The present invention prevents silicone rubber from decomposing into combustible low-molecular siloxane at high temperatures, and inhibits weight loss. This silicone rubber composition comprises: polyorganosiloxane represented by formula (A1) (component a); a weight loss inhibitor (component b); and an organic peroxide crosslinking agent (component c), wherein weight loss when silicone rubber obtained by crosslinking the silicone rubber composition is heated from 30°C to 900°C at a temperature increase rate of 150°C/minute in nitrogen atmosphere is less than 0.4 g/cm3.
C08L 83/07 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
C08J 9/06 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent
C08K 3/11 - Compounds containing metals of Groups 4 to 10 or of Groups 14 to 16 of the Periodic Table
A thermally conductive silicone composition includes a thermally conductive filler that includes: a silicon carbide having a peak of the particle size distribution in the range of from 10 to 40 μm; a first thermally conductive filler having a thermal conductivity of 10 to 300 W/mK and having a peak of the particle size distribution in the range of from 0.1 to 1.0 μm; a second thermally conductive filler having a thermal conductivity of 10 to 300 W/mK and having a peak of the particle size distribution in the range of from more than 1.0 to less than 10 μm; and a third thermally conductive filler (exclusive of silicon carbide) having a thermal conductivity of 60 to 300 W/mK and having a peak of the particle size distribution in the range of from 10 to 40 μm.
A UV-curable silicone composition includes a polyorganosiloxane (A) containing at least one alkenyl group in the molecule and having an alkenyl group content of 0.3 mmol/g or less on average; a polyorganohydrogensiloxane (B) having at least three silicon-bonded hydrogen atoms in the molecule; and a UV-active platinum catalyst (C).
C08G 77/00 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon
C08G 77/08 - Preparatory processes characterised by the catalysts used
C08G 77/20 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
4.
OIL-BASED COMPOSITION AND HAIR CONDITIONING FORMULATION CONTAINING THE SAME
Provided herein is an oil-based composition containing an oil-based solvent selected from a hydrocarbon oil and an alkyl-terminated amino-functionalized silicone which is dissolved or dispersed in the oil-based solvent, and a method for preparing the same. Also provide a hair conditioning formulation containing the oil-based composition, and a method for conditioning hair using the formulation.
A61K 8/898 - Polysiloxanes containing atoms other than silicon, carbon, oxygen and hydrogen, e.g. dimethicone copolyol phosphate containing nitrogen, e.g. amodimethicone, trimethyl silyl amodimethicone or dimethicone propyl PG-betaine
A61K 8/92 - Oils, fats or waxesDerivatives thereof, e.g. hydrogenation products
C08L 83/08 - Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
C08G 77/26 - Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen nitrogen-containing groups
A thermally-conductive polysiloxane composition contains (A) a silver powder, (B) a polyorganosiloxane containing one or more aliphatic unsaturated groups in a molecule, (C) a polyorganohydrogensiloxane having two or more hydrogen atoms bonded to a silicon atom in a molecule, and (D) a platinum-based catalyst, wherein the component (A) includes (A-1) a flaky silver powder having a tapped density of 3.0 to 10.0 g/cm3 and an average particle size of 1 to 20 μm, and (A-2) an agglomerated silver powder having a tapped density of 1.0 to 5.0 g/cm3 and an average particle size of 1 to 10 μm, and the content ratio of component (A-1) and component (A-2) in 100 mass % of the thermally-conductive polysiloxane composition is 70 to 98 mass %. A heat-dissipating material uses the thermally-conductive polysiloxane composition.
Provided is a moisture-curable silicone composition comprising (A) a polyorganosiloxane having two or more hydroxyl groups or hydrolyzable groups in each molecule, (B) a siloxane having two or more silicon-atom-bonded -OR2 groups, (C) a condensation catalyst, (D) a silicon-based adhesion promoter which is a compound that has, in each molecule, one or more groups selected from the group consisting of aromatic-hydrocarbon-containing groups, epoxy-group-containing groups, and linear, branched, or cyclic aliphatic unsaturated hydrocarbon groups and that has at least one heteroatom in each molecule besides the adhesion-promoting functional groups, and (E) an inorganic filler. When used as various sealing materials and potting materials for, for example, automotive industrial articles required to have high reliability, this moisture-curable silicone composition can come to attain both sufficient adhesiveness and compression set at low temperatures in a short time.
One embodiment of the present invention provides an antifouling member, one surface of which is provided with a relief structure on the order of nanometers, and which comprises antifouling layers that are provided on the recessed parts of the relief structure. The present invention also provides: a display in which at least a part of a display portion is covered with the antifouling member; a touch panel in which at least a part of a touch unit is covered with the antifouling member; and a sensor, the surface of which is at least partially covered with the antifouling member.
B32B 3/30 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layerLayered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a layer with cavities or internal voids characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
In the first aspect of the present invention, a method for manufacturing an antifouling member is provided, comprising: a step of providing nano-order irregularities on one surface of a base material; and a step for forming an antifouling layer containing a perfluoropolyether-containing silane compound in at least a recessed portion of the irregularities.
G02B 1/18 - Coatings for keeping optical surfaces clean, e.g. hydrophobic or photo-catalytic films
B05D 3/06 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
B05D 5/00 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
B05D 5/02 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a matt or rough surface
B05D 7/24 - Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
B32B 3/30 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layerLayered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a layer with cavities or internal voids characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
C09K 3/18 - Materials not provided for elsewhere for application to surface to minimize adherence of ice, mist or water theretoThawing or antifreeze materials for application to surfaces
The present invention provides an ultraviolet-curable silicone composition which has excellent curing properties in the thickness direction and at parts that are not irradiated with light. Provided is an ultraviolet-curable silicone composition comprising (A) a polyorganosiloxane that has at least two alkenyl groups per molecule, (B) a polyorganosiloxane that has at least two mercaptoalkyl groups or hydrogen atoms bonded to a silicon atom per molecule, (C) an ultraviolet diffuser, and (D) a photoreaction initiator or platinum-based catalyst that is activated by ultraviolet rays. The amount of component (C) relative to 100 parts by mass of component (A) is 0.05-15.0 parts by mass. The transmission percentage of the composition prior to curing as measured with a wavelength of 365 nm and in accordance with JIS K 0115 is 33-95%.
[Problem] To provide a cosmetic in which the dispersibility of metal oxide fine particles is excellent. [Solution] This cosmetic contains component (A), component (B), and component (C). (A) One or more selected from 1,1,1,3,5,5,5-heptamethyl-3-alkyl (C10-14) trisiloxanes. (B) Metal oxide fine particles. (C) A silicone oil having a number average molecular weight not less than 400 but less than 30,000 (excluding component (A)).
A61K 8/894 - Polysiloxanes saturated, e.g. dimethicone, phenyl trimethicone, C24-C28 methicone or stearyl dimethicone modified by a polyoxyalkylene group, e.g. cetyl dimethicone copolyol
A61Q 1/02 - Preparations containing skin colorants, e.g. pigments
A61Q 1/04 - Preparations containing skin colorants, e.g. pigments for lips
A61Q 1/10 - Preparations containing skin colorants, e.g. pigments for eyes, e.g. eyeliner, mascara
A curable polyorganosiloxane composition includes (a) a polyorganosiloxane having two or more curable functional group capable of causing addition reaction in one molecule; (b) a crosslinking agent having three or more crosslinking groups which have reactivity with the curable functional group of the (a) in one molecule; (c) a curing catalyst capable of catalyzing a crosslinking reaction of the (a) and (b); and (d) a silicon compound having a monovalent alkyl group of 8 to 30 carbon atoms and a hydrolyzable group which are directly bonded to a silicon atom; and in some cases, (e) scaly inorganic fine particles. An adhesive may use the curable polyorganosiloxane composition.
The present invention provides an ultraviolet curable silicone composition which has excellent curability in a portion that is not irradiated with light and in the thickness direction. The present invention provides an ultraviolet curable silicone composition which contains: (A) a polyorganosiloxane that has at least two alkenyl groups in each molecule and an average alkenyl group content of 0.08 mmol/g or more; (B) a polyorganohydrogen siloxane that has at least three hydrogen atoms, which are bonded to silicon atoms, in each molecule; and (C) a platinum catalyst that is activated by ultraviolet light. With respect to a cured product that is obtained by irradiating the composition with ultraviolet light having a wavelength of 365 nm for 45 seconds at an illuminance of 100 mW/cm2 with a diameter of 7.0 mm in a yellow room and subsequently storing the resulting composition at 23°C for 16 hours, the curing diameter at a depth of 1.8 mm is 10.8 mm or more.
A curable polyorganosiloxane composition includes (a) a polyorganosiloxane having two or more curable functional groups per molecule; (b) a crosslinking agent having per molecule two or more crosslinkable groups having reactivity with the curable functional groups of the component (a); (c) a curing catalyst capable of catalyzing a crosslinking reaction of the component (a) and the component (b); (d) a pigment which itself does not emit a fluorescent light; and (e) a UV tracer. The composition can be used as an adhesive.
C08K 5/45 - Heterocyclic compounds having sulfur in the ring
C08J 3/28 - Treatment by wave energy or particle radiation
C08F 4/26 - Metallic compounds other than hydrides and other than metallo-organic compoundsBoron halide or aluminium halide complexes with organic compounds containing oxygen of manganese, iron group metals, or platinum group metals
Provided is a UV-curable silicone composition having excellent curability and shelf life. This UV-curable silicone composition contains: (A) a polyorganosiloxane having at least one alkenyl group per one molecule and an average alkenyl group content of 0.3 mmol/g or less; (B) a polyorganohydrodiene siloxane having at least three hydrogen atoms, which are bonded to silicone atoms, per one molecule; and (C) a platinum catalyst that is activated by UV rays.
A curable composition includes a perfluoro(poly)ether group-containing silane compound represented by the general formula (I) (wherein, definitions of each group are as described in the specification); (b) an organic silicon compound having at least two OR2 groups bonded to Si atom (here, R2s are each independently a hydrogen atom or a monovalent organic group at each appearance) or a partially hydrolyzed condensate thereof; and (c) a condensation catalyst.
A curable composition contains (A) a perfluoro(poly)ether group-containing silane compound having two or more Si atoms bonded to at least one group selected from the group consisting of a hydroxyl group and a hydrolyzable group, (B) a compound (other than (A)) having at least two OR2 groups bonded to an Si atom (in the formula, R2 each independently are a hydrogen atom or a monovalent organic group at each occurrence) or a partial hydrolysis condensate thereof, (C) a condensation catalyst, and (D) surface-treated silica.
A curable composition includes: (A) a perfluoro(poly)ether group-containing silane compound having two or more Si atoms bonded to at least one group selected from the group consisting of a hydroxyl group and hydrolyzable groups; (B) a compound having at least two OR2 groups (in the formula, R2 is independently a hydrogen atom or a monovalent organic group at each occurrence) bonded to an Si atom (provided that (A) and (D) are excluded) or a partially hydrolyzed condensate thereof; (C) a condensation catalyst; and (D) a compound containing two or more alkoxysilyl groups in one molecule or a partially hydrolyzed condensate thereof (provided that (A) is excluded), with the linking group between the alkoxysilyl groups being a group other than that selected from the group consisting of an —O— group and a group having a siloxane bond.
A curable composition contains (A) a perfluoro(poly)ether group-containing silane compound having two or more Si atoms bonded to at least one group selected from the group consisting of a hydroxyl group and a hydrolyzable group, (B) a compound (other than (A)) having at least two OR2 groups bonded to an Si atom (in the formula, R2 each independently are a hydrogen atom or a monovalent organic group at each occurrence) or a partial hydrolysis condensate thereof, (C) a condensation catalyst, and (D) an inorganic filler with a primary particle size from 0.01 to 0.1 μm.
A moisture-curable curable composition includes a perfluoro(poly)ether group-containing silane compound (a1) represented by formula (I); a perfluoro(poly)ether group-containing silane compound (a2) represented by formula (II) (in each formula, the definition of each group is as defined in the specification); (b) an organic silicon compound having at least two OR2 groups (here, R2s are each independently a hydrogen atom or a monovalent organic group at each appearance) bonded to Si atom or a partially hydrolyzed condensate thereof; and (c) a condensation catalyst.
An addition reaction curing type polyorganosiloxane composition for bonding poly(phenylene sulfide) resins includes (A) a polyorganosiloxane containing two or more alkenyl groups in the molecule, (B) a polyorganohydrogensiloxane having, in the molecule, three or more silicon-atom-bonded hydrogen atoms, (C) a platinum-based catalyst, (D) an oxide or carbonate of a metal selected from among the metals in Groups 2 and 12 of the periodic table, and (E) an adhesion promoter, the content of the ingredient (D) being 0.1-20 wt % with respect to the whole composition.
C09J 7/25 - PlasticsMetallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
Provided are: a thermally-conductive polysiloxane composition having high thermal conductivity and exceptional workability due to low viscosity; and a heat-dissipating material that uses the thermally-conductive polysiloxane composition. The thermally-conductive polysiloxane composition contains (A) a silver powder, (B) a polyorganosiloxane containing one or more aliphatic unsaturated groups in a molecule, (C) a polyorganohydrogensiloxane having two or more hydrogen atoms bonded to a silicon atom in a molecule, and (D) a platinum-based catalyst, wherein the component (A) includes (A-1) a flaky silver powder having a tapped density of 3.0 to 10.0 g/cm 3and an average particle size of 1 to 20 μm, and (A-2) an agglomerated silver powder having a tapped density of 1.0 to 5.0 g/cm 3 and an average particle size of 1 to 10 μm, and the content ratio of component (A-1) and component (A-2) in 100 mass% of the thermally-conductive polysiloxane composition is 70 to 98 mass%.
A curable composition comprising: a perfluoro(poly)ether group–containing silane compound represented by general formula (I) (the radicals in the formula are defined in the description); (b) an organosilicon compound having at least two of an OR2group bonded to a Si atom (wherein each appearance of R2 independently represents a hydrogen atom or a monovalent organic group), or a partial hydrolysis-condensation product of said compound; and (c) a condensation catalyst.
C08G 65/336 - Polymers modified by chemical after-treatment with organic compounds containing silicon
C08G 77/26 - Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen nitrogen-containing groups
C08K 5/5415 - Silicon-containing compounds containing oxygen containing at least one Si—O bond
The present disclosure relates to silica particles comprising repeating units of (SiO4/2) that are spherical in shape, which has the benefit of compatibility with personal care components and the resulting personal care applications. The present disclosure also relates to methods of preparing silica particles.
A61K 8/02 - Cosmetics or similar toiletry preparations characterised by special physical form
A61K 8/58 - Cosmetics or similar toiletry preparations characterised by the composition containing organic compounds containing atoms other than carbon, hydrogen, halogen, oxygen, nitrogen, sulfur or phosphorus
A thermally conductive polysiloxane composition includes (A) a thermally conductive filler and (B) one or more compounds selected from an alkoxysilyl group-containing compound and a dimethylpolysiloxane, wherein: component (A) includes (A-1) round, indefinite-shaped or polyhedral aluminum nitride particles having an average particle diameter of from 50 μm to 150 μm and (A-2) round, indefinite-shaped or polyhedral aluminum nitride particles having an average particle diameter of 10 μm or more but less than 50 μm in an amount of from 20% by mass to 100% by mass relative to the total amount of component (A); and the content ratio of component (A-1) to component (A-2) is from 50:50 to 95:5 on a mass basis.
Provided are: a curable polyorganosiloxane composition that contains (a) a polyorganosiloxane having, per molecule, 2 or more curable functional groups able to bring about an addition reaction, (b) a crosslinking agent having, per molecule, 3 or more crosslinking groups able to react with a curable functional group in the component (a), (c) a curing catalyst able to catalyze a crosslinking reaction between the components (a) and (b), (d) a silicon compound in which a monovalent alkyl group having 8-30 carbon atoms and a hydrolyzable group are directly bonded to a silicon atom; and, optionally, (e) flaky inorganic fine particles; and an adhesive which is obtained using the curable polyorganosiloxane composition and which exhibits improved adhesive durability to a variety of substrates at sites in contact with aqueous solutions (water, LLC, salt water, and the like).
There is provided an aqueous coating agent composition that does not contain an organotin compound and forms a coating film having good slipperiness and having excellent adhesiveness (adhesion) and abrasion resistance. The aqueous coating agent composition contains: (A) polydiorganosiloxane having both terminals blocked with hydroxyl groups, the polydiorganosiloxane having a viscosity of 50 to 100,000,000 mPa·s (at 25° C.); (B) polyorganohydrogensiloxane having at least three hydrogen atoms in one molecule; (C) a zinc compound as a curing catalyst; (D) an organic compound and/or polyorganosiloxane having at least one of a primary amino group and a secondary amino group; (E) an adhesion improving component; and (F) spherical particles.
B05D 7/02 - Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber
C08G 77/08 - Preparatory processes characterised by the catalysts used
C08G 77/12 - Polysiloxanes containing silicon bound to hydrogen
C08G 77/26 - Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen nitrogen-containing groups
C08K 5/5415 - Silicon-containing compounds containing oxygen containing at least one Si—O bond
An adhesive polyorganosiloxane composition includes, at a specific composition ratio: (A) a linear polyorganosiloxane containing an alkenyl group including a low-viscosity linear polyorganosiloxane containing an alkenyl group; (B) a polyorganosiloxane containing at least three alkenyl groups in the molecule; (C1) a polyorganohydrogensiloxane having 3 or more hydrogen atoms bonded to a silicon atom in the molecule; (C2) a linear polyorganohydrogensiloxane having one hydrogen atom bonded to a silicon atom only at both terminals of the molecular chain, and having no aliphatic unsaturated bonds in the molecule; (D) a filler; (E) a platinum group metal compound; and (F) two or more kinds of specific adhesion imparting agent.
C09J 183/06 - Polysiloxanes containing silicon bound to oxygen-containing groups
C08G 77/00 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon
An adhesive polyorganosiloxane composition includes: (A) a polyorganosiloxane having 2 or more alkenyl groups in each molecule thereof; (B) a polyorganohydrodienesiloxane having 3 or more hydrogen atoms bonded to a silicon atom in each molecule thereof; (C) a platinum-based catalyst; (D) at least two kinds of adhesion-imparting agents selected from the group consisting of specific organic silicon compounds, silane compounds, tetraalkoxysilane compounds, and/or partial hydrolysis condensates thereof; (E) hexamethyldisilazane; (F) water; and (G) at least one of (G1) and (G2), where (G1) is a non-surface-treated inorganic filler having a BET specific surface area of 50 to 500 m2/g, and (G2) is an inorganic filler obtained by surface-treating said (G1) with hexamethyldisilazane.
This curable polyorganosiloxane composition comprises: (a) a polyorganosiloxane having at least two curable functional groups in one molecule; (b) a cross-linking agent having, in one molecule, at least two crosslinkable group having reactivity with the curable functional group in (a); (c) a curing catalyst which can catalyse the crosslinking reaction of (a) and (b); (d) a pigment that does not emit fluorescence; and (e) a UV tracer. This composition becomes an adhesive that makes it easy to confirm whether the composition has been uniformly applied to a substrate having a similar color.
A thermally conductive polysiloxane composition comprising: (A) a thermally conductive filler; (B) a polyorganosiloxane resin having a curable functional group in the polysiloxane molecule, the polyorganosiloxane resin comprising at least one polysiloxane (b1) having one curable functional group in the molecule thereof; (C) a siloxane compound having an alkoxysilyl group and a linear siloxane structure; (D) a hydrogenpolyorganosiloxane; and (E) a platinum catalyst, wherein the content of the polysiloxane (b1) having one curable functional group in the molecule thereof in the polyorganosiloxane resin (B) is more than 80% by mass.
There is provided a polyorganosiloxane composition capable of providing a cured product which has low hardness, high transparency, high tensile strength, and low surface tackiness. A curable polyorganosiloxane composition includes: (A) alkenyl group-containing polyorganosiloxane containing straight-chained polyorganosiloxane composed of (A1) both ends alkenyl group polyorganosiloxane having a predetermined viscosity and (A2) polyorganosiloxane having a predetermined viscosity and having 0.6 or more and less than 2 alkenyl groups on average, and (A3) resinous polyorganosiloxane; (B) polyorganohydrogensiloxane composed of (B1) both ends Si—H-containing straight-chained polyorganosiloxane, and (B2) polyorganosiloxane having 3 or more Si—H; and (C) a hydrosilylation reaction catalyst, in mounts that satisfy predetermined relationships.
There is provided an adhesive application apparatus capable of efficiently applying an adhesive without inhibiting curing of the adhesive. An adhesive application apparatus of the present invention includes a mounting table 10, an adhesive dosing unit 20, and an ultraviolet irradiation unit 30, and it applies a delayed-ultraviolet-curable adhesive 200 to a surface of a panel 100. The panel 100 is mounted on a mounting surface S10 of the mounting table 10. The adhesive dosing unit 20 applies the adhesive 200 to the surface of the panel 100 mounted on the mounting table 10 by discharging the adhesive 200 from an adhesive dosing port H20. The ultraviolet irradiation unit 30 irradiates the adhesive 200 dosed from the adhesive dosing port H20 with ultraviolet light L. Here, the ultraviolet irradiation unit 30 irradiates the adhesive 200 with the ultraviolet light L along the mounting surface S10 before the adhesive 200 dosed from the adhesive dosing port H20 is applied to the surface of the panel 100.
Provided is a curable composition containing: (a) a perfluoro(poly)ether group-containing silane compound represented by general formula (1) ( in the formula, the definition of each group is as in the description; (b) an organic silicon compound having at least two OR2groups bonded to a Si atom (wherein R2 each independently are a hydrogen atom or a monovalent organic group) or a partial hydrolysis condensate thereof; and (c) a condensation catalyst. Said composition provides a curable composition cured with moisture at room temperature and having excellent curable properties in deep parts.
C08G 65/336 - Polymers modified by chemical after-treatment with organic compounds containing silicon
C08G 77/26 - Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen nitrogen-containing groups
C08K 5/5415 - Silicon-containing compounds containing oxygen containing at least one Si—O bond
Provided is a curable composition that can provide a cured product excellent in adhesiveness to various substrates. A curable composition comprising: (A) a perfluoro(poly)ether group-containing silane compound having two or more Si atoms bonded to at least one group selected from the group consisting of a hydroxy group and hydrolyzable groups; (B) a compound having at least two OR2groups (in the formula, R2 is independently a hydrogen atom or a monovalent organic group at each occurrence) bonded to an Si atom (provided that (A) and (D) are excluded) or a partially hydrolyzed condensate thereof; (C) a condensation catalyst; and (D) a compound containing two or more alkoxysilyl groups in one molecule or a partially hydrolyzed condensate thereof (provided that (A) is excluded), with the linking group between the alkoxysilyl groups being -O- group, and a group other than groups having siloxane bonds.
Provided is a curable composition having reduced flowability, wherein said composition does not spill after being applied. The curable composition contains (A) a perfluoro(poly)ether group-containing silane compound having two or more Si atoms bonded to at least one group selected from the group consisting of hydroxyl groups and hydrolyzable groups, (B) a compound (other than (A)) having at least two OR2groups bonded to a Si atom (in the formula, R2 each independently are a hydrogen atom or a monovalent organic group at each occurrence) or a partial hydrolysis condensate thereof, (C) a condensation catalyst, and (D) primary filler with a primary particle size from 0.01 to 0.1 μm.
Provided is a curable composition having reduced flowability, such that said composition does not spill after being applied. The curable composition contains (A) a perfluoro(poly)ether group-containing silane compound having two or more Si atoms bonded to at least one group selected from the group consisting of hydroxyl groups and hydrolyzable groups, (B) a compound (other than (A)) having at least two OR2groups bonded to a Si atom (in the formula, R2 each independently are a hydrogen atom or a monovalent organic group at each occurrence) or a partial hydrolysis condensate thereof, (C) a condensation catalyst, and (D) surface-treated silica.
Provided is a moisture curable composition containing: a perfluoro(poly)ether group-containing silane compound (a1) represented by formula (I); a perfluoro(poly)ether group-containing silane compound (a2) represented by formula (II) (b) an organic silicon compound having at least two OR2groups (wherein R2 each independently are a hydrogen atom or a monovalent organic group) bonded to a Si atom, or a partial hydrolysis condensate thereof; and (c) a condensation catalyst. The curable composition provides a cured article with excellent compatibility and crack resistance.
There is provided silicone rubber that achieves both a low modulus and high tear strength and a liquid silicone rubber composition that gives the silicone rubber. The liquid silicone rubber composition contains: (A) an alkenyl group-containing linear polyorganosiloxane; (B) a 0.1 to 39 parts by mass linear hydrogenorganopolysiloxane relative to 100 parts by mass of (A); (C) a polyorganosiloxane having alkenyl groups and Si—H whose total number in one molecule is three or more; (D) a hydrosilylation catalyst; and (E) a silica powder having a specific surface area of 100 to 420 m2/g, the content of the silica powder being 10 to 50 parts by mass relative to 100 parts by mass of (A). Relative to the total mass of (A), (B), and (C), the total molar amount of the alkenyl groups of (A) and Si—H of (B) is 0.03 to 0.19 mmol/g, and the total molar amount of the alkenyl groups and SiH of (C) is 0.01 to 0.05 mmol/g. An Si—H/alkenyl group ratio of the composition is 0.7 to 1.3.
A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, (B) a polyorganosiloxane resin including at least one polysiloxane having one curable functional group in the molecule thereof, and (C) a siloxane compound having an alkoxysilyl group and a linear siloxane structure.
A siloxane compound represented by the general formula (1):
2 is a linear organosiloxy group represented by the general formula (2):
3 is independently a monovalent hydrocarbon group having 1 to 6 carbon atoms.
C08G 77/18 - Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
C08G 77/50 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
C08K 3/013 - Fillers, pigments or reinforcing additives
C08K 9/06 - Ingredients treated with organic substances with silicon-containing compounds
A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, and (B) at least one member selected from the group consisting of an alkoxysilyl group-containing compound and a dimethylpolysiloxane. The component (A) includes at least two thermally conductive fillers having different average particle diameters, and (A-1) indefinite-shaped aluminum nitride particles having an average particle diameter of 30 μm to 150 μm in an amount of at least 20% by mass, based on the mass of a total of the component (A).
C08G 77/08 - Preparatory processes characterised by the catalysts used
C08G 77/12 - Polysiloxanes containing silicon bound to hydrogen
C08G 77/18 - Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
C08G 77/20 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
C08G 77/00 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon
The present invention relates to a thermally conductive polysiloxane composition that provides a cured product having excellent tackiness and flexibility in which the composition contains (A) a thermally conductive filler, (B) a siloxane compound having an alkoxysilyl group and a linear siloxane structure, (C) a polyorganosiloxane having at least two alkenyl groups bonded to silicon atoms per molecule, (D1) a linear polyorganohydrogensiloxane represented by the general formula (4), (D2) a polyorganohydrogensiloxane having per molecule at least three units represented by the general formula (5), and (E) a platinum catalyst.
C08G 77/08 - Preparatory processes characterised by the catalysts used
C08G 77/18 - Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
C08G 77/20 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
C08G 77/00 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon
Provided is an addition reaction curing type polyorganosiloxane composition which has excellent adhesiveness to poly(phenylene sulfide) resins and decreases little in adhesiveness in long-term use in high-temperature environments. The polyorganosiloxane composition for bonding poly(phenylene sulfide) resins comprises (A) a polyorganosiloxane containing two or more alkenyl groups in the molecule, (B) a polyorganohydrogensiloxane having, in the molecule, three or more silicon-atom-bonded hydrogen atoms, (C) a platinum-based catalyst, (D) an oxide or carbonate of a metal selected from among the metals in Groups 2 and 12 of the periodic table, and (E) an adhesion promoter, the content of the ingredient (D) being 0.1-20 wt% with respect to the whole composition.
To provide a polyorganosiloxane composition whose cured product has uniform good flame retardancy and good physical properties with less discoloring, for example, yellowing, and which has excellent temporal stability when stored. A flame-retardant polyorganosiloxane composition contains: (A) straight-chain polyalkylsiloxane having two or more alkenyl groups in one molecule and having a 10,000 to 1,000,000 mPa·s viscosity (25° C.); (B) resinoid polyorganosiloxane containing a Q unit and having 1.5 or more alkenyl groups on average, mass % of the component (B) being 30 to 80 mass % of the total of the components (A), (B); (C) polyorganohydrogensiloxane having three or more Si—H, an amount of the component (C) being such that Si—H/(total of the alkenyl groups in the components (A), (B)) becomes 1.0 to 3.0 moles; and (D) a catalytic amount of a hydrosilylation reaction catalyst, wherein the total content of phosphorus and an alkali metal is 20 mass ppm or less.
G02B 1/04 - Optical elements characterised by the material of which they are madeOptical coatings for optical elements made of organic materials, e.g. plastics
46.
POLYORGANOSILOXANE COMPOSITION FOR MOLDING, OPTICAL MEMBER, AND MOLDING METHOD
To provide a polyorganosiloxane composition with good moldability, and a cured product with good mold release property and excellent non-contamination property to the metal mold. A polyorganosiloxane composition for molding includes: (A) a straight-chain polyorganosiloxane having two or more alkenyl groups in one molecule, and having a viscosity (at 25° C.) of 10,000 to 1,000,000 mPa·s; (B) 30 to 80 mass % of a resinoid polyorganosiloxane containing Q units, and having 1.5 or more alkenyl groups on average in one molecule, to a total of the components (A) and (B); (C) a polyorganohydrogensiloxane containing M units and Q units, having a molar ratio of alkoxy groups and Si—H of less than 0.15, and having a mass decrease rate when heated at 150° C. for 30 minutes of 2.0% or less, wherein an amount of the (Si—H/alkenyl groups) is 1.0 to 3.0 mol; and (D) a catalytic amount of a hydrosilylation reaction catalyst.
G02B 1/04 - Optical elements characterised by the material of which they are madeOptical coatings for optical elements made of organic materials, e.g. plastics
F21V 3/06 - GlobesBowlsCover glasses characterised by materials, surface treatments or coatings characterised by the material
47.
Method of manufacturing silicone cured product, silicone cured product and optical member
To provide a method of manufacturing a silicone cured product and a silicone cured product which allow generation of a volatile component to be reduced significantly even being exposed to high temperatures of room temperature or more for a long time. A method of manufacturing a silicone cured product includes: curing an additional polyorganosiloxane composition by hydrosilylation reaction under closed atmosphere at a temperature of 40° C. or more and 200° C. or less to obtain a primary cured product; and heating the primary cured product under open atmosphere or reduced pressure at a temperature of 60° C. or more and 160° C. or less, and a silicone cured product in which when heated at 150° C. for 16 hours, a total generation amount of an alcohol having 1 to 3 carbon atoms and an oxide thereof, and an alkyl group-containing silane compound having 1 to 3 carbon atoms is 10 ppm or less.
The present invention provides a thermally conductive polysiloxane composition which has a high thermal conductivity, while having excellent work efficiency due to high ejection properties. A thermally conductive polysiloxane composition which contains (A) a thermally conductive filler and (B) one or more compounds selected from the group consisting of an alkoxysilyl group-containing compound and a dimethylpolysiloxane, wherein: component (A) comprises (A-1) round, amorphous or polyhedral aluminum nitride particles having an average particle diameter of from 50 μm to 150 μm and (A-2) round, amorphous or polyhedral aluminum nitride particles having an average particle diameter of 10 μm or more but less than 50 μm in an amount of from 20% by mass to 100% by mass relative to the total amount of component (A); and the content ratio of component (A-1) to component (A-2) is from 50:50 to 95:5 on a mass basis.
The present invention provides an aqueous coating agent composition which does not contain an organic tin compound and forms a coating film that has good lubricity, excellent bondability (adhesiveness) and excellent wear resistance. This aqueous coating agent composition contains (A) a polydiorganosiloxane which has a viscosity (at 25°C) of 50 to 100,000,000 mPa·s, while having both terminals blocked with hydroxyl groups, (B) a polyorganohydrogen siloxane which has at least three hydrogen atoms in each molecule, (C) a zinc compound which serves as a curing catalyst, (D) an organic compound having at least one of a primary amino group and a secondary amino group and/or a polyorganosiloxane, (E) an adhesion improving component and (F) spherical fine particles.
The present invention provides an aqueous coating agent composition which does not contain an organic tin compound and forms a coating film that has good lubricity, excellent bondability (adhesiveness) and excellent wear resistance. This aqueous coating agent composition contains (A) a polydiorganosiloxane which has a viscosity (at 25°C) of 50 to 100,000,000 mPa∙s, while having both terminals blocked with hydroxyl groups, (B) a polyorganohydrogen siloxane which has at least three hydrogen atoms in each molecule, (C) a zinc compound which serves as a curing catalyst, (D) an organic compound having at least one of a primary amino group and a secondary amino group and/or a polyorganosiloxane, (E) an adhesion improving component and (F) spherical fine particles.
The present invention pertains to an adhesive polyorganosiloxane composition that has a low modulus of elasticity, is capable of giving a break-proof cured product and has a high adhesiveness and low viscosity, said adhesive polyorganosiloxane composition comprising, at a specific composition ratio: (A) an alkenyl group-containing linear polyorganosiloxane including an alkenyl group-containing linear polyorganosiloxane having a low viscosity; (B) a polyorganosiloxane containing at least three alkenyl groups per molecule; (C1) a polyorganohydrogensiloxane having three or more hydrogen atoms bonded to a silicon atom in a molecule; (C2) a linear polyorganohydrogensiloxane having a hydrogen atom bonded to a silicon atom exclusively at each end of the molecular chain and containing no aliphatic unsaturated bond in the molecule; (D) a filler; (E) a platinum-group metal compound; and (F) two or more kinds of specific tackifiers.
Provided is a polyorganosiloxane composition that can be used to obtain a cured product which has low hardness, high transparency, great tensile strength, and low surface adhesiveness. This curable polyorganosiloxane composition contains (A) an alkenyl group-containing polyorganosiloxane having (A1) a polyorganosiloxane having an alkenyl group at both ends thereof and having a predetermined viscosity, (A2) a straight-chain polyorganosiloxane comprising a polyorganosiloxane having, on average, not less than 0.6 but less than 2 of alkenyl groups and having a predetermined viscosity, and (A3) a resin-like polyorganosiloxane, (B) a polyorganohydrogen siloxane comprising (B1) a straight-chain polyorganosiloxane containing Si-H at both ends thereof, and (B2) a polyorganosiloxane having three or more Si-H, and (C) a hydrosilylation reaction catalyst, in amounts that satisfy a predetermined relationship.
Provided is an adhesive application device that enables efficient application of an adhesive without inhibiting the curing of the adhesive. The adhesive application device according to the present invention comprises a placement stage 10, an adhesive feeding part 20, and a UV irradiation part 30, and applies a slow-UV-curable adhesive 200 to the surface of a panel 100. The panel 100 is placed on a placement surface S10 of the placement stage 10. The adhesive feeding unit 20 discharges the adhesive 200 from an adhesive feed opening H20, thereby applying the adhesive 200 to the surface of the panel 100 placed on the placement stage 10. The UV irradiation unit 30 irradiates the adhesive 200 discharged from the adhesive feed opening H20 with ultraviolet light L. The UV irradiation unit 30 irradiates the adhesive 200 with the ultraviolet light L along the placement surface S10 before the adhesive 200 discharged from the adhesive feed opening H20 is applied to the surface of the panel 100.
B05C 9/10 - Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by groups , or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed before the application
B05C 5/00 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
B05C 5/02 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work from an outlet device in contact, or almost in contact, with the work
The present invention relates to an adhesive polyorganosiloxane composition including: (A) a polyorganosiloxane having two or more alkenyl groups in each molecule thereof; (B) a polyorganohydrodienesiloxane having three or more hydrogen atoms bonded to a silicon atom in each molecule thereof; (C) a platinum-based catalyst; (D) at least two types of adhesion-imparting agents selected from the group consisting of specific organic silicon compounds, silane compounds, tetraalkoxysilane compounds, and/or partial hydrolysis condensates thereof; (E) hexamethyldisilazane; (F) water; and (G) at least one of (G1) and (G2), where (G1) is a non-surface-treated inorganic filler having a GET specific surface area of 50-500 m2/g, and (G2) is an inorganic filler surface-treated with hexamethyldisilazane.
The present invention relates to a thermally conductive polysiloxane composition comprising: (A) a thermally conductive filler, (B) a siloxane compound having a specified structure; (C) an alkoxysilane compound having a specified structure; (D) a polyorganosiloxane containing at least one aliphatic unsaturated group per molecule; (E) a polyorganohydrogensiloxane having two or more hydrogen atoms bonded to silicon atoms per molecule; and (F) a platinum-based catalyst.
Provided are a silicone rubber capable of combining a low modulus with high tear strength and a liquid silicone rubber composition giving the silicone rubber. The liquid silicone rubber composition comprises (A) an alkenylated linear polyorganosiloxane, (B) a linear hydrogenorganopolysiloxane, the amount of which is 0.1-39 parts by mass per 100 parts by mass of ingredient (A), (C) a polyorganosiloxane having one or more alkenyl groups and one or more Si-H groups in a total number of three or larger in the molecule, (D) a hydrosilylation catalyst, and (E) a silica powder having a specific surface area of 100-420 m2/g, the amount of which is 10-50 parts by mass per 100 parts by mass of ingredient (A). The total molar amount of the alkenyl groups of ingredient (A) and the Si-H groups of ingredient (B) is 0.03-0.19 mmol/g and the total molar amount of the alkenyl groups and Si-H groups of ingredient (C) is 0.01-0.05 mmol/g, with respect to the total mass of ingredients (A), (B), and (C). The composition has an Si-H group/alkenyl group ratio of 0.7-1.3.
Provided are a manufacturing method for a cured silicone product and a cured silicone product having significantly reduced generation of volatile components from the product, even when exposed for a long time to high temperatures that are higher than room temperature. Disclosed are: a manufacturing method for a cured silicone product, the method comprising a curing step for obtaining a primarily cured product by curing an addition-type polyorganosiloxane composition by means of a hydrosilylation reaction in a closed system at a temperature of 40-200°C, inclusive, and a heating step for heating the primarily cured product at a temperature of 60-160°C, inclusive, in an open system or under reduced pressure; and a cured silicone product for which, when heated for 16 hours at 150°C, the total amount of C1-3 alcohol and oxides thereof and C1-3 alkyl groups-containing silane compounds generated is not greater than 10ppm.
C08J 7/00 - Chemical treatment or coating of shaped articles made of macromolecular substances
C08L 83/05 - Polysiloxanes containing silicon bound to hydrogen
C08L 83/07 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
G02B 1/04 - Optical elements characterised by the material of which they are madeOptical coatings for optical elements made of organic materials, e.g. plastics
58.
POLYORGANOSILOXANE COMPOSITION FOR MOLDING, OPTICAL MEMBER, AND MOLDING METHOD
Provided is a polyorganosiloxane composition for molding which has excellent moldability for injection molding or the like, results in easy release of a cured product from a metal mold, and inhibits contamination of a metal mold. The polyorganosiloxane composition for molding comprises: (A) a straight-chain polyorganosiloxane which comprises, in one molecule, at least two alkenyl groups, and which has a viscosity (25°C) of 10,000-1,000,000 mPa·s; (B) a resin polyorganosiloxane which includes a Q unit, and which comprises, in one molecule, on average at least 1.5 alkenyl groups, 30-80 mass% of (B) being included relative to the total of components (A) and (B); (C) a polyorganohydrogensiloxane which includes an M unit and a Q unit, in which the alkoxy group and Si-H molar ratio is less than 0.15, and which has a mass depletion rate of no more than 2.0% when heated to 150°C for 30 minutes, (C) being included in an amount such that (Si-H/alkenyl group) is 1.0-3.0 mols; and (D) a catalytic amount of a hydrosilylation catalyst.
C08L 83/07 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
C08K 3/01 - Use of inorganic substances as compounding ingredients characterised by their specific function
C08L 83/05 - Polysiloxanes containing silicon bound to hydrogen
G02B 1/04 - Optical elements characterised by the material of which they are madeOptical coatings for optical elements made of organic materials, e.g. plastics
Provided is a polyorganosiloxane composition which has uniform excellent flame-retardant properties, excellent physical characteristics, can be used to obtain a cured product in which discoloration, for example yellowing, is suppressed, and has excellent stability over time when stored. Disclosed is a flame-retardant polyorganosiloxane composition which comprises: (A) a straight-chain polyalkylsiloxane which comprises, in one molecule, at least two alkenyl groups, and which has a viscosity (25°C) of 10,000-1,000,000 mPa·s; (B) a resin polyorganosiloxane which includes a Q unit, and which comprises on average at least 1.5 alkenyl groups, 30-80 mass% of (B) being included relative to the total of components (A) and (B); (C) a polyorganohydrogensiloxane which includes at least three Si-H, (C) being included in an amount such that Si-H/(the total of alkenyl groups in components (A) and (B)) is 1.0-3.0 mols; and (D) a catalytic amount of a hydrosilylation catalyst, wherein the total amount of phosphorus and alkali metal included is not greater than 20 ppm by mass.
C08L 83/07 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
C08K 3/01 - Use of inorganic substances as compounding ingredients characterised by their specific function
C08L 83/05 - Polysiloxanes containing silicon bound to hydrogen
G02B 1/04 - Optical elements characterised by the material of which they are madeOptical coatings for optical elements made of organic materials, e.g. plastics
A method for producing a polyorganosiloxane resin composition including: (a) mixing a thermally-conductive filler having a particle size distribution having a single peak, with a surface treatment agent containing a siloxane to form a mixture, and (b) mixing the mixture from step (a) with a polysiloxane resin.
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
[Problem] To make it possible, in a parallel-type heater in which heater patterns are formed in parallel between terminals, to perform a pre-production resistance adjustment easily without detracting from an intended function of the heater and without requiring skills. [Solution] Provided is a heater 30 in which heater patterns 31, 32 are provided in parallel between terminals A, B, wherein each terminal is divided into a divided terminal 37 having electrical conduction only with the heater pattern 31, and a divided terminal 38 having electrical conduction only with the heater pattern 32. After a heater body 36 is fabricated, in a state prior to mounting a feed bolt 50, resistance adjustment is performed with respect to each of a virtual series path 45 formed between the divided terminals 37, 37 and a virtual series path 46 formed between the divided terminals 38, 38, and then the feed bolt is mounted to each terminal, whereby a plurality of virtual series heater patterns are placed in electrical conduction with each other, thus forming a parallel circuit.
[Problem] To provide a wafer supporting device wherein particle generation is suppressed while chucking force is not decreased. [Solution] In this wafer supporting device, chuck electrodes 3 are provided in a predetermined pattern on the surface of an insulation base material, the chuck electrodes being covered by an insulation cover layer 5 made up of PBN or C-PBN. The surface of each chuck electrode has a protruding section 3a so as to assume a protruding-and-recessed shape. The surface of the insulation cover layer is formed into a protruding-and-recessed shape in conformity with the protrusions and recesses of the chuck electrode surfaces. The top surfaces of the protruding sections 5a of the insulation cover layer are approximately flush with one another, forming a wafer placement face 9.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H02N 13/00 - Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
This heat-conductive polysiloxane composition contains (A) a heat-conductive filler; (B) a polyorganosiloxane resin having curable functional groups in polysiloxane molecules, the polyorganosiloxane resin including at least one type of polysiloxane (b1) having one curable functional group in a molecule; (C) a siloxane compound having alkoxysilyl groups and a linear siloxane structure; (D) a hydrodiene polyorganosiloxane; and (E) a platinum catalyst. The content of the polysiloxane (b1) having one curable functional group in a molecule is more than 80 mass% in terms of the total polyorganosiloxane resin (B).
The present invention relates to a thermally conductive polysiloxane composition containing: (A) a thermally conductive filler; (B) a siloxane compound of a specific structure; (C) an alkoxysilane compound of a specific structure; (D) a polyorganosiloxane having one or more aliphatic unsaturated groups per molecule; (E) a polyorganohydrogensiloxane having two or more hydrogen atoms bonded to silicon atoms per molecule; and (F) a platinum-based catalyst.
The present invention pertains to a thermally conductive polysiloxane composition that provides a cured material having excellent tack properties and an excellent flexibility. This thermally conductive polysiloxane composition contains (A) a thermally conductive filler, (B) a siloxane compound having an alkoxysilyl group and a straight-chain siloxane structure, (C) a polyorganosiloxane having at least two silicon atom-bonded alkenyl groups in each molecule, (D1) a straight-chain polyorganosiloxane represented by general formula (4), (D2) a polyorganohydrogensiloxane having in each molecule at least three units represented by general formula (5), and (E) a platinum catalyst.
A thermally conductive composition is a thermally conductive composition including (A) a spherical thermally conductive filler, (B) an alkoxysilane compound or dimethylpolysiloxane, and (C) a polyorganosiloxane (not inclusive of the dimethylpolysiloxane of component (B)), wherein component (A) is a mixture formulated with specific ratios of fillers having different average particle sizes, the mixture being formulated with a filler having an average particle size of 50 μm or more in an amount of 30% by mass or more; component (B) and component (C) are included in a total amount of 1.5 to 35 parts by mass relative to 100 parts by mass of component (A); and a content ratio of component (C) in the total amount of component (B) and component (C) is 15 to 98% by mass.
2/g and a pH of 5.0 to 9.0; and (E) a polyoxyalkylene glycol, and/or a derivative of the polyoxyalkylene glycol. (B) includes: a linear polyorganosiloxane; and optionally a branched polyorganosiloxane. The ratio of mercaptoalkyl groups in (A) to the total aliphatic unsaturated groups in (B) is 0.45 to 2.00, the content of (D) is 0.5 to 26 parts relative to 100 parts by mass of (B), the content of (E) is 0.001 to 1.0 mass % relative to the total mass of (A) to (E), and the viscosity at 23° C. is 500 to 100,000 cP.
C08G 77/20 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
C08G 77/28 - Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen sulfur-containing groups
C08G 77/00 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon
69.
ROOM-TEMPERATURE-CURING POLYORGANOSILOXANE COMPOSITION AND METHOD OF PREPARING SAME
This room-temperature-curing polyorganosiloxane composition contains: (A) 100 parts by mass of a polyorganosiloxane having molecule chains capped at the ends by hydroxyl groups or alkoxy groups; (B) 1–300 parts by mass of a filler; (C) 0.1–20 parts by mass of a polyorganosiloxane having a resin structure represented by the average unit formula (R1 3SiO1/2)p[Si(OH)xO(4-x)/2]q; (D) 0.1–20 parts by mass of a tri- or tetrafunctional silane compound and/or a partially hydrolyzed condensate thereof; (E) 0.1–10 parts by mass of a titanium chelate catalyst; and (F) 0.01–5 parts by mass of an adhesiveness-imparting agent. The room-temperature-curing polyorganosiloxane composition exhibits, in high-temperature, high-humidity environments, little reduction in physical properties, such as cured hardness, or in adhesiveness.
A thermally conductive polysiloxane composition or a silicone grease which each comprise a thermally conductive filler, a polyorganosiloxane having at least two curable functional groups, and a siloxane represented by general formula (1) (wherein R1, R2, R3, X, a, b, c, R4, Y, and d are as defined in the description).
Provided is a cyclic siloxane represented by general formula (1) (wherein R1, R2, R3, X, a, b, c, R4, Y, and d are as defined in the description), the cyclic siloxane having a hydrolyzable functional group that comprises an alkoxysilyl group and having a linear polysiloxane structure having a specific length. The compound is utilizable as a surface treatment agent which is for thermally conductive fillers and is capable of giving compositions excellent in terms of applicability, thermal conductivity, and operating efficiency.
C08G 77/50 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
Provided is a thermally conductive polysiloxane composition having high thermal conductivity and exceptional workability due to low viscosity. The thermally conductive polysiloxane composition contains (A) a thermally conductive filler and (B) one or more selected from the group consisting of an alkoxysilyl-group-containing compound and a dimethylpolysiloxane, wherein the component (A) comprises two or more types of thermally conductive fillers having different average particle diameters, and includes (A-1) amorphous aluminum nitride particles in an amount of at least 20 mass% relative to the total content of the component (A), said particles (A-1) having an average particle diameter of 30-150 μm.
The present invention is an addition reaction type polyorganosiloxane composition which can be cured rapidly at room temperature. A cured product of the composition exhibits high elongation, excellent stress relaxation properties and good reliability under conditions of high temperature and high humidity and exhibits excellent reliability in cold/heat cycling. The composition contains: (A1) a straight chain polysiloxane containing alkenyl groups at both terminals; (B1) a straight chain polysiloxane containing SiH groups at both terminals; (B2) a crosslinkable polyorganohydrogensiloxane; one or more types selected from the group consisting of (A2) a straight chain polysiloxane containing an alkenyl group at one terminal and (B3) a straight chain polysiloxane containing a SiH group at one terminal; and (C) a platinum-based catalyst. The content of component A2 is 0-60 parts by weight relative to a total of 100 parts by weight of components A1 and A2, and the value of (HB1+HB2+HB3) / (ViA1+ViA2) (in the formula, ViA1, ViA2, HB1, HB2 and HB3 are as disclosed in the description) is 0.6-2.2.
C08L 83/07 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
C08L 83/05 - Polysiloxanes containing silicon bound to hydrogen
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
74.
Polyorganosiloxane composition for molding, optical member, light source lens or cover, and molding method
A polyorganosiloxane composition for molding includes: (A) a straight-chain polyorganosiloxane having two or more alkenyl groups and having a viscosity (25° C.) of 10,000 to 500,000 mPa·s; (B) 30 to 80 mass % of a resinoid polyorganosiloxane including M, D, and Q units, at a molar ratio of a:b:c, on average (0.3≤a≤0.6, 0≤b≤0.1, 0.4≤c≤0.7, and a+b+c=1), and having two or more alkenyl groups; (C) an amount of a polyorganohydrogensiloxane having Si-bonded hydrogen atoms, an average degree of polymerization of 10 or more, a content of the Si-bonded hydrogen atoms of 5.0 mmol/g or more and 11.0 mmol/g or less, and a mass decrease rate up to 140° C. by TGA of 2.0 mass % or less so that an amount of the (Si-bonded hydrogen atoms/alkenyl groups) is 1.0 to 3.0 mol; and (D) a hydrosilylation reaction catalyst. A cured product excellent in mold release property is obtained and contamination of a metal mold is prevented.
F21V 3/06 - GlobesBowlsCover glasses characterised by materials, surface treatments or coatings characterised by the material
C08K 5/521 - Esters of phosphoric acids, e.g. of H3PO4
C08K 5/524 - Esters of phosphorous acids, e.g. of H3PO3
C08G 77/20 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
G02B 1/04 - Optical elements characterised by the material of which they are madeOptical coatings for optical elements made of organic materials, e.g. plastics
This flame-retardant polyorganosiloxane includes (A) a straight-chain polyorganosiloxane having two or more alkenyl groups in one molecule and whose viscosity (25° C.) is 10,000 to 1,000,000 mPa·s; (B) 30 to 80 mass % of a resinoid polyorganosiloxane which includes Q unit and has 1.5 or more alkenyl groups on average, and in which a molar ratio of alkoxy groups to alkyl groups is 0.030 or less; (C) an amount of a polyorganohydrogensiloxane, whose average degree of polymerization is 10 or more, and in which a Si—H content is 5.0 mmol/g or more, in which Si—H/(a total of alkenyl groups) is 1.0 to 3.0 mol; and (D) a hydrosilylation reaction catalyst. A flame-retardant polyorganosiloxane composition capable of reducing an amount of a platinum-based metal compound is provided.
F21V 3/06 - GlobesBowlsCover glasses characterised by materials, surface treatments or coatings characterised by the material
C08K 5/521 - Esters of phosphoric acids, e.g. of H3PO4
C08K 5/524 - Esters of phosphorous acids, e.g. of H3PO3
G02B 1/04 - Optical elements characterised by the material of which they are madeOptical coatings for optical elements made of organic materials, e.g. plastics
Provided is a silicone rubber composition that exhibits improved moldability, particularly extrusion moldability, while also ensuring that a cured product obtained therefrom has sufficient strength. A silicone rubber composition comprising: (A) 100 parts by mass of a base polymer formed from (A1) a polyorganosiloxane diol having a viscosity at 25°C of 1 to 100 Pas, and (A2) a polyorganosiloxane having a viscosity at 25°C of 0.2 to 40,000 Pas, wherein the proportion of (A1) with respect to the total amount of (A) is 20 to 100 mass%, the viscosity at 25°C is 5 to 20,000 Pas, and the alkenyl group content is 0.001 to 0.3 mmol/g; (B) 10 to 50 parts by mass of a silica powder having a specific surface area of 50 to 400 m2/g; (C) 1 to 10 parts by mass of an organosilazane; and (D) a catalytic amount of a curing agent.
A method for producing a polyorganosiloxane resin composition, the method comprising: (a1) a step for mixing a thermally-conductive filler of which the particle size distribution has a single peak, with a surface treatment agent containing siloxane; and (b) a step for mixing the mixture between the thermally-conductive filler and the surface treatment agent obtained in step (a1), with a polysiloxane resin, wherein the surface treatment agent contains a siloxane compound represented by general formula (1) (wherein, R1, R2, R3, X, a, b, c, R4, Y, and d are as defined in the description).
This room temperature curable polyorganosiloxane composition contains: (A) 100 parts by mass of a polyorganosiloxane having molecular chain terminals blocked with hydroxyl groups or alkoxyl groups; (B) 1-300 parts by mass of a filler; (C) 0.1-20 parts by mass of a polyorganosiloxane having a resin structure represented by average unit formula (R13SiO1/2)p[Si(OH)xO(4-x)/2]q; (D) 0.1-20 parts by mass of a trifunctional or tetrafunctional silane compound and/or a partial hydrolysis-condensation product thereof; (E) 0.1-10 parts by mass of a titanium chelate catalyst; and (F) 0.01-5 parts by mass of an adhesiveness-imparting agent. This room temperature curable polyorganosiloxane composition provides a cured product that is suppressed in deterioration of adhesiveness and physical characteristics such as hardness in a high-temperature high-humidity atmosphere.
Provided is a thermally conductive composition which has low viscosity and is easy to coat, while having high thermal conductivity. A thermally conductive composition which contains (A) a spherical thermally conductive filler, (B) an alkoxysilane compound or a dimethylpolysiloxane and (C) a polyorganosiloxane (excluding the dimethylpolysiloxane serving as the component (B)). This thermally conductive composition is configured such that: the component (A) is a mixture obtained by blending fillers having different average particle diameters at a specific ratio; the mixture is obtained by blending 30% by mass or more of a filler having an average particle diameter of 50 μm or more; the component (B) and the component (C) are contained in an amount of 1.5-35 parts by mass in total relative to 100 parts by mass of the component (A); and the content ratio of the component (C) in the total of the component (B) and the component (C) is 15-98% by mass.
Provided is a thermally conductive composition that exhibits excellent thermal conductivity, has low viscosity and is easy to apply. Specifically provided is a thermally conductive composition comprising (A) a spherical thermally conductive filler and (B) an alkoxysilane compound or a dimethylpolysiloxane, wherein the spherical thermally conductive filler of component (A) is a mixture obtained by blending fillers having different average particle diameters at a specified ratio, and the mixture is obtained by blending in at least 30 mass% of a spherical thermally conductive filler comprising a nitride and having an average particle diameter of 50 μm or greater.
2 represent prescribed group respectively, and a and b are prescribed positive numbers), having an Mw of 2,000 to 100,000 and a three-dimensional network structure, and being in a solid state or in a semisolid state at normal temperature; and (B) 0.1 to 15 parts by mass of an organic titanium compound.
C08L 83/00 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon onlyCompositions of derivatives of such polymers
C08L 83/06 - Polysiloxanes containing silicon bound to oxygen-containing groups
C09D 183/06 - Polysiloxanes containing silicon bound to oxygen-containing groups
C08G 77/18 - Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
B05D 1/02 - Processes for applying liquids or other fluent materials performed by spraying
82.
RESIN COMPOSITION FOR ELECTRICAL/ELECTRONIC COMPONENTS
The present invention relates to a resin composition for electrical/electronic components, which contains (A) a polyorganosiloxane that has a viscosity of 20-3,000 cP at 23°C and contains a mercaptoalkyl group bonded to a silicon atom, (B) a polyorganosiloxane that contains an aliphatic unsaturated group and is composed of (B1) a linear polyorganosiloxane represented by formula (I), and optionally (B2) a branched polyorganosiloxane which is composed of an SiO4/2 unit, an R'3SiO1/2 unit and an R'2SiO2/2 unit, and optionally an R'SiO3/2 unit, and wherein at least three R' moieties are aliphatic unsaturated groups in each molecule, (C) a photoreaction initiator, (D) a silica that has a chemically treated surface, a BET specific surface area of 50-250 m2/g and a pH of 5.0-9.0, and (E) a polyoxyalkylene glycol, in which the alkylene unit is a linear or branched alkylene group having 2-4 carbon atoms, and/or a derivative of the polyoxyalkylene glycol. In this connection, the ratio of the number of mercaptoalkyl groups in the component (A) to the total number of aliphatic unsaturated groups in the component (B) is 0.45-2.00; the content of the component (D) is 0.5-26 parts by mass relative to 100 parts by mass of the component (B); the content of the component (E) is 0.001-1.0% by mass relative to the total mass of the components (A)-(E); and the viscosity of the resin composition at 23°C is 500-100,000 cP.
This flame-retardant polyorganosiloxane composition comprises: (A) a straight-chain polyorganosiloxane including two or more alkenyl groups in a single molecule, and having a viscosity (25°C) of from 10,000 to 1,000,000 mPa·s; (B) from 30 to 80 mass% of a resin-form polyorganosiloxane including Q units and including 1.5 or more alkenyl groups on average, wherein the molar ratio of alkoxy groups to substituted or non-substituted alkyl groups is 0.030 or less; (C) a polyorganohydrogen siloxane including Si-H, having an average degree of polymerization of 10 or greater, and having an Si-H content of 5.0 mmol/g or greater, the amount of said polyorganohydrogen siloxane being such that the ratio of Si-H to the total amount of alkenyl groups in components (A) and (B) is from 1.0 to 3.0 mol; and (D) a catalytic amount of a hydrosilylation reaction catalyst. Thus, it is possible to provide a flame-retardant polyorganosiloxane composition in which the blending amount of platinum-based metal compounds is suppressed, and with which it is possible to obtain, at low cost, a cured product having excellent flame retardancy.
C08L 83/07 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
C08G 77/20 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
C08K 5/521 - Esters of phosphoric acids, e.g. of H3PO4
C08K 5/524 - Esters of phosphorous acids, e.g. of H3PO3
C08L 83/05 - Polysiloxanes containing silicon bound to hydrogen
G02B 1/04 - Optical elements characterised by the material of which they are madeOptical coatings for optical elements made of organic materials, e.g. plastics
84.
POLYORGANOSILOXANE COMPOSITION FOR MOLDING, OPTICAL MEMBER, LENS OR COVER FOR LIGHT SOURCE, AND MOLDING METHOD
This polyorganosiloxane composition for molding comprises: (A) a straight-chain polyorganosiloxane including two or more alkenyl groups in a single molecule and having a viscosity (25°C) of from 10,000 to 500,000 mPa·s; (B) from 30 to 80 mass% of a resin-form polyorganosiloxane including M units, D units, and Q units at a molar ratio of a:b:c on average (0.3≤a≤0.6, 0≤b≤0.1, 0.4≤c≤0.7, and a+b+c=1), and including two or more alkenyl groups; (C) a polyorganohydrogen siloxane including Si-H, having an average degree of polymerization of 10 or greater, and having an Si-H content of from 5.0 mmol/g to 11.0 mmol/g inclusive, the mass reduction rate up to 140°C by TGA being 2.0 mass% or less, and the amount of said polyorganohydrogen siloxane being such that the ratio of Si-H to the alkenyl groups is from 1.0 to 3.0 mol; and (D) a hydrosilylation reaction catalyst. Thus, a cured product having excellent mold releasability is obtained, and the mold is prevented from contamination.
C08L 83/07 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
C08G 77/20 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
C08K 5/521 - Esters of phosphoric acids, e.g. of H3PO4
C08K 5/524 - Esters of phosphorous acids, e.g. of H3PO3
C08L 83/05 - Polysiloxanes containing silicon bound to hydrogen
G02B 1/04 - Optical elements characterised by the material of which they are madeOptical coatings for optical elements made of organic materials, e.g. plastics
85.
Organosiloxane composition having high refractive index and applications containing the same
The invention is directed to a silicone compound of the general formula (I) and a personal care composition comprising the silicone compound (I) as described herein, and to personal care applications containing the same and processes of making the silicone compound.
C07F 7/08 - Compounds having one or more C—Si linkages
A61K 8/58 - Cosmetics or similar toiletry preparations characterised by the composition containing organic compounds containing atoms other than carbon, hydrogen, halogen, oxygen, nitrogen, sulfur or phosphorus
A61Q 17/04 - Topical preparations for affording protection against sunlight or other radiationTopical sun tanning preparations
A61Q 1/02 - Preparations containing skin colorants, e.g. pigments
A61Q 1/04 - Preparations containing skin colorants, e.g. pigments for lips
A61K 8/81 - Cosmetics or similar toiletry preparations characterised by the composition containing organic macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
The invention is directed to a silicone compound of the general formula (I) and a personal care composition comprising the silicone compound (I) as described herein, and to personal care applications containing the same and processes of making the silicone compound.
C07F 7/08 - Compounds having one or more C—Si linkages
A61Q 1/04 - Preparations containing skin colorants, e.g. pigments for lips
A61K 8/58 - Cosmetics or similar toiletry preparations characterised by the composition containing organic compounds containing atoms other than carbon, hydrogen, halogen, oxygen, nitrogen, sulfur or phosphorus
A61K 8/81 - Cosmetics or similar toiletry preparations characterised by the composition containing organic macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
(C) a heterocyclic compound containing nitrogen atoms in an amount of 30 to 3000 ppm relative to 100 parts by mass of the component (A), wherein the curing agent is not included in the 100 parts by mass.
The present invention provides a heat-curable silicone rubber composition capable of giving a stable and high antistatic property for a long time without degrading inherent properties of a silicone rubber, such as thermal stability. The heat-curable silicone rubber composition includes: (A) 100 parts by mass of a mixture of a polyorganosiloxane obtained by polymerization by using an alkali metal hydroxide as a polymerization catalyst and by neutralization, and a curing agent, and (B) 50 to 1000 ppm of an ionic substance containing an anion and a cation, and being a bis(trifluoromethanesulfonyl)imide as the anion.
The silicone composition for sealing a semiconductor, comprises: (A) 100 parts of a polyorganosiloxane having one or more alkenyl groups, obtained by reacting (a1) 60 to 99 parts of an organosiloxane containing at least a trifunctional siloxane unit not taking part in a hydrosilylation reaction, with (a2) 40 to 1 parts of an organosiloxane containing a bifunctional siloxane unit having an alkenyl group and/or a monofunctional siloxane unit having an alkenyl group; (B) an amount of a polyorganohydrogensiloxane having two or more hydrogen atoms having a viscosity at 25° C. of 1 to 1000 mPa·s so that an amount of the hydrogen atoms is 0.5 to 3.0 mol per mol of the alkenyl groups; and (C) a platinum-based catalysts, wherein a decrease in storage modulus of a cured product thereof from 25° C. to 50° C. is 40% or more.
Specifically the polyorganosiloxane (A) is prepared by block or graft polymerization and equilibration reaction of three specific, different, organosiloxanes including a branched siloxane, a linear siloxane and a cyclic siloxane.
C08L 83/10 - Block- or graft-copolymers containing polysiloxane sequences
C08G 77/12 - Polysiloxanes containing silicon bound to hydrogen
C08G 77/20 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
C08G 77/00 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon
90.
Composition for silicone rubber foam, manufacturing method of silicone rubber foam, and silicone rubber foam
There are provided a composition for silicone rubber foam, a manufacturing method of a silicone rubber foam, and a silicone rubber foam in which it is possible to control the foaming states. The composition for silicone rubber foam contains: (A) 100 parts by mass of polyorganosiloxane having a degree of polymerization of 4,000 to 10,000 and having two or more alkenyl groups at a content of 0.001 mmol/g or more and less than 0.3 mmol/g; an amount of polyorganohydrogensiloxane having an average of two or more Si-atom-bonded hydrogen atoms so that a molar ratio of the hydrogen atoms to the alkenyl groups in the (A) component is 0.001 to 5; 0.1 to 10 parts by mass of an organic foaming agent with a decomposition temperature of 50 to 250° C.; 5 to 200 parts by mass of silica powder; and a catalyst amount of a platinum-based metal catalyst activated with ultraviolet rays.
C08J 9/00 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof
C08J 9/14 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent organic
C08J 9/06 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent
The invention provides dam compositions which can give cured products serving as dam materials exhibiting appropriate hardness and adhesion with respect to adherends and which are preferably such that the dam materials also have inconspicuous joints with fillers. The invention also provides image displays manufactured with the compositions.
2/g. In the composition, the ratio of the number of the mercaptoalkyl groups present in (A) to the total number of the aliphatic unsaturated groups in (B) and (D) is 0.45 to 1.50; the amount of (E) is 0.5 to 24 parts by weight per 100 parts by weight of (B); and the composition has a viscosity at 23° C. of 20,000 to 10,000,000 cP. An image display includes an image display component and a protective component sealed with the composition.
Provided is an addition-cured silicone composition such that the obtained silicone cured product is superior with respect to adhesiveness and appearance, and has little contraction or change in hardness due to heat. The addition-cured silicone composition contains: (A) 100 parts by mass of a polyorganosiloxane having an alkenyl group; (B) a polyorganohydrogensiloxane at an amount such that there are 0.9-3.0 moles of hydrogen atoms bonded to silicon atoms for every total of 1 mole of alkenyl groups that component (A) has; (C) a catalytic amount of a hydrosilylation catalyst; (D) 0.01-10 parts by mass of an adhesiveness imparting agent; and (E) 0.001-0.05 parts by mass of an organic free radical (compound having a 5- or 6-membered nitrogen-containing heterocyclic skeleton and of which the nitrogen atoms are bonded to the oxygen atoms of the free radicals).
3/2 units, at least three R′ groups per molecule of the branched polyorganosiloxane (B2) are aliphatic unsaturated groups, the proportion of the number of the aliphatic unsaturated groups in (B2) to the total number of the aliphatic unsaturated groups in (B) is more than 50% and not more than 95%; (C) a photoreaction initiator; (D) a silane compound; and (E) an MQ resin having a weight average molecular weight of 2,000 to 2,500,000 and/or an MDQ resin having a weight average molecular weight of 2,000 to 1,000,000.
C08L 83/00 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon onlyCompositions of derivatives of such polymers
C09J 143/04 - Homopolymers or copolymers of monomers containing silicon
C08L 83/08 - Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
C08K 5/5425 - Silicon-containing compounds containing oxygen containing at least one C=C bond
C08G 77/20 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
C08G 77/28 - Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen sulfur-containing groups
94.
ROOM-TEMPERATURE-CURABLE POLYORGANOSILOXANE COMPOSITION AND ELECTRIC/ELECTRONIC DEVICE
Provided is a room-temperature-curable polyorganosiloxane composition having low viscosity and good applying properties without use of a solvent, the composition for forming a cured coating having excellent scratch resistance. This room-temperature-curable polyorganosiloxane composition contains 0.1-15 parts by mass of (B) an organic titanium compound with respect to 100 parts by mass of (A) a mixture obtained by mixing: (A1) 10-80 parts by mass of a polyorganosiloxane having two or more alkoxy groups bonded to a silicon atom and a viscosity of 3 mPa∙s-500 mPa∙s; and (A2) 90-20 parts by weight of a polyorganosiloxane represented by the average composition formula R1 aSi(OR2)bO{4 – (a + b)}/2 (In the formula, R1 is an unsubstituted monovalent hydrocarbon group or the like, R2 is an alkyl group or an alkoxy-substituted alkyl group, and a and b are positive numbers satisfying 0.5 ≤ a ≤ 1.5 and 0 < b < 3.), having a molecular weight of 2,000-100,000 and a three-dimensional network structure, and being solid or semisolid at normal temperature.
Provided is an addition-curable silicone composition having little shrinkage or change in hardness due to heat, a cured silicone product of which obtained has excellent adhesiveness and appearance and makes it possible to protect metals, especially silver, from corrosion. An addition-curable silicone composition containing 100 parts by mass of polyorganosiloxane having an alkenyl group, polyorganohydrogensiloxane in an amount to make 0.9-3.0 mol of hydrogen atoms bonded to silicon atoms per 1 mol total amount of this alkenyl group, a catalytic amount of hydrosilylation catalyst, 0.01-10 parts by mass of adhesiveness-imparting agent, and 0.001-0.015 parts by mass, calculated in terms of metal atoms, of carboxylic acid metal salt indicated by (R3COO)kM (M indicates a metal atom selected from Ce, Fe, Cr, La, Nd, Pr, and Sm, k indicates a positive number of 2-4, and R3 indicates a substituted or unsubstituted hydrocarbon group having 4-10 carbon atoms).
C08L 83/05 - Polysiloxanes containing silicon bound to hydrogen
C08L 83/06 - Polysiloxanes containing silicon bound to oxygen-containing groups
H01L 21/52 - Mounting semiconductor bodies in containers
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
96.
CURED PRODUCT OF CURABLE POLYORGANOSILOXANE COMPOSITION, BONDED BODY PRODUCED USING CURABLE POLYORGANOSILOXANE COMPOSITION, METHOD FOR PRODUCING BONDED BODY USING CURABLE POLYORGANOSILOXANE COMPOSITION, AND USE OF SAID BONDED BODY
The present invention relates to a cured product of a curable polyorganosiloxane composition which comprises (A) an alkenyl-group-containing polyorganosiloxane containing at least two alkenyl groups in the molecule, (B) a polyorganohydrogensiloxane having at least two hydrogen atoms each bound to a silicon atom in the molecule, and (C) a platinum-containing catalyst, wherein the ratio of the number (ViA) of alkenyl groups in the component (A) to the number (HB) of hydrogen atoms each bound to a silicon atom in the component (B) is 0.5 to 100 and the component (C) is contained in an amount of 0.5 to 1000 ppm in terms of platinum-type metal atom content, and wherein the composition that is not cured yet comprises at least two parts selected from the group consisting of a part containing the component (B), a part containing both the components (B) and (A), a part containing the component (C) and a part containing both the components (C) and (A).
C09J 183/05 - Polysiloxanes containing silicon bound to hydrogen
C09J 183/07 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
C08G 77/50 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
97.
Method of preparing a curable polyorganosiloxane composition
A method of preparing a curable polyorganosiloxane composition including kneading a uniform mixture of an alkenyl group-containing polyorganosiloxane, a polyorganohydrogensiloxane, and a platinum group metal compound, and defoaming the kneaded mixture under reduced pressure, the alkenyl group-containing polyorganosiloxane includes a linear polyorganosiloxane of the formula (I):
3/2, R′ represents a monovalent aliphatic or alicyclic, and at least three R′ groups per molecule are alkenyls, the alkenyl group-containing polyorganosiloxane having a weight ratio of the branched to linear polyorganosiloxane of 1 to 5; and a number of hydrogens bonded to a silicon atom of the polyorganohydrogensiloxane exceeds 2.
B05D 3/02 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
C08G 77/20 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
C08G 77/00 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon
98.
SILICONE COMPOSITION FOR OPTICAL SEMICONDUCTOR SEALING AND OPTICAL SEMICONDUCTOR DEVICE
Provided are: a silicone composition for optical semiconductor sealing in which deformation of a cured product thereof is minimized; and a highly reliable optical semiconductor device using same. The silicone composition for optical semiconductor sealing contains: a polyorganosiloxane (A) having two or more alkenyl groups that are bonded to a silicon atom in a molecule thereof; a straight-chain polyorganohydrogen siloxane (B) that has at least two hydrogen atoms bonded to a silicon atom in a molecule thereof and that is represented by the unit formula [R23SiO1/2]a[R22SiO2/2]b[R2HSiO2/2]c[R22HSiO1/2]d (in the formula, R2 represents substituted or unsubstituted monovalent hydrocarbon groups that do not have an aliphatic unsaturated carbon bond and that are the same or different, a, b, c, and d are integers of 0 or higher, a + d = 2, and a + b + c + d is an integer of 5-80 and a number that satisfies 0.05 ≤ (c + d)/(a + b + c + d) ≤ 0.70); and a platinum catalyst (C).
This adhesiveness-imparting agent is characterized by: containing a siloxane unit (a) that comprises an epoxy group and a bifunctional siloxane unit (b) that comprises an alkenyl group; and by having a molecular weight (Mw) of 1,000-15,000. Also provided is an adhesive polyorganosiloxane composition containing: 100 parts by mass of a polyorganosiloxane (A) comprising an alkenyl group; an amount of a hydrogen atom-containing polyorganohydrogen siloxane (B) that corresponds to 0.1-4 hydrogen atoms per alkenyl group in the component (A); a catalytic amount of a platinum catalyst (C); and 0.05-10 parts by mass of the adhesiveness-imparting agent (D). The present invention provides an adhesive polyorganosiloxane composition that exhibits good adhesiveness with respect to plastics such as PPA.
The invention is directed to phenyi-containing functional polysiloxanes and polycarbonate-polysiloxane copolymer compositions made therefrom having improved optical clarity and better low temperature impact resistance.
