Yamaichi Electronics Co., Ltd.

Japan

Back to Profile

1-100 of 241 for Yamaichi Electronics Co., Ltd. and 1 subsidiary Sort by
Query
Aggregations
IP Type
        Patent 218
        Trademark 23
Jurisdiction
        United States 132
        World 101
        Europe 5
        Canada 3
Owner / Subsidiary
[Owner] Yamaichi Electronics Co., Ltd. 241
Asia Yamaichi Electronics Inc. 1
Date
2026 July 1
2026 June 2
2026 (YTD) 6
2025 22
2024 17
See more
IPC Class
H01R 33/76 - Holders with sockets, clips or analogous contacts, adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket 25
G01R 1/067 - Measuring probes 24
H01R 12/71 - Coupling devices for rigid printing circuits or like structures 24
G01R 31/26 - Testing of individual semiconductor devices 20
G02B 6/42 - Coupling light guides with opto-electronic elements 20
See more
Status
Pending 19
Registered / In Force 222
  1     2     3        Next Page

1.

ELECTRICAL CONNECTOR FOR HIGH-SPEED TRANSMISSION

      
Application Number 19554471
Status Pending
Filing Date 2026-03-02
First Publication Date 2026-07-09
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor
  • Takai, Yosuke
  • Ito, Toshiyasu

Abstract

Provided is a connector having: a top pin group 120 having a plurality of contact pins 121, 122 aligned in a predetermined direction; and a bottom pin group having a plurality of contact pins aligned in the predetermined direction in which the bottom pin group is arranged so as to face the top pin group 120 and located on a mount substrate side. Each of the contact pins 121, 122 is at least either one of a signal pin 122 used for signaling and a ground pin 121 used for grounding, and the top pin group 120 has a double ground configuration in which sets each including two signal pins 122 aligned between two ground pins 121 are aligned adjacent to each other in the predetermined direction.

IPC Classes  ?

  • H01R 13/6471 - Means for preventing cross-talk by special arrangement of ground and signal conductors, e.g. GSGS [Ground-Signal-Ground-Signal]
  • H01R 12/72 - Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
  • H01R 13/6585 - Shielding material individually surrounding or interposed between mutually spaced contacts
  • H01R 12/73 - Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures

2.

ELECTRICAL COMPONENT SOCKET

      
Application Number JP2024043124
Publication Number 2026/120779
Status In Force
Filing Date 2024-12-05
Publication Date 2026-06-11
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor Yamamoto Seiya

Abstract

The purpose of the present invention is to provide an electrical component socket that can hold a contact pin with good precision and ensure proper contact with both a mounting substrate and a semiconductor package. The present invention provides an electrical component socket characterized by comprising: a base member; a plurality of contact pins; a movable pedestal that has a plurality of first through holes in which the plurality of contact pins can slide; and a first holding substrate that has a plurality of second through holes holding the plurality of contact pins in a slidable manner, and is provided to be movable in the axial direction of the contact pins with respect to the base member, wherein the base member houses the plurality of contact pins, the movable pedestal, and the first holding substrate, in the state in which the electrical component socket is placed on an external substrate, the plurality of contact pins are held by the first holding substrate so as to be at positions not in contact with the external substrate, and when the electrical component socket is to be fixed to the external substrate after being placed on the external substrate, the first holding substrate is lowered, and the plurality of contact pins come into contact with the electrodes of the external substrate.

IPC Classes  ?

  • H01R 33/76 - Holders with sockets, clips or analogous contacts, adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket

3.

CONNECTOR

      
Application Number JP2024043292
Publication Number 2026/120810
Status In Force
Filing Date 2024-12-06
Publication Date 2026-06-11
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor
  • Hashimoto Kazuya
  • Takahira Hiroshi

Abstract

This connector (10) has: a first receptacle unit (100a) mounted on a first board (11a); a second receptacle unit (100b) mounted on a second board (11b); and a plug unit (200) connecting the receptacle units (100a, 100b). Each receptacle unit (100a, 100b) has: a housing (110) fixed to the board (11a, 11b) on which the receptacle unit (100a, 100b) is mounted; and a displacement part (120) that can be displaced with respect to the housing (110). The plug unit (200) has an FPC (210) and a housing (220) that holds the FPC (210). The connector (10) electrically connects the first board (11a) and the second board (11b) to each other due to the plug unit (200) being connected to each receptacle unit (100a, 100b).

IPC Classes  ?

  • H01R 12/91 - Coupling devices allowing relative movement between coupling parts e.g. floating or self aligning
  • H01R 12/53 - Fixed connections for rigid printed circuits or like structures connecting to cables except for flat or ribbon cables
  • H01R 31/06 - Intermediate parts for linking two coupling parts, e.g. adapter

4.

Connector for an optical module

      
Application Number 29990522
Grant Number D1119810
Status In Force
Filing Date 2025-02-21
First Publication Date 2026-03-24
Grant Date 2026-03-24
Owner Yamaichi Electronics Co., Ltd. (Japan)
Inventor
  • Ito, Toshiyasu
  • Saito, Masaaki

5.

Connector for an optical module

      
Application Number 29743934
Grant Number D1114741
Status In Force
Filing Date 2020-07-24
First Publication Date 2026-02-24
Grant Date 2026-02-24
Owner Yamaichi Electronics Co., Ltd. (Japan)
Inventor
  • Ito, Toshiyasu
  • Saito, Masaaki

6.

CONNECTOR ASSEMBLY

      
Application Number 19237314
Status Pending
Filing Date 2025-06-13
First Publication Date 2026-01-29
Owner
  • Japan Aviation Electronics Industry, Ltd. (Japan)
  • Yamaichi Electronics Co., Ltd. (Japan)
Inventor
  • Tanaka, Masashi
  • Kuribayashi, Hiroaki
  • Nozawa, Keita
  • Ito, Toshiyasu
  • Takai, Yosuke
  • Saito, Masaaki

Abstract

A connector assembly in which ground paths between cables and a paddle card are formed and of which the size can be reduced is provided. A connector assembly includes a ground member including a plurality of partitioning members made of metal, each of which has a U-shape, and a metal plate to which the partitioning members are fixed. The ground member is configured such that the partitioning members are arranged at a pitch twice a predetermined pitch in a width direction of the connector assembly, so that partition walls of the partitioning members are arranged at the predetermined pitch in the width direction of the connector assembly. The ground shields are electrically connected to the ground member in a state where ground shields exposed from insulating films of the cables are disposed between the partition walls.

IPC Classes  ?

  • H01R 24/56 - Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency specially adapted for specific shapes of cables, e.g. corrugated cables, twisted pair cables, cables with two screens or hollow cables

7.

Receptacle cage

      
Application Number 30003717
Grant Number D1103123
Status In Force
Filing Date 2025-05-14
First Publication Date 2025-11-25
Grant Date 2025-11-25
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor Ito, Toshiyasu

8.

RELAY CONNECTOR, MOUNTING CONNECTOR, AND CONNECTOR ASSEMBLY

      
Application Number JP2025009550
Publication Number 2025/225193
Status In Force
Filing Date 2025-03-13
Publication Date 2025-10-30
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor
  • Sasaki, Takamitsu
  • Aoki, Masayoshi

Abstract

The present invention comprises a signal pin (160) that extends along a first axis (C1), a connector body (110) that accommodates the signal pin (160), and a ground fitting (120) that is attached to the connector body (110). The connector body (110) has a lower cylindrical section (111) that surrounds a mounting connector that is formed into a cylindrical shape centered on the first axis (C1) and is mounted on a substrate. The ground fitting (120) has at least one leaf spring part (122). The leaf spring part (122) includes a tip-side portion (122a) and a base-end-side portion (122b). The tip-side portion (122a) is positioned inside the lower cylindrical section (111) and is in contact with the outer peripheral surface of a mounting connector (200) at a first contact point. The base-end-side portion (122b) is positioned outside the lower cylindrical section (111) and is in contact with the connector body (110) at a second contact point.

IPC Classes  ?

  • H01R 31/06 - Intermediate parts for linking two coupling parts, e.g. adapter
  • H01R 12/91 - Coupling devices allowing relative movement between coupling parts e.g. floating or self aligning

9.

Case for containing circuit board

      
Application Number 29840820
Grant Number D1099056
Status In Force
Filing Date 2022-06-01
First Publication Date 2025-10-21
Grant Date 2025-10-21
Owner Yamaichi Electronics Co., Ltd. (Japan)
Inventor Shimoyama, Takahiro

10.

Receptacle cage

      
Application Number 29854890
Grant Number D1098050
Status In Force
Filing Date 2022-09-28
First Publication Date 2025-10-14
Grant Date 2025-10-14
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor Ito, Toshiyasu

11.

Case for containing circuit board

      
Application Number 29840822
Grant Number D1098061
Status In Force
Filing Date 2022-06-01
First Publication Date 2025-10-14
Grant Date 2025-10-14
Owner Yamaichi Electronics Co., Ltd. (Japan)
Inventor Shimoyama, Takahiro

12.

CONNECTOR AND CONNECTOR ASSEMBLY

      
Application Number 18606603
Status Pending
Filing Date 2024-03-15
First Publication Date 2025-09-18
Owner Yamaichi Electronics Co., Ltd. (Japan)
Inventor
  • Ito, Toshiyasu
  • Cole, Christopher R.

Abstract

A connector which is mounted on a circuit board and into which a module board of an external module is inserted in a first direction. The circuit board has pads for power supply that are arranged spaced apart from each other in a second direction, and the module board has electrodes for power supply. The connector includes: a connector body into which the module board is inserted; one or more power supply pins accommodated inside the connector body and being in contact with the electrodes for power supply of the module board; and at least one bus bar. The bus bar is connected to the one or more power supply pins and connected to the pads for power supply that are arranged spaced apart from each other in the second direction.

IPC Classes  ?

  • H01R 12/71 - Coupling devices for rigid printing circuits or like structures
  • H01R 13/424 - Securing in a demountable manner in base or case composed of a plurality of insulating parts having at least one resilient insulating part
  • H01R 13/518 - Means for holding or embracing insulating body, e.g. casing for holding or embracing several coupling parts, e.g. frames

13.

INSPECTION SOCKET

      
Application Number JP2024042981
Publication Number 2025/164086
Status In Force
Filing Date 2024-12-05
Publication Date 2025-08-07
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor
  • Ishibashi, Takahiro
  • Miyaaki, Junichi

Abstract

Provided is a socket equipped with a pressing member that is free from wobbling or capable of minimizing wobbling during movement. In a first section where a cover member (120) moves upward by a prescribed distance from a proximity position, the movement of a latch member (150) is regulated by a link mechanism so as to move upward of a placement surface (113a) from a release position by turning about the axis along the depth direction. In a second section where the cover member (120) moves further upward to reach a separation position, the movement of the latch member (150) is regulated by the link mechanism so as to move to a pressing position by moving only downward.

IPC Classes  ?

  • H01R 33/76 - Holders with sockets, clips or analogous contacts, adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
  • H01L 23/32 - Holders for supporting the complete device in operation, i.e. detachable fixtures

14.

CONNECTOR AND CONNECTOR ASSEMBLY

      
Application Number 19024834
Status Pending
Filing Date 2025-01-16
First Publication Date 2025-07-31
Owner Yamaichi Electronics Co., Ltd. (Japan)
Inventor
  • Ito, Toshiyasu
  • Cole, Christopher R.
  • Kikuchi, Koji

Abstract

Provided is a connector which is mounted on a circuit board and into which a module board of an external module is inserted in a first direction. The circuit board has pads for power supply that are arranged spaced apart from each other in a second direction, and the module board has electrodes for power supply. The connector includes: a connector body into which the module board is inserted; one or more power supply pins accommodated inside the connector body and being in contact with the electrodes for power supply of the module board; and at least one bus bar. The bus bar is connected to the one or more power supply pins and connected to the pads for power supply that are arranged spaced apart from each other in the second direction.

IPC Classes  ?

  • H01R 12/71 - Coupling devices for rigid printing circuits or like structures
  • H01R 12/70 - Coupling devices
  • H01R 13/02 - Contact members
  • H01R 13/447 - Shutter or cover plate
  • H01R 25/16 - Rails or bus-bars provided with a plurality of discrete connecting locations for counterparts

15.

CARD CONNECTOR

      
Application Number JP2024000447
Publication Number 2025/150149
Status In Force
Filing Date 2024-01-11
Publication Date 2025-07-17
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor
  • Murayama Yuta
  • Hashimoto Kazuya
  • Takahira Hiroshi

Abstract

Provided is a card connector in which a heat transfer part makes proper contact with an inserted card to enable efficient radiation of heat to the outside. Provided is a card connector comprising: a base member that accommodates an external card; a plurality of contacts that are attached to the base member and that, when the external card is accommodated, make contact with a terminal member of the external card; a cover member that forms an accommodation space for the base member and the external card; and a crosspiece part that defines the accommodation space together with the base member and the cover member. The cover member is provided with a top plate part. The top plate part is provided with a heat transfer part that, when the external card is accommodated in the accommodation space, makes contact with the external card. The heat transfer part is in the form of a spring having a cantilevered structure curved toward the accommodation space, and, when the external card is not accommodated, a portion of the surface of the free end of the cantilevered structure facing the accommodation space makes contact with the crosspiece part.

IPC Classes  ?

  • H01R 12/72 - Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
  • G06K 7/00 - Methods or arrangements for sensing record carriers

16.

Connector

      
Application Number 29853881
Grant Number D1082701
Status In Force
Filing Date 2022-09-20
First Publication Date 2025-07-08
Grant Date 2025-07-08
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor Ito, Toshiyasu

17.

Connector

      
Application Number 29853876
Grant Number D1082700
Status In Force
Filing Date 2022-09-20
First Publication Date 2025-07-08
Grant Date 2025-07-08
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor Ito, Toshiyasu

18.

CONNECTOR

      
Application Number JP2023047018
Publication Number 2025/141799
Status In Force
Filing Date 2023-12-27
Publication Date 2025-07-03
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor
  • Yamada, Yoshiya
  • Takahira, Hiroshi
  • Shimoyama, Takahiro

Abstract

The present invention provides a connector having a structure which makes it possible to improve assemblability and handleability. Provided is a connector 10 for electrically connecting, to a printed wiring board 20, a flat-shaped electronic component 30 which is inserted along the depth direction D1, said connector 10 comprising a pushing member 150. The pushing member 150 has a plurality of pushing pieces 153. The plurality of pushing pieces 153: extend along the depth direction D1; are arranged in the width direction D2; push, with portions thereof which are located near tip ends thereof, a lock member 120 toward a plurality of contact pins 131; and are connected to and integrated with each other at portions thereof which are located near base ends thereof.

IPC Classes  ?

  • H01R 13/629 - Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure

19.

Cage and cage assembly

      
Application Number 18522823
Grant Number 12674946
Status In Force
Filing Date 2023-11-29
First Publication Date 2025-05-29
Grant Date 2026-07-07
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor Ito, Toshiyasu

Abstract

A cage configured to be attached to a face of a circuit board and accommodate external devices inserted into the cage along a depth direction substantially orthogonal to the face includes at least one vertical unit. The vertical unit defines a port set where ports as spaces to accommodate the external devices are aligned in the vertical direction, has two vertical plates extending in the vertical direction, spanning over the entire height in the vertical direction of the port set, and arranged to face each other in the horizontal direction spaced from each other by a distance corresponding to a width in the horizontal direction of the ports, and has horizontal plates extending in the horizontal direction, arranged between the vertical plates, and arranged to face each other in the vertical direction. In the vertical unit, the ports are defined by the two vertical plates and the horizontal plates.

IPC Classes  ?

  • G02B 6/42 - Coupling light guides with opto-electronic elements

20.

Receptacle assembly panel

      
Application Number 29854840
Grant Number D1070773
Status In Force
Filing Date 2022-09-28
First Publication Date 2025-04-15
Grant Date 2025-04-15
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor Ito, Toshiyasu

21.

Receptacle assembly panel

      
Application Number 29854883
Grant Number D1070774
Status In Force
Filing Date 2022-09-28
First Publication Date 2025-04-15
Grant Date 2025-04-15
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor Ito, Toshiyasu

22.

Receptacle assembly and circuit board

      
Application Number 18377059
Grant Number 12652751
Status In Force
Filing Date 2023-10-05
First Publication Date 2025-04-10
Grant Date 2026-06-09
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor Ito, Toshiyasu

Abstract

Provided are a receptacle assembly and a circuit board in which routing of internal layer wirings is taken into consideration. Some of the plurality of first internal layer wirings 134 are drawn toward the second electrode line L2 when viewed in the depth direction Dd, and some of the plurality of second internal layer wirings 134 are drawn toward the first electrode line L1 when viewed in the depth direction Dd.

IPC Classes  ?

  • H05K 1/02 - Printed circuits Details
  • H01R 12/73 - Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
  • H05K 1/18 - Printed circuits structurally associated with non-printed electric components
  • H05K 1/181 -

23.

RELAY DEVICE AND CONNECTOR ASSEMBLY

      
Application Number 18375038
Status Pending
Filing Date 2023-09-29
First Publication Date 2025-04-03
Owner Yamaichi Electronics Co., Ltd. (Japan)
Inventor
  • Ito, Toshiyasu
  • Kuroda, Toshitaka
  • Saito, Masaaki

Abstract

Provided are a relay device and a connector assembly that can electrically connect a connector and an external circuit board to each other without using terminals bent at a right angle. A relay device configured to electrically connect a plurality of contact pins to a plurality of cables and a host board includes a paddle board and a connection part, the paddle board electrically connects some of the plurality of contact pins to the plurality of cables, the connection part has a plurality of press-fit pins, and the plurality of press-fit pins electrically connect the paddle board to the host board.

IPC Classes  ?

  • H01R 31/06 - Intermediate parts for linking two coupling parts, e.g. adapter
  • H01R 12/71 - Coupling devices for rigid printing circuits or like structures
  • H01R 13/04 - Pins or blades for co-operation with sockets
  • H01R 13/10 - Sockets for co-operation with pins or blades
  • H01R 13/506 - BasesCases composed of different pieces assembled by snap action of the parts
  • H01R 13/6461 - Means for preventing cross-talk

24.

ELECTRIC CONNECTOR AND ELECTRONIC APPARATUS

      
Application Number JP2023035794
Publication Number 2025/069438
Status In Force
Filing Date 2023-09-29
Publication Date 2025-04-03
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor Shimoyama,takahiro

Abstract

An electric connector (1) comprises: a connector body (1a); at least one signal contact (40); and at least one ground contact (50) that is attached to the connector body (1a) in a manner allowing for displacement with respect to the connector body (1a) along the direction in which the electric connector (1) is mounted on a mounting substrate (200), the at least one ground contact (50) including at least one leaf spring portion (52) and at least one contact portion (51c) that is pressed against the mounting substrate (200) in accordance with operation of the at least one leaf spring portion (52). The connector body (1a) has at least one pressed surface (67, 18a) that is pressed by the at least one leaf spring portion (52), the at least one pressed surface (67, 18a) being formed non-perpendicular to the mounting direction. The at least one ground contact (50) is configured so as to be biased in a direction away from the connector body (1a) in response to pressing of the at least one pressed surface (67, 18a) by the at least one leaf spring portion (52) in a direction intersecting the mounting direction.

IPC Classes  ?

  • H01R 12/91 - Coupling devices allowing relative movement between coupling parts e.g. floating or self aligning
  • H01R 24/38 - Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts

25.

CONNECTOR

      
Application Number 18375130
Status Pending
Filing Date 2023-09-29
First Publication Date 2025-04-03
Owner Yamaichi Electronics Co., Ltd. (Japan)
Inventor Ito, Toshiyasu

Abstract

Provided is a connector in which a housing is reinforced in order to suppress deformation of the housing and thus realize good contact performance of contact pins. Outer housings 110, 110′ each have a base part 111, an intermediate part 112, and a tip part 113 from the circuit board 20 side along the depth direction Dd, the base part 111 includes a bottom face 111a facing a circuit board 20, the tip part 113 includes a slot opening 113a configured to accept a module board 11 inserted, the intermediate part 112 includes a smaller dimension in the width direction Dw and/or a smaller dimension of the height direction Dh than the base part 111 and the tip part 113, and a frame 170, a second frame 180, and a frame 190 each are an annular plate having four sides surrounding the intermediate part 112.

IPC Classes  ?

  • H01R 12/73 - Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures

26.

Cage assembly and receptacle assembly

      
Application Number 18372841
Grant Number 12422200
Status In Force
Filing Date 2023-09-26
First Publication Date 2025-03-27
Grant Date 2025-09-23
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor
  • Ito, Toshiyasu
  • Saito, Masaaki

Abstract

Provided are a cage assembly and a receptacle assembly that can efficiently cool a heat sink. An embodiment includes: a cage 100 configured to house an optical module 310; and a heat sink 50 configured to thermally contact with the optical module 310, the cage 100 has a port wall 110 defining a port Sp in which the optical module 310 is housed, a first adjacent wall 120 defining a first adjacent space S1 that is adjacent to the port Sp in the second direction, and a second adjacent wall 130 defining a second adjacent space S2 that is adjacent to the port Sp in the third direction and in which the optical module 310 is not housed, and the heat sink 50 is housed in the first adjacent space S1.

IPC Classes  ?

  • G06F 1/16 - Constructional details or arrangements
  • F28F 9/00 - CasingsHeader boxesAuxiliary supports for elementsAuxiliary members within casings
  • F28F 9/02 - Header boxesEnd plates
  • G02B 6/42 - Coupling light guides with opto-electronic elements
  • H05K 5/00 - Casings, cabinets or drawers for electric apparatus
  • H05K 7/00 - Constructional details common to different types of electric apparatus
  • H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

27.

CABLE DEVICE AND METHOD OF PRODUCING THE SAME

      
Application Number 18686682
Status Pending
Filing Date 2021-10-05
First Publication Date 2025-01-16
Owner Yamaichi Electronics Co., Ltd. (Japan)
Inventor
  • Shimoyama, Takahiro
  • Yonezawa, Akira
  • Takahira, Hiroshi

Abstract

Cable device (9) includes a flexible cable (2) including a plurality of cable-strips (35) formed in accordance with one or more slits (21), and one or more bundling members (5) for bundling the plurality of cable-strips (35) into a stacked state. The plurality of cable-strips (35) includes two or more signal transmission strips (35s) each of which includes at least one high-frequency signal transmission line. The cable device (9) further includes a spacer (80) interposed between the signal transmission strips (35s) in a stacking direction of the cable-strips (35) in at least one or more bundling locations by the one or more bundling members (5).

IPC Classes  ?

  • H05K 1/02 - Printed circuits Details
  • H01B 7/08 - Flat or ribbon cables
  • H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables

28.

CABLE ASSEMBLY AND METHOD FOR MANUFACTURING CABLE ASSEMBLY

      
Application Number 18221157
Status Pending
Filing Date 2023-07-12
First Publication Date 2025-01-16
Owner
  • YAMAICHI ELECTRONICS CO., LTD. (Japan)
  • Japan Aviation Electronics Industry, Limited (Japan)
Inventor
  • Ito, Toshiyasu
  • Shimizu, Osamu
  • Kuroki, Yoshihide
  • Nozawa, Keita
  • Tanaka, Masashi
  • Kuribayashi, Hiroaki

Abstract

According to an embodiment, a cable assembly arranged between a first connector and a second connector is disclosed. The first connector is arranged at a position near a control device on a substrate and the second connector is arranged at a position away from the control device on the substrate. The cable assembly includes a cable row, a paddle card substrate and a hot melt material. In the cable row a plurality of cables each transmitting a differential signal are arranged side by side. The paddle card substrate is provided with signal electrodes and ground electrodes, internal conductors of the plurality of cables are electrically connected to the signal electrodes. External conductors of the plurality of cables are electrically connected to the ground electrodes.

IPC Classes  ?

  • H01R 12/62 - Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
  • H01R 13/6585 - Shielding material individually surrounding or interposed between mutually spaced contacts
  • H01R 43/02 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections

29.

HEATSINK UNIT, IC SOCKET, SEMICONDUCTOR PACKAGE MAKING METHOD, AND SEMICONDUCTOR PACKAGE

      
Application Number 18270398
Status Pending
Filing Date 2021-12-10
First Publication Date 2024-12-19
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor
  • Miwa, Koichi
  • Sagano, Hideki
  • Sato, Masaru

Abstract

Provided is a heat sink unit that is less likely to damage a package and has excellent handleability. The heat sink unit 1 includes a base 90, a cover 20, a first lever 80, a third lever 50, and a heat sink 30. The first lever 80 is rotatably held by the base 90, carries the heat sink 30 and a heat sink pedestal 40, and is hard stopped at the base 90 by an end portion of the first lever 80. The third lever 50 is rotatably held by the cover 20, is connected to the first lever 80 to open and close the same, and controls up-and-down movements of the heat sink pedestal 40 by a tip end of the third lever 50. The heat sink 30 is configured to press the IC package 100 with timing shifted by a long hole of the third lever 50 after the first lever 80 is hard stopped at the base 90.

IPC Classes  ?

  • H01L 23/40 - Mountings or securing means for detachable cooling or heating arrangements
  • H01L 23/043 - ContainersSeals characterised by the shape the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
  • H01L 23/367 - Cooling facilitated by shape of device

30.

ELECTRICAL COMPONENT SOCKET

      
Application Number JP2024010233
Publication Number 2024/241675
Status In Force
Filing Date 2024-03-15
Publication Date 2024-11-28
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor
  • Yamamoto Seiya
  • Suzuki Katsumi

Abstract

Provided is an electrical component socket that suppresses deformation of holding substrates and accurately holds contact pins at predetermined positions. Provided is an electrical component socket comprising a movable base, a first holding substrate, a second holding substrate, and contact pins slidably held by the first holding substrate and the second holding substrate. The electrical component socket is characterized by further comprising a first elastic member that is disposed between the movable base and the first holding substrate, and is subjected to elastic force in the axial direction of the contact pins, and a second elastic member that is disposed between the first holding substrate and the second holding substrate, and is subjected to elastic force in the axial direction of the contact pins, wherein a part of the first holding substrate is sandwiched between the first elastic member and the second elastic member.

IPC Classes  ?

  • G01R 31/26 - Testing of individual semiconductor devices
  • H01R 33/76 - Holders with sockets, clips or analogous contacts, adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket

31.

PROBE AND INSPECTION SOCKET

      
Application Number 18687416
Status Pending
Filing Date 2022-08-10
First Publication Date 2024-10-24
Owner
  • Yamaichi Electronics Co., Ltd. (Japan)
  • Mikuro Spring Co., Ltd. (Japan)
Inventor
  • Yamamoto, Seiya
  • Suzuki, Katsumi
  • Fujimoto, Shinya

Abstract

Provided are a probe and a socket for inspection that cause the probe to be in direct contact with a housing and are not required to have high dimensional accuracy in the manufacturing thereof. A probe for grounding to be inserted through a through-hole, which is formed in a housing and defined by a metal inner circumferential wall, includes: a probe body including a cylindrical barrel extending in the direction of a first axis and a plunger; and a spring member through which the barrel is inserted, the spring member includes a coil part wound about a second axis, the barrel being inserted through the coil part in the direction of the second axis, and includes a protruding part formed continuously to the coil part and protruding outward from an outer circumferential face of the coil part to be in elastic contact with the inner circumferential wall, and the coil part presses the probe body against the inner circumferential wall by elasticity of the protruding part.

IPC Classes  ?

  • G01R 1/067 - Measuring probes
  • G01R 1/04 - HousingsSupporting membersArrangements of terminals

32.

CONNECTOR

      
Application Number 18608569
Status Pending
Filing Date 2024-03-18
First Publication Date 2024-09-19
Owner Yamaichi Electronics Co., Ltd. (Japan)
Inventor
  • Kukita, Hiroaki
  • Okubo, Miho

Abstract

Provided is a connector that can suppress resonance without using an additional component such as a conductive resin or a metal piece. A connector 1 includes: a pair of signal pins arranged in parallel and configured for differential transmission; a pair of ground pins 7G arranged in parallel on both sides of the pair of signal pins, respectively; and a housing 2 configured to accommodate the signal pins and the ground pins 7G, and a dielectric constant of surroundings of the ground pins 7G is smaller than a dielectric constant of surroundings of the signal pins.

IPC Classes  ?

  • H01R 13/6471 - Means for preventing cross-talk by special arrangement of ground and signal conductors, e.g. GSGS [Ground-Signal-Ground-Signal]

33.

Connector with shielding plates to block noise between adjacent channels

      
Application Number 18573211
Grant Number 12676433
Status In Force
Filing Date 2021-06-22
First Publication Date 2024-08-29
Grant Date 2026-07-07
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor
  • Kasai, Eiji
  • Takahira, Hiroshi

Abstract

According to an embodiment, a connector includes a receptacle unit and a plug unit, and electrically connects external boards by inserting, fitting and connecting the plug unit into the receptacle unit in a first direction. The receptacle unit includes a plurality of first contacts arranged at predetermined intervals in a second direction orthogonal to the first direction and connected at one end to a first external board. The plug unit includes a plurality of second contacts corresponding respectively to the first contacts and arranged in the second direction, each of the second contacts having one end connected to the other end of the first contact and the other end connected to the second external board. At least either of the receptacle unit and the plug unit includes a plurality of shielding plates that are provided so as to be separated from each other in at least the second direction and each correspond to a different channel.

IPC Classes  ?

  • H01R 13/6585 - Shielding material individually surrounding or interposed between mutually spaced contacts
  • H01R 12/71 - Coupling devices for rigid printing circuits or like structures
  • H01R 13/6471 - Means for preventing cross-talk by special arrangement of ground and signal conductors, e.g. GSGS [Ground-Signal-Ground-Signal]

34.

Connector

      
Application Number 18102971
Grant Number 12537335
Status In Force
Filing Date 2023-01-30
First Publication Date 2024-08-01
Grant Date 2026-01-27
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor
  • Ito, Toshiyasu
  • Takai, Yosuke
  • Saito, Masaaki

Abstract

An embodiment includes a main body holding pin groups and partition walls partitioning adjacent signal pins from each other, each of the signal pins has a fixing part located on a mount part side and fixed to a substrate, tip parts located on an insertion-extraction part side and serving as a free end, and a contact part provided between the fixing part and the tip parts and configured to be in electrical contact with electrodes of a device, and the adjacent tip parts are located via an opening.

IPC Classes  ?

  • H01R 13/502 - BasesCases composed of different pieces
  • H01R 13/40 - Securing contact members in or to a base or caseInsulating of contact members
  • H01R 24/60 - Contacts spaced along planar side wall transverse to longitudinal axis of engagement

35.

Plug connector and receptacle connector, and method of extracting plug connector

      
Application Number 18087999
Grant Number 12500378
Status In Force
Filing Date 2022-12-23
First Publication Date 2024-06-27
Grant Date 2025-12-16
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor Ito, Toshiyasu

Abstract

A plug connector inserted in or extracted from a receptacle connector includes a casing and a lever member attached to the casing. The lever member has a fulcrum part supported pivotably to the casing, an engaging part that is located closer to the receptacle connector than the fulcrum part in an insertion-extraction direction and that can engage with an engaged part of the receptacle connector, and an operating part that is located on the opposite side from the receptacle connector with respect to the fulcrum part in the insertion-extraction direction and that, when pressed, can release the engaging part from engagement with the engaged part.

IPC Classes  ?

  • H01R 13/62 - Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
  • H01R 13/629 - Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure
  • H01R 13/633 - Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure for disengagement only

36.

CONNECTOR, CONNECTOR ASSEMBLY, CAMERA MODULE, AND ASSEMBLY METHOD

      
Application Number 18286812
Status Pending
Filing Date 2021-05-19
First Publication Date 2024-06-20
Owner Yamaichi Electronics Co., Ltd. (Japan)
Inventor
  • Murayama, Yuta
  • Takahira, Hiroshi
  • Oya, Masaaki

Abstract

A connector is provided that can be mounted on a surface of a substrate by reflow soldering while ensuring waterproofness due to a seal member. A cylindrical external terminal extends in an axis direction with an outer bush in close contact with an outer circumferential face of the external terminal. An inner bush is in close contact with an inner circumferential face of the external terminal. A contact pin is inserted in the inner bush along the axis direction inside the external terminal, and the outer bush and the inner bush have heat resistance durable against a temperature of reflow soldering performed when the connector is mounted on the substrate. A connector assembly, a camera module and an assembly method are also provided.

IPC Classes  ?

  • H01R 12/71 - Coupling devices for rigid printing circuits or like structures
  • H01R 13/52 - Dustproof, splashproof, drip-proof, waterproof, or flameproof cases

37.

CONNECTOR AND HIGH-FREQUENCY SIGNAL TRANSMISSION DEVICE

      
Application Number 18286303
Status Pending
Filing Date 2021-04-19
First Publication Date 2024-06-13
Owner Yamaichi Electronics Co., Ltd. (Japan)
Inventor
  • Takahira, Hiroshi
  • Yonezawa, Akira

Abstract

Connector to which a high-frequency signal transmission cable is electrically coupled includes: an insulator; a group of contact terminals including at least M unit arrays arranged in a width direction of the insulator, each unit array including one or more signal contact terminals and one or more ground contact terminals. The insulator includes an insulator body and at least M attachment members which are attached to the insulator body and arranged in the width direction of the insulator. The respective unit arrays included in the at least M unit arrays are respectively supported by the respective attachment members included in the at least M attachment members.

IPC Classes  ?

  • H01R 13/6471 - Means for preventing cross-talk by special arrangement of ground and signal conductors, e.g. GSGS [Ground-Signal-Ground-Signal]
  • H01R 12/77 - Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
  • H01R 13/639 - Additional means for holding or locking coupling parts together after engagement

38.

Connector and assembly method of connector

      
Application Number 18074279
Grant Number 12456829
Status In Force
Filing Date 2022-12-02
First Publication Date 2024-06-06
Grant Date 2025-10-28
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor
  • Sato, Shigeru
  • Ito, Toshiyasu

Abstract

A connector that is mounted on an external mount substrate and in or from which an external pluggable substrate is inserted or extracted in an insertion-extraction direction Die includes: pin groups each including a plurality of aligned contact pins; an outer housing holding the pin groups and a frame attached to the outer housing. The outer housing has a main body and a protruding part which protrudes in the insertion-extraction direction Die from the main body and in which a slot opening in or from which the pluggable substrate is inserted or extracted is formed. The frame surrounds the whole circumference of the protruding part and is installed on an installation surface of the main body substantially orthogonal to the insertion-extraction direction Die.

IPC Classes  ?

  • H01R 12/73 - Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
  • H01R 13/115 - U-shaped sockets having inwardly-bent legs
  • H01R 13/502 - BasesCases composed of different pieces
  • H01R 43/20 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve

39.

High-frequency signal transmission device and high-frequency signal transmission cable

      
Application Number 18286307
Grant Number 12477653
Status In Force
Filing Date 2021-04-19
First Publication Date 2024-05-23
Grant Date 2025-11-18
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor
  • Takahira, Hiroshi
  • Yonezawa, Akira

Abstract

High-frequency signal transmission cable includes: a dielectric layer; and first and second wiring layers arranged to sandwich the dielectric layer. The first wiring layer includes at least M (M indicating a natural number of 2 or more) differential transmission lines. The first wiring layer further includes a group of first ground lines including at least 2×M first ground lines. The second wiring layer includes a group of second ground lines including at least M second ground lines. The group of first ground lines are allocated to the M differential transmission lines in accordance with a condition of at least two first ground lines per one differential transmission line in non-overlap manner, and the group of second ground lines are allocated to the M differential transmission lines in accordance with a condition of at least one second ground line per one differential transmission line in non-overlap manner. Each of the differential transmission lines is interposed between the at least two first ground lines and is opposed to the at least one second ground line.

IPC Classes  ?

  • H05K 1/02 - Printed circuits Details
  • H01B 7/08 - Flat or ribbon cables
  • H01R 12/57 - Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
  • H01R 12/77 - Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
  • H01R 12/79 - Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
  • H05K 1/11 - Printed elements for providing electric connections to or between printed circuits

40.

CIRCUIT BOARD SOCKET

      
Application Number JP2023037398
Publication Number 2024/106101
Status In Force
Filing Date 2023-10-16
Publication Date 2024-05-23
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor
  • Koumi Kuniyoshi
  • Miwa Koichi
  • Miura Tomohiro

Abstract

This circuit board socket is characterized by comprising: a plurality of contacts; a contact fixing board for fixing and holding each of the plurality of contacts; an elastic contact pressing board that is connected to the contact fixing board and that has a plurality of through-holes through which the plurality of contacts pass; and a plurality of elastic contacts that are disposed on a side opposite to the contact fixing board relative to the elastic contact pressing board, and that come into contact with the plurality of contacts. The circuit board socket is characterized in that each of the elastic contacts comes into contact with the elastic contact pressing board in a direction in which an elastic force of the elastic contact is applied.

IPC Classes  ?

  • H01R 33/76 - Holders with sockets, clips or analogous contacts, adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
  • G01R 1/067 - Measuring probes
  • G01R 1/073 - Multiple probes

41.

RECEPTACLE ASSEMBLY, CAGE AND MOUNTING METHOD

      
Application Number 18205327
Status Pending
Filing Date 2023-06-02
First Publication Date 2024-03-21
Owner Yamaichi Electronics Co., Ltd. (Japan)
Inventor Ito, Toshiyasu

Abstract

An embodiment includes: a connector configured to allow a module substrate of a pluggable module to be inserted to the connector along an insertion-extraction direction Die and configured to be electrically connected to the module substrate; a cage having a cage body configured to accommodate the connector and defines a space in which the pluggable module is guided and inserted along the insertion-extraction direction Die. The connector and the cage body are mounted on a substrate such that the insertion-extraction direction Die is substantially orthogonal to the front side of the substrate and a fixing part for fixing the cage body to the substrate is provided at a rear end edge of the cage body located on the substrate side when mounted on the substrate.

IPC Classes  ?

  • H01R 13/518 - Means for holding or embracing insulating body, e.g. casing for holding or embracing several coupling parts, e.g. frames
  • H01R 12/71 - Coupling devices for rigid printing circuits or like structures

42.

SOCKET

      
Application Number JP2023022150
Publication Number 2024/042822
Status In Force
Filing Date 2023-06-14
Publication Date 2024-02-29
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor
  • Tahara,masaki
  • Miyaaki,junichi
  • Sato,masaru

Abstract

A socket (1) comprises: a base (2) having a mounting portion (21) in which an IC chip (9) is mounted, and supporting a plurality of contact members (99) that are to be electrically connected to the IC chip (9); an operating member (3) which is provided so as to be capable of moving vertically with respect to the base (2), and which is shaped to allow the IC chip (9) to be introduced into the mounting portion (21); pivoting members (4) which pivot relative to the base (2) in conjunction with the vertical movement of the operating member (3); and pressing members (5) which move, in conjunction with the pivoting of the pivoting member (4), between a contacting position in contact with an upper surface of the IC chip (9) mounted in the mounting portion (21) and a retracted position separated diagonally upward from the contacting position toward the outside of the socket, the pressing members (5) moving while maintaining a fixed orientation.

IPC Classes  ?

  • G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
  • H01R 33/76 - Holders with sockets, clips or analogous contacts, adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket

43.

CONNECTOR AND CONNECTOR ASSEMBLY

      
Application Number 18227508
Status Pending
Filing Date 2023-07-28
First Publication Date 2024-02-01
Owner Yamaichi Electronics Co., Ltd. (Japan)
Inventor Ito, Toshiyasu

Abstract

Provided are a connector and a connector assembly that can reduce an insertion loss. A connector is configured such that a substrate is inserted along an insertion-extraction direction in a region between a first pin group and a second pin group. The contact pins each have: a curved part, curved convex toward the region and including a contact point contacted with an electrode pad of the substrate; and a straight first beam part, having a tip which is connected to a base end of the curved part, and a base end which is bent so as to be spaced away from the region.

IPC Classes  ?

  • H01R 12/72 - Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
  • H01R 13/6471 - Means for preventing cross-talk by special arrangement of ground and signal conductors, e.g. GSGS [Ground-Signal-Ground-Signal]
  • H01R 43/20 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
  • H01R 13/05 - Resilient pins or blades

44.

Contact pin and socket for inspection

      
Application Number 18220319
Grant Number 12461124
Status In Force
Filing Date 2023-07-11
First Publication Date 2024-01-18
Grant Date 2025-11-04
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor Miyaaki, Junichi

Abstract

Provided are a contact pin and a socket for inspection that can improve contact reliability to an IC package. An embodiment includes: an electrically conductive electrical contact extending from a base end to a tip and having an elastic deformation part elastically expandable and compressible in the extending direction formed between the base end and the tip; and an electrically conductive thermal contact extending from a base end to a tip and having an elastic deformation part elastically expandable and compressible in the extending direction formed between the base end and the tip, and the electrical contact and the thermal contact are laterally stacked adjacent to each other and are movable independently of each other.

IPC Classes  ?

  • G01R 1/067 - Measuring probes
  • G01R 1/04 - HousingsSupporting membersArrangements of terminals

45.

CONTACT PIN AND SOCKET FOR INSPECTION

      
Application Number 18220328
Status Pending
Filing Date 2023-07-11
First Publication Date 2024-01-18
Owner Yamaichi Electronics Co., Ltd. (Japan)
Inventor Miyaaki, Junichi

Abstract

Provided are a contact pin and a socket for inspection that can improve electrical performance or thermal performance. An embodiment includes: an electric conductive electrical contact extending from the base end to the tip and having an elastic deformation part elastically expandable and compressible in the extending direction formed between the base end and the tip; an electric conductive thermal contact extending from the base end to the tip and having an elastic deformation part elastically expandable and compressible in the extending direction formed between the base end and the tip; and an electrically conductive casing that bundles the electrical contact and the thermal contact laterally stacked adjacent to each other, and the casing is in contact with the electrical contact and the thermal contact so as to form a path bypassing the elastic deformation part.

IPC Classes  ?

46.

Electrical connector for high-speed transmission

      
Application Number 18339508
Grant Number 12665352
Status In Force
Filing Date 2023-06-22
First Publication Date 2023-12-28
Grant Date 2026-06-23
Owner Yamaichi Electronics Co., Ltd. (Japan)
Inventor
  • Takai, Yosuke
  • Ito, Toshiyasu

Abstract

Provided is a connector having: a top pin group 120 having a plurality of contact pins 121, 122 aligned in a predetermined direction; and a bottom pin group having a plurality of contact pins aligned in the predetermined direction in which the bottom pin group is arranged so as to face the top pin group 120 and located on a mount substrate side. Each of the contact pins 121, 122 is at least either one of a signal pin 122 used for signaling and a ground pin 121 used for grounding, and the top pin group 120 includes a double ground configuration in which sets each including two signal pins 122 aligned between two ground pins 121 are aligned adjacent to each other in the predetermined direction.

IPC Classes  ?

  • H01R 13/6471 - Means for preventing cross-talk by special arrangement of ground and signal conductors, e.g. GSGS [Ground-Signal-Ground-Signal]
  • H01R 12/72 - Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
  • H01R 13/6585 - Shielding material individually surrounding or interposed between mutually spaced contacts
  • H01R 12/73 - Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures

47.

Connector

      
Application Number 18339538
Status Pending
Filing Date 2023-06-22
First Publication Date 2023-12-28
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor
  • Takai, Yosuke
  • Ito, Toshiyasu

Abstract

Provided is a connector including: a pin group having contact pins aligned in a predetermined direction; an alignment member formed extending in the predetermined direction and having an alignment groove at an end in a width direction orthogonal to the predetermined direction, the alignment groove being for aligning the contact pins; and a conductive member formed extending in the predetermined direction, coupled to the alignment member, and electrically connected to the contact pins used for grounding. The alignment member includes any one of a first protrusion and a first hole configured to accommodate the first protrusion in a center area in the predetermined direction, the conductive member includes the other of the first protrusion and the first hole in the center area in the predetermined direction, and the alignment member and the conductive member are coupled to each other by the first protrusion being secured in the first hole.

IPC Classes  ?

  • H01R 13/40 - Securing contact members in or to a base or caseInsulating of contact members

48.

Plug connector, housing for plug connector, and manufacturing method of housing for plug connector

      
Application Number 18339555
Grant Number 12665368
Status In Force
Filing Date 2023-06-22
First Publication Date 2023-12-28
Grant Date 2026-06-23
Owner Yamaichi Eletronics Co., Ltd. (Japan)
Inventor Takai, Yosuke

Abstract

a from the surface.

IPC Classes  ?

  • H01R 43/24 - Assembling by moulding on contact members
  • H01R 13/08 - Resiliently-mounted rigid pins or blades

49.

Connector for high-speed transmission

      
Application Number 18210968
Grant Number 12372732
Status In Force
Filing Date 2023-06-16
First Publication Date 2023-12-21
Grant Date 2025-07-29
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor Ito, Toshiyasu

Abstract

A high-speed transmission connector includes a connector housing with a slot, upper and lower plate portions facing each other across the slot, first and second contact rows arranged face to face with each other within the connector housing, first and second caps supported in a hole of the upper plate portion and the lower plate portion, respectively. Each contact of the first and second contact row includes a receiving portion to receive a header of an external communication device. The receiving portion includes a receiving tip end portion facing an insertion side of the header and a curved portion extending from a rear end of the receiving tip end portion and bent in an arch shape.

IPC Classes  ?

  • H04B 10/00 - Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
  • G02B 6/42 - Coupling light guides with opto-electronic elements
  • H04B 10/40 - Transceivers

50.

High-frequency signal transmission device and electrical connection method for wiring board and connector

      
Application Number 18209235
Grant Number 12512613
Status In Force
Filing Date 2023-06-13
First Publication Date 2023-12-14
Grant Date 2025-12-30
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor
  • Shimoyama, Takahiro
  • Yonezawa, Akira
  • Takahira, Hiroshi

Abstract

According to an embodiment, high-frequency signal transmission device includes a connector and a wiring board with two cable ends. The connector includes contact terminals with signal contact terminals and ground contact terminals. In a wiring board, signal contact pads, ground contact pads and one or more ground layers are formed on at least one of the cable ends. The ground contact terminal includes an arm portion bent so as to locally abut against the ground contact pad at a contact portion. The contact portion of the arm portion is positioned so as to (i) at least partially abut against a surface of a covering portion of the ground contact pad covering the first penetrating electrode directly above the first penetrating electrode, or (ii) abut against the ground contact pad near an outer periphery of the covering portion, when the wiring board is electrically connected to the connector.

IPC Classes  ?

  • H01R 12/67 - Fixed connections for flexible printed circuits, flat or ribbon cables or like structures characterised by the terminal insulation penetrating terminals
  • H01R 12/79 - Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures

51.

HEATSINK UNIT, IC SOCKET, METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE

      
Application Number 18034602
Status Pending
Filing Date 2021-10-07
First Publication Date 2023-11-30
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor
  • Miwa, Koichi
  • Sagano, Hideki
  • Sato, Masaru

Abstract

The present invention provides a heat sink unit that has a small mounting area and high radiating efficiency without breaking or damaging the IC package. The heat sink unit includes a base, a heat sink, a unit base, a heat sink mount, a frame member, a first lever, and a second lever. When the frame member 6 reaches a confronting position, further rocking is restricted, the heat sink mount supported by the frame member moves downward, and the end surface of the heat sink supported by the heat sink mount comes into contact with the IC package.

IPC Classes  ?

  • H01L 23/40 - Mountings or securing means for detachable cooling or heating arrangements

52.

High-speed transmission device, cable assembly, and high-speed transmission connector

      
Application Number 18140231
Grant Number 12438294
Status In Force
Filing Date 2023-04-27
First Publication Date 2023-11-02
Grant Date 2025-10-07
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor
  • Ito, Toshiyasu
  • Shimizu, Osamu

Abstract

According to an embodiment, a high-speed transmission device includes a substrate, a control device on the substrate, a first connector, a second connector; and a cable assembly between the first connector and the second connector. The first connector is disposed at a position near the control device on the substrate and electrically connected to the control device via the substrate. The second connector is disposed at a position away from the control device on the substrate and equipped with an apparatus for transmitting/receiving a signal to and from the control device. The cable assembly includes a cable row, a paddle card substrate and a first conductive resin cover. Cables each transmitting a differential signal are arranged side by side in the cable row. The cables each comprise an internal conductor and an external conductor.

IPC Classes  ?

  • H01R 12/71 - Coupling devices for rigid printing circuits or like structures
  • H01R 12/75 - Coupling devices for rigid printing circuits or like structures connecting to cables except for flat or ribbon cables

53.

High-speed transmission device, cable assembly, and high-speed transmission connector

      
Application Number 18170223
Grant Number 12451633
Status In Force
Filing Date 2023-02-16
First Publication Date 2023-11-02
Grant Date 2025-10-21
Owner
  • YAMAICHI ELECTRONICS CO., LTD. (Japan)
  • Japan Aviation Electronics Industry, Limited (Japan)
Inventor
  • Ito, Toshiyasu
  • Shimizu, Osamu
  • Kuroki, Yoshihide
  • Nozawa, Keita
  • Tanaka, Masashi
  • Kuribayashi, Hiroaki

Abstract

According to an embodiment, a high-speed transmission device includes a substrate, a control device on the substrate, a first connector, a second connector; and a cable assembly between the first connector and the second connector. The first connector is disposed at a position near the control device on the substrate and electrically connected to the control device via the substrate. The second connector is disposed at a position away from the control device on the substrate and equipped with an apparatus for transmitting/receiving a signal to and from the control device. The cable assembly includes a cable row, a paddle card substrate and a first conductive resin cover. Cables each transmitting a differential signal are arranged side by side in the cable row. The cables each comprise an internal conductor and an external conductor.

IPC Classes  ?

  • H01R 12/71 - Coupling devices for rigid printing circuits or like structures
  • H01R 12/75 - Coupling devices for rigid printing circuits or like structures connecting to cables except for flat or ribbon cables

54.

Impedance mismatch suppressing connector

      
Application Number 18042407
Grant Number 12418125
Status In Force
Filing Date 2020-08-31
First Publication Date 2023-10-12
Grant Date 2025-09-16
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor Takahira, Hiroshi

Abstract

Provided is a technical system by which the impedance mismatch of the plug unit of a connector can be suppressed. A plug unit of a connector includes: a plurality of contacts; and a housing having a base portion provided with a plurality of through holes into which the plurality of contacts are inserted, and a header that protrudes from the base portion and is provided with a plurality of slits holding portions of the plurality of contacts exposed toward the header side from the through holes. A portion of the contact inserted into the through hole and a portion of the contact held by the slit are formed in a linear shape.

IPC Classes  ?

  • H01R 12/91 - Coupling devices allowing relative movement between coupling parts e.g. floating or self aligning
  • H01R 12/71 - Coupling devices for rigid printing circuits or like structures
  • H01R 13/405 - Securing in non-demountable manner, e.g. moulding, riveting
  • H01R 13/6473 - Impedance matching

55.

Connector

      
Application Number 18042400
Grant Number 12368256
Status In Force
Filing Date 2020-08-31
First Publication Date 2023-10-12
Grant Date 2025-07-22
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor Takahira, Hiroshi

Abstract

Provided is a connector capable of smoothly performing floating while suppressing impedance mismatch. A receptacle unit of a connector includes: a fixed housing that is fixed to a substrate and has an opening portion penetrating through the fixed housing upward and downward; a floating housing accommodated in the opening portion of the fixed housing with a movable space and a movable space apart; and a plurality of contacts that are bridged between the fixed housing and the floating housing and have a support piece portion supported by the fixed housing, a support piece portion supported by the floating housing, and an elastically deformable elastic deformation portion interposed between these two support piece portions.

IPC Classes  ?

  • H01R 13/00 - Details of coupling devices of the kinds covered by groups or
  • H01R 12/91 - Coupling devices allowing relative movement between coupling parts e.g. floating or self aligning
  • H01R 13/6473 - Impedance matching

56.

Connector

      
Application Number 18117133
Grant Number 12614883
Status In Force
Filing Date 2023-03-03
First Publication Date 2023-09-07
Grant Date 2026-04-28
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor Shimoyama, Takahiro

Abstract

Provided is a connector that can achieve improvement in strength, improvement in shape accuracy, a reduction in the number of components, and a reduction in the number of steps required for assembly. A connector for connecting an external substrate and an external cable to each other includes: a metal casing having a ground terminal part electrically connected to and fitted into an external substrate-side connector mounted to the substrate and a fitting part into which the cable is fitted, and the ground terminal part and the fitting part are integrally formed.

IPC Classes  ?

  • H01R 24/54 - Intermediate parts, e.g. adapters, splitters or elbows
  • H01R 24/52 - Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency mounted in or to a panel or structure
  • H04N 23/51 - Housings

57.

Connector for high-speed transmission

      
Application Number 17976332
Grant Number 12407136
Status In Force
Filing Date 2022-10-28
First Publication Date 2023-05-04
Grant Date 2025-09-02
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor
  • Suzuki, Hayane
  • Takai, Yosuke
  • Ito, Toshiyasu

Abstract

A connector for high-speed transmission includes a housing, a column of contacts and a metal member in the contacts. The housing includes an opening portion to be fitted into an external communication partner. The contact has a contact portion in contact with the communication partner, a first linear portion extending rearward from a rear end of the contact portion, a second linear portion bent and extending from a rear end of the first linear portion and a terminal portion soldered to an external substrate. The metal member shorts the contact for ground and is bent so as to avoid contacts other than the contact for ground. The metal member has a bent portion bent in a U-shape across the contacts other than the contact for ground, and is connected to the first and/or the second linear portion of the contact for ground.

IPC Classes  ?

  • H01R 13/6471 - Means for preventing cross-talk by special arrangement of ground and signal conductors, e.g. GSGS [Ground-Signal-Ground-Signal]
  • H01R 12/72 - Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
  • H01R 13/40 - Securing contact members in or to a base or caseInsulating of contact members
  • H01R 13/514 - BasesCases formed as a modular block or assembly, i.e. composed of co-operating parts provided with contact members or holding contact members between them
  • H01R 43/16 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending

58.

CABLE DEVICE, AND METHOD FOR MANUFACTURING SAME

      
Application Number JP2021036869
Publication Number 2023/058129
Status In Force
Filing Date 2021-10-05
Publication Date 2023-04-13
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor
  • Shimoyama,takahiro
  • Yonezawa,akira
  • Takahira,hiroshi

Abstract

A cable device (9) comprises: a flexible cable (2) including a plurality of cable strips (35) formed in accordance with one or more slits (21); and one or more bundling implements (5) for bundling the plurality of cable strips (35) in a stacked state. The plurality of cable strips (35) include at least two signal transmitting strips (35s), each including at least one transmission path for a high frequency signal. The cable device (9) additionally includes spacers (80) inserted between the signal transmitting strips (35s) in a stacking direction of the cable strips (35), at one or more bundling locations associated with the one or more bundling implements (5).

IPC Classes  ?

59.

Mezzanine connector housing

      
Application Number 29792242
Grant Number D0983146
Status In Force
Filing Date 2022-03-15
First Publication Date 2023-04-11
Grant Date 2023-04-11
Owner Yamaichi Electronics Co., Ltd. (Japan)
Inventor Shimoyama, Takahiro

60.

PROBE AND INSPECTION SOCKET

      
Application Number JP2022030582
Publication Number 2023/032625
Status In Force
Filing Date 2022-08-10
Publication Date 2023-03-09
Owner
  • YAMAICHI ELECTRONICS CO., LTD. (Japan)
  • MIKURO SPRING CO., LTD. (Japan)
Inventor
  • Yamamoto, Seiya
  • Suzuki, Katsumi
  • Fujimoto, Shinya

Abstract

Provided are a probe and inspection socket that make it possible for the probe to be brought into direct contact with a housing without a high degree of manufacturing dimension precision being required. This probe for grounding is inserted into a through hole (40) that is formed in a housing (11) and is demarcated by a metal inner circumferential wall. The probe comprises a probe body (101) comprising a cylindrical barrel (130) and a plunger (110, 120) that extend in the direction of a first axis and a spring member (150) that the barrel (130) is inserted into. The spring member (150) comprises a coil part (151) that is wound around a second axis and has the barrel (130) inserted therein in the direction of the second axis and a protrusion part (152) that is formed so as to be continuous with the coil part (151), protrudes further to the outside than the outer circumferential surface of the coil part (151), and elastically touches the inner circumferential wall. The coil part (151) pushes the probe body (101) against the inner circumferential wall as a result of the elasticity of the protrusion part (152).

IPC Classes  ?

61.

Mezzanine connector housing

      
Application Number 29737479
Grant Number D0978804
Status In Force
Filing Date 2020-06-09
First Publication Date 2023-02-21
Grant Date 2023-02-21
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor Shimoyama, Takahiro

62.

Socket

      
Application Number 17814705
Grant Number 12237599
Status In Force
Filing Date 2022-07-25
First Publication Date 2023-02-02
Grant Date 2025-02-25
Owner
  • YAMAICHI ELECTRONICS CO., LTD. (Japan)
  • Huawei Technologies Co., Ltd. (China)
Inventor Ito, Toshiyasu

Abstract

A socket includes a housing and a plurality of contacts. The housing is formed in a box-shape with an opening and is provided with a matrix of through holes at a bottom portion. The plurality of contacts includes ground contacts and signal contacts which are arranged so as to be aligned alternately in a predetermined array direction by one or a plurality of them and are passed through the through holes. The ground contacts adjacent to each other in the array direction are short-circuited.

IPC Classes  ?

63.

RECEPTACLE CONNECTOR AND METHOD FOR PRODUCING SAME

      
Application Number JP2021026042
Publication Number 2023/281757
Status In Force
Filing Date 2021-07-09
Publication Date 2023-01-12
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor Kudo,yasuyuki

Abstract

This receptacle connector (2) has an insulator (21) and a female contact group (22) in which a plurality of female contacts (23) are arranged on the insulator (21) in a direction (D2) which is orthogonal to a direction (D1) in which a plug connector (1) and the receptacle connector (2) are attached and detached. The female contacts (23) have an arm pair (24') for sandwiching a male contact (13) of the plug connector (1), and also have a connecting part (25) to which an electrical wire is electrically connected. The female contacts (23) are assembled so as to electrically connect separate, independent metal members (31, 32). The metal members (31, 32) are assembled in a manner such that the female contacts (23) have the arm pair (24') and the connecting part (25).

IPC Classes  ?

  • H01R 13/11 - Resilient sockets
  • H01R 13/405 - Securing in non-demountable manner, e.g. moulding, riveting
  • H01R 13/502 - BasesCases composed of different pieces

64.

RECEPTACLE CONNECTOR AND CONNECTOR DEVICE

      
Application Number JP2021026043
Publication Number 2023/281758
Status In Force
Filing Date 2021-07-09
Publication Date 2023-01-12
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor Kudo,yasuyuki

Abstract

An insulator (21) is provided with one or more lock units (71) which prevent a cover (40) from coming off of the insulator (21) in an attaching/detaching direction (D1). When connecting a plug connector (1) to a receptacle connector (2), the lock unit (71) and the plug connector (1) come into contact with each other, whereby the cover (40) is prevented from coming off of the insulator (21).

IPC Classes  ?

  • H01R 43/18 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing bases or cases for contact members
  • H01R 13/11 - Resilient sockets
  • H01R 13/502 - BasesCases composed of different pieces

65.

CONNECTOR

      
Application Number JP2021023660
Publication Number 2022/269770
Status In Force
Filing Date 2021-06-22
Publication Date 2022-12-29
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor
  • Kasai Eiji
  • Takahira Hiroshi

Abstract

According to one embodiment, a connector comprises a receptacle unit and a plug unit. External boards are electrically connected as a result of the plug unit being connected to the receptacle unit by being inserted and fitted into the receptacle unit in a first direction. The receptacle unit comprises a plurality of first contacts that are arranged at prescribed intervals in a second direction that is orthogonal to the first direction and are connected at one end to a first external board. The plug unit comprises a plurality of second contacts that are arranged in the second direction so as to correspond to the first contacts, are respectively connected at one end to the other ends of the first contacts, and are connected at the other end to a second external board. At least one of the receptacle unit and the plug unit comprises a plurality of shielding plates that are provided so as to be separated from each other in at least the second direction and to correspond to different channels.

IPC Classes  ?

  • H01R 13/6585 - Shielding material individually surrounding or interposed between mutually spaced contacts
  • H01R 24/60 - Contacts spaced along planar side wall transverse to longitudinal axis of engagement

66.

SOCKET FOR INSPECTION OF IC PACKAGE AND METHOD FOR PRODUCING SAME

      
Application Number JP2022020244
Publication Number 2022/259818
Status In Force
Filing Date 2022-05-13
Publication Date 2022-12-15
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor
  • Tahara,masaki
  • Miyaaki,junichi
  • Sato,masaru

Abstract

A socket main body (10) is provided with a space (8) that allows horizontal movement of a ground contact pin (40) toward the outer periphery of the socket main body (10), wherein the ground contact pin (40) is attached to the socket main body (10) by the horizontal movement of the ground contact pin (40) in the space (8), so that the socket main body (10) prevents shifting of the ground contact pin (40) in the vertical direction.

IPC Classes  ?

  • H01R 33/76 - Holders with sockets, clips or analogous contacts, adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
  • G01R 31/26 - Testing of individual semiconductor devices
  • H01R 43/00 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors

67.

Connector for photoelectric conversion module and connector assembly for photoelectric conversion module

      
Application Number 17767024
Grant Number 12255418
Status In Force
Filing Date 2019-10-09
First Publication Date 2022-12-08
Grant Date 2025-03-18
Owner Yamaichi Electronics Co., Ltd. (Japan)
Inventor
  • Ito, Toshiyasu
  • Saito, Masaaki

Abstract

A connector (7) includes: a first connector part (10) having a first module side connection part connected to one end of an OSFP module in the front (F), having a first substrate side connection part connected to a substrate, and installed on the substrate; a second connector part (20) provided at a position such that the first module side connection part is interposed between the substrate and the second connector part (20), having a second module side connection part connected to one end of an OSFP module at the front (F), having a second substrate side connection part connected to the substrate, and stacked on the first connector part (10); and an intermediate part (30) provided between the first connector part (10) and the second connector part (20), and a cooling flow path in which air flows from the front (F) side toward the rear (R) side of the connector (7) is formed in the intermediate part (30).

IPC Classes  ?

  • H01R 13/533 - Bases or cases made for use in extreme conditions, e.g. high temperature, radiation, vibration, corrosive environment, pressure
  • H02S 40/36 - Electrical components characterised by special electrical interconnection means between two or more PV modules, e.g. electrical module-to-module connection

68.

CONNECTOR, CONNECTOR ASSEMBLY, CAMERA MODULE, AND ASSEMBLY METHOD

      
Application Number JP2021019063
Publication Number 2022/244165
Status In Force
Filing Date 2021-05-19
Publication Date 2022-11-24
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor
  • Murayama, Yuta
  • Takahira, Hiroshi
  • Oya, Masaaki

Abstract

Provided are: a connector that can be mounted on the surface of a substrate by reflow soldering while ensuring waterproofness with a seal member; a connector assembly; a camera module; and an assembly method. This invention includes: a cylindrical external terminal (110) extending in the axial direction; an outer bush (120) provided in close contact with the outer peripheral surface of the external terminal (110); an inner bush (130) provided in close contact with the inner peripheral surface of the external terminal (110); and a contact pin (140) inserted into the inner bush (130) along the axial direction inside the external terminal (110). The outer bush (120) and the inner bush (130) have heat resistance capable of withstanding the temperature of reflow soldering at the time of mounting on a substrate.

IPC Classes  ?

  • H01R 12/71 - Coupling devices for rigid printing circuits or like structures
  • H01R 13/52 - Dustproof, splashproof, drip-proof, waterproof, or flameproof cases

69.

CABLE CONNECTOR AND CABLE CONNECTOR ASSEMBLY

      
Application Number 17765719
Status Pending
Filing Date 2019-10-03
First Publication Date 2022-11-17
Owner Yamaichi Electronics Co., Ltd. (Japan)
Inventor
  • Abe, Kiyoshi
  • Shimoyama, Takahiro

Abstract

Provided are a cable connector and a cable connector assembly that can reduce crosstalk that may occur between proximate differential pairs at an end of a cable on an electronic device side. The cable connector for electrically connecting a cable (31a) to an electronic device (for example, an optical transceiver or an integrated circuit) includes a metal shield member (20) configured to cover a circumference of a part near an end of a differential pair (30a) on the electronic device side, and the differential pair is formed of the cable (31a).

IPC Classes  ?

  • H01R 13/6591 - Specific features or arrangements of connection of shield to conductive members
  • H01R 13/42 - Securing in a demountable manner
  • H01R 13/6585 - Shielding material individually surrounding or interposed between mutually spaced contacts

70.

Mezzanine connector housing

      
Application Number 29817962
Grant Number D0969749
Status In Force
Filing Date 2021-12-06
First Publication Date 2022-11-15
Grant Date 2022-11-15
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor
  • Ito, Toshiyasu
  • Takai, Yosuke
  • Enjoji, Taichi

71.

Connector for optical module

      
Application Number 29729290
Grant Number D0968337
Status In Force
Filing Date 2020-03-25
First Publication Date 2022-11-01
Grant Date 2022-11-01
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor
  • Ito, Toshiyasu
  • Saito, Masaaki

72.

HIGH-FREQUENCY SIGNAL TRANSMISSION DEVICE AND HIGH-FREQUENCY SIGNAL TRANSMISSION CABLE

      
Application Number JP2021015932
Publication Number 2022/224323
Status In Force
Filing Date 2021-04-19
Publication Date 2022-10-27
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor
  • Takahira,hiroshi
  • Yonezawa,akira

Abstract

A high-frequency signal transmission cable (4) includes a dielectric layer (70) and first and second wiring layers (71, 72) provided so as to sandwich the dielectric layer (70). The first wiring layer (71) is provided with at least M differential transmission lines (M indicating a natural number equal to or greater than 2). The first wiring layer (71) is further provided with a first ground line group comprising at least 2×M first ground lines (81). The second wiring layer (72) is provided with a second ground line group comprising at least M second ground lines (82). At least two first ground lines (81) included in the first ground line group are allocated without overlapping to each differential transmission line of the M differential transmission lines. At least one second ground line (82) included in the second ground line group is allocated without overlapping to each differential transmission line of the M differential transmission lines. Each differential transmission line is sandwiched between at least two first ground lines (81) and provided opposing at least one second ground line (82).

IPC Classes  ?

  • H01B 7/08 - Flat or ribbon cables
  • H05K 1/02 - Printed circuits Details
  • H05K 1/11 - Printed elements for providing electric connections to or between printed circuits

73.

CONNECTOR AND HIGH-FREQUENCY SIGNAL TRANSMISSION DEVICE

      
Application Number JP2021015933
Publication Number 2022/224324
Status In Force
Filing Date 2021-04-19
Publication Date 2022-10-27
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor
  • Takahira,hiroshi
  • Yonezawa,akira

Abstract

A connector (1, 2) to which a high-frequency signal transmission cable (4) is electrically connected comprises an insulator (11) and a contact terminal group (12) in which at least M (M is a natural number of 2 or more) unit arrays (C1-C8), each comprising one or more signal contact terminals (12S) and one or more ground contact terminals (12G), are arranged along a width direction of the insulator (11). The insulator (11) includes an insulator body (21) and at least M attaching members (22) which are attached to the insulator body (21) and are arranged along the width direction of the insulator (11). The individual unit arrays included in the at least M unit arrays (C1-C8) are separately supported by the individual attaching members included in the at least M attaching members (22).

IPC Classes  ?

  • H01R 12/77 - Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
  • H01R 13/6471 - Means for preventing cross-talk by special arrangement of ground and signal conductors, e.g. GSGS [Ground-Signal-Ground-Signal]

74.

HEATSINK UNIT, IC SOCKET, SEMICONDUCTOR PACKAGE MAKING METHOD, AND SEMICONDUCTOR PACKAGE

      
Application Number JP2021045580
Publication Number 2022/158161
Status In Force
Filing Date 2021-12-10
Publication Date 2022-07-28
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor
  • Miwa Kouichi
  • Sagano Hideki
  • Sato Masaru

Abstract

Provided is a heatsink unit that is less likely to damage a package and has excellent usability. A heatsink unit 1 comprises a base 90, a cover 20, a first lever 80, third levers 50 and a heatsink 30. The first lever 80 is rotatably held by the base 90, bears the heatsink 30 and a heatsink pedestal 40, and comes to a hard stop, at an end of the first lever 80, on the base 90. The third levers 50 are rotatably held by the cover 20, are linked with the first lever 80 to open or close the same, and controls, at the tips of the third levers 50, the up-and-down movements of the heatsink pedestal 40. The third levers 50 are configured so that, after the first lever 80 comes to a hard stop on the base 90, the heatsink 30 presses an IC package 100 with a timing shifted due to a slot in the third levers 50.

IPC Classes  ?

  • H01L 23/40 - Mountings or securing means for detachable cooling or heating arrangements
  • H01L 23/32 - Holders for supporting the complete device in operation, i.e. detachable fixtures
  • H01L 23/36 - Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
  • H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

75.

Mezzanine connector housing

      
Application Number 29737484
Grant Number D0958758
Status In Force
Filing Date 2020-06-09
First Publication Date 2022-07-26
Grant Date 2022-07-26
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor Shimoyama, Takahiro

76.

High-speed transmission connector

      
Application Number 17570424
Grant Number 11967785
Status In Force
Filing Date 2022-01-07
First Publication Date 2022-07-14
Grant Date 2024-04-23
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor
  • Ishii, Yoshiharu
  • Ito, Toshiyasu

Abstract

A high-speed transmission connector is described that includes a housing, a row of front side contacts supported on the housing, a row of rear side contacts supported on the housing, and a metal member. The housing has a slot to be fitted with a header of an external communication partner, and an upper plate portion and a lower plate portion facing each other vertically across the slot. The front side contact portions are exposed on a front side in the slot and the rear side contact portions are exposed on a rear side in the slot. The metal member supports the upper plate portion and the lower plate portion and fastens the upper plate portion and the lower plate portion.

IPC Classes  ?

  • H01R 13/502 - BasesCases composed of different pieces
  • H01R 24/60 - Contacts spaced along planar side wall transverse to longitudinal axis of engagement
  • H01R 107/00 - Four or more poles

77.

Connector set and connector

      
Application Number 17559200
Grant Number 11984679
Status In Force
Filing Date 2021-12-22
First Publication Date 2022-06-30
Grant Date 2024-05-14
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor
  • Ito, Toshiyasu
  • Takai, Yosuke

Abstract

A connector set is disclosed that includes a plurality of connectors and a cap to be attached to the plurality of connectors when the plurality of connectors are reflow-mounted on an external substrate. Each one end portion of the connectors and the cap is provided with a fitted portion and a fitting portion to be fitted in the fitted portion. The fitted portion is provided with an opening portion for moving the fitting portion so as to absorb thermal expansion from one end portion side to the other end portion side due to temperature conversion of reflow.

IPC Classes  ?

  • H01R 12/71 - Coupling devices for rigid printing circuits or like structures
  • H01R 12/70 - Coupling devices
  • H01R 13/506 - BasesCases composed of different pieces assembled by snap action of the parts

78.

Connector and connector set

      
Application Number 17559270
Grant Number 11949179
Status In Force
Filing Date 2021-12-22
First Publication Date 2022-06-30
Grant Date 2024-04-02
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor
  • Ito, Toshiyasu
  • Takai, Yosuke

Abstract

A connector is provided that includes a plurality of socket type connectors to be mounted on a first substrate and a plurality of plug type connectors to be mounted on a second substrate, thereby electrically connecting the first substrate and the second substrate. The socket type connector includes a housing with a slot and a plurality of contacts arranged in the slot. The plug type connector includes a housing with a header to be fitted in the slot, and a plurality of contacts arranged in the header. The housing of the socket type connector and the housing of the plug type connector has a rotationally asymmetrical shape as viewed from a fitting direction.

IPC Classes  ?

  • H01R 12/71 - Coupling devices for rigid printing circuits or like structures
  • H01R 12/70 - Coupling devices

79.

Connector set and cap

      
Application Number 17559335
Grant Number 12027790
Status In Force
Filing Date 2021-12-22
First Publication Date 2022-06-30
Grant Date 2024-07-02
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor
  • Ito, Toshiyasu
  • Takai, Yosuke

Abstract

A connector set is provided that includes a first connector, a first cap to be attached to the first connector when the first connector is reflow-mounted on a first external substrate, a second connector, and a second cap to be attached to the second connector when the second connector is reflow-mounted on a second external substrate formed of a material with a smaller thermal expansion coefficient than that of the first external substrate. The second cap is formed of a material with a smaller thermal expansion coefficient than that of the first cap.

IPC Classes  ?

  • H01R 12/71 - Coupling devices for rigid printing circuits or like structures
  • H01R 12/70 - Coupling devices

80.

Socket for inspection

      
Application Number 17454640
Grant Number 11821915
Status In Force
Filing Date 2021-11-12
First Publication Date 2022-05-19
Grant Date 2023-11-21
Owner Yamaichi Electronics Co., Ltd. (Japan)
Inventor
  • Nakashima, Kouki
  • Suzuki, Katsumi

Abstract

Provided is a socket for inspection that can correct inclination of a terminal in contact with a device under inspection to stabilize the terminal-to-electrode contact. The socket includes: a contact terminal having a barrel with a flange, a device side terminal, a test board side terminal, and a spring; a housing having a stepped hole through which the contact terminal is inserted and in which a step that abuts against the flange is axially formed; and a movable pedestal provided so as to move closer to and away from the housing and having a receiving hole through which a distal end side of the device side terminal projecting from the barrel is inserted and which receives an electrode of the device. A guide part whose inner diameter is substantially the same as the outer diameter of a projecting portion of the device side terminal is formed in the receiving hole.

IPC Classes  ?

  • G01R 1/04 - HousingsSupporting membersArrangements of terminals
  • H01R 12/70 - Coupling devices
  • H01R 13/24 - Contacts for co-operating by abutting resilientContacts for co-operating by abutting resiliently mounted
  • H01R 12/71 - Coupling devices for rigid printing circuits or like structures

81.

HEATSINK UNIT, IC SOCKET, METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE

      
Application Number JP2021037115
Publication Number 2022/091735
Status In Force
Filing Date 2021-10-07
Publication Date 2022-05-05
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor
  • Miwa Kouichi
  • Sagano Hideki
  • Sato Masaru

Abstract

The present invention provides a heatsink unit that does not break or damage an IC package and has a small mounting area and high heat dissipating efficiency. The heatsink unit 1 is provided with a base portion 22, a heatsink 2, a unit base 4, a heatsink pedestal 5, a frame body 6, a first lever 8, and a second lever 7. As the frame body 6 reaches a confronting position, any further pivotal movement is regulated, the heatsink pedestal 5 supported on the frame body 6 moves down, and an end face of the heatsink 2 supported on the heatsink pedestal 5 contacts the IC package.

IPC Classes  ?

  • H01L 23/32 - Holders for supporting the complete device in operation, i.e. detachable fixtures
  • H01L 23/40 - Mountings or securing means for detachable cooling or heating arrangements
  • H01R 33/76 - Holders with sockets, clips or analogous contacts, adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
  • G01R 31/26 - Testing of individual semiconductor devices

82.

Mezzanine connector housing

      
Application Number 29737412
Grant Number D0949799
Status In Force
Filing Date 2020-06-09
First Publication Date 2022-04-26
Grant Date 2022-04-26
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor
  • Ito, Toshiyasu
  • Takai, Yosuke
  • Enjoji, Taichi

83.

LGA SOCKET

      
Application Number JP2021033532
Publication Number 2022/070860
Status In Force
Filing Date 2021-09-13
Publication Date 2022-04-07
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor
  • Kikuchi Koji
  • Hashimoto Kazuya
  • Yamada Yoshiya

Abstract

Provided is an LGA socket capable of preventing the occurrence of crosstalk during fast transmission and preventing damage to a contact due to warping of a semiconductor package. An LGA socket 100 is provided with: a first insulator 1; a second insulator 2; a center substrate 3 sandwiched from the top and bottom by the first insulator 1 and the second insulator 2, said center substrate 3 having a layered structure of a plurality of layers including a ground layer and having a plurality of through-holes 30-i-j formed so as to pass therethrough between a first opening 10 side and a second opening 20 side; a plurality of pairs of contacts 71-i-j and 72-i-j that are electrically connected to one another as a result of being inserted into the through-holes 30-i-j from the first opening 10 side and the second opening 20 side and soldered; and a first resin member 81-i disposed at the first opening 10 side in the center substrate 3. The first resin member 81-i has: a first basal section 810 for supporting the contacts 71-i-j; and a first stopper 811 that extends upward from the first basal section 810 and that abuts against a package 105 fitted to the first opening 10.

IPC Classes  ?

  • H01R 12/58 - Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
  • H01R 33/76 - Holders with sockets, clips or analogous contacts, adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
  • H01R 13/24 - Contacts for co-operating by abutting resilientContacts for co-operating by abutting resiliently mounted

84.

Kelvin contact for inspection, kelvin socket for inspection, and method of manufacturing kelvin contact for inspection

      
Application Number 17467134
Grant Number 11536743
Status In Force
Filing Date 2021-09-03
First Publication Date 2022-03-10
Grant Date 2022-12-27
Owner Yamaichi Electronics Co., Ltd. (Japan)
Inventor
  • Suzuki, Katsumi
  • Genma, Akira
  • Matsumoto, Tsuyoshi
  • Kubota, Tetsuya

Abstract

Provided is a Kelvin contact for inspection in which contacts and an insulating layer are less likely to be shifted relative to each other even after repeatedly performed Kelvin inspection. The Kelvin contact for inspection includes: a first contact having an upper contact point that comes into contact with one electrode terminal of an IC device and a lower contact point that comes into contact with an electrode pad of a substrate for inspection; and a second contact having an upper contact point that comes into contact with the one electrode terminal and the lower contact point that comes into contact with an electrode pad of the substrate for inspection. The first and second contacts are adjacently arranged to contact with the same one electrode terminal and provided with an insulating layer surrounding the entire main body area except upper and lower contact point areas including the upper and lower contact points, respectively.

IPC Classes  ?

  • G01R 1/04 - HousingsSupporting membersArrangements of terminals
  • G01R 1/067 - Measuring probes
  • G01R 1/073 - Multiple probes
  • G01R 31/20 - Preparation of articles or specimens to facilitate testing
  • G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer

85.

CONNECTOR

      
Application Number JP2020032908
Publication Number 2022/044332
Status In Force
Filing Date 2020-08-31
Publication Date 2022-03-03
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor Takahira Hiroshi

Abstract

Provided is a connector which can smoothly perform floating while suppressing impedance mismatch. A receptacle unit 93 of this connector 100 includes a plurality of contacts 3-j (j = 1 to K) installed between a stationary housing 1 and a floating housing 2, the plurality of contacts 3-j (j = 1 to K) having a support piece part 36 supported on the stationary housing 1, a support piece part 37 supported on the floating housing 2, and an elastic deformation part 38 which is interposed between the two support piece parts 36 and 37 and is elastically deformable. The elastic deformation part 38 has two linear parts 381 and 382 which extend along a wall part 12 and a wall part 22 facing a movable space 102 in the stationary housing 1 and the floating housing 2, and a flexible part 380 between the upper ends of the two linear parts 381 and 382, and portions of the wall part 12 and the wall part 22 facing the flexible part 380 are curved along the shape of the flexible part 380.

IPC Classes  ?

  • H01R 12/91 - Coupling devices allowing relative movement between coupling parts e.g. floating or self aligning
  • H01R 13/6473 - Impedance matching

86.

CONNECTOR

      
Application Number JP2020032910
Publication Number 2022/044333
Status In Force
Filing Date 2020-08-31
Publication Date 2022-03-03
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor Takahira Hiroshi

Abstract

Provided is a technical means making it possible to suppress impedance mismatching of a plug unit of a connector. A plug unit (97) of a connector (100) is equipped with a plurality of contacts (7), and a housing (6) that comprises: a base section (63) in which provided are: a plurality of through holes (67) into which the plurality of contacts (7) are inserted; and a header (62) which protrudes out from the base section (63) and which is provided with a plurality of slits (66) for holding sections, of the plurality of contacts (7), that are exposed to the side of the header (62) from the through holes (67). Of each contact (7), a section inserted into the through hole (67) and a section held in the slit (66) form a single straight line shape.

IPC Classes  ?

  • H01R 12/71 - Coupling devices for rigid printing circuits or like structures
  • H01R 13/6473 - Impedance matching

87.

CABLE CONNECTOR, AND MODULE UNIT

      
Application Number JP2021016144
Publication Number 2022/004101
Status In Force
Filing Date 2021-04-21
Publication Date 2022-01-06
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor Sasaki, Takamitsu

Abstract

Provided are a cable connector and a module unit with which there are no differences between individual units, and stable waterproofing is possible, with which it is possible to reduce the number of components and the assembly time, and with which it is not necessary for an outer conductor to be divided. A cable connector (110) is provided with: a contact pin (120) comprising a solid elongate member extending in an axial (X1) direction; a rubber bush (130) through which the contact pin (120) is inserted in the axial (X1) direction; a tubular outer conductor (160) which internally holds the rubber bush (130) by being brought into close contact therewith; a casing (170) which internally holds the outer conductor (160); and an O-ring (140) interposed between the outer conductor (160) and the casing (170).

IPC Classes  ?

  • H01R 12/71 - Coupling devices for rigid printing circuits or like structures
  • H01R 13/52 - Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
  • H01R 24/38 - Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts

88.

Socket for high-speed transmission

      
Application Number 17333665
Grant Number 11569618
Status In Force
Filing Date 2021-05-28
First Publication Date 2021-12-02
Grant Date 2023-01-31
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor Ito, Toshiyasu

Abstract

A socket having a housing, a plurality of contacts, a plurality of insulating members and a plurality of conductive resin members is described. The housing is in a box shape with an opening and is provided with a matrix of penetration holes at a bottom portion. The plurality of contacts include contacts for ground and respective pairs of contacts for high-speed differential transmission. The plurality of insulating members support the plurality of contacts and are pressed into the housing so that the contacts are exposed on an opposite side of the opening from the penetration holes of the housing. The plurality of conductive resin members are fitted at positions of the plurality of insulating members in contact with the contacts for ground.

IPC Classes  ?

  • H01R 13/6471 - Means for preventing cross-talk by special arrangement of ground and signal conductors, e.g. GSGS [Ground-Signal-Ground-Signal]
  • H01R 12/70 - Coupling devices

89.

IC socket for semiconductor

      
Application Number 17259773
Grant Number 11624774
Status In Force
Filing Date 2019-07-09
First Publication Date 2021-11-04
Grant Date 2023-04-11
Owner Yamaichi Electronics Co., Ltd. (Japan)
Inventor Kobayashi, Hiroki

Abstract

b) and secured to an inspection substrate; and a lid member (18) that does not come into contact with the image sensor (60) and that covers a back surface region (80) on a side of a back surface (64) of the image sensor (60) when the image sensor (60) is attached to the seat (12).

IPC Classes  ?

  • G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
  • G01R 1/04 - HousingsSupporting membersArrangements of terminals
  • H01L 23/32 - Holders for supporting the complete device in operation, i.e. detachable fixtures
  • H01L 27/146 - Imager structures
  • H01R 33/76 - Holders with sockets, clips or analogous contacts, adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket

90.

FLOATING CONNECTOR AND METHOD FOR MANUFACTURING SAME

      
Application Number JP2021013722
Publication Number 2021/201053
Status In Force
Filing Date 2021-03-30
Publication Date 2021-10-07
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor
  • Taguchi,kazutaka
  • Ooya,masaaki

Abstract

A floating connector (2) includes: a first insulator (40); a second insulator (50); and a contact group (21J) in which contacts that have spring properties and that connect the first insulator (40) and the second insulator (50) are arranged. The contact group (21J) includes a plurality of signal contacts (S) and a plurality of ground contacts (G). An electroconductive member (7) is attached to the second insulator (50), and two or more ground contacts (G) included in the contact group (21J) are electrically connected via the electroconductive member (7).

IPC Classes  ?

  • H01R 12/91 - Coupling devices allowing relative movement between coupling parts e.g. floating or self aligning
  • H01R 13/6473 - Impedance matching

91.

Test socket

      
Application Number 16832896
Grant Number 11353497
Status In Force
Filing Date 2020-03-27
First Publication Date 2021-09-30
Grant Date 2022-06-07
Owner Yamaichi Electronics Co., Ltd. (Japan)
Inventor Nose, Takanori

Abstract

A test socket includes a pedestal. The pedestal includes a central pedestal including a central contact portion coming in contact with a central region of a bottom surface of a semiconductor package and a plurality of insertion holes formed to correspond to a plurality of solder balls projecting from the bottom surface of the semiconductor package, so as to allow the solder balls to be inserted into respective insertion holes. The pedestal further includes a circumferential pedestal separated from the central pedestal by a space having an opening width larger than a diameter of the insertion hole and including a circumferential contact portion coming in contact with a circumference of the bottom surface of the semiconductor package.

IPC Classes  ?

  • G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
  • G01R 1/04 - HousingsSupporting membersArrangements of terminals

92.

High-speed transmission connector

      
Application Number 17172844
Grant Number 11545779
Status In Force
Filing Date 2021-02-10
First Publication Date 2021-08-19
Grant Date 2023-01-03
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor Ishii, Yoshiharu

Abstract

According to an embodiment, a high-speed transmission connector includes: a row of first contacts, a row of second contacts, a row of third contacts, a row of fourth contacts, an upper housing that supports the row of first contacts, a lower housing that supports the row of second contacts, and an inner housing that supports the row of third contacts and the row of fourth contacts. The upper housing, the lower housing, and the inner housing are assembled in such a manner that the upper housing and the lower housing face each other in a vertical direction with a gap therebetween, and the inner housing is accommodated in the upper housing and the lower housing. The gap forms a slot into which a header of a device as a communicating counterpart is to be fitted.

IPC Classes  ?

  • H01R 13/50 - BasesCases formed as an integral body
  • H01R 13/502 - BasesCases composed of different pieces
  • H01R 13/41 - Securing in non-demountable manner, e.g. moulding, riveting by frictional grip in grommet, panel or base
  • H01R 13/6585 - Shielding material individually surrounding or interposed between mutually spaced contacts
  • H01R 13/6597 - Specific features or arrangements of connection of shield to conductive members the conductive member being a contact of the connector

93.

LGA socket

      
Application Number 17177833
Grant Number 11336045
Status In Force
Filing Date 2021-02-17
First Publication Date 2021-08-19
Grant Date 2022-05-17
Owner Yamaichi Electronics Co., Ltd. (Japan)
Inventor
  • Yamada, Yoshiya
  • Kikuchi, Koji
  • Ito, Toshiyasu
  • Takai, Yosuke

Abstract

According to an embodiment, an LGA socket includes a center substrate, first and second insulator and a plurality of pairs of contacts. The center substrate is configured by a multi-layer structure including a ground layer and a plurality of through holes formed through the center substrate. The first insulator is arranged around the plurality of through holes on an upper surface of the center substrate. The second insulator is arranged around the plurality of through holes on a lower surface of the center substrate. The plurality of pairs of contacts are inserted into the through holes from an upper side and from a lower side of the through holes and are soldered via the through holes to be electrically connected to each other.

IPC Classes  ?

  • H01R 13/24 - Contacts for co-operating by abutting resilientContacts for co-operating by abutting resiliently mounted
  • H01R 12/58 - Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
  • H01R 13/504 - BasesCases composed of different pieces different pieces being moulded, cemented, welded, e.g. ultrasonic, or swaged together
  • H01R 33/74 - Devices having four or more poles
  • H01R 13/03 - Contact members characterised by the material, e.g. plating or coating materials
  • H01R 12/71 - Coupling devices for rigid printing circuits or like structures

94.

Housing of high-speed transmission connector and high-speed transmission connector

      
Application Number 17175165
Grant Number 11450983
Status In Force
Filing Date 2021-02-12
First Publication Date 2021-08-19
Grant Date 2022-09-20
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor Shimoyama, Takahiro

Abstract

According to an embodiment, a housing of a high-speed transmission connector fitted to a connector of a counterpart substrate via a frontage. The housing of the first aspect includes: a bottom plate forming a bottom of the frontage and being provided with at least one boss on a surface opposite to the frontage side; a pair of first side walls facing each other in a first direction with the frontage sandwiched therebetween; and a pair of second side walls facing each other in a second direction orthogonal to the first direction with the frontage sandwiched therebetween. The bottom plate is provided with first through holes for tolerance measurement having inner peripheral surfaces including side wall surfaces of the first side walls in the same planes and/or second through holes for tolerance measurement having inner peripheral surfaces including side wall surfaces of the second side walls in the same planes.

IPC Classes  ?

  • H01R 12/71 - Coupling devices for rigid printing circuits or like structures
  • H01R 13/50 - BasesCases formed as an integral body

95.

YAMAICHI

      
Application Number 212836700
Status Registered
Filing Date 2021-07-30
Registration Date 2023-07-12
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
NICE Classes  ? 09 - Scientific and electric apparatus and instruments

Goods & Services

(1) Integrated circuit sockets; electrical connectors; optical connectors; printed circuit boards.

96.

YAMAICHI ELECTRONICS

      
Application Number 212836100
Status Registered
Filing Date 2021-07-30
Registration Date 2023-07-12
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
NICE Classes  ? 09 - Scientific and electric apparatus and instruments

Goods & Services

(1) Electrical plugs and sockets; integrated circuit sockets; connectors for distributing or controlling electricity; connectors for electrical distribution or control; electrical connectors; electronic connectors; printed circuit boards; flexible circuit boards; connectors for electronic circuits; connectors for SIM cards; connectors for secure digital (SD) memory cards; electric wires and cables; wire connectors [electricity]; optical connectors; telecommunication machines and apparatus, namely, optical fiber telecommunications apparatus; connectors for telecommunication machines and apparatus, namely, optical fibre connectors; optical apparatus and instruments, namely, optical cables, optical fibers, optical filters, optical lenses, optical sensors, optical transceivers; optical filters; filters for optical devices; camera filters

97.

Connector for high-speed transmission and method for fixing solder to fork portion of connector for high-speed transmission

      
Application Number 17116245
Grant Number 11626678
Status In Force
Filing Date 2020-12-09
First Publication Date 2021-06-17
Grant Date 2023-04-11
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor
  • Ito, Toshiyasu
  • Takai, Yosuke
  • Enjoji, Taichi

Abstract

According to an embodiment of the present disclosure, a connector for high-speed transmission to be fitted with an external counterpart connector includes a housing and a plurality of terminals. The housing has at least one or more slots. The plurality of terminals includes ground terminals and signal terminals are arranged in the slot along a first direction orthogonal to a fitting direction of the connector. Partition walls are provided between adjacent terminals in the slot, and a height of the partition walls between the ground terminals and the signal terminals in the fitting direction is lower than a height of other partition walls in the fitting direction.

IPC Classes  ?

  • H01R 13/187 - Pins, blades or sockets having separate spring member for producing or increasing contact pressure the spring member being in the socket
  • H01R 13/24 - Contacts for co-operating by abutting resilientContacts for co-operating by abutting resiliently mounted
  • H01R 12/71 - Coupling devices for rigid printing circuits or like structures
  • H01R 13/514 - BasesCases formed as a modular block or assembly, i.e. composed of co-operating parts provided with contact members or holding contact members between them
  • H01R 13/6461 - Means for preventing cross-talk

98.

Inspection socket

      
Application Number 17110623
Grant Number 11329419
Status In Force
Filing Date 2020-12-03
First Publication Date 2021-06-10
Grant Date 2022-05-10
Owner Yamaichi Electronics Co., Ltd. (Japan)
Inventor Nakamura, Yuji

Abstract

c are designed to have, for impedance matching, a gap from the outer periphery of the contact terminal 80.

IPC Classes  ?

  • H01R 13/512 - BasesCases composed of different pieces assembled by screw or screws
  • G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
  • H01R 13/6461 - Means for preventing cross-talk
  • H01R 33/76 - Holders with sockets, clips or analogous contacts, adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
  • H01R 13/436 - Securing a plurality of contact members by one locking piece
  • H01R 13/6473 - Impedance matching

99.

Socket for inspection

      
Application Number 17047625
Grant Number 11415624
Status In Force
Filing Date 2019-01-31
First Publication Date 2021-05-20
Grant Date 2022-08-16
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor Miyaaki, Junichi

Abstract

c5) is performed after a contact operation by the latch (6) is performed.

IPC Classes  ?

  • H01R 13/625 - Casing or ring with bayonet engagement
  • G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
  • H01L 23/32 - Holders for supporting the complete device in operation, i.e. detachable fixtures
  • H01R 12/88 - Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures acting manually by rotating or pivoting connector housing parts

100.

CONNECTOR FOR PHOTOELECTRIC CONVERSION MODULE AND CONNECTOR ASSEMBLY FOR PHOTOELECTRIC CONVERSION MODULE

      
Application Number JP2019039746
Publication Number 2021/070273
Status In Force
Filing Date 2019-10-09
Publication Date 2021-04-15
Owner YAMAICHI ELECTRONICS CO., LTD. (Japan)
Inventor
  • Ito, Toshiyasu
  • Saito, Masaaki

Abstract

The present invention comprises: a first connector part (10) having, on the front (F), a first module-side connection part connected to one end of an OSFP module, and also having a first substrate-side connection part connected to a substrate, the first connector part (10) being positioned on the substrate; a second connector part (20) provided at a position in which the first module-side connection part is interposed between the second connector part (20) and the substrate, the second connector part (20) having, on the front (F), a second module-side connection part connected to one end of the OSFP module, and also having a second substrate-side connection part connected to the substrate, the second connector part (20) being layered on the first connector part (10); and an intermediate part (30) provided between the first connector part (10) and the second connector part (20). A cooling flow path is formed in the intermediate part (30), air flowing in the cooling path from the front (F) side of a connector (7) toward the rear (R) side.

IPC Classes  ?

  • H01R 13/533 - Bases or cases made for use in extreme conditions, e.g. high temperature, radiation, vibration, corrosive environment, pressure
  • H01R 12/71 - Coupling devices for rigid printing circuits or like structures
  1     2     3        Next Page