An interchangeable coupler for a heater system connects a plurality of resistive heating elements of the heater system to at least one busbar of the heater system. The interchangeable coupler includes a main body including an upper end portion, a lower end portion and an internal cavity extending from the upper end portion toward the lower end portion. The internal cavity defines a lower bore, and the lower end portion includes a plurality of flexible gripping members to deflect outward when a connection pin of a respective resistive heating element of the plurality of resistive heating elements is inserted into the lower bore. The main body includes at least one contact arm to be inserted through at least one slot of at least one aperture of the at least one busbar and rotated to abut a side of the at least one busbar.
A method for controlling temperature of a heater including a resistive heating element. The method includes applying power to the resistive heating element of the heater at a variable ramp rate to increase temperature of the heater to a desired temperature setpoint. The variable ramp rate is set to a desired ramp rate. The variable ramp rate varies based on a temperature change of the resistive heating element with respect to time, and a control system dynamically adjusts the variable ramp rate to define different rates of ramping the applied power. The method further includes monitoring an electric current flowing through the resistive heating element of the heater, and reducing the variable ramp rate from the desired ramp rate to a permitted ramp rate in response to the electric current being greater than a lower limit of an electric current limit band.
G01K 1/02 - Means for indicating or recording specially adapted for thermometers
G01K 3/00 - Thermometers giving results other than momentary value of temperature
G01K 3/14 - Thermometers giving results other than momentary value of temperature giving differences of valuesThermometers giving results other than momentary value of temperature giving differentiated values in respect of space
G01R 19/165 - Indicating that current or voltage is either above or below a predetermined value or within or outside a predetermined range of values
G05D 23/19 - Control of temperature characterised by the use of electric means
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H05B 3/22 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
3.
METHOD AND SYSTEM FOR CALIBRATING A CONTROLLER THAT DETERMINES A RESISTANCE OF A LOAD
A method for enhancing resistance measurements of a load includes obtaining a plurality of sample resistance values of the load, determining an average resistance value based on the plurality of sample resistance values, determining a resistance difference based on the average resistance value and a nominal resistance value associated with the load, updating an offset correction value of a controller in response to the resistance difference being greater than a resistance tolerance, and measuring a resistance of the load based on the offset correction value and one or more electrical characteristics of the load.
A temperature sensing system to detect a temperature of a surface includes a sensor assembly and first and second lead wires. The sensor assembly includes a probe head and a temperature sensor disposed within the probe head. The first and second lead wires suspend the probe head such that the probe head abuts the surface. The first and second lead wires comprising different materials. The first and second lead wires are configured to provide multiple degrees of freedom of movement to the probe head and temperature measurements.
G01K 1/143 - SupportsFastening devicesArrangements for mounting thermometers in particular locations for measuring surface temperatures
G01K 7/02 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using thermoelectric elements, e.g. thermocouples
5.
HYBRID SHAFT ASSEMBLY FOR THERMAL CONTROL IN HEATED SEMICONDUCTOR PEDESTALS
A hybrid shaft assembly for use in controlled atmosphere chambers, such as by way of example heated pedestals for semiconductor manufacturing, includes a substrate, a hub having an upper portion and a lower portion, the upper portion being secured to the substrate with an upper joining layer, and a shaft secured to the lower portion of the hub with a lower joining layer. The shaft comprises a material having a thermal conductivity lower than a material of the hub and a material of the substrate.
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
6.
COUPLING BOX HAIRPIN REPLACEMENT FOR HIGH VOLTAGE HEATING FIELD
A heater assembly includes a pair of heating sections, each heating section including a conductive portion, and a coupling assembly. The coupling assembly includes a coupling enclosure having a housing and an end cap, the end cap secured to a distal end portion of the housing and defining an aperture extending therethrough. A coupling member is disposed inside the housing, and the conductive portions of the pair of heating sections are connected by the coupling member. A closure assembly is disposed within the housing and located between the coupling member and the end cap, the closure assembly defining at least one channel that is in fluid communication with the aperture of the end cap and configured to guide a fluid flowing therein toward an area where the end cap is secured to the housing.
A heater system for semiconductor processing includes a base, a plurality of gas processing components, and a heater. The plurality of gas processing components are secured to the base. The heater is disposed along a length of the base and between the base and the plurality of gas processing components. The heater is configured to provide heat to the plurality of gas processing components.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
G01K 7/04 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using thermoelectric elements, e.g. thermocouples the object to be measured not forming one of the thermoelectric materials
H05B 3/34 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater flexible, e.g. heating nets or webs
8.
SENSOR SYSTEM AND INTEGRATED HEATER-SENSOR FOR MEASURING AND CONTROLLING PERFORMANCE OF A HEATER SYSTEM
A heater system includes an integrated heater device. The integrated heater device includes at least one multiportion resistive element having a first portion defined by a first conductive material and a second portion defined by a second conductive material having a lower temperature coefficient of resistance (TCR) than that of the first conductive material. The second portion is coupled to the first portion so as to extend along an axis, and the at least one multiportion resistive element is operable as a heater to generate heat and as a sensor.
F24H 15/421 - Control of fluid heaters characterised by the type of controllers using electronic processing, e.g. computer-based using pre-stored data
F24H 15/45 - Control of fluid heaters characterised by the type of controllers using electronic processing, e.g. computer-based remotely accessible
G01F 23/22 - Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water
G01F 23/24 - Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring variations of resistance of resistors due to contact with conductor fluid
G01K 13/00 - Thermometers specially adapted for specific purposes
A method for joining ceramic pieces includes placing a layer of titanium on each of a first ceramic piece and a second ceramic piece; placing a layer of nickel on each of the layers of titanium; assembling the first ceramic piece and the second ceramic piece with the layers of nickel and the layers of titanium between the ceramic pieces; pressing the first ceramic piece and the second ceramic piece with the layers of nickel and the layers of titanium together; heating the first ceramic piece, the second ceramic piece, the layers of nickel, and the layers of titanium to a joining temperature in a vacuum; and cooling the first ceramic piece, the second ceramic piece, the layers of nickel, and the layers of titanium to create a hermetic seal between the first ceramic piece and the second ceramic piece.
B23K 1/19 - Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
B23K 35/28 - Selection of soldering or welding materials proper with the principal constituent melting at less than 950°C
B23K 103/00 - Materials to be soldered, welded or cut
B32B 9/00 - Layered products essentially comprising a particular substance not covered by groups
C04B 35/581 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxides based on borides, nitrides or silicides based on aluminium nitride
C04B 37/00 - Joining burned ceramic articles with other burned ceramic articles or other articles by heating
C04B 37/02 - Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
10.
CONTROL AND MONITORING SYSTEM FOR GAS DELIVERY SYSTEM
A method for monitoring a semiconductor processing system including a gas delivery system, a thermal system, and a fluid flow line includes obtaining a plurality of operational data from the gas delivery system, the thermal system, or a combination thereof and determining a performance characteristic of the fluid flow line based on one or more operational data of the plurality of operational data. The method includes identifying one or more locations associated with the one or more operational data in a reference virtual model and generating a dynamic state model of the fluid flow line based on the reference virtual model, the one or more identified locations, and the determined performance characteristic, where the dynamic state model is a digital representation of the fluid flow line.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
A standoff assembly for use in terminating a plurality of resistive heaters disposed within a fluid vessel includes a pressure adapter plate, an electrical enclosure adapter plate, and a plurality of conduits. The electrical enclosure adapter plate is spaced apart from the pressure adapter plate to define a dry volume therebetween. The conduits are secured to the pressure adapter plate and the electrical enclosure adapter plate. Each conduit is aligned concentrically with each of the resistive heating elements.
F24H 1/10 - Continuous-flow heaters, i.e. heaters in which heat is generated only while the water is flowing, e.g. with direct contact of the water with the heating medium
A method of controlling a thermal system of an industrial process includes monitoring intermediate data, associating the intermediate data with correlation data, wherein the correlation data includes an internal process control input, an external heater control input, the output control, or a combination thereof. The method further includes generating a model that defines a relationship between the intermediate data and the correlation data, identifying a state of the heater system based on the model, and selectively performing a corrective action based on the identified state of the heater system.
G05B 19/4155 - Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by programme execution, i.e. part programme or machine function execution, e.g. selection of a programme
G05B 11/42 - Automatic controllers electric with provision for obtaining particular characteristics, e.g. proportional, integral, differential for obtaining a characteristic which is both proportional and time-dependent, e.g. P. I., P. I. D.
G05B 17/00 - Systems involving the use of models or simulators of said systems
G05D 23/19 - Control of temperature characterised by the use of electric means
A terminal assembly for a heater system includes a plurality of resistive heating elements arranged in multiple power phases includes a plurality of power busbars, a neutral busbar, and a plurality of interchangeable couplers. Each power busbar corresponds to a power phase of the multiple power phases and is configured to connect a power lead from one of the multiple power phases and a first end of a plurality of resistive heating elements. The resistive heating elements are in electrical communication with the power lead. The neutral busbar is offset longitudinally from the power busbars and configured to receive a second end of the resistive heating elements. The interchangeable couplers are configured to connect at least a subset of the resistive heating elements to at least one power busbar or at least one neutral busbar.
H05B 3/26 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
H05B 3/08 - Heater elements structurally combined with coupling elements or with holders having electric connections specially adapted for high temperatures
A heater assembly includes a substrate with resistive heating elements positioned along its perimeter for azimuthal temperature control. The heater assembly includes electrical leads connected to the heating elements, with a first portion running along the substrate's perimeter and a second portion extending to the central area. The plurality of resistive heating elements are independently controllable to provide azimuthal temperature control of the heater assembly.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
16.
SOLID-STATE BONDING METHOD FOR THE MANUFACTURE OF SEMICONDUCTOR CHUCKS AND HEATERS
A layered assembly for use in a controlled atmosphere chamber includes a plurality of substrates and an electrically functioning layer embedded between two adjacent substrates of the plurality of substrates, the electrically functioning layer being a material configured to secure the two adjacent substrates together using a solid-state bonding process. An electrical termination area is integral with the electrically functioning layer, and a peripheral sealing band is embedded between and extends around a periphery of internal faces of the two adjacent substrates, the peripheral sealing band being a material configured to secure and seal the two adjacent substrates together using the solid-state bonding process. Dielectric regions are present between the two adjacent substrates and between edge boundaries of the electrically functioning layer, the dielectric regions being sealed between the two adjacent substrates by the peripheral sealing band.
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
A thermal system includes a two-wire heater and a power switch. The power switch is to provide power to the two-wire heater from a power source based on a control signal. The thermal system includes a controller having a sensor circuit configured to measure an electrical characteristic of the two-wire heater. The controller is to calculate a temperature of the thermal system based on a change in the measured electrical characteristic and determine whether the temperature is greater than a temperature setpoint. The controller is to output the control signal based on the determination.
G05D 23/24 - Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature the sensing element having a resistance varying with temperature, e.g. thermistor
Disclosed is a method for controlling a heater assembly by detecting variations in multiple heating zones based on temperature decay rates or resistance characteristics of each zone. A calibration procedure is executed to mitigate the identified variations in the heating zones, ensuring uniform heating performance across the heater assembly.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
A monolithic heated 3D body includes a thin-walled substrate defining a complex curved exterior surface, and a layered heater applied to the complex curved exterior surface of the thin-walled substrate. The layered heater includes at least one resistive heating layer, a set of termination pads in electrical contact with the at least one resistive heating layer, and a dielectric layer disposed over the at least one resistive heating layer.
H05B 3/26 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
H05B 3/06 - Heater elements structurally combined with coupling elements or with holders
An electrostatic chuck (ESC) for use in semiconductor processing includes a main body comprising an upper mounting surface, the upper mounting surface defining a surface profile and a guide plate coupled to the upper mounting surface of the main body. The guide plate includes a lower mounting surface. The lower mounting surface defines a surface profile that follows the surface profile of the upper mounting surface of the main body. The ESC further includes a heater embedded within the main body and a radio frequency (RF) electrode embedded within the guide plate. The main body is coupled to the guide plate via a connection consisting of a mechanical interlock.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
21.
SYSTEM AND METHOD FOR HEATING FLUID USING GALVANICALLY ISOLATED ELECTRICAL ENERGY HAVING ZERO VOLTAGE TO GROUND
A thermal control system for a fluid heating system including a tube defining an inlet and an outlet includes a galvanically isolated power supply to be electrically connected to the tube to provide an electric energy to heat the tube. The thermal control system also includes a power controller to control the galvanically isolated power supply. The power controller is to adjust an electric current to be provided by the galvanically isolated power supply to the tube. The galvanically isolated power supply is to provide at least two low voltage terminals at the tube and at least one high voltage terminal at the tube. The at least one high voltage terminal is disposed between the at least two low voltage terminals. The galvanically isolated power supply is to provide substantially zero voltage at the inlet and substantially zero voltage at the outlet of the tube.
A control system for use in a fluid flow application includes a heater and a control device. The heater includes at least one resistive heating element having a relationship between resistance and temperature defining a non-monotonic curve. The heater is to heat fluid flow. The control device is to determine a flow characteristic of the fluid flow and a temperature of the at least one resistive heating element along the non-monotonic curve between resistance and temperature based on a change in resistance of the at least one resistive heating element.
F01N 9/00 - Electrical control of exhaust gas treating apparatus
F01N 3/021 - Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for cooling, or for removing solid constituents of, exhaust by means of filters
F01N 3/023 - Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for cooling, or for removing solid constituents of, exhaust by means of filters using means for regenerating the filters, e.g. by burning trapped particles
F01N 3/027 - Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for cooling, or for removing solid constituents of, exhaust by means of filters using means for regenerating the filters, e.g. by burning trapped particles using electric or magnetic heating
F01N 3/08 - Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for rendering innocuous
F01N 3/10 - Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for rendering innocuous by thermal or catalytic conversion of noxious components of exhaust
F01N 3/20 - Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for rendering innocuous by thermal or catalytic conversion of noxious components of exhaust characterised by methods of operationControl specially adapted for catalytic conversion
F01N 11/00 - Monitoring or diagnostic devices for exhaust-gas treatment apparatus
F01N 13/00 - Exhaust or silencing apparatus characterised by constructional features
F02D 41/02 - Circuit arrangements for generating control signals
F02D 41/22 - Safety or indicating devices for abnormal conditions
G01F 1/68 - Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
G01F 1/86 - Indirect mass flowmeters, e.g. measuring volume flow and density, temperature, or pressure
G01K 7/16 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements
G01M 15/05 - Testing internal-combustion engines by combined monitoring of two or more different engine parameters
G05D 23/185 - Control of temperature with auxiliary non-electric power
G05D 23/24 - Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature the sensing element having a resistance varying with temperature, e.g. thermistor
G05D 23/30 - Automatic controllers with an auxiliary heating device affecting the sensing element, e.g. for anticipating change of temperature
G07C 5/08 - Registering or indicating performance data other than driving, working, idle, or waiting time, with or without registering driving, working, idle, or waiting time
H01C 7/02 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
H01C 7/04 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
H05B 3/14 - Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
H05B 3/18 - Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor the conductor being embedded in an insulating material
H05B 3/20 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
H05B 3/40 - Heating elements having the shape of rods or tubes
23.
RESISTANCE CALIBRATION AND MONITORING OF THERMAL SYSTEMS
A method of calibrating temperature of a resistive element includes: generating a standard resistance-temperature (R-T) curve for the resistive element in an isothermal condition, wherein the resistive element comprises a material with a Curie temperature; generating an operational R-T curve for the resistive element during a normal operation of the resistive element; shifting the operational R-T curve toward the standard R-T curve at the Curie temperature to generate an adjusted operational R-T curve; and adjusting a measured temperature of the resistive element based on a resistance of the resistive element and the adjusted operational R-T curve.
G01K 7/18 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
G01K 7/16 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements
Nickel-Carbon And Nickel-Cobalt-Carbon Brazes And Brazing Processes For Joining Ceramics And Metals And Semiconductor Processing And Industrial Equipment Using Same
A joining method includes placing a brazing element between an interface area of a first ceramic piece and an interface area of a second ceramic piece to create a joining pre-assembly and placing the components of said joining pre-assembly into a process chamber. Oxygen is removed from said process chamber and at least said brazing element of said joining pre-assembly is heated, thereby hermetically joining said first ceramic piece to said second ceramic piece. Said brazing element consists of Cobalt and Carbon.
Methods and systems for predicting at least one temperature along a fluid flow path of a fluid flow system having a heater disposed in the fluid flow path are provided. In one example, a method includes: obtaining at least one input, wherein the at least one input includes a setpoint, a mass flow rate, an inlet temperature, or a combination thereof; calculating a temperature associated with the heater based on a predefined model and the at least one input; and setting a value of the at least one temperature along the fluid flow path to the temperature of the heater.
F01N 9/00 - Electrical control of exhaust gas treating apparatus
F01N 3/023 - Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for cooling, or for removing solid constituents of, exhaust by means of filters using means for regenerating the filters, e.g. by burning trapped particles
F01N 3/027 - Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for cooling, or for removing solid constituents of, exhaust by means of filters using means for regenerating the filters, e.g. by burning trapped particles using electric or magnetic heating
F01N 3/20 - Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for rendering innocuous by thermal or catalytic conversion of noxious components of exhaust characterised by methods of operationControl specially adapted for catalytic conversion
F01N 11/00 - Monitoring or diagnostic devices for exhaust-gas treatment apparatus
F01N 13/00 - Exhaust or silencing apparatus characterised by constructional features
F02D 41/02 - Circuit arrangements for generating control signals
F02D 41/22 - Safety or indicating devices for abnormal conditions
G01F 1/68 - Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
G01F 1/86 - Indirect mass flowmeters, e.g. measuring volume flow and density, temperature, or pressure
G01K 7/16 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements
G01M 15/05 - Testing internal-combustion engines by combined monitoring of two or more different engine parameters
G05D 23/185 - Control of temperature with auxiliary non-electric power
G05D 23/24 - Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature the sensing element having a resistance varying with temperature, e.g. thermistor
G05D 23/30 - Automatic controllers with an auxiliary heating device affecting the sensing element, e.g. for anticipating change of temperature
G07C 5/08 - Registering or indicating performance data other than driving, working, idle, or waiting time, with or without registering driving, working, idle, or waiting time
H05B 3/14 - Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
H05B 3/18 - Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor the conductor being embedded in an insulating material
H05B 3/20 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
H05B 3/40 - Heating elements having the shape of rods or tubes
F01N 3/021 - Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for cooling, or for removing solid constituents of, exhaust by means of filters
F01N 3/08 - Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for rendering innocuous
F01N 3/10 - Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for rendering innocuous by thermal or catalytic conversion of noxious components of exhaust
H01C 7/02 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
H01C 7/04 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
26.
SYSTEMS AND METHODS FOR CONTROLLING A HEATER BASED ON A DIFFERENTIAL CURRENT
A control system includes a controller that is configured to determine a differential current of a heater based on a difference between a power conductor current of the heater and a neutral conductor current of the heater, determine whether the differential current of the heater is greater than a threshold differential current, and selectively perform a corrective action in response to the differential current being greater than the threshold differential current.
G05D 23/30 - Automatic controllers with an auxiliary heating device affecting the sensing element, e.g. for anticipating change of temperature
H05B 3/34 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater flexible, e.g. heating nets or webs
H05B 3/40 - Heating elements having the shape of rods or tubes
27.
METHOD AND SYSTEM FOR CONTROLLING AN ELECTRIC HEATER USING CONTROL ON ENERGY
A method for controlling a heated process of a heater includes: obtaining a target temperature; identifying a first amount of electrical energy based on a prediction that the first amount of electrical energy is sized to cause a temperature of the heated process to reach the target temperature, wherein the first amount of electrical energy is indicative of one or more wattage, the first amount of electrical energy is indicative of a quantity of time that the one or more wattage is applied to the heater, and the prediction is based on an energy profile associated with the heater; and providing the one or more wattage to the heater for a portion of the quantity of time.
G05D 23/19 - Control of temperature characterised by the use of electric means
G05B 19/4155 - Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by programme execution, i.e. part programme or machine function execution, e.g. selection of a programme
A method for calibrating a control system configured to control a two-wire heater includes providing power to a load electrically coupled to the control system, generating, an initial measured characteristic and a calibrated measured characteristic of the load by the control system and a controller calibration system, respectively. The method further includes defining a calibrated measurement reference based on a correlation of the initial measured characteristic and the calibrated measured characteristic. With the calibrated measure reference, the control system is further calibrated to define a resistance-temperature calibration reference for determining a working temperature of the two-wire heater based on a measured resistance of the two-wire heater.
H05B 3/26 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
29.
SYSTEMS AND METHODS FOR DETERMINING POLYMER BUILD-UP WITHIN A CHEMICAL PROCESSING CHAMBER
A method for monitoring polymer build-up within a chemical processing chamber and in response to generating thermal energy during a chemical process includes determining a response characteristic in response to generating the thermal energy, where the response characteristic includes an operational characteristic associated with the heater, a wall characteristic associated with at least one external wall surface of the chemical processing chamber, or a combination thereof. The method includes correlating the response characteristic to an amount of polymer build¬ up within the chemical processing chamber based on a response characteristic- polymer build-up correlation model and an emissivity range of the polymer build-up.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
An exhaust gas heater system for an exhaust system of an internal combustion engine includes a housing and a heating element. The housing includes an outer peripheral wall disposed about a central axis and defining an interior hollow space configured to receive exhaust gas from an exhaust pipe of the exhaust system such that the exhaust gas flows through the interior hollow space. The heating element is positioned within the hollow space and including a first end and a second end. The heating element forms a zig-zag shape extending in a radial direction relative to the central axis.
F01N 3/20 - Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for rendering innocuous by thermal or catalytic conversion of noxious components of exhaust characterised by methods of operationControl specially adapted for catalytic conversion
F01N 3/027 - Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for cooling, or for removing solid constituents of, exhaust by means of filters using means for regenerating the filters, e.g. by burning trapped particles using electric or magnetic heating
F23G 7/00 - Methods or apparatus, e.g. incinerators, specially adapted for combustion of specific waste or low grade fuels, e.g. chemicals
H05B 3/48 - Heating elements having the shape of rods or tubes non-flexible heating conductor embedded in insulating material
A tailored thermal body includes a substrate and a plurality of material regions extending throughout the substrate, the plurality of material regions having a variable thermal conductivity. At least one heating element is secured to the substrate. The substrate and the plurality of material regions are formed using at least one additive manufacturing process, and materials of the substrate and the plurality of material regions are chemically fused together.
A flow-through heater assembly includes a housing and a heater. The housing includes an inlet, an outlet, and a bore extending between the inlet and the outlet. The heater is disposed within the housing and extends between the inlet and the outlet. The heater includes at least one opening proximate the inlet and at least one opening proximate the outlet. The heater defines an anfractuous path from the inlet to the outlet, and the openings in the heater are in fluid communication with the bore of the housing.
F24H 9/00 - FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL Details
F28F 13/08 - Arrangements for modifying heat transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by varying the cross-section of the flow channels
G01K 7/16 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements
G01K 13/02 - Thermometers specially adapted for specific purposes for measuring temperature of moving fluids or granular materials capable of flow
H05B 3/06 - Heater elements structurally combined with coupling elements or with holders
34.
METHOD AND SYSTEM FOR DETECTING AND DIAGNOSING FLUID LINE LEAKAGE FOR INDUSTRIAL SYSTEMS
A method of detecting a leak-induced abnormal condition in a semiconductor processing system comprising a subsystem. The method includes determining a performance characteristic of the semiconductor processing system. The method includes determining the leak-induced abnormal condition is present within the subsystem, wherein the determination of the presence of the leak-induced abnormal condition is based on the performance characteristic and a temperature characteristic of the subsystem. The method also includes performing a corrective action based on the determination of the presence of the leak-induced abnormal condition.
G01M 3/00 - Investigating fluid tightness of structures
G01M 3/18 - Investigating fluid tightness of structures by using fluid or vacuum by detecting the presence of fluid at the leakage point using electric detection means for pipes, cables, or tubesInvestigating fluid tightness of structures by using fluid or vacuum by detecting the presence of fluid at the leakage point using electric detection means for pipe joints or sealsInvestigating fluid tightness of structures by using fluid or vacuum by detecting the presence of fluid at the leakage point using electric detection means for valves
35.
METHOD AND SYSTEM FOR CALIBRATING A CONTROLLER THAT DETERMINES A RESISTANCE OF A LOAD
A method for enhancing resistance measurements of a load includes obtaining a plurality of sample resistance values of the load, determining an average resistance value based on the plurality of sample resistance values, determining a resistance difference based on the average resistance value and a nominal resistance value associated with the load, updating an offset correction value of a controller in response to the resistance difference being greater than a resistance tolerance, and measuring a resistance of the load based on the offset correction value and one or more electrical characteristics of the load.
A temperature sensing system to detect a temperature of a surface includes a sensor assembly and first and second lead wires. The sensor assembly includes a probe head and a temperature sensor disposed within the probe head. The first and second lead wires suspend the probe head such that the probe head abuts the surface. The first and second lead wires comprising different materials. The first and second lead wires are configured to provide multiple degrees of freedom of movement to the probe head and temperature measurements.
A heater system for semiconductor processing includes a base, a plurality of gas processing components, and a heater. The plurality of gas processing components are secured to the base. The heater is disposed along a length of the base and between the base and the plurality of gas processing components. The heater is configured to provide heat to the plurality of gas processing components.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
38.
HYBRID SHAFT ASSEMBLY FOR THERMAL CONTROL IN HEATED SEMICONDUCTOR PEDESTALS
A hybrid shaft assembly for use in controlled atmosphere chambers, such as by way of example heated pedestals for semiconductor manufacturing, includes a substrate, a hub having an upper portion and a lower portion, the upper portion being secured to the substrate with an upper joining layer, and a shaft secured to the lower portion of the hub with a lower joining layer. The shaft comprises a material having a thermal conductivity lower than a material of the hub and a material of the substrate.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
An electrostatic chuck includes a ceramic top plate layer made of a beryllium oxide material, a ceramic bottom plate layer made of a beryllium oxide material, a ceramic middle plate layer disposed between the ceramic top plate layer and the ceramic bottom plate layer, an electrode layer disposed between the ceramic top plate layer and the ceramic middle plate layer, and a heater layer disposed between the ceramic middle plate layer and the ceramic bottom plate layer. The electrode layer joins and hermetically seals the ceramic top plate layer to the ceramic middle plate layer, and the heater layer joins and hermetically seals the ceramic middle plate layer to the ceramic bottom plate layer.
B32B 9/00 - Layered products essentially comprising a particular substance not covered by groups
B23K 35/28 - Selection of soldering or welding materials proper with the principal constituent melting at less than 950°C
B23K 35/00 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
B32B 7/14 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties applied in spaced arrangements, e.g. in stripes
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
B23K 1/19 - Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
B23K 1/20 - Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
B23K 1/00 - Soldering, e.g. brazing, or unsoldering
F16B 9/00 - Connections of rods or tubular parts to flat surfaces at an angle
B32B 3/30 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layerLayered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a layer with cavities or internal voids characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
C04B 37/00 - Joining burned ceramic articles with other burned ceramic articles or other articles by heating
B32B 9/04 - Layered products essentially comprising a particular substance not covered by groups comprising such substance as the main or only constituent of a layer, next to another layer of a specific substance
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
40.
Medium voltage bus system for electric circulation heaters
A terminal assembly for a heater system includes a plurality of resistive heating elements arranged in multiple power phases includes a plurality of power busbars, a neutral busbar, a phase barrier disposed between each of the plurality of power busbars, and a plurality of interchangeable couplers. Each power busbar corresponds to a power phase of the multiple power phases and is configured to connect a power lead from one of the multiple power phases and a first end of a plurality of resistive heating elements. The resistive heating elements are in electrical communication with the power lead. The neutral busbar is offset longitudinally from the power busbars and configured to receive a second end of the resistive heating elements. The interchangeable couplers are configured to connect at least a subset of the resistive heating elements to at least one power busbar or at least one neutral busbar.
H05B 3/26 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
H05B 3/08 - Heater elements structurally combined with coupling elements or with holders having electric connections specially adapted for high temperatures
41.
MEDIUM VOLTAGE BUS SYSTEM FOR ELECTRIC CIRCULATION HEATERS
A terminal assembly for a heater system includes a plurality of resistive heating elements arranged in multiple power phases includes a plurality of power busbars, a neutral busbar, a phase barrier disposed between each of the plurality of power busbars, and a plurality of interchangeable couplers. Each power busbar corresponds to a power phase of the multiple power phases and is configured to connect a power lead from one of the multiple power phases and a first end of a plurality of resistive heating elements. The resistive heating elements are in electrical communication with the power lead. The neutral busbar is offset longitudinally from the power busbars and configured to receive a second end of the resistive heating elements. The interchangeable couplers are configured to connect at least a subset of the resistive heating elements to at least one power busbar or at least one neutral busbar.
H05B 3/06 - Heater elements structurally combined with coupling elements or with holders
43.
Nickel-Carbon And Nickel-Cobalt-Carbon Brazes And Brazing Processes For Joining Ceramics And Metals And Semiconductor Processing And Industrial Equipment Using Same
A joining method includes the steps of placing a brazing element between an interface area of a first ceramic piece and an interface area of a second ceramic piece to create a joining pre-assembly, placing the components of said joining pre-assembly into a process chamber, removing oxygen from said process chamber, and heating at least said brazing element of said joining pre-assembly, thereby hermetically joining said first ceramic piece to said second ceramic piece. The brazing element consists of Nickel and Carbon.
A method for the joining of ceramic pieces includes applying a layer of titanium on a first ceramic piece and applying a layer of titanium on a second ceramic piece; applying a layer of nickel on each of the layers of titanium on the first ceramic piece and the second ceramic piece; applying a layer of nickel phosphorous to each of the layers of nickel on the first ceramic piece and the second ceramic piece; assembling the first ceramic piece and the second ceramic piece with the layers of titanium, nickel, and nickel phosphorous therebetween; pressing the layer of nickel phosphorous of the first ceramic piece against the layer of nickel phosphorous of the second ceramic piece; heating the first ceramic piece and the second ceramic piece to a joining temperature in a vacuum; and cooling the first ceramic piece and the second ceramic piece. A hermetic seal is formed between the first ceramic piece and the second ceramic piece.
C04B 35/581 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxides based on borides, nitrides or silicides based on aluminium nitride
B23K 1/00 - Soldering, e.g. brazing, or unsoldering
B23K 1/19 - Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
B23K 35/28 - Selection of soldering or welding materials proper with the principal constituent melting at less than 950°C
B32B 9/00 - Layered products essentially comprising a particular substance not covered by groups
C04B 37/00 - Joining burned ceramic articles with other burned ceramic articles or other articles by heating
C04B 37/02 - Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
B23K 103/00 - Materials to be soldered, welded or cut
45.
SOLID-STATE BONDING METHOD FOR THE MANUFACTURE OF SEMICONDUCTOR CHUCKS AND HEATERS
A layered assembly for use in a controlled atmosphere chamber includes a plurality of substrates and an electrically functioning layer embedded between two adjacent substrates of the plurality of substrates, the electrically functioning layer being a material configured to secure the two adjacent substrates together using a solid- state bonding process. An electrical termination area is integral with the electrically functioning layer, and a peripheral sealing band is embedded between and extends around a periphery of internal faces of the two adjacent substrates, the peripheral sealing band being a material configured to secure and seal the two adjacent substrates together using the solid-state bonding process. Dielectric regions are present between the two adjacent substrates and between edge boundaries of the electrically functioning layer, the dielectric regions being sealed between the two adjacent substrates by the peripheral sealing band.
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
A method for monitoring a surface condition of a component includes providing thermal energy to a component, determining a thermal response of the heater in response to providing the thermal energy, and determining a thermal characteristic of the component based on a reference thermal response and the thermal response. The method includes predicting the surface condition of the component based on the thermal characteristic and a predictive analytic model, where the predictive analytic model correlates the thermal characteristic of the component to an estimated surface condition of the component.
C23C 16/44 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
G01N 25/20 - Investigating or analysing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
G06Q 10/04 - Forecasting or optimisation specially adapted for administrative or management purposes, e.g. linear programming or "cutting stock problem"
A method of providing power, via a plurality of power control systems, includes forming, by at least two power control systems from among the plurality of power control systems, a power network and defining, by each power control system of the power network, a power allocation schedule for a power cycle using a dynamic load scheduling model. The power allocation schedule identifies one or more designated power control systems from among the at least two of the power control systems to provide power to a load during the power cycle. For at least portion of the power cycle, the method includes providing power to the load by the one or more designated power control systems of the power network based on the power allocation schedule.
H02J 3/00 - Circuit arrangements for ac mains or ac distribution networks
H02J 13/00 - Circuit arrangements for providing remote indication of network conditions, e.g. an instantaneous record of the open or closed condition of each circuitbreaker in the networkCircuit arrangements for providing remote control of switching means in a power distribution network, e.g. switching in and out of current consumers by using a pulse code signal carried by the network
48.
METHOD OF GENERATING A DIGITAL TWIN OF THE ENVIRONMENT OF INDUSTRIAL PROCESSES
A method of generating a digital twin of an environment (10) includes generating one or more mathematical-based variables based on a mathematical model (304) of the environment and sensor data from one or more sensors of the environment, generating one or more machine learning-based variables based on a machine learning-based model of the environment (308) and the sensor data, and stacking the one or more mathematical-based variables and the one or more machine learning-based variables based on a meta-learning model to generate a machine learning input (312) for predicting a performance characteristic of the environment (320).
G05B 17/02 - Systems involving the use of models or simulators of said systems electric
G06F 30/27 - Design optimisation, verification or simulation using machine learning, e.g. artificial intelligence, neural networks, support vector machines [SVM] or training a model
49.
METHOD OF GENERATING A DIGITAL TWIN OF THE ENVIRONMENT OF INDUSTRIAL PROCESSES
A method of generating a digital twin of an environment includes generating one or more mathematical-based variables based on a mathematical model of the environment and sensor data from one or more sensors of the environment, generating one or more machine learning-based variables based on a machine learning-based model of the environment and the sensor data, and stacking the one or more mathematical-based variables and the one or more machine learning-based variables based on a meta-learning model to generate a machine learning input for predicting a performance characteristic of the environment.
G06F 30/27 - Design optimisation, verification or simulation using machine learning, e.g. artificial intelligence, neural networks, support vector machines [SVM] or training a model
A method of generating a digital twin of an environment (10) includes generating one or more mathematical-based variables based on a mathematical model (304) of the environment and sensor data from one or more sensors of the environment, generating one or more machine learning-based variables based on a machine learning-based model of the environment (308) and the sensor data, and stacking the one or more mathematical-based variables and the one or more machine learning-based variables based on a meta-learning model to generate a machine learning input (312) for predicting a performance characteristic of the environment (320).
G06F 30/27 - Design optimisation, verification or simulation using machine learning, e.g. artificial intelligence, neural networks, support vector machines [SVM] or training a model
G05B 17/02 - Systems involving the use of models or simulators of said systems electric
The present disclosure is directed toward a control system and method for controlling a heater system. The control system includes a plurality of zone control circuits, a primary controller, a plurality of power controllers, and a plurality of sensor controllers. The zone control circuits are operable to provide power to a plurality of heater zones of the heater system and to measure performance characteristics of the zones. The power controllers are coupled to the plurality of zone control circuits to control power to the plurality of zones. The sensor controllers monitor operation of the heater zones based on the performance characteristics. The primary controller is coupled to the power controllers and is configured to provide an operation set-point for each of the heater zones based on the performance characteristics.
A heater assembly includes a substrate, a plurality of resistive heating elements disposed along a perimeter of the substrate, and a common ground electrical lead connected to at least some of the plurality of resistive heating elements and having a portion extending along the perimeter of the substrate. The plurality of resistive heating elements are independently controllable to provide azimuthal temperature control of the heater assembly.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
53.
Modular heater assembly with interchangeable auxiliary sensing junctions
A heater system is provided, which includes a plurality of heaters, a controller for supplying power to the plurality of heaters, a plurality sets of auxiliary wires extending from the plurality of heaters, and a wire harness for connecting the plurality sets of auxiliary wires to the controller. Each set of auxiliary wires includes three wires, two of the three wires being made of different materials and being joined to form a thermocouple junction, such that each of the plurality of heaters is operable to function as both a heater and a temperature sensor.
G01K 7/02 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using thermoelectric elements, e.g. thermocouples
H05B 3/06 - Heater elements structurally combined with coupling elements or with holders
H05B 3/78 - Heating arrangements specially adapted for immersion heating
A heating assembly includes a support member for supporting a target thereon, a diffuser layer attached to the support member, and a heater attached to the diffuser layer. The diffuser layer includes discrete diffuser segments separated by gaps. The discrete diffuser segments are made of the same material and are configured to allow a desired thermal gradient to be maintained between the discrete diffuser segments during heating of the target.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
C23C 24/04 - Impact or kinetic deposition of particles
H05B 3/14 - Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
55.
SHAPED ELECTRICAL INTERCONNECTIONS FOR MULTI-LAYER HEATER CONSTRUCTIONS
An electrical interconnect for use in connecting layers of a multi-layer heater includes a shaped body having a lower end portion and an upper end portion. The lower end portion has a smaller contact area than a contact area of the upper end portion, and the contact area of the lower end portion is proximate a heating layer and the contact area of the upper end portion is proximate a routing layer.
H05B 3/28 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
56.
Sensor system and integrated heater-sensor for measuring and controlling performance of a heater system
A heater system includes an integrated heater device and a control system. The integrated heater device includes a thermocouple for measuring temperature and one or more multiportion resistive elements that are operable as heaters to create a temperature differential between the fluid and air to detect the fluid, and as sensors to measure a fluid level. The control device operates the integrated heater device as a sensor or heater based on one or more performance characteristics of the heater system and self-calibrates the heater device.
G01F 23/22 - Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water
F24H 9/20 - Arrangement or mounting of control or safety devices
F24H 15/20 - Control of fluid heaters characterised by control inputs
F24H 15/37 - Control of heat-generating means in heaters of electric heaters
G01F 23/24 - Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring variations of resistance of resistors due to contact with conductor fluid
G01K 13/00 - Thermometers specially adapted for specific purposes
An electrical interconnect for use in connecting layers of a multi-layer heater includes a shaped body having a lower end portion and an upper end portion. The lower end portion has a smaller contact area than a contact area of the upper end portion, and the contact area of the lower end portion is proximate a heating layer and the contact area of the upper end portion is proximate a routing layer.
H05B 3/26 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
58.
METHOD AND SYSTEM FOR CALCULATING ELECTRICAL CHARACTERISTICS OF AN ELECTRIC HEATER
A method of controlling temperature of a heater including a resistive heating element includes measuring a voltage count and a current count based on data from an analog-digital converter (ADC) circuit of a sensor circuit, where the sensor circuit is electrically coupled to the heater. The method includes selecting one or more dynamic gain levels of the ADC from among a plurality of dynamic gain levels based on a shift gain correlation, determining a resistance of the resistive heating element based on the voltage count, the current count, and the one or more dynamic gain levels, and controlling power to the heater based on the resistance.
G01R 19/257 - Arrangements for measuring currents or voltages or for indicating presence or sign thereof using digital measurement techniques using analogue/digital converters of the type with comparison of different reference values with the value of voltage or current, e.g. using step-by-step method
59.
METHOD AND SYSTEM FOR CALCULATING ELECTRICAL CHARACTERISTICS OF AN ELECTRIC HEATER
A method of controlling temperature of a heater including a resistive heating element includes measuring a voltage count and a current count based on data from an analog-digital converter (ADC) circuit of a sensor circuit, where the sensor circuit is electrically coupled to the heater. The method includes selecting one or more dynamic gain levels of the ADC from among a plurality of dynamic gain levels based on a shift gain correlation, determining a resistance of the resistive heating element based on the voltage count, the current count, and the one or more dynamic gain levels, and controlling power to the heater based on the resistance.
A temperature sensing system includes an outer casing, a thermocouple including a thermocouple junction, and a reference sensor. The thermocouple and the reference sensor are received within the outer casing. The reference sensor is disposed proximate an end of the thermocouple opposing the thermocouple junction and is configured to provide a reference temperature based on which a temperature measured by the thermocouple is determined.
A wireless sensor assembly incudes a housing, a wireless power source, a wireless communication component, and firmware. The housing defines a first aperture for receiving an external sensor and a second aperture defining a communication port configured to receive a wire harness. The wireless communications component and the firmware are powered by the wireless power source. The wireless communications component is configured to be in electrical communication with the external sensor and transmit data from the external sensor to an external device. The firmware is configured to manage a rate of data transmittal from the wireless communications component to the external device. The wireless power source, the wireless communications component, and the firmware are mounted within the same housing. The data from the external sensor is transmitted from the external sensor wirelessly through the wireless communications component or through the wire harness to the external device for processing.
H04Q 9/00 - Arrangements in telecontrol or telemetry systems for selectively calling a substation from a main station, in which substation desired apparatus is selected for applying a control signal thereto or for obtaining measured values therefrom
G01D 21/00 - Measuring or testing not otherwise provided for
H04L 41/082 - Configuration setting characterised by the conditions triggering a change of settings the condition being updates or upgrades of network functionality
A temperature sensing system includes an outer casing, a thermocouple including a thermocouple junction, and a reference sensor. The thermocouple and the reference sensor are received within the outer casing. The reference sensor is disposed proximate an end of the thermocouple opposing the thermocouple junction and is configured to provide a reference temperature based on which a temperature measured by the thermocouple is determined.
G01K 7/02 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using thermoelectric elements, e.g. thermocouples
G01K 7/16 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements
A heater includes a flow guide and electrical resistance heating elements. The flow guide defines a continuous geometric helicoid disposed about a longitudinal axis and defines perforations that extend in a longitudinal direction through a first longitudinal length of the geometric helicoid. The first longitudinal length is less than a full longitudinal length of the geometric helicoid. The electrical resistance heating elements extend through the perforations. For each electrical resistance heating element, a length of that electrical resistance heating element and a pitch of the geometric helicoid at a distal end of that electrical resistance heating element are such that the distal end of that electrical resistance heating element is a distance X from the geometric helicoid at the distal end of that electrical resistance heating element. The distance X is less than or equal to 40% of the pitch at the distal end of that electrical resistance heating element.
F28F 9/22 - Arrangements for directing heat-exchange media into successive compartments, e.g. arrangements of guide plates
F28D 7/06 - Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits having a single U-bend
F28D 7/16 - Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits being arranged in parallel spaced relation
F28F 9/013 - Auxiliary supports for elements for tubes or tube-assemblies
A heater includes a flow guide and a plurality of electrical resistance heating elements. The flow guide defines a continuous geometric helicoid disposed about a longitudinal axis of the heater assembly. The flow guide defines a predetermined pattern of perforations that extend in a longitudinal direction through a first longitudinal length of the geometric helicoid, the longitudinal direction being parallel to the longitudinal axis. The plurality of electrical resistance heating elements extend through the perforations. At least one electrical resistance heating element of the plurality of electrical resistance heating elements has a first region with a first watt density and a second region with a second watt density. The second region is located farther in the longitudinal direction than the first region. The second watt density is less than the first watt density.
F28F 9/22 - Arrangements for directing heat-exchange media into successive compartments, e.g. arrangements of guide plates
F28F 9/013 - Auxiliary supports for elements for tubes or tube-assemblies
F28D 7/16 - Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits being arranged in parallel spaced relation
F28D 7/06 - Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits having a single U-bend
A multi-zone heater with a plurality of thermocouples such that different heater zones can be monitored for temperature independently. The independent thermocouples may have their leads routed out from the shaft of the heater in a channel that is closed with a joining process that results in hermetic seal adapted to withstand both the interior atmosphere of the shaft and the process chemicals in the process chamber. The thermocouple and its leads may be enclosed with a joining process in which a channel cover is brazed to the heater plate with aluminum.
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
H05B 3/28 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
A standoff assembly for use in terminating a plurality of resistive heaters disposed within a fluid vessel includes a pressure adapter plate, an electrical enclosure adapter plate, and a plurality of conduits. An end portion of each of the resistive heating elements extends through the pressure adapter plate. The electrical enclosure adapter plate is spaced apart from the pressure adapter plate to define a dry volume therebetween. The conduits are secured to the pressure adapter plate and the electrical enclosure adapter plate. Each conduit is aligned concentrically with each of the resistive heating elements. An electrical termination portion of each resistive heating element is disposed within the conduit.
A standoff assembly for use in terminating a plurality of resistive heaters disposed within a fluid vessel includes a pressure adapter plate, an electrical enclosure adapter plate, and a plurality of conduits. An end portion of each of the resistive heating elements extends through the pressure adapter plate. The electrical enclosure adapter plate is spaced apart from the pressure adapter plate to define a dry volume therebetween. The conduits are secured to the pressure adapter plate and the electrical enclosure adapter plate. Each conduit is aligned concentrically with each of the resistive heating elements. An electrical termination portion of each resistive heating element is disposed within the conduit.
F24H 1/10 - Continuous-flow heaters, i.e. heaters in which heat is generated only while the water is flowing, e.g. with direct contact of the water with the heating medium
A standoff assembly for use in terminating a plurality of resistive heaters disposed within a fluid vessel includes a pressure adapter plate, an electrical enclosure adapter plate, and a plurality of conduits. An end portion of each of the resistive heating elements extends through the pressure adapter plate. The electrical enclosure adapter plate is spaced apart from the pressure adapter plate to define a dry volume therebetween. The conduits are secured to the pressure adapter plate and the electrical enclosure adapter plate. Each conduit is aligned concentrically with each of the resistive heating elements. An electrical termination portion of each resistive heating element is disposed within the conduit.
09 - Scientific and electric apparatus and instruments
Goods & Services
Apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling the distribution or use of alternating electric current; Apparatus and instruments for conveying, distributing, transforming, storing, regulating or controlling alternating electric current; Electric transformers; Electric control devices for heating and energy management; Electric control devices for heating management; Electric voltage transformers; Electrical transformers; Electrical resistance heating wires and electrical controllers therefor; Electronic control circuits for electric heaters
A control system for controlling an adjustable output voltage provided to a heater includes a controller configured to determine an input parameter based on an electrical characteristic of the heater, where the heater includes a resistive heating element that is operable to emit heat and as a sensor. The controller is further configured to determine an output voltage for the heater based on the input parameter and a desired setpoint, and to transmit a signal to a power converter to generate the output voltage. The desired setpoint is based on an operational state of the heater, and the input parameter includes data indicative of a temperature of the resistive heating element that is determined based on the electrical characteristic.
G01R 19/22 - Arrangements for measuring currents or voltages or for indicating presence or sign thereof using conversion of AC into DC
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
F24D 11/02 - Central heating systems using heat accumulated in storage masses using heat pumps
G01R 19/165 - Indicating that current or voltage is either above or below a predetermined value or within or outside a predetermined range of values
G01R 19/257 - Arrangements for measuring currents or voltages or for indicating presence or sign thereof using digital measurement techniques using analogue/digital converters of the type with comparison of different reference values with the value of voltage or current, e.g. using step-by-step method
A heater assembly includes a flow guide and a plurality of electrical resistance heating elements. The flow guide defines a continuous geometric helicoid disposed about a longitudinal axis of the heater assembly. The flow guide defines a predetermined pattern of perforations that extend in a longitudinal direction through a first longitudinal length of the geometric helicoid. The longitudinal direction is parallel to the longitudinal axis. The geometric helicoid has a first pitch at a first zone along the longitudinal axis and a second pitch at a second zone along the longitudinal axis. The second pitch is shorter than the first pitch. The electrical resistance heating elements extend through the perforations.
F28F 9/22 - Arrangements for directing heat-exchange media into successive compartments, e.g. arrangements of guide plates
F28F 9/013 - Auxiliary supports for elements for tubes or tube-assemblies
F28D 7/16 - Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits being arranged in parallel spaced relation
F28D 7/06 - Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits having a single U-bend
A heating system includes at least one electric heater disposed within a fluid flow system and a control device that is configured to determine a temperature of the at least one electric heater based on a model, at least one fluid flow system input, and at least one heater input. The at least one heater input includes at least one physical characteristic of the heating system, the at least one physical characteristic includes at least one of a resistance wire diameter, a heater insulation thickness, a heater sheath thickness, a conductivity, a specific heat and density of the material of the heater, an emissivity of the heater and the fluid flow pathway, and combinations thereof. The control device is configured to provide power to the at least one electric heater based on the temperature of the at least one electric heater.
F01N 9/00 - Electrical control of exhaust gas treating apparatus
F01N 11/00 - Monitoring or diagnostic devices for exhaust-gas treatment apparatus
F01N 3/027 - Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for cooling, or for removing solid constituents of, exhaust by means of filters using means for regenerating the filters, e.g. by burning trapped particles using electric or magnetic heating
G01F 1/68 - Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
G05D 23/185 - Control of temperature with auxiliary non-electric power
F01N 3/20 - Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for rendering innocuous by thermal or catalytic conversion of noxious components of exhaust characterised by methods of operationControl specially adapted for catalytic conversion
F02D 41/22 - Safety or indicating devices for abnormal conditions
G01M 15/05 - Testing internal-combustion engines by combined monitoring of two or more different engine parameters
G07C 5/08 - Registering or indicating performance data other than driving, working, idle, or waiting time, with or without registering driving, working, idle, or waiting time
H05B 3/20 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
H05B 3/40 - Heating elements having the shape of rods or tubes
G01K 7/16 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements
G05D 23/24 - Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature the sensing element having a resistance varying with temperature, e.g. thermistor
G05D 23/30 - Automatic controllers with an auxiliary heating device affecting the sensing element, e.g. for anticipating change of temperature
H05B 3/14 - Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
G01F 1/86 - Indirect mass flowmeters, e.g. measuring volume flow and density, temperature, or pressure
H05B 3/18 - Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor the conductor being embedded in an insulating material
F01N 3/023 - Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for cooling, or for removing solid constituents of, exhaust by means of filters using means for regenerating the filters, e.g. by burning trapped particles
F01N 3/10 - Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for rendering innocuous by thermal or catalytic conversion of noxious components of exhaust
F01N 3/021 - Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for cooling, or for removing solid constituents of, exhaust by means of filters
F01N 3/08 - Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for rendering innocuous
H01C 7/02 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
H01C 7/04 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
An electric heater system includes an inlet, an outlet, a plurality of heat exchanger assemblies, and one or more connectors. The plurality of heat exchanger assemblies are connected in series. Each heat exchanger assembly includes a vessel, heating elements disposed within the vessel, and a fluid guide member. The connectors secure the vessels of the plurality of heat exchanger assemblies to each other. The connectors are also in fluid communication with the vessels. Fluid entering the inlet flows through the heat exchanger assemblies and through one or more connectors where it exits the outlet. The fluid guide members of the heat exchanger assemblies are of different or the same combinations to generate a predetermined pressure drop between the inlet and the outlet.
F24H 9/00 - FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL Details
F28D 7/16 - Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits being arranged in parallel spaced relation
F24H 3/04 - Air heaters with forced circulation the air being in direct contact with the heating medium, e.g. electric heating element
An electric heater system includes an inlet, an outlet, a plurality of heat exchanger assemblies, and one or more connectors. The plurality of heat exchanger assemblies are connected in series. Each heat exchanger assembly includes a vessel, heating elements disposed within the vessel, and a fluid guide member. The connectors secure the vessels of the plurality of heat exchanger assemblies to each other. The connectors are also in fluid communication with the vessels. Fluid entering the inlet flows through the heat exchanger assemblies and through one or more connectors where it exits the outlet. The fluid guide members of the heat exchanger assemblies are of different or the same combinations to generate a predetermined pressure drop between the inlet and the outlet.
F24H 1/10 - Continuous-flow heaters, i.e. heaters in which heat is generated only while the water is flowing, e.g. with direct contact of the water with the heating medium
F24H 9/00 - FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL Details
A thermal insulation structure includes an insulation layer having a first surface proximate a cooling device and a second surface opposing the first surface. A heater is disposed proximate the second surface, and a protective layer is disposed proximate the heater layer such that the heater layer is disposed between the insulation layer and the protective layer. The heater layer is configured to reduce frost or ice buildup on an exterior surface of the insulation layer.
A thermal insulation structure includes an insulation layer having a first surface proximate a cooling device and a second surface opposing the first surface. A heater is disposed proximate the second surface, and a protective layer is disposed proximate the heater layer such that the heater layer is disposed between the insulation layer and the protective layer. The heater layer is configured to reduce frost or ice buildup on an exterior surface of the insulation layer.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
79.
High power density insulated exhaust heating system
An exhaust gas heating unit for an engine includes a housing and a heating element. The housing includes a tubular peripheral wall and has an interior hollow space. The heating element has first and second ends and extends longitudinally therebetween to form a spiral shape within the interior hollow space. The heating element includes a thermally conductive sheath, an electrically conductive resistance element that extends longitudinally within the external sheath, and an electrically insulating material disposed about the resistance element between the resistance element and the sheath. A heat transfer member is positioned within the interior hollow space and is formed from one or more strips of thermally conductive material. The strips contact the external sheath at a plurality of locations between the first end and the second end. The heat transfer member has a corrugated shape that follows the spiral shape of the heating element.
F01N 3/20 - Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for rendering innocuous by thermal or catalytic conversion of noxious components of exhaust characterised by methods of operationControl specially adapted for catalytic conversion
F01N 3/027 - Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for cooling, or for removing solid constituents of, exhaust by means of filters using means for regenerating the filters, e.g. by burning trapped particles using electric or magnetic heating
F23G 7/00 - Methods or apparatus, e.g. incinerators, specially adapted for combustion of specific waste or low grade fuels, e.g. chemicals
H05B 3/48 - Heating elements having the shape of rods or tubes non-flexible heating conductor embedded in insulating material
80.
High power density insulated exhaust heating system
An exhaust gas heater system for an exhaust system of an internal combustion engine includes a housing and a heating element. The housing includes an outer peripheral wall disposed about a central axis and defining an interior hollow space configured to receive exhaust gas from an exhaust pipe of the exhaust system such that the exhaust gas flows through the interior hollow space. The heating element is positioned within the hollow space and including a first end and a second end. The heating element forms a zig-zag shape extending in a radial direction relative to the central axis.
F01N 3/20 - Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for rendering innocuous by thermal or catalytic conversion of noxious components of exhaust characterised by methods of operationControl specially adapted for catalytic conversion
F01N 3/027 - Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for cooling, or for removing solid constituents of, exhaust by means of filters using means for regenerating the filters, e.g. by burning trapped particles using electric or magnetic heating
F23G 7/00 - Methods or apparatus, e.g. incinerators, specially adapted for combustion of specific waste or low grade fuels, e.g. chemicals
H05B 3/48 - Heating elements having the shape of rods or tubes non-flexible heating conductor embedded in insulating material
81.
METAL HEATER ASSEMBLY WITH EMBEDDED RESISTIVE HEATERS
A metal heater includes a metal substrate with a groove, a resistive heater disposed within the groove, and a fill metal disposed over the resistive heater and substantially filling the groove, wherein the fill metal has a lower melting temperature than the metal substrate. The fill metal can be indium and a cover plate can be bonded to the metal substrate and over the indium. A method of manufacturing the metal heater and a method of operating the metal heater are also provided.
H05B 3/12 - Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
H05B 3/06 - Heater elements structurally combined with coupling elements or with holders
A metal heater includes a metal substrate with a groove, a resistive heater disposed within the groove, and a fill metal disposed over the resistive heater and substantially filling the groove, wherein the fill metal has a lower melting temperature than the metal substrate. The fill metal can be indium and a cover plate can be bonded to the metal substrate and over the indium. A method of manufacturing the metal heater and a method of operating the metal heater are also provided.
H05B 3/24 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor being self-supporting
A support pedestal includes a support member including a resistive layer having a plurality of zones, a routing layer, and a plurality of conductive vias. The plurality of zones are defined by a plurality of independently controllable resistive heating elements. The resistive layer and the routing layer are disposed in different planes of the support member and are connected by the plurality of conductive vias.
H05B 3/06 - Heater elements structurally combined with coupling elements or with holders
H05B 3/28 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
H01L 23/485 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
C23C 16/458 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
84.
Industrial control projective capacitive touch interface
An industrial control device includes a display, a body, a first sensor, and a controller. The body includes a facia wall, an inner shroud, and an outer shroud. The facia wall includes a window that is a transparent material aligned to permit the display to be viewed through the window. The inner shroud extends rearward from a rear side of the facia wall. The outer shroud is disposed about the inner shroud and extends rearward from the rear side of the facia wall and is spaced apart from the inner shroud to define a cavity. A seal member is within the cavity forms a seal with a facia plate disposed about the inner shroud. The first sensor detects contact with a front surface of the facia wall. The controller is coupled to an output of the first sensor. The controller is coupled to the display and controls the display.
H05K 7/14 - Mounting supporting structure in casing or on frame or rack
G06F 3/041 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
G06F 3/044 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
H01R 13/514 - BasesCases formed as a modular block or assembly, i.e. composed of co-operating parts provided with contact members or holding contact members between them
A heater bundle includes a plurality of heater assemblies, at least one of the heater assemblies including a plurality of heater units, at least one of the heater units defining at least one independently controlled heating zone. A thermal provision is configured to modify a thermal conductance along a length of the at least one heater assembly to compensate for non-uniform temperatures within at least one heater unit. The heater bundle includes a power supply device including a controller configured to modulate power to the independently controlled heating zone through the power conductors based on the determined temperature to provide a desired power output along a length of at least one heater assembly.
A system includes a heater bundle having at least one heater assembly with a plurality of heater units. At least one of the heater units defines at least one independently controlled heating zone, and a plurality of power conductors are electrically connected to the heater units. A power supply device includes a controller configured to modulate power to the at least one independently controlled heating zone through the power conductors, and the controller is configured to calculate temperature within the at least one heater unit based on a predefined model and at least one input, and the controller modulates power to the at least one heater unit based on the calculated temperature.
A heater system includes a heater bundle with heater assemblies, at least one of the heater assemblies having a plurality of heater units, at least one heater unit having an independently controlled heating zone, and the at least one heater assembly having a physical construction configured to deliver a variable power output per unit length along a length of the at least one heater assembly. A plurality of power conductors are electrically connected to the plurality of heater units and the heater system further includes a means for determining temperature. A power supply device includes a controller configured to modulate power to the independently controlled heating zone through the power conductors based on the determined temperature to provide a desired power output along a length of the at least one heater assembly.
A heater system includes a heater bundle. The heater bundle includes at least one heater assembly, where the heater assembly includes a plurality of heater units, and more than one of the heater units defines at least one independently controlled heating zone. The heater bundle includes a plurality of power conductors electrically connected to the independently controlled heating zone. The heater system includes means for determining temperature and at least one power switch, the power switch disposed proximate the heater bundle. The heater system includes at least one controller configured to modulate power to the independently controlled heating zones through the power conductors based on the determined temperature to provide a desired power output along a length of the heater assembly. The controller is configured to provide power to the power switch.
A cable heater assembly includes a cable heater and an adapter system. The cable heater includes an outer sheath and a conductor. A portion of the conductor is exposed from the outer sheath. The adapter system includes an adapter body mounted to an end of the cable heater and a cap joined to the adapter body to enclose the portion of the conductor inside the cap.
A cable heater assembly includes a cable heater and an adapter system. The cable heater includes an outer sheath and a conductor. A portion of the conductor is exposed from the outer sheath. The adapter system includes an adapter body mounted to an end of the cable heater and a cap joined to the adapter body to enclose the portion of the conductor inside the cap.
A molding system is provided, which includes at least one mold part and a heating and cooling module. The at least one mold part defines a mold cavity having an opening. The heating and cooling module is inserted into the opening to close the mold cavity. The heating and cooling module includes a die insert defining a mold surface, a layered heater for heating the mold surface, and a cooling unit for cooling the mold surface. The layered heater is disposed between the die insert and the cooling unit and includes functional layers formed directly on a surface of the cooling unit or a surface of the die insert opposite to the mold surface by using layered or layering processes selected from a group consisting of thick film, thin film, thermal spray and sol-gel processes.
B29C 33/02 - Moulds or coresDetails thereof or accessories therefor with incorporated heating or cooling means
H05B 3/28 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
A method of detecting a leak-induced abnormal condition in a fluid line system having a plurality of heaters includes determining a plurality of temperature characteristics at a plurality of locations of the fluid line system, where each temperature from among the plurality of temperature characteristics is associated with at least one heater from among the plurality of heaters and monitoring, for each of the plurality of heaters, an electrical characteristic of the heater. The method includes determining the leak-induced abnormal condition is present within the fluid line system in response to the electrical characteristic of a given heater from among the plurality of heaters and the temperature characteristic associated with the given heater satisfying a temperature-and-electrical characteristics (TEC) deviation condition and performing a corrective action in response to determining the leak-induced abnormal condition is present.
A method of detecting a leak-induced abnormal condition in a fluid line system having a plurality of heaters includes determining a plurality of temperature characteristics at a plurality of locations of the fluid line system, where each temperature from among the plurality of temperature characteristics is associated with at least one heater from among the plurality of heaters and monitoring, for each of the plurality of heaters, an electrical characteristic of the heater. The method includes determining the leak-induced abnormal condition is present within the fluid line system in response to the electrical characteristic of a given heater from among the plurality of heaters and the temperature characteristic associated with the given heater satisfying a temperature-and-electrical characteristics (TEC) deviation condition and performing a corrective action in response to determining the leak-induced abnormal condition is present.
G01M 3/18 - Investigating fluid tightness of structures by using fluid or vacuum by detecting the presence of fluid at the leakage point using electric detection means for pipes, cables, or tubesInvestigating fluid tightness of structures by using fluid or vacuum by detecting the presence of fluid at the leakage point using electric detection means for pipe joints or sealsInvestigating fluid tightness of structures by using fluid or vacuum by detecting the presence of fluid at the leakage point using electric detection means for valves
G01M 3/00 - Investigating fluid tightness of structures
G01M 3/28 - Investigating fluid tightness of structures by using fluid or vacuum by measuring rate of loss or gain of fluid, e.g. by pressure-responsive devices, by flow detectors for pipes, cables, or tubesInvestigating fluid tightness of structures by using fluid or vacuum by measuring rate of loss or gain of fluid, e.g. by pressure-responsive devices, by flow detectors for pipe joints or sealsInvestigating fluid tightness of structures by using fluid or vacuum by measuring rate of loss or gain of fluid, e.g. by pressure-responsive devices, by flow detectors for valves
A method of providing power via a plurality of power control systems forming a power network is provided. Each power control system includes a power controller and a power switch operable by the power controller. The method includes defining, by each power controller of the power network, a power allocation schedule for a power cycle using a dynamic load scheduling model based on a members list of the power network. The power cycle is divided into a plurality of power units, and the power allocation schedule identifies one or more designated power control systems from among the plurality of power control systems to provide power to a load during each of the power units. For the power cycle, the method includes providing power to the load by the one or more designated power control systems during a respective power unit based on the power allocation schedule.
H02J 3/00 - Circuit arrangements for ac mains or ac distribution networks
H02J 13/00 - Circuit arrangements for providing remote indication of network conditions, e.g. an instantaneous record of the open or closed condition of each circuitbreaker in the networkCircuit arrangements for providing remote control of switching means in a power distribution network, e.g. switching in and out of current consumers by using a pulse code signal carried by the network
A method of providing power via a plurality of power control systems forming a power network is provided. Each power control system includes a power controller and a power switch operable by the power controller. The method includes defining, by each power controller of the power network, a power allocation schedule for a power cycle using a dynamic load scheduling model based on a members list of the power network. The power cycle is divided into a plurality of power units, and the power allocation schedule identifies one or more designated power control systems from among the plurality of power control systems to provide power to a load during each of the power units. For the power cycle, the method includes providing power to the load by the one or more designated power control systems during a respective power unit based on the power allocation schedule.
The present disclosure is directed toward a temperature detector probe that includes a housing, a pair of electrical connectors, a support cap, and a sensor. The housing defines a bore longitudinally extending through the housing, and the pair of electrical connectors extend through the bore. The support cap is disposed at a first end portion of the housing. The sensor is provided on the support cap and is electrically coupled to the pair of electrical connectors. The support cap is positioned between the pair of electrical connectors and the support cap.
G01K 7/02 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using thermoelectric elements, e.g. thermocouples
G01K 1/16 - Special arrangements for conducting heat from the object to the sensitive element
G01K 1/143 - SupportsFastening devicesArrangements for mounting thermometers in particular locations for measuring surface temperatures
A support pedestal includes a substrate, a plurality of resistive heating elements disposed on the substrate and defining a plurality of heating zones, and electric terminals disposed at a central region of the substrate. At least one of the electric terminals is connected to at least two of the plurality of resistive heating elements.
H05B 3/28 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
C23C 16/458 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
H01L 23/485 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
H01L 23/52 - Arrangements for conducting electric current within the device in operation from one component to another
H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
A termination assembly for a heater assembly includes a plurality of resistive heaters (26) arranged in discrete power phases, each resistive heater comprising a resistive heating element surrounded by dielectric material and a sheath. The termination assembly includes a plurality of electrically nonconductive members (76). Each electrically nonconductive member (76) includes a plurality of apertures configured to receive power pins (80) of the plurality of resistive heaters. The termination assembly includes a plurality of connectors (82) configured to connect the power pins to the electrically nonconductive members. Each electrically nonconductive member includes a number of the plurality of connectors corresponding to a number of power pins being terminated. The termination assembly includes an electrical circuit (85) embedded in or disposed on at least one of the plurality of electrically nonconductive members.
H05B 3/06 - Heater elements structurally combined with coupling elements or with holders
F24H 1/10 - Continuous-flow heaters, i.e. heaters in which heat is generated only while the water is flowing, e.g. with direct contact of the water with the heating medium
H05B 3/42 - Heating elements having the shape of rods or tubes non-flexible
99.
ENCAPSULATED BUS CIRCUIT FOR FLUID HEATING SYSTEMS
A termination assembly for a heater assembly includes a plurality of resistive heaters arranged in discrete power phases, each resistive heater comprising a resistive heating element surrounded by dielectric material and a sheath. The termination assembly includes a plurality of electrically nonconductive members. Each electrically nonconductive member includes a plurality of apertures configured to receive power pins of the plurality of resistive heaters. The termination assembly includes a plurality of connectors configured to connect the power pins to the electrically nonconductive members. Each electrically nonconductive member includes a number of the plurality of connectors corresponding to a number of power pins being terminated. The termination assembly includes an electrical circuit embedded in or disposed on at least one of the plurality of electrically nonconductive members.
F24H 1/10 - Continuous-flow heaters, i.e. heaters in which heat is generated only while the water is flowing, e.g. with direct contact of the water with the heating medium
F24H 15/407 - Control of fluid heaters characterised by the type of controllers using electrical switching, e.g. TRIAC
A method includes: emitting, by a controller, a stimulus at a heating surface of a heater assembly, the stimulus causing a disturbance to a predetermined temperature of the heating surface, wherein the heater assembly has the heating surface and a plurality of heating elements for heating a heating target; receiving, by a control system from the controller, stimulus information; and controlling, by the control system, the heater assembly to maintain a predetermined temperature profile on the heating surface based on the stimulus information from the controller.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H05B 3/22 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
