An air cavity package with one or more dovetail recesses configured with a first recess and a coincident second recess. The first recess has a first depth and the second recess has a second depth. The first recess has a lower width and an upper width smaller than the first lower width creating a dovetail shape. Individual dovetail recesses are created by creating a first recess in the flange at a first width and depth. A second recess with a second width and second depth and coincident with the first recess is pressed into the flange. The second width is greater than the first width and the second depth is smaller than the first depth. Pressing the second recess causes the first width at an upper portion to decrease, causing the first recess to develop a dovetail shape.
H01L 21/50 - Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups or
H01L 21/52 - Mounting semiconductor bodies in containers
H01L 23/10 - ContainersSeals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
H01L 23/12 - Mountings, e.g. non-detachable insulating substrates
2.
ELECTRONIC COMPONENT PACKAGE WITH IMPROVED MOUNTING AND ASSEMBLY
The present disclosure is directed to electronic packages with improved designs for mounting and assembly. An improved electronic package has a housing comprised of a housing material having a shear strength of less than about 11,000 psi, such as a conventionally known polymer. The electronic package has a leadframe within and extending from the housing, and is comprised of a leadframe material having a shear strength of more than about 20,000 psi. The leadframe further comprises fastener holes for receiving the threaded fasteners. Because the leadframe is the primary mounting point for the fasteners and because the leadframe material is stronger than the housing material, the strength of the fastener bond and the risk of the threads stripping out is reduced.
H01L 21/52 - Mounting semiconductor bodies in containers
H01L 23/36 - Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
H01L 21/50 - Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups or
H01L 23/10 - ContainersSeals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
3.
AIR CAVITY PACKAGE WITH IMPROVED THERMAL CONDUCTIVITY
The present disclosure is directed to an air cavity package with increased thermal conductivity and capable of withstanding higher reworking temperatures comprising a flange, a leadframe, and a lower ring but no upper ring. In some embodiments, an upper ring and a lower ring are present. The rings may comprise polymers such as LCP, metals such as copper, and other suitable materials. The lower ring may have a reduced thickness to increase thermal conductivity. The air cavity package with increased thermal conductivity may comprise a leadframe adhered directly to a flange. The leadframe may further comprises a copper layer adhered directly to the flange and the flange may be adhered directly to the copper layer with a solder.
An air cavity package having a supplemental heat generator for generating heat and a pressure greater than atmospheric pressure within the air cavity package. The supplemental heat generator may be maintained at a constant or variable temperature. The supplemental heat generator may be selectively activated based on a predetermined parameter by a user or by a processor. The supplemental heat generator may be an RF and or other chip capable of generating heat or a conductive wire.
B65D 51/10 - Loosely-engaging lids or covers for jars, cans or like containers for liquids without means for effecting sealing of container opening automatically when container is tilted for pouring
B65B 63/08 - Auxiliary devices, not otherwise provided for, for operating on articles or materials to be packaged for heating or cooling articles or materials to facilitate packaging
B65D 81/18 - Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient
G05D 16/20 - Control of fluid pressure characterised by the use of electric means
G05D 23/19 - Control of temperature characterised by the use of electric means
H05B 3/64 - Heating elements specially adapted for furnaces using ribbon, rod, or wire heater
5.
VACUUM ASSISTED SEALING PROCESSES & SYSTEMS FOR INCREASING AIR CAVITY PACKAGE MANUFACTURING RATES
The present disclosure describes a sealing processes and structure for sealing air cavity electronic packages using a thermosetting, thermal plastic, other known or as yet unknown adhesives, or hybrid combinations of such adhesive(s). Processes disclosed comprise steps of providing a base and a lid, with at least one of the base and the lid having a mating surface coated with the adhesive. Initially, an air gap is maintained between the base, the lid, and the adhesive and a vacuum is generated around the base, the lid, and the adhesive. Once the vacuum has been generated, the base and the lid are mated to create a mated package assembly with a vacuum therein. After the mating, the mated package assembly is heated to a curing temperature to cure the adhesive, and pressure may be applied as well. Because the air within the mated package assembly has been evacuated prior to heating, there is no air pressure build-up therein, reducing or eliminating the presence of blowouts and pin holes.
The present disclosure describes a lead for semiconductor device package having at least one aperture through a portion of the lead that will be bonded to a PCB. A semiconductor device package includes a housing having a base, a side wall frame, and a lid, a die surrounded by the housing, and at least one lead extending from the die until the die is exterior to the housing, the lead having at least one aperture through a portion of the lead that will be bonded to a PCB.
H01L 23/28 - Encapsulation, e.g. encapsulating layers, coatings
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 23/34 - Arrangements for cooling, heating, ventilating or temperature compensation
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
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