Described herein are packages and techniques aimed at stabilizing the wavelengths of emission of a wavelength division multiplexing (WDM) optical source against temperature fluctuations. An optical source is coupled with a feedback loop that monitors the degree to which the wavelengths of emission conform to the designated WDM channel grid and dynamically adjusts the operating parameters of the source to maintain such conformity. The technique involves a combination of coarse spectral alignment and fine spectral alignment. An optical source uses a pair of thermo-electric coolers (TEC) to aid in the spectral alignment process. A first TEC is thermally coupled to a laser chip. A second TEC is thermally coupled to a multiplexer chip—a chip that monitors compliance of the emission wavelengths with the designated WDM grid.
H01S 3/13 - Stabilisation of laser output parameters, e.g. frequency or amplitude
G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
Described herein are photonic isolators that utilize integrated photonic polarization controllers to block (or at least attenuate) back-reflections. A photonic isolator includes a first polarization controller formed on a first photonic integrated circuit (PIC) and a second polarization controller formed on a second PIC. The photonic isolator is arranged to permit passage of light in one direction (e.g., from a transmitting PIC to a receiving PIC) while blocking or at least attenuating passage of light in the opposite direction (e.g., from the receiving PIC to the transmitting PIC). The isolator described herein may be compatible with standard semiconductor fabrication processes, such as complementary metal-oxide-semiconductor (CMOS) processes, which provide scalability and high-volume manufacturing. Accordingly, some embodiments relate to an integrated photonic isolator that can be manufactured using CMOS fabrication techniques without the use of exotic magnetic materials.
G02F 1/01 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour
G02F 1/21 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour by interference
G02F 1/225 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour by interference in an optical waveguide structure
Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.
G02B 6/122 - Basic optical elements, e.g. light-guiding paths
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
G02B 6/13 - Integrated optical circuits characterised by the manufacturing method
G02B 6/136 - Integrated optical circuits characterised by the manufacturing method by etching
H04J 14/02 - Wavelength-division multiplex systems
Described herein are systems that integrate a network interface controller (NIC) with a processing unit through co-packaging to improve bandwidth and latency while reducing power consumption. The NIC may be 3D stacked on top of a photonic interposer. A chip-to-chip interface between the NIC and the processing unit addresses bandwidth bottlenecks and latency associated with conventional PCIe-based approaches. The use of silicon photonics enables optical bandwidth that matches the bandwidth of the chip-to-chip interface while reducing power consumption compared to conventional approaches using active optical cables. The photonic interposer may include SRAM buffers for retransmission operations.
Described herein are systems that integrate a network interface controller (NIC) with a processing unit through co-packaging to improve bandwidth and latency while reducing power consumption. The NIC may be 3D stacked on top of a photonic interposer. A chip-to-chip interface between the NIC and the processing unit addresses bandwidth bottlenecks and latency associated with conventional PCIe-based approaches. The use of silicon photonics enables optical bandwidth that matches the bandwidth of the chip-to-chip interface while reducing power consumption compared to conventional approaches using active optical cables. The photonic interposer may include SRAM buffers for retransmission operations.
G02B 6/43 - Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
G02B 6/42 - Coupling light guides with opto-electronic elements
H10B 80/00 - Assemblies of multiple devices comprising at least one memory device covered by this subclass
H10D 80/30 - Assemblies of multiple devices comprising at least one device covered by this subclass the at least one device being covered by groups , e.g. assemblies comprising integrated circuit processor chips
09 - Scientific and electric apparatus and instruments
Goods & Services
Lasers for use in optical communication; lasers for
non-medical purposes for use on a single photonic circuit;
optical communications technology, namely, wavelength
division multiplexing (WDM) devices.
A device includes a magnetically attachable fiber array unit (FAU) for coupling optical fibers to a photonic integrated circuit (PIC). The device uses magnetic retention to secure the FAU to a substrate, where the FAU includes a fiber that is optically coupled to a waveguide of the PIC. Conventional fiber array units use mechanical retention means such as latches, clips, spring-loaded ball bearings, or friction fits to achieve pluggability. These mechanical parts can experience wear and tear from repeated insertions and removals. The magnetically attachable fiber coupler provides an alternative to conventional mechanical retention approaches by using magnetic retention for a pluggable FAU that attaches to a package including a PIC. By replacing mechanical retention means with magnetic retention, the magnetically attachable fiber coupler may reduce susceptibility to wear from repeated connection and disconnection cycles.
A photonic device includes a photonic integrated circuit (PIC) comprising a plurality of waveguides, an optical coupler array positioned near an edge of the PIC, and a plurality of optical fibers. The optical coupler array comprises a plurality of optical couplers. Each optical coupler of the optical coupler array defines an optical path coupling a respective waveguide of the plurality of waveguides to a respective optical fiber of the plurality of optical fibers. At least two optical couplers of the plurality of optical couplers are offset relative to each other, either in a first direction perpendicular to the waveguide plane or a second direction perpendicular to the edge of the PIC, or both.
A photonic device includes a photonic integrated circuit (PIC) comprising a plurality of waveguides, an optical coupler array positioned near an edge of the PIC, and a plurality of optical fibers. The optical coupler array comprises a plurality of optical couplers. Each optical coupler of the optical coupler array defines an optical path coupling a respective waveguide of the plurality of waveguides to a respective optical fiber of the plurality of optical fibers. At least two optical couplers of the plurality of optical couplers are offset relative to each other, either in a first direction perpendicular to the waveguide plane or a second direction perpendicular to the edge of the PIC, or both.
A photonic device includes a package comprising a partial interposer and an electronic-photonic assembly disposed thereon. The assembly comprises a photonic integrated circuit (PIC) having first and second sides, wherein the first side is attached to the partial interposer, and wherein the PIC comprises a waveguide defining a waveguide plane. The assembly further comprises an electronic integrated circuit (EIC) attached to the second side of the PIC and an encapsulant at least partially surrounding the EIC. The device includes an optical coupler attached to the PIC, configured to collimate light emitted by the PIC in a direction angled relative to the waveguide plane. The device includes an optical assembly comprising a detachable plug and fiber, positioned to receive the collimated light from the optical coupler.
A photonic device includes a package comprising a partial interposer and an electronic-photonic assembly disposed thereon. The assembly comprises a photonic integrated circuit (PIC) having first and second sides, wherein the first side is attached to the partial interposer, and wherein the PIC comprises a waveguide defining a waveguide plane. The assembly further comprises an electronic integrated circuit (EIC) attached to the second side of the PIC and an encapsulant at least partially surrounding the EIC. The device includes an optical coupler attached to the PIC, configured to collimate light emitted by the PIC in a direction angled relative to the waveguide plane. The device includes an optical assembly comprising a detachable plug and fiber, positioned to receive the collimated light from the optical coupler.
Described herein are photonic devices and methods of manufacturing the same. The photonic devices include a photonic integrated circuit (PIC) disposed on a substrate and a socket configured to receive a pluggable optical coupler to couple the PIC to one or more optical fibers. Manufacturing the photonic devices may include removing a portion of the PIC to expose through-silicon-vias (TSVs) of the PIC, coupling electronic integrated circuits (EIC) to the PIC, and forming a mold around portions of the EICs. The architecture of the photonic devices enables pluggable fiber array units in multi-die configurations while maintaining low optical loss through wafer-level assembly.
An optical device includes a first optical resonator and a second optical resonator optically coupled to the first optical resonator. A first heater is thermally coupled to the first optical resonator and a second heater is thermally coupled to the second optical resonator. The second heater is configured to be controlled separately from the first heater. A photodetector is coupled to the optical device to monitor light output from the coupled resonators. A controller applies a common-mode dither to the first heater and the second heater. Prior to applying the common-mode dither, the controller reads a first output from the photodetector. Subsequent to applying the common-mode dither, the controller reads a second output from the photodetector. The controller adjusts voltages applied to the first heater and the second heater based on a comparison between the first output and the second output to compensate for variations between the resonators.
G02F 1/01 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour
G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
An optical device includes a first optical resonator and a second optical resonator optically coupled to the first optical resonator. A first heater is thermally coupled to the first optical resonator and a second heater is thermally coupled to the second optical resonator. The second heater is configured to be controlled separately from the first heater. A photodetector is coupled to the optical device to monitor light output from the coupled resonators. A controller applies a common-mode dither to the first heater and the second heater. Prior to applying the common-mode dither, the controller reads a first output from the photodetector. Subsequent to applying the common-mode dither, the controller reads a second output from the photodetector. The controller adjusts voltages applied to the first heater and the second heater based on a comparison between the first output and the second output to compensate for variations between the resonators.
G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
15.
PHOTONIC COMMUNICATION PLATFORM AND RELATED ARCHITECTURES, SYSTEMS AND METHODS
Photonic interposers that enable low-power, high-bandwidth inter-chip (e.g., board-level and/or rack-level) as well as intra-chip communication are described. Described herein are techniques, architectures and processes that improve upon the performance of conventional computers. Some embodiments provide photonic interposers that use photonic tiles, where each tile includes programmable photonic circuits that can be programmed based on the needs of a particular computer architecture. Some tiles are instantiations of a common template tile that are stitched together in a 1D or a 2D arrangement. Some embodiments described herein provide a programmable physical network designed to connect pairs of tiles together with photonic links.
G02B 6/124 - Geodesic lenses or integrated gratings
G02B 6/13 - Integrated optical circuits characterised by the manufacturing method
G02B 6/42 - Coupling light guides with opto-electronic elements
G02B 6/43 - Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
H04B 10/079 - Arrangements for monitoring or testing transmission systemsArrangements for fault measurement of transmission systems using an in-service signal using measurements of the data signal
H04B 10/80 - Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups , e.g. optical power feeding or optical transmission through water
H04J 14/02 - Wavelength-division multiplex systems
09 - Scientific and electric apparatus and instruments
Goods & Services
(1) Lasers for use in optical communication; lasers for non-medical purposes for use on a single photonic circuit; optical communications technology, namely, wavelength division multiplexing (WDM) devices.
17.
PHOTONIC INTEGRATED CIRCUIT WITH A PLUGGABLE FIBER COUPLER
Described herein are systems and techniques for providing photonic devices having efficient optical coupling between waveguides and optical fibers. The photonic devices comprise an edge coupler disposed within a cavity of a photonic integrated circuit (PIC) and a pluggable assembly removably coupled with the edge coupler. The PIC includes a spot size converter optically coupled to a waveguide to expand light received from the waveguide prior to exiting the PIC.
A device may include an electronic-photonic assembly comprising: a photonic integrated circuit (PIC) comprising a waveguide defining a waveguide plane, an electronic integrated circuit (EIC) attached to the PIC; and an encapsulant at least partially encapsulating the EIC. A device may include an optical coupler attached to the PIC, wherein the optical coupler is configured to collimate, in a first direction that is angled relative to the waveguide plane, light emitted by the PIC upon being guided by the waveguide. A device may include an optical assembly comprising a detachable plug and a fiber attached to the detachable plug, wherein the optical assembly is positioned to receive the collimated light from the optical coupler.
Described herein are systems and techniques for providing photonic devices having efficient optical coupling between waveguides. The photonic devices comprise a glass substrate having glass waveguides and a photonic integrated circuit (PIC) having PIC waveguides evanescently coupled with the glass waveguides. The waveguides may have recesses disposed between adjacent waveguides to allow for excess adhesive to be squeezed out. The PIC may have a trench exposing the waveguide layer of the PIC, thus reducing the gap between the PIC waveguides and the glass waveguides when coupled.
A device may include an electronic-photonic assembly comprising: a photonic integrated circuit (PIC) comprising a waveguide extending near a sidewall of the PIC, an electronic integrated circuit (EIC) attached to the PIC; and an encapsulant at least partially encapsulating the EIC. A device may include an optical assembly comprising a detachable plug and a fiber attached to the detachable plug. A device may include an optical coupler between the sidewall of the PIC and the optical assembly, wherein the optical coupler is configured to couple light received from the waveguide to the fiber.
A device may include an electronic-photonic assembly comprising: a photonic integrated circuit (PIC) comprising a waveguide extending near a sidewall of the PIC, an electronic integrated circuit (EIC) attached to the PIC; and an encapsulant at least partially encapsulating the EIC. A device may include an optical assembly comprising a detachable plug and a fiber attached to the detachable plug. A device may include an optical coupler between the sidewall of the PIC and the optical assembly, wherein the optical coupler is configured to couple light received from the waveguide to the fiber.
A device may include an electronic -photonic assembly comprising: a photonic integrated circuit (PIC) comprising a waveguide defining a waveguide plane, an electronic integrated circuit (ETC) attached to the PIC; and an encapsulant at least partially encapsulating the EIC. A device may include an optical coupler attached to the PIC, wherein the optical coupler is configured to collimate, in a first direction that is angled relative to the waveguide plane, light emitted by the PIC upon being guided by the waveguide. A device may include an optical assembly comprising a detachable plug and a fiber attached to the detachable plug, wherein the optical assembly is positioned to receive the collimated light from the optical coupler.
Described herein are systems and techniques for providing photonic devices having glass substrates for use in an optical interconnect system. The photonic devices comprise a glass substrate and one or more optoelectronic assemblies coupled through openings of the glass substrate. Waveguides of the optoelectronic assemblies may be optically coupled with waveguides of the glass substrate forming an optical network through the glass substrate. The assembly waveguides may be optically coupled to the glass waveguides through pluggable optical couplers, evanescent coupling, and/or edge coupling.
Described herein are techniques for light extraction in hybrid-bonded photonics packages, in which application- specific integrated circuits (ASICs) are attached to a photonic integrated circuit (PIC) via hybrid-bonding. The techniques developed by the inventors involve extraction of light from the backside of the PIC, as opposed to the top side or the edge of the PIC as in conventional devices. A photonic device comprises a substrate, a PIC, an ASIC and an optical assembly. The PIC is disposed on the substrate and has a first surface and a second surface. The first surface faces the substrate. The ASIC is hybrid-bonded to the second surface of the PIC. The optical assembly comprises a fiber array unit and an optical fiber. The optical assembly is disposed in an opening formed in the substrate and the optical assembly is configured to receive light through the first surface of the PIC.
Described herein are systems and techniques for a bidirectional polarization diverse optical transceivers. When an optical signal propagates along a single mode fiber, the single polarization mode gets rotated and may arrive at an optical transceiver with an arbitrary superposition of two orthogonal polarization modes, each of which experience differing optical effects. The bidirectional optical transceivers described herein include one or more features for addressing the differing optical effects so that both polarization modes are received at substantially a same time.
In optical interconnect systems, information may be encoded in different wavelengths of light in an optical signal in a wavelength division multiplexing (WDM) scheme. The inventors have recognized and appreciated that the data rate of an optical interconnect system may be doubled by employing a polarization multiplexing scheme, where some information is encoded in an optical signal having a first polarization state and other information is encoded in an optical signal having a second, orthogonal polarization state as the different polarizations will act independently while propagating along a fiber. Accordingly, described herein are systems and techniques for optical interconnect systems employing polarization multiplexing.
Described herein are packaged photonic devices configured to mitigate the negative effects of package warpage using piezoelectric transducers. As the package deforms due to mismatches in the coefficient of thermal expansion (CTE) among its components, the piezoelectric transducers are actuated to bend and conform to the resulting curvature of the photonic integrated circuit (PIC). By adapting their shape to the warped surface, the piezoelectric transducers restore and maintain proper optical alignment, thereby ensuring efficient fiber-to-PIC coupling despite the presence of package warpage. In one example, a photonic device comprises a PIC, an optical assembly attached to the PIC and comprising a fiber array unit (FAU) and a fiber array attached to the FAU, and a piezoelectric transducer attached to the FAU.
Described herein are systems and techniques for a bidirectional polarization diverse optical transceivers. When an optical signal propagates along a single mode fiber, the single polarization mode gets rotated and may arrive at an optical transceiver with an arbitrary superposition of two orthogonal polarization modes, each of which experience differing optical effects. The bidirectional optical transceivers described herein include one or more features for addressing the differing optical effects so that both polarization modes are received at substantially a same time.
Described herein are systems and techniques for providing photonic devices having glass substrates for use in an optical interconnect system. The photonic devices comprise a glass substrate and one or more optoelectronic assemblies coupled through openings of the glass substrate. Waveguides of the optoelectronic assemblies may be optically coupled with waveguides of the glass substrate forming an optical network through the glass substrate. The assembly waveguides may be optically coupled to the glass waveguides through pluggable optical couplers, evanescent coupling, and/or edge coupling.
Described herein are techniques for light extraction in hybrid-bonded photonics packages, in which application-specific integrated circuits (ASICs) are attached to a photonic integrated circuit (PIC) via hybrid-bonding. The techniques developed by the inventors involve extraction of light from the backside of the PIC, as opposed to the top side or the edge of the PIC as in conventional devices. A photonic device comprises a substrate, a PIC, an ASIC and an optical assembly. The PIC is disposed on the substrate and has a first surface and a second surface. The first surface faces the substrate. The ASIC is hybrid-bonded to the second surface of the PIC. The optical assembly comprises a fiber array unit and an optical fiber. The optical assembly is disposed in an opening formed in the substrate and the optical assembly is configured to receive light through the first surface of the PIC.
In optical interconnect systems, information may be encoded in different wavelengths of light in an optical signal in a wavelength division multiplexing (WDM) scheme. The inventors have recognized and appreciated that the data rate of an optical interconnect system may be doubled by employing a polarization multiplexing scheme, where some information is encoded in an optical signal having a first polarization state and other information is encoded in an optical signal having a second, orthogonal polarization state as the different polarizations will act independently while propagating along a fiber. Accordingly, described herein are systems and techniques for optical interconnect systems employing polarization multiplexing.
Described herein are glass substrates that include a cavity and glass fingers extending into the cavity. A photonic integrated circuit (PIC) is positioned near the cavity such that a waveguide of the PIC is optically coupled to a waveguide of the glass substrate formed in one of the glass fingers. The structure described herein allows for improved coupling efficiency between the PIC and the glass substrate, and improved access for underfill and outgassing processes. This approach facilitates reliable packaging of large or multi -reticle PICs while maintaining high optical and mechanical performance.
G02B 6/30 - Optical coupling means for use between fibre and thin-film device
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
G02B 6/42 - Coupling light guides with opto-electronic elements
Described herein are fiber-connection structures for photonic integrated circuits (PICs). These fiber connection structures enable efficient optical coupling between integrated waveguides and corresponding optical fibers by facilitating reliable edge coupling. The fiber-connection designs developed by the inventor improve upon conventional approaches by increasing fan-out fiber capability, coupling efficiency and scalability. A photonic package comprises a substrate, a PIC, an application-specific integrated circuit (ASIC) and a glass coupler. The PIC is attached to the substrate and comprises a PIC waveguide having an end adjacent an edge of the PIC. The ASIC is attached to the PIC. The glass coupler is attached to the PIC and comprises a glass waveguide optically coupled to the PIC waveguide.
Described herein are fiber-connection structures for photonic integrated circuits (PICs). These fiber connection structures enable efficient optical coupling between integrated waveguides and corresponding optical fibers by facilitating reliable edge coupling. The fiber-connection designs developed by the inventor improve upon conventional approaches by increasing fan-out fiber capability, coupling efficiency and scalability. A photonic package comprises a substrate, a PIC, an application-specific integrated circuit (ASIC) and a glass coupler. The PIC is attached to the substrate and comprises a PIC waveguide having an end adjacent an edge of the PIC. The ASIC is attached to the PIC. The glass coupler is attached to the PIC and comprises a glass waveguide optically coupled to the PIC waveguide.
Described herein are glass substrates that include a cavity and glass fingers extending into the cavity. A photonic integrated circuit (PIC) is positioned near the cavity such that a waveguide of the PIC is optically coupled to a waveguide of the glass substrate formed in one of the glass fingers. The structure described herein allows for improved coupling efficiency between the PIC and the glass substrate, and improved access for underfill and outgassing processes. This approach facilitates reliable packaging of large or multi-reticle PICs while maintaining high optical and mechanical performance.
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
G02B 6/136 - Integrated optical circuits characterised by the manufacturing method by etching
36.
TECHNIQUES TO PREVENT UNDERFILL INTERFERENCE IN PHOTONIC FIBER COUPLERS
Described herein are robust fiber-connection structures for photonic integrated circuits (PICs). These fiber connection structures enable efficient optical coupling between integrated waveguides defined near an edge of a PIC and corresponding optical fibers, thereby facilitating reliable edge coupling. The fiber-connection designs developed by the inventor improve upon conventional approaches by minimizing damage associated die-sawing processes, reducing surface roughness and preventing underfill intrusion into the edge coupling region.
Described herein are robust fiber-connection structures for photonic integrated circuits (PICs). These fiber connection structures enable efficient optical coupling between integrated waveguides defined near an edge of a PIC and corresponding optical fibers, thereby facilitating reliable edge coupling. The fiber-connection designs developed by the inventor improve upon conventional approaches by minimizing damage associated die-sawing processes, reducing surface roughness and preventing underfill intrusion into the edge coupling region.
Described herein are optical systems that reduce channel crosstalk in semiconductor optical amplifiers (SOAs) without sacrificing suppression of noise due to amplified spontaneous emission, thereby overcoming trade-offs existing in conventional amplifiers. These schemes involve injection of continuous wave (CW) light into the SOA. The CW assist light may be provided at a wavelength within the transparency region of an SOA. Injecting CW assist light in the transparency region results in a speed-up of the carrier lifetime and gain recovery. Application of CW assist light in the transparency region establishes a feedback mechanism by which the more carriers are depleted, the faster the carrier recovery. Furthermore, the injection of CW light results in pinning of the carrier density and constant gain. CW light injection can be used in SOAs that use bulk, quantum-well, and quantum dot gain material.
Described herein are systems and methods for dynamically configuring networks using Optical Circuit Switching (OCS). Rather than having a central OCS device, or in addition to the central OCS device, OCS devices are distributed to various compute modules (e.g., electrical processing units or groups of electrical processing units). The distributed OCS devices provide better performance of the system, reducing latency and power consumption by leveraging and distributing scale-up and scale-out bandwidth as needed.
Described herein are systems and methods for dynamically configuring memory using Optical Circuit Switching (OCS). As electrical processing units such as accelerators are limited by their available bandwidth, providing disaggregated memory can help expand memory and enable better processing performance. Providing OCS devices to dynamically reconfigure processor-to-processor and processor-to-memory connections enables flexible reconfiguration of the disaggregated memory and improve performance of the system.
Described herein are systems and methods for recovering manufacturing yield of semiconductor electro-optical systems. The methods and techniques leverage Optical Circuit Switching (OCS) to dynamically route connections away from faulty hardware and to maximize usage of the remaining functioning hardware. The OCS may be controlled to route connections based on information indicative of the performance of the optical channels and the electrical processing units of the semiconductor system.
Described herein are systems and methods for leveraging Optical Circuit Switching (OCS) to dynamically route connections in an optoelectronic system. The OCS may be used to dynamically route connections away from faulty hardware and to maximize usage of the remaining functioning hardware. The OCS may be used to dynamically distribute bandwidth in a distributed network and/or systems employing disaggregated memory.
G02B 6/28 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
G02B 6/122 - Basic optical elements, e.g. light-guiding paths
Described herein are packages and techniques aimed at stabilizing the wavelengths of emission of a wavelength division multiplexing (WDM) optical source against temperature fluctuations. An optical source is coupled with a feedback loop that monitors the degree to which the wavelengths of emission conform to the designated WDM channel grid and dynamically adjusts the operating parameters of the source to maintain such conformity. The technique involves a combination of coarse spectral alignment and fine spectral alignment. An optical source uses a pair of thermo-electric coolers (TEC) to aid in the spectral alignment process. A first TEC is thermally coupled to a laser chip. A second TEC is thermally coupled to a multiplexer chip—a chip that monitors compliance of the emission wavelengths with the designated WDM grid.
G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
Described herein are compact, high-power tunable optical sources with precise wavelength control. The tunable optical sources developed by the inventors and described herein use laser arrays that are compatible with wavelength division multiplexing (WDM) schemes, making these sources particularly suitable for use in applications requiring high levels of data throughput. These sources use integrated wavemeters to measure the wavelength of optical emission. These wavemeters are formed monolithically on the same substrate hosting the laser array, resulting in a much smaller footprint than what is possible using conventional, external instrumentation. The wavemeters described herein use optical interferometers as part of a feedback control loop to ensure that the lasers emit light at the desired carrier wavelengths. A wavemeter can map the wavelength of emission of a laser to the wavelengths of emission of a calibrated optical source.
H01S 3/13 - Stabilisation of laser output parameters, e.g. frequency or amplitude
G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
H01S 3/00 - Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
Described herein are packages and techniques aimed at stabilizing the wavelengths of emission of a wavelength division multiplexing (WDM) optical source against temperature fluctuations. An optical source is coupled with a feedback loop that monitors the degree to which the wavelengths of emission conform to the designated WDM channel grid and dynamically adjusts the operating parameters of the source to maintain such conformity. The technique involves a combination of coarse spectral alignment and fine spectral alignment. An optical source uses a pair of thermo-electric coolers (TEC) to aid in the spectral alignment process. A first TEC is thermally coupled to a laser chip. A second TEC is thermally coupled to a multiplexer chip - a chip that monitors compliance of the emission wavelengths with the designated WDM grid.
Described herein are compact, high-power tunable optical sources with precise wavelength control. The tunable optical sources developed by the inventors and described herein use laser arrays that are compatible with wavelength division multiplexing (WDM) schemes, making these sources particularly suitable for use in applications requiring high levels of data throughput. These sources use integrated wavemeters to measure the wavelength of optical emission. These wavemeters are formed monolithically on the same substrate hosting the laser array, resulting in a much smaller footprint than what is possible using conventional, external instrumentation. The wavemeters described herein use optical interferometers as part of a feedback control loop to ensure that the lasers emit light at the desired carrier wavelengths. A wavemeter can map the wavelength of emission of a laser to the wavelengths of emission of a calibrated optical source.
Hybrid interconnect schemes that combine both electrical and optical stitching are described. Electrical stitching is well- suited for short-reach, high-bandwidth connections between adjacent or closely spaced units. On the other hand, optical stitching is well-suited for long-reach, low-loss connections between non-adjacent units. By leveraging the complementary nature of electrical and optical stitching, a multi -reticle device may be constructed that provides substantially greater scalability in terms of compute and memory density and overall interconnect bandwidth than is achievable using conventional approaches. An intermediate connection layer is configured to electrically connect electrical integrated circuits (EIC) of the plurality of EICs that are within a cutoff range of one another. An electro-optical interposer is configured to optically connect EICs of the plurality of EICs that are outside the cutoff range of one another.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
G11C 5/02 - Disposition of storage elements, e.g. in the form of a matrix array
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
48.
MULTI-RETICLE DEVICE WITH ELECTRICAL AND OPTICAL STITCHING
Hybrid interconnect schemes that combine both electrical and optical stitching are described. Electrical stitching is well-suited for short-reach, high-bandwidth connections between adjacent or closely spaced units. On the other hand, optical stitching is well-suited for long-reach, low-loss connections between non-adjacent units. By leveraging the complementary nature of electrical and optical stitching, a multi-reticle device may be constructed that provides substantially greater scalability in terms of compute and memory density and overall interconnect bandwidth than is achievable using conventional approaches. An intermediate connection layer is configured to electrically connect electrical integrated circuits (EIC) of the plurality of EICs that are within a cutoff range of one another. An electro-optical interposer is configured to optically connect EICs of the plurality of EICs that are outside the cutoff range of one another.
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
49.
RECONSTITUTED WAFER-SCALE DEVICES USING SEMICONDUCTOR STRIPS
Described herein are manufacturing techniques and packages that enable wafer-scale heterogenous integration of electronic integrated circuits (EIC) with photonic integrated circuits (PIC) using a reconstitution-based fabrication approach. Wafer-scale photonic devices are formed by assembling strips of known-good dies (KGD). Such strips include arrays of adjacent reticles that have been singulated from a wafer. A strip can include a single row (or column) of reticles singulated from a wafer or multiple rows (or columns) that are adjacent to one another, enabling two-dimensional assembly and increased coverage. Wafer reconstitution involves transferring and bonding one or more strips of KGDs to a target substrate. A KGD is a reticle that is not part of an exclusion zone and has been verified to work properly. Thus, a reconstituted wafer includes strips that have verified to be fully functional.
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
G02B 6/13 - Integrated optical circuits characterised by the manufacturing method
50.
RECONSTITUTED WAFER-SCALE DEVICES USING SEMICONDUCTOR STRIPS
Described herein are manufacturing techniques and packages that enable wafer-scale heterogenous integration of electronic integrated circuits (EIC) with photonic integrated circuits (PIC) using a reconstitution-based fabrication approach. Wafer-scale photonic devices are formed by assembling strips of known-good dies (KGD). Such strips include arrays of adjacent reticles that have been singulated from a wafer. A strip can include a single row (or column) of reticles singulated from a wafer or multiple rows (or columns) that are adjacent to one another, enabling two-dimensional assembly and increased coverage. Wafer reconstitution involves transferring and bonding one or more strips of KGDs to a target substrate. A KGD is a reticle that is not part of an exclusion zone and has been verified to work properly. Thus, a reconstituted wafer includes strips that have verified to be fully functional.
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
G02B 6/42 - Coupling light guides with opto-electronic elements
G02B 6/43 - Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
H01L 21/66 - Testing or measuring during manufacture or treatment
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
H01L 23/00 - Details of semiconductor or other solid state devices
09 - Scientific and electric apparatus and instruments
Goods & Services
Lasers for use in optical communication; lasers for non-medical purposes for use on a single photonic circuit; optical communications technology, namely, wavelength division multiplexing (WDM) devices
Described herein are optical switches that enable high-speed, low-loss, and low-crosstalk switching across multiple wavelengths within a CMOS-compatible platform. The optical switches described herein use resonant devices (e.g., microring resonators) controlled via carrier-induced phase modulation effects. To allow for multi-wavelength operation, the inventor proposes matching the free spectral range (FSR) of a resonant device to the spacing between adjacent WDM channels. By matching the FSR of a resonant device to the spacing between adjacent WDM channels, all the WDM channels can be switch simultaneously, thereby increasing the system's ability to perform parallel, high-speed switching. Resonant devices of the types described herein may be implemented in various ways. In one example, a device may be configured as a microring resonator, a closed-loop waveguide positioned adjacent to a bus waveguide, where light can couple into and out of the microring through evanescent coupling.
G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
G02B 6/35 - Optical coupling means having switching means
Described herein are optical switches that leverage wavelength division multiplexing (WDM) to route signals to the desired output. The optical switches developed by the inventors represent significant advancements over conventional designs in several critical areas. A switching scheme uses WDM to route signals to the desired destination. Each source/destination pair may be encoded on a particular WDM channel. For example, a device that intends to transmit a message from an input port to a particular output port may encode the message on a WDM channel that is uniquely associated with that output port. This approach presents a significant advantage over conventional switching architectures in that it removes the requirement to use stages of electrical routing, thereby reducing power consumption and signal latency. Instead, routing is performed on the basis of WDM channels.
Photonic interposers that enable low-power, high-bandwidth inter-chip (e.g., board-level and/or rack-level) as well as intra-chip communication are described. Described herein are techniques, architectures and processes that improve upon the performance of conventional computers. Some embodiments provide photonic interposers that use photonic tiles, where each tile includes programmable photonic circuits that can be programmed based on the needs of a particular computer architecture. Some tiles are instantiations of a common template tile that are stitched together in a 1D or a 2D arrangement. Some embodiments described herein provide a programmable physical network designed to connect pairs of tiles together with photonic links.
G02B 6/124 - Geodesic lenses or integrated gratings
G02B 6/13 - Integrated optical circuits characterised by the manufacturing method
G02B 6/42 - Coupling light guides with opto-electronic elements
G02B 6/43 - Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
H04B 10/079 - Arrangements for monitoring or testing transmission systemsArrangements for fault measurement of transmission systems using an in-service signal using measurements of the data signal
H04B 10/80 - Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups , e.g. optical power feeding or optical transmission through water
H04J 14/02 - Wavelength-division multiplex systems
55.
PHOTONIC COMMUNICATION PLATFORM AND RELATED CIRCUITS
Photonic interposers that enable low-power, high-bandwidth inter-chip (e.g., board-level and/or rack-level) as well as intra-chip communication are described. Described herein are techniques, architectures and processes that improve upon the performance of conventional computers. Some embodiments provide photonic interposers that use photonic tiles, where each tile includes programmable photonic circuits that can be programmed based on the needs of a particular computer architecture. Some tiles are instantiations of a common template tile that are stitched together in a 1D or a 2D arrangement. Some embodiments described herein provide a programmable physical network designed to connect pairs of tiles together with photonic links.
G02B 6/124 - Geodesic lenses or integrated gratings
G02B 6/13 - Integrated optical circuits characterised by the manufacturing method
G02B 6/42 - Coupling light guides with opto-electronic elements
G02B 6/43 - Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
H04B 10/079 - Arrangements for monitoring or testing transmission systemsArrangements for fault measurement of transmission systems using an in-service signal using measurements of the data signal
H04B 10/80 - Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups , e.g. optical power feeding or optical transmission through water
H04J 14/02 - Wavelength-division multiplex systems
56.
PLUGGABLE FIBER-TO-CHIP COUPLING FOR WAFER SCALE CO-PACKAGED OPTICS
Described herein are pluggable fiber-attach-first techniques and related manufacturing methods for assembling photonic chips according to the fiber-attach-first technique. The techniques may be used in several fields including, but not limited to, 2D, 2.5D, and 3D package architectures, wafer scale packaging technologies, and transceiver technologies. A photonic device comprises a photonic stack, a glass substrate and epoxy configured to hold the photonic stack and the glass substrate together. The photonic stack comprises one or more alignment features. The glass substrate comprises one or more alignment features, wherein each of the one or more alignment features of the glass substrate engage with a corresponding alignment feature of the photonic stack such that one or more waveguides of the photonic stack are optically coupled with one or more glass waveguides of the glass substrate.
Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
G02B 6/122 - Basic optical elements, e.g. light-guiding paths
G02B 6/13 - Integrated optical circuits characterised by the manufacturing method
G02B 6/136 - Integrated optical circuits characterised by the manufacturing method by etching
Described herein are pluggable fiber-attach-first techniques and related manufacturing methods for assembling photonic chips according to the fiber-attach-first technique. The techniques may be used in several fields including, but not limited to, 2D, 2.5D, and 3D package architectures, wafer scale packaging technologies, and transceiver technologies. A photonic device comprises a photonic stack (120), a glass substrate (140) and epoxy configured to hold the photonic stack (120) and the glass substrate (140) together. The photonic stack (120) comprises one or more alignment features. The glass substrate comprises one or more alignment features (142) wherein each of the one or more alignment features (142) of the glass substrate (140) engage with a corresponding alignment feature (132) of the photonic stack (120) such that one or more waveguides of the photonic stack are optically coupled with one or more glass waveguides (144) of the glass substrate (140).
G02B 6/30 - Optical coupling means for use between fibre and thin-film device
G02B 6/136 - Integrated optical circuits characterised by the manufacturing method by etching
G02B 6/28 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals
G02B 6/38 - Mechanical coupling means having fibre to fibre mating means
G02B 6/43 - Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
Described herein are photonic sources and related system architectures that can satisfy the optical power requirements of large photonic accelerators. Some embodiments relate to a computer comprising a photonic accelerator configured to perform matrix multiplication; a fiber array optically coupled to the photonic accelerator; and a photonic source optically coupled to the fiber array. The photonic source comprising a laser array comprising a plurality of monolithically co-integrated lasers, and a coupling lens array comprising a plurality of monolithically co-integrated lenses, the coupling lens array optically coupling the laser array to the fiber array. The laser array is configured to output between 0.1 W and 10 W of optical power.
Photonic interposers that enable low-power, high-bandwidth inter-chip (e.g., board-level and/or rack-level) as well as intra-chip communication are described. Described herein are techniques, architectures and processes that improve upon the performance of conventional computers. Some embodiments provide photonic interposers that use photonic tiles, where each tile includes programmable photonic circuits that can be programmed based on the needs of a particular computer architecture. Some tiles are instantiations of a common template tile that are stitched together in a 1D or a 2D arrangement. Some embodiments described herein provide a programmable physical network designed to connect pairs of tiles together with photonic links.
G02B 6/124 - Geodesic lenses or integrated gratings
G02B 6/13 - Integrated optical circuits characterised by the manufacturing method
G02B 6/42 - Coupling light guides with opto-electronic elements
G02B 6/43 - Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
H04B 10/079 - Arrangements for monitoring or testing transmission systemsArrangements for fault measurement of transmission systems using an in-service signal using measurements of the data signal
H04B 10/80 - Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups , e.g. optical power feeding or optical transmission through water
H04J 14/02 - Wavelength-division multiplex systems
61.
3D STACKED I/O CHIPLET ON OPTICAL INTERPOSER FOR HIGH BANDWIDTH APPLICATIONS
Described herein is a novel approach that leverages a 3D stacked die complex with an active optical interposer integrated with an I/O chiplet including high-speed serializer/deserializer (SerDes). By integrating silicon in this way, shoreline constraints are eliminated, allowing for the SerDes macros to be placed virtually anywhere on the I/O chiplet. The photonic-based interconnects described herein improve upon conventional approaches based on co-packaged optics (CPO), Linear-drive Pluggable Optics (LPO) and copper-based solutions in terms of bandwidth and power consumption. The interconnects described herein rely on photonic-electronic packages in which a PIC provides processing units (e.g., XPU), electronic switching chips or other types of application-specific integrated circuits (ASIC) with access to optical fiber-based networks while multiple SerDes provide high-speed serialization and deserialization. More specifically, the application describes a photonic-electronic package, comprising: a photonic integrated circuit (PIC) comprising a first plurality of through silicon vias (TSV) and a second plurality of TSVs; and an electronic integrated circuit (EIC) mounted on the PIC, wherein the EIC comprises an input-output (I/O) interface coupled to the first plurality of TSVs of the PIC, a plurality of serializer-deserializer (SerDes) coupled to the second plurality of TSVs of the PIC, and a data path coupling the I/O interface to at least one of the plurality of SerDes.
Described herein is a novel approach that leverages a 3D stacked die complex with an active optical interposer integrated with an I/O chiplet including high-speed serializer/deserializer (SerDes). By integrating silicon in this way, shoreline constraints are eliminated, allowing for the SerDes macros to be placed virtually anywhere on the I/O chiplet. The photonic-based interconnects described herein improve upon conventional approaches based on co-packaged optics (CPO), Linear-drive Pluggable Optics (LPO) and copper-based solutions in terms of bandwidth and power consumption. The interconnects described herein rely on photonic-electronic packages in which a PIC provides processing units (e.g., XPU), electronic switching chips or other types of application-specific integrated circuits (ASIC) with access to optical fiber-based networks while multiple SerDes provide high-speed serialization and deserialization.
Described herein are wavelength division multiplexing (WDM) transceivers configured to support fast, bidirectional communication over optical channels. An optical transceiver comprises a transmitter, a receiver, an input/output (I/O) port and an optical interleaver. The transmitter comprises a first bus waveguide and a plurality of optical modulators coupled to the first bus waveguide, each of the optical modulators being resonant at a respective wavelengths in a first wavelength set. The receiver comprises a second bus waveguide and a plurality of optical filters coupled to the second bus waveguide, each of the optical filters being resonant at a respective wavelength in a second wavelength set. The (I/O) port is coupled to an optical channel. The optical interleaver is configured to selectively couple light having wavelengths in the first wavelength set from the first waveguide bus to the I/O port, and selectively couple light having wavelengths in the second wavelength set from the I/O port to the second bus waveguide.
G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.
G02B 6/122 - Basic optical elements, e.g. light-guiding paths
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
G02B 6/13 - Integrated optical circuits characterised by the manufacturing method
G02B 6/136 - Integrated optical circuits characterised by the manufacturing method by etching
H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or
H04J 14/02 - Wavelength-division multiplex systems
09 - Scientific and electric apparatus and instruments
Goods & Services
Lasers for use in optical communication; lasers for
non-medical purposes for use on a single photonic circuit;
optical communications technology, namely, photonic
integrated circuits; integrated circuits; optical
communications technology, namely, wavelength division
multiplexing (WDM) devices.
Hybrid analog-digital processing systems are described. An example of a hybrid analog-digital processing system includes photonic accelerator configured to perform matrix-vector multiplication using light. The photonic accelerator exhibits a frequency response having a first bandwidth (e.g., less than 3 GHz). The hybrid analog-digital processing system further includes a plurality of analog-to-digital converters (ADCs) coupled to the photonic accelerator, and a plurality of digital equalizers coupled to the plurality of ADCs, wherein the digital equalizers are configured to set a frequency response of the hybrid analog-digital processing system to a second bandwidth greater than the first bandwidth.
Described herein are electronic-photonic packages including photonic integrated circuits (PIC) that are assembled using hybrid bonding techniques and that communicate with external electronic dies using through silicon vias (TSVs). PICs of the types described herein may be used to support optical-domain communication between electronic devices, whether in the form of inter-chip communication or intra-chip communication. A package may include a PIC comprising a photonic layer comprising a plurality of controllable photonic devices and a first plurality of TSVs, and an electronic layer hybrid-bonded to the photonic layer, the electronic layer comprising a second plurality of TSVs coupled to the first plurality of TSVs, and electronic circuitry configured to control the controllable photonic devices. The package may further include a first electronic die mounted on the PIC and coupled to the first plurality of TSVs or the second plurality of TSVs.
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
Described herein are electronic -photonic packages including photonic integrated circuits (PIC) that are assembled using hybrid bonding techniques and that communicate with external electronic dies using through silicon vias (TSVs). PICs of the types described herein may be used to support optical-domain communication between electronic devices, whether in the form of inter-chip communication or intra-chip communication. A package may include a PIC comprising a photonic layer comprising a plurality of controllable photonic devices and a first plurality of TSVs, and an electronic layer hybrid-bonded to the photonic layer, the electronic layer comprising a second plurality of TSVs coupled to the first plurality of TSVs, and electronic circuitry configured to control the controllable photonic devices. The package may further include a first electronic die mounted on the PIC and coupled to the first plurality of TSVs or the second plurality of TSVs.
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
G02B 6/42 - Coupling light guides with opto-electronic elements
09 - Scientific and electric apparatus and instruments
Goods & Services
(1) Lasers for use in optical communication; lasers for non-medical purposes for use on a single photonic circuit; optical communications technology, namely, photonic integrated circuits; integrated circuits; optical communications technology, namely, wavelength division multiplexing (WDM) devices.
70.
WAVELENGTH REMAPPING IN AN ON-CHIP WAVELENGTH DIVISION MULTIPLEXING (WDM) SOLUTION
Described herein are architectures configured to enable wavelength remapping in on-chip wavelength division multiplexing (WDM) optical systems. An optical switching network receives light having wavelengths corresponding to wavelength set A at a first subset of the plurality of inputs and light having wavelengths corresponding to wavelength set B at a second subset of the plurality of inputs. The wavelengths are received in accordance with a first spatial order. In response, the optical switching network may change the order from the first spatial order to a second spatial order. For example, the optical switching network may output light having wavelengths corresponding to wavelength set A at a first subset of the plurality of outputs and light having wavelengths corresponding to wavelength set B at a second subset of the plurality of outputs in accordance with the second spatial order.
Described herein are architectures configured to enable wavelength remapping in on-chip wavelength division multiplexing (WDM) optical systems. An optical switching network receives light having wavelengths corresponding to wavelength set A at a first subset of the plurality of inputs and light having wavelengths corresponding to wavelength set B at a second subset of the plurality of inputs. The wavelengths are received in accordance with a first spatial order. In response, the optical switching network may change the order from the first spatial order to a second spatial order. For example, the optical switching network may output light having wavelengths corresponding to wavelength set A at a first subset of the plurality of outputs and light having wavelengths corresponding to wavelength set B at a second subset of the plurality of outputs in accordance with the second spatial order.
Photonic interposers that enable low-power, high-bandwidth inter-chip (e.g., board-level and/or rack-level) as well as intra-chip communication are described. Described herein are techniques, architectures and processes that improve upon the performance of conventional computers. Some embodiments provide photonic interposers that use photonic tiles, where each tile includes programmable photonic circuits that can be programmed based on the needs of a particular computer architecture. Some tiles are instantiations of a common template tile that are stitched together in a 1D or a 2D arrangement. Some embodiments described herein provide a programmable physical network designed to connect pairs of tiles together with photonic links.
G02B 6/124 - Geodesic lenses or integrated gratings
G02B 6/13 - Integrated optical circuits characterised by the manufacturing method
G02B 6/42 - Coupling light guides with opto-electronic elements
G02B 6/43 - Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
H04B 10/079 - Arrangements for monitoring or testing transmission systemsArrangements for fault measurement of transmission systems using an in-service signal using measurements of the data signal
H04B 10/80 - Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups , e.g. optical power feeding or optical transmission through water
H04J 14/02 - Wavelength-division multiplex systems
Described herein are wavelength division multiplexing (WDM) transceivers configured to support fast, bidirectional communication over optical channels. An optical transceiver comprises a transmitter, a receiver, an input/output (I/O) port and an optical interleaver. The transmitter comprises a first bus waveguide and a plurality of optical modulators coupled to the first bus waveguide, each of the optical modulators being resonant at a respective wavelengths in a first wavelength set. The receiver comprises a second bus waveguide and a plurality of optical filters coupled to the second bus waveguide, each of the optical filters being resonant at a respective wavelength in a second wavelength set. The (I/O) port is coupled to an optical channel. The optical interleaver is configured to selectively couple light having wavelengths in the first wavelength set from the first waveguide bus to the I/O port, and selectively couple light having wavelengths in the second wavelength set from the I/O port to the second bus waveguide.
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
G02B 6/42 - Coupling light guides with opto-electronic elements
H04J 14/02 - Wavelength-division multiplex systems
Described herein are wavelength division multiplexing (WDM) transceivers configured to support fast, bidirectional communication over optical channels. An optical transceiver comprises a transmitter, a receiver, an input/output (I/O) port and an optical interleaver. The transmitter comprises a first bus waveguide and a plurality of optical modulators coupled to the first bus waveguide, each of the optical modulators being resonant at a respective wavelengths in a first wavelength set. The receiver comprises a second bus waveguide and a plurality of optical filters coupled to the second bus waveguide, each of the optical filters being resonant at a respective wavelength in a second wavelength set. The (I/O) port is coupled to an optical channel. The optical interleaver is configured to selectively couple light having wavelengths in the first wavelength set from the first waveguide bus to the I/O port, and selectively couple light having wavelengths in the second wavelength set from the I/O port to the second bus waveguide.
G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
Aspects of the present application relate to an optical phase shifter including a first waveguide defined in a first semiconductor layer, the first waveguide comprising a single-mode portion, a multi-mode portion, and a tapered portion coupling the single-mode portion to the multi-mode portion. A second waveguide is defined in a second semiconductor layer, the second waveguide having a tapered portion and a tip, wherein the tapered portion of the second waveguide overlaps with the tapered portion of the first waveguide. For tuning the phase change, a first electrically resistive path, defined at least partially in the first semiconductor layer, is included. The first electrically resistive path intersects the multi-mode portion of the first waveguide.
G02F 1/025 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on semiconductor elements having potential barriers, e.g. having a PN or PIN junction in an optical waveguide structure
Systems and methods for performing matrix operations using a photonic processor are provided. The photonic processor includes encoders configured to encode a numerical value into an optical signal and optical multiplication devices configured to output an electrical signal proportional to a product of one or more encoded values. The optical multiplication devices include a first input waveguide, a second input waveguide, a coupler circuit coupled to the first input waveguide and the second input waveguide, a first detector and a second detector coupled to the coupler circuit, and a circuit coupled to the first detector and second detector and configured to output a current that is proportional to a product of a first input value and a second input value.
G06E 1/04 - Devices for processing exclusively digital data operating upon the order or content of the data handled for performing computations using exclusively denominational number representation, e.g. using binary, ternary, decimal representation
Described herein are compact, power efficient photonic processors deigned to handle general matrix-matrix (GEMM) operations. A photonic processor may comprise a controller, an optical interferometer, a plurality of signal drivers, and an optical receiver. The controller is configured to obtain a vector of input values and a matrix of parameters. The optical interferometer comprises an output and a plurality of optical phase shifters. Each signal driver of the plurality of signal drivers is configured to control a respective phase shifter to phase shift light traveling in the optical interferometer based on i) a polarity set by a respective parameter of the matrix, and ii) an amount set by a respective input value of the vector. The optical receiver is coupled to the output of the optical interferometer.
Described herein are packages in which photonic chiplets are disposed in recesses defined on an underlying substrate. Positioning chiplets in this way allows short trace lengths between the electrical chips and the optical converters, V-groove fiber assemblies that can be attached along any direction of a photonic chiplet (north-south and/or west-east) and easy access to the electrical chips for power and signals. A package may include a substrate having a recess defined near an edge of the substrate, a photonic chiplet disposed in the recess, an electrical chiplet disposed at least in part on the photonic chiplet, and a fiber optically coupled to the photonic chiplet at the edge of the substrate. The electrical chiplet may be disposed in part on the photonic chiplet and in part on the top surface of the substrate.
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
Described herein are balanced, bidirectional, optical communication networks. These networks may be used in large-scale settings, including in networks including more than one hundred nodes or more than one thousands nodes. A network may include a plurality of nodes. Each node comprises a plurality of optical transceivers of a first type and a plurality of optical transceivers of a second type. The types differ from each other in a characteristic of light transmitted by the respective optical transceiver. The optical transceivers of the first type are in equal numbers across the plurality of nodes and the optical transceivers of the second type are also in equal numbers across the plurality of nodes. A plurality of optical channels connect the nodes with one another by coupling optical transceivers of the first type with optical transceivers of the second type. The optical channel support bidirectional communication between the connected nodes.
H04B 10/80 - Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups , e.g. optical power feeding or optical transmission through water
Aspects relate to a photonic processing system, a photonic processor, and a method of performing matrix-vector multiplication. An optical encoder may encode an input vector into a first plurality of optical signals. A photonic processor may receive the first plurality of optical signals; perform a plurality of operations on the first plurality of optical signals, the plurality of operations implementing a matrix multiplication of the input vector by a matrix; and output a second plurality of optical signals representing an output vector. An optical receiver may detect the second plurality of optical signals and output an electrical digital representation of the output vector.
G02F 1/21 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour by interference
G06T 1/20 - Processor architecturesProcessor configuration, e.g. pipelining
H04B 10/80 - Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups , e.g. optical power feeding or optical transmission through water
H04J 14/02 - Wavelength-division multiplex systems
Described herein are balanced, bidirectional, optical communication networks. These networks may be used in large-scale settings, including in networks including more than one hundred nodes or more than one thousands nodes. A network may include a plurality of nodes. Each node comprises a plurality of optical transceivers of a first type and a plurality of optical transceivers of a second type. The types differ from each other in a characteristic of light transmitted by the respective optical transceiver. The optical transceivers of the first type are in equal numbers across the plurality of nodes and the optical transceivers of the second type are also in equal numbers across the plurality of nodes. A plurality of optical channels connect the nodes with one another by coupling optical transceivers of the first type with optical transceivers of the second type. The optical channel support bidirectional communication between the connected nodes.
H04J 14/02 - Wavelength-division multiplex systems
H04B 10/80 - Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups , e.g. optical power feeding or optical transmission through water
H04Q 11/00 - Selecting arrangements for multiplex systems
Described herein are embodiments of a photonic computing system comprising one or more processors in communication with disaggregated memory through one or more optical channels. The disaggregated memory comprises multiple memory units placed on a photonic substrate that includes a photonic network that can be programmed to configure which of the memory units can be accessed by each of the processor(s). The disaggregated memory includes a memory controller for reading and writing data to/from the memory units. The memory controller may be configured to perform processing in concert with the processor(s).
G06F 3/00 - Input arrangements for transferring data to be processed into a form capable of being handled by the computerOutput arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
G06F 3/06 - Digital input from, or digital output to, record carriers
Described herein is a packaging approach that employs a remapping layer to maintain compatibility to different types of electronic chips while allowing chip designers to standardize the layout of the electrical interface of a photonic interposer. A remapping layer remaps the electrical interface of an electronic chip to the electrical interface of a photonic interposer. Remapping layers may be implemented in various ways, including for example as monolithic electronic interposers and/or as individual remapping chips. In some embodiments, to reduce manufacturing costs, remapping layers may be implemented using passive electronics (without transistors). Because remapping layers are significantly less costly to manufacture than photonic interposers, shifting the need to provide ad hoc electrical interfaces from the photonic interposer to the remapping layer enhances the applicability of photonic interposers in computational, telecom and datacom settings.
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
84.
POLARIZATION LOCKER FOR FIBER CONNECTIONS AND RELATED METHODS
Photonic interconnect systems are described. A fiber connects a first photonic integrated circuit (PIC) to a second PIC. The fiber is non-polarization maintaining and as a results creates polarization drift. As a result, the polarization appearing at the output of a fiber may be different from the polarization launched at the input of the fiber. To reduce the negative effects of polarization drift, each PIC may be equipped with a polarization locker. Control circuitry is configured to control the first and second polarization lockers by setting one of the first and second polarization lockers to an active configuration and setting the other of the first and second polarization lockers to a passive configuration. Controlling the polarization lockers in this way prevents inconsistencies in polarization without having to expend additional resources that would otherwise be required to communicate the phase shift across the fiber.
09 - Scientific and electric apparatus and instruments
Goods & Services
Lasers for use in optical communication; lasers for non-medical purposes for use on a single photonic circuit; optical communications technology, namely, wavelength division multiplexing (WDM) devices
86.
YIELD ENHANCEMENT TECHNIQUES FOR PHOTONIC COMMUNICATIONS PLATFORM
Described herein are techniques for yield enhancement in photonic communications platforms. A photonic communication platform may include a photonic substrate patterned with a plurality of photonic modules including at least first and second photonic modules, wherein the first and second photonic modules are copies of a common template photonic module. Yield enhancement may be accomplished using photonic redundancy and/or electronic redundancy. Photonic redundancy may involve redundant optical lanes provided in parallel to primary optical lanes. Electronic redundancy may involve use of additional electronic circuits or wires running in parallel to electronic circuits or wires. Defective circuits may be disabled to prevent negative impacts on other parts of the electronic system. This can be done by providing power-isolating switches that completely disable and isolate the defective circuits.
Techniques for efficiently tuning of optical resonant devices (e.g., micro-ring modulators (MRM) or add/drop filters) are described. The techniques described herein can be used in photonic communication systems that transmit data using several wavelengths of light sharing a common optical waveguide or a common fiber, e.g., wavelength division multiplexing (WDM) systems. These techniques may involve varying the way in which resonant wavelengths are mapped to the wavelengths of emission until it is determined that the power consumption is appropriate (e.g., below a certain threshold value). This significantly reduces the amount of power needed to ensure proper alignment between wavelength of emission and resonant wavelengths.
Described herein photonic interconnects based on glass interposers. Glass interposers of the types described herein are used to photonically interconnect multiple smaller photonic integrated circuits (PIC), as opposed to using a single, larger PIC. The typical yield of a glass interposer is significantly higher than the yield of a PIC. This is because glass interposers are passive in nature, while PICs include active photonic elements. Active photonic components (e.g., photonic transceivers and switches) tend to be more susceptible to manufacturing defects than passive photonic components (e.g., waveguides and couplers) because active components require additional manufacturing steps (e.g., ion implantation, sputtering, epitaxial growth, etc.). The approach described herein improves performance because instead of having to slice a large number of continuous reticles from a wafer, one can pick and choose reticles known to have yielded.
G02B 6/13 - Integrated optical circuits characterised by the manufacturing method
G02B 6/42 - Coupling light guides with opto-electronic elements
H01L 23/52 - Arrangements for conducting electric current within the device in operation from one component to another
H01L 23/532 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
H01L 23/544 - Marks applied to semiconductor devices, e.g. registration marks, test patterns
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
89.
OPTICAL COMMUNICATION SUBSTRATE USING GLASS INTERPOSER
Described herein photonic interconnects based on glass interposers. Glass interposers of the types described herein are used to photonically interconnect multiple smaller photonic integrated circuits (PIC), as opposed to using a single, larger PIC. The typical yield of a glass interposer is significantly higher than the yield of a PIC. This is because glass interposers are passive in nature, while PICs include active photonic elements. Active photonic components (e.g., photonic transceivers and switches) tend to be more susceptible to manufacturing defects than passive photonic components (e.g., waveguides and couplers) because active components require additional manufacturing steps (e.g., ion implantation, sputtering, epitaxial growth, etc.). The approach described herein improves performance because instead of having to slice a large number of continuous reticles from a wafer, one can pick and choose reticles known to have yielded.
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
H04B 10/80 - Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups , e.g. optical power feeding or optical transmission through water
Systems and methods for performing matrix operations using a photonic processor are provided. The photonic processor includes encoders configured to encode a numerical value into an optical signal and optical multiplication devices configured to output an electrical signal proportional to a product of one or more encoded values. The optical multiplication devices include a first input waveguide, a second input waveguide, a coupler circuit coupled to the first input waveguide and the second input waveguide, a first detector and a second detector coupled to the coupler circuit, and a circuit coupled to the first detector and second detector and configured to output a current that is proportional to a product of a first input value and a second input value.
G06E 1/04 - Devices for processing exclusively digital data operating upon the order or content of the data handled for performing computations using exclusively denominational number representation, e.g. using binary, ternary, decimal representation
Described herein are optical fiber shuffle circuits designed to programmably interconnect any number of ports without having to rely on thousands of optical fibers or more. The optical fiber shuffle circuits developed by the inventors and described herein can be built into photonic interposers. Photonic interposers of the types described herein include, for example, semiconductor substrates patterned (photolithographically) with photonic integrated circuits such as waveguides, modulators, photodetectors, switches, couplers, etc., or any combination thereof.
Hybrid analog-digital processing systems are described. An example of a hybrid analog-digital processing system includes photonic accelerator configured to perform matrix-vector multiplication using light. The photonic accelerator exhibits a frequency response having a first bandwidth (e.g., less than 3 GHz). The hybrid analog-digital processing system further includes a plurality of analog-to-digital converters (ADCs) coupled to the photonic accelerator, and a plurality of digital equalizers coupled to the plurality of ADCs, wherein the digital equalizers are configured to set a frequency response of the hybrid analog-digital processing system to a second bandwidth greater than the first bandwidth.
Described herein ate optical fiber shuffle circuits designed to programmably interconnect any number of ports without having to rely on thousands of optical fibers or more. The optical fiber shuffle circuits developed by the inventors and described herein can be built into photonic interposers. Photonic interposers of the types described herein include, for example, semiconductor substrates patterned (photolithographically) with photonic integrated circuits such as waveguides, modulators, photodetectors, switches, couplers, etc., or any combination thereof.
H04J 14/02 - Wavelength-division multiplex systems
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
Provided herein are optical fiber arrays and optical assemblies included optical fiber arrays. The optical fiber array includes a fiber array chip that has first optical connections disposed on a first edge of the fiber array chip and second optical connections disposed on a second edge of the fiber array chip. Optical fibers are coupled to the first optical connections. Active devices (e.g., photonic and/or electronic devices) are disposed on the fiber array chip. The optical fiber array is removably, optically couplable to another optical component such as a photonic integrated circuit.
G02B 6/42 - Coupling light guides with opto-electronic elements
G02B 6/43 - Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
G02B 6/38 - Mechanical coupling means having fibre to fibre mating means
Provided herein are optical fiber arrays and optical assemblies included optical fiber arrays. The optical fiber array includes a fiber array chip that has first optical connections disposed on a first edge of the fiber array chip and second optical connections disposed on a second edge of the fiber array chip. Optical fibers are coupled to the first optical connections. Active devices (e.g., photonic and/or electronic devices) are disposed on the fiber array chip. The optical fiber array is removably, optically couplable to another optical component such as a photonic integrated circuit.
Described herein are photonic communication platforms that permit use by multiple users in a secure way. A platform comprises a substrate, a first photonic circuit monolithically integrated with the substrate, and a second photonic circuit monolithically integrated with the substrate. The first photonic circuit is patterned with a first plurality of photonic modules, the photonic modules of the first plurality being copies of a common template photonic module The second photonic circuit is patterned with a second plurality of photonic modules, the photonic modules of the second plurality being copies of the common template photonic module. A photonic link couples the first photonic circuit to the second photonic circuit. A controller optically isolates the first photonic circuit from the second photonic circuit by optically interrupting the photonic link.
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
97.
Optical flow switching using photonic integrated circuits
Provided herein are optical flow switches, and optical flow switch packages, implemented using photonic switches. The optical flow switch includes a network of photonic switches arranged between input and output ports of the optical flow switch. The network of photonic switches spans two or more reticles, and the two or more reticles may include photonic switching arrangements corresponding to repeated reticle masks or sets of reticle masks. The optical flow switch may be mounted to a glass substrate to form an optical flow switch package.
G02B 6/35 - Optical coupling means having switching means
G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
98.
HYBRID ANALOG-DIGITAL MATRIX PROCESSOR AND RELATED METHOD FOR PERFORMING FOURIER TRANSFORM
Hybrid analog-digital processors and related methods are described. A hybrid analog-digital processor or related method may carry out an algorithm for efficiently performing a Fourier Transform with lower power consumption and higher speed compared with fully-digital processors. A hybrid analog-digital processor or related method may use a digital processor to perform some portions of a Fourier Transform, such as sizing signals for input into an analog accelerator (such as a photonic accelerator). The analog accelerator may be configured to perform some portions of the Fourier Transform by performing matrix-vector multiplication on the sized signals using light. Further efficiency may be provided by in some environments by batching signals that are input into the analog accelerator into 2D arrays, or by performing matrix-vector multiplication using a submatrix of a full Fourier Transform matrix.
Provided herein are optical flow switches, and optical flow switch packages, implemented using photonic switches. The optical flow switch includes a network of photonic switches arranged between input and output ports of the optical flow switch. The network of photonic switches spans two or more reticles, and the two or more reticles may include photonic switching arrangements corresponding to repeated reticle masks or sets of reticle masks. The optical flow switch may be mounted to a glass substrate to form an optical flow switch package.
Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
G02B 6/122 - Basic optical elements, e.g. light-guiding paths
G02B 6/13 - Integrated optical circuits characterised by the manufacturing method
G02B 6/136 - Integrated optical circuits characterised by the manufacturing method by etching
H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or
H04J 14/02 - Wavelength-division multiplex systems
