Abstract

When a pump housing for an electromagnetic pump for the propulsion of a conductive liquid in a cooling circuit, in particular for the cooling of electrical components, said pump housing comprising an upper part and a lower part which assembled constitute a pump chamber having an internal surface, said lower part being provided with openings for pipes for the cooling circuit, said openings pointing inwards to the pump chamber, said pump housing being additionally provided with two openings for electrodes, said electrodes pointing inwards to the pump chamber and being arranged on opposed sides of the pump housing and being equipped with electrodes (8), is improved to the extent that the internal surface (5) of the pump chamber (4) is provided with a coating (10) having electrically insulating properties, it is ensured that the electrical scattering losses are reduced significantly. When, additionally, electrodes having a low transition resistance and being capable of ensuring a good contact face to the conductive cooling liquid are provided, electrical losses in electrodes and in the body of the pump housing may advantageously be reduced.

IPC Classes  ?

• H02K 44/04 - Conduction pumps
• F04B 53/08 - CoolingHeatingPreventing freezing
• F04B 19/20 - Other positive-displacement pumps
• F04B 19/00 - Machines or pumps having pertinent characteristics not provided for in, or of interest apart from, groups
• H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
• F04B 35/04 - Piston pumps specially adapted for elastic fluids and characterised by the driving means to their working members, or by combination with, or adaptation to, specific driving engines or motors, not otherwise provided for the means being electric
• F04B 53/16 - CasingsCylindersCylinder liners or headsFluid connections
• H02K 44/08 - Magnetohydrodynamic [MHD] generators
• C25B 11/00 - ElectrodesManufacture thereof not otherwise provided for

Abstract

When, according to the invention, the pump housing (1) for an electromagnetic pump (2) for a cooling circuit is arranged such that the base part (6) of the pump housing is equipped with pipe openings (8, 9), which lead from the lower side (14) of the base part perpendicularly into the channels (10) of the pump housing, it is ensured that the cooling circuit may be established with a single length of pipe (3), whose pipe ends (16) are introduced into the pipe openings (8, 9) and are soldered. It is ensured at the same time that the circuit may be established with just two solderings. This results in a significant reduction of the costs of manufacturing a cooling circuit.

IPC Classes  ?

• F04B 35/04 - Piston pumps specially adapted for elastic fluids and characterised by the driving means to their working members, or by combination with, or adaptation to, specific driving engines or motors, not otherwise provided for the means being electric
• G06F 1/20 - Cooling means
• F04B 19/20 - Other positive-displacement pumps
• H02K 44/02 - Electrodynamic pumps
• H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
• F04B 19/00 - Machines or pumps having pertinent characteristics not provided for in, or of interest apart from, groups

Abstract

An electromagnetic pump, wherein a conductive liquid in a pipe (1, 11) is supplied with an AC current or a DC current transversely to the pipe, as well as respectively has a DC or an AC magnetic field applied thereto perpendicularly to the direction of flow, uses a mixture of alkali metals, preferably the alkali metals Na and K, as the conductive liquid. The electromagnetic pump is composed of a profile (1) having one or more channels (2), said profile (1) having integrated therein a cooling head (10) and an electromagnetic pump having a pump housing (15) which has the same cross-section as the profile (1), said pump housing (15) being made of a non- conductive material, while the cooling head has a cooling plate which is intended to contact an IC circuit or a microprocessor with a view to cooling. The invention ensures an efficient pumping of the alkali metals, which provides a good supply of cooling to the cooling plate.

IPC Classes  ?

• H02K 44/04 - Conduction pumps
• G06F 1/20 - Cooling means
• H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids

Abstract

An electromagnetic pump according to the invention is composed of a plurality of parallel pipes (9A, 9B, 9C, 9D, 9E, 9F, 9G, 9H, 9I, 9J), which are connected at each side of a housing (11), which is made of an insulating, electrically conducting material, so that the liquid from the pipes (9A, 9B, 9C, 9D, 9E) flows into the housing and is subsequently returned in the pipes (9F, 9G, 9H, 9I, 9J) out of the housing. Two electrodes (3, 3A) are connected at opposed sides of the housing transversely to the pipes, said electrodes passing current through the liquid. A magnetic field is applied perpendicularly relative to the electrodes. Barriers (12A, 12B, 12C, 12D, 12E, 12F, 12G, 12H) of an insulating mate- rial or constrictions, such as notches, (13A, 13B, 13C, 13D, 13E, 13F, 13G, 13H) are optionally provided in the housing (11) between the pipes where these enter and leave the housing (11), so that there is a certain distance between the barriers at each side of the housing. The invention thus provides an electromagnetic pump which is suitable for the cooling of microprocessors, IC circuits and the like, as it has an effective, fast flow of liquid without any formation of vortices with the supply of a relatively low electric current.

IPC Classes  ?

• H02K 44/04 - Conduction pumps