09 - Scientific and electric apparatus and instruments
Goods & Services
Thermometry; temperature sensors; Thermopile Infrared (IR) sensors combined with integrated signal processor, I2C interface and an interrupt output to interface with microcontrollers; single-pixel thermopile and a signal-processing unit incorporated into a single Transistor Outline (TO) package with integrated lens, Transistor Outline (TO) package with integrated Infrared Window or Surface Mount Device (SMD) package
2.
PASSIVE PYROELECTRIC INFRARED SENSOR WITH SENSOR ELEMENTS ON A SINGLE CRYSTAL
Described herein are techniques for reducing spike noise arising in pyroelectric infrared sensors due to charge build up. The sensors developed by the inventors and described herein rely on the use of dummy elements positioned to prevent or limit charge build-up in the unused space. A first sensing element comprises a first portion of the first layer of conductive material, a first portion of the layer of pyroelectric material, a first portion of the second layer of conductive material and a first absorption region coupled to the first portion of the first layer of conductive material. A dummy element comprises a second portion of the first layer of conductive material, a second portion of the layer of pyroelectric material and a second portion of the second layer of conductive material. The first layer of conductive material defines a first gap between the first portion of the first layer of conductive material and the second portion of the first layer of conductive material.
G01J 5/34 - Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using capacitors, e.g. pyroelectric capacitors
Described herein are techniques for reducing spike noise arising in pyroelectric infrared sensors due to charge build up. The sensors developed by the inventors and described herein rely on the use of dummy elements positioned to prevent or limit charge build-up in the unused space. A first sensing element comprises a first portion of the first layer of conductive material, a first portion of the layer of pyroelectric material, a first portion of the second layer of conductive material and a first absorption region coupled to the first portion of the first layer of conductive material. A dummy element comprises a second portion of the first layer of conductive material, a second portion of the layer of pyroelectric material and a second portion of the second layer of conductive material. The first layer of conductive material defines a first gap between the first portion of the first layer of conductive material and the second portion of the first layer of conductive material.
Some aspects of the technology described herein are directed to a thermal sensor and corresponding systems and methods for mitigating errors arising from non-radiative heat flow. The thermal sensor system, comprising: a thermal sensor comprising and a housing. The thermal sensor comprising: a thermal detection region of a sensor substrate; a thermal reference region of the sensor substrate; and an array of thermocouples configured to detect a thermal differential between the thermal detection region and the thermal reference region. The housing configured to support the thermal sensor within the housing and beneath a windowed aperture of the housing, wherein the windowed aperture is configured such that radiative energy may transmit through the windowed aperture and be received by the thermal sensor.
An illumination source includes a laser driver unit configured to emit a plasma sustaining beam. An ingress collimator receives the plasma sustaining beam and produces a collimated ingress beam. A focusing optic receives the collimated ingress beam and produce a focused sustaining beam. A sealed lamp chamber contains an ionizable media that, once ignited, forms a high intensity light emitting plasma having a waist size smaller than 150 microns. The sealed lamp chamber further includes an ingress window configured to receive the focused sustaining beam and an egress window configured to emit the high intensity light. An ignition source is configured to ignite the ionizable media, and an exit fiber is configured to receive and convey the high intensity light. The high intensity light is white light with a black body spectrum, and the exit fiber has a diameter in the range of 200-500 micrometers.
H05G 2/00 - Apparatus or processes specially adapted for producing X-rays, not involving X-ray tubes, e.g. involving generation of a plasma
H01J 61/16 - Selection of substances for gas fillingsSpecified operating pressure or temperature having helium, argon, neon, krypton, or xenon as the principle constituent
H01J 61/54 - Igniting arrangements, e.g. promoting ionisation for starting
H05H 1/22 - Arrangements for confining plasma by electric or magnetic fieldsArrangements for heating plasma for injection heating
A61B 1/06 - Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopesIlluminating arrangements therefor with illuminating arrangements
6.
CORRECTION FOR NON-RADIATION HEAT-FLOWS IN INFRARED TEMPERATURE SENSOR
Some aspects of the technology described herein are directed to a thermal sensor and corresponding systems and methods for mitigating errors arising from non-radiative heat flow. The thermal sensor system, comprising: a thermal sensor comprising and a housing. The thermal sensor comprising: a thermal detection region of a sensor substrate; a thermal reference region of the sensor substrate; and an array of thermocouples configured to detect a thermal differential between the thermal detection region and the thermal reference region. The housing configured to support the thermal sensor within the housing and beneath a windowed aperture of the housing, wherein the windowed aperture is configured such that radiative energy may transmit through the windowed aperture and be received by the thermal sensor.
G01J 5/06 - Arrangements for eliminating effects of disturbing radiationArrangements for compensating changes in sensitivity
G01J 5/12 - Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
An illumination source includes a laser driver unit configured to emit a plasma sustaining beam. An ingress collimator receives the plasma sustaining beam and produces a collimated ingress beam. A focusing optic receives the collimated ingress beam and produce a focused sustaining beam. A sealed lamp chamber contains an ionizable media that, once ignited, forms a high intensity light emitting plasma having a waist size smaller than 150 microns. The sealed lamp chamber further includes an ingress window configured to receive the focused sustaining beam and an egress window configured to emit the high intensity light. An ignition source is configured to ignite the ionizable media, and an exit fiber is configured to receive and convey the high intensity light. The high intensity light is white light with a black body spectrum, and the exit fiber has a diameter in the range of 200-500 micrometers.
H05G 2/00 - Apparatus or processes specially adapted for producing X-rays, not involving X-ray tubes, e.g. involving generation of a plasma
H05H 1/22 - Arrangements for confining plasma by electric or magnetic fieldsArrangements for heating plasma for injection heating
H01J 61/16 - Selection of substances for gas fillingsSpecified operating pressure or temperature having helium, argon, neon, krypton, or xenon as the principle constituent
H01J 61/54 - Igniting arrangements, e.g. promoting ionisation for starting
A61B 1/06 - Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopesIlluminating arrangements therefor with illuminating arrangements
An illumination source includes a laser driver unit configured to emit a plasma sustaining beam. An ingress collimator receives the plasma sustaining beam and produces a collimated ingress beam. A focusing optic receives the collimated ingress beam and produce a focused sustaining beam. A sealed lamp chamber contains an ionizable media that, once ignited, forms a high intensity light emitting plasma having a waist size smaller than 150 microns. The sealed lamp chamber further includes an ingress window configured to receive the focused sustaining beam and an egress window configured to emit the high intensity light. An ignition source is configured to ignite the ionizable media, and an exit fiber is configured to receive and convey the high intensity light. The high intensity light is white light with a black body spectrum, and the exit fiber has a diameter in the range of 200-500 micrometers.
H05G 2/00 - Apparatus or processes specially adapted for producing X-rays, not involving X-ray tubes, e.g. involving generation of a plasma
H05H 1/22 - Arrangements for confining plasma by electric or magnetic fieldsArrangements for heating plasma for injection heating
H01J 61/16 - Selection of substances for gas fillingsSpecified operating pressure or temperature having helium, argon, neon, krypton, or xenon as the principle constituent
H01J 61/54 - Igniting arrangements, e.g. promoting ionisation for starting
A61B 1/06 - Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopesIlluminating arrangements therefor with illuminating arrangements
09 - Scientific and electric apparatus and instruments
Goods & Services
Thermopile Infrared (IR) sensors combined with integrated
signal processor, I2C interface and an interrupt output
designed to interface with micro-controllers; single-pixel
thermopile and a signal-processing unit incorporated into a
single Transistor Outline (TO) package with integrated lens,
Transistor Outline (TO) package with integrated Infrared
Window or Surface Mount Device (SMD) package.
09 - Scientific and electric apparatus and instruments
Goods & Services
(1) Thermopile-based Infrared (IR) sensor combined with integrated signal processor, Inter-Integrated Circuit (I2C) interface and an interrupt output designed to interface with micro-controllers; single-pixel thermopile and a signal-processing unit incorporated into a single Transistor Outline (TO) Lens, Transistor Outline (TO) Infrared (IR) Window or Surface Mount Device (SMD) package
11.
Unreleased thermopile infrared sensor using material transfer method
An unreleased thermopile IR sensor and method of fabrication is provided which includes a new thermally isolating material and an ultra-thin material based sensor which, in combination, provide excellent sensitivity without requiring a released membrane structure. The sensor is fabricated using a wafer transfer technique in which a substrate assembly comprising the substrate and new thermally isolating material is bonded to a carrier substrate assembly comprising a carrier substrate and the ultra-thin material, followed by removal of the carrier substrate. As such, temperature restrictions of the various materials are overcome.
G01J 5/20 - Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
G01J 5/12 - Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
G01J 5/06 - Arrangements for eliminating effects of disturbing radiationArrangements for compensating changes in sensitivity
H01L 31/09 - Devices sensitive to infrared, visible or ultra- violet radiation
H01L 35/32 - SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR - Details thereof operating with Peltier or Seebeck effect only characterised by the structure or configuration of the cell or thermocouple forming the device
H01L 35/34 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
09 - Scientific and electric apparatus and instruments
Goods & Services
A thermopile-based IR sensor combined with integrated signal processor, I2C interface and an interrupt output designed to interface with micro-controllers; single-pixel thermopile and a signal-processing unit incorporated into a single Transistor Outline package with integrated lens (TO Lens), Transistor Outline package with integrated Infrared window (TO IR Window) or Surface Mount Device (SMD) package
13.
Infrared presence sensing with modeled background subtraction
A motion sensing device includes an infrared radiation (IR) sensor configured receive signal IR from a warm object and background IR to produce a direct current output. A first transformation filter receives the direct current output and produces a filtered background. A second transformation filter receives the direct current output and produces a filtered signal. A rating compares the filtered signal and the filtered background to produce a result signal based on a detected difference between the filtered signal and the filtered background.
An apparatus configured to sense presence and motion in a monitored space is presented. The apparatus includes a dual-element assembly with a first thermal sensing element and a second thermal sensing element configured to produce a direct current output that is sustained at a level substantially proportional to an amount of thermal energy being received at the thermal sensing elements. A lens array (or equivalent optics) is coupled to the elements, having a plurality of lenses directing incident thermal energy from a plurality of optically-defined spatial zones onto the sensing elements. An electronic circuitry is configured to read a resulting signal of the dual-element assembly and an individual output signal of each the first thermal sensing element and the second thermal sensing element.
G01J 5/12 - Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
G01J 5/00 - Radiation pyrometry, e.g. infrared or optical thermometry
G08B 13/193 - Actuation by interference with heat, light, or radiation of shorter wavelengthActuation by intruding sources of heat, light, or radiation of shorter wavelength using passive radiation detection systems using infrared-radiation detection systems using focusing means
15.
Motion and gesture recognition by a passive thermal sensor system
Systems and methods for recognizing motion made by a moving person are presented. The system includes a thermal sensor configured to generate a low frequency or direct current signal upon receiving thermal energy. A spatially modulating optic is disposed between the thermal sensor and the warm object. The optic is configured to modulate the thermal energy received by the thermal sensor as a function of an orientation of the moving person with respect to the thermal sensor. An electronics unit in communication with the thermal sensor includes a memory and a processor. The processor is configured by the memory to detect a change in the thermal sensor signal and recognize a characteristic of the thermal sensor signal.
Systems and methods for recognizing a gesture made by a warm object are presented. The system includes a thermal sensor configured to generate a low frequency or direct current signal upon receiving thermal energy. A spatially modulating optic is disposed between the thermal sensor and the warm object. The optic is configured to modulate the thermal energy received by the thermal sensor as a function of an orientation of the warm object with respect to the thermal sensor. An electronics unit in communication with the thermal sensor includes a memory and a processor. The processor is configured by the memory to detect a change in the thermal sensor signal and recognize a characteristic of the thermal sensor signal.
A method for manufacturing an imaging device in a semiconductor substrate is disclosed. The substrate includes a first surface, a second surface substantially opposite the first surface, and a thickness defined by a distance between the first surface and the second surface. A trench is fabricated in the semiconductor substrate first surface. A passivation layer is applied over the substrate first surface and the trench, optionally filling the trench by depositing a conformal layer over the substrate first surface. The conformal layer and the passivation layer are planarized from the substrate first surface, and a membrane is fabricated on the substrate first surface. From the substrate second surface, a cavity is formed in the substrate abutting the membrane and at least a portion of the trench via the unmasked region.
G01J 5/12 - Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
H01L 21/76 - Making of isolation regions between components
A method for manufacturing an imaging device is presented. The method starts with providing a wafer having a membrane with an opening bonded to a substrate. A photoresist layer is deposited over the membrane and wafer surface. A portion of the substrate back surface under a central part of the membrane is etched anisotropicly. A first region of the photoresist layer is removed, exposing an opening in the membrane, so that a first isotropic etching of the substrate is performed through the membrane opening. A second region of the photoresist layer is stripped, exposing a second membrane opening, providing access for a second isotropic etching of the substrate through the first and/or second membrane opening.
A method of manufacturing a pixel structure having an umbrella absorber is disclosed. The method includes providing a substrate with a membrane on a first surface of the substrate. The membrane has one or more openings that expose one or more portions of the first surface, and includes a thermopile. A sacrificial layer is deposited on the membrane and in the one or more openings. The sacrificial layer is patterned to expose a portion of the membrane associated with one or more hot junctions of the thermopile. A rigid, thermally-conductive layer is formed on the sacrificial layer and on the exposed portion of the membrane associated with the one or more hot junctions of the thermopile. An absorber is deposited on the rigid, thermally-conductive layer. A cavity is formed in the substrate from a second surface of the substrate to the membrane and the sacrificial layer is removed.
G01J 5/12 - Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
H01L 31/02 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof - Details
An apparatus configured to sense presence and motion in a monitored space includes one or more thermal sensing devices and a lens array. Each thermal sensing device is configured to produce a direct current output that is sustained at a level substantially proportional to an amount of thermal energy being received at the thermal sensing device. The lens array is coupled to the one or more thermal sensing devices and includes multiple lenses, each of which is configured to direct incident thermal energy from at least a respective one of multiple different physical zones located within the monitored space onto the one or more thermal sensing devices.
G01K 1/16 - Special arrangements for conducting heat from the object to the sensitive element
G08B 13/193 - Actuation by interference with heat, light, or radiation of shorter wavelengthActuation by intruding sources of heat, light, or radiation of shorter wavelength using passive radiation detection systems using infrared-radiation detection systems using focusing means
21.
OPTICAL SENSING ELEMENT ARRANGEMENT WITH INTEGRAL PACKAGE
A sensor assembly is disclosed that includes a hollow casing having a radiation entrance opening. A radiation-transmissive optic is at the radiation entrance opening. A substrate is inside and sealed against the hollow casing. An optical sensing element is coupled to the substrate and configured to sense radiation that has passed through the radiation-transmissive optic. A method of manufacturing the sensor assembly also is disclosed.
G01J 5/20 - Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
A circuit for detecting electromagnetic radiation includes a pyroelectric sensor element connected to convert electromagnetic radiation into an electric signal. An n-channel junction field effect transistor is connected to receive the electric signal. A printed circuit board includes at least one low inductance low resistance area to provide a ground path for all alternating current components. A first capacitor is connected between the FET source terminal and a second capacitor is connected between the FET drain terminal and ground. A gate resistor is connected in parallel with the sensor element or a resistor is included in the sensor elements.
G01J 5/34 - Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using capacitors, e.g. pyroelectric capacitors
A method is presented for forming multiple surface mount technology (SMT) sensor packages in a panel for separation into individual SMT sensor packages. A base plate is mapped as a grid of sensor footprints, and each footprint is populated with electronic and sensor components. A cover plate including window elements is mapped to a similar grid. The cover plate is bonded to the base plate, such that the window elements are positioned to allow incident electromagnetic radiation upon corresponding sensors mounted on the printed circuit board. Each sensor footprint is sealed within a recess or cell beneath the cover. The sensor circuits may be tested before and/or after being separated into individual SMT sensor packages.
Apparatus and method for a passive range finding proximity detector include a sensor element configured to detect infrared radiation emitted by objects within a detection area. The sensor is configured to detect the ambient temperature, size, distance, or speed and direction of movement of an object from the sensor. The sensor is configured to set parameters for a controlled device based upon the detected size, distance, or speed and direction of an object in relation to one or more size thresholds, distance thresholds, or speed and direction thresholds.
G01S 11/12 - Systems for determining distance or velocity not using reflection or reradiation using electromagnetic waves other than radio waves
G01S 5/16 - Position-fixing by co-ordinating two or more direction or position-line determinationsPosition-fixing by co-ordinating two or more distance determinations using electromagnetic waves other than radio waves
Graphene-based thermopiles are provided. The graphene-based thermopiles may include thermocouples having one or more graphene strips that may be polarized to adjust their Seebeck coefficients. The polarized graphene strips may have larger Seebeck coefficients than the materials conventionally used in thermopile devices. As a result, the graphene-based thermopiles may generate large output voltages using fewer thermocouples than conventional thermopile devices.
G01J 5/12 - Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
A radiation sensing device for sensing first radiation (15) comprises a radiation sensor (11) for sensing the first radiation and at least one first radiation guiding member (13) forming at least a part of a first radiation path for guiding, and preferably converging or focusing, the first radiation towards the sensor. The first radiation guiding member (13) also forms at least a part of a second radiation path for guiding second radiation emitted by an illumination device (12). A control circuit (20) comprises a first sensor circuit (21) for operating one or more radiation sensors (11), an illumination circuit (22) for operating one or more illumination devices (22), and at least one connection (26) amongst said circuits (21, 22).
F21V 23/04 - Arrangement of electric circuit elements in or on lighting devices the elements being switches
G08B 13/196 - Actuation by interference with heat, light, or radiation of shorter wavelengthActuation by intruding sources of heat, light, or radiation of shorter wavelength using passive radiation detection systems using image scanning and comparing systems using television cameras
A thermopile sensor array is provided. The thermopile sensor array may include multiple pixels (109) formed by multiple thermopiles (107) arranged on a single common shared support membrane (103). A separation between the edge of the shared support membrane and the outermost thermopile(s) may be included to provide additional thermal isolation between the thermopile and an underlying silicon substrate (101).
G01J 5/12 - Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
H01L 35/00 - SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR - Details thereof
A thermopile sensor array is provided. The thermopile sensor array may include multiple pixels formed by multiple thermopiles arranged on a single common shared support membrane. A separation between the edge of the shared support membrane and the outermost thermopile(s) may be included to provide additional thermal isolation between the thermopile and an underlying silicon substrate.
H01L 31/058 - including means to utilise heat energy, e.g. hybrid systems, or a supplementary source of electric energy
H01L 29/06 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions
H01L 35/28 - SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR - Details thereof operating with Peltier or Seebeck effect only
A heater (15) for a sensor (10) comprises a substrate (20), an electrically conductive heating structure (21) on the substrate (20), and one or more connecting portions (28) for electrically connecting the heating structure (21) to one or more outside terminals (14) of the sensor (10). The substrate (20) is rigid and can comprise ceramics, preferably alumina ceramics.
A sensor array, comprising: a plurality of sensors electrically connected in series or in parallel, each of the plurality of sensors operable to generate an individual electrical signal; a multiplexing scheme generator operable to generate a multiplexing scheme; a modulation system connected to the multiplexing scheme generator and operable to selectively reverse the polarity of each of the plurality of sensors for each of a plurality of samples; a readout device operable to sequentially read a plurality of output signals of the plurality of electrically connected sensors, wherein the number of samples is greater than or equal to the number of sensors and wherein one or more electrical signals of the plurality of sensors are readout as one electrical signal; and a demultiplexer operable to receive the output electrical signals and to determine the individual electrical signals of each of the plurality of sensors based on the multiplexing scheme.
H04J 3/16 - Time-division multiplex systems in which the time allocation to individual channels within a transmission cycle is variable, e.g. to accommodate varying complexity of signals, to vary number of channels transmitted
A short arc lamp comprises front and back subassemblies including mating weld rings, whereby the lamp can be assembled and sealed through welding of the weld rings. Each subassembly includes a number of self-aligning components to facilitate assembly and improve alignment accuracy. The metal body of the lamp can have a cooling projection portion, which can be received by a heat sink to remove heat from near the anode. A heat sink also can be formed as part of the metal body. The lamp reflector can be a drop-in reflector, or can be formed as part of the metal body through a process such as metal injection molding. A single strut can be used to position the cathode, which can be part of the sleeve or received by a portion of the sleeve. A trigger electrode can be used to simplify the power supply for the lamp.
H01J 1/00 - Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
A xenon short-arc lamp system includes a choice of two anode heatsinks with different mechanisms for thermally interfacing to, and supporting, e.g., a 300W-400W xenon short-arc lamp. One heatsink, allows a conventional mounting in which a split ring and clamp combination accommodate and clamp to a screw-on base adapter fitted to the 300W-400W xenon short-arc lamp. The lamp can then be operated at 300W. The second heatsink accommodates the 300W-400W xenon short-arc lamp directly without the adapter. A large threaded stud on the lamp is screwed directly into the heatsink and is seated such that a large orthogonal flat planar annular ring area also makes a tight thermal connection. The lamp can then be operated at its higher limit because of the much improved thermal resistance.
A method for correcting the output signal of a radiation sensor 20 includes obtaining two or more temperature signals from a corresponding number of measurements of quantities at different times and/or different locations relating to the temperature of the sensor, and correcting the output signal with reference to said temperature signals.
A sensor for detecting electromagnetic radiation comprises a sensor element, a housing in which the sensor element is disposed, and a radiation inlet window provided in the housing and closed by a material transmissible for the radiation to be detected. The transmissible material is fixed to the housing by fixation means not disposed in the field of view of the sensor element.
A sensor element for detecting electromagnetic radiation, particularly in the infrared range, comprises one or more heat-sensitive portions provided on a substrate and one or more influencing layers for influencing the absorption and/or reflection of the electromagnetic radiation to be detected. The heat-sensitive portion(s) and/or the influencing layers are arranged on the substrate in accordance with the thermal properties of the influencing layers, preferably asymmetrically.
G01J 5/12 - Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
G01K 7/02 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using thermoelectric elements, e.g. thermocouples
A short arc lamp comprises front and back subassemblies including mating weld rings, whereby the lamp can be assembled and sealed through welding of the weld rings. Each subassembly includes a number of self-aligning components to facilitate assembly and improve alignment accuracy. The metal body of the lamp can have a cooling projection portion, which can be received by a heat sink to remove heat from near the anode. A heat sink also can be formed as part of the metal body. The lamp reflector can be a drop-in reflector, or can be formed as part of the metal body through a process such as metal injection molding. A single strut can be used to position the cathode, which can be part of the sleeve or received by a portion of the sleeve. A trigger electrode can be used to simplify the power supply for the lamp.
