Ube-nitto Kasei Co., Ltd.

Japan

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IPC Class
H01B 13/016 - Apparatus or processes specially adapted for manufacturing conductors or cables for manufacturing co-axial cables 3
B32B 27/00 - Layered products essentially comprising synthetic resin 2
C23C 18/18 - Pretreatment of the material to be coated 2
G02F 1/1339 - GasketsSpacersSealing of cells 2
H01B 11/18 - Coaxial cablesAnalogous cables having more than one inner conductor within a common outer conductor 2
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Found results for  patents

1.

CONDENSATE OF AMINO-BEARING SILANE COUPLING AGENT WITH METAL ALKOXIDE COMPOUND, MATERIAL FOR LAMINATE BASE COMPRISING SAME AS MAIN COMPONENT, LAMINATE BASE AND ELECROCONDUCTIVE MEMBER, AND PROCESSES FOR MANUFACTURING SAME

      
Application Number JP2012060592
Publication Number 2012/165081
Status In Force
Filing Date 2012-04-19
Publication Date 2012-12-06
Owner UBE-NITTO KASEI CO., LTD. (Japan)
Inventor
  • Iura, Koji
  • Matsubayashi, Akihiro
  • Fukunaga, Kenji

Abstract

Provided are: a condensate which can enhance the tight adhesion between a substrate and an electroconductive pattern formed using an electrocoductive ink, particularly, an ink or paste that contains metal nanoparticles; and a process for manufacturing the same. This condensate is a condensate which is obtained by hydrolytic condensation of an amino-bearing silane coupling agent with a metal alkoxide compound represented by general formula (I) and which comprises M-O repeating units as the main skeleton. R1nM(OR2)m-n ⋅⋅⋅ (I) In general formula (I), R1 is a nonhydrolyzable group; R2 is C1-6 alkyl; M is at least one metal selected from the group consisting of Si, Ti, Al, Zr, Li, Na, Ca, Sr, Ba, Zn, B, Ga, Y, Ge, Pb, P, Sb, V, Ta, W, La, Nd and In; m represents the valence of M and is 3 or 4; when m is 4, n is an integer of 0 to 2, while when m is 3, n is an integer of 0 to 1; and in a case where multiple R1 moieties are present, the R1 moieties may be the same or different from each other, while in a case wherein multiple OR2 moieties are present, the OR2 moieties may be the same or different from each other.

IPC Classes  ?

  • C08G 79/00 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbon
  • B32B 9/00 - Layered products essentially comprising a particular substance not covered by groups
  • C08G 77/26 - Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen nitrogen-containing groups
  • C08G 77/58 - Metal-containing linkages
  • C08L 83/08 - Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
  • C08L 83/14 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon onlyCompositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
  • C08L 85/00 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbonCompositions of derivatives of such polymers
  • H05K 1/09 - Use of materials for the metallic pattern

2.

ANTI-REFLECTION MATERIAL

      
Application Number JP2011079268
Publication Number 2012/086560
Status In Force
Filing Date 2011-12-12
Publication Date 2012-06-28
Owner UBE NITTO KASEI CO., LTD. (Japan)
Inventor
  • Kobayashi, Akihiro
  • Nakano, Tatsuya
  • Takada, Takahisa

Abstract

An anti-reflection material which is a coating film that is formed on at least a part of the surface of a light-transmitting base and that is composed of a binder, silica particles and air pockets. The anti-reflection material is characterized in that: the silica particles are arranged in two layers from the base surface; the first layer on the base side is densely filled with the particles and there are the air pockets between the base and the silica particles; and the silica particles in the second layer partially cover the silica particles in the first layer and there are the air pockets between the silica particles in the first layer and the silica particles in the second layer.

IPC Classes  ?

3.

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

      
Application Number JP2011059934
Publication Number 2011/138906
Status In Force
Filing Date 2011-04-22
Publication Date 2011-11-10
Owner
  • NATIONAL UNIVERSITY CORPORATION TOHOKU UNIVERSITY (Japan)
  • UBE INDUSTRIES, LTD. (Japan)
  • UBE-NITTO KASEI CO., LTD. (Japan)
Inventor
  • Ohmi, Tadahiro
  • Watanuki, Kohei
  • Manabe, Nobuyuki
  • Suzuki, Hirokazu

Abstract

Disclosed is a method for manufacturing a semiconductor device comprising an element isolation region, which comprises: a step wherein a semiconductor substrate is provided with a shallow trench for forming the element isolation region; a step wherein a coating liquid is applied over the semiconductor substrate including the sallow trench; and a step wherein the thus-coated coating film is modified into an insulating material for element isolation. The coating liquid contains one or more compositions represented by the following general formula: ((CH3)nSiO2-n/2)x(SiO2)1-x (wherein n = 1-3 and 0 ≤ x ≤ 1.0), and a solvent. The above-described modification step has a step wherein the coating film is subjected to a heat treatment in an oxidizing atmosphere at a reduced pressure of 10-200 Torr, thereby being modified into an SiO2 film. In the modification step, the coating film is modified into an SiO2 film that is free from granulation and/or formation of voids.

IPC Classes  ?

  • H01L 21/76 - Making of isolation regions between components
  • H01L 27/08 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind

4.

LAMINATE STRUCTURE AND LAMINATE

      
Application Number JP2011057792
Publication Number 2011/122615
Status In Force
Filing Date 2011-03-29
Publication Date 2011-10-06
Owner UBE-NITTO KASEI CO., LTD. (Japan)
Inventor
  • Tanaka, Naoki
  • Hirose, Takafumi

Abstract

Disclosed is a laminate structure which is provided on the exterior side of a windowpane (G). If the laminate structure is arranged on a float plate glass having a thickness of 3 mm, the haze value of the laminate structure including the float plate glass is 10% or less. The laminate structure comprises a light absorbing layer (12) and a heat insulating layer (13). The light absorbing layer (12) is composed of a film that contains fine conductive particles and thus absorbs infrared light. The heat insulating layer (13) is composed of a film that contains hollow particles and thus has closed cells. The laminate structure is provided such that the heat insulating layer (13) is located between the windowpane (G) and the light absorbing layer (12). Also disclosed is a laminate (11) which comprises a resin base (B), a light absorbing layer (12), and a heat insulating layer (13) that is arranged between a windowpane (G) and the light absorbing layer (12).

IPC Classes  ?

  • B32B 17/06 - Layered products essentially comprising sheet glass, or fibres of glass, slag or the like comprising glass as the main or only constituent of a layer, next to another layer of a specific substance
  • B32B 5/22 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous
  • B32B 27/18 - Layered products essentially comprising synthetic resin characterised by the use of special additives
  • C03C 17/34 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions

5.

CABLE GUIDE

      
Application Number JP2010073546
Publication Number 2011/092991
Status In Force
Filing Date 2010-12-27
Publication Date 2011-08-04
Owner UBE-NITTO KASEI CO., LTD. (Japan)
Inventor
  • Hirai Toshiharu
  • Ito Kenji
  • Nakayama Norihiro
  • Nomura Kazuhiro
  • Yamazoe Saiji

Abstract

Disclosed is a cable guide that is able to easily position a cable, hampers the generation of dust, and can be produced at a low cost. Sidewalls (2) in which at least the tip sections thereof are slanted or curved inwards are formed along both edges in the width direction of a bottom section (1) that extends in one direction, and a cable housing section (3) is formed by the bottom section (1) and the sidewalls (2). At that time, the cable guide (10) is formed by separating the facing tips of the sidewalls (2) at a fixed distance and integrating the bottom section (1) and the sidewalls (2) by means of a thermoplastic elastomer. In addition, in accordance with need, the amount of change in the angle formed by the sidewalls (2) and the bottom section (1) when 0.044 N/mm2 of vertical load is applied to the tip sections of the sidewalls (2) from within the cable housing section (3) is made no more than 45°, and the coefficient of static friction and the coefficient of dynamic friction of the inner surface of at least the bottom section (1) and the sidewalls (2), which were measured in accordance with the methods stipulated in JIS K 7125, are made no more than 0.7 and no more than 0.5, respectively.

IPC Classes  ?

  • H02G 11/00 - Arrangements of electric cables or lines between relatively-movable parts
  • F16G 13/16 - Hauling- or hoisting-chains with arrangements for holding electric cables, hoses, or the like
  • F16L 3/00 - Supports for pipes, cables or protective tubing, e.g. hangers, holders, clamps, cleats, clips, brackets
  • F16L 3/02 - Supports for pipes, cables or protective tubing, e.g. hangers, holders, clamps, cleats, clips, brackets partly surrounding the pipes, cables or protective tubing

6.

METHOD FOR PRODUCING FLEXIBLE METAL LAMINATE

      
Application Number JP2010065549
Publication Number 2011/033990
Status In Force
Filing Date 2010-09-09
Publication Date 2011-03-24
Owner
  • UBE INDUSTRIES, LTD. (Japan)
  • UBE-NITTO KASEI CO., LTD. (Japan)
Inventor
  • Kochiyama, Takuro
  • Shimokawa, Hiroto
  • Mineki, Yoshitaka
  • Sasaki, Masami

Abstract

In a method for producing a flexible metal laminate (15) provided with a step for continuously thermocompressing laminating metal foils (12), (14), onto a thermocompression resin film (13), the thermocompressing step is performed by arranging a protection metal foil (16) between a pressurizing surface (74a) of a heating/pressurizing formation device and the laminating metal foils (12), (14), and the protection metal foil (16) is used so that the pressurization surface (74a) is in contact with a matte surface (16b). When the protection metal foil (16) located so that the matte surface (16b) is in contact with a plate having a surface equivalent with the pressurization surface (74a) is stretched in one direction while a load is applied to a shiny surface (16a) to thereby subject the protection metal foil (16) to an abrasion-resistance test wherein the matte surface (16b) of the protection metal foil (16) is rubbed on the plate, a linear scuff will be found on the matte surface (16b) of the protection metal foil (16) only when the load exceeds 500 g per area of 76 mm x 26 mm.

IPC Classes  ?

  • B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
  • B32B 15/088 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising polyamides
  • B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
  • H05K 1/03 - Use of materials for the substrate
  • H05K 3/00 - Apparatus or processes for manufacturing printed circuits

7.

HOLLOW-CORE-BODY FOR TRANSMISSION CABLE, MANUFACTURING METHOD THEREOF, AND SIGNAL TRANSMISSION CABLE

      
Application Number JP2010059898
Publication Number 2011/007635
Status In Force
Filing Date 2010-06-11
Publication Date 2011-01-20
Owner UBE-NITTO KASEI CO., LTD. (Japan)
Inventor
  • Tanaka, Seiji
  • Matsuno, Shigehiro
  • Suemori, Masaya
  • Harada, Ken

Abstract

Provided is a hollow-core-body for transmission cables, a manufacturing method thereof, and a signal transmission cable, wherein the degree of electrical hollowness is high, mechanical strength (especially side-pressure strength) is excellent, and production of the cable can be conducted with stability. An insulation sheathing body (2) is composed of an inner-circular section (2a), multiple rib sections (2b) extending radially from this inner-circular section (2a), and an outer-circular section (2c) that connects the outer ends of the rib sections (2b), and is also provided with three or more gap sections (2d) surrounded by the inner-circular section (2a), the outer-circular section (2c), and each of the rib sections (2b). The hollow core body (10, 11), which has the insulation sheathing body (2) installed around the circumference of an inner conductor (1, 3), has the thickness of the inner-circular section (2a) made to be in a range of 1-4% of the outer circumference of the insulation sheathing body, and also made to be thinner than the rib sections (2b) and the outer-circular section (2c).

IPC Classes  ?

  • H01B 11/18 - Coaxial cablesAnalogous cables having more than one inner conductor within a common outer conductor
  • H01B 11/00 - Communication cables or conductors
  • H01B 13/016 - Apparatus or processes specially adapted for manufacturing conductors or cables for manufacturing co-axial cables

8.

METHOD AND APPARATUS FOR PRODUCING HOLLOW CORE ELEMENT FOR DIFFERENTIAL TRANSMISSION CABLE

      
Application Number JP2009071017
Publication Number 2010/095336
Status In Force
Filing Date 2009-12-17
Publication Date 2010-08-26
Owner UBE-NITTO KASEI CO., LTD. (Japan)
Inventor
  • Tanaka Seiji
  • Harada Ken

Abstract

Provided are a method and an apparatus for producing a hollow core element for a differential transmission cable, wherein the skew is not more than 10 ps/m. An insulation coating element composed of an insulating resin, which is comprised of an inner annular portion, an outer annular portion, and a plurality of coupling portions for coupling these annular portions, is formed around an inner conductor (1) by an extruder (22) provided with a die (22a).  After that, the insulation coating element is cooled by a cooling portion 23 of a water-cooling, air-cooling, or heating-cooling system.  The cooling conditions are adjusted in accordance with the variation of the permittivity (εr) of the hollow core element (11).

IPC Classes  ?

  • H01B 13/016 - Apparatus or processes specially adapted for manufacturing conductors or cables for manufacturing co-axial cables
  • H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables

9.

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

      
Application Number JP2009070982
Publication Number 2010/073947
Status In Force
Filing Date 2009-12-16
Publication Date 2010-07-01
Owner
  • NATIONAL UNIVERSITY CORPORATION TOHOKU UNIVERSITY (Japan)
  • UBE-NITTO KASEI CO., LTD. (Japan)
Inventor
  • Ohmi, Tadahiro
  • Bamba, Akinori
  • Suzuki, Hirokazu
  • Manabe, Nobuyuki
  • Koike, Tadashi

Abstract

The insulation breakdown voltage of a coating insulating film used in an element isolation region is improved.  A coating film formed from a composition that is obtained by adding one or more kinds of compounds, which contains a different element M capable of forming an oxide in an amount of 0.5-11.1 mol% relative to the mole number of Si, to a compound represented by the following general formula: ((CH3)nSiO2-n/2)x(SiO2)1-x (wherein n = 1-3 and 0 ≤ x ≤ 1.0), is used as an insulating coating film that is used in an element isolation region.

IPC Classes  ?

  • H01L 21/76 - Making of isolation regions between components
  • H01L 21/314 - Inorganic layers
  • H01L 21/316 - Inorganic layers composed of oxides or glassy oxides or oxide-based glass

10.

METHOD FOR FORMING METAL COATING FILM, AND ELECTRICALLY CONDUCTIVE PARTICLE

      
Application Number JP2009066366
Publication Number 2010/035708
Status In Force
Filing Date 2009-09-18
Publication Date 2010-04-01
Owner UBE-NITTO KASEI CO., LTD. (Japan)
Inventor Kuroda, Hidekatsu

Abstract

Disclosed is a method for forming a metal coating film, in which the metal coating film is formed on the surface of a non-electrically-conductive particle by electroless plating. In the method, the electroless plating is carried out after the pretreatment for attaching a metal core to the non-electrically-conductive particle and can form a metal coating film comprising silver in the presence of a hydrophilic polymer having a pyrrolidone group. Also disclosed is an electrically conductive particle which is imparted with electrical conductivity by forming a metal coating film on the whole surface of a non-electrically-conductive particle. The metal coating film comprises a coating film composed of only silver.

IPC Classes  ?

  • C23C 18/44 - Coating with noble metals using reducing agents
  • G02F 1/1339 - GasketsSpacersSealing of cells
  • H01B 5/00 - Non-insulated conductors or conductive bodies characterised by their form
  • H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables

11.

ELECTRONIC DEVICE HAVING GLASS BASE CONTAINING SODIUM AND METHOD FOR MANUFACTURING THE SAME

      
Application Number JP2009061562
Publication Number 2010/001793
Status In Force
Filing Date 2009-06-25
Publication Date 2010-01-07
Owner
  • NATIONAL UNIVERSITY CORPORATION TOHOKU UNIVERSITY (Japan)
  • UBE INDUSTRIES, LTD. (Japan)
  • UBE-NITTO KASEI CO., LTD. (Japan)
Inventor
  • Ohmi, Tadahiro
  • Watanuki, Kohei
  • Suzuki, Hirokazu

Abstract

Disclosed is an electronic device comprising a glass base (10) containing sodium, and a sodium diffusion-preventing film (11) which is a planarization coating film formed on the glass base (10).  An electronic element (12) is formed on the sodium diffusion-preventing film (11).

IPC Classes  ?

  • C03C 17/30 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating with organic material with silicon-containing compounds
  • H01J 5/08 - VesselsContainersShields associated therewithVacuum locks provided with coatings on the walls thereofSelection of materials for the coatings

12.

METHOD FOR PRODUCING HOLLOW CORE BODY OF COAXIAL CABLE, HOLLOW CORE BODY OF COAXIAL CABLE, AND COAXIAL CABLE

      
Application Number JP2009054847
Publication Number 2009/119339
Status In Force
Filing Date 2009-03-13
Publication Date 2009-10-01
Owner UBE-NITTO KASEI CO., LTD. (Japan)
Inventor
  • Tanaka, Seiji
  • Matsuno, Shigehiro
  • Suemori, Masaya

Abstract

Disclosed is a method for producing a hollow core body of a coaxial cable having a high hollow rate and stabilized electrical characteristics in the longitudinal direction. A method for producing a hollow core body of a coaxial cable comprising an inner conductor, and an insulating coating consisting of an inner annulus covering the inner conductor, a plurality of ribs extending radially from the inner annulus, and an outer annulus having outside diameter of 0.5 mm or less and coupling the outer edge of the ribs, and having a plurality of hollow portions surrounded by the inner annulus, the outer annulus, and the ribs, wherein the hollow portions occupy 40% or more of the area of an insulating portion and circularity of the outer annulus is 96.0% or above. The method for producing a hollow core body of a coaxial cable comprises at least following steps (1)-(3): (1) a step for extruding molten resin from a die which can form the insulating coating, (2) a step for heating resin which forms the insulating coating, and (3) a step for gradually cooling the resin forming the insulating coating at around the room temperature.

IPC Classes  ?

  • H01B 13/016 - Apparatus or processes specially adapted for manufacturing conductors or cables for manufacturing co-axial cables
  • H01B 11/18 - Coaxial cablesAnalogous cables having more than one inner conductor within a common outer conductor

13.

FIBER-REINFORCED SYNTHETIC-FIBER-MADE WIRE-LIKE MATERIAL, GABION BASKET MAT FOR CIVIL ENGINEERING WORKS AND CORF MADE BY USING THE MATERIAL, AND PROCESS FOR PRODUCTION OF FIBER REINFORCED SYNTHETIC-FIBER-MADE WIRE-LIKE MATERIAL

      
Application Number JP2008071433
Publication Number 2009/072424
Status In Force
Filing Date 2008-11-26
Publication Date 2009-06-11
Owner UBE-NITTO KASEI CO., LTD. (Japan)
Inventor
  • Iwata, Tatsumi
  • Isobe, Masato
  • Irie, Yoshiki

Abstract

The invention provides a fiber-reinforced synthetic-fiber-made wire-like material which is freed from dripping and has excellent physical properties. In producing a fiber-reinforced synthetic-fiber-made wire-like material by heat-curing a wire-like material intermediate which is obtained by impregnating filaments (11) with an uncured thermosetting resin (12) and covering the outer periphery of the resulting filaments (11) with a thermoplastic resin (13), the uncured thermosetting resin (12) can be inhibited from dripping in the heat-curing by incorporating previously a thickening agent and a penetrating-thickening into the uncured thermosetting resin.

IPC Classes  ?

  • D06M 15/227 - Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds of hydrocarbons, or reaction products thereof, e.g. afterhalogenated or sulfochlorinated
  • D04C 1/06 - Braid or lace serving particular purposes
  • D06M 15/00 - Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials with macromolecular compoundsSuch treatment combined with mechanical treatment
  • D06M 15/21 - Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
  • D06M 15/263 - Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds of unsaturated carboxylic acidsSalts or esters thereof
  • D06M 15/555 - Epoxy resins modified by compounds containing phosphorus
  • D06M 15/70 - Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials with macromolecular compoundsSuch treatment combined with mechanical treatment combined with mechanical treatment

14.

METHOD FOR FORMATION OF METAL COATING FILM, AND ELECTRICALLY CONDUCTIVE PARTICLE

      
Application Number JP2008069024
Publication Number 2009/054371
Status In Force
Filing Date 2008-10-21
Publication Date 2009-04-30
Owner UBE-NITTO KASEI CO., LTD. (Japan)
Inventor Kuroda, Hidekatsu

Abstract

Disclosed is a method for forming a metal coating film, which is characterized by forming a metal coating film on an electrically non-conductive particle having a particle diameter of 0.5 to 100 &mgr;m by electroless plating. The electroless plating is carried out after a pre-treatment for attaching a metal core to the electrically non-conductive particle is carried out, and can form a metal coating film made of silver in the presence of a silane compound having a thiol group. The metal coating film formed over the entire surface of the electrically non-conductive particle can impart electrical conductivity to the electrically non-conductive particle. The electrically non-conductive particle has a particle diameter ranging from 0.5 to 100 &mgr;m. The metal coating film is composed of a single silver layer.

IPC Classes  ?

15.

PHOTOCATALYTIC FILM, METHOD FOR PRODUCTION OF PHOTOCATALYTIC FILM, ARTICLE, AND HYDROPHILIZATION METHOD

      
Application Number JP2008069174
Publication Number 2009/051271
Status In Force
Filing Date 2008-10-16
Publication Date 2009-04-23
Owner UBE NITTO KASEI CO., LTD. (Japan)
Inventor
  • Tanaka, Naoki
  • Kitagawa, Takeshi
  • Suematsu, Daisuke
  • Takami, Kazuyuki

Abstract

Disclosed is a photocatalytic film which contains a photosemiconductor particle in at least one main surface thereof, wherein the main surface can be hydrophilized by the irradiation with light. When the photocatalytic film is irradiated with a light having a half-value width of 15 nm or less after being kept in a dark place, the rate of hydrophilization is less than 2 (1/deg/min/105) in the region where the irradiated light has a wavelength of 370 nm or longer, and 2 (1/deg/min/105) or more in at least a part of the region where the irradiated light has a wavelength of 300 to 360 nm.

IPC Classes  ?

  • B01J 35/02 - Solids
  • B01J 21/06 - Silicon, titanium, zirconium or hafniumOxides or hydroxides thereof
  • B01J 37/10 - Heat treatment in the presence of water, e.g. steam

16.

METHOD FOR MANUFACTURING ELECTRONIC DEVICE

      
Application Number JP2008066080
Publication Number 2009/034926
Status In Force
Filing Date 2008-09-05
Publication Date 2009-03-19
Owner
  • NATIONAL UNIVERSITY CORPORATION TOHOKU UNIVERSITY (Japan)
  • ZEON CORPORATION (Japan)
  • UBE INDUSTRIES, LTD. (Japan)
  • UBE-NITTO KASEI CO., LTD. (Japan)
Inventor
  • Ohmi, Tadahiro
  • Fujimura, Makoto
  • Koike, Tadashi
  • Bamba, Akinori
  • Kobayashi, Akihiro
  • Watanuki, Kohei

Abstract

Provided is a method for manufacturing an electronic device wherein a conductor layer is uniformly formed on a substrate having a super large area. In the method for manufacturing the electronic device, a metal film for forming a gate electrode is selectively embedded in a transparent resin film formed on a substrate, and the metal film is formed by sputtering directly on the substrate at the gate electrode portion, and on an insulating coat film on portions other than the gate electrode portion. The metal film on the insulating coat film is removed by chemical liftoff with removal of the insulating coat film by etching.

IPC Classes  ?

  • H01L 21/336 - Field-effect transistors with an insulated gate
  • G02F 1/1368 - Active matrix addressed cells in which the switching element is a three-electrode device
  • H01L 21/28 - Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups
  • H01L 21/306 - Chemical or electrical treatment, e.g. electrolytic etching
  • H01L 21/3205 - Deposition of non-insulating-, e.g. conductive- or resistive-, layers, on insulating layersAfter-treatment of these layers
  • H01L 29/786 - Thin-film transistors

17.

FIBER-REINFORCED RESIN SHEET FOR REPAIR/REINFORCEMENT OF CONCRETE STRUCTURE AND PROCESS FOR PRODUCING THE SAME

      
Application Number JP2008064939
Publication Number 2009/031414
Status In Force
Filing Date 2008-08-21
Publication Date 2009-03-12
Owner UBE NITTO KASEI CO., LTD. (Japan)
Inventor
  • Arai, Takashi
  • Koyama, Nobumichi
  • Ohta, Akio
  • Kato, Yasushi

Abstract

A fiber-reinforced resin sheet for the repair/reinforcement of a concrete structure which comprises: a mesh material comprising monofilaments which each is a sea-island type composite organic fiber having a sea part and fiber-form island parts disposed in the sea part and which have been disposed in a net arrangement while leaving spaces among them; and a sheet-form transparent resin layer in which the mesh material has been embedded.

IPC Classes  ?

  • B32B 13/14 - Layered products essentially comprising a water-setting substance, e.g. concrete, plaster, asbestos cement, or like builders' material next to a fibrous or filamentary layer
  • B32B 5/02 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments
  • B32B 13/12 - Layered products essentially comprising a water-setting substance, e.g. concrete, plaster, asbestos cement, or like builders' material comprising such substances as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
  • D01F 8/04 - Conjugated, i.e. bi- or multicomponent, man-made filaments or the likeManufacture thereof from synthetic polymers
  • D01F 8/06 - Conjugated, i.e. bi- or multicomponent, man-made filaments or the likeManufacture thereof from synthetic polymers with at least one polyolefin as constituent
  • D03D 1/00 - Woven fabrics designed to make specified articles
  • D03D 9/00 - Open-work fabrics
  • D03D 15/00 - Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used

18.

SEMICONDUCTOR DEVICE, AND ITS MANUFACTURING METHOD

      
Application Number JP2008064573
Publication Number 2009/022719
Status In Force
Filing Date 2008-08-14
Publication Date 2009-02-19
Owner
  • NATIONAL UNIVERSITY CORPORATION TOHOKU UNIVERSITY (Japan)
  • TOKYO ELECTRON LIMITED (Japan)
  • UBE INDUSTRIES, LTD. (Japan)
  • UBE-NITTO KASEI CO., LTD. (Japan)
Inventor
  • Ohmi, Tadahiro
  • Matsuoka, Takaaki
  • Inokuchi, Atsutoshi
  • Watanuki, Kohei
  • Koike, Tadashi
  • Adachi, Tatsuhiko

Abstract

Intended is to manufacture a semiconductor device including a shallow trench element separating region and an inter-layer insulating film of a multi-layered structure. A method for manufacturing the semiconductor device has to use a CMP repeatedly, but this CMP itself takes a high cost so that the manufacturing cost is raised by the repeated uses of the CMP. The insulating film to be used in a shallow trench (ST) element separating region and/or the inter-layer insulating film as the lowermost layer is exemplified by an insulating coating film, which can be applied by a spin-coating method. This insulating coating film has such a composition as is expressed by (CH3)nSiO2-n/2)x(SiO2)1-x (wherein n = 1 to 3, and 0 ≤ x ≤ 1.0), and a film of a different specific dielectric constant k is formed by selecting a heat-treatment condition. Moreover, an STI element separating region can be formed by modifying the insulating coating film completely into an SiO2 film, and the inter-layer insulating film of the small dielectric constant k can be formed by making it into an incompletely modified state.

IPC Classes  ?

  • H01L 21/76 - Making of isolation regions between components
  • H01L 21/312 - Organic layers, e.g. photoresist
  • H01L 21/3205 - Deposition of non-insulating-, e.g. conductive- or resistive-, layers, on insulating layersAfter-treatment of these layers
  • H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device
  • H01L 21/8238 - Complementary field-effect transistors, e.g. CMOS
  • H01L 27/08 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind
  • H01L 27/092 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors

19.

INTERLAYER INSULATION FILM AND WIRING STRUCTURE, AND THEIR MANUFACTURING METHOD

      
Application Number JP2008064572
Publication Number 2009/022718
Status In Force
Filing Date 2008-08-14
Publication Date 2009-02-19
Owner
  • NATIONAL UNIVERSITY CORPORATION TOHOKU UNIVERSITY (Japan)
  • TOKYO ELECTRON LIMITED (Japan)
  • UBE INDUSTRIES, LTD. (Japan)
  • UBE-NITTO KASEI CO., LTD. (Japan)
Inventor
  • Ohmi, Tadahiro
  • Matsuoka, Takaaki
  • Inokuchi, Atsutoshi
  • Watanuki, Kohei
  • Koike, Tadashi
  • Adachi, Tatsuhiko

Abstract

An insulative coat film comprising one or two or more kinds of oxides having a dielectric constant (k) of 2.5 or smaller and expressed by a general formula of ((CH3)nSiO2-n/2)x(SiO2)1-x (where n=1 to 3, x≤1) is used to form an interlayer insulation film. The insulative coat film applied by spin-coating is flat without reflecting underlying unevenness, and the heat-treated film has surface roughness of 1 nm or less in Ra and 20 nm or less in a P-V value. The interlayer insulation film containing the insulative coat film can have a wiring structure and an electrode formed only by etchingwithout need of a CMP process.

IPC Classes  ?

  • H01L 21/312 - Organic layers, e.g. photoresist
  • H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device
  • H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body

20.

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

      
Application Number JP2007074451
Publication Number 2008/075727
Status In Force
Filing Date 2007-12-19
Publication Date 2008-06-26
Owner
  • NATIONAL UNIVERSITY CORPORATION TOHOKU UNIVERSITY (Japan)
  • ZEON CORPORATION (Japan)
  • UBE-NITTO KASEI CO., LTD. (Japan)
  • UBE INDUSTRIES, LTD. (Japan)
Inventor
  • Ohmi, Tadahiro
  • Sugitani, Koichi
  • Koike, Tadashi
  • Bamba, Akinori
  • Kobayashi, Akihiro
  • Watanuki, Kohei

Abstract

Disclosed is a thin-film transistor (TFT) having a gate insulating film excellent in transparency and planarity. Also disclosed is a method for manufacturing such a thin-film transistor. A transparent insulating film (131) composed of an oxide represented by RxMOy is formed as a gate insulating film arranged between a gate electrode and a semiconductor layer. The transparent insulating film (131) is made of a coating agent which is composed of one mixed liquid obtained by dissolving or dispersing a condensate, which is obtained by subjecting a compound represented by RxMXm-x (wherein R represents a non-hydrolyzable substituent, M represents Si, Ti, Al, Zr, Zn, Sn or In, X represents a hydrolyzable substituent, x represents an integer of 0-3, and m represents the valence of M) to a hydrolysis-condensation reaction, in an organic solvent, water or their mixed solvent, or alternatively a coating agent which is obtained by mixing two or more of such mixed liquids.

IPC Classes  ?

21.

REINFORCING SHORT FIBER FOR CEMENT MOLDING

      
Application Number JP2007068665
Publication Number 2008/038658
Status In Force
Filing Date 2007-09-26
Publication Date 2008-04-03
Owner UBE-NITTO KASEI CO., LTD. (Japan)
Inventor
  • Fukuda, Naoya
  • Ishii, Toku
  • Meguro, Yuuki
  • Oota, Shinji
  • Takahashi, Hideki
  • Shinya, Toshinori
  • Shiina, Takayoshi
  • Kurabayashi, Kiyoshi
  • Tanaka, Tooru
  • Shimizu, Youichirou

Abstract

A reinforcing short fiber for cement molding, consisting of an oriented fiber composed mainly of a synthetic resin, which fiber in its cross-section configuration is roughly a polygon having three or more projecting portions, at least one side portion of the polygon provided with depressed portions with given intervals along the longitudinal direction of the fiber. The reinforcing short fiber for cement molding, as a reinforcing short fiber for cement molding in civil engineering, construction work, etc., has satisfactory fixing power with cement paste and, at charging and mixing, exhibits good spreadability and good dispersibility in concrete.

IPC Classes  ?

  • C04B 16/06 - Macromolecular compounds fibrous
  • D01D 4/02 - Spinnerettes
  • D01D 5/253 - Formation of filaments, threads, or the like with a non-circular cross sectionSpinnerette packs therefor
  • D01F 6/00 - Monocomponent man-made filaments or the like of synthetic polymersManufacture thereof
  • D01F 6/04 - Monocomponent man-made filaments or the like of synthetic polymersManufacture thereof from homopolymers obtained by reactions only involving carbon-to-carbon unsaturated bonds from polyolefins
  • D01F 6/06 - Monocomponent man-made filaments or the like of synthetic polymersManufacture thereof from homopolymers obtained by reactions only involving carbon-to-carbon unsaturated bonds from polyolefins from polypropylene

22.

BASE MATERIAL COVERED WITH METAL LAYER AND PROCESS FOR PRODUCING THE SAME

      
Application Number JP2007068002
Publication Number 2008/032839
Status In Force
Filing Date 2007-09-07
Publication Date 2008-03-20
Owner UBE NITTO KASEI CO., LTD. (Japan)
Inventor Kuroda, Hidekatsu

Abstract

A base material covered with metal layer characterized by having a base material, metal nanoparticles in dotted or layered form provided on the base material via a silane coupling agent containing a chelate forming functional group, and a metal layer superimposed on the metal nanoparticles in dotted or layered form. Further, there is provided a process for producing a base material covered with metal layer, characterized by including bringing a base material into contact with a water base solution containing a hydrolysis catalyst, a silane coupling agent containing a chelate forming functional group and a metal nanoparticle forming metal salt and treating the resultant mixture with a reducing agent to thereby obtain metal nanoparticles in dotted or layered form provided on the base material via the silane coupling agent containing a chelate forming functional group, and thereafter forming a metal layer on the metal nanoparticles in dotted or layered form.

IPC Classes  ?

  • C23C 18/18 - Pretreatment of the material to be coated
  • C23C 18/42 - Coating with noble metals
  • H01B 5/00 - Non-insulated conductors or conductive bodies characterised by their form
  • H01B 5/14 - Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports

23.

METHOD AND DEVICE FOR MANUFACTURING SPIRAL SPACER

      
Application Number JP2006307973
Publication Number 2007/113924
Status In Force
Filing Date 2006-04-14
Publication Date 2007-10-11
Owner UBE-NITTO KASEI CO., LTD. (Japan)
Inventor
  • Sera, Masaki
  • Hirano, Chihiro

Abstract

⏧PROBLEMS] To increase productivity. ⏧MEANS FOR SOLVING PROBLEMS] This device for manufacturing a spiral spacer comprises a tension member wire disposed at its center and a spacer body part covered on the outer periphery of the tension member wire and having a plurality of spiral grooves formed in the outer periphery thereof. A twisting device (10) holding the tension member wire (A) and imparting twist thereto is installed immediately before a non-rotating die (12) for extruding a molten resin for molding for the spacer body part to the outer periphery of the tension member wire (A). The twisting device (10) comprises holding mechanism parts (100) for the tension member wire (A) and a twisting mechanism part (101) for the holding mechanism parts (100). The holding mechanism parts (100) are disposed oppositely to each other on both sides of the tension member wire (A), and comprise a plurality of rollers (100b) formed in pairs and supporting the tension member wire (A). The multiple sets of rollers (100b) are disposed along the extension direction of the tension member wire (A). High friction members (100j) are installed on the outer peripheral surfaces of the rollers (100b).

IPC Classes  ?

  • G02B 6/44 - Mechanical structures for providing tensile strength and external protection for fibres, e.g. optical transmission cables

24.

COMPOSITE PLATE MATERIAL AND BOX-FORM OBJECT MADE OF THE COMPOSITE PLATE MATERIAL

      
Application Number JP2006315624
Publication Number 2007/043239
Status In Force
Filing Date 2006-08-08
Publication Date 2007-04-19
Owner UBE-NITTO KASEI CO., LTD. (Japan)
Inventor Matsuura, Masahiro

Abstract

⏧PROBLEMS] To provide: a composite plate material made up of plate materials certainly superposed without using an adhesive; and a box-form object made of this plate material. ⏧MEANS FOR SOLVING PROBLEMS] The composite plate material has a multilayer structure and is suitable for use as a structural material, a protective material, a face material for box-form objects such as carry containers and packaging cases, etc. It is easy to recycle. For example, the composite plate material (1) has a multilayer structure comprising thermoplastic resin plate materials (A) and (B) united with each other by fusion-bonding at least peripheral regions (X) of the plate plane parts of the thermoplastic resin plate materials like rimming. Plates of the same kind or different kinds selected from various materials can be superposed by this method.

IPC Classes  ?

  • B32B 3/02 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
  • B32B 3/28 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layerLayered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a layer with cavities or internal voids characterised by a layer comprising a deformed thin sheet, e.g. corrugated, crumpled
  • B65D 65/40 - Applications of laminates for particular packaging purposes

25.

METHOD AND DEVICE FOR MANUFACTURING SPIRAL SPACER

      
Application Number JP2006307970
Publication Number 2007/039948
Status In Force
Filing Date 2006-04-14
Publication Date 2007-04-12
Owner UBE-NITTO KASEI CO., LTD. (Japan)
Inventor
  • Sera, Masaki
  • Watanabe, Kazunori
  • Shimizu, Kazuyoshi

Abstract

⏧PROBLEMS] To increase productivity. ⏧MEANS FOR SOLVING THE PROBLEMS] This device is used for manufacturing a spiral spacer having a high tension wire disposed at its center and a spacer body part coated on the outer periphery of the high tension wire and having a plurality of spiral grooves formed in its outer periphery. A twisting device (10) for holding the high tension wire (A) and imparting twist to the wire is provided in just front of a non-rotating die (12) for extruding a molten resin for molding the spacer body part to the outer periphery of the high tension wire (A). The twisting device (10) comprises a holding mechanism part (100) for holding the high tension wire (A) and a twisting mechanism part (101) for the holding mechanism part (100). The holding mechanism part (100) has a plurality of steel rollers formed in pairs which are disposed oppositely to each other around the high tension wire (A) as a center, and hold the high tension wire (A). The paired sets of steel rollers are disposed along the direction of extension of the high tension wire (A).

IPC Classes  ?

  • G02B 6/44 - Mechanical structures for providing tensile strength and external protection for fibres, e.g. optical transmission cables
  • B29C 47/02 - incorporating preformed parts or layers, e.g. extrusion moulding around inserts or for coating articles
  • B29C 47/08 - Component parts, details or accessories; Auxiliary operations
  • B29L 9/00 - Layered products

26.

ANTIFOULING BASE FOR PRINTING, PRINTED MATTER USING SAME AND PRINTED BODY

      
Application Number JP2005012870
Publication Number 2006/137173
Status In Force
Filing Date 2005-07-12
Publication Date 2006-12-28
Owner UBE-NITTO KASEI CO., LTD. (Japan)
Inventor
  • Nakasone, Takayoshi
  • Nakayama, Norihiro
  • Tanaka, Shinji
  • Tanaka, Naoki

Abstract

Disclosed is an antifouling base for printing which exhibits self-cleaning properties for a long time due to photocatalytic activity. Also disclosed are a printed matter using such an antifouling base and a printed body. Specifically disclosed is an antifouling base for printing which is characterized in that a photocatalytically active layer is arranged on one side of an organic base via an activity blocking layer and the other side of the organic base serves as a printing surface.

IPC Classes  ?

  • C08J 7/04 - Coating
  • B32B 27/00 - Layered products essentially comprising synthetic resin
  • G09F 15/00 - Boards, hoardings, pillars, or like structures for notices, placards, posters, or the like
  • G09F 19/22 - Advertising or display means on roads, walls or similar surfaces, e.g. illuminated
  • C08L 101/00 - Compositions of unspecified macromolecular compounds

27.

ANTIFOULING PRINTING SHEET

      
Application Number JP2006312425
Publication Number 2006/137446
Status In Force
Filing Date 2006-06-21
Publication Date 2006-12-28
Owner UBE-NITTO KASEI CO., LTD. (Japan)
Inventor
  • Nakasone, Takayoshi
  • Nakayama, Norihiro
  • Tanaka, Shinji
  • Tanaka, Naoki
  • Takami, Kazuyuki

Abstract

An antifouling printing sheet characterized by having a hydrophobic antifouling layer formed on one side of a transparent base sheet and a printing surface on the other side, a printed object having a printed antifouling printing sheet, a printed body. The antifouling printing sheet has a self-cleaning capability thanks to a photocatalyst activation action over a long period of time. A printed object and a printed body using the sheet are also provided.

IPC Classes  ?

  • B32B 27/00 - Layered products essentially comprising synthetic resin
  • B32B 27/36 - Layered products essentially comprising synthetic resin comprising polyesters
  • B41J 2/01 - Ink jet
  • B41M 5/00 - Duplicating or marking methodsSheet materials for use therein
  • B41M 5/50 - Recording sheets characterised by the coating used to improve ink, dye or pigment receptivity, e.g. for ink-jet or thermal dye transfer recording
  • B41M 5/52 - Macromolecular coatings
  • G09F 7/00 - Signs, name or number plates, letters, numerals, or symbolsPanels or boards
  • G09F 15/02 - Bills, posters, or the like therefor

28.

PLASTIC TUNNEL CULTIVATION FRAME AND METHOD FOR PRODUCING THE SAME

      
Application Number JP2006311244
Publication Number 2006/132190
Status In Force
Filing Date 2006-06-05
Publication Date 2006-12-14
Owner UBE-NITTO KASEI CO., LTD. (Japan)
Inventor
  • Irie, Yoshiki
  • Fukuhara, Jun
  • Iwata, Tatsumi

Abstract

An agricultural plastic tunnel cultivation frame which is an arcuate frame comprising a long member containing fiber-reinforced synthetic resin and consisting of a bent portion and a body portion, characterized in that the cross-section of the bent portion is different from that of the body portion and the ratio ⏧Rm/Rf] of the rigidity (Rm) of the body portion and the rigidity (Rf) of the bent portion is 2.0-4.0. A method for producing a frame having a cross-section of three-layer structure forming an arch by a ceiling portion, a bent portion, an erected portion and an underground buried portion, and a plastic tunnel cultivation frame made of fiber-reinforced resin and capable of forming an inverted U-shaped tunnel are also provided.

IPC Classes  ?

  • A01G 13/02 - Protective coverings for plants; Devices for laying-out coverings
  • B29C 47/00 - Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor (extrusion blow-moulding B29C 49/04)
  • B29C 69/00 - Combinations of shaping techniques not provided for in a single one of main groups , e.g. associations of moulding and joining techniquesApparatus therefor