Abstract

A resin molding device according to the present invention includes: a photographing unit for photographing an image of a resin material supplied onto a target object; a molding mechanism for molding a resin molded article using the resin material supplied onto the target object; and a control unit for acquiring the image and controlling the operation of the molding mechanism. The control unit calculates, in each of a plurality of blocks included in the image, the percentage occupied by a region in which the resin material is present or a region in which the resin material is not present, and determines whether or not molding using the resin material by the molding mechanism is possible on the basis of the degree of similarity between a plurality of percentages respectively calculated for the plurality of blocks and a plurality of reference ratios respectively set in advance for the plurality of blocks.

IPC Classes  ?

• B29C 43/58 - Measuring, controlling or regulating

Abstract

A resin molding device according to the present invention comprises: a first mold that is capable of placing a substrate on which an electronic element is mounted; a second mold for forming a cavity between the first mold and the second mold; a transfer mechanism for supplying a resin material to the cavity by a plunger; and a control unit for controlling the moving speed of the plunger on the basis of a volume value of a space in which the resin material in the cavity can be filled in a state in which the substrate is placed in the cavity.

IPC Classes  ?

• H01L 23/28 - Encapsulation, e.g. encapsulating layers, coatings
• B29C 45/02 - Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
• B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
• B29C 45/76 - Measuring, controlling or regulating
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings

Abstract

Provided is a resin molding apparatus that can raise and lower a movable platen with a simple configuration. The resin molding apparatus comprises: a body frame (20) that has a bracket (25); a movable platen (31) that is supported by the body frame (20); a first ball screw (11) that has a first gear (G1); a second ball screw (12) that has a second gear (G2); a servo motor unit (15) that has a drive member (18), the drive member (18) being coupled to the first gear (G1) and the second gear (G2) and driving the first ball screw (11) and the second ball screw (12), thereby raising and lowering the movable platen (31); a holding member (40) that is supported by the bracket (25), holds the servo motor unit (15), and changes the positional relationship of the drive member (18) with respect to the first gear (G1) and the second gear (G2) by moving relative to the bracket (25); and a position adjustment mechanism (45A) that adjusts the relative position of the holding member (40) with respect to the bracket (25).

IPC Classes  ?

• B29C 33/20 - Opening, closing or clamping
• B29C 45/17 - Component parts, details or accessoriesAuxiliary operations
• B29C 45/64 - Mould opening, closing or clamping devices

Abstract

The present invention simplifies a machining apparatus and improves the productivity thereof, and comprises a machining table provided on one surface thereof with a plurality of suction holes capable of holding a sealed substrate by suction, and that has a plurality of through openings which penetrate from the one surface to another surface, a machining mechanism that machines the sealed substrate held by suction to the machining table, and a storage mechanism that directly stores the sealed substrate machined by the machining mechanism to a storage member.

IPC Classes  ?

• B23K 37/04 - Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
• B23K 26/38 - Removing material by boring or cutting

Abstract

To obtain a molding die that allows a positioning pin to be attached to and detached from the main body of the molding die by a simple method.　The molding die includes a first die (10) and a second die disposed facing the first die (10). The first die (10) has a main body (11) provided with an opposing surface (11S) and has a positioning pin (12) that positions an object to be molded (40) held by the first die (10). The positioning pin (12) is provided with a pedestal (13) disposed on the inside of the main body (11) and a tip (14) that can be attached to and detached from the pedestal (13) from the opposing surface (11S) side of the main body (11). The tip (14) has a small-diameter part (14A) that positions the object to be molded (40) by contacting the object to be molded (40). The small-diameter part (14A) has a diameter (D1) smaller than the diameter (D2) of the pedestal (13).

IPC Classes  ?

• B29C 33/30 - Mounting, exchanging or centering
• B29C 43/36 - Moulds for making articles of definite length, i.e. discrete articles
• B29C 45/26 - Moulds

Abstract

The present invention provides a supply jig which is capable of efficiently supplying a mold release film and a resin material.　The present invention is provided with: a film holder which is capable of holding a mold release film; and a resin material holder which is provided with a resin holding part that is capable of holding a resin material, and which can be attached to and detached from the film holder.

IPC Classes  ?

• B29C 43/32 - Component parts, details or accessoriesAuxiliary operations
• B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings

Abstract

The present invention is a conveyance device 6 for conveying a molding object W, that positions and holds a molding object without using a positioning pin, and comprises a holding unit 61 for holding the molding object W, and a multi-joint arm part 62 for moving the holding unit 61. The holding unit 61 includes: a base member 63 connected to a tip part 621 of the multi-joint arm part 62; and a positioning mechanism 64 for positioning the molding object W with respect to the base member 63 in contact with an outer peripheral end surface of the molding object W.

IPC Classes  ?

• H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
• B65G 49/07 - Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
• H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations

Abstract

The present invention improves the throughput of resin molding by efficiently transporting a molding object. The present invention comprises: a transport mechanism 2 that transports a pre-molding substrate W into molding dies 7A, 7B and transports a resin molded article P out from the molding dies 7A, 7B; a first transfer stage 3 on which the pre-molding substrate W is transferred; a second transfer stage 4 on which the resin molded article P is transferred; a supply mechanism 5 for supplying the pre-molding substrate W to the first transfer stage 3; and a recovery mechanism 6 for recovering the resin molded article P from the second transfer stage 4. The transport mechanism 2 has a pre-molding transport part 21 for transporting the pre-molding substrate W from the first transfer stage 3 into the molding dies 7A, 7B, and a post-molding transport part 22 for transporting the resin molded article P out from the molding dies 7A, 7B to the second transfer stage 4. The first transfer stage 3 and the second transfer stage 4 are arranged side by side. The pre-molding transport part 21 and the post-molding transport part 22 are arranged side by side in correspondence with the first transfer stage 3 and the second transfer stage 4.

IPC Classes  ?

• B29C 43/34 - Feeding the material to the mould or the compression means
• B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles

Abstract

This cutting method is for cutting an object (60) which includes: a substrate (63) having an element fixed thereto; and a protective film (67) adhered to the substrate (63) and protecting the element. The method includes: a temperature lowering step for lowering the temperature of the protective film (67) by spraying the same with a fluid from a fluid discharge part (34); a film cutting step for cutting the protective film (67) after the temperature lowering step; and a substrate cutting step for, after the film cutting step, cutting the substrate (63) while spraying the same with a cutting fluid of a temperature higher than that of the fluid.

IPC Classes  ?

• H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
• B26D 1/14 - Cutting through work characterised by the nature or movement of the cutting memberApparatus or machines thereforCutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
• B26D 7/10 - Means for treating work or cutting member to facilitate cutting by heating

Goods & Services

Processing of ceramics; molding of plastic materials; custom molding of synthetic resins for others; processing of plastics; encapsulation of semiconductors; custom manufacture and processing of semiconductor circuits; custom manufacture and processing of semiconductor components; custom manufacture and processing of semiconductor devices; custom manufacture and processing of semiconductor wafers; custom manufacture and processing of semiconductor chips; custom manufacture and processing of semiconductor substrates; custom manufacture and processing of parts for manufacturing semiconductors; assembling and precise processing of electronic parts being the manufacture of microelectronics to the order and specification of others; metalworking; manufacture of optical lenses to the order and specification of others; processing of glass for optical lenses; custom manufacture and processing of optical lenses; processing of glass; assembling, manufacturing and processing of medical apparatus and instruments, namely, manufacture of medical devices to the order and specification of others; ceramic coating services, namely, ceramic PVD (Physical Vapor Deposition) coating and ceramic wet process coating services; PVD (Physical Vapor Deposition) coating and wet process coating services to semiconductor manufacturing machines; PVD (Physical Vapor Deposition) coating and wet process coating services to electronic parts manufacturing machines; PVD (Physical Vapor Deposition) coating and wet process coating services to plastic surfaces; PVD (Physical Vapor Deposition) coating and wet process coating services to plastic processing machines and apparatus; PVD (Physical Vapor Deposition) coating and wet process coating services to cutting tools for machinery; PVD (Physical Vapor Deposition) coating and wet process coating services to metal surfaces; PVD (Physical Vapor Deposition) coating and wet process coating services to metalworking machines; PVD (Physical Vapor Deposition) coating and wet process coating services to ceramic surfaces; PVD (Physical Vapor Deposition) coating and wet process coating services to ceramic processing machines and apparatus; PVD (Physical Vapor Deposition) coating and wet process coating services to glass surfaces; PVD (Physical Vapor Deposition) coating and wet process coating services to glass processing machines and apparatus; custom manufacture of food processing and food treatment machines and tools with a protective surface coating; custom manufacture of medical supplies and prescription pharmaceuticals manufacturing machines and tools with a protective surface coating; custom manufacture of chutes and trays of medical supplies manufacturing machines with a protective surface coating; metal plating of molds for use in industry; processing being the custom manufacture of molds for shaping synthetic resins; integrated circuit etching treatment; wafer foundry, namely, manufacturing of semiconductor wafers for others; custom manufacture of electronic parts; custom manufacture and processing of eyeglass lenses; custom manufacture and processing of loupe lenses; ceramic PVD (Physical Vapor Deposition) coating and ceramic wet process coating services for molds for use in industry and parts for manufacturing semiconductors for the purpose of wear-resistance, heat resistance, corrosion-resistance, and electricity-proofing; ceramic PVD (Physical Vapor Deposition) coating and ceramic wet process coating services for molds for use in industry and parts for manufacturing semiconductors for the purpose of water repellent and antifouling; ceramic PVD (Physical Vapor Deposition) coating and ceramic wet process coating services to conveying machines and loading-unloading machines and apparatus; PVD (Physical Vapor Deposition) coating and wet process coating services to molds for use in industry; PVD (Physical Vapor Deposition) coating and wet process coating services for the application of wear-resistant coating to cutting tools for machinery; PVD (Physical Vapor Deposition) coating and ceramic wet process coating services for optical lenses; PVD (Physical Vapor Deposition) coating and ceramic wet process coating services to parts of machines; PVD (Physical Vapor Deposition) coating and wet process coating services for eyeglass lenses and optical lenses; application of optical, transparent, solar reflective and wear resistant coatings on metallic, organic and mineral substrates, namely, PVD (Physical Vapor Deposition) coating and wet process coating services; PVD (Physical Vapor Deposition) coating and wet process coating services for the application of antifouling coating of electricity generators and solar panels

Goods & Services

Plastic films for use in mold release during manufacture process of semiconductors, integrated circuits, electronic circuits, circuit boards, printed wiring boards and electronic parts; protective resin film having water repellent properties for industrial use; resin film having water repellent properties for industrial use; plastic film having water repellent properties, other than for wrapping; semi-processed plastic in sheet form; plastic substances, semi-processed

Goods & Services

Semiconductor manufacturing machines and parts therefore; molds being parts of machines for manufacturing semiconductors; resin sealing machines for manufacturing semiconductors and parts therefore; cutting machines for manufacturing semiconductors and parts therefore; integrated circuits manufacturing machines and parts therefore; electronic circuits manufacturing machines and parts therefore; circuit boards manufacturing machines and parts therefore; printed wiring boards manufacturing machines and parts therefore; electronic parts manufacturing machines and parts therefore; resin sealing machines for integrated circuits; resin sealing machines for electronic circuits; resin sealing machines for circuit boards; resin sealing machines for printed wiring boards; resin sealing machines for electronic parts; molds being parts of machines for sealing resins of integrated circuits; molds being parts of machines for sealing resins of electronic circuits; molds being parts of machines for sealing resins of circuit boards; molds being parts of machines for sealing resins of printed wiring boards; molds being parts of machines for sealing resins of electronic parts; cutting machines for manufacturing integrated circuits and parts therefore; cutting machines for manufacturing electronic circuits and parts therefore; cutting machines for manufacturing circuit boards and parts therefore; cutting machines for manufacturing printed wiring boards and parts therefore; cutting machines for manufacturing electronic parts and parts therefore; plastic processing machines and parts therefore; molds being parts of machines for processing resins; molds being parts of machines for processing plastics; metalworking machines and parts therefore; molds and press dies being parts of machines for metal-forming; cutting tools for machinery; ceramic processing machines and parts therefore; ceramic cutting machines and parts therefore; glass processing machines and parts therefore; machines and apparatus for manufacturing rubber goods; laser cutting machines for manufacturing semiconductors; laser cutting machines for processing plastics; laser cutting machines for manufacturing electronic parts; laser cutting machines for metalworking; laser cutting machines for processing ceramics; laser cutting machines for processing glass; laser cutting machines for processing rubber; laser cutting machines; laser engraving machines; laser engraving machines for manufacturing semiconductors; electric laser welding machines; finishing machines for metalworking, woodworking and plastics working; cutting machines and parts therefore; industrial paper cutting machines; blades being parts of machines for cutting machines; blades being parts of machines for semiconductor manufacturing machines; blades being parts of machines for electronic parts manufacturing machines; blades being parts of machines for ceramic cutting machines; automobile parts manufacturing machines; machines for manufacturing pharmaceuticals and parts therefore; industrial machine press; cemented carbide cutting tools; molds being parts of machines for use in the manufacture of rubber goods; industrial machine press for correcting distortion of frames of semiconductor substrates; electric metal cutting machines; laser cutting machines

Abstract

To provide a resin molding device capable of preventing an object to be molded from falling even when warpage occurs in the object to be molded.　Provided is a resin molding device which places an object to be molded between an upper mold and a lower mold and performs compression molding, wherein the upper mold is provided with: a first suction mechanism which is formed so as to open to the lower surface of the upper mold, in which a plurality of suction holes for suctioning the object to be molded are formed, and which is capable of suctioning air from at least one first suction hole among the plurality of suction holes; and a second suction mechanism which is capable of suctioning air from at least one second suction hole among the plurality of suction holes, and is capable of suctioning air through the second suction hole independently of the first suction mechanism.

IPC Classes  ?

• B29C 43/36 - Moulds for making articles of definite length, i.e. discrete articles
• B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
• B29C 43/34 - Feeding the material to the mould or the compression means
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings

Abstract

A laser processing apparatus that removes a part of a workpiece by irradiating with laser beams, a region where portions in the workpiece different in material are provided as being aligned in a direction of scanning, and scanning the region with laser beams along the direction of scanning. A controller sets the part of the workpiece as a plurality of processing layers, and in scanning with laser beams, the controller controls an emitter and a scanner based on a processing condition for each of the plurality of processing layers. The processing condition for each of the plurality of processing layers is set based on positions of the portions in the region different in material.

IPC Classes  ?

• B23K 26/364 - Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
• B23K 26/402 - Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators

Goods & Services

Semiconductor manufacturing machines and their parts and fittings; molds [parts of machines] for manufacturing semiconductors; resin sealing machines for manufacturing semiconductors and their parts and fittings; cutting machines for manufacturing semiconductors and their parts and fittings; integrated circuits manufacturing machines and their parts and fittings; electronic circuits manufacturing machines and their parts and fittings; circuit boards manufacturing machines and their parts and fittings; printed wiring boards manufacturing machines and their parts and fittings; electronic parts manufacturing machines and their parts and fittings; resin sealing machines for integrated circuits; resin sealing machines for electronic circuits; resin sealing machines for circuit boards; resin sealing machines for printed wiring boards; resin sealing machines for electronic parts; molds [parts of machines] for sealing resins of integrated circuits; molds [parts of machines] for sealing resins of electronic circuits; molds [parts of machines] for sealing resins of circuit boards; molds [parts of machines] for sealing resins of printed wiring boards; molds [parts of machines] for sealing resins of electronic parts; cutting machines for manufacturing integrated circuits and their parts and fittings; cutting machines for manufacturing electronic circuits and their parts and fittings; cutting machines for manufacturing circuit boards and their parts and fittings; cutting machines for manufacturing printed wiring boards and their parts and fittings; cutting machines for manufacturing electronic parts and their parts and fittings; plastic processing machines and apparatus and their parts and fittings; molds [parts of machines] for processing resins; molds [parts of machines] for processing plastics; metalworking machines and their parts and fittings; molds and dies [parts of machines] for metal-forming; cutting tools for machinery; ceramic processing machines and apparatus and their parts and fittings; ceramic cutting machines and their parts and fittings; glass processing machines and apparatus and their parts and fittings; machines and apparatus for manufacturing rubber goods; laser processing machines for manufacturing semiconductors; laser processing machines for processing plastics; laser processing machines for manufacturing electronic parts; laser processing machines for metalworking; laser processing machines for processing ceramics; laser processing machines for processing glass; laser processing machines for processing rubber; laser marking apparatus; laser marking apparatus for manufacturing semiconductors; laser welding machines; finishing machines for metalworking, woodworking and plastics working; cutting machines and their parts and fittings; industrial cutters; blades for cutting machines; blades for semiconductor manufacturing machines; blades for electronic parts manufacturing machines; blades for ceramic cutting machines; automobile parts manufacturing machines; machines and apparatus for manufacturing pharmaceuticals and their parts and fittings; presses [machines for industrial purposes]; machine elements, not for land vehicles; cemented carbide tools; molds [parts of machines] for use in the manufacture of rubber goods; apparatus for correcting distortion of frames of semiconductor substrates; electric metal cutting machines; laser cutting machines.

Goods & Services

Mold releasing film; plastic semi-worked products; protective resin film having water repellent properties adapted for automobile mirrors; protective resin film having water repellent properties adapted for automobile windows; protective resin film having water repellent properties adapted for automobiles; protective resin film having water repellent properties adapted for bicycles; protective resin film having water repellent properties adapted for window glass; protective resin film having water repellent properties adapted for mirrors [looking glasses]; protective resin film having water repellent properties adapted for furniture; protective resin film having water repellent properties adapted for cooking utensils for household purposes; protective resin film having water repellent properties adapted for kitchen sinks for household purposes; protective resin film having water repellent properties adapted for vanity top sinks and bathroom sinks; protective resin film having water repellent properties adapted for bath tubs; protective resin film having water repellent properties adapted for bathroom walls; protective resin film having water repellent properties adapted for bathroom floor and wash places; protective resin film having water repellent properties adapted for toilet bowls; protective resin film having water repellent properties adapted for toilet tanks; protective resin film having water repellent properties adapted for leather goods; protective resin film having water repellent properties; resin film having water repellent properties; plastic film having water repellent properties, other than for wrapping; plastic film, other than for wrapping; semi-processed plastic in sheet form; plastic substances, semi-processed; plastic sheeting for agricultural purposes; insulators; reinforcing sheets of plastic firm for plastic greenhouse for agricultural purposes; plastic greenhouse film for agricultural purposes.

Goods & Services

Ceramic processing; treatment and processing of plastics; moulding of plastic materials; molding/shaping of synthetic resins; processing of plastics; encapsulation of semiconductors; custom manufacture and processing of semiconductors; custom assembling and precise processing of electronic parts; metalworking; custom manufacture and processing of lenses; custom manufacture and processing of optical lenses; resurfacing of glass; etching of glass; blowing of glass; polishing of glass; custom assembling, manufacturing and processing of medical apparatus and instruments; ceramic coating services; coating services to semiconductor manufacturing machines; coating services to electronic parts manufacturing machines; coating services on plastic surfaces; coating services to plastic processing machines and apparatus; application of protective surface coatings to machines and tools; coating services on metal surfaces; coating services to metalworking machines, coating services on ceramic surfaces; coating services to ceramic processing machines and apparatus; coating services on glass surfaces; coating services to glass processing machines and apparatus; custom manufacture of machines and tools with a protective surface coating; plating of molds; custom processing of synthetic resin-forming molds; integrated circuit etching treatment; wafer foundry; custom manufacture and processing of semiconductor wafer; custom manufacture of electronic parts; custom manufacture and processing of eyeglass lenses; custom manufacture and processing of loupe lenses; ceramic coating services for the purpose of wear-resistant, heat-resistant, corrosion-resistantand electric-proof; ceramic coating services for the purpose of water repellent and antifouling; ceramic coating services to conveying machines and loading-unloading machines and apparatus; coating services to molds; wear-resistant coating for cutting tools for machinery; coating of optical lenses; coating services to parts of machines; coating of eyeglass lens; reinforced coating services to eyeglass lens; coating services, namely optical, transparent, solar reflective and wear-resistant coatings on metallic, organic and mineral substrates; antifouling coating for electricity generators and solar panels.

Abstract

This resin molding system comprises: a molding die (C) which includes a positioning part (37a) for positioning a molding target object (Sa) having a positioning hole (49a) and on which the molding target object (Sa) is placed in a state in which the positioning part (37a) is passed through the positioning hole (49a); and a transport device having a shift mechanism (16) for bringing the positioning hole (49a) into contact with the positioning part (37a) to thereby position the molding target object (Sa) with respect to the positioning part (37a).

IPC Classes  ?

• B29C 33/12 - Moulds or coresDetails thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
• B29C 45/02 - Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
• B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
• B29C 45/76 - Measuring, controlling or regulating

Abstract

The present disclosure relates to an upper die configured to hold a substrate, and a lower die configured to be clamped with the upper die and has a cavity. The lower die includes a pot that is communicably connected to a resin injection port provided on the bottom surface of the cavity, and where the resin material is contained, an injection plunger is advanced and retracted inside the pot to inject the resin material into the cavity via the resin injection port, a resin reservoir that is connected to a discharge port provided on the bottom surface of the cavity communicably, and where resin material flown out of the cavity accumulates, a suction hole that is connected to the resin reservoir and that is configured to suction the air via the resin reservoir, through the discharge port, and a switching plunger.

IPC Classes  ?

• B29C 45/02 - Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
• B29C 45/00 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor
• B29C 45/34 - Moulds having venting means
• B29L 7/00 - Flat articles, e.g. films or sheets

Abstract

The present invention is a resin molding device that causes a forming mold to slide in a sliding direction intersecting a mold closing direction, and that reduces wear which occurs due to the sliding of the forming mold. The resin molding device comprises: a mold closing mechanism 10 for closing forming molds 51, 52 together via base members 2-4; a forming mold sliding mechanism 20 for causing the forming molds 51, 52 to slide between a closed position Q at which to close the molds and a protruding position R located further outward than the base members 2-4 in the sliding direction intersecting the mold closing direction; and a spacing modification mechanism 30 for modifying a spacing between mutually opposing surfaces of the base members 2-4 and the forming molds 51, 52 when the forming mold sliding mechanism 20 causes the forming molds 51, 52 to slide between the closed position Q and the protruding position R.

IPC Classes  ?

• B29C 43/36 - Moulds for making articles of definite length, i.e. discrete articles
• B29C 33/68 - Release sheets
• B29C 43/34 - Feeding the material to the mould or the compression means
• B29C 43/50 - Removing moulded articles

Abstract

A conveyor (10) conveys a work (Sa) to be molded, while holding the work (Sa), and places the work (Sa) on a mold (C) which has positioning parts (37) for positioning the work (Sa) and in which the positioning parts (37) are covered with a film (F). The conveyor (10) is equipped with: a work-holding part (13) which holds the work (Sa); a work-pressing part (14) which presses the work (Sa) toward the mold (C) when the work (Sa) released from the holding by the work-holding part (13) is placed on the mold (C); and a film perforation mechanism (16) which makes the positioning parts (37) perforate the film (F) before the work-pressing part (14) presses the work (Sa).

IPC Classes  ?

• B29C 33/12 - Moulds or coresDetails thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
• B29C 33/68 - Release sheets
• B29C 45/02 - Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
• B29C 45/17 - Component parts, details or accessoriesAuxiliary operations
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings

Abstract

The present invention is for producing a resin molded article while satisfying conditions such as maintaining the temperature of a mold, reducing the contamination of a mold, shortening the takt time, or the like. The present invention is provided with: a mold clamping mechanism 10 for clamping molds 51, 52 via base members 2 to 4; a mold sliding mechanism 20 for sliding the molds 51, 52 to a projecting position R that is positioned on the outer side of the base members 2 to 4; transport mechanisms 13, 18 for transporting an object to be transported to the molds 51, 52 at the projecting position R; and a control unit COM for controlling the mold sliding mechanism 20 and the transport mechanisms 13, 18. The control unit COM controls so that the moving operation of the transport mechanisms 13, 18 to transport positions X1, X2 for transporting the object to be transported to the molds 51 and 52 at the projecting position R is started before the sliding operation to the projecting position R by the mold sliding mechanism 20, or alternatively, the control unit COM controls so that the sliding operation overlaps with at least a part of the moving operation.

IPC Classes  ?

• B29C 45/76 - Measuring, controlling or regulating
• B29C 33/20 - Opening, closing or clamping
• B29C 33/30 - Mounting, exchanging or centering
• B29C 43/34 - Feeding the material to the mould or the compression means
• B29C 45/64 - Mould opening, closing or clamping devices

Abstract

A method for manufacturing a semiconductor device includes a resin sealing step for sealing a semiconductor chip with a resin material in a state where the semiconductor chip is bonded on a lead frame in which a depressed portion is formed, a laser light irradiation step for irradiating the depressed portion with laser light to remove the resin material in the depressed portion by the laser light so that a part of the resin material remains in the depressed portion, and a cutting step for cutting a bottom face of the depressed portion in the lead frame together with the part of the resin material in the depressed portion.

IPC Classes  ?

• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
• H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
• H01L 23/495 - Lead-frames

Abstract

A lead frame has a back surface having a multiple-irradiated region that is irradiated with laser light scanned in a first scan step and laser light scanned in a second scan step, a unit resin molded product that is formed in a cutting step has corner regions overlapping the multiple-irradiated region of the lead frame, and the multiple-irradiated region prevents the laser light emitted to the back surface from reaching portions of the resin material on the front surface of the lead frame, the portions being located at a position corresponding to the corner regions.

IPC Classes  ?

• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
• B23K 26/38 - Removing material by boring or cutting
• H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
• H01L 23/495 - Lead-frames

Abstract

223233) are substituted by atoms of a group 4A element; and the refractive index of at least one of the films that are adjacent to the high refractive index film (12) is lower than the refractive index of the high refractive index film (12).

IPC Classes  ?

• B32B 7/023 - Optical properties
• B32B 9/00 - Layered products essentially comprising a particular substance not covered by groups
• G02B 1/14 - Protective coatings, e.g. hard coatings
• G02B 1/115 - Multilayers

Abstract

A resin supply device includes a resin supply mechanism configured to contain and supply a resin material; a nozzle made of an elastic material and having an ejection outlet for ejecting the resin material from the resin supply mechanism; and a clamp mechanism configured to press a tip of the nozzle from outside to shape the ejection outlet into three or more fold rotational symmetry about an axis of the nozzle and change an opening area of the ejection outlet.

IPC Classes  ?

• B29C 43/34 - Feeding the material to the mould or the compression means
• B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles

Abstract

HHH, releases electrical connection to the motor 31a to cause inertial rotation of the motor 31a.

IPC Classes  ?

• H02P 29/00 - Arrangements for regulating or controlling electric motors, appropriate for both AC and DC motors
• B29C 43/34 - Feeding the material to the mould or the compression means

Abstract

The present invention is for cleaning a material holding frame for conveying a resin material and efficiently collecting dust generated by the cleaning and provides a cleaning device 30 for cleaning a material holding frame 10 for conveying a resin material J, the cleaning device 30 being provided with: a stage 31 on which the material holding frame 10 is placed; a first cleaning body 32 which is provided on the stage 31 and cleans an inner peripheral surface 10a of the material holding frame 10 placed on the stage 31; and a dust collecting port 33 which is provided on the stage 31 and collects dust generated by cleaning the material holding frame 10.

IPC Classes  ?

• B29C 43/34 - Feeding the material to the mould or the compression means
• B08B 5/04 - Cleaning by suction, with or without auxiliary action
• B29C 43/02 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings

Abstract

This cutting system includes a cutting mechanism and a control unit. The cutting mechanism cuts an object to be cut. The control unit controls the cutting mechanism so as to manufacture a cut article by cutting the object to be cut according to cutting conditions. The cutting conditions include a plurality of factors. The control unit: acquires a plurality of levels for each factor included in the cutting conditions; generates, according to a testing planning method, a plurality of combinations each of which is a combination of levels selected one by one for each factor; controls the cutting mechanism to cut the object to be cut according to each of the plurality of combinations so as to manufacture a cutting article for each combination of levels; and determines, for each factor, a level for main production or a level to be set as a level candidate for main production, on the basis of an evaluation value of each cut article manufactured for each combination of levels.

IPC Classes  ?

• H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
• B24B 27/06 - Grinders for cutting-off
• B24B 49/00 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or workArrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation

Abstract

Provided is a laser processing device capable of performing laser processing while efficiently sucking up dust. This laser processing device comprises: a stage (60); an outer peripheral wall section (30) that is arranged such that a hollow space (S) extends from a position near the stage (60) to a position distant from the stage (60); a cylindrical wall section (20) that divides the hollow space (S) into an inner space (S1) and an outer space (S2); an irradiation unit (40) that emits a laser beam (L) such that the laser beam passes through the inner space (S1) and irradiates a workpiece (W); a transparent member (50) that is provided so as to close the inner space (S1); and a lid member (10) that has a first opening (11) and is arranged between the cylindrical wall section (20) and the outer peripheral wall section (30) so as to close the outer space (S2). The cylindrical wall section (20) has a second opening (22) at a position that is nearer to the stage (60) than the transparent member (50) is to the stage (60).

IPC Classes  ?

• B23K 26/16 - Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
• B23K 26/36 - Removing material

Abstract

Provided is a method for producing a resin molded article, the method suppressing the occurrence of wrinkles in a mold release film during compression molding using the mold release film, and also suppressing the formation of resin projections that may drop during conveyance of the resin molded article after resin molding.　In the method for producing a resin molded article according to the present disclosure: in a resin molding step, a molding object is disposed between an upper mold and a lower mold (200), a mold release film is disposed on the bottom surface and the side surface of a cavity (200A), and a resin molded article is produced by performing resin molding by means of compression molding, in which a molding mold is clamped, with a resin material being disposed on the mold release film; and in a conveyance step, the molding mold is opened after the resin molding step, and the resin molded article is taken out from the molding mold and conveyed. At the upper surface of a lower-mold side surface member (201), a depth difference (201D) that is equal to or less than the thickness of the mold release film is formed in a position at which the upper surface is adjacent to the inner peripheral surface of the lower-mold side surface member (201).

IPC Classes  ?

• B29C 33/68 - Release sheets
• B29C 43/34 - Feeding the material to the mould or the compression means
• B29C 43/50 - Removing moulded articles

Abstract

Provided are a cutting device, a cutting method, and a method for manufacturing a cut product, with which it is possible to perform accurate half-cuts with little variability.　The cutting device according to the present invention comprises a table for holding an object to be cut, a cutting mechanism having a blade capable of cutting the object to be cut, a detecting unit for detecting contact between the blade and an upper surface of the object to be cut, and a control unit for controlling the cutting mechanism, wherein the control unit controls a height-direction position of the blade when cutting the object to be cut on the basis of a height position of the blade when the detecting unit detects contact between the blade and the upper surface of the object to be cut.

IPC Classes  ?

• B24B 47/22 - Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
• B24B 27/06 - Grinders for cutting-off
• H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions

Abstract

The present invention, in order to efficiently suction gas generated from resin molding, provides a transport mechanism 6 that transports a transported object P from an upper mold 3 or a lower mold 4 that has been opened, the transport mechanism 6 comprising a body unit 60 that advances into a space between the upper mold 3 and lower mold 4 that have been opened, wherein suction ports 6x for suctioning gas are formed in a tip-end surface 60a in the advancing direction of the body unit 60.

IPC Classes  ?

• B29C 39/36 - Removing moulded articles
• B29C 33/44 - Moulds or coresDetails thereof or accessories therefor with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles
• B29C 33/70 - Maintenance
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings

Abstract

Provided is a shaping mold by which a reduction in costs can be achieved.　A shaping mold according to the present invention comprises one mold, and another mold having a cavity in which a mold release film is disposed. The other mold comprises a main surface member and a side surface member. The side surface member comprises: a first adsorption part that is formed on a first opposing surface opposing the one mold and adsorbs the mold release film; a second adsorption part that is formed on the first opposing surface further to the cavity side than the first adsorption part and adsorbs the mold release film; and a suctioning path for suctioning air from the first adsorption part and the second adsorption part. The suctioning path is branched into a first branched path and a second branched path, the first branched path having one end side in the circulation direction of air connected to a suctioning device and the other end side connected to the first adsorption part, and the second branched path being connected to the second adsorption part. The minimum cross-sectional area of a cross section of the second branched path is smaller than the minimum cross-sectional area of a cross section of the first branched path.

IPC Classes  ?

• B29C 33/68 - Release sheets
• B29C 43/36 - Moulds for making articles of definite length, i.e. discrete articles

Abstract

The resin-molding device comprises: a molding die having a first mold that includes a pot block and a second mold disposed opposite the first mold; a clamping mechanism for clamping the molding die; a position adjustment mechanism (20) for adjusting the position of an edge (Fa) of a release film (F) supplied to the first mold; and a control unit that controls the operation of the position adjustment mechanism (20). The position adjustment mechanism (20) includes columnar rollers (21, 22) that transport the release film (F) and a sensor (23) that detects the position of the edge (Fa) of the release film (F). The control unit can perform control to tilt the columnar rollers (21, 22), taking the transport direction (V) of the release film (F) as the axis, based on the results of detection of the position of the edge (Fa) of the release film (F) by the sensor (23).

IPC Classes  ?

• B29C 45/02 - Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
• B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
• B29C 45/17 - Component parts, details or accessoriesAuxiliary operations
• B29C 33/68 - Release sheets

Abstract

A compression molding die includes a first mold and a second mold. The first mold includes a bottom surface member and a side surface member. A space is providable in the first mold by a step of at least one of an outer peripheral surface of the bottom surface member and an inner peripheral surface of the side surface member. The first mold includes a gas inlet capable of introducing gas into the space, a gas outlet through which the gas introduced into the space is dischargeable, and a seal member below the space.

IPC Classes  ?

• B29C 33/72 - Cleaning
• B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
• B29C 43/36 - Moulds for making articles of definite length, i.e. discrete articles

Abstract

Provided are: a discharge device capable of controlling the discharge amount of a liquid resin with high accuracy; a resin molded article manufacturing device, and a resin molded article manufacturing method.　This discharge device (100) comprises a plunger (20) configured to be movable in a first direction and a second direction inside a cartridge (10). In the plunger (20), a flow passage (23) is provided which enables a gas to flow between a first side where the liquid resin (13) is located and a second side opposite the first side. A check valve (50) is provided which enables the gas to flow from the first side to the second side when the plunger (20) has moved in the first direction and which prevents the gas from flowing from the second side to the first side when the plunger (20) has moved in the second direction.

IPC Classes  ?

• B29C 43/34 - Feeding the material to the mould or the compression means
• B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles

Abstract

A method for producing a resin molded product which does not use a spreading member for spreading a resin and achieves applying a liquid resin in a short time even when an area to be applied with the liquid resin is large. The method includes: applying liquid resin (21) on film (11), and performing resin molding with liquid resin (21) applied in the applying the liquid resin, wherein the applying the liquid resin includes: supplying the liquid resin (21) on a part of a surface of film (11) on a side to be applied with liquid resin (21), spreading liquid resin (21) on a surface of a side supplied with liquid resin (21) in film (11) by folding film (11) supplied with liquid resin (21) such that the side supplied with liquid resin (21) be inside, and opening film (11) folded in the spreading liquid resin (21).

IPC Classes  ?

• B29C 41/12 - Spreading-out the material on a substrate
• B29L 31/34 - Electrical apparatus, e.g. sparking plugs or parts thereof
• H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components

Abstract

The present invention provides a molding mold that can prevent molding defects and mold-release defects in resin molded articles.　A molding mold according to the present invention comprises one mold and another mold that is opposite the one mold and has a cavity that is provided with a mold-release film. The other mold comprises a principal surface member that forms a principal surface of the cavity and a side surface member that forms a side surface of the cavity. An opposing surface of the side surface member that is opposite the first mold has a mold-release film suction hole that suctions the mold-release film and includes a plurality of first suction holes and second suction holes that link adjacent first suction holes. At the opposing surface, the first suction holes are longer than the second suction holes in the direction orthogonal to the direction in which the second suction holes extend to link adjacent first suction holes.

IPC Classes  ?

• B29C 33/68 - Release sheets
• B29C 43/36 - Moulds for making articles of definite length, i.e. discrete articles

Abstract

The present invention provides a mold comprising a mold body that holds an object to be molded and has a cavity into which a resin material is supplied, wherein the mold body has an upper mold, a lower mold including a pot block in which pots are formed to be filled with the resin material, and an intermediate mold (IM) which is located between the upper and lower molds and which has a first surface (81) that faces the object to be molded. The intermediate mold (IM) has a body member (86) with gates (84) for supplying the resin material to the cavity, an outer frame member (87) disposed on the periphery of the body member (86), and a holding mechanism (88) that holds the body member (86) in the outer frame member (87). The body member (86) and the outer frame member (87) are separable.

IPC Classes  ?

• B29C 45/26 - Moulds
• B29C 33/12 - Moulds or coresDetails thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
• B29C 33/38 - Moulds or coresDetails thereof or accessories therefor characterised by the material or the manufacturing process
• B29C 45/02 - Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
• B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
• B29C 45/38 - Cutting-off equipment for sprues or ingates
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings

Abstract

This cutting device is equipped with an imaging part, a first processing unit, and a second processing unit. The imaging part captures an image of some or all of a plurality of cut articles to thereby produce a captured image. The first processing unit sets a plurality of inspection areas in the captured image. The second processing unit inspects the appearances of the cut articles captured in the captured image, on the basis of images contained in the plurality of inspection areas of the captured image. The first processing unit carries out assessment processing of assessing whether a portion of a side of any of the cut articles is included in a given number of pixels, which are consecutive pixels along a first direction in the captured image, on the basis of each pixel value of the given number of pixels. The first processing unit repeatedly carries out the assessment processing on the given number of pixels lying in a different position, thereby setting at least some of the plurality of inspection areas.

IPC Classes  ?

• H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
• B24B 27/06 - Grinders for cutting-off
• B24B 49/12 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or workArrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

Goods & Services

Semiconductor manufacturing machines and their parts and fittings; semiconductor manufacturing machines incorporating testing unit; molds being parts of machines for manufacturing semiconductors; resin sealing machines for manufacturing semiconductors and their parts and fittings; resin sealing machines for manufacturing semiconductors incorporating testing unit; cutting machines for manufacturing semiconductors and their parts and fittings; cutting machines for manufacturing semiconductors incorporating testing unit; integrated circuits manufacturing machines and their parts and fittings; integrated circuits manufacturing machines incorporating testing unit; electronic circuits manufacturing machines and their parts and fittings; electronic circuits manufacturing machines incorporating testing unit; circuit boards manufacturing machines and their parts and fittings; circuit boards manufacturing machines incorporating testing unit; printed wiring boards manufacturing machines and their parts and fittings; printed wiring boards manufacturing machines incorporating testing unit; electronic parts manufacturing machines and their parts and fittings; resin sealing machines for integrated circuits and their parts and fittings; resin sealing machines for electronic circuits and their parts and fittings; resin sealing machines for circuit boards and their parts and fittings; resin sealing machines for printed wiring boards and their parts and fittings; resin sealing machines for electronic parts and their parts and fittings; molds being parts of machines for sealing resins of integrated circuits and their parts and fittings; molds being parts of machines for sealing resins of electronic circuits and their parts and fittings; molds being parts of machines for sealing resins of circuit boards and their parts and fittings; molds being parts of machines for sealing resins of printed wiring boards and their parts and fittings; molds being parts of machines for sealing resins of electronic parts and their parts and fittings; cutting machines for manufacturing integrated circuits and their parts and fittings; cutting machines for manufacturing electronic circuits and their parts and fittings; cutting machines for manufacturing circuit boards and their parts and fittings; cutting machines for manufacturing printed wiring boards and their parts and fittings; cutting machines for manufacturing electronic parts and their parts and fittings; plastic processing machines and apparatus and their parts and fittings; molds being parts of machines for processing resins; molds being parts of machines for processing plastics; metalworking machines and their parts and fittings; molds and dies being parts of machines for metal-forming; cutting tools for machinery; ceramic processing machines and apparatus and their parts and fittings; ceramic cutting machines and their parts and fittings; glass processing machines and apparatus and their parts and fittings; machines and apparatus for manufacturing rubber goods; laser processing machines for manufacturing semiconductors; laser processing machines for processing plastics; laser processing machines for manufacturing electronic parts; laser processing machines for metalworking; laser processing machines for processing ceramics; laser processing machines for processing glass; laser processing machines for processing rubber; laser marking apparatus; laser marking apparatus for manufacturing semiconductors; laser welding machines; finishing machines for metalworking, woodworking and plastics working; cutting machines and their parts and fittings; metal cutting machines; resin cutting machines; plastic cutting machines; glass cutting machines; paper cutting machines; glass-resin cutting machines; metal-resin cutting machines; semiconductor-resin cutting machines; industrial cutters; blades for cutting machines; blades for semiconductor manufacturing machines; blades for electronic parts manufacturing machines; blades for metal cutting machines; blades for resin cutting machines; blades for plastic cutting machines; blades for ceramic cutting machines; automobile parts manufacturing machines; machines and apparatus for manufacturing pharmaceuticals and their parts and fittings; presses [machines for industrial purposes]; machine elements, not for land vehicles; cemented carbide tools; moulds being parts of machines for use in the manufacture of rubber goods; apparatus for correcting distortion of frames of semiconductor substrates; laser cutting machines. Data communication apparatus and instruments; telecommunication machines and apparatus; computer programs; computer software, recorded; electronic components; computer peripheral devices; personal digital assistants; data inputting device; touchless data inputting device; projectors for stereoscopic images; projectors; lenses for projectors; diagnostic apparatus, not for medical purposes; prerecorded CD-ROMs, DVDs and other data carriers; optical lenses; optical machines and apparatus; laboratory apparatus and instruments; software for diagnostics and troubleshooting; lenses for spectacles. Mold releasing film; plastic film, other than for wrapping; plastic substances, semi-processed; plastic semi-worked products. Repair or maintenance of semiconductor manufacturing machines; repair or maintenance of resin sealing machines for manufacturing semiconductors; repair or maintenance of cutting machines for manufacturing semiconductors; repair or maintenance of electronic parts manufacturing machines; repair or maintenance of resin sealing machines for electronic parts; repair or maintenance of cutting machines for manufacturing electronic parts; repair or maintenance of plastic processing machines and apparatus; repair or maintenance of metalworking machines; repair or maintenance of ceramic processing machines and apparatus; repair or maintenance of glass processing machines and apparatus; repair or maintenance of machines and apparatus for manufacturing rubber goods; repair or maintenance of apparatus for testing semiconductor, printed circuit boards or electronic parts; repair or maintenance of molds. Processing of ceramics; molding/shaping of plastic products; molding/shaping of synthetic resins; processing of plastics; encapsulation of semiconductors; custom manufacture and processing of semiconductors; custom assembling and precise processing of electronic parts; metalworking; custom manufacture and processing of lenses; custom manufacture and processing of optical lenses; processing of glass; custom machining of medical apparatus and instruments; application of coatings to medical apparatus and instruments; custom assembling and manufacturing of medical apparatus and instruments; application of ceramic coatings; application of coatings to semiconductor manufacturing machines; application of coatings to electronic parts manufacturing machines; application of coatings on plastic surfaces; application of coatings to plastic processing machines and apparatus; application of coatings to cutting tools for machinery; application of coatings on metal surfaces; application of coatings to metalworking machines; application of coatings on ceramic surfaces; application of coatings to ceramic processing machines and apparatus; application of coatings on glass surfaces; application of coatings to glass processing machines and apparatus; custom manufacture of machines and tools with a protective surface coating; plating of molds; custom processing of synthetic resin-forming molds. Rental of computers; providing computer programs on data networks; monitoring of computer systems to detect breakdowns; computer programming; technological advice relating to computers, automobiles and industrial machines.

Abstract

This resin-molding device comprises: a first module; a second module; a third module; and a transport mechanism. The first module supplies a release film. The second module mounts a liquid resin on the release film. The third module performs resin molding by clamping a molding die in a state where the release film having the liquid resin mounted thereon is disposed in the molding die. The second module includes a first stage and a second stage. The transport mechanism starts transporting the release film from the first module to the second stage while the liquid resin is being supplied to the release film that has been at least temporarily disposed on the first stage.

IPC Classes  ?

• B29C 39/26 - Moulds or cores
• B29C 33/36 - Moulds or coresDetails thereof or accessories therefor movable, e.g. to or from the moulding station continuously movable
• B29C 43/34 - Feeding the material to the mould or the compression means
• B29C 43/36 - Moulds for making articles of definite length, i.e. discrete articles

Abstract

Provided is a cutting apparatus that is capable of discharging mill ends more reliably.　This cutting apparatus comprises: a processing table which is capable of moving along a linear moving direction; a cutting mechanism for cutting a cutting object placed on the processing table; a receiving member which is formed below the processing table along the moving direction and which has a groove portion that is capable of receiving mill ends resulting from the cutting of the cutting object by the cutting mechanism; a mobile body which is capable of moving along the moving direction; and a removing member that is provided to the mobile body, that is disposed so as to abut on the groove portion, and that removes the mill ends from the groove portion.

IPC Classes  ?

• B23Q 11/00 - Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling workSafety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
• B23D 59/00 - Accessories specially designed for sawing machines or sawing devices
• B24B 27/06 - Grinders for cutting-off
• B26D 1/18 - Cutting through work characterised by the nature or movement of the cutting memberApparatus or machines thereforCutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a movable axis mounted on a movable carriage
• B26D 7/18 - Means for removing cut-out material or waste
• H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions

Abstract

The present invention provides a method for manufacturing an optical component that makes it possible to position plates with respect to each other with good precision.　Provided is a method for manufacturing an optical component in which an optical component is manufactured by joining two or more plates having an optical element part, said method comprising: a first positioning step for causing a pair of facing surfaces of each first notch part of a first plate, which are opposite each other, to both come into contact with a positioning member, said first plate having at least two first notch parts formed along two directions orthogonal to each other; a second positioning step for causing a pair of facing surfaces of each second notch part of a second plate, which are opposite to each other, to both come into contact with the positioning member, said second plate having at least two second notch parts formed along two directions orthogonal to each other; and a joining step for joining the first plate and the second plate.

IPC Classes  ?

• G02B 7/00 - Mountings, adjusting means, or light-tight connections, for optical elements
• B29C 45/00 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor
• G02B 3/00 - Simple or compound lenses

Abstract

A method for producing a resin molded product comprises conveying a molding die maintenance member including a plate-like support and a molding die maintenance resin from a common storage to a molding die for resin molding including an upper die and a lower die, clamping the molding die in a state where the molding die maintenance member is placed between the upper die and the lower die of the molding die, performing maintenance by heating the molding die maintenance member after the clamping the molding die, conveying the molding die maintenance member from the molding die, conveying a substrate from the storage to the molding die, and clamping the molding die in a state where the substrate is placed between the upper die and the lower die of the molding die.

IPC Classes  ?

• B29C 33/72 - Cleaning

Abstract

A resin molding device includes: a lower mold on which a substrate is placed; an upper mold in which a cavity is formed by a side block and a cavity block provided so as to be capable of ascending and descending vertically with respect to the side block; a clamp mechanism which clamps the lower mold and the upper mold; a transfer mechanism which supplies a resin material to the cavity by a plunger; and a controller which performs first final adjustment control for adjusting a clamp load of the clamp mechanism to a final clamp load after the cavity has been filled with the resin material supplied from the transfer mechanism and which performs second final adjustment control for driving the plunger after the first adjustment control has been completed and thereby adjusting a plunger load applied to the plunger to a final plunger load.

IPC Classes  ?

• B29C 45/76 - Measuring, controlling or regulating
• B29C 45/02 - Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
• B29C 45/64 - Mould opening, closing or clamping devices
• B29C 45/77 - Measuring, controlling or regulating of velocity or pressure of moulding material

Abstract

Provided is a mold capable of preventing a substrate from falling from an upper mold even when warpage of the substrate occurs.　This mold for molding resin through compression molding comprises: an upper mold in which a plurality of substrate suction holes for sucking a substrate and a plurality of film suction holes for sucking a release film are formed so as to open on a lower surface of the upper mold; a lower mold disposed below the upper mold in the vertical direction; and a plurality of pushing members provided to the upper mold such that the pushing members can move up and down, and a lower end part thereof can protrude downwardly from the lower surface of the upper mold.

IPC Classes  ?

• B29C 43/36 - Moulds for making articles of definite length, i.e. discrete articles

Abstract

The present invention provides a simple configuration which solves troubles, such as clogging, caused by the passage of vertical resin tablets. A resin feeder according to the present invention is equipped with a resin sending part 81 which sends out resin tablets T by vibration, a resin passage part 821 through which the resin tablets T sent out by the sending part 81 pass, and a resin conveyance part 822 which conveys out the resin tablets T that have moved through the resin passage part 821. The resin passage part 821 has: a guide groove 111 which comes into contact with the outer peripheral surfaces of horizontal resin tablets T and guides the horizontal resin tablets T toward the resin conveyance part 822; and inclined contact surfaces 121 which are inclined with respect to the passage direction X in which the horizontal resin tablets T pass toward the resin conveyance part 822 and which can come into contact with the outer peripheral surfaces of vertical resin tablets T.

IPC Classes  ?

• B29C 31/02 - Dispensing from vessels, e.g. hoppers
• B29C 31/04 - Feeding, e.g. into a mould cavity
• B29C 45/02 - Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
• B29C 45/18 - Feeding the material into the injection moulding apparatus
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings

Abstract

The present invention relates to a sheet material positioning device for a sheet material having a base material and a functional material disposed on the base material, the sheet material positioning device comprising: a support mechanism for supporting the sheet material; a sheet table for fixing the sheet material; and a detection unit for detecting the position of the functional material in the planar direction in the sheet material supported by the support mechanism. The sheet material positioning device is configured to fix the sheet material to the sheet table after completion of positioning in which the sheet material is moved relative to the sheet table, on the basis of the position of the functional material detected by the detection unit, so that the functional material is disposed in a specified position relative to the sheet table.

IPC Classes  ?

• B65H 9/00 - Registering, e.g. orientating, articlesDevices therefor
• H01L 23/00 - Details of semiconductor or other solid state devices

Abstract

This warp correction system comprises a warp correction device and a relay unit. The warp correction device corrects warp in a first molded substrate and produces a second molded substrate. The relay unit is disposed between the warp correction device and a machining device on the exterior of the warp correction device. The machining device machines the second molded substrate. The relay unit includes a first conveyance mechanism that receives the second molded substrate from the warp correction device and conveys the second molded substrate to the machining device.

IPC Classes  ?

• H01L 21/50 - Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups or
• H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations

Abstract

A cutting device (100) comprises a sliding door structure (200). The sliding door structure (200) is provided with: a rail cover (21) configured to cover a rail (23) that is configured to enable linear movement of a sliding door (20); an unnecessary article removal member (28) configured to be able to remove an unnecessary article (S) on the rail cover (21); and a holding member (27) configured to bring at least a part of the unnecessary article removal member (28) into contact with the upper surface (21a) of the rail cover (21) and to hold the unnecessary article removal member (28).

IPC Classes  ?

• H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
• B23Q 11/00 - Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling workSafety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
• B23Q 11/08 - Protective coverings for parts of machine toolsSplash guards
• B24B 27/06 - Grinders for cutting-off
• B24B 55/06 - Dust extraction equipment on grinding or polishing machines

Abstract

The present invention provides a production method and a production apparatus, each of which is capable of producing a plurality of semiconductor components from one lead frame.　The semiconductor components each have: a resin portion 21 in which a semiconductor chip is sealed with a resin; and a plurality of lead parts 22 which protrudes in a common direction from one surface of the resin portion 21. A method for producing a semiconductor component according to the present invention comprises: a step in which a lead frame 3 that is provided with a plurality of resin portions 21 is cut so as to separate the plurality of resin portions 21 into individual pieces; and a step in which the lengths of the plurality of lead parts 22 that protrude from each individualized resin portion 21 are extended. With respect to the lead frame 3, the protrusion surface of one resin portion 21, from the protrusion surface the lead parts 22 protruding, and the protrusion surface of another resin portion 21 face each other; and the protrusion ends of two lead parts 22 respectively protruding from the two protrusion surfaces, which face each other, are connected to each other.

IPC Classes  ?

• H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings

Abstract

This cutting device cuts an object to be cut. The cutting device comprises a table, a cutting mechanism, and an imaging device. The table holds the object to be cut. The cutting mechanism cuts the object to be cut held by the table. The imaging device captures an image of the object to be cut held by the table. The object to be cut includes a plurality of marks formed in an imaging area by the imaging device. The cutting device additionally comprises a storage unit and a display unit. The storage unit stores an image and the coordinates of each of a plurality of marks serving as a reference. For each of the plurality of marks imaged by the imaging device, the display unit displays a coordinate shift amount obtained by performing comparison with a corresponding mark among the plurality of marks serving as a reference stored in the storage unit.

IPC Classes  ?

• H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
• B23Q 17/00 - Arrangements for indicating or measuring on machine tools
• B23Q 17/24 - Arrangements for indicating or measuring on machine tools using optics
• B24B 27/06 - Grinders for cutting-off
• B24B 49/12 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or workArrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
• B28D 7/00 - Accessories specially adapted for use with machines or devices of the other groups of this subclass

Abstract

A resin-material feeding mechanism is provided with which the total weight of resin tablets can be measured with high accuracy.　The resin-material feeding mechanism comprises: a sending part for successively sending portions of a resin material; a total-weight measurement part for collectively measuring the weight of the portions of the resin material sent out by the sending part; a transfer part where the portions of the resin material sent out by the sending part are transferred to a conveying mechanism which conveys the resin material to a mold; and a movement part for moving the resin material among the sending part, the total-weight measurement part, and the transfer part.

IPC Classes  ?

• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
• B29C 45/02 - Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity

Abstract

The resin molding device comprises: a lower mold on which a substrate is placed; an upper mold in which a cavity is formed by a side block and a cavity block provided so as to be capable of rising and descending vertically with respect to the side block; a clamp mechanism for clamping the lower mold and the upper mold; a transfer mechanism that supplies a resin material to the cavity by means of a plunger; and a controller that uses the relationship between the position of the plunger and a resin filling rate for the cavity calculated on the basis of the volume of a chip arranged on the substrate and the volume of the resin material when performing filling rate correspondence control for controlling operation relating to resin molding triggered as a result of the plunger arriving at a position corresponding to a predetermined resin filling rate.

IPC Classes  ?

• B29C 45/02 - Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
• B29C 45/64 - Mould opening, closing or clamping devices
• B29C 45/34 - Moulds having venting means
• B29C 45/76 - Measuring, controlling or regulating
• B29C 45/77 - Measuring, controlling or regulating of velocity or pressure of moulding material
• B29C 45/80 - Measuring, controlling or regulating of relative position of mould parts

Goods & Services

Semiconductor manufacturing machines and parts therefor; semiconductor manufacturing machines with a testing unit sold as an integral component; molds being parts of machines for manufacturing semiconductors; resin sealing machines for manufacturing semiconductors and parts therefor; resin sealing machines for manufacturing semiconductors with a testing unit sold as an integral component; cutting machines for manufacturing semiconductors and parts therefor; cutting machines for manufacturing semiconductors with a testing unit sold as an integral component; integrated circuits manufacturing machines and parts therefor; integrated circuits manufacturing machines with a testing unit sold as an integral component; electronic circuits manufacturing machines and parts therefor; electronic circuits manufacturing machines with a testing unit sold as an integral component; circuit boards manufacturing machines and parts therefor; circuit boards manufacturing machines with a testing unit sold as an integral component; printed wiring boards manufacturing machines and parts therefor; printed wiring boards manufacturing machines with a testing unit sold as an integral component; electronic parts manufacturing machines and parts therefor; resin sealing machines for integrated circuits and parts therefor; resin sealing machines for electronic circuits and parts therefor; resin sealing machines for circuit boards and parts therefor; resin sealing machines for printed wiring boards and parts therefor; resin sealing machines for electronic parts and parts therefor; molds being parts of machines for sealing resins of integrated circuits and parts therefor; molds being parts of machines for sealing resins of electronic circuits and parts therefor; molds being parts of machines for sealing resins of circuit boards and parts therefor; molds being parts of machines for sealing resins of printed wiring boards and parts therefor; molds being parts of machines for sealing resins of electronic parts and parts therefor; cutting machines for manufacturing integrated circuits and parts therefor; cutting machines for manufacturing electronic circuits and parts therefor; cutting machines for manufacturing circuit boards and parts therefor; cutting machines for manufacturing printed wiring boards and parts therefor; cutting machines for manufacturing electronic parts and parts therefor; plastic processing machines and apparatus and parts therefor; molds being parts of machines for processing resins; molds being parts of machines for processing plastics; metalworking machines and parts therefor; molds and press dies being parts of machines for metal-forming; cutting tools for machinery; ceramic processing machines and parts therefor; ceramic cutting machines and parts therefor; glass processing machines and parts therefor; machines and apparatus for manufacturing rubber goods; laser cutting machines for manufacturing semiconductors; laser trimming machines for manufacturing semiconductors; laser cutting machines for processing plastics; laser trimming machines for processing plastics; laser cutting machines for manufacturing electronic parts; laser trimming machines for manufacturing electronic parts; laser cutting machines for metalworking; laser trimming machines for metalworking; laser cutting machines for processing ceramics; laser trimming machines for processing ceramics; laser cutting machines for processing glass; laser trimming machines for processing glass; laser cutting machines for processing rubber; laser trimming machines for processing rubber; laser marking apparatus, namely, laser marking machines to mark surfaces by oxidation, etching, engraving, foaming, chemical change, or carbonization; laser engraving apparatus for manufacturing semiconductors; electric laser welding machines; finishing machines for metalworking, woodworking and plastics working; cutting machines and parts therefor; metal cutting machines; resin cutting machines; plastic cutting machines; glass cutting machines; paper cutting machines; glass-resin cutting machines; metal-resin cutting machines; semiconductor-resin cutting machines; blades being parts of cutting machines; blades being parts of semiconductor manufacturing machines; blades being parts of electronic parts manufacturing machines; blades being parts of metal cutting machines; blades being parts of resin cutting machines; blades being parts of plastic cutting machines; blades being parts of ceramic cutting machines; automobile parts manufacturing machines; machines and apparatus for manufacturing pharmaceuticals and parts therefor; industrial machine presses; cemented carbide cutting tools; moulds being parts of machines for use in the manufacture of rubber goods; industrial machine press for correcting distortion of frames of semiconductor substrates; laser cutting machines Processing of ceramics; custom molding and shaping of plastic products for others; custom molding and shaping of synthetic resins for others; processing of plastics; encapsulation of semiconductors; custom manufacture and processing of semiconductors; custom assembling and precise processing of electronic parts; metalworking; custom manufacture and processing of lenses; custom manufacture and processing of optical lenses; processing of glass; assembling, manufacturing and processing of medical apparatus and instruments; custom manufacturing of medical apparatus and instruments for others; PVD (Physical Vapor Deposition) coating and wet process coating services for the appliation of coatings to medical apparatus and instruments; application of coatings by ceramics, namely, ceramic PVD (Physical Vapor Deposition) coating and ceramic wet process coating services; PVD (Physical Vapor Deposition) coating and wet process coating services for the application of coatings to semiconductor manufacturing machines; PVD (Physical Vapor Deposition) coating and wet process coating services for the application of coatings to electronic parts manufacturing machines; PVD (Physical Vapor Deposition) coating and wet process coating services for the application of coatings to plastic surfaces; PVD (Physical Vapor Deposition) coating and wet process coating services for the application of coatings to plastic processing machines and apparatus; PVD (Physical Vapor Deposition) coating and wet process coating services for the application of coatings to cutting tools for machinery; PVD (Physical Vapor Deposition) coating and wet process coating services for the application of coatings to metal surfaces; PVD (Physical Vapor Deposition) coating and wet process coating services for the application of coatings to metalworking machines; PVD (Physical Vapor Deposition) coating and wet process coating services for the application of coatings to ceramic surfaces; PVD (Physical Vapor Deposition) coating and wet process coating services for the application of coatings to ceramic processing machines and apparatus; PVD (Physical Vapor Deposition) coating and wet process coating services for the application of coatings to glass surfaces; PVD (Physical Vapor Deposition) coating and wet process coating services for the application of coatings to glass processing machines and apparatus; metal plating of molds; custom manufacturing of synthetic resin-forming molds. Computer peripheral devices; personal digital assistants; projectors for stereoscopic images; optical lenses; lenses for spectacles Plastic films for use in mold release during manufacture process ofsemiconductors, integrated circuits, electronic circuits, circuit boards, printed wiring boards and electronic parts; plastic substances, semi-processed Repair or maintenance of semiconductor manufacturing machines; repair or maintenance of resin sealing machines for manufacturing semiconductors; repair or maintenance of cutting machines for manufacturing semiconductors; repair or maintenance of electronic parts manufacturing machines; repair or maintenance of resin sealing machines for electronic parts; repair or maintenance of cutting machines for manufacturing electronic parts; repair or maintenance of plastic processing machines and apparatus; repair or maintenance of metalworking machines; repair or maintenance of ceramic processing machines and apparatus; repair or maintenance of glass processing machines and apparatus; repair or maintenance of machines and apparatus for manufacturing rubber goods; repair or maintenance of apparatus for testing semiconductor, printed circuit boards or electronic parts; repair or maintenance of molds. Rental of computers; monitoring of computer systems to detect breakdowns; computer programming; technological advice relating to computers, automobiles and industrial machines

Abstract

A conveying device 13 according to the present invention makes it possible to position a molding target with respect to a pot block having an overhang part, and is for conveying a molding target W1 to a lower mold 15 provided to a pot block 141 having an overhang part 141b. The conveying device 13 is provided with: a substrate holding part 3 for holding the molding target W1; and a holding part transfer mechanism 4 for transferring the substrate holding part 3. The holding part transfer mechanism 4 transfers the substrate holding part 3 toward the pot block 141 in a state where the molding target W1 is separated from the lower mold 15, and brings the molding target W1 into contact with a lateral surface 141c below the overhang part 141b in the pot block 141. After the molding target W1 is brought into contact with the lateral surface 141c by the holding part transfer mechanism 4, the substrate holding part 3 releases the hold on the molding target W1.

IPC Classes  ?

• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
• B29C 45/02 - Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
• B29C 45/17 - Component parts, details or accessoriesAuxiliary operations
• H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations

Abstract

In the present invention, a transport mechanism 19, which reliably recovers unnecessary resin on a pot block that has an overhanging part while reliably transporting a resin molded article from a lower mold provided with the pot block, has: a first holding part 20 that holds the resin molded article W2; a second holding part 21 that holds the unnecessary resin K on the pot block 141; a first lifting mechanism 22 that raises the first holding part 20 so that the resin molded article W2 held by the first holding part 20 moves upward underneath the overhanging part 141b; and a horizontal moving mechanism 23 that, in a state in which the first holding part 20 is raised by the first lifting mechanism 22, moves the first holding part 20 horizontally so that the resin molded article W2 held by the first holding part 20 moves out from underneath the overhanging part 141b. In a state in which the resin molded article W2 is moved out from underneath the overhanging part 141b and the second holding part 21 is in contact with the unnecessary resin K on the pot block 141, the lower mold 15 is lowered by a mold clamping mechanism 17, and a plunger 142a is raised relative to the lower mold by a transfer mechanism 142.

IPC Classes  ?

• B29C 33/44 - Moulds or coresDetails thereof or accessories therefor with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles
• B29C 45/02 - Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings

Abstract

A mold (C) comprising: a lower mold (LM) comprising lower-mold cavity blocks (53) and a pot block (54) having a pot (54b) formed; an upper mold (UM) comprising upper-mold cavity blocks (64) and a cull block (65) disposed over the pot block (54) and capable of ascending and descending independently of the upper-mold cavity blocks (64); first elastic members (55), which push the lower-mold cavity blocks (53) toward the upper mold (UM); a plurality of support members (63) which push the upper-mold cavity blocks (64) and the cull block (65) and are elastically deformable; and a second elastic member (66) which pushes the cull block (65) and can cause the cull block (65) to protrude downward from the lower surfaces of the upper-mold cavity blocks (64).

IPC Classes  ?

• B29C 45/02 - Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
• B29C 45/26 - Moulds
• B29C 45/34 - Moulds having venting means
• B29C 33/10 - Moulds or coresDetails thereof or accessories therefor with incorporated venting means
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings

Abstract

A compression mold includes a first mold and a second mold. The first mold includes a side surface member and a bottom surface member. The side surface member includes a step height on a bottom surface member side of the side surface member. The step height includes a first surface of the side surface member, a second surface that extends from the first surface toward the bottom surface member, and a third surface that extends downward from the second surface. The bottom surface member includes an upper surface where a resin material can be arranged and a slide surface that extends downward from the upper surface and is slidable with respect to the third surface of the side surface member. The third surface of the side surface member is not exposed while the resin material is supplied.

IPC Classes  ?

• B29C 43/04 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles using movable moulds
• B29C 43/36 - Moulds for making articles of definite length, i.e. discrete articles
• B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles

Abstract

The present invention enables a reference surface member to reliably contact a side surface of a recess of a molding die, and is directed to a conveyance apparatus that conveys an object to be molded to a molding die in which a recess is formed on a side of a mold surface on which the object to be molded is placed, the conveyance apparatus including: a position reference mechanism having a reference surface serving as a positioning reference of the object to be molded placed on the molding die; and an object-to-be-molded moving mechanism that moves the object to be molded placed on the molding die toward the reference surface.

IPC Classes  ?

• B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
• B29C 45/26 - Moulds

Abstract

Provided are a molding mold, a resin molding device, and a method for manufacturing a resin molded article that enable the prevention of resin leakage.　A molding die (1000) is used in compression molding, and comprises a first die (200) and a second die (100) that are arranged facing each other. The first die (200) is provided with a die main surface member (202) constituting a main surface serving as a bottom surface or a top surface of a die cavity (204), and die lateral surface members (201) constituting lateral surfaces of the die cavity (204). The die cavity (204) is formed by a space enclosed by the die main surface member (202) and the die lateral surface members (201). A resin material (20) can be accommodated inside the die cavity (204). The die lateral surface members (201) are capable of moving up and down relative to the die main surface member (202). The die lateral surface members (201) each have elastic members (203a) and (203b) which are arranged on an opposite side to a side facing the second die (100). The elastic members (203a) and (203b) are arranged so as to be capable of partially differentiating a state in which a force is applied along a planar-shaped outer periphery of the die cavity (204).

IPC Classes  ?

• B29C 33/10 - Moulds or coresDetails thereof or accessories therefor with incorporated venting means
• B29C 33/20 - Opening, closing or clamping
• B29C 43/34 - Feeding the material to the mould or the compression means
• B29C 43/36 - Moulds for making articles of definite length, i.e. discrete articles

Abstract

Provided is a resin molding apparatus capable of taking out an object to be molded that has been stored in a conveyance member to perform resin molding.　The resin molding apparatus comprises: a take-out mechanism that takes out an object to be molded from a conveyance member in which the object to be molded has been stored; a first object to be molded conveyance mechanism that conveys the object to be molded that has been taken out from the conveyance member to a mold; a conveyance member storage part capable of storing the conveyance member from which the object to be molded has been taken out; a conveyance member conveyance mechanism that conveys the conveyance member from which the object to be molded has been taken out to the conveyance member storage part; a mold clamping mechanism that clamps the mold to which the object to be molded has been conveyed to perform resin molding; a second object to be molded conveyance mechanism that conveys the molded object to be molded from the mold; and an object to be molded storage mechanism that stores the object to be molded conveyed from the mold in the conveyance member stored in the conveyance member storage part.

IPC Classes  ?

• B29C 45/02 - Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
• B29C 45/42 - Removing or ejecting moulded articles using means movable from outside the mould between mould parts
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings

Abstract

The method for producing a cleaning brush for a mold (30) for cleaning a mold installed in a resin molding device comprises a step that prepares a channel brush (36) formed by fixing a bristle material (33) to a channel member (35), a step that wraps and fixes the channel brush in a spiral around a shaft member (38), and a step that cuts the tips of the bristle material (33). By cutting the tips of the bristle material (33), short bristle regions (31R) containing bristles (33) having a first length and long bristle regions (32R) containing bristles having a second length longer than the first length are formed in the channel brush on the shaft member (38).

IPC Classes  ?

• B29C 45/17 - Component parts, details or accessoriesAuxiliary operations
• B29C 45/26 - Moulds
• B29C 33/72 - Cleaning
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings

Abstract

The present invention provides a novel electronic component, a production method therefor, and a conductive sheet used for these. Provided is a method for producing an electronic component provided with a conductive layer, said method comprising: a first fixing stage for fixing a pre-covering electronic component, which is an electronic component prior to being covered with a conductive layer, to a first fixing member; a second fixing stage for fixing a conductive sheet to a second fixing member which has a recess; and a conductive layer formation stage for closing together the first fixing member and the second fixing member such that the recess of the second fixing member and the pre-covering electronic component mesh together, and transferring the conductive sheet to the pre-covering electronic component, thereby forming a conductive layer on a surface of the pre-covering electronic component.

IPC Classes  ?

• H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
• H01L 23/00 - Details of semiconductor or other solid state devices
• H05K 1/02 - Printed circuits Details

Abstract

Provided is a laser processing device that enables a film to be stabilized and processed. The present invention comprises: a conveyance mechanism that conveys a film; a holding mechanism that has a pair of holding parts which can at least sandwich and hold lateral portions of the processing range of the film; and a laser mechanism for processing the processing range of the film held by the holding mechanism.

IPC Classes  ?

• B23K 26/382 - Removing material by boring or cutting by boring
• B65H 20/00 - Advancing webs

Abstract

This molding die comprises an upper molding die (20a) and a lower molding die (20b). The upper molding die (20a) or the lower molding die (20b) is provided with a cavity block (21) in which a cavity for accommodating a body section (3a) is formed, and a terminal accommodation section (200) for accommodating a terminal (3b). The terminal accommodation section (200) is provided with a terminal disposition block (23), and an elastic resin (4) between the cavity block (21) and the terminal disposition block (23). A slit (22) is provided in the terminal accommodation section (200).

IPC Classes  ?

• B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
• B29C 45/36 - Moulds having means for locating or centering cores
• B29C 33/12 - Moulds or coresDetails thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels

Abstract

This resin molding device comprises: a resin feeding mechanism (21) that feeds powder-form resin (R) to a feed receiver (F); a shaping mold that includes an upper mold and a lower mold opposing the upper mold, the powder-form resin (R) being disposed between the upper and lower molds; and a mold clamping mechanism that clamps the shaping mold for compression molding. The resin feeding mechanism (21) includes: a rotary body (230) that is shaped as a circular column having a plurality of recesses (232a) in the outer peripheral surface (231) thereof, and that rotates about an axial center (X); a resin feeding unit (220) in which powder-form resin (R) is collected and an opening (223) is formed through which the powder-form resin (R) free-falls and is fed to the rotary body (230); and a paddle member (224) disposed such that one end thereof contacts the outer peripheral surface (231) of the rotary body.

IPC Classes  ?

• B29C 43/34 - Feeding the material to the mould or the compression means
• B29C 31/04 - Feeding, e.g. into a mould cavity
• B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles

Goods & Services

Processing of ceramics; molding/shaping of plastic products; molding/shaping of synthetic resins; processing of plastics; assembling and precise processing of electronic parts; manufacture and processing of lenses; manufacture and processing of optical lenses; processing of glass; assembling, manufacturing and processing of medical apparatus and instruments; application of coatings by ceramics; application of coatings by ceramics for the purpose of wear-resistant, heat-resistant, corrosion-resistant and electric-proof; application of coatings by ceramics for the purpose of water repellent and antifouling; application of coatings for plastic surface; application of coatings for plastic processing machines and apparatus; application of coatings for ceramic surface; application of coatings for ceramic processing machines and apparatus; application of coatings for glass surface; application of coatings for glass processing machines and apparatus; application of coatings for conveying machines and loading-unloading machines and apparatus; custom manufacture of machines and tools with a protective surface coating; coating for eyeglass lens; application of reinforced coating for eyeglass lens; coating of optical lenses; application of optical, transparent, solar reflective and wear-resistant coatings on metallic, organic and mineral substrates; antifouling coating for electricity generators and solar panels.

Abstract

A resin molding apparatus includes: a mold die that is configured to hold an object to be molded, the object including a substrate and a chip on the substrate, and that has a cavity configured to receive a resin material through a gate; a mold clamp mechanism configured to clamp the mold die; and a control section configured to control how the mold die and the mold clamp mechanism are operated, the mold die including: a movable block configured to narrow at least a portion of an internal flow path of the cavity in which internal flow path the chip is not disposed; and a driving mechanism configured to drive the movable block with use of a fluid, the control section being configured to change a driving force of the driving mechanism during resin-molding of the object.

IPC Classes  ?

• B29C 45/02 - Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
• B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
• B29C 45/26 - Moulds
• B29C 45/64 - Mould opening, closing or clamping devices
• B29C 45/76 - Measuring, controlling or regulating
• B29C 45/80 - Measuring, controlling or regulating of relative position of mould parts
• B29C 45/00 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor

Abstract

This method for manufacturing a resin-molded article (31) comprises: a step (S1) for preparing a mold object (3) that has a body (3a) and a terminal (3b) having a flat surface (3c) extending from one end of the body (3a); a step (S2) for bringing an elastic resin (4) into close contact with the terminal (3b); a step (S3) for placing, after the step (S2) for forming a close contact with the elastic resin (4), the mold object (3) in a lower mold (20b) such that the direction orthogonal to the direction in which the flat surface (3c) extends is perpendicular to a molding surface (22d) of the lower mold (20b); and a step (S4) for clamping the lower mold (20b) and an upper mold (20a), and resin molding the mold object (3).

IPC Classes  ?

• B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
• B29C 33/14 - Moulds or coresDetails thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels against the mould wall
• B29C 45/02 - Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity

Goods & Services

Processing of ceramics; molding/shaping of plastic products; molding/shaping of synthetic resins; processing of plastics; encapsulation of semiconductors; manufacture and processing of semiconductors; assembling and precise processing of electronic parts; metalworking; manufacture and processing of lenses; manufacture and processing of optical lenses; processing of glass; assembling, manufacturing and processing of medical apparatus and instruments; application of coatings by ceramics; application of coatings by ceramics for the purpose of wear-resistant, heat-resistant, corrosion-resistant and electric-proof; application of coatings by ceramics for the purpose of water repellent and antifouling; application of coatings for semiconductor manufacturing machines; application of coatings for electronic parts manufacturing machines; application of coatings for plastic surface; application of coatings for plastic processing machines and apparatus; application of coatings for cutting tools for machinery; application of coatings for metal surface; application of coatings for metalworking machines; application of coatings for ceramic surface; application of coatings for ceramic processing machines and apparatus; application of coatings for glass surface; application of coatings for glass processing machines and apparatus; application of coatings for conveying machines and loading-unloading machines and apparatus; custom manufacture of machines and tools with a protective surface coating; plating of molds; processing of molds for shaping synthetic resins; application of coatings for molds; wear-resistant coating for cutting tools for machinery; coating of optical lenses.

Abstract

The present invention is to improve the quality and appearance of a second molded product such as a secondary molded product obtained by further resin-molding a first molded product such as a primary molded product, for example. The present invention is a method for manufacturing a resin molded product in which a second molded product is obtained by further performing resin molding on a resin-molded first molded product using a first mold with a cavity formed and a second mold facing the first mold, the method including a disposing step of disposing the first molded product in the cavity and disposing a resin material on the first molded product, and a mold clamping step of clamping the first mold and the second mold after the disposing step.

IPC Classes  ?

• B29C 43/14 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles in several steps
• B29C 43/50 - Removing moulded articles

Abstract

The present invention provides a resin molding device which clamps a plurality of molding dies, molds resin by absorbing variations in the thicknesses of molding objects in the molding dies while synchronizing the clamping of the plurality of molding dies, and comprises a lift interlocking mechanism 8 that interlocks the raising/lowering of an intermediate plate 4 with the raising/lowering of a movable platen 3. The lift interlocking mechanism 8 comprises a pantograph mechanism 81 that expands and contracts due to the raising/lowering of the movable platen 3, and a coupling mechanism 82 that couples a crossing link portion 811 of the pantograph mechanism 81 with the intermediate plate 4. The coupling mechanism 82 includes a connection member 821 connected to the crossing link portion 811, a coupling member 822 that couples the connection member 821 with the intermediate plate 4, and elastic members 823a, 823b interposed between the connection member 821 and the coupling member 822.

IPC Classes  ?

• B29C 33/22 - Opening, closing or clamping by rectilinear movement
• B29C 43/04 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles using movable moulds
• B29C 43/32 - Component parts, details or accessoriesAuxiliary operations

Abstract

Provided is a cutting device comprising a table for cutting, a cutting mechanism, a table for dressing, a housing mechanism, and a transport mechanism. The table for cutting holds an object to be cut. The cutting mechanism uses a blade to cut the object to be cut held by the table for cutting. The table for dressing holds a dressing board for dressing the blade. The housing mechanism houses a plurality of stacked dressing boards. The transport mechanism includes a substrate transport part and a dressing board transport part that can move along with the substrate transport part. The substrate transport part suctions the object to be cut and transports the suctioned object to be cut to the table for cutting. The dressing board transport part transports the dressing board between the housing mechanism and the table for dressing.

IPC Classes  ?

• B24B 53/00 - Devices or means for dressing or conditioning abrasive surfaces
• B24B 27/06 - Grinders for cutting-off
• B24B 53/12 - Dressing toolsHolders therefor
• H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
• H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations

Abstract

This method for manufacturing a processed article comprises: a preparation step for preparing an object (1) to be processed that includes at least a lead frame in which a groove (5) is formed in advance along a position to be severed; an upper layer removing step for partially removing, before the object (1) to be processed is severed, an upper layer part (3c) of the object (1) to be processed forming the groove (5); and a plating step for performing, before the object (1) to be processed is severed, a plating process on the object (1) to be processed from which the upper layer part (3c) has been partly removed. In a state prior to the implementation of the upper layer removing step, the upper layer part (3c) includes a severed region (3m) that will be removed when the object (1) to be processed is severed, and a non-severed region (3n) that is positioned between the severed region (3m) and an opening end (5c) of the groove (5). In the upper layer removing step, at least a part of the non-severed region (3n) is removed. Thus, it is possible to obtain a method for manufacturing a processed article from which enhanced connection reliability can be obtained.

IPC Classes  ?

• H01L 23/50 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements for integrated circuit devices

Goods & Services

Molding of plastic materials; custom molding of synthetic resins for others; processing of plastics; encapsulation of semiconductors; custom manufacture and processing of semiconductor circuits; custom manufacture and processing of semiconductor components; custom manufacture and processing of semiconductor devices; custom manufacture and processing of semiconductor wafers; custom manufacture and processing of semiconductor chips; custom manufacture and processing of semiconductor substrates; custom manufacture and processing of parts for manufacturing semiconductors; assembling and precise processing of electronic parts being the manufacture of microelectronics to the order and specification of others; metalworking; manufacture of optical lenses to the order and specification of others; processing of glass for optical lenses; processing of glass; assembling, manufacturing and processing of medical apparatus and instruments, namely, manufacture of medical devices to the order and specification of others; application of coatings by ceramics, namely, ceramic PVD (Physical Vapor Deposition) coating and ceramic wet process coating services; application of coatings by ceramics, namely, ceramic PVD (Physical Vapor Deposition) coating and ceramic wet process coating services for molds for use in industry and parts for manufacturing semiconductors for the purpose of wear-resistance, heat resistance, corrosion-resistance, and electricity-proofing; application of coatings by ceramics , namely, ceramic PVD (Physical Vapor Deposition) coating and ceramic wet process coating services for molds for use in industry and parts for manufacturing semiconductors, for the purpose of water repellent and antifouling; PVD (Physical Vapor Deposition) coating and wet process coating services for the application of coatings to semiconductor manufacturing machines; PVD (Physical Vapor Deposition) coating and wet process coating services for the application of coatings to electronic parts manufacturing machines; PVD (Physical Vapor Deposition) coating and wet process coating services for the application of coatings to plastic surfaces; PVD (Physical Vapor Deposition) coating and wet process coating services for the application of coatings to plastic processing machines and apparatus; PVD (Physical Vapor Deposition) coating and wet process coating services for the application of coatings to cutting tools for machinery; PVD (Physical Vapor Deposition) coating and wet process coating services for the application of coatings to metal surfaces; PVD (Physical Vapor Deposition) coating and wet process coating services for the application of coatings to metalworking machines; PVD (Physical Vapor Deposition) coating and wet process coating services for the application of coatings to ceramic surfaces; PVD (Physical Vapor Deposition) coating and wet process coating services for the application of coatings to ceramic processing machines and apparatus; PVD (Physical Vapor Deposition) coating and wet process coating services for the application of coatings to glass surfaces; PVD (Physical Vapor Deposition) coating and wet process coating services for the application of coatings to glass processing machines and apparatus; PVD (Physical Vapor Deposition) coating and wet process coating services for the application of coatings to conveying machines and loading-unloading machines and apparatus; custom manufacture of food processing and food treatment machines and tools with a protective surface coating; custom manufacture of medical supplies and prescription pharmaceuticals manufacturing machines and tools with a protective surface coating; custom manufacture of chutes and trays of medical supplies manufacturing machines with a protective surface coating; metal plating of molds for use in industry; processing being the custom manufacture of molds for shaping synthetic resins; PVD (Physical Vapor Deposition) coating and wet process coating services for the application of coatings to molds for use in industry; PVD (Physical Vapor Deposition) coating and wet process coating services for the application of wear-resistant coating to cutting tools for machinery; PVD (Physical Vapor Deposition) coating and ceramic wet process coating services for optical lenses

Goods & Services

Processing of plastics; Manufacture of optical lenses to the order and specification of others; processing of glass for optical lenses; Processing of glass; Assembling, manufacturing and processing of medical apparatus and instruments namely, manufacture of medical devices to the order and specification of others; Application of coatings by ceramics, namely, ceramic PVD (Physical Vapor Deposition) coating and ceramic wet process coating services; Application of coatings by ceramics, namely, ceramic PVD (Physical Vapor Deposition) coating and ceramic wet process coating services for molds for use in industry and parts for manufacturing semiconductors for the purpose of wear-resistance, heat resistance, corrosion-resistance, and electricity-proofing; application of coatings by ceramics, namely, ceramic PVD (Physical Vapor Deposition) coating and ceramic wet process coating services for molds for use in industry and parts for manufacturing semiconductors for the purpose of water repellent and antifouling; PVD (Physical Vapor Deposition) coating and wet process coating services for the application of coatings to plastic surfaces; PVD (Physical Vapor Deposition) coating and wet process coating services for the application of coatings to ceramic surfaces; PVD (Physical Vapor Deposition) coating and wet process coating services for the application of coatings to glass surfaces; custom manufacture of food processing and food treatment machines and tools with a protective surface coating; custom manufacture of medical supplies and prescription pharmaceuticals manufacturing machines and tools with a protective surface coating; custom manufacture of chutes and trays of medical supplies manufacturing machines with a protective surface coating; PVD (Physical Vapor Deposition) coating and wet process coating services for eyeglass lenses and optical lenses; Application of optical, transparent, solar reflective and wear-resistant coatings on metallic, organic and mineral substrates, namely, PVD (Physical Vapor Deposition) coating and wet process coating services; PVD (Physical Vapor Deposition) coating and wet process coating services for the application of antifouling coating of electricity generators and solar panels

Abstract

Provided is a method for manufacturing a magnetic wedge by which productivity can be increased. The manufacturing method comprises: a resin molding step in which a plurality of cavities formed in an upper mold and/or a lower mold that are opposite each other and gaps narrower than the depth of adjacent portions of the cavities and formed between the plurality of cavities and between the upper mold and the lower mold are filled with a resin material containing a magnetic powder, and in that state, the resin material is resin molded through compression molding such that a plurality of products are collectively molded; and a resin layer removal step in which a resin layer formed by the resin molds at the gaps is removed.

IPC Classes  ?

• H02K 15/02 - Processes or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines of stator or rotor bodies
• H02K 3/493 - Slot-closing devices magnetic

Abstract

A dust collector according to the present invention can be equipped with a bag-shaped filter member that has an opening and is at least partly formed of an air-permeable material having air permeability. The dust collector comprises: a casing in which is formed an intake port and an exhaust port; a gas-suctioning source that can suction in a gas from the exhaust port; and an installation member that is disposed within the casing so as to cover the exhaust port and has a plurality of ventilation holes formed therein. Further, the dust collector is configured such that in a state in which the opening of the filter member is connected to the intake port and at least a portion of the air-permeable material is disposed on the installation member, a gas that has flowed in from the intake port is discharged from the exhaust port via the filter member as a result of driving the gas-suctioning source.

IPC Classes  ?

• B01D 46/02 - Particle separators, e.g. dust precipitators, having hollow filters made of flexible material
• B01D 46/52 - Particle separators, e.g. dust precipitators, using filters embodying folded material
• B01D 46/62 - Filters or filtering processes specially modified for separating dispersed particles from gases or vapours with multiple filtering elements, characterised by their mutual disposition connected in series
• B29C 31/00 - Handling, e.g. feeding of the material to be shaped

Abstract

This cutting device is supplied with process water from a water supply facility outside of the cutting device. The cutting device comprises a cutting unit, a supply unit, a detection unit, an adjustment unit, and a control unit. The cutting unit cuts an object to be cut. The supply unit supplies, directly or indirectly to at least one of the object to be cut and the cutting unit, the process water supplied from the water supply facility. The detection unit detects a flow rate of the process water supplied by the supply unit. The adjustment unit adjusts the flow rate of the process water supplied by the supply unit. The control unit carries out both the feedforward control for controlling the adjustment unit on the basis of a disturbance factor prior to cutting of the object to be cut, and the feedback control for controlling the adjustment unit on the basis of a detection result by the detection unit, to make the detection result closer to a target value.

IPC Classes  ?

• B23Q 11/10 - Arrangements for cooling or lubricating tools or work
• B24B 27/06 - Grinders for cutting-off
• B24B 55/02 - Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
• B24B 55/06 - Dust extraction equipment on grinding or polishing machines
• B28D 7/02 - Accessories specially adapted for use with machines or devices of the other groups of this subclass for removing or laying dust, e.g. by spraying liquidsAccessories specially adapted for use with machines or devices of the other groups of this subclass for cooling work
• G05B 11/32 - Automatic controllers electric with inputs from more than one sensing elementAutomatic controllers electric with outputs to more than one correcting element
• G05D 7/06 - Control of flow characterised by the use of electric means
• H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions

Abstract

The present invention simplifies a processing device and improves productivity thereof, and comprises: processing tables 2A, 2B having a plurality of suction holes 2h provided in one surface thereof and a plurality of penetrating openings 2T that penetrate from one surface 2x to another surface 2y, said suction holes being capable of holding a sealed substrate W by suction; a processing mechanism 4 for processing the sealed substrate W held by suction to the processing tables 2A, 2B; and a storing mechanism 21 (24) for directly storing the sealed substrate W that has been processed by the processing mechanism 4 in a storage member 211 (23).

IPC Classes  ?

• H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• B23K 26/08 - Devices involving relative movement between laser beam and workpiece
• B23K 26/10 - Devices involving relative movement between laser beam and workpiece using a fixed support
• B23K 26/38 - Removing material by boring or cutting

Abstract

The present invention simplifies a processing device and improves productivity thereof by capturing an image of a processed workpiece to inspect said workpiece, with the processed workpiece held by suction to a processing table. The present invention comprises: processing tables 2A, 2B having a plurality of suction holes 2h provided in one surface thereof, said suction holes being capable of holding a sealed substrate W by suction; a processing mechanism 4 for processing the sealed substrate W held by suction to the processing tables 2A, 2B; and a first camera 131 for capturing an image of the sealed substrate W that has been processed by the processing mechanism 4. The processing tables 2A, 2B have a plurality of penetrating openings 2T that penetrate from one surface 2x to the other surface 2y, the processing mechanism 4 processes the sealed substrate W at the penetrating openings 2T, and the first camera 131 captures an image of the processed sealed substrate W that is held by suction to the processing tables 2A, 2B.

IPC Classes  ?

• H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• B23K 26/08 - Devices involving relative movement between laser beam and workpiece
• B23K 26/10 - Devices involving relative movement between laser beam and workpiece using a fixed support
• B23K 26/38 - Removing material by boring or cutting
• H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping

Abstract

This tape sticking device comprises: a tape holding mechanism (21); a bend mechanism (23) positioned so as to be spaced apart from the tape holding mechanism (21); and a movement mechanism configured so as to be capable of moving the tape holding mechanism (21) and the bend mechanism (23) relative to each other. The bend mechanism (23) comprises an elastic member holding mechanism (22) configured so as to be capable of holding at least a portion of the outer periphery of an elastic member (32). The bend mechanism (23) is configured such that the elastic member (32), when in a state of being held by the elastic member holding mechanism (22), can be bent so as to protrude toward the tape holding mechanism (21) side.

IPC Classes  ?

• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
• B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
• H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
• H01L 23/50 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements for integrated circuit devices

Abstract

The present invention suppresses scratching of a processing table due to laser light and reduces limitations on laser processing conditions for preventing scratching of the processing table. The present invention comprises: a reversible processing table 2A, 2B in which a plurality of suction holes 2h capable of suctioning a workpiece W being processed are provided to one surface 2x; and a laser light irradiation unit 41A, 41B for irradiating the workpiece W being processed, which is suctioned to the processing table 2A, 2B, with laser light to process the workpiece W being processed. The processing table 2A, 2B has a plurality of through-openings 2T through which the laser light can pass, the through-openings 2T penetrating from the one surface 2x to the other surface 2y.

IPC Classes  ?

• B23K 26/10 - Devices involving relative movement between laser beam and workpiece using a fixed support
• B23K 26/16 - Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
• B23K 26/70 - Auxiliary operations or equipment

Abstract

The present invention is intended to prevent resin from sticking to a molding surface of a first molding die that holds an object to be molded, without using a release film, and is a resin molding apparatus that performs resin molding on the object to be molded, the resin molding apparatus including: a first molding die that holds the object to be molded; a second molding die that is provided in a manner facing the first molding die and that has a cavity for holding resin material; and a cover plate that is provided between the object to be molded and the first molding die, that covers a molding surface of the first molding die, and that has rigidity for maintaining its own shape.

IPC Classes  ?

• B29C 43/36 - Moulds for making articles of definite length, i.e. discrete articles
• B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles

Abstract

This laser processing device removes a portion of an object to be processed by emitting laser light toward a region of the object to be processed in which sections formed of different materials are disposed side by side in a scanning direction, and by performing scanning with the laser light along the scanning direction. A control unit (25) of the laser processing device sets a portion of the object to be processed as a plurality of processing layers (Y1-Y3), and during laser light scanning, controls an emission unit 23 and a scanning unit 24 on the basis of the processing conditions for the plurality of processing layers. The respective processing conditions for the plurality of processing layers are set on the basis of the positions of the sections formed of different materials in the region.

IPC Classes  ?

• B23K 26/36 - Removing material
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings

Abstract

This cutting device comprises a table, a cutting mechanism, a holding mechanism, and a water isolation/discharge mechanism. The table or the holding mechanism is connected to a dry vacuum pump through a suction path. The water isolation/discharge mechanism is positioned on the suction path and discharges water through a water discharge path. The water isolation/discharge mechanism includes a first tank, a second tank, and a valve mechanism. The first tank includes a partition plate for partitioning the tank into a region where a connection opening leading to the vacuum pump is positioned and a region where a connection opening leading to the table or the holding mechanism is positioned. A space is formed in the first tank above the partition plate. The valve mechanism changes between a first state, in which water flowing from the first tank into the second tank is reserved in the second tank, and a second state, in which water is reserved in the first tank and the water reserved in the second tank is discharged.

IPC Classes  ?

• B23Q 3/08 - Work-clamping means other than mechanically-actuated
• B24B 27/06 - Grinders for cutting-off
• B24B 41/06 - Work supports, e.g. adjustable steadies
• B24B 55/06 - Dust extraction equipment on grinding or polishing machines
• B28D 1/24 - Working stone or stone-like materials, e.g. brick, concrete, not provided for elsewhereMachines, devices, tools therefor by cutting, e.g. incising with cutting discs
• B28D 7/02 - Accessories specially adapted for use with machines or devices of the other groups of this subclass for removing or laying dust, e.g. by spraying liquidsAccessories specially adapted for use with machines or devices of the other groups of this subclass for cooling work
• B28D 7/04 - Accessories specially adapted for use with machines or devices of the other groups of this subclass for supporting or holding work
• H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions

Abstract

This resin molding device (30) comprises: a mold (C) having an upper mold (UM) and a lower mold (LM); a mold clamping mechanism (35) that clamps the mold (C); and a film supply mechanism (1) that supplies a release film (F) between the upper mold (UM) and the lower mold (LM) and has a delivery mechanism (11) including a delivery roll (11a) that delivers the release film (F), and a film conveyance mechanism (7) that conveys the release film (F); and a control unit (6) that controls an operation of the film supply mechanism (1), wherein, when the film conveyance mechanism (7) conveys the release film (F), the control unit (6) rotates the delivery roll (11a) in the same direction as the direction in which the film conveyance mechanism (7) conveys the release film (F).

IPC Classes  ?

• B29C 45/02 - Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
• B29C 31/04 - Feeding, e.g. into a mould cavity
• B29C 33/44 - Moulds or coresDetails thereof or accessories therefor with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles
• B29C 43/34 - Feeding the material to the mould or the compression means

Abstract

The present invention provides an inspection system that inspects an object to be inspected on the basis of a captured image of the object to be inspected. The inspection system includes a lighting section, a camera, a control section, and a storage section. The lighting section can change a light irradiation state and irradiates the object to be inspected with light. The camera generates a captured image with the object to be inspected irradiated with light. The control section controls each of the lighting section and the camera to generate a plurality of captured images in different irradiation states. The storage section stores a reference histogram. The control section compares the reference histogram with each histogram generated on the basis of a respective one of the plurality of captured images, and determines an irradiation state to be used in inspection on the basis of comparison results.

IPC Classes  ?

• G01N 21/88 - Investigating the presence of flaws, defects or contamination
• H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions

Abstract

Provided are a cutting device capable of washing a flange, and a method for manufacturing a cut article.　The present invention comprises: a blade replacement mechanism for replacing a blade provided on a spindle part; and a washing mechanism for washing a pair of flanges for fixing the blade to the spindle part.

IPC Classes  ?

• B24B 55/06 - Dust extraction equipment on grinding or polishing machines
• B23Q 3/155 - Arrangements for automatic insertion or removal of tools
• B24B 27/06 - Grinders for cutting-off
• B24B 45/00 - Means for securing grinding wheels on rotary arbors
• H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions

Abstract

Provided is a resin molding device with which it is possible to have a detailed grasp of resin pressure.　The present invention comprises: a bottom mold in which a pot for accommodating a resin material is formed; a top mold provided facing the bottom mold and in which a cull portion is formed on a section facing the pot; a plunger capable of transferring the resin material accommodated in the pot; and a first sensor that is provided at a mold-facing position of the top mold or at a tip portion of the plunger, and detects a value relating to pressure.

IPC Classes  ?

• B29C 45/02 - Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
• B29C 45/77 - Measuring, controlling or regulating of velocity or pressure of moulding material

Abstract

A mold for resin molding according to the present invention reduces molding defects in a resin transfer molding method, and is provided with: an upper mold 2 which holds a substrate W; and a lower mold 3 which has a cavity 3C and is to be clamped with the upper mold 2. The lower mold 3 is provided with: a pot 31 that is in communication with a resin injection port 3h1, which is formed in the bottom surface of the cavity 3C, and holds a resin material R; an injection plunger 32 that moves back and forth in the pot 31 so as to inject the resin material R into the cavity 3 through the resin injection port 3h1; a resin pool part 33 that is in communication with a discharge port 3h2, which is formed in the bottom surface of the cavity 3C, and holds the resin material R flowed out of the cavity 3C; a suction hole 34 that is connected to the resin pool part 33 so as to suck air from the discharge port 3h2 by the intermediary of the resin pool part 33; and a switching plunger 35 that moves back and forth in the resin pool part 33, and makes a switch between a state in which the suction hole 34 is in communication with the discharge port 3h2 and a state in which the suction hole 34 is disconnected from the discharge port 3h2.

IPC Classes  ?

• B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
• B29C 33/10 - Moulds or coresDetails thereof or accessories therefor with incorporated venting means
• B29C 45/02 - Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings

Abstract

Provided is a method for producing a forming mold for resin molding that makes it possible to improve the quality of a resin molded article.　The invention includes: a fixation step for performing fixation such that a mold member for forming a cavity and a support block for supporting the mold member on the opposite side from the cavity are integrated; and, following the fixation step, a machining step for machining at least a side surface of the support block so as to correspond to a side surface of a remaining portion of the mold member.

IPC Classes  ?

• B29C 33/38 - Moulds or coresDetails thereof or accessories therefor characterised by the material or the manufacturing process
• B29C 45/26 - Moulds

Abstract

This cutting device is configured to cut an object to be cut, with a blade. The cutting device comprises an imaging unit, and a control unit. The imaging unit is configured to move relatively to a dressing board, and image some region of the dressing board. The control unit is configured to control the imaging unit to image a plurality of first regions of the dressing board in order, and, on the basis of imaging results of the imaging unit, determine whether or not there is a cut line in each of the plurality of first regions. Two first regions adjacent to each other among the plurality of first regions are spaced apart from each other with a second region therebetween. The control unit, on the basis of whether or not there is a cut line in each of the plurality of first regions, decides whether or not it is necessary to determine whether or not there is a cut line in the second region.

IPC Classes  ?

• B24B 53/00 - Devices or means for dressing or conditioning abrasive surfaces
• B24B 27/06 - Grinders for cutting-off
• B24B 49/12 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or workArrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
• B24B 53/12 - Dressing toolsHolders therefor
• H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions

Abstract

This resin supply device (2A) comprises: a resin supply mechanism (23a) for supplying a resin material housed thereinside, a nozzle (23b) that is formed of an elastic material and that has a discharge port (23c) for discharging the resin material in the resin supply mechanism (23a); and a clamp mechanism (24) that pushes the tip portion of the nozzle (23b) from the outer side so as to cause the shape of the discharge port (23c) of the nozzle (23b) to be at least a three-fold rotational symmetry about the axis (X) of the nozzle (23b), and that changes the opening area of the discharge port (23c).

IPC Classes  ?

• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
• B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
• B29C 43/34 - Feeding the material to the mould or the compression means

Abstract

The present invention is for automatically replacing a holding plate for holding a processing-target object, and provides a processing device 100 that holds a sealed board W on processing tables 2A, 2B, and processes the sealed board W by a processing mechanism 4 while moving the processing tables 2A, 2B. The processing device 100 comprises: a plate housing part 24 that houses a holding plate M1 for holding the sealed board W; a holding base part M2 on which the holding plate M1 is mounted attachably thereto/detachably therefrom and which holds the sealed board W by using the holding plate M1; and a plate conveying mechanism 25 that conveys the holding plate M1 between the plate housing part 24 and the holding base part M2. The plate conveying mechanism 25 conveys the holding plate M1 detached from the holding base part M2 to the plate housing part 24 and conveys the holding plate M1 located at the plate housing part 24 to the holding base part M2.

IPC Classes  ?

• H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
• H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions

Abstract

The present invention aims at eliminating a need for a protective cover such as a bellows cover and improving a collection rate of machining scraps, and includes machining tables that are fixed at least in X and Y directions on a horizontal plane and hold a workpiece, a machining mechanism that machines the workpiece with a rotary tool using a machining liquid, a moving mechanism that linearly moves the machining mechanism at least in each of the X and Y directions on the horizontal plane, and a machining scrap storage unit that is provided below the machining tables and stores machining scraps generated by machining by the machining mechanism.

IPC Classes  ?

• B23Q 1/48 - Movable or adjustable work or tool supports using particular mechanisms with sliding pairs and rotating pairs
• B24B 27/06 - Grinders for cutting-off
• B24B 41/06 - Work supports, e.g. adjustable steadies

Abstract

This method for manufacturing a semiconductor device comprises: a resin encapsulation step for encapsulating a semiconductor chip (6) with a resin material (9) with the semiconductor chip (6) bonded to a lead frame (1) having a recess (5) formed therein; a laser light emitting step for emitting laser light toward the recess (5) to remove the resin material (9) in the recess (5) with the laser light in such a way that a part (9c) of the resin material (9) remains in the recess (5); and a cutting step for cutting a bottom surface (4v) of the recess (5) of the lead frame (1), together with the part (9c) of the resin material (9) in the recess (5).

IPC Classes  ?

• H01L 23/50 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements for integrated circuit devices