Transound Electronics Co., Ltd.

China

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IPC Class
H04R 1/10 - EarpiecesAttachments therefor 8
H04R 25/00 - Deaf-aid sets 8
H04R 9/06 - Loudspeakers 7
H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type Details 6
H04R 9/04 - Construction, mounting, or centering of coil 4
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Status
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Registered / In Force 24

1.

Vibration generator with control and vibration assemblies in housing and electronic device having the same

      
Application Number 18415859
Grant Number 12573930
Status In Force
Filing Date 2024-01-18
First Publication Date 2025-05-29
Grant Date 2026-03-10
Owner Transound Electronics Co., Ltd. (China)
Inventor
  • Wen, Tseng-Feng
  • Xue, Hui
  • He, Zhi-Jian
  • Chen, Yan-Fang

Abstract

A vibration generator is provided, which includes a housing defining a receiving space, a control assembly fixed in the receiving space, and a vibration assembly received in the receiving space. The control assembly can generate an alternating magnetic field. The vibration assembly is movably received in the receiving space and includes a magnet and a vibration sheet. The vibration sheet is connected to the magnet and the housing. The magnet is configured to vibrate back and forth in the alternating magnetic field and transmits the vibrations to the housing.

IPC Classes  ?

  • H02K 33/16 - Motors with reciprocating, oscillating or vibrating magnet, armature or coil system with polarised armatures moving in alternate directions by reversal or energisation of a single coil system
  • H02K 33/18 - Motors with reciprocating, oscillating or vibrating magnet, armature or coil system with coil systems moving upon intermittent or reversed energisation thereof by interaction with a fixed field system, e.g. permanent magnets

2.

VOICE COIL STRUCTURE AND LOUDSPEAKER

      
Application Number 18521011
Status Pending
Filing Date 2023-11-28
First Publication Date 2024-06-20
Owner Transound Electronics Co, Ltd. (China)
Inventor
  • Wen, Tseng-Feng
  • Huang, Chun-Han
  • Tseng, Chung-Hsien

Abstract

The present disclosure provides a voice coil structure and a loudspeaker. The voice coil structure includes a substrate, a first wiring layer disposed on the substrate, and a first insulation layer disposed on the first wiring layer. The first wiring layer has a winding structure. The first wiring layer further includes a first end and a second end. The first insulation layer defines a through hole and a first notch. The first end is exposed from the through hole, and the second end is exposed from the first notch.

IPC Classes  ?

3.

Bone conduction receiver

      
Application Number 18139925
Grant Number 12317039
Status In Force
Filing Date 2023-04-26
First Publication Date 2024-05-09
Grant Date 2025-05-27
Owner TRANSOUND ELECTRONICS CO., LTD. (China)
Inventor
  • Wen, Tseng-Feng
  • Xue, Hui
  • Chen, Yangfang

Abstract

A bone conduction receiver includes a housing, a vibrating plate, a bracket, a magnetic loop assembly, a coil, and a protective cover. The vibrating plate is disposed inside the housing and keeps a distance from an inner bottom of the housing. The protective cover is located on one side of the vibrating plate, facing away from the inner bottom of the housing, and covers the opening of the accommodation room. The bracket is located on the side of the vibrating plate, facing away from the inner bottom of the housing. The magnetic loop assembly is secured in the bracket. One end of the coil is fixed to an inner side of the protective cover, and another end of the coil extends into the bracket and surrounds the magnetic loop assembly.

IPC Classes  ?

4.

Loudspeaker using semiconductor voice coil and electronic device using the same

      
Application Number 17945385
Grant Number 12143794
Status In Force
Filing Date 2022-09-15
First Publication Date 2024-02-08
Grant Date 2024-11-12
Owner Transound Electronics Co., Ltd. (China)
Inventor
  • Wen, Tseng-Feng
  • Xue, Hui

Abstract

A loudspeaker using a semiconductor voice coil includes a vibrating assembly and a magnetic force assembly. The magnetic force assembly and the vibrating assembly are arranged at an interval. The vibrating component includes a diaphragm and the semiconductor voice coil. The semiconductor voice coil is arranged on a side of the diaphragm. The magnetic force assembly and the semiconductor voice coil are arranged on the same side of the diaphragm. A magnetic gap is defined in the magnetic force assembly. The semiconductor voice coil is arranged in the magnetic gap. The magnetic field lines in the magnetic gap are perpendicular to the direction of current in the semiconductor voice coil. An electronic device including the loudspeaker is also disclosed.

IPC Classes  ?

  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type Details
  • H04R 9/04 - Construction, mounting, or centering of coil
  • H04R 9/06 - Loudspeakers

5.

Headset

      
Application Number 29823729
Grant Number D1010610
Status In Force
Filing Date 2022-01-19
First Publication Date 2024-01-09
Grant Date 2024-01-09
Owner Transound Electronics Co., Ltd. (China)
Inventor
  • Wen, Tseng-Feng
  • Zheng, Hu-Ming
  • Xue, Hui
  • Che, Hua-Quan

6.

Speaker

      
Application Number 17695805
Grant Number 11778388
Status In Force
Filing Date 2022-03-15
First Publication Date 2023-03-30
Grant Date 2023-10-03
Owner Transound Electronics Co., Ltd. (China)
Inventor
  • Wen, Tseng-Feng
  • Zheng, Huming
  • Xue, Hui

Abstract

A speaker includes a speaker body and a diaphragm. The diaphragm is a planar structure. The speaker body includes a positioning structure. The positioning structure has a cavity penetrating front and back sides of the positioning structure. The diaphragm is positioned on the positioning structure. The diaphragm is in the form of a planar structure, instead of a curved or spherical structure. The planar structure of the diaphragm is simplified, so that the manufacturing process of the diaphragm is simpler.

IPC Classes  ?

  • H04R 9/06 - Loudspeakers
  • H04R 7/06 - Plane diaphragms comprising a plurality of sections or layers
  • H04R 1/02 - CasingsCabinetsMountings therein
  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type Details
  • H04R 7/18 - Mounting or tensioning of diaphragms or cones at the periphery

7.

One-piece speaker having built-in sound cavity

      
Application Number 17153854
Grant Number 11451892
Status In Force
Filing Date 2021-01-20
First Publication Date 2022-05-12
Grant Date 2022-09-20
Owner TRANSOUND ELECTRONICS CO., LTD. (China)
Inventor
  • Wen, Tseng-Feng
  • Xue, Hui

Abstract

A one-piece speaker having a built-in sound cavity includes a holder, a casing, a diaphragm, a voice coil, a washer, a magnet, a U-shaped cup, and a circuit board assembly. The speaker has its built-in sound cavity, so that the assembly is more convenient and flexible. The overall structure is simpler and easy to be produced. The sound cavity is larger, the sound sensitivity is better, and there is no need to distinguish between mid and low sounds. The bandwidth is larger, the response speed is faster, the signal frequency allowed to pass is high, the signal distortion is small, and the sound quality is better.

IPC Classes  ?

  • H04R 1/02 - CasingsCabinetsMountings therein
  • H04R 9/06 - Loudspeakers
  • H04R 9/04 - Construction, mounting, or centering of coil
  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type Details
  • H04R 7/18 - Mounting or tensioning of diaphragms or cones at the periphery
  • H04R 1/34 - Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by using a single transducer with sound reflecting, diffracting, directing or guiding means
  • H04R 3/00 - Circuits for transducers
  • H04R 7/12 - Non-planar diaphragms or cones

8.

Solid-medium sound conducting receiver and electronic device with the same

      
Application Number 17106351
Grant Number 11297436
Status In Force
Filing Date 2020-11-30
First Publication Date 2022-04-05
Grant Date 2022-04-05
Owner Transound Electronics Co., Ltd. (China)
Inventor
  • Wen, Tseng-Feng
  • Zheng, Hu-Ming
  • He, Zhi-Jian
  • Chen, Yan-Fang

Abstract

A conduction receiver utilizing sound transmission through a solid medium includes an outer casing, a vibration reed, a magnet, a washer, a coil, and a lid. The lid covers surfaces of the outer casing to form a sealed first receiving space. The vibration reed, the magnet, the washer, and the coil are all arranged in the first receiving space. A peripheral surface of the vibration reed is coupled to the outer casing. The magnet is arranged at a side of the vibration reed away from a bottom of the outer casing. The washer is arranged at a side of the magnet away from the vibration reed. A first end of the coil is fixed to an inner surface of the lid, and a second end of the coil extends into the first receiving space and is coiled around the magnet and the washer. An electronic device is also provided.

IPC Classes  ?

  • H04R 9/06 - Loudspeakers
  • H04R 9/04 - Construction, mounting, or centering of coil
  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type Details
  • H04R 11/06 - Telephone receivers

9.

TWS bone conduction earphone

      
Application Number 17074646
Grant Number 11503394
Status In Force
Filing Date 2020-10-20
First Publication Date 2021-11-11
Grant Date 2022-11-15
Owner TRANSOUND ELECTRONICS CO., LTD. (China)
Inventor
  • Wen, Tseng-Feng
  • Zheng, Huming

Abstract

A TWS bone conduction earphone includes an earphone housing and an earphone body. The earphone housing is configured to accommodate the earphone body. The earphone body includes a storage module, a Bluetooth module and a bone conduction module. The storage module is configured to store a Bluetooth address corresponding to a Bluetooth device to be connected and paired. The Bluetooth module is configured to establish a communication with the corresponding Bluetooth device according to the Bluetooth address to obtain an audio signal from the Bluetooth device. The bone conduction module vibrates according to the audio signal for transmitting sounds through ossicles. Using Bluetooth technology, bone conduction wireless answering is realized, without the restriction of the earphone cable. It is more convenient to use, and the sound transmission is realized through bone conduction without damaging hearing.

IPC Classes  ?

10.

BONE CONDUCTION BLUETOOTH EARPHONE, AND COMBINATION THEREOF WITH CHARGING BASE

      
Application Number CN2019115084
Publication Number 2021/027084
Status In Force
Filing Date 2019-11-01
Publication Date 2021-02-18
Owner TRANSOUND ELECTRONICS CO., LTD (China)
Inventor Wen, Tseng-Feng

Abstract

Disclosed are bone conduction Bluetooth earphone, and a combination thereof with a charging base. The bone conduction Bluetooth earphone comprises a main body of the earphone, and a PCB board, a wireless module, and a rechargeable battery disposed within the main body of the earphone. The wireless module and the rechargeable battery are both electrically connected to the PCB board. The main body of the earphone is further provided with a bone conduction speaker module therein, and the bone conduction speaker module is electrically connected to the PCB board. The main body of the earphone comprises a main body portion and a housing connected to the main body portion. The main body portion and the housing have a first installation cavity and a second installation cavity, respectively, and the first installation cavity and the second installation cavity communicate with each other. The PCB board and the wireless module are installed in the first installation cavity. The rechargeable battery and the bone conduction speaker module are installed in the second installation cavity. In this way, the invention realizes a bone conduction Bluetooth earphone design, addresses the problems of air conduction-based speakers that require high air impermeability, have a need for a resonant cavity, and are inconvenient to tune and assemble. The invention has a smart and practical structural design, thereby facilitating manufacturing.

IPC Classes  ?

11.

Combination of bone conduction Bluetooth earphone and charging base

      
Application Number 16734407
Grant Number 10887681
Status In Force
Filing Date 2020-01-06
First Publication Date 2021-01-05
Grant Date 2021-01-05
Owner TRANSOUND ELECTRONICS CO., LTD. (China)
Inventor Wen, Tseng-Feng

Abstract

A combination of a bone conduction Bluetooth earphone and a charging base includes an earphone body, a PCB, a wireless module, and a rechargeable battery. The PCB, the wireless module and the rechargeable battery are disposed in the earphone body. The wireless module and the rechargeable battery are electrically connected to the PCB. It realizes the design of the bone conduction Bluetooth earphone and solves the problem that an air conduction speaker needs good air tightness, a resonant chamber and tuning and is inconvenient for assembly. The structural design is clever and reasonable, and it is easy for production.

IPC Classes  ?

12.

ELECTRET CAPACITOR MICROPHONE WITH SMALL NOISE COEFFICIENT AND MANUFACTURING METHOD THEREOF

      
Application Number CN2019088219
Publication Number 2020/151140
Status In Force
Filing Date 2019-05-24
Publication Date 2020-07-30
Owner TRANSOUND ELECTRONICS CO., LTD (China)
Inventor
  • Zheng, Huming
  • Wen, Tseng-Feng
  • Zhang, Yu
  • Tong, Feng

Abstract

The present invention relates to an electret capacitor microphone with a small noise coefficient and a manufacturing method thereof, comprising a housing and an electret type variable capacitor mounted in the housing, and an ASIC amplifier, wherein the ASIC amplifier is mounted on a PCB board, and the PCB board is provided with an output end; the electret type variable capacitor is electrically connected to the ASIC amplifier, and the ASIC amplifier is electrically connected to the output end of the PCB board; the manufacturing method comprises the following steps: preparation steps: preparing the housing, the electret type variable capacitor, and the ASIC amplifier, and the ASIC amplifier is bonded onto the PCB board by using a COB process; assembly steps: firstly, assembling the electret type variable capacitor into the housing, then assembling the ASIC amplifier together with the PCB board into the housing, and forming an electrical connection between the ASIC amplifier and the electret type variable capacitor; the noise coefficient is effectively reduced, the normal transmission of the effective sound is ensured, in particular, the stability and reliability of the ASIC amplifier during use are ensured. Moreover, the process flow is simple, the process efficiency is high, and the processing cost is low.

IPC Classes  ?

  • H04R 19/01 - Electrostatic transducers characterised by the use of electrets

13.

Electret condenser microphone with low noise figure and method for producing the same

      
Application Number 16449473
Grant Number 10873815
Status In Force
Filing Date 2019-06-24
First Publication Date 2020-07-23
Grant Date 2020-12-22
Owner TRANSOUND ELECTRONICS CO., LTD. (China)
Inventor
  • Zheng, Huming
  • Wen, Tseng-Feng
  • Zhang, Yu
  • Tong, Feng

Abstract

An electret condenser microphone with a low noise figure and a method for producing the same are disclosed. An electret variable condenser is first installed into a housing, and then an ASIC amplifier and a printed circuit board are installed into the housing. The ASIC amplifier is electrically connected to the electret variable condenser. It reduces the noise figure effectively and ensures the normal transmission of the effective sound. In particular, it ensures the stability and reliability of the ASIC amplifier during use. The process is simple, the production efficiency is high, and the processing cost is low.

IPC Classes  ?

  • H04R 19/01 - Electrostatic transducers characterised by the use of electrets

14.

Noise cancelling earphone integrated with filter module

      
Application Number 16538743
Grant Number 10715905
Status In Force
Filing Date 2019-08-12
First Publication Date 2020-06-04
Grant Date 2020-07-14
Owner TRANSOUND ELECTRONICS CO., LTD. (China)
Inventor Wen, Tseng-Feng

Abstract

A noise cancelling earphone includes an earphone housing, a filter module, and a speaker. The filter module and the speaker are installed in the earphone housing. The filter module includes a printed circuit board, a microphone, and a filter unit. The microphone and the filter unit are respectively disposed on the printed circuit board. The filter unit is electrically connected between the microphone and the speaker. The filter module is arranged in the earphone. The structural design is reasonable, the space is effectively utilized, the structure is compact, and the assembly is convenient.

IPC Classes  ?

  • H04R 1/10 - EarpiecesAttachments therefor
  • G10K 11/178 - Methods or devices for protecting against, or for damping, noise or other acoustic waves in general using interference effectsMasking sound by electro-acoustically regenerating the original acoustic waves in anti-phase

15.

Bonepods

      
Application Number 1532708
Status Registered
Filing Date 2020-02-28
Registration Date 2020-02-28
Owner Transound Electronics CO.,LTD (China)
NICE Classes  ? 09 - Scientific and electric apparatus and instruments

Goods & Services

Microphones; horns for loudspeakers; vibration sensors; portable media players; pickups for telecommunication apparatus; earphones; in-ear headphones; headphones; wireless headsets for use with cellular phones.

16.

In-ear headphone having MMCX socket and detachable in-ear headphone assembly

      
Application Number 15972213
Grant Number 10638211
Status In Force
Filing Date 2018-05-06
First Publication Date 2019-03-21
Grant Date 2020-04-28
Owner TRANSOUND ELECTRONICS CO., LTD. (China)
Inventor
  • Wen, Tseng-Feng
  • Zeng, Weiguo
  • Wu, Haijuan
  • Cheng, Lin

Abstract

An in-ear headphone having an MMCX socket and a detachable in-ear headphone assembly are provided. The in-ear headphone includes a headphone housing and a speaker assembly disposed in the headphone housing. The headphone housing includes a first housing and a second housing to be connected with each other. The first housing has a first interface portion extending from one end thereof. The second housing has a second interface portion extending from one end thereof. The first interface portion and the second interface portion jointly form an interface.

IPC Classes  ?

17.

Electrostatic loudspeaker and electrostatic headphone

      
Application Number 15813164
Grant Number 10250966
Status In Force
Filing Date 2017-11-15
First Publication Date 2018-06-28
Grant Date 2019-04-02
Owner TRANSOUND ELECTRONICS CO., LTD. (China)
Inventor
  • Zheng, Huming
  • He, Zhijian
  • Deng, Xiaolin
  • Wen, Tseng-Feng

Abstract

An electrostatic loudspeaker and an electrostatic headphone are provided. The electrostatic loudspeaker includes a first back grid portion, a second back grid portion, a diaphragm portion, and an audio amplifier circuit module. The two polarized and charged back grid portions are combined with the diaphragm portion to form two alternating electric fields, providing great sound. The structure is simple and can be assembled conveniently.

IPC Classes  ?

18.

Freely adjustable ergonomic bone conduction earphone rack

      
Application Number 15131045
Grant Number 09686603
Status In Force
Filing Date 2016-04-18
First Publication Date 2017-05-04
Grant Date 2017-06-20
Owner TRANSOUND ELECTRONICS CO., LTD. (China)
Inventor
  • Zheng, Huming
  • Zhang, Yu
  • Wen, Tseng-Feng

Abstract

A freely adjustable ergonomic bone conduction earphone rack and bone conduction earphone using the same are disclosed. The rack includes a head-mounted unit, ear-hung units and mounting units, where the ear-hung unit is respectively configured on the two ends of the head-mounted unit, and the mounting unit is coupled to the ear-hung unit; the mounting unit has a connection section in connection with the ear-hung unit and mounting section for the mounting of a bone conduction vibrator, where at least the connection section is a soft plastic body, and the mounting unit is configured to be adjustable freely multi-directional relatively to the ear-hung unit with the deformation of the connection section.

IPC Classes  ?

19.

High sound quality piezoelectric speaker

      
Application Number 15190202
Grant Number 09860647
Status In Force
Filing Date 2016-06-23
First Publication Date 2017-01-26
Grant Date 2018-01-02
Owner TRANSOUND ELECTRONICS CO., LTD. (China)
Inventor
  • Wen, Tseng-Feng
  • Zheng, Huming
  • He, Zhijian
  • Deng, Xiaolin

Abstract

A high sound quality piezoelectric speaker includes a moving coil speaker, a support frame, a vibration plate, and a piezoelectric ceramic plate. The support frame is arranged on the moving coil speaker and the vibration plate is positioned on the support frame. With the piezoelectric ceramic plate being positioned on the vibration plate, the moving coil speaker and the piezoelectric ceramic plate may collaboratively and better handle both high-frequency and low-frequency sounds, exhibiting relatively wide playback band and making sound quality better, to thereby reach the standard of high sound quality and provide users with improved enjoyment of sound perception.

IPC Classes  ?

  • H04R 25/00 - Deaf-aid sets
  • H04R 17/00 - Piezoelectric transducersElectrostrictive transducers
  • H04R 9/06 - Loudspeakers
  • H04R 1/24 - Structural combinations of separate transducers or of parts of the same transducer and responsive respectively to two or more frequency ranges
  • H04R 1/02 - CasingsCabinetsMountings therein
  • H04R 7/04 - Plane diaphragms

20.

Package-integrable high sound quality moving coil loudspeaker structure

      
Application Number 14887282
Grant Number 09462403
Status In Force
Filing Date 2015-10-19
First Publication Date 2016-10-04
Grant Date 2016-10-04
Owner TRANSOUND ELECTRONICS CO., LTD. (China)
Inventor
  • Wen, Tseng-Feng
  • Zheng, Huming
  • Xue, Hui
  • Deng, Sen

Abstract

A package-integrable high sound quality voice coil loudspeaker structure includes a metal shell, and a diaphragm, voice coil washer, magnet, T iron and PCB packed integrally inside the metal shell; the metal shell has a cylindrical side wall and bottom wall, and a sound output is opened on the bottom wall, with a lengthened cylinder in communication with the first sound output being projected outward integrally from the bottom face of the bottom wall. Therefore, the present invention utilizing the metal shell to pack all components integrally simplifies the assembly process, and has a good waterproof performance. In addition, the configuration of the lengthened cylinder improves the sound quality.

IPC Classes  ?

  • H04R 9/06 - Loudspeakers
  • H04R 31/00 - Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
  • H04R 7/16 - Mounting or tensioning of diaphragms or cones
  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type Details
  • H04R 9/10 - Telephone receivers

21.

Moving iron sounding device

      
Application Number 14840056
Grant Number 09510102
Status In Force
Filing Date 2015-08-31
First Publication Date 2016-06-09
Grant Date 2016-11-29
Owner TRANSOUND ELECTRONICS CO., LTD. (China)
Inventor
  • Zheng, Huming
  • He, Zhijian
  • Zhang, Yu
  • Deng, Xiaolin
  • Wen, Tseng-Feng

Abstract

A moving iron sounding device includes a casing, a diaphragm sounding system, and a magnetic circuit system. The magnetic circuit system includes a dual-rectangle-shaped magnetic circuit, an inductance coil, and an armature. The diaphragm sounding system includes a support ring and a composite diaphragm. The composite diaphragm includes a diaphragm sheet and a metal sheet. One end of the metal sheet is welded to the vibration portion through a connecting arm, and another end of the metal sheet is connected to the support ring. The present invention achieves a stable connection of the diaphragm sounding system and the magnetic circuit system and ensures the quality of the product. During the process of assembly, the adhesive won't be spilled on the diaphragm.

IPC Classes  ?

  • H04R 25/00 - Deaf-aid sets
  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type Details
  • H04R 7/16 - Mounting or tensioning of diaphragms or cones

22.

SOUNDINN

      
Serial Number 86804040
Status Registered
Filing Date 2015-10-29
Registration Date 2017-01-03
Owner TRANSOUND ELECTRONICS CO., LTD. (China)
NICE Classes  ? 09 - Scientific and electric apparatus and instruments

Goods & Services

telephone receivers; telephone transmitters; microphones; horns for loudspeakers; headphones; earphones; audio monitoring apparatus comprised of electrical transmitters and receivers

23.

High bass speaker monomer and a high bass earphone structure

      
Application Number 14427636
Grant Number 09602912
Status In Force
Filing Date 2013-12-19
First Publication Date 2015-09-03
Grant Date 2017-03-21
Owner TRANSOUND ELECTRONICS CO., LTD. (China)
Inventor Wen, Tsengfeng

Abstract

A high bass speaker monomer comprises a framework, a magnetic air loop component and a vibration membrane. The frame work is disposed at a central position of the frame work. A hollow structure is formed on the framework and around the magnetic air loop component. An isolation ring formed on the framework divides the hollow structure into at least one high tone region and bass region respectively located near and far away from the magnetic air loop component. The vibration membrane is disposed on the framework and covers the magnetic air loop component and the two regions. The high bass speaker monomer is disposed in a casing body to construct a high bass earphone structure. The isolation ring separates the high tone from the low tone to prevent them from mixing. Therefore, the sound of the earphone is more stable and the quality of the sound is better.

IPC Classes  ?

  • H04R 25/00 - Deaf-aid sets
  • H04R 1/10 - EarpiecesAttachments therefor
  • H04R 1/24 - Structural combinations of separate transducers or of parts of the same transducer and responsive respectively to two or more frequency ranges
  • H04R 1/28 - Transducer mountings or enclosures designed for specific frequency responseTransducer enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means

24.

Acoustic metal diaphragm

      
Application Number 14539020
Grant Number 09204221
Status In Force
Filing Date 2014-11-12
First Publication Date 2015-06-18
Grant Date 2015-12-01
Owner TRANSOUND ELECTRONICS CO., LTD. (China)
Inventor Wen, Tsengfeng

Abstract

An acoustic metal diaphragm comprises a diaphragm base made of an organic material and a metal-plated layer. The diaphragm base has a smooth surface. The metal-plated layer is adhered to the smooth surface of the diaphragm base by an intermediate layer. The intermediate layer is disposed between the diaphragm base and the metal-plated layer. The metal-plated layer is made of pure beryllium or a beryllium alloy. Accordingly, the diaphragm base is made of the organic material and provided with a smooth surface. The intermediate layer allows the metal-plated layer to be adhered to the smooth surface more firmly. Using the pure beryllium or beryllium alloy to manufacture the metal-plated layer increases the rigidity of the diaphragm base and maintains the softness thereof to slow down the attenuation of the bandwidth, attain a wider frequency band, solve the problem of the high frequency and increase the quality of the sound.

IPC Classes  ?

  • H04R 7/10 - Plane diaphragms comprising a plurality of sections or layers comprising superposed layers in contact
  • H04R 7/12 - Non-planar diaphragms or cones

25.

Contact type electret condenser pickup

      
Application Number 11840927
Grant Number 08090125
Status In Force
Filing Date 2007-08-17
First Publication Date 2008-03-13
Grant Date 2012-01-03
Owner TRANSOUND ELECTRONICS CO., LTD. (China)
Inventor
  • Zheng, Hu-Ming
  • He, Zhi-Jian
  • Ouyang, Yi

Abstract

A contact type electret condenser pickup to deliver high anti noise, top talking quality, and comprehensive range of applications includes a casing provided with an accommodation chamber to contain an O-ring, a vibration part, an insulation packing, a back plate retaining ring containing a back plate, a conductive connection ring, and a circuit board horizontally placed in sequence; vibration of a sound of a user is transmitted to the vibration part; then an inertia vibration of the metal sheet changes capacitance between the vibration part and the back plate; the changed vibration is converted through the circuit board set into voltage of alternating signals for output variable according to changes of vibration.

IPC Classes  ?