A heat transfer arrangement for use with an immersion cooling system. A support is configured to contact a heat transfer device such as a vapor chamber or spreader plate to stiffen the heat transfer device and urge the heat transfer device into contact with a heat generating device. The support includes an arm that has a first portion that extends toward a central area of the heat transfer device over and out of contact with the heat transfer device and a second portion that contacts the heat transfer device within the central area. The arm can avoid contact with the heat transfer device, including surfaces having a boiling enhancement coating configured to transfer heat to a cooling liquid.
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
F28F 13/18 - Arrangements for modifying heat transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflectingArrangements for modifying heat transfer, e.g. increasing, decreasing by surface treatment, e.g. polishing
A liquid cooled heat exchanger includes first and second heat exchange chambers that are in thermal communication. The first heat exchange chamber is downstream of the second heat exchanges chamber and receives heat from a heat generating device, such as an electronic circuit. Heat in the first heat exchange chamber can be transferred to the second heat exchange chamber to increase the temperature of a subcooled liquid working fluid in the second heat exchange chamber. This can render a pressure drop across the heat exchanger that is relatively insensitive to a fraction of liquid that is vaporized in the first heat exchange chamber.
A liquid cooled heat exchanger includes first and second heat exchange chambers that are in thermal communication. The first heat exchange chamber is downstream of the second heat exchanges chamber and receives heat from a heat generating device, such as an electronic circuit. Heat in the first heat exchange chamber can be transferred to the second heat exchange chamber to increase the temperature of a subcooled liquid working fluid in the second heat exchange chamber. This can render a pressure drop across the heat exchanger that is relatively insensitive to a fraction of liquid that is vaporized in the first heat exchange chamber.
A thermosiphon device includes an evaporator section, a condenser section and a liquid path configured to deliver liquid that exits the evaporator section directly back to the evaporator inlet. The condenser section has a significantly reduced mass flow rate and lower pressure drop as compared to the evaporator section, which has an increase liquid fraction of working fluid.
F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes
A thermosiphon device includes an evaporator section, a condenser section and a liquid path configured to deliver liquid that exits the evaporator section directly back to the evaporator inlet. The condenser section has a significantly reduced mass flow rate and lower pressure drop as compared to the evaporator section, which has an increase liquid fraction of working fluid.
F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes
F28D 21/00 - Heat-exchange apparatus not covered by any of the groups
A heat sink for use in an immersion cooling system that includes a sintered powder structure enclosed in a porous enclosure. The porous enclosure has openings, e.g., formed by a mesh, with a size to help contain sintered powder particles that may be dislodged during operation of the heat sink.
H01L 23/373 - Cooling facilitated by selection of materials for the device
H01L 23/44 - Arrangements for cooling, heating, ventilating or temperature compensation the complete device being wholly immersed in a fluid other than air
H01L 23/427 - Cooling by change of state, e.g. use of heat pipes
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
A heat sink for use in an immersion cooling system that includes a sintered powder structure enclosed in a porous enclosure. The porous enclosure has openings, e.g., formed by a mesh, with a size to help contain sintered powder particles that may be dislodged during operation of the heat sink.
H01L 23/373 - Cooling facilitated by selection of materials for the device
F28D 1/02 - Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with the heat-exchange conduits immersed in the body of fluid
F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes
F28F 3/06 - Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
H01L 23/44 - Arrangements for cooling, heating, ventilating or temperature compensation the complete device being wholly immersed in a fluid other than air
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
F28D 21/00 - Heat-exchange apparatus not covered by any of the groups
H01L 23/427 - Cooling by change of state, e.g. use of heat pipes
8.
METHOD AND APPARATUS FOR FORMING LIQUID FILLED HEAT TRANSFER DEVICE
A heat transfer device includes three plates sandwiched together to form a vapor chamber or similar device. The three plates may be sealingly joined at a closed periphery to define a closed volume that contains a working fluid. One or more of the three plates may include structure to support capillary or other working fluid flow in the closed volume, e.g., a center plate may include openings and/or other structure to permit working fluid flow through and/or along the plate. An outer one of the plates may include an opening through which working fluid may be introduced into the closed volume. After filling with working fluid, the plates may be sealingly joined at one or more joints that extend chordwise across the closed periphery, e.g., so a portion of the plate that defines the opening can be removed from the device.
F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes
H01L 23/427 - Cooling by change of state, e.g. use of heat pipes
9.
Method and apparatus for forming liquid filled heat transfer device
A heat transfer device includes three plates sandwiched together to form a vapor chamber or similar device. The three plates may be sealingly joined at a closed periphery to define a closed volume that contains a working fluid. One or more of the three plates may include structure to support capillary or other working fluid flow in the closed volume, e.g., a center plate may include openings and/or other structure to permit working fluid flow through and/or along the plate. An outer one of the plates may include an opening through which working fluid may be introduced into the closed volume. After filling with working fluid, the plates may be sealingly joined at one or more joints that extend chordwise across the closed periphery, e.g., so a portion of the plate that defines the opening can be removed from the device.
F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes
F28D 15/04 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes with tubes having a capillary structure
F28F 3/02 - Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
F28F 3/08 - Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
A heat transfer device such as a heat sink includes one or more fins for dissipating heat received from a heat source, such as an integrated circuit or other electronic component. A thermosiphon component including a tube that defines a closed, continuous loop and contains a working fluid is attached to a face of a corresponding fin and is arranged to operate as a two-phase thermosiphon to transfer heat across areas of the fin. The heat transfer may equalize temperatures across the fin, enhancing efficiency.
F28F 13/06 - Arrangements for modifying heat transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes
42 - Scientific, technological and industrial services, research and design
Goods & Services
Providing temporary use of non-downloadable cloud-based software for the thermal aspects of product design, for use in running simulations of product thermal performance and thermal management, and for providing recommendations for thermal solutions for such products
12.
Thermosiphon with multiport tube and flow arrangement
A thermosiphon device includes one or more flat multiport tube structures having at least one section that defines a plurality of flow channels and at least one web that extends from the section in a plane of the flat multiport tube structures. The flow channels may function as condensing channels, e.g., in a counterflow device, or as evaporation channels. A multiport tube structure may include two sections that each define a plurality of flow channels and the two sections may be joined by a web that extends between the sections in the plane of the multiport tube structure. The sections may function as condensing channels, as evaporation channels, or one section may function as a set of evaporation channel and the other section may function as a set of condensing channels. Multiport tube sections may alternately function as a vapor supply path or liquid return path.
F28D 15/04 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes with tubes having a capillary structure
F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes
F28D 1/053 - Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with the heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight
F28F 1/12 - Tubular elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
A thermosiphon device includes an evaporator section that is formed as a single integrated part including one or more evaporation channels and a liquid return path, and/or includes a condenser section that is formed as a single integrated part including one or more condensing channels and a vapor supply path. A single manifold may include vapor and liquid chambers that are separate from each other and that fluidly connect evaporation channels with the vapor supply path and fluidly connect condensing channels with the liquid return path, respectively. Portions of the evaporator or condenser section that define the liquid return path or vapor supply path, respectively, may be free of any fins or other thermal transfer structure.
F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes
H01L 23/427 - Cooling by change of state, e.g. use of heat pipes
H01L 23/367 - Cooling facilitated by shape of device
37 - Construction and mining; installation and repair services
42 - Scientific, technological and industrial services, research and design
Goods & Services
Cold plates; cooling loops for cooling apparatus; heat sinks for cooling or heating apparatus; heat exchangers; manifolds and cooling distribution units for heat removal. Installation of heat removal and cooling systems. Design of heat removal and cooling systems; development of heat removal and cooling systems.
37 - Construction and mining; installation and repair services
42 - Scientific, technological and industrial services, research and design
Goods & Services
Cold plates; cooling loops for cooling apparatus; heat sinks for cooling or heating apparatus; heat exchangers; manifolds and cooling distribution units for heat removal. Installation of heat removal and cooling systems. Design of heat removal and cooling systems; development of heat removal and cooling systems.
A fluid mover includes a chamber with one or more outlet openings, first and/or second fluidic diaphragm(s) having a fluid-moving portion movable in the chamber to cause fluid to move at the outlet opening, and a coil assembly magnetically coupled to the fluidic diaphragm to move the movable portion of the fluidic diaphragm(s) in response to a current in the coil. A spring portion of the fluidic diaphragm(s) may be separate from the fluid-moving portion and be arranged to exert a spring bias on the fluid-moving portion. The spring portion may include two or more spring elements that each includes a chord portion and a radial portion. The chord portion may be attached to the chamber housing at opposite ends, and the radial portion may extend radially inward from the chord portion from an intermediate point between the opposite ends to a center of the diaphragm.
A thermosiphon device includes one or more flat multiport tube structures having at least one section that defines a plurality of flow channels and at least one web that extends from the section in a plane of the flat multiport tube structures. The flow channels may function as condensing channels, e.g., in a counterflow device, or as evaporation channels. A multiport tube structure may include two sections that each define a plurality of flow channels and the two sections may be joined by a web that extends between the sections in the plane of the multiport tube structure. The sections may function as condensing channels, as evaporation channels, or one section may function as a set of evaporation channel and the other section may function as a set of condensing channels. Multiport tube sections may alternately function as a vapor supply path or liquid return path.
F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes
F28D 1/053 - Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with the heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight
A thermosiphon device (1) including one or more multi-port tubes (5) that form both an evaporator section (11) and a condenser section (10) for the device. The one or more tubes may be flat tubes with multiple, parallel flow channels, and may be bent to form a bend (13) between the evaporator and condenser sections of the tube(s). One or more flow channels (22) of the tube at the bend may provide a vapor flow path or a liquid flow path between the evaporator and condenser sections.
F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes
A thermosiphon device including one or more multi-port tubes that form both an evaporator section and a condenser section for the device. The one or more tubes may be flat tubes with multiple, parallel flow channels, and may be bent to form a bend between the evaporator and condenser sections of the tube(s). One or more flow channels of the tube at the bend may provide a vapor flow path or a liquid flow path between the evaporator and condenser sections.
F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes
21.
EVAPORATOR AND CONDENSER SECTION STRUCTURE FOR THERMOSIPHON
A thermosiphon device (10) includes a closed loop evaporator section (2) having one or more evaporation channels (22) that are fed by a liquid return path (21), and a condenser section (1) with one or more condensing channels (12). The condenser section may include a vapor supply path (11) that is adjacent one or more condensing channels, e.g., located between two sets of condensing channels. Evaporator and/or condenser sections may be made from a single, flat bent tube, which may be bent about an axis parallel to the plane of the flat tube to form a turnaround and/or twisted about an axis along a length of the tube at the tube ends. A single tube (25) may form both evaporator and condenser sections of a thermosiphon device, and an axially extending wall (23) inside the tube in the evaporator section may separate an evaporator section from a liquid return section.
F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes
A thermosiphon device includes an evaporator section that is formed as a single integrated part including one or more evaporation channels and a liquid return path, and/or includes a condenser section that is formed as a single integrated part including one or more condensing channels and a vapor supply path. A single manifold may include vapor and liquid chambers that are separate from each other and that fluidly connect evaporation channels with the vapor supply path and fluidly connect condensing channels with the liquid return path, respectively. Portions of the evaporator or condenser section that define the liquid return path or vapor supply path, respectively, may be free of any fins or other thermal transfer structure.
F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes
H01L 23/427 - Cooling by change of state, e.g. use of heat pipes
23.
PLANAR COIL AND SUPPORT FOR ACTUATOR OF FLUID MOVER
A fluid mover includes a chamber with one or more outlet openings, first and/or second fluidic diaphragm(s) having a portion movable in the chamber to cause fluid to move at the outlet opening, and a coil assembly magnetically coupled to the fluidic diaphragm to move the movable portion of the fluidic diaphragm(s) in response to a current in the coil. The coil assembly includes a coil with an opening, and a plug may be positioned in the opening and/or a support may be positioned around a periphery of the coil. The plug and/or the support may have a magnetic permeability greater than one and be arranged so magnetic field lines created by the coil pass through the plug and/or support. The coil, plug and/or support may define a flat surface, e.g., such that a uniform gap is present between the diaphragm(s) and the coil, plug and/or support.
A fluid mover includes a chamber with one or more outlet openings, first and/or second fluidic diaphragm(s) having a portion movable in the chamber to cause fluid to move at the outlet opening, and a coil assembly magnetically coupled to the fluidic diaphragm to move the movable portion of the fluidic diaphragm(s) in response to a current in the coil. The coil assembly includes a coil with an opening, and a plug may be positioned in the opening and/or a support may be positioned around a periphery of the coil. The plug and/or the support may have a magnetic permeability greater than one and be arranged so magnetic field lines created by the coil pass through the plug and/or support. The coil, plug and/or support may define a flat surface, e.g., such that a uniform gap is present between the diaphragm(s) and the coil, plug and/or support.
H02K 33/16 - Motors with reciprocating, oscillating or vibrating magnet, armature or coil system with polarised armatures moving in alternate directions by reversal or energisation of a single coil system
F04B 45/04 - Pumps or pumping installations having flexible working members and specially adapted for elastic fluids having plate-like flexible members, e.g. diaphragms
An assembly for engaging a heat sink with an electrical component heat source includes a first retaining device with a frame that defines an opening to receive at least a portion of the heat sink and/or the heat source. The frame may be assembled with a heat sink and a retainer element arranged to resiliently bias the heat sink into contact with the heat source, and thereafter the heat sink assembly may be engaged with a heat source. A contact plate of the heat sink may be positioned into the opening of the frame from a top of the frame, i.e., inserted in a top-down direction, and the frame may be arranged for engagement with a tool to mount the fully assembled heat sink, frame and retainer element combination to the heat source.
A diaphragm (2) for a fluid mover, such as a synthetic jet device, includes separate concentric substrate sections (2a, 2b). The substrate sections (2a, 2b) may be joined together by a resilient material at a junction (16) between the sections (2a, 2b), and the sections (2a, 2b) may include intermeshed cantilever tabs (18). The substrate sections (2a, 2b) may be joined to resist pressure-induced ballooning or similar deformation, yet allow for relatively large axial deformation. A fluid mover comprising such a diaphragm (2) is also disclosed.
F04B 43/00 - Machines, pumps, or pumping installations having flexible working members
F04B 45/04 - Pumps or pumping installations having flexible working members and specially adapted for elastic fluids having plate-like flexible members, e.g. diaphragms
F04B 43/02 - Machines, pumps, or pumping installations having flexible working members having plate-like flexible members, e.g. diaphragms
Method and assembly for attaching a heat sink to a heat source surface associated with a printed circuit board or other component having a heat source. A fastener assembly may include a push pin with a barbed, bifurcated end arranged to be inserted through an opening of the printed circuit board and thereby secure the heat sink to the printed circuit board. A stopper may be headless, be separable from the push pin, and have a portion, such as a barrel-shaped element, positionable in a throughbore of the push pin that supports the bifurcated end so that movement of the barbed portions toward each other is resisted, thereby securing engagement of the barbed portions with the printed circuit board.
F16D 1/00 - Couplings for rigidly connecting two coaxial shafts or other movable machine elements
F28F 9/26 - Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators
H01L 23/40 - Mountings or securing means for detachable cooling or heating arrangements
B23P 15/26 - Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers
F16B 21/12 - Means without screw-thread for preventing relative axial movement of a pin, spigot, shaft, or the like and a member surrounding itStud-and-socket releasable fastenings without screw-thread by separate parts with locking-pins or split-pins thrust into holes
F28F 3/02 - Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
F16B 21/06 - Releasable fastening devices with snap action
F16B 21/08 - Releasable fastening devices with snap action in which the stud, pin, or spigot has a resilient part
28.
SYSTEM AND METHOD FOR COOLING HEAT GENERATING COMPONENTS
An assembly for cooling heat generating components, such as power electronics, computer processors and other devices. Multiple components may be mounted to a support and cooled by a flow of cooling fluid. A single cooling fluid inlet and outlet may be provided for the support, yet multiple components, including components that have different heat removal requirements may be suitably cooled. One or more manifold elements may provide cooling fluid flow paths that contact a heat transfer surface of a corresponding component to receive heat.
An assembly for cooling heat generating components, such as power electronics, computer processors and other devices. Multiple components may be mounted to a support and cooled by a flow of cooling fluid. A single cooling fluid inlet and outlet may be provided for the support, yet multiple components, including components that have different heat removal requirements may be suitably cooled. One or more manifold elements may provide cooling fluid flow paths that contact a heat transfer surface of a corresponding component to receive heat.
A system and method for deploying a heat harvesting system and for harvesting heat from a geothermal well using one or more heat pipes. A heat exchanger may receive heat from one or more heat pipes for transfer to a heat receiving component. The heat pipes may be thermally coupled to the heat exchanger via a thermal gap material having a relatively low thermal conductivity. A mounting component may engage heat pipes and define a thermal gap between the heat pipes and heat exchanger. A heat spreader, having a relatively high thermal conductivity, may be used to transfer heat from the heat pipes to the thermal gap material and help define a working temperature for the heat pipes. A heat pipe deployment system may include anti-buckling supports and/or a guide to help keep the heat pipes from buckling and to guide the heat pipes into corresponding well bores during deployment.
A thermal transfer device comprising a thermal transfer surface and a passageway for conducting a thermal transfer fluid from an inlet to an outlet while passing in thermal contact with the thermal transfer surface. The passageway has at least two spiral passages and a connection channel connecting the at least two spiral passages to permit flow of the heat transfer fluid from a first spiral passage to a second spiral passage; thereby forming a path for the flow of the thermal fluid from the inlet, through the passageway, along the first spiral passage to the connection channel, then along the connection channel to the second spiral passage, and then to the outlet.
F28F 1/00 - Tubular elementsAssemblies of tubular elements
F28D 7/02 - Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits being helically coiled
F28D 9/00 - Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
F28F 3/06 - Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
F28F 13/12 - Arrangements for modifying heat transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by creating turbulence, e.g. by stirring, by increasing the force of circulation
F28F 1/40 - Tubular elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only inside the tubular element
F28F 3/08 - Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
F28F 1/36 - Tubular elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending obliquely the means being helically-wound fins or wire spirals
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
F28D 21/00 - Heat-exchange apparatus not covered by any of the groups
An assembly for engaging a heat sink with an electrical component heat source includes a first retaining device with a frame that defines an opening to receive at least a portion of the heat sink and/or the heat source. The frame may form an interrupted loop around the opening with first and second free ends that are movable to adjust a size of the opening. Movement of the free ends may be performed by hand, and without the use of tools, allowing for tool free engagement/disengagement with the heat source. The free ends or other portion of the first retaining device may be engaged by a second retaining device to keep the first retaining device engaged with the heat source and/or heat sink. The second retaining device may also, or alternately, engage with the first retaining device to resiliently bias the heat sink into contact with the heat source.
Method and assembly for attaching a heat sink to a heat source surface associated with a printed circuit board or other component having a heat source. A fastener assembly may include a push pin with a barbed, bifurcated end arranged to be inserted through an opening of the printed circuit board and thereby secure the heat sink to the printed circuit board. A stopper may be headless, be separable from the push pin, and have a portion, such as a barrel-shaped element, positionable in a throughbore of the push pin that supports the bifurcated end so that movement of the barbed portions toward each other is resisted, thereby securing engagement of the barbed portions with the printed circuit board.
A thermal transfer device including a thermally conductive support structure to be secured to a substrate having at least two types of heat sources. The support structure has a plurality of apertures, one for each first heat source. Each aperture accommodates an individual heat sink configured to make thermal contact with a first heat source. Each heat sink fits in its aperture, and is attached to the support structure by at least one spring mount for holding the heat sink in place. Preferably, the spring mount includes a plurality of springs disposed about the heat sink to provide a balanced downward force on the heat sink. The support structure has a bottom surface receiving a thermal transfer medium to provide thermal contact between the second heat sources and the support structure, thereby allowing for dissipation of the heat generated by the second heat sources through the support structure.
A thermal transfer device having a reduced vertical profile. The device includes a condenser with substantially vertical internal cooling fins. An inlet conducts a thermal transfer fluid in a vapor state to the tops of the cooling fins where the vapor condenses and flows down the fins to the bottom of the condenser. The bottom of the condenser is angled towards an outlet for conducting the liquid thermal transfer fluid to a reservoir for holding the fluid. The inlet and the outlet are both positioned at a height above the level of the thermal transfer fluid in liquid state in the reservoir. The device may also include fins on the exterior of the condenser for providing cooling surfaces which do not contact the thermal transfer fluid in either the liquid or vapor states.
A thermal transfer device comprising a thermal transfer surface and a passageway for conducting a thermal transfer fluid from an inlet to an outlet while passing in thermal contact with the thermal transfer surface. The passageway has at least two spiral passages and a connection channel connecting the at least two spiral passages to permit flow of the heat transfer fluid from a first spiral passage to a second spiral passage; thereby forming a path for the flow of the thermal fluid from the inlet, through the passageway, along the first spiral passage to the connection channel, then along the connection channel to the second spiral passage, and then to the outlet.
F28D 9/04 - Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits being formed by spirally-wound plates or laminae
An assembly for a heat sink having a contact plate with opposing first and second faces, a plurality of fins extending from the first face of the contact plate, and a plurality of gaps between the fins. A retaining device has a first pair of opposing sides and a second pair of opposing sides, the first and second pairs of opposing sides surrounding an opening, the first pair of opposing sides having primary framing members, at least some of the primary framing members having a first end at a respective side and a distal free end, with at least one engagement member positioned proximate the distal free ends. The primary framing members define a receiving space for the heat sink. A metal spring is configured in a closed shape cross-section for engagement with the retaining device. The metal spring has a pair of elongated sides, a pair of truncated sides and heat sink engagement regions. The heat sink engagement regions are positioned against the contact plate when the metal spring is engaged with the retaining device, to urge the contact plate towards the engagement members. The assembly is particularly well suited for use with ball grid array packages to interface electronic components in such packages with the heat sink.
A fluid-cooled heat sink (1) for electronic components having a heat exchanger (2) which can be associated with at least one electronic component (3), the heat exchanger having at least one channel (6) with an inlet (7) and an outlet (8) for a cooling fluid. The heat exchanger (2) having a first outer surface (4) for contact with the electronic component (3) and a second outer surface (5). The heat sink (1) having a stiffening element (15) operating on the heat exchanger (2) at the second outer surface (5) for associating and pressing the heat exchanger (2) on the electronic component (3).
A heat sink assembly includes a base plate having a top surface provided with cooling fins, and a bottom surface with an open channel, the channel having remote regions and a central region with a rectangular cross-section. A heat pipe arrangement including at least two sections is nested in the channel, each section having at least one evaporator section and a condenser section, wherein the evaporator sections are juxtaposed side by side in the central region, and the condenser sections are in respective remote regions. The arrangement is preferably a single S-shaped heat pipe with a pair of hooked ends and a center section which form the evaporator sections, the evaporator sections each having a rectangular profile and an exposed surface which is flush with the bottom surface of the base plate, the condenser sections connecting the evaporator sections and being recessed below the bottom surface.
A fluid energy transfer device, including a chamber for receiving a fluid, at least a portion of the chamber comprising a movable portion relative to another portion of the chamber, the movable portion being adapted to change the volume of the chamber from a first volume to a second volume by movement of the movable portion. The device further includes an actuator attached to the movable portion, wherein the displacements of the movable portion can be larger than the displacement of the actuator.
Photovoltaic solar panels are cooled below ambient air temperature with a positive energy balance using a cooling fluid flowing through a flat chamber of substantially uniform thickness provided against the back surface of each panel. The chamber thickness and other dimensions of the flat chamber are chosen so that, for a predetermined mass flow rate through the chamber in a given temperature range, a laminar flow regime is maintained. Obstacles which provide varying flow patterns may be provided in the chamber to disturb the boundary layer and improve heat transfer to the fluid. Since laminar flow minimizes the energy required to. move the fluid, there is very little parasitic drain of the power produced by the solar panel.
F24J 2/10 - having reflectors as concentrating elements
H01L 31/052 - Cooling means directly associated or integrated with the PV cell, e.g. integrated Peltier elements for active cooling or heat sinks directly associated with the PV cells
A fluid-cooled heat sink (1) for electronic components comprises a heat exchanger (2) which can be associated with at least one electronic component (3), the heat exchanger having at least one channel (6) with an inlet (7) and an outlet (8) for a cooling fluid; the heat exchanger (2) having a first outer surface (4) for contact with the electronic component (3) and a second outer surface (5); the heat sink (1) comprising a stiffening element (15) operating on the heat exchanger (2) at the second outer surface (5) for associating and pressing the heat exchanger (2) on the electronic component (3).
