Osaka Research Institute of Industrial Science and Technology

Japan

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2025 January 1
2025 (YTD) 1
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IPC Class
B22F 1/00 - Metallic powderTreatment of metallic powder, e.g. to facilitate working or to improve properties 11
B33Y 70/00 - Materials specially adapted for additive manufacturing 11
B33Y 10/00 - Processes of additive manufacturing 10
B33Y 80/00 - Products made by additive manufacturing 10
B22F 3/24 - After-treatment of workpieces or articles 9
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Status
Pending 11
Registered / In Force 68
Found results for  patents

1.

STERILIZATION METHOD AND STERILIZATION DEVICE

      
Application Number JP2024023075
Publication Number 2025/005102
Status In Force
Filing Date 2024-06-26
Publication Date 2025-01-02
Owner
  • OSAKA UNIVERSITY (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Kitano, Katsuhisa
  • Ikawa, Satoshi

Abstract

This sterilization device (1) comprises: a first container (12) that accommodates an object (A01); a first decompression unit (14) that decompresses the first container; and a supply unit (15) that supplies a pernitric acid gas to the object placed under a decompressed condition provided by the first decompression unit. The sterilization device can sterilize deep portions of the object.

IPC Classes  ?

  • A61L 2/20 - Gaseous substances, e.g. vapours

2.

COMPOUND AND BATTERY CONTAINING SAME

      
Application Number 18288221
Status Pending
Filing Date 2022-04-22
First Publication Date 2024-07-04
Owner
  • IDEMITSU KOSAN CO., LTD. (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Kato, Atsutaka
  • Yamamoto, Mari
  • Takahashi, Masanari
  • Utsuno, Futoshi
  • Higuchi, Hiroyuki

Abstract

One of the purposes of the present invention is to provide: a compound which can be used as a binder having ion conductivity; and a battery which contains the compound. One aspect of the present invention is a compound comprising P and S as constituent elements, a group comprising one or more elements selected from the group consisting of O, N and halogen, the group bonding to the P, and a disulfide bond.

IPC Classes  ?

  • H01M 4/62 - Selection of inactive substances as ingredients for active masses, e.g. binders, fillers
  • C01B 25/14 - Sulfur, selenium, or tellurium compounds of phosphorus
  • H01M 4/13 - Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulatorsProcesses of manufacture thereof
  • H01M 10/0562 - Solid materials

3.

SPUTTERING APPARATUS

      
Application Number 18286462
Status Pending
Filing Date 2022-04-26
First Publication Date 2024-06-13
Owner
  • EMD CORPORATION (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Ebe, Akinori
  • Kondo, Yusuke
  • Kakehi, Yoshiharu
  • Satoh, Kazuo
  • Ikuhara, Shiro
  • Iwasaki, Shinichi
  • Ogawa, Soichi

Abstract

A sputtering apparatus includes: target holders holding targets facing each other; a substrate holder on a side of a plasma generation region between the targets; main magnetic field generation units on the back surface sides of the target holders to generate main magnetic fields on surfaces of the targets in which magnets are disposed such that opposite poles face each other; a power supply to generate an electric field in a plasma generation region; a radio-frequency electromagnetic field generation unit to generate a radio-frequency electromagnetic field on a side of the plasma generation region facing the substrate holder with the plasma generation region between them; and a plasma source gas introduction unit to introduce a plasma source gas into the plasma generation region, wherein a device for generating a magnetic field does not exist at the ends of the target holders on a side of radio-frequency electromagnetic field generation unit.

IPC Classes  ?

  • H01J 37/34 - Gas-filled discharge tubes operating with cathodic sputtering
  • C23C 14/35 - Sputtering by application of a magnetic field, e.g. magnetron sputtering
  • H01J 37/32 - Gas-filled discharge tubes

4.

COMPOUND, COMPOSITION, SOLID ELECTROLYTE MATERIAL, SHEET FOR BATTERY, BATTERY, AND METHOD FOR PRODUCING COMPOUND

      
Application Number JP2023042602
Publication Number 2024/122411
Status In Force
Filing Date 2023-11-28
Publication Date 2024-06-13
Owner
  • IDEMITSU KOSAN CO.,LTD. (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Utsuno, Futoshi
  • Higuchi, Hiroyuki
  • Kato, Atsutaka
  • Yamamoto, Mari
  • Takahashi, Masanari

Abstract

Provided is a compound comprising repeating units represented by formula (1) as a noncyclic structure. (In formula (1), X1 is a chalcogen atom. R is a hydrogen atom or a substitution group.)

IPC Classes  ?

  • C01B 25/14 - Sulfur, selenium, or tellurium compounds of phosphorus
  • C01B 25/10 - Halides or oxyhalides of phosphorus
  • H01B 1/06 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of other non-metallic substances
  • H01B 1/10 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of other non-metallic substances sulfides
  • H01M 10/0562 - Solid materials

5.

Sensing Fiber Member

      
Application Number 18268341
Status Pending
Filing Date 2021-12-23
First Publication Date 2024-02-01
Owner
  • Asahi Kasei Advance Corporation (Japan)
  • Osaka Research Institute of Industrial Science and Technology (Japan)
  • Kaji Nylon .Inc (Japan)
Inventor
  • Uno, Mayumi
  • Omori, Mariko
  • Morita, Shigeru
  • Yoshimura, Kansei

Abstract

Provided is a sensing fiber member which can be processed in long lengths, which excels in mass production, which is supple and has an excellent texture, and which is much less costly than a contact sensing fiber member (a piezoelectric yarn) for which a conventional piezoelectric material is used. This sensing fiber member has at least two covering yarns for which covering is achieved by wrapping an insulating fiber serving as a covering material in one direction around a linear conductor constituting a core material, two of the covering yarns being arranged close to each other. The sensing fiber member is characterized by reading changes in resistance and/or changes in capacitance between the linear conductors of the two covering yarns arranged close to each other.

IPC Classes  ?

  • D02G 3/36 - Cored or coated yarns or threads
  • G01L 1/20 - Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluidsMeasuring force or stress, in general by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
  • G01L 1/14 - Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
  • D02G 3/28 - Doubled, plied, or cabled threads
  • D02G 3/44 - Yarns or threads characterised by the purpose for which they are designed

6.

RESIN COMPOSITION, BINDER FOR BATTERY, ELECTRODE MIXTURE LAYER FOR BATTERY, ELECTROLYTE LAYER, SHEET FOR BATTERY, BATTERY, AND RESIN COMPOSITION PRODUCTION METHOD

      
Application Number 18251966
Status Pending
Filing Date 2021-11-05
First Publication Date 2024-01-11
Owner
  • IDEMITSU KOSAN CO.,LTD. (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Kato, Atsutaka
  • Yamamoto, Mari
  • Takahashi, Masanari
  • Utsuno, Futoshi
  • Higuchi, Hiroyuki

Abstract

A resin composition containing a compound including phosphorus and sulfur as constituent elements and having a disulfide bond, and a thermoplastic resin.

IPC Classes  ?

  • C08K 3/32 - Phosphorus-containing compounds
  • C08L 53/02 - Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers of vinyl aromatic monomers and conjugated dienes
  • H01M 10/052 - Li-accumulators
  • H01M 10/0562 - Solid materials
  • H01M 4/13 - Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulatorsProcesses of manufacture thereof
  • H01M 4/62 - Selection of inactive substances as ingredients for active masses, e.g. binders, fillers
  • H01B 1/10 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of other non-metallic substances sulfides

7.

BIOMETRIC INFORMATION MEASUREMENT DEVICE

      
Application Number JP2023022982
Publication Number 2023/249064
Status In Force
Filing Date 2023-06-21
Publication Date 2023-12-28
Owner
  • ASAHI KASEI ADVANCE CORPORATION (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
  • KAJI NYLON .INC (Japan)
Inventor
  • Morita, Shigeru
  • Saito, Daisuke
  • Uno, Mayumi
  • Omori, Mariko
  • Yoshimura, Kansei
  • Tsurumi, Takuto

Abstract

Provided is a biometric information measurement device that can detect a change in the biometric information of a wearer (a movement of a finger, the bending and stretching of an arm or foot, a posture change during sitting, a change in length of the body surface due to respiration, and a change in surface moisture amount). The present invention relates to a biometric information measurement device that is made of a fiber base material including a sensing member, and that is disposed in contact with a prescribed position of a living body, wherein the sensing member has at least two core-sheath structure threads in which high-resistance fibers as a cladding material are disposed around a linear conductor as a core material, two among the at least two core-sheath structure threads are disposed adjacent to each other to make it possible to read a change in resistance and/or a change in capacitance between the linear conductors of the two core-sheath structure threads, and the biometric information or a fluctuation thereof is measured based on said change. The present invention also relates to a garment provided with said device.

IPC Classes  ?

  • A61B 5/107 - Measuring physical dimensions, e.g. size of the entire body or parts thereof
  • A61B 5/00 - Measuring for diagnostic purposes Identification of persons
  • A61B 5/0533 - Measuring galvanic skin response
  • A61B 5/113 - Measuring movement of the entire body or parts thereof, e.g. head or hand tremor or mobility of a limb occurring during breathing
  • H10N 30/30 - Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
  • H10N 30/857 - Macromolecular compositions

8.

METAL POWDER FOR ADDITIVE MANUFACTURING, METHOD OF MANUFACTURING AN ADDITIVE MANUFACTURED OBJECT USING THE METAL POWDER, AND THE ADDITIVE MANUFACTURED OBJECT

      
Application Number 18031255
Status Pending
Filing Date 2021-10-11
First Publication Date 2023-11-30
Owner
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
  • TOYO ALUMINIUM KABUSHIKI KAISHA (Japan)
Inventor
  • Sugahara, Takahiro
  • Nakamoto, Takayuki
  • Miki, Takao
  • Fujiwara, Kota
  • Ozaki, Tomoatsu
  • Murakami, Isao
  • Tanaka, Akiei

Abstract

A metal powder for additive manufacturing is used (i) which includes, as a main component, aluminum, and not less than 0.20% by mass and not more than 13% by mass of at least one alloy element other than the aluminum, selected from iron, manganese, chromium, nickel and zirconium, and (ii) in which the content of iron is less than 4.5% by mass.

IPC Classes  ?

  • B22F 1/00 - Metallic powderTreatment of metallic powder, e.g. to facilitate working or to improve properties
  • B22F 10/28 - Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
  • C22C 1/04 - Making non-ferrous alloys by powder metallurgy
  • C22C 21/00 - Alloys based on aluminium

9.

HEAT TREATMENT METHOD FOR DISSIMILAR METAL JOINT MATERIAL AND RESULTING DISSIMILAR METAL JOINT MATERIAL

      
Application Number JP2023001607
Publication Number 2023/145620
Status In Force
Filing Date 2023-01-20
Publication Date 2023-08-03
Owner
  • FUJI TERMINAL INDUSTRY CO.,LTD. (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Nagaoka Toru
  • Kyoda Takeshi
  • Ando Masahiro
  • Miwa Tetsuji

Abstract

The present invention addresses the problem of, for a dissimilar metal joint material in which different mechanical properties have been obtained as a result of cold working. homogenizing subsequent processing characteristics. The present invention pertains to a heat treatment method for a dissimilar metal joint material, said method involving: a joining step in which a first metal member and a second metal member of different kinds from each other are joined together to form the dissimilar metal joint material; a processing step in which cold working of the dissimilar metal joint material is carried out in order to recrystallize the first metal member at a first recrystallization temperature for the first metal member to have a first worked structure to be formed into a first recrystallized structure, and to recrystallize the second metal member at a second recrystallization temperature higher than the first recrystallization temperature for the second metal member to have a second worked structure to be formed into a second recrystallized structure; and a heating step in which at least the first worked structure is formed into the first recrystallized structure by heating the cold-worked dissimilar metal joint material at a temperature between the first recrystallization temperature and the second recrystallization temperature.

IPC Classes  ?

  • C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
  • B23K 20/12 - Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by frictionFriction welding
  • C22F 1/04 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
  • C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

10.

STERILIZATION METHOD AND STERILIZATION DEVICE

      
Application Number JP2022047999
Publication Number 2023/127825
Status In Force
Filing Date 2022-12-26
Publication Date 2023-07-06
Owner
  • OSAKA UNIVERSITY (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Kitano Katsuhisa
  • Ikawa Satoshi

Abstract

A sterilization device (1) comprises a pernitric acid gas generation unit (10) and a sterilization treatment unit (20). The pernitric acid gas generation unit (10) generates pernitric acid gas by gasifying a liquid containing pernitric acid. When doing so, for example, the pernitric acid gas generation unit (10) generates a pernitric acid mist by atomizing, with the use of ultrasonic waves, the liquid containing pernitric acid, and causes the pernitric acid gas to be generated from the pernitric acid mist. The sterilization treatment unit (20) applies the pernitric acid gas to a sterilization target (22) to sterilize the sterilization target (22).

IPC Classes  ?

11.

THERMOPLASTIC EPOXY RESIN, ADHESIVE, MODIFIER, AND METHOD FOR PRODUCING THERMOPLASTIC EPOXY RESIN

      
Application Number JP2022014362
Publication Number 2022/254906
Status In Force
Filing Date 2022-03-25
Publication Date 2022-12-08
Owner
  • ASAHI CHEMICAL CO., LTD. (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Sakaguchi, Masahiro
  • Kimura, Hajime
  • Yonekawa, Morio
  • Otsuka, Keiko

Abstract

A thermoplastic epoxy resin including a product of reaction between a bifunctional epoxy compound, which has two glycidyl groups in the molecule, and one or more bifunctional thiol compounds, which each have two mercapto groups in the molecule. The bifunctional thiol compounds comprise a hydrocarbon-based bifunctional thiol compound and/or an ether-based bifunctional thiol compound.

IPC Classes  ?

  • C08G 59/66 - Mercaptans
  • C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins

12.

COMPOUND AND BATTERY COMPRISING THE SAME

      
Application Number 17626939
Status Pending
Filing Date 2020-07-17
First Publication Date 2022-11-24
Owner
  • IDEMITSU KOSAN CO.,LTD. (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Kato, Atsutaka
  • Yamamoto, Mari
  • Takahashi, Masanari
  • Utsuno, Futoshi
  • Higuchi, Hiroyuki

Abstract

A compound comprising phosphorus atoms and sulfur atoms as constituent elements and having a peak in Raman spectroscopy, the peak being attributable to a disulfide bond bonding between two phosphorus atoms.

IPC Classes  ?

  • H01M 10/0562 - Solid materials
  • C01B 25/14 - Sulfur, selenium, or tellurium compounds of phosphorus
  • H01M 4/62 - Selection of inactive substances as ingredients for active masses, e.g. binders, fillers

13.

Vibration control system using kurtosis response spectrum

      
Application Number 17705575
Grant Number 11835426
Status In Force
Filing Date 2022-03-28
First Publication Date 2022-11-24
Grant Date 2023-12-05
Owner
  • Osaka Research Institute of Industrial Science and Technology (Japan)
  • IMV CORPORATION (Japan)
Inventor
  • Hosoyama, Akira
  • Nakaura, Yuji
  • Yamauchi, Yoshikado

Abstract

A vibration control system calculates a Kurtosis Response Spectrum (KRS) of a response waveform which characterizes non-Gaussianity in a random vibration test and is utilized for vibration control. The system compares a target KRS and the response KRS, and controls a characteristic of a phase used to generate a waveform for control such that the response KRS becomes equal to the target KRS. The waveform for control is generated by applying a random phase to each frequency component of an amplitude corresponding to Power Spectral Density (PSD). The system controls a characteristic of this phase (e.g., standard deviation) per frequency, controls the KRS, deforms the waveform for control on the basis of an equalization characteristic, and calculates a drive waveform. The system sequentially updates the equalization characteristic on the basis of the response waveform and the drive waveform. The calculated drive waveform is provided to a vibration generator.

IPC Classes  ?

  • G01M 7/02 - Vibration-testing
  • B06B 1/02 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy

14.

SPUTTERING DEVICE

      
Application Number JP2022018834
Publication Number 2022/230857
Status In Force
Filing Date 2022-04-26
Publication Date 2022-11-03
Owner
  • EMD CORPORATION (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Ebe, Akinori
  • Kondo, Yusuke
  • Kakehi, Yoshiharu
  • Satoh, Kazuo
  • Ikuhara, Shiro
  • Iwasaki, Shinichi

Abstract

A sputtering device (10) is provided with: a first target holder (111) and a second target holder (112) respectively holding a first target (T1) and a second target (T2) with surfaces thereof opposing each other; a substrate holder (16) provided laterally of a plasma generating region (R) between the first target (T1) and the second target (T2) respectively being held by the first target holder (111) and the second target holder (112); a first main magnetic field generating portion (121) and a second main magnetic field generating portion (122) which are respectively provided on the back side of the first target holder (111) and the second target holder (112), in which magnets are arranged with mutually opposite poles thereof opposing each other, and which respectively generate a first main magnetic field and a second main magnetic field on the surfaces of the first target (T1) and the second target (T2) being held by the respective holders; a power supply for applying predetermined potentials to the first target holder (111) and the second target holder (112) to generate an electric field in the plasma generating region (R); a high frequency electromagnetic field generating portion (17) provided in the plasma generating region (R) on the side opposing the substrate holder (16) across the plasma generating region (R) to generate a high frequency electromagnetic field in the plasma generating region (R); and a plasma raw material gas introducing portion (15) for introducing a plasma raw material gas into the plasma generating region (R). There is no means for generating a magnetic field at the ends of the first target holder (111) and the second target holder (112) on the side of the high frequency electromagnetic field generating portion (17).

IPC Classes  ?

  • H05H 1/46 - Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
  • C23C 14/34 - Sputtering
  • C23C 14/35 - Sputtering by application of a magnetic field, e.g. magnetron sputtering

15.

COMPOUND AND BATTERY CONTAINING SAME

      
Application Number JP2022018525
Publication Number 2022/230765
Status In Force
Filing Date 2022-04-22
Publication Date 2022-11-03
Owner
  • IDEMITSU KOSAN CO.,LTD. (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Kato, Atsutaka
  • Yamamoto, Mari
  • Takahashi, Masanari
  • Utsuno, Futoshi
  • Higuchi, Hiroyuki

Abstract

One of the purposes of the present invention is to provide: a compound which can be used as a binder having ion conductivity; and a battery which contains the compound. One aspect of the present invention is a compound which contains P and S as constituent elements and has both of a group containing at least one element that is bound to the P and is selected from the group consisting of O, N and a halogen and a disulfide bond.

IPC Classes  ?

  • C01B 25/14 - Sulfur, selenium, or tellurium compounds of phosphorus
  • C01D 3/12 - Iodides
  • H01M 4/13 - Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulatorsProcesses of manufacture thereof
  • H01M 4/62 - Selection of inactive substances as ingredients for active masses, e.g. binders, fillers
  • H01M 10/0562 - Solid materials

16.

SENSING FIBER MEMBER

      
Application Number JP2021048008
Publication Number 2022/138862
Status In Force
Filing Date 2021-12-23
Publication Date 2022-06-30
Owner
  • ASAHI KASEI ADVANCE CORPORATION (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
  • KAJI NYLON .INC (Japan)
Inventor
  • Uno, Mayumi
  • Omori, Mariko
  • Morita, Shigeru
  • Yoshimura, Kansei

Abstract

Provided is a sensing fiber member which can be processed in long lengths, which excels in mass production, which is supple and has an excellent texture, and which is much less costly than a contact sensing fiber member (a piezoelectric yarn) for which a conventional piezoelectric material is used. This sensing fiber member has at least two covering yarns for which covering is achieved by wrapping an insulating fiber serving as a covering material in one direction around a linear conductor constituting a core material, two of the covering yarns being arranged close to each other. The sensing fiber member is characterized by reading changes in resistance and/or changes in capacitance between the linear conductors of the two covering yarns arranged close to each other.

IPC Classes  ?

  • D02G 3/04 - Blended or other yarns or threads containing components made from different materials
  • D02G 3/26 - Yarns or threads characterised by constructional features with characteristics dependent on the amount or direction of twist
  • D02G 3/38 - Threads in which fibres, filaments, or yarns are wound with other yarns or filaments
  • D02G 3/44 - Yarns or threads characterised by the purpose for which they are designed
  • G01L 1/14 - Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
  • G01L 1/20 - Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluidsMeasuring force or stress, in general by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
  • H01G 5/16 - Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaftProcesses of their manufacture using variation of distance between electrodes
  • H01G 4/16 - Organic dielectrics of fibrous material, e.g. paper
  • G01L 5/00 - Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
  • D03D 15/20 - Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used characterised by the material of the fibres or filaments constituting the yarns or threads
  • D03D 15/37 - Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used characterised by the structure of the fibres or filaments with specific cross-section or surface shape

17.

RESIN COMPOSITION, BINDER FOR BATTERY, ELECTRODE MIXTURE LAYER FOR BATTERY, ELECTROLYTE LAYER, SHEET FOR BATTERY, BATTERY, AND RESIN COMPOSITION PRODUCTION METHOD

      
Application Number JP2021040760
Publication Number 2022/097717
Status In Force
Filing Date 2021-11-05
Publication Date 2022-05-12
Owner
  • IDEMITSU KOSAN CO.,LTD. (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Kato, Atsutaka
  • Yamamoto, Mari
  • Takahashi, Masanari
  • Utsuno, Futoshi
  • Higuchi, Hiroyuki

Abstract

A resin composition comprising: a compound including phosphorus and sulfur as constituent elements and having a disulfide bond; and a thermoplastic resin.

IPC Classes  ?

  • C08L 101/00 - Compositions of unspecified macromolecular compounds
  • H01M 4/13 - Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulatorsProcesses of manufacture thereof
  • H01M 4/62 - Selection of inactive substances as ingredients for active masses, e.g. binders, fillers
  • H01B 1/06 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of other non-metallic substances
  • C08K 3/32 - Phosphorus-containing compounds
  • H01M 10/052 - Li-accumulators
  • H01M 10/0562 - Solid materials

18.

METAL POWDER FOR ADDITIVE MANUFACTURING, METHOD FOR MANUFACTURING ADDITIVE-MANUFACTURED ARTICLE USING SAME, AND ADDITIVE-MANUFACTURED ARTICLE

      
Application Number JP2021037590
Publication Number 2022/080319
Status In Force
Filing Date 2021-10-11
Publication Date 2022-04-21
Owner
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
  • TOYO ALUMINIUM KABUSHIKI KAISHA (Japan)
Inventor
  • Sugahara Takahiro
  • Nakamoto Takayuki
  • Miki Takao
  • Fujiwara Kota
  • Ozaki Tomoatsu
  • Murakami Isao
  • Tanaka Akiei

Abstract

The present invention uses a metal powder for additive manufacturing, containing as elements alloyed with aluminum, 0.20-13% by mass of at least one selected from iron, manganese, chromium, nickel, and zirconium, the content of iron being less than 4.5% by mass.

IPC Classes  ?

  • B22F 10/28 - Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
  • B22F 1/00 - Metallic powderTreatment of metallic powder, e.g. to facilitate working or to improve properties
  • B22F 3/16 - Both compacting and sintering in successive or repeated steps
  • B22F 3/24 - After-treatment of workpieces or articles
  • B22F 10/362 - Process control of energy beam parameters for preheating
  • B22F 10/64 - Treatment of workpieces or articles after build-up by thermal means
  • B22F 12/13 - Auxiliary heating means to preheat the material
  • C22C 21/00 - Alloys based on aluminium

19.

Patterned fiber substrate

      
Application Number 17417506
Grant Number 11864314
Status In Force
Filing Date 2019-12-18
First Publication Date 2022-04-14
Grant Date 2024-01-02
Owner
  • KURARAY CO., LTD. (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Hayashi, Kohei
  • Obata, Soichi
  • Shirotani, Yasuhiro
  • Nitani, Masashi
  • Uno, Mayumi
  • Maeda, Kazuki

Abstract

The present invention relates to a patterned fiber substrate comprising: a fiber substrate; and a pattern consisting of a functional material and formed on the fiber substrate, wherein at least a part of the functional material that constitutes the pattern is present in inside of the fiber substrate, the fiber substrate has a contact angle of 100 to 170° with pure water on its surface, and the pattern has a narrowest line width of 1 to 3000 μm.

IPC Classes  ?

  • H05K 1/03 - Use of materials for the substrate
  • D06M 10/00 - Physical treatment of fibres, threads, yarns, fabrics or fibrous goods made from such materials, e.g. ultrasonic, corona discharge, irradiation, electric currents or magnetic fieldsPhysical treatment combined with treatment with chemical compounds or elements
  • D06M 23/16 - Processes for the non-uniform application of treating agents, e.g. one-sided treatmentDifferential treatment
  • H05K 3/28 - Applying non-metallic protective coatings
  • H05K 3/46 - Manufacturing multi-layer circuits

20.

CELLULOSE COMPOSITE RESIN

      
Application Number JP2021031136
Publication Number 2022/070691
Status In Force
Filing Date 2021-08-25
Publication Date 2022-04-07
Owner
  • DAIO PAPER CORPORATION (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Kadota Joji
  • Agari Yasuyuki
  • Hirano Hiroshi
  • Okada Akinori
  • Imai, Takaaki

Abstract

[Problem] To provide a cellulose composite resin excellent in tensile strength. [Solution] Provided is a cellulose composite resin including cellulose nanofibers and ungrafted polylactic acid, the cellulose composite resin being characterized in that the cellulose nanofibers are grafted cellulose nanofibers having a graft chain and that the graft chain is a polylactic acid.

IPC Classes  ?

  • C08L 1/08 - Cellulose derivatives
  • C08L 67/04 - Polyesters derived from hydroxy carboxylic acids, e.g. lactones
  • C08L 101/16 - Compositions of unspecified macromolecular compounds the macromolecular compounds being biodegradable
  • C08B 3/20 - Esterification with maintenance of the fibrous structure of the cellulose

21.

POLYLACTIC ACID COMPOSITE RESIN

      
Application Number JP2021031137
Publication Number 2022/070692
Status In Force
Filing Date 2021-08-25
Publication Date 2022-04-07
Owner
  • DAIO PAPER CORPORATION (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Kadota Joji
  • Agari Yasuyuki
  • Hirano Hiroshi
  • Okada Akinori
  • Imai, Takaaki

Abstract

[Problem] To provide a polylactic acid composite resin excelling in heat resistance. [Solution] This polylactic acid composite resin is characterized by including grafted cellulose nanofibers that are of an average fiber diameter of 4-1000 nm and that each have a graft chain, and in that the graft chain is a polylactic acid.

IPC Classes  ?

  • C08L 1/08 - Cellulose derivatives
  • C08L 67/04 - Polyesters derived from hydroxy carboxylic acids, e.g. lactones
  • C08L 101/16 - Compositions of unspecified macromolecular compounds the macromolecular compounds being biodegradable
  • C08B 3/20 - Esterification with maintenance of the fibrous structure of the cellulose

22.

METHOD FOR PRODUCING THEANINE-PRODUCING MICROORGANISM

      
Application Number JP2021021367
Publication Number 2022/014196
Status In Force
Filing Date 2021-06-04
Publication Date 2022-01-20
Owner
  • TAIYO KAGAKU CO., LTD. (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Kondo, Yusuke
  • Matsumiya, Yoshiki
  • Koma, Daisuke
  • Ohmoto, Takashi
  • Moriyoshi, Kunihiko
  • Yamanaka, Hayato
  • Ohashi, Hiroyuki

Abstract

A non-natural microorganism that produces theanine from a carbon source, said microorganism containing a gene that encodes a protein having alanine decarboxylase activity and a gene that encodes a protein having γ-glutamylmethylamide synthetase activity or glutaminase activity. According to the present invention, theanine can be efficiently produced with the use of the novel microorganism.

IPC Classes  ?

  • C12N 15/52 - Genes encoding for enzymes or proenzymes
  • C12N 1/15 - Fungi Culture media therefor modified by introduction of foreign genetic material
  • C12N 1/19 - YeastsCulture media therefor modified by introduction of foreign genetic material
  • C12N 1/21 - BacteriaCulture media therefor modified by introduction of foreign genetic material
  • C12N 5/10 - Cells modified by introduction of foreign genetic material, e.g. virus-transformed cells
  • C12N 15/32 - Bacillus crystal proteins
  • C12N 15/53 - Oxidoreductases (1)
  • C12N 15/55 - Hydrolases (3)
  • C12N 15/60 - Lyases (4)
  • C12P 13/04 - Alpha- or beta-amino acids

23.

Resin composition for generating allylphenol-maleimide copolymer for electronic component protective film, and electronic component protective film comprising this copolymer

      
Application Number 17287772
Grant Number 12037507
Status In Force
Filing Date 2019-11-05
First Publication Date 2021-12-16
Grant Date 2024-07-16
Owner
  • Osaka Research Institute of Industrial Science and Technology (Japan)
  • KOA Corporation (Japan)
Inventor
  • Ohtsuka, Keiko
  • Yonekawa, Morio
  • Kimura, Hajime
  • Yoshioka, Ken
  • Kanamaru, Nobuhiro
  • Suwa, Masaki
  • Machida, Kazumi

Abstract

This invention provides a resin composition for preparing an allylphenol-maleimide copolymer used for a protective film for an electronic component including: (A) an allyl group-containing phenol compound having a rigid structure; (B) an N-aromatic maleimide group-containing compound having a rigid structure; and (C) an N-aliphatic maleimide group-containing compound having a flexible structure.

IPC Classes  ?

  • C08K 3/22 - OxidesHydroxides of metals
  • C08F 212/34 - Monomers containing two or more unsaturated aliphatic radicals
  • C08F 234/00 - Copolymers of cyclic compounds having no unsaturated aliphatic radicals in a side chain and having one or more carbon-to-carbon double bonds in a heterocyclic ring
  • C09D 7/61 - Additives non-macromolecular inorganic
  • C09D 125/18 - Homopolymers or copolymers of aromatic monomers containing elements other than carbon and hydrogen
  • C09D 145/00 - Coating compositions based on homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic ring systemCoating compositions based on derivatives of such polymers
  • H01B 3/30 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances plasticsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances resinsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances waxes
  • H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material

24.

COPPER POWDER FOR 3D PRINTING, METHOD FOR PRODUCING COPPER POWDER FOR 3D PRINTING, METHOD FOR PRODUCING 3D PRINTED ARTICLE, AND 3D PRINTED ARTICLE

      
Application Number 17295205
Status Pending
Filing Date 2019-11-29
First Publication Date 2021-12-16
Owner
  • MEC COMPANY., LTD. (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Katayama, Daisuke
  • Nakazawa, Masato
  • Igami, Kaori
  • Sugahara, Takahiro
  • Nakamoto, Takayuki
  • Miki, Takao
  • Uchida, Sohei

Abstract

The present invention relates to a copper powder for additive manufacturing, a method for producing the same, an additive manufactured product, a method for producing the same and the like, and an object of the present invention is to provide a copper powder for additive manufacturing that can sufficiently improve the mechanical strength and electrical conductivity of an additive manufactured product. The means for achieving the above-mentioned object of the present invention is, for example, a copper powder for additive manufacturing having a mean particle size of 1 μm or more and 150 μm or less, containing copper oxide in an amount of 0.10 g/m2 or more and 7.0 g/m2 or less per unit surface area and 0.5 mass % or more and 9.4 mass % or less per unit mass.

IPC Classes  ?

  • B22F 1/00 - Metallic powderTreatment of metallic powder, e.g. to facilitate working or to improve properties
  • B22F 10/28 - Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
  • B33Y 80/00 - Products made by additive manufacturing
  • B33Y 70/00 - Materials specially adapted for additive manufacturing

25.

D-Glucaric Acid Producing Bacterium, and Method for Manufacturing D-Glucaric Acid

      
Application Number 17192751
Status Pending
Filing Date 2021-03-04
First Publication Date 2021-08-19
Owner
  • Ensuiko Sugar Refining Co., Ltd. (Japan)
  • Osaka Research Institute of Industrial Science and Technology (Japan)
Inventor
  • Ito, Tetsuya
  • Tadokoro, Hiroki
  • Masaki, Hisaharu
  • Mikuni, Katsuhiko
  • Murakami, Hiromi
  • Kiso, Taro
  • Kiryu, Takaaki

Abstract

The present invention provides a D-glucaric acid-producing bacterium and a method for producing D-glucaric acid. The present invention is characterized in that D-glucaric acid or a salt thereof is produced from one or more saccharides selected from the group consisting of D-glucose, D-gluconic acid and D-glucuronic acid with catalytic action of a specific alcohol dehydrogenase PQQ-ADH (1) and a specific aldehyde dehydrogenase PQQ-ALDH (2), and that D-glucaric acid or a salt thereof is produced by using a microorganism having the PQQ-ADH (1) and the PQQ-ALDH (2) or a processed product thereof in the presence of the one or more saccharides. The present invention can provide a microorganism having improved productivity of D-glucaric acid to be used for production of D-glucaric acid and a method for efficiently producing D-glucaric acid.

IPC Classes  ?

  • C12P 7/58 - Aldonic, ketoaldonic or saccharic acids
  • C12P 7/24 - Preparation of oxygen-containing organic compounds containing a carbonyl group
  • C12P 19/00 - Preparation of compounds containing saccharide radicals
  • C12N 9/04 - Oxidoreductases (1.), e.g. luciferase acting on CHOH groups as donors, e.g. glucose oxidase, lactate dehydrogenase (1.1)
  • C12N 9/02 - Oxidoreductases (1.), e.g. luciferase
  • C12P 7/42 - Hydroxy carboxylic acids
  • C12N 15/09 - Recombinant DNA-technology
  • C12N 1/20 - BacteriaCulture media therefor

26.

Copper alloy powder, method of producing additively-manufactured article, and additively-manufactured article

      
Application Number 17192125
Grant Number 12084745
Status In Force
Filing Date 2021-03-04
First Publication Date 2021-06-24
Grant Date 2024-09-10
Owner
  • DAIHEN CORPORATION (Japan)
  • Osaka Research Institute of Industrial Science and Technology (Japan)
Inventor
  • Tsubota, Ryusuke
  • Oka, Yohei
  • Okamoto, Akira
  • Nakamoto, Takayuki
  • Sugahara, Takahiro
  • Shinomiya, Naruaki
  • Takemura, Mamoru
  • Uchida, Sohei

Abstract

A copper alloy powder is a copper alloy powder for additive manufacturing. The copper alloy powder contains more than 1.00 mass % and not more than 2.80 mass % of chromium, and a balance of copper. A method for producing an additively-manufactured article includes a first step of preparing a copper alloy powder containing more than 1.00 mass % and not more than 2.80 mass % of chromium and a balance of copper and a second step of producing the additively-manufactured article from the copper alloy powder, and the additively-manufactured article is produced such that forming a powder layer including the copper alloy powder, and solidifying the copper alloy powder at a predetermined position in the powder layer to form a shaped layer are sequentially repeated to stack such shaped layers to thus produce the additively-manufactured article.

IPC Classes  ?

  • C22C 1/04 - Making non-ferrous alloys by powder metallurgy
  • B22F 3/24 - After-treatment of workpieces or articles
  • B22F 10/00 - Additive manufacturing of workpieces or articles from metallic powder
  • B22F 10/25 - Direct deposition of metal particles, e.g. direct metal deposition [DMD] or laser engineered net shaping [LENS]
  • B22F 10/28 - Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
  • B22F 10/32 - Process control of the atmosphere, e.g. composition or pressure in a building chamber
  • B22F 10/36 - Process control of energy beam parameters
  • B22F 10/64 - Treatment of workpieces or articles after build-up by thermal means
  • B33Y 10/00 - Processes of additive manufacturing
  • B33Y 70/00 - Materials specially adapted for additive manufacturing
  • C22C 9/00 - Alloys based on copper
  • C22C 9/06 - Alloys based on copper with nickel or cobalt as the next major constituent
  • C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
  • B22F 10/80 - Data acquisition or data processing
  • B22F 12/41 - Radiation means characterised by the type, e.g. laser or electron beam
  • B22F 12/67 - Blades
  • B33Y 80/00 - Products made by additive manufacturing

27.

COMPOUND AND BATTERY INCLUDING SAME

      
Application Number JP2020027911
Publication Number 2021/010479
Status In Force
Filing Date 2020-07-17
Publication Date 2021-01-21
Owner
  • IDEMITSU KOSAN CO.,LTD. (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Kato, Atsutaka
  • Yamamoto, Mari
  • Takahashi, Masaya
  • Utsuno, Futoshi
  • Higuchi, Hiroyuki

Abstract

A compound including phosphorus and sulfur as constituent elements and having a peak derived from a disulfide bond that bonds two phosphorus elements in Raman spectroscopy.

IPC Classes  ?

  • C01B 25/14 - Sulfur, selenium, or tellurium compounds of phosphorus
  • C03C 3/32 - Non-oxide glass compositions, e.g. binary or ternary halides, sulfides, or nitrides of germanium, selenium or tellurium
  • H01M 4/13 - Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulatorsProcesses of manufacture thereof
  • H01M 4/62 - Selection of inactive substances as ingredients for active masses, e.g. binders, fillers
  • H01M 10/052 - Li-accumulators
  • H01M 10/0562 - Solid materials

28.

THICKENING STABILIZER AND SOLVENT COMPOSITION USING SAME FOR PRODUCING ELECTRONIC DEVICE

      
Application Number 17043416
Status Pending
Filing Date 2019-03-18
First Publication Date 2021-01-21
Owner
  • DAICEL CORPORATION (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Suzuki, Youji
  • Kakehashi, Rie
  • Tokai, Naoji

Abstract

Provided is a compound that thickens a fluid organic material to a desired viscosity and uniformly stabilizes composition thereof. A compound of the present invention is represented by Formula (1): where R1 represents a monovalent linear aliphatic hydrocarbon group having from 10 to 25 carbons; R2 and R3 are the same or different, representing a divalent aliphatic hydrocarbon group having 2, 4, 6, or 8 carbons, a divalent alicyclic hydrocarbon group having 6 carbons, or a divalent aromatic hydrocarbon group; R4 represents a divalent aliphatic hydrocarbon group having from 1 to 8 carbon(s); R5 and R6 are the same or different, representing a monovalent aliphatic hydrocarbon group having from 1 to 3 carbon(s) or a hydroxyalkylether group L1 to L3 represent an amide bond; in a case where L1 and L3 are —CONH—, L2 is —NHCO—, and in a case where L1 and L3 are —NHCO—, L2 is —CONH—. Provided is a compound that thickens a fluid organic material to a desired viscosity and uniformly stabilizes composition thereof. A compound of the present invention is represented by Formula (1): where R1 represents a monovalent linear aliphatic hydrocarbon group having from 10 to 25 carbons; R2 and R3 are the same or different, representing a divalent aliphatic hydrocarbon group having 2, 4, 6, or 8 carbons, a divalent alicyclic hydrocarbon group having 6 carbons, or a divalent aromatic hydrocarbon group; R4 represents a divalent aliphatic hydrocarbon group having from 1 to 8 carbon(s); R5 and R6 are the same or different, representing a monovalent aliphatic hydrocarbon group having from 1 to 3 carbon(s) or a hydroxyalkylether group L1 to L3 represent an amide bond; in a case where L1 and L3 are —CONH—, L2 is —NHCO—, and in a case where L1 and L3 are —NHCO—, L2 is —CONH—.

IPC Classes  ?

  • C07C 233/36 - Carboxylic acid amides having carbon atoms of carboxamide groups bound to hydrogen atoms or to acyclic carbon atoms having the nitrogen atom of at least one of the carboxamide groups bound to a carbon atom of a hydrocarbon radical substituted by amino groups with the substituted hydrocarbon radical bound to the nitrogen atom of the carboxamide group by an acyclic carbon atom having the carbon atom of the carboxamide group bound to a hydrogen atom or to a carbon atom of an acyclic saturated carbon skeleton
  • C07C 231/02 - Preparation of carboxylic acid amides from carboxylic acids or from esters, anhydrides, or halides thereof by reaction with ammonia or amines
  • C07C 231/12 - Preparation of carboxylic acid amides by reactions not involving the formation of carboxamide groups
  • C09D 11/033 - Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
  • C09J 11/06 - Non-macromolecular additives organic
  • C09D 7/20 - Diluents or solvents

29.

Flexible substrate, electronic device, and method for manufacturing electronic device

      
Application Number 16962171
Grant Number 11178764
Status In Force
Filing Date 2018-12-25
First Publication Date 2020-10-29
Grant Date 2021-11-16
Owner
  • Pi-Crystal Incorporation (Japan)
  • Osaka Research Institute of Industrial Science and Technology (Japan)
Inventor
  • Uno, Mayumi
  • Maeda, Kazuki
  • Nitani, Masashi
  • Cha, Busang
  • Takeya, Junichi

Abstract

A flexible substrate and an electronic device having high flexibility as a whole including an element mounting portion and a connection terminal portion, and a production method of the electronic device are provided. The flexible substrate includes a flexible base, and a conductive wiring made of a conductive organic compound formed on the base, wherein part of the conductive wiring serves as a connection part with another electronic member. Further, an electronic device 100 includes flexible bases 11 and 21, conductive wirings 13 and 23 made of a conductive organic compound formed on the bases, and electronic elements 12 and 22 connected to the conductive wirings, wherein part of the conductive wiring serves as a connection part 30 with another substrate.

IPC Classes  ?

  • H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
  • H05K 1/09 - Use of materials for the metallic pattern
  • H05K 1/14 - Structural association of two or more printed circuits
  • H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
  • H05K 3/36 - Assembling printed circuits with other printed circuits
  • B29L 31/34 - Electrical apparatus, e.g. sparking plugs or parts thereof

30.

POWER GENERATION DEVICE, TRANSMISSION DEVICE, AND POWER GENERATION METHOD

      
Application Number JP2019002384
Publication Number 2020/148916
Status In Force
Filing Date 2019-01-25
Publication Date 2020-07-23
Owner
  • DAIHEN CORPORATION (Japan)
  • OSAKA PREFECTURE UNIVERSITY PUBLIC CORPORATION (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Yoshimura, Takeshi
  • Murakami, Shuichi
  • Danjo, Azusa
  • Minami, Toshio
  • Ueno, Yuya

Abstract

This power generation device is provided with: a permanent magnet (3) provided so as to be displaceable with respect to a conductor (W) through which alternating current flows; a conversion unit for converting the vibration energy of the permanent magnet (3) to electric energy when the permanent magnet (3) vibrates by an alternating magnetic field formed around the conductor (W); and an output unit (4) for outputting the converted electric energy.

IPC Classes  ?

  • H02N 2/18 - Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing electrical output from mechanical input, e.g. generators
  • H02N 1/00 - Electrostatic generators or motors using a solid moving electrostatic charge carrier

31.

PATTERNED FIBER SUBSTRATE

      
Application Number JP2019049616
Publication Number 2020/137742
Status In Force
Filing Date 2019-12-18
Publication Date 2020-07-02
Owner
  • KURARAY CO., LTD. (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Hayashi, Kohei
  • Obata, Soichi
  • Shirotani, Yasuhiro
  • Nitani, Masashi
  • Uno, Mayumi
  • Maeda, Kazuki

Abstract

The present invention relates to a patterned fiber substrate comprising a fiber substrate and a pattern made of a functional material formed on the fiber substrate, wherein: at least some of the functional material constituting the pattern is present inside the fiber substrate; the contact angle of the surface of the fiber substrate with respect to pure water is 100-170°; and the thinnest line width of the pattern is 1-3000 μm.

IPC Classes  ?

  • D04H 13/00 - Other non-woven fabrics
  • D06M 10/00 - Physical treatment of fibres, threads, yarns, fabrics or fibrous goods made from such materials, e.g. ultrasonic, corona discharge, irradiation, electric currents or magnetic fieldsPhysical treatment combined with treatment with chemical compounds or elements
  • D06M 23/16 - Processes for the non-uniform application of treating agents, e.g. one-sided treatmentDifferential treatment

32.

Manufacturing method for metal component and manufacturing apparatus for metal component

      
Application Number 16469780
Grant Number 11786951
Status In Force
Filing Date 2017-12-28
First Publication Date 2020-07-02
Grant Date 2023-10-17
Owner
  • ISHIZAKI PRESS INDUSTRIAL CO., LTD. (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Ishizaki, Taizo
  • Shinomiya, Naruaki
  • Shirakawa, Nobuhiko

Abstract

The manufacturing apparatus for a metal component includes: a preheating portion configured to locally induction-heat a metal plate; and a stamping portion configured to stamp the metal plate. The preheating portion includes a heating coil. The heating coil is arranged such that an axial direction of the heating coil is along a movement direction of the pressing portion and the heating coil faces, in the axial direction, an area where an amount of deformation is relatively large in a processing region of the metal plate to be stamped by the stamping portion. The heating coil is configured such that at least a part of the area where the amount of deformation is relatively large in the processing region of the metal plate is heated to a higher temperature than an area where the amount of deformation is relatively small in the processing region.

IPC Classes  ?

33.

COPPER POWDER FOR 3D PRINTING, METHOD FOR PRODUCING COPPER POWDER FOR 3D PRINTING, METHOD FOR PRODUCING 3D PRINTED ARTICLE, AND 3D PRINTED ARTICLE

      
Application Number JP2019046833
Publication Number 2020/116349
Status In Force
Filing Date 2019-11-29
Publication Date 2020-06-11
Owner
  • MEC COMPANY., LTD. (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Katayama Daisuke
  • Nakazawa Masato
  • Igami Kaori
  • Sugahara Takahiro
  • Nakamoto Takayuki
  • Miki Takao
  • Uchida Sohei

Abstract

The present invention pertains to a copper powder for 3D printing, a method for producing said copper powder, a 3D printed article, and a method for producing the 3D printed article, etc. The problem addressed is the provision of a copper powder for 3D printing which can adequately improve the mechanical strength and electroconductivity of 3D laminated articles. The means of the present invention for solving the abovementioned problem is a copper powder for 3D printing having an average particle size of 1 µm to 150 µm, containing 0.10 g/m2to 7.0 g/m2 of copper oxide per unit of surface area, and 0.5% to 9.4% by mass per unit of mass.

IPC Classes  ?

  • B22F 1/00 - Metallic powderTreatment of metallic powder, e.g. to facilitate working or to improve properties
  • B22F 1/02 - Special treatment of metallic powder, e.g. to facilitate working, to improve properties; Metallic powders per se, e.g. mixtures of particles of different composition comprising coating of the powder
  • B22F 3/105 - Sintering only by using electric current, laser radiation or plasma
  • B22F 3/16 - Both compacting and sintering in successive or repeated steps
  • B33Y 10/00 - Processes of additive manufacturing
  • B33Y 70/00 - Materials specially adapted for additive manufacturing
  • B33Y 80/00 - Products made by additive manufacturing

34.

COPPER POWDER FOR ADDITIVE MANUFACTURING, METHOD FOR PRODUCING COPPER POWDER FOR ADDITIVE MANUFACTURING, METHOD FOR PRODUCING ADDITIVE MANUFACTURED PRODUCT, AND ADDITIVE MANUFACTURED PRODUCT

      
Document Number 03120953
Status Pending
Filing Date 2019-11-29
Open to Public Date 2020-06-11
Owner
  • MEC COMPANY., LTD. (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Katayama, Daisuke
  • Nakazawa, Masato
  • Igami, Kaori
  • Sugahara, Takahiro
  • Nakamoto, Takayuki
  • Miki, Takao
  • Uchida, Sohei

Abstract

The present invention pertains to a copper powder for 3D printing, a method for producing said copper powder, a 3D printed article, and a method for producing the 3D printed article, etc. The problem addressed is the provision of a copper powder for 3D printing which can adequately improve the mechanical strength and electroconductivity of 3D laminated articles. The means of the present invention for solving the abovementioned problem is a copper powder for 3D printing having an average particle size of 1 µm to 150 µm, containing 0.10 g/m2 to 7.0 g/m2 of copper oxide per unit of surface area, and 0.5% to 9.4% by mass per unit of mass.

IPC Classes  ?

  • B22F 1/16 - Metallic particles coated with a non-metal
  • B33Y 10/00 - Processes of additive manufacturing
  • B33Y 70/00 - Materials specially adapted for additive manufacturing
  • B33Y 80/00 - Products made by additive manufacturing
  • B22F 10/25 - Direct deposition of metal particles, e.g. direct metal deposition [DMD] or laser engineered net shaping [LENS]
  • B22F 10/28 - Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
  • B22F 1/05 - Metallic powder characterised by the size or surface area of the particles
  • B22F 1/142 - Thermal or thermo-mechanical treatment
  • B22F 9/00 - Making metallic powder or suspensions thereofApparatus or devices specially adapted therefor

35.

RESIN COMPOSITION FOR GENERATING ALLYL PHENOL-MALEIMIDE COPOLYMER FOR ELECTRONIC COMPONENT PROTECTIVE FILM, AND ELECTRONIC COMPONENT PROTECTIVE FILM COMPRISING THIS COPOLYMER

      
Application Number JP2019043221
Publication Number 2020/095882
Status In Force
Filing Date 2019-11-05
Publication Date 2020-05-14
Owner
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
  • KOA CORPORATION (Japan)
Inventor
  • Ohtsuka Keiko
  • Yonekawa Morio
  • Kimura Hajime
  • Yoshioka Ken
  • Kanamaru Nobuhiro
  • Suwa Masaki
  • Machida Kazumi

Abstract

A resin composition for generating an allyl phenol-maleimide copolymer for an electronic component protective film, containing (A) an allyl group-containing phenol compound having a rigid structure, (B) an N-aromatic maleimide group-containing compound having a rigid structure, and (C) an N-aliphatic maleimide group-containing compound having a flexible structure.

IPC Classes  ?

  • C08G 61/00 - Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
  • C08F 222/40 - Imides, e.g. cyclic imides
  • C08L 35/00 - Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereofCompositions of derivatives of such polymers
  • H01B 3/30 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances plasticsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances resinsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances waxes
  • H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
  • C08K 3/22 - OxidesHydroxides of metals

36.

Polylactide-grafted cellulose nanofiber and production method thereof

      
Application Number 16612552
Grant Number 11046787
Status In Force
Filing Date 2018-05-09
First Publication Date 2020-04-23
Grant Date 2021-06-29
Owner
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
  • DAIO PAPER CORPORATION (Japan)
Inventor
  • Kadota, Joji
  • Agari, Yasuyuki
  • Hirano, Hiroshi
  • Okada, Akinori
  • Imai, Takaaki

Abstract

Provided are a polylactide-grafted cellulose nanofiber that is suitable as a molding material, and a production method thereof. A polylactide-grafted cellulose nanofiber includes grafted cellulose having a graft chain bonding to cellulose constituting a cellulose nanofiber, wherein the graft chain is a polylactide, and a ratio of an absorbance derived from C═O of the polylactide to an absorbance derived from O—H of the cellulose on an infrared absorption spectrum is no less than 0.01 and no greater than 1,000. In addition, a production method of a polylactide-grafted cellulose nanofiber includes carrying out graft polymerization of a lactide to cellulose constituting a cellulose nanofiber in the presence of an organic polymerization catalyst which includes an amine and a salt obtained by reacting the amine with an acid. As the organic polymerization catalyst, 4-dimethylaminopyridine and 4-dimethylaminopyridinium triflate are preferred.

IPC Classes  ?

37.

POLYLACTIDE-GRAFTED CELLULOSE NANOFIBER AND PRODUCTION METHOD THEREOF OR

      
Document Number 03063332
Status Pending
Filing Date 2018-05-09
Open to Public Date 2019-12-05
Owner
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
  • DAIO PAPER CORPORATION (Japan)
Inventor
  • Kadota, Joji
  • Agari, Yasuyuki
  • Hirano, Hiroshi
  • Okada, Akinori
  • Imai, Takaaki

Abstract

Provided are: poly(lactic acid)-grafted cellulose nanofibers suitable for use as a molding material; and a method for producing the cellulose nanofibers. The present invention relates to poly(lactic acid)-grafted cellulose nanofibers, which comprise a grafted cellulose comprising: cellulose nanofibers; and graft chains bonded to the cellulose constituting the cellulose nanofibers, the graft chains being poly(lactic acid). The poly(lactic acid)-grafted cellulose nanofibers give an infrared absorption spectrum in which the ratio of the absorbance assigned to poly(lactic acid) C=O to the absorbance assigned to cellulose O-H is 0.01-1,000. The present invention further relates to a method for producing poly(lactic acid)-grafted cellulose nanofibers which includes a step in which lactide is graft-polymerized with cellulose constituting cellulose nanofibers, in the presence of an organic polymerization catalyst comprising an amine and a salt obtained by reacting said amine with an acid. Preferred as the organic polymerization catalyst are 4-dimethylaminopyridine and 4-dimethylaminopyridinium triflate.

IPC Classes  ?

  • C08G 63/08 - Lactones or lactides
  • C08L 1/08 - Cellulose derivatives
  • C08L 101/16 - Compositions of unspecified macromolecular compounds the macromolecular compounds being biodegradable

38.

MATERIAL FOR REINFORCING CARBON-FIBER-REINFORCED PLASTIC AND MATERIAL FOR REINFORCING PLASTIC

      
Application Number JP2019019228
Publication Number 2019/221155
Status In Force
Filing Date 2019-05-15
Publication Date 2019-11-21
Owner
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
  • MIZUNO CORPORATION (Japan)
Inventor
  • Katagiri, Kazuaki
  • Okumura, Toshihiko
  • Yamaguchi, Shimpei
  • Ehiro, Takuya
  • Kawakita, Sonomi
  • Kume, Kazuhiro

Abstract

This material for reinforcing carbon-fiber-reinforced plastic is lightweight, has excellent impact strength, and includes at least one carbon-fiber-reinforced plastic layer and at least one cellulose nanofiber layer. At least one cellulose nanofiber layer is adjacently disposed on at least one surface of at least one carbon-fiber-reinforced plastic layer. The carbon-fiber-reinforced plastic layer contains carbon-fiber-reinforced plastic. The cellulose nanofiber layer contains cellulose nanofibers and a polymer compound. This material for reinforcing another material contains cellulose nanofibers and a polymer compound, and is used for reinforcing another material (such as a hydrophobic resin).

IPC Classes  ?

  • B32B 5/02 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments
  • B05D 7/24 - Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
  • C08J 5/04 - Reinforcing macromolecular compounds with loose or coherent fibrous material

39.

THERMALLY CONDUCTIVE COMPOSITE FILLER, HEAT-DISSIPATING RESIN COMPOSITION CONTAINING SAME, AND HEAT-DISSIPATING GREASE AND HEAT-DISSIPATING MEMBER COMPRISING SAID HEAT-DISSIPATING RESIN COMPOSITION

      
Application Number JP2019014481
Publication Number 2019/194131
Status In Force
Filing Date 2019-04-01
Publication Date 2019-10-10
Owner
  • JNC CORPORATION (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Fujiwara Takeshi
  • Koga Shin
  • Ujiiye Kento
  • Agari Yasuyuki
  • Hirano Hiroshi
  • Kadota Joji
  • Okada Akinori

Abstract

[Problem] To improve a thermally conductive filler. [Solution] A thermally conductive composite filler containing a first thermally conductive filler, a second thermally conductive filler, and a polyvinylacetal resin that serves as a binder. Typically, the first thermally conductive filler is aluminum nitride and the second thermally conductive filler is boron nitride. A resin composition in which the above thermally conductive composite filler is used. A heat-dissipating member in which the above resin composition is used.

IPC Classes  ?

  • C08L 29/14 - Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
  • C08K 3/01 - Use of inorganic substances as compounding ingredients characterised by their specific function
  • H01L 23/373 - Cooling facilitated by selection of materials for the device

40.

COMPOSITION FOR HEAT DISSIPATING MEMBER, VISIBLE LIGHT REFLECTIVE HEAT DISSIPATING MEMBER, LIGHT EMITTING DEVICE, LIGHT EMITTING APPARATUS

      
Application Number JP2019014794
Publication Number 2019/194221
Status In Force
Filing Date 2019-04-03
Publication Date 2019-10-10
Owner
  • JNC CORPORATION (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Fujiwara, Takeshi
  • Kuninobu, Takafumi
  • Ujiiye, Kento
  • Takizawa, Kazuhiro
  • Agari, Yasuyuki
  • Hirano, Hiroshi
  • Kadota, Joji
  • Okada, Akinori

Abstract

The present invention provides a composition capable of forming a heat dissipating member excellent in both heat conductivity and visible light reflectivity and also provides a visible light reflective heat dissipating member. The composition for a heat dissipating member of the present invention comprises: a first coupling agent 11; a thermally conductive first inorganic filler 1 bonded to one end of the first coupling agent 11; a second coupling agent 12; a thermally conductive second inorganic filler 2 bonded to one end of the second coupling agent 12; a polymerizable compound 22 which is bifunctional or has higher functionality, the polymerizable compound 22 being bonded by one functional group to the other end of the second coupling agent 12; and a visible light reflective third inorganic filler. The first coupling agent 11 and the polymerizable compound 22 have mutually bondable groups. The average particle diameter of the third inorganic filler is smaller than the average particle diameters of the first inorganic filler and the second inorganic filler. The ratio of the third inorganic filler to the total amount of the first inorganic filler, the second inorganic filler, and the third inorganic filler is 1%-50% by mass.

IPC Classes  ?

  • C08L 101/00 - Compositions of unspecified macromolecular compounds
  • C08K 3/01 - Use of inorganic substances as compounding ingredients characterised by their specific function
  • H01L 33/60 - Reflective elements
  • H01L 33/64 - Heat extraction or cooling elements

41.

THICKENING AND STABILIZING AGENT, AND SOLVENT COMPOSITION USING SAME FOR PRODUCTION OF ELECTRONIC DEVICE

      
Application Number JP2019011207
Publication Number 2019/188508
Status In Force
Filing Date 2019-03-18
Publication Date 2019-10-03
Owner
  • DAICEL CORPORATION (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Suzuki, Youji
  • Kakehashi, Rie
  • Tokai, Naoji

Abstract

Provided is a compound capable of thickening a fluidic organic substance to a desired viscosity, and uniformly stabilizing the compositional makeup thereof. The compound according to the present invention is represented by formula (1). In formula (1), R1represents a monovalent straight-chain aliphatic hydrocarbon group having 10-25 carbon atoms, R2and R3, which are the same or different, each represent a divalent aliphatic hydrocarbon group having 2, 4, 6, or 8 carbon atoms, a divalent alicyclic hydrocarbon group having 6 carbon atoms, or a divalent aromatic hydrocarbon group, R4represents a divalent aliphatic hydrocarbon group having 1-8 carbon atoms, and R5and R6, which are the same or different, each represent a monovalent aliphatic hydrocarbon group having 1-3 carbon atoms or a hydroxyalkyl ether group. L1-L3each represent an amide bond, and in the case where L1and L3are -CONH-, L2is -NHCO-, and in the case where L1and L3are -NHCO-, L2 is -CONH-.

IPC Classes  ?

  • C07C 291/04 - Compounds containing carbon and nitrogen and having functional groups not covered by groups containing nitrogen-oxide bonds containing amino-oxide bonds
  • C07C 231/08 - Preparation of carboxylic acid amides from amides by reaction at nitrogen atoms of carboxamide groups
  • C07C 233/36 - Carboxylic acid amides having carbon atoms of carboxamide groups bound to hydrogen atoms or to acyclic carbon atoms having the nitrogen atom of at least one of the carboxamide groups bound to a carbon atom of a hydrocarbon radical substituted by amino groups with the substituted hydrocarbon radical bound to the nitrogen atom of the carboxamide group by an acyclic carbon atom having the carbon atom of the carboxamide group bound to a hydrogen atom or to a carbon atom of an acyclic saturated carbon skeleton
  • C09K 3/00 - Materials not provided for elsewhere
  • C07C 231/02 - Preparation of carboxylic acid amides from carboxylic acids or from esters, anhydrides, or halides thereof by reaction with ammonia or amines

42.

Striking device and natural frequency measuring device

      
Application Number 16248809
Grant Number 10969312
Status In Force
Filing Date 2019-01-16
First Publication Date 2019-08-01
Grant Date 2021-04-06
Owner
  • SHIMADZU CORPORATION (Japan)
  • Osaka Research Institute of Industrial Science and Technology (Japan)
  • City of Nagoya (Japan)
  • AKITA PREFECTURE (Japan)
Inventor
  • Takii, Tadaoki
  • Nishimura, Masaki
  • Taniguchi, Satoshi
  • Kimura, Mitsuhiko
  • Kasai, Norifumi

Abstract

Provided are a striking device and a natural frequency measuring device capable of simply and accurately measuring a natural frequency of a system including force detector. The striking device includes an arm capable of swinging around a spindle, and a steel ball arranged in an end part of the arm on a side opposite to the spindle. The spindle is supported by a supporting part capable of lifting up and down relative to a post erected on a magnet stand. A supporting part for supporting a supporting plate is arranged at a position in the post and above the supporting part. A permanent magnet is placed above the supporting plate. The steel ball falls down in an arc shape from a standby height position when the permanent magnet is removed.

IPC Classes  ?

  • G01N 3/00 - Investigating strength properties of solid materials by application of mechanical stress
  • G01N 3/04 - Chucks
  • G01N 3/10 - Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces generated by pneumatic or hydraulic pressure
  • G01M 7/08 - Shock-testing
  • G01N 3/08 - Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces

43.

FLEXIBLE SUBSTRATE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

      
Application Number JP2018047444
Publication Number 2019/138855
Status In Force
Filing Date 2018-12-25
Publication Date 2019-07-18
Owner
  • PI-CRYSTAL INCORPORATION (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Uno Mayumi
  • Maeda Kazuki
  • Nitani Masashi
  • Cha Busang
  • Takeya Junichi

Abstract

The present invention provides: a flexible substrate and an electronic device, each having high flexibility as a whole including at an element-mounting portion and a connecting terminal portion; and a method for manufacturing such an electronic device. This flexible substrate is provided with a flexible base material and a conductive wiring which is formed of a conductive organic compound and which is disposed on the base material, wherein a portion of the conductive wiring becomes a part to be connected with another electronic member. An electronic device 100 is provided with: flexible base materials 11, 21; conductive wirings 13, 23 which are formed of a conductive organic compound and which are disposed on the respective base materials; and electronic elements 12, 22 that are connected to the respective conductive wirings, wherein portions of the conductive wirings form a connection part 30 with another substrate.

IPC Classes  ?

  • H05K 1/14 - Structural association of two or more printed circuits
  • H05K 1/09 - Use of materials for the metallic pattern
  • H05K 3/36 - Assembling printed circuits with other printed circuits
  • H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material

44.

MICROORGANISM CAPABLE OF PRODUCING AROMATIC COMPOUND

      
Application Number JP2017028650
Publication Number 2019/030808
Status In Force
Filing Date 2017-08-07
Publication Date 2019-02-14
Owner OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Koma Daisuke
  • Ohmoto Takashi
  • Yamanaka Hayato
  • Moriyoshi Kunihiko

Abstract

EscherichiaEscherichia, in which at least five genes shown below are introduced onto the chromosome thereof along with promoters respectively capable of inducing the expression of the genes: (1) aroA, (2) aroB, (3) aroC, (4) aroGfbror aroFfbr, and (5) pheAfbror tyrAfbr. In another aspect, the present disclosure relates to a method for producing an aromatic compound, comprising culturing the microorganism in a culture medium.

IPC Classes  ?

  • C12N 1/21 - BacteriaCulture media therefor modified by introduction of foreign genetic material
  • C12P 7/22 - Preparation of oxygen-containing organic compounds containing a hydroxy group aromatic
  • C12P 13/22 - TryptophanTyrosinePhenylalanine3,4-Dihydroxyphenylalanine
  • C12N 15/09 - Recombinant DNA-technology

45.

Composition for heat-dissipating member, heat-dissipating member, electronic instrument, method for producing composition for heat-dissipating member, and method for producing heat-dissipating member

      
Application Number 16081426
Grant Number 10679922
Status In Force
Filing Date 2017-02-28
First Publication Date 2019-01-24
Grant Date 2020-06-09
Owner
  • JNC CORPORATION (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Fujiwara, Takeshi
  • Inagaki, Jyunichi
  • Hinatsu, Masako
  • Agari, Yasuyuki
  • Hirano, Hiroshi
  • Kadota, Joji
  • Okada, Akinori

Abstract

The inventions are: a composition capable of forming a heat-dissipating member that has high thermal conductivity and in which the thermal expansion coefficient can be controlled; and a heat-dissipating member. This composition for a heat-dissipating member comprises a thermally conductive first inorganic filler bonded to one end of a first coupling agent, and a thermally conductive second inorganic filler bonded to one end of a second coupling agent, the composition being characterized in that: at least one of the first coupling agent and the second coupling agent is a liquid crystal silane coupling agent; the other end of the first coupling agent and the other end of the second coupling agent each have a functional group bondable with one another; and the other end of the first coupling agent bonds with the other end of the second coupling agent by a curing treatment.

IPC Classes  ?

  • H01L 23/373 - Cooling facilitated by selection of materials for the device
  • C09C 3/12 - Treatment with organosilicon compounds
  • C09K 5/14 - Solid materials, e.g. powdery or granular
  • H01L 23/36 - Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
  • C08K 9/06 - Ingredients treated with organic substances with silicon-containing compounds
  • C08K 3/28 - Nitrogen-containing compounds

46.

Composition for heat-dissipating member, heat-dissipating member, electronic instrument, and method for producing heat-dissipating member

      
Application Number 16081430
Grant Number 10752755
Status In Force
Filing Date 2017-02-28
First Publication Date 2019-01-24
Grant Date 2020-08-25
Owner
  • JNC CORPORATION (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Fujiwara, Takeshi
  • Hattori, Takayuki
  • Inagaki, Jyunichi
  • Kuninobu, Takafumi
  • Takizawa, Kazuhiro
  • Agari, Yasuyuki
  • Hirano, Hiroshi
  • Kadota, Joji
  • Okada, Akinori

Abstract

This invention is a composition capable of forming a heat-dissipating member that has high heat resistance and high thermal conductivity. This composition for a heat-dissipating member comprises a thermally conductive first inorganic filler bonded to one end of a first coupling agent, and a thermally conductive second inorganic filler bonded to one end of a second coupling agent, the composition being characterized in that: the other end of the first coupling agent and the other end of the second coupling agent are each bonded to a bifunctional or higher silsesquioxane by a curing treatment, as illustrated in FIG. 2; or at least one of the first coupling agent and the second coupling agent includes, in the structure thereof, a silsesquioxane, and the other end of the first coupling agent and the other end of the second coupling agent are bonded together as illustrated in FIG. 3.

IPC Classes  ?

  • C08K 9/06 - Ingredients treated with organic substances with silicon-containing compounds
  • C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
  • C08L 83/04 - Polysiloxanes
  • C08G 59/32 - Epoxy compounds containing three or more epoxy groups
  • C09K 5/14 - Solid materials, e.g. powdery or granular
  • C08L 83/06 - Polysiloxanes containing silicon bound to oxygen-containing groups
  • C08K 9/04 - Ingredients treated with organic substances
  • H01L 23/26 - Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances
  • C09C 3/12 - Treatment with organosilicon compounds
  • C08K 3/04 - Carbon
  • C08G 77/04 - Polysiloxanes
  • C08K 3/14 - Carbides
  • C08K 3/22 - OxidesHydroxides of metals
  • C08K 3/28 - Nitrogen-containing compounds
  • C08K 3/34 - Silicon-containing compounds
  • C08K 3/38 - Boron-containing compounds
  • H01L 23/373 - Cooling facilitated by selection of materials for the device

47.

Composition for resin surface roughening

      
Application Number 16062741
Grant Number 11084915
Status In Force
Filing Date 2016-12-26
First Publication Date 2018-12-27
Grant Date 2021-08-10
Owner
  • Sumitomo Seika Chemicals Co., Ltd. (Japan)
  • Osaka Research Institute of Industrial Science and Technology (Japan)
Inventor
  • Nishioka, Kiyoshi
  • Maeda, Hiroki
  • Ishikura, Kei
  • Matsukawa, Kimihiro
  • Kashiwagi, Yukiyasu
  • Saitoh, Masashi

Abstract

Provided is a means capable of realizing a surface-roughening method for modifying the surface of a resin molded article to form a surficial layer, such as a coating or plating, or to impart a function derived from the surface configuration. The method comprises adding a resin composition and performing a post-treatment and is thus simpler and easier than conventional methods. The resin composition is a composition for resin surface roughening that contains an aliphatic polycarbonate and an alkali metal salt.

IPC Classes  ?

  • B29C 71/02 - Thermal after-treatment
  • C08K 3/22 - OxidesHydroxides of metals
  • C08K 3/26 - CarbonatesBicarbonates
  • C08K 5/098 - Metal salts of carboxylic acids
  • C08L 69/00 - Compositions of polycarbonatesCompositions of derivatives of polycarbonates
  • C08J 7/00 - Chemical treatment or coating of shaped articles made of macromolecular substances
  • C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
  • C08G 59/42 - Polycarboxylic acidsAnhydrides, halides, or low-molecular-weight esters thereof
  • C08G 64/34 - General preparatory processes using carbon dioxide and cyclic ethers

48.

DETECTION DEVICE

      
Application Number JP2018021390
Publication Number 2018/230382
Status In Force
Filing Date 2018-06-04
Publication Date 2018-12-20
Owner
  • SHARP KABUSHIKI KAISHA (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Kobashi, Tadashi
  • Iwata, Noboru
  • Arimura, Tatsuhito
  • Takenaka, Yukio
  • Watase, Seiji
  • Mitamura, Koji
  • Nakamura, Masashi

Abstract

The present invention enables the achievement of a detection device which is capable of performing a selective measurement of a plurality of substances to be measured by a simple method. A detection device (1) according to the present invention is provided with two or more detection parts (11) which adsorb substances to be measured. The two or more detection parts (11) include a first detection part containing a first compound and a second detection part containing a second compound that is different from the first compound; and the first detection part and the second detection part are configured to output electrical signals different from each other with respect to the adsorption of a same substance to be measured.

IPC Classes  ?

  • G01N 27/22 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance

49.

POLY(LACTIC ACID)-GRAFTED CELLULOSE NANOFIBER AND PRODUCTION METHOD THEREFOR

      
Application Number JP2018018017
Publication Number 2018/207848
Status In Force
Filing Date 2018-05-09
Publication Date 2018-11-15
Owner
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
  • DAIO PAPER CORPORATION (Japan)
Inventor
  • Kadota Joji
  • Agari Yasuyuki
  • Hirano Hiroshi
  • Okada Akinori
  • Imai Takaaki

Abstract

Provided are: poly(lactic acid)-grafted cellulose nanofibers suitable for use as a molding material; and a method for producing the cellulose nanofibers. The present invention relates to poly(lactic acid)-grafted cellulose nanofibers, which comprise a grafted cellulose comprising: cellulose nanofibers; and graft chains bonded to the cellulose constituting the cellulose nanofibers, the graft chains being poly(lactic acid). The poly(lactic acid)-grafted cellulose nanofibers give an infrared absorption spectrum in which the ratio of the absorbance assigned to poly(lactic acid) C=O to the absorbance assigned to cellulose O-H is 0.01-1,000. The present invention further relates to a method for producing poly(lactic acid)-grafted cellulose nanofibers which includes a step in which lactide is graft-polymerized with cellulose constituting cellulose nanofibers, in the presence of an organic polymerization catalyst comprising an amine and a salt obtained by reacting said amine with an acid. Preferred as the organic polymerization catalyst are 4-dimethylaminopyridine and 4-dimethylaminopyridinium triflate.

IPC Classes  ?

  • C08G 63/08 - Lactones or lactides
  • C08L 1/08 - Cellulose derivatives
  • C08L 101/16 - Compositions of unspecified macromolecular compounds the macromolecular compounds being biodegradable

50.

FRICTION MATERIAL

      
Application Number JP2018014098
Publication Number 2018/190171
Status In Force
Filing Date 2018-04-02
Publication Date 2018-10-18
Owner
  • HARIMA CHEMICALS, INCORPORATED (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Ohashi, Yasunori
  • Zhou, Lin
  • Yamamoto, Maiko
  • Taniguchi, Yuki
  • Takayama, Ryotaro
  • Kimura, Hajime
  • Otsuka, Keiko
  • Matsumoto, Akihiro

Abstract

A friction material which contains a binder, wherein the binder comprises a reaction product obtained by reactions among a lignin having aliphatic hydroxy groups in the molecule, a phenol, and an aldehyde, the lignin having an aliphatic-hydroxy-group content of 0.5-8.5 mass% with respect to the overall amount of the lignin.

IPC Classes  ?

51.

METHOD FOR MANUFACTURING METAL COMPONENTS AND DEVICE FOR MANUFACTURING METAL COMPONENTS

      
Application Number JP2017047162
Publication Number 2018/179657
Status In Force
Filing Date 2017-12-28
Publication Date 2018-10-04
Owner
  • ISHIZAKI PRESS INDUSTRIAL CO., LTD. (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Ishizaki, Taizo
  • Shinomiya, Naruaki
  • Shirakawa, Nobuhiko

Abstract

Provided are a method for manufacturing metal components and a device for manufacturing metal components, whereby productivity can be improved. The device for manufacturing metal components is provided with: a preliminary heating part (10) that locally induction-heats a metal plate; and a press processing part (20) that press-processes the metal plate. The preliminary heating part (10) includes a heating coil (11). The heating coil (11) is disposed such that the axial direction of the heating coil (11) follows the moving direction of a pressing part and that the heating coil (11) is disposed axially facing a relatively more deformed section of the processed region of the metal plate which has been press-processed by the press processing part (20). Also, the heating coil (11) is configured such that at least a portion of the relatively more deformed section of the processed region of the metal plate is heated to a higher temperature than a relatively less deformed section of the processed region.

IPC Classes  ?

  • B21D 22/20 - Deep-drawing
  • B21D 24/00 - Special deep-drawing arrangements in, or in connection with, presses
  • B21D 37/16 - Heating or cooling
  • H05B 6/10 - Induction heating apparatus, other than furnaces, for specific applications

52.

SLIDING MATERIAL

      
Application Number JP2018003412
Publication Number 2018/179820
Status In Force
Filing Date 2018-02-01
Publication Date 2018-10-04
Owner
  • HARIMA CHEMICALS, INCORPORATED (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Ohashi, Yasunori
  • Zhou, Lin
  • Yamamoto, Maiko
  • Taniguchi, Yuki
  • Takayama, Ryotaro
  • Kimura, Hajime
  • Otsuka, Keiko
  • Matsumoto, Akihiro

Abstract

This sliding material includes a binder. The binder includes a novolac type phenolic resin, and a lignin.

IPC Classes  ?

  • C08L 61/10 - Phenol-formaldehyde condensates
  • C08L 97/00 - Compositions of lignin-containing materials
  • F16C 33/18 - Sliding surface consisting mainly of wood or fibrous material
  • F16J 15/34 - Sealings between relatively-moving surfaces with slip-ring pressed against a more or less radial face on one member

53.

SLIDING MATERIAL

      
Application Number JP2018003413
Publication Number 2018/179821
Status In Force
Filing Date 2018-02-01
Publication Date 2018-10-04
Owner
  • HARIMA CHEMICALS, INCORPORATED (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Ohashi, Yasunori
  • Zhou, Lin
  • Yamamoto, Maiko
  • Taniguchi, Yuki
  • Takayama, Ryotaro
  • Kimura, Hajime
  • Otsuka, Keiko
  • Matsumoto, Akihiro

Abstract

This sliding material includes a binder. The binder includes a reaction product of a lignin, a phenol, and an aldehyde.

IPC Classes  ?

  • C08L 61/10 - Phenol-formaldehyde condensates
  • C08G 16/06 - Block or graft polymers prepared by polycondensation of aldehydes or ketones on to macromolecular compounds
  • F16C 33/18 - Sliding surface consisting mainly of wood or fibrous material
  • F16J 15/34 - Sealings between relatively-moving surfaces with slip-ring pressed against a more or less radial face on one member

54.

All solid state secondary-battery additive, all-solid-state secondary battery, and method for producing same

      
Application Number 15753077
Grant Number 10756383
Status In Force
Filing Date 2016-08-16
First Publication Date 2018-08-23
Grant Date 2020-08-25
Owner
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
  • SUMITOMO SEIKA CHEMICALS CO., LTD. (Japan)
Inventor
  • Takahashi, Masanari
  • Yamamoto, Mari
  • Kobayashi, Yasuyuki
  • Ikeda, Shingo
  • Kashiwagi, Yukiyasu
  • Saitoh, Masashi
  • Karashima, Shuichi
  • Nishioka, Kiyoshi
  • Miyabara, Ryo

Abstract

General Formula (I) 2 and m in the polyalkylene carbonate (I) chain is independently the same or different.)

IPC Classes  ?

  • H01M 4/62 - Selection of inactive substances as ingredients for active masses, e.g. binders, fillers
  • C08L 69/00 - Compositions of polycarbonatesCompositions of derivatives of polycarbonates
  • H01M 10/0525 - Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodesLithium-ion batteries
  • H01M 10/0562 - Solid materials
  • H01M 4/13 - Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulatorsProcesses of manufacture thereof
  • H01M 10/0585 - Construction or manufacture of accumulators having only flat construction elements, i.e. flat positive electrodes, flat negative electrodes and flat separators
  • H01M 4/139 - Processes of manufacture
  • H01M 10/058 - Construction or manufacture
  • H01M 4/131 - Electrodes based on mixed oxides or hydroxides, or on mixtures of oxides or hydroxides, e.g. LiCoOx
  • H01M 4/133 - Electrodes based on carbonaceous material, e.g. graphite-intercalation compounds or CFx
  • H01M 4/02 - Electrodes composed of, or comprising, active material

55.

NOVOLAC TYPE PHENOLIC RESIN, RESIN COMPOSITION AND METHOD FOR PRODUCING NOVOLAC TYPE PHENOLIC RESIN

      
Application Number JP2017044286
Publication Number 2018/139074
Status In Force
Filing Date 2017-12-11
Publication Date 2018-08-02
Owner
  • HARIMA CHEMICALS, INCORPORATED (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Ohashi, Yasunori
  • Zhou, Lin
  • Yamamoto, Maiko
  • Taniguchi, Yuki
  • Kimura, Hajime
  • Otsuka, Keiko
  • Matsumoto, Akihiro

Abstract

This novolac type phenolic resin is a reaction product that is obtained by reacting a lignin that has an aliphatic hydroxyl group in each molecule, a phenol and an aldehyde in the presence of an acid catalyst; and the content ratio of the aliphatic hydroxyl group in the lignin is from 0.5% by mass to 7.0% by mass (inclusive) relative to the total mass of the lignin.

IPC Classes  ?

  • C08G 8/24 - Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with mixtures of two or more phenols which are not covered by only one of the groups
  • C08L 61/14 - Modified phenol-aldehyde condensates

56.

ACNE STRAIN-SELECTIVE ANTIBACTERIAL AGENT

      
Application Number JP2017039144
Publication Number 2018/084112
Status In Force
Filing Date 2017-10-30
Publication Date 2018-05-11
Owner
  • MOMOTANI JUNTENKAN CO., LTD. (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Uyama, Ayaka
  • Sugino, Teizo
  • Nagao, Toshihiro
  • Tanaka, Shigemitsu

Abstract

Provided is a medicinal agent having a selective antibacterial activity whereby, from among acne bacteria being human skin indigenous microorganisms, an acne strain enriched in an acne patient group can be killed or inhibited from growing compared with an acne strain enriched in a healthy subject group. The acne strain-selective antibacterial agent comprises at least one kind of fatty acid selected from the group consisting of saturated fatty acids having 14-20 carbon atoms (C14:0 to C20:0) and monovalent unsaturated fatty acids having 18 carbon atoms (C18:1), each in a free form or a salt form, or esters thereof.

IPC Classes  ?

  • A61K 31/20 - Carboxylic acids, e.g. valproic acid having a carboxyl group bound to an acyclic chain of seven or more carbon atoms, e.g. stearic, palmitic or arachidic acid
  • A41B 17/00 - Selection of special materials for underwear
  • A61K 8/36 - Carboxylic acidsSalts or anhydrides thereof
  • A61K 8/37 - Esters of carboxylic acids
  • A61K 31/201 - Carboxylic acids, e.g. valproic acid having a carboxyl group bound to an acyclic chain of seven or more carbon atoms, e.g. stearic, palmitic or arachidic acid having one or two double bonds, e.g. oleic or linoleic acid
  • A61K 31/23 - Esters, e.g. nitroglycerine, selenocyanates of carboxylic acids of acyclic acids, e.g. pravastatin of acids having a carboxyl group bound to a chain of seven or more carbon atoms
  • A61K 31/231 - Esters, e.g. nitroglycerine, selenocyanates of carboxylic acids of acyclic acids, e.g. pravastatin of acids having a carboxyl group bound to a chain of seven or more carbon atoms having one or two double bonds
  • A61K 31/575 - Compounds containing cyclopenta[a]hydrophenanthrene ring systemsDerivatives thereof, e.g. steroids substituted in position 17 beta by a chain of three or more carbon atoms, e.g. cholane, cholestane, ergosterol, sitosterol
  • A61P 17/10 - Anti-acne agents
  • A61P 31/04 - Antibacterial agents
  • A61Q 19/00 - Preparations for care of the skin

57.

LAMINATED MOLDING PRODUCTION METHOD AND LAMINATED MOLDING

      
Application Number JP2017028083
Publication Number 2018/079002
Status In Force
Filing Date 2017-08-02
Publication Date 2018-05-03
Owner
  • DAIHEN CORPORATION (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Tsubota, Ryusuke
  • Oka, Yohei
  • Okamoto, Akira
  • Nakamoto, Takayuki
  • Sugahara, Takahiro
  • Shinomiya, Naruaki
  • Takemura, Mamoru
  • Uchida, Sohei

Abstract

This laminated molding production method comprises: a first step for preparing a copper alloy powder; a second step for producing a laminated molding using the copper alloy powder; and a third step for subjecting the laminated molding to heat treatment at a temperature of 300°C or higher. The copper alloy powder contains 0.10-1.00 mass% of chromium with the remainder being copper. The laminated molding is produced by sequentially repeating a step for forming a powder layer containing the copper alloy powder and a step for forming a molding layer by solidifying the copper alloy powder at a prescribed position in the powder layer, thereby laminating the molding layers.

IPC Classes  ?

  • B22F 3/16 - Both compacting and sintering in successive or repeated steps
  • B22F 1/00 - Metallic powderTreatment of metallic powder, e.g. to facilitate working or to improve properties
  • B22F 3/105 - Sintering only by using electric current, laser radiation or plasma
  • B22F 3/24 - After-treatment of workpieces or articles
  • B33Y 10/00 - Processes of additive manufacturing
  • B33Y 70/00 - Materials specially adapted for additive manufacturing

58.

COPPER ALLOY POWDER, LAMINATE MOLDING PRODUCTION METHOD, AND LAMINATE MOLDING

      
Application Number JP2017037142
Publication Number 2018/079304
Status In Force
Filing Date 2017-10-13
Publication Date 2018-05-03
Owner
  • DAIHEN CORPORATION (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Tsubota, Ryusuke
  • Oka, Yohei
  • Okamoto, Akira
  • Nakamoto, Takayuki
  • Sugahara, Takahiro
  • Shinomiya, Naruaki
  • Takemura, Mamoru
  • Uchida, Sohei

Abstract

This copper alloy powder is used for molding a laminate. The copper alloy powder comprises more than 1.00 mass% and at most 2.80 mass% of chromium with the remainder being copper.

IPC Classes  ?

  • B22F 1/00 - Metallic powderTreatment of metallic powder, e.g. to facilitate working or to improve properties
  • B22F 3/105 - Sintering only by using electric current, laser radiation or plasma
  • B22F 3/16 - Both compacting and sintering in successive or repeated steps
  • B22F 3/24 - After-treatment of workpieces or articles
  • B33Y 10/00 - Processes of additive manufacturing
  • B33Y 70/00 - Materials specially adapted for additive manufacturing
  • B33Y 80/00 - Products made by additive manufacturing

59.

Copper alloy powder, method of producing additively-manufactured article, and additively-manufactured article

      
Application Number 15791675
Grant Number 10981226
Status In Force
Filing Date 2017-10-24
First Publication Date 2018-04-26
Grant Date 2021-04-20
Owner
  • DAIHEN CORPORATION (Japan)
  • Osaka Research Institute of Industrial Science and Technology (Japan)
Inventor
  • Tsubota, Ryusuke
  • Oka, Yohei
  • Okamoto, Akira
  • Nakamoto, Takayuki
  • Sugahara, Takahiro
  • Shinomiya, Naruaki
  • Takemura, Mamoru
  • Uchida, Sohei

Abstract

A copper alloy powder is a copper alloy powder for additive manufacturing. The copper alloy powder contains more than 1.00 mass % and not more than 2.80 mass % of chromium, and a balance of copper. A method for producing an additively-manufactured article includes a first step of preparing a copper alloy powder containing more than 1.00 mass % and not more than 2.80 mass % of chromium and a balance of copper and a second step of producing the additively-manufactured article from the copper alloy powder, and the additively-manufactured article is produced such that forming a powder layer including the copper alloy powder, and solidifying the copper alloy powder at a predetermined position in the powder layer to form a shaped layer are sequentially repeated to stack such shaped layers to thus produce the additively-manufactured article.

IPC Classes  ?

  • B22F 3/105 - Sintering only by using electric current, laser radiation or plasma
  • C22C 1/04 - Making non-ferrous alloys by powder metallurgy
  • B33Y 70/00 - Materials specially adapted for additive manufacturing
  • C22C 9/00 - Alloys based on copper
  • B33Y 10/00 - Processes of additive manufacturing
  • B33Y 80/00 - Products made by additive manufacturing
  • C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
  • B22F 3/24 - After-treatment of workpieces or articles
  • C22C 9/06 - Alloys based on copper with nickel or cobalt as the next major constituent

60.

POLYROTAXANE-CONTAINING COMPOSITION AND CURED PRODUCT THEREOF

      
Application Number JP2017033002
Publication Number 2018/052008
Status In Force
Filing Date 2017-09-13
Publication Date 2018-03-22
Owner
  • SUMITOMO SEIKA CHEMICALS CO., LTD. (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
  • ADVANCED SOFTMATERIALS INC. (Japan)
Inventor
  • Masuhara, Yusaku
  • Sainou, Naoki
  • Ishikura, Kei
  • Matsukawa, Kimihiro
  • Mitamura, Koji
  • Zhao, Changming

Abstract

The present invention provides a polyrotaxane-containing composition which can be used to obtain a cured product simultaneously having superior transparency, self-repair ability, high hardness, and low tackiness. The present invention also provides a cured product which is obtained by curing the polyrotaxane-containing composition. The polyrotaxane-containing composition according to the present invention contains: a polyrotaxane including a cyclic molecule, a linear molecule inserted through the opening of the cyclic molecule, and blocking groups which block the linear molecule at both ends thereof; a polysiloxane having at least one functional group selected from the group consisting of a thiol group, an amino group, and a hydroxy group; and a curing agent.

IPC Classes  ?

  • C08L 71/02 - Polyalkylene oxides
  • C08B 37/16 - CyclodextrinDerivatives thereof
  • C08G 65/46 - Post-polymerisation treatment, e.g. recovery, purification, drying
  • C08K 5/29 - Compounds containing carbon-to-nitrogen double bonds
  • C08L 83/08 - Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
  • C08L 101/06 - Compositions of unspecified macromolecular compounds characterised by the presence of specified groups containing oxygen atoms
  • C09D 7/12 - Other additives
  • C09D 105/16 - CyclodextrinDerivatives thereof
  • C09D 183/04 - Polysiloxanes
  • C09D 201/00 - Coating compositions based on unspecified macromolecular compounds
  • C09D 201/06 - Coating compositions based on unspecified macromolecular compounds characterised by the presence of specified groups containing oxygen atoms

61.

LAMINATE-MOLDING METAL POWDER, LAMINATE-MOLDED ARTICLE MANUFACTURING METHOD, AND LAMINATE-MOLDED ARTICLE

      
Application Number JP2016065829
Publication Number 2017/203717
Status In Force
Filing Date 2016-05-27
Publication Date 2017-11-30
Owner OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Sugahara, Takahiro
  • Nakamoto, Takayuki

Abstract

Provided is a laminate-molded article having high ductility and thermal conductivity in addition to a high relative density. A laminate-molded article 1 is manufactured by means of laminate molding by using laminate-molding metal powder that contains aluminum as the principal component, that contains, in total, 10% or less by mass of silicon and magnesium, and wherein the contained amount of silicon is greater than 1% by mass.

IPC Classes  ?

  • B22F 1/00 - Metallic powderTreatment of metallic powder, e.g. to facilitate working or to improve properties
  • B22F 3/105 - Sintering only by using electric current, laser radiation or plasma
  • B22F 3/16 - Both compacting and sintering in successive or repeated steps
  • C22C 21/02 - Alloys based on aluminium with silicon as the next major constituent

62.

Metal powder, method of producing additively-manufactured article, and additively-manufactured article

      
Application Number 15657300
Grant Number 10421122
Status In Force
Filing Date 2017-07-24
First Publication Date 2017-11-23
Grant Date 2019-09-24
Owner
  • DAIHEN CORPORATION (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Tsubota, Ryusuke
  • Tanaka, Junichi
  • Oka, Yohei
  • Nakamoto, Takayuki
  • Sugahara, Takahiro
  • Takemura, Mamoru
  • Uchida, Sohei

Abstract

A metal powder contains not less than 0.10 mass % and not more than 1.00 mass % of at least one of chromium and silicon, and a balance of copper. The total content of the chromium and the silicon is not more than 1.00 mass %. In accordance with an additive manufacturing method for this metal powder, an additively-manufactured article made from a copper alloy is provided. The additively-manufactured article has both an adequate mechanical strength and an adequate electrical conductivity.

IPC Classes  ?

  • B22F 1/00 - Metallic powderTreatment of metallic powder, e.g. to facilitate working or to improve properties
  • B22F 3/105 - Sintering only by using electric current, laser radiation or plasma
  • C22C 1/04 - Making non-ferrous alloys by powder metallurgy
  • C22C 9/00 - Alloys based on copper
  • C22C 9/10 - Alloys based on copper with silicon as the next major constituent
  • B22F 3/24 - After-treatment of workpieces or articles
  • C22C 9/06 - Alloys based on copper with nickel or cobalt as the next major constituent
  • B33Y 10/00 - Processes of additive manufacturing
  • B33Y 70/00 - Materials specially adapted for additive manufacturing
  • B33Y 80/00 - Products made by additive manufacturing
  • B22F 9/08 - Making metallic powder or suspensions thereofApparatus or devices specially adapted therefor using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying

63.

Metal powder, method of producing additively-manufactured article, and additively-manufactured article

      
Application Number 15657348
Grant Number 11077495
Status In Force
Filing Date 2017-07-24
First Publication Date 2017-11-09
Grant Date 2021-08-03
Owner
  • DAIHEN CORPORATION (Japan)
  • Osaka Research Institute of Industrial Science and Technology (Japan)
Inventor
  • Tsubota, Ryusuke
  • Tanaka, Junichi
  • Oka, Yohei
  • Nakamoto, Takayuki
  • Sugahara, Takahiro
  • Takemura, Mamoru
  • Uchida, Sohei

Abstract

A metal powder contains not less than 0.10 mass % and not more than 1.00 mass % of at least one of chromium and silicon, and a balance of copper. The total content of the chromium and the silicon is not more than 1.00 mass %. In accordance with an additive manufacturing method for this metal powder, an additively-manufactured article made from a copper alloy is provided. The additively-manufactured article has both an adequate mechanical strength and an adequate electrical conductivity.

IPC Classes  ?

  • B22F 1/00 - Metallic powderTreatment of metallic powder, e.g. to facilitate working or to improve properties
  • C22C 1/04 - Making non-ferrous alloys by powder metallurgy
  • C22C 9/00 - Alloys based on copper
  • C22C 9/10 - Alloys based on copper with silicon as the next major constituent
  • C22C 9/06 - Alloys based on copper with nickel or cobalt as the next major constituent
  • B22F 12/00 - Apparatus or devices specially adapted for additive manufacturingAuxiliary means for additive manufacturingCombinations of additive manufacturing apparatus or devices with other processing apparatus or devices
  • B22F 3/24 - After-treatment of workpieces or articles
  • B22F 10/10 - Formation of a green body
  • B33Y 10/00 - Processes of additive manufacturing
  • B33Y 70/00 - Materials specially adapted for additive manufacturing
  • B33Y 80/00 - Products made by additive manufacturing
  • B22F 9/08 - Making metallic powder or suspensions thereofApparatus or devices specially adapted therefor using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying

64.

HEAT-CURABLE RESIN COMPOSITION, CURED OBJECT, MOLDING MATERIAL, AND MOLDED OBJECT

      
Application Number JP2017008472
Publication Number 2017/187783
Status In Force
Filing Date 2017-03-03
Publication Date 2017-11-02
Owner
  • SUMITOMO SEIKA CHEMICALS CO., LTD. (Japan)
  • ADVANCED SOFTMATERIALS INC. (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Nishioka, Kiyoshi
  • Masuhara, Yusaku
  • Zhao, Changming
  • Ohtsuka, Keiko
  • Kimura, Hajime
  • Matsumoto, Akihiro

Abstract

The present invention provides a heat-curable resin composition which is capable of giving cured objects excellent in terms of toughness and adhesiveness, without considerably lowering the mechanical strength or heat resistance. The present invention further provides a cured object, a molding material, and a molded object which are obtained from or including the heat-curable resin composition. The heat-curable resin composition of the present invention comprises a compound having a maleimide group and a polyrotaxane that comprises cyclic molecules, a linear molecule piercing through the cavities of the cyclic molecules in a skewered state, and blocking groups with which both ends of the linear molecule have been blocked.

IPC Classes  ?

  • C08L 79/00 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups
  • C08F 2/44 - Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
  • C08F 283/06 - Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass on to polyethers, polyoxymethylenes or polyacetals
  • C08F 290/10 - Polymers provided for in subclass
  • C08F 290/14 - Polymers provided for in subclass
  • C08G 73/02 - Polyamines
  • C08L 35/00 - Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereofCompositions of derivatives of such polymers
  • C08L 71/00 - Compositions of polyethers obtained by reactions forming an ether link in the main chainCompositions of derivatives of such polymers

65.

LAMINATE, ELECTRONIC DEVICE, AND PRODUCTION METHOD FOR LAMINATE

      
Application Number JP2017008026
Publication Number 2017/150586
Status In Force
Filing Date 2017-02-28
Publication Date 2017-09-08
Owner
  • JNC CORPORATION (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Fujiwara,takeshi
  • Inagaki, Jyunichi
  • Agari, Yasuyuki
  • Hirano, Hiroshi
  • Kadota, Joji
  • Okada, Akinori

Abstract

The present invention is a laminate: with which differences in the thermal expansion coefficient at interfaces between different materials in the interior of a semiconductor element or the like can be kept small; which has high heat resistance; and which has high thermal conductivity. This laminate is provided with at least two layers of thermal expansion-controlling members, the thermal expansion-controlling members including a thermally conductive first inorganic filler joined to one end of a first coupling agent, and a thermally conductive second inorganic filler joined to one end of a second coupling agent; the other end of the first coupling agent and the other end of the second coupling agent are respectively joined to a polymerizable compound, or joined to one another; and the thermal expansion-controlling members have thermal expansion coefficients that are respectively different.

IPC Classes  ?

  • B32B 7/02 - Physical, chemical or physicochemical properties
  • B32B 9/00 - Layered products essentially comprising a particular substance not covered by groups
  • B32B 27/20 - Layered products essentially comprising synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
  • C08K 9/04 - Ingredients treated with organic substances
  • C08L 63/02 - Polyglycidyl ethers of bis-phenols
  • H01L 23/36 - Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
  • H01L 23/373 - Cooling facilitated by selection of materials for the device

66.

COMPOSITION FOR LOW THERMAL EXPANSION MEMBERS, LOW THERMAL EXPANSION MEMBER, ELECTRONIC DEVICE, AND METHOD FOR PRODUCING LOW THERMAL EXPANSION MEMBER

      
Application Number JP2017008027
Publication Number 2017/150587
Status In Force
Filing Date 2017-02-28
Publication Date 2017-09-08
Owner
  • JNC CORPORATION (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Fujiwara,takeshi
  • Inagaki, Jyunichi
  • Agari, Yasuyuki
  • Hirano, Hiroshi
  • Kadota, Joji
  • Okada, Akinori

Abstract

The present invention provides: a composition for low thermal expansion members, which is capable of forming a low thermal expansion member that has a thermal expansion coefficient close to those of the members within a semiconductor element, while having high heat resistance and high heat conductivity; and a low thermal expansion member. A composition for low thermal expansion members according to the present invention is characterized by containing: a heat conductive first inorganic filler 1 that is bonded to one end of a first coupling agent 11; and a heat conductive second inorganic filler 2 that is bonded to one end of a second coupling agent 12. This composition for low thermal expansion members is also characterized in that the first inorganic filler 1 and the second inorganic filler 2 are bonded to each other via the first coupling agent 11 and the second coupling agent 12 by means of a curing treatment.

IPC Classes  ?

  • C08L 59/00 - Compositions of polyacetalsCompositions of derivatives of polyacetals
  • C08K 3/00 - Use of inorganic substances as compounding ingredients
  • C08K 7/14 - Glass
  • C09K 5/14 - Solid materials, e.g. powdery or granular

67.

COMPOSITION FOR HEAT-DISSIPATING MEMBER, HEAT-DISSIPATING MEMBER, ELECTRONIC INSTRUMENT, AND METHOD FOR PRODUCING HEAT-DISSIPATING MEMBER

      
Application Number JP2017008029
Publication Number 2017/150589
Status In Force
Filing Date 2017-02-28
Publication Date 2017-09-08
Owner
  • JNC CORPORATION (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Fujiwara, Takeshi
  • Hattori, Takayuki
  • Inagaki, Jyunichi
  • Kuninobu, Takafumi
  • Takizawa, Kazuhiro
  • Agari, Yasuyuki
  • Hirano, Hiroshi
  • Kadota, Joji
  • Okada, Akinori

Abstract

This invention is a composition capable of forming a heat-dissipating member that has high heat resistance and high thermal conductivity. This composition for a heat-dissipating member comprises a thermally conductive first inorganic filler bonded to one end of a first coupling agent, and a thermally conductive second inorganic filler bonded to one end of a second coupling agent, the composition being characterized in that: the other end of the first coupling agent 11 and the other end of the second coupling agent 12 are each bonded to a bifunctional or higher silsesquioxane 21 by a curing treatment, as illustrated in Fig. 2, for example; or at least one of the first coupling agent and the second coupling agent includes, in the structure thereof, a silsesquioxane, and the other end of the first coupling agent 13 and the other end of the second coupling agent 12 are bonded together as illustrated in Fig. 3, for example.

IPC Classes  ?

  • C08L 83/04 - Polysiloxanes
  • C08G 59/32 - Epoxy compounds containing three or more epoxy groups
  • C08K 9/04 - Ingredients treated with organic substances
  • C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
  • C09K 5/14 - Solid materials, e.g. powdery or granular

68.

COMPOSITION FOR HEAT-DISSIPATING MEMBER, HEAT-DISSIPATING MEMBER, ELECTRONIC INSTRUMENT, METHOD FOR PRODUCING COMPOSITION FOR HEAT-DISSIPATING MEMBER, AND METHOD FOR PRODUCING HEAT-DISSIPATING MEMBER

      
Application Number JP2017008028
Publication Number 2017/150588
Status In Force
Filing Date 2017-02-28
Publication Date 2017-09-08
Owner
  • JNC CORPORATION (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Fujiwara, Takeshi
  • Inagaki, Jyunichi
  • Hinatsu, Masako
  • Agari, Yasuyuki
  • Hirano, Hiroshi
  • Kadota, Joji
  • Okada, Akinori

Abstract

The inventions are: a composition capable of forming a heat-dissipating member that has high thermal conductivity and in which the thermal expansion coefficient can be controlled; and a heat-dissipating member. This composition for a heat-dissipating member comprises a thermally conductive first inorganic filler bonded to one end of a first coupling agent, and a thermally conductive second inorganic filler bonded to one end of a second coupling agent, the composition being characterized in that: at least one of the first coupling agent and the second coupling agent is a liquid crystal silane coupling agent; the other end of the first coupling agent and the other end of the second coupling agent each have a functional group bondable with one another; and the other end of the first coupling agent bonds with the other end of the second coupling agent by a curing treatment.

IPC Classes  ?

  • C09K 5/14 - Solid materials, e.g. powdery or granular
  • C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
  • C08G 79/00 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbon

69.

COMPOSITION FOR RESIN SURFACE ROUGHENING

      
Application Number JP2016088652
Publication Number 2017/119330
Status In Force
Filing Date 2016-12-26
Publication Date 2017-07-13
Owner
  • SUMITOMO SEIKA CHEMICALS CO., LTD. (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Nishioka, Kiyoshi
  • Maeda, Hiroki
  • Ishikura, Kei
  • Matsukawa, Kimihiro
  • Kashiwagi, Yukiyasu
  • Saitoh, Masashi

Abstract

Provided is a means whereby a surface-roughening method for modifying the front layer of a resin molded article to form a surface layer such as a paint or plating or to impart a function derived from the surface shape can be realized by addition of a resin composition and post-treatment more simply than in the past. The resin composition is a composition for resin surface roughening that contains an aliphatic polycarbonate and an alkali metal salt.

IPC Classes  ?

  • C08L 69/00 - Compositions of polycarbonatesCompositions of derivatives of polycarbonates
  • C08J 7/00 - Chemical treatment or coating of shaped articles made of macromolecular substances
  • C08K 3/22 - OxidesHydroxides of metals
  • C08K 3/26 - CarbonatesBicarbonates
  • C08K 5/098 - Metal salts of carboxylic acids

70.

CHROMIUM PLATING SOLUTION, ELECTROPLATING METHOD, AND METHOD FOR PRODUCING CHROMIUM PLATING SOLUTION

      
Application Number JP2015085703
Publication Number 2017/109834
Status In Force
Filing Date 2015-12-21
Publication Date 2017-06-29
Owner
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
  • TEIKOKU ION CO., LTD. (Japan)
Inventor
  • Hayashi, Shohei
  • Morikawa, Tsutomu
  • Nakade, Takuo
  • Nagataki, Takayuki
  • Kawawaki, Takuya
  • Hojo, Masafumi
  • Nakamura, Takashi

Abstract

Provided are: a chromium plating solution and electroplating method which allow for a plating process in which an increase in hexavalent chromium concentration at an anode is inhibited, and good chromium plating can be performed over a long period of time; and a method for producing the chromium plating solution. The chromium plating solution according to the present invention contains, at least, trivalent chromium ions and at least one selected from the group consisting of ions of palladium and gold. Alternatively, the chromium plating solution according to the present invention contains, at least, trivalent chromium ions and hexavalent chromium ions, and at least one selected from the group consisting of ions of palladium and gold. Since the chromium plating solution contains palladium ions and/or gold ions, an increase in hexavalent chromium concentration at an anode is inhibited, and a good plating process can be performed over a long period of time.

IPC Classes  ?

  • C25D 3/06 - ElectroplatingBaths therefor from solutions of chromium from solutions of trivalent chromium

71.

ALL SOLID STATE SECONDARY-BATTERY ADDITIVE, ALL-SOLID-STATE SECONDARY BATTERY, AND METHOD FOR PRODUCING SAME

      
Application Number JP2016073938
Publication Number 2017/030127
Status In Force
Filing Date 2016-08-16
Publication Date 2017-02-23
Owner
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
  • SUMITOMO SEIKA CHEMICALS CO., LTD. (Japan)
Inventor
  • Takahashi, Masanari
  • Yamamoto, Mari
  • Kobayashi, Yasuyuki
  • Ikeda, Shingo
  • Kashiwagi, Yukiyasu
  • Saitoh, Masashi
  • Karashima, Shuichi
  • Nishioka, Kiyoshi
  • Miyabara, Ryo

Abstract

Provided is an all solid state secondary-battery additive comprising a polyalkylene carbonate (I) represented by general formula (I), and by providing such additive, properties such as the charge-discharge capacity and interface resistance of an all-solid-state secondary battery are improved. (In general formula (I), R1 and R2 are each a C1-10 chain-like alkylene group or C3-10 cycloalkylene group, m is 0, 1, or 2 and n is an integer of 10 to 15000, and each R1, R2 and m in the polyalkylene carbonate (I) chain is independently the same or different.)

IPC Classes  ?

  • H01M 10/0562 - Solid materials
  • H01B 1/06 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of other non-metallic substances
  • H01M 4/13 - Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulatorsProcesses of manufacture thereof
  • H01M 4/62 - Selection of inactive substances as ingredients for active masses, e.g. binders, fillers
  • H01M 10/058 - Construction or manufacture

72.

RESIN COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSITION, AND MOLDED ARTICLE

      
Application Number JP2016064575
Publication Number 2016/194600
Status In Force
Filing Date 2016-05-17
Publication Date 2016-12-08
Owner
  • HARIMA CHEMICALS, INCORPORATED (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Ohashi, Yasunori
  • Zhou, Lin
  • Yamamoto, Maiko
  • Kimura, Hajime
  • Otsuka, Keiko
  • Matsumoto, Akihiro

Abstract

The resin composition contains a thermosetting resin and a lignin modified by a carboxylic acid and phenols.

IPC Classes  ?

  • C08L 97/00 - Compositions of lignin-containing materials
  • C08L 61/06 - Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
  • C08L 101/00 - Compositions of unspecified macromolecular compounds

73.

Metal powder, method of producing additively-manufactured article, and additively-manufactured article

      
Application Number 15151693
Grant Number 10843260
Status In Force
Filing Date 2016-05-11
First Publication Date 2016-11-17
Grant Date 2020-11-24
Owner
  • DAIHEN CORPORATION (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Tsubota, Ryusuke
  • Tanaka, Jyunichi
  • Oka, Yohei
  • Nakamoto, Takayuki
  • Sugahara, Takahiro
  • Takemura, Mamoru
  • Uchida, Sohei

Abstract

A metal powder contains not less than 0.10 mass % and not more than 1.00 mass % of at least one of chromium and silicon, and a balance of copper. The total content of the chromium and the silicon is not more than 1.00 mass %. In accordance with an additive manufacturing method for this metal powder, an additively-manufactured article made from a copper alloy is provided. The additively-manufactured article has both an adequate mechanical strength and an adequate electrical conductivity.

IPC Classes  ?

  • B22F 1/00 - Metallic powderTreatment of metallic powder, e.g. to facilitate working or to improve properties
  • B22F 3/105 - Sintering only by using electric current, laser radiation or plasma
  • C22C 1/04 - Making non-ferrous alloys by powder metallurgy
  • C22C 9/00 - Alloys based on copper
  • C22C 9/10 - Alloys based on copper with silicon as the next major constituent
  • C22C 9/06 - Alloys based on copper with nickel or cobalt as the next major constituent
  • B22F 3/24 - After-treatment of workpieces or articles
  • B33Y 10/00 - Processes of additive manufacturing
  • B33Y 70/00 - Materials specially adapted for additive manufacturing
  • B33Y 80/00 - Products made by additive manufacturing
  • B22F 9/08 - Making metallic powder or suspensions thereofApparatus or devices specially adapted therefor using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying

74.

METAL POWDER, METHOD FOR PRODUCING MULTILAYER SHAPED STRUCTURE, AND MULTILAYER SHAPED STRUCTURE

      
Application Number JP2016063712
Publication Number 2016/181924
Status In Force
Filing Date 2016-05-09
Publication Date 2016-11-17
Owner
  • DAIHEN CORPORATION (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Tsubota, Ryusuke
  • Tanaka, Jyunichi
  • Oka, Yohei
  • Nakamoto, Takayuki
  • Sugahara, Takahiro
  • Takemura, Mamoru
  • Uchida, Sohei

Abstract

A metal powder for multilayer structure shaping. This metal powder contains at least one of chromium and silicon in an amount of from 0.10% by mass to 1.00% by mass (inclusive) so that the total amount of the chromium and silicon is 1.00% by mass or less, with the balance made up of copper.

IPC Classes  ?

  • B22F 1/00 - Metallic powderTreatment of metallic powder, e.g. to facilitate working or to improve properties
  • B22F 3/105 - Sintering only by using electric current, laser radiation or plasma
  • B22F 3/16 - Both compacting and sintering in successive or repeated steps
  • B22F 3/24 - After-treatment of workpieces or articles
  • B33Y 10/00 - Processes of additive manufacturing
  • B33Y 70/00 - Materials specially adapted for additive manufacturing
  • B33Y 80/00 - Products made by additive manufacturing
  • C22C 9/00 - Alloys based on copper
  • C22C 9/10 - Alloys based on copper with silicon as the next major constituent

75.

D-glucaric acid producing bacterium, and method for manufacturing D-glucaric acid

      
Application Number 14404714
Grant Number 10975396
Status In Force
Filing Date 2013-06-03
First Publication Date 2015-06-04
Grant Date 2021-04-13
Owner
  • Ensuiko Sugar Refining Co., Ltd. (Japan)
  • Osaka Research Institute of Industrial Science and Technology (Japan)
Inventor
  • Ito, Tetsuya
  • Tadokoro, Hiroki
  • Masaki, Hisaharu
  • Mikuni, Katsuhiko
  • Murakami, Hiromi
  • Kiso, Taro
  • Kiryu, Takaaki

Abstract

The present invention provides a D-glucaric acid-producing bacterium and a method for producing D-glucaric acid. The present invention is characterized in that D-glucaric acid or a salt thereof is produced from one or more saccharides selected from the group consisting of D-glucose, D-gluconic acid and D-glucuronic acid with catalytic action of a specific alcohol dehydrogenase PQQ-ADH (1) and a specific aldehyde dehydrogenase PQQ-ALDH (2), and that D-glucaric acid or a salt thereof is produced by using a microorganism having the PQQ-ADH (1) and the PQQ-ALDH (2) or a processed product thereof in the presence of the one or more saccharides. The present invention can provide a microorganism having improved productivity of D-glucaric acid to be used for production of D-glucaric acid and a method for efficiently producing D-glucaric acid.

IPC Classes  ?

  • C12P 7/58 - Aldonic, ketoaldonic or saccharic acids
  • C12P 7/24 - Preparation of oxygen-containing organic compounds containing a carbonyl group
  • C12P 19/00 - Preparation of compounds containing saccharide radicals
  • C12N 9/04 - Oxidoreductases (1.), e.g. luciferase acting on CHOH groups as donors, e.g. glucose oxidase, lactate dehydrogenase (1.1)
  • C12N 9/02 - Oxidoreductases (1.), e.g. luciferase
  • C12P 7/42 - Hydroxy carboxylic acids
  • C12N 15/09 - Recombinant DNA-technology
  • C12N 1/20 - BacteriaCulture media therefor

76.

Metal oxide dispersion, polymerizable composition comprising the metal oxide dispersion, and polymer thereof

      
Application Number 14396181
Grant Number 09890264
Status In Force
Filing Date 2013-04-24
First Publication Date 2015-02-19
Grant Date 2018-02-13
Owner
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
  • DAIHACHI CHEMICAL INDUSTRY CO., LTD. (Japan)
Inventor
  • Matsukawa, Kimihiro
  • Watase, Seiji
  • Hirata, Manabu

Abstract

An objective of the present invention is to provide an organic-inorganic hybrid acrylic polymer having an increased refractive index, which has a higher transparency and a less impaired scratch resistance; a metal oxide dispersion and a polymerizable composition as materials for the polymer; and the organic-inorganic hybrid polymer capable of being produced in a crack-free manner. Another objective of the present invention is to provide a high-performance antireflection film using the organic-inorganic hybrid polymer. The metal oxide dispersion of the present invention comprises a phosphorus compound represented by Formula (1): 2 is an organic residue; and n is 1 or 2) and a metal oxide.

IPC Classes  ?

  • C08K 3/22 - OxidesHydroxides of metals
  • C01G 23/053 - Producing by wet processes, e.g. hydrolysing titanium salts
  • C08F 30/02 - Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing phosphorus
  • C08F 2/44 - Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
  • G02B 1/111 - Anti-reflection coatings using layers comprising organic materials
  • C01G 19/02 - Oxides
  • C01G 25/02 - Oxides
  • C01G 27/02 - Oxides
  • C01G 9/02 - OxidesHydroxides
  • B01F 17/00 - Use of substances as emulsifying, wetting, dispersing, or foam-producing agents
  • B82Y 30/00 - Nanotechnology for materials or surface science, e.g. nanocomposites
  • C08F 130/02 - Homopolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing phosphorus
  • C08F 230/02 - Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing phosphorus
  • C08F 222/10 - Esters

77.

Metal paste composition

      
Application Number 14005618
Grant Number 09414487
Status In Force
Filing Date 2012-03-06
First Publication Date 2014-01-09
Grant Date 2016-08-09
Owner
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Fujimoto, Nobutaka
  • Kawakita, Tomoki
  • Miyabara, Ryou
  • Nakamoto, Masami
  • Ohno, Toshinobu
  • Yamamoto, Mari
  • Kashiwagi, Yukiyasu

Abstract

The present invention provides a metal paste composition which can obtain the calcined bodies having low volume resistivity in a wiring substrate after calcining. More specifically, the present invention provides a metal paste composition comprising a metal, an aliphatic polycarbonate, and an organic solvent.

IPC Classes  ?

  • H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
  • C08K 5/109 - EstersEther-esters of carbonic acid
  • H05K 1/09 - Use of materials for the metallic pattern
  • C08K 5/3415 - Five-membered rings
  • C08K 3/08 - Metals

78.

Heat conductive elastomer composition

      
Application Number 13638145
Grant Number 08871835
Status In Force
Filing Date 2010-10-12
First Publication Date 2013-02-07
Grant Date 2014-10-28
Owner
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
  • OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Shiraki, Masanori
  • Date, Noriaki
  • Agari, Yasujuki

Abstract

The object of the present invention is to provide a heat conductive elastomer composite useful as the heat radiating member of electric parts or electronic parts, or the like. In the present invention, an aluminum hydroxide having a surface covered with an organic coupling agent and/or an inactivated magnesium oxide, being a magnesia clinker having a surface covered with an inorganic substance and/or an organic substance, is (are) combined as heat conductive filler(s) in an elastomer composite mainly composed of a styrenic elastomer.

IPC Classes  ?

  • C08K 9/06 - Ingredients treated with organic substances with silicon-containing compounds
  • C08L 91/06 - Waxes
  • C08L 53/02 - Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers of vinyl aromatic monomers and conjugated dienes

79.

Methods and systems for image intra-prediction mode management

      
Application Number 12058681
Grant Number 08228986
Status In Force
Filing Date 2008-03-29
First Publication Date 2008-07-24
Grant Date 2012-07-24
Owner OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Sun, Shijun
  • Kerofsky, Louis Joseph

Abstract

Embodiments of the present invention relate to methods and systems for ordering, communicating and applying pixel intra-prediction modes.

IPC Classes  ?

  • H04B 1/66 - Details of transmission systems, not covered by a single one of groups Details of transmission systems not characterised by the medium used for transmission for reducing bandwidth of signalsDetails of transmission systems, not covered by a single one of groups Details of transmission systems not characterised by the medium used for transmission for improving efficiency of transmission