Abstract

A highly heat-dissipating flexible printed circuit board (GFPCB) efficiently emits heat transferred from a heat source such as an LED to the flexible printed circuit board. The highly heat-dissipating flexible printed circuit board comprises: a flexible board layer which is formed in a flexibly bendable thin-film form by bonding a polyimide (PI) film to the lower side of a copper (Cu) film using an adhesive and has a heat element installed on the upper side thereof; and a heat dissipation layer which is formed in a thin-film form by coating any one of graphitic carbon and a graphite powder binder on the upper side of an aluminum (Al) film and is bonded to the lower side of the flexible board layer using a pressure sensitive adhesive (PSA) to receive heat generated and transferred from the heat element and emit the heat to the outside.

IPC Classes  ?

• B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
• B32B 9/00 - Layered products essentially comprising a particular substance not covered by groups
• F21S 41/32 - Optical layout thereof
• H05K 1/02 - Printed circuits Details

Abstract

Provided is a high-dielectric film. The high-dielectric film may comprise: a dielectric film containing a polymer; a first foil structure, which is disposed on the top surface of the dielectric film and in which a first resin layer containing first metal compound particles and second metal compound particles is coated on a first metal foil; and a second foil structure, which is disposed on the bottom surface of the dielectric film and in which a second resin layer containing the first metal compound particles and the second metal compound particles is coated on a second metal foil.

IPC Classes  ?

• H01G 4/20 - Dielectrics using combinations of dielectrics from more than one of groups
• H01G 4/10 - Metal-oxide dielectrics

Abstract

Provided is a high heat radiation thin film. The high heat radiation thin film may comprise a metal substrate, and a carbon layer which is disposed on the metal substrate and is thicker than 2.5 nm and thinner than 10 nm.

IPC Classes  ?

• B32B 9/00 - Layered products essentially comprising a particular substance not covered by groups
• B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
• B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
• B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
• C23C 14/06 - Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
• C23C 14/48 - Ion implantation
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• B82Y 30/00 - Nanotechnology for materials or surface science, e.g. nanocomposites

Abstract

A high thermal radiation thin film including a carbon material is provided. The high thermal radiation thin film including a carbon material comprises a first metal film and a first carbon layer coming in direct contact with a first surface of the first metal film, wherein the first carbon layer includes a graphite powder and a binder, or is a graphitic carbon layer.

IPC Classes  ?

• B32B 9/04 - Layered products essentially comprising a particular substance not covered by groups comprising such substance as the main or only constituent of a layer, next to another layer of a specific substance
• B32B 9/00 - Layered products essentially comprising a particular substance not covered by groups
• B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
• B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

Provided is a high heat dissipating thin film. The high heat dissipating thin film may comprise: a metal substrate; and a carbon layer disposed on the metal substrate, wherein the carbon layer is thicker than 2.5 nm and thinner than 10 nm.

IPC Classes  ?

• B32B 9/04 - Layered products essentially comprising a particular substance not covered by groups comprising such substance as the main or only constituent of a layer, next to another layer of a specific substance
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• B32B 9/00 - Layered products essentially comprising a particular substance not covered by groups
• B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
• B32B 15/18 - Layered products essentially comprising metal comprising iron or steel
• B32B 37/06 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method

Abstract

The present invention relates to a heat-radiating graphene sheet and a manufacturing method therefor, and more specifically, to a heat-radiating graphene sheet which is thin, has excellent durability, notably enhanced thermal conductivity, and at the same time, excellent heat-radiation properties, and a manufacturing method therefor. Accordingly, the present invention may be widely applied in all industries requiring heat-radiation properties.

IPC Classes  ?

• C04B 35/52 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxides based on carbon, e.g. graphite
• C04B 35/64 - Burning or sintering processes
• C04B 35/622 - Forming processesProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products
• C04B 35/626 - Preparing or treating the powders individually or as batches
• C04B 35/634 - Polymers
• C01B 32/182 - Graphene
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

The present invention relates to an insulative substrate-less heat-radiation tape and a manufacturing method therefor, and more specifically, to an insulative substrate-less heat-radiation tape exhibiting excellent insulation and adhesive force, notably enhanced thermal conductivity, and at the same time, excellent heat-radiation properties, and a manufacturing method therefor. Accordingly, the present invention may be widely applied in all industries requiring insulation and heat-radiation properties.

IPC Classes  ?

• C09J 7/00 - Adhesives in the form of films or foils
• C09J 11/04 - Non-macromolecular additives inorganic
• C09J 201/00 - Adhesives based on unspecified macromolecular compounds

Abstract

The present invention has been made to solve the problem described above. The purpose of the present invention is to provide a heat dissipation sheet, which has an excellent heat dissipation characteristic, has a specific porosity, and exhibits both excellent horizontal thermal conductivity and excellent peeling strength, and a manufacturing method therefor.

IPC Classes  ?

• B32B 7/02 - Physical, chemical or physicochemical properties
• B32B 9/00 - Layered products essentially comprising a particular substance not covered by groups
• B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
• B32B 15/095 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising polyurethanes
• B32B 27/18 - Layered products essentially comprising synthetic resin characterised by the use of special additives
• B32B 27/40 - Layered products essentially comprising synthetic resin comprising polyurethanes

Abstract

The present invention relates to a heat dissipating tape using a conductive fiber and a method for manufacturing same. More particularly, the present invention provides a heat dissipating tape, comprising: a conductive substrate which is made of conductive fiber coated with a conductive material; and an heat dissipating adhesion layer which is formed on at least one side of the conductive substrate and is coated with a heat dissipating adhesive including a graphite-containing acrylic adhesive or silicon adhesive. The heat dissipating tape has excellent resistance to external forces on the product, has an excellent outer appearance due to its smooth surface, is less likely to get damaged, and the heat dissipating adhesion layer is not easily separated from the conductive substrate.

IPC Classes  ?

• G11B 5/708 - Record carriers characterised by the selection of the material comprising one or more layers of magnetisable particles homogeneously mixed with a bonding agent on a base layer characterised by the addition of non-magnetic particles to the magnetic layer
• G11B 5/735 - Base layers characterised by the back layer
• G11B 5/738 - Base layers characterised by the intermediate layer
• B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
• B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
• C09J 7/02 - on carriers
• C09J 7/04 - on paper or textile fabric (adhesive bandages, dressings or absorbent pads A61L 15/16)
• C08K 3/04 - Carbon

Abstract

The present invention relates to a horizontal thermoelectric tape and a method for manufacturing same, and more particularly, to a horizontal thermoelectric tape for an effective blocking of an electromagnetic wave and an excellent heat dissipation effect. The horizontal thermoelectric tape of the present invention unifies the double layer structure of an adhesion layer and a heat dissipation layer, more effectively achieving the heat dissipation effect, and simplifying the manufacturing process thereof, and by using a non-evaporated metal foil as a conductive base material, enables a horizontal thermoelectric tape having an excellent heat conductivity, and using a conductive base material not containing impurities.

IPC Classes  ?

• B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
• B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
• G11B 5/708 - Record carriers characterised by the selection of the material comprising one or more layers of magnetisable particles homogeneously mixed with a bonding agent on a base layer characterised by the addition of non-magnetic particles to the magnetic layer
• G11B 5/735 - Base layers characterised by the back layer
• G11B 5/738 - Base layers characterised by the intermediate layer
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
• C08K 3/32 - Phosphorus-containing compounds
• C08K 3/00 - Use of inorganic substances as compounding ingredients
• C08K 3/04 - Carbon
• C09J 7/02 - on carriers
• C08K 3/22 - OxidesHydroxides of metals

Abstract

The present invention relates to a heat dissipating tape using a conductive fiber and a method for manufacturing same. More particularly, the present invention relates to a heat dissipating tape comprising a heat dissipating adhesion portion having as a conductive base material portion, a conductive fiber coated with a conductive substance, and having a heat dissipating adhesive coated on the conductive base material portion, the heat dissipating adhesive being an acryl adhesive or a silicone adhesive containing graphite. The heat dissipating tape of the present invention has an excellent resistance to external forces on the product, has an excellent outer appearance due to the smooth surface, is less likely to get damaged, and enables the delamination of the conductive base material portion and the heat dissipating adhesion portion to not occur as easily.

IPC Classes  ?

• H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• C09J 7/02 - on carriers

Abstract

The present invention relates to a horizontal thermoelectric tape and a method for manufacturing same, and more particularly, to a horizontal thermoelectric tape for an effective blocking of an electromagnetic wave and an excellent heat dissipation effect. The horizontal thermoelectric tape of the present invention unifies the double layer structure of an adhesion layer and a heat dissipation layer, more effectively achieving the heat dissipation effect, and simplifying the manufacturing process thereof, and by using a non-evaporated metal foil as a conductive base material, enables a horizontal thermoelectric tape having an excellent heat conductivity, and using a conductive base material not containing impurities.

IPC Classes  ?

• H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• C09J 7/02 - on carriers