VTI Technologies Oy

Finland

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IPC Class
G01C 19/56 - Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces 9
B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes 6
G01P 15/08 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values 3
G01P 15/18 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration in two or more dimensions 3
H03H 9/02 - Networks comprising electromechanical or electro-acoustic elementsElectromechanical resonators Details 3
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Found results for  patents

1.

Method for the precise measuring operation of a micromechanical rotation rate sensor

      
Application Number 13266613
Grant Number 08794047
Status In Force
Filing Date 2010-04-28
First Publication Date 2012-05-17
Grant Date 2014-08-05
Owner
  • Continental Teves AG & Co. oHG (Germany)
  • VTI Technologies Oy (Finland)
Inventor
  • Günthner, Stefan
  • Hilser, Roland
  • Sivaraman, Ramnath
  • Schmid, Bernhard
  • Klemetti, Petri

Abstract

f).

IPC Classes  ?

  • G01C 19/56 - Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces

2.

IMPROVED MICROMECHANICAL RESONATOR

      
Application Number FI2011050152
Publication Number 2011/101547
Status In Force
Filing Date 2011-02-18
Publication Date 2011-08-25
Owner VTI TECHNOLOGIES OY (Finland)
Inventor Kaajakari, Ville

Abstract

The object of the invention is to provide an improved structure for a microelectromechanical (MEMS) resonator. According to a first aspect of the invention, the resonator structure in accordance with the invention has a characteristic frequency of oscillation in combination with a given mechanical amplitude, whereby to set said mechanical amplitude, in the resonator structure, by way anchoring at an anchor point (A) located at a given point of the resonator structure substrate, a first element (1) is adapted oscillatory and a second element (2) is adapted oscillatory in such a manner that at least one of said first element and of said second element are arranged to oscillate synchronously with regard to said anchor point (A), whereby the location of said anchor point (A) is selected to be substantially within the joint projection defined by the dimensions of said first (1) and said second element (2).

IPC Classes  ?

  • H03H 9/02 - Networks comprising electromechanical or electro-acoustic elementsElectromechanical resonators Details
  • H03H 9/24 - Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
  • G01C 19/56 - Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces

3.

BULK ACOUSTIC WAVE RESONATOR AND METHOD OF MANUFACTURING THEREOF

      
Application Number FI2010050935
Publication Number 2011/061402
Status In Force
Filing Date 2010-11-19
Publication Date 2011-05-26
Owner
  • TEKNOLOGIAN TUTKIMUSKESKUS VTT (Finland)
  • VTI TECHNOLOGIES OY (Finland)
Inventor
  • Jaakkola, Antti
  • Kuisma, Heikki

Abstract

The invention concerns a novel bulk acoustic wave (BAW) resonator design and method of manufacturing thereof. The bulk acoustic wave resonator comprises a resonator portion, which is provided with at least one void having the form of a trench which forms a continuous closed path on the resonator portion. By manufacturing the void in the same processing step as the outer dimensions of the resonator portion, the effect of processing variations on the resonant frequency of the resonator can be reduced. By means of the invention, the accuracy of BAW resonators can be increased.

IPC Classes  ?

  • H03H 9/02 - Networks comprising electromechanical or electro-acoustic elementsElectromechanical resonators Details
  • H03H 9/15 - Constructional features of resonators consisting of piezoelectric or electrostrictive material
  • H03H 3/04 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
  • H03H 3/007 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
  • H01P 7/06 - Cavity resonators

4.

METHOD AND DEVICE FOR ENERGY HARVESTING

      
Application Number FI2010050785
Publication Number 2011/042611
Status In Force
Filing Date 2010-10-08
Publication Date 2011-04-14
Owner
  • VTI Technologies Oy (Finland)
  • Toyota Motor Corporation (Japan)
Inventor
  • Kärkkäinen, Anna-Maija
  • Kyynäräinen, Jukka
  • Roschier, Leif
  • Kuisma, Heikki

Abstract

A device (100) harvests energy from vibration and/or strain and utilises both capacitive (102a, 102b) and piezoelectric elements(105). The principle of operation is out-of-plane capacitive harvester,where the bias voltage for the capacitive element is generated with a piezoelectric element(105). The device utilizes a thin dielectric film (104) between the capacitor plates (102a, 102b) maximizing the harvested energy and enabling the harvester operation in semi-contact mode so that short circuits are prevented. For example when utilised in a wheel or the like, the capacitor is closed and opened at every strike or every turn of a wheel being thus independent of the harvester's mechanical resonance frequency.

IPC Classes  ?

  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
  • H01L 41/113 - Piezo-electric or electrostrictive elements with mechanical input and electrical output
  • B60C 23/04 - Signalling devices actuated by tyre pressure mounted on the wheel or tyre

5.

METHOD FOR THE PRECISE MEASURING OPERATION OF A MICROMECHANICAL ROTATION RATE SENSOR

      
Application Number EP2010055708
Publication Number 2010/125098
Status In Force
Filing Date 2010-04-28
Publication Date 2010-11-04
Owner
  • CONTINENTAL TEVES AG & CO. OHG (Germany)
  • VTI TECHNOLOGIES OY (Finland)
Inventor
  • Sivaraman, Ramnath
  • Schmid, Bernhard
  • Hilser, Roland
  • Günthner, Stefan
  • Klemetti, Petri

Abstract

The invention relates to a method for the precise measuring operation of a micromechanical rotation rate sensor, comprising at least one deflectably suspended seismic mass (1, 15, 20), at least one drive system for driving the seismic mass (1, 15, 20), and at least one first (2, 11, 18) and one second (3, 12, 19) trimming electrode element, which are jointly associated directly or indirectly with the seismic mass (1, 15, 20), wherein a first electrical trimming voltage (UT01, UTL01, UTR01) is set between the first trimming electrode element (2, 11, 18) and the seismic mass (1, 15, 20) and a second electrical trimming voltage (UT02, UTL02, UTR02) is set between the second trimming electrode element (3, 12, 19) and the seismic mass (1, 15, 20), wherein the first and the second electrical trimming voltage are set at least according to a quadrature parameter (UT) and a resonance parameter (Uf).

IPC Classes  ?

  • G01C 19/56 - Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces

6.

MICRO-MECHANICAL SENSOR OF ANGULAR VELOCITY

      
Application Number FI2010050159
Publication Number 2010/100333
Status In Force
Filing Date 2010-03-01
Publication Date 2010-09-10
Owner VTI TECHNOLOGIES OY (Finland)
Inventor Blomqvist, Anssi

Abstract

The invention presents a micro-mechanical resonator, comprising two masses coupled in the direction of a common axis by a spring structure such, that the spring structure comprises a spring that couples at least a first bar connected to the masses and a second bar extending in the motion axis direction, said spring being arranged to bend in a direction perpendicular to the motion direction of the motion axis. The invention also relates to a micro-mechanical resonator matrix, a sensor and a navigation device.

IPC Classes  ?

  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
  • G01C 19/56 - Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
  • G01C 21/10 - NavigationNavigational instruments not provided for in groups by using measurement of speed or acceleration
  • G01P 3/14 - Devices characterised by the use of mechanical means by exciting one or more mechanical resonance systems

7.

VIBRATING MICRO-MECHANICAL SENSOR OF ANGULAR VELOCITY

      
Application Number FI2010050160
Publication Number 2010/100334
Status In Force
Filing Date 2010-03-01
Publication Date 2010-09-10
Owner VTI TECHNOLOGIES OY (Finland)
Inventor
  • Blomqvist, Anssi
  • Ruohio, Jaakko

Abstract

The invention relates to measuring devices used for measuring angular velocity, and more precisely, to vibrating micro-mechanical sensors of angular velocity. The sensor of angular velocity according to the invention comprises at least two seismic mass structures (1), (2), excitation structures (3), (4) and coupling seesaw type springs (6), (7). The objective of the invention is to provide an improved sensor structure, which enables reliable measuring with good efficiency particularly in small vibrating micro-mechanical angular velocity sensor solutions.

IPC Classes  ?

  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
  • G01C 19/56 - Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
  • G01P 3/14 - Devices characterised by the use of mechanical means by exciting one or more mechanical resonance systems

8.

VIBRATING MICRO-MECHANICAL SENSOR OF ANGULAR VELOCITY

      
Application Number FI2009050270
Publication Number 2009/127782
Status In Force
Filing Date 2009-04-08
Publication Date 2009-10-22
Owner VTI TECHNOLOGIES OY (Finland)
Inventor Blomqvist, Anssi

Abstract

The invention relates to measuring devices used in measuring angular velocity and, more precisely, to vibrating micro-mechanical sensors of angular velocity. The sensor of angular velocity according to the invention is adapted to measure angular velocity in relation to two or three axes, and at the least two seismic masses (34-36, 52-53, 71-75) of the sensor of angular velocity are adapted to be activated into primary motion vibration by means of a common mode. The structure of the sensor of angular velocity according to the invention enables reliable measuring with good performance, particularly in small size vibrating micro-mechanical sensors of angular velocity.

IPC Classes  ?

  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
  • G01C 19/56 - Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
  • G01P 3/44 - Devices characterised by the use of electric or magnetic means for measuring angular speed

9.

A MICROMECHANICAL RESONATOR

      
Application Number FI2009000020
Publication Number 2009/092846
Status In Force
Filing Date 2009-01-23
Publication Date 2009-07-30
Owner VTI TECHNOLOGIES, OY (Finland)
Inventor Kaajakari, Ville

Abstract

The invention relates to design of micromechanical resonators and, more precisely, to the design of microelectro- mechanical systems (MEMS) resonators. The invention provides an improved design structure for a microelectromechanical systems (MEMS) resonator in which the width of the spring elements (3), (23-24), (27- 30) is greater than the width of the electrode fingers (5-9), (25-26), (31-34), said widths specifically dimensioned so that the sensitivity of the resonant frequency change with respect to dimensional manufacturing variations Formula approaches zero. The improved structure is frequency robust to manufacturing variations and enables reliable frequency referencing with good performance, particularly in small size solutions.

IPC Classes  ?

  • H03H 9/02 - Networks comprising electromechanical or electro-acoustic elementsElectromechanical resonators Details
  • H03H 9/24 - Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes

10.

VIBRATING MICROMECHANICAL SENSOR OF ANGULAR VELOCITY

      
Application Number FI2008050539
Publication Number 2009/043967
Status In Force
Filing Date 2008-09-29
Publication Date 2009-04-09
Owner VTI TECHNOLOGIES OY (Finland)
Inventor
  • Klemetti, Petri
  • Nera, Kaisa
  • Lipsanen, Antti
  • Blomqvist, Anssi
  • Torkkeli, Altti

Abstract

The invention relates to measuring devices to be used in the measuring of angular velocity and, more precisely, to vibrating micromechanical sensors of angular velocity. In a sensor of angular velocity according to the invention, a mass is supported to the frame of the sensor component by means of an asymmetrical spring structure (1), (2), (3), (4), (22), (24) in such a way, that the coupling from one mode of motion to another, conveyed by the spring (1), (2), (3), (4), (22), (24), cancels or alleviates the coupling caused by the non-ideality due to the skewness in the springs or in their support. The structure of the sensor of angular velocity according to the invention enables reliable measuring with good performance, particularly in small vibrating micromechanical solutions for sensors of angular velocity.

IPC Classes  ?

  • G01P 3/02 - Devices characterised by the use of mechanical means
  • G01C 19/5712 - Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using masses driven in reciprocating rotary motion about an axis the devices involving a micromechanical structure
  • G01P 15/097 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by vibratory elements

11.

METHOD AND DEVICE FOR MEASURING THE PROGRESS OF A MOVING PERSON

      
Application Number FI2008050355
Publication Number 2009/007498
Status In Force
Filing Date 2008-06-13
Publication Date 2009-01-15
Owner VTI TECHNOLOGIES OY (Finland)
Inventor Meriheinä, Ulf

Abstract

The invention relates to measuring devices to be used in physical measuring, and more particularly, to a method and a device for measuring the progress of a moving person. In the solution according to the invention the quantities describing the progress of the moving person can be calculated based on vertical acceleration values of the body measured by means of an acceleration sensor, and on the measured time. The invention aims at providing a solution, better and simpler than prior solutions, for measuring the progress of a moving person, which solution is applicable for use in a multitude of measuring solutions for ways of locomotion of various types.

IPC Classes  ?

  • G01P 15/08 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values
  • G01C 21/12 - NavigationNavigational instruments not provided for in groups by using measurement of speed or acceleration executed aboard the object being navigatedDead reckoning
  • A61B 5/11 - Measuring movement of the entire body or parts thereof, e.g. head or hand tremor or mobility of a limb

12.

A METHOD FOR MEASURING ANGULAR VELOCITY AND A VIBRATING MICROMECHANICAL SENSOR OF ANGULAR VELOCITY

      
Application Number FI2008050313
Publication Number 2008/145823
Status In Force
Filing Date 2008-05-29
Publication Date 2008-12-04
Owner VTI TECHNOLOGIES OY (Finland)
Inventor Blomqvist, Anssi

Abstract

The invention relates to measuring devices used in measuring angular velocity, and, more precisely, to vibrating micromechanical sensors of angular velocity. In the solution for a sensor of angular velocity according to the invention, a mass is suspended by means of spring structures having non-orthogonal primary and secondary axes such, that a test activation in phase with the primary motion is induced in a detection resonator, and the angular velocity to be measured is, by means of a phase detector, detected from the phase difference between the primary motion and the secondary motion. The structure of the sensor of angular velocity according to the invention enables reliable measuring with good performance, particularly in small vibrating micromechanical solutions for a sensor of angular velocity.

IPC Classes  ?

  • G01P 15/08 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values
  • G01C 19/56 - Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces

13.

METHOD AND DEVICE FOR MEASURING THE PROGRESS OF A MOVING PERSON

      
Application Number FI2008050180
Publication Number 2008/125730
Status In Force
Filing Date 2008-04-11
Publication Date 2008-10-23
Owner VTI TECHNOLOGIES OY (Finland)
Inventor
  • Meriheinä, Ulf
  • Lahtinen, Juha

Abstract

The invention relates to measuring devices to be used in physical measuring, and more particularly, to a method and a device for measuring the progress of a moving person. In the solution according to the invention the quantities describing the progress of the moving person are being calculated based on step cycle-specific acceleration stage characteristic accelerations a + and step cycle -specific braking stage characteristic acceleration a - obtained from acceleration values measured by means of an acceleration sensor, and on the measured time. The invention aims at providing a solution, better and simpler than prior solutions, for measuring the progress of a moving person, which solution is applicable for use in a multitude of measuring solutions for ways of locomotion of various types.

IPC Classes  ?

  • G01C 22/00 - Measuring distance traversed on the ground by vehicles, persons, animals or other moving solid bodies, e.g. using odometers or using pedometers
  • G01P 15/08 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values
  • A63B 69/00 - Training appliances or apparatus for special sports
  • G01P 7/00 - Measuring speed by integrating acceleration
  • G04B 47/06 - Time-pieces combined with other articles which do not interfere with the running or the time-keeping of the time-piece with attached measuring instruments, e.g. pedometer, barometer, thermometer, compass
  • G01C 21/16 - NavigationNavigational instruments not provided for in groups by using measurement of speed or acceleration executed aboard the object being navigatedDead reckoning by integrating acceleration or speed, i.e. inertial navigation
  • G01C 21/20 - Instruments for performing navigational calculations

14.

ENCAPSULATION MODULE METHOD FOR PRODUCTION AND USE THEREOF

      
Application Number EP2007063975
Publication Number 2008/077821
Status In Force
Filing Date 2007-12-14
Publication Date 2008-07-03
Owner
  • CONTINENTAL TEVES AG & CO. OHG (Germany)
  • VTI TECHNOLOGIES OY (Finland)
Inventor
  • Hartmann, Bernhard
  • Hilser, Roland
  • Kuisma, Heikki
  • Torkkeli, Altti

Abstract

The invention relates to a method for producing an encapsulation module (A) and/or for encapsulating a micromechanical arrangement, wherein electronic connection means, such as through contacts (2), electrical lines, contacts and/or electronic structures are produced from a blank (1) of electrically conducting semiconductor material, in particular, doped silicon, by means of one or more structuring processes and/or etching processes, wherein in the process of the formation of the electronic connector means, a plinth (6) of the semiconductor material is generated on which the electronic connector means are arranged, subsequently being embedded in an embedding material (9) and the embedding material and/or the semiconductor plinth (6) are removed after the embedding to the extent that a defined number of the electronic connector means have electrical contact on at least one of the outer surfaces (7, 8) of the encapsulation module (A) and during the process of the formation of the electronic connector means with the at least one structuring and/or etching process at least one isolated material mound on each of which a through contact (2) is arranged, are formed on the plinth of the semiconductor material (6), which forms a semiconductor electrode (3). The invention further relates to an encapsulation module and/or a micromechanical arrangement with at least one through contact (2) and at least one semiconductor electrode (3) and the use thereof in motor vehicles.

IPC Classes  ?

  • B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate

15.

METHOD FOR MANUFACTURING A MICROELECTROMECHANICAL COMPONENT, AND A MICROELECTROMECHANICAL COMPONENT

      
Application Number FI2006050508
Publication Number 2007/060290
Status In Force
Filing Date 2006-11-21
Publication Date 2007-05-31
Owner VTI TECHNOLOGIES OY (Finland)
Inventor Kuisma, Heikki

Abstract

The invention relates to microelectromechanical components, like microelectromechanical gauges used in measuring e.g. acceleration, angular acceleration, angular velocity, or other physical quantities. The microelectromechanical component, according to the invention, comprises a microelectromechanical chip part (46), sealed by means of a cover part (24), (28), (33), (41), (47), (48), and an electronic circuit part (64), (74), suitably bonded to each other. The aim of the invention is to provide an improved method of manufacturing a microelectromechanical component, and to provide a microelectromechanical component, which is applicable for use particularly in small microelectromechanical sensor solutions.

IPC Classes  ?

  • B81B 7/00 - Microstructural systems
  • B81C 99/00 - Subject matter not provided for in other groups of this subclass
  • G01C 19/56 - Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
  • G01L 9/00 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elementsTransmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
  • G01P 15/18 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration in two or more dimensions

16.

METHOD FOR MANUFACTURING A MICROELECTROMECHANICAL COMPONENT, AND A MICROELECTROMECHANICAL COMPONENT

      
Application Number FI2006050507
Publication Number 2007/060289
Status In Force
Filing Date 2006-11-21
Publication Date 2007-05-31
Owner VTI TECHNOLOGIES OY (Finland)
Inventor
  • Kuisma, Heikki
  • Niemistö, Jiri

Abstract

The invention relates to microelectromechanical components, like microelectromechanical gauges used in measuring e.g. acceleration, angular acceleration, angular velocity, or other physical quantities. The microelectromechanical component, according to the invention, comprises, suitably bonded to each other, a microelectromechanical chip part (46), (60) sealed by a cover part (24), (28), (33), (41), (47), (48), and at least one electronic circuit part (63), (78), (83). The aim of the invention is to provide an improved method of manufacturing a microelectromechanical component, and to provide a microelectromechanical component, which is applicable for use particularly in small microelectromechanical sensor solutions.

IPC Classes  ?

  • B81C 3/00 - Assembling of devices or systems from individually processed components
  • B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
  • B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
  • B81C 99/00 - Subject matter not provided for in other groups of this subclass
  • G01C 17/38 - Testing, calibrating, or compensating of compasses
  • G01C 19/56 - Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
  • G01C 19/5783 - Mountings or housings not specific to any of the devices covered by groups
  • G01C 25/00 - Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass
  • G01L 9/00 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elementsTransmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
  • G01P 15/18 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration in two or more dimensions
  • G01P 3/00 - Measuring linear or angular speedMeasuring differences of linear or angular speeds

17.

A METHOD FOR THE MICROMECHANICAL MEASUREMENT OF ACCELERATION AND A MICROMECHANICAL ACCELERATION SENSOR

      
Application Number FI2006050393
Publication Number 2007/031606
Status In Force
Filing Date 2006-09-15
Publication Date 2007-03-22
Owner VTI TECHNOLOGIES OY (Finland)
Inventor
  • Lehtonen, Tuomo
  • Mourujärvi, Risto
  • Salo, Teemu
  • Thurau, Jens

Abstract

The invention relates to measurement devices used in the measurement of acceleration, and more specifically, to micromechanical acceleration sensors. The invention seeks to offer an improved method for the measurement of acceleration directed to three or two dimensions using a micromechanical acceleration sensor as well as an improved micro- mechanical acceleration sensor. Using this invention, the functional reliability of a sensor can be monitored in constant use, and it is suitable for use particularly in small-sized micromechanical acceleration sensor solutions measuring in relation to several axes.

IPC Classes  ?

  • G01P 21/00 - Testing or calibrating of apparatus or devices covered by the other groups of this subclass
  • B81B 5/00 - Devices comprising elements which are movable in relation to each other, e.g. comprising slidable or rotatable elements
  • G01P 15/125 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by capacitive pick-up
  • G01P 15/18 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration in two or more dimensions