Abstract

A device of mass transferring chips includes a first substrate, which includes a chip-connecting area configured to connect a chip. The device further includes a second substrate, which includes a support layer and a first adhesive layer. The chip is between the first substrate and the second substrate. The first adhesive layer includes a first surface, a second surface, and a patterned recess. The first surface has a chip-receiving area configured to attach the chip from the first substrate. The second surface is opposite to the first surface and is in contact with a first side of the support layer. The patterned recess is disposed on the first surface and spaced apart from the chip-receiving area.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
• H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
• H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
• H01L 33/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof

Abstract

A memory chip includes a first decoding device and a memory device. The first decoding device is configured to generate multiple word line signals. The memory device is configured to generate a third data signal based on a first data signal and a second data signal. The memory device includes a first memory circuit and a second memory circuit. The first memory circuit is configured to generate the first data signal at a first node according to the word line signals during a first period. The second memory circuit is configured to generate the second data signal at a second node different from the first node according to the word line signals during a second period after the first period. A method of operating a memory chip is also disclosed herein.

IPC Classes  ?

• G11C 8/10 - Decoders
• G11C 8/08 - Word line control circuits, e.g. drivers, boosters, pull-up circuits, pull-down circuits, precharging circuits, for word lines
• G11C 8/18 - Address timing or clocking circuitsAddress control signal generation or management, e.g. for row address strobe [RAS] or column address strobe [CAS] signals

Abstract

The invention provides a display device, comprising: a first substrate having a peripheral region and a display region, a plurality of pixel units disposed in the display region; a second metal layer electrically connected to the plurality of pixel units; a first planarization layer including a plurality of bump pad groups and a plurality of opening regions; a third metal layer having a position corresponding to the plurality of opening regions; a second substrate; a light shielding layer, a first color resist layer and a second planarization layer disposed on the second substrate; a second color resist layer; wherein in the display region, the second color resist layer is adjacent to the first color resist layer, and in the peripheral region, the second color resist layer and the first color resist layer are stacked, and a position of the second color resist layer corresponds to the plurality of opening regions.

IPC Classes  ?

• H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
• H01L 27/15 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier, specially adapted for light emission

Goods & Services

Computer assembly to the order and specification of others; Video and/or digital image display device assembly to the order and specification of others Computer hardware; Software as a Medical Device (SaMD), recorded on computer media, for viewing images from an endoscope; Computer screen saver software, recorded on computer media; Recorded computer software for controlling the operation of an industrial endoscope; wearable video display monitors; Television monitors; Liquid crystal display (LCD) monitors; Computer display monitors; Flat panel display screens; LCD large-screen displays; Computer screens; Downloadable computer game software for use on mobile and cellular phones; recorded software for processing and displaying digital images of the anatomy for diagnosis and treatment; Downloadable computer software for monitoring, accessing, reading, and tracking information in the field of patient medical records; Downloadable software in the nature of a mobile application for use in database management; Downloadable computer programs for processing digital images; touch screen; touch panel; interactive touch screen terminal; Recorded computer software platforms for managing software download; computer terminals; thin client computers; Downloadable computer software development tools; computers for integrating digital data; Fingerprint scanners; computer hardware, for use in facial recognition; Electronic interactive whiteboards; Tablet computers; Electronic notice boards; Digital signage display panels Computer services, namely, designing and implementing for monitoring computer systems for error detection, designing and implementing for websites of others, designing, researching, developing and testing for new product in the field of displaying device for others, designing new liquid crystal display for others; computer software design; Maintenance and updating of computer software; software maintenance; leasing of computer program for data monitoring and data accessing; rental of computer software, namely, leasing of computer software for use in software development and in database management; Consultation about the maintenance and updating of computer software; technical consultation in the field of computer software; computer system analysis; computer system design; Installation, maintenance, and updating of computer software; computer program duplication; service for providing the time-restricted use of non-downloadable on-line computer software for monitoring of computer systems for tracking any data accessing; consultation for computer hardware design and computer software development; remote monitoring of computer systems for tracking data accessing; Monitoring of computer systems to detect breakdowns; Information technology consulting services, namely, consulting in the field of information technology relating to installation, maintenance, and repair of computer software; providing information relating to computer technology and programming via a website; cloud computing featuring software for providing a communication network to connect with vehicles; consultation for web site design; software as a service (SAAS) services featuring software for providing a communication network to connect with vehicles; Outsource service provider in the field of information technology consulting, namely in the field of information technology relating to installation, maintenance, and repair of computer software; software development in the framework of software publishing; Platform as a service (PAAS) featuring computer software platforms for providing a communication network to connect with vehicles; Electrical engineering consultancy; Research and development of new products for others; new product design service in the field of video and/or digital image display device for others; product research, product development, and product testing all in the field of video and/or digital image display device for others; product design service for others in the field of electronic products and related components; designing liquid crystal display devices for others

Goods & Services

Computer assembly to the order and specification of others; Video and/or digital image display device assembly to the order and specification of others Computer hardware; Software as a Medical Device (SaMD), recorded on computer media, for viewing images from an endoscope; Computer screen saver software, recorded on computer media; Recorded computer software for controlling the operation of an industrial endoscope; wearable video display monitors; Television monitors; Liquid crystal display (LCD) monitors; Computer display monitors; Flat panel display screens; LCD large-screen displays; Computer screens; Downloadable computer game software for use on mobile and cellular phones; recorded software for processing and displaying digital images of the anatomy for diagnosis and treatment; Downloadable computer software for monitoring, accessing, reading, and tracking information in the field of patient medical records; Downloadable software in the nature of a mobile application for use in database management; Downloadable computer programs for processing digital images; touch screen; touch panel; interactive touch screen terminal; Recorded computer software platforms for managing software download; computer terminals; thin client computers; Downloadable computer software development tools; computers for integrating digital data; Fingerprint scanners; computer hardware, for use in facial recognition; Electronic interactive whiteboards; Tablet computers; Electronic notice boards; Digital signage display panels Computer services, namely, designing and implementing for monitoring computer systems for error detection, designing and implementing for websites of others, designing, researching, developing and testing for new product in the field of displaying device for others, designing new liquid crystal display for others; computer software design; Maintenance and updating of computer software; software maintenance; leasing of computer program for data monitoring and data accessing; rental of computer software, namely, leasing of computer software for use in software development and in database management; Consultation about the maintenance and updating of computer software; technical consultation in the field of computer software; computer system analysis; computer system design; Installation, maintenance, and updating of computer software; computer program duplication; service for providing the time-restricted use of non-downloadable on-line computer software for monitoring of computer systems for tracking any data accessing; consultation for computer hardware design and computer software development; remote monitoring of computer systems for tracking data accessing; Monitoring of computer systems to detect breakdowns; Information technology consulting services, namely, consulting in the field of information technology relating to installation, maintenance, and repair of computer software; providing information relating to computer technology and programming via a website; cloud computing featuring software for providing a communication network to connect with vehicles; consultation for web site design; software as a service (SAAS) services featuring software for providing a communication network to connect with vehicles; Outsource service provider in the field of information technology consulting, namely in the field of information technology relating to installation, maintenance, and repair of computer software; software development in the framework of software publishing; Platform as a service (PAAS) featuring computer software platforms for providing a communication network to connect with vehicles; Electrical engineering consultancy; Research and development of new products for others; new product design service in the field of video and/or digital image display device for others; product research, product development, and product testing all in the field of video and/or digital image display device for others; product design service for others in the field of electronic products and related components; designing liquid crystal display devices for others

Abstract

A display device includes a multiple of light-emitting elements and a multiple of driving circuits. Each of the multiple of driving circuits is configured to generate a driving current flowing through one of the multiple of light-emitting elements. Each of the multiple of driving circuits includes a first transistor, a second transistor, a reset circuit, a first control circuit and a second control circuit. The driving current flows from a first system high voltage terminal through the first transistor, the second transistor and one of the multiple of light-emitting elements to a system low voltage terminal. The first control circuit is configured to control the first transistor to modulate pulse amplitude of the driving current. The second control circuit is configured to control the second transistor to modulate pulse width of the driving current.

IPC Classes  ?

• G09G 3/32 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
• G09G 3/20 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix

Abstract

An antenna device includes first to third antenna units and a feed-in line. An angle between the second antenna unit and the first antenna unit is substantially equal to 90 degrees. An angle between the third antenna unit and the first antenna unit is substantially equal to 90 degrees. The feed-in line crosses over each of the first to third antenna units in a view, and is configured to turn on and turn off each of the first to third antenna units. The first antenna unit and the second antenna unit are configured to generate a first polarized signal, the third antenna unit and the second antenna unit are configured to generate a second polarized signal, and the first polarized signal and the second polarized signal have different polarizations.

IPC Classes  ?

• H01Q 5/35 - Individual or coupled radiating elements, each element being fed in an unspecified way for different propagation modes using two or more simultaneously fed points
• H01Q 1/50 - Structural association of antennas with earthing switches, lead-in devices or lightning protectors
• H01Q 21/24 - Combinations of antenna units polarised in different directions for transmitting or receiving circularly and elliptically polarised waves or waves linearly polarised in any direction
• H01Q 21/28 - Combinations of substantially independent non-interacting antenna units or systems

Abstract

A light emitting diode structure includes a substrate, a chip on a top surface of the substrate, transparent cup walls on the top surface of the substrate and surround the chip, a wavelength conversion layer covering the chip between the transparent cup walls, and a reflective layer on the wavelength conversion layer. The reflective layer includes a curved bottom surface protruding toward the chip and directly contacting a top surface of the wavelength conversion layer. An edge of the reflective layer directly contacts the transparent cup walls and the wavelength conversion layer. The wavelength conversion layer fills a space defined by the substrate, the transparent cup walls and the reflective layer such that a bottom surface, a side surface, and the top surface of the wavelength conversion layer directly contacts the substrate, the transparent cup walls, and the reflective layer, respectively.

IPC Classes  ?

• H01L 33/60 - Reflective elements
• G02F 1/13357 - Illuminating devices
• H01L 33/50 - Wavelength conversion elements
• H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls

Abstract

A display device includes a glass substrate, light emitting diodes (LEDs) and driving circuits. The glass substrate includes first and second sides. The driving circuits are coupled to the LEDs. An anode of each of the LEDs receives a first anode signal different from a first reference anode signal by a first signal difference and a second anode signal different from a second reference anode signal by a second signal difference. A cathode of each of the LEDs receives a first cathode signal different from a first reference cathode signal by a third signal difference and a second cathode signal different from a second reference cathode signal by a fourth signal difference. The LEDs that are closer to the second side have greater first and third signal difference, and the LEDs that are closer to the first side have greater second fourth signal difference.

IPC Classes  ?

• G09G 3/32 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
• H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
• H05B 45/10 - Controlling the intensity of the light
• H05B 45/30 - Driver circuits

Abstract

A naked-eye stereoscopic display system including a display, an optical element, and a controller is provided. The display is adapted to emit a plurality of image beams, and includes a plurality of display regions. Each of the display regions includes a plurality of first sub-display regions and a second sub-display region. A light configuration is performed on the image beams by the optical element, and then the image beams are projected out of the naked-eye stereoscopic display. The controller is electrically connected with the display. The controller controls the display, so that a light intensity of an image beam generated by the first sub-display regions is lower than a light intensity of an image beam generated by the second sub-display region. A display method of the naked-eye stereoscopic display is also provided.

IPC Classes  ?

• H04N 13/307 - Image reproducers for viewing without the aid of special glasses, i.e. using autostereoscopic displays using fly-eye lenses, e.g. arrangements of circular lenses

Abstract

A display apparatus includes circuit boards and display units. The display unit includes a circuit substrate, a first light emitting device, and second light emitting devices. The circuit substrate has a first wire bonding pad and second wire bonding pads. A first electrode disposed 5 on one side of a first light emitting structure layer of the first light emitting device is wire-bonded to one second wire bonding pad, and a second electrode disposed on the other side of the first light emitting structure layer is bonded to the first wire bonding pad. Third and fourth electrodes disposed on one side of a second light emitting structure layer of the second light emitting device are respectively wire-bonded to two of the first wire bonding pad and the second wire bonding 10 pads. The first wire bonding pad overlaps the first light emitting device and at least one second light emitting device.

IPC Classes  ?

• H01L 25/13 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group
• H01L 33/48 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the semiconductor body packages
• H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls

Abstract

The invention relates to a display panel, comprising a first substrate; a second substrate comprising a color resist layer, the color resist layer comprising a first color resist, a second color resist and a third color resist sequentially arranged in a first direction; and a display molecular layer disposed between the first substrate and the second substrate; wherein, in a second direction perpendicular to the first direction, the first color resist comprises a plurality of first color resist stripes, the second color resist comprises at least one second color resist stripe, the third color resist comprises at least one third color resist stripe, and a volume of the first color resist stripe is smaller than a volume of the second color resist stripe and smaller than a volume of the third color resist stripe, wherein the first color resist is a green color resist.

IPC Classes  ?

• G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors

Abstract

The present invention relates to a display device, comprising: a first substrate comprising a first inner surface, a first outer surface opposite to the first inner surface, a display region, a bonding region adjacent to the display region, a plurality of thin film transistors disposed on the first inner surface and corresponding to the display region; a second substrate opposite to the display region and comprising a second inner surface, a second outer surface opposite to the second inner surface, a first color resist and a second color resist each disposed on the second inner surface; a display molecular layer disposed between the first substrate and the second substrate; an electrical shielding layer disposed on the first outer surface of the first substrate, wherein the electrical shielding layer comprises a first shielding region corresponding to the first color resist and a second shielding region corresponding to the bonding region.

IPC Classes  ?

• G06F 3/041 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
• G02F 1/01 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour
• H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
• H05K 9/00 - Screening of apparatus or components against electric or magnetic fields

Abstract

A level shifter includes a buffer circuit, a first shift circuit, and a second shift circuit. The buffer circuit provides a first signal and a first inverted signal to the first shift circuit, such that the first shift circuit provides a second signal and a second inverted signal to the second shift circuit. The second shift circuit generates a plurality of output signals according to the second signal and the second inverted signal. The first shift circuit includes a plurality of first stacking transistors and a first voltage divider circuit. The first voltage divider circuit is electrically coupled between a first system high voltage terminal and a system low voltage terminal. The first voltage divider circuit is configured to provide a first inner bias to gate terminals of the first stacking transistors.

IPC Classes  ?

• H03K 3/356 - Bistable circuits
• H03K 17/10 - Modifications for increasing the maximum permissible switched voltage
• H03K 19/0185 - Coupling arrangementsInterface arrangements using field-effect transistors only

Abstract

An optoelectronic tweezer device includes a transparent substrate, a semiconductor layer, a first electrode and a dielectric layer. The semiconductor layer is located above the transparent substrate and includes a first doping region, a second doping region and a transition region, wherein the transition region is located between the first doping region and the second doping region. The first electrode is located on the first doping region and is electrically connected to the first doping region. The dielectric layer is located above the semiconductor layer and has a first through hole overlapping the first electrode.

IPC Classes  ?

• B01L 3/00 - Containers or dishes for laboratory use, e.g. laboratory glasswareDroppers
• B03C 5/02 - Separators

Abstract

Provided is a display apparatus including a display panel, multiple antenna electrodes, a dummy electrode, and multiple feed lines. The display panel has a display area. The antenna electrodes are disposed on the display panel and overlap the display area. The dummy electrode is disposed around the antenna electrodes and overlaps the display area. The dummy electrode is electrically separated from the antenna electrodes, and has multiple dummy wire segments whose extension directions intersect each other. The dummy wire segments have multiple breaks. The feed lines are respectively electrically connected to the antenna electrodes. An antenna module is also provided.

IPC Classes  ?

• H01Q 1/22 - SupportsMounting means by structural association with other equipment or articles
• H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support
• H01Q 9/04 - Resonant antennas
• G06F 1/16 - Constructional details or arrangements
• H01Q 1/14 - SupportsMounting means for wire or other non-rigid radiating elements

Abstract

A display apparatus includes a driving backplane and a light-emitting element. The driving backplane includes a substrate, a pixel driving circuit disposed on the substrate and a pad electrically connected to the pixel driving circuit. The pad has a first metal layer, a first intermetallic layer and a first diffusion barrier layer, wherein the first metal layer, the first intermetallic layer and the first diffusion barrier layer are sequentially stacked along a direction away from the substrate. The light-emitting element includes an electrode and a conductive bump electrically connected to the electrode. The conductive bump has a second intermetallic layer, and the first diffusion barrier layer is located between the second intermetallic layer and the first intermetallic layer.

IPC Classes  ?

• H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
• H01L 33/38 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the electrodes with a particular shape

Abstract

A display panel has a plurality of pixel areas and a peripheral area surrounding the pixel areas, and includes a substrate, at least two planarization layers, a plurality of pads, a first dummy pattern, and a plurality of light-emitting devices. The substrate has a first substrate edge extending in a first direction. The at least two planarization layers are disposed on the substrate. The pads are disposed on the at least two planarization layers, and are located in the pixel areas. The pads include at least one first edge pad closest to the first substrate edge. The first dummy pattern is disposed on the at least two planarization layers, and extends in the peripheral area between the at least one first edge pad and the first substrate edge. The light-emitting devices are electrically connected to the pads.

IPC Classes  ?

• H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
• H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits

Abstract

A display panel includes a substrate, light-emitting diodes, and a cured opaque encapsulant layer. The light-emitting diodes are disposed on a first surface of the substrate. The cured opaque encapsulant layer is disposed on the first surface and a side surface of the substrate, and surrounds the light emitting diodes. A second surface of the cured opaque encapsulant layer facing away from the substrate is a rough surface.

IPC Classes  ?

• H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
• H01L 25/13 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group
• H01L 33/54 - Encapsulations having a particular shape

Abstract

A phase shifter is provided, which includes a first substrate, a second substrate, a liquid crystal layer, a plurality of first ring-shaped electrodes and a plurality of second ring-shaped electrodes. The first substrate and the second substrate are disposed opposite to each other. The liquid crystal layer is disposed between the first substrate and the second substrate. The plurality of first ring-shaped electrodes are disposed sequentially and in interval on a side of the first substrate close to the liquid crystal layer. The plurality of second ring-shaped electrodes are disposed sequentially and in interval on a side of the second substrate close to the liquid crystal layer. A plurality of vertical projections, projected by the plurality of first ring-shaped electrodes to the second substrate, and at least partially overlapped with the plurality of second ring-shaped electrodes, respectively.

IPC Classes  ?

• H01Q 3/30 - Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elementsArrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the distribution of energy across a radiating aperture varying the phase
• H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support
• H01Q 1/42 - Housings not intimately mechanically associated with radiating elements, e.g. radome
• H01Q 21/06 - Arrays of individually energised antenna units similarly polarised and spaced apart

Abstract

Provided is a display apparatus including a first cholesteric liquid crystal panel, a second cholesteric liquid crystal panel, and a third cholesteric liquid crystal panel. The first cholesteric liquid crystal panel has a light receiving surface. The second cholesteric liquid crystal panel overlaps the first cholesteric liquid crystal panel and is disposed on a side of the first cholesteric liquid crystal panel away from the light receiving surface. The third cholesteric liquid crystal panel overlaps the second cholesteric liquid crystal panel and is disposed on a side of the second cholesteric liquid crystal panel away from the first cholesteric liquid crystal panel. One of the first cholesteric liquid crystal panel, the second cholesteric liquid crystal panel, and the third cholesteric liquid crystal panel is provided with multiple first light shielding patterns separated from each other.

IPC Classes  ?

• G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors
• G02F 1/1347 - Arrangement of liquid crystal layers or cells in which the final condition of one light beam is achieved by the addition of the effects of two or more layers or cells

Abstract

A memory chip includes a first decoding device and a memory device. The first decoding device is configured to generate multiple word line signals. The memory device is configured to generate a third data signal based on a first data signal and a second data signal. The memory device includes a first memory circuit and a second memory circuit. The first memory circuit is configured to generate the first data signal at a first node according to the word line signals during a first period. The second memory circuit is configured to generate the second data signal at a second node different from the first node according to the word line signals during a second period after the first period. A method of operating a memory chip is also disclosed herein.

IPC Classes  ?

• G11C 8/10 - Decoders
• G11C 8/08 - Word line control circuits, e.g. drivers, boosters, pull-up circuits, pull-down circuits, precharging circuits, for word lines
• G11C 8/18 - Address timing or clocking circuitsAddress control signal generation or management, e.g. for row address strobe [RAS] or column address strobe [CAS] signals

Abstract

A display panel includes a first substrate, a second substrate, a liquid crystal layer, a pixel electrode, a common electrode, a first polarizer and a second polarizer. The pixel electrode includes a trunk portion, first to fourth branch portions, and first to fourth strip portions. The trunk portion extends along a first direction. The first and second branch portions are connected to a first end of the trunk portion. The third and fourth branch portions are connected to a second end of the trunk portion. The first strip portions are connected to the first and second branch portions. The second strip portions are connected to the third and fourth branch portions. The third strip portions are connected to the first and third branch portions and the trunk portion. The fourth strip portions are connected to the second and fourth branch portions and the trunk portion.

IPC Classes  ?

• G02F 1/1343 - Electrodes
• G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors

Abstract

A stretchable display panel includes a first stretchable film, a first transparent optical clear adhesive, a patterned organic layer, multiple light-emitting elements, and multiple wires. The first transparent optical clear adhesive is located on the first stretchable film. The patterned organic layer includes multiple first island portions and multiple first bridge portions. Any adjacent two of the first island portions are connected via a corresponding one of the first bridge portions. The light-emitting elements are located above the first island portions. The first transparent optical clear adhesive is located between the light-emitting elements and the first stretchable film. A first surface of the patterned organic layer faces away from the light-emitting elements. An included angle between the first surface and a first side surface of the first island portions is greater than 90 degrees. The wires are located above the first bridge portions.

IPC Classes  ?

• H01L 27/15 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier, specially adapted for light emission
• G09F 9/30 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
• G09F 9/33 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
• H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls

Abstract

A display device includes two adjacent pixel electrodes spaced apart from each other by a gap extending in a first direction, at least one signal line extending in the first direction and having at least one protrusion at at least one side thereof, and two adjacent common electrode lines spaced apart from each other. The orthogonal projection of one/the other common electrode line on the substrate is located between the orthogonal projection of the signal line on the substrate and the orthogonal projection of one/the other pixel electrode on the substrate. Each common electrode line has a bend segment bending away from the signal line, wherein the protrusion of the at least one signal line positionally corresponds to the bend segment of each common electrode line, and the length of the protrusion is not larger than the length of the bend segment.

IPC Classes  ?

• G02F 1/1362 - Active matrix addressed cells
• G02F 1/1343 - Electrodes

Abstract

A pixel driving device includes a driving transistor, a pixel driving circuit, an optical sensor circuit, and a reset and reading circuit. Driving transistor controls a light emission device. Pixel driving circuit is connected to the driving transistor and resets according to a first sweep signal. Pixel driving circuit compensates according to a second sweep signal. Pixel driving circuit controls the driving transistor according to a driving signal to drive light emission device. Optical sensor circuit includes a node. Optical sensor circuit resets the node to a voltage level of the driving signal. Light sensing circuit performs sensing to generate a light sensing signal. Reset and reading circuit is connected to the driving transistor, the pixel driving circuit, and the optical sensor circuit. Reset and reading circuit receives a reset and reading signal so as to reset the pixel driving circuit and to read out the light sensing signal.

IPC Classes  ?

• G09G 3/32 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]

Abstract

A method for measuring a physiological signal includes following steps: detecting a first physiological signal of a target; receiving the first physiological signal to generate a first signal and a second signal by a radar sensor; selecting one of the first signal and the second signal to generate a plurality of original signals, which a phase difference is formed between the first signal and the second signal; and capturing a respiration signal and a heartbeat signal according to the plurality of original signals.

IPC Classes  ?

• A61B 5/0205 - Simultaneously evaluating both cardiovascular conditions and different types of body conditions, e.g. heart and respiratory condition
• A61B 5/05 - Detecting, measuring or recording for diagnosis by means of electric currents or magnetic fieldsMeasuring using microwaves or radio waves
• A61B 5/00 - Measuring for diagnostic purposes Identification of persons

Abstract

A display panel includes a pixel array substrate, a plurality of vertical light emitting devices and a flip-chip light emitting device. The pixel array substrate has a first pixel area and a second pixel area. The vertical light emitting devices are disposed in the first pixel area and the second pixel area and electrically connected to the pixel array substrate. The flip-chip light emitting device is disposed in the second pixel area and electrically connected to the pixel array substrate. A color of an emitted light beam of the flip-chip light emitting device and a color of an emitted light beam of one of the vertical light emitting devices located in the first pixel area are identical.

IPC Classes  ?

• H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 33/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof
• H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls

Abstract

The present disclosure provides a driving circuit, including a transistor and a level shifter. The first terminal of the transistor is electrically connected to a light emitting diode and is configured to receive a supply voltage. The second terminal of the transistor is configured to receive a first reference voltage. The level shifter is configured to receive an input signal from a previous-stage driving circuit and adjust the voltage level of the input signal according to a voltage operating range formed by the supply voltage and the first reference voltage to generate a level-shifted signal corresponding to the voltage operating range and configured to control the transistor. The input signal varies between a second reference voltage and the supply voltage. The second reference voltage and the first reference voltage are different from each other and both lower than the supply voltage.

IPC Classes  ?

• G09G 3/32 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
• G11C 19/00 - Digital stores in which the information is moved stepwise, e.g. shift registers
• H03K 19/0185 - Coupling arrangementsInterface arrangements using field-effect transistors only
• H01L 29/10 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified, or switched and such electrode being part of a semiconductor device which comprises three or more electrodes

Abstract

A display device includes a first substrate, a first circuit structure, and light-emitting element package structures. The first circuit structure is located above the first substrate, and the first circuit structure has holes. Light-emitting element package structures are located above the first circuit structure. Each light-emitting element package structure includes a second substrate and at least one light-emitting element. The light emitting element is located between the second substrate and the first substrate, emitting toward the first circuit substrate, and overlapping with corresponding hole of the first circuit structure. The width of the corresponding hole near the first substrate is greater than the width of the corresponding hole near the second substrate.

IPC Classes  ?

• H01L 33/54 - Encapsulations having a particular shape
• H01L 27/15 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier, specially adapted for light emission
• H01L 33/10 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the semiconductor bodies with a light reflecting structure, e.g. semiconductor Bragg reflector
• H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls

Abstract

Provided is a manufacturing method of an active device substrate including the following steps. A blind hole is formed in a substrate. A first conductive pattern and an active device are formed on a first surface of the substrate, where the first conductive pattern overlaps the blind hole. After the first conductive pattern and the active device are formed, an etching process is executed on the substrate to form a through hole penetrating the substrate at the position of the blind hole. A conductive material is filled into the through hole to form a conductive hole. The conductive hole is electrically connected to the first conductive pattern. A second conductive pattern is formed on a second surface of the substrate, where the second conductive pattern is electrically connected to the first conductive pattern through the conductive hole.

IPC Classes  ?

• H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device
• H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits

Abstract

A display apparatus includes a first conductive pattern layer, a first insulating pattern layer, a second conductive pattern layer, a second insulating pattern layer, pixel structures, and a light-absorbing pattern layer. The first insulating pattern layer is disposed on the first conductive pattern layer and has a first opening. The second conductive pattern layer is disposed on the first insulating pattern layer and has light-shielding conductive patterns arranged periodically. The second insulating pattern layer is disposed on the second conductive pattern layer and has a second opening overlapped with the first opening. The light-absorbing pattern layer covers at least a first sidewall defining the first opening and a second sidewall defining the second opening and separates the light-shielding conductive patterns of the second conductive pattern layer. The light-absorbing pattern layer has a light-transmitting opening overlapped with the first opening and the second opening.

IPC Classes  ?

• H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
• H01L 33/44 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
• H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
• H01L 33/58 - Optical field-shaping elements

Abstract

A thin film transistor includes a semiconductor layer, a first gate electrode disposed at one side of the semiconductor layer, a first gate insulating layer disposed between the first gate electrode and the semiconductor layer, a second gate electrode and a third gate electrode disposed at another side of the semiconductor layer, and a second gate insulating layer. The second gate electrode is separated from the third gate electrode. The second gate insulating layer is disposed between the second and third gate electrodes and the semiconductor layer. An orthogonal projection of the first gate electrode on the semiconductor layer is partially overlapped with an orthogonal projection of the second gate electrode on the semiconductor layer. The orthogonal projection of the first gate electrode on the semiconductor layer is partially overlapped with an orthogonal projection of the third gate electrode on the semiconductor layer.

IPC Classes  ?

• H01L 29/786 - Thin-film transistors
• H01L 29/417 - Electrodes characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched

Abstract

A pixel structure, including a first semiconductor layer, a first active layer, a second semiconductor layer, a second active layer, a third semiconductor layer, and an electrode layer that are sequentially stacked, is provided. A first portion of the electrode layer is electrically connected to a first portion of the first semiconductor layer through a first opening of a first portion of the third semiconductor layer, a first opening of a first portion of the second active layer, a first opening of a first portion of the second semiconductor layer, and a first opening of a first portion of the first active layer. A second portion of the electrode layer is electrically connected to a second portion of the second semiconductor layer through a second opening of a second portion of the third semiconductor layer and a second opening of a second portion of the second active layer.

IPC Classes  ?

• H01L 33/38 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the electrodes with a particular shape
• H01L 33/50 - Wavelength conversion elements
• H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls

Abstract

A display device includes a circuit substrate, multiple light-emitting elements, a color conversion layer, and a bank. The light-emitting elements are disposed on and electrically connected to the circuit substrate, respectively. The color conversion layer is disposed on a first light-emitting element of the light-emitting elements. The bank is disposed between the light-emitting elements. There is a gap between the bank and the color conversion layer. A manufacturing method of a display device is also provided.

IPC Classes  ?

• H01L 27/15 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier, specially adapted for light emission
• H01L 33/54 - Encapsulations having a particular shape
• H01L 33/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof
• H01L 33/50 - Wavelength conversion elements
• H01L 33/58 - Optical field-shaping elements
• H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls

Abstract

A display device including a display area and a non-display area is provided. The display area includes a display panel, a switch unit and a first reflective film. The non-display area includes a second reflective film. The switch unit is disposed on the display panel. The first reflective film is disposed between the display panel and the switch unit. When the display device is set in a pattern mode, the display panel does not emit image light. For the pattern mode, the reflectivity in the display area is approximately equal to the reflectivity in the non-display area for ambient light.

IPC Classes  ?

• G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors
• G02F 1/13363 - Birefringent elements, e.g. for optical compensation

Abstract

A display device includes a circuit substrate, a silicon dioxide pattern, and a plurality of light-emitting elements. The silicon dioxide pattern is located on the circuit substrate and has a plurality of openings. The light-emitting elements are located on the circuit substrate and are electrically connected to the circuit substrate. The light-emitting elements are located in the openings and are adjacent to the silicon dioxide pattern. A manufacturing method of a display device is also provided.

IPC Classes  ?

• H01L 27/15 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier, specially adapted for light emission
• H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
• H01L 33/46 - Reflective coating, e.g. dielectric Bragg reflector
• H01L 33/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof
• H01L 33/50 - Wavelength conversion elements

Abstract

A display apparatus including a first substrate, a first electrode, a second substrate, a first microlens layer, a second microlens layer, a second electrode, a blocking wall structure, an electrophoresis medium, and multiple particles. The first electrode is disposed on the first substrate. The first microlens layer, having multiple first microlenses, is disposed on the second substrate. The second microlens layer, having multiple second microlenses, is disposed on the first microlens layer. The second electrode is disposed on the second microlens layer. The blocking wall structure is at least disposed between the first electrode and the second electrode and has an accommodating space corresponding to the first electrode. The electrophoresis medium is disposed in the accommodating space. The first microlens layer and the second microlens layer are disposed between the second substrate and at least a portion of the electrophoresis medium. The particles are mixed within the electrophoresis medium.

IPC Classes  ?

• G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors
• G02F 1/1339 - GasketsSpacersSealing of cells
• G02F 1/167 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field characterised by the electro-optical or magneto-optical effect by electrophoresis
• G02F 1/1676 - Electrodes
• G02F 1/1677 - Structural association of cells with optical devices, e.g. reflectors or illuminating devices
• G02F 1/1679 - GasketsSpacersSealing of cellsFilling or closing of cells
• G02F 1/16756 - Insulating layers

Abstract

A display device, including a circuit substrate and multiple light emitting units, is provided. The light emitting units are located on the circuit substrate and are electrically connected to the circuit substrate. Each light emitting unit includes a main isolation structure and multiple light emitting elements, and the main isolation structure surrounds the light emitting elements.

IPC Classes  ?

• H01L 27/15 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier, specially adapted for light emission
• H01L 33/20 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
• H01L 33/48 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the semiconductor body packages

Abstract

A light detection device including a substrate, a first light detector, a second light detector, and a switch element is provided. The first light detector is disposed on the substrate and includes a first active layer. The second light detector is disposed between the substrate and the first light detector and includes a second active layer. The switch element is disposed on the substrate. A horizontal projection of the second active layer on the substrate completely falls within a horizontal projection of the first active layer on the substrate. A negative electrode of the first light detector and a negative electrode of the second light detector are electrically connected to the switch element via a first metal layer.

IPC Classes  ?

• G01J 3/28 - Investigating the spectrum
• G01J 1/42 - Photometry, e.g. photographic exposure meter using electric radiation detectors
• H01L 31/0224 - Electrodes
• H01L 31/0232 - Optical elements or arrangements associated with the device
• G01J 1/02 - Photometry, e.g. photographic exposure meter Details
• G01J 1/04 - Optical or mechanical part
• G01J 1/44 - Electric circuits

Abstract

A method for fault detection is adapted for a vehicle display fault detection system. The vehicle display fault detection system includes a vehicle system and a display system. The method for fault detection includes following steps: detecting whether a first state of the display system is abnormal or not; when the first state is abnormal, the display system is configured to generate a fault detection signal; classifying to generate a control signal according to the fault detection signal; and adjusting the first state of the display system to a second state.

IPC Classes  ?

• G07C 5/08 - Registering or indicating performance data other than driving, working, idle, or waiting time, with or without registering driving, working, idle, or waiting time
• B60W 50/14 - Means for informing the driver, warning the driver or prompting a driver intervention

Abstract

A display device includes a pixel array substrate and a circuit board. The pixel array substrate has a first surface, a second surface opposite to the first surface, and a first side surface connecting the first surface and the second surface. Multiple bonding pads are located on the first surface. The circuit board is bent from above the first surface of the pixel array substrate to below the second surface. The circuit board is electrically connected to the bonding pads and includes a thermoplastic substrate. The thermoplastic substrate includes a third surface facing the pixel array substrate and a fourth surface opposite to the third surface. The thermoplastic substrate includes a first bend formed by thermoplastics.

IPC Classes  ?

• H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
• G02F 1/1345 - Conductors connecting electrodes to cell terminals
• H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
• H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
• H01L 33/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof

Abstract

The present disclosure discloses a display device, including a glass substrate and a plurality of light emitting diodes (LEDs). The glass substrate includes a first side and a second side. The LEDs include a first LED and a second LED. Compared with a reference anode signal, a first anode signal received by the first LED has a first anode signal difference and a second anode signal received by the second LED has a second anode signal difference. The first anode signal difference is smaller than the second anode signal difference. Compared with a reference cathode signal, a first cathode signal received by the first LED has a first cathode signal difference and a second cathode signal received by the second LED has a second cathode signal difference. The first cathode signal difference is larger than the cathode anode signal difference.

IPC Classes  ?

• G09G 3/32 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
• H05B 45/30 - Driver circuits
• H05B 45/10 - Controlling the intensity of the light
• H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits

Abstract

A total internal reflection display includes a sub-pixel, a reflecting layer, at least one first stereoscopic electrode and a display medium layer. The sub-pixel is defined by a color filter and a black matrix disposed adjacently to the color filter. The reflecting layer is located beneath the sub-pixel. The first stereoscopic electrode is located beneath the black matrix. The width of the first stereoscopic electrode is less than the width of the black matrix. The display medium layer is located between the sub-pixel and the reflecting layer. The height of the first stereoscopic electrode is greater than half of the thickness of the display medium layer.

IPC Classes  ?

• G02F 1/167 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field characterised by the electro-optical or magneto-optical effect by electrophoresis
• G02F 1/1676 - Electrodes
• G02F 1/16766 - Electrodes for active matrices
• G02F 1/1677 - Structural association of cells with optical devices, e.g. reflectors or illuminating devices
• G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors
• G09G 3/34 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix by control of light from an independent source

Abstract

A fingerprint sensing apparatus including a first substrate, a light sensing structure, a second substrate, a lens layer, a filler, and a first light shielding layer is provided. The light sensing structure is disposed on a sensing area of the first substrate. The lens layer is disposed on the second substrate. The lens layer has multiple first convex portions and a first concave portion. The filler is disposed between the lens layer and the light sensing structure. The refractive index of the filler is greater than the refractive index of the lens layer. The first light shielding layer is disposed between the second substrate and the lens layer. A solid of the first light shielding layer overlaps the first convex portions of the lens layer. An opening of the first light shielding layer overlaps the first concave portion of the lens layer.

IPC Classes  ?

• G06V 40/13 - Sensors therefor

Abstract

A display panel includes a circuit substrate, a plurality of first electrodes, a first bank layer, a second bank layer, an organic light-emitting material layer, and a second electrode. The first bank layer is located on the first electrodes and has a plurality of first openings overlapped with the first electrodes. The second bank layer is located on the first bank layer and the circuit substrate. The second bank layer has a plurality of second openings extended along a first direction. A single second opening has a different width in a second direction. The second openings are overlapped with the first openings, and the second openings and the first openings together form organic light-emitting material filling regions. A maximum width of a first portion of each organic light-emitting material filling region is greater than a maximum width of a second portion of each organic light-emitting material filling region.

IPC Classes  ?

• H10K 59/122 - Pixel-defining structures or layers, e.g. banks
• H10K 59/35 - Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
• H10K 71/00 - Manufacture or treatment specially adapted for the organic devices covered by this subclass
• H10K 59/12 - Active-matrix OLED [AMOLED] displays

Abstract

A display panel, including a circuit substrate, a light emitting diode, and a reflective layer, is provided. The light emitting diode includes a light emitting layer and first and second semiconductor layers. The light emitting layer is located between the first and second semiconductor layers. The second semiconductor layer is located between the first semiconductor layer and the circuit substrate. The reflective layer is in contact with a part of a side surface of the light emitting diode. A part of the reflective layer is located between the light emitting diode and the circuit substrate. Taking a direction perpendicular to a top surface of the circuit substrate as a height direction, a horizontal height of a top surface of the reflective layer is located between a horizontal height of a top surface of the light emitting layer and a horizontal height of a top surface of the light emitting diode.

IPC Classes  ?

• H01L 33/46 - Reflective coating, e.g. dielectric Bragg reflector
• H01L 33/54 - Encapsulations having a particular shape
• H01L 33/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof

Abstract

A pulse diagnosis apparatus includes a base, a bearing and a plurality of sensing module. The base has a motion module. The motion module is disposed on the base and moves back and forward in a first direction. The bearing is disposed on the motion module and includes a first face and a second face. Each sensing module includes a driving element, a flexible element and a sensing unit. The driving element moves in the first direction and passes through the bearing. The driving element includes a first terminal and a second terminal. The first terminal is adjacent to the second face. The second terminal is adjacent to the first face. The flexible element is hitched up the driving element. Two terminals of the flexible element are against the second terminal and the bearing. The sensing unit is disposed on the second terminal.

IPC Classes  ?

• A61B 5/021 - Measuring pressure in heart or blood vessels
• A61B 5/00 - Measuring for diagnostic purposes Identification of persons

Abstract

An active device substrate includes a substrate, a first semiconductor layer, a gate insulating layer, a first gate, a first source, a first drain and a shielding electrode. The first semiconductor layer includes a first heavily doped region, a first lightly doped region, a channel region, a second lightly doped region, and a second heavily doped region that are sequentially connected. The first gate is located on the gate insulating layer and overlaps the channel region. The first source is electrically connected to the first heavily doped region. The first drain is electrically connected to the second heavily doped region. The shielding electrode overlaps the second lightly doped region in a normal direction of the substrate.

IPC Classes  ?

• H01L 29/40 - Electrodes
• H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
• H01L 29/417 - Electrodes characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
• H01L 29/786 - Thin-film transistors

Abstract

A display device, including a flexible substrate, multiple lighting units, and multiple signal lines, is provided. The lighting units and the signal lines are located on the flexible substrate, and the signal lines are respectively electrically connected to the lighting units. Each signal line includes multiple first conductive patterns, at least one second conductive pattern, and at least one third conductive pattern. The first conductive patterns are located on the flexible substrate. The second conductive pattern is located on the first conductive patterns, and two ends of each second conductive pattern are respectively connected to two first conductive patterns. In a stretched state, the two first conductive patterns twist the commonly connected second conductive pattern. The third conductive pattern is superimposed on the second conductive pattern.

IPC Classes  ?

• H10K 59/131 - Interconnections, e.g. wiring lines or terminals
• H10K 50/80 - Constructional details
• H10K 77/10 - Substrates, e.g. flexible substrates

Abstract

The present invention provides a light emitting panel, which includes: a substrate, at least one light emitting element disposed on the substrate, and a reflective structure layer. The reflective structure layer includes a plurality of first microstructure units disposed on the substrate and distributed around the at least one light emitting element, and a plurality of second microstructure units disposed on and overlapping the first microstructure units. A spacing between adjacent first microstructure units among the first microstructure units is less than a spacing between adjacent second microstructure units among the second microstructure units.

IPC Classes  ?

• H01L 33/10 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the semiconductor bodies with a light reflecting structure, e.g. semiconductor Bragg reflector
• H01L 27/15 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier, specially adapted for light emission

Abstract

A display device includes a circuit board and a plurality of light-emitting units disposed on the circuit board. The circuit board includes a substrate and a plurality of signal lines disposed on the substrate. Each light-emitting unit includes a base board, at least one light-emitting element and a driving circuit layer. The light-emitting element is between the base board and the substrate. The driving circuit layer is between the light-emitting element and the base board, and electrically connected to the light-emitting element and the signal line.

IPC Classes  ?

• H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
• G06F 3/041 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 1/02 - Printed circuits Details

Abstract

The present disclosure provides an electronic device. The electronic device includes a first substrate, a second substrate opposite to the first substrate, a buffer layer disposed on the second substrate, a protection layer, an active array, a pixel array, and an alignment film. The first substrate includes a transmitting region, a display region surrounding the transmission region, and a periphery region surrounding the display region. The protection layer is disposed on the buffer layer. The active array is disposed on the buffer layer. The pixel array is disposed on the active array and electrically connected to the active array. The alignment film is conformally disposed on the protection layer and the second substrate. The alignment film includes a first portion in direct contact with the second substrate. A vertical projection of the first portion of the alignment film overlaps the transmitting region of the first substrate.

IPC Classes  ?

• G02F 1/1362 - Active matrix addressed cells
• G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors
• G02F 1/1333 - Constructional arrangements

Abstract

The present disclosure provides a flexible display panel, which includes a substrate, a plurality of hollow regions, a plurality of display units, a plurality of wire structures, and a plurality of spacers. The substrate is defined as a plurality of island regions and a plurality of bridge regions. Each of the hollow regions is surrounded by four adjacent of the island regions and four adjacent of the bridge regions. The display units are respectively disposed on the island regions of the substrate. The wire structures are respectively disposed on the bridge regions and electrically connected to the display units. Each of the wire structures includes at least one wire layer including at least one wire disposed on the substrate. The spacers are disposed on and in contact with the substrate, and respectively surround the hollow regions, and separated from the wire structures to control etching sizing.

IPC Classes  ?

• H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
• G09F 9/30 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
• G09F 9/33 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
• H01L 27/15 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier, specially adapted for light emission
• H01L 33/12 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the semiconductor bodies with a stress relaxation structure, e.g. buffer layer

Abstract

A backlight module includes a light source array, a reflector module, and an optical film. The light source array includes a plurality of light sources. The light emitted from the light source can be refracted by the lens unit to obtain a specific light-output angle and uniformity. The reflector module includes a plurality of reflector units. Each reflector unit includes a flat portion, a first wall portion, and a corner wall portion, which have structures and arrangements designed to enable the light source to achieve a display effect of less shadows and better contrast.

IPC Classes  ?

• F21V 7/00 - Reflectors for light sources
• F21V 5/04 - Refractors for light sources of lens shape
• F21Y 105/16 - Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array square or rectangular, e.g. for light panels

Abstract

A driving circuit includes a driving transistor, a capacitor, a reset circuit, a touch sensing electrode, a sensing circuit, and a read circuit. The capacitor is electrically coupled to a gate terminal of the driving transistor. The reset circuit is electrically coupled to the gate terminal of the driving transistor, and the reset circuit is configured to reset the voltage level of the gate terminal of the driving transistor. The sensing circuit is electrically coupled between the touch sensing electrode and the gate terminal of the driving transistor, and the sensing circuit is configured to transmit the voltage level of the touch sensing electrode to the gate terminal of the driving transistor. The read circuit is electrically coupled to the driving transistor, and the read circuit is configured to output a touch sensing signal according to the voltage level of the gate terminal of the driving transistor.

IPC Classes  ?

• G06F 3/041 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
• G06F 3/044 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
• G09G 3/20 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix

Abstract

A biometric verification device includes a backlight module, a photodetector, a switching element, and at least one collimation structure. The photodetector is disposed on the backlight module. The switching element is disposed on the backlight module and electrically connected with the photodetector. The at least one collimation structure is disposed on the backlight module and has a first pinhole and a second pinhole. The horizontal projections of the first pinhole and the second pinhole on the backlight module do not overlap with the horizontal projection of the photodetector on the backlight module.

IPC Classes  ?

• G06V 40/13 - Sensors therefor
• H01L 27/146 - Imager structures
• F21V 8/00 - Use of light guides, e.g. fibre optic devices, in lighting devices or systems

Abstract

A fingerprint sensing device includes a first substrate, a sensing element layer, a second substrate, a micro-structure layer, and a spacer layer. The sensing element layer is located on the first substrate and includes multiple sensing elements. The second substrate is located on the sensing element layer. The micro-structure layer is located between the second substrate and the sensing element layer, and includes multiple micro-lens structures and multiple dummy structures. Orthogonal projections of the micro-lens structures on the first substrate overlap orthogonal projections of the sensing elements on the first substrate. The spacer layer is located between the second substrate and the sensing element layer, and includes multiple main spacers. Each of the main spacers covers at least one of the dummy structures.

IPC Classes  ?

• G06F 3/042 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by opto-electronic means
• G06V 40/13 - Sensors therefor
• G02F 1/1333 - Constructional arrangements
• G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors
• H01L 27/146 - Imager structures
• H10K 39/32 - Organic image sensors

Abstract

A photosensitive device includes a first substrate, a second substrate, a supporting structure, multiple first microlenses, multiple second microlenses, a first photosensitive element, a second photosensitive element, and a collimating structure. The second substrate is opposite to the first substrate, and there is a gap between the first substrate and the second substrate. The supporting structure is located in the gap between the first substrate and the second substrate. The first microlenses and the second microlenses are respectively disposed on a first side and a second side of the gap. The first photosensitive element is overlapping with one of the first microlenses and one of the second microlenses. The second photosensitive element is overlapping with another one of the second microlenses. The collimating structure is located between the first substrate and the first microlenses.

IPC Classes  ?

• H01L 27/146 - Imager structures
• G02B 27/30 - Collimators

Abstract

A light-emitting device, including a first type semiconductor layer, a patterned insulating layer, a light-emitting layer, and a second type semiconductor layer, is provided. The patterned insulating layer covers the first type semiconductor layer and has a plurality of insulating openings. The insulating openings are separated from each other. The light-emitting layer is located in the plurality of insulating openings and covers a portion of the first type semiconductor layer. The second type semiconductor layer is located on the light-emitting layer.

IPC Classes  ?

• H01L 27/15 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier, specially adapted for light emission
• H01L 33/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof
• H01L 33/42 - Transparent materials
• H01L 33/44 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating

Abstract

A display device includes a light emitting element, an adhesive barrier wall and an array substrate. The light emitting element includes a first contact and a second contact disposed on a first surface of the light emitting element. The adhesive barrier wall is disposed on the first surface of the light emitting element and includes a first portion between the first contact and the second contact. The array substrate includes a first pad and a second pad disposed on a second surface of the array substrate. The first contact and the second contact of the light emitting element are respectively connected to the first pad and the second pad.

IPC Classes  ?

• H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
• H01L 33/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof

Abstract

A fingerprint recognition device including a light emitting layer, an image sensing layer and a micro-lens layer is provided. The image sensing layer has a plurality of pixels. The micro-lens layer is disposed between the light emitting layer and the image sensing layer and has a plurality of micro lenses respectively corresponding to the pixels. A distance between the micro-lens layer and the light emitting layer is less than or equal to 800 um and greater than or equal to h1, where h1=(x/2×tan θ), x is the minimum distance between two micro lenses respectively corresponding to different pixels on a plane where the micro-lens layer is disposed, and θ is an FWHM light receiving angle of each of the micro lenses.

IPC Classes  ?

• G06V 40/13 - Sensors therefor
• G02F 1/13357 - Illuminating devices
• G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors
• G06V 40/12 - Fingerprints or palmprints

Abstract

A display panel including a pixel circuit substrate, a planarization layer, a plurality of bonding pads, a plurality of light-emitting devices, a plurality of auxiliary electrodes, and a reflective structure layer is provided. The pixel circuit substrate has a plurality of signal lines. The planarization layer covers the signal lines. The bonding pads are disposed on the planarization layer and are electrically connected to the signal lines. The light-emitting devices are electrically bonded to the bonding pads. The auxiliary electrodes are disposed between the bonding pads. The reflective structure layer is disposed between the light-emitting devices and overlaps at least part of the auxiliary electrodes and the bonding pads. A method of fabricating the display panel is also provided.

IPC Classes  ?

• H01L 33/60 - Reflective elements
• H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
• H01L 33/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof
• G06F 3/044 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
• G06F 3/041 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
• H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls

Abstract

An ultrasonic detection device, including a substrate, sensing elements, a first test element, a first dummy element, at least one first common signal line, sensing signal lines, and at least one test signal line, is provided. The sensing elements, the first test element, and the first dummy element are located on the substrate. The first test element is located between the sensing elements and the first dummy element. Each of the sensing elements, the first test element, and the first dummy element includes an array of capacitive microelectromechanical ultrasonic transducers. The first common signal line is electrically connected to the sensing elements and the first test element. The sensing signal lines are electrically connected to the sensing elements. The test signal line is electrically connected to the first test element.

IPC Classes  ?

• G01S 7/52 - Details of systems according to groups , , of systems according to group
• B06B 1/02 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy
• G01S 15/89 - Sonar systems specially adapted for specific applications for mapping or imaging

Abstract

A dual sensing device, including a first substrate, a first sensing element layer, and a second sensing element layer, is provided. The first sensing element layer is disposed on the first substrate and includes multiple first sensing elements. The second sensing element layer is disposed on the first sensing element layer and includes multiple second sensing elements, wherein an orthographic projection of the second sensing element on the first substrate overlaps with an orthographic projection of the first sensing element on the first substrate.

IPC Classes  ?

• G06V 40/13 - Sensors therefor

Abstract

An optical sensing device includes a substrate, a sensing element layer, a light-shielding layer, and a light absorbing layer. The substrate has a first surface and a second surface opposite to each other. The sensing element layer is disposed on the first surface and includes multiple sensing elements. The light-shielding layer is disposed on the sensing element layer and has multiple openings. An orthogonal projection of the opening on the substrate overlaps an orthogonal projection of the sensing element on the substrate. The light absorbing layer is disposed on the second surface. An electronic apparatus including the optical sensing device is also provided.

IPC Classes  ?

• G01J 1/04 - Optical or mechanical part
• G02B 1/115 - Multilayers
• G02B 5/00 - Optical elements other than lenses
• G06V 40/13 - Sensors therefor

Abstract

The disclosure provides a voltage adjust circuit. The voltage adjust circuit includes a buffer circuit, a bias circuit, a level shifter and a cross voltage limit circuit. The buffer circuit includes a plurality of pull-up transistors and a plurality of pull-down transistors. The pull-up transistors coupled in series between an output terminal of the circuit and a high voltage system terminal. The pull-down transistors coupled in series between the output terminal and a low voltage system terminal. The cross voltage limit circuit is configured to limit transient and static bias voltages across two terminals of the pull-up transistors or the pull-down transistors.

IPC Classes  ?

• H03K 5/00 - Manipulation of pulses not covered by one of the other main groups of this subclass
• H03K 5/02 - Shaping pulses by amplifying
• H03K 19/0175 - Coupling arrangementsInterface arrangements

Abstract

A level shifter includes a buffer circuit, a first shift circuit, and a second shift circuit. The buffer circuit provides a first signal and a first inverted signal to the first shift circuit, such that the first shift circuit provides a second signal and a second inverted signal to the second shift circuit. The second shift circuit generates a plurality of output signals according to the second signal and the second inverted signal. The first shift circuit includes a plurality of first stacking transistors and a first voltage divider circuit. The first voltage divider circuit is electrically coupled between a first system high voltage terminal and a system low voltage terminal. The first voltage divider circuit is configured to provide a first inner bias to gate terminals of the first stacking transistors.

IPC Classes  ?

• H03K 3/356 - Bistable circuits
• H03K 17/10 - Modifications for increasing the maximum permissible switched voltage
• H03K 19/0185 - Coupling arrangementsInterface arrangements using field-effect transistors only

Abstract

A light emitting diode includes a first semiconductor layer, a second semiconductor layer, a first pad, a second pad, and a protection bump. The first semiconductor layer and the second semiconductor layer are overlapping with each other. An area of a first surface of the first semiconductor layer is larger than an area of a second surface of the second semiconductor layer. The first surface faces the second surface. The first pad is electrically connected to the first semiconductor layer. The second pad is electrically connected to the second semiconductor layer. The protection bump is located between the first pad and the second pad.

IPC Classes  ?

• H01L 33/44 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 33/38 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the electrodes with a particular shape
• H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
• H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group

Abstract

A display device includes a flexible substrate, a bonding pad, a light-emitting diode, an encapsulant, and a support structure. The bonding pad and the light-emitting diode are located on the flexible substrate. The encapsulant covers the light-emitting diode. The support structure is laterally located between the light-emitting diode and the bonding pad. The support structure has an inclined surface, and a thickness of the support structure close to the light-emitting diode is greater than the thickness of the support structure close to the bonding pad.

IPC Classes  ?

• H01L 33/56 - Materials, e.g. epoxy or silicone resin
• H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
• H01L 33/48 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the semiconductor body packages
• H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls

Abstract

Provided is a display panel, including a substrate, multiple pixel circuits, an insulating layer, multiple first electrodes, a first isolation structure, and a second isolation structure. The pixel circuits are located on the substrate. The insulating layer is located on the pixel circuits and has multiple through holes. The first electrodes are located on the insulating layer and are respectively electrically connected to the pixel circuits through the through holes. The first isolation structure is located on the insulating layer and overlaps the through holes. The second isolation structure includes multiple separating parts and multiple cover parts. The separating parts and the first isolation structure at least partially overlap, and the cover parts respectively overlap the through holes and the first isolation structure.

IPC Classes  ?

• H10K 59/131 - Interconnections, e.g. wiring lines or terminals
• H10K 59/121 - Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements

Abstract

A device of mass transferring chips includes a first substrate, which includes a first surface with a chip-connecting area configured to attach a chip, a second surface opposite to the first surface, and a patterned recess. The patterned recess is disposed on the first surface or the second surface. A projection of at least a portion of the patterned recess on the first surface is spaced apart from the chip-connecting area. The device further includes a second substrate with a third surface. The third surface has a chip-receiving area configured to attach the chip from the first substrate.

IPC Classes  ?

• H01L 21/00 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid-state devices, or of parts thereof
• H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
• H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
• H01L 33/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof

Abstract

A light-emitting device including a first substrate, a first active element, a barrier layer, a first photosensitive element, a flat layer, and a first light-emitting diode is provided. The first active element is on the first substrate. The barrier layer is on the first active element. The first photosensitive element is on the barrier layer. The flat layer is on the first photosensitive element, and the first photosensitive element is between the barrier layer and the flat layer. The first light-emitting diode is on the flat layer. The first light-emitting diode includes a first electrode, a light-emitting layer, and a second electrode. The first electrode is electrically connected to the first active element. The first photosensitive element is not completely shielded by the first electrode in a normal direction of the first substrate. The light-emitting layer is on the first electrode. The second electrode is on the light-emitting layer.

IPC Classes  ?

• H01L 33/42 - Transparent materials
• G09G 3/00 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
• H01L 27/15 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier, specially adapted for light emission
• H01L 33/38 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the electrodes with a particular shape
• H01L 33/46 - Reflective coating, e.g. dielectric Bragg reflector

Abstract

A display panel includes a first substrate, a second substrate, a light-emitting diode, a white insulation layer, and a first spacer layer. The first substrate has a filter layer and at least one black matrix. The second substrate is opposite to the first substrate. The light-emitting diode is disposed on the second substrate. The white insulation layer is located on the first substrate and protrudes toward the second substrate. The white insulation layer is overlapped with the filter layer and the black matrix along a first direction substantially perpendicular to the first substrate. The first spacer layer is disposed between the second substrate and the white insulation layer, and the first spacer layer is overlapped with the black matrix along the first direction.

IPC Classes  ?

• H01L 27/15 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier, specially adapted for light emission
• H01L 33/50 - Wavelength conversion elements
• H01L 33/58 - Optical field-shaping elements
• H01L 33/60 - Reflective elements

Abstract

A pulse sensor and a pulse sensing system are provided. The pulse sensor includes a pressure sensing circuit, a reference circuit, and an output circuit. The pressure sensing circuit may sense a pulse vibration to generate a sensing signal. The reference circuit may generate a reference signal according to a base signal. A first input terminal of the output circuit is coupled to the pressure sensing circuit. A second input terminal of the output circuit is coupled to the reference circuit. The output circuit generates a pulse sensing current at an output terminal of the output circuit according to a difference between the sensing signal and the reference signal.

IPC Classes  ?

• A61B 5/0245 - Measuring pulse rate or heart rate using sensing means generating electric signals

Abstract

An electronic device and a manufacturing method thereof are provided. The electronic device includes an array substrate, which includes a substrate, a first conductive layer, a first insulating layer, a second conductive layer, and a second insulating layer. The substrate has a substrate surface. The first conductive layer is located on the substrate surface. The first insulating layer is located on the first conductive layer. The second conductive layer is located on the first insulating layer and includes a first sputtering layer, a second sputtering layer, and a third sputtering layer. The second insulating layer is located on the second conductive layer. The second sputtering layer is located between the first and third sputtering layers, and includes a first metal element. The first sputtering layer includes the first metal element and a second metal element. The third sputtering layer includes the first metal element and a third metal element.

IPC Classes  ?

• H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
• C23C 14/54 - Controlling or regulating the coating process
• C23C 14/34 - Sputtering

Abstract

The present invention provides a pulse diagnosis device including at least one bellow, at least one sensor, and a locating element. The bellow has a sensing surface having a first end and a second end opposite to each other. The sensor is disposed on the sensing surface and has a sensing area at least partially extending from the first end to the second end or protruding from the second end. The locating element is at least partially disposed along the second end to position the sensor at the second end, wherein the sensing area does not overlap with the locating element at least partially.

IPC Classes  ?

• A61B 5/024 - Measuring pulse rate or heart rate

Abstract

The present disclosure provides a semiconductor device, including a buffer layer, a first sub-chip and a second sub-chip, and a connecting element. The first sub-chip and the second sub-chip are separately arranged on the buffer layer. Each of the first sub-chip and the second sub-chip includes a first diffusion layer, an active layer, and a second diffusion layer. The first diffusion layer, the active layer, and the second diffusion layer are sequentially arranged on the buffer layer in a top-down approach. The first diffusion layer and the buffer layer are first-type epitaxial layers, and the second diffusion layer is a second-type epitaxial layer. The connecting element is configured to couple the second diffusion layer of the first sub-chip and the first diffusion layer of the second sub-chip.

IPC Classes  ?

• H01L 27/15 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier, specially adapted for light emission
• G09G 3/32 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]

Abstract

The present disclosure provides a light emitting diode component, including a body and a plurality of P-N diode structures. The P-N diode structures are coupled in series and integrated on the body. The P-N diode structures include a plurality of p-type doping layers and a plurality of n-type doping layers. The p-type doping layer of a first P-N diode structure in the P-N diode structures is electrically coupled to the n-type doping layer of a second P-N diode structure in the P-N diode structures.

IPC Classes  ?

• H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
• H01L 33/38 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the electrodes with a particular shape
• H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls

Abstract

A pixel array is provided. The pixel array includes a plurality of red pixels, a plurality of green pixels, and a plurality of blue pixels. Each green pixel includes a light emitting diode (LED), a first transistor, a second transistor, a third transistor, and a fourth transistor. The LED receives a system low voltage. The first transistor receives a first data signal and a first scan signal. The second transistor is coupled to a second end of the first transistor and the anode of the light emitting diode. The third transistor receives a system high voltage and a first control signal, and is coupled to a first end of the second transistor. The fourth transistor is coupled to the anode of the light-emitting diode of an adjacent green pixel, a control terminal of the third transistor, and the anode of the light-emitting diode.

IPC Classes  ?

• G09G 3/32 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]

Abstract

An X-ray sensing device includes a photosensitive element, lead-containing glass, and an X-ray conversion structure. The photosensitive element is configured to sense light having a first wavelength. The lead-containing glass overlaps the photosensitive element. The X-ray conversion structure is disposed on the lead-containing glass. The lead-containing glass is located between the photosensitive element and the X-ray conversion structure. The X-ray conversion structure is configured to at least partially convert X-rays into light having the first wavelength.

IPC Classes  ?

• G01T 1/20 - Measuring radiation intensity with scintillation detectors
• C03C 4/08 - Compositions for glass with special properties for glass selectively absorbing radiation of specified wave lengths
• H01L 27/146 - Imager structures

Abstract

A pixel array is provided. The pixel array includes a plurality of pixels, wherein each of the pixels includes a light emitting diode, a first transistor, a second transistor, a third transistor, a fourth transistor, and a fifth transistor. The first transistor receives a first data signal and a first scan signal. The second transistor is coupled to the first transistor and an anode of the light emitting diode. The third transistor receives a system high voltage and a first control signal, and is coupled to the second transistor. The fourth transistor is coupled to an anode of a light emitting diode of an adjacent pixel, a control terminal of the third transistor, and a cathode of the light emitting diode. The fifth transistor is coupled to the cathode of the light emitting diode, and receives a second control signal and a system low voltage.

IPC Classes  ?

• G09G 3/32 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]

Abstract

A display panel includes a drive element, a first heat dissipation layer, a light-emitting element, and a second heat dissipation layer. The drive element is disposed on a substrate. The first heat dissipation layer is disposed on the drive element. The light-emitting element is disposed on the first heat dissipation layer and electrically connected to the drive element. The second heat dissipation layer covers the light-emitting element. A refractive index of the first heat dissipation layer is greater than a refractive index of the second heat dissipation layer when a light-emitting surface of the light-emitting element faces the first heat dissipation layer, and the refractive index of the second heat dissipation layer is greater than the refractive index of the first heat dissipation layer when the light-emitting surface of the light-emitting element faces the second heat dissipation layer.

IPC Classes  ?

• H01L 33/64 - Heat extraction or cooling elements
• H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
• H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body

Abstract

A display device includes a substrate, a first light-emitting diode, an encapsulant and a first Fresnel lens. The first light emitting diode is located on the substrate. The encapsulant covers the first light emitting diode. The first Fresnel lens is located on the encapsulant and overlapping with the first light emitting diode. The width of the first Fresnel lens is 4 to 10 times the width of the first light emitting diode.

IPC Classes  ?

• H01L 33/54 - Encapsulations having a particular shape
• H01L 27/15 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier, specially adapted for light emission
• H01L 33/44 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
• H01L 33/58 - Optical field-shaping elements

Abstract

The present invention provides a loading box, which includes a box body, a first groove set, and a first positioning member. The box body includes a base and a side wall protruding from the base along a plurality of sides of the base. The first groove set has a plurality of first grooves, and is disposed on the base along a first side. The first positioning member is arranged corresponding to the first groove set, and includes: a first baffle, detachably inserted into one of the first grooves in the first groove set; and a first supporting arm and a second supporting arm, respectively connected to the first baffle and protruding from the first baffle toward the side wall. One ends of the first supporting arm and the second supporting arm of the first positioning member away from the first baffle are detachably connected to the box body.

IPC Classes  ?

• B65D 81/05 - Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents

Abstract

A circuit substrate includes a substrate, an active device, a first signal line, a second signal line, a shielding electrode, a data line, a pixel electrode, and a common electrode. The first signal line is electrically connected to the active device, and includes a main portion and a connection portion connected to the main portion. The main portion extends along a first direction. The second signal line extends along a second direction. The second signal line is electrically connected to the connection portion. The shielding electrode overlaps the connection portion in a normal direction of the substrate. The shielding electrode and the second signal line belong to a same conductive layer. The data line is electrically connected to the active device. The common electrode is electrically connected to the shielding electrode.

IPC Classes  ?

• G02F 1/1362 - Active matrix addressed cells
• G02F 1/1343 - Electrodes

Abstract

A light shielding element substrate includes a substrate, a transparent island structure and a first light shielding layer. The transparent island structure is located on the substrate. The first light shielding layer is located on the transparent island structure. The first light shielding layer is overlapping with a part of the top surface of the transparent island structure. The first light shielding layer has a first through hole overlapping the top surface of the transparent island structure.

IPC Classes  ?

• G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors
• G02F 1/1333 - Constructional arrangements
• G06V 40/13 - Sensors therefor
• G02F 1/13357 - Illuminating devices

Abstract

An antenna device includes a first antenna unit, a second antenna unit and a third antenna unit. An angle between the second antenna unit and the first antenna unit is substantially equal to 90 degrees. An angle between the third antenna unit and the first antenna unit is substantially equal to 90 degrees. The first antenna unit and the second antenna unit are configured to generate a signal having a first polarization when the third antenna unit is turned off. The third antenna unit and the second antenna unit are configured to generate a signal having a second polarization different from the first polarization when the third antenna unit is turned off. A method of generating polarized signals is also disclosed herein.

IPC Classes  ?

• H01Q 5/35 - Individual or coupled radiating elements, each element being fed in an unspecified way for different propagation modes using two or more simultaneously fed points
• H01Q 21/24 - Combinations of antenna units polarised in different directions for transmitting or receiving circularly and elliptically polarised waves or waves linearly polarised in any direction
• H01Q 1/50 - Structural association of antennas with earthing switches, lead-in devices or lightning protectors
• H01Q 21/28 - Combinations of substantially independent non-interacting antenna units or systems

Abstract

A display device includes a circuit substrate, a blocker, a first and second pad located on the circuit substrate, a light-emitting element, and a first and second connecting portion. The blocker is located on the circuit substrate, and has an opposite first and second side and an opposite third and fourth side. The first pad is adjacent to the first side of the blocker. The second pad is adjacent to the second side of the blocker. The light-emitting element is located on the blocker and the first and second pads, and includes a first and second electrode. The first connecting portion is connected to the first electrode and the first pad. The second connecting portion is connected to the second electrode and the second pad. The third and fourth sides of the blocker are aligned with a side of each of the first and second connecting portions.

IPC Classes  ?

• H01L 33/52 - Encapsulations
• H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
• H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls

Abstract

A display device includes pixel driving circuits. A first pixel driving circuit includes a light emitting element, first and second driving units and a control unit. The light emitting element emits light according to a current. The first driving unit generates the current. The second driving unit drives the first driving unit to adjust the current according to a first scanning signal. The control unit controls the first driving unit to adjust the current according to a first light emitting signal. The first scanning signal has first slope to third slopes during first to third periods, respectively. The first to third slopes are different from each other. The first light emitting signal has an enable voltage level during the first and third periods, and has a disable voltage level during the second period. The first to third periods are arranged continuously in order.

IPC Classes  ?

• G09G 3/3233 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix with pixel circuitry controlling the current through the light-emitting element
• G09G 3/32 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]

Abstract

A display panel includes a substrate and display pixels. The display pixels are disposed on the substrate, and each of the display pixels includes pad sets, light-emitting devices, a first connecting wire, a second connecting wire, and first cutting regions. Each pad set has a first pad and a second pad. The light-emitting devices are electrically bonded to at least part of the pad sets. The first connecting wire is electrically connected to the first pads of a plurality of first pad sets of the pad sets. The second connecting wire is electrically connected to the second pads of the pad sets. The first cutting regions are disposed on one side of each of the first pad sets. Two first connecting portions of the first connecting wire and the second connecting wire connecting each of the first pad sets are located in one of the first cutting regions.

IPC Classes  ?

• H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body

Abstract

A display device and a display method are provided. The display device includes a board, a sensing circuit, and a feedback control circuit. The board includes a display array formed by a plurality of pixels. The sensing circuit includes a test pixel and a light sensor. The light sensor receives light emitted by the test pixel to generate a corresponding sensing signal. The feedback control circuit receives the sensing signal and generates a pulse width adjusting signal to adjust a pulse width at which the pixels are operated for display.

IPC Classes  ?

• G09G 3/20 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix
• G09G 5/10 - Intensity circuits

Abstract

A cholesteric liquid crystal display includes a cholesteric liquid crystal device, a color filter element, a first quarter-wave plate, and a light recovery structure. The cholesteric liquid crystal device includes a cholesteric liquid crystal. The color filter element and the first quarter-wave plate overlap the cholesteric liquid crystal device. The first quarter-wave plate and the color filter element are located between the cholesteric liquid crystal and the light recovery structure.

IPC Classes  ?

• G02F 1/137 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells characterised by the electro-optical or magneto-optical effect, e.g. field-induced phase transition, orientation effect, guest-host interaction or dynamic scattering
• G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors
• G02F 1/13363 - Birefringent elements, e.g. for optical compensation

Abstract

An optical sensor circuit is provided. In the optical sensor circuit, an output stage circuit transmits a voltage of first and second node to the output line according to a first driving signal. A first sensor is configured to generate a first photocurrent according to a first color light that senses an ambient light, and generate a second photocurrent according to a second color light. A second sensor is configured to generate a third photocurrent according to a third color light, and generate a fourth photocurrent according to the second color light. In a sensing phase, when the first sensor senses the first color light, and the second sensor senses the third color light, the first sensor adjusts a voltage level of the voltage according to the first photocurrent, and the second sensor adjusts the voltage level of the voltage according to the third photocurrent.

IPC Classes  ?

• G01J 3/51 - Measurement of colourColour measuring devices, e.g. colorimeters using electric radiation detectors using colour filters
• G01J 3/50 - Measurement of colourColour measuring devices, e.g. colorimeters using electric radiation detectors

Abstract

An active phased array, including multiple antennas, multiple phase shifters, and multiple filters, is provided. The phase shifters are individually coupled to a corresponding one of the antennas. The filters are commonly coupled to a signal feeding line and individually coupled to a corresponding one of the phase shifters. Each filter includes a filter capacitor and a filter resistor. The filter capacitor is coupled between a first node and a second node and has a capacitance. The filter resistor is coupled between the second node and a third node and has a resistance. The first node is coupled to one of the signal feeding line, the second node is coupled to a corresponding one of the phase shifters, the third node is coupled to the ground, and at least one of the capacitance and the resistance is adjustable.

IPC Classes  ?

• H01Q 21/00 - Antenna arrays or systems
• H01Q 3/36 - Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elementsArrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the distribution of energy across a radiating aperture varying the phase by electrical means with variable phase-shifters

Abstract

The present invention provides a polarizer module and an operation method thereof. The polarizer module includes a bifacial reflective polarizer, a first liquid crystal layer, a second liquid crystal layer, a first polarizer, and a second polarizer. The bifacial reflective polarizer has a first surface and a second surface opposite to each other. The first liquid crystal layer and the second liquid crystal layer are disposed on the first surface and the second surface respectively. The first polarizer and the second polarizer are disposed on the first liquid crystal layer and the second liquid crystal layer respectively.

IPC Classes  ?

• G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors
• G02F 1/1347 - Arrangement of liquid crystal layers or cells in which the final condition of one light beam is achieved by the addition of the effects of two or more layers or cells
• G02B 5/30 - Polarising elements
• G02F 1/133 - Constructional arrangementsOperation of liquid crystal cellsCircuit arrangements

Abstract

A driving circuit for a display panel and including a receiving interface, a timing controller, a pulse width modulation controller and a line latch is disclosed. The receiving interface is configured to receive a first input signal, a second input signal and a link signal to generate a plurality of display data accordingly, wherein the first input signal and the second input signal are a pair of differential signals. The timing controller is configured to interpret the first input signal, the second input signal and the link signal to generate a trigger signal. The pulse width modulation controller is configured to perform pulse width modulation to generate a first output signal and a second output signal. The line latch is configured to hold the first and second output signals, and output the first and second output signals according to the trigger signal to drive the display panel.

IPC Classes  ?

• G09G 3/32 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
• G09G 3/20 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix