Abstract

Disclosed herein is a method for transferring die from a wafer that includes picking two or more die from a wafer using a multi-spindle picking head, wherein the multi-spindle picking head is rotatable. The method includes moving the multi-spindle picking head from the wafer feeder to a placement machine, and presenting the two or more picked die to the placement machine for subsequent placement. Further disclosed herein is an apparatus for transferring die from a wafer that includes a picking head with a plurality of spindles. Each spindle is configured to pick a die from a wafer of die. The multi-spindle picking head is rotatable and moveable in at least one direction.

IPC Classes  ?

• H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment

Abstract

A component tape comprising a base tape that includes pockets configured to house electrical components for placement on a printed circuit board and a cover tape, covering the base tape wherein a portion of the cover tape is configured to engage with a tape engagement feature of a component tape feeder.

IPC Classes  ?

• B65D 85/86 - Containers, packaging elements or packages, specially adapted for particular articles or materials for electrical components

Abstract

Provided is a component tape feeder apparatus comprising a single output module, a single component exposure module, operably connected to the single output module, and, a plurality of input modules, wherein each input module of the plurality of input modules is operably connected to the single exposure module. A corresponding method of feeding electronic components includes supplying a plurality of component tapes housing electronic components to the single exposure module, wherein the supplying involves receiving and forwarding of the plurality of component tapes by the plurality of input modules.

IPC Classes  ?

• B65H 5/28 - Feeding articles stored in rolled or folded bands
• G07F 11/68 - Coin-freed apparatus for dispensing, or the like, discrete articles in which the articles are torn or severed from strips or sheets
• B65H 20/00 - Advancing webs
• B65H 23/00 - Registering, tensioning, smoothing, or guiding webs
• B65H 57/18 - Guides for filamentary materialsSupports therefor mounted to facilitate unwinding of material from packages

Goods & Services

Electrical machines, namely, machines used in electronic circuit board assembly, namely machines for mounting and bonding electronic components in the assembly of electronic circuit boards

Goods & Services

Electronic component delivery systems for use in the field of printed circuit board assembly, composed of bare die feeders, reel feeders and component tape, feeder storage carts, feeder calibration and set-up stations, component bulk feeders and label printers/feeders, all sold as a unit

Goods & Services

Electronic component delivery systems for use in the field of printed circuit board assembly, composed of component tape and reel feeders, feeder storage carts, feeder calibration and set-up stations, bare die feeders, component bulk feeders and label printers/feeders, all sold as a unit

Goods & Services

computer programs for use in connection with electronic component assembly production lines, namely, process line monitoring and programming software and process line optimization software

Goods & Services

Machines for the Manufacture, Preparation and Circuit Integration of Electronic Components-Namely, Diodes, Registers, Capacitators, Terminals, Transistors, Modules, Jumper & Terminal Wires, and Microelectronic Circuit Apparatus

Goods & Services

Computer Hardware-Namely, Data Input and Readout Components, Interrelated Machine Controllers, and Memory Storage for Use with Programmable Automatic Machinery Systems

Goods & Services

Computer Hardware-Namely, Data Input and Readout Components, Interrelated Machine Controllers, and Memory Storage for Use with Programmable Automatic Machinery Systems

Goods & Services

MACHINES FOR THE MANUFACTURE, PREPARATION AND CIRCUTT INTEGRATION OF ELECTRONIC COMPONENTS-NAMELY, DIODES, RESISTORS, CAPACITORS, TERMINALS, TRANSISTORS, MODULES, AND JUMPER AND TERMINAL WIRES