A window for far-infrared thermal imaging sensor assembly, according to the present invention, comprises: an incident surface on which far-infrared rays are incident; and an opposing surface facing a thermal imaging sensor, wherein the window for a far-infrared thermal imaging sensor assembly is bonded to an upper portion of the far-infrared thermal imaging sensor so as to transmit the far-infrared ray toward the far-infrared thermal imaging sensor, and the incidence surface is subjected to a refraction reduction treatment of the incident far-infrared rays compared to the refraction occurring on a flat surface of a same material.
An apparatus for correcting a temperature of an object using a shutter may comprise a temperature measurement module for measuring the temperature of the object and a temperature of the shutter, a noise temperature calculation module for calculating the temperature due to noise using the measured temperature of the shutter, and a temperature correction module for correcting the temperature of the object by subtracting the calculated temperature due to noise from the measured temperature of the object.
H04N 23/23 - Cameras or camera modules comprising electronic image sensorsControl thereof for generating image signals from infrared radiation only from thermal infrared radiation
3.
Apparatus, method, and computer-readable recording medium for measuring temperature of object using compensation of board temperature
An apparatus for measuring temperature of an object using compensation of board temperature may include an infrared light sensor module for providing output voltage due to the infrared light emitted by an object; a board temperature compensation module for compensating the provided output voltage to the output voltage at the reference configuration temperature of the board using a first function of output voltage to board temperature obtained at a reference configuration temperature of a blackbody; and a calculation module for obtaining the temperature of the object from the compensated output voltage using a second function of temperature of the blackbody to the output voltage obtained at a reference configuration temperature of the board.
G01J 5/06 - Arrangements for eliminating effects of disturbing radiationArrangements for compensating changes in sensitivity
G01J 5/52 - Radiation pyrometry, e.g. infrared or optical thermometry using comparison with reference sources, e.g. disappearing-filament pyrometer
H04N 23/23 - Cameras or camera modules comprising electronic image sensorsControl thereof for generating image signals from infrared radiation only from thermal infrared radiation
4.
APPARATUS, METHOD, AND COMPUTER-READABLE RECORDING MEDIUM FOR CORRECTING TEMPERATURE OF OBJECT USING SHUTTER
An apparatus for correcting the temperature of an object using a shutter according to one embodiment of the present invention may comprise: a temperature measurement module for measuring the temperature of an object and a shutter; a noise temperature calculation module for calculating the temperature due to noise using the measured temperature of the shutter; and a temperature correction module for correcting the temperature of the object by subtracting the calculated temperature due to noise from the measured temperature of the object.
An apparatus for measuring temperature of an object using compensation of board temperature according to one embodiment of the present invention may comprise: an infrared light sensor module for providing output voltage due to the infrared light emitted by an object; a board temperature compensation module for compensating the provided output voltage to the output voltage at the reference configuration temperature of the board using a first function of output voltage to board temperature obtained at a reference configuration temperature of a blackbody; and a calculation module for obtaining the temperature of the object from the compensated output voltage using a second function of temperature of the blackbody to the output voltage obtained at a reference configuration temperature of the board.
A temperature measuring device using a thermal imaging camera according to an embodiment of the present invention may comprise: a first operation module for obtaining, for the thermal imaging camera, a curve of temperature difference versus output code difference where the X axis represents the output code difference and the Y axis represents the temperature difference indicated by a plurality of measured values; a second operation module for obtaining a function of temperature difference versus output code difference, the function curve-fitted by using the curve of temperature difference versus output code difference; and a third operation module for measuring the temperature of an object by applying the curve-fitted function of temperature difference versus output code difference.
A temperature measuring device using a thermal imaging camera according to an embodiment of the present invention may comprise: a first operation module for obtaining, for the thermal imaging camera, a curve of temperature difference versus output code difference where the X axis represents the output code difference and the Y axis represents the temperature difference indicated by a plurality of measured values; a second operation module for obtaining a function of temperature difference versus output code difference, the function curve-fitted by using the curve of temperature difference versus output code difference; and a third operation module for measuring the temperature of an object by applying the curve-fitted function of temperature difference versus output code difference.
A micro electro mechanical systems (MEMS) sensor packaging includes a first wafer having a readout integrated circuit (ROIC) formed thereon, a second wafer disposed corresponding to the first wafer and having a concave portion on one side thereof and a MEMS sensor prepared on the concave portion, joint solders formed along a surrounding of the MEMS sensor and sealing the MEMS sensor jointing the first and second wafers, and pad solders formed to electrically connect the ROIC circuit of the first wafer and the MEMS sensor of the second wafer. According to the present disclosure, in joining and packaging a wafer having the ROIC formed thereon and a wafer having the MEMS sensor formed thereon, the size of a package can be reduced and an electric signal can be stably provided by forming internally pad solders for electrically connecting the ROIC and the MEMS sensor.
G01P 15/08 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values
B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
H01L 31/02 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof - Details
The present invention relates to a MEMS sensor packing and a method thereof. The MEMS sensor packaging includes: a first wafer on which on an ROIC circuit is disposed; a second wafer disposed to correspond to the first wafer and having a concave portion in one surface thereof to provide a MEMS sensor; a bonding solder disposed around the MEMS sensor to bond the first and second wafers to each other, thereby sealing the MEMS sensor; and a solder pad electrically connecting the ROIC circuit of the first wafer to the MEMS sensor of the second wafer. According to the present invention, when the wafer on which the ROIC circuit is disposed and the wafer on which the MEMS sensor is disposed are bonded to package the bonded wafers, the solder pad for electrically connecting the ROIC sensor to the MEMS sensor may be provided within the package to reduce the size of the package and stably supply an electrical signal.
B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
G01P 15/00 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
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