Abstract

Provided is a thermal-and UV-curable (meth) acrylate composition comprising: (A) an epoxy resin, (B) a (meth) acrylate, (C) a photoinitiator, (D) a thiol curing agent, and (E) a catalyst mixture containing (e-1) an epoxy-adduct polyamine, (e-2) a microcapsule type hardener for an epoxy resin comprising a core and a shell, and (e-3) a urea-modified imidazole, wherein the weight ratio of the component (e-2) to the component (e-3) is not lower than 2.1. Furthermore, a method for preparing the composition, a method for curing the composition, a cured product obtained from the composition or by the curing method, an article comprising the cured product, and a use of the composition or the cured product in assembling a camera module are also provided.

IPC Classes  ?

• C09J 4/06 - Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups
• C08G 59/68 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the catalysts used
• C09J 133/14 - Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
• C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used

Abstract

An electrically conductive moisture-curable composition comprising: A) a polyfunctional silane compound having at least two alkoxysilane groups, B) a moisture scavenger, C) an alkoxysilane isocyanurate compound and optionally an epoxy functional silane coupling agent,(D) a photo-acid generator, which is a sulfonium salt, E) a moisture-curing catalyst, and(F) an electrically conductive filler is provided. Also disclosed is a method of applying the composition, a cured product of the composition, an article comprising the cured product, and a use of the composition or the cured product thereof.

IPC Classes  ?

• C08L 83/04 - Polysiloxanes
• C09J 9/02 - Electrically-conducting adhesives
• B01J 31/12 - Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides containing organo-metallic compounds or metal hydrides
• C09J 183/04 - Polysiloxanes
• C09J 201/10 - Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups containing hydrolysable silane groups
• C08L 101/10 - Compositions of unspecified macromolecular compounds characterised by the presence of specified groups containing hydrolysable silane groups
• C08K 5/00 - Use of organic ingredients

Abstract

A one-part curable epoxy composition comprising: (A) from 20 to 90 wt. % of a non-aromatic epoxy resin, based on the total weight of the composition; (B) a non-aromatic curing agent and optionally a non-aromatic accelerator, which is a combination of a dicyandiamide and a non-aromatic urea accelerator, or a dihydrazide represented by the following general formula (I) : wherein R is an organic radical containing no heterocycle; (C) a UV stabilizer; and (D) a rubber with a core-shell structure. And also a cured product of the said composition, an article comprising the cured product, and use of the said composition or the cured product in electronic device.

IPC Classes  ?

• C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
• C09J 163/02 - Polyglycidyl ethers of bis-phenols
• C08L 21/02 - Latex

Abstract

The present invention relates to a composition for a high-resilient thermally conductive gap pad, to a gap pad made from said composition, as well as to a method of preparing a gap pad with said composition.

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H01L 23/373 - Cooling facilitated by selection of materials for the device

Abstract

The present invention provides a two-part thermally conductive silicone adhesive composition featuring favorable storage stability and high dispensing stability while maintain good thermal conductivity.

IPC Classes  ?

• C09J 183/07 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
• C08L 83/07 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
• C08K 3/22 - OxidesHydroxides of metals

Abstract

Provided is a radiation-curable adhesive composition comprising (A) at least one cationically polymerizable component, (B) at least one photoinitiator system comprising (B1) at least one ferrocenium salt, and (B2) at least one aromatic iodonium salt, (C) at least one peroxide, and (D) optionally at least one free radically polymerizable compound; wherein the mass ratio between the component (B2) to the component (B1) is from 0.25 to less than 4; and the mass ratio between the component (C) to the component (B1) is from 0.5 to 8.

IPC Classes  ?

• C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
• C09J 171/00 - Adhesives based on polyethers obtained by reactions forming an ether link in the main chainAdhesives based on derivatives of such polymers
• C08J 3/28 - Treatment by wave energy or particle radiation

Abstract

The present invention provides an aqueous polymer emulsion with satisfactory resistance to electrochemical deposition property and good porosity sealing performance on casting metals or parts co-molded by two different metal materials. The aqueous polymer emulsion comprises at least one (meth) acrylic polymer prepared by at least two monomers comprising at least one alkyl (meth) acrylate and at least one unsaturated carboxylic acid, at least one corrosion inhibitor, and at least one chelating agent, wherein the at least one unsaturated carboxylic acid is present in an amount of less than 3.5% by weight, based on the total weight of the monomers.

IPC Classes  ?

• C08L 33/08 - Homopolymers or copolymers of acrylic acid esters
• C08L 33/10 - Homopolymers or copolymers of methacrylic acid esters
• C08L 33/02 - Homopolymers or copolymers of acidsMetal or ammonium salts thereof
• B22F 3/26 - Impregnating
• C09K 3/12 - Materials not provided for elsewhere for stopping leaks, e.g. in radiators or in tanks

Abstract

5050 particles size of more than 70 μm; (D) a thermal conductive filler other than component (C); (E) a silane coupling agent; and (F) a catalyst, which features favorable combination of properties including good flowability and high thermal conductivity when cured.

IPC Classes  ?

• C09D 183/04 - Polysiloxanes
• C09D 183/05 - Polysiloxanes containing silicon bound to hydrogen
• C09D 183/07 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
• C08K 3/04 - Carbon
• C08K 3/08 - Metals

Abstract

The present invention provides a moisture-curable polyurethane hot melt adhesive composition comprising (A) at least one polyurethane prepolymer obtained by reacting a reactant mixture comprising (A1) a polyol mixture comprising: (a) at least one polyester polyol, and (b) at least one polyether polyol, and (A2) at least one polyisocyanate having at least two isocyanate groups in one molecule; (B) at least one (meth) acrylic polymer present in an amount of no greater than 14%by weight based on the total weight of the adhesive composition, and (C) at least one amorphous polyalphaolefin having a softening point of less than 100℃, present in an amount of no greater than 20%by weight, based on the total weight of the adhesive composition.

IPC Classes  ?

• C09J 175/04 - Polyurethanes
• C09J 175/06 - Polyurethanes from polyesters
• C09J 175/08 - Polyurethanes from polyethers
• C08L 75/04 - Polyurethanes
• C08L 33/08 - Homopolymers or copolymers of acrylic acid esters
• C08L 33/10 - Homopolymers or copolymers of methacrylic acid esters
• C08L 33/12 - Homopolymers or copolymers of methyl methacrylate
• C08L 23/00 - Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bondCompositions of derivatives of such polymers

Abstract

Provided is a thermally conductive adhesive composition, comprising: a) from 0.5 to 30%, preferably from 2 to 20% by weight of an epoxy resin, b) from 0.5 to 30%, preferably from 2 to 20% by weight of an anhydride, c) from 0.1 to 5%, preferably from 0.5 to 3.5% by weight of a catalyst, and d) from 50 to 98%, preferably from 60 to 95% by weight of a metal filler, based on the total weight of the thermally conductive adhesive composition, wherein the catalyst has a core-shell structure with a shell encapsulating a core, the core of the catalyst comprises an amine-based compound, and the shell of the catalyst is prepared by reacting at least two of an epoxy resin, an amine-based compound, and a polyisocyanate. Also provided are a preparation method and use of the thermally conductive adhesive composition.

IPC Classes  ?

• C09J 9/00 - Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
• C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins

Abstract

505050 particle size of greater than 5 μm; (D) at least one silane coupling agent; and (E) at least one platinum-based curing catalyst; wherein component (C1) is present in an amount of less than 62%by weight based on the weight of the composition and the component (C2) is present in an amount of less than 80%by weight based on the weight of the composition, which features favorable combination of properties including good flowability, as well as high thermal conductivity and good lap shear strength when cured.

IPC Classes  ?

• C08L 83/07 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
• C08L 83/05 - Polysiloxanes containing silicon bound to hydrogen
• C08G 77/20 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
• C08G 77/12 - Polysiloxanes containing silicon bound to hydrogen
• C08K 3/20 - OxidesHydroxides
• C08K 5/541 - Silicon-containing compounds containing oxygen

Abstract

Provided is a curable composition comprising (A) at least one (meth) acrylate; (B) at least one diaryliodonium salt; and (C) at least one latent amine catalyst, which can thermally be curable at a temperature of lower than 100℃ and can be also thermally curable and radiation curable. The curable composition exhibits favorable adhesion strength on various substrates when cured.

IPC Classes  ?

• C09J 4/00 - Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
• C09J 4/02 - Acrylmonomers
• C09J 11/06 - Non-macromolecular additives organic

Abstract

Disclosed is a radiation curable (meth) acrylic adhesive composition consisting essentially of: i) a (meth) acrylated polydiene resin; ii) a multi-functional (meth) acrylic monomer component; iii) a mono-functional (meth) acrylic monomer component; and iv) a photo initiator component.

IPC Classes  ?

• C08F 136/06 - Butadiene
• C09J 4/02 - Acrylmonomers
• C08F 8/30 - Introducing nitrogen atoms or nitrogen-containing groups

Abstract

The present invention relates to a curable adhesive composition comprising (A) at least one maleimide compound, (B) at least one thiol compound having at least two mercapto groups and no siloxane group in the molecule; (C) at least one latent curing agent; and (D) optionally, at least one photo radical polymerization initiator. The cured product derived from the present adhesive composition features high moisture resistant property. Furthermore, the invention also provided an article comprising the cured adhesive composition, and the use thereof.

IPC Classes  ?

• C09J 135/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least another carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereofAdhesives based on derivatives of such polymers
• C09J 179/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
• C09J 133/24 - Homopolymers or copolymers of amides or imides
• C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
• C09J 115/00 - Adhesives based on rubber derivatives
• C09J 11/06 - Non-macromolecular additives organic

Abstract

Disclosed is a conductive epoxy resin composition, in particular for bonding copper substrate, and the cured product, and the use thereof as well as a semiconductor device comprising the cured product.

IPC Classes  ?

• C08G 59/14 - Polycondensates modified by chemical after-treatment
• C08G 59/22 - Di-epoxy compounds
• C08G 59/38 - Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
• C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
• C09J 9/02 - Electrically-conducting adhesives

Abstract

A moisture-curable polyurethane hot melt adhesive composition having good oleic acid resistance, especially when exposed to 100%pure oleic acid under aging condition of 65 ℃ and 90%relative humidity, wherein the adhesive composition comprises, consists essentially of or consists of a moisture-curable polyurethane prepolymer, the prepolymer being a reaction product of at least one amorphous polyester polyol containing an aromatic group and at least one polyisocyanate, preferably at least one polyisocyanate containing an aromatic group, wherein the aromatic group is comprised in the polyurethane prepolymer in a content of no less than 23 wt. %, preferably no less than 25 wt. %, more preferably no less than 30 wt. %.

IPC Classes  ?

• C09J 175/06 - Polyurethanes from polyesters
• C08G 18/42 - Polycondensates having carboxylic or carbonic ester groups in the main chain
• C08G 18/76 - Polyisocyanates or polyisothiocyanates cyclic aromatic
• B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties

Abstract

Disclosed is an aqueous polymer dispersion comprising at least one polymer having a carboxyl group and optionally an additional functional group selected from hydroxy, isocyanate, fluoro, phosphate, hydrazide, acetoacetate group and combination thereof, in which the polymer has a glass transition temperature of larger than -40°C and less than 35°C, and the aqueous polymer dispersion has a solid content of larger than 50% by weight.

IPC Classes  ?

• B22F 3/26 - Impregnating
• C09K 3/12 - Materials not provided for elsewhere for stopping leaks, e.g. in radiators or in tanks
• C08L 33/10 - Homopolymers or copolymers of methacrylic acid esters
• C09D 133/10 - Homopolymers or copolymers of methacrylic acid esters

Abstract

The present invention provides a hotmelt adhesive composition, comprising (A) at least one polyurethane prepolymer obtained by reacting (A1) polyols comprising: (a) at least one polyester polyol, and (b) at least one polyether polyol, with (A2) at least one polyisocyanate having at least two isocyanate groups in one molecule; (B) at least one thermoplastic resin; and (C) at least one aspect ratio promoter in an amount of no more than 10% by weight based on the total weight of the composition.

IPC Classes  ?

• C09J 175/04 - Polyurethanes
• C08G 18/10 - Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
• C09J 11/04 - Non-macromolecular additives inorganic

Abstract

A silver sintering composition containing a copper alloy is disclosed, which is capable of being stably sintered on various metal substrates such as copper, gold or silver with good adhesion and sintering strength.

IPC Classes  ?

• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Abstract

The present disclosure provides a rework device and a rework method. The rework device includes a first supporting component, a second supporting component and a heating component disposed between the first supporting component and the second supporting component and being in flush with the second supporting component. The first supporting component is inclined at an angle with respect to the heating component. This type of rework device and rework method has the advantages of simple structure, low cost and convenient operation.

IPC Classes  ?

• H01L 31/05 - Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
• H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof

Abstract

A vacuum impregnation device (1) for vacuum impregnating a workpiece (3), where the vacuum impregnation device (1) including a vacuum impregnation tank (5) for storing glue(13), the vacuum impregnation tank (5) including a side wall(15); a sliding block (7) coupled to the side wall (15) of the vacuum impregnation tank (5), the sliding block (7) being adapted for supporting the workpiece (3) above the glue (13); and an electromagnetic controller (11), the electromagnetic controlle r(11) being disposed outside the vacuum impregnation tank (5) and being operative to move the sliding block (7) towards the side wall (15) of the vacuum impregnation tank (5) such that the workpiece (3) is released and drops into the glue (13). The vacuum impregnation device(1) has the advantages of simple structure, low cost and convenient operation.

IPC Classes  ?

• B05C 3/02 - Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material
• B22F 3/26 - Impregnating

Abstract

Provided is a curable adhesive composition for die attach that can eliminate the void issue, minimize the fillet, and has lower bond line thickness and tilt trend, when cured.

IPC Classes  ?

• C09J 9/02 - Electrically-conducting adhesives
• C09J 11/04 - Non-macromolecular additives inorganic
• C08K 3/08 - Metals
• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits

Abstract

This invention relates to a foaming composition, comprising at least one ethylene-vinyl acetate (EVA) copolymer; at least one foaming agent; at least one peroxide compound; at least one polyamine; at least one crosslinking enhancer; at least one primary antioxidant; and at least one secondary antioxidant; the content of the crosslinking enhancer is from 0.1 to 3%by weight based on the total weight of the composition. A foaming article cured from the foaming composition under the temperature range of 80 to 120°C according to the present invention exhibits high initial volume expansion ratio at the baking window from 130 to 200°C and shows excellent stability after storage.

IPC Classes  ?

• C08J 9/06 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent
• C08L 31/04 - Homopolymers or copolymers of vinyl acetate
• C08K 5/14 - Peroxides
• C08K 5/17 - AminesQuaternary ammonium compounds
• C08K 5/103 - EstersEther-esters of monocarboxylic acids with polyalcohols
• C08K 5/40 - ThiuramsulfidesThiurampolysulfides, e.g. compounds containing groups
• C08K 5/39 - Thiocarbamic acidsDerivatives thereof, e.g. dithiocarbamates
• C08K 5/378 - Sulfides containing heterocyclic rings
• C08K 5/13 - PhenolsPhenolates
• C08K 5/49 - Phosphorus-containing compounds
• C08K 5/36 - Sulfur-, selenium-, or tellurium-containing compounds

Abstract

Provided herein is a photoresist stripper composition, which comprises at least one choline compound, at least one polar aprotic solvent, and water. The weight percentage of the choline compound is from 2.5 to 50 %, preferably from 5 to 50%, more preferably from 7 to 30%, and most preferably from 9 to 18% by weight based on the total weight of the composition. The photoresist stripper composition exhibits excellent photoresist cleaning performance and low etching to the substrate.

IPC Classes  ?

• G03F 7/42 - Stripping or agents therefor
• C11D 7/32 - Organic compounds containing nitrogen

Abstract

A UV curable adhesive composition comprises at least one (meth) acrylate monomer; at least one urethane (meth) acrylate oligomer comprising an unsaturated aliphatic main chain, and having a number average molecular weight of 5000-35000 g/mol; and at least one photoinitiator. The UV curable adhesive composition exhibits low dielectric constant and good thermal shock resistance.

IPC Classes  ?

• C08F 290/06 - Polymers provided for in subclass
• C09J 4/02 - Acrylmonomers

Abstract

A radiation curable sealant composition particularly suitable for producing a liquid crystal display is disclosed. The sealant composition contains: one or more curable resins having a group selected from epoxy group, (meth) acryloyl group, maleimide group, and combination thereof, and a latent curing agent, in which the molar equivalent ratio of maleimide group to (meth) acryloyl group and/or epoxy group in the one or more curable resins is larger than 0.2. The radiation curable sealant composition possesses an excellent gel time under UV curing and an improved resistance to liquid crystal penetration and liquid crystal contamination as well as a good adhesion and reliable performance.

IPC Classes  ?

• C08L 79/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• C09K 3/10 - Materials not provided for elsewhere for sealing or packing joints or covers
• G02F 1/1339 - GasketsSpacersSealing of cells

Abstract

A thermally curable sealant composition comprises one or more thermally curable resins having a group selected from epoxy group, (meth) acryloyl group, maleimide group, and combination thereof, and a latent curing agent, in which the molar equivalent ratio of epoxy group to (meth) acryloyl group and/or maleimide group in the one or more thermally curable resins is from 0.1 to 5.0. The thermally curable sealant composition possesses an excellent gel time at elevated temperature and an improved resistance to liquid crystal penetration and liquid crystal contamination, a good adhesion and a good reliability.

IPC Classes  ?

• C09K 3/10 - Materials not provided for elsewhere for sealing or packing joints or covers
• C08G 59/17 - Polycondensates modified by chemical after-treatment by monocarboxylic acids or by anhydrides, halides or low-molecular-weight esters thereof by acrylic or methacrylic acid
• C08G 59/44 - Amides
• C08F 290/14 - Polymers provided for in subclass
• G02F 1/1339 - GasketsSpacersSealing of cells

Abstract

A cationically curable sealant composition for liquid crystal sealing is suitable to be used in one drop filling (ODF) process for manufacturing liquid crystal display device without the concern of moisture resistance and liquid crystal penetration. The cationically curable sealant composition comprises an epoxy resin selected from phenol novolac epoxy resin, dicyclopentadiene type epoxy resin, and combination thereof; and a diaryliodonium fluorine photoinitiator represented by formula (1), wherein R 1 and R 2 represent each independently hydrogen, an optionally substituted alkyl, an optionally substituted cycloalkyl, an optionally substituted alkoxy, or carboxyl or its ester, M represents As, P, Sb or B, X represents F or C 6F 5, and n is 4 or 6. In addition, a process of producing a liquid crystal display having a liquid crystal layer between a first substrate and a second substrate, comprises steps of: applying a cationically curable sealant composition on a sealing region at a periphery of a surface of the first substrate; radiation curing the composition, and obtaining a partially cured product; dropping liquid crystal on a central area encircled by the sealing region of the surface of the first substrate or the corresponding area of the second substrate, and forming the liquid crystal layer; overlaying the second substrate on the first substrate; and radiation curing the partially cured product.

IPC Classes  ?

• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• C08L 63/04 - Epoxynovolacs
• C09K 3/10 - Materials not provided for elsewhere for sealing or packing joints or covers
• C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
• C09J 163/04 - Epoxynovolacs

Abstract

An improved one-drop-filling process of producing a liquid crystal display having a liquid crystal layer between a first substrate and a second substrate comprises steps of applying a curable resin composition on a sealing region at a periphery of a surface of the first substrate; radiation curing the curable resin composition, and obtaining a partially cured product; dropping liquid crystal on a central area encircled by the sealing region of the surface of the first substrate or the corresponding area of the second substrate, and forming the liquid crystal layer; overlaying the second substrate on the first substrate; and thermal curing the partially cured product.

IPC Classes  ?

• G02F 1/1339 - GasketsSpacersSealing of cells

Abstract

An improved one-drop-filling process of producing a liquid crystal display having a liquid crystal layer between a first substrate and a second substrate, comprises steps of applying a thermally curable resin composition on a sealing region at a periphery of a surface of the first substrate; conducting a first thermal curing of the thermally curable resin composition at a temperature of 40℃ to 75℃, and obtaining a partially cured product; dropping liquid crystal on a central area encircled by the sealing region of the surface of the first substrate or the corresponding area of the second substrate, and forming the liquid crystal layer; overlaying the second substrate on the first substrate; and conducting a second thermal curing of the partially cured product.

IPC Classes  ?

• G02F 1/1339 - GasketsSpacersSealing of cells

Abstract

An electrically conductive composition for use in the preparation of an electrically conductive network, said composition comprising, based on the total weight of the composition: a) from 75 to 98 wt.％ of a silver powder having a tap density of at least 4.0 g/cm 3 and a specific surface area of less than 1.5 m 2/g; b) from 1 to 10 wt.％ of a binder resin; c) from 0 to 5 wt.％ of a hardener; and, d) from 0 to 10 wt.％ of solvent, wherein said composition is characterized in that, when heated to a temperature at which the silver powder starts to sinter, the binder resin is not yet fully cured or fully solidified. The composition could effectively deposit a metallic network in ohmic contact with a substrate such that the contacting network will be characterized by a high conductivity, whereby resistive losses are minimized, and a low contact resistance with the substrate.

IPC Classes  ?

• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Abstract

Provided is an electrically conductive composition for use in the preparation of an electrically conductive network, said composition comprising, based on the total weight of the composition: a) from 75 to 98 wt % of a silver powder having a tap density of at least 4.0 g/cm 3 and a specific surface area of less than 1.5 m 2/g; b) from 1 to 10 wt % of a binder resin; c) from 0 to 5 wt % of a hardener; and, d) from 0 to 10 wt % of solvent, wherein said composition is characterized in that, when heated to a temperature at which the silver powder starts to sinter, the binder resin is not yet fully cured or fully solidified.

IPC Classes  ?

• C08K 3/08 - Metals
• C08L 63/02 - Polyglycidyl ethers of bis-phenols
• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
• H01L 31/02 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof - Details

Abstract

The present invention relates to a conductive compositions for low frequency EMI shielding. An EMI shielding composition according to the present invention comprises a resin comprising a thermoplastic resin and/or a thermoset resin, a solvent and/or a reactive diluent and particles, wherein said particles comprise a mixture of magnetic particles and electrically conductive particles or magnetic particles coated with electrically conductive material or a mixture of magnetic particles coated with electrically conductive material and electrically conductive particles and wherein, said composition comprises ≥ 10％magnetic particles by weight, by total weight of the composition. The EMI shielding composition according to the present invention has good electrical and magnetic conductivity and is suitable as a drop-in solution for EMI shielding in a wide frequency range, and especially at low frequency ranges.

IPC Classes  ?

• H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
• C09K 3/00 - Materials not provided for elsewhere

Abstract

A conductive paste composition for solar photovoltaic cells is provided, which comprises metal particles dispersed in a suitable carrier therefor, wherein said carrier comprises a solvent and a resin, and wherein at least a portion of said metal particles are characterized by having a Ψ value, as defined by X-ray diffraction < 0.0020, having at least 50％ degree of crystallinity, and being anisotropic with respect to crystallographic direction.

IPC Classes  ?

• H01L 31/0224 - Electrodes

Abstract

The present invention relates to compositions that are suitable for use as electrically conductive inks in the fabrication of electronic devices, such as c-Si solar modules. The electrically conductive ink comprises a) one or more aromatic resins; b) electrically conductive silver particles having an average particle size of 1 μm to 40 μm, and a tap density of 1.5 g/cm 3 to 6.5 g/cm 3; and c) one or more organic solvents. The present invention further relates to a method of forming an electrically conductive pathway on a substrate and to a method of forming a bonded assembly using said electrically conductive ink.

IPC Classes  ?

• C09D 11/52 - Electrically conductive inks
• H01L 31/0224 - Electrodes
• H01L 31/02 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof - Details
• H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof

Abstract

This invention is an adhesive composition that has sufficient mechanical and adhesive strength to withstand manufacturing operations at temperatures between 125° to 210°C without first being cured. In brief, the cure after the die attach operation is skipped, and the adhesive can perform without out-gassing and creating voids through the wire bonding operation, at temperatures typically 125° to 210°C, and molding operation, at temperatures typically 170° to 80°C. The adhesive composition comprises (i) a low glass transition (Tg) acrylate monomer, (ii) a difunctional acrylate/epoxy compound, (iii) a phenoxy resin, and (iv) a solid epoxy resin.

IPC Classes  ?

• C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins

Abstract

The present invention relates to compositions that are suitable for use as electrically conductive inks in the fabrication of electronic devices, such as c-Si solar modules. The electrically conductive ink comprises a) one or more aromatic resins; b) electrically conductive silver particles having an average particle size of 1 μm to 40 μm, and a tap density of 1.5 g/cm3 to 6.5 g/cm3; and c) one or more organic solvents. The present invention further relates to a method of forming an electrically conductive pathway on a substrate and to a method of forming a bonded assembly using said electrically conductive ink.

IPC Classes  ?

• C09D 11/52 - Electrically conductive inks
• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Abstract

The present invention relates to compositions that are suitable for use as electrically conductive inks in the fabrication of electronic devices, such as c-Si solar modules. The electrically conductive ink comprises a) one or more aromatic resins; b) electrically conductive silver particles having an average particle size of 1 μm to 40 μm, and a tap density of 1.5 g/cm3 to 6.5 g/cm3; and c) one or more organic solvents. The present invention further relates to a method of forming an electrically conductive pathway on a substrate and to a method of forming a bonded assembly using said electrically conductive ink.

IPC Classes  ?

• C09D 11/10 - Printing inks based on artificial resins
• C08L 71/00 - Compositions of polyethers obtained by reactions forming an ether link in the main chainCompositions of derivatives of such polymers
• H05K 1/02 - Printed circuits Details
• C08K 3/08 - Metals

Abstract

Provided is a one part liquid underfill composition comprising an epoxy resin, a latent epoxy curing agent, a photocurable resin or monomer, a photoinitiator, an optional filler, and an optional thermal initiator. Also provided is a packaging process using the underfill composition.

IPC Classes  ?

• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• C08L 33/08 - Homopolymers or copolymers of acrylic acid esters
• C08L 33/10 - Homopolymers or copolymers of methacrylic acid esters
• C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings

Abstract

A flexible conductive ink composition comprises (A) a resin binder, (B) silver-plated core conductive particles, and (C) conductive particles having a surface area at least 1.0 m2/g.

IPC Classes  ?

• H01B 1/20 - Conductive material dispersed in non-conductive organic material
• H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material

Abstract

A novel conductive coating for capacitors and a capacitor employing the conductive coating are provided. The conductive coating includes two types of coatings, i.e. thermosetting conductive coating and thermoplastic conductive coating. The thermosetting conductive coating includes an epoxy resin, a curing agent for the epoxy resin, nonmetallic silver-plated particles and a solvent. The thermoplastic conductive coating includes a thermoplastic resin, nonmetallic silver-plated particles and a solvent; wherein the thermoplastic resin is a fluorine rubber.

IPC Classes  ?

• C09D 5/24 - Electrically-conducting paints
• C09D 163/02 - Polyglycidyl ethers of bis-phenols
• C09D 163/04 - Epoxynovolacs
• C09D 127/12 - Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogenCoating compositions based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
• C09D 127/14 - Homopolymers or copolymers of vinyl fluoride
• C09D 127/16 - Homopolymers or copolymers of vinylidene fluoride
• C09D 127/18 - Homopolymers or copolymers of tetrafluoroethene
• C09D 127/20 - Homopolymers or copolymers of hexafluoropropene
• C09D 127/22 - Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogenCoating compositions based on derivatives of such polymers modified by chemical after-treatment
• H01G 4/00 - Fixed capacitorsProcesses of their manufacture

Abstract

Transparency, mechanical strength and resistance against heat as well as photo-degradation of a silicone-based curable composition shall be improved. This is achieved by providing a curable composition comprising: (A) at least one organopolysiloxane represented by the composition formula (1): (R13Si01/2)a(R12Si02/2)b(R1 R2SiO2/2)c(R1SiO3/2)d(R2SiO3/2)e(R12R2SiO1/2)f (1), wherein each R1 independently represents a monovalent organic group having 1 to 20 carbon atoms or an OH group with the proviso that at each silicon-atom bearing no R2 at least one R1 represents a monovalent organic group having 1 to 20 carbon atoms, each R2 independently represents a methacryloxyalkyl group having 5 to 20 carbon atoms and a, b, c, d, e, f each represent the fraction of the number of the respective units based on the number of all units of the organopolysiloxane and satisfy a ≥ 0, b ≥ 0, c ≥ 0, d ≥ 0, e ≥ 0, f ≥ 0 and also satisfy c+e > 0 and a+b+c+d+e+f = 1; and (B) at least one curing catalyst. A transparent product can be obtained after curing of the aforementioned silicone composition that exhibits excellent discoloration resistance and good mechanical strength. Therefore, the product is ideal for encapsulation of LED (light emitting device) elements.

IPC Classes  ?

• C08L 83/04 - Polysiloxanes
• C08G 77/04 - Polysiloxanes

Abstract

A conductive curable composition filled with silver coated material, and more particularly, an organic curable composition comprising micron meter scale fine silver coated material with flaky shape, which have stabilized against premature reaction by the addition of chelating agents, and their application in die attach, and a method for preparing the same is provided herein.

IPC Classes  ?

• C08K 3/08 - Metals
• C09J 9/02 - Electrically-conducting adhesives
• C09J 11/04 - Non-macromolecular additives inorganic
• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
• C09J 133/08 - Homopolymers or copolymers of acrylic acid esters
• C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
• C09J 175/04 - Polyurethanes
• C09J 183/04 - Polysiloxanes