Remotely surveying a photovoltaic system site includes receiving a photograph uploaded by a user device; analyzing the photograph using a trained machine learning model; receiving a confidence score from the trained machine learning model; determining if the photograph includes predetermined information, the predetermined information being used to perform a remote photovoltaic (PV) system site survey remotely; and in response to a determination that the photograph does not include the predetermined information, provide specific instructions regarding the missing information, wherein the specific instructions include guidance on how to retake the photograph to capture the predetermined information.
H02S 50/15 - Testing of PV devices, e.g. of PV modules or single PV cells using optical means, e.g. using electroluminescence
G06V 10/74 - Image or video pattern matchingProximity measures in feature spaces
G06V 10/98 - Detection or correction of errors, e.g. by rescanning the pattern or by human interventionEvaluation of the quality of the acquired patterns
G06V 20/70 - Labelling scene content, e.g. deriving syntactic or semantic representations
G06V 30/42 - Document-oriented image-based pattern recognition based on the type of document
An end clamp for installation of a solar module includes a cap member that is installed in an opening of a rail. The end clamp also includes an assembly having a slider member and a base member, and also includes a fastener that attaches the assembly to the cap member. The slider member moves relative to the base member to clamp down on a flange of the solar module based on tightening of the fastener.
F16B 2/06 - Clamps, i.e. with gripping action effected by positive means other than the inherent resistance to deformation of the material of the fastening external, i.e. with contracting action
F16B 2/14 - Clamps, i.e. with gripping action effected by positive means other than the inherent resistance to deformation of the material of the fastening using wedges
09 - Scientific and electric apparatus and instruments
Goods & Services
Batteries and battery systems for storing and discharging electric energy from solar panels or power grids; energy storage systems sold as a unit comprised of batteries, inverters and power controllers; electrical power distribution boards and electrical power distribution panels
4.
SYSTEMS AND APPARATUSES FOR PRECIPITATION MANAGEMENT IN SOLAR ASSEMBLIES
A solar assembly includes a single-slope crossbeam, a plurality of clip angle brackets, and a plurality of photovoltaic (PV) modules. Each PV module is supported by at least two of the plurality of clip angle brackets, and a height of the plurality of angle brackets differ from each other in order to allow the PV modules to be shingled.
Photovoltaic panels may be aggregated in various ways and may be aggregated with the use of a backplane where the backplane comprises electrical connectors positioned to electrically connect the PV panels. The PV panels may have various sizes and shapes and may overlap one or more other PV panels or PV panels being aggregated.
H02S 40/36 - Electrical components characterised by special electrical interconnection means between two or more PV modules, e.g. electrical module-to-module connection
H02S 40/34 - Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes
Reconfigurable PV panels can have features that include cut lines for separating full panels into smaller subpanels, connector ribbons for assembling several reconfigurable PV panels into a one-dimensional or two-dimensional array and can be stacked upon each other and unstacked by rotating them about a shared connection.
A photovoltaic panel having a distributed support frame adhered to a photovoltaic module is described. For example, the distributed support frame may include one or more support member or support mounts adhered to the photovoltaic module by an adhesive layer. The photovoltaic module may include layers bound together by an encapsulant. Accordingly, the distributed support frame may be attached to the photovoltaic module during a same lamination process used to laminate the photovoltaic module.
This specification describes angled polymer solar modules, methods for producing angled polymer solar modules, and methods for installing angled polymer solar modules. In some examples, a method includes producing a flat polymer sheet including one or more photovoltaic cells. The method includes applying force to the flat polymer sheet to curve the flat polymer sheet in at least one region, forming an angled polymer sheet from the flat polymer sheet. The method includes mounting the angled polymer sheet on a roof deck such that the photovoltaic cells are angled with respect to the roof deck by virtue of the at least one region being curved.
H02S 30/00 - Structural details of PV modules other than those related to light conversion
H01L 31/0352 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
The present disclosure provides systems and methods for integrating an energy control system with an electrical system having a utility meter connected to a utility grid, a photovoltaic (PV) system, an energy storage system, and a plurality of electrical loads. The systems and methods include determining a site condition of the electrical system, determining a type of backup configuration for the electrical system based on the determined site condition, and determining a location of at least one of a main circuit breaker, the PV system, a subpanel, and a site current transformer with respect to the energy control system based on the determined site condition and the determined type of backup configuration.
Subtractive metallization approaches for fabricating solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a semiconductor region in or above a substrate. A metal foil portion can include an adhesive layer thereon. The adhesive layer is above the semiconductor region and has an opening therein exposing a portion of the semiconductor region. A conductive material is on and electrically coupled to the portion of the semiconductor region exposed by the opening in the adhesive layer. The conductive material is further on and electrically coupled to the metal foil portion.
Testing to detect intermittent electrical pathways is described. Applied currents may be reversed to fully test all components of a workpiece. Various testing methodologies may be employed. These methodologies may include Time Domain Reflectometry (TDR), mechanical agitation, dark current/voltage testing, (dark IV), i.e., electrical testing of a workpiece using applied electricity, and thermographic imaging, e.g., infra-red thermal imaging. The sensed voltage during agitation may be compared to a benchmark voltage to determine whether or not an intermittent failure exists.
Aligned metallization approaches for fabricating solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a semiconductor layer over a semiconductor substrate. A first plurality of discrete openings is in the semiconductor layer and exposes corresponding discrete portions of the semiconductor substrate. A plurality of doped regions is in the semiconductor substrate and corresponds to the first plurality of discrete openings. An insulating layer is over the semiconductor layer and is in the first plurality of discrete openings. A second plurality of discrete openings is in the insulating layer and exposes corresponding portions of the plurality of doped regions. Each one of the second plurality of discrete openings is entirely within a perimeter of a corresponding one of the first plurality of discrete openings. A plurality of conductive contacts is in the second plurality of discrete openings and is on the plurality of doped regions.
Photovoltaic (PV) frames, PV frame systems, methods of PV manufacture, articles of PV manufacture, and processes involving PVs are provided. These frames may employ a laminate receiver configured to receive a surface of a PV laminate and support that PV laminate upon installation of a PV system.
Wire-based metallization and stringing techniques for solar cells, and the resulting solar cells, modules, and equipment, are described. In an example, a string of solar cells includes a plurality of back-contact solar cells, wherein each of the plurality of back-contact solar cells includes P- type and N-type doped diffusion regions. A plurality of conductive wires is disposed over a back surface of each of the plurality of solar cells, wherein each of the plurality of conductive wires is substantially parallel to the P-type and N-type doped diffusion regions of each of the plurality of solar cells. One or more of the plurality of conductive wires adjoins a pair of adjacent solar cells of the plurality of solar cells and has a relief feature between the pair of adjacent solar cells.
H01L 31/0465 - PV modules composed of a plurality of thin film solar cells deposited on the same substrate comprising particular structures for the electrical interconnection of adjacent PV cells in the module
H01L 31/0352 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
H01L 31/05 - Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
15.
SOLAR CELLS HAVING HYBRID ARCHITECTURES INCLUDING DIFFERENTIATED P-TYPE AND N-TYPE REGIONS WITH OFFSET CONTACTS
A solar cell, and methods of fabricating said solar cell, are disclosed. The solar cell can include a first emitter region over a substrate, the first emitter region having a perimeter around a portion of the substrate. A first conductive contact is electrically coupled to the first emitter region at a location outside of the perimeter of the first emitter region.
H01L 31/0392 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates
09 - Scientific and electric apparatus and instruments
Goods & Services
Apparatus for management of a solar-based energy system, namely, an apparatus comprised of an electrical panel, autodisconnect switches, and recorded intelligent energy management software for storing electrical energy and discharging electricity, storing electrical energy and discharging electricity to or from an electric power grid to meet energy usage goals and demands, and monitoring and optimizing the storage and discharge of electrical energy in a photovoltaic-connected energy system
09 - Scientific and electric apparatus and instruments
Goods & Services
Batteries and battery systems for storing and discharging electric energy from solar panels or power grids; energy storage systems sold as a unit comprised of batteries, inverters and power controllers; electrical power distribution boards and electrical power distribution panels
18.
SOLAR CELLS HAVING HYBRID ARCHITECTURES INCLUDING DIFFERENTIATED P-TYPE AND N-TYPE REGIONS
A solar cell, and methods of fabricating said solar cell, are disclosed. The solar cell can include a substrate having a light-receiving surface and a back surface. The solar cell can include a first semiconductor region of a first conductivity type disposed on a first dielectric layer, wherein the first dielectric layer is disposed on the substrate. The solar cell can also include a second semiconductor region of a second, different, conductivity type disposed on a second dielectric layer, where a portion of the second thin dielectric layer is disposed between the first and second semiconductor regions. The solar cell can include a third dielectric layer disposed on the second semiconductor region. The solar cell can include a first conductive contact disposed over the first semiconductor region but not the third dielectric layer. The solar cell can include a second conductive contact disposed over the second semiconductor region, where the second conductive contact is disposed over the third dielectric layer and second semiconductor region. In an embodiment, the third dielectric layer can be a dopant layer.
H01L 31/02 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof - Details
H01L 31/032 - Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups
H01L 31/0368 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including polycrystalline semiconductors
A solar cell can include a first plurality of metal contact fingers, and a second plurality of metal contact fingers interdigitated with the first plurality of metal contact fingers, wherein at least one of the first plurality of metal contact fingers comprises a wrap¬ around metal finger that passes between a first edge of the solar cell and at least one contact pads. A photovoltaic (PV) string including a solar cell with a wrap-around metal contact finger. A method of coupling an electrically conductive connector to a solar cell with a wrap-around metal contact finger.
Modular photovoltaic (PV) panel, system, and method of mounting. The system including a mounting flashing configured to mounted to a mounting surface and a folding PV panel. The folding PV panel including: a first subpanel including first PV cells, wherein the first subpanel extends along a first lateral plane and comprises a plurality of mounting hooks extending laterally from and affixed to a backside of the first subpanel, the mounting hooks configured to couple to the mounting flashing; a second subpanel including second PV cells, wherein the second subpanel extends along a second lateral plane, wherein the second subpanel comprises a front edge support configured to hold a front edge of the second subpanel away from the mounting surface; and a hinge assembly rotationally coupling the first subpanel and the second subpanel to allow an angle between the first lateral plane and the second lateral plane to change.
Methods of fabricating solar cells having junctions retracted from cleaved edges, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a light-receiving surface, a back surface, and sidewalls. An emitter region is in the substrate at the light-receiving surface of the substrate. The emitter region has sidewalls laterally retracted from the sidewalls of the substrate. A passivation layer is on the sidewalls of the emitter region.
H01L 31/036 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
09 - Scientific and electric apparatus and instruments
Goods & Services
Batteries and battery systems for storing and discharging electric energy from solar panels; solar energy storage systems sold as a unit comprised of solar panels, namely, solar panels for the production of electricity, batteries, inverters and controllers; electrical distribution boards and electrical distribution panels
23.
LOCAL METALLIZATION FOR SEMICONDUCTOR SUBSTRATES USING A LASER BEAM
Local metallization of semiconductor substrates using a laser beam, and the resulting structures, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, are described. For example, a solar cell includes a substrate and a plurality of semiconductor regions disposed in or above the substrate. A plurality of conductive contact structures is electrically connected to the plurality of semiconductor regions. Each conductive contact structure includes a locally deposited metal portion disposed in contact with a corresponding a semiconductor region.
H01L 31/0368 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including polycrystalline semiconductors
24.
LASER ASSISTED METALLIZATION PROCESS FOR SOLAR CELL CIRCUIT FORMATION
A method of fabricating solar cell, solar laminate and/or solar module string is provided. The method may include: locating a metal foil over a plurality of semiconductor substrates; exposing the metal foil to laser beam over selected portions of the plurality of semiconductor substrates, wherein exposing the metal foil to the laser beam forms a plurality conductive contact structures having of locally deposited metal portion electrically connecting the metal foil to the semiconductor substrates at the selected portions; and selectively removing portions of the metal foil, wherein remaining portions of the metal foil extend between at least two of the plurality of semiconductor substrates.
Metallization of semiconductor substrates using a laser beam, and the resulting structures, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, solar cell circuit, solar cell strings, and solar cell arrays are described. A solar cell string can include a plurality of solar cells. The plurality of solar cells can include a substrate and a plurality of semiconductor regions disposed in or above the substrate. A plurality of conductive contact structures is electrically connected to the plurality semiconductor regions. Each conductive contact structure includes a locally deposited metal portion disposed in contact with a corresponding one of the semiconductor regions.
H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
H01L 31/05 - Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
H01L 31/02 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof - Details
H01L 31/072 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN heterojunction type
26.
LASER ASSISTED METALLIZATION PROCESS FOR SOLAR CELL FABRICATION
A method for fabricating a solar cell and the and the resulting structures, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, are described. The method can include: providing a solar cell having metal foil having first regions that are electrically connected to semiconductor regions on a substrate at a plurality of conductive contact structures, and second regions; locating a carrier sheet over the second regions; bonding the carrier sheet to the second regions; and removing the carrier sheet from the substrate to selectively remove the second regions of the metal foil.
A system for fabricating solar cells. The system including one or more of: a laser assisted metallization patterning unit adapted to expose a metal foil located over a substrate to a laser beam to form a conductive contact structure comprising a locally deposited metal on the substrate; a debris removal unit adapted to remove debris from a top surface of a metal foil that is attached to a top surface of a substrate; a carrier attachment unit adapted to attach a carrier to one the top surface of the metal foil; and a metal removal unit adapted to remove the carrier and at least a portion of the metal foil.
e.ge.g., micro-electronic devices, semiconductor substrates and/or solar cells, are described. For example, a method of fabricating a solar cell includes providing a substrate having an intervening layer thereon. The method also includes locating a metal foil over the intervening layer. The method also includes exposing the metal foil to a laser beam, wherein exposing the metal foil to the laser beam forms openings in the intervening layer and forms a plurality of conductive contact structures electrically connected to portions of the substrate exposed by the openings.
H01L 31/0463 - PV modules composed of a plurality of thin film solar cells deposited on the same substrate characterised by special patterning methods to connect the PV cells in a module, e.g. laser cutting of the conductive or active layers
Connectors, systems with connectors and processes with connectors are described. These include how connectors can actively hold external portions of two frames or other components together during transport and before final installation, as well as, how the connectors can be repositionable on the frame or other component so as to provide a mechanical connection in one position and not to provide a mechanical connection when moved into a second position. The connectors can also function to provide spacing or alignment or both between frames or other components grouped together using the connectors.
H02S 40/36 - Electrical components characterised by special electrical interconnection means between two or more PV modules, e.g. electrical module-to-module connection
H02S 40/22 - Light-reflecting or light-concentrating means
F16B 5/00 - Joining sheets or plates to one another or to strips or bars parallel to them
30.
WIRE-BASED METALLIZATION AND STRINGING FOR SOLAR CELLS
Wire-based metallization and stringing techniques for solar cells, and the resulting solar cells, modules, and equipment, are described. In an example, a substrate has a surface. A plurality of N-type and P-type semiconductor regions is disposed in or above the surface of the substrate. A conductive contact structure is disposed on the plurality of N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of conductive wires, each conductive wire of the plurality of conductive wires essentially continuously bonded directly to a corresponding one of the N-type and P-type semiconductor regions.
Frames and processes of manufacture using single-wall frame sections coupled to other single-wall frame sections or double-wall frame sections using a connecting key are provided. The connecting key can be metallic, polymer, ceramic, a laminate, and combinations thereof.
One embodiment is a photovoltaic (PV) module including a frame to receive a perimeter of a backside of a photovoltaic (PV) laminate. The cross rail assembly may include: a conductive frame to receive a perimeter of a backside of a photovoltaic (PV) laminate; one or more conductive cross rail members provide structural rigidity to the conductive frame; and one or more pairs of couplers coupled to the conductive frame, wherein: at least one coupler comprises a grounding coupler having a first keyed section to insert into an opening in the conductive frame and a second keyed section to mate with an end of a conductive cross rail member of the one or more conductive cross rail members to ground the conductive cross rail member to the frame; or at least one coupler of at least one of the one or more pairs includes a length to define a cabling channel.
An autonomous solar collector cleaning device includes at least one main shaft, a first driver attached to a first end of the at least one main shaft, and a second driver attached to a second end of the at least one main shaft. The first and second drivers propel the cleaning device along a surface of the solar collector. A first sensor is attached to the first driver to detect an edge of the solar collector, and a second sensor is attached to the second driver to detect the edge of the solar collector. A control circuit maintains alignment of the cleaning device with respect to the solar collector based on outputs from the first and second sensors.
The invention relates to a method for recycling sub-micron Si-particles from a Si wafer production process resulting from a diamond fixed abrasive process, in particular slicing and cutting comprising the steps of: - providing a paste (3) of sub-micron Si-particles resulting from said diamond fixed abrasive process, - drying and shaping into a layer (7) said paste of sub-micron Si-particles, - applying a zone melting step to said dried and shaped layer of Si-particles on a substrate (5).
C30B 35/00 - Apparatus not otherwise provided for, specially adapted for the growth, production or after-treatment of single crystals or of a homogeneous polycrystalline material with defined structure
35.
PHOTOVOLTAIC MODULE WITH DISTRIBUTED POWER CONVERSION CIRCUITS
A photovoltaic module includes solar cells (101) and a power conversion circuit. The power conversion circuit includes an in-laminate circuit (200) that is disposed with the solar cells (101) within a laminate (160) of the photovoltaic module. The power conversion circuit further includes an external circuit disposed outside of the laminate (160). The external circuit is in an enclosure (150), such as a junction box. The external circuit includes magnetic components, such as an inductor or a transformer.
H02S 40/34 - Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes
36.
PHOTOVOLTAIC MODULE HAVING BI-DIRECTIONAL COUPLINGS
A photovoltaic (PV) module having bi-directional couplings is described. The bi-directional couplings include a first coupling mounted on a support frame under a first edge of the PV module and a second coupling mounted on the support frame under a second edge of the PV module. The PV module can be a keystone module and the bi-directional couplings of the keystone module can connect to respective couplings of several adjacent PV modules. The bi-directional couplings can form male-to-female connections with the respective couplings to quickly combine the PV modules into a PV module assembly. The PV module assembly includes the bi-directionally connected PV modules supporting each other in both an x- direction and a y- direction.
H02S 40/34 - Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes
H01L 31/05 - Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
A folding photovoltaic (PV) panel is described. The folding PV panel may include several subpanels interconnected by a hinge assembly. The hinge assembly may include a first section, a second section, and a third section between the first and second sections. The first section of the hinge assembly may couple to a first subpanel and the second section of the hinge assembly may couple to a second subpanel. The folding PV panel may include at least one electrical conductor extending from the first subpanel to the second subpanel. The at least one electrical conductor may be located in the hinge assembly or in a cabling assembly bridging a channel defined by edges of the first and second subpanels and the third section of the hinge assembly.
H02S 40/36 - Electrical components characterised by special electrical interconnection means between two or more PV modules, e.g. electrical module-to-module connection
H02S 40/34 - Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes
H01L 31/05 - Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
Methods of recycling silicon swarf into electronic grade polysilicon or metallurgical-grade silicon are described herein are described. In an example, a method includes cutting a silicon ingot and recovering silicon swarf having a first purity from the cutting process. The recovered silicon is purified in an upgraded metallurgical silicon process to produce electronic grade polysilicon particles having a second purity higher than the first purity. The upgraded metallurgical silicon process can include dissolving the recovered silicon particles in a molten aluminum metal smelt.
H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
B28D 5/04 - Fine working of gems, jewels, crystals, e.g. of semiconductor materialApparatus therefor by tools other than of rotary type, e.g. reciprocating tools
This specification describes methods for processing semiconductor wafers, methods for loading semiconductor wafers into wafer carriers, and semiconductor wafer carriers. The methods and wafer carriers can be used for increasing the rigidity of wafers, e.g., large and thin wafers, by intentionally bowing the wafers to an extent that does not break the wafers. In some examples, a method for processing semiconductor wafers includes loading each semiconductor wafer into a respective semiconductor wafer slot of a semiconductor wafer carrier, horizontally bowing each semiconductor wafer, and moving the semiconductor wafer carrier into a processing station and processing the semiconductor wafers at the processing station while the semiconductor wafers are loaded into the semiconductor wafer carrier and horizontally bowed.
H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
H01L 31/042 - PV modules or arrays of single PV cells
This specification describes semiconductor wafer carriers, methods for manufacturing the semiconductor wafer carriers, and methods for using the semiconductor wafer carriers. The semiconductor wafer carriers can include features for avoiding double-slotting, for preventing glove marks on semiconductor wafers, and for providing additional sitting and storage options for the wafer carrier. In some examples, a semiconductor wafer carrier includes multiple notched left-side rods that are parallel in a vertical direction and multiple notched right-side rods that are parallel in the vertical direction. The semiconductor wafer carrier includes one or more bottom rods. The left-side rods, the right-side rods, and the one or more bottom rods are joined to define semiconductor wafer slots.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
41.
PLASMA-CURING OF LIGHT-RECEIVING SURFACES OF SOLAR CELLS
Methods of fabricating solar cells using plasma-curing of light-receiving surfaces of the solar cells, and the resulting solar cells, are described. In an example, a method of fabricating a solar cell includes forming a dielectric layer on a light-receiving surface of a silicon substrate. The method also includes forming an anti-reflective coating (ARC) layer over the dielectric layer. The method also includes exposing the ARC layer to plasma-induced radiation.
Solar cell emitter regions fabrication is described. In an example, a species mask, e.g., a shadow mask, is provided between a plasma source and a semiconductor wafer. The species mask includes an opening pattern having several openings with respective opening widths and pitches. Species emitted by the plasma source pass through the openings in the species mask and implant in the semiconductor wafer to form several emitter region fingers having respective finger widths and pitches. In an embodiment, the opening widths and pitches vary across the species mask and the emitter region finger widths and pitches are uniform across the semiconductor wafer.
Electrical component location is provided. Employed location techniques may include providing a cycling signal, having components to be located sense the cycling signal at the same time, report back the sensed signal, and determining relative locations for one or more of the components using the sensed signals reported by the components.
Methods of fabricating a solar cell, and system for electrically coupling solar cells, are described. In an example, the methods for fabricating a solar cell can include placing conductive wires in a wire guide, where conductive wires are placed over a first semiconductor substrate having first doped regions and second doped regions. The method can include aligning the conductive wires over the first and second doped regions, where the wire guide aligns the conductive wires substantially parallel to the first and second doped regions. The method can include bonding the conductive wires to the first and second doped regions. The bonding can include applying a mechanical force to the semiconductor substrate via a roller or bonding head of the wire guide, where the wire guide inhibits lateral movement of the conductive wires during the bonding.
Methods of fabricating solar cell emitter regions with differentiated P-type and N-type regions architectures, and resulting solar cells, are described. In an example, a solar cell can include a substrate having a light-receiving surface and a back surface. A first doped region of a first conductivity type, wherein the first doped region is disposed in a first portion of the back surface. A first thin dielectric layer disposed over the back surface of the substrate, where a portion of the first thin dielectric layer is disposed over the first doped region of the first conductivity type. A first semiconductor layer disposed over the first thin dielectric layer. A second doped region of a second conductivity type in the first semiconductor layer, where the second doped region is disposed over a second portion of the back surface.
H01L 31/072 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN heterojunction type
H01L 31/0368 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including polycrystalline semiconductors
Methods of fabricating a solar cell, and system for electrically coupling solar cells, are described. In an example, the methods for fabricating a solar cell can include forming a first cut portion from a conductive foil. The method can also include aligning the first cut portion to a first doped region of a first semiconductor substrate. The method can include bonding the first cut portion to the first doped region of the first semiconductor substrate. The method can also include aligning and bonding a plurality of cut portions of the conductive foil to a plurality of semiconductor substrates.
A solar-tracking photovoltaic (PV) system having several PV modules mounted on a torque tube is described. The torque tube may include several sections joined by a torque tube coupler. For example, the torque tube coupler may having a medial section and end sections to join to the torque tube sections. The medial section and the torque tube sections may have a same outer diameter.
Solar devices and methods for producing solar devices are disclosed. Aspects of the disclosure provide a solar device that includes at least a first solar cell and a second solar cell. The first solar cell is configured to have a first edge of a non-linear shape with protruding portions and have first one or more contact pads arranged in the protruding portions. The second solar cell is configured to overlap with the first solar cell at the protruding portions. The second solar cell includes second one or more contact pads that are aligned with the first one or more contact pads to electrically connect the first solar cell and the second solar cell.
Systems, methods, and articles of manufacture are provided wherein inverter topologies and inverter control employ primary and secondary windings with a half-bridge circuit and an unfolding bridge circuit positioned between the second winding and an AC grid. Certain topologies may employ control circuits for controlling the bridges suitable for a phase angle of the AC grid.
H02M 7/48 - Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
H02M 1/44 - Circuits or arrangements for compensating for electromagnetic interference in converters or inverters
H02J 3/38 - Arrangements for parallelly feeding a single network by two or more generators, converters or transformers
H02S 40/32 - Electrical components comprising DC/AC inverter means associated with the PV module itself, e.g. AC modules
50.
PROTECTIVE REGION FOR METALLIZATION OF SOLAR CELLS
Methods of fabricating a solar cell including metallization techniques and resulting solar cells, are described. In an example, a first and second semiconductor regions can be formed in or above a substrate, where a separation region is disposed between the first and second semiconductor regions. A protective region can be formed over the separation region. A first metal layer can be formed over the substrate, where the protective region prevents and/or inhibits damage to the separation region during the formation of the first metal layer. Conductive contacts can be formed over the first and second semiconductor regions.
H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
H01L 31/0368 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including polycrystalline semiconductors
Solar cells having conductive contacts are described. In an example, a solar cell can include a protective layer disposed over a substrate, where the protective layer comprises a contact hole. A first metal layer disposed over the protective layer, where the first metal layer is electrically connected to the substrate through the contact hole. A second metal layer disposed over the first metal layer and a bond region disposed between the first metal layer and the second metal layer, where the bond region is located above a region of the protective layer without a contact hole.
H01L 31/0368 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including polycrystalline semiconductors
H01L 31/0392 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates
H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
52.
LASER TECHNIQUES FOR FOIL-BASED METALLIZATION OF SOLAR CELLS
Methods of fabricating a solar cell including metallization techniques and resulting solar cells, are described. In an example, a semiconductor region can be formed in or above a substrate. A first metal layer can be formed over the semiconductor region. A laser can be applied over a first region of the metal layer to form a first metal weld between the metal layer and the semiconductor region, where applying a laser over the first region comprises applying the laser at a first scanning speed. Subsequent to applying the laser over the first region, the laser can be applied over a second region of the metal layer where applying the laser over the second region includes applying a laser at a second scanning speed. Subsequent to applying the laser over the second region, the laser can be applied over a third region of the metal layer to form a second metal weld, where applying the laser over the third region comprises applying the laser at a third scanning speed.
H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 31/0392 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates
53.
PHOTOVOLTAIC PANEL HAVING A DISTRIBUTED SUPPORT FRAME
A photovoltaic panel having a photovoltaic module supported by a distributed support frame is described. The distributed support frame may include a support member extending over a back surface of the photovoltaic module. For example, one or more support members may extend laterally from a support hub mounted on the back surface. The distributed support frame may reduce a span length of the photovoltaic module between support locations, and thus, may reduce a likelihood that a module laminate will crack under a design load.
A solar collection system may collect energy from the sun to generate electricity for distribution on an electrical grid. In addition to generating electricity, a solar collection system may include support devices such as motors, controllers, sensors, and other support devices to perform various tasks to allow the solar collection system to more effectively generate electricity. When the solar collection system is generating sufficient power, the support devices may be powered by the solar collection system. However, when the solar collection system is not generating sufficient power, the support devices may be powered by a backfeed power supply circuit coupled to the electrical grid.
A solar power system may include rails, solar modules, and a plurality of clamps to secure the solar modules to the rails. An end clamp may be partially disposed inside a rail at an end of the rail. The end clamp may secure a solar module to the rail by coupling to the frame of the solar module. The end clamp may include a fastener that may be tightened to engage the end clamp and secure the solar module by holding it on top of the rail. The end clamp may establish an electrical grounding connection between the frame of the solar module and the rail.
A photovoltaic module having an external electrical connector is described. For example, the photovoltaic module may include a plug receptacle mounted on a module laminate, and a contact may extend from a photovoltaic cell within the module laminate into a plug channel of the plug receptacle. The plug receptacle may receive a mating electrical connector, e.g., an electrical plug, of off-panel electronics. Accordingly, the contact may be removably connected to the mating electrical connector, and the photovoltaic cell may be placed in electrical connection with the off-panel electronics.
H02S 40/36 - Electrical components characterised by special electrical interconnection means between two or more PV modules, e.g. electrical module-to-module connection
Methods of fabricating a solar cell, and resulting solar cell are described. In an example, the method for fabricating a solar cell include forming an oxide region over a light receiving region of a silicon substrate. The method can include forming an interfacial region over the light receiving surface of the silicon substrate. The method can also include forming a first surface region comprising aluminum oxide over the interfacial region and forming a second surface region over the first surface region. In some embodiments, the first surface region can have a thickness greater than the second surface region. In one embodiment, the second surface region can have a thickness greater than the thickness of the first surface region.
H01L 31/0232 - Optical elements or arrangements associated with the device
H01L 31/0368 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including polycrystalline semiconductors
H01L 31/0376 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including amorphous semiconductors
H01L 31/0392 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates
H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
58.
PHOTOVOLTAIC ASSEMBLY HAVING CORNER-FACING ELECTRICAL CONNECTOR PORT
Photovoltaic (PV) assemblies and electrical connections for interconnecting PV modules to form PV arrays are described herein. The PV assemblies can include angled connector terminals to electrically mate with power connector ports of the PV modules. A power connector port can face a corner of a PV module. The electrical connections of the PV assemblies can simplify cable management and facilitate flexibility in arrangement and interconnection of PV modules and PV arrays.
H02S 40/36 - Electrical components characterised by special electrical interconnection means between two or more PV modules, e.g. electrical module-to-module connection
H01L 31/05 - Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
H02S 40/34 - Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes
59.
SYSTEMS AND METHODS FOR REWORKING SHINGLED SOLAR CELL MODULES
A high efficiency configuration for a solar cell module comprises solar cells arranged in a shingled manner to form super cells, which may be arranged to efficiently use the area of the solar module, reduce series resistance, and increase module efficiency. Removing a defective solar cell from a super cell may be difficult, however. It may therefore be advantageous to bypass defective solar cells in a super cell rather than remove and replace them. A bypass conductor may be applied to the rear surface of the super cell to bypass one or more defective solar cells in a super cell or in a solar module comprising super cells.
H01L 31/05 - Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
H02S 40/36 - Electrical components characterised by special electrical interconnection means between two or more PV modules, e.g. electrical module-to-module connection
Disclosed herein are approaches to fabricating solar cells, solar cell strings and solar modules using roll-to-roll foil-based metallization approaches. Methods disclosed herein can comprise the steps of providing at least one solar cell wafer on a first roll unit and conveying a metal foil to the first roll unit. The metal foil can be coupled to the solar cell wafer on the first roll unit to produce a unified pairing of the metal foil and the solar cell wafer. We disclose solar energy collection devices and manufacturing methods thereof enabling reduction of manufacturing costs due to simplification of the manufacturing process by a high throughput foil metallization process.
H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
H01L 31/05 - Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
H01L 31/0368 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including polycrystalline semiconductors
H01L 31/02 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof - Details
09 - Scientific and electric apparatus and instruments
11 - Environmental control apparatus
35 - Advertising and business services
36 - Financial, insurance and real estate services
37 - Construction and mining; installation and repair services
42 - Scientific, technological and industrial services, research and design
Goods & Services
Computer software and computer hardware for use in energy
monitoring and energy management and for use in tracking
energy usage; software for inventory management. Solar heat collection panels; solar collectors and mounting
systems for solar collectors comprised of structural
supports and mounting rails for stabilization on the ground
and for rooftop stabilization, solar collector supports, and
clamps, all sold as a unit with solar collectors. Energy usage management (terms considered too vague by the
International Bureau - rule 13(2)(b) of the Common
Regulations); energy usage management information services
(terms considered too vague by the International Bureau -
rule 13(2)(b) of the Common Regulations); home energy
assessment services for the purpose of determining energy
efficiency or usage management; information in the field of
energy efficiency (terms considered too vague by the
International Bureau - rule 13(2)(b) of the Common
Regulations); business consulting and advisory services in
the field of energy efficiency; consultation in the field of
energy efficiency. Financing services, namely, solar electric system leases,
solar power purchase agreements, and financing loans for the
purchase and installation of solar power systems. Installation, cleaning, repair, and maintenance of solar
energy based power systems and alternative energy products
for commercial use; installation, repair, and maintenance of
solar energy systems, solar collectors and solar heat
collection panels; installation of facilities to produce
solar energy, installation of ground-mounted and
roof-mounted solar panel systems. Remote monitoring, metering and data analysis of energy
usage and energy management systems; energy usage monitoring
in the nature of data analysis; temporary use of
non-downloadable computer software for use in energy
monitoring and energy management and for use in tracking
energy usage.
A wafer transfer system can include a wafer gripper for picking and placing semiconductor devices. In an embodiment, the wafer gripper can include a first portion, a second portion and a laminate between the first and second portion. In one embodiment, the first portion can comprise glass or tempered glass, where the first portion having at least one vacuum hole and is configured to receive the semiconductor device. In an embodiment, the second portion can include glass or tempered glass, the second portion having configured to use low air pressure from a closed vacuum to vacuum a wafer. In an embodiment, the laminate can bond the first portion to the second portion.
H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
63.
TRI-LAYER SEMICONDUCTOR STACKS FOR PATTERNING FEATURES ON SOLAR CELLS
Tri-layer semiconductor stacks for patterning features on solar cells, and the resulting solar cells, are described herein. In an example, a solar cell includes a substrate. A semiconductor structure is disposed above the substrate. The semiconductor structure includes a P-type semiconductor layer disposed directly on a first semiconductor layer. A third semiconductor layer is disposed directly on the P-type semiconductor layer. An outermost edge of the third semiconductor layer is laterally recessed from an outermost edge of the first semiconductor layer by a width. An outermost edge of the P-type semiconductor layer is sloped from the outermost edge of the third semiconductor layer to the outermost edge of the third semiconductor layer. A conductive contact structure is electrically connected to the semiconductor structure.
H01L 31/0392 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates
H01L 31/042 - PV modules or arrays of single PV cells
H01L 31/06 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier
H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
64.
THERMOCOMPRESSION BONDING APPROACHES FOR FOIL-BASED METALLIZATION OF NON-METAL SURFACES OF SOLAR CELLS
Thermocompression bonding approaches for foil-based metallization of non-metal surfaces of solar cells, and the resulting solar cells, are described. For example, a solar cell includes a substrate and a plurality of alternating N-type and P-type semiconductor regions disposed in or above the substrate. A plurality of conductive contact structures is electrically connected to the plurality of alternating N-type and P-type semiconductor regions. Each conductive contact structure includes a metal foil portion disposed in direct contact with a corresponding one of the alternating N-type and P-type semiconductor regions.
H01L 31/0368 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including polycrystalline semiconductors
H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
65.
METALLIZATION OF SOLAR CELLS WITH DIFFERENTIATED P-TYPE AND N-TYPE REGION ARCHITECTURES
Methods of fabricating solar cell emitter regions with differentiated P-type and N-type regions architectures, and resulting solar cells, are described. In an example, a back contact solar cell can include a substrate having a light-receiving surface and a back surface. A first polycrystalline silicon emitter region of a first conductivity type is disposed on a first thin dielectric layer disposed on the back surface of the substrate. A second polycrystalline silicon emitter region of a second, different, conductivity type is disposed on a second thin dielectric layer disposed on the back surface of the substrate. A third thin dielectric layer is disposed over an exposed outer portion of the first polycrystalline silicon emitter region and is disposed laterally directly between the first and second polycrystalline silicon emitter regions. A first conductive contact structure is disposed on the first polycrystalline silicon emitter region. A second conductive contact structure is disposed on the second polycrystalline silicon emitter region. Metallization methods, include etching techniques for forming a first and second conductive contact structure are also described.
Die-cutting approaches for foil-based metallization of solar cells, and the resulting solar cells are disclosed herein. Die-cutting approaches for foil-based metallization of solar cells include forming a plurality of semiconductor regions in or above a substrate and forming a patterned damage buffer in alignment with locations between the plurality of semiconductor regions. Additionally, a metal layer comprising a metal seed layer and//or metal foil is formed over the patterned damage buffer. The metal layer is cut by a cutting die at locations between the plurality of semiconductor regions by applying a mechanical force to the cutting die.
H01L 31/036 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
H01L 31/06 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier
H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
A high efficiency configuration for a solar cell module comprises solar cells arranged in an overlapping shingled manner and conductively bonded to each other in their overlapping regions to form super cells, which may be arranged to efficiently use the area of the solar module.
Solar cells having a plurality of sub-cells coupled by metallization structures having a metal bridge, and singulation approaches to forming solar cells having a plurality of sub-cells coupled by metallization structures, are described. In an example, the metal bridge can provide structural support and provide for an electrical connection between a first contact pad and a first busbar. Adjacent ones of the singulated and physically separated semiconductor substrate portions have a groove there between and where the metal bridge can be perpendicular to the groove. The solar cell can include a first contact pad adjacent to a second contact pad.
H01L 31/05 - Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
H01L 31/02 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof - Details
H01L 31/0392 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates
Solar tracker systems having several rows of photovoltaic strings individually actuated by respective tracker control systems, are described. In an example, a solar tracker system includes a tracker control system having a tracker controller powered by forward-fed power from a photovoltaic string, e.g., during daytime, and powered by back-fed power from a station hub, e.g., during nighttime. Methods of operating the solar tracker system to forward-feed or back-feed power to the tracker control system are also described.
Solar cell fabrication using laser patterning of ion-implanted etch-resistant layers, and the resulting solar cells, are described. In an example, a back contact solar cell includes an N-type single crystalline silicon substrate having a light-receiving surface and a back surface. Alternating continuous N-type emitter regions and segmented P-type emitter regions are disposed on the back surface of the N-type single crystalline silicon substrate, with gaps between segments of the segmented P-type emitter regions. Trenches are included in the N-type single crystalline silicon substrate between the alternating continuous N-type emitter regions and segmented P-type emitter regions and in locations of the gaps between segments of the segmented P-type emitter regions.
H01L 31/036 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
H01L 31/06 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier
A high efficiency configuration for a solar cell module comprises solar cells arranged in an overlapping shingled manner and conductively bonded to each other in their overlapping regions to form super cells, which may be arranged to efficiently use the area of the solar module.
A photovoltaic (PV) robotic cleaning device can include a cleaning head configured to apply a vaporized cleaning solution on a portion of a PV collector while the PV robotic cleaning device is traveling over the PV collector, where the vaporized cleaning solution can heat the portion of a PV collector while travelling. The photovoltaic (PV) robotic cleaning device can include a squeegee element coupled to the cleaning head, where the squeegee element can be configured to remove a cleaning solution formed by the vaporized cleaning solution.
Methods of fabricating solar cells using a metal-containing thermal and diffusion barrier layer in foil-based metallization approaches, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes forming a plurality of semiconductor regions in or above a substrate. The method also includes forming a metal-containing thermal and diffusion barrier layer above the plurality of semiconductor regions. The method also includes forming a metal seed layer on the metal-containing thermal and diffusion barrier layer. The method also includes forming a metal conductor layer on the metal seed layer. The method also includes laser welding the metal conductor layer to the metal seed layer. The metal-containing thermal and diffusion barrier layer protects the plurality of semiconductor regions during the laser welding.
H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
H01L 31/0392 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates
H01L 31/036 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
Photovoltaic (PV) cells that can be interconnected with improved interconnect joints to form PV cell strings and PV modules. The improved interconnect joints comprise at least two types of adhesive bonding regions to maximize both electrical conductivity and mechanical strength of interconnect joints coupling terminals of PV cells. The disclosed approaches to PV cell interconnection provide greater manufacturing rates and higher quality PV cell strings and PV modules.
Various improved approaches to ensure proper alignment of a photovoltaic (PV) laminate with a frame and prevent PV module structural defects are described herein. PV laminate-constraining devices, or clips, can inhibit physical deformation of a PV laminate during manufacturing, shipping, and/or installation. PV laminate-constraining features and devices can direct adhesive regions into desired locations and/or inhibit displacement of adhesives during PV module manufacturing.
Multi-operation tools for photovoltaic cell processing are described. In an example, a multi-operation tool includes a conveyor system to move a photovoltaic (PV) cell continuously along a conveyor path through a laser scribing station and an adhesive printing station. Furthermore, the PV cell may be aligned to a laser head of the laser scribing station and a printer head of the adhesive printing station in a single alignment operation prior to being laser scribed and printed with an adhesive in a continuous process.
Location functionality to determine the geospatial location of a PV module is described. This functionality may be performed at the PV module site itself as well as remote from the PV module site. The location functionality may involve the analysis of data collected from the location of the PV module or modules being analyzed as well as data from locations of other PV modules, which are not being analyzed. This data, from other PV modules may be gathered, recorded, and used as a benchmark, or for some other purpose in embodiments.
Indentation approaches for foil-based metallization of solar cells, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes forming a plurality of alternating N-type and P-type semiconductor regions in or above a substrate. The method also includes locating a metal foil above the alternating N-type and P-type semiconductor regions. The method also includes forming a plurality of indentations through only a portion of the metal foil, the plurality of indentations formed at regions corresponding to locations between the alternating N-type and P-type semiconductor regions. The method also includes, subsequent to forming the plurality of indentations, isolating regions of the remaining metal foil corresponding to the alternating N-type and P-type semiconductor regions.
H01L 31/06 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier
H01L 31/0392 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates
H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
79.
PHOTOVOLTAIC MANAGEMENT AND MODULE-LEVEL POWER ELECTRONIC
A photovoltaic (PV) system includes module-level power electronic (MLPE) devices that produce energy. The PV system includes a gateway to receive and send data to MLPE devices. The gateway also connects the PV system with a network, such as a local area network, that allows access to the Internet. The gateway provides functionality within the PV system to perform various processes to improve operation of MLPE devices.
A photovoltaic (PV) module cleaning system can include a robotic cleaning device and a support system. The support system can be configured to provide a metered fill to the robotic cleaning device.
A communication system and method of operating the same that includes, in one embodiment, a transmit filter including a transmit filter capacitor, and a receive filter coupled to the transmit filter. The communication system also includes a switch, coupled to an auxiliary winding of a transformer and to the transmit filter capacitor, configured to alter an impedance of the transmit filter during a receive mode of operation of the communication system. In another embodiment, a transmitter is configured to receive an input data stream, and produce a control signal for a switch-mode power amplifier employing a predetermined data sequence selected by the input data stream thereto.
Methods, systems, and computer readable media are disclosed for maintaining photovoltaic power plant reactive power capability, e.g., through the manipulation of direct current (DC) voltage, In some examples, A control system includes a monitor input for receiving a monitor signal indicative of an input voltage of an inverter system and a control output for outputting a control signal to a voltage-clipping device of a solar panel system supplying a solar output voltage to the inverter system. The control system includes a control circuit configured to perform operations comprising: determining, using the monitor signal, that the input voltage of the inverter system exceeds a threshold voltage; and in response to determining that the input voltage of the inverter system exceeds the threshold voltage, causing, using the control signal, the voltage-clipping device to reduce the solar output voltage by shorting out one or more photovoltaic solar cells of the solar panel system.
H02S 50/00 - Monitoring or testing of PV systems, e.g. load balancing or fault identification
H02S 40/32 - Electrical components comprising DC/AC inverter means associated with the PV module itself, e.g. AC modules
G01R 31/36 - Arrangements for testing, measuring or monitoring the electrical condition of accumulators or electric batteries, e.g. capacity or state of charge [SoC]
83.
ENCAPSULANT BONDING METHODS FOR PHOTOVOLTAIC MODULE MANUFACTURING
Various improved approaches to prevent solar cell motion during manufacturing of PV laminates and modules are described herein. Disclosed contactless heating methods comprise positioning a plurality of solar cells on a layer of encapsulant and heating an encapsulant bonding region within the first encapsulant layer to a temperature sufficient to adhere the plurality of solar cells to the superstrate. Compared to some heat-tacking methods and manual taping, the contactless heating methods described herein provide an accurate, high-throughput approach to inhibiting solar cell shifting during PV module manufacture.
Methods and systems include moving a mobile communication unit along a plurality of module units, and exchanging data with one of the plurality of module units based at least upon the mobile communication unit being in proximity to the one of the plurality of module units.
Differential power processing (DΡΡ) converters are used within circuit architecture of solar power modules to process the mismatched power between solar elements in a power module. The DPP converters use various topologies to process the mismatched power. These topologies can include a housekeeping power supply where the housekeeping power is coupled to the main bus, or, through various other tapping topologies, including to a subset of PV cell substrings.
H02M 3/155 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
A high efficiency configuration for a solar cell module comprises solar cells arranged in an overlapping shingled manner and conductively bonded to each other in their overlapping regions to form super cells, which may be arranged to efficiently use the area of the solar module. Rear surface electrical connections between solar cells in electrically parallel super cells provide alternative current paths (i.e., detours) through the solar module around damaged, shaded, or otherwise underperforming solar cells.
H01L 31/042 - PV modules or arrays of single PV cells
H01L 31/05 - Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
H02S 40/36 - Electrical components characterised by special electrical interconnection means between two or more PV modules, e.g. electrical module-to-module connection
87.
THERMAL MANAGEMENT OF SYSTEMS WITH ELECTRIC COMPONENTS
Methods, systems, and computer readable media are disclosed for thermal management of a system of one or more electric components. In some examples, the system includes a housing, one or more electric components, one or more temperature sensors on or in the housing, and a thermal management circuit coupled to the electric components and the temperature sensors. The thermal management circuit is configured to monitor the temperature sensors and, based on monitoring the temperature sensors, cause at least a first electric component to curtail power consumption, thereby reducing heat generating by the first electric component.
Methods, systems, and computer readable media are disclosed for monitoring photovoltaic solar systems. In some examples, the system includes a solar power measurement input for coupling to a solar panel system, a measurement circuit configured to measure power produced by the solar panel system using the solar power measurement input, and a data transmission system. The measurement circuit is configured, by virtue of the measurement circuit including electrical components rated to at least a certain tolerance level, to take revenue-grade power measurements from the solar power measurement input with a level of accuracy that meets a national or international metering standard. The data transmission system is configured to transmit the revenue-grade power measurements from the measurement circuit to a remote system.
H02S 50/00 - Monitoring or testing of PV systems, e.g. load balancing or fault identification
G01R 31/36 - Arrangements for testing, measuring or monitoring the electrical condition of accumulators or electric batteries, e.g. capacity or state of charge [SoC]
Enclosures having reconfigurable compartments for routing wiring used to monitor photovoltaic system output are described. In an example, an enclosure includes a housing around a circuitry bay and a wiring bay, and the wiring bay contains movable shrouds and/or partitions to divide the wiring bay into several reconfigurable wiring compartments. High-voltage wiring and low-voltage wiring may be routed through the wiring compartments, and the shrouds and/or partitions may physically and electrically isolate the high-voltage wiring from the low-voltage wiring. A tray disposed in the circuitry bay and include antenna mounts that extend into the wiring bay to isolate antennas mounted on the antenna mounts from electromagnetic interference from electronic components within the circuitry bay.
A photovoltaic (PV) module can include a PV laminate, a frame coupled to a perimeter of the laminate, a junction box that includes a housing for an electrical connection between a plurality of PV cells of the laminate and a plurality of conductors, and an electronics enclosure coupled to the frame. In embodiments, the electronics enclosure can include electronic circuitry that is electrically coupled to the plurality of conductors and to another photovoltaic module.
Approaches for fabricating one-dimensional metallization for solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate and parallel along a first direction to form a one-dimensional layout of emitter regions for the solar cell. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal lines corresponding to the plurality of alternating N-type and P-type semiconductor regions. The plurality of metal lines is parallel along the first direction to form a one-dimensional layout of a metallization layer for the solar cell.
H01L 31/0392 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates
H01L 31/05 - Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
H01L 31/06 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier
H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
Fabricating a semiconductor device can include forming a metal seed region over a substrate. The method can include forming a mask over a first portion of the metal seed region. The method can also include forming a metal region over the metal seed region and removing the mask. The method can include forming metal contact fingers on the semiconductor device, where the forming includes etching the first portion of the metal seed region with an etchant comprising an acid, an oxidizer and chloride ions.
H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
H01L 21/306 - Chemical or electrical treatment, e.g. electrolytic etching
H01L 31/0392 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates
93.
LEAVE-IN ETCH MASK FOR FOIL-BASED METALLIZATION OF SOLAR CELLS
Approaches for fabricating foil-based metallization of solar cells based on a leave-in etch mask, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes metal foil portions in alignment with corresponding ones of the alternating N-type and P-type semiconductor regions. A patterned wet etchant-resistant polymer layer is disposed on the conductive contact structure. Portions of the patterned wet etchant-resistant polymer layer are disposed on and in alignment with the metal foil portions.
H01L 31/0392 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates
H01L 21/306 - Chemical or electrical treatment, e.g. electrolytic etching
Thermal compression bonding approaches for foil-based metallization of solar cells, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes placing a metal foil over a metalized surface of a wafer of the solar cell. The method also includes locating the metal foil with the metalized surface of the wafer. The method also includes, subsequent to the locating, applying a force to the metal foil such that a shear force appears between the metal foil and the metallized surface of the wafer to electrically connect a substantial portion of the metal foil with the metalized surface of the wafer.
H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
H01L 31/0392 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates
H01L 31/06 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier
95.
HIERARCHICAL CONTROL OF A PLURALITY OF POWER SUBSYSTEMS AND METHOD OF OPERATING THE SAME
An apparatus formed with a plurality of power subsystems, and method of operating the same. In one embodiment, the apparatus is formed with plurality of local controllers to control an operating characteristic of at least one of the plurality of power subsystems. A central controller of the apparatus is configured to receive an indication of an overall power produced by the plurality of power subsystems, selectively command a first local controller of the plurality of local controllers to change a value of the operating characteristic of a first power subsystem of the plurality of power subsystems, receive an indication of a change in the overall power in response to the change in the value of the operating characteristic of the first power subsystem, and store, in memory, the change in the value of the operating characteristic of the first power subsystem if the overall power is increased.
Approaches for fabricating wire-based metallization for solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal wires. Each metal wire of the plurality of metal wires is parallel along a first direction to form a one-dimensional layout of a metallization layer for the solar cell.
H01L 31/02 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof - Details
H01L 31/0392 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates
H01L 31/042 - PV modules or arrays of single PV cells
H01L 31/102 - Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier or surface barrier
97.
METALLIZATION AND STRINGING FOR BACK-CONTACT SOLAR CELLS
Metallization and stringing methods for back-contact solar cells, and resulting solar cells, are described. In an example, in one embodiment, a method involves aligning conductive wires over the back sides of adjacent solar cells, wherein the wires are aligned substantially parallel to P-type and N-type doped diffusion regions of the solar cells. The method involves bonding the wires to the back side of each of the solar cells over the P-type and N-type doped diffusion regions. The method further includes cutting every other one of the wires between each adjacent pair of the solar cells.
H01L 31/0392 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates
H01L 31/05 - Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
H01L 31/06 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier
98.
THERMO-COMPRESSION BONDING TOOL WITH HIGH TEMPERATURE ELASTIC ELEMENT
A thermo-compression bonding tool with a high temperature elastic element, and methods of bonding a metal sheet to a substrate using a thermo-compression bonding tool are described. In an example, a system for bonding a metal sheet to a substrate includes a stage to support the substrate and an elastic roller located above the stage. The elastic roller includes a high temperature material. The system also includes a heated backing plate located above the elastic roller. The backing plate is configured to apply pressure and heat to the elastic roller as the elastic roller rolls across a metal sheet disposed above the substrate.
H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
H01L 31/0392 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates
A solar cell can include a substrate, a semiconductor region disposed in or above the substrate, and a conductive contact disposed on the semiconductor region that includes a first conductive region disposed on the semiconductor region, a first barrier region disposed on the first conductive region, a second barrier region disposed on the first barrier region, and a second conductive region disposed over the second barrier region.
H01L 31/04 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof adapted as photovoltaic [PV] conversion devices
H01L 21/306 - Chemical or electrical treatment, e.g. electrolytic etching
H01L 31/0232 - Optical elements or arrangements associated with the device
H01L 31/0288 - Inorganic materials including, apart from doping material or other impurities, only elements of Group IV of the Periodic System characterised by the doping material
H01L 31/0392 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates
100.
HIGH THROUGHPUT CHEMICAL VAPOR DEPOSITION ELECTRODE
Processes and systems to fabricate high throughput, low cost tubular polysilicon feed rods, which can be used as direct feedstock to grow a crystalline silicon material, are disclosed. In an example, a chemical vapor deposition (CVD) process includes depositing polysilicon on a tubular electrode to form a tubular polysilicon feed rod. The tubular polysilicon feed rod may be melted in a float zone process to grow the single-crystalline silicon material.
H01L 31/0392 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates
H01L 31/0368 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including polycrystalline semiconductors
C23C 16/44 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
