The present disclosure is directed to a package that includes a transparent layer that is on and covers a sensor of a die as well as a plurality of electrical connections that extend from a first surface of the package to the second surface of the package opposite to the first surface. In at least one embodiment of a package, the electrical connections each include a conductive structure that extends through the transparent layer to a first side of a corresponding contact pad of the die, and at least one electrical that extends into the second surface of the die to a second side of the corresponding contact pad that is opposite to the first side. In at least another embodiment of a package, the electrical connections include a conductive structure that extends through a molding compound to a first side of a corresponding contact pad of the die, and at least one electrical via that extends into the second surface of the die to a second side of the corresponding contact pad opposite to the first side.
H10F 39/00 - Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group , e.g. radiation detectors comprising photodiode arrays
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
A method of operating a display includes performing a non-synchronized touch scan pattern on a display with a controller coupled to the display. The non-synchronized touch scan pattern schedules touch scans independent of a refresh rate of the display. Upon the controller detecting a first synchronization pulse from a display controller coupled to the controller and the display, a first pulse-checking timer is started. Upon detecting a second synchronization pulse from the display controller and before the first pulse-checking timer expires, a first display refresh rate for the display is obtained from an interval between the first synchronization pulse and the second synchronization pulse. A synchronized touch scan pattern is performed with the controller, and is scheduled to avoid touch scans coinciding with refreshes of the display performed at the first display refresh rate.
G06F 3/041 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
G06F 3/044 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
G09G 3/3233 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix with pixel circuitry controlling the current through the light-emitting element
The present description concerns a converter comprising an AC-DC conversion stage comprising a first thyristor, a first power supply circuit delivering a first reference voltage between a first node and a second node, and a second power supply circuit delivering a second reference voltage between third and fourth nodes, the cathode of the first thyristor being coupled to the first node of the first power supply circuit by a first switch and being connected to the fourth node, the second power supply circuit comprising a first rectifying element coupled to the second node of the first power supply circuit and coupled to the third node.
H02M 7/155 - Conversion of AC power input into DC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a thyratron or thyristor type requiring extinguishing means using semiconductor devices only
H02M 1/42 - Circuits or arrangements for compensating for or adjusting power factor in converters or inverters
4.
MICRO LENS ARRAYS AND METHODS OF FORMATION THEREOF
A method of forming a device, the method including depositing a first photoresist layer over a substrate, forming an array of seed lenses by patterning and reflowing the first photoresist layer, a dimension of the array of seed lenses varying across the substrate, forming a second photoresist layer over the array of seed lenses, and forming a microlens array by patterning and reflowing the second photoresist layer.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
A method of operating a display includes performing a non-synchronized touch scan pattern on a display with a controller coupled to the display. The non-synchronized touch scan pattern schedules touch scans independent of a refresh rate of the display. Upon the controller detecting a first synchronization pulse from a display controller coupled to the controller and the display, a first pulse-checking timer is started. Upon detecting a second synchronization pulse from the display controller and before the first pulse-checking timer expires, a first display refresh rate for the display is obtained from an interval between the first synchronization pulse and the second synchronization pulse. A synchronized touch scan pattern is performed with the controller, and is scheduled to avoid touch scans coinciding with refreshes of the display performed at the first display refresh rate.
G06F 3/041 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
G06F 3/044 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
G09G 3/3233 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix with pixel circuitry controlling the current through the light-emitting element
The present description concerns a circuit for converting from a first alternating voltage to a second voltage. The circuit includes: a first thyristor; a first control circuit of the first thyristor; a power factor correction circuit comprising a coil; and a first circuit configured to convert a third voltage into a fourth DC voltage. The third voltage corresponds to a difference between a potential at a first node connected to an output node of the coil and a reference potential. The fourth DC voltage is configured to supply the first control circuit of the first thyristor, and is referenced with respect to the same reference potential as the third voltage.
H02M 7/145 - Conversion of AC power input into DC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a thyratron or thyristor type requiring extinguishing means
H02M 7/155 - Conversion of AC power input into DC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a thyratron or thyristor type requiring extinguishing means using semiconductor devices only
H02M 7/162 - Conversion of AC power input into DC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a thyratron or thyristor type requiring extinguishing means using semiconductor devices only in a bridge configuration
H02M 3/335 - Conversion of DC power input into DC power output with intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate AC using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only
Cliff Detection in Robotic Devices A method of operating a robotic device includes: moving the robotic device towards an edge of a cliff while a ToF sensor senses reflected signals having been transmitted by the ToF sensor, the reflected signals being generated by the signals transmitted by the ToF sensor being reflected off a target object back to the ToF sensor, the ToF sensor being attached to a front of the robotic device and including an array of single-photon avalanche diode (SPAD) sensors; comparing a statistical distribution of the reflected signals received at a plurality of different rows of zones configured by the array of SPADs in a region of interest (ROI) of the ToF sensor and based on the comparing detecting an approaching of the edge of the cliff; and in response to detecting the approaching of the edge, changing a propulsion of the robotic device before reaching the edge.
A method of operating a display includes performing a non-synchronized touch scan pattern on a display with a controller coupled to the display. The non-synchronized touch scan pattern schedules touch scans independent of a refresh rate of the display. Upon the controller detecting a first synchronization pulse from a display controller coupled to the controller and the display, a first pulse-checking timer is started. Upon detecting a second synchronization pulse from the display controller and before the first pulse-checking timer expires, a first display refresh rate for the display is obtained from an interval between the first synchronization pulse and the second synchronization pulse. A synchronized touch scan pattern is performed with the controller, and is scheduled to avoid touch scans coinciding with refreshes of the display performed at the first display refresh rate.
G06F 3/041 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
G09G 3/3233 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix with pixel circuitry controlling the current through the light-emitting element
G06F 3/044 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
A semiconductor package includes a silicon substrate with an active surface and an inactive surface. A semiconductor device, such as an image, light, or optical sensor, is formed in the active surface and disposed on the substrate. A glass plate is coupled to the substrate with adhesive. The glass plate includes a sensor area that corresponds to the area of the semiconductor device and holes through the glass plate that are generally positioned around the sensor area of the glass plate. During formation of the package, the holes through the glass plate allow gas released by the adhesive to escape the package and prevent formation of a gas bubble.
H01L 23/04 - ContainersSeals characterised by the shape
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 23/00 - Details of semiconductor or other solid state devices
A method for reporting touch on a touchscreen includes detecting first touch data from the touchscreen corresponding to a first touch on the touchscreen; determining coordinates of the first touch from the first touch data; reporting the coordinates of the first touch at a first time; determining predicted coordinates of a second touch based on a linear regression of historical touch data; and reporting the predicted coordinates of the second touch at a second time, where the second time occurs after the first time.
The present disclosure relates to a method for aligning a smartphone providing NFC wireless power for charging a battery of a device, the method comprising: emitting, with a first NFC antenna of the smartphone, an NFC field for wirelessly charging the battery of the device comprising a second NFC antenna; obtaining, with the smartphone, a measured value of a signal representative of the NFC field strength between the smartphone and the device; determining, by the smartphone, a range of values of a plurality of ranges of values the measured value belongs; and emitting, by the smartphone, at least one notification signal to a user with a frequency determined by the determined range of values.
H04B 5/00 - Near-field transmission systems, e.g. inductive or capacitive transmission systems
H02J 50/10 - Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
H02J 50/80 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the exchange of data, concerning supply or distribution of electric power, between transmitting devices and receiving devices
H02J 50/90 - Circuit arrangements or systems for wireless supply or distribution of electric power involving detection or optimisation of position, e.g. alignment
12.
RADIO FREQUENCY IDENTIFICATION AND QI WIRELESS POWER DEVICE
STMicroelectronics Razvoj Polprevodnikov D.O.O. (Slovenia)
Inventor
Cordier, Nicolas
Chen, Chia Hao
Blaha, Karel
Abstract
Provided is a device comprising a frequency demodulator and an amplitude demodulator. The device is configured to use, in a first mode, both the frequency demodulator and the amplitude demodulator in parallel and to activate a radio frequency identification (RFID) card mode or a Qi charger mode based on results provided by said demodulators.
The present description concerns a converter comprising an AC-DC conversion stage comprising a first thyristor, a first power supply circuit delivering a first reference voltage between a first node and a second node, and a second power supply circuit delivering a second reference voltage between third and fourth nodes, the cathode of the first thyristor being coupled to the first node of the first power supply circuit by a first switch and being connected to the fourth node, the second power supply circuit comprising a first rectifying element coupled to the second node of the first power supply circuit and coupled to the third node.
H02M 7/155 - Conversion of AC power input into DC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a thyratron or thyristor type requiring extinguishing means using semiconductor devices only
H02M 1/42 - Circuits or arrangements for compensating for or adjusting power factor in converters or inverters
14.
Micro lens arrays and methods of formation thereof
A method of forming a device, the method including: depositing a first photoresist layer over a substrate, forming an array of seed lenses by patterning and reflowing the first photoresist layer, a dimension of the array of seed lenses varying across the substrate, forming a second photoresist layer over the array of seed lenses, and forming a microlens array by patterning and reflowing the second photoresist layer.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
15.
METHOD AND DEVICE OF DISTANCE MEASUREMENT BY TIME-OF-FLIGHT CALCULATION WITH WRAPAROUND
The present disclosure concerns a method of measuring the distance between a device and an object comprising the steps of determination of a first estimated distance based on the time of flight of first light pulses having a first period; determination of a second estimated distance based on the time of flight of second light pulses having a second period different from the first period; determination based on the interval between the first and second estimated distances of whether the device is in a wraparound area among wraparound areas; and if the device is in a wraparound area among wraparound areas, adding to the first estimated distance a compensation having its value depending on the wraparound area.
G01S 17/894 - 3D imaging with simultaneous measurement of time-of-flight at a 2D array of receiver pixels, e.g. time-of-flight cameras or flash lidar
G01S 17/10 - Systems determining position data of a target for measuring distance only using transmission of interrupted, pulse-modulated waves
G01S 7/4863 - Detector arrays, e.g. charge-transfer gates
G01S 7/48 - Details of systems according to groups , , of systems according to group
H01L 31/107 - Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier or surface barrier the potential barrier working in avalanche mode, e.g. avalanche photodiode
A method is provided that is implemented by a first NFC device configured in reader mode. The method includes evaluating an information about the coupling between the first NFC device and a second NFC device configured in card mode, as a function of the position of an antenna of the first NFC device with respect to an antenna of the second NFC device. The method further includes indicating the information by a user interface of the first device.
The present disclosure is directed to a package that includes a transparent layer that is on and covers a sensor of a die as well as a plurality of electrical connections that extend from a first surface of the package to the second surface of the package opposite to the first surface. In at least one embodiment of a package, the electrical connections each include a conductive structure that extends through the transparent layer to a first side of a corresponding contact pad of the die, and at least one electrical that extends into the second surface of the die to a second side of the corresponding contact pad that is opposite to the first side. In at least another embodiment of a package, the electrical connections include a conductive structure that extends through a molding compound to a first side of a corresponding contact pad of the die, and at least one electrical via that extends into the second surface of the die to a second side of the corresponding contact pad opposite to the first side.
H10F 39/00 - Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group , e.g. radiation detectors comprising photodiode arrays
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
A circuit includes two thyristors coupled in anti-series. An AC capacitor has first and second electrodes respectively coupled to two different electrodes of the two thyristors. The first and second electrodes are coupled to receive an AC voltage. A control circuit detects discontinuance of application of the AC voltage to the AC capacitor and in response thereto simultaneously applies same gate currents to the two thyristors. A current path through the two thyristors (one passing current in forward mode and the other in reverse mode) discharges a residual voltage stored on the AC capacitor.
H02M 1/32 - Means for protecting converters other than by automatic disconnection
H02M 7/155 - Conversion of AC power input into DC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a thyratron or thyristor type requiring extinguishing means using semiconductor devices only
H02M 1/08 - Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
An AC capacitor is coupled to a totem-pole type PFC circuit. In response to detection of a power input disconnection, the PFC circuit is controlled to discharge the AC capacitor. The PFC circuit includes a resistor and a first MOSFET and a second MOSFET coupled in series between DC output nodes with a common node coupled to the AC capacitor. When the disconnection event is detected, one of the first and second MOSFETs is turned on to discharge the AC capacitor with a current flowing through the resistor and the turned on MOSFET. Furthermore, a thyristor may be simultaneously turned on, with the discharge current flowing through a series coupling of the MOSFET, resistor and thyristor. Disconnection is detected by detecting a zero-crossing failure of an AC power input voltage or lack of input voltage decrease or input current increase in response to MOSFET turn on for a DC input.
H02M 1/42 - Circuits or arrangements for compensating for or adjusting power factor in converters or inverters
H02M 1/32 - Means for protecting converters other than by automatic disconnection
H02M 7/155 - Conversion of AC power input into DC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a thyratron or thyristor type requiring extinguishing means using semiconductor devices only
H02M 7/217 - Conversion of AC power input into DC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
The present disclosure relates to a method for aligning a smartphone providing NFC wireless power for charging a battery of a device, the method comprising: emitting, with a first NFC antenna of the smartphone, an NFC field for wirelessly charging the battery of the device comprising a second NFC antenna; obtaining, with the smartphone, a measured value of a signal representative of the NFC field strength between the smartphone and the device; determining, by the smartphone, a range of values of a plurality of ranges of values the measured value belongs; and emitting, by the smartphone, at least one notification signal to a user with a frequency determined by the determined range of values.
H04B 5/00 - Near-field transmission systems, e.g. inductive or capacitive transmission systems
H02J 50/10 - Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
H02J 50/80 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the exchange of data, concerning supply or distribution of electric power, between transmitting devices and receiving devices
H02J 50/90 - Circuit arrangements or systems for wireless supply or distribution of electric power involving detection or optimisation of position, e.g. alignment
A die including a first contact with a first shape (e.g., ring-shaped) and a second contact with a second shape (e.g., cylindrical shaped) different from the first shape. The first contact has an opening that extends through a central region of a surface of the first contact. A first solder portion is coupled to the surface of the first contact and the first solder portion has the first shape. A second solder portion is coupled to a surface of the second contact and the second solder portion has the second shape. The first solder portion and the second solder portion both have respective points furthest away from a substrate of the die. These respective points of the first solder portion and the second solder portion are co-planar with each other such that a standoff height of the die remains consistent when coupled to a PCB or an electronic component.
A fan-out wafer level package includes a semiconductor die with a redistribution layer on a sidewall of the semiconductor die. A redistribution layer positioned over the die includes an extended portion that extends along the sidewall. The semiconductor die is encapsulated in a molding compound layer. The molding compound layer is positioned between the extended portion of the redistribution layer and the sidewall of the semiconductor die. Solder contacts, for electrically connecting the semiconductor device to an electronic circuit board, are positioned on the redistribution layer. The solder contacts and the sidewall of the redistribution layer can provide electrical contact on two different locations. Accordingly, the package can be used to improve interconnectivity by providing vertical and horizontal connections.
An AC capacitor is coupled to a totem-pole type PFC circuit. In response to detection of a power input disconnection, the PFC circuit is controlled to discharge the AC capacitor. The PFC circuit includes a resistor and a first MOSFET and a second MOSFET coupled in series between DC output nodes with a common node coupled to the AC capacitor. When the disconnection event is detected, one of the first and second MOSFETs is turned on to discharge the AC capacitor with a current flowing through the resistor and the turned on MOSFET. Furthermore, a thyristor may be simultaneously turned on, with the discharge current flowing through a series coupling of the MOSFET, resistor and thyristor. Disconnection is detected by detecting a zero-crossing failure of an AC power input voltage or lack of input voltage decrease or input current increase in response to MOSFET turn on for a DC input.
H02M 1/42 - Circuits or arrangements for compensating for or adjusting power factor in converters or inverters
H02M 7/155 - Conversion of AC power input into DC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a thyratron or thyristor type requiring extinguishing means using semiconductor devices only
H02M 7/217 - Conversion of AC power input into DC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
H02M 1/32 - Means for protecting converters other than by automatic disconnection
24.
WLCSP with transparent substrate and method of manufacturing the same
The present disclosure is directed to a package, such as a wafer level chip scale package (WLCSP), with a die coupled to a central portion of a transparent substrate. The transparent substrate includes a central portion having and a peripheral portion surrounding the central portion. The package includes a conductive layer coupled to a contact of the die within the package that extends from the transparent substrate to an active surface of the package. The active surface is utilized to mount the package within an electronic device or to a printed circuit board (PCB) accordingly. The package includes a first insulating layer separating the die from the conductive layer, and a second insulating layer on the conductive layer.
H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
H01L 31/0392 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates
H01L 31/02 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof - Details
H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
A capacitive element has its terminals coupled together by two thyristors electrically in antiparallel. The discharge of the capacitive element is controlled by the application of a gate current to one thyristor of the two thyristors which is in a reverse-biased state in response to a voltage stored across the terminals of the capacitive element. The reverse-biased thyristor responds to the applied gate current by passing a leakage current to discharge the stored voltage.
H02M 7/155 - Conversion of AC power input into DC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a thyratron or thyristor type requiring extinguishing means using semiconductor devices only
H02J 7/00 - Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
H02M 1/42 - Circuits or arrangements for compensating for or adjusting power factor in converters or inverters
H02J 7/34 - Parallel operation in networks using both storage and other DC sources, e.g. providing buffering
A rectifying bridge has a thyristor coupled in series with a rectifying element between a first rectified output terminal of a rectifying bridge circuit and a second rectified output terminal of the rectifying bridge circuit. A diode is coupled in series with a DC voltage source between a gate of the thyristor and the second rectified output terminal.
H02M 7/162 - Conversion of AC power input into DC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a thyratron or thyristor type requiring extinguishing means using semiconductor devices only in a bridge configuration
H02M 1/32 - Means for protecting converters other than by automatic disconnection
H02M 1/36 - Means for starting or stopping converters
H02M 1/42 - Circuits or arrangements for compensating for or adjusting power factor in converters or inverters
H02M 1/08 - Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
A circuit includes two thyristors coupled in anti-series. An AC capacitor has first and second electrodes respectively coupled to two different electrodes of the two thyristors. The first and second electrodes are coupled to receive an AC voltage. A control circuit detects discontinuance of application of the AC voltage to the AC capacitor and in response thereto simultaneously applies same gate currents to the two thyristors. A current path through the two thyristors (one passing current in forward mode and the other in reverse mode) discharges a residual voltage stored on the AC capacitor.
H02M 1/32 - Means for protecting converters other than by automatic disconnection
H02M 7/155 - Conversion of AC power input into DC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a thyratron or thyristor type requiring extinguishing means using semiconductor devices only
H02M 1/08 - Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
A fan-out wafer level package includes a semiconductor die with a redistribution layer on a sidewall of the semiconductor die. A redistribution layer positioned over the die includes an extended portion that extends along the sidewall. The semiconductor die is encapsulated in a molding compound layer. The molding compound layer is positioned between the extended portion of the redistribution layer and the sidewall of the semiconductor die. Solder contacts, for electrically connecting the semiconductor device to an electronic circuit board, are positioned on the redistribution layer. The solder contacts and the sidewall of the redistribution layer can provide electrical contact on two different locations. Accordingly, the package can be used to improve interconnectivity by providing vertical and horizontal connections.
An embodiment is a circuit for use with a display device, the circuit including: a first input node configured to be operatively coupled to a first port of a data source device that provides the display device with data, to receive a first direct voltage used for a real-time display of the data on the display device; and at least one output node, configured to operatively provide the display device with at least one output voltage generated based on the first direct voltage, wherein the first port is isolated from a data port used to transmit the data.
G06F 1/26 - Power supply means, e.g. regulation thereof
G09G 3/20 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix
30.
Data source and display having power circuits providing different output voltages based on duty cycle
An embodiment is a circuit for use with a display device, the circuit including: a first input node configured to be operatively coupled to a first port of a data source device that provides the display device with data, to receive a first direct voltage used for a real-time display of the data on the display device; and at least one output node, configured to operatively provide the display device with at least one output voltage generated based on the first direct voltage, wherein the first port is isolated from a data port used to transmit the data.
G06F 3/038 - Control and interface arrangements therefor, e.g. drivers or device-embedded control circuitry
G06F 1/26 - Power supply means, e.g. regulation thereof
G09G 3/20 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix
31.
Electronic device for receiving a radio-frequency signal
An electronic device includes an analog-to-digital converter adapted to receive a radio-frequency signal and adapted to provide therefrom a digital signal, wherein the radio-frequency signal may include an interference signal. The electronic device has a controller adapted to perform a digital measure on the digital signal and adapted to generate therefrom a selection signal having a first value indicating a non-interference condition in the radio-frequency signal and having a second value indicating an interference-condition in the radio-frequency signal. A selector is adapted to transmit the digital signal in case the selection signal has the first value and to transmit a signal replacing the digital signal in case the selection signal has the second value.
Methods and device for in-system firmware update in an information output device are provided. In one aspect, a method of firmware update in a display device receives a set of data in an image format through a video signal input channel of an input port of the display device. The set of data is converted from the image format to an instruction set format that is different from the image format. A first set of instructions that is used to operate the display device is updated with the set of data in the instruction set format.
patents