Abstract

A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.

IPC Classes  ?

• H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
• H01L 23/482 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of lead-in layers inseparably applied to the semiconductor body
• H03H 9/05 - Holders or supports
• H03H 9/10 - Mounting in enclosures
• H01L 23/50 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements for integrated circuit devices
• H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
• H01L 23/00 - Details of semiconductor or other solid state devices

Abstract

A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.

IPC Classes  ?

• H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
• H03H 9/10 - Mounting in enclosures
• H03H 9/05 - Holders or supports
• H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
• H01L 23/482 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of lead-in layers inseparably applied to the semiconductor body
• H01L 23/50 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements for integrated circuit devices
• H01L 23/00 - Details of semiconductor or other solid state devices

Abstract

A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.

IPC Classes  ?

• H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
• H03H 9/05 - Holders or supports
• H01L 23/00 - Details of semiconductor or other solid state devices
• H03H 9/10 - Mounting in enclosures
• H01L 23/50 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements for integrated circuit devices
• H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
• H01L 23/482 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of lead-in layers inseparably applied to the semiconductor body

Abstract

A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.

IPC Classes  ?

• H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
• H03H 9/05 - Holders or supports
• H03H 9/10 - Mounting in enclosures
• H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
• H01L 23/482 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of lead-in layers inseparably applied to the semiconductor body
• H01L 23/50 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements for integrated circuit devices
• H01L 23/00 - Details of semiconductor or other solid state devices

Abstract

A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.

IPC Classes  ?

• H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
• H03H 9/10 - Mounting in enclosures
• H01L 23/482 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of lead-in layers inseparably applied to the semiconductor body
• H01L 23/50 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements for integrated circuit devices
• H03H 9/05 - Holders or supports
• H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
• H01L 23/00 - Details of semiconductor or other solid state devices

Abstract

A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.

IPC Classes  ?

• H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
• H03H 9/10 - Mounting in enclosures
• H01L 23/482 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of lead-in layers inseparably applied to the semiconductor body
• H01L 23/50 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements for integrated circuit devices
• H03H 9/05 - Holders or supports
• H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
• H01L 23/00 - Details of semiconductor or other solid state devices

Abstract

A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.

IPC Classes  ?

• H01L 29/40 - Electrodes
• H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
• H01L 23/482 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of lead-in layers inseparably applied to the semiconductor body
• H03H 9/05 - Holders or supports
• H03H 9/10 - Mounting in enclosures
• H01L 23/50 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements for integrated circuit devices
• H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
• H01L 23/00 - Details of semiconductor or other solid state devices

Abstract

A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.

IPC Classes  ?

• H01L 29/40 - Electrodes
• H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
• H01L 23/482 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of lead-in layers inseparably applied to the semiconductor body
• H03H 9/05 - Holders or supports
• H03H 9/10 - Mounting in enclosures
• H01L 23/50 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements for integrated circuit devices
• H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
• H01L 23/00 - Details of semiconductor or other solid state devices

Abstract

A semiconductor device has a through electrode formed in a through hole which penetrates a Si substrate from one surface to the other surface of the Si substrate, wherein a rectangular electrode pad is provided on the other surface with an insulation film laid between the electrode pad and the other surface, an opening of the through hole on the one surface side is circular, an opening of the through hole on the other surface side is rectangular, and the area of the opening on the other surface side is made smaller than the area of the opening on the one surface side.

IPC Classes  ?

• H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
• H01L 23/52 - Arrangements for conducting electric current within the device in operation from one component to another
• H01L 29/40 - Electrodes
• H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
• H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
• H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device

Abstract

An electronic substrate includes: an electronic element provided on a first face of a semiconductor substrate having a through hole; a passive element provided on a second face of the semiconductor substrate; a first part of an interconnection pattern provided on the second face of the semiconductor substrate; an insulating layer provided on the second face of the semiconductor substrate; and a second part of the interconnection pattern provided on the insulating layer.

IPC Classes  ?

• H05K 7/00 - Constructional details common to different types of electric apparatus
• H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
• H01L 23/498 - Leads on insulating substrates
• H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits

Abstract

A semiconductor device has a through electrode formed in a through hole which penetrates a Si substrate from one surface to the other surface of the Si substrate, wherein a rectangular electrode pad is provided on the other surface with an insulation film laid between the electrode pad and the other surface, an opening of the through hole on the one surface side is circular, an opening of the through hole on the other surface side is rectangular, and the area of the opening on the other surface side is made smaller than the area of the opening on the one surface side.

IPC Classes  ?

• H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
• H01L 23/52 - Arrangements for conducting electric current within the device in operation from one component to another
• H01L 29/40 - Electrodes
• H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
• H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device
• H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates

Abstract

A semiconductor device includes a semiconductor substrate and a through electrode provided in a through hole formed in the semiconductor substrate. The through electrode partially protrudes from a back surface of the semiconductor substrate, which is opposite to an active surface thereof. The through electrode includes a resin core and a conductive film covering at least a part of the resin core.

IPC Classes  ?

• H01L 29/40 - Electrodes
• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
• H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device
• H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements

Abstract

A semiconductor device includes: a semiconductor substrate including a first face and a second face on a side opposite to the first face; an external connection terminal formed on the first face of the semiconductor substrate; a first electrode formed on the first face of the semiconductor substrate and electrically connected to the external connection terminal; an electronic element formed on or above the second face of the semiconductor substrate; a second electrode electrically connected to the electronic element and having a top face and a rear face; a groove portion formed on the second face of the semiconductor substrate and having a bottom face including at least part of the rear face of the second electrode; and a conductive portion formed in the groove portion and electrically connected to the rear face of the second electrode.

IPC Classes  ?

• H01L 29/40 - Electrodes
• H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
• H03H 9/05 - Holders or supports
• H03H 9/10 - Mounting in enclosures
• H01L 23/482 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of lead-in layers inseparably applied to the semiconductor body
• H01L 23/00 - Details of semiconductor or other solid state devices

Abstract

A semiconductor device has a through electrode formed in a through hole which penetrates a Si substrate from one surface to the other surface of the Si substrate, wherein a rectangular electrode pad is provided on the other surface with an insulation film laid between the electrode pad and the other surface, an opening of the through hole on the one surface side is circular, an opening of the through hole on the other surface side is rectangular, and the area of the opening on the other surface side is made smaller than the area of the opening on the one surface side.

IPC Classes  ?

• H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
• H01L 23/52 - Arrangements for conducting electric current within the device in operation from one component to another
• H01L 29/40 - Electrodes
• H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
• H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
• H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device

Abstract

An electronic substrate includes: an electronic element provided on a first face of a semiconductor substrate having a through hole; a passive element provided on a second face of the semiconductor substrate; a first part of an interconnection pattern provided on the second face of the semiconductor substrate; an insulating layer provided on the second face of the semiconductor substrate; and a second part of the interconnection pattern provided on the insulating layer.

IPC Classes  ?

• H05K 7/02 - Arrangements of circuit components or wiring on supporting structure
• H05K 7/06 - Arrangements of circuit components or wiring on supporting structure on insulating boards
• H05K 7/08 - Arrangements of circuit components or wiring on supporting structure on insulating boards on perforated boards
• H05K 7/10 - Plug-in assemblages of components
• H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
• H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
• H01L 23/498 - Leads on insulating substrates

Abstract

A semiconductor device includes a semiconductor substrate and a through electrode provided in a through hole formed in the semiconductor substrate. The through electrode partially protrudes from a back surface of the semiconductor substrate, which is opposite to an active surface thereof. The through electrode includes a resin core and a conductive film covering at least a part of the resin core.

IPC Classes  ?

• H01L 29/40 - Electrodes

Abstract

A semiconductor device includes: a semiconductor substrate including a first face and a second face on a side opposite to the first face; an external connection terminal formed on the first face of the semiconductor substrate; a first electrode formed on the first face of the semiconductor substrate and electrically connected to the external connection terminal; an electronic element formed on or above the second face of the semiconductor substrate; a second electrode electrically connected to the electronic element and having a top face and a rear face; a groove portion formed on the second face of the semiconductor substrate and having a bottom face including at least part of the rear face of the second electrode; and a conductive portion formed in the groove portion and electrically connected to the rear face of the second electrode.

IPC Classes  ?

• H01L 21/4763 - Deposition of non-insulating-, e.g. conductive-, resistive-, layers on insulating layersAfter-treatment of these layers

Abstract

A semiconductor device has a through electrode formed in a through hole which penetrates a Si substrate from one surface to the other surface of the Si substrate, wherein a rectangular electrode pad is provided on the other surface with an insulation film laid between the electrode pad and the other surface, an opening of the through hole on the one surface side is circular, an opening of the through hole on the other surface side is rectangular, and the area of the opening on the other surface side is made smaller than the area of the opening on the one surface side.

IPC Classes  ?

• H01L 21/44 - Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups

Abstract

A semiconductor device includes: a semiconductor substrate including a first face and a second face on a side opposite to the first face; an external connection terminal formed on the first face of the semiconductor substrate; a first electrode formed on the first face of the semiconductor substrate and electrically connected to the external connection terminal; an electronic element formed on or above the second face of the semiconductor substrate; a second electrode electrically connected to the electronic element and having a top face and a rear face; a groove portion formed on the second face of the semiconductor substrate and having a bottom face including at least part of the rear face of the second electrode; and a conductive portion formed in the groove portion and electrically connected to the rear face of the second electrode.

IPC Classes  ?

• H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements

Abstract

An image display device includes a display unit that is installed inside a finder window provided in a housing and displays images, an obtaining unit that obtains brightness of a space inside the finder window, and a control unit that when the brightness obtained by the obtaining unit is a first brightness, sets the brightness of the display unit to a second brightness, and when the brightness obtained by the obtaining unit is a third brightness brighter than the first brightness, sets the brightness of the display unit to a fourth brightness brighter than the second brightness.

IPC Classes  ?

• G03B 17/20 - Signals indicating condition of a camera member or suitability of light visible in viewfinder
• G03B 13/02 - Viewfinders

Abstract

An image display device includes a display unit that is installed inside a finder window provided in a housing and displays images, an illumination unit that illuminates a space inside the finder window, and a control unit that when brightness of the display unit is a first brightness, sets the brightness of the illumination unit to a second brightness, and when the brightness of the display unit is a third brightness brighter than the first brightness, sets the brightness of the illumination unit to a fourth brightness brighter than the second brightness.

IPC Classes  ?

• G03B 17/20 - Signals indicating condition of a camera member or suitability of light visible in viewfinder
• G03B 13/02 - Viewfinders

Abstract

An image display device includes a display unit that is installed inside a finder window provided in a housing and displays images, an illumination unit that illuminates a space inside the finder window, an obtaining unit that obtains brightness of an outside of the housing, and a control unit that when the brightness obtained by the obtaining unit is a first brightness, sets the brightness of the illumination unit to a second brightness, and when the brightness obtained by the obtaining unit is a third brightness brighter than the first brightness, sets the brightness of the illumination unit to a fourth brightness brighter than the second brightness.

IPC Classes  ?

• G03B 17/20 - Signals indicating condition of a camera member or suitability of light visible in viewfinder
• G03B 13/02 - Viewfinders

Abstract

An input image (e.g. a digital RGB color image) is subjected to an eye classifier that is targeted at discriminating a complete eye pattern from any non-eye patterns. The red-eye candidate list with associated bounding boxes that are generated by the red-eye classifier are received. The bounding rectangles are subjected to object segmentation. A connected component labeling procedure is then applied to obtain one or more red regions. The largest red region is then chosen for feature extraction. A number of features are then extracted from this region. Then these features are used to determine if the particular candidate red-eye object is a mouth.

IPC Classes  ?

• G06K 9/34 - Segmentation of touching or overlapping patterns in the image field
• G06K 9/40 - Noise filtering
• G06K 9/00 - Methods or arrangements for reading or recognising printed or written characters or for recognising patterns, e.g. fingerprints

Abstract

A semiconductor device has a through electrode formed in a through hole which penetrates a Si substrate from one surface to the other surface of the Si substrate, wherein a rectangular electrode pad is provided on the other surface with an insulation film laid between the electrode pad and the other surface, an opening of the through hole on the one surface side is circular, an opening of the through hole on the other surface side is rectangular, and the area of the opening on the other surface side is made smaller than the area of the opening on the one surface side.

IPC Classes  ?

• H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
• H01L 23/52 - Arrangements for conducting electric current within the device in operation from one component to another
• H01L 29/40 - Electrodes

Abstract

An imaging device includes: an imaging unit that images a subject with three or more kinds of exposures, ratios of respective pairs of exposures of which adjacent to each other in an ascending order or a descending order are equal; and a combining unit that combines, on the basis of the ratios, pixel signals corresponding to the respective three or more kinds of exposures obtained by imaging the subject with the imaging unit.

IPC Classes  ?

• H04N 5/225 - Television cameras
• H04N 9/04 - Picture signal generators

Abstract

Automatic red-eye object classification in digital photographic images. A method for classifying a candidate red-eye object in a digital photographic image includes several acts. First, a candidate red-eye object in a digital photographic image is selected. Next, RGB pixels of the candidate red-eye object are converted into YUV pixels. Then, the YUV pixels satisfying a constraint that is a function of the YUV pixels are summed. Next, the sum is determined to be greater than or equal to a scaled version of the total number of YUV pixels in the candidate red-eye object. Finally, the candidate red-eye object is transformed into a true red-eye object.

IPC Classes  ?

• G06K 9/00 - Methods or arrangements for reading or recognising printed or written characters or for recognising patterns, e.g. fingerprints
• G06K 9/46 - Extraction of features or characteristics of the image
• G06K 9/66 - Methods or arrangements for recognition using electronic means using simultaneous comparisons or correlations of the image signals with a plurality of references, e.g. resistor matrix references adjustable by an adaptive method, e.g. learning
• G06K 9/62 - Methods or arrangements for recognition using electronic means

Abstract

A semiconductor device comprising: a substrate; a terminal on the substrate's first surface; a first electrode on the first surface connected to the terminal; an electronic element on the substrate's second surface; a second electrode connected to the electronic element; a groove on the second surface leading to the second electrode; a conductive portion inside the grove connected to the second electrode's rear face; a first wiring on the first surface connected to the first electrode; a second wiring connecting the first wiring and the terminal; a stress-absorbing layer between the substrate and terminal; a land connecting the first wiring and the second wiring, the land opening a part of the stress-absorbing layer and exposing the first wiring, the land being in a region surrounded by terminals, and the land being along a straight line connecting the centers of diagonal terminals, with the region between the terminals.

IPC Classes  ?

• H01L 23/04 - ContainersSeals characterised by the shape
• H01L 21/28 - Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups

Abstract

The electronic substrate includes: a substrate having a first face on which an active element is formed, and a second face on an opposite side to the first face and on which a passive element is formed; and an insulating layer including insulating resin and provided on the substrate, wherein the passive element is formed on the insulating layer, and further comprising: an interconnection pattern arranged on or above the second face of the substrate, wherein the passive element is configured from one part of the interconnection pattern, and a resin layer provided on the second face of the substrate, wherein at least one part of the passive element is formed on the resin layer.

IPC Classes  ?

• H05K 7/00 - Constructional details common to different types of electric apparatus

Abstract

The manufacturing method for electronic substrate includes: forming an active region on a first face of a substrate; forming a first part of an interconnection pattern as a passive element on a second face of the substrate; forming an insulating layer as a stress-relieving layer on the second face of the substrate; and forming a second part of the interconnection pattern as the passive element on the insulating layer.

IPC Classes  ?

• H05K 7/02 - Arrangements of circuit components or wiring on supporting structure
• H05K 7/06 - Arrangements of circuit components or wiring on supporting structure on insulating boards
• H05K 7/08 - Arrangements of circuit components or wiring on supporting structure on insulating boards on perforated boards
• H05K 7/10 - Plug-in assemblages of components

Abstract

Disclosed are methods, devices, and computer program products for red-eye detection in a digital image. In one example embodiment, a method for detecting a red-eye effect in a digital image includes several acts. First, red pixels having a predetermined degree of redness are identified in the image. Next, redness contrast is detected with respect to each of the red pixels and redness is then enhanced for those red pixels having a predetermined level of redness contrast. The pixels identified as being red are then further refined by applying another redness threshold based on one or more color characteristics associated with the red pixels. The refined set of red pixels may then be partitioned into a set of one or more candidate red-eye objects. A candidate red-eye object may be removed as a false positive based on geometric constraints associated with red-eye objects and/or proximity of the object to pixels with human skin-like color tones.

IPC Classes  ?

• G06K 9/00 - Methods or arrangements for reading or recognising printed or written characters or for recognising patterns, e.g. fingerprints
• G06K 9/40 - Noise filtering

Abstract

Disclosed are methods, devices, and computer program products for red-eye detection in an image. In one example embodiment, a method for detecting red-eye objects in an image includes several acts. First, a set of candidate red-eye objects identified in the image is received. Then, features are extracted from the candidate red-eye objects and, with a plurality of classifiers, a false red-eye object is eliminated from the set of candidate red-eye objects based on the extracted features. First and second ones of the plurality of classifiers are optimized for classifying objects in a first range of sizes using first and second ones of the extracted features, respectively. Furthermore, third and fourth ones of the plurality of classifiers are also optimized for classifying objects using the first and second ones of the extracted features, respectively, but for objects in a second range of sizes.

IPC Classes  ?

• G06K 9/40 - Noise filtering
• G06K 9/00 - Methods or arrangements for reading or recognising printed or written characters or for recognising patterns, e.g. fingerprints
• G06K 9/62 - Methods or arrangements for recognition using electronic means

Abstract

A digital camera including a lens, first and second sensors, a shutoff member, a display, a detector, an exposure amount determiner, and a still image generator. The first sensor receives light through the lens and the second sensor also receives light through the lens, but is different from the first sensor. The shutoff member performs a first shutoff of the light received by the first sensor through the lens and also ends the first shutoff. The display displays a moving image based on the light received by the first sensor, and while the moving image is displayed, the detector detects a shutter operation. The exposure amount determiner determines, in response to the detected shutter operation, an exposure amount based on the light received by the second sensor when the first sensor does not receive light through the lens. The still image generator generates a still image based on the light received by the first sensor and the exposure amount determined by the exposure amount determiner.

IPC Classes  ?

• H04N 5/235 - Circuitry for compensating for variation in the brightness of the object
• G03B 7/00 - Control of exposure by setting shutters, diaphragms or filters, separately or conjointly

Abstract

A semiconductor device includes a semiconductor substrate and a through electrode provided in a through hole formed in the semiconductor substrate. The through electrode partially protrudes from a back surface of the semiconductor substrate, which is opposite to an active surface thereof. The through electrode includes a resin core and a conductive film covering at least a part of the resin core.

IPC Classes  ?

• H01L 29/40 - Electrodes

Abstract

An information processing device comprising a data record medium access unit into which a data record medium, which has a first operation mode and a second operation mode as operation modes and has a first sub-operation mode and a second sub-operation mode as sub-operation modes of the second operation mode, is inserted and which gains access to the inserted data record medium, wherein it is necessary to stop power supply to the data record medium when the access to the data record medium is switched between the first operation mode and the second operation mode, but it is not necessary to stop the power supply to the data record medium when the access to the data record medium is switched between the first sub-operation mode and the second sub-operation mode and a selection unit which allows a user to select a type of access to the data record medium inserted into the data record medium access unit, wherein the information processing device is able to select an operation mode having a fastest data transmission rate among operation modes in which a newly detected data record medium is operable on the basis of a mode selection table.

IPC Classes  ?

• G06F 13/12 - Program control for peripheral devices using hardware independent of the central processor, e.g. channel or peripheral processor

Abstract

An image recording device that includes: a photographing condition information storing unit that stores photographing condition information including information of an area in which an image is photographed and information of a period of time in which the image is photographed; photographing control means that allows the photographing unit to photograph an image when it is determined that current location information acquired by the location information acquisition unit and current time information acquired by the time information acquisition unit satisfy a condition shown in the photographing condition information stored in the photographing condition information storing unit; and image recording means that records local image data, and allowing the local image data to correspond to recording content information including information of an area in which the photographing is executed and time information acquired by the time information acquisition unit in a photographing period.

IPC Classes  ?

• G03B 17/24 - Details of cameras or camera bodiesAccessories therefor with means for separately producing marks on the film, e.g. title, time of exposure
• G03B 17/48 - Details of cameras or camera bodiesAccessories therefor adapted for combination with other photographic or optical apparatus

Abstract

A method, of interpolating missing colors in a color filter array comprising red, green and blue photosites comprises determining and interpolation direction for each red and each blue photosite based on local edge information and interpolating a green color for each red and each blue photosite in the determined interpolation direction for that photosite. For each green photosite, red and blue colors are interpolated. For each red photosite, a blue color is interpolated in the determined interpolation direction for that photosite and for each blue photosite, a red color is interpolated in the determined interpolation direction for that photosite.

IPC Classes  ?

• H04N 9/64 - Circuits for processing colour signals

Abstract

A semiconductor device includes: a semiconductor substrate including a first face and a second face on a side opposite to the first face; an external connection terminal formed on the first face of the semiconductor substrate; a first electrode formed on the first face of the semiconductor substrate and electrically connected to the external connection terminal; an electronic element formed on or above the second face of the semiconductor substrate; a second electrode electrically connected to the electronic element and having a top face and a rear face; a groove portion formed on the second face of the semiconductor substrate and having a bottom face including at least part of the rear face of the second electrode; and a conductive portion formed in the groove portion and electrically connected to the rear face of the second electrode.

IPC Classes  ?

• H01L 21/28 - Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups

Abstract

An image processor is the image processor generating composed image data by composite image data of plural images taken with different exposures, which includes an image data acquisition unit that acquires image data of images taken with different exposures, a reliability evaluation unit that evaluates the reliability of image data having different exposures acquired by the image acquisition unit, in which the image data acquired by the image acquisition unit includes image data of plural color components, according to image data of plural color components included in the image data, a color selection unit that selects image data of each color component from any of image data of plural images having different exposures based on the reliability obtained from the result of evaluation by the reliability evaluation unit and a composite unit that generates the composed image data by composite image data of respective color components selected by the color selection unit in the image data.

IPC Classes  ?

• G06K 9/00 - Methods or arrangements for reading or recognising printed or written characters or for recognising patterns, e.g. fingerprints

Abstract

An image pickup device having a photoelectric conversion unit having a plurality of photoelectric conversion elements arranged in a matrix pattern for converting exposed light into electric charges and accumulating the same and an electronic shutter function for controlling the exposure time for each frame including: a first reader for reading out electric charges exposed during a standard exposure time from respective pixels including the photoelectric conversion elements in the exposed area of the photoelectric conversion unit in a destructive read-out method; a second reader for reading out electric charges exposed during a short exposure time, which is an exposure time shorter than the standard exposure time, from the respective pixels including the photoelectric conversion elements during the same exposure period as the first reader in a nondestructive read-out method; and a saturation predictor for predicting whether or not the amounts of accumulated electric charges in the respective pixels being exposed during the standard exposure time are saturated on the basis of a non-standard exposure pixel data including the electric charges being exposed during the short exposure time, which are read out by the second reader.

IPC Classes  ?

• H04N 5/235 - Circuitry for compensating for variation in the brightness of the object
• H04N 3/14 - Scanning details of television systemsCombination thereof with generation of supply voltages by means not exclusively optical-mechanical by means of electrically scanned solid-state devices
• H04N 5/335 - Transforming light or analogous information into electric information using solid-state image sensors [SSIS]
• G03B 7/00 - Control of exposure by setting shutters, diaphragms or filters, separately or conjointly

Abstract

A shake detection device detecting a camera shake amount generated when photographing a subject includes a detection sensor detecting a rotation speed around a predetermined axis of the camera, a first image shift amount calculation unit driving the detection sensor to detect the rotation speed and, for an image of the subject photographed by the camera, calculating a first image shift amount as an image shift amount in a first direction based on the rotation speed, a second image shift amount calculation unit performing a predetermined image analysis on the image of the subject photographed by the camera and, for the image of the subject photographed by the camera, calculating a second image shift amount as an image shift amount in a second direction based on the analysis result, and a shake amount estimation unit estimating the camera shake amount using the first and second image shift amounts.

IPC Classes  ?

• G03B 17/00 - Details of cameras or camera bodiesAccessories therefor

Abstract

A method of generating a panorama background from a set of images comprises dividing each of the images into blocks and comparing color-space features of corresponding blocks of the images to select background blocks. The selected background blocks are merged to generate the panorama background. An apparatus and computer readable medium embodying a computer program for generating a panorama background are also provided.

IPC Classes  ?

• G06K 9/36 - Image preprocessing, i.e. processing the image information without deciding about the identity of the image

Abstract

a that expresses the outer border of the imaging range so as to obtain the image as a finder image, and controls so that the finder image is displayed on a display 47. As a result, the imaging range PA is smaller than the finder range FA but is smaller by only one size. The ratio occupied by the imaging range PA within the finder range FA is accordingly sufficiently large, and the imaging range PA can be recognized easily and without fail.

IPC Classes  ?

• G03B 13/14 - Viewfinders adjusting viewfinder field to compensate for parallax due to short range

Abstract

A data processing device includes a data storage section that stores data; an authentication information storage section that stores first authentication information registered by a user; an input section that allows the user to input second authentication information; a first judgment section that permits reading of the data stored in the data storage section when the first authentication information matches the second authentication information, and does not permit reading of the data stored in the data storage section when the first authentication information does not match the second authentication information; a slot into which an external storage device can be inserted; and a writing admission section that permits writing of the data stored in an external storage device into the data storage section without input of the second authentication information when the external storage device is inserted into the slot.

IPC Classes  ?

• G06F 7/04 - Identity comparison, i.e. for like or unlike values

Abstract

An image capturing apparatus includes: a shake amount detecting unit that detects a shake amount; a composition determining unit that determines whether the composition of a picture is determined during image capturing on the basis of the correlation among a plurality of frames; a shake correcting unit that performs a shake correcting process on a captured image on the basis of the detected camera shake amount; and a correction control unit that controls the shake correcting unit to start the shake correcting process when the shake amount is smaller than a predetermined reference shake amount and it is determined that the composition of a picture is determined.

IPC Classes  ?

• G03B 17/00 - Details of cameras or camera bodiesAccessories therefor
• G03B 3/10 - Power-operated focusing
• G03B 13/36 - Autofocus systems
• H04N 5/228 - Circuit details for pick-up tubes

Abstract

A controller includes a photographing control unit controlling an image pickup unit taking a photograph of an object to perform a short-time photographing operation in which an exposure time is set shorter than a normal exposure time and an image correcting unit acquiring correction information for correcting image data taken in the short-time photographing operation and correcting the image data using the acquired correction information.

IPC Classes  ?

• G03B 7/083 - Analogue circuits for control of exposure time

Abstract

A controller is provided which includes a photographing control unit controlling an image pickup unit to take a photograph and a shake detecting unit detecting an amount of shake even time the image pickup unit takes a photograph. Here, the photographing control unit allows the image pickup unit to consecutively take a photograph and ends the photographing operation of the image pickup unit when the amount of shake detected by the shake detecting unit at the time of the photographing operation of the image pickup unit is larger than the amount of shake detected at the time of the previous photographing operation.

IPC Classes  ?

• G03B 17/00 - Details of cameras or camera bodiesAccessories therefor

Abstract

A method, apparatus and image capture device for limiting motion blur during capture of an image predetermines a relationship between movement of the image capture device, time and blur extent. A rate of movement of the image capture device is obtained and used in conjunction with the determined relationship and a blur extent limit as a basis for obtaining a maximum exposure time for the image capture device in order to limit blur extent. On the basis of the maximum exposure time obtained and a required image brightness, the image capture device is configured, and then an image is captured by the image capture device. Once the image has been captured, due to the possibility of under-exposure from having limited the exposure time, the image is processed as required to increase its intensity.

IPC Classes  ?

• G03B 17/01 -
• G03B 7/093 - Digital circuits for control of exposure time

Abstract

An interactive photo system that provides an interesting and entertaining way to link photos from the digital and analog domains. The system enables easy conversion of a paper-based photo into digital form. The conversion process generally involves a user holding up a paper-based photo image in front of a camera of the system, such that the captured image is rendered in a specific location on a display screen. The system adjusts the captured image for orientation and illumination irregularities in creating a digital version of the paper-based photo. The system further includes a database of digital images and a content retrieval engine to which content from the just-converted digital image can be used as a search query to search the database for other similar digital photos.

IPC Classes  ?

• G06K 9/00 - Methods or arrangements for reading or recognising printed or written characters or for recognising patterns, e.g. fingerprints
• G06K 9/54 - Combinations of preprocessing functions
• G06K 9/60 - Combination of image acquisition and preprocessing functions

Abstract

A semiconductor device includes: a semiconductor substrate having an active face; a first electrode provided on or above the active face; an external connection terminal provided on or above the active face and electrically connected to the first electrode; and a connection terminal provided on or above the active face of the semiconductor substrate.

IPC Classes  ?

• H01L 23/02 - ContainersSeals
• H01L 21/44 - Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups

Abstract

A control method of a digital camera includes: displaying a moving image on a screen based on charges stored in an image sensor by an electronic shutter with a shutter curtain opened; detecting illuminance of the shutter curtain with the shutter curtain closed; setting a still image exposure period based on the detected illuminance of the shutter curtain; exposing the image sensor in the still image exposure period with the shutter curtain opened; and storing a still image in a recording medium based on the charges stored in the image sensor in the still image exposure period.

IPC Classes  ?

• H04N 5/235 - Circuitry for compensating for variation in the brightness of the object
• G03B 7/00 - Control of exposure by setting shutters, diaphragms or filters, separately or conjointly

Abstract

An electronic substrate is disclosed that includes: a substrate having a first face on which an active region is formed, and a second face on an opposite side to the first face and on which a passive element is formed. The substrate may further include: a penetrative conductive portion penetrating through the substrate; and an electrode formed on the first face, wherein the passive element is electrically connected to the electrode via a penetrative conductive portion.

IPC Classes  ?

• H05K 7/02 - Arrangements of circuit components or wiring on supporting structure
• H05K 7/06 - Arrangements of circuit components or wiring on supporting structure on insulating boards
• H05K 7/08 - Arrangements of circuit components or wiring on supporting structure on insulating boards on perforated boards
• H05K 7/10 - Plug-in assemblages of components

Abstract

A semiconductor device includes: a semiconductor substrate including a first face and a second face on a side opposite to the first face; an external connection terminal formed on the first face of the semiconductor substrate; a first electrode formed on the first face of the semiconductor substrate and electrically connected to the external connection terminal; an electronic element formed on or above the second face of the semiconductor substrate; a second electrode electrically connected to the electronic element and having a top face and a rear face; a groove portion formed on the second face of the semiconductor substrate and having a bottom face including at least part of the rear face of the second electrode; and a conductive portion formed in the groove portion and electrically connected to the rear face of the second electrode.

IPC Classes  ?

• H01L 23/04 - ContainersSeals characterised by the shape

Abstract

An image capturing device includes an image capturer, operable to perform a first image capturing of an object image so as to generate first image data corresponding to a first time period shorter than a predetermined time period, and operable to perform a second image capturing of the object image so as to generate second image data corresponding to a second time period shorter than the predetermined time period, a storage, adapted to store the first image data and the second image data, and an image generator, operable to generate image data corresponding to the predetermined time period based on the first image data and the second image data.

IPC Classes  ?

• G11B 27/00 - EditingIndexingAddressingTiming or synchronisingMonitoringMeasuring tape travel
• H04N 5/93 - Regeneration of the television signal or of selected parts thereof
• H04N 5/228 - Circuit details for pick-up tubes
• G03B 17/00 - Details of cameras or camera bodiesAccessories therefor

Abstract

An image correction system includes an image capturer, operable to capture an object image and to generate image data based on the object image, a first storage, adapted to store the image data, a timing signal generator, operable to periodically generate timing signals, an image processor, operable to periodically store the image data into the first storage in accordance with each of the timing signals, a detector, operable to periodically detect movement of the image capturer and to generate movement data based on the detected movement, and a second storage, adapted to periodically store the movement data in association with timing data based on each of the timing signals.

IPC Classes  ?

• H04N 1/00 - Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmissionDetails thereof
• H04N 1/40 - Picture signal circuits
• H04N 1/04 - Scanning arrangements
• G03B 37/02 - Panoramic or wide-screen photographyPhotographing extended surfaces, e.g. for surveyingPhotographing internal surfaces, e.g. of pipe with scanning movement of lens or camera

Abstract

An image correcting method includes: (a) acquiring original image information to be corrected; (b) setting a confirmation range for confirming an effect of a correction; (c) producing corrected image information; and (d) displaying, on an image display section, an original image based on the original image information and a corrected image based on the corrected image information. The confirmation range is set based on the original image information. The corrected image information is produced by correcting the original image information within the confirmation range.

IPC Classes  ?

• H04N 5/228 - Circuit details for pick-up tubes

Abstract

In the present invention, an image evaluation method includes: (a) a step of acquiring image information to be evaluated; (b) a step of setting an evaluation area for the acquired image information, the evaluation area being smaller than an area corresponding to the image information; (c) a step of obtaining an individual evaluation on the acquired image information; (d) a step of obtaining another individual evaluation on the acquired image information; and (e) a step of obtaining a comprehensive evaluation based on the individual evaluation and the other individual evaluation. Herein, the individual evaluation is obtained by individually evaluating a predetermined item in the set evaluation area. The other individual evaluation is obtained by individually evaluating another predetermined item.

IPC Classes  ?

• G06K 9/40 - Noise filtering
• G06K 9/00 - Methods or arrangements for reading or recognising printed or written characters or for recognising patterns, e.g. fingerprints

Abstract

The present method of evaluating image information, includes: extracting, from image information to be evaluated, a plurality of edge pixels located in a boundary of an image expressed by the image information; calculating, for each of the edge pixels, a number of pixels that include the edge pixel targeted for calculation, that exist in the boundary, and that are arranged in a direction intersecting with the boundary; and performing out-of-focus blurring evaluation of the image information on the basis of the number of pixels that exist in the boundary and a number of the edge pixels.

IPC Classes  ?

• G06K 9/40 - Noise filtering

Abstract

An image capturing device is adapted to capture an object image and to generate an image data. Each of a plurality of image capturers is adapted to perform an image capturing of a part of the object image and to generate a partial image data which constitutes a part of the image data based on the part of the object image. Each of the image capturers has an optical axis. A detector is operable to detect movement of each of the image capturers in a direction perpendicular to the optical axis during the image capturing and to generate movement data based on the detected movement, for each of the image capturers. A processor is operable to correct the partial image data so as to compensate the movement during the image capturing based on the movement data.

IPC Classes  ?

• H04N 5/228 - Circuit details for pick-up tubes

Abstract

An evaluating method of image information acquires image information, performs camera shake evaluation of the image information by determining a camera shake direction on the basis of the image information, and performs out-of-focus evaluation of the image information by using information concerning a camera shake direction determined in the camera shake evaluation.

IPC Classes  ?

• G06K 9/40 - Noise filtering
• G03B 17/00 - Details of cameras or camera bodiesAccessories therefor

Abstract

An imaging apparatus includes an imaging part that images a subject to generate image data, an image storage part that temporarily stores original image data that was imaged by the imaging part, an image data size reducing part that forms image data for display by reducing the size of image data stored in the image storage part, and an image display part that displays image data for display that was formed by the image data size reducing part; the imaging apparatus further comprising a camera shake state detection part that detects a camera shake occurrence state of the imaging part, a camera shake decision part that decides whether or not camera shake occurred for image data for display that was reduced by the image data size reducing part based on a camera shake state that was detected by the camera shake state detection part, and a camera shake correction part that, when a result decided by the camera shake decision part is that a camera shake occurrence state exists, subjects the image data for display to camera shake correction and displays corrected image data for display on the image display part.

IPC Classes  ?

• G03B 17/00 - Details of cameras or camera bodiesAccessories therefor

Abstract

A semiconductor device includes: a semiconductor substrate having an active surface and a back surface; an integrated circuit formed on the active surface; a feedthrough electrode penetrating the semiconductor substrate, and projecting from the active surface and the back surface; a first resin layer formed on the active surface, having a thickness greater than a height of a portion of the feedthrough electrode that projects from the active surface, and having an opening portion for exposing at least a portion of the feedthrough electrode; a wiring layer which is formed on the first resin layer, and which is connected to the feedthrough electrode through the opening portion; and an external connecting terminal connected to the wiring layer.

IPC Classes  ?

• H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
• H01L 23/52 - Arrangements for conducting electric current within the device in operation from one component to another
• H01L 29/40 - Electrodes

Abstract

A digital imaging device is operated to capture a first image in a digital format. At least two non-contiguous portions of the first image are rendered in a display of the digital imaging device. The at least two non-contiguous portions of the first image are used to align a live version of a second image in the display, wherein the second image is an extension of the first image. The second image is captured in a digital format. A corner matching algorithm is applied to determine an offset of the second image with respect to the first image, wherein the offset is required to achieve a substantially accurate alignment of the first and second images. Application of the corner matching algorithm is limited to an overlap region intervening between the at least two non-contiguous portions of the first image.

IPC Classes  ?

• H04N 5/225 - Television cameras

Abstract

A solid-state imaging device including a plurality of unit pixels, each of which includes: a storage well for storing electric charge generated by a photoelectric transducer using incident light; a transferring unit, which is formed on a top surface of a substrate, for transferring the electric charge to a floating diffusion region; and an amplifier for outputting a pixel signal that is amplified based on the electric charge transferred to the floating diffusion region, wherein: the transferring unit is a transfer control element having: a transfer gate that is provided on the substrate surface through an insulation film so that part of the transfer gate overlaps the storage well when the substrate is viewed from a direction orthogonal to the substrate surface; and an electric charge-retaining region for retaining the electric charge that is provided within the substrate and under the transfer gate; and further a diffusion layer that serves as a transfer path between the floating diffusion region and the electric charge-retaining region is provided under another diffusion layer of the substrate.

IPC Classes  ?

• H01L 27/148 - Charge coupled imagers
• H01L 29/768 - Charge-coupled devices with field effect produced by an insulated gate
• H01L 31/062 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the metal-insulator-semiconductor type
• H01L 31/113 - Devices sensitive to infrared, visible or ultraviolet radiation characterised by field-effect operation, e.g. junction field-effect photo- transistor being of the conductor-insulator- semiconductor type, e.g. metal- insulator-semiconductor field-effect transistor

Abstract

The technique of the invention accurately detects a pixel defect in an image taken by an imaging device, such as a digital still camera. The image processing flow of the invention maps luminance data to respective pixels of a specified pixel array and computes a difference between the luminance data of each target pixel and an average value of the luminance data of four adjoining pixels on the top, bottom, left, and right of the target pixel. The presence or the absence of any pixel defect is detected according to the computed difference. The luminance data of an identified defective pixel detected as the pixel defect is corrected with the luminance data of adjoining pixels on the top, bottom, left, and right of the identified defective pixel.

IPC Classes  ?

• H04N 9/64 - Circuits for processing colour signals

Abstract

An image quality display apparatus includes an input means for inputting images, an operating means for accepting a request for display of a graph showing a frequency distribution of shading levels of an image inputted by the input means, a display means for displaying the graph in response to the display request, and a tallying means for preparing data for displaying the graph before accepting the display request.

IPC Classes  ?

• G06K 9/00 - Methods or arrangements for reading or recognising printed or written characters or for recognising patterns, e.g. fingerprints

Abstract

A digital camera having a color image sensor, an optical system, a rotatable first switch, and a second switch that switches between various modes. The second switch indicates an intermediate point corresponding to the photograph mode, a first point corresponding to the first setting mode, or a second point corresponding to the second setting mode. A first setting unit sets a first processing condition relating to a white balance of an image according to a rotation angle of the first switch in the first setting mode. A second setting unit sets a second processing condition relating to a data size of an image according to a rotation angle of the first switch in the second setting mode. Furthermore, a processing unit processes an output signal of the color image sensor according to a first processing condition and a second processing condition in the photograph mode.

IPC Classes  ?

• H04N 5/222 - Studio circuitryStudio devicesStudio equipment
• H04N 5/225 - Television cameras

Abstract

An image search method for searching image data includes the steps of searching identifying information for identifying the image data by using search information, informing the image data including the identifying information in correspondence with the search information, and causing a user to select image data to be executed a predetermined processing from the informed image data.

IPC Classes  ?

• H04N 5/222 - Studio circuitryStudio devicesStudio equipment

Abstract

An image processing method is provided for performing false color reduction processing on a color-difference signal acquired after performing color interpolation processing on image data taken in by a color image pickup sensor, wherein the false color reduction processing uses a one-dimensional filter for selecting N (N≧4) pixels which are continuous in a row direction including a target pixel and determines a pixel value of the target pixel from the pixel values that remain when maximum and minimum pixel values are excluded from the pixel values of the pixels selected by the one-dimensional filter. This enables effective reduction or elimination of a false color generated at an edge part by the color interpolation processing.

IPC Classes  ?

• G06K 9/00 - Methods or arrangements for reading or recognising printed or written characters or for recognising patterns, e.g. fingerprints

Abstract

A digital camera includes: an imaging unit that images a subject; a storage that stores preset-image data indicative of a preset image having an insertion area for a user image, and imaging control data for controlling an imaging of a user image which is to be inserted into the insertion area, with associating the preset-image data with the imaging control data; a controller that controls the imaging unit based on the imaging control data; and an outputting unit that outputs user image data indicative of the user image output from the imaging unit, with associating the user image data with the preset-image data.

IPC Classes  ?

• H04N 5/262 - Studio circuits, e.g. for mixing, switching-over, change of character of image, other special effects

Abstract

A digital camera includes: an imaging unit that photoelectrically converts light to output a color image; a selecting unit that selects any one identifier from identifiers which are colored in different colors from each other; and a black/white image producing unit that produces a black/white image by weighting gradation values of respective colors for each of pixels of the output color image and adding the weighted gradation values to each other. When the light entered to the imaging unit is entered to a color filter having a color equal to a color of the selected identifier, a correlation between a light amount of light having a wavelength which penetrates the color filer and a light amount of the entered light becomes stronger than a correlation between a light amount of light having a wavelength which is absorbed by the color filter and the light amount of the entered light.

IPC Classes  ?

• H04N 3/14 - Scanning details of television systemsCombination thereof with generation of supply voltages by means not exclusively optical-mechanical by means of electrically scanned solid-state devices
• H04N 5/225 - Television cameras
• H04N 5/222 - Studio circuitryStudio devicesStudio equipment

Abstract

Default image data and subject image data are stored separately in nonvolatile memory and when the subject image data stored in the nonvolatile memory is displayed in a standard playback mode, the subject image data is displayed on an LCD at a specific scaling factor (first scaling factor) determined by the image size of the subject image data regardless of whether or not default image data is set for the subject image data. On the other hand, when composite image data is displayed in a print preview mode, scaling processing to display the subject image data on the LCD at a smaller scaling factor than the first scaling factor is performed so that the whole of the composite image data can be displayed on one screen of the display.

IPC Classes  ?

• H04N 5/228 - Circuit details for pick-up tubes
• H04N 5/232 - Devices for controlling television cameras, e.g. remote control
• H04N 9/07 - Picture signal generators with one pick-up device only
• H04N 1/21 - Intermediate information storage
• H04N 1/04 - Scanning arrangements
• H04N 20/75 -
• G03B 17/18 - Signals indicating condition of a camera member or suitability of light
• G06F 3/048 - Interaction techniques based on graphical user interfaces [GUI]

Abstract

An image processing device is provided. The image processing device includes a first shift register connected to a line for reading out an image signal that selects a line where a signal in response to carriers accumulated in an accumulation state for generating carriers in the photo diode in response to received light is read out, regarding each line of the matrix by scanning a plurality of lines in a direction that is perpendicular to each line of a matrix and is designated, a second shift register connected to a line for clearing an image signal where the residual carriers in the solid-state image-pickup element are discharged from the solid-state image-pickup element, and an output circuit that outputs a reset signal to the first shift register when a direction of scanning lines of the matrix is changed.

IPC Classes  ?

• H04N 3/14 - Scanning details of television systemsCombination thereof with generation of supply voltages by means not exclusively optical-mechanical by means of electrically scanned solid-state devices
• H04N 5/335 - Transforming light or analogous information into electric information using solid-state image sensors [SSIS]
• H01L 27/00 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate

Abstract

A chromatic aberration correction apparatus is provided that comprises an image storing means for storing a line image of one line of an image before correction, a correction value calculation means for correcting a chromatic aberration according to the distance from the center of the line image based on the values of the respective pixels of the line image stored in the image storing means and calculating the values of the respective pixels after correction, and an output means for outputting the line image corrected by the values of the respective pixels after correction.

IPC Classes  ?

• G06K 9/36 - Image preprocessing, i.e. processing the image information without deciding about the identity of the image

Abstract

An image processing device and method are provided. In a method of reading an image signal from a solid-state image-pickup element where a plurality of unit pixels including a transistor for detecting a light signal and a photo diode are arranged in a matrix, shift data applied to a line for reading out an image signal, which outputs a signal for selecting a line for reading out an image signal, is output to a shift register connected to a line for reading out an image signal, when the number of lines between line for reading out an image signal and line for clearing an image signal are equal to or less than the number of lines in the matrix and the condition for picking an image up is changed.

IPC Classes  ?

• H04N 3/14 - Scanning details of television systemsCombination thereof with generation of supply voltages by means not exclusively optical-mechanical by means of electrically scanned solid-state devices
• H04N 5/335 - Transforming light or analogous information into electric information using solid-state image sensors [SSIS]
• H01L 27/00 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate