An optical detection method. A substrate (100) is placed at a predetermined position of a workpiece table (200); first, an optical detection module (300) is made to photograph, one by one, at least some patterns to be subjected to detection (101) which are within a detection area (102) of the optical detection module (300); then, the workpiece table (200) rotates the substrate (100) by a predetermined angle, such that patterns to be subjected to detection (101) which are outside the detection area (102) enter the detection area (102); and in this case, the optical detection module (300) photographs, one by one, the remaining patterns to be subjected to detection (101). Therefore, there is no requirement to increase a translation motion stroke of the workpiece table (200) and the motion precision at a distal stroke position, and there is also no requirement to adjust the frame structure and overall layout of a whole machine, thereby reducing the cost and occupied area of the whole machine, and improving the process adaptability.
Provided in the present invention are an exposure projection objective lens and a lithography machine. The exposure projection objective lens comprises a first lens group, a second lens group, a third lens group and a fourth lens group, which are sequentially arranged from an object surface to an image surface, wherein the first lens group and the fourth lens group are used for compensating for aberration at a field of view, and the second lens group and the third lens group are used for compensating for aberration at a pupil plane. In the present invention, the aberration at the field of view is compensated for by means of the first lens group and the fourth lens group, and the aberration at the pupil plane is compensated for by means of the second lens group and the third lens group, such that the performance correction level of the exposure projection objective lens is improved, and the exposure performance of the lithography machine can thus be directly improved, thereby achieving a lower exposure resolution and less uniformity of critical dimensions.
The present invention provides a projection objective and a mask aligner. The projection objective comprises a first lens group and a second lens group, the number of lenses of the first lens group is the same as the number of lenses of the second lens group, and the side of the first lens group distant from the second lens group or the side of the second lens group distant from the first lens group is provided with a protection device. A protection device is provided on the side of the second lens group distant from the first lens group, so that pollution caused by volatilization of a photoresist can be effectively isolated, and environmental adaptability and reliability of the mask aligner are improved; and there is no protection device on the side of the first lens group distant from the second lens group, so that the object side working distance can be effectively increased, an external interface is formed, the integrated assembly difficulty of the projection objective is reduced, and the problem of interference of mask transmission of the mask aligner is reduced. Alternatively, a protection device is provided on the side of the first lens group distant from the second lens group, so that environmental pollution of the side of the projection objective distant from the second lens group can be effectively isolated.
The present invention provides a laser annealing energy control method and a laser annealing device. The laser annealing energy control method comprises: moving a laser spot relative to a substrate at a first laser power, and reducing the laser power of the laser spot to a second laser power at a first position relative to the substrate; relative to the substrate, moving the laser spot to a second position relative to the substrate; moving the laser spot relative to the substrate from the second position relative to the substrate to a third position relative to the substrate, and increasing the laser power to a third laser power; and the laser spot performing scanning annealing on the substrate at the third laser power. The laser spot moves to the edge of the substrate relative to the substrate, so that the laser power is reduced, and the problem of energy peak at the edge of the substrate and the problem of fragments caused by thermal stress are avoided.
Provided in the present invention are a safety shutter and a lithography machine. The safety shutter comprises: a cover plate, a blade, a transmission shaft, and a driving assembly, wherein the cover plate is provided with a light-transmitting hole, and the driving assembly is arranged on the cover plate and located at a side edge of the light-transmitting hole; the transmission shaft is connected to both the driving assembly and the blade, and is configured to drive the blade to rotate when the driving assembly moves, so as to enable the blade to close or open the light-transmitting hole; and the transmission shaft is provided with a coupling portion and a connecting portion, the coupling portion being connected to the connecting portion, and the connecting portion extending in a radial direction of the transmission shaft and being connected to the blade so as to support the blade. In the present invention, the coupling portion, which is on the transmission shaft, is used for the correction of off-centering, angular deflection, vibration amplitudes, and other axis deviations generated between rotary bodies, so as to improve the reliability of movement of the safety shutter and prevent jamming or unsmooth movement. In addition, the connecting portion, which is on the transmission shaft, is used to increase the support force of the blade, so as to reduce an unbalanced loading moment of the blade, and improve the smoothness of movement.
The present invention relates to the technical field of semiconductors, and provides a substrate transfer mechanism and an exposure platform system. The substrate transfer mechanism comprises a rotating seat, an adsorption assembly, a base, and a rotation driving member; the rotating seat is mounted on the base so as to rotate along the central axis of the rotating seat, and the base is mounted on a workbench of the exposure platform system; the adsorption assembly is arranged on the rotating seat and used for adsorbing a wafer; and the rotation driving member is arranged on the base and used for driving the rotating seat to rotate by taking the central axis of the rotating seat as the center. Thus, according to the substrate transfer mechanism and the exposure platform system, when a circumferential position error of loading a wafer is compensated, the rotating seat in the substrate transfer mechanism only needs to be adaptively driven to rotate, and the exposure platform system does not need to be driven to rotate as a whole, thereby facilitating simplifying the rotating structure, increasing the input-output ratio, and facilitating achieving high rotation precision.
A measurement system and measurement method for a focal plane of a laser spot. The measurement method for a focal plane of a laser spot comprises: measuring thermal radiation energy of a laser spot on the surface of a device to be machined, obtaining an optimal focal plane according to thermal radiation energy of different focal planes of the laser spot, and establishing a relationship between the different focal planes of the laser spot and the thermal radiation energy (S10); and according to the relationship between the different focal planes of the laser spot and the thermal radiation energy, adjusting in real time the distance between the surface of said device and the optimal focal plane of the laser spot during a machining process (S20). The method achieves a micron-scale measurement precision, improves the measurement precision of a focal plane, facilitates an improvement in real-time compensation for a focal plane of a laser spot during a machining process, and improves the laser machining process performance.
Provided in the present invention are a measurement apparatus and a measurement method. The measurement apparatus comprises a workpiece table, an optical imaging system, an optical ranging system and a signal processing system, wherein the optical imaging system performs focusing on a first area on a substrate to be measured, and the first area is a part of an area to be measured of said substrate; and the optical ranging system measures a height value of the first area after the optical imaging system completes focusing on the first area, and uses same as a first height value. The measurement apparatus measures said substrate by using the first height value measured by the optical ranging system as a reference. In the present invention, by using a first height value as a reference, an optical ranging system is used to perform focusing on a substrate to be measured, such that there is a relatively high focusing rate, and relatively high focusing precision can also be ensured, thereby improving the measurement rate and measurement precision.
A workpiece table system and a working method thereof. The workpiece table system comprises: a micro-motion module (14), a coarse-motion module (13), an impact force absorption module (12), a suspension frame (15), a bottom frame (11) and an active shock absorption module (16). The suspension frame (15) and the bottom frame (11) are isolated from each other by means of the active shock absorption module (16). The suspension frame (15) provides vertical air-floating support for the micro-motion module (14). The coarse-motion module (13) is provided on the bottom frame (11) by means of the impact force absorption module (12). The bottom frame (11) provides vertical air-floating support for the impact force absorption module (12). The impact force absorption module (12) is used for absorbing impact force generated by the coarse-motion module (13) during movement processes. The micro-motion module (14) and the coarse-motion module (13) are of a separate design, and when the micro-motion module (14) moves, the coarse-motion module (13) follows the motion of the micro-motion module (14). The workpiece table system can increase the movement precision of a workpiece table to 30nm.
The present invention provides a wafer conveying system. The wafer conveying system comprises a wafer library, a manipulator, a wafer loading deviation detection module, and a wafer loading deviation compensation module; the manipulator is used for taking out a wafer from the wafer library and conveying the wafer to a preset station; the wafer loading deviation detection module is used for obtaining a wafer loading deviation of the wafer at the preset station; the wafer loading deviation compensation module calculates a position deviation of the wafer at a handover station of the manipulator and a workpiece stage on the basis of the wafer loading deviation, the workpiece stage moves to the handover station and the position is adjusted on the basis of the position deviation, and the manipulator conveys the wafer to the handover station; or the wafer loading deviation compensation module calculates a wafer loading path of the manipulator from the preset station to the handover station of the manipulator and the workpiece stage on the basis of the wafer loading deviation, and the manipulator moves to the handover station according to the wafer loading path and conveys the wafer to the workpiece stage. Compensating for the wafer loading deviation of the wafer by using the present invention is beneficial to reducing the cost. The present invention also provides a wafer conveying method and a defect detection device.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
11.
SUBSTRATE HEATING DEVICE AND SEMICONDUCTOR APPARATUS
Provided in the present invention are a substrate heating device and a semiconductor apparatus. The substrate heating device comprises a heating disc and at least two lifting units, wherein the heating disc is provided with a contact surface, and is configured to bear and heat a substrate; and each lifting unit comprises a lifting portion and a receiving portion, the lifting portion being arranged on an outer side of the heating disc, and the receiving portion being connected to the lifting portion and being configured to support and lift the substrate. In the present invention, an avoidance space for the lifting of the substrate is changed from the inside of the heating disc to the outer side of the heating disc, so that the number and area of openings in the contact surface are reduced, that is, the contact area between the heating disc and the substrate is increased, thereby improving the uniformity of a heating temperature of the heating disc.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
Provided in the present invention are a suction disc, a silicon wafer suction device, an exposure apparatus and a warping silicon wafer suction method. The suction disc comprises a suction disc body, a sealing ring group, and flexible suction cup groups, wherein the sealing ring group comprises at least two sealing rings, which are distributed on the suction disc body in a concentric circle form; the suction disc body is divided into a central suction region and a peripheral suction region; and one flexible suction cup group is provided in each of the central suction region and the peripheral suction region. In this way, a thin (flexible) warping silicon wafer can be suctioned in sections or in regions according to the characteristics of the warping silicon wafer, and during a suction process, the heights of the flexible suction cup groups located in different suction regions change as the silicon wafer descends, thus achieving a certain supporting and buffering effect, so that the problem of severe out-of-tolerance in terms of appearance shape of the silicon wafer can be solved.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
Provided in the present invention is a detection formula configuration and optimization method and apparatus, an electronic device and a storage medium. The method comprises: labeling a first data sample to obtain a second data sample; wherein the first data sample comprises a plurality of pieces of detection result data, and the second data sample comprises the detection result data and a label corresponding to each piece of data; according to the second data sample, obtaining data feature distribution information of a detection object; using a preset outlier statistical analysis strategy, performing outlier statistical analysis on the data feature distribution information, so as to obtain defect distribution boundary information and determine a detection formula; finally, according to the defect distribution boundary information and the preset outlier statistical analysis strategy, determining or optimizing the values of detection parameters of the detection formula by means of reverse derivation. In the invention, the coupling relationship between the parameters is considered, such that repeated adjustment of parameters can be avoided, and meanwhile, a whole set of detection parameters are inferred, so that rapid modeling of the detection formula is achieved; and manpower and time costs can be saved.
G06V 10/762 - Arrangements for image or video recognition or understanding using pattern recognition or machine learning using clustering, e.g. of similar faces in social networks
14.
PHOTOLITHOGRAPHY PROJECTION OBJECTIVE LENS AND PHOTOLITHOGRAPHY MACHINE
123455 of the fifth lens group (G5) satisfy the following formulas (I) and (II). On the basis of a high exposure resolution being realized, the number of lenses and the number of aspheric lenses can be reduced, such that the design costs and the manufacturing period of the photolithography projection objective lens (50) are reduced, thereby improving the market competitiveness of the product; moreover, by means of combining positive focal power and negative focal powers which alternate with each other, the image quality correction capability of the photolithography projection objective lens (50) is improved, such that the exposure imaging quality is improved, thereby realizing a lower exposure resolution and CDU. The photolithography projection objective lens (50) is applied to a photolithography machine.
Provided in the present invention is a detection and positioning method for an alignment mark of a silicon wafer. The method comprises: firstly, establishing a knowledge base, wherein the knowledge base is provided with first feature information of a first detection image of several known alignment marks; then, acquiring second feature information of a second detection image of an alignment mark to be detected; and performing similarity comparison on the first feature information and the second feature information item by item, and according to several known alignment marks obtained by means of comparison, acquiring position information, on a silicon wafer, of the alignment mark to be detected, such that the known alignment marks are accurately found, and the detection and positioning precision and efficiency of the alignment mark to be detected are improved. Correspondingly, further provided in the present invention are a detection and positioning system for an alignment mark of a silicon wafer, and an electronic device and a non-transitory computer-readable storage medium.
Provided in the present invention are a wafer pre-alignment apparatus and a wafer pre-alignment method. The wafer pre-alignment apparatus comprises a support assembly, a camera, and a light source. The support assembly is used to support a wafer, an upper surface of the support assembly for placing the wafer being provided with at least three positioning markers located at the periphery of the wafer, the camera being used to capture an image of the wafer and the support assembly supporting the wafer, and the image comprising all of the positioning markers on the support assembly. The light source is used to provide an illumination beam such that an illumination light field is formed on the upper surface of the support assembly when an image is captured. The image captured by the camera can be used to obtain a center deviation amount and a rotation angle of the wafer without one revolution of the wafer, which can reduce mechanical complexity of the wafer pre-alignment apparatus, help reduce manufacturing costs of the wafer pre-alignment apparatus, and improve pre-alignment efficiency. In the wafer pre-alignment method provided in the present invention, the center deviation amount and the rotation angle of the wafer are obtained using the image captured by the camera.
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
17.
Displacement measuring apparatus, displacement measuring method and photolithography device
A displacement measuring apparatus, a displacement measuring method and a photolithography device are disclosed. The displacement measuring apparatus includes a light source module (300), a diffractive member (200), a reader head assembly (100), an optical detection module (410, 411, 412, 413) and a signal analysis module (500). The reader head assembly (100) is configured to receive two input light beams (610, 611) from the light source module (300) and guide them so that they come into contact in parallel with the diffractive member (200) and are both diffracted. The diffracted input light beams are guided and combined to form at least one output light beam (612, 613, 614) each containing diffracted light signals respectively of the two input light beams (610, 611), which exit in the same direction from the same light spot location of the diffractive member (200). Displacement information of the diffractive member (200) can be derived from phase change information contained in an interference signal produced by each output light beam (612, 613, 614). The displacement measuring apparatus and method can be used to achieve independent displacement measurements in different direction, with adaptivity to a wide angle and reduced nonlinearity errors. The photolithography device includes the displacement measuring apparatus.
G01D 5/353 - Mechanical means for transferring the output of a sensing memberMeans for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for convertingTransducers not specially adapted for a specific variable using optical means, i.e. using infrared, visible or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells influencing the transmission properties of an optical fibre
G01D 5/38 - Forming the light into pulses by diffraction gratings
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
Provided a lithography projection objective includes: first lens group, second lens group, third lens group, fourth lens group, and fifth lens group, wherein first lens group, second lens group, third lens group, fourth lens group, and fifth lens group are sequentially arranged along an optical axis; first lens group and third lens group each has negative optical power, second lens group and fourth lens group each has positive optical power, fifth lens group has optical power of 0, sum optical power of first lens group, second lens group, third lens group, fourth lens group, and fifth lens group is 0; lithography projection objective further includes diaphragm; and first lens group, third lens group, and fourth lens group each comprises aspheric lenses, one aspheric lens thereof includes an aspherical surface; and a number of aspheric lenses is greater than or equal to 4 and less than or equal to 8.
G02B 13/00 - Optical objectives specially designed for the purposes specified below
G02B 9/60 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having five components only
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
An exposure apparatus and method. The exposure apparatus includes a control system, light source system, plurality of illumination systems and plurality of projection objective lenses. The light source system is configured to emit a plurality of first illumination beams incident on the illumination systems. Each illumination system includes a variable attenuator and branch energy detector. The branch energy detector is configured to detect an illuminance level of a second illumination beam generated in the corresponding illumination system and feed it back to the control system. The control system is configured to adjust the illuminance levels of the second illumination beams in the respective illumination systems by controlling the respective variable attenuators therein. The exposure apparatus and method have improved exposure performance and allow finer and faster energy adjustments, thus enabling precise control and higher exposure accuracy.
Disclosed are a chip encapsulation method and an encapsulated chip. The chip encapsulation method comprises: providing a carrier; forming a redistribution layer on the carrier; forming a conductive bump structure on the redistribution layer; welding a chip pin to the conductive bump structure, and forming a chip encapsulation structure; and applying uniform pressure to an area where the conductive bump structure is located, and at the same time, carrying out laser annealing on the area where the conductive bump structure is located.
Disclosed are a silicon wafer adsorption device and a laser annealing apparatus. The silicon wafer adsorption device comprises: an adsorption surface capable of adsorbing the silicon wafer; an identifier difference member disposed on the outer peripheral of the adsorption surface and disposed to form an identifier area. The adsorption surface comprises an adsorption area capable of adsorbing and fixing the silicon wafer;the identifier area is arranged adjacent to the adsorption area. The silicon wafer is arranged, when being adsorbed and fixed by the adsorption area, to have at least part of the edge thereof falling within the identifier area. The identifier area has a machine recognition degree different with that of the silicon wafer.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
22.
WAVE ABERRATION MEASUREMENT DEVICE, MEASUREMENT METHOD, AND PHOTOLITHOGRAPHY MACHINE
The present application provides a wave aberration measurement device, a measurement method, and a photolithography machine. The wave aberration measurement device comprises: an illumination system configured to generate an illumination beam, and an object-plane hole plate located at a light emergent side of the illumination system and fixed to a mask table, wherein the object-plane hole plate is provided with multiple object-plane holes. Each object-plane hole comprises g object-plane hole marks having different grating directions, g being a positive integer greater than or equal to 2. The multiple object-plane hole marks on the object-plane hole plate are arranged in an array. Object-plane hole marks in the same row of the array have the same grating direction. The distance, in a row direction of the array, between two adjacent object-plane hole marks in the same row of the array is h1, and the minimum distance, in a row direction of the array, between the two closest object-plane hole marks in two rows of the array having the same grating direction is h2, wherein h1 = m × h2, and m is a positive integer greater than or equal to 2. Any two rows of object-plane hole marks having the same grating direction are an array arrangement.
A spin coating device and method. The spin coating device includes a rotatable rotary shaft and sucker fixed on an end portion of the shaft, and an electromagnetic induction device below the sucker which includes an annular magnet fixed below the sucker, coil group formed by a first and second coil, and strip-shaped magnet fixed at the rotary shaft. A base on the sucker has a notch. The unbalanced centrifugal force during rotation of the sucker causes vibration. The electromagnetic induction device enables the centrifugal force generated during rotation of the sucker to be in balance with the magnetic force generated by the electromagnetic induction device to adjust the levelness of the sucker surface. The device does not need manual manipulation, enables the sucker to be more stable, reduces damage to the equipment due to vibration, and improves the effect of photoresist spin-coating while saving time and labor.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
The present invention provides a linear module, which includes a casing, and a linear transmission device (20). The casing has an internal cavity, in which the linear transmission device (20) is at least partially disposed, and an output opening (31) which extends along a movement direction of the linear transmission device (20) defined on the case. A sealing band (32) is arranged at the output opening (31). The linear module further includes a first rolling mechanism (50) which is moveable in synchronization with the linear transmission device (20) and is arranged on a side of the sealing band (32) which is away from the internal cavity. The first rolling mechanism (50) is in rolling contact with the sealing band (32). This linear module enables high cleanliness and has good sealing performance, high accuracy and high stability.
F16H 19/06 - Gearings comprising essentially only toothed gears or friction members and not capable of conveying indefinitely-continuing rotary motion for interconverting rotary motion and reciprocating motion comprising an endless flexible member
F16H 57/029 - GearboxesMounting gearing therein characterised by means for sealing gearboxes, e.g. to improve airtightness
Disclosed are a displacement measuring apparatus, a displacement measuring method and a photolithography device. The displacement measuring apparatus comprises a light source module (300), a diffraction element (200), a reading head assembly (100), light detection modules (410, 411, 412, 413) and a signal analysis module (500). The reading head assembly (100) is used to receive two input beams (610, 611) generated by the light source module (300) and guide the two input beams (610, 611) to contact the diffraction element (200) in parallel to generate diffraction, and then guide and combine the diffracted input beams to form at least one output beam (612, 613, 614), each output beam (612, 613, 614) comprising diffracted light signals emitted from the same light spot position of the diffraction element (200) in the same direction and respectively corresponding to the two input beams (610, 611). Displacement information of the diffraction element (200) can be obtained according to phase change information of an interference signal of each output beam (612, 613, 614). The displacement measuring apparatus and the displacement measuring method can achieve independent displacement measurement in different directions, and help to achieve wide-angle adaptive displacement measurement and reduce nonlinear errors. The photolithography device comprises the displacement measuring apparatus.
The present invention provides a maglev motor and a control method therefor. At least two coil modules are provided on a magnetic steel array module. Each of the coil modules comprises at least six force generating bodies distributed in a matrix. A control module identifies the working conditions of the two coil modules in real time and controls the power-on and power-off of the force generating bodies thereof according to the working conditions of the coil modules to control the working modes of the coil modules. The at least six force generating bodies distributed in a matrix can be used simultaneously in a limited area, thereby increasing the acceleration of the motion of the coil modules as necessary, and there is no need to make the size of the magnetic steel array module large enough.
A projection objective, used for projecting an object space to an image space. The objective includes, from the object space along an optical axis in sequence: a first lens set (G1) having positive focal power, a second lens set (G2) having negative focal power, a third lens set (G3) having positive focal power, a fourth lens set (G4) having negative focal power, and a fifth lens set (G5) having positive focal power. Aspheric lenses are provided in the first lens set (G1), the second lens set (G2), the third lens set (G3), the fourth lens set (G4), and the fifth lens set (G5). According to the design, the number of lenses is reduced, the structure of the objective is more compact, the transmittance of the objective is improved, the structural design of aspheric lenses is optimized, the asphericity of the aspheric lenses is reduced, the processing difficulty and costs for the aspheric lenses are reduced, and except for the above situations, the objective has a bitelecentric structure, and the sensitivity of the objective for micro irregularity defects on a mask surface is reduced.
Disclosed are a mask plate and a stitching exposure method. The mask plate comprises: a target exposure pattern (110) and a compensation exposure pattern (120), wherein the compensation exposure pattern (120) is located at a stitching end of the target exposure pattern (110); the target exposure pattern (110) has a first width Y0 in a direction perpendicular to a stitching direction (X); the compensation exposure pattern (120) has a second width Y1 in the direction perpendicular to the stitching direction (X); and the first width Y0 and the minimum resolution capability W of a lithographic apparatus satisfy Y0 ≥ 120％W, the compensation exposure pattern (120) adjoins the stitching end of the target exposure pattern (110), and 60％Y0 ≤ Y1 ≤ 99％Y0.
G03F 1/42 - Alignment or registration features, e.g. alignment marks on the mask substrates
G03F 1/00 - Originals for photomechanical production of textured or patterned surfaces, e.g. masks, photo-masks or reticlesMask blanks or pellicles thereforContainers specially adapted thereforPreparation thereof
29.
MULTI-STATION FLEXIBLE TAPE EXPOSURE DEVICE AND EXPOSURE METHOD
Provided are a multi-station flexible tape exposure device and exposure method. A workpiece table (11) has a plurality of stations provided with flexible tapes; when the flexible tapes in an exposure area (112) are exposed, alignment measurement and/or focal plane measurement is synchronously performed on the flexible tapes in a measurement area (111); while the exposed flexible tapes are transferred out from the exposure area (112), the flexible tapes having completed alignment measurement and/or focal plane measurement are transferred from the measurement area (111) to the exposure area (112); and a control unit (50) controls a photomask adjustment unit (40) such that same adjusts a photomask (M1) during a transferring process, and controls, after the next flexible tape reaches the exposure area (112), an exposure unit (3) such that same exposes the next flexible tape. By means of a multi-station parallel mode, the alignment measurement and/or focal plane measurement on the flexible tapes in the measurement area (111) and the exposure of the flexible tapes in the exposure area (112) are synchronously performed, the adjustment of the photomask (M1) is completed during a station switching process, and the flexible tapes are simultaneously treated at multiple stations, thereby reducing the time consumption of the exposure process and facilitating an improvement in productivity.
An air-float cushion structure, comprising an air-float cushion body (30). The air-float cushion body (30) comprises an outlet surface (31), a non-outlet surface (32), and a side surface (33) connecting the outlet surface (31) and the non-outlet surface (32). The side surface (33) of the air-float cushion body (30) is provided with a gas inlet (34). The outlet surface (31) is provided with a first outlet unit (311). The first outlet unit (311) comprises a first orifice (3111), first pressure equalizing slots (3112), first protrusions (3113), and second pressure equalizing slots (3114). The first pressure equalizing slots (3112) are arranged around the first orifice (3111). The first protrusions (3113) are arranged around the first pressure equalizing slots (3112). The second pressure equalizing slots (3114) are arranged around the first protrusions (3113). The problems in an air-float cushion structure of poor dynamic stability or low stiffness and bearing capacity are solved.
F16C 32/06 - Bearings not otherwise provided for with moving member supported by a fluid cushion formed, at least to a large extent, otherwise than by movement of the shaft, e.g. hydrostatic air-cushion bearings
31.
EXPOSURE APPARATUS FOR FLEXIBLE TAPES USING TWO WORKPIECE PLATFORMS AND EXPOSURE METHOD
An exposure apparatus for flexible tapes (80) using two workpiece platforms and an exposure method. When the two workpiece platforms (11) are respectively located in an exposure region (112) and a measurement region (111), measurement and exposure are performed on the flexible tapes (80) simultaneously. After the measurement and exposure are completed, the two workpiece platforms (11) move to switch between operation regions. During the movement of the workpiece platforms (11), a control module (50) controls a photomask adjustment module (40) to adjust a photomask (M1), according to alignment data and/or focal plane measurement data measured by a measurement module (20), and after the flexible tape (80) moves from the measurement region (111) to the exposure region (112), the control module (50) controls an exposure module (30) to perform exposure on the flexible tape (80) in the exposure region (112). The two workpiece platforms (11) operate in parallel, and when alignment and/or focal plane measurement is performed on the flexible tape (80) on the workpiece platform (11) in the measurement region (111), exposure is simultaneously performed on the flexible tape (80) on the workpiece platform (11) in the exposure region (112). During switching between operation regions, the adjustment performed on the photomask (M1) is completed, and the two workpiece platforms (11) simultaneously process the flexible tapes (80), thereby utilizing time better, reducing a time required by an exposure process, and improving productivity.
A wafer holder and a wafer transfer apparatus, system and method are disclosed. The wafer holder is mounted onto the wafer transfer apparatus and includes a holder body and a sucker. The holder body defines a first opening, while the sucker includes a first skirt. The first skirt is located on one side of the holder body and connected to the first opening. A groove is formed at a joint between the first skirt and the first opening. The groove is located at an outer side of the first skirt, and is able to relief stresses produced at a base portion of the sucker during deformation of the first skirt.
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
B65G 47/91 - Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
An objective lens device (00), comprising a light transmission unit (110), a gas supply unit (120), and a control unit (130). The light transmission unit (110) comprises a first lens group (111), a wavefront compensator (112), and a second lens group (113) sequentially disposed in a light transmission direction, wherein a first pressure sensing unit (51) is disposed in at least one of the first lens group (111) and the second lens group (113), and a second pressure sensing unit (52) is disposed in the wavefront compensator (112). The gas supply unit (120) is configured to output gas to the wavefront compensator (112), the gas meeting preset requirements of pressure stability and purity. The control unit (130) is configured to adjust a gas output of the gas supply unit (120), such that the difference between a first pressure value and a second pressure value is within a preset pressure difference threshold range.
Disclosed is a protruding plate detection device for a mask plate, the device comprising: a distance measurement sensor (110) configured to be located on one side of a plate library; an adjustment assembly (120) configured to drive the distance measurement sensor (110) to move so as to scan multiple plate grooves of the plate library and enable a distance measurement signal, transmitted by the distance measurement sensor (110), to be reflected by mask plates in the multiple plate grooves and reflected back to the distance measurement sensor (110) along an original path; and a detection mechanism (130) respectively connected to the distance measurement sensor (110) and the adjustment assembly (120), and configured to control the distance measurement sensor (110) and the adjustment assembly (120) to operate, and to determine, according to the scanning position and posture of the distance measurement sensor (110) when scanning the multiple plate grooves and the distance information measured by the distance measurement sensor (110), whether there is a protruding plate in the multiple plate grooves. Detection can be performed without manual checking, and the efficiency of protruding plate detection is improved. A mask transmission system and a lithography device are further disclosed.
G01B 11/14 - Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
A semiconductor manufacturing apparatus, including a chip supply module used for providing a plurality of chips; a load plate supply module including a load plate and a load-plate motion platform used for holding the load plate; a chip transfer-loading module including a chip transfer-loading platform used for suctioning chips. The chip transfer-loading platform is used at a first position for transferring chips from the chip supply module. The chip transfer-loading platform carries the chips to a second position to bond the chips onto a load plate to form a bonding sheet. A packaging module is used for packaging the bonding plate on the load-plate motion platform to form a packaged chip.
G11C 11/00 - Digital stores characterised by the use of particular electric or magnetic storage elementsStorage elements therefor
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
B29C 65/48 - Joining of preformed partsApparatus therefor using adhesives
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
G11C 5/04 - Supports for storage elementsMounting or fixing of storage elements on such supports
B29L 31/34 - Electrical apparatus, e.g. sparking plugs or parts thereof
A defect detection device, comprising: a workpiece carrier (110) configured to support an object under test (210) and to control the object under test (210) to move; a synchronization controller (120) configured to receive a trigger command provided by the workpiece carrier (110), and to generate, according to the trigger command, at least one of a bright field synchronization control signal and a dark field synchronization control signal; at least one of a bright field illumination source (130) and a dark field illumination source (140), the bright field illumination source (130) being configured to receive the bright field synchronization control signal, and the dark field illumination source (140) being configured to receive the dark field synchronization control signal; an imaging component (150) configured to perform imaging processing on a light beam having passed through the object under test (210); a beam splitting prism (160) located at a light-emitting side of the imaging component (150); and at least two detectors (170, 171, 172), each detector (170, 171, 172) being connected to the synchronization controller (120).
A method for vertical control of a lithography machine includes step 1, prior to a scanning exposure, controlling vertical measurement sensors to measure workpiece to obtain overall surface profile data of the workpiece; step 2, performing a global leveling based on the overall surface profile data of the workpiece; and step 3, during the scanning exposure of each exposure field, measuring a local surface profile of the workpiece in real time by the vertical measurement sensors and controlling at least one of a mask stage, a workpiece stage and a projection objective to move vertically according to a Z-directional height value, an Rx-directional tilt value and an Ry-directional tilt value corresponding to the local surface profile of the workpiece, to compensate for the local surface profile of the workpiece in real time, so that an upper surface of each exposure field coincides with a reference focal plane for the exposure field. This method enables flexible vertical control with high accuracy by providing multiple control options.
The lithography apparatus includes at least two exposure devices and one substrate device. The substrate device includes a substrate stage and a substrate supported by the substrate stage. The at least two exposure devices are disposed in symmetry to each other above the substrate with respect to a direction for scanning exposure and configured to simultaneously create two exposure fields onto the substrate to expose the portions of the substrate within the exposure fields.
Provided are an optical alignment apparatus and a photoetching system, which can be compatible with alignment and scanning of narrow marks, and can effectively improve scanning signal energy of the marks, suppress optical crosstalk between the marks and between a mark and a photoetching line, and improve the alignment accuracy. Furthermore, a light beam modulation element in an imaging unit comprises a plurality of sub-components correspondingly provided at the positions of light-transmitting regions, except for regions for transmitting ±1-order diffraction light beams of a diffraction grating, of a light beam restriction element on a one-to-one basis, and the sub-components can eliminate interference of zero-order light and stray light, thereby further improving the scanning signal energy of the marks, and improving the alignment accuracy.
A photoetching projective objective, comprising a first lens group (LG1), a second lens group (LG2), a third lens group (LG3), a fourth lens group (LG4), and a fifth lens group (LG5) that are sequentially arranged in an optical axis, wherein the first lens group (LG1) and the third lens group (LG3) both have a negative light focal degree; the second lens group (LG2) and the fourth lens group (LG4) both have a positive light focal degree; the light focal degree of the fifth lens group (LG5) is 0; the sum of the light focal degrees of the first lens group (LG1), the second lens group (LG2), the third lens group (LG3), the fourth lens group (LG4), and the fifth lens group (LG5) is 0. The photoetching projective objective further comprises an aperture slot (AS); the first lens group (LG1), the third lens group (LG3), and the fourth lens group (LG4) all have an aspherical lens, and one aspherical lens comprises one aspheric surface; and the number of aspherical lenses is greater than or equal to 4 and less than or equal to 8.
G02B 13/18 - Optical objectives specially designed for the purposes specified below with lenses having one or more non-spherical faces, e.g. for reducing geometrical aberration
A mask attitude monitoring method and apparatus and a mask particle size measurement device. The monitoring method comprises: obtaining a distance (H1, H2) from at least one calibration point to a standard surface (A) along a first direction (Z) (S11); respectively obtaining a distance (H1'), along the first direction (Z), from the at least one calibration point to a first detection point (a1) on a mask (200) to be measured, a distance (H2') from the at least one calibration point to a second detection point (a2) on said mask (200) along the first direction (Z), and a distance from the at least one calibration point to a third detection point (a3) on said mask (200) along the first direction (Z) (S12); and calculating a deflection angle of said mask (200) around a second direction (X) with respect to the standard plane (A) and a deflection angle around a third direction (Y) according to obtained data (S13).
Disclosed is a laser annealing device for an SiC substrate. The device comprises: a laser emission unit configured to provide a laser light source required for annealing; a laser shaping unit configured to shape a laser emitted by the laser emission unit into a rectangular light spot, energy distribution of the rectangular light spot in a scanning direction being trapezoidal; a scanning galvanometer unit configured to control a laser beam from the laser shaping unit such that the laser beam carries out scanning, according to a pre-set scanning mode, on the surface of an SiC substrate to be annealed; a workpiece bearing mechanism configured to bear the SiC substrate to be annealed; and a main controller electrically connected to the laser emission unit, the laser shaping unit, the scanning galvanometer unit and the workpiece bearing mechanism, respectively.
A mounting device and a mounting method for a grating ruler, a grating measurement system and a lithography machine. The mounting device for a grating ruler comprises a mounting base plate (10) and an adaptive structure, one end face of the mounting base plate (10) being provided with a through hole (15), the through hole (15) being used for providing an optical path channel of a projection and exposure optical system of a lithography machine. The grating ruler (16) is connected to one end face of the mounting base plate (10), the adaptive structure comprises a flexible block (11), a stiffness damper (12) and a vibration absorption damper (13), and the flexible block (11), the stiffness damper (12) and the vibration absorption damper (13) are fixedly connected to the other end face of the mounting base plate (10). In this way, the influence of external heat transfer, vibration of a main substrate (14), thermal deformation of the main substrate (14), and air pressure fluctuation generated by a workpiece table (20) in a high-speed movement process on the measurement stability of the grating ruler (16) of the workpiece table (20) are reduced, thereby improving the measurement accuracy of the grating ruler (16) of the workpiece table (20).
An object surface detection device and detection method. The detection device comprises: a light source unit (100), configured to generate light that illuminates an object to be detected (400); a workbench unit (200), configured to carry the object to be detected; and a detection unit (300), configured to receive scattered light generated by a foreign object on a surface of the object to be detected (400), wherein the workbench unit (200) moves relative to the detection unit (300) along a first direction in a translation plane; the detection unit (300) comprises a time delay integral (TDI) line array camera; and a line detection field of view of the detection unit (300) is arranged along a second direction, and an included angle θ between the vertical direction of the first direction and the second direction is greater than 0°.
Provided is a device for detecting wave aberration of projection objective lens, comprising: a light source for providing detection beam; an object grating marking unit (100) for splitting the detection beam, to obtain a first beam (11) in a first direction and a second beam (12) in a second direction; a beam splitting and collimating unit for splitting and collimating the light beam passing through a projection objective unit (200); a diffraction unit (400) for diffracting the light beam passing through the beam splitting and collimating unit, to obtain interference images in two directions; a workpiece table (600) for driving the object grating marking unit (100), the beam splitting and collimating unit, the diffraction unit (400) and an imaging detection unit (500) to perform a one way stepping along a straight line in a predetermined direction between the first direction and the second direction, and simultaneously collecting the intensity of the interference image at each stepping of the first beam (11) and the second beam (12), to obtain the wave aberration in the first direction and the second direction respectively, thus the detection time is shortened, and the detection accuracy of the wave aberration is improved. Provided are also a method for detecting wave aberration of projection objective lens and a photolithography machine.
A mask fork, configured to transfer a mask from a standard mechanical interface pod. The standard mechanical interface pod includes a plurality of supports having a L-shaped cross section. Each of the plurality of supports includes a connecting section extending horizontally and a supporting section extending vertically, and the connecting section has a bottom to which a limiting section is fixed. The mask fork includes a fork body and two tines connected to the fork body in symmetry with each other. Each of the tines comprises a transfer member configured to support the mask during a transfer of the mask and anti-collision members including a first anti-collision member extending horizontally and a second anti-collision member extending vertically. The first anti-collision member is horizontally attached to a side of the transfer member facing away from the mask.
Disclosed is a silicon wafer processing device; a pre-aligned optical assembly and an edge exposure assembly are provided on a synchronous bi-directional motion module, reducing the occupied space of the device and saving the installation cost; and furthermore, a synchronous bi-directional motion module, a rotation unit and a position compensation unit on a bottom plate are controlled by means of a control assembly, so as to reduce the operational complexity; and moreover, the synchronous bi-directional motion module is controlled to drive the pre-aligned optical assembly and the edge exposure assembly to simultaneously move, so that the operations of pre-aligning and edge exposure can be performed on silicon wafers of different sizes, thereby saving the switching time and increasing the work efficiency. Further disclosed is a method for processing a silicon wafer using a silicon wafer processing device.
An apparatus and method for die defect detection are disclosed. The apparatus includes: a light source unit (10) for emitting light of at least two wavelengths; a beam splitter (40) for receiving the light emitted by the light source unit (10) and splitting it into a first portion and a second portion, the first portion of the light reflected by a die (60) surface under inspection and thereby forming a detection beam; a reference unit (70) for receiving the second portion of the light and processing it into a reference beam; and a detection unit (90) for receiving the detection beam and the reference beam. The reference beam crosses the detection beam at an angle and thus produces interference fringes on a sensing surface of the detection unit (90), based on which a defect parameter of the die (60) surface under inspection is determined. This apparatus is capable of measuring a die with improved accuracy and efficiency and is suitable for the measurement of large dies.
An objective lens protection device, objective lens system and lithographic device. The objective lens protection device includes a main structure provided with, oppositely disposed, an air supply unit and extraction unit. The air supply unit is used to output air. The extraction unit extracts air output by the air supply unit to form at least one layer of air curtain between the air supply unit and extraction unit. The objective lens protection device can effectively control the flow rate of wind discharge, controlling wind in a laminar flow state and ensuring uniform flow field of the air curtain, and can effectively block organic matters volatilized from the bottom up, eliminate opportunity for a direct contact of the organic matters with the lens, and prevent objective lens from contamination by the volatilization of the organic matters of photoresist, thus ensuring the imaging quality of the objective lens.
A vacuumizing device includes a vacuum chamber, a bonding fixture and a vacuumizing system. The bonding fixture is disposed in the vacuum chamber and includes a substrate table provided with a plurality of grooves for retention of the substrate by suction. The vacuumizing system is disposed in communication with both the vacuum chamber and grooves. During vacuumizing by the vacuumizing system, a vacuum value in the grooves is smaller than or equal to a vacuum value in the vacuum chamber. In the vacuumizing device and methods, the vacuumizing system is used to vacuumize the grooves in the substrate table and the vacuum chamber so that the vacuum value in the grooves is always smaller than or equal to that in the vacuum chamber. As a result, the substrates are firmly retained on the substrate table without warping, thereby improving the quality of substrate bonding.
H01L 21/18 - Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
An optical path compensation apparatus includes a wedge assembly, a driving mechanism and a preload unit. The wedge assembly includes a movable wedge and a fixed wedge. The movable wedge and the fixed wedge having equal wedge angles and respective wedge surfaces inclined in opposite directions. The preload unit is configured to elastically press the movable wedge on the fixed wedge, and the driving mechanism is configured to cause relative movement between the wedge surface of the movable wedge and the wedge surface of the fixed wedge. This optical path compensation apparatus is capable of achieving effective position correction of a focal plane of a measurement system for focusing and leveling in a smooth, convenient and precise way while not causing any error in other directions.
G02B 26/08 - Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
An optical collimating system, which is used to collimate a beam having a preset numerical aperture and a preset wavelength; the optical collimating system comprises a first plano-convex lens (L1), a first crescent-shaped convex lens (L2), a second crescent-shaped convex lens (L3), a third crescent-shaped convex lens (L4) and a first biconvex lens (5), which are located in sequence at a side of the object side.
G02B 9/60 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having five components only
G02B 9/34 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having four components only
G02B 9/12 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having three components only
Provided are a chip bonding apparatus and bonding method. The apparatus comprises: a chip supply unit (10); a substrate supply unit (20); a first pick-up assembly (30) arranged between the chip supply unit (10) and the substrate supply unit (20), comprising a first rotating component and a first pick-up head arranged on the first rotating component; a second pick-up assembly (40) comprising a second rotating component and a second pick-up head arranged on the second rotating component, wherein the first pick-up assembly (30) picks up a chip (60) from the chip supply unit (10) or the second pick-up assembly (40), and delivers the chip (60) onto a substrate of the substrate supply unit (20) to complete the bonding; and a vision unit (50) for realizing the alignment of the chip (60) and the substrate on the first pick-up assembly (30), wherein the chip supply unit (10), the substrate supply unit (20), the second pick-up assembly (40) and the vision unit (50) are respectively located on four work positions of the first pick-up head. The chip (60) is transported through rotation, improving the productivity of chip (60) bonding; and the chip (60) is reversed by utilizing the second pick-up assembly (40), which is compatible with two ways of bonding, i.e. a mark face of the chip (60) facing upwards and downwards.
A reticle cassette includes a bottom panel, a frame arranged on the bottom panel, and a top cover arranged on the frame, the bottom panel, the frame and the top cover defining a chamber with an opening, the reticle cassette further providing a door panel at one side of the opening. The bottom panel is provided thereon with a plurality of reticle supporting posts each separated from the frame by a lateral gap, and the frame has a longitudinal cross-section comprising H-shaped structures. A web and a bottom surface of the first vertical wall are separated from the bottom panel by vertical gaps. The gaps are arranged between the reticle supporting posts and the frame so as to make the reticle cassette suitable for use with both vacuum suction type and physical clamping type handling forks to pick up the reticle.
G03F 1/66 - Containers specially adapted for masks, mask blanks or pelliclesPreparation thereof
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
55.
Shifting-in/out mechanism, and shifting-in/out device used for workpiece table of photoetching machine
A shifting-in/out mechanism includes a connecting block, flat spring made of two segments connected by a hinge, spring deflection assembly and wheel assembly. One segment of the flat spring is connected to the wheel assembly and the other is mounted, by the connecting block, on an object to be moved. The spring deflection assembly provides a driving force for deflecting the segment of the flat spring connected to the wheel assembly toward a movement supporting surface. A shifting-in/out device for a workpiece stage of a photoetching machine includes a bottom frame, air spring, air-cushion device and plurality of the mechanisms arranged on a lower or side surfaces of the bottom frame. In the mechanism, the flat spring has two segments hinged together. All locations of the flat spring that are stressed to cause deflection of the flat spring are substantially on a single line.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
A shutter device includes a movable shading module and a movement control module configured to control movement of the movable shading module. The movable shading module includes a shading unit, a driving unit and a signal measuring unit. The shading unit includes two blades, and the movement control module is configured to generate a control signal. The driving unit is configured to receive the control signal and drive the two blades. The signal measuring unit is configured to measure an operating status of the blades feed it back to the movement control module in real time. The movement control module is configured to update the control signal based on the fed back operating status. This shutter device can overcome the problems of low exposure dose accuracy and light leaks arising from the use of existing shutters and provide various accurately-controlled exposure doses suitable for different applications.
A levellable reticle library assembly includes a reticle library assembly (4), a pivot assembly (3) and a frame assembly (2). The reticle library assembly (4) is disposed on the frame assembly (2) so that it is able to be leveled by the pivot assembly (3) via the frame assembly (2), and the reticle library assembly (4) can also be leveled by the frame assembly (2).
A debonding leveling device and a debonding method are for leveling during a process for debonding a first object and a second object. The first and second objects are retained by a first fixation plate (11) and a second fixation plate (21), respectively. The device includes: a mounting plate (30), disposed at an outer side of one of the first (11) and second (21) fixation plates; a connecting rod assembly (40) fixed around a center position of the mounting plate (30), the connecting rod assembly (40) connected to the one of the first (11) and second (21) fixation plates sequentially via a sliding pair (50) and a spherical pair (60) connected to the sliding pair (50); and at least three elastic assemblies (70) disposed between the mounting plate and the one of the first and second fixation plates, each of the elastic assemblies coupled to the mounting plate (30) and the one of the first (11) and second (21) fixation plates. The combination of the spherical pair and the sliding pair allows an adaptation of leveling objects to dynamic changes of the reference, and the elastic assemblies performs a leveling for the leveling objects in real-time based on an orientation of the reference. This entails a simple structure with a reasonable layout, which is easy to use in practice and is particularly helping in dynamic leveling applications without requiring an active control.
B32B 43/00 - Operations specially adapted for layered products and not otherwise provided for, e.g. repairingApparatus therefor
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B32B 38/10 - Removing layers, or parts of layers, mechanically or chemically
An apparatus and method for bonding alignment are provided. The apparatus for bonding alignment includes a press assembly and an objective lens group (105) disposed on one side of the press assembly. The press assembly includes a first chuck (103) and a rotatable second chuck (104). When support surfaces of the first and second chucks are not parallel to each other, the second chuck is rotated to make the two support surfaces parallel. A first substrate (301) is then loaded on the first chuck, and alignment marks (302) on the first substrate are observed using the objective lens group disposed on one side of the press assembly. A second substrate (501) is loaded on the second chuck, and alignment marks (502) on the second substrate are also observed with the objective lens group. Based on an observation result by the objective lens group, the two substrates are moved so that the alignment marks thereon are aligned and hence the two substrates themselves are aligned. In this method, the chucks are adjusted, prior to the alignment of the substrates. This dispenses with the need for employment of high-precision components and reduces the complexity of the apparatus. Moreover, adjusting the chucks first can ensure control of a global alignment accuracy between the substrates, and in particular, can reduce wedge-shaped errors between the substrates that may result from deformations of the substrates during bonding.
B32B 41/00 - Arrangements for controlling or monitoring lamination processesSafety arrangements
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
H01L 23/544 - Marks applied to semiconductor devices, e.g. registration marks, test patterns
An edge exposure apparatus and method are disclosed. The edge exposure apparatus includes: a base frame (1); an edge exposure unit (2) mounted on the base frame and configured to perform an edge exposure process on a wafer; a pre-alignment unit (3) for centering and orienting the wafer and cooperating with the edge exposure unit (2) in the edge exposure process; a cassette unit (4) for storing and detecting the wafer; a robotic arm (5) for transferring the wafer; and a master control unit (6) for controlling the above components of the edge exposure apparatus. The edge exposure unit (2) and the pre-alignment unit (3) share a common worktable, resulting in structural compactness. Alternatively, two pre-alignment units (3) and two edge exposure units (2) may be included in order to increase processing efficiency.
G03F 9/00 - Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
61.
Machine vision system for substrate alignment and alignment device
A machine vision system for substrate alignment includes first and second illumination sources (11, 12), first and second reflectors (21, 22), first and second objective lenses (31, 32) and first and second detectors (41, 42), each of which pair is symmetric with respect to an X-axis. Light beams emitted from the first and second illumination sources are irradiated on and reflected by respective substrates (1, 2), amplified by the respective objective lenses and received and detected by the respective detectors. An alignment apparatus is also disclosed. Disposing each of the pair of the first and second illumination sources, the first and second reflectors, the first and second objective lenses and the first and second detectors in symmetry with respect to the X-axis results in a significantly reduced footprint of the machine vision system along the orientation of lens barrels of the objective lenses and hence an expanded detection range thereof and improved alignment efficiency and accuracy.
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
G01B 11/27 - Measuring arrangements characterised by the use of optical techniques for measuring angles or tapersMeasuring arrangements characterised by the use of optical techniques for testing the alignment of axes for testing the alignment of axes
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 23/00 - Details of semiconductor or other solid state devices
62.
Knife edge set of mask aligner, large-view-field mask aligner, and exposure method
A shutter blade assembly for a photolithography machine, a large-field of view (FoV) photolithography machine and an exposure method are disclosed. A scanning-directional shutter blade subassembly is moved once during each illuminance test and then moved above alignment marks after the test. During exposure, the scanning-directional shutter blade subassembly moves with a mask stage in the same direction and at the same speed so that it stays stationary relative to the alignment marks on a photomask (4). In case of full-FoV exposure, it is not necessary for a non-scanning-directional shutter blade subassembly to be moved, while in case of partial-FoV exposure, it is moved into the partial exposure FoV and defines there a window for obtaining a light spot with a desired shape by modulating illumination light. After that, with the non-scanning-directional shutter blade subassembly being maintained stationary, the exposure FoV can be shifted from the current exposed region to a new region to be exposed simply by moving the mask and wafer stages. This process can be repeated until all the regions to be exposed have been exposed. Since the need for multiple shutter blade assemblies is dispensed with, structural simplification can be achieved, the requirements for control accuracy can be lowered.
A beam splitting device comprises a first wedge-shaped beam splitter (11) and a second wedge-shaped beam splitter (12) sequentially arranged in a beam transmission direction. The first wedge-shaped beam splitter (11) and the second wedge-shaped beam splitter (12) are configured such that a first transmissive light beam (1-T) is produced after an incoming light beam (1) has passed through the first wedge-shaped beam splitter (11), and a second transmissive light beam (2-T) parallel to the incoming light beam (1) is formed after the first transmissive beam (1-T) has passed through the second wedge-shaped beam splitter (12).
A method for detecting degree of particulate contamination on a flat panel mainly includes the following steps: illuminating a to-be-detected flat panel (40) by using a light source module (10), to form an illumination field; adjusting a half width of the illumination field; adjusting a luminous intensity at a center of the illumination field and a luminous intensity at an edge of the half width of the illumination field; adjusting a light intensity and a position of the light source, as well as a position of a detector (20); and acquiring signals from foreign objects on the flat panel by using the detector (20). This method greatly alleviates particle mirror crosstalk and crosstalk of patterns on the lower surface of the flat panel, and improves the SNR, thus enhancing the accuracy in detection of foreign objects on the flat panel.
Provided is an exposure machine, comprising: a core exposure measuring frame, an inner support frame, and a position adjustment assembly, wherein the core exposure measuring frame is provided with an exposure system and a measuring system, the inner support frame is provided with a motion platform system, the position adjustment assembly is respectively connected to the core exposure measuring frame and the inner support frame, and the position adjustment assembly is configured to be able to structurally deform when the inner support frame moves and deforms with the motion platform system, so as to adjust the relative positions of the motion platform system and the exposure system, such that the relative positions of the motion platform system and the exposure system do not change.
A device for moving a workpiece platform is provided, comprising a bottom frame (1) for supporting the workpiece platform, a pneumatic spring (2) disposed on a lower surface of the bottom frame (1), an air cushion unit (3) for generating flotation to support the workpiece platform when the workpiece platform is being moved, and a moving unit (200) disposed on the bottom frame (1). The moving unit (200) comprises: a roller unit (4), for driving the workpiece platform to move; a leaf spring (6), wherein one end of the leaf spring (6) is connected to a connecting block (5), and the other end thereof is connected to the roller unit (4); and a leaf spring deformation drive unit (8), connected to the leaf spring (6), to enable, by driving the leaf spring (6) to deform, the roller unit (4) to be in contact with the ground when the workpiece platform is being moved. The leaf spring deformation drive unit (8) is disposed such that the leaf spring (6) deforms, and the roller unit (4) is in contact with the ground when the workpiece platform is being moved in or out, driving the workpiece platform to move, preventing jamming in case of extremely high torque, and improving stability when the workpiece platform is being moved.
A method for rewiring of semiconductor devices is provided, in which deviations of electrical connection terminals (211, 212, 221, 222, 231, 232) on a carrier (100) are calculated and corrected by forming rewiring structures on the electrical connection terminals by mask-free photolithography. A wiring layer and/or solder balls (700) is/are then formed on the rewiring structures by processing the carrier (100) in a monolithic manner using mask-based photolithography. In this way, the combined use of mask-free photolithography and mask-based photolithography allows for higher efficiency and a shorter process cycle, compared to only using mask-free photolithography.
A universal chip batch-bonding apparatus and method. The apparatus comprises a material pick-and-place area and a transfer work area. The material pick-and-place area comprises a blue tape pick-and-place area (110) for providing a chip (113) and a substrate pick-and-place area (120) for placing a substrate (123), the blue tape pick-and-place area (110) and the substrate pick-and-place area (120) being separately arranged at two ends of the transfer work area. The transfer work area sequentially comprises a chip pickup and separation area (210), a chip alignment and fine-tuning area (220), and a chip batch-bonding area (230) in a direction running from the blue tape pick-and-place area (110) to the substrate pick-and-place area (120). A chip carrier transfer apparatus (300) is provided in the transfer work area, and the chip carrier transfer apparatus (300) passes through the transfer work area and is used to move and supply materials among the chip pickup and separation area (210), the chip alignment and fine-tuning area (220), and the chip batch-bonding area (230). By means of a compatible design, the apparatus is suitable for both die-up and die-down attachment modes, expanding the application scope of the apparatus. In addition, the modular design can be configured according to requirements, increasing market potential.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 23/00 - Details of semiconductor or other solid state devices
A flip-chip bonding device and method are disclosed. The bonding device includes: a supply unit (10) for separating a flip-chip (200) from a carrier (100) and providing the flip-chip (200), the supply unit (10) including flipping device (11); a transfer unit (20) for receiving the flip-chip (200) from the flipping device (11); a position adjustment unit (30) for adjusting the positions of flip-chips (200) on the transfer unit (20); a bonding unit (40) for bonding the flip-chips (200) on the transfer unit (20) onto a substrate (400); a transportation unit (50) for transporting the transfer unit (20); and a control unit (60) for controlling the movement of the preceding units. The transfer unit (20) is capable of receiving multiple flip-chips (200) and allows the flip-chips (200) to be bonded simultaneously. This can result in savings in bonding time and an improvement in throughput. Moreover, during the transportation of the transfer unit (20), the positions of the flip-chips (200) thereon can be adjusted by the position adjustment unit (30), thereby ensuring high positional accuracy of the flip-chips (200) in the subsequent bonding step. As a result, a high-accuracy bonding can be achieved.
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
H01L 21/50 - Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups or
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H05K 13/08 - Monitoring manufacture of assemblages
Provided are a clearing apparatus (210), a lithography device (200) and a lithography method. The clearing apparatus (210) comprises: a suction unit (211) and a negative-pressure passage (212). The suction unit (211) is located on a surface of a workpiece platform, the negative-pressure passage (212) is located inside the workpiece platform, and the negative-pressure passage (212) is in communication with the suction unit (211) and provides negative pressure to the suction unit (211). When a grating panel (260) contains an immersion liquid, the grating panel can be cleaned by means of negative-pressure suction so as to reduce the frequency of wiping or replacing a grating panel (260) and also reduce secondary pollution of a grating panel (260), thereby improving the convenience and reliability of cleaning for a grating panel (260).
A workpiece table system and a photolithography device, wherein the workpiece table system comprises a base frame (100), a base (200), a moving assembly, a balance mass assembly (600), a gravity compensation apparatus (700), and a transmission apparatus; the base (200) is fixed on the base frame (100); the moving assembly is configured to provide a driving force for the movement of a stage (500); the balance mass assembly (600) is movably arranged on the base frame (100); a stator portion (301) of the moving assembly is fixed to the balance mass assembly (600); a mover portion (302) drives the stage (500) to move relative to the stator portion (301), and a reverse force thereof drives the balance mass assembly (600) to move in the opposite direction; the gravity compensation apparatus (700) is located between the base frame (100) and the base (200) and is configured to perform vertical gravity compensation on a load on the base (200); the balance mass assembly (600) drives the gravity compensation apparatus (700) to synchronously move in the same direction as the stage (500) by means of the transmission apparatus.
A manipulator, a bonding cavity, a wafer bonding system, and a bonding method. The manipulator comprises: a tray (10); at least three wafer positioning columns (20) fixed on the tray (10); at least three first wafer spacing mechanisms (30) fixed on the tray (10), each first wafer spacing structure (30) comprising a first wafer spacer (31), and a first driving member (32) configured to drive the first wafer spacer (31) to enter a wafer holding region of the tray (10).
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
73.
MULTI-WAVELENGTH OPTICAL SYSTEM AND LASER ANNEALING DEVICE
Disclosed by the present application are a multi-wavelength optical system and a laser annealing device. The multi-wavelength optical system comprises: a reference optical path unit, at least one optical path unit to be adjusted, a focal plane compensation unit, and a focusing unit; wherein one focal plane compensation unit is disposed in each optical path of the optical path unit to be adjusted; the light wavelengths of the reference optical path unit and the optical path unit to be adjusted are not equal; each focal plane compensation unit is configured to change an optical path of the corresponding optical path unit to be adjusted, so that light beams of the optical path unit to be adjusted are focused on a second focal plane after passing through the focusing unit; and light beams of the reference optical path unit are focused on the first focal plane after passing through the focusing unit, and the second focal plane and the first focal plane are of a confocal plane.
Disclosed by the embodiments of the present invention are a sensor, a mask plate fork, a manipulator, a mask plate transmission system and a lithography machine. The sensor comprises a voltage regulator module, a photoelectric sensing module, a signal amplification module and a signal detection module; the voltage regulator module is electrically connected to the photoelectric sensing module and the signal amplification module; the photoelectric sensing module is configured to detect whether a target object reaches a set area; the signal amplification module is electrically connected to the photoelectric sensing module; and the signal detection module is electrically connected to both the voltage regulator module and the signal amplification module, and the signal detection module is configured to determine the current working state of a sensor on the basis of a signal outputted in a signal amplification mode.
A grid error measurement method and a measurement device, and optical equipment. The grid error measurement method comprises: acquiring first actual position information about a preset alignment measurement mark on a substrate by means of a position measurement system in optical equipment, the substrate being horizontally adsorbed on a substrate adsorbing table of the optical equipment at a first angle, and a first direction being perpendicular to the second direction (S110); acquiring second actual position information about the preset alignment measurement mark by means of the position measurement system, the substrate being horizontally absorbed on the substrate adsorbing table at a second angle, and the second angle being different from the first angle (S120); and calculating the grid error of the position measurement system according to the first actual position information, the second actual position information, and the standard position information of the preset alignment measurement mark (S130).
G01B 21/04 - Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness by measuring coordinates of points
76.
DEFECT INSPECTION APPARATUS AND DEFECT INSPECTION METHOD
A defect inspection apparatus and a defect inspection method. The defect inspection apparatus comprises an illumination module (20) and an imaging inspection module (30). The illumination module (20) is configured to generate a detection light beam (201), and to make the detection light beam (201) incident to the inspection surface of a product to be inspected (40). The imaging inspection module (30) is configured to detect whether the detection light beam (201) is scattered by the inspection surface of said product (40) so as to generate a scattered imaging light beam (301), and if detecting the scattered imaging light beam (301), to determine defect information of said product (40) according to the scattered imaging light beam (301). The illuminance of the detection light beam (201) satisfies: (U1×R)/(U2×L)≥S1, wherein S1 is a signal-to-noise ratio needing to be satisfied to suppress crosstalk on the non-inspection surface of said product (40), U1 is the central illuminance of the detection light beam (201), R is the scattering efficiency of light by the minimum inspectable defect at a receivable angle, U2 is the illuminance of the half-width edge of the detection light beam (201), and L is the scattering efficiency of light by the maximum crosstalk object on the non-detection surface at a receivable angle. The half width W of the detection light beam (201) satisfies: d×(tanα+tanβ)>FOV/2+W, wherein d is the thickness of said product (40), FOV is an effective field of view of the imaging inspection module (30), α is the angle of refraction of the detection light beam (201) in said product (40), and β is the angle of refraction of the scattered imaging light beam (301) in said product (40).
A lithography machine luminance uniformity compensation method is provided. In the invention, luminance distribution data produced by an illumination system in respect of a reference surface is collected over a certain period of time, so that at different periods in the life cycle of the illumination system compensation regions corresponding to each period may be arranged on a compensation surface in the path of exposed light, such that the intensity of light incident on the reference surface may be compensated. In this way, luminance uniformity during the life cycle of the illumination system may satisfy control requirements. By means of introducing compensation-operation positions, luminance uniformity pre-compensation processing may be carried out for the entire life cycle of the illumination system. The invention not only achieves uniform compensation, but also extends the uniform compensation life cycle, thereby reducing cost, improving reliability, and reducing manufacturing cost and technical difficulty. Moreover, because a compensation panel is configured to rotate about a central axis to achieve compensation-operation position switching, the number of moving mechanisms is reduced and the control scheme is optimized. A lithography machine luminance uniformity compensation device, an illumination system comprising the device, and a lithography machine comprising the system are also provided.
A polarization aberration measuring method for a projection objective lens, comprising: calculating the Jones matrix of a projection objective lens (PO) by means of a light intensity matrix constructed by all groups of light intensity values that is measured on the basis of a light intensity measuring device (IS) and a λ function matrix constructed by all selected elements, so as to directly calculate the Jones matrix of the projection objective lens (PO), effectively avoiding the resultant error caused by the depolarization effect of transitioning the Mueller matrix to the Jones matrix, improving the measurement and calculation accuracy.
Disclosed is a mask transfer system, comprising: an external template repository unit (2), a template picking and placing manipulator unit (1), a granularity detection unit (3), an internal template repository unit (4) and a template exchange manipulator unit (5), wherein the template picking and placing manipulator unit (1) comprises: a template fork (100), an inching adjustment structure (120), a control box (300) and a mechanical arm (200), the template fork (100) being rigidly connected to the mechanical arm (200), and the control box (300) being disposed on the mechanical arm (200). The levelness of the template fork (100) of the template picking and placing manipulator unit (1) is adjusted by means of the inching adjustment structure (120), thereby improving the accuracy of the template picking and placing manipulator unit (1) exchanging a template with the external template repository unit (2), the internal template repository unit (4), the granularity detection unit (3) and the template exchange manipulator unit (5).
G12B 5/00 - Adjusting position or attitude, e.g. level, of instruments or other apparatus, or of parts thereofCompensating for the effects of tilting or acceleration, e.g. for optical apparatus
A focusing and leveling device calculates an amount of defocus and/or tilt of a substrate and includes an illumination unit, projection-side mark plate with projection-side slit mark, projection-side imaging group, deflection prism, beam splitter, detection unit and signal processing unit. A light beam emitted from the illumination unit passes through the projection-side mark plate and is trimmed into a probe beam directed by the projection-side imaging group onto a substrate surface. The prism deflects the probe beam reflected by the surface of the substrate for a first time so that it is incident on the substrate surface and reflected for a second time onto the projection-side imaging group. The beam splitter directs the probe beam that travelled through the projection-side imaging group onto the detection unit. The signal processing unit calculates the amount of defocus and/or tilt based on a measurement spot detected by the detection unit.
A shutter device includes a light blocking unit and a voice coil motor. The voice coil motor includes a permanent magnet module, a guide track assembly and a coil assembly. The coil assembly is arranged on the guide track assembly, and the permanent magnet module is adapted to produce a magnetic field in the guide track assembly. The light blocking unit includes two shutter blades both connecting to the coil assembly. When energized, the coil assembly will produce a magnetic field having a direction same as or opposite to the direction of the magnetic field in the guide track assembly so that the coil assembly moves forward or backward along the guide track assembly to drive the two shutter blades to open or close. A method controls the shutter device. An exposure dose control method is used with a photolithography machine including the shutter device.
G03B 9/22 - More than two members each moving in one direction to open and then in opposite direction to close, e.g. iris type
G03B 9/62 - Means for varying duration of "open" period of shutter by varying interval of time between end of opening movement and beginning of closing movement
H02K 33/12 - Motors with reciprocating, oscillating or vibrating magnet, armature or coil system with armatures moving in alternate directions by alternate energisation of two coil systems
A batch bonding apparatus and bonding method. The bonding apparatus comprises: a chip supply unit (10) for providing a chip (60) to be bonded; a substrate supply unit (20) for providing a substrate; a transfer unit (40) for transferring the chip (60) between the chip supply unit (10) and the substrate supply unit (20); and a pickup unit (30) disposed above the chip supply unit (10), for picking up the chip (60) from the chip supply unit (10) and uploading the chip (60) to the transfer unit (40) after flipping a marked surface of the chip (60) in a required direction. In the present invention pickup of each chip is completed individually, but transfer processes and bonding processes can be carried out for multiple chips at the same time, greatly increasing yield.
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 23/544 - Marks applied to semiconductor devices, e.g. registration marks, test patterns
A chip bonding apparatus includes a chip separation unit, a chip alignment unit, a chip bonding unit and a bonding robotic arm unit. The bonding robotic arm unit includes a first bonding robotic arm unit and a second bonding robotic arm unit. The first bonding robotic arm unit includes a first motion stage, a first driver configured to drive the first motion stage and at least one first bonding robotic arm arranged on the first motion stage. The first bonding robotic arm is configured to suck up a chip from the chip separation unit and deliver it to the chip alignment unit. The second bonding robotic arm unit includes a second motion stage, a second driver configured to drive the second motion stage and at least one second bonding robotic arm arranged on the second motion stage.
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
B65G 47/91 - Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
84.
Shutter device used for exposure in lithography machine, and method for use thereof
A shutter device for use in exposure by a photolithography machine and a method of using the shutter device are disclosed. The device includes a shutter blade (1); a rotating motor (2) for driving the shutter blade (1) to rotate; a controller in electric connection with the rotating motor (2); and a supporter (3) for supporting the rotating motor (2). The shutter blade (1) includes a rotation center (11) and, disposed in correspondence with the rotation center (11), at least one open portion (12) and at least one shielding portion (13). The rotation center (11) is coupled to the rotating motor (2) which drives the shutter blade (1) to rotate so that the shutter device opening and closure are accomplished to enable and disable exposure. The shielding portion (13) includes a hollow portion (131) which significantly reduces the mass of the shutter blade (1), thereby facilitating the control over the rotation of the shutter blade (1). Under the control of the controller, the opening and closing of the shutter is accomplished during rotation of the shutter blade (1) at a constant speed, while the acceleration and deceleration of the shutter blade (1) take place in the period when the shutter device is in a closed state, which is relatively long and allows a large stroke. This significantly reduces the required torque of the rotating motor (2) and effectively shortens the shutter opening and closing time.
An optical alignment device and a replacement method for a lamp thereof. The optical alignment device comprises: a light source (100), a steering component (200), a rail (300), and a moveable gripper (400). The light source (100) comprises at least one lamp (111). The steering component (200) is connected to the light source (100), and is configured to switch the light source (100) between a first state and a second state, wherein the first state is a working state and the second state is a state in which the lamp (111) is opposite the moveable gripper (400). The rail (300) extends from a maintenance door of the optical alignment device to the light source (100), and the positioning thereof is configured to be a motion path of the moveable gripper (400). The moveable gripper (400) is configured to grip a lamp to be replaced or a new lamp of the light source (100) and move the same along the rail (300).
Disclosed by the present application are a method and device for determining the spatial position shape of an object, a storage medium and a robot. The method for determining the spatial position pattern of an object comprises: acquiring a binocular visual image of an object to be tested and a standard mark by means of a binocular vision device; correcting and fitting the binocular visual image of the object to be tested so as to obtain a range image of the object to be tested in a world coordinate system, and determining a point cloud data image of the object to be tested according to the range image; determining point cloud data of an upper surface and the center position of the upper surface as position data of an object to be tested; and determining shape data of the object to be tested according to a fitting surface of the point cloud data of the upper surface of the object to be tested and the distance between the center position of the upper surface of the object to be tested and a boundary position of the point cloud data of the upper surface of the object to be tested.
The present application discloses an illumination system, an exposure system and a photolithography apparatus. The illumination system comprises: a light source, a beam adjustment module located on a light exiting side of the light source, and a polarization state adjustment module provided between the light source and the beam adjustment module. The beam adjustment module comprises a cone mirror assembly, wherein the cone mirror assembly is coated with an optical film layer having different transmission rates with respect to s light and p light. The polarization state adjustment module comprises a wave plate, wherein the wave plate forms a first included angle with a plane perpendicular to an optical axis of the illumination beam. The polarization state adjustment module is configured to change the polarization state of an illumination beam from linearly polarized to partially polarized, such that a pupil has energy distribution in both horizontal and vertical directions, thereby changing ellipticity of the pupil.
A worktable and a back side alignment device, relating to the technical field of integrated circuit manufacturing. The worktable comprises a horizontal base (1), an air-support plate (2), a suction cup (5), and a first air guide assembly (6); the horizontal base (1) is provided with a light transmission hole (11) penetrating the top and bottom surfaces of the horizontal base (1); the air-support plate (2) is disposed on the horizontal base (1) and is movable on a horizontal plane with respect to the horizontal base (1); a plurality of first light passing holes (211) spaced apart from each other is provided on the air-support plate (2), one of the plurality of first light passing holes (211) being communicated with the light transmission hole (11) when the air-support plate (2) moves above the horizontal base (1); the suction cup (5) is disposed above the air-support plate (2) and can rotate in three degrees of freedom with respect to the air-support plate (2) and translate in the vertical direction; the suction cup (5) is provided with second light passing holes (51) at positions corresponding to the first light passing holes (211); the upper surface of the suction cup (5) is provided with a first suction air passage for sucking a substrate (20); a first end of the first air guide assembly (6) is communicated with the air-support plate (2), and a second end of the first air guide assembly (6) is communicated with the first suction air passage.
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
89.
Pattern structure and exposure method of patterned sapphire substrate mask
A pattern structure of a photomask for a patterned sapphire substrate (PPS) and an exposure method are disclosed. The pattern structure is formed by stitching a plurality of identical polygons each including at least two sector-shaped opaque areas (7) and one transparent area (2). The polygons are joined together by stitching the sector-shaped opaque areas (7) into round opaque areas (1). Boundary areas of the photomask that are unable to accommodate a complete one of the polygons are configured as opaque areas (1). This pattern structure ensures that the round opaque areas (1) near the frames will not be affected by lighting conditions. During the exposure of another identical PSS photomask pattern, it only needs to superimpose it with the first photomask pattern at their frames to allow the part other than the frame to be exposed. In this way, the photomask pattern and exposure method solves the problem of blurred pattern image edges arising from excessively narrow gaps between photomask frames and opaque areas (1).
G03F 1/90 - Originals for photomechanical production of textured or patterned surfaces, e.g. masks, photo-masks or reticlesMask blanks or pellicles thereforContainers specially adapted thereforPreparation thereof prepared by montage processes
A grating measuring device includes: a light source module (300) for generating two light beams having different frequencies, one of which serves as a measuring beam and the other as a reference beam; a grating (200); and a grating measuring probe (100) including a dual-frequency light reception module, a vertical measurement module, a vertical detection module and a reference detection module. The dual-frequency light reception module is configured to receive the measuring and reference beams, and the vertical measurement module is adapted to project the measuring beam onto the grating (200), collect a zeroth-order diffracted beam resulting from double diffraction occurring at the grating, and feed the zeroth-order diffracted beam to the vertical detection module. The zeroth-order diffracted beam interferes with the reference beam in the vertical detection module, resulting in a vertical interference signal. In addition, the measuring and reference beams interfere with each other also in the reference detection module to result in a reference interference signal. The vertical and reference interference signals are received by a signal processing module and serve as a basis for calculating a vertical displacement of the grating (200). This grating measuring device allows a great vertical displacement measurement range at any working distance.
A device and method for measuring amplitude of a scanning mirror are disclosed. The device includes a light source (20) for outputting an optical signal; a diaphragm (21) for modifying size and shape of a light spot of the optical signal output by the light source (20); a scanning mirror retainer for placing a scanning mirror (22) to be measured, the scanning mirror, after being retained, being able to periodically reflect the optical signal; a photoelectric sensor (23) including three or more sensing elements and configured to detect and collect the optical signal reflected by the scanning mirror (22); and a signal acquisition and processing unit (24) for processing a signal collected by the photoelectric sensor (23) to derive an amplitude of the scanning mirror (22). Therefore, it is possible to characterize the scanning mirror (22) before the scanning mirror (22) is used, determining performance of the scanning mirror (22).
H01J 3/14 - Arrangements for focusing or reflecting ray or beam
G01J 1/42 - Photometry, e.g. photographic exposure meter using electric radiation detectors
G02B 26/08 - Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
Provided is a mask thickness measurement device, comprising: a thickness measurement sensor, comprising a laser transmitting and receiving end (121), the laser transmitting and receiving end (121) being located at one side of a mask (110) and configured to transmit laser along the horizontal direction of the mask (110) to irradiate the mask (110), and to receive the reflected laser; a driving part configured to drive the mask (110) or the thickness measurement sensor to move, so that the mask (110) and the thickness measurement sensor move relatively along the thickness direction of the mask (110); and a thickness calculation unit configured to calculate thickness information of the mask (110) according to a laser signal received by the laser transmitting and receiving end (121) and the movement position of the mask (110) or the thickness measurement sensor. Also provided are a mask storage mechanism comprising the mask thickness measurement device, a transmission mechanism, and a photolithography system.
Provided is a substrate edge protection device (100), including: a base (110), a grib component (120) provided at a working side edge of the base (110) and configured to grip and secure a base edge protection ring (130), and a warpage processing mechanism (140) provided on the working side of the base. The warpage processing mechanism (140) includes a plurality of blow holes on a work surface, and air intake holes in communication with the plurality of blow holes, so that air is blown to the substrate by means of the plurality of blow holes so as to level the substrate. Further provided are a lithographic apparatus for the substrate edge protection device (100) and a corresponding substrate edge protection method.
A system and method for controlling an exposure dose of a light source are disclosed. The system includes an LED light source, a light homogenizer, an energy detection unit and an exposure dose control unit coupled to both the LED light source and the energy detection unit. The energy detection unit includes an energy detector corresponding to the LED light source or the light homogenizer and an energy spot sensor corresponding to a wafer. By using the LED light source capable of producing UV light in lieu of an existing mercury lamp, the system is less hazardous and safer by eliminating the risk of discharging hazardous mercury vapor into the environment when the mercury lamp is broken. Moreover, exposure illuminance of the LED light source can be adjusted and the LED light source can be turned on/off under the control of exposure dose control unit to expose the wafer with high dose control accuracy, without needing to use a variable attenuator or an exposure shutter. This reduces the system's complexity and cost and increases its reliability.
A measurement device and method for focusing and leveling are disclosed. The device includes a measuring optical path and a first monitoring optical path. Measuring light in the measuring optical path interacts with a wafer and is then incident on a measuring detector to form thereon a measuring mark. First monitoring light in the first monitoring optical path is incident on a measuring detector to form thereon a first monitoring mark. An error in a measurement result of the wafer that arises from a drift of the measuring detector can be eliminated by compensating for a vertical deviation of the wafer obtained by subtracting a drift of the first monitoring mark from a displacement of the measuring mark. In this way, measurement accuracy and stability can be improved by monitoring and correcting the drift of the measuring detector.
G03B 21/14 - Projectors or projection-type viewersAccessories therefor Details
G01B 11/25 - Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. moiré fringes, on the object
G02B 27/09 - Beam shaping, e.g. changing the cross-sectioned area, not otherwise provided for
An automatic optical inspection (AOI) device and method are disclosed. The device is adapted to inspect an object under inspection (OUI) (102) carried on a workpiece stage (101) and includes: a plurality of detectors (111, 112) for capturing images of the OUI (102); a plurality of light sources (121, 122) for illuminating the OUI (102) in different illumination modes; and a synchronization controller (140) signal-coupled to both the plurality of detectors (111, 112) and the plurality of light sources (121, 122). The synchronization controller (140) is configured to directly or indirectly control the plurality of detectors (111, 112) and the plurality of light sources (121, 122) based on the position of the OUI (102) so that each of them is individually activated and deactivated according to a timing profile, that each of the detectors (111, 112) is able to capture images of the OUI (102) in an illumination mode provided by a corresponding one of the light sources (121, 122), and that when any one of the light sources (121, 122) is illuminating the OUI (102), only the one of the detectors (111, 112) corresponding to this light source (121, 122) is activated. Through the timing control over the multiple light sources (121, 122) and detectors (111, 112) by the synchronization controller (140), inspection with multiple measurement configurations can be accomplished within a single scan, resulting in a significant improvement in inspection efficiency.
Provided is a safety shutter device for a photoetching machine. The safety shutter device comprises a casing (10) provided with a light through hole (11), a driving body (20), an execution body (30) and a transmission body (40). The driving body (20) is mounted on an outer wall of the casing (10). The execution body (30) can move between a first position completely shielding the light through hole (11) and a second position completely not shielding the light through hole (11). The transmission body (40) is respectively connected to the driving body (20) and the execution body (30), and the driving body (20) is configured to drive the execution body (30) via the transmission body (40) to shield or open the light through hole (11).
Provided is a liquid tank (1), comprising a tank (100), a partition plate (101) arranged in the tank (100), and an air discharge pipe (102) communicating the interior of the tank (100) and the external environment, wherein the tank (100) comprises a liquid inlet cavity (200) and a liquid outlet cavity (300) divided by the partition plate (101), the bottom of the liquid inlet cavity (200) is in communication with the bottom of the liquid outlet cavity (300), and the top of the liquid inlet cavity (200) is in communication with the top of the liquid outlet cavity (300); the partition plate (101) is configured to prevent bubbles generated in the liquid inlet cavity (200) from flowing into the liquid outlet cavity (300); and the air discharge pipe (102) is configured to discharge the overflowing bubbles.
An optical measurement device includes: a deformation measurement device for measuring magnitude of deformation of an optical detection platform frame, and a correction module for correcting the position of a substrate carrier and/or the position of an optical detection device according to the magnitude of deformation of the optical detection platform frame, so as to eliminate an error in measurement of mark positions due to deformation of the frame. An optical measurement method is also disclosed.
A photo-alignment control method and a photo-alignment apparatus are disclosed. In the photo-alignment control method, a yaw angle of a motion stage (130) relative to a polarizing illumination device (110) is detected to derive a weighted dynamic polarization angle deviation of a substrate (200), so that a rotational angle of a rotary table (120) for rotating a substrate (200) is controlled, thereby effectively improving a control accuracy of a polarization angle in the photo-alignment process and further to ensure an accuracy of an alignment angle formed in an alignment film.
G02F 1/1337 - Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
