The invention relates to a measuring device (10; 10a) for a machining system (12; 12a) for machining a workpiece (14; 14a) using a high-energy machining beam (16; 16a), wherein the measuring device (10; 10a) comprises a beam generating unit (18; 18a) configured to generate a sample beam (20; 20a) and a reference beam (22; 22a) that can be caused to interfere for the performance of optical interference measurements such as optical coherence tomography; a sample arm (24; 24a) that is optically connected to the beam generating unit (18; 18a) and in which the sample beam (20; 20a) is optically guided so that it can be projected onto the workpiece (14; 14a); a reference arm (26; 26a) that is optically connected to the beam generating unit (18; 18a) and in which the reference beam (22; 22a) is optically guided; and a measuring interface (28; 28a) that can be used to couple the sample beam (20; 20a) into the machining beam (16; 16a); the measuring device (10; 10a) comprising a base module (30; 30a) and an interchangeable module (32; 32a) that is connectable or connected thereto. The interchangeable module (32; 32a) comprises a beam guiding portion (48a) that includes optical components (50a) for guiding the sample beam (20a) and/or the reference beam (22a) and that is configured to form a central portion (52; 52a) of the sample arm (24; 24a) and/or the reference arm (26; 26a).
The invention relates to a measuring device (10; 10a) for a machining system (12; 12a) for machining a workpiece (14; 14a) using a high-energy machining beam (16; 16a), wherein the measuring device (10; 10a) comprises a beam generating unit (18; 18a) configured to generate a sample beam (20; 20a) and a reference beam (22; 22a) that can be caused to interfere for the performance of optical interference measurements such as optical coherence tomography; a sample arm (24; 24a) that is optically connected to the beam generating unit (18; 18a) and in which the sample beam (20; 20a) is optically guided so that it can be projected onto the workpiece (14; 14a); a reference arm (26; 26a) that is optically connected to the beam generating unit (18; 18a) and in which the reference beam (22; 22a) is optically guided; and a measuring interface (28; 28a) that can be used to couple the sample beam (20; 20a) into the machining beam (16; 16a); the measuring device (10; 10a) comprising a base module (30; 30a) and an interchangeable module (32; 32a) that is connectable or connected thereto. The interchangeable module (32; 32a) comprises a beam guiding portion (48a) that includes optical components (50a) for guiding the sample beam (20a) and/or the reference beam (22a) and that is configured to form a central portion (52; 52a) of the sample arm (24; 24a) and/or the reference arm (26; 26a).
The invention further relates to a system comprising a measuring device (10; 10a) and a plurality of interchangeable modules (32, 32′, 32″), a machining system (12; 12a) and a method for adjusting a measuring device (10; 10a).
The invention relates to a measuring device for performing measurements on a workpiece, which are used to prepare and/or assess a weld seam produced by a welding device and having an initial portion and/or an end portion. The measuring device comprises a measuring unit comprising an optical coherence tomograph including a sample beam and sample, wherein the sample beam can be selectively focused on different measuring positions relative to a current machining position along the weld seam. The measuring device further comprises a fastening unit configured to attach at least the sample head to the welding device, and a control unit configured to dynamically adjust the leading beam and/or the trailing beam during machining along the weld seam. The invention further relates to a machining system, a method for performing measurements on a workpiece, and a method for machining a workpiece.
The invention relates to a measuring device for performing measurements on a workpiece which are used to prepare and/or assess a weld seam produced by a welding device and having an initial portion and/or an end portion. The measuring device comprises a measuring unit comprising an optical coherence tomograph including a sample beam source, wherein the sample beam can be selectively focused on different measuring positions relative to a current machining position along the weld seam. The measuring device further comprises a fastening unit which is configured to attach at least the sample head to the welding device, and a control unit which is configured to dynamically adjust the leading beam and/or the trailing beam during machining along the weld seam. The invention further relates to a machining system, a method for performing measurements on a workpiece, and a method for machining a workpiece.
G01B 9/02091 - Tomographic interferometers, e.g. based on optical coherence
G01N 33/207 - Welded or soldered jointsSolderability
4.
METHOD, MEASURING DEVICE, MACHINING SYSTEM AND COMPUTER PROGRAM PRODUCT FOR DETERMINING A CORRECTED HEIGHT SIGNAL FROM MEASUREMENT DATA OBTAINED WITH OPTICAL COHERENCE TOMOGRAPHY
A method, measuring device, machining system and computer program product are provided for determining a corrected height signal from measurement data obtained with optical coherence tomography. The measurement data comprises an object signal and a background signal superimposed on the object signal, the object signal and the background signal being subject to different dispersion. A first transformation is performed comprising transforming the measurement data, the first transformation being targeted at the background signal to obtain a height signal, background components in the height signal are determined, the background components in the height signal are compensated to obtain a background-compensated height signal, an inverse transformation is performed comprising back-transforming the background-compensated height signal to obtain background-compensated measurement data, dispersion compensation for the object signal is performed to obtain dispersion-compensated and background-compensated measurement data, and a second transformation is performed comprising transforming the dispersion-compensated and background-compensated measurement data to obtain a dispersion-compensated and background-compensated height signal.
The invention relates to a measuring device (10; 10a) for a machining system (12; 12a) for machining a workpiece (14; 14a) by means of a high-energy machining beam (16; 16a), the measuring device (10; 10a) comprising: a beam generating unit (18; 18a) configured to generate a measurement beam (20; 20a) and a reference beam (22; 22a) which can be made to interfere for the purposes of carrying out optical interference measurements such as optical coherence tomography; a measurement arm (24; 24a) which is optically connected to the beam generating unit (18; 18a) and in which the measurement beam (20; 20a) is optically guided such that the latter can be projected onto the workpiece (14; 14a); a reference arm (26; 26a) which is optically connected to the beam generating unit (18; 18a) and in which the reference beam (22; 22a) is optically guided; and a measurement interface (28; 28a), by means of which the measurement beam (20; 20a) can be coupled into the machining beam (16; 16a); wherein the measuring device (10; 10a) comprises a base module (30; 30a) and an interchangeable module (32; 32a) connectable or connected thereto. The interchangeable module (32; 32a) comprises a beam guiding section (48a) which comprises optical components (50a) for guiding the measurement beam (20a) and/or the reference beam (22a) and which is configured to form a central section (52; 52a) of the measurement arm (24; 24a) and/or reference arm (26; 26a). The invention further relates to a system having a measuring device (10; 10a) and a plurality of interchangeable modules (32, 32', 32"), a machining system (12; 12a), and a method for adjusting a measuring device (10; 10a).
The invention relates to a method for conducting and monitoring a machining process of a workpiece (10), in particular a welding process for joining the workpiece (10) to a further workpiece (10), by means of a high-energy machining beam (14), wherein the method comprises the following steps: generating a high-energy machining beam (14); projecting and/or focusing the machining beam (14) onto the workpiece (10), wherein, in accordance with a machining control signal, different machining regions of the workpiece (10) are machined; generating a measurement beam (16) by means of an optical coherence tomograph (18), wherein the measurement beam (16) is able to be coupled into the machining beam (14); determining measurement points (20) during the machining process by means of the optical coherence tomograph (18) using the measurement beam (16), in accordance with a measurement control signal; obtaining at least one external signal which is based on a measured variable and which is independent of a processing of the machining control signal and of the measurement control signal; generating an evaluation on the basis of the measurement points (20) and of the at least one external signal, which evaluation comprises a comparison of the measurement points (20) with at least one threshold value; monitoring the machining process on the basis of the evaluation.
The invention relates further to a correspondingly configured device for conducting and monitoring a machining process of a workpiece (10).
The invention relates to a measuring device for acquiring surface data and/or interfaces of a workpiece to be processed by a laser processing device. The laser processing device comprises a laser source and a processing head which is configured to provide at least one high-energy processing beam, in particular a laser beam. The laser source and the processing head are interconnected by an optical fiber and the measuring device comprises a scanning device configured as an optical coherence tomograph for surface scanning and/or interface scanning of the workpiece. The optical fiber which interconnects the laser source and the processing head forms a component of the scanning device.
G01B 11/24 - Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
H01S 3/0933 - Processes or apparatus for excitation, e.g. pumping using optical pumping by incoherent light of a semiconductor, e.g. light emitting diode
A method for monitoring the machining of a workpiece with a high-energy processing beam comprises the steps of: recording an electronically evaluatable image which contains at least the point of incidence of the processing beam on the workpiece; generating actual image data; comparing the actual image data with nominal image data; generating an image error signal if the actual image data deviate from the nominal image data; detecting, synchronously with the generation of the actual image data, the actual processing parameters controlling the process to be monitored; comparing the actual processing parameters with nominal processing parameters; generating a process error signal if the actual processing parameters deviate from the nominal processing parameters; generating an error signal when an image error signal and a processing error signal are present simultaneously; and initiating measures if an image error signal is present.
The invention relates to a method for determining a corrected height signal from measurement data obtained with optical coherence tomography, the measurement data being based on interference of sample light guided in a sample arm and reference light guided in a reference arm, the sample arm and the reference arm differing in dispersion. The measurement data comprise an object signal and a background signal superimposed on the object signal, the object signal and the
background signal being subject to different dispersion. The method comprises the following steps: obtaining the measurement data; performing a first transformation comprising transforming the measurement data, the first transformation being targeted at the background signal, thus obtaining a height signal; determining
background components in the height signal; compensating the background components in the height signal, thus obtaining a background-compensated height signal; performing an inverse transformation comprising back-transforming the background-compensated height signal, thus obtaining background-compensated measurement data; performing dispersion compensation for the object signal, thus obtaining dispersion-compensated and background-compensated measurement data; and performing a second transformation comprising transforming the dispersion-compensated and background-compensated measurement data, thus obtaining a dispersion-compensated and background-compensated height signal. The invention further relates to a measuring device, a machining system, program code, and a computer program product.
The invention relates to a measuring device (10) for performing measurements on a workpiece (12) which are used to prepare and/or assess a weld seam (16) produced by a welding device (14) and having an initial portion (18) and/or an end portion (20). The measuring device (10) comprises a measuring unit (22) comprising an optical coherence tomograph (24) including a sample beam source (26) for producing a sample beam (28) as well as a sample head (30) via which the sample beam (28) can be outcoupled, wherein the sample beam (28) can be selectively focused on different measuring positions (32, 34) relative to a current machining position (36) along the weld seam (16), so that, with respect to a machining direction (38), a leading beam and/or a trailing beam of a current measuring position (32, 34) are adjustable relative to the current machining position (36). The measuring device (10) further comprises a fastening unit (40) which is configured to attach at least the sample head (30) to the welding device (14) in such a way that the sample head (30) is moved along with the welding device (14) when the welding device (14) is moving relative to the workpiece (12). In addition, the measuring device (10) comprises a control unit (42) which is configured to dynamically adjust the leading beam and/or the trailing beam during machining along the weld seam (16) such that the leading beam increases along the initial portion (18) and/or that the trailing beam decreases along the end portion (20). The invention further relates to a machining system (66), a method for performing measurements on a workpiece (12), and a method for machining a workpiece (12).
B23K 9/095 - Monitoring or automatic control of welding parameters
B23K 31/12 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to investigating the properties, e.g. the weldability, of materials
G01B 9/02091 - Tomographic interferometers, e.g. based on optical coherence
11.
MEASURING DEVICE, MACHINING SYSTEM AND METHOD FOR ADJUSTING A MEASURING DEVICE
The invention relates to a measuring device (10; 10a) for a machining system (12; 12a) for machining a workpiece (14; 14a) by means of a high-energy machining beam (16; 16a), the measuring device (10; 10a) comprising: a beam generating unit (18; 18a) configured to generate a measurement beam (20; 20a) and a reference beam (22; 22a) which can be made to interfere for the purposes of carrying out optical interference measurements such as optical coherence tomography; a measurement arm (24; 24a) which is optically connected to the beam generating unit (18; 18a) and in which the measurement beam (20; 20a) is optically guided such that the latter can be projected onto the workpiece (14; 14a); a reference arm (26; 26a) which is optically connected to the beam generating unit (18; 18a) and in which the reference beam (22; 22a) is optically guided; and a measurement interface (28; 28a), by means of which the measurement beam (20; 20a) can be coupled into the machining beam (16; 16a); wherein the measuring device (10; 10a) comprises a base module (30; 30a) and an interchangeable module (32; 32a) connectable or connected thereto. The interchangeable module (32; 32a) comprises a beam guiding section (48a) which comprises optical components (50a) for guiding the measurement beam (20a) and/or the reference beam (22a) and which is configured to form a central section (52; 52a) of the measurement arm (24; 24a) and/or reference arm (26; 26a). The invention further relates to a system having a measuring device (10; 10a) and a plurality of interchangeable modules (32, 32?, 32?), a machining system (12; 12a), and a method for adjusting a measuring device (10; 10a).
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