Abstract

The present invention provides an assembly comprising a thermally conductive thermoplastic polymer as a heat sink to provide thermal management for an electrical/electronic component and a reaction injection molded (RIM) polyurethane to replace the potting compound typically used in such assemblies. In addition to replacing the potting compound, the cured polyurethane forms the part, such as the base of the LED bulb, which heretofore has been a separate component, thus reducing the number of components and saving a production step.

IPC Classes  ?

• F21V 29/87 - Organic material, e.g. filled polymer compositesThermo-conductive additives or coatings therefor
• F21V 29/77 - Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
• F21K 9/23 - Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
• F21K 9/90 - Methods of manufacture
• F21V 23/00 - Arrangement of electric circuit elements in or on lighting devices
• B29C 67/24 - Shaping techniques not covered by groups , or characterised by the choice of material
• F21V 31/04 - Provision of filling media
• F21Y 105/10 - Planar light sources comprising a two-dimensional array of point-like light-generating elements
• F21Y 115/10 - Light-emitting diodes [LED]
• B29K 75/00 - Use of polyureas or polyurethanes as moulding material
• B29K 669/00 - Use of polycarbonates for preformed parts, e.g. for inserts
• B29L 31/34 - Electrical apparatus, e.g. sparking plugs or parts thereof

Abstract

An LED lighting device includes a light emitting assembly including at least one LED and a wireless network interface connecting the LED lighting device to a network. The wireless network interface includes a RF transceiver. An antenna is in electrical communication with the RF transceiver. A thermally conductive housing receives the light emitting assembly, the thermally conductive housing in thermal communication with the at least one LED. In one aspect the thermally conductive housing is formed of a thermally conductive and electrically nonconductive material. In another aspect, the thermally conductive housing includes a first portion attached to a second portion, wherein the first portion is formed of a first, thermally conductive material and defines an interior cavity receiving the wireless network interface. The second portion is formed of a second, electrically nonconductive material and defines an aperture allowing optical output of the at least one LED to pass therethrough.

IPC Classes  ?

• H01Q 1/26 - SupportsMounting means by structural association with other equipment or articles with electric discharge tube
• H05B 37/02 - Controlling
• F21K 99/00 - Subject matter not provided for in other groups of this subclass
• H05B 33/08 - Circuit arrangements for operating electroluminescent light sources
• F21V 29/77 - Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
• F21V 29/85 - Protecting lighting devices from thermal damageCooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
• F21Y 101/02 - Miniature, e.g. light emitting diodes (LED)

Abstract

The present invention provides an assembly comprising a thermally conductive thermoplastic polymer as a heat sink to provide thermal management for an electrical/electronic component and a reaction injection molded (RIM) polyurethane to replace the potting compound typically used in such assemblies. In addition to replacing the potting compound, the cured polyurethane forms the part, such as the base of the LED bulb, which heretofore has been a separate component, thus reducing the number of components and saving a production step.

IPC Classes  ?

• F21V 29/87 - Organic material, e.g. filled polymer compositesThermo-conductive additives or coatings therefor
• F21K 9/23 - Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
• B29C 67/24 - Shaping techniques not covered by groups , or characterised by the choice of material
• F21K 99/00 - Subject matter not provided for in other groups of this subclass
• F21K 9/90 - Methods of manufacture
• F21V 23/00 - Arrangement of electric circuit elements in or on lighting devices
• F21V 29/77 - Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
• B29K 75/00 - Use of polyureas or polyurethanes as moulding material
• B29K 669/00 - Use of polycarbonates for preformed parts, e.g. for inserts
• B29L 31/34 - Electrical apparatus, e.g. sparking plugs or parts thereof
• F21V 31/04 - Provision of filling media
• F21Y 105/10 - Planar light sources comprising a two-dimensional array of point-like light-generating elements
• F21Y 115/10 - Light-emitting diodes [LED]

Abstract

The present invention provides an assembly comprising a thermally conductive thermoplastic polymer as a heat sink to provide thermal management for an electrical/electronic component and a reaction injection molded (RIM) polyurethane to replace the potting compound typically used in such assemblies. In addition to replacing the potting compound, the cured polyurethane forms the part, such as the base of the LED bulb, which heretofore has been a separate component, thus reducing the number of components and saving a production step.

IPC Classes  ?

• F21V 9/00 - Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

An LED lighting device includes a light emitting assembly including at least one LED and a wireless network interface connecting the LED lighting device to a network. The wireless network interface includes a RF transceiver. An antenna is in electrical communication with the RF transceiver. A thermally conductive housing receives the light emitting assembly, the thermally conductive housing in thermal communication with the at least one LED. In one aspect the thermally conductive housing is formed of a thermally conductive and electrically nonconductive material. In another aspect, the thermally conductive housing includes a first portion attached to a second portion, wherein the first portion is formed of a first, thermally conductive material and defines an interior cavity receiving the wireless network interface. The second portion is formed of a second, electrically nonconductive material and defines an aperture allowing optical output of the at least one LED to pass therethrough.

IPC Classes  ?

• F21S 2/00 - Systems of lighting devices, not provided for in main groups or , e.g. of modular construction

Abstract

The present invention provides a composition containing about 90% to about 30% of at least one amorphous thermoplastic or at least one semi crystalline thermoplastic or a mixture thereof and about 10% to about 70% of expanded graphite, wherein about 90% of the particles of the expanded graphite have a particle size of at least about 200 microns. The inventive compositions may find use in LED heat sink applications.

IPC Classes  ?

• C08L 101/00 - Compositions of unspecified macromolecular compounds
• C08K 3/04 - Carbon
• H01B 1/24 - Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon, or silicon
• C08L 69/00 - Compositions of polycarbonatesCompositions of derivatives of polycarbonates
• F21V 29/00 - Protecting lighting devices from thermal damageCooling or heating arrangements specially adapted for lighting devices or systems

Abstract

In one aspect, an LED lighting apparatus includes an electronic circuit board having a peripheral portion and a central portion that is radially inward of said peripheral portion, said electronic circuit board having an exterior side for optically interfacing with ambient environment during operation and an interior side opposite the exterior side. At least one LED is mounted on the exterior side of the electronic circuit board central portion and a thermally conductive housing encloses said electronic circuit board, said thermally conductive housing formed of a moldable thermally conductive material. The thermally conductive housing defines a first cavity adjacent the central portion of the electronic circuit board exterior side and a second cavity adjacent the central portion of the electronic circuit board interior side, wherein a portion of said thermally conductive housing being overmolded onto said peripheral portion. In a further aspect, a method of manufacturing an LED lighting apparatus is provided.

IPC Classes  ?

• F21K 99/00 - Subject matter not provided for in other groups of this subclass
• F21V 15/01 - Housings, e.g. material or assembling of housing parts
• F21V 31/04 - Provision of filling media
• B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
• F21V 29/00 - Protecting lighting devices from thermal damageCooling or heating arrangements specially adapted for lighting devices or systems
• F21V 19/00 - Fastening of light sources or lamp holders
• B29C 45/00 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor
• F21Y 101/02 - Miniature, e.g. light emitting diodes (LED)
• F21V 17/16 - Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts of the lighting deviceSnap action mounting

Abstract

In one aspect, an LED lighting apparatus includes an electronic circuit board having a peripheral portion and a central portion that is radially inward of said peripheral portion, said electronic circuit board having an exterior side for optically interfacing with ambient environment during operation and an interior side opposite the exterior side. At least one LED is mounted on the exterior side of the electronic circuit board central portion and a thermally conductive housing encloses said electronic circuit board, said thermally conductive housing formed of a moldable thermally conductive material. The thermally conductive housing defines a first cavity adjacent the central portion of the electronic circuit board exterior side and a second cavity adjacent the central portion of the electronic circuit board interior side, wherein a portion of said thermally conductive housing being overmolded onto said peripheral portion.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating