A magnetic device, comprising a body and a coil disposed in the body, wherein a terminal part of the conductive wire forming the coil comprises a first portion and a second portion, wherein the first portion is exposed from the body for forming an electrode, wherein the second portion of the terminal part is deformed for increasing the distance between the terminal part of the conductive wire and the coil for preventing a short circuit.
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
An output current protection controller includes a comparator circuit and a threshold voltage generator circuit. The comparator circuit compares a current sensing signal with a detection threshold voltage to generate a control signal that controls output current protection of a switching regulator circuit. The current sensing signal is indicative of an output current of the switching regulator circuit. The threshold voltage generator circuit adaptively adjusts the detection threshold voltage according to temperature variation.
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
A coupled inductor has two coils made by film processes, wherein a first coil is disposed on a top surface of a magnetic sheet and a second coil is disposed on a bottom surface of the magnetic sheet, for controlling the variations of the gap between the two coils in a smaller range.
B22F 1/00 - Metallic powderTreatment of metallic powder, e.g. to facilitate working or to improve properties
B22F 1/052 - Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
H01F 27/32 - Insulating of coils, windings, or parts thereof
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
The present disclosure provides a package including a die, a first leadframe and a second leadframe. The first leadframe and the second leadframe are stacked and bonded together by using adhering substance to form a final leadframe. The die is bonded to the final leadframe. By using the package of the embodiments, the package includes appropriate signal transmission paths and multi-directional heat dissipation paths.
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
5.
LITHIUM-ION SECONDARY BATTERY, POSITIVE ELECTRODE STRUCTURE THEREOF, AND CHARGING AND DISCHARGING METHOD THEREFOR
A lithium-ion secondary battery is provided in the present disclosure, including a positive electrode with a first current collector and a first active material, a negative electrode, a separator between the positive electrode and the negative electrode, a field electrode at one side of the positive electrode opposite to the negative electrode, and a first insulating layer isolated between the positive electrode and the field electrode.
H01M 4/74 - Meshes or woven materialExpanded metal
H01M 10/0525 - Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodesLithium-ion batteries
H01M 10/0585 - Construction or manufacture of accumulators having only flat construction elements, i.e. flat positive electrodes, flat negative electrodes and flat separators
A heat dissipation structure is disposed between two busbars or disposed outside the busbar, so as to dissipate heat from the busbar. In an embodiment, the heat dissipation structure is disposed between two busbars, such that a single heat dissipation structure is used to dissipate heat from two busbars simultaneously, so as to reduce cost of the heat dissipation structure. Furthermore, an insulation member is disposed between the two busbars and/or disposed between the busbar and the heat dissipation structure to achieve electrical insulation.
A magnetic component structure with thermal conductive filler, including two magnetic cores combining together to form an inner accommodating space and at least one core opening, two plate portions connect each other through an inner leg structure and two outer leg structures, a bobbin sleeving on the inner leg structure, a coil winding on the bobbin, a bobbin housing surrounding the bobbin and the coil winding and form winding opening facing the at least one core opening, gaps are formed between the encasing structure constituted by the bobbin housing and the bobbin sleeving and the magnetic cores, a thermal conductive filler formed between the bobbin and the bobbin housing and encapsulating at least parts of the coil winding, and a cooling surface contacts the magnetic cores and the thermal conductive filler, the thermal conductive filler extends outwardly to contact the cooling surface through the opening and the winding opening.
A magnetic component includes a primary winding, a secondary winding and at least one tertiary winding stacked with each other to form a symmetrical inductance structure or an asymmetrical inductance structure. Through the relationship of the distances between the primary winding, the secondary winding and the at least one tertiary winding of the symmetrical inductance structure, the leakage inductance can be balanced, the tolerance can be stabilized, the reverse current can be eliminated, the AC loss of the tertiary winding can be reduced, and/or the total loss can be reduced. Through the relationship of the distances between the primary winding, the secondary winding and the at least one tertiary winding of the asymmetrical inductance structure, the leakage inductance can be adjusted more flexibly, the tolerance can be stabilized, and the couple energy can be reduced.
A method to form a plurality of inductors in a single process by stacking multiple magnetic sheets, wherein each sheet is made to form a particular part in quantities, which can be a base part, a pillar part, a hollow part, or a cover part, for forming a magnetic body of an inductor.
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
H01F 1/22 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
An IC package structure with connections is provided in the present disclosure, including a die bonded to a leadframe, a plurality of connections bonded to the leadframe, a molding compound formed on the leadframe, a metal layer formed on the molding compound and electrically connecting with the connections, and an electronic component mounted on the metal layer.
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
H10D 80/30 - Assemblies of multiple devices comprising at least one device covered by this subclass the at least one device being covered by groups , e.g. assemblies comprising integrated circuit processor chips
11.
PHASE-CONTROL ARRAY ANTENNA MODULE CAPABLE OF SUPRESSING GRATING LOBE GAIN AND PHASE-SHIFT CONTROL METHOD THEREOF
A phase-control array antenna module capable of suppressing grating lobe gain is provided and includes an array antenna and a beam steering unit. The array antenna includes a plurality of sub-antennas, each of which includes at least one antenna unit. Any two adjacent sub-antenna rows or columns are staggered in the first direction. A phase-shift unit angle is formed between any two adjacent RF signals in the azimuth direction and changes in related to a steering angle of beam according to a microwave radiation field pattern of the array antenna in the azimuth direction. A compensation angle is formed between any two RF signals in an elevation direction from the two adjacent sub-antennas with and without staggering. In the first-phase shift unit angle interval, the compensation angle is a first compensation angle, and in the second phase-shift unit angle interval, the compensation angle is a second compensation angle.
H01Q 3/36 - Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elementsArrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the distribution of energy across a radiating aperture varying the phase by electrical means with variable phase-shifters
H01Q 1/52 - Means for reducing coupling between antennas Means for reducing coupling between an antenna and another structure
12.
RADOME WITH CIRCULARLY POLARIZED METAMATERIAL AND ANTENNA ASSEMBLY
The present invention provides a radome incorporating a circularly polarized metamaterial, including a dielectric carrier and a circularly polarized metamaterial layer attached to or embedded into the dielectric carrier and electrically floating with respect to ground. The circularly polarized metamaterial layer includes a plurality of X-shaped openings arranged in an array and exposing the dielectric carrier, and a first radiation pattern transmits through the circularly polarized metamaterial layer, resulting in a second radiation pattern having enhanced focusing characteristics compared to the first radiation pattern.
A tin-based solder paste, a soldering method and an electronic component formed thereby are provided. A copper powder is mixed into the tin-based solder paste, and a weight ratio of the copper powder to an overall metallic powder ranges within 0.2-20%. The electronic component includes a core element, a copper wire and a soldering member. The core element has thereon an electrode terminal. One end of the copper wire is in contact with the electrode terminal. The soldering member covers the one end of the copper wire and the electrode terminal to form the solder joint electrically connecting the copper wire to the electrode terminal, wherein copper-based particles enveloped in an intermetallic compound are dispersed in the soldering member, and the copper-based particles have a particle size of 1-50 μm.
B23K 1/19 - Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
B23K 35/00 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
H01F 5/04 - Arrangements of electric connections to coils, e.g. leads
H01R 43/02 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
A coupled inductor includes a core assembly, at least two first windings, and a second winding. The core assembly includes a first core and a second core. The first core includes a first base plate, two first non-winding posts, and at least two first winding posts disposed between the two first non-winding posts. The two first non-winding posts and the first winding posts are connected to the first base plate. Each of the first windings is wound around a corresponding first winding post. The second winding covers the at least two first windings. The at least two first windings and the second winding are disposed along a first direction. A first wound direction of the at least two first windings and a second wound direction of the second winding are parallel to each other.
A magnetic component includes a magnetic body, a first winding, a second winding and a magnetic filler. The first winding is disposed in the magnetic body. A first end and a second end of the first winding respectively extend towards a first side and a second side of the magnetic body. The second winding is disposed in the magnetic body. A third end and a fourth end of the second winding extend towards the first side of the magnetic body. The first winding partially covers the second winding. The magnetic filler is filled between the first winding and the second winding.
H01F 27/32 - Insulating of coils, windings, or parts thereof
H01F 27/34 - Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
A wireless charger comprises a top cover; a metallic case; and a first high-k heat-conducting material, disposed between a bottom surface of the top cover and a top surface of the metallic case to form a heat conductive path from the top cover to the metallic case via the first high-k heat-conducting material for dissipating heat generated by an electronic device disposed on the top cover for wireless charging the electronic device.
H01F 27/32 - Insulating of coils, windings, or parts thereof
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
H01Q 7/06 - Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
H02J 7/00 - Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
H02J 50/10 - Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
H10N 10/00 - Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
The present disclosure provides a multi-function charging printed circuit board by forming a short-range antenna and multiple charging coils on multiple layers, wherein the short-range antenna and at least one charging coil is integrated on a single layer. One or more temperature-detecting units are disposed on the charging side of the charging printed circuit board for effectively dissipating heat and avoiding over-temperature accidents. A ferrite sheet is attached to the bottom side of the wireless charging printed circuit board for improving the efficiency of wireless charging.
A recess is formed on a bottom surface of a body of an inductor, wherein an electrode for connecting to a ground is disposed in the recess, and an electrode connecting with a coil of the inductor is disposed on a protruding portion adjacent to the recess.
H01F 27/36 - Electric or magnetic shields or screens
H01F 41/00 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
A power inductor component includes a conductor and a magnetic powder material mold. The conductor includes two bending portions and two electrode portions respectively attached to the two bending portions. The magnetic powder material mold and the conductor are formed into an integral structure. The conductor is embedded in the integral structure. The magnetic powder material mold includes a first magnetic powder portion and a second magnetic powder portion. The conductor has less than one turn. The first magnetic powder portion is disposed on an outer side of the conductor. The second magnetic powder portion is disposed on an inner side of the conductor. The integral structure includes a first surface and a second surface opposite to each other, a third surface and a fourth surface opposite to each other, and a fifth surface and a sixth surface opposite to each other.
A busbar filter including a core with a through hole, two busbars extending through the through hole, and a first over-molding part formed on the two busbars and between the two busbars and the core, wherein the first over-molding part fills up gaps between the two busbars and a remaining space in the through hole.
A mixture for making a multilayer inductor, wherein the mixture comprises a first magnetic powder, a second magnetic powder, and a glass material, wherein each of the first magnetic powder and the second magnetic powder comprises an amorphous or nanocrystalline magnetic powder, wherein a softening point temperature of the glass material is in a range of 300°˜430° C.
B22F 1/00 - Metallic powderTreatment of metallic powder, e.g. to facilitate working or to improve properties
B22F 1/052 - Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
H01F 27/32 - Insulating of coils, windings, or parts thereof
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
A coil structure comprises a coil formed by a conductive wire and a flexible printed circuit board, wherein the flexible printed circuit board is disposed across a plurality winding turns of the coil, wherein a first terminal part and a second terminal part of the conductive wire are respectively electrically connected to the flexible printed circuit board for electrically connecting to an external circuit.
H01F 5/04 - Arrangements of electric connections to coils, e.g. leads
H01F 27/06 - Mounting, supporting, or suspending transformers, reactors, or choke coils
H01F 41/063 - Winding flat conductive wires or sheets with insulation
H01F 41/076 - Forming taps or terminals while winding, e.g. by wrapping or soldering the wire onto pins, or by directly forming terminals from the wire
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H05K 1/18 - Printed circuits structurally associated with non-printed electric components
A coupled inductor includes a first conductive body, a second conductive body, and a molding body. The first conductive body includes a first lateral portion, a first top portion, and a second lateral portion. The first conductive body extends from the first lateral portion to the second lateral portion via the first top portion. The second conductive body includes a third lateral portion, a second top portion, and a fourth lateral portion. The second conductive body extends from the third lateral portion to the fourth lateral portion via the second top portion. The molding body encapsulates the first lateral portion, the first top portion, and the second lateral portion of the first conductive body. At least one material is filled in a first space between a first bending portion of the first conductive body and a first bending portion of the second conductive body.
A soldering structure includes a conductive base, a conductive wire and a soldering portion. The conductive base includes a first limiting member and a second limiting member spaced apart from the first limiting member. The conductive wire includes a conductive portion and an insulating layer covering the conductive portion. The conductive portion includes an exposed portion exposed from the insulating layer, the conductive wire passes through the first limiting member, the exposed portion is located between the first limiting member and the second limiting member, and the second limiting member clamps an end of the conductive wire. The soldering portion at least partially covers the exposed portion, the first limiting member and the second limiting member, so that the conductive wire is electrically connected with the conductive base.
A power supply system includes a system board, a first-stage power supply module, a second-stage power supply module and a heat conductive structure. The system board includes a processor on a first surface of the system board. The first-stage power supply module is disposed on a second surface of the system board and provides a target output voltage from a plurality of power electrodes of a mounting surface of the first-stage power supply module to the processor through a circuit layout of the system board. The second-stage power supply module is disposed on the first-stage power supply module. The heat conductive structure is sandwiched between the first-stage power supply module and the second-stage power supply module. Two opposite sides of the heat conductive structure are respectively in contact with the first-stage power supply module and the second-stage power supply module.
A power supply module includes at least one sub-power supply module. Each of the at least one sub-power supply module includes an upper circuit board, a lower circuit board and an inductor. The inductor is disposed between the upper circuit board and the lower circuit board. An upper surface of the inductor faces the upper circuit board and a lower surface of the inductor faces the lower circuit board. The inductor includes two primary windings and two secondary windings. Two electrodes of each of the two primary windings are respectively arranged at the upper surface and the lower surface of the inductor and respectively connected to the upper circuit board and the lower circuit board. The two secondary windings are electrically connected in series through the upper circuit board and the lower circuit board or through the upper circuit board.
A wire winding method for forming a common mode choke includes winding a first wire and a second wire in parallel for 1 turn, winding the first wire and the second wire to cross each other in a following ¼ turn, winding the first wire and the second wire in parallel for ¾ turn, winding the first wire for ¼ turn, and winding the second wire to cross the first wire, winding the first wire and the second wire in parallel for first ¼ turn, winding the first wire to cross the first wire, and winding the second wire to cross the first wire, winding the first wire and the second wire in parallel for second ¼ turn, winding the first wire to cross the first wire, and winding the second wire for ¼ turn, and winding the first wire and the second wire in parallel for another ¾ turn.
A resistor is provided, which comprises: a resistive element; a first conductive element connected to the first side of the resistive element; a second conductive element connected to the second side of the resistive element; and a first extension part connected to the first side of the resistive element, extending in a direction away from the resistive element and spaced apart from the first conductive element; a second extension part connected to the second side of the resistive element, extending in a direction away from the resistive element and spaced apart from the second conductive element; a first sensing point located on the first extension part; and a second sensing point located on the second extension part.
H01C 7/06 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material including means to minimise changes in resistance with changes in temperature
National Tsing Hua University (Taiwan, Province of China)
Inventor
Wang, I-Sheng
Lu, Wen-Hsuan
Chen, Yen-Lin
Chen, Han-Yi
Abstract
A solid-state electrolyte of a lithium-ion battery is provided. The lithium-ion battery has a negative electrode including a lithium-containing material in contact with the solid-state electrolyte. The solid-state electrolyte includes a multiple-doping material with a chemical formula of LixTiyMm(PO4)3, wherein 0.8≤x≤1.5, 0
A lithium-ion secondary battery is provided in the present disclosure, including a positive electrode with a first current collector and a first active material, a negative electrode, a separator between the positive electrode and the negative electrode, a field electrode at one side of the negative electrode opposite to the positive electrode, and a first insulating layer isolated between the negative electrode and the field electrode.
H01M 4/505 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of manganese of mixed oxides or hydroxides containing manganese for inserting or intercalating light metals, e.g. LiMn2O4 or LiMn2OxFy
H01M 4/525 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of nickel, cobalt or iron of mixed oxides or hydroxides containing iron, cobalt or nickel for inserting or intercalating light metals, e.g. LiNiO2, LiCoO2 or LiCoOxFy
A composite dielectric structure includes a first dielectric ceramic layer including a first dielectric ceramic material and having a first permittivity; a second dielectric ceramic layer including a second dielectric ceramic material and having a second permittivity; and an interleaving layer comprising a glass or glass-based material. A volume percentage of the glass or glass-based material is 93%-100% of overall material of the interleaving layer. The interleaving layer is disposed between a first surface of the first dielectric ceramic layer and a second surface of the second dielectric ceramic layer for binding the first dielectric ceramic layer and the dielectric second surface of the second ceramic layer to form the composite dielectric structure.
B32B 17/06 - Layered products essentially comprising sheet glass, or fibres of glass, slag or the like comprising glass as the main or only constituent of a layer, next to another layer of a specific substance
B32B 7/02 - Physical, chemical or physicochemical properties
B32B 9/00 - Layered products essentially comprising a particular substance not covered by groups
C04B 37/00 - Joining burned ceramic articles with other burned ceramic articles or other articles by heating
H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
A stacked electronic structure, wherein a molding body encapsulates a first active device with a first electrode on a top surface of the first active device and a second electrode on a bottom surface of the first active device; and a magnetic device disposed over the molding body and comprising a first inductor, wherein the second electrode of the first active device is electrically connected to the substrate, and the first electrode of the first active device tis electrically connected to the first inductor.
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 23/373 - Cooling facilitated by selection of materials for the device
A coupled inductor, comprising: a first conductive body, comprising a first lateral portion, a first top portion, and a second lateral portion, wherein the first conductive body extends from the first lateral portion to the second lateral portion via the first top portion; a second conductive body, comprising a third lateral portion, a second top portion, and a fourth lateral portion, wherein the second conductive body extends from the third lateral portion to the fourth lateral portion via the second top portion; and a molding body, encapsulating the first lateral portion, the first top portion, and the second lateral portion of the first conductive body.
A power conversion circuit is provided, which includes a control circuit. The control circuit includes a reference signal generation circuit, a comparator, an on-time control circuit and a driving circuit. The reference signal generation circuit is configured to compensate for a first reference voltage and generate an adjusted reference voltage. The reference signal generation circuit includes an operational amplifier circuit, a compensation capacitor and a compensation branch circuit. The operational amplifier circuit is configured to receive the first reference voltage and accordingly generate the adjusted reference voltage. The comparator is configured to output a comparison signal according to a signal related to the first output voltage and a signal related to the adjusted reference voltage. The on-time control circuit is configured to generate an on-time control signal according to the comparison signal. The driving circuit is configured to generate a driving control signal according to the on-time control signal.
H02M 7/217 - Conversion of AC power input into DC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
35.
Flexible printed circuit board with embedded optical waveguide structure
A flexible printed circuit board with embedded optical waveguide structure, including a photoelectric transmission unit, wherein the photoelectric transmission unit includes a flexible insulation layer, a first optoelectronic unit and a second optoelectronic unit embedded in the photoelectric transmission unit, at least one redistribution layer having at least one conductive structure stacked with the flexible insulation layer and electrically connected with the first optoelectronic unit and second optoelectronic unit, an optical waveguide structure stacked with the flexible insulation layer, a first metal bump and a second metal bump adjacent to the optical waveguide structure and in optical alignment respectively with the first optoelectronic unit and the second optoelectronic unit to provide reflection planes for optical signal, wherein first metal bump and second metal bump are solid structures made of the same material as the one of redistribution layer.
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
An inductor assembly includes a first magnetic core, a second magnetic core, a winding and a bonding material layer. The second magnetic core includes a channel. The winding is disposed within the channel. The bonding material layer is disposed between the first magnetic core and the second magnetic core and includes a first bonding material and a second bonding material. A magnetic permeability of the first bonding material is greater than a magnetic permeability of the second bonding material. The first bonding material and the second bonding material are disposed on the second magnetic core. A surface of the first bonding material faced to the first magnetic core and a surface of the second bonding material faced to the first magnetic core are coplanar with each other.
A magnetic component is adapted to be used in a power inductor. The magnetic component includes a magnetic body containing amorphous magnetic powders and/or nano-crystalline magnetic powders and at least one silicon-free glass material distributed among the amorphous magnetic powders and/or nano-crystalline magnetic powders; a coil embedded in the magnetic body; and a pair of electrodes electrically connected to two terminals of the coil, respectively.
B22F 1/00 - Metallic powderTreatment of metallic powder, e.g. to facilitate working or to improve properties
B22F 1/052 - Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
H01F 27/32 - Insulating of coils, windings, or parts thereof
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
A wireless charging module includes a module case, a fan, a coil assembly and a circuit board. The module case defines a first cavity and a second cavity and has a first side and a second side opposite to the first side. The second side defines an air outlet. The fan is disposed at the first side of the module case and configured to form an airflow S. The coil assembly is disposed in the first cavity, so that a first air channel is formed for the airflow S to pass through a first surface of the coil assembly. The circuit board is disposed in the second cavity and configured to form a second air channel allowing the airflow S to pass through a first surface of the circuit board and a third air channel allowing the airflow S to pass through a second surface of the circuit board. The airflow S passes through the first air channel, the second air channel and the third air channel and flows out of the wireless charging module from the air outlet.
H02J 50/10 - Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
H02J 7/00 - Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
H02J 50/40 - Circuit arrangements or systems for wireless supply or distribution of electric power using two or more transmitting or receiving devices
H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
39.
On-time controller, power converter and switching operation method for the power converter
An on-time controller, for controlling a switching operation of a power converter includes an on-time controlling circuit, configured to control an on-time signal of a switch circuit of the power converter according to a reference voltage, wherein the reference voltage is varied according to an output voltage of an output terminal of the switch circuit; and a frequency adjusting circuit, coupled to the on-time controlling circuit, configured to sense the output voltage of the output terminal of the switch circuit, generate a load sensing current according to the output voltage, and provide the load sensing current to the on-time controlling circuit for compensating the reference voltage to adjust the on-time signal of the switch circuit and a switching frequency of the switch circuit.
A magnetic component includes a core, at least one spacer and at least two coils. The core includes an inner leg and at least two outer legs. The at least two coils and the at least one spacer are stacked with each other and directly sleeved on the inner leg. Each of the at least two coils is formed by winding a wire covered by at least three misaligned layers of insulating tape.
A magnetic component includes a core, a first winding, a second winding and at least one magnetic filler. The core includes an inner leg. The first winding is disposed in the core and wound around the inner leg. The second winding is disposed in the core and surrounds the first winding. At least one filling region and at least one non-filling region are formed between the first winding and the second winding. The at least one magnetic filler is filled in at least a part of the at least one filling region.
A coupled inductor including a first coil wound around a first pillar, a second coil wound around a second pillar, a gap magnetic body between the first coil and second coil and comprised of magnetic powders, a first magnetic body on the first coil opposite to the gap magnetic body, and a second magnetic body on the second coil opposite to the gap magnetic body, wherein the first magnetic body, first coil, gap magnetic body, second coil and second magnetic body are stacked sequentially in a first direction, and a ratio of a thickness of the gap magnetic body in the first direction to mean particle size D90 of the magnetic powders in gap magnetic body is between 2-30 or between 0-0.75.
A magnetic component includes a core, at least one coil, a first heat dissipating member and a second heat dissipating member. The core includes at least one outer leg and an inner leg. The at least one coil is wound around the inner leg. The first heat dissipating member is disposed on a first side and a top side of the core. The second heat dissipating member is disposed on a second side and the top side of the core. The first heat dissipating member and the second heat dissipating member have a first joint region, a second joint region and a third joint region on the top side. Projections of the first joint region and the second joint region do not overlap with the inner leg. A projection of at least one of the first heat dissipating member and the second heat dissipating member overlaps with the inner leg.
A magnetic component includes a core and at least one coil. The core includes at least one outer leg and an inner leg. The inner leg is separated from an upper inner surface of the core. The inner leg is at least partially divided into a plurality of separated portions along a length direction of the inner leg. The at least one coil is wound around the inner leg.
A method to form a plurality of inductors in a single process by placing multiple coils on a first magnetic sheet, and then stacking magnetic layers on the first magnetic sheet to encapsulate the coils so as to from a large magnetic body, and then cutting the large magnetic body into multiple inductors, wherein a terminal part of the coil disposed on the bottom surface of the magnetic body of the inductor is extended away from the axis of the coil and is entirely located at a same side of the axis of the coil.
H05K 1/18 - Printed circuits structurally associated with non-printed electric components
H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in subclass
46.
CONNECTING STRUCTURE AND SIGNAL TRANSMISSION SYSTEM
A connecting structure includes a flexible flat cable. The flexible flat cable includes a first end portion, a second end portion, a connecting portion, a first pad region, a second pad region and a slot. The connecting portion is connected between the first end portion and the second end portion. The first pad region is disposed on the first end portion. The second pad region is disposed on the second end portion. The slot is formed in the connecting portion. The slot is extended along a length direction of the flexible flat cable. The flexible flat cable is a laminated structure including at least one set of signal trace pattern and at least one shielding structure. The at least one shielding structure correspondingly surrounds the at least one set of signal trace pattern in the connecting portion.
H01R 13/6585 - Shielding material individually surrounding or interposed between mutually spaced contacts
H01R 12/77 - Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
H01R 12/79 - Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
An inductor is disclosed, the inductor comprising: a T-shaped magnetic core, being made of a material comprising an annealed soft magnetic metal material and having a base and a pillar integrally formed with the base, wherein μC×Hsat≥1800, where μC is a permeability of the T-shaped magnetic core, and Hsat (Oe) is a strength of the magnetic field at 80% of μC0, where μC0 is the permeability of the T-shaped magnetic core when the strength of the magnetic field is 0.
A solid-state battery includes a first electrode; a second electrode having a first side facing a first side of the first electrode and spaced from the first electrode; and a solid electrolyte at least partially disposed in a space between the first electrode and the second electrode for providing a path for metal ions associated with the first electrode and/or the second electrode to move through. The metal ions are kept differentially distributed along the path.
An electrode plate having active substance of electrochemical energy storage device is provided in the present invention, including a current collector and an electrode formed of active substance on the current collector, wherein the active substance includes first particles in form of spherical powder and second particles in form of monocrystalline structure, and an average particle size of the first particles is larger than or equal to three times of an average particle size of the second particles, and a volume ratio of the first particles in the active substance is greater than a volume ratio of the second particles in the active substance, and a breakage rate of said electrode formed by mixed first particles and second particles in rolling pressing process is smaller than or equal to 40%.
H01M 4/525 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of nickel, cobalt or iron of mixed oxides or hydroxides containing iron, cobalt or nickel for inserting or intercalating light metals, e.g. LiNiO2, LiCoO2 or LiCoOxFy
G01N 23/2251 - Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups , or by measuring secondary emission from the material using electron or ion microprobes using incident electron beams, e.g. scanning electron microscopy [SEM]
H01M 4/133 - Electrodes based on carbonaceous material, e.g. graphite-intercalation compounds or CFx
H01M 4/62 - Selection of inactive substances as ingredients for active masses, e.g. binders, fillers
50.
Voltage convertor module including a lead-frame, a unitary bare die and a molding body
A voltage convertor module includes a lead-frame, a unitary bare die and a molding body. The lead-frame can have a plurality of electrodes including an input voltage electrode, an output voltage electrode, a ground electrode and a controlling electrode. The unitary bare die is disposed only on the lead-frame, where a plurality of pads of the unitary bare die are electrically connected to the electrodes of the lead-frame correspondingly. The unitary bare die includes the plurality of pads, a buck controller block, a first switching unit block, a second switching unit block, a feedback unit block and a plurality of routing structures.
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
H02M 3/00 - Conversion of DC power input into DC power output
51.
ELECTRONIC COMPONENT WITH HIGH COPLANARITY AND METHOD OF MANUFACTURING THE SAME
An electronic component with high coplanarity, including a body with a functional circuit and a mounting plane, a first electrode with a first area deposited on the mounting plane, and a second electrode with a second area deposited on the mounting plane, wherein the first area is larger than the second area, and the first electrode and the second electrode includes a conductive layer and at least one first plating layer over the conductive layer, and a thickness of the conductive layer of the first electrode is smaller than a thickness of the conductive layer of the second electrode, and a thickness of the first plating layer of the first electrode is larger than a thickness of the first plating layer of the second electrode.
A magnetic component includes a core, a winding, a lead frame and a conductive material. The winding is disposed in the core. A winding end of the winding extends to an outer periphery of the core. The lead frame is disposed on the outer periphery of the core. At least one hole is formed on the lead frame and corresponds to the winding end. The conductive material is disposed in the at least one hole. The conductive material is in contact with the winding end.
An electronic module, comprising: a first electronic device, a first circuit board disposed over the first top surface, and a second circuit board disposed under the bottom surface of the body of the first electronic device, wherein a plurality of conductors are disposed over a first lateral surface for electrically connecting the first circuit board and the second circuit board, wherein a plurality of electrodes of the electronic module are disposed on a bottom surface of the second circuit board.
A magnetic component includes a core, at least one coil and a thermal conductive filler. The core includes an inner leg, at least two outer legs and at least one non-bonding region. The at least one coil is wound around the inner leg or the at least two outer legs. The thermal conductive filler covers a part of the core. At least one part of the at least one non-bonding region is not covered by the thermal conductive filler.
A method to form an inductor, the method comprising: forming a metal structure by removing unwanted portions of the metal plate to form a first electrode, a second electrode, and a bare conductor wire between the first electrode and the second electrode, wherein a first thickness of the first electrode is greater than a thickness of the bare conductor wire, and a second thickness of the second electrode is greater than said thickness of the bare conductor wire; and forming a magnetic body to encapsulate the bare conductor wire, and a least one portion of the first electrode and a least one portion of the second electrode.
H01F 41/00 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
H05K 1/18 - Printed circuits structurally associated with non-printed electric components
56.
Current sensing module, vehicle system and method of performing current sensing and failure diagnosis
A current sensing module includes a shunt resistor for receiving and sensing a current, a digital sensing circuit, and an analog sensing circuit. The shunt resistor includes a connecting part, a first resistive part and a second resistive part coupled in series to the first resistive part via the connecting part. The digital sensing circuit is coupled to the first resistive part for measuring a first analog voltage of the first resistive part when the current flows through the first resistive part, and providing a first digital measuring value associated with the first analog voltage. The analog sensing circuit is coupled to the second resistive part for measuring a second analog voltage of the second resistive part when the current flows through the second resistive part, and providing a second analog measuring value associated with the second analog voltage.
G01R 19/00 - Arrangements for measuring currents or voltages or for indicating presence or sign thereof
G01R 1/20 - Modifications of basic electric elements for use in electric measuring instrumentsStructural combinations of such elements with such instruments
A coil structure comprises a coil and a conductive terminal part, wherein the coil is formed by a conductive wire comprising a metal wire and at least one insulating layer encapsulating the metal wire, wherein a first terminal part of the metal wire is exposed from the at least one insulating layer, wherein a first portion of the conductive terminal part encapsulates the first terminal part of the metal wire and a second portion of the conductive terminal part extends from said first portion as an electrode for electrically connecting to an external circuit.
B23P 19/00 - Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformationTools or devices therefor so far as not provided for in other classes
H01F 5/04 - Arrangements of electric connections to coils, e.g. leads
H01F 27/06 - Mounting, supporting, or suspending transformers, reactors, or choke coils
H01F 41/063 - Winding flat conductive wires or sheets with insulation
H01F 41/076 - Forming taps or terminals while winding, e.g. by wrapping or soldering the wire onto pins, or by directly forming terminals from the wire
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H05K 1/18 - Printed circuits structurally associated with non-printed electric components
A magnetic device having a first coil and a second coil, wherein the first coil is wound in a first direction when viewed from the first terminal part of the first coil, and the second coil is wound in a second direction when viewed from the third terminal part of the second coil, wherein the first direction and the second direction are opposite to each other for canceling magnetic fluxes generated by the first coil and the second coil.
H01F 1/14 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
F21V 8/00 - Use of light guides, e.g. fibre optic devices, in lighting devices or systems
H01F 1/16 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of sheets
A light guide assembly, comprising: a substrate and a light guide disposed on the substrate, wherein the top surface of the body comprises a first protrusion having a first slanting surface and a second slanting surface opposite to the first slanting surface for reflecting lights entering into the body, wherein a first outer surface of the body extends from a first lateral surface to the first slanting surface, wherein a highest point of the first slanting surface is located between the first lateral surface and a second lateral surface opposite to the first lateral surface, and a highest point of the second slanting surface is located between the first lateral surface and a lowest point of the second slanting surface.
A method of fabricating a magnetic component structure with thermal conductive filler, including steps of providing a mold with a coil mounted therein, potting the mold with a thermal conductive material to form a thermal conductive filler encapsulating at least a portion of said coil, releasing the thermal conductive filler and the coil from the mold, and combining the thermal conductive filler with magnetic cores to form a magnetic component structure.
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
H01F 1/147 - Alloys characterised by their composition
H01F 1/34 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
H01F 27/32 - Insulating of coils, windings, or parts thereof
61.
Structure of resistor device and system for measuring resistance of same
A resistor structure includes a resistor body; and a first electrode structure disposed at and being in electric contact with a first end of the resistor body, and a second electrode structure disposed at and being in electric contact with a second end opposite to the first end of the resistor body. Each of the first electrode structure and the second electrode structure has at least one conductive protrusion. The at least one conductive protrusion of the first electrode structure and the at least one conductive protrusion of the second electrode structure both serve as voltage-sensing terminals for electric connection to an external voltage measurement device, or both serve as current-sensing terminals for electric connection to a current measurement device.
H01C 1/148 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals embracing or surrounding the resistive element
G01R 1/20 - Modifications of basic electric elements for use in electric measuring instrumentsStructural combinations of such elements with such instruments
G01R 19/00 - Arrangements for measuring currents or voltages or for indicating presence or sign thereof
A lithium-ion coin battery having a winding core as an anode lead and a cathode lead is provided in the present invention, including a winding core having a first electrode section, a second electrode section and an insulating section isolating the first electrode section and the second electrode section, an electrode winding having a first electrode sheet, a second electrode sheet and a separator isolating between the first electrode sheet and the second electrode sheet, wherein the electrode winding winds on the winding core, and the first electrode sheet is electrically coupled with the first electrode section of the winding core, the second electrode sheet is electrically coupled with the second electrode section of the winding core, and the separator is coupled with the insulating section of the winding core.
H01M 10/0587 - Construction or manufacture of accumulators having only wound construction elements, i.e. wound positive electrodes, wound negative electrodes and wound separators
H01M 10/0525 - Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodesLithium-ion batteries
H01M 50/109 - Primary casingsJackets or wrappings characterised by their shape or physical structure of button or coin shape
H01M 50/153 - Lids or covers characterised by their shape for button or coin cells
H01M 10/0585 - Construction or manufacture of accumulators having only flat construction elements, i.e. flat positive electrodes, flat negative electrodes and flat separators
A stacked electronic structure, including a substrate, wherein electronic devices are disposed on the substrate, and a molding body encapsulates the electronic devices, wherein a first thermal conductive layer is disposed on a first electronic device, and a second thermal conductive layer is disposed on a second electronic device, wherein a magnetic device comprising a magnetic body is disposed over a top surface of the molding body, wherein at least one third thermal conductive layer is disposed on the magnetic body, and the first thermal conductive layer and the second thermal conductive layer are respectively connected with the at least one third thermal conductive layer for dissipating heat.
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
H05K 1/18 - Printed circuits structurally associated with non-printed electric components
H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in subclass
An electronic structure comprising: a circuit board, wherein electronic devices and a transformer are disposed on the circuit board, wherein the transformer comprises a first coil, a second coil, and a magnetic body comprising a pillar with at least one portion of the pillar being disposed in a through-opening of the circuit board, wherein the first coil is wound around an upper portion of the pillar and the second coil is wound around a lower portion of the pillar for forming the transformer.
A magnetic device, a body; and an insulated conductive wire which comprises a metal wire and an insulating layer encapsulating the metal wire, wherein the insulated conductive wire comprises a coil and a first terminal part, wherein an outer surface of the internal metal part of a first portion of the first terminal part is exposed from the insulating layer for forming an electrode, wherein a second portion of the first terminal part is disposed in the body, and an outer surface of the internal metal part of the second portion of the terminal part is exposed from the insulating layer.
A magnetic component includes a first core, a second core, an outer bobbin, a first winding, an inner bobbin and a second winding. The outer bobbin is disposed between the first core and the second core. The outer bobbin has a hollow tube portion, a first bottom portion and a first top portion. The first winding is wound around outer side of the hollow tube portion. The inner bobbin is disposed in the hollow tube portion. The inner bobbin has a second bottom portion and a second top portion. The second winding is wound around the inner bobbin. The second bottom portion is exposed to bottom side of the first bottom portion, such that the first bottom portion overlaps the second bottom portion in a height direction of the magnetic component. The second top portion and the second bottom portion abut against inner side of the hollow tube portion.
H01F 27/34 - Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
H01F 27/32 - Insulating of coils, windings, or parts thereof
A magnetic component includes a magnetic body and a coil. The magnetic body includes an inner leg, at least one outer leg, a first bottom portion and a second bottom portion. The inner leg and the at least one outer leg protrude from the first bottom portion and the second bottom portion. A cross-sectional area of the inner leg is larger than a total cross-sectional area of the at least one outer leg. The coil is wound around the inner leg.
A chip resistor structure includes a substrate; a pair of first electrodes disposed opposite to each other on a first surface of the substrate at a first interval; a resistance layer disposed between the pair of first electrodes on the first surface; a spacer layer made of a material having a composition different from that of the resistance layer, disposed over the pair of first electrodes; a protective layer overlying the resistance layer; and a plating layer electroplated onto the pair of first electrodes and the spacer layer, and having ends extending beyond the pair of first electrodes terminate at least over the spacer layer. The plating layer may be joined with or spaced from or climb up to the protective layer on or above the spacer layer.
H01C 1/142 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals or tapping points being coated on the resistive element
H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
69.
Dual-polarized antenna and related antenna module and electronic device
An antenna includes a ground layer, two polarization signal feeding terminals disposed on the ground layer, two polarization structures, four coupling metals and four radiating metals. The first polarization structure includes a first extending portion electrically connected to the first polarization signal feeding terminal and extends from a first channel to a second channel in a first direction over the ground layer. The second polarization structure includes a second extending portion electrically connected to the second polarization signal feeding terminal and extends from a third channel to a fourth channel in second direction over the ground layer, wherein the first extending portion crosses the second extending portion in a non-contact manner to define four regions. The four coupling metals are disposed on the first through the fourth regions, respectively. The four radiating metals are disposed on the first through the fourth channels, respectively.
H01Q 21/26 - Turnstile or like antennas comprising arrangements of three or more elongated elements disposed radially and symmetrically in a horizontal plane about a common centre
H01Q 19/02 - Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic Details
70.
COMMON MODE FILTER FOR ENHANCING MODE CONVERSION IN BROADBAND COMMUNICATION
A common mode filter includes a magnetic core, a first wire wound around the magnetic core and comprising N turns, and a second wire wound around the magnetic core and comprising N turns, N being an integer exceeding 1. An (S+1)th turn of the first wire is stacked on an inner turn of the first wire and an inner turn of the second wire, S being a positive integer less than (N−1).
An electronic module, comprising an inductor, a first circuit board, and a second circuit board, wherein the first circuit board is disposed on a lateral surface of the body of the inductor with at least one electronic device being disposed on the first circuit board, wherein the second circuit board is disposed under the body of the inductor and electrically connected to the inductor.
A magnetic component structure with thermal conductive filler, including two magnetic cores combining together to form an inner accommodating space and at least one core opening, two plate portions connect each other through an inner leg structure and two outer leg structures, a bobbin sleeving on the inner leg structure, a coil winding on the bobbin, a bobbin housing surrounding the bobbin and the coil winding and form winding opening facing the at least one core opening, gaps are formed between the encasing structure constituted by the bobbin housing and the bobbin sleeving and the magnetic cores, a thermal conductive filler formed between the bobbin and the bobbin housing and encapsulating at least parts of the coil winding, and a cooling surface contacts the magnetic cores and the thermal conductive filler, the thermal conductive filler extends outwardly to contact the cooling surface through the opening and the winding opening.
A coupled inductor having a body, wherein a first electrode and a second electrode are connected to a first coil, and a third electrode and a fourth electrode are connected to a second coil, wherein a first horizontal line segment passing through the first electrode and the second electrode and a second horizontal line segment passing through the third electrode and the fourth electrode crosses each other at a location inside the periphery of a bottom surface of the body.
a wireless charger, comprising: a top cover for placing an electronic device thereon; at least one coil, disposed under the top cover; and a first magnet embedded inside the top cover for aligning with a second magnet of the electronic device for wireless charging the electronic device.
H02J 50/90 - Circuit arrangements or systems for wireless supply or distribution of electric power involving detection or optimisation of position, e.g. alignment
H02J 7/00 - Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
H02J 50/00 - Circuit arrangements or systems for wireless supply or distribution of electric power
H02J 50/40 - Circuit arrangements or systems for wireless supply or distribution of electric power using two or more transmitting or receiving devices
H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
H02J 50/10 - Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
A wireless charger having coils disposed in a recess of a metallic case of the wireless charger, wherein a heat-conducting material is disposed in the recess to encapsulate the coils with the first heat-conducting material being in contact with the coils, a sidewall, and a bottom surface of the recess.
H01M 10/46 - Accumulators structurally combined with charging apparatus
H02J 7/00 - Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
H02J 50/00 - Circuit arrangements or systems for wireless supply or distribution of electric power
H02J 50/10 - Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
H02J 50/40 - Circuit arrangements or systems for wireless supply or distribution of electric power using two or more transmitting or receiving devices
H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
H02J 50/90 - Circuit arrangements or systems for wireless supply or distribution of electric power involving detection or optimisation of position, e.g. alignment
A coupled inductor has two pillars that are aligned in a vertical direction, wherein a first coil and a second coil are respectively wound around one of the two pillars, respectively, wherein the bottom surface of winding turns of the first coil and the bottom surface of winding turns of the second coil are separated by a gap, wherein a magnetic material is disposed in the gap and a straight line that is enclosed by each of the first coil and the second coil passes through the two pillars.
An electrical component, comprising: a magnetic body and a coil disposed in the magnetic body, wherein the magnetic body comprises a first magnetic powder and a second magnetic powder, wherein the D50 of the first magnetic powder is greater than the D50 of the second magnetic powder, wherein the D90 of the first magnetic powder is not greater than 50 um, and the D90 of the second magnetic powder is not greater than 50 um.
H01F 27/30 - Fastening or clamping coils, windings, or parts thereof togetherFastening or mounting coils or windings on core, casing, or other support
H01F 27/32 - Insulating of coils, windings, or parts thereof
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
A coupled inductor has two coils made by film or a lithography processes, wherein a first coil is disposed on a top surface of a magnetic sheet and a second coil is disposed on the bottom surface of the magnetic sheet, for controlling the variations of the alignments of the two coils in a smaller range.
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
An electronic module comprising electrical components on a circuit board and a molding body disposed on the circuit board to encapsulate the electrical components, wherein a recess is formed in the molding body for exposing an electrode of the electronic module for connecting with an external component.
H01F 27/30 - Fastening or clamping coils, windings, or parts thereof togetherFastening or mounting coils or windings on core, casing, or other support
H01F 27/32 - Insulating of coils, windings, or parts thereof
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
A mixture for making a multilayer inductor, wherein the mixture comprises a first magnetic powder, a second magnetic powder, and a glass material, wherein each of the first magnetic powder and the second magnetic powder comprises an amorphous or nanocrystalline magnetic powder, wherein a softening point temperature of the glass material is in a range of 300°˜430° C.
B22F 1/00 - Metallic powderTreatment of metallic powder, e.g. to facilitate working or to improve properties
H01F 1/153 - Amorphous metallic alloys, e.g. glassy metals
B22F 1/16 - Metallic particles coated with a non-metal
B22F 1/052 - Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
A coupled inductor has two coils made by film processes, wherein a first coil is disposed on a top surface of a magnetic sheet and a second coil is disposed on a bottom surface of the magnetic sheet, for controlling the variations of the gap between the two coils in a smaller range.
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
A magnetic component includes a first core component, a second core component and at least one coil. The first core component includes a first molding bobbin covering a first part of a core set by an injection molding process. The second core component includes a second molding bobbin covering a second part of the core set by the injection molding process. The first core component is assembled with the second core component to form a first pillar and a second pillar. Each of the first pillar and the second pillar includes a plurality of cores stacked with each other in a direction toward an outside or inside of the magnetic component. The at least one coil is wound on at least one of the first pillar and the second pillar.
H01F 17/06 - Fixed inductances of the signal type with magnetic core with core substantially closed in itself, e.g. toroid
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
H01F 27/32 - Insulating of coils, windings, or parts thereof
A wireless charger, comprising: a thermal-conductive plastic cover; a first circuit board; and a metallic case, wherein the first circuit board are disposed in the metallic case, wherein a wind tunnel is formed between the thermal-conductive plastic cover and the circuit board for lowering the temperature of an electronic device that is wirelessly charged on the thermal-conductive plastic cover.
A magnetic device, comprising a body and a coil disposed in the body, wherein a terminal part of the conductive wire forming the coil comprises a first portion and a second portion, wherein the first portion is exposed from the body for forming an electrode, wherein the second portion of the terminal part is deformed for increasing the distance between the terminal part of the conductive wire and the coil for preventing a short circuit.
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
A structure for forming a 3D-coil transponder, wherein each group of leads is encapsulated by a separated insulating molding body and a magnetic body disposed over the plurality of separated groups of leads, wherein each said insulating molding body does not extend across two or more groups of leads.
H01Q 7/06 - Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
H01F 27/32 - Insulating of coils, windings, or parts thereof
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
H02J 7/00 - Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
H02J 50/10 - Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
H10N 10/00 - Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
86.
Wireless charger having thermoelectric cooler chips for dissipating heat
A wireless charger comprises atop cover; a metallic case; and a first thermoelectric cooler chip, disposed between a bottom surface of the top cover and a top surface of the metallic case to form a heat conductive path from the top cover to the metallic case via the first thermoelectric cooler chip for dissipating heat generated by an electronic device disposed on the top cover for wireless charging the electronic device.
H01F 27/32 - Insulating of coils, windings, or parts thereof
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
H01Q 7/06 - Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
H02J 7/00 - Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
H10N 10/00 - Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
A shielding layer that is made of conductive and magnetic material is used to encapsulate the bare metal wire of a coil of an inductor to shield the coil from the external magnetic field and make the resistance and the power loss of the inductor lower.
A stacked electronic module includes a magnetic device comprising a magnetic body with electrodes of the magnetic device being disposed on a top and bottom surface of the magnetic body, wherein a molding body encapsulates the magnetic body, wherein conductive layers are disposed on a top and bottom surface of the molding body for electrically connected to the electrodes of the magnetic device.
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
H01F 27/26 - Fastening parts of the core togetherFastening or mounting the core on casing or support
H01F 41/00 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
H01F 27/36 - Electric or magnetic shields or screens
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
At least one shielding layer made of conductive material is formed on a body of an inductor, wherein at least one portion of the top surface of the body is exposed from the shielding layer, so as to provide an exhaust channel for moisture inside the body to leak to the outside of the body, thereby preventing the residual moisture from deforming the inductor due to thermal expansion.
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
A recess is formed on a bottom surface of a body of an inductor, wherein an electrode for connecting to a ground is disposed in the recess, and an electrode connecting with a coil of the inductor is disposed on a protruding portion adjacent to the recess.
H01F 27/36 - Electric or magnetic shields or screens
H01F 41/00 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
The present invention discloses a dielectric filter with multilayer resonator, including a dielectric block, a plurality of multilayer resonator formed in the dielectric block, wherein each multilayer resonator is in a column shape extending in a first direction into the dielectric block and is formed of multiple metal layers paralleling and overlapping each other in a second direction, and vias extend in the second direction and connecting the metal layers in each multilayer resonator, and a ground electrode connected to the ground terminal of each multilayer resonator.
An electrode structure on a circuit board, the electrode structure comprising a metal structure disposed on and electrically connected to the circuit board, wherein the metal structure and a surface of the circuit board forms a space therebetween, wherein at least one first electrical component is disposed in the space and an outer surface of the metal structure forms an electrode for electrically connecting with an external component.
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H05K 1/18 - Printed circuits structurally associated with non-printed electric components
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
H01F 1/22 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
93.
Method to form multiple electrical components and a single electrical component made by the method
A method to form a plurality of inductors in a single process by stacking multiple magnetic sheets, wherein each sheet is made to form a particular part in quantities, which can be a base part, a pillar part, a hollow part, or a cover part, for forming a magnetic body of an inductor.
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
H05K 1/09 - Use of materials for the metallic pattern
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H05K 1/18 - Printed circuits structurally associated with non-printed electric components
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
H01F 1/22 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
An electronic module, such as a VRM, has a power inductor and power wave pins disposed on a bottom surface of a circuit board so as to reduce the size and increase the heat dissipation capability of the VRM.
An electronic structure comprises: a circuit board, wherein a plurality of electronic devices and a transformer are disposed on the circuit board, the transformer comprises a first coil, a second coil, and a magnetic body, wherein a molding body encapsulates at least one portion of the outer surface of the first coil, at least one portion of the outer surface of the second coil, and the plurality of electronic devices for electrically isolating the plurality of electronic devices from the transformer.
A structure of coils for a wireless charger comprises a plurality of coils, wherein the plurality of coils are stacked into a plurality of layers of coils with each layer comprising at least two coils, wherein at least two electronic devices are capable of being placed over the plurality of coils for charging the at least two electronic devices.
H02J 7/02 - Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries for charging batteries from AC mains by converters
H02J 50/10 - Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
H02J 50/40 - Circuit arrangements or systems for wireless supply or distribution of electric power using two or more transmitting or receiving devices
H01F 27/32 - Insulating of coils, windings, or parts thereof
H02J 7/00 - Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
H01F 27/34 - Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
H04M 1/02 - Constructional features of telephone sets
A solid-state battery includes a first electrode; a second electrode having a first side facing a first side of the first electrode and spaced from the first electrode; and a solid electrolyte at least partially disposed in a space between the first electrode and the second electrode for providing a path for metal ions associated with the first electrode and/or the second electrode to move through. The metal ions are kept differentially distributed along the path.
A current detection device including two conductors, a resistor and two detection portions is provided. The resistor is disposed between the two conductors. At least one of the detection portions is a detection terminal including a first terminal portion and a second terminal portion. The first terminal portion includes a first flange and a second flange, the second flange is connected to the second terminal portion, and at least one portion of the second flange is buried into at least one conductor. The first flange is buried into the at least one conductor, a distal end of the first flange does not protrude beyond the second surface, a distance is kept between the distal end of the first flange and the second surface, a gap is defined between the first flange and the second flange, and at least one portion of the gap is filled with a material of the at least one conductor.
G01R 19/00 - Arrangements for measuring currents or voltages or for indicating presence or sign thereof
G01R 1/20 - Modifications of basic electric elements for use in electric measuring instrumentsStructural combinations of such elements with such instruments
G01R 15/14 - Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
An inductor is disclosed, the inductor comprising: a T-shaped magnetic core, being made of a material comprising an annealed soft magnetic metal material and having a base and a pillar integrally formed with the base, wherein μC×Hsat≥1800, where μC is a permeability of the T-shaped magnetic core, and Hsat (Oe) is a strength of the magnetic field at 80% of μC0, where μC0 is the permeability of the T-shaped magnetic core when the strength of the magnetic field is 0.
An electronic module, such as a VRM, has a power inductor and power wave pins disposed on a bottom surface of a circuit board so as to reduce the size and increase the heat dissipation capability of the VRM.
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
H02M 3/156 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
