the thickness direction of the rubber-like elastic body 10 or obliquely with respect to the thickness direction. The heat-conductive filler 20 has both ends thereof exposed on surfaces 11, 12 of the rubber-like elastic body 10.

IPC Classes  ?

• H01L 23/373 - Cooling facilitated by selection of materials for the device
• B29B 15/08 - Pretreatment of the material to be shaped, not covered by groups of reinforcements or fillers
• C08J 5/18 - Manufacture of films or sheets
• H01L 23/36 - Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

[Problem] To provide: a thermally conductive sheet that can be configured to have a low hardness and a high thermal conductivity; and a method for producing the same.　[Solution] The present invention relates to a thermally conductive sheet 1 provided with a rubber-like elastic body 10 in sheet form and carbon fibers 20 that are embedded diagonally with respect to the direction of thickness of the rubber-like elastic body 10, wherein the carbon fibers 20 are amorphous carbon fibers and both ends 21 and 22 thereof are exposed at the surfaces 11 and 12 of the rubber-like elastic body 10. The present invention also relates to a method for producing the thermally conductive sheet 1.

IPC Classes  ?

• H01L 23/373 - Cooling facilitated by selection of materials for the device
• B29B 15/08 - Pretreatment of the material to be shaped, not covered by groups of reinforcements or fillers
• C08J 5/18 - Manufacture of films or sheets
• H01L 23/36 - Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

[Problem] To provide a push-button switch member in which the resistance drops rapidly to enable a clear push-down after a load with which a push-button is pushed reaches a maximum.　[Solution] The present invention relates to a push-button switch member comprising: a keytop; a domed part; and a base part. When the keytop is pushed toward the base part side, the domed part is buckled and deformed, and when the pushing of the keytop is released, the domed part returns to its original shape. In a load-displacement curve 20, 30 that begins from the start of pushing of the keytop, passes through the buckling deformation of the domed part, and ends when a lower area of the keytop abuts a fixed part on an extension line of the keytop, a second angle B from a peak point where the load reaches a maximum value to a make point where the load reaches a minimum value is smaller than a first angle A from an initial point where the pushing of the keytop is initiated to the peak point.

IPC Classes  ?

• H01H 13/52 - Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a single operating member the contact returning to its original state immediately upon removal of operating force, e.g. bell push switch

Abstract

[Problem] To provide a fire-spread prevention type cell unit in which a battery cell is provided with a fire-spread preventing sheet that deforms readily in conformity with thermal expansion of a battery cell, and that is capable of deforming elastically over a long period of time, thereby maintaining porosity of the sheet, and to provide a method for manufacturing the fire-spread prevention type cell unit, and a battery.　[Solution] The present invention relates to a fire-spread prevention type cell unit 1, a method for manufacturing the same, and a battery, the fire-spread prevention type cell unit 1 comprising a battery cell 20, and a fire-spread preventing sheet 10 which is affixed to a side surface positioned in a direction in which the battery cell 20 extends, wherein: the fire-spread preventing sheet 10 is a porous sponge sheet; and holes 15 in the fire-spread preventing sheet 10 have an elongate shape, and a length direction of the holes 15 is oriented in a thickness direction of the fire-spread preventing sheet 10.

IPC Classes  ?

• H01M 10/658 - Means for temperature control structurally associated with the cells by thermal insulation or shielding
• H01M 50/204 - Racks, modules or packs for multiple batteries or multiple cells
• H01M 50/291 - MountingsSecondary casings or framesRacks, modules or packsSuspension devicesShock absorbersTransport or carrying devicesHolders characterised by spacing elements or positioning means within frames, racks or packs characterised by their shape

Abstract

[Problem] To provide: a fire spreading prevention unit that prevents fire spreading by reducing thermal conduction between heat sources during a rise in temperature of the heat sources, that is not easily damaged during expansion of the heat sources, and that can actively dissipate heat from the heat sources; and a battery provided with the same.　[Solution] The present invention relates to a fire spreading prevention unit 1, comprising: fire spreading prevention sheets 20 each disposed so as to be sandwiched between a plurality of heat sources; and a thermally conductive member 10 disposed between the heat sources and a member to which heat from the heat sources is transmitted. The fire spreading prevention sheets 20 are multilayer sheets each obtained by laminating one or more rubber sheets 23, one or more heat resistant sheets 21, and one or more thermally conductive sheets 22. The thermally conductive sheets 22 each have a protrusion 25 that protrudes beyond the rubber sheet 23 and the heat resistant sheet 21 and has both surfaces in the thickness direction of the thermally conductive sheet 22 exposed. The fire spreading prevention sheets 20 are erected on the thermally conductive member 10 in a state in which the respective protrusions 25 are brought into contact with the thermally conductive member 10. The present invention also relates to a battery provided with the fire spreading prevention unit.

IPC Classes  ?

• H01M 10/647 - Prismatic or flat cells, e.g. pouch cells
• H01M 10/655 - Solid structures for heat exchange or heat conduction
• H01M 10/658 - Means for temperature control structurally associated with the cells by thermal insulation or shielding
• H01M 50/204 - Racks, modules or packs for multiple batteries or multiple cells

Abstract

[Problem] To provide a push button switch member that has high durability while maintaining good operability.　[Solution] The present invention relates to a push button switch member 1 comprising: a push-movable part 11 having a recess 12 that is recessed downward from a top surface, the push-movable part being movable in a pushing direction and a reverse direction in response to pushing on the top surface; a buckling-deformable first dome portion 13 connected to the outer periphery in the radial direction of the push-movable part 11 as seen in plan view; a non-buckling-deformable second dome portion 14 different from the first dome 13, the second dome portion being connected to the inner periphery in the radial direction of the push-movable part 11 as seen in plan view; a protrusion 16 protruding from the second dome portion 14 in the opposite direction from the top surface, the protrusion being able to move toward a substrate 50 that is in the opposite direction from the top surface; and a base portion 15 connected to the outer periphery in the radial direction of the first dome portion 13 as seen in plan view, the base portion being secured to the substrate 50. The second dome portion 14 and the protrusion 16 cover an end portion on the opposite side from the top surface of the recess 12, and the second dome portion 14 has at least one convex portion 40 between the push-movable part 11 and the protrusion 16, the convex portion protruding toward the opening side of the recess 12.

IPC Classes  ?

• H01H 13/12 - Movable partsContacts mounted thereon

Abstract

[Problem] To provide a multilayer separator which is capable of stabilizing the gas barrier characteristics at high levels.　[Solution] The present invention relates to a multilayer separator 1 which is provided with: a plate 2 which contains graphite and a resin, and has a surface that is provided with grooves 30, 32 serving as flow channels; and an internal barrier layer 3c for gas barrier, the internal barrier layer 3c being positioned inside the plate 2 in the thickness direction so as to divide the plate 2 into two regions in the thickness direction. The present invention also relates to a method for producing this multilayer separator 1.

IPC Classes  ?

• H01M 8/021 - Alloys based on iron
• H01M 8/0221 - Organic resinsOrganic polymers
• H01M 8/0228 - Composites in the form of layered or coated products
• H01M 8/10 - Fuel cells with solid electrolytes

Abstract

Provided is an adhesive composition that is capable of forming an adhesive layer having excellent electrical properties (low relative permittivity and low dielectric loss tangent) and excellent adhesiveness (adhesion properties) after heat curing, can improve adhesiveness (adhesion properties) in a laminating step, can prevent the peeling and lifting of layers during temporary fixing and roll-to-roll work, also has a high crosslink density, and does not cause heat resistance, solvent resistance and the like to deteriorate. The adhesive composition contains a bismaleimide resin and a styrene-based elastomer.

IPC Classes  ?

• C09J 163/04 - Epoxynovolacs
• C09J 11/06 - Non-macromolecular additives organic
• C09J 7/35 - Heat-activated

Abstract

The present invention is a method for producing an adhesive holding jig 10 provided with a support substrate 11 and an adhesive agent layer 12 which is provided on the support substrate 11 and which has a relief pattern 13 on a surface 12a thereof, said method comprising: a first step for inserting a nano-implant mold 30 that has a pattern 31 for forming a relief pattern 13 into an upper mold 21 of a mold 20 that has the upper mold 21 and a lower mold 22, and disposing the support substrate 11 in a cavity bottom part 22a of the lower mold 22; a second step for disposing a heat-curing liquid adhesive material 24 on the support substrate 11; a third step for closing and then heating the mold 20 so as to integrally bond and mold the support substrate 11 and the heat-curing liquid adhesive material 24; and a fourth step for opening the mold 20 and removing an adhesive holding jig 10 that has been molded.

IPC Classes  ?

• B29C 39/10 - Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressureApparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
• B29C 39/24 - Feeding the material into the mould
• B29C 39/26 - Moulds or cores
• B29C 33/42 - Moulds or coresDetails thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
• B29C 59/02 - Surface shaping, e.g. embossingApparatus therefor by mechanical means, e.g. pressing

Abstract

[Problem] To provide: a separator which has excellent strength and excellent electrical conductivity; and a method for producing this separator.　[Solution] The present invention relates to a separator 1 for power storage devices, the separator 1 being provided with a plate 2 that contains graphite, a resin and an aramid fiber that is different from the resin, wherein: a surface 31 of the plate 2 is provided with grooves 30, 32 that serve as flow channels; and the aramid fiber is a para-aramid fiber that contains a meta-phenylene group. The present invention also relates to a method for producing this separator 1.

IPC Classes  ?

• H01M 8/0221 - Organic resinsOrganic polymers
• H01M 8/0228 - Composites in the form of layered or coated products
• H01M 50/403 - Manufacturing processes of separators, membranes or diaphragms
• H01M 50/414 - Synthetic resins, e.g. .thermoplastics or thermosetting resins
• H01M 50/423 - Polyamide resins
• H01M 50/449 - Separators, membranes or diaphragms characterised by the material having a layered structure

Abstract

In order to provide a fuel cell separator having excellent strength, electrical conductivity, and gas barrier properties, a fuel cell separator 1 according to the present invention comprises: a plate 2, the constituent material of which contains granular or fibrous graphite and granular or fibrous resin; and a barrier layer 3 which has more favorable gas barrier characteristics than the plate 2, wherein the surface of the plate 2 is provided with grooves 30 serving as flow passages, and the barrier layer 3 covers at least the front-side surface and the rear-side surface of the plate 2, including the grooves 30 and portions of the surface of the plate 2 other than the grooves 30.

IPC Classes  ?

• H01M 8/0228 - Composites in the form of layered or coated products
• H01M 8/0213 - Gas-impermeable carbon-containing materials
• H01M 8/0221 - Organic resinsOrganic polymers
• H01M 8/026 - CollectorsSeparators, e.g. bipolar separatorsInterconnectors characterised by the configuration of channels, e.g. by the flow field of the reactant or coolant characterised by grooves, e.g. their pitch or depth

Abstract

A method of manufacturing a diamond substrate includes: a step of placing a laser condensing unit 190 configured to condense laser light B so as to face an upper surface 10a of a block 10 of single crystal diamond; and a step of forming a modified layer 20, which includes a processing mark 21b of graphite and a crack 22b extending along a surface (111) around the processing mark 21b, along the surface (111) of the single crystal diamond at a predetermined depth from an upper surface of the block by radiating the laser light B on the upper surface 10a of the block 10 from the laser condensing unit 190 under predetermined conditions and condensing the laser light B inside the block 10, and moving the laser condensing unit 190 and the block 10 in a relative manner two-dimensionally.

IPC Classes  ?

• H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof

Abstract

A method of manufacturing a diamond substrate includes: a step of placing a laser condensing unit 190 configured to condense laser light B so as to face an upper surface 10a of a block 10 of single crystal diamond, a step of forming a modified layer 20, which includes a processing mark 21 of graphite and a crack 22b extending along a surface (111) around the processing mark 21, in a partial region of the upper surface 10a of the block 10 along the surface (111) of the single crystal diamond, along the surface (111) of the single crystal diamond at a predetermined depth from the upper surface 10a of the block 10 by radiating the laser light B on the upper surface 10a of the block 10 from the laser condensing unit 190 under predetermined conditions and condensing the laser light B inside the block 10, and moving the laser condensing unit 190 and the block 10 in a relative manner two-dimensionally, and a step of forming a cleavage plane 25 at the predetermined depth of the remaining region of the upper surface 10a of the block 10 by spontaneously propagating cleavage from the modified layer 20.

IPC Classes  ?

• C30B 33/04 - After-treatment of single crystals or homogeneous polycrystalline material with defined structure using electric or magnetic fields or particle radiation
• B23K 26/40 - Removing material taking account of the properties of the material involved
• C30B 29/04 - Diamond
• C30B 33/08 - Etching
• C04B 41/00 - After-treatment of mortars, concrete, artificial stone or ceramicsTreatment of natural stone
• C04B 41/91 - After-treatment of mortars, concrete, artificial stone or ceramicsTreatment of natural stone of only ceramics involving the removal of part of the materials of the treated articles, e.g. etching

Abstract

Provided is an adhesive composition that is for forming a low-dielectric adhesive layer having heat resistance and being capable of preventing resin flow (resin flow-out properties), that exhibits excellent adhesiveness even with respect to a low-dielectric base material film having poor adhesiveness, and that has excellent electrical properties (dielectric properties) capable of handling 5G. Further, the adhesive composition can form an adhesive layer having superior adhesion-reliability even after being kept at 150°C for 168 hours.　The adhesive composition contains a resin composition including styrene-based elastomers. The styrene-based elastomers include a modified styrene-based elastomer. The styrene-based elastomers also include a styrene-based elastomer having a styrene ratio of 33 or more.

IPC Classes  ?

• H05K 1/03 - Use of materials for the substrate
• B32B 27/00 - Layered products essentially comprising synthetic resin
• C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
• C09J 125/08 - Copolymers of styrene
• H05K 3/28 - Applying non-metallic protective coatings
• H05K 9/00 - Screening of apparatus or components against electric or magnetic fields

Abstract

Provided is an adhesive composition that is for forming a low-dielectric adhesive layer having both heat resistance and chemical resistance (solvent resistance), that exhibits excellent adhesiveness even with respect to a low-dielectric base material film having poor adhesiveness, and that has excellent electrical properties (dielectric properties) capable of handling 5G.　The adhesive composition contains styrene-based elastomers, a bismaleimide resin, and a benzoxazine resin. The styrene-based elastomers include a styrene-based elastomer including an amino group.

IPC Classes  ?

• H05K 1/03 - Use of materials for the substrate
• B32B 27/00 - Layered products essentially comprising synthetic resin
• C09J 7/25 - PlasticsMetallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
• C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
• C09J 125/08 - Copolymers of styrene
• C09J 179/04 - Polycondensates having nitrogen-containing heterocyclic rings in the main chainPolyhydrazidesPolyamide acids or similar polyimide precursors

Abstract

The present invention provides an adhesive composition for forming a low-dielectric adhesive layer that has both heat resistance and chemical resistance (solvent resistance), the adhesive composition exhibiting favorable adhesion to a low-dielectric base material film having poor adhesion properties, while having favorable electrical properties (dielectric properties) compatible with 5G.　The adhesive composition contains a styrene elastomer and a benzoxazine resin, and the styrene elastomer includes a styrene elastomer containing an amino group.

IPC Classes  ?

• H05K 1/03 - Use of materials for the substrate
• B32B 27/00 - Layered products essentially comprising synthetic resin
• C09J 7/25 - PlasticsMetallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
• C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
• C09J 125/08 - Copolymers of styrene
• C09J 179/04 - Polycondensates having nitrogen-containing heterocyclic rings in the main chainPolyhydrazidesPolyamide acids or similar polyimide precursors
• H05K 3/38 - Improvement of the adhesion between the insulating substrate and the metal

Abstract

[Problem] To increase thermal conduction of a thermally conductive member interposed between a heat source and a cooling member.　[Solution] The present invention pertains to a thermally conductive member 1 that can be interposed between a heat source and a cooling member to cause heat to move from the heat source to the cooling member. The thermally conductive member 1 comprises: an elastic sheet 10 that is elastically deformable at least in the thickness direction; and a thermally conductive film 20 provided so as to advance by meandering in a predetermined direction in the sheet plane at a right angle to the thickness direction of the elastic sheet 10, while being exposed at the front surface and the back surface, in an alternating manner, in the thickness direction of the elastic sheet 10. The elastic sheet 10 is provided with a tapered part 15 or a curved part at the edge contacting the thermal conducive film 20. The thermally conductive film 20 covers the tapered member 15 or the curved member of the elastic sheet 10. The present invention also pertains to: a manufacturing method of the thermally conductive member; and a battery.

IPC Classes  ?

• H01M 10/613 - Cooling or keeping cold
• H01M 10/653 - Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
• H01M 10/6554 - Rods or plates
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

According to one embodiment, a substrate storage container includes a transport component configured to be mountable to a container body by being relatively displaced with respect to the container body from the rear side to the front side. The container body has a container body-side protrusion protruding upward. The transport component has a transport component-side protrusion protruding downward. In a mounted state, the transport component-side protrusion is engaged with the front side of the container body-side protrusion to be restricted from being displaced backwards. When a predetermined load is applied to the transport component-side protrusion upwardly, the transport component-side protrusion is displaced by a smaller amount than the container body-side protrusion displaced when the predetermined load is applied to the container body-side protrusion downwardly.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations

Abstract

A substrate accommodating container according to the present invention comprises a container main body capable of accommodating a substrate (W), a lid (20) for closing an opening in the container main body, a retainer (50) installed in the lid (20), and a left and right pair of substrate supporting portions (55) which are formed in the retainer (50), and which hold the substrate (W) by sandwiching the same against the container main body, wherein the substrate supporting portions (55) have an arcuate shape in a cross-sectional view from a vertical direction perpendicular to a closing direction of the lid (20). Further, the substrate supporting portions (55) form U-shaped slots together with a pair of substrate guide portions (56) which are provided upright from both upper and lower edges. It is thus possible to provide a substrate accommodating container capable of holding substrates stably, even if the substrate thicknesses differ.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure

Abstract

This panel accommodating container comprises a container main body for accommodating a plurality of panels, and a panel supporting portion provided inside the container main body to support the plurality of panels, wherein: the panel supporting portion is provided with a first shaft extending in a first direction, for supporting one panel among the plurality of panels; the container main body is provided with a first support strut for fixing the first shaft; the first shaft has a first end portion and a second end portion, which are two end portions thereof in the first direction; a first fitting hole into which the first end portion is fitted is provided in the first support strut; and the first fitting hole is inclined upward with increasing distance toward the inside of the container main body in the first direction.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• B65D 85/42 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for ampoulesContainers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for lamp bulbsContainers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for electronic valves or tubes
• B65D 85/48 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets

Abstract

A substrate storage container includes: an opening on a front surface side; and a gas supply mechanism on a bottom surface. The gas supply mechanism has: an introduction path configured to receive a gas from a bottom surface side; a check valve disposed at a position that does not overlap with the introduction path in a horizontal plane along the bottom surface; and a flow path configured to supply the gas from the introduction path to the check valve.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• B08B 9/093 - Cleaning of containers, e.g. tanks by the force of jets or sprays
• B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure

Abstract

A multilayer sheet disposed at least between a plurality of heat sources and capable of conducting heat from the heat sources includes: a rubber sheet made of a rubber-like elastic body; heat insulating sheets laminated on both surfaces of the rubber sheet and capable of reducing heat conduction between the plurality of adjacent heat sources; and first heat conductive sheets laminated outside the heat insulating sheets in a separated manner and having more excellent heat conductivity than the rubber sheet and the heat insulating sheets, in which the heat insulating sheets have a bag shape wrapping the rubber sheet, and a cell unit including the multilayer sheet.

IPC Classes  ?

• H01M 10/658 - Means for temperature control structurally associated with the cells by thermal insulation or shielding
• B32B 25/04 - Layered products essentially comprising natural or synthetic rubber comprising rubber as the main or only constituent of a layer, next to another layer of a specific substance
• H01M 10/613 - Cooling or keeping cold
• H01M 50/204 - Racks, modules or packs for multiple batteries or multiple cells

Abstract

[Problem] With respect to a thermal conduction member, to reduce damage to a thermal conduction film serving as a heat flow path during compression in the thickness direction.　[Solution] The present invention pertains to a thermal conduction member 1 that can be interposed between a heat source and a cooling unit to cause heat to move from the heat source to the cooling unit. The thermal conduction member 1 comprises: an elastic sheet 10 that is elastically deformable at least in the thickness direction; and a thermal conduction film 20 provided so as to advance meandering in a predetermined direction in the sheet plane at a right angle to the thickness direction of the elastic sheet 10 while also being alternately exposed to the front-side surface and the reverse-side surface of the thickness direction of the elastic sheet 10. The thermal conduction film 20 is provided to the elastic sheet 10 so that all or a major portion of a predetermined direction is inclined at an acute angle to the thickness direction in the cross-section of the thickness direction of the elastic sheet 10. The present invention also pertains to a battery provided with the thermal conduction member.

IPC Classes  ?

• H01L 23/36 - Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
• H01M 10/613 - Cooling or keeping cold
• H01M 10/625 - Vehicles
• H01M 10/655 - Solid structures for heat exchange or heat conduction

Abstract

A substrate storage container includes: a container body configured to store a substrate; a lid configured to close an opening formed on the front side of the container body; and a retainer arranged on the back of the lid and configured to restrict the substrate from moving to the front side. The retainer includes an integration of: a frame configured to be detachably attached to the back of the lid; a contact portion including a convex portion configured to contact the substrate and restrict the substrate from moving to the front side; and a beam structure that connects the frame and the contact portion. The contact portion and the beam structure are configured to be spaced apart from the lid.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers

Abstract

Provided is a panel storage container including: a container body that has a flange that demarcates an opening and that stores a plurality of panels; a lid body that closes the opening; and a protruding protective member that is provided between an outer circumferential surface of the lid body and an inner circumferential surface of the flange, the circumferential surfaces being opposed to each other in a state in which the lid body closes the opening.

IPC Classes  ?

• B65D 85/86 - Containers, packaging elements or packages, specially adapted for particular articles or materials for electrical components
• B65D 85/48 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers

Abstract

Provided is an adhesive composition for forming low-dielectric adhesive layers which have satisfactory electrical properties (dielectric properties) that render the adhesive layer adaptable to the 5th generation mobile communication system (5G) and which have satisfactory adhesiveness also to low-dielectric base films having poor bondability and further have heat resistance and chemical resistance (solvent resistance), the adhesive composition being capable of being reduced in resin flow.　The adhesive composition comprises a hardener and a resin composition including a modified styrene-based elastomer, wherein the modified styrene-based elastomer is contained in an amount of 25 parts by mass or more per 100 parts by mass of the resin composition and the resin composition has a melt flow rate (200°C, 21.60 kg) of 40 g/10 min or less.

IPC Classes  ?

• C09J 125/08 - Copolymers of styrene
• C09J 153/02 - Vinyl aromatic monomers and conjugated dienes
• C09J 7/25 - PlasticsMetallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
• C09J 7/35 - Heat-activated
• H05K 1/03 - Use of materials for the substrate
• H05K 3/28 - Applying non-metallic protective coatings

Abstract

The present invention provides a fixing pad 10 comprising a base material 11 and a sliding layer 13 provided over a principal surface 11a of the base material 11, wherein the sliding layer 13 is formed from a woven material or knitted material containing fluorocarbon fiber and/or glass fiber, and wherein a sliding surface 13a of the sliding layer 13 has a surface roughness Ra of 12.0 μm or less.

IPC Classes  ?

• G03G 15/20 - Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat

Abstract

1313 of the sliding member 13 from a surface 13b of the sliding member 13 on the base material 11 side.

IPC Classes  ?

• G03G 15/20 - Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat

Abstract

Provided is a substrate storage container provided with a valve body that improves assembly workability.　This substrate storage container comprises a valve body 40 that controls the flow of a gas to a container body 10. The valve body 40 comprises: a first path 458 that communicates with the outside; an elastic valve body 45 that has a valve opening 454 that allows communication with a second path 459 that communicates with the inside; a retention member 41 that retains the elastic valve body 45; and a fastening cap 47 that, by being inserted into the elastic valve body 45, fixes the elastic valve body 45 to the retention member 41. The valve opening 454 is closed by adhesion resulting from the elastic force of the elastic valve body 45.

IPC Classes  ?

• F16K 15/14 - Check valves with flexible valve members
• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• B65D 85/86 - Containers, packaging elements or packages, specially adapted for particular articles or materials for electrical components

Abstract

Provided is a substrate storage container capable of suppressing seal defects due to a gasket when an opening of a container body is closed with a lid.　This substrate storage container 1 comprises: a container body 10 capable of storing a substrate; a lid 20 which closes a rectangular opening of the container body 10; and an annular gasket 30 provided between the container body 10 and the lid 20, wherein the container body 10 has, in an opening section 11 that forms the opening, at least one among a guide rib 40 or a guide slit 50, the lid 20 has at least one among a guide slit 50 or a guide rib 40 which can engage with the guide rib 40 or the guide slit 50 of the container body 10, and when the opening is closed with the lid 20, the guide rib 40 engages with the guide slit 50, thereby preventing the lid 20 from inclining at an angle greater than a certain angle with respect to an opening surface that forms the opening.

IPC Classes  ?

• B65D 43/04 - Removable lids or covers having a part, or parts, engaging within the mouth of the container and retained by friction or gravity
• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure

Abstract

In a heat, dissipating structure, a plurality of heat dissipating members for a heat source are connected. Each heat dissipating member has a heat conduction sheet that extends while winding in a spiral shape for conducting the heat from the heat source; a cushion member which is provided on an annular rear side of the heat conduction sheet and can be more easily deformed corresponding to the outer surface shape of the heat source than the heat conduction sheet; an adhesive layer that fixes the heat conduction sheet and the cushion member and is more easily deformed than the heat conduction sheet; and a through passage penetrating in the direction in which the heat conduction sheet extends while being wound. The heat dissipating members are connected by connection members in a state of being aligned perpendicular to the direction in which the heat conduction sheet extends while being wound.

IPC Classes  ?

• H01M 10/6556 - Solid parts with flow channel passages or pipes for heat exchange
• H01L 23/367 - Cooling facilitated by shape of device
• H01M 10/0525 - Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodesLithium-ion batteries
• H01M 10/613 - Cooling or keeping cold
• H01M 10/625 - Vehicles
• H01M 10/653 - Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
• H01M 10/655 - Solid structures for heat exchange or heat conduction
• H01M 10/6567 - Liquids
• H01M 50/204 - Racks, modules or packs for multiple batteries or multiple cells
• H01M 50/224 - Metals
• H01M 50/242 - MountingsSecondary casings or framesRacks, modules or packsSuspension devicesShock absorbersTransport or carrying devicesHolders characterised by physical properties of casings or racks, e.g. dimensions adapted for protecting batteries against vibrations, collision impact or swelling

Abstract

Provided is a diffused light control sheet (10) comprising: a louver layer (1) in which a light-transmission band (2) and a light-shielding band (3) are alternately and repeatedly provided; a transparent protective layer (4) provided on the first surface of the louver layer; and a light diffusion layer (5) provided on the second surface of the louver layer, the haze measured in accordance with JIS K 7136 (2000) of the light diffusion layer being 93% or greater.

IPC Classes  ?

• G02B 5/00 - Optical elements other than lenses
• B32B 7/023 - Optical properties
• B32B 25/08 - Layered products essentially comprising natural or synthetic rubber comprising rubber as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
• B32B 25/20 - Layered products essentially comprising natural or synthetic rubber comprising silicone rubber
• B32B 27/36 - Layered products essentially comprising synthetic resin comprising polyesters
• F21S 2/00 - Systems of lighting devices, not provided for in main groups or , e.g. of modular construction
• F21V 3/06 - GlobesBowlsCover glasses characterised by materials, surface treatments or coatings characterised by the material
• F21V 11/02 - Screens not covered by groups , , or using parallel laminae or strips, e.g. of Venetian-blind type
• G02B 5/02 - Diffusing elementsAfocal elements
• F21Y 115/10 - Light-emitting diodes [LED]

Abstract

Provided is a developing roller that has suitable toner release properties and excellent filming resistance.　The developing roller 1 comprises a shaft 2, an elastic layer 3 provided to the outer surface of the shaft 2 and containing a silicone rubber, and a coating layer 4 provided outside the elastic layer 3 and containing a silicone-modified urethane resin. The adhesive force of the coating layer 4 as measured by a nanoindenter is 4.0 μN or less. The capacitance of the coating layer 4 is preferably 11 nF or less at 0.1 Hz.

IPC Classes  ?

• F16C 13/00 - Rolls, drums, discs, or the likeBearings or mountings therefor
• C08L 75/04 - Polyurethanes
• G03G 15/08 - Apparatus for electrographic processes using a charge pattern for developing using a solid developer, e.g. powder developer

Abstract

Provided is an adhesive composition that makes it possible to prevent resin flow on the occasion of thermocompression bonding by controlling mechanical characteristics, that exhibits suitable electrical characteristics, and whereby it is possible to form an adhesive layer having suitable adhesion.　The adhesive composition contains at least an inorganic filler and a resin composition including a styrene elastomer. The content of the inorganic filler is 1-180 parts by mass with respect to 100 parts by mass of the resin composition. The inorganic filler has a plate-like or scale-like shape. An adhesive layer obtained by curing the adhesive composition has a dielectric constant of 3.5 or less at a frequency of 28 GHz. The dielectric loss tangent of the adhesive layer at a frequency of 28 GHz is 0.005 or less.

IPC Classes  ?

• B32B 27/00 - Layered products essentially comprising synthetic resin
• C09J 11/04 - Non-macromolecular additives inorganic
• C09J 109/06 - Copolymers with styrene
• C09J 125/08 - Copolymers of styrene
• C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
• H05K 1/03 - Use of materials for the substrate

Abstract

[Problem] To provide: a heat dissipation member that can be adapted to various forms of heat source, has excellent elastic deformability, and has high heat dissipation properties and electrical insulation properties; a heat dissipation structure; and a battery.　[Solution] The present invention pertains to: a heat dissipation member 2 for enhancing heat dissipation from a heat source, the heat dissipation member 2 having a form in which a sheet 1 is curved in an arcuate shape, the sheet 1 being provided with a heat conduction member 20 and a coating layer 10 coating the outside of the heat conduction member 20; a heat dissipation structure comprising two or more heat dissipation members 2; and a battery comprising a heat dissipation member 2.

IPC Classes  ?

• H01M 10/613 - Cooling or keeping cold
• H01M 10/625 - Vehicles
• H01M 10/653 - Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
• H01M 10/655 - Solid structures for heat exchange or heat conduction
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

Provided are a storage container and a method for manufacturing the same that are capable of improving the strength and airtightness of a molded container.　This storage container has, as a functional resin member, an insert component of a container body 1, said insert component being insert molded from a molding material containing a specified resin, and the functional resin member is made to be a sidewall plate 20 including a plurality of support pieces 12, said sidewall plate 20 having a thick part 21 that has an equivalent or greater thickness than the thickness of a sidewall 11 of the container body 1, and a thin joining part 22 that is formed on the periphery of said thick part 21 and that clamps to a peripheral wall 2 of the container body 1 so as to be joined. When insert molding the container body 1, the majority of the peripheral wall 2 of the container body 1 and the thin joining part 22 of the sidewall plate 20 are caused to engage and join, and the contact area of the peripheral wall 2 and the joining part 22 are expanded. Consequently, it is possible to eliminate the deterioration of the mechanical strength and the leakiness of around the sidewall plate 20 peripheral part in the sidewall 11 of the container body 1, and it is possible to prevent the separation of the peripheral wall 2 of the container body 1 and the sidewall plate 20.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• B65D 85/86 - Containers, packaging elements or packages, specially adapted for particular articles or materials for electrical components

Abstract

A heat dissipation structure for a battery includes a plurality of heat dissipation members. The heat dissipation members are each provided with: a heat conductive sheet having a shape that extends while winding in a spiral shape for transferring the heat from the heat source, a cushion member which is provided on an annular rear surface of the heat conductive sheet and can be more easily deformed to conform to the outer surface shape of the heat source than the heat conductive sheet, and a penetration path penetrating in the direction in which the heat conductive sheet extends while winding. The plurality of heat dissipation members is connected to each other by connection members in a state of being aligned in a direction perpendicular to the direction in which the beat conductive sheet extends while winding.

IPC Classes  ?

• H01M 10/6556 - Solid parts with flow channel passages or pipes for heat exchange
• H01L 23/367 - Cooling facilitated by shape of device
• H01M 10/613 - Cooling or keeping cold
• H01M 10/653 - Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
• H01M 10/655 - Solid structures for heat exchange or heat conduction
• H01M 10/6567 - Liquids
• H01M 50/204 - Racks, modules or packs for multiple batteries or multiple cells
• H01M 50/242 - MountingsSecondary casings or framesRacks, modules or packsSuspension devicesShock absorbersTransport or carrying devicesHolders characterised by physical properties of casings or racks, e.g. dimensions adapted for protecting batteries against vibrations, collision impact or swelling
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• H01M 50/224 - Metals

Abstract

[Problem] To provide an anticorrosion structure of advanced anticorrosion effectiveness, and a method of manufacturing the same.　[Solution] The present invention relates to an anticorrosion structure 6 and a method of manufacturing the same, the anticorrosion structure 6 comprising at least one of a metal bolt 2 and a metal nut 3, and an anticorrosion member 1 that covers a section protruding from a joint surface 50 of a joint employing the at least one of the bolt and the nut, wherein the anticorrosion member 1 is composed of a silicone rubber which is a cured silicone rubber compound.

IPC Classes  ?

• C23F 15/00 - Other methods of preventing corrosion or incrustation
• F16B 33/06 - Surface treatment of parts furnished with screw-thread, e.g. for preventing seizure
• F16B 37/14 - Cap nutsNut caps or bolt caps
• H02G 7/00 - Overhead installations of electric lines or cables

Abstract

The present invention provides an adhesive composition for forming a low-dielectric adhesive layer that has both heat resistance and chemical resistance (solvent resistance), the adhesive composition exhibiting satisfactory bonding properties, with respect to a low-dielectric base material film having poor bonding properties, while having satisfactory electrical properties (dielectric properties) capable of handling 5G.　Said adhesive composition contains a styrene-based elastomer and an epoxy-modified resin having a structure represented by formula (1) below. (R1, R2, R3, and R4are each independently hydrogen or an organic group. Note that at least one of R1and R2is an organic group, and at least one of R3and R4 is an organic group.)

IPC Classes  ?

• B32B 27/30 - Layered products essentially comprising synthetic resin comprising vinyl resinLayered products essentially comprising synthetic resin comprising acrylic resin
• C09J 125/10 - Copolymers of styrene with conjugated dienes
• C09J 153/02 - Vinyl aromatic monomers and conjugated dienes
• C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
• C09J 163/10 - Epoxy resins modified by unsaturated compounds

Abstract

This cell culturing silicone rubber sheet (10) has a plurality of regularly arranged through-holes (2), wherein the average opening diameter of the plurality of through-holes opened in a first surface (1a) of said silicone rubber sheet is 0.4-10 μm, and the thickness of the silicone rubber sheet is 5-200 μm.

IPC Classes  ?

• C12M 1/00 - Apparatus for enzymology or microbiology

Abstract

The present invention provides: a resin film which is produced from a polyarylene ether ketone resin and has improved thermal dimensional stability without deteriorating heat resistance and low dielectric characteristics, while being suppressed in increase of the relative dielectric constant or tanδ due to high humidity; a method for producing this resin film; a printed wiring board; a coverlay; and a multilayer body.　A resin film 2 which is used for a printed wiring board 1 or the like and contains a polyarylene ether ketone resin, a fluorine-based resin and a synthetic mica, wherein: the total content of the polyarylene ether ketone resin and the fluorine-based resin is set to 100 parts by mass; the content of the synthetic mica is set to a value from 10 parts by mass to 80 parts by mass; the mass ratio of the polyarylene ether ketone resin to the fluorine-based resin, namely (polyarylene ether ketone resin)/(fluorine-based resin) is set to a value from 98/2 to 50/50; and the relative crystallinity of the polyarylene ether ketone resin is set to 80% or higher.

IPC Classes  ?

• B32B 27/00 - Layered products essentially comprising synthetic resin
• B32B 27/18 - Layered products essentially comprising synthetic resin characterised by the use of special additives
• B32B 27/30 - Layered products essentially comprising synthetic resin comprising vinyl resinLayered products essentially comprising synthetic resin comprising acrylic resin
• C08L 27/12 - Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogenCompositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
• C08L 71/08 - Polyethers derived from hydroxy compounds or from their metallic derivatives
• C08J 5/18 - Manufacture of films or sheets
• B32B 15/082 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising vinyl resinsLayered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising acrylic resins
• C08K 3/34 - Silicon-containing compounds
• H05K 3/28 - Applying non-metallic protective coatings

Abstract

A conductive polymer dispersion of this disclosure includes: a conductive composite containing a π-conjugated conductive polymer and a polyanion; an isocyanurate-based compound; and a dispersion medium for dispersing the conductive composite.

IPC Classes  ?

• C09D 5/24 - Electrically-conducting paints
• H01B 1/12 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of other non-metallic substances organic substances
• C08K 5/3492 - Triazines
• C09D 7/63 - Additives non-macromolecular organic
• C08G 61/12 - Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
• C08L 65/00 - Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chainCompositions of derivatives of such polymers
• H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables
• C08L 101/12 - Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
• C08K 5/3477 - Six-membered rings
• C09D 7/20 - Diluents or solvents
• C09D 165/00 - Coating compositions based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chainCoating compositions based on derivatives of such polymers
• C09D 167/00 - Coating compositions based on polyesters obtained by reactions forming a carboxylic ester link in the main chainCoating compositions based on derivatives of such polymers
• C09D 175/12 - Polyurethanes from compounds containing nitrogen and active hydrogen, the nitrogen atom not being part of an isocyanate group

Abstract

Provided is a sponge roller having high durability.　The present invention is a sponge roller 1 comprising a shaft body 2 and a foamed elastic layer 3 formed on the outer circumference of the shaft body 2, wherein: the foamed elastic layer 3 is formed by foaming and vulcanizing a composition which is for a foamed elastic layer and contains a millable-type silicone rubber composition, a vinyl group-containing silicone crude rubber, a foaming agent, and a crosslinking agent; and the loss factor tanδ of a cured product of a rubber composition, which is obtained by removing the foaming agent from the composition for a foamed elastic layer, is at most 0.035 under the following measurement conditions. Frequency of 8 Hz, temperature of 100ºC, and strain control of 5 μm

IPC Classes  ?

• F16C 13/00 - Rolls, drums, discs, or the likeBearings or mountings therefor
• C08L 83/04 - Polysiloxanes
• G03G 15/00 - Apparatus for electrographic processes using a charge pattern
• G03G 15/20 - Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat

Abstract

[Problem] To provide a heat radiation structure and a battery that may adapt to various forms of a heat source, have excellent elastic deformation, have excellent heat radiation efficiency, improve the equalization of the heat radiation of each of a plurality of heat sources, and improve the productivity.　[Solution] The present invention relates to a heat radiation structure 1 and a battery, including: a plurality of heat radiation members 20; and a support plate 10 for supporting the plurality of heat radiation members 20, the heat radiation members 20 including a plurality of cushion members 22 having a hollow or solid shape, and heat conducting sheets 21 covering the outside surfaces of the cushion members 22, the support plate 10 including a plurality of trench parts 15 in a direction perpendicular to the longitudinal direction of the heat radiation members 20, the trench parts 15 being for supporting the heat radiation members 20, and each trench part 15 being a curved trench part that is open on the heat radiation member 20 side and recessed in the thickness direction, each trench part 15 being formed to have a curvature radius R2 larger than the curvature radius R1 of each heat radiation member 20 and a depth T smaller than the circle conversion diameter D of each heat radiation member 20.

IPC Classes  ?

• H01L 23/36 - Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
• H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
• H01M 10/613 - Cooling or keeping cold
• H01M 10/617 - Types of temperature control for achieving uniformity or desired distribution of temperature
• H01M 10/647 - Prismatic or flat cells, e.g. pouch cells
• H01M 10/6554 - Rods or plates
• H01M 10/6556 - Solid parts with flow channel passages or pipes for heat exchange
• H01M 10/6563 - Gases with forced flow, e.g. by blowers
• H01M 10/6568 - Liquids characterised by flow circuits, e.g. loops, located externally to the cells or cell casings
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

An alloy resin usable for forming a surface layer of a shaped article comprising a base layer and the surface layer, the alloy resin comprising the vinyl-chloride-based resin and the methyl-methacrylate-based resin in a mass ratio of 20:80 to 90:10. When the ratio (W) of the mass of the methyl-methacrylate-based resin to the total mass of the vinyl-chloride-based resin and the methyl-methacrylate-based resin is plotted as the abscissa and the melt flow rate (R) of the alloy resin, measured in accordance with JIS K 7210-1, is plotted as the ordinate to obtain a graph, then the plots lie in a range sandwiched between a line represented by R=6.25-4.7×W and a line represented by R=4.50-4.7×W.

IPC Classes  ?

• B32B 27/18 - Layered products essentially comprising synthetic resin characterised by the use of special additives
• B32B 27/30 - Layered products essentially comprising synthetic resin comprising vinyl resinLayered products essentially comprising synthetic resin comprising acrylic resin
• C08L 27/06 - Homopolymers or copolymers of vinyl chloride
• C08L 33/12 - Homopolymers or copolymers of methyl methacrylate

Abstract

The purpose of the present invention is to provide a vertical contact-type probe, a probe card, and a socket that have excellent durability for the inspection of a DUT, i.e., a semiconductor IC or a packaged semiconductor, having a small electrode interval, and that can handle high-frequency inspection of DUTs having high operation frequency. Provided is a vertical contact-type probe (1) which, in a state in which: a first needle-like electrically conductive member (20) extends in a thickness direction of an elastomer sheet (12) on a first surface (10a) side of an elastomer connector (10); a first end (20a) of the first needle-like electrically conductive member (20) is in contact with a metal thin wire (14); a second needle-like electrically conductive member (30) extends in a thickness direction of the elastomer sheet (12) on a second surface (10b) side of the elastomer connector (10); a first end (30a) of the second needle-like electrically conductive member (30) is in contact with the metal thin wire (14); and a second end (30b) of the second needle-like electrically conductive member (30) is in contact with an electrode terminal of a circuit board, inspects a DUT by causing a second end (20b) of the first needle-like electrically conductive member (20) to contact an electrode of the DUT.

IPC Classes  ?

• H01L 23/32 - Holders for supporting the complete device in operation, i.e. detachable fixtures
• H01L 21/66 - Testing or measuring during manufacture or treatment
• H01R 33/76 - Holders with sockets, clips or analogous contacts, adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
• G01R 1/073 - Multiple probes
• G01R 31/26 - Testing of individual semiconductor devices

Abstract

Provided is a metal-clad laminated plate in which transmission loss of electrical signals can be reduced, the fineness in pitch of a circuit pattern can be increased, and a very fine circuit can be formed with high precision, the metal-clad laminated plate having exceptional adhesion of a metal film.　A metal-clad laminated plate obtained by laminating a coating film and a metal film on a substrate film in the stated order, wherein: the metal film is formed by at least one formation process from among plating, sputtering, and deposition; and the surface roughness (Rz) of the coating film is 1 μm or less.

IPC Classes  ?

• B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin

Abstract

The purpose of the present invention is to provide: an alloy resin which contains a vinyl chloride resin and a methyl methacrylate resin and enables the achievement of a molded article that exhibits excellent transparency; and a molded article which uses this alloy resin. An alloy resin which is obtained by blending a vinyl chloride resin and a methyl methacrylate resin at a mass ratio of from 50:50 to 90:10, wherein if an arbitrarily selected part thereof is observed with a transmission electron microscope at a magnification of 3,000 times, a white spot having a size of 4 μm2 or more is not observed within a region having a length of 55 μm and a width of 80 μm, said region being arbitrarily selected from a microscopic image thereof.

IPC Classes  ?

• C08L 27/06 - Homopolymers or copolymers of vinyl chloride
• C08L 33/12 - Homopolymers or copolymers of methyl methacrylate