Machine-outil à découper; Machine à découper au laser; machines et machines-outils pour le traitement de matériaux par laser; machines et appareils de découpe, de forage, d'abrasion, d'aiguisage et de traitement de surfaces par laser; dispositifs de découpe au laser; foreuses à laser; machines à graver au laser; dispositifs de soudage au laser.
3.
METHOD AND DEVICE FOR MARKING A CONTAINER CONTAINING A MEDICINAL SUBSTANCE
The disclosure relates to a method for marking a container comprising a vial containing a medicinal substance and closed by a cap secured to the vial by a ring. With the container being at least partially covered with frost, the method further comprises a step of laser marking the ring through the frost. The disclosure also relates to a device for marking a container.
The invention relates to an optical device (10) for a laser micro-machining system, the device comprising: an optical axis (16), a collimating member (20) on the optical axis (16), a diffractive optical element (18) on the optical axis upstream of the collimating member (20), the diffractive optical element being capable of dividing a non-collimated laser beam propagating along the optical axis into a plurality of sub-beams, and the diffractive optical element being movable relative to the collimating member (20), the displacement of the diffractive optical element (18) relative to the collimating member being capable of varying the angle between the sub-beams downstream of the collimating member, while maintaining the shape and size of the sub-beams. The invention further relates to a micro-machining system and to a micro-machining method.
The invention relates to a method for controlling a focal point of a laser beam emitted by a high-power ultrashort-pulse laser source, the method comprising the steps of: providing a high-power laser source (12); activating the laser source; controlling the focal point of the laser beam (14) by imposing a burst mode on the laser source so as to generate a laser beam comprising a pulse train comprising sets of laser pulses, wherein the sets of pulses are repeated over time. The invention also relates to a device for implementing the method.
A method for machining a sample of amorphous metal alloy using a femtosecond laser, including at least one step of irradiating the sample with a laser beam along a reference trajectory to ablate material from the sample, so as to obtain a sample machined and maintained in the amorphous state, in which, the laser beam is pulsed, and the duration of each pulse is less than 1000 femtoseconds, preferably less than 600 femtoseconds, and in which the amorphous metal alloy has a critical diameter less than 5 millimeters, and/or a difference between the crystallization temperature and the glass transition temperature less than 60° C., and/or a quotient of the difference between the crystallization temperature and the glass transition temperature and of the difference between the liquidus temperature and the temperature glass transition is less than 0.12.
The present invention relates to a method for assembling an arrangement of one or more substrates, the method comprising arranging the one or more substrates in an arrangement in which at least one surface is defined by a plurality of edges of the one or more substrates; structuring the at least one surface with a structuring laser beam capable of manufacturing one or more grooves in the at least one surface; placing an insulating part in contact with the at least one surface; applying a pressure to maintain contact between an insulating part and the at least one surface; welding the one or more substrates and the insulating part by heating the one or more substrates so as to reach in the insulating part a temperature melting at least a portion of the insulating part into the one or more grooves of the at least one surface. The method also relates to a disassembling method and an arrangement of one or more substrates.
B23K 37/04 - Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
Disclosed is an optical system for laser machining that enables simpler and more reliable machining of several patterns simultaneously on the same part. The system comprises an ultra-short pulse laser source for generating a source laser beam; a device with a separation means for separating a source laser beam into a plurality of separated laser beams, such that each of the separated laser beams is directed in a direction of propagation specific thereto; a spatial offsetting unit for obtaining, from the plurality of separated laser beams, a plurality of offset laser beams such that each offset laser beam can propagate around a main axis of propagation A specific thereto and is capable of describing a movement around the main axis of propagation A; and a focusing means configured to focus each offset laser beam on a workpiece in the direction of the axis of propagation specific thereto.
G02B 26/08 - Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
A method for volume heat treating a part having an external surface delimiting its volume, the method comprising the following steps:
a. providing a laser source;
b. providing the part;
c. providing support means for supporting the part;
d. placing said part so that it is held in position by said support means; and
e. irradiating with the laser source at least one segment of the external surface of the part with a laser exposure power and duration to obtain a temperature rise in essentially the entire volume of the part.
The invention relates to a method for machining an amorphous metal alloy sample (1) using a femtosecond laser, comprising at least a step of irradiating the sample (1) with a laser beam (2) along a reference path (TRef) in order to ablate material of the sample (1), such as to obtain a machined sample (1) maintained in the amorphous state, wherein the laser beam (2) is pulsed and the duration of each pulse is less than 1000 femtoseconds, preferably less than 600 femtoseconds, and the laser beam (2) pulse frequency (f) is greater than 20kHz. According to the invention, the amorphous metal alloy has a submillimetre critical diameter (Dc), and/or a difference (ΔTx) between crystallisation temperature (Tx) and glass transition temperature (Tg) of less than 60°C, and/or a quotient (ΔTx/(TI-Tg)) of the difference (ΔTx) between crystallisation temperature (Tx) and glass transition temperature (Tg) and the difference between liquidus temperature (Tl) and glass transition temperature (Tg) of less than 0.12.
Optical system for laser machining, which system enables simpler and more reliable machining of several patterns simultaneously on the same part. The system of the invention comprises - an ultra-short pulse laser source for generating a source laser beam (101); - a device (1) with - separation means (30) for separating a source laser beam (101) into a plurality of separated laser beams (301), such that each of the separated laser beams (301) is directed in a direction of propagation specific thereto; - a spatial offsetting unit (50, 50X, 50Y) for obtaining, from said plurality of separated laser beams (301), a plurality of offset laser beams (501) such that each offset laser beam (501) can propagate around a main axis of propagation A specific thereto and is capable of describing a movement around the main axis of propagation A; - focusing means (70) configured to focus each offset laser beam on a workpiece in the direction of the axis of propagation specific thereto.
A method for providing a first and a second laser beam, which are spatially offset in relation to an input laser beam. The method includes: providing a laser source for generating the input laser beam; providing a spatial offsetting unit for providing an offset laser beam that can keep the same polarization between the input laser beam and the offset laser beam; providing a separating unit including a first module for separation by polarization in order to obtain, from the offset laser beam: the first laser beam spatially offset by transmission; and the second laser beam spatially offset by reflection, the first and second spatially offset laser beams being suitable for each describing a circle.
G02B 26/08 - Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
Disclosed is a method for volume heat treatment of a part (2) having an outer surface (22) delimiting its volume, the method comprising the following steps: a. providing a laser source (3); b. providing the part (2); c. providing support means (4) for supporting the part (2); d. positioning the part (2) such that it is held in position by the support means (4); e. irradiating at least one portion (23) of the outer surface (22) of the part (2) with the laser source (3) at a laser power and for a laser exposure time in order to obtain an increase in temperature in substantially the whole of the volume of the part (2).
C21D 1/773 - Methods of treatment in inert gas, controlled atmosphere, vacuum or pulverulent material under reduced pressure or vacuum
C21D 9/00 - Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articlesFurnaces therefor
F27B 5/04 - Muffle furnacesRetort furnacesOther furnaces in which the charge is held completely isolated adapted for treating the charge in vacuum or special atmosphere
F27D 7/06 - Forming or maintaining special atmospheres or vacuum within heating chambers
A system for holding a workpiece in position and exposing it to laser radiation, such that: the workpiece includes a bottom surface and a top surface that are electrically insulated from each other. The system includes an electrostatic charge generating device for generating electrostatic charges on the top surface; an electrically conductive support for forming, on the bottom surface, electrostatic charges of opposite sign to those generated on the top surface; and a laser device for machining or welding. The electrostatic charge generating device is arranged to be activated before or during the laser machining or welding, such that the workpiece is held in position relative to the electrically conductive support during the machining or welding thereof.
B23K 37/04 - Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
An optical device for detecting the drift of a light beam of a laser machining system includes a beam splitter for obtaining a first light beam along a first optical path and a second light beam along a second optical path. The optical device further includes a focal module positioned at least partially along the first optical path to obtain a focused light beam that is directed towards a first light beam matrix detection means positioned in a focusing plane associated with the focal module. The optical device also includes an afocal module positioned at least partially along the second optical path to obtain a collimated light beam that is directed towards a second light beam matrix detection means.
G01B 11/27 - Measuring arrangements characterised by the use of optical techniques for measuring angles or tapersMeasuring arrangements characterised by the use of optical techniques for testing the alignment of axes for testing the alignment of axes
B23K 26/04 - Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
p, a diameter at the focal point w, a Gaussian order p, a pulse repetition rate PRR of pulses n, a wavelength; b) making said learning machining function to learn so as to said laser machining system can machine said material to be machined according to the machining result sought.
G06F 30/20 - Design optimisation, verification or simulation
B23K 26/06 - Shaping the laser beam, e.g. by masks or multi-focusing
B23K 26/0622 - Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
B23K 26/082 - Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
B23K 26/359 - Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
B23K 26/382 - Removing material by boring or cutting by boring
B23K 26/40 - Removing material taking account of the properties of the material involved
G05B 19/4155 - Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by programme execution, i.e. part programme or machine function execution, e.g. selection of a programme
17.
Laser machining simulation method, laser machining system having means for implementing the method, and computer program for implementing this method
P, diameter of said machining laser beam at a focal point w, order of a Gaussian p, pulse repetition rate PRR n, wavelength; determining with said central unit on the basis of the information relating to said material to be machined and the laser machining system, a machining profile in two dimensions corresponding to the simulation of a machining of said material to be machined with said laser machining system.
G06F 30/20 - Design optimisation, verification or simulation
B23K 26/06 - Shaping the laser beam, e.g. by masks or multi-focusing
B23K 26/0622 - Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
B23K 26/082 - Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
B23K 26/359 - Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
B23K 26/382 - Removing material by boring or cutting by boring
B23K 26/40 - Removing material taking account of the properties of the material involved
G05B 19/4155 - Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by programme execution, i.e. part programme or machine function execution, e.g. selection of a programme
18.
Method for structuring a substrate, assembly comprising a substrate and a device for structuring said substrate, and substrate with such a structure
Method for structuring a substrate (11) and comprising the following steps: —providing a device (100) comprising a light source (33), an optical system (2) for obtaining an outgoing light beam (7) spatially offset in relation to the incoming light beam (1), and capable of modifying this spatial offset, focusing means (9) for focusing the outgoing light beam (7), a substrate holder (59), a movement device (60) for generating a movement (41) between the outgoing light beam (7) and the substrate (11); —providing and placing the substrate (11) on the substrate holder (59); —etching the substrate with the focused outgoing light beam (7) having an angle of attack (107) greater than 1° for any spatial offset between outgoing light beam (7) and incoming light beam (1) imposed by the optical system (2).
The invention relates to a method for providing a first (10) and a second (20) laser beam, which are spatially offset in relation to an input laser beam (301), and comprising the following steps: a) providing a laser source (300) for generating said input laser beam (301); b) providing a spatial offsetting unit (1) for providing an offset laser beam (7) that can keep the same polarisation between said input laser beam (301) and said offset laser beam (7); c) providing a separating unit (2) comprising a first module for separation (50) by polarisation in order to obtain, from said offset laser beam (7): the first laser beam spatially offset (10) by transmission; and the second laser beam spatially offest (20) by reflection, said first (10) and second (20) spatially offset laser beams being suitable for each describing a circle.
A system (100) for holding a workpiece (5) in position and exposing it to laser radiation, such that: - said workpiece (5) comprises a bottom surface (51) and a top surface (52) that are electrically insulated from each other; - said system (100) comprising: o an electrostatic charge generating device (9) for generating electrostatic charges on said top surface (52); o an electrically conductive support (80) for forming, on the bottom surface (51), electrostatic charges of opposite sign to those generated on said top surface (52); o a laser device (20) for machining or welding (5); said electrostatic charge generating device (9) being arranged to be activated before or during the laser machining or welding, such that said workpiece (5) is held in position relative to said electrically conductive support (80) during the machining or welding thereof.
The invention concerns a laser machining device comprising, in particular, means configured to generate and direct a gas stream to an area lying above a machining support in such a way as to create a suction effect capable of entraining machining dust away from said machining support. The method according to the invention consists essentially in a process extending the practical application of the abovementioned laser machining device.
B23K 26/142 - Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beamNozzles therefor for the removal of by-products
An optical device (100) for detecting the drift of a light beam of a laser machining system and comprising: - a beam splitter (50) for obtaining: o a first light beam (3) along a first optical path, and o a second light beam (4), along a second optical path; - a focal module (300) positioned at least partially along the first optical path to obtain a focused light beam, said focused light beam is directed towards a first light beam matrix detection means (30) positioned in a focusing plane (12) associated with said focal module (300); - an afocal module (400) positioned at least partially along the second optical path to obtain a collimated light beam (5), said collimated light beam (5) is directed towards a second light beam matrix detection means (40).
pp, • a diameter at the focal point w, • a Gaussian order p, • a pulse repetition rate PRR of n pulses, • a wavelength; (b) learning on the basis of the machining learning function so as to enable the laser machining system to machine the material to be machined according to the machining result sought.
pp, the diameter of the machining laser beam at a focal point w, a Gaussian order p, the pulse repetition rate PRR of n pulses, the wavelength; determining, by means of the central unit and on the basis of the information relating to the material to be machined and to the laser machining system, a two-dimensional machining profile corresponding to the simulation of a machining process of the material to be machined using the laser machining system.
The present application relates to a method for structuring a substrate (11) and comprising the following steps: providing a device (2) comprising a light source (21), an optical system (3) for obtaining an outgoing light beam (7) spatially offset relative to the incoming light beam (8), and suitable for modifying this spatial offset, focusing means (9) for focusing the outgoing light beam (7), a substrate holder, a movement device (60) for generating movement between the outgoing light beam (7) and the substrate (11), providing and placing the substrate (11) on the substrate holder, etching the substrate (11) with the focused outgoing light beam (7) having an angle of attack (107) greater than 1° for any spatial offset between outgoing light beam (7) and incoming light beam (1) imposed by the optical system (3).
B23K 26/06 - Shaping the laser beam, e.g. by masks or multi-focusing
B23K 26/08 - Devices involving relative movement between laser beam and workpiece
B23K 26/402 - Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
G02B 5/122 - Reflex reflectors cube corner, trihedral or triple reflector type
G02B 26/08 - Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
Machining device (100) comprising: a light source (33); an optical system (2) for obtaining a spatially offset outgoing light beam (7) remaining parallel to a given position upstream focusing means (9), said optical system (2) comprising: a movable mirror (19) such that its normal is able to depict a trajectory in a three-dimensional space, said optical system (2) being configured such that said first incident light beam (4) and said normal to the movable mirror (19) are separated by an angle (15) comprised between 0° and 15° for all possible positions and orientations of said movable mirror (19); driving means (6) for moving said movable mirror (19); a retro reflection system (21) able to provide a second incident light beam (8) parallel to a first reflected light beam (23) on said movable mirror (19); focusing means (9) for focusing outgoing light beam (7) on a target (10).
B23K 26/00 - Working by laser beam, e.g. welding, cutting or boring
B23K 26/06 - Shaping the laser beam, e.g. by masks or multi-focusing
G02B 5/122 - Reflex reflectors cube corner, trihedral or triple reflector type
G02B 26/08 - Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
The present invention relates to a method for joining a substrate (11) with a part (14) comprising a step of structuring the substrate with a pulsed laser (31), the substrate (11) preferably being made of metal and the part preferably being polymer-based. The structuring step allows grooves to be etched into the substrate (11) in a pattern (17) determined by the relative movement (41) of the beam (32) and the substrate (11). The pattern (17) is designed so as to allow an excellent adhesion to be achieved between the structured substrate (12) and a part (14) after the substrate (12) and the part (14) have been joined by laser welding (130). Preferably, the joining method comprises a step (50) of pre-treating the structured surface in order to allow better absorption of the laser during the joining by welding.
B23K 26/323 - Bonding taking account of the properties of the material involved involving parts made of dissimilar metallic material
B23K 26/359 - Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
Machining device (100) comprising: a light source (33); an optical system (2) for obtaining a spatially offset outgoing light beam (7) remaining parallel to a given position upstream focusing means (9), said optical system (2) comprising: a movable mirror (19) such that its normal is able to depict a trajectory in a three- dimensional space, said optical system (2) being configured such that said first incident light beam (4) and said normal to the movable mirror (19) are separated by an angle (15) comprised between 0° and 15° for all possible positions and orientations of said movable mirror (19); driving means (6) for moving said movable mirror (19); a retro reflection system (21) able to provide a second incident light beam (8) parallel to a first reflected light beam (23) on said movable mirror (19); focusing means (9) for focusing outgoing light beam (7) on a target (10).
G02B 5/122 - Reflex reflectors cube corner, trihedral or triple reflector type
G02B 26/08 - Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
B23K 26/388 - Trepanning, i.e. boring by moving the beam spot about an axis
B23K 26/082 - Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
