Described is an affixing apparatus capable of flattening a surface of a film affixed to a main surface of a plate-shaped body. An affixing apparatus for affixing the film to the plate-shaped body includes: a plate-shaped mounting member provided with a mounting portion on which the plate-shaped body is mounted; a plate-shaped pressing member installed at a position facing the mounting member; and a support member installed at an outer edge of the mounting portion so as to be positioned between the mounting member and the pressing member.
B32B 37/10 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using direct action of vacuum or fluid pressure
B32B 37/12 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
2.
BACK GRINDING ADHESIVE FILM AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
A back grinding adhesive film used to protect a surface of a wafer, the back grinding adhesive film including a base material layer, and an adhesive resin layer which is formed on one surface side of the base material layer and configured with an ultraviolet curable adhesive resin material, in which, when a viscoelastic characteristic is measured after curing the ultraviolet curable adhesive resin material by irradiating with an ultraviolet ray, a storage elastic modulus at 5° C. E′ (5° C.) is 2.0×106 to 2.0×109 Pa, and a storage elastic modulus 100° C. E′ (100° C.) is 1.0×106 to 3.0×107 Pa.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 27/06 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance
C09J 5/00 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
3.
PROTECTION FILM, METHOD FOR AFFIXING SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR COMPONENT
Provided are a method for affixing a protective film, a method for manufacturing a semiconductor component, and a protective film for use in the affixing method, which are capable of suppressing occurrence of a failure caused by a step on a main surface of a semiconductor wafer. The affixing method includes: an arrangement step of arranging a protective film so as to cover a main surface A of a semiconductor wafer; and an affixing step of pressing the protective film against the main surface to affix the protective film to the main surface. The affixing step includes a compression step of compressing the protective film in a thickness direction thereof.
B32B 37/10 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using direct action of vacuum or fluid pressure
B32B 37/12 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
4.
PROTECTION FILM, METHOD FOR AFFIXING SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR COMPONENT
Provided are a method for affixing a protective film, a method for manufacturing a semiconductor component, and a protective film for use in the affixing method, which are capable of suppressing occurrence of a failure caused by a step on a main surface of a semiconductor wafer. The affixing method includes: an arrangement step of arranging a protective film so as to cover a main surface A of a semiconductor wafer; and an affixing step of pressing the protective film against the main surface to affix the protective film to the main surface. The affixing step includes a compression step of compressing the protective film in a thickness direction thereof.
B32B 37/10 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using direct action of vacuum or fluid pressure
B32B 37/12 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
5.
ELECTRONIC COMPONENT MANUFACTURING METHOD, MANUFACTURING FILM, AND MANUFACTURING TOOL
A component manufacturing method includes: a step of arranging a plurality of electronic components in a state where electrodes are exposed, on a support having a substrate and a holding layer, with the holding layer interposed therebetween; and a step of evaluating electric characteristics of 80 or more of the electronic components among the electronic components arranged on the support by bringing all or some of the exposed electrodes and probes into contact with each other and simultaneously performing conduction evaluation. A component manufacturing film includes a resin base layer, the holding layer provided on one surface side of the resin base layer, and a joint layer that is provided on an opposite side of the resin base layer and bonds the component manufacturing film to the substrate. A component manufacturing tool includes the substrate and the holding layer provided to one surface of the substrate.
H01L 21/66 - Testing or measuring during manufacture or treatment
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
6.
BACK GRINDING ADHESIVE FILM AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
A back grinding adhesive film used to protect a surface of a wafer. This adhesive film includes a base material layer, and an adhesive resin layer which is provided on one surface side of the base material layer and configured with an ultraviolet curable adhesive resin material. The ultraviolet curable adhesive resin material has a loss tangent tan δ at −5° C. of 0.25 to 0.85.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
H01L 21/268 - Bombardment with wave or particle radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
7.
BACK GRINDING ADHESIVE FILM AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
A back grinding adhesive film used to protect a surface of a wafer, the back grinding adhesive film including a base material layer, and an adhesive resin layer which is provided on one surface side of the base material layer and configured with an ultraviolet curable adhesive resin material. Here, regarding the ultraviolet curable adhesive resin material, when a storage elastic modulus at −15° C. is defined as E′ (−15° C.) and a storage elastic modulus at 100° C. is defined as E′ (100° C.) in a case where a viscoelastic characteristic is measured, E′ (100° C.) is 1.0×106 to 3.5×107 Pa, and E′) (100° C./E′ (−15° C.) is 2.0×10−3 to 1.5×10−2.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
A method for manufacturing an electronic device at least includes a step (A) of preparing a structure which includes a wafer including a circuit forming surface, and an adhesive film bonded to the circuit forming surface side of the wafer, a step (B) of back-grinding a surface of the wafer on a side opposite to the circuit forming surface side, and a step (C) of irradiating the adhesive film with an ultraviolet ray and then removing the adhesive film from the wafer. The adhesive film includes a base material layer, and an adhesive resin layer configured with an ultraviolet curable adhesive resin material. The adhesive resin layer of the adhesive film after being irradiated with an ultraviolet ray has a storage elastic modulus at 5° C. of 2.0×106 to 2.0×109 Pa, and a storage elastic modulus at 100° C. of 1.0×106 to 3.0×107 Pa.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
A method for manufacturing an electronic device at least includes a step (A) of preparing a structure which includes a wafer including a circuit forming surface, and an adhesive film bonded to the circuit forming surface side of the wafer, a step (B) of back-grinding a surface of the wafer on a side opposite to the circuit forming surface side; and a step (C) of removing the adhesive film from the wafer after the adhesive film is irradiated with an ultraviolet ray. This adhesive film includes a base material layer, and an adhesive resin layer which is provided on one surface side of the base material layer and configured with an ultraviolet curable adhesive resin material. In the step (C), regarding the adhesive resin layer of the adhesive film after being irradiated with an ultraviolet ray, a storage elastic modulus at 100° C. is 2.0×10−3 to 1.5×10−2.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
A method for manufacturing an electronic device at least includes a step (A) of preparing a structure which includes a wafer including a circuit forming surface, and an adhesive film bonded to the circuit forming surface side of the wafer, a step (B) of back-grinding a surface of the wafer on a side opposite to the circuit forming surface side, and a step (C) of irradiating the adhesive film with an ultraviolet ray and then removing the adhesive film from the wafer, in which the adhesive film includes a base material layer, and an adhesive resin layer configured with an ultraviolet curable adhesive resin material, provided on one surface side of the base material layer, regarding the ultraviolet curable adhesive resin material, a storage elastic modulus (100° C.) at 100° C. is 1.0×106 to 3.5×107 Pa, and E′ (100° C.)/E′ (−15° C.) is 2.0×10−3 to 1.5×10−2.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
A method for manufacturing an electronic device at least includes a step (A) of preparing a structure which includes a wafer including a circuit forming surface, and an adhesive film bonded to the circuit forming surface side of the wafer, a step (B) of back-grinding a surface of the wafer on a side opposite to the circuit forming surface side; and a step (C) of removing the adhesive film from the wafer after the adhesive film is irradiated with an ultraviolet ray. The adhesive film includes a base material layer, and an ultraviolet curable adhesive resin layer provided on one surface side of the base material layer using an ultraviolet curable adhesive resin material. In addition, a loss tangent tan δ at −5° C. of a cured film of the ultraviolet curable adhesive resin material is 0.25 to 0.85.
H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
C09J 5/00 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
A method for manufacturing an electronic device includes a step (A) of preparing a structure which includes a wafer including a circuit forming surface, and an adhesive film bonded to the circuit forming surface side of the wafer, a step (B) of back-grinding a surface of the wafer on a side opposite to the circuit forming surface side, and a step (C) of irradiating the adhesive film with an ultraviolet ray and then removing the adhesive film from the wafer. The adhesive film includes a base material layer, and an adhesive resin layer configured with an ultraviolet curable adhesive resin material. The ultraviolet curable adhesive resin material has a storage elastic modulus at 5° C. E′ (5° C.) after curing of 2.0×106 to 2.0×109 Pa, and a storage elastic modulus at 100° C. E′ (100° C.) of 1.0×106 to 3.0×107 Pa.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
C09J 133/10 - Homopolymers or copolymers of methacrylic acid esters
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
A method for manufacturing an electronic device at least includes a step (A) of preparing a structure which includes a wafer including a circuit forming surface, and an adhesive film bonded to the circuit forming surface side of the wafer, a step (B) of back-grinding a surface of the wafer on a side opposite to the circuit forming surface side; and a step (C) of removing the adhesive film from the wafer after the adhesive film is irradiated with an ultraviolet ray. The adhesive film includes a base material layer, and an ultraviolet curable adhesive resin layer provided on one surface side of the base material layer using an ultraviolet curable adhesive resin material. In addition, in the step (C), a loss tangent tan δ at −5° C. of the adhesive resin layer of the adhesive film after being irradiated with an ultraviolet ray, is 0.25 to 0.85.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
H01G 13/00 - Apparatus specially adapted for manufacturing capacitorsProcesses specially adapted for manufacturing capacitors not provided for in groups
B28B 1/30 - Producing shaped articles from the material by applying the material on to a core, or other moulding surface to form a layer thereon
Provided is a method for manufacturing a ceramic green sheet which facilitates the peeling of a green sheet and effectively suppresses the contamination of the green sheet. The problem is solved by a method for manufacturing a ceramic green sheet, the method comprising: a) a step for applying a ceramic slurry onto a release film for manufacturing a ceramic green sheet; b) a step for forming a ceramic green sheet from the ceramic slurry applied in the a) step; c) a step for peeling off the ceramic green sheet formed in the b) step from the release film for manufacturing a ceramic green sheet; and d) a step for laminating a plurality of the ceramic green sheets peeled off in the c) step, wherein the release film for manufacturing a ceramic green sheet has a substrate and a release agent layer provided on at least one side of the substrate, and the sliding-down angle of diiodomethane on the surface on the opposite side of the release agent layer from the substrate is at most 33º.
B28B 1/30 - Producing shaped articles from the material by applying the material on to a core, or other moulding surface to form a layer thereon
B32B 7/06 - Interconnection of layers permitting easy separation
B32B 9/00 - Layered products essentially comprising a particular substance not covered by groups
H01G 13/00 - Apparatus specially adapted for manufacturing capacitorsProcesses specially adapted for manufacturing capacitors not provided for in groups
H01G 13/00 - Apparatus specially adapted for manufacturing capacitorsProcesses specially adapted for manufacturing capacitors not provided for in groups
17.
PACKAGING FILM, PACKAGING MATERIAL, AND FOOD PACKAGE
This packaging film (100) comprises: a biaxially stretched film layer (101) containing homopolypropylene; and a surface layer (A) (103) provided on at least one surface of the biaxially stretched film layer (101), wherein, when the total molar number of all monomer-derived constitutional units contained in the packaging film (100) is 100 mol%, the content of constitutional units derived from C2-C10 α-olefins (where the α-olefins exclude propylene) is 1.5-20.0 mol%.
A biaxially oriented polypropylene film (100) is provided with a biaxially oriented film layer (101) containing a propylene polymer, and has a crystal ratio of at least 38% at 165° C or lower, as determined by differential scanning calorimetry.
B65D 65/40 - Applications of laminates for particular packaging purposes
C08L 23/00 - Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bondCompositions of derivatives of such polymers
C08L 23/10 - Homopolymers or copolymers of propene
A biaxially stretched polypropylene film (100) comprising a biaxially stretched film layer (101) containing a propylene-based polymer, wherein the long period of crystals in the TD direction obtained by a small-angle X-ray scattering (SAXS) measurement is 28.0 nm or less.
B65D 65/40 - Applications of laminates for particular packaging purposes
C08L 23/00 - Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bondCompositions of derivatives of such polymers
C08L 23/10 - Homopolymers or copolymers of propene
Disclosed is a biaxially stretched polypropylene film (100) which comprises a biaxially stretched film layer (101) that contains a propylene polymer, and a surface resin layer (103) that is positioned on at least one surface of the biaxially stretched film layer (101) and contains a homopolypropylene (A), wherein the half-life of the saturated charged voltage as determined by the process described below is 1,300 seconds or less. (Process) A voltage is applied to the surface resin layer (103)-side surface of the biaxially stretched polypropylene film (100) for 30 seconds at an application voltage of 10 kV, a temperature of 23°C and a humidity of 50% RH, with the distance between the sample and the electrode being 20 mm, and the saturated charged voltage of the surface of the biaxially stretched polypropylene film (100) and the half-life of the saturated charged voltage are calculated in accordance with JIS L1094 (2014).
Provided is a stretched polyethylene film that contains, in the given order, the following: a high-density polyethylene layer 1 (101); a medium-density polyethylene layer (102); and a high-density polyethylene layer 2 (103). The stretched polyethylene film is configured so that the full-width at half-maximum (FWHM) of a peak is no more than 0.20 degrees, the peak being found on the basis of small-angle x-ray scattering (SAXS) measurement and being in a range in which an MD-direction diffraction angle ２θ is 0.2-0.4 degrees.
A packaging film comprising a biaxially oriented film layer (101) containing a propylene polymer, and a surface layer (A) (103) provided on at least one surface of the biaxially oriented film layer (101), the packaging film having an external haze of at least 2.0% as measured in accordance with JIS K7136(2000).
An oriented polyethylene film (100) comprising a high-density polyethylene layer 1 (101), a medium-density polyethylene layer (102), and a high-density polyethylene layer 2 (103) in this order, wherein the oriented polyethylene film has a crystal thickness of 16 nm or less in the MD direction as determined by small-angle X-ray scattering (SAXS) measurement.
A gas barrier coating material containing a polycarboxylic acid, a polyamine compound, and a Zn compound, wherein the value of (number of mol of Zn compound in the gas barrier coating material)/(number of mol of -COO- groups included in the polycarboxylic acid in the gas barrier coating material) is 0.40-0.70.
A gas barrier laminate comprising a substrate layer, a gas barrier layer provided on at least one surface of the substrate layer, and an inorganic substance layer provided between the substrate layer and the gas barrier layer, a composition ratio of Zn measured by X-ray photoelectron spectroscopy of the gas barrier layer is 1-10 atom%, when mass peak intensity of 6444H-measured through time-of-flight secondary ion mass spectroscopy of the gas barrier layer is denoted by I(6444H-3322 -3322 -), the value of I(6444H-3322 -) is 6×10-4to 5×10-2, a composition ratio of N measured through X-ray photoelectron spectroscopy of the gas barrier layer is higher than 0 atom% and lower than or equal to 12 atom%, and when mass peak intensity of CN-measured by time-of-flight secondary ion spectroscopy of the gas barrier layer is denoted by I(CN-), the value of I(CN-3322 -) is higher than 0 and equal to or lower 2.
Provided are a protective film and a back grinding method for a semiconductor wafer, which can suppress occurrence of suction defect. A protective film is a film that protects a surface of a semiconductor wafer on which a circuit is formed when a back surface of the semiconductor wafer is ground in a state where the surface of the semiconductor wafer is sucked to a fixture. The protective film has a pressure-sensitive adhesive layer, a base material layer, and an auxiliary layer. The pressure-sensitive adhesive layer is a layer to be stuck to the semiconductor wafer, the auxiliary layer is a layer to be contact to the fixture, and the semiconductor wafer is a semiconductor wafer having a level difference on an outer peripheral edge of the surface on which the circuit is formed.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
21211 between a silicon back surface-grinding support substrate made from borosilicate glass and the adhesive surface A is at least 1.1 as measured while keeping the angle between the separated layers at 10°.
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
A method for manufacturing an electronic device includes at least a preparing step of preparing a structure provided with an adhesive film provided with a base material layer, an adhesive resin layer (A) provided on a first surface side of the base material layer, an adhesive resin layer (B) provided on a second surface side of the base material layer, and an unevenness-absorbing resin layer (C) provided between the base material layer and the adhesive resin layer (A) or between the base material layer and the adhesive resin layer, and an electronic component attached to the adhesive resin layer (A) of the adhesive film and having an uneven structure, a cross-linking step of cross-linking the unevenness-absorbing resin layer (C) by applying an external stimulus to the unevenness-absorbing resin layer (C) in the structure, and a sealing step of sealing the electronic component with a sealing material.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
C09J 7/24 - PlasticsMetallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
Provided is a sealant film for a retort food packaging container in which heat resistance at a retort temperature and shock resistance at a low temperature are balanced at a high level beyond the limit of a conventional technology or a wide processable temperature range and shock resistance at a low temperature are balanced. The problem is solved by the sealant film for a retort food packaging container comprising a seal layer, a core layer, and a laminate layer each containing straight-chain polyethylene, wherein each of the layers has specific density and/or is polymerized by a specific catalyst, or has a specific heat melting ratio at 121℃.
The present invention provides a mold release film for processing, which enables the production of a resin-sealed semiconductor or the like with a high productivity that exceeds the limits of the prior art by having high deaeration properties, while maintaining properties such as excellent mold releasability, excellent appearance of molded articles and excellent followability to a mold, these properties having been required for mold release films for processing in the past, and achieving a good balance among these properties at high levels that exceed the limits of the prior art. The above are achieved by means of a mold release film for processing, which is provided with recesses and projections on at least one of two surfaces, wherein the developed interfacial area ratio (Sdr) of the surface that is provided with the recesses and projections is 4.0% to 50.0% as measured with a laser microscope.
Provided is a method for producing cellulose beads such as porous cellulose beads, the method further facilitating handling, washing, removal, etc., of a dispersion medium and enabling cellulose beads having a minute particle size and a narrow particle size distribution to be easily and inexpensively produced. This problem is solved by a cellulose bead production method comprising: a) a step for preparing a dispersion medium containing a surfactant and an organic solvent; b) a step for causing a cellulose-dissolved solution containing cellulose and an alkaline aqueous solution to contact the dispersion medium; and c) a step for adding an acid to an emulsion containing the cellulose-dissolved solution obtained in step b), wherein the organic solvent has a boiling point of 105°C or lower.
The present invention provides a method for producing cellulose beads wherein the particle size of the cellulose beads can be controlled more finely. The problem is solved by a method for producing cellulose beads that includes a) a step for preparing a dispersion medium including a surfactant and an organic solvent, b) a step for bringing a cellulose dissolved solution including an alkaline aqueous solution and cellulose into contact with the dispersion medium, and c) a step for adding an acid to an emulsion including the cellulose dissolved solution obtained in step b), the HLB value of the surfactant being 4.3-6.5.
A solar cell sealing material of the present invention is a solar cell sealing material that is used to seal a solar cell element and includes an ethylene.α-olefin copolymer, an organic peroxide (A) having a one-hour half-life temperature in a range of equal to or higher than 100° C. and equal to or lower than 130° C., and an organic peroxide (B) having a one-hour half-life temperature in a range of higher than 130° C. and equal to or lower than 160° C., and a ratio (X2/X1) of a content X2 of the organic peroxide (B) to a content X1 of the organic peroxide (A) in the solar cell sealing material is equal to or more than 0.05 and equal to or less than 1.10.
A gas barrier film formed of a cured product of a mixture including a polycarboxylic acid, a polyamine compound, and a polyvalent metal compound, in which in an infrared absorption spectrum of the gas barrier film, an area ratio of an amide bond represented by B/A is equal to or less than 0.380, an area ratio of a carboxylic acid represented by C/A is equal to or less than 0.150, and an area ratio of carboxylate represented by D/A is equal to or more than 0.520.
B05D 3/02 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
B05D 3/04 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
B05D 7/00 - Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
B05D 7/24 - Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
B65D 65/42 - Applications of coated or impregnated materials
C08G 69/26 - Polyamides derived from amino carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
Provided is a back grinding adhesive film that is used to protect the surface of a wafer. This adhesive film includes a substrate layer and an adhesive resin layer provided on one side of the substrate layer and composed of a UV-curable adhesive resin material. The UV-curable adhesive resin material satisfies property (A) below, when the viscoelastic properties thereof are measured by following steps (i) and (ii) below. [Step] (i) A film having a thickness of 0.2 mm is formed by using a UV-curable adhesive resin material. The film is irradiated with ultraviolet rays having a dominant wavelength of 365 nm by using a high-pressure mercury lamp, under an environment of 25℃, with an irradiation intensity of 100 W/cm2and an ultraviolet level of 1080 mJ/cm2, so that the film is cured by the ultraviolet rays to obtain a cured film. (ii) The dynamic viscoelasticity of the cured film is measured at a frequency of 1 Hz, in a tensile mode, and in a temperature range of -50 to 200℃. [Property] (A) The loss tangent tan δ at -5℃ is 0.25-0.85.
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
A method for producing an electronic device, the method comprising at least: a step (A) for preparing a structure that is provided with a wafer having a circuit formation surface and an adhesive film that is bonded to a circuit formation surface side of an electronic component; a step (B) for back-grinding a surface of the wafer, the surface being on the reverse side from the circuit formation surface; and a step (C) for irradiating the adhesive film with ultraviolet light, and subsequently removing the adhesive film from the wafer. The adhesive film comprises: a base material layer; and an ultraviolet curable adhesive resin layer which is formed on one surface of the base material layer with use of an ultraviolet curable adhesive resin material. With respect to the step (C), the loss tangent tanδ at -5°C of the adhesive resin layer of the adhesive film after irradiation of ultraviolet light is from 0.25 to 0.85 as determined under the conditions described below. (Conditions: The dynamic viscoelasticity is measured at a frequency of 1 Hz in a tensile mode over a temperature range from -50°C to 200°.)
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
This method for producing an electronic device includes at least a step (A) of preparing a structure that is provided with a wafer having a circuit-forming surface and an adhesive film affixed on the circuit-forming surface side of the wafer, a step (B) of backgrinding a surface of the wafer on the opposite side from the circuit-forming surface, and a step (C) of irradiating the adhesive film with UV light and then removing the adhesive film from the wafer, wherein the adhesive film is provided with a base material layer and an adhesive resin layer that is provided on one surface side of the base material layer and is constituted by a UV-curable adhesive resin material, and the UV-curable adhesive resin material, when the viscoelastic properties thereof are measured according to the below procedures (i) and (ii), has a storage modulus E' (100°C) at 100°C of 1.0×106to 3.5×107Pa, and E'(100℃)/E'(-15°C) equals 2.0×10-3to 1.5×10-2. [Procedures] (i) A film having a film thickness of 0.2 mm is formed using the UV-curable adhesive resin material, and the film is irradiated and UV-cured in a 25°C environment, by using a high-pressure mercury lamp to irradiate UV light having a dominant wavelength of 365 nm at an irradiation intensity of 100 W/cm2and a UV dose of 1080 mJ/cm2, whereby a cured film is obtained. (ii) The dynamic viscoelasticity of the cured film is measured in a temperature range of -50 to 200°C at a frequency of 1 Hz in a tensile mode.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
A method for producing an electronic device which is provided with a step for preparing a structure equipped with a wafer having a circuit formation surface, and an adhesive film stuck to the circuit formation surface side of the wafer, a step for backgrinding the surface of the wafer on the side thereof opposite the circuit formation surface, and a step for irradiating the adhesive film with ultraviolet rays, and thereafter, removing the adhesive film from the wafer, wherein: the adhesive film is equipped with a substrate layer, and an adhesive resin layer provided on one surface of the substrate layer and comprising an ultraviolet ray-curable adhesive resin material; the storage elastic modulus E' (5°C) at 5°C after curing by ultraviolet radiation is 2.0×106to 2.0×109Pa; and the storage elastic modulus E' (100°C) at 100°C is 1.0×106to 3.0×107Pa.
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
This method for producing an electronic device at least includes: a step (A) for preparing a structure comprising a wafer which has a circuit-forming surface and an adhesive film stuck on the circuit-forming surface side of the wafer; a step (B) for backgrinding the surface on the side opposite to the circuit-forming surface side of the wafer; and a step (C) for irradiating the adhesive film with UV light and thereafter removing the adhesive film from the wafer. The adhesive film comprises: a base layer; and an adhesive resin layer which is provided on one side of the base layer and which is composed of a UV-curable adhesive resin material. In step (C), E'(100°C), which is the storage elastic modulus at 100°C of the adhesive resin layer of the adhesive film after being irradiated with UV light, is 1.0 × 106to 3.5 × 107Pa when measured under the condition shown below, and E'(100°C)/E'(-15°C) is 2.0 × 10-3to 1.5 × 10-2. (Condition) The dynamic viscoelasticity is measured in tensile mode at a frequency of 1 Hz and in the temperature range from -50°C to 200°C.
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
A method for producing an electronic device, the method comprising at least: a step (A) for preparing a structure that is provided with a wafer having a circuit formation surface and an adhesive film that is bonded to the circuit formation surface side of the wafer; a step (B) for back-grinding a surface of the wafer, the surface being on the reverse side from the circuit formation surface; and a step (C) for irradiating the adhesive film with ultraviolet light, and subsequently removing the adhesive film from the wafer. Meanwhile, the adhesive film comprises: a base material layer; and an ultraviolet curable adhesive resin layer which is formed on one surface of the base material layer with use of an ultraviolet curable adhesive resin material. The loss tangent tanδ at -5°C of a cured film of the ultraviolet curable adhesive resin material as determined by the procedure described below is from 0.25 to 0.85. [Procedure]: (i) A film having a film thickness of 0.2 mm is formed with use of an ultraviolet curable adhesive resin material; and the film is irradiated with ultraviolet light having a main wavelength of 365 nm at an irradiation intensity of 100 W/cm2at an ultraviolet dose of 1,080 mJ/cm2 with use of a high pressure mercury lamp in an environment of 25°C, thereby obtaining a cured film by means of ultraviolet curing. (ii) The dynamic viscoelasticity of the cured film is measured at a frequency of 1 Hz in a tensile mode over a temperature range from -50°C to 200°C.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
Provided is an adhesive film for backgrinding, the adhesive film being used to protect the surface of a wafer, and comprising a base material layer and an adhesive resin layer that is provided on one side of the base material layer and constituted from a UV-curable adhesive resin material. Here, in the UV-curable adhesive resin material, E'(100°C) is 1.0×106to 3.5 ×107Pa, and E'(100°C)/E'(-15°C) is 2.0×10-3to 1.5 ×10-2, where E'(-15°C) is the storage modulus at -15°C and E'(100°C) is the storage modulus at 100°C when the elasticity characteristics of the UV-curable adhesive resin material are measured by procedures (i) and (ii). [Procedures] (i) A film having a thickness of 0.2 mm is formed using the UV-curable adhesive resin material, and the film is UV-cured by irradiation with ultraviolet rays having a dominant wavelength of 365 nm at an irradiation intensity of 100 W/cm2and an ultraviolet quantity of 1080 mJ/cm2 using a high-pressure mercury lamp. (ii) The dynamic viscoelasticity of the cured film is measured at a frequency of 1 Hz in tensile mode at a temperate in the range of -50-200°C.
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
A method for producing an electronic device, the method comprising at least: a step (A) for preparing a structure that is provided with a wafer having a circuit formation surface and an adhesive film that is bonded to the circuit formation surface side of the wafer; a step (B) for back-grinding a surface of the wafer, the surface being on the reverse side from the circuit formation surface; and a step (C) for irradiating the adhesive film with ultraviolet light, and subsequently removing the adhesive film from the wafer. With respect to this method for producing an electronic device, the adhesive film comprises a base material layer, and an adhesive resin layer which is formed of an ultraviolet curable adhesive resin material on one surface of the base material layer; with respect to the step (C), the storage elastic modulus at 5°C (E'(5°C)) of the adhesive resin layer of the adhesive film after irradiation of ultraviolet light is 2.0 × 106Pa to 2.0 × 109Pa, and the storage elastic modulus at 100°C (E'(100°C)) thereof is 1.0 × 106Pa to 3.0 × 107 Pa, as determined under the conditions described below. (Conditions) The dynamic viscoelasticity is measured at a frequency of 1 Hz in a tensile mode over a temperature range from -50°C to 200°.
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
45.
ADHESIVE FILM FOR BACKGRINDING AND PRODUCTION METHOD FOR ELECTRONIC DEVICE
An adhesive film that is for backgrinding and that is used to protect a surface of a wafer, the film comprising: a base layer; and an adhesive resin layer that is provided on one surface of the base layer and that is made of a UV curable adhesive resin material, wherein, when viscoelasticity characteristics of the UV curable adhesive resin material is measured after the UV curable adhesive resin material is cured by irradiation with UV, the storage modulus E' (5°C) is 2.0×106to 2.0×109Pa at 5°C, and the storage modulus E' (100°C) is 1.0×106to 3.0×107 Pa at 100°C.
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
A packaging body configured with a packaging film, in which the outermost layer is a polyethylene-based resin layer and the polyethylene-based resin layer is uniaxially or biaxially stretched.
B65D 75/00 - Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes or webs of flexible sheet material, e.g. in folded wrappers
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
This adhesive resin film is provided with a base material layer, a concavo-convex absorptive resin layer, and an adhesive resin layer in this order, and is used to protect a circuit forming surface of an electronic component. The concavo-convex absorptive resin layer has a minimum value G'bmin of a storage elastic modulus G'b of 0.001 MPa or more and less than 0.1 MPa at 25°C or more and less than 250°C and has a storage elastic modulus G'b250 of 0.005 MPa to 0.3 MPa, inclusive, at 250°C.
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
A method for manufacturing an electronic device includes at least a step (1) of preparing a structure comprising (i) an adhesive film provided with a base material layer, an adhesive resin layer (A) provided on a first surface side of the base material layer, and an adhesive resin layer (B) provided on a second surface side of the base material layer, (ii) an electronic component attached to the adhesive resin layer (A) of the adhesive film, and (iii) a support substrate attached to the adhesive resin layer (B) of the adhesive film; a step (2) of sealing the electronic component with a sealing material; a step (3) of peeling the support substrate from the structure by reducing an adhesive force of the adhesive resin layer (B) by applying an external stimulus; and a step (4) of peeling the adhesive film from the electronic component.
21211 between the support (A) and the adhesive layer (B), measured while the angles formed between the mutually separated layers are maintained at 10°, is 1.1 or more.
21122 between the adhesive layer (B)/the workpiece (C) is at least 1.1, the 10° peel strength being measured by maintaining the angle formed between the peeled layers at 10°.
The purpose of the present invention is to provide a component manufacturing method of high assessment efficiency, and a component manufacturing film and a component manufacturing tool that are for use in the component manufacturing method. This method comprises: a step for arranging a plurality of electronic components on a support having a substrate and a holding layer with electrodes of the electronic components exposed via the holding layer; and a step for simultaneously performing energization assessment for electrical characteristics of 80 or more of the electronic components arranged on the support by bringing a probe into contact with all or some of the exposed electrodes. The component manufacturing film comprises a resin base layer, a holding layer provided to one surface side of the resin base layer, and a joint layer provided to the opposite surface side of the resin base layer so as to join the component manufacturing film to the substrate. The component manufacturing tool comprises a substrate and a holding layer provided to one surface of the substrate.
H01L 21/66 - Testing or measuring during manufacture or treatment
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
G01R 31/26 - Testing of individual semiconductor devices
52.
REAR SURFACE GRINDING METHOD FOR WAFER AND ELECTRONIC DEVICE PRODUCTION METHOD
The present invention addresses the problem of providing a rear surface grinding method for a wafer, in which the rear surface of a wafer is ground such that the impact of recesses and protrusions on the front surface of the wafer can be suppressed and in which handling after wafer thinning is improved. The present problem is solved by a rear surface grinding method for a wafer having recesses and protrusions on the front surface thereof, the rear surface grinding method for a wafer being characterized by comprising, prior to rear surface grinding of the wafer, a step (1) for forming a protective layer on the front surface of the wafer, a step (2) for flattening the surface of the protective layer that is not in contact with the wafer, and a step (3) for adhering a support to the surface of the protective layer that is not in contact with the wafer, with an adhesive layer therebetween.
B23D 5/02 - Planing or slotting machines cutting otherwise than by relative movement of the tool and workpiece in a straight line involving rotary and straight-line movements only, e.g. for cutting helical grooves
B24B 7/04 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfacesAccessories therefor involving a rotary work-table
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
53.
PACKAGING FILM, PACKAGE, AND METHOD OF MANUFACTURING LAMINATED FILM
Provided is a packaging film including: a substrate layer that includes polyethylene; and a coating layer that includes a resin and is provided in contact with one surface of the substrate layer or is provided over one surface of the substrate layer through an anchor coat layer. In one preferable aspect of the packaging film, when a glass transition temperature of the coating layer is represented by Tgc and a glass transition temperature of the substrate layer is represented by Tgs, a value of Tgc is −25° C. to 120° C. and a value of Tgc-Tgs is 90° C. to 245° C.
B65D 65/42 - Applications of coated or impregnated materials
B05D 3/02 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
B05D 7/04 - Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber to surfaces of films or sheets
An adhesive film includes a base material layer, an adhesive resin layer (A) provided on a first surface side of the base material layer, and an adhesive resin layer (B) provided on a second surface side of the base material layer and of which an adhesive force is reduced by an external stimulus. When a mass of the adhesive film after heating and drying at 130° C. for 30 minutes is defined as W1 and the mass of the adhesive film after the heated and dried adhesive film is left for 24 hours at 25° C. under an atmosphere of 50% RH to absorb water is defined as W2, an average water absorption rate indicated by 100×(W2−W1)/W1 is 0.90% by mass or less.
C09J 7/25 - PlasticsMetallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
The present invention addresses the problem of blending an antibacterial and antiviral component, which contains stearyl diethanolamine, in a resin molded body with high uniformity and stability exceeding the limits of prior arts. The problem is solved by the resin molded body containing a polymer resin, stearyl diethanolamine and palmityl diethanolamine, wherein the content of the palmityl diethanolamine is 2-25 parts by mass with respect to 100 parts by mass of the total amount of the stearyl diethanolamine and the palmityl diethanolamine, and the polymer resin contains polyolefin or polyamide.
C08L 23/00 - Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bondCompositions of derivatives of such polymers
C08L 77/00 - Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chainCompositions of derivatives of such polymers
A method for manufacturing an electronic device includes at least a preparing step of preparing a structure provided with an adhesive film provided with a base material layer, an adhesive resin layer (A) provided on a first surface side of the base material layer, an adhesive resin layer (B) provided on a second surface side of the base material layer and in which an adhesive force is reduced by external stimuli, and an unevenness-absorbing resin layer (C) provided between the base material layer and the adhesive resin layer (A) or between the base material layer and the adhesive resin layer (B), an electronic component attached to the adhesive resin layer (A) of the adhesive film and having an uneven structure, and a support substrate attached to the adhesive resin layer (B) of the adhesive film; and a sealing step of sealing the electronic component with a sealing material.
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
B32B 37/12 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
Provided are a film for manufacturing semiconductor component, a film for electronic component manufacture, a method for manufacturing a semiconductor component using such a film for manufacturing semiconductor component, and a method for manufacturing an electronic component using such a film for electronic component manufacture. The film for component manufacture includes a base layer and an adhesive layer provided on one surface side of the base layer, and the Ra (μm) of the surface of one side of the base layer on which the adhesive layer is not provided is 0.1 to 2.0, and the Rz (μm) is 1.0 to 15. The method using the film for component manufacture includes a segmenting step, a pickup step, and an evaluation step prior to the pickup step.
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
B32B 43/00 - Operations specially adapted for layered products and not otherwise provided for, e.g. repairingApparatus therefor
G01R 1/04 - HousingsSupporting membersArrangements of terminals
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
Described is an affixing apparatus capable of flattening a surface of a film affixed to a main surface of a plate-shaped body. An affixing apparatus for affixing the film to the plate-shaped body includes: a plate-shaped mounting member provided with a mounting portion on which the plate-shaped body is mounted; a plate-shaped pressing member installed at a position facing the mounting member; and a support member installed at an outer edge of the mounting portion so as to be positioned between the mounting member and the pressing member.
B32B 37/10 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using direct action of vacuum or fluid pressure
B32B 37/12 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
60.
Protection film, method for affixing same, and method for manufacturing semiconductor component
Provided are a method for affixing a protective film, a method for manufacturing a semiconductor component, and a protective film for use in the affixing method, which are capable of suppressing occurrence of a failure caused by a step on a main surface of a semiconductor wafer. The affixing method includes: an arrangement step of arranging a protective film so as to cover a main surface A of a semiconductor wafer; and an affixing step of pressing the protective film against the main surface to affix the protective film to the main surface. The affixing step includes a compression step of compressing the protective film in a thickness direction thereof.
B32B 37/10 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using direct action of vacuum or fluid pressure
B32B 37/12 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
The present invention provides a multilayer film which has a thermally fusible layer, and which exhibits: high impact resistance that is suitable for cover materials for plastic containers or the like; excellently easy openability if combined with an adherend such as a plastic container; and the like. The above are achieved by means of a multilayer film which comprises a thermally fusible layer, an intermediate layer and a laminate layer, wherein a specific amount of a low-density polyethylene that is derived from biomass is contained in a specific layer.
The present invention provides polyethylene-based multilayer films which are suitable for use for packaging bags and the like, and specifically provides: a multilayer film which exhibits excellent tearability, while maintaining excellent characteristics such as mechanical strength and blocking resistance; a multilayer film which has further improved mechanical strength such as Young's modulus, while maintaining excellent characteristics such as blocking resistance; and a multilayer film which exhibits excellent blocking resistance and excellent lamination strength with respect to an outer film, while maintaining excellent characteristics such as sealing strength and impact resistance. The above are achieved by means of a multilayer film which comprises (A) a thermally fusible layer, (B) an intermediate layer and (C) a laminate layer, said layers respectively containing a petroleum-derived linear low density polyethylene, wherein at least one of (A) the thermally fusible layer, (B) the intermediate layer and (C) the laminate layer contains a plant-derived biomass polyethylene.
The present invention addresses the problem of providing high-impact strength laminated film and sheet that have high visible light transparency and that are colorable quite freely, using highly oriented polyolefin film and sheet. The problem is solved by laminated film and sheet that are each provided with an orientated layer A comprising a polyolefin resin and having the degree of orientation of 30% or more in the direction of the principal orientation axis, and an orientated layer B comprising a polyolefin resin and having the degree of orientation of 30% or more in the direction of the principal orientation axis. The laminated film and sheet each have a visible light transmittance of 1.5% or more. An angle formed by the principal orientation axis of the orientated layer A and the principal orientation axis of the orientated layer B is 20-160°.
B29C 65/06 - Joining of preformed partsApparatus therefor by heating, with or without pressure using friction, e.g. spin welding
B29C 65/08 - Joining of preformed partsApparatus therefor by heating, with or without pressure using ultrasonic vibrations
B29C 65/20 - Joining of preformed partsApparatus therefor by heating, with or without pressure using heated tool with direct contact, e.g. using "mirror"
B32B 7/03 - Layered products characterised by the relation between layers Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties Layered products characterised by the interconnection of layers with respect to the orientation of features
64.
Gas barrier polymer and gas barrier laminate using same
A method for producing an electronic device comprising at least: a step (A) for preparing a structure (100) which is provided with an electronic component (30) that has a circuit formation surface (30A), and an adhesive film (50) that is bonded to the circuit formation surface (30A) side of the electronic component (30); a step (B) for back grinding the surface of the electronic component (30) on the reverse side of the circuit formation surface (30A); and a step (C) for removing the adhesive film (50) from the electronic component (30) after irradiating the adhesive film (50) with UV rays. The adhesive film (50) comprises a base material layer (10) and a UV curable adhesive resin layer (20) that is provided on one surface of the base material layer (10), and the 60° peel strength of the adhesive film (50) in step (C), as measured using the following method, after being irradiated with UV rays is 0.4N/25mm to 5.0N/25mm, inclusive. (Method) A tensile testing machine is used to peel the adhesive film (50), which has been irradiated with UV rays, from the electronic component (30) at 23°C and a speed of 150 mm/min in a 60° direction, and the strength (N/25mm) at that time serves as the 60° peel strength.
C09J 133/06 - Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
An adhesive film (50) that is for back grinding, is used for protecting the surface of an electronic component (30), and comprises a base material layer (10) and a UV ray curable adhesive resin layer (20) provided on one surface of the base material layer (10), wherein the 60° peel strength of the adhesive film (50), as measured using the following method, after being irradiated with UV rays is 0.4N/25mm to 5.0N/25mm, inclusive. (Method) The adhesive film (50) is affixed to a silicon mirror wafer so that the adhesive resin layer (20) is in contact with the silicon mirror wafer. Subsequently, a high-pressure mercury lamp is used to irradiate the adhesive film (50) in an environment of 25°C with UV rays having a main wavelength of 365nm at an irradiation intensity of 100 mW/cm2and a UV ray amount of 1,080 mJ/cm2, thereby UV curing the adhesive resin layer (20). Then, a tensile testing machine is used to peel the adhesive film (50) from the silicon mirror wafer at 23°C and a speed of 150 mm/min in a 60° direction, and the strength (N/25mm) at that time serves as the 60° peel strength.
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
A method for producing an electronic device comprising at least: a step (A) for preparing a structure (100) which is provided with an electronic component (30) that has a circuit formation surface (30A), and an adhesive film (50) that is bonded to the circuit formation surface (30A) side of the electronic component (30); a step (B) for back grinding the surface of the electronic component (30) on the reverse side of the circuit formation surface (30A); and a step (C) for removing the adhesive film (50) from the electronic component (30) after irradiating the adhesive film (50) with UV rays. The adhesive film (50) comprises a base material layer (10) and a UV curable adhesive resin layer (20) that is provided on one surface of the base material layer (10), and the 60° peel strength of the adhesive film (50), as measured using the following method, after being irradiated with UV rays is 0.4N/25mm to 5.0N/25mm, inclusive. (Method) The adhesive film (50) is affixed to a silicon mirror wafer so that the adhesive resin layer (20) is in contact with the silicon mirror wafer. Subsequently, a high-pressure mercury lamp is used to irradiate the adhesive resin layer (20) in an environment of 25°C with UV rays having a main wavelength of 365nm at an irradiation intensity of 100 mW/cm2and a UV ray amount of 1,080 mJ/cm2, thereby UV curing the adhesive resin layer (20). Then, a tensile testing machine is used to peel the adhesive film (50) from the silicon mirror wafer at 23°C and a speed of 150 mm/min in a 60° direction, and the strength (N/25mm) at that time serves as the 60° peel strength.
C09J 133/06 - Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
The present invention provides: a protective film which is capable of suppressing the occurrence of an adsorption failure; and a back grinding method for a semiconductor wafer. This protective film 30 protects a surface 11, on which a circuit has been formed, of a semiconductor wafer 10 when a back surface 12 of the semiconductor wafer 10 is ground, while having the surface 11 adsorbed onto a fixture 41. The protective film 30 comprises an adhesive layer 33, a base material layer 31 and an auxiliary layer 32. The adhesive layer 33 is bonded to the semiconductor wafer 10, while the auxiliary layer 32 comes into contact with the fixture 41. The semiconductor wafer 10 has a level difference 13 in the outer peripheral edge of the surface 11 on which circuit has been formed.
B24B 7/22 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfacesAccessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
B24B 41/06 - Work supports, e.g. adjustable steadies
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
A method for producing an electronic device comprising at least: a step (A) for preparing a structure (100) which is provided with an electronic component (30) that has a circuit formation surface (30A) and an adhesive film (50) that is bonded to the circuit formation surface (30A) of the electronic component (30); a step (B) for back grinding a surface of the electronic component (30), said surface being on the reverse side of the circuit formation surface (30A); and a step (C) for removing the adhesive film (50) from the electronic component (30) after irradiating the adhesive film (50) with ultraviolet light. With respect to this method for producing an electronic device, the adhesive film (50) comprises a base material layer (10) and an ultraviolet curable adhesive resin layer (20) that is provided on one surface of the base material layer (10), and the elongation at break of the adhesive resin layer (20) after being irradiated with ultraviolet light with the ultraviolet dose of 1,080 mJ/cm2 is from 20% to 200%.
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
B23K 26/53 - Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
C09J 7/10 - Adhesives in the form of films or foils without carriers
A method for producing an electronic device comprising at least: a step (A) for preparing a structure (100) which is provided with an electronic component (30) that has a circuit formation surface (30A) and an adhesive film (50) that is bonded to the circuit formation surface (30A) of the electronic component (30); a step (B) for back grinding a surface of the electronic component (30), said surface being on the reverse side of the circuit formation surface (30A); and a step (C) for removing the adhesive film (50) from the electronic component (30) after irradiating the adhesive film (50) with ultraviolet light. With respect to this method for producing an electronic device, the adhesive film (50) comprises a base material layer (10) and an ultraviolet curable adhesive resin layer (20) that is provided on one surface of the base material layer (10), and the elongation at break of the adhesive resin layer (20) after being irradiated with ultraviolet light in the step (C) is from 20% to 200%.
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
B23K 26/53 - Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
Provided is an adhesive laminated film (50) used to protect circuit-forming surfaces of electronic components, the adhesive laminated film (50) comprising a base layer (20), a concave-convex absorbent resin layer (30), and an adhesive resin layer (40) in this order, wherein the concave-convex absorbent resin layer (30) contains an ethylene-based copolymer having a melting point of 40-80°C and a crosslinking agent, and the content of the crosslinking agent in the concave-convex absorbent resin layer (30) is 0.06-0.60 parts by mass with respect to 100 parts by mass of the ethylene-based copolymer.
A back-grinding adhesive film (50) is used for protecting the surface of an electronic component (30) and comprises a substrate layer (10) and an ultraviolet-ray curable adhesive resin layer (20) that is disposed on one surface of the substrate layer (10). The back-grinding adhesive film (50) is configured so that the elongation-to-break of the adhesive resin layer (20) after ultraviolet-ray curing is 20-200%.
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
A method for producing an electronic device, said method comprising at least: a preparation step for preparing a structure (100) which is provided with a base material layer (10), an adhesive film (50) that comprises an adhesive resin layer (A) which is provided on a first surface (10A) side of the base material layer (10) for the purpose of provisionally affixing an electronic component (70), an adhesive resin layer (B) which is provided on a second surface (10B) side of the base material layer (10), and a relief absorbing resin layer (C) which is provided between the base material layer (10) and the adhesive resin layer (A) or between the base material layer (10) and the adhesive resin layer (B), while being able to be crosslinked by means of an external stimulus, and an electronic component (70) that is bonded to the adhesive resin layer (A) of the adhesive film (50), while having a relief structure (75); a crosslinking step for crosslinking the relief absorbing resin layer (C) in the structure (100) by applying an external stimulus to the relief absorbing resin layer (C); and a sealing step for sealing the electronic component (70) by means of a sealing material (60).
The present invention provides: a solar cell sealing material sheet which is mainly composed of a polyolefin resin, and which enables a solar cell module that uses this solar cell sealing material sheet to be effectively suppressed in the formation of air bubbles or bulges at high temperatures; and a method for producing this solar cell sealing material sheet. The above are achieved by means of a method for producing a solar cell sealing material sheet, said method comprising: a step wherein crosslinkable resin pellets are produced by impregnating pellets, which are mainly composed of a polyolefin resin, with a crosslinking agent and a crosslinking assistant; a step wherein the crosslinkable resin pellets are fed into a cylinder through a supply port of an extrusion molding machine, and a resin composition containing the polyolefin resin, the crosslinking agent and the crosslinking assistant is melted and kneaded in the cylinder; and a step wherein the resin composition is extrusion molded into a sheet through a die of the extrusion molding machine. With respect to this method for producing a solar cell sealing material sheet, the crosslinking agent contains a compound that has two or more alkylperoxy groups represented by formula (1) in the structure; and the crosslinking assistant contains triallyl isocyanurate. (1): R1-OO- (In the formula, R1 represents an alkyl group having from 1 to 6 carbon atoms.)
C08L 23/00 - Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bondCompositions of derivatives of such polymers
The present invention provides a multilayer mold release film which has excellent physical properties such as breaking resistance, followability, mold releasability, lateral surface biting prevention and cushioning layer bleeding suppression. The above are achieved by means of a multilayer mold release film that is obtained by irradiating a multilayer film, which comprises a mold release layer A containing a non-crosslinkable resin and a radical scavenger and a resin layer B containing an ethylene polymer, with an electron beam, thereby crosslinking the resin layer B, wherein the contact angle with water of the mold release layer A after the electron beam irradiation is from 90° to 130°.
Provided is a release film that is used in the joining of electronic components through thermal compression bonding, wherein: the release film is provided with a heat-resistant resin layer (A) and a release layer (B) that contains a fluorine-based resin and that is disposed on one surface of the heat-resistant resin layer (A); the thickness of the heat-resistant resin layer (A) is less than 25μm; the thickness of the release layer (B) is 5μm or less; and the thickness of the release film is less than 25μm.
H01L 21/603 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation involving the application of pressure, e.g. thermo-compression bonding
H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
77.
SUCTIONING ASSISTANCE FILM AND METHOD FOR SUCTIONING SEMICONDUCTOR WAFER
The present invention addresses the problem of providing: a suctioning assistance film capable of suppressing the occurrence of a suctioning failure; and a method for suctioning a semiconductor wafer. As the solution to the problem, a suctioning assistance film 30 interposed between a fixture 41 and a semiconductor wafer 10 when a non-polished surface 11, on which the circuit of the semiconductor wafer 10 is formed, is suctioned to the fixture 41, has: a base material layer 31 adhered to the non-polished surface 11 side on which the circuit is formed; and an assistance layer 32 that is brought into contact with the fixture 41 in a state of being supported by the base material layer 31 and assists the suctioning.
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
C09J 7/25 - PlasticsMetallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
Provided is a release film that is used in joining electronic components that have a non-conductive adhesive film therebetween by means of heating and pressing, said release film comprising a metal layer (A), and a release layer (B) that is disposed on one surface of the metal layer (A) and contains a fluororesin.
B32B 15/082 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising vinyl resinsLayered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising acrylic resins
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
H01L 21/603 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation involving the application of pressure, e.g. thermo-compression bonding
H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
Provided is a method for producing an electronic device, comprising: a preparation step (A) for preparing a structure (60) which is provided with an electronic part (10) having a circuit formation surface (10A) and an adhesive laminated film (50) having, in this order, a base material layer (20) that includes one polyester-based resin layer, an unevenness absorption resin layer (30) that is ultraviolet-curable, and an adhesive resin layer (40), and in which the adhesive laminated film (50) is affixed to the circuit formation surface (10A) of the electronic part (10) so as to protect the circuit formation surface (10A); an ultraviolet curing step (B) for irradiating the adhesive laminated film (50) with ultraviolet rays so as to cure the unevenness absorption resin layer (30) of the adhesive laminated film (50); and a surface treatment step (C) for treating, under vacuum and with application of heat, the surface of the electronic part (10) on the opposite side from the circuit formation surface (10A).
C08J 3/28 - Treatment by wave energy or particle radiation
C09J 201/02 - Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
A component manufacturing method includes a step of obtaining a holding tool. The holding tool includes: a frame body having an opening; and a holding film placed on the frame body. The step is a step of placing the holding film on the frame body while stretching the holding film in at least three different directions or in all directions to the frame body. The holding film includes a base layer and a holding layer. The holding tool forming device includes: a mechanism that pushes a plain film from a base layer side to bring about a stretched state; a mechanism that fixes the plain film to the frame body such that the stretched state is maintained; and a mechanism that isolates an unnecessary portion from the plain film to obtain the holding film.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
C09J 7/25 - PlasticsMetallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
81.
Coating material for gas barrier, gas barrier film, and laminated body
A coating material for a gas barrier includes polycarboxylic acid, a polyamine compound, a polyvalent metal compound, and a base, in which (molar number of —COO— groups included in the polycarboxylic acid)/(molar number of amino groups included in the polyamine compound)=100/20 to 100/90.
B32B 27/06 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance
B32B 37/06 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
C08J 7/16 - Chemical modification with polymerisable compounds
C09D 4/06 - Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups
C09D 5/00 - Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects producedFilling pastes
This gas barrier film is constituted from a cured product of a mixture containing a polycarboxylic acid, a polyamine compound and a polyvalent metal compound. In an infrared absorption spectrum of the gas barrier film, if A denotes the total peak area within an absorption band of 1493 cm-1- 1780 cm-1, B denotes the total peak area within an absorption band of 1598 cm-1- 1690 cm-1, C denotes the total peak area within an absorption band of 1690 cm-1- 1780 cm-1and D denotes the total peak area within an absorption band of 1493 cm-1- 1598 cm-1, the amide bond area ratio represented by B/A is 0.380 or less, the carboxylic acid area ratio represented by C/A is 0.150 or less, and the carboxylate area ratio represented by D/A is 0.520 or more.
B05D 3/00 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
B05D 5/00 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
B05D 7/00 - Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
B05D 7/24 - Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
B32B 9/00 - Layered products essentially comprising a particular substance not covered by groups
C09D 133/02 - Homopolymers or copolymers of acidsMetal or ammonium salts thereof
C09D 177/00 - Coating compositions based on polyamides obtained by reactions forming a carboxylic amide link in the main chainCoating compositions based on derivatives of such polymers
A method for manufacturing electronic apparatus includes: a step (A) of preparing a structure provided with an adhesive film and one or two or more electronic components affixed to an adhesive surface of the adhesive film; a step (B) of disposing the structure in the electronic component testing apparatus such that the electronic component is positioned over an electronic component installation region of a sample stand of the electronic component testing apparatus in a defined manner; a step (C) of evaluating the properties of the electronic component in a state of being affixed to the adhesive film with the probe terminal being in contact with a terminal of the electronic component; and a step (D) of picking up the electronic component from the adhesive film after the step (C). A defined sample stand is also provided.
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 23/12 - Mountings, e.g. non-detachable insulating substrates
85.
Adhesive film and method for manufacturing electronic device
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
A barrier laminate film (100) of the present invention includes: a base material layer (101), a stress relaxation layer (102), an inorganic material layer (103), and a barrier resin layer (104) in this order. The barrier resin layer (104) includes an amide cross-linked compound of a polycarboxylic acid and a polyamine, and the stress relaxation layer (102) includes a polyurethane-based resin having an aromatic ring structure in a main chain.
B32B 37/24 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
Provided is a packaging body (10) composed of a packaging film, wherein the outermost layer of the packaging body is a polyethylene-based resin layer, and the polyethylene-based resin layer is stretched uniaxially or biaxially.
Provided is a film for manufacturing a semiconductor part in which an evaluation step accompanied with a temperature change, a segmenting step, and a pickup step can be commonly performed, a method for manufacturing a semiconductor part, a semiconductor part, and an evaluation method. The film includes a base layer, and an adhesive layer disposed on one surface side of the base layer, wherein the ratio RE (=E′(160)/E′(−40)) of the elastic modulus of the base layer at 160° C. to the elastic modulus of the base layer at −40° C. is RE≥0.01, and the elastic modulus E′(−40) is 10 MPa to less than 1000 MPa. The method includes bonding the adhesive layer to a back surface of a semiconductor wafer, separating the semiconductor wafer into segments to obtain semiconductor parts, and separating the semiconductor parts from the adhesive layer, and includes a step of evaluating.
H01L 21/00 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid-state devices, or of parts thereof
C09J 7/25 - PlasticsMetallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
C09J 7/20 - Adhesives in the form of films or foils characterised by their carriers
C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
C09J 133/08 - Homopolymers or copolymers of acrylic acid esters
C09J 133/12 - Homopolymers or copolymers of methyl methacrylate
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
The method for manufacturing an electronic device includes at least: a step of preparing a structure provided with an adhesive film provided with a base material layer, an adhesive resin layer (A) provided on a first surface side of the base material layer and for temporarily fixing an electronic component, and an adhesive resin layer (B) provided on a second surface side of the base material layer and in which an adhesive force is decreased by an external stimulus, an electronic component attached to the adhesive resin layer (A) of the adhesive film, and a support substrate attached to the adhesive resin layer (B) of the adhesive film; at least one step selected from a step of decreasing water content in the adhesive film and a step of decreasing water content in the structure; and a step of sealing the electronic component with a sealing material.
B32B 37/06 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
B32B 37/12 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
B32B 37/18 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
C09J 5/00 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers
C09K 3/10 - Materials not provided for elsewhere for sealing or packing joints or covers
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
H01L 23/00 - Details of semiconductor or other solid state devices
A method for producing an electronic device, which comprises at least: a step (1) for preparing a structure (100) that is provided with an adhesive film (50), which comprises a base material layer (10), an adhesive resin layer (A) provided on a first surface (10A) side of the base material layer (10), and an adhesive resin layer (B) provided on a second surface (10B) side of the base material layer (10) and having an adhesive force that decreases by external stimuli, wherein the storage elastic modulus E' of the adhesive resin layer (A) at 125°C is from 0.2 × 106Pa to 4.5 × 106 Pa (inclusive), an electronic component (70) which is bonded to the adhesive resin layer (A) of the adhesive film (50), and a supporting substrate (80) which is bonded to the adhesive resin layer (B) of the adhesive film (50); a step (2) for sealing the electronic component (70) by means of a sealing material (60); a step (3) for separating the supporting substrate (80) from the structure (100) by decreasing the adhesive force of the adhesive resin layer (B) by applying external stimuli thereto; and a step (4) for separating the adhesive film (50) from the electronic component (70).
C09J 5/06 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
C09J 7/24 - PlasticsMetallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
C09J 7/25 - PlasticsMetallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
A packaging film equipped with a base material layer including polyethylene and a coating layer including a resin provided in contact with one side of the base material layer or provided via an anchor coating layer. An embodiment in which the value of Tgc is from -25 to 120°C and the value of Tgc-Tgs is from 90 to 245°C, taking the glass transition temperature of the coating layer to be Tgc and the glass transition temperature of the base material layer to be Tgs, can be given as one preferred embodiment of this packaging film.
B05D 3/00 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
B05D 3/02 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
B05D 7/04 - Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber to surfaces of films or sheets
B32B 3/30 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layerLayered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a layer with cavities or internal voids characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
This electronic apparatus production method comprises: a preparatory step (A) for preparing a structure (60) provided with an electronic component (10) which has a circuit-forming surface (10A), a pressure-sensitive laminate film (50) which has, in this sequence, a substrate layer (20), an unevenness-absorbing resin layer (30), and a pressure-sensitive resin layer (40) and which is bonded to the circuit-forming surface (10A) side of the electronic component (10), and a thermosetting protective film (70) which is bonded to a surface (10C) on the side opposite to the circuit-forming surface (10A) of the electronic component (10); and a thermal curing step (B) for thermally curing the thermosetting protective film (70) by heating the structure (60).
A method for manufacturing a semiconductor device according to the present invention includes at least the following three steps: (A) a step of preparing a first structure (100) including an adhesive laminate film (50) having a heat-resistant resin layer (10), a flexible resin layer (20) and an adhesive resin layer (30) in this order, and a first semiconductor component (60) adhered to the adhesive resin layer (30) and having a first terminal (65); (B) a step of performing solder reflow processing on the first structure (100) in a state where the first semiconductor component (60) is adhered to the adhesive resin layer (30); and (C) a step of, after the step (B), peeling the heat-resistant resin layer (10) from the adhesive laminate film (50).
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 23/482 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of lead-in layers inseparably applied to the semiconductor body
96.
METHOD FOR MANUFACTURING ADHESIVE FILM AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
The present invention is a method for manufacturing an adhesive film (50) comprising: a substrate layer (10); and an adhesive resin layer (A) which is provided on a first surface (10A) of the substrate layer (10) and which includes thermally expandable fine microspheres. This method includes: a storing step in which the thermally expandable microspheres are stored in an environment where the temperature is 20°C or less and the humidity is 40%RH or less; and a step performed after the storing step, in which the adhesive resin layer (A) containing the thermally expandable microspheres is formed on the first surface (10A) of the substrate layer (10).
Provided are: a mold releasing film for a printed wiring board manufacturing process that has followability, crease resistance, and releasability at a high level; and a printed board manufacturing method that has releasability, prevention of outflow of adhesive, and prevention of occurrence of wrinkles in a mold releasing film at a high level. The above problem is solved by a mold releasing film for a printed wiring board manufacturing process that includes at least a mold releasing layer (A) and an intermediate layer (B), the mold releasing film characterized in that the mold releasing layer (A) has a thickness of 15 μm or less, and the intermediate layer (B) has a modulus of elasticity of tension of 11 MPa or more at 180°C, and a printed board manufacturing method using the mold releasing film for a process.
The present invention addresses the problem of providing an affixing device capable of planarizing the surface of a film 20 affixed to a major surface 10A of a plate-like body 10. An affixing device 30 for affixing a film 20 onto a plate-like body 10 is provided with: a plate-like mounting member 31 having a mounting portion 31A for mounting the plate-like body 10; a plate-like pressing member 32 installed in a position opposing the mounting member 31; and a support member 33 which is installed on an outer edge of the mounting portion 31A so as to be positioned between the mounting member 31 and the pressing member 32.
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
Provided are a protection film affixing method, a semiconductor component manufacturing method, and a protection film used for an affixing method with which make it possible to suppress generation of troubles caused by a height difference in a main surface of a semiconductor wafer. The affixing method comprises an arranging step for arranging a protection film 20 so as to cover a main surface 10A of a semiconductor wafer 10, and an affixing step for affixing the protection film 20 by pressing the protection film 20 onto the main surface 10A. The main surface 10A includes a first region 12 in which bumps 11 are provided, and a second region 13 which includes at least a part of a periphery of the main surface 10A and in which the bumps 11 are not provided. The affixing step includes a compressing step for compressing the protection film 20 in a thickness direction thereof. The compressing step is performed using a pressing member 32 for pressing the protection film 20 onto the main surface 10A, and a support member 33 installed along an outer periphery of the second region 13.
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
This electronic device production method at least comprises a preparation step for preparing a structure (100), and a sealing step for sealing an electronic component (70) using a sealing material (60). The structure (100) includes: an adhesive film (50) including a base material layer (10), an adhesive resin layer (A) that is provided to a first surface (10A) side of the base material layer (10) and used for provisionally immobilizing the electronic component (70), an adhesive resin layer (B) that is provided to a second surface (10B) side of the base material layer (10) and loses adhesiveness due to external stimulation, and an absorbent relief resin layer (C) that is provided between the base material layer (10) and the adhesive resin layer (A) or between the base material layer (10) and the adhesive resin layer (B); the electronic component (70) joined to the adhesive resin layer (A) of the adhesive film (50) and having a relief structure (75); and a support substrate (80) joined to the adhesive resin layer (B) of the adhesive film (50).
H01L 23/12 - Mountings, e.g. non-detachable insulating substrates
C09J 123/00 - Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bondAdhesives based on derivatives of such polymers
C09J 125/04 - Homopolymers or copolymers of styrene
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
