A posture holding mat according to the present invention is a mat which has a predetermined thickness to hold a posture, the posture holding mat includes: an elastic foam; and a cuttable line which allows the mat to be cut to a predetermined size and in the cuttable line, cuts penetrating in the direction of the thickness are provided at a predetermined interval. In this way, the posture holding mat can be cut by an operator with fingers without use of a cutting tool such as a cutter, can be bent to be used and can be used for holding the posture of a subject during an operation in orthopedics, surgery or the like.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
A semiconductor wafer transfer container (1) comprises: a container body (10) that has an opening portion (11) on one end and a mount portion (12) on the other end, the mount portion (12) facing the opening portion (11) to house a stack of wafers; and a lid (20) that closes the opening portion (11). The container body (10) comprises: a plurality of arc-shaped body side-wall portions (14) that are provided upright on the mount portion (12) and define a housing portion (13) for housing the wafers; and auxiliary wall portions (14a) that are provided upright at both end-edge portions of the body side wall portions (14) and that are folded onto the back-surface side.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
A body-position holding mat (M1) according to the present invention is for holding a body position and has a prescribed thickness, wherein: the mat is formed from an elastic foam body and has cuttable lines (L) that make it possible to cut the mat (M1) into a prescribed size; and the cuttable lines (L) are provided with breaks (Br), which pass through the mat in the thickness direction, with prescribed spacings therebetween. Accordingly, a worker can cut the mat with his/her fingers without employing a cutting tool, such as a cutter; the mat can also be folded and then used; and the mat can also be used to hold the body position of a subject while performing procedures in orthopedic surgery and other surgical fields.
The present invention provides: a polyurethane foam which has an adequately low hardness and excellent mechanical strength, while maintaining good rebound resilience; and a shoe sole member which is obtained using this polyurethane foam. This polyurethane foam is configured from a polyurethane starting material that contains a polyol component, a polyisocyanate component, a foaming agent, a catalyst and a foam stabilizer, while being configured such that: the polyol component contains a polytetramethylene ether glycol that has a number average molecular weight of from 600 to 3,000; the proportion of the polytetramethylene ether glycol in the polyol component is 90% by mass or more; the polyisocyanate component contains (i) an isocyanate group-terminated prepolymer that has a number average molecular weight of from 500 to 2,000, an average number of functional groups of 2 and an isocyanate group content of from 3% by mass to 10% by mass and (ii) a modified MDI that has an isocyanate group content of from 25% by mass to 33% by mass; and the isocyanate group content in the polyisocyanate component is from 11% by mass to 27% by mass. A shoe sole member is configured using this polyurethane foam.
A semiconductor wafer container includes two outer shells in a substantially flat and identical form. Each outer shell vertically overlaps so as to accommodate a single semiconductor wafer therein. Each outer shell has a main body, a wafer retaining device and an external wall forming device. The wafer retaining device accommodates and fixedly holds the wafer in such a manner that upper and bottom surfaces of the wafer are not substantially in contact with the outer shells. The wafer retaining device includes: an inclined surface; a wafer contact surface; and a shallow gap portion. The external wall forming device has a hanging portion formed on an outer peripheral edge of the bottom surface of the outer shell so as to externally constitute a closed external wall relative to the wafer when each outer shell vertically overlaps to store the wafer.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
Described herein are wafer accommodation containers. A wafer accommodation container (1) includes: a container body having one end that is provided with an opening (11) and another end that is provided with a mount element (12) on which wafers are stacked, the mount element (12) facing the opening (11); a cover (20) to cover the opening (11); and a connection mechanism (30) to detachably connect the container body (10) and the cover (20).
H01L 23/13 - Mountings, e.g. non-detachable insulating substrates characterised by the shape
H01L 23/051 - ContainersSeals characterised by the shape the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
17 - Rubber and plastic; packing and insulating materials
Goods & Services
Anti-dazzle films for windows [tinted films]; Plastic film other than for wrapping; Plastic substances, semi-processed; Rubber, gutta-percha, gum, asbestos, mica; Plastics in extruded form for use in manufacture; packing, stopping and insulating materials, flexible pipes, not of metal.
a) of the holding members (22) to positions at which the holding members (22) press the outer sides of the substrates (W), and the guide grooves (13) are formed as a dent on surfaces of the mount element (12).
G11C 15/04 - Digital stores in which information comprising one or more characteristic parts is written into the store and in which information is read-out by searching for one or more of these characteristic parts, i.e. associative or content-addressed stores using semiconductor elements
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
G11C 5/04 - Supports for storage elementsMounting or fixing of storage elements on such supports
Provided is a polyurethane foam that has outstanding lightness of weight and can be used to form a shoe sole member without sacrificing the properties of durability, shock absorption, rebound resilience, and flex resistance. The polyurethane foam comprises a soft segment formed from a polyol constituent and a hard segment formed from a structure section that includes a urethane bonding section, wherein: the presence ratio of the soft segment and that of the hard segment, expressed as the mass ratio of the soft segment to the hard segment with the total of the soft segment and the hard segment being 100 parts by mass, is in the range of 70/30 to 80/20; the average bubble diameter of the polyurethane foam is 30 µm–100 µm; at least 90% of all air bubbles formed in the polyurethane foam have bubble diameters of 20–300 µm; the apparent density of the polyurethane foam, measured in accordance with JIS K 7222, is 0.25–0.50 g/cm3; and the hardness of the polyurethane foam, measured using a type C Asker durometer in accordance with JIS K 7312 is 50–65.
Disclosed is a separator for semiconductor wafers vertically stacked in that the stacked wafers do not contact with each other, or the wafer does not contact to an inner top surface or an inner bottom surface of a conveyance container of the semiconductor wafer, the separator being interposed between two of the wafers neighboring vertically, between the wafer and an inner top surface, or between the wafer and an inner bottom surface of the container. The separator includes: a flat annular body; an annular convex portion having a wafer support surface coming into contact with a peripheral line of the wafer along a peripheral edge portion of the flat annular body, the annular convex portion forming cutout portions in a suitable number of places; and shock-absorbing function pieces neighboring to the cutout portions and extending diagonally upward or diagonally downward from a separator reference plane.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
09 - Scientific and electric apparatus and instruments
Goods & Services
Plastic cases and boxes specifically adapted for carrying semiconductor wafers; Fire boats; Life-saving rafts; Life jackets; Scientific, research, navigation, surveying, photographic, cinematographic, audiovisual, optical, weighing, measuring, signalling, detecting, testing, inspecting, life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling the distribution or use of electricity; apparatus and instruments for recording, transmitting, reproducing or processing sound, images or data; recorded and downloadable media, computer software, blank digital or analogue recording and storage media; mechanisms for coin-operated apparatus; cash registers, calculating devices; computers and computer peripheral devices; diving suits, divers' masks, ear plugs for divers, nose clips for divers and swimmers, gloves for divers, breathing apparatus for underwater swimming.
[Problem] To provide a semiconductor wafer container. [Solution] A semiconductor wafer container in which two substantially flat outer shells having the same shape are overlapped in a vertical direction and a single semiconductor wafer is stored, wherein: the outer shells have, in addition to a main body thereof, a wafer-holding means and an outer wall formation means; the wafer-holding means is for accommodating the upper and lower surfaces of the wafer in a substantially contactless manner and securing and holding the upper and lower surfaces, the wafer-holding means having an inclined surface formed on the upper surface of the outer shell, which comes into line contact with the outer peripheral edge of the semiconductor wafer from below, a wafer contact surface formed on the lower surface of the outer shell, which comes into surface contact with the outer peripheral edge of the semiconductor wafer from above, and a shallow-bottomed void part formed at the respective center part of both the upper and lower surfaces of the outer shell so as to be capable of accommodating the upper half or the lower half of the wafer; and the outer wall formation means has a hanging part formed on the outer peripheral edge of the lower surface of the outer shell so as to form, when the two outer shells are overlapped in the vertical direction and the semiconductor wafer is stored, a closed outer wall on the outside of the stored semiconductor wafer.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
A wafer accommodation container (1) provided with a container body (10) in which one end has an opening (11) and the other end has a mounting part (12) facing the opening (11) and having wafers stacked and accommodated thereon, a lid body (20) for covering the opening (11), and a retaining mechanism (30) for closely fitting and retaining the container body (10) and the lid body (20) so as to be capable of opening and closing, wherein: the retaining mechanism (30) has, in at least two locations, a locking member (32) that extends from the other end of the container body (10) to the one end and has a locking claw part (31) on one end part, and a locking hole part (33) provided to the lid body (20) and to which the locking claw part (31) is locked; and a guide member (40) is configured to be provided to a lid-body-side wall part (21), the guide member (40) guiding the container body (10) and the lid body (20) so as to retain the same in a concentric state while in contact with the locking member (32) when the lid body (20) is being closely fitted to the container body (10).
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
A substrate housing container (1) is provided with: a container body (10) that has an opening (11) at one end and, at the other end, a mounting part (12) which is opposed to the opening (11) and on which substrates (W) are superposed and housed; and a lid (20) that covers the opening (11), wherein the lid (20) has a lid body (21) that covers the opening (11) and at least two pressing members (22) that oscillate in the center direction of the lid body (21) and press the outside of the substrates (W) housed and superposed on the container body (10) in the lid body (21), the container body (10) has a guide groove (13) that causes the tips (22a) of the pressing members (22) to move from the outside of the mounting part (12) toward the inside, and guides the tips to positions for pressing the outside of the substrates (W), and the guide groove (13) is formed recessed from the surface of the mounting part (12).
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65D 85/86 - Containers, packaging elements or packages, specially adapted for particular articles or materials for electrical components
A rigid polyurethane foam which has ultrafine cells, has a low thermal conductivity of 0.0190 W/(m·K) or lower, exhibits excellent heat insulating properties and flame retardancy, and has very little impact on global warming, without using a special apparatus such as a gas loading device. Provided is a rigid polyurethane foam which is obtained by mixing and reacting raw materials including a polyol, a polyisocyanate, a blowing agent, and a catalyst. The rigid polyurethane foam contains the polyol containing a polyester polyol having an aromatic component concentration of 17-35 wt. %, and a non-amine-based polyether polyol and/or an aromatic amine-based polyether polyol; the polyisocyanate in which MDI/TDI are mixed at a ratio of 4/6 to 9/1; and the blowing agent containing a halogenated olefin.
C08J 9/14 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent organic
A ring spacer interposed between plate-shaped objects above and below in a container for storing and transporting the plate-shaped objects when a plurality of plate-shaped objects is stored in an up-and-down direction includes a ring-shaped abutment portion and a control portion. An upper face and a lower face in the abutment portion have an approximately flat shape and the upper face in the abutment portion abuts against a lower face of a peripheral edge portion of the plate-shaped object. The lower face in the abutment portion abuts against an upper face of the peripheral edge portion of the plate-shaped object. The control portion includes a control portion upper face positioned to protrude further upward than the support face of the abutment portion and a control portion lower face positioned at an appropriate location in a thickness direction of the abutment portion.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
[Problem] To provide a separator. [Solution] A separator to be interposed, in a semiconductor wafer transport container which contains vertically stacked semiconductor wafers, between the two vertically adjacent semiconductor wafers or between the semiconductor wafer and the inner top surface or inner bottom surface of the semiconductor wafer transport container, so as to prevent contact between the stacked semiconductor wafers or to prevent contact between the semiconductor wafer and the inner top surface or inner bottom surface of the semiconductor wafer transport container, the separator being characterized by having a flat annular body and having, around the outer circumferential edge portion thereof, an annular projected portion having a wafer support surface having contact with the outer circumferential edge of the semiconductor wafer, wherein the annular projected portion has cutout sections at an appropriate number of points, and is provided with buffer function pieces which are adjacent to the corresponding cutout sections and which extend obliquely upward or obliquely downward from a reference surface of the separator.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
[Problem] The purpose of the present invention is to provide a knitted cloth for cleaning with excellent drying properties and excellent foaming and foam duration properties. [Solution] The present invention provides a knitted fabric for cleaning, characterized in that the knitted fabric for cleaning has at least two layers constituting a front surface and a back surface, the two layers of fabric have at least two linking parts for linking the two layers, the knitted fabric for cleaning has a bulk density of 15 - 35 cm3/g, and the knitted fabric for cleaning is compressible to 50% or greater if 100% is defined as being the initial thickness.
D04B 1/00 - Weft knitting processes for the production of fabrics or articles not dependent on the use of particular machinesFabrics or articles defined by such processes
A47K 7/02 - Bathing sponges, brushes, gloves, or similar cleaning or rubbing implements
C11D 17/04 - Detergent materials or soaps characterised by their shape or physical properties combined with or containing other objects
Multi-layer, perforated polyolefin films comprising at least one polyolefin layer having a high visible light absorbance and at least one polyolefin film having a high opacity, a support layer interposed between the first and second layers, a plurality of perforations penetrating from the first and second layers, a shore D hardness of at least (35) and wherein at least one of the first two layer has a surface tension of at least (34) dyne/cm are provided. Methods for preparation and use of the poly olefin films are also provided.
[Goal] To provide a hard polyurethane foam which has ultrafine cells, has a low thermal conductivity of 0.0190 W/(m·K) or lower, exhibits excellent heat insulating properties and flame retardancy, and has very little impact on global warming, without using a special apparatus such as a gas loading device. [Configuration] Provided is a hard polyurethane foam which is obtained by mixing and reacting raw materials including a polyol, a polyisocyanate, a foaming agent, and a catalyst. The hard polyurethane foam is characterized by the following: the polyol contains a polyester polyol having an aromatic component concentration of 17-35 wt.%, and a non-amine-based polyether polyol and/or an aromatic amine-based polyether polyol; the polyisocyanate is one in which MDI/TDI are mixed at a ratio of 4/6 to 9/1; and the foaming agent contains a halogenated olefin.
[Purpose] To provide a ring spacer that makes it possible to transport a plate-shaped object such as a cover glass for an image sensor surface, or a semiconductor wafer having a 3DS-IC structure while minimizing damage or transfer to the surface of the plate-shaped object when the plate-shaped object is to be stored in a container and transported. [Structure] A ring spacer interposed between plate-shaped objects above and below in a container for storing and transporting a plate-shaped object, the ring spacer characterized in comprising at least a ring-shaped abutting section and a restricting section, the upper and lower surfaces of the abutting section being a substantially flat shape, the upper surface of the abutting section being in contact with the lower surface of the plate-shaped object at the peripheral edge and being a support surface for supporting the lower surface of the plate-shaped object at the peripheral edge, the lower surface of the abutting section being in contact with the upper surface of the plate-shaped object at the peripheral edge and being a pressing surface for pressing the upper surface of the plate-shaped object at the peripheral edge, and the restricting section having a restricting section upper surface positioned further outward than the outer contour of the plate-shaped object as viewed from above and positioned so as to project further upward than the support surface of the abutting section, and a restricting section lower surface positioned in a suitable location in the thickness direction of the abutting section.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
A tray for storing a wafer with a tape frame in a storage container includes a ring-shaped frame, a dicing tape and a semiconductor wafer. The dicing tape is stuck on the rear surface of the ring-shaped frame, and the semiconductor wafer is supported on the dicing tape. The tray has a substantially circular shape and is positioned on the upper side and the lower side of the wafer with tape frame. The front surface of the tray has a flat portion for mounting the wafer, and at least a portion of the outer peripheral portion of the front surface of the tray includes a convex portion. A projecting portion is formed on the rear surface so that the projection portion is positioned outside the outer periphery of the semiconductor wafer of the wafer with the tape frame when the tray is positioned on the wafer with tape frame.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
17 - Rubber and plastic; packing and insulating materials
Goods & Services
Anti-dazzle films for windows [tinted films]; Plastic film other than for wrapping; Plastic substances, semi-processed, Rubber, gutta-percha, gum, asbestos, mica; Plastics in extruded form for use in manufacture; packing, stopping and insulating materials, flexible pipes, not of metal.
Provided is synthetic leather which is lightweight while having an excellent appearance, texture (feel), wear resistance, and peeling strength in comparison to conventional synthetic leather, has high durability enabling use in car seats, furniture seats, and the like, and moreover can be produced in an extremely short period of time and can reduce production costs. This synthetic leather is formed by layering a polyurethane resin layer on a greige fabric via an adhesive layer, and is characterized in that the mass per unit area of the greige fabric is less than 200 g/m2, and the adhesive layer comprises a polyurethane resin including foamed thermally expandable microparticles which is formed by heating a urethane adhesive comprising a urethane polymer having a terminal isocyanate group blocked with a blocking agent, an amine cross-linking agent, and thermally expandable microparticles to foam the thermally expandable microparticles while causing the urethane polymer and the amine cross-linking agent to undergo a cross-linking reaction.
D06N 3/14 - Artificial leather, oilcloth, or like material obtained by covering fibrous webs with macromolecular material, e.g. resins, rubber or derivatives thereof with macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds with polyurethanes
B32B 5/24 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous one layer being a fibrous or filamentary layer
The present invention provides a tray which, even when a tape-frame-fitted wafer including an ultra thin semiconductor wafer having a thickness of 200 μm or less is transported while being accommodated in a container, is capable of reducing the amplitude of the semiconductor wafer as caused by the vibration of the container and preventing damage to the semiconductor wafer. This tray is used when accommodating, in a storing container, a tape-frame-fitted wafer in which a dicing tape adheres to the reverse side of a ring-shaped frame and a semiconductor wafer is supported on the dicing tape, wherein the tray is characterized in that the tray is provide d above and below the tape-frame-fitted wafer and is almost round, a portion of the surface of the tray on which the tape-frame-fitted wafer is placed is almost flat, the surface of the tray has a convex portion on at least part of the outer circumferential edge thereof, and, when the tray is provided above the tape-frame-fitted wafer, the reverse side of the tray is provided with a protruding part that protrudes outward from the outer circumference of the semiconductor wafer in the tape-frame-fitted wafer.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
B65D 85/86 - Containers, packaging elements or packages, specially adapted for particular articles or materials for electrical components
NATIONAL UNIVERSITY CORPORATION NAGOYA UNIVERSITY (Japan)
ACHILLES CORPORATION (Japan)
Inventor
Yasuda Kimiaki
Ohi Takashi
Yoshida Takashi
Abstract
Provided are: an organic substance adsorbent material that has superior durability and organic substance adsorbence, and the applications of which can be applied to a variety of fields; and an organic substance adsorbent carrier comprising the organic substance absorbent material. The present invention provides an organic substance adsorbent material that comprises powdered diatomaceous earth, a crosslinking agent, and a cationic water-soluble polymer for adsorbing organic substances, and that results from crosslinked bodies of the water-soluble polymer being carried in the diatomaceous earth in the state of being embedded. The organic substance adsorbent carrier comprising the organic substance adsorbent material in a synthetic resin can resolve the conventional problem of the water-soluble polymer delaminating and the adsorbence decreasing, and has highly superior durability and organic substance adsorbence.
Provided is a surface-protecting film offering superior workability and antistatic properties in addition to superior adhesion, whereby the film does not curl, attachment to an adherend is easy and yet detachment can also be performed easily and in an aesthetically pleasing manner, and the adherend will be entirely free of contamination after detachment. This surface-protecting film, comprising a base material layer (A) and an adhesive layer (B), is characterized in that the base material layer (A) contains a low-density polyethylene (i),a high-density polyethylene (ii), and a polyether-polyolefin block copolymer (iii), the mixing ratio of (i) and (ii) being 3:1-1:1 by weight ratio, and in that the adhesive layer (B) contains a linear low-density polyethylene (iv) having a density of at most 0.900 g/cm3 and the polyether-polyolefin block copolymer (iii). Preferably, the amount of polyether-polyolefin block copolymer is 10-30 wt% in both the base material layer (A) and the adhesive layer (B).
Provided is a solar cell sealing material, with which air is excellently released, and breakage of solar cells is reliably eliminated in a sealing step in solar cell manufacture. The solar cell sealing material is formed by embossing at least one surface of a sheet obtained by film-forming a transparent soft resin composition. The solar cell sealing material is characterized in that: (A) the porosity of the embossed surface of the sheet is less than 5 %; (B) the depths of recesses in the embossed surface are not uniform; (B-1) the arithmetic average roughness (Ra) of the embossed surface is 1.0-3.0 μm; and (B-2) the maximum height roughness (Rz) is 5-15 μm.
[Problem] Provide a base film of a tape for a semiconductor production process. [Solution] The base film of a tape for a semiconductor production process is a substrate film formed from A) an ionomer resin that is obtained by subjecting a dipolymer, the polymer structural units of which are ethylene and (meth)acrylic acid, to crosslinking by metal ions, and B) a substance containing a terpolymer, the polymer structural components of which are ethylene, (meth)acrylic acid, and (meth)acrylic acid alkyl ester, wherein the amount of component B) used is within a range of at least 5 mass% to no more than 50 mass% on the basis of the total amount of components A) + B).
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
The present invention produces, by a simple production process, a resin sheet including a decorative film on the surface of which a design face is to be formed and a metal film on which an antenna and a circuit pattern are to be formed. The present invention produces a resin sheet by the steps of: providing a decorative print on the resin sheet; applying, onto the resin sheet, paint containing conductive polymer microparticles; immersing the resin sheet in a preprocessing solution for dedoping; immersing the resin sheet in a catalytic solution containing plating catalytic metal; and immersing the resin sheet in an electroless plating solution.
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B29C 51/08 - Deep-drawing or matched-mould forming, i.e. using mechanical means only
B29C 51/14 - Shaping by thermoforming, e.g. shaping sheets in matched moulds or by deep-drawingApparatus therefor using multilayered preforms or sheets
A conductive resin composite material containing a polycarbonate resin and vapor grown carbon fibers, which is characterized in that the vapor grown carbon fibers have an average fiber outer diameter of more than 100 nm but not more than 150 nm, that the polycarbonate resin and the vapor grown carbon fibers are mixed at such a ratio that the vapor grown carbon fibers are in an amount of 1-11.2 parts by mass per 100 parts by mass of the polycarbonate resin, and that the elongation at break of the composite material is not less than 30%.
H01B 1/24 - Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon, or silicon
A conductive resin composite material comprising a base resin and carbon fibers, characterized in that the carbon fibers have an average outer diameter of 20-300 nm, excluding 20 nm, are of at least two kinds of carbon fibers which differ in outer-diameter distribution, and are contained in an amount of 1-11.2 parts by mass per 100 parts by mass of the base resin. The composite material containing carbon fibers has satisfactory conductivity and satisfactory resin material properties including elongation at break, etc., and carbon fiber shedding rarely occurs.
H01B 1/24 - Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon, or silicon
B29C 45/00 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor
Disclosed are a plated molded article and a method for producing the same. Specifically disclosed is a plate article wherein a coating layer containing conductive polymer particles and a binder is formed on the surface of a molded article, and a metal plating film is formed on the coating layer by electroless plating through adsorption of a catalyst metal. The binder is present in an amount of 0.1-10 parts by mass per 1 part by mass of the conductive polymer particles, and the coating layer has a thickness of 0.5-100 &mgr;m. The sizes of the catalyst metal lumps adsorbed on the coating layer are not more than 150 nm, and the amount of the catalyst metal adsorbed on the coating layer per unit area is from 0.1 &mgr;g/cm2 to 3.0 &mgr;g/cm2.
A dark color, resin sheet-like body having light reflective properties in a near-infrared region, the body comprising a surface layer (A) receiving solar radiation and a reflection layer (B). Surface layer (A) exhibits a dark color with a solar radiation absorption ratio of 90% or more in a wavelength region of 380 to 720 nm, a ratio of less than 30% in a near-infrared region of 720 to 1500 nm, and ratio of 50% or more in a near-infrared region of 720 to 1500 nm. Reflection layer (B) has a solar radiation reflection ratio of 85% or more in a wavelength region of 380 to 1500 nm. A ratio in a near-infrared region of 720 to 1500 nm of a sheet-like body formed by laminating surface layer (A) and reflection layer (B) is 70% or more.
B32B 27/20 - Layered products essentially comprising synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
50.
SOLVENT-FREE POLYURETHANE-UREA FOAM SHEET, METHOD FOR PRODUCTION THEREOF, AND SYNTHETIC LEATHER
Disclosed is a solvent-free polyurethane-urea foam sheet which is produced by foaming a solvent-free urethane resin composition with air or an inert gas, shaping the foamed material into a sheet-like material, and hardening the sheet-like material by heating. The solvent-free urethane resin composition comprises (A) a prepolymer produced by the reaction between a diisocyanate compound with a polyol having a molecular weight of 500 to 3000, (B) a cross-linking agent comprising a polyol having 2 to 4 hydroxy groups on average, and (C) water, wherein the content of an isocyanate group in the component (A) is 7.0 to 12.0% by mass, the residual amount of an isocyanate group in a mixture of the components (A) and (B) is 2.0 to 5.0% by mass, the residual amount of an isocyanate group in a mixture of the components (A), (B) and (C) is 0.01 to 0.5% by mass, and the number average molecular weight of all of the polyol used as a raw material for the component (A) and the polyol of the component (B) is 600 or more. Also disclosed is a method for producing the sheet. Further disclosed is a synthetic leather comprising the sheet.
C08G 18/10 - Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
C08G 18/00 - Polymeric products of isocyanates or isothiocyanates
D06N 3/14 - Artificial leather, oilcloth, or like material obtained by covering fibrous webs with macromolecular material, e.g. resins, rubber or derivatives thereof with macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds with polyurethanes
51.
UPHOLSTERY MATERIAL FOR FORMING INTEGRATED-FOAM UPHOLSTERY
Disclosed is an upholstery material (10) that comprises a facing material (11), a polyurethane foam (12) adhered to the inward side thereof, and a nonwoven cloth (13) adhered to the inward side thereof, and which has a water pressure resistance of 450 mmH2O or greater, preferably 500 mmH2O or greater, and more preferably 550 mmH2O or greater; has an air permeability of 0.1 to 20 cc/cm2/s, and preferably 5 to 15 cc/cm2/s; has an average pore size of 0.1 to 20 쎽m, and preferably 5 to 15 쎽m.
B32B 27/12 - Layered products essentially comprising synthetic resin next to a fibrous or filamentary layer
B29C 39/10 - Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressureApparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
B32B 5/24 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous one layer being a fibrous or filamentary layer
B68G 7/06 - Filling of cushions, mattresses, or the like
D04H 3/16 - Non woven fabrics formed wholly or mainly of yarns or like filamentary material of substantial length characterised by the method of strengthening or consolidating with bonds between thermoplastic yarns or filaments produced by welding with bonds between thermoplastic filaments produced in association with filament formation, e.g. immediately following extrusion
B29K 75/00 - Use of polyureas or polyurethanes as moulding material
B29K 105/04 - Condition, form or state of moulded material cellular or porous
B29L 31/58 - Upholstery or cushions, e.g. vehicle upholstery or interior padding
Disclosed are a plated article and a method for producing a plated article. Specifically disclosed is a plated article wherein a coating layer containing a conductive polymer fine particle and a binder is formed on the surface of a base, and a metal plating film is formed on the coating layer by electroless plating. In this plated article, the binder is present in an amount of 0.1-10 parts by mass per 1 part by mass of the conductive polymer fine particle, and the coating layer has a thickness of 20-500 nm.
C23C 18/18 - Pretreatment of the material to be coated
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
There is provided a heat shielding transparent sheet which transmits visual light but cuts infrared light and is remarkably resistant to climate and thermal deterioration even in an environment of outdoor use, the sheet comprising a synthetic resin with 0.4 to 2.7g/m2 of Tungsten Oxide particles and having visible light transmittance of 70 % or more and sunlight transmittance of 65 % or less, respectively.
This invention provides a synthetic resin sheet-shaped material comprising a surface layer (A), which receives a solar radiation, and a reflective layer (B). The synthetic resin sheet-shaped material is a dark color sheet-shaped material having light reflective properties in a near infrared range. The surface layer (A) is a dark color development layer having a solar radiation absorption of not less than 90% in a wavelength range of 380 to 720 nm, having a solar radiation absorption of less than 30% in a near infrared range of 720 to 1500 nm, and having a solar radiation transmittance of not less than 50% in a near infrared range of 720 to 1500 nm. The reflective layer (B) has a solar radiation reflectance of not less than 85% in a wavelength range of 380 to 1500 nm. The sheet-shaped material formed of a laminate of the surface layer (A) and the reflective layer (B) has a solar radiation reflectance of not less than 70% in a near infrared range of 720 to 1500 nm.
It is possible to prevent generation of micro-particles by friction between a storage disc and a package. The package includes a container body (1), a lower cover (2), and an upper cover (3). The container body (1) is a bottom-less and cover-less square container having holding grooves (15) at both side surfaces (4, 4) for inserting a storage disc D. The storage disc D has a circular shape and is contained in a row in the longitudinal direction of the container body (1). The lower cover (2) covers the lower opening of the container body (1). The upper cover (3) covers at least the open top of the container body (1) and has a notch (14) and an elastic protrusion (18). The notch (14) supports the upper end of the storage disc D inserted into the holding grooves (15, 15) and suppresses deflection in the row direction. The elastic protrusion (18) protrudes in an inversed V shape at the both sides of the notch (14) so as to press downward the both shoulders of the storage disc D by its elastic force, thereby suppressing the deflection of the storage disc D in the radial direction and preventing deflection of the storage disc.
A wafer protective sheet 1 is made of a synthetic resin sheet with a thickness of 80 to 130 μm having a large number of projected parts and recessed parts on its front and rear surfaces. The large number of projected parts and the large number of recessed parts are respectively disposed so that each part is positioned at intersections of lattice stripes, and the projected part and the recessed part are disposed alternately each other. The sheet has such a water-like cross section that the recessed parts in the rear surface match the projected parts on the front surface and the projected parts on the rear surface match the recessed parts in the front surface. The wafer protective sheet 1 has a bending resistance of 30 to 80 mm. The wafer protective sheet 1 of the present invention is sufficiently thin. When the wafer protective sheets are interposed between stacked wafers to protect them, the sheets do not adhere to the wafers. Thus, wafers housed in a container can be protected against vibration during transportation.
16 - Paper, cardboard and goods made from these materials
17 - Rubber and plastic; packing and insulating materials
18 - Leather and imitations of leather
20 - Furniture and decorative products
24 - Textiles and textile goods
Goods & Services
(1) Flexible and semi-rigid films and sheeting for use in the manufacture of automotive products, building insulation products, pressure sensitive products, bookbinding and stationery, furniture and protective coverings for furniture, toys, flexible packaging, industrial fabrics and medical articles.
16 - Paper, cardboard and goods made from these materials
17 - Rubber and plastic; packing and insulating materials
18 - Leather and imitations of leather
20 - Furniture and decorative products
24 - Textiles and textile goods
Goods & Services
(1) Flexible and semi-rigid films and sheeting for use in the manufacture of automotive products, building insulation products, pressure sensitive products, bookbinding and stationery, furniture and protective coverings for furniture, toys, flexible packaging, industrial fabrics and medical articles.
12 - Land, air and water vehicles; parts of land vehicles
17 - Rubber and plastic; packing and insulating materials
25 - Clothing; footwear; headgear
Goods & Services
[ Flotation Devices-Namely, Air Mattresses for Recreational Use ] General Purpose Boats and Boats for Sporting and Fishing Purposes Plastic Film, Plastic Sheeting (Supported and Unsupported), Expanded Vinyl Sheeting [ and Suede-Like Expanded Vinyl Sheeting ] [ Dress Shoes, Work Shoes, Basketball Shoes, Tennis Shoes, Sneakers, Sandals, Slippers, Boots, and Overshoes, Intended for Use by Men, Women, and Children; Wearing Apparel-Namely, Raincoats, Parka Suits, Jackets, Coats, and Pants for Men, Women, and Children Made out of Rubberized Fabrics ]
