Xtpl S.A.

Poland

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IP Type
        Patent 44
        Trademark 8
Jurisdiction
        United States 31
        World 13
        Europe 8
Date
2026 (YTD) 1
2025 5
2024 7
2023 4
2022 14
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IPC Class
H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material 11
C09D 11/52 - Electrically conductive inks 10
B33Y 10/00 - Processes of additive manufacturing 6
C09D 11/037 - Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment 6
C09D 11/033 - Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent 5
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NICE Class
02 - Paints, varnishes, lacquers 8
40 - Treatment of materials; recycling, air and water treatment, 8
07 - Machines and machine tools 4
09 - Scientific and electric apparatus and instruments 4
42 - Scientific, technological and industrial services, research and design 4
Status
Pending 8
Registered / In Force 44

1.

METHODS FOR REMOVING A CONDUCTIVE STRUCTURE FROM A SUBSTRATE

      
Application Number 19263740
Status Pending
Filing Date 2025-07-09
First Publication Date 2026-01-15
Owner XTPL S.A. (Poland)
Inventor
  • Wiatrowska, Aneta
  • Chudzynska, Aleksandra
  • Nawrot, Witold
  • Lysien, Mateusz
  • Kowalczewski, Piotr

Abstract

Methods for removing a conductive structure from a substrate are provided. The method includes additively manufacturing a conductive structure on a substrate. The method includes sintering the conductive structure and performing a manufacturing process with the conductive structure. The method includes removing the conductive structure from the substrate.

IPC Classes  ?

  • B22F 10/62 - Treatment of workpieces or articles after build-up by chemical means
  • B22F 10/66 - Treatment of workpieces or articles after build-up by mechanical means
  • B33Y 40/20 - Post-treatment, e.g. curing, coating or polishing

2.

ADDITIVE MANUFACTURING SYSTEMS COMPRISING AT LEAST TWO NOZZLES AND METHODS FOR ADDITIVE MANUFACTURING

      
Application Number 19243997
Status Pending
Filing Date 2025-06-20
First Publication Date 2025-12-25
Owner XTPL S.A. (Poland)
Inventor
  • Kubica, Krzysztof
  • Wlodarczyk, Sebastian
  • Nawrot, Witold

Abstract

Additive manufacturing systems comprising at least two nozzles and methods for additive manufacturing are provided. An example system comprises a first cartridge assembly, a second cartridge assembly, a first nozzle positioning system, a second nozzle positioning system, and a control circuit. The first cartridge assembly comprises a first nozzle. The second cartridge assembly comprises a second nozzle. The first nozzle positioning system is operatively coupled to the first cartridge assembly and capable to move the first nozzle independently of the second nozzle and in at least three degrees of freedom relative to the second nozzle. The second nozzle positioning system operatively coupled to the second cartridge assembly capable to move the second nozzle independently of the first nozzle and in at least three degrees of freedom relative to the first nozzle.

IPC Classes  ?

  • B29C 64/209 - HeadsNozzles
  • B29C 64/124 - Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
  • B29C 64/232 - Driving means for motion along the axis orthogonal to the plane of a layer
  • B29C 64/236 - Driving means for motion in a direction within the plane of a layer
  • B29C 64/336 - Feeding of two or more materials
  • B33Y 10/00 - Processes of additive manufacturing
  • B33Y 30/00 - Apparatus for additive manufacturingDetails thereof or accessories therefor

3.

APPARATUS AND METHODS FOR FILLING MICROCAVITIES

      
Application Number 18975484
Status Pending
Filing Date 2024-12-10
First Publication Date 2025-07-10
Owner XTPL S.A. (Poland)
Inventor
  • Gradzka-Kurzaj, Iwona
  • Drozdek, Slawomir

Abstract

An apparatus and methods for filling microcavities are provided. For example, a method can include disposing a nozzle of a print head of an additive manufacturing system proximal to a microcavity defined in a substrate. The nozzle is disposed such that a first distance between the nozzle and a sidewall of the substrate defining the microcavity is no greater than a droplet size of an ink composition. The method can further include dispensing the ink composition from the nozzle into the microcavity. The nozzle moves at least in a horizontal path while dispensing, and the horizontal path includes a directional change of at least 15 degrees.

IPC Classes  ?

  • B29C 64/209 - HeadsNozzles
  • B29C 64/232 - Driving means for motion along the axis orthogonal to the plane of a layer
  • B29C 64/236 - Driving means for motion in a direction within the plane of a layer
  • B33Y 10/00 - Processes of additive manufacturing
  • B33Y 30/00 - Apparatus for additive manufacturingDetails thereof or accessories therefor

4.

CONDUCTIVE COMPOSITIONS FOR ADDITIVE MANUFACTURING, ADDITIVE MANUFACTURING METHODS, ELECTRICALLY CONDUCTIVE TRACES PRODUCED THEREFROM, AND ELECTRONIC ARTICLES

      
Application Number 18981779
Status Pending
Filing Date 2024-12-16
First Publication Date 2025-07-10
Owner XTPL S.A. (Poland)
Inventor
  • Schneider, Ludovic
  • Motyka, Aleksandra
  • Gadzalinska, Jolanta

Abstract

Conductive compositions for additive manufacturing, additive manufacturing methods, electrically conductive traces produced therefrom, and electronic articles are provided. The composition comprises at least 75 percent by weight of gold nanoparticles and at least 2 percent by weight of a polar solvent based, all based on the total weight of the composition. The gold nanoparticles comprise an average particle size of no greater than 100 nm as measured with transmission electron microscopy. The polar solvent has a boiling point of at least 200° C. The composition comprises less than 5 percent by weight of any solvent having a boiling point of less than 200° C. based on the total weight of the composition.

IPC Classes  ?

  • C08K 3/105 - Compounds containing metals of Groups 1 to 3 or of Groups 11 to 13 of the Periodic Table
  • B29C 64/118 - Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using filamentary material being melted, e.g. fused deposition modelling [FDM]
  • B29K 105/16 - Fillers
  • B33Y 70/10 - Composites of different types of material, e.g. mixtures of ceramics and polymers or mixtures of metals and biomaterials

5.

CONDUCTIVE COMPOSITIONS FOR ADDITIVE MANUFACTURING, ADDITIVE MANUFACTURING METHODS, ELECTRICALLY CONDUCTIVE TRACES PRODUCED THEREFROM, AND ELECTRONIC ARTICLES

      
Application Number 18887101
Status Pending
Filing Date 2024-09-17
First Publication Date 2025-03-27
Owner XTPL S.A. (Poland)
Inventor
  • Lysien, Mateusz
  • Bialobrzeska, Dagmara
  • Schneider, Ludovic

Abstract

Conductive compositions for additive manufacturing, additive manufacturing methods, electrically conductive traces produced therefrom, and electronic articles are provided. The composition comprises at least 75 percent by weight of copper nanoparticles, at least 2 percent by weight of a polar solvent, and at least 0.1 percent by weight of a dispersant, all based on the total weight of the composition. The copper nanoparticles comprise an average particle size of no greater than 500 nm as measured with transmission electron microscopy. The polar solvent has a boiling point of at least 150° C.

IPC Classes  ?

  • C09D 5/24 - Electrically-conducting paints
  • B33Y 70/10 - Composites of different types of material, e.g. mixtures of ceramics and polymers or mixtures of metals and biomaterials
  • C09D 7/20 - Diluents or solvents
  • C09D 7/40 - Additives
  • C09D 7/45 - Anti-settling agents
  • C09D 7/61 - Additives non-macromolecular inorganic
  • C09D 7/65 - Additives macromolecular
  • C09D 139/06 - Homopolymers or copolymers of N-vinyl-pyrrolidones
  • C09D 171/00 - Coating compositions based on polyethers obtained by reactions forming an ether link in the main chainCoating compositions based on derivatives of such polymers

6.

METHOD FOR ADDITIVE MANUFACTURING AND AN ADDITIVE MANUFACTURING APPARATUS

      
Application Number 18467087
Status Pending
Filing Date 2023-09-14
First Publication Date 2025-03-20
Owner XTPL S.A. (Poland)
Inventor
  • Gradzka-Kurzaj, Iwona
  • Kowalczewski, Piotr

Abstract

A method for additive manufacturing and an additive manufacturing apparatus are provided. The method includes disposing a nozzle of a print head of an additive manufacturing system over a location on a substrate. An ink composition from the nozzle is deposited onto the location of the substrate while moving the nozzle away from the substrate to increase a distance therebetween, thereby forming a portion of a structure on the location. The method includes repeatedly, as necessary to increase a distance the portion of the substrate protrudes from the substrate, performing the following over the location: moving the nozzle away from the substrate while not depositing the ink composition, moving the nozzle towards the substrate, and dispensing the ink composition from the nozzle onto the structure while moving the nozzle away from the substrate.

IPC Classes  ?

  • B29C 64/232 - Driving means for motion along the axis orthogonal to the plane of a layer
  • B29C 64/112 - Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using individual droplets, e.g. from jetting heads
  • B29C 64/209 - HeadsNozzles
  • B29K 105/00 - Condition, form or state of moulded material
  • B33Y 10/00 - Processes of additive manufacturing
  • B33Y 30/00 - Apparatus for additive manufacturingDetails thereof or accessories therefor

7.

A METHOD FOR PRINTING TRACES ON A SUBSTRATE AND AN ADDITIVE MANUFACTURING APPARATUS THEREFOR

      
Application Number IB2023057529
Publication Number 2024/057107
Status In Force
Filing Date 2023-07-25
Publication Date 2024-03-21
Owner XTPL SA (Poland)
Inventor
  • Witczak, Łukasz
  • Grądzka-Kurzaj, Iwona
  • Wiatrowska, Aneta
  • Fiączyk, Karolina
  • Granek, Filip

Abstract

A method for printing traces on a substrate and an additive manufacturing apparatus therefor are provided. The method comprises determining at least two first location points for a first trace and at least two second location points for a second trace. The first trace and the second trace traverse at least two surfaces of the substrate, including a first surface of the substrate and a second surface of the substrate. At least two third location points are determined for a third trace based on the at least two first location points and the at least two second location points. The third trace is intermediate the first trace and the second trace. The third trace is formed on the at least two surfaces based on the at least two third location points.

IPC Classes  ?

  • H05K 1/02 - Printed circuits Details
  • H05K 1/09 - Use of materials for the metallic pattern
  • H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material

8.

Method for printing traces on a substrate and an additive manufacturing apparatus therefor

      
Application Number 18345175
Grant Number 12082347
Status In Force
Filing Date 2023-06-30
First Publication Date 2024-03-21
Grant Date 2024-09-03
Owner XTPL S.A. (Poland)
Inventor
  • Witczak, Lukasz
  • Grądzka-Kurzaj, Iwona
  • Wiatrowska, Aneta
  • Fiączyk, Karolina
  • Granek, Filip

Abstract

A method for printing traces on a substrate and an additive manufacturing apparatus therefor are provided. The method comprises determining at least two first location points for a first trace and at least two second location points for a second trace. The first trace and the second trace traverse at least two surfaces of the substrate, including a first surface of the substrate and a second surface of the substrate. At least two third location points are determined for a third trace based on the at least two first location points and the at least two second location points. The third trace is intermediate the first trace and the second trace. The third trace is formed on the at least two surfaces based on the at least two third location points.

IPC Classes  ?

  • H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material

9.

IJ36

      
Application Number 018984866
Status Registered
Filing Date 2024-02-09
Registration Date 2024-06-19
Owner XTPL S.A. (Poland)
NICE Classes  ?
  • 02 - Paints, varnishes, lacquers
  • 40 - Treatment of materials; recycling, air and water treatment,

Goods & Services

Dyestuffs, pigments and Inks; Letterpress ink; Printing pigments; Printing ink containing nanoparticles; Printing ink for 3D printers; Printing ink for 3D printers for electrical circuits; Conductive paints; Toners and toner cartridges, filled, for printers; Silver emulsions [pigments]; Nano inks for industrial and laboratory printers; Nano inks based on silver, gold and copper nanoparticles. Printing; Digital printing; Custom 3D printing for others; Printing of nanomaterials.

10.

CL60

      
Application Number 018984880
Status Registered
Filing Date 2024-02-09
Registration Date 2024-06-19
Owner XTPL S.A. (Poland)
NICE Classes  ?
  • 02 - Paints, varnishes, lacquers
  • 40 - Treatment of materials; recycling, air and water treatment,

Goods & Services

Dyestuffs, pigments and Inks; Letterpress ink; Printing pigments; Printing ink containing nanoparticles; Printing ink for 3D printers; Printing ink for 3D printers for electrical circuits; Conductive paints; Toners and toner cartridges, filled, for printers; Silver emulsions [pigments]; Nano inks for industrial and laboratory printers; Nano inks based on silver, gold and copper nanoparticles. Printing; Digital printing; Custom 3D printing for others; Printing of nanomaterials.

11.

UPD

      
Application Number 018984889
Status Registered
Filing Date 2024-02-09
Registration Date 2024-07-16
Owner XTPL S.A. (Poland)
NICE Classes  ?
  • 02 - Paints, varnishes, lacquers
  • 07 - Machines and machine tools
  • 09 - Scientific and electric apparatus and instruments
  • 40 - Treatment of materials; recycling, air and water treatment,
  • 42 - Scientific, technological and industrial services, research and design

Goods & Services

Colorants, pigments and inks; Typographic ink; Printing pigments; Printing ink containing nanoparticles; Printing ink for 3D printers; Printing ink for 3D printers for electrical circuits; Conductive paints; Toners and toner cartridges, filled, for printers; Silver emulsions [pigments]; Nano-inks for industrial and laboratory printers; Nano-inks based on silver nanoparticles, Nano-inks based on nanoparticles of gold and copper. Printing machines; Parts and fittings for printing machines and printers; Print heads for nanomaterial printers and printing machines; 3D printers; Printers for 3D printed circuits; Printers for printing multi-layer printed circuit boards; Nanomaterial printers. Scientific, photographic, optical, measuring, signalling, checking (supervision) and control apparatus and instruments; Apparatus and instruments for controlling electricity; Apparatus and instruments for accumulating electricity; Apparatus and instruments for switching electricity; Apparatus and instruments for transforming electricity; Apparatus and instruments for regulating electricity; Apparatus and instruments for conducting electricity; Data processing equipment; Computers; Programs for computers; Controlling software for computer printers; Operating programs for industrial and laboratory printers; Printers for use with computers; Multifunction printers [MFP]; Print heads for multifunctional printers and for computer printers; Replicating apparatus; Precision measuring apparatus; Electrical and electronic components; Optical fibres [light conducting filaments]; Information technology and audio-visual, multimedia and photographic devices; Semi-conductors; Circuit boards for electrical and; Conductive foils for use in electronics and for the production of thin-film photoelectric cells. Printing; Digital printing; Custom 3D printing for others; Printing of nanomaterials. Scientific and technological services and research in the following fields: nano technology and Design relating to the aforesaid services; Industrial analysis and research services; Nanotechnology research; Technical consultancy in connection with the aforesaid services.

12.

CL34

      
Application Number 018984882
Status Registered
Filing Date 2024-02-09
Registration Date 2024-06-19
Owner XTPL S.A. (Poland)
NICE Classes  ?
  • 02 - Paints, varnishes, lacquers
  • 40 - Treatment of materials; recycling, air and water treatment,

Goods & Services

Dyestuffs, pigments and Inks; Letterpress ink; Printing pigments; Printing ink containing nanoparticles; Printing ink for 3D printers; Printing ink for 3D printers for electrical circuits; Conductive paints; Toners and toner cartridges, filled, for printers; Silver emulsions [pigments]; Nano inks for industrial and laboratory printers; Nano inks based on silver, gold and copper nanoparticles. Printing; Digital printing; Custom 3D printing for others; Printing of nanomaterials.

13.

DPS

      
Application Number 018984936
Status Registered
Filing Date 2024-02-09
Registration Date 2024-07-16
Owner XTPL S.A. (Poland)
NICE Classes  ?
  • 02 - Paints, varnishes, lacquers
  • 07 - Machines and machine tools
  • 09 - Scientific and electric apparatus and instruments
  • 40 - Treatment of materials; recycling, air and water treatment,
  • 42 - Scientific, technological and industrial services, research and design

Goods & Services

Colorants, pigments and inks; Typographic ink; Printing pigments; Printing ink containing nanoparticles; Printing ink for 3D printers; Printing ink for 3D printers for electrical circuits; Conductive paints; Toners and toner cartridges, filled, for printers; Silver emulsions [pigments]; Nano-inks for industrial and laboratory printers; Nano-inks based on silver nanoparticles, Nano-inks based on nanoparticles of gold and copper. Printing machines; Parts and fittings for printing machines and printers; Print heads for nanomaterial printers and printing machines; 3D printers; Printers for 3D printed circuits; Printers for printing multi-layer printed circuit boards; Nanomaterial printers. Scientific, photographic, optical, measuring, signalling, checking (supervision) and control apparatus and instruments; Apparatus and instruments for controlling electricity; Apparatus and instruments for accumulating electricity; Apparatus and instruments for switching electricity; Apparatus and instruments for transforming electricity; Apparatus and instruments for regulating electricity; Apparatus and instruments for conducting electricity; Data processing equipment; Computers; Programs for computers; Controlling software for computer printers; Operating programs for industrial and laboratory printers; Printers for use with computers; Multifunction printers [MFP]; Print heads for multifunctional printers and for computer printers; Replicating apparatus; Precision measuring apparatus; Electrical and electronic components; Optical fibres [light conducting filaments]; Information technology and audio-visual, multimedia and photographic devices; Semi-conductors; Circuit boards for electrical and; Conductive foils for use in electronics and for the production of thin-film photoelectric cells. Printing; Digital printing; Custom 3D printing for others; Printing of nanomaterials. Scientific and technological services and research in the following fields: nano technology and Design relating to the aforesaid services; Industrial analysis and research services; Nanotechnology research; Technical consultancy in connection with the aforesaid services.

14.

Method of forming a feature by dispensing a metallic nanoparticle composition from an ink-jet print head and a metallic nanoparticle composition for ink-jet printing

      
Application Number 18247536
Grant Number 11987049
Status In Force
Filing Date 2022-02-11
First Publication Date 2023-11-23
Grant Date 2024-05-21
Owner XTPL S.A. (Poland)
Inventor
  • Lysien, Mateusz
  • Schneider, Ludovic
  • Tarapata, Grzegorz
  • Granek, Filip

Abstract

A method of forming a feature by dispensing a metallic nanoparticle composition from an ink-jet print head is disclosed. A jetting waveform is applied to piezoelectric actuator to dispense droplets of the metallic nanoparticle composition through nozzle opening. The droplets range in volume between 0.5 picoliter and 2.0 picoliter. The jetting waveform includes an intermediate contraction waveform portion, a final contraction waveform portion after the intermediate contraction waveform portion, and an expansion waveform portion after the final contraction waveform portion. During the intermediate contraction waveform portion, an applied voltage increases from an initial low voltage to an intermediate voltage and then is held at the intermediate voltage. During the final contraction waveform portion, the applied voltage increases from the intermediate voltage to maximum voltage and then is held at the maximum voltage. During the expansion waveform portion, the applied voltage decreases from the maximum voltage to a final low voltage.

IPC Classes  ?

  • B41J 2/045 - Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
  • C09D 11/033 - Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
  • C09D 11/037 - Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
  • C09D 11/106 - Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
  • C09D 11/322 - Pigment inks
  • C09D 11/36 - Inkjet printing inks based on non-aqueous solvents
  • C09D 11/52 - Electrically conductive inks

15.

Methods of extruding a nanoparticle composition onto a substrate

      
Application Number 18040324
Grant Number 12434297
Status In Force
Filing Date 2021-10-07
First Publication Date 2023-08-24
Grant Date 2025-10-07
Owner XTPL S.A. (Poland)
Inventor
  • Rusek, Marcin
  • Witczak, Lukasz
  • Granek, Filip

Abstract

A method of extruding a nanoparticle composition onto a substrate is disclosed. A nanoparticle composition dispenser includes a capillary tube. The capillary tube is oriented such that a first longitudinal axis extending through the capillary tube is tilted at an oblique angle relative to a vertical axis. The capillary tube is positioned above the substrate such that the capillary tube and its reflection from the substrate are visible within a field-of-view of a camera. Digital images of the capillary tube and its reflection are captured and processed to detect the first longitudinal axis extending through the capillary tube and a second longitudinal axis extending through the reflection. A point of intersection of the first longitudinal axis and the second longitudinal axis is calculated to estimate a zero-height position. The capillary tube is positioned at a start position in accordance with the zero-height position.

IPC Classes  ?

  • B22F 10/10 - Formation of a green body
  • B22F 10/31 - Calibration of process steps or apparatus settings, e.g. before or during manufacturing
  • B22F 10/85 - Data acquisition or data processing for controlling or regulating additive manufacturing processes
  • B22F 12/90 - Means for process control, e.g. cameras or sensors
  • B33Y 10/00 - Processes of additive manufacturing
  • B33Y 50/02 - Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
  • G01N 1/31 - Apparatus therefor
  • G01N 35/00 - Automatic analysis not limited to methods or materials provided for in any single one of groups Handling materials therefor
  • G01N 35/10 - Devices for transferring samples to, in, or from, the analysis apparatus, e.g. suction devices, injection devices
  • G06T 7/11 - Region-based segmentation
  • G06T 7/50 - Depth or shape recovery
  • G06T 7/70 - Determining position or orientation of objects or cameras

16.

Metallic nanoparticle composition and method of dispensing metallic nanoparticle composition

      
Application Number 17998381
Grant Number 12577423
Status In Force
Filing Date 2021-05-11
First Publication Date 2023-06-15
Grant Date 2026-03-17
Owner XTPL S.A. (Poland)
Inventor
  • Lysien, Mateusz
  • Schneider, Ludovic
  • Witczak, Lukasz
  • Fiaczyk, Karolina
  • Granek, Filip

Abstract

A metallic nanoparticle composition includes metallic nanoparticles and a non-aqueous polar protic solvent. The non-aqueous polar protic solvent has two hydroxyl groups, a boiling point of at least 280° C. at 760 mm Hg, and a viscosity in a range of 45 cP to 65 cP at 20° C. Polyvinylpyrrolidone (PVP) is present on the metallic nanoparticle surfaces. A concentration of metals in the metallic nanoparticle composition is in a range of 60 wt % to 90 wt % and a concentration, in aggregate, of solvents having a boiling point of less than 280° C. at 760 mm Hg in the metallic nanoparticle composition does not exceed 3 wt %.

IPC Classes  ?

  • C09D 11/52 - Electrically conductive inks
  • B22F 1/054 - Nanosized particles
  • B22F 1/0545 - Dispersions or suspensions of nanosized particles
  • B22F 1/102 - Metallic powder coated with organic material
  • B22F 1/107 - Metallic powder containing lubricating or binding agentsMetallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
  • B41J 2/175 - Ink supply systems
  • C09D 11/033 - Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
  • C09D 11/037 - Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
  • C09D 11/106 - Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
  • C09D 11/322 - Pigment inks
  • C09D 11/36 - Inkjet printing inks based on non-aqueous solvents
  • C09D 11/38 - Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
  • H05K 1/09 - Use of materials for the metallic pattern
  • H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
  • B22F 9/24 - Making metallic powder or suspensions thereofApparatus or devices specially adapted therefor using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions

17.

Method of forming a transparent conductive member, and a free-standing transparent conductive film

      
Application Number 18045014
Grant Number 12073962
Status In Force
Filing Date 2022-10-07
First Publication Date 2023-04-27
Grant Date 2024-08-27
Owner XTPL S.A. (Poland)
Inventor
  • Witczak, Łukasz
  • Chrzanowski, Maciej
  • Podhorodecki, Artur
  • Granek, Filip

Abstract

Devices, systems, and methods related to a transparent conductive film are disclosed. In one aspect, a method of forming a transparent conductive member (e.g., a transparent conductive film) includes extruding a metallic nanoparticle composition from a capillary tube onto a temporary substrate to form an extrudate. The extrudate can include metallic nanoparticle lines. The method further includes sintering the extrudate and the temporary substrate, dispensing a photocurable polymer onto the temporary substrate, and laminating a second substrate to the photocurable polymer. The photocurable polymer and the extrudate are interposed between the temporary substrate and the second substrate. The method further includes curing the photocurable polymer to form a transparent polymer layer and separating the temporary substrate from the transparent layer to form the transparent conductive member. The transparent conductive member includes the transparent polymer layer and the extrudate embedded in the transparent polymer layer.

IPC Classes  ?

  • H01B 5/14 - Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
  • B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
  • B32B 17/10 - Layered products essentially comprising sheet glass, or fibres of glass, slag or the like comprising glass as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
  • B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
  • H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys

18.

Method of filling a microcavity with layers of polymeric material

      
Application Number 17804939
Grant Number 11931935
Status In Force
Filing Date 2022-06-01
First Publication Date 2022-12-08
Grant Date 2024-03-19
Owner XTPL S.A. (Poland)
Inventor
  • Gadzalińska, Jolanta
  • Witczak, Łukasz
  • Wiatrowska, Aneta
  • Fia̧zyk, Karolina
  • Kowalczewski, Piotr
  • Granek, Filip

Abstract

A method of filling a microcavity with layers of a polymer material includes the following steps: (A) estimating a current vertical position of a bottom of the microcavity (current bottom position); (B) lowering the capillary tube into the microcavity towards the current bottom position; (C) dispensing a polymer composition from a tube outlet of the capillary tube under a dispensing applied pressure until the polymer composition substantially fills the microcavity; (D) curing a work piece including the microcavity and the polymer composition in the microcavity to obtain a current layer of the polymer material; and (E) repeatedly executing steps (A), (B), (C), and (D), until the layers of the polymer material have substantially filled the microcavity.

IPC Classes  ?

  • B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
  • B29C 45/00 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor
  • B29C 45/16 - Making multilayered or multicoloured articles
  • B29C 45/20 - Injection nozzles
  • B29K 77/00 - Use of polyamides, e.g. polyesteramides, as moulding material

19.

Method of detecting surface irregularities on or in an internal surface of a cylinder for use in a piston-cylinder assembly, and related apparatus

      
Application Number 17663226
Grant Number 12105012
Status In Force
Filing Date 2022-05-13
First Publication Date 2022-11-17
Grant Date 2024-10-01
Owner XTPL S.A. (Poland)
Inventor
  • Zieba, Szymon
  • Tybel, Maciej
  • Granek, Filip

Abstract

In various aspects, a method of detecting surface irregularities on or in an internal surface of a cylinder for use in a piston-cylinder assembly is disclosed. The method can include (A) fixing a position of and an orientation of a first one of the cylinder and a piston; (B) configuring a positioner and a dynamometer to move a dynamometer and a second one of the cylinder and the piston along a common longitudinal axis, the dynamometer being mechanically coupled to the second one; (C) moving the second one relative to the first one along the common longitudinal axis between a first position and a second position, the piston being located inside the cylinder at the first position and at the second position; and (D) measuring, by the dynamometer, a frictional force between the piston and the cylinder during the movement.

IPC Classes  ?

  • G01N 19/02 - Measuring coefficient of friction between materials
  • G01N 3/08 - Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces

20.

METHOD OF FORMING CONTIGUOUS CONDUCTIVE FEATURES ON A SUBSTRATE

      
Application Number 17621540
Status Pending
Filing Date 2020-07-01
First Publication Date 2022-11-10
Owner XTPL S.A. (Poland)
Inventor
  • Lysien, Mateusz
  • Wiatrowska, Aneta
  • Gadja, Monika
  • Fiaczyk, Karolina
  • Granek, Filip

Abstract

A composition for forming a contiguous conductive feature on a substrate includes silver nanoparticles, a titanium precursor compound, a first non-aqueous polar protic solvent, and a second non-aqueous polar protic solvent. The concentration of the titanium precursor compound in the composition is in a range of 2 vol % to 13 vol %. A method of forming a contiguous conductive feature on a substrate includes dispensing the composition on the substrate to form a contiguous precursor feature and sintering the contiguous precursor feature at a sintering temperature in a range of 300° C. to 500° C. to form the contiguous conductive feature. Example titanium precursor compounds are: titanium(IV) butoxide, titanium(IV) isopropoxide, titanium(IV) chloride, tetrakis(diethylamido)titanium(IV), and dimethyltitanocene.

IPC Classes  ?

  • B22F 7/04 - Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting of composite layers with one or more layers not made from powder, e.g. made from solid metal
  • B22F 1/107 - Metallic powder containing lubricating or binding agentsMetallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting

21.

Methods of dispensing a metallic nanoparticle composition from a nozzle onto a substrate

      
Application Number 17596920
Grant Number 12101893
Status In Force
Filing Date 2020-07-28
First Publication Date 2022-09-29
Grant Date 2024-09-24
Owner XTPL S.A. (Poland)
Inventor
  • Zając, Mateusz
  • Nowak, Urszula
  • Kowalczewski, Piotr
  • Granek, Filip
  • Kotarski, Jan
  • Tybel, Maciej
  • Zięba, Szymon

Abstract

A method of dispensing a metallic nanoparticle composition along a trajectory on a substrate is disclosed. The composition is dispensed from a nozzle through its outlet. The outlet is characterized by an outlet size. First, an initial pressure is applied to the composition in the nozzle to cause the composition to flow from the outlet. The nozzle is positioned at a height such that the composition does not flow onto the substrate. Second, the nozzle is lowered toward the substrate such that a fluid bridge forms between the outlet and the substrate and an adjusted pressure is applied to the composition in the nozzle. The adjusted pressure is lower than needed for the composition to continue to flow from the outlet. Third, the fluid is dispensed from the nozzle. A dispensing pressure is applied to the fluid while the nozzle is laterally displaced along the trajectory on the substrate.

IPC Classes  ?

  • H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
  • B05D 1/26 - Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface

22.

Method of forming an electrically conductive feature traversing a microscopic step and related apparatus

      
Application Number 17654088
Grant Number 12033862
Status In Force
Filing Date 2022-03-09
First Publication Date 2022-09-29
Grant Date 2024-07-09
Owner XTPL S.A. (Poland)
Inventor
  • Witczak, Łukasz
  • Gadzalińska, Jolanta
  • Wiatrowska, Aneta
  • Fia̧czyk, Karolina
  • Kowalczewski, Piotr
  • Granek, Filip

Abstract

A method of forming an electrically conductive feature traversing a microscopic step on or in a substrate is disclosed. A metallic nanoparticle composition is continuously extruded from a capillary tube (nozzle) while displacing the capillary tube along a first portion of a trajectory from a first position (above a step-top portion) past an edge of the microscopic step to a second position to form a first extrudate. The composition is continuously extruded while displacing the nozzle along a sloped second portion of the trajectory from the second position to a third position (above a step-bottom portion) to form a second extrudate. The third position is at a lower height than the second position. The composition is continuously extruded while displacing the nozzle along a third portion of the trajectory from the third position to a fourth position (above the step-bottom portion). The feature includes the first, second, and third extrudates.

IPC Classes  ?

  • H01L 21/288 - Deposition of conductive or insulating materials for electrodes from a liquid, e.g. electrolytic deposition
  • B41M 1/22 - Metallic printingPrinting with powdered inks
  • B82Y 40/00 - Manufacture or treatment of nanostructures
  • H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys

23.

METHOD OF FORMING A FEATURE BY DISPENSING A METALLIC NANOPARTICLE COMPOSITION FROM AN INK-JET PRINT HEAD AND A METALLIC NANOPARTICLE COMPOSITION FOR INK-JET PRINTING

      
Application Number IB2022051232
Publication Number 2022/172210
Status In Force
Filing Date 2022-02-11
Publication Date 2022-08-18
Owner XTPL S.A. (Poland)
Inventor
  • Łysień, Mateusz
  • Schneider, Ludovic
  • Tarapata, Grzegorz
  • Granek, Filip

Abstract

A method of forming a feature by dispensing a metallic nanoparticle composition from an ink-jet print head is disclosed. A jetting waveform is applied to piezoelectric actuator to dispense droplets of the metallic nanoparticle composition through nozzle opening. The droplets range in volume between 0.5 picoliter and 2.0 picoliter. The jetting waveform includes an intermediate contraction waveform portion, a final contraction waveform portion after the intermediate contraction waveform portion, and an expansion waveform portion after the final contraction waveform portion. During the intermediate contraction waveform portion, an applied voltage increases from an initial low voltage to an intermediate voltage and then is held at the intermediate voltage. During the final contraction waveform portion, the applied voltage increases from the intermediate voltage to maximum voltage and then is held at the maximum voltage. During the expansion waveform portion, the applied voltage decreases from the maximum voltage to a final low voltage.

IPC Classes  ?

  • B41J 2/045 - Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
  • C09D 11/322 - Pigment inks
  • C09D 11/36 - Inkjet printing inks based on non-aqueous solvents
  • C09D 11/52 - Electrically conductive inks

24.

Additive method of forming a metallic nanoparticle microdot on a substrate, a metallic nanoparticle microdot, and an elongate metallic nanoparticle feature

      
Application Number 17646333
Grant Number 12128477
Status In Force
Filing Date 2021-12-29
First Publication Date 2022-07-07
Grant Date 2024-10-29
Owner XTPL S.A. (Poland)
Inventor
  • Gadzalińska, Jolanta
  • Kowalczewski, Piotr
  • Fia̧czyk, Karolina
  • Wiatrowska, Aneta
  • Granek, Filip

Abstract

1 above the zero-height position, including forming a fluid bridge between the outlet and the substrate; (C) optionally lifting the capillary tube relative to the substrate by a height increment of Dh while continuing to extrude the metallic nanoparticle composition from the outlet; and (D) rapidly lifting the capillary tube to separate the outlet from the fluid bridge.

IPC Classes  ?

  • B05B 1/00 - Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
  • B22F 1/054 - Nanosized particles
  • B22F 1/0545 - Dispersions or suspensions of nanosized particles
  • B22F 1/107 - Metallic powder containing lubricating or binding agentsMetallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
  • B22F 10/10 - Formation of a green body
  • B22F 10/32 - Process control of the atmosphere, e.g. composition or pressure in a building chamber
  • B33Y 10/00 - Processes of additive manufacturing
  • B33Y 70/10 - Composites of different types of material, e.g. mixtures of ceramics and polymers or mixtures of metals and biomaterials
  • B33Y 80/00 - Products made by additive manufacturing

25.

Methods of detecting and adjusting contact of a micro-structural fluid ejector to a substrate and method of detecting a fault condition in fluid flow from a micro-structural fluid ejector onto a substrate

      
Application Number 17594387
Grant Number 12202279
Status In Force
Filing Date 2020-04-14
First Publication Date 2022-06-23
Grant Date 2025-01-21
Owner XTPL S.A. (Poland)
Inventor
  • Gos, Tomasz
  • Wysoczanski, Tomasz
  • Granek, Filip

Abstract

max. A method of detecting a fault condition in fluid flow from a micro-structural fluid ejector onto a substrate includes analyzing the digital image to determine whether edges are present in a region of interest where fluid dispensed from the micro-structural fluid ejector should be present.

IPC Classes  ?

  • B41J 25/308 - Bodily-movable mechanisms for print heads or carriages movable towards or from paper surface with print gap adjustment mechanisms
  • B22F 10/14 - Formation of a green body by jetting of binder onto a bed of metal powder
  • B22F 12/90 - Means for process control, e.g. cameras or sensors
  • B41J 2/165 - Prevention of nozzle clogging, e.g. cleaning, capping or moistening for nozzles
  • G05B 19/042 - Programme control other than numerical control, i.e. in sequence controllers or logic controllers using digital processors
  • H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
  • B22F 1/0545 - Dispersions or suspensions of nanosized particles

26.

METHODS OF EXTRUDING A NANOPARTICLE COMPOSITION ONTO A SUBSTRATE

      
Application Number IB2021059194
Publication Number 2022/074595
Status In Force
Filing Date 2021-10-07
Publication Date 2022-04-14
Owner XTPL S. A. (Poland)
Inventor
  • Rusek, Marcin
  • Witczak, Łukasz
  • Granek, Filip

Abstract

A method of extruding a nanoparticle composition onto a substrate is disclosed. A nanoparticle composition dispenser includes a capillary tube. The capillary tube is oriented such that a first longitudinal axis extending through the capillary tube is tilted at an oblique angle relative to a vertical axis. The capillary tube is positioned above the substrate such that the capillary tube and its reflection from the substrate are visible within a field-of-view of a camera. Digital images of the capillary tube and its reflection are captured and processed to detect the first longitudinal axis extending through the capillary tube and a second longitudinal axis extending through the reflection. A point of intersection of the first longitudinal axis and the second longitudinal axis is calculated to estimate a zero-height position. The capillary tube is positioned at a start position in accordance with the zero-height position.

IPC Classes  ?

  • B05B 15/68 - Arrangements for adjusting the position of spray heads
  • B22F 1/00 - Metallic powderTreatment of metallic powder, e.g. to facilitate working or to improve properties
  • B22F 10/10 - Formation of a green body
  • B22F 10/31 - Calibration of process steps or apparatus settings, e.g. before or during manufacturing
  • B22F 12/53 - Nozzles
  • B22F 12/90 - Means for process control, e.g. cameras or sensors
  • B33Y 10/00 - Processes of additive manufacturing
  • B33Y 50/02 - Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
  • G01B 11/14 - Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
  • G01B 11/16 - Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge
  • H05K 1/09 - Use of materials for the metallic pattern
  • H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
  • C09D 11/52 - Electrically conductive inks
  • B22F 9/24 - Making metallic powder or suspensions thereofApparatus or devices specially adapted therefor using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions

27.

Method of printing fluid

      
Application Number 17425638
Grant Number 11673406
Status In Force
Filing Date 2019-03-20
First Publication Date 2022-03-31
Grant Date 2023-06-13
Owner XTPL S.A. (Poland)
Inventor
  • Granek, Filip
  • Wiatrowska, Aneta
  • Fijak, Krzysztof
  • Dusza, Michal
  • Cichon, Przemyslaw
  • Kowalczewski, Piotr

Abstract

Method of printing fluid on a printable surface of a substrate. A print head ejects fluid in a continuous stream. The print head that includes a micro-structural fluid ejector, which consists of output, elongate input, and tapering portions between the output and the elongate input portions. The output consists of an exit orifice of an inner diameter ranging between 0.1 μm and 5 μm and an end face having a surface roughness of less than 0.1 μm. The print head is positioned above the substrate with the output of the micro-structural fluid ejector pointing downward. During printing, the print head positioning system maintains a vertical distance between the end face and the printable surface of the substrate within a range of 0 μm to 5 μm, and the pneumatic system applies pressure to the fluid in the micro-structural fluid ejector in the range of −50,000 Pa to 1,000,000 Pa.

IPC Classes  ?

28.

CONDUCTIVE INK COMPOSITIONS

      
Application Number 17425660
Status Pending
Filing Date 2019-03-20
First Publication Date 2022-03-24
Owner XTPL S.A. (Poland)
Inventor
  • Lysien, Mateusz
  • Zleba, Maciej
  • Wiatrowska, Aneta
  • Granek, Filip

Abstract

A conductive ink composition includes metallic nanoparticles, a first non-aqueous polar protic solvent, and a second non-aqueous polar protic solvent. The metallic nanoparticles can be silver nanoparticles. The silver nanoparticles can have an average particle size in a range of 20 nm to 80 nm. Polyvinylpyrrolidone is present on the metallic nanoparticle surfaces. The first solvent has a boiling point of at least 110° C. and a viscosity of at least 10 cP at 25° C. The second solvent has a boiling point of at least 200° C. and a viscosity of at least 100 cP at 25° C. The conductive ink composition contains the metallic nanoparticles in a range of 10 wt %to 75 wt %. The concentration of the second solvent in the conductive ink composition is 11.0% by volume or greater.

IPC Classes  ?

  • C09D 11/52 - Electrically conductive inks
  • C09D 11/033 - Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
  • C09D 11/037 - Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
  • C08K 3/08 - Metals
  • C08K 9/08 - Ingredients agglomerated by treatment with a binding agent
  • C08K 5/053 - Polyhydroxylic alcohols

29.

Fluid printing apparatus

      
Application Number 17425610
Grant Number 11673409
Status In Force
Filing Date 2019-03-20
First Publication Date 2022-03-17
Grant Date 2023-06-13
Owner XTPL S.A. (Poland)
Inventor
  • Granek, Filip
  • Wiatrowska, Aneta
  • Fijak, Krzysztof
  • Dusza, Michal
  • Cichon, Przemyslaw
  • Kowalczewski, Piotr

Abstract

Fluid printing apparatus including substrate, print head, pneumatic system, and print head positioning system. The print head ejects fluid in a continuous stream with a micro-structural fluid ejector consisting of output, elongate input, and tapering portions between the output and elongate input portions. The output portion consists of an exit orifice of an inner diameter ranging between 0.1 μm and 5 μm and an end face having a surface roughness of less than 0.1 μm. The print head is positioned above the substrate with the output portion of the micro-structural fluid ejector pointing downward. During printing, the print head positioning system maintains a vertical distance between the end face and the printable surface of the substrate within a range of 0 μm to 5 μm, and the pneumatic system applies pressure to the fluid in the micro-structural fluid ejector in the range of −50,000 Pa to 1,000,000 Pa.

IPC Classes  ?

  • B41J 3/28 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for printing downwardly on flat surfaces, e.g. of books, drawings, boxes
  • B41J 2/045 - Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
  • B41J 2/175 - Ink supply systems

30.

CL85

      
Application Number 018667924
Status Registered
Filing Date 2022-03-07
Registration Date 2022-07-30
Owner XTPL S.A. (Poland)
NICE Classes  ?
  • 02 - Paints, varnishes, lacquers
  • 40 - Treatment of materials; recycling, air and water treatment,

Goods & Services

Colorants, pigments and inks; Typographic ink; Printing pigments; Printing ink containing nanoparticles; Printing ink for 3D printers; Printing ink for 3D printers for electrical circuits; Conductive paints; Toners and toner cartridges, filled, for printers; Emulsions (Silver -) [pigments]; Nano-inks for industrial and laboratory printers; Nano-inks based on silver nanoparticles. Printing; Digital printing; 3D printing; Printing of nanomaterials.

31.

Method of forming an elongate electrical connection feature traversing a microscopic step

      
Application Number 17391633
Grant Number 11911814
Status In Force
Filing Date 2021-08-02
First Publication Date 2022-02-10
Grant Date 2024-02-27
Owner XTPL S.A. (Poland)
Inventor
  • Witczak, Łukasz
  • Kowalczewski, Piotr
  • Wiatrowska, Aneta
  • Fia̧czyk, Karolina
  • Kosior, Łukasz
  • Granek, Filip

Abstract

A method of forming an elongate electrical connection feature that traverses at least one step on or in a substrate is disclosed. A metallic nanoparticle composition is extruded from a capillary tube while the capillary tube is displaced relative to the substrate. The method includes: (1) continuously extruding the composition from the capillary tube while displacing the capillary tube by a height increment during a displacement period; (2) continuously extruding the composition from the capillary tube while the capillary tube is stationary during a stationary period; and (3) repeatedly executing (1) and (2) until the capillary tube is displaced from a position at a step bottom portion to another position at a height not lower than a step top portion.

IPC Classes  ?

  • B21C 23/00 - Extruding metalImpact extrusion
  • H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
  • B22F 3/20 - Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sinteringApparatus specially adapted therefor by extruding

32.

Method of estimating a line width of a nanoparticle line formed using a capillary tube, and related methods

      
Application Number 17337070
Grant Number 11754483
Status In Force
Filing Date 2021-06-02
First Publication Date 2021-12-09
Grant Date 2023-09-12
Owner XTPL S.A. (Poland)
Inventor
  • Zieba, Szymon
  • Tybel, Maciej
  • Kowalczewski, Piotr
  • Granek, Filip

Abstract

A method of obtaining a numerical model is disclosed. The numerical model correlates estimated line width values to minimum pressure for gas bubble generation (MPGBG) values. An MPGBG value of each capillary tube in the reference group is measured for a liquid. A nanoparticle composition is deposited, under standard conditions, on substrate(s) from each respective reference capillary tube, to form nanoparticle lines. A line width of each of the nanoparticle lines deposited using each respective reference capillary tube is measured by a microscope apparatus. A numerical model that correlates estimated line width values to MPGBG values for the liquid is calculated.

IPC Classes  ?

  • G01N 13/02 - Investigating surface tension of liquids

33.

Metallic nanoparticle composition dispenser and method of dispensing metallic nanoparticle composition

      
Application Number 17314739
Grant Number 12285898
Status In Force
Filing Date 2021-05-07
First Publication Date 2021-11-18
Grant Date 2025-04-29
Owner XTPL S.A. (Poland)
Inventor
  • Kaczmarz, Krzysztof
  • Tybel, Maciej
  • Witczak, Łukasz
  • Fiączyk, Karolina
  • Granek, Filip

Abstract

A metallic nanoparticle composition dispenser includes a piston-cylinder assembly and a capillary tube. The piston-cylinder assembly includes a cylinder, a pneumatic port at first end of the cylinder, an outlet port at a second end of the cylinder opposite the first end, and a piston movable in the cylinder between the first end and the second end. The capillary tube has a tube inlet and a tube outlet, with the tube inlet being coupled to the outlet port of the cylinder. A metallic nanoparticle composition is contained in the cylinder. The metallic nanoparticle composition dispenser is configured such that the metallic nanoparticle composition is extruded by the piston through the capillary tube under pneumatic actuation by a regulated pneumatic system coupled to the pneumatic port.

IPC Classes  ?

  • B29C 48/475 - Means for plasticising or homogenising the moulding material or forcing it through the nozzle or die using pistons, accumulators or press rams
  • B29C 48/00 - Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired formApparatus therefor
  • B29K 105/16 - Fillers
  • B29K 505/14 - Noble metals, e.g. silver, gold or platinum
  • C09D 11/033 - Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
  • C09D 11/037 - Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
  • C09D 11/106 - Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
  • C09D 11/52 - Electrically conductive inks

34.

METALLIC NANOPARTICLE COMPOSITION AND METHOD OF DISPENSING METALLIC NANOPARTICLE COMPOSITION

      
Application Number IB2021054005
Publication Number 2021/229435
Status In Force
Filing Date 2021-05-11
Publication Date 2021-11-18
Owner XTPL S.A. (Poland)
Inventor
  • Łysień, Mateusz
  • Schneider, Ludovic
  • Witczak, Łukasz
  • Fiączyk, Karolina
  • Granek, Filip

Abstract

A metallic nanoparticle composition includes metallic nanoparticles and a non-aqueous polar protic solvent. The non-aqueous polar protic solvent has two hydroxyl groups, a boiling point of at least 280 °C at 760 mm Hg, and a viscosity in a range of 45 cP to 65 cP at 20 °C. Polyvinylpyrrolidone (PVP) is present on the metallic nanoparticle surfaces. A concentration of metals in the metallic nanoparticle composition is in a range of 60 wt % to 90 wt % and a concentration, in aggregate, of solvents having a boiling point of less than 280 °C at 760 mm Hg in the metallic nanoparticle composition does not exceed 3 wt %.

IPC Classes  ?

  • B22F 1/00 - Metallic powderTreatment of metallic powder, e.g. to facilitate working or to improve properties

35.

Method of forming a structure upon a substrate

      
Application Number 17265382
Grant Number 11490526
Status In Force
Filing Date 2019-08-01
First Publication Date 2021-09-30
Grant Date 2022-11-01
Owner XTPL S.A. (Poland)
Inventor
  • Kowalczewski, Piotr
  • Wiatrowska, Aneta
  • Dusza, Michal
  • Granek, Filip

Abstract

A method of forming a structure upon a substrate is disclosed. The method comprises: providing a substrate upon a surface of which a plurality of electrically conductive pads are disposed; depositing fluid containing a dispersion of electrically polarizable nanoparticles onto the substrate such that at least a portion of a first one of the plurality of pads is in contact with the fluid; applying an alternating electric field to the fluid using a first electrode and a second electrode, the first electrode being positioned so as to provide an effective first electrode end position from which the electric field is applied, coincident with the deposited fluid, and spaced apart from the first pad by a distance, and the second electrode being in contact with the first pad, such that a plurality of the nanoparticles are assembled to form a first elongate structure extending along at least part of the distance between the effective first electrode end position and the portion of the first pad.

IPC Classes  ?

  • H05K 3/00 - Apparatus or processes for manufacturing printed circuits
  • H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
  • H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
  • H05K 1/09 - Use of materials for the metallic pattern

36.

Method of decreasing a sheet resistance of a transparent conductor and a method of forming a multilayer transparent conductor

      
Application Number 17202226
Grant Number 11905591
Status In Force
Filing Date 2021-03-15
First Publication Date 2021-09-16
Grant Date 2024-02-20
Owner XTPL S.A. (Poland)
Inventor
  • Stańczak, Anna
  • Gadzalińska, Jolanta
  • Lysień, Mateusz
  • Wiatrowska, Aneta
  • Granek, Filip

Abstract

A method of decreasing a sheet resistance of a transparent conductor is disclosed. The method includes the following: forming a first transparent conductor layer on a substrate; dispensing a metallic nanoparticle composition on the first transparent conductor layer to form metallic nanoparticle features; and sintering at least the first transparent conductor layer and the metallic nanoparticle features. The first transparent conductor layer includes a crystalline metal oxide. The aperture ratio of the transparent conductor is in a range of 90% to 99%. A multilayer transparent conductor and a method of forming a multilayer transparent conductor are also disclosed.

IPC Classes  ?

  • C23C 14/35 - Sputtering by application of a magnetic field, e.g. magnetron sputtering
  • C23C 14/08 - Oxides
  • C04B 35/457 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on zinc, tin or bismuth oxides or solid solutions thereof with other oxides, e.g. zincates, stannates or bismuthates based on tin oxides or stannates

37.

Method of measuring a minimum pressure for gas bubble generation of a capillary tube, and related methods

      
Application Number 17174892
Grant Number 12253537
Status In Force
Filing Date 2021-02-12
First Publication Date 2021-08-12
Grant Date 2025-03-18
Owner XTPL S.A. (Poland)
Inventor
  • Zięba, Szymon
  • Tybel, Maciej
  • Kowalczewski, Piotr
  • Granek, Filip

Abstract

A method of measuring a minimum pressure for gas bubble generation (MPGBG) value of a capillary tube is disclosed. The capillary tube has an inlet and an output portion including an outlet. The inlet is connected to a regulated pneumatic system, configured to supply a gas to the inlet under pressure. The output portion is immersed in a liquid. The gas is supplied to the inlet under a range of pressures including a higher pressure range and a lower pressure range. In the higher pressure range, gas bubbles are generated in the liquid from the outlet. In the lower pressure range, no gas bubbles are generated in the liquid from the outlet. A value of the minimum pressure for gas bubble generation (MPGBG) for the liquid is determined. Other methods include a method of measuring and storing MPGBG values of capillary tubes, methods of selecting at least one capillary tube from a plurality of capillary tubes, and a method of cutting a capillary tube to a desired MPGBG value.

IPC Classes  ?

  • G01N 7/14 - Analysing materials by measuring the pressure or volume of a gas or vapour by allowing the material to emit a gas or vapour, e.g. water vapour, and measuring a pressure or volume difference
  • B01F 23/231 - Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids by bubbling
  • B01L 3/00 - Containers or dishes for laboratory use, e.g. laboratory glasswareDroppers
  • G01N 13/02 - Investigating surface tension of liquids

38.

Method of estimating an output diameter of a capillary tube, and related methods

      
Application Number 17174912
Grant Number 11691110
Status In Force
Filing Date 2021-02-12
First Publication Date 2021-08-12
Grant Date 2023-07-04
Owner XTPL S.A. (Poland)
Inventor
  • Zięba, Szymon
  • Tybel, Maciej
  • Kowalczewski, Piotr
  • Granek, Filip

Abstract

A method of obtaining a numerical model is disclosed. The numerical model correlates estimated capillary tube output diameter values to minimum pressure for gas bubble generation (MPGBG) values. An MPGBG value of each capillary tube in the reference group is measured for a liquid. An output diameter of each of the capillary tubes is measured by a microscope apparatus. A numerical model that correlates estimated capillary tube output diameter values to MPGBG values for the liquid is calculated. A method of estimating an output diameter of a capillary tube includes the following steps. An MPGBG value of the capillary tube for a liquid is measured, and the measured MPGBG value is input into the numerical model to estimate the capillary tube output diameter value. Other methods include a method of estimating an output diameter value of a capillary tube in a test group, a method of estimating and storing output diameter values of capillary tubes in a test group, methods of selecting at least one capillary tube from a plurality of capillary tubes in a test group, and a method of cutting a capillary tube to a desired estimated capillary tube output diameter value.

IPC Classes  ?

  • B01F 23/23 - Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids
  • B01F 23/232 - Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids using flow-mixing means for introducing the gases, e.g. baffles
  • B01F 23/20 - Mixing gases with liquids
  • B01F 23/454 - Mixing liquids with liquidsEmulsifying using flow mixing by injecting a mixture of liquid and gas
  • B01F 23/2373 - Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids characterised by the physical or chemical properties of gases or vapours introduced in the liquid media for obtaining fine bubbles, i.e. bubbles with a size below 100 µm

39.

Method for repairing conductor tracks

      
Application Number 16972094
Grant Number 11419219
Status In Force
Filing Date 2019-06-05
First Publication Date 2021-07-22
Grant Date 2022-08-16
Owner XTPL S.A. (Poland)
Inventor
  • Kowalczewski, Piotr
  • Wiatrowska, Aneta
  • Dusza, Michal
  • Granek, Filip

Abstract

A method for modifying an elongate structure including providing a fluid deposited onto the substrate, the fluid containing a dispersion of electrically polarizable nanoparticles and applying an AC voltage across a portion of the elongate structure so as to cause an alternating electric current to pass through the narrow section such that a break in the elongate structure is formed at the narrow section, the break being defined between a first broken end and a second broken end of the elongate structure, and then cause, when the break is formed, an alternating electric field to be applied to the fluid such that a plurality of the nanoparticles contained in the fluid are assembled to form a continuation of the elongate structure extending from the first broken end towards the second broken end so as to join the first and second broken ends.

IPC Classes  ?

  • H05K 3/22 - Secondary treatment of printed circuits
  • H05K 3/46 - Manufacturing multi-layer circuits

40.

Metallic nanoparticle compositions

      
Application Number 17024512
Grant Number 11549026
Status In Force
Filing Date 2020-09-17
First Publication Date 2021-03-25
Grant Date 2023-01-10
Owner XTPL S.A. (Poland)
Inventor
  • Lysień, Mateusz
  • Wiatrowska, Aneta
  • Ziȩba, Maciej
  • Schneider, Ludovic
  • Granek, Filip

Abstract

A metallic nanoparticle composition includes copper nanoparticles, a first non-aqueous polar protic solvent (boiling point in a range of 180° C. to 250° C. and viscosity in a range of 10 cP to 100 cP at 25° C.), and a second non-aqueous polar protic solvent (boiling point in a range of 280° C. to 300° C. and a viscosity of at least 100 cP at 25° C.). The concentration of copper nanoparticles in the composition is in a range of 32 wt % to 55 wt %, and the concentration of the second non-aqueous polar protic solvent in the composition is in a range of 4 wt % to 10 wt %. There is polyvinylpyrrolidone present on the copper nanoparticles surfaces. The composition's viscosity is at least 250 cP at 25° C.

IPC Classes  ?

  • C09D 11/033 - Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
  • C09D 11/52 - Electrically conductive inks
  • C09D 11/106 - Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
  • C09D 11/037 - Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment

41.

METHODS OF DISPENSING A METALLIC NANOPARTICLE COMPOSITION FROM A NOZZLE ONTO A SUBSTRATE

      
Application Number IB2020057100
Publication Number 2021/019435
Status In Force
Filing Date 2020-07-28
Publication Date 2021-02-04
Owner XTPL S.A. (Poland)
Inventor
  • Zając, Mateusz
  • Nowak, Urszula
  • Kowalczewski, Piotr
  • Granek, Filip
  • Kotarski, Jan
  • Tybel, Maciej
  • Zieba, Szymon

Abstract

A method of dispensing a metallic nanoparticle composition along a trajectory on a substrate (110) is disclosed. First, an initial pressure is applied to the composition in the nozzle to cause the composition to flow from the outlet. The nozzle (200) is positioned at a height such that the composition does not flow onto the substrate. Second, the nozzle is lowered toward the substrate such that a fluid bridge forms between the outlet and the substrate (110) and an adjusted pressure is applied to the composition in the nozzle (200). The adjusted pressure is lower than needed for the composition to continue to flow from the outlet. Third, the fluid is dispensed from the nozzle (200). A dispensing pressure is applied to the fluid while the nozzle is laterally displaced along the trajectory on the substrate (110).

IPC Classes  ?

  • B83B 3/00 -
  • H01L 21/00 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid-state devices, or of parts thereof

42.

METHOD OF FORMING CONTIGUOUS CONDUCTIVE FEATURES ON A SUBSTRATE

      
Application Number IB2020056215
Publication Number 2021/001763
Status In Force
Filing Date 2020-07-01
Publication Date 2021-01-07
Owner XTPL S.A. (Poland)
Inventor
  • Łysień, Mateusz
  • Wiatrowska, Aneta
  • Żelechowska, Monika
  • Fiączyk, Karolina
  • Granek, Filip

Abstract

A composition for forming a contiguous conductive feature on a substrate includes silver nanoparticles, a titanium precursor compound, a first non-aqueous polar protic solvent, and a second non‐aqueous polar protic solvent. The concentration of the titanium precursor compound in the composition is in a range of 2 vol % to 13 vol %. A method of forming a contiguous conductive feature on a substrate includes dispensing the composition on the substrate to form a contiguous precursor feature and sintering the contiguous precursor feature at a sintering temperature in a range of 300 °C to 500 °C to form the contiguous conductive feature. Example titanium precursor compounds are: titanium(IV) butoxide, titanium(IV) isopropoxide, titanium(IV) chloride, tetrakis(diethylamido)titanium(IV), and dimethyltitanocene.

IPC Classes  ?

  • B22F 1/02 - Special treatment of metallic powder, e.g. to facilitate working, to improve properties; Metallic powders per se, e.g. mixtures of particles of different composition comprising coating of the powder
  • B22F 1/00 - Metallic powderTreatment of metallic powder, e.g. to facilitate working or to improve properties
  • B22F 9/24 - Making metallic powder or suspensions thereofApparatus or devices specially adapted therefor using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
  • C09D 11/037 - Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
  • C09D 11/52 - Electrically conductive inks
  • H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

43.

METHODS OF DETECTING AND ADJUSTING CONTACT OF A MICRO-STRUCTURAL FLUID EJECTOR TO A SUBSTRATE AND METHOD OF DETECTING A FAULT CONDITION IN FLUID FLOW FROM A MICRO STRUCTURAL FLUID EJECTOR ONTO A SUBSTRATE

      
Application Number IB2020053500
Publication Number 2020/212840
Status In Force
Filing Date 2020-04-14
Publication Date 2020-10-22
Owner XTPL S.A. (Poland)
Inventor
  • Gos, Tomasz
  • Wysoczański, Tomasz
  • Granek, Filip

Abstract

Methods are disclosed relating to the operation of a micro-structural fluid ejector in a fluid printing apparatus. The methods include providing an imaging system, capturing a digital image of the micro-structural fluid ejector and its surroundings, and pre-processing the digital image to detect edges. A method of detecting contact of a micro-structural fluid ejector to a substrate includes repeatedly lowering the print head and measuring the length of a detected edge until the currently measured length is determined to be longer than a previously measured length. A method of adjusting contact of a micro-structural fluid ejector to a substrate includes calculating a bending coefficient A of the micro-structural fluid ejector and lowering the print head toward the substrate if the bending coefficient A is less than a minimum threshold value Amin, raising the print head away from the substrate if the bending coefficient A is greater than a maximum threshold value Amax, and making no change to the vertical displacement of the print head if the bending coefficient A is in the range of Amin to Amax. A method of detecting a fault condition in fluid flow from a micro-structural fluid ejector onto a substrate includes analyzing the digital image to determine whether edges are present in a region of interest where fluid dispensed from the micro-structural fluid ejector should be present.

IPC Classes  ?

  • B41J 25/308 - Bodily-movable mechanisms for print heads or carriages movable towards or from paper surface with print gap adjustment mechanisms
  • B41J 2/005 - Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
  • B41J 25/312 - Bodily-movable mechanisms for print heads or carriages movable towards or from paper surface with print pressure adjustment mechanisms, e.g. pressure-on-the-paper mechanisms
  • B41J 2/165 - Prevention of nozzle clogging, e.g. cleaning, capping or moistening for nozzles
  • B05D 1/00 - Processes for applying liquids or other fluent materials
  • B05C 5/00 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
  • B41J 29/393 - Devices for controlling or analysing the entire machine
  • B22F 3/00 - Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sinteringApparatus specially adapted therefor
  • B41J 2/16 - Production of nozzles
  • C09D 11/52 - Electrically conductive inks
  • G03F 1/72 - Repair or correction of mask defects
  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
  • B82Y 10/00 - Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
  • B82Y 40/00 - Manufacture or treatment of nanostructures
  • H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
  • H01L 21/288 - Deposition of conductive or insulating materials for electrodes from a liquid, e.g. electrolytic deposition

44.

CONDUCTIVE INK COMPOSITIONS

      
Application Number IB2019052288
Publication Number 2020/170012
Status In Force
Filing Date 2019-03-20
Publication Date 2020-08-27
Owner XTPL S.A. (Poland)
Inventor
  • Łysień, Mateusz
  • Zięba, Maciej
  • Wiatrowska, Aneta
  • Granek, Filip

Abstract

A conductive ink composition includes metallic nanoparticles, a first non-aqueous polar protic solvent, and a second non-aqueous polar protic solvent. The metallic nanoparticles can be silver nanoparticles. The silver nanoparticles can have an average particle size in a range of 20 nm to 80 nm. Polyvinylpyrrolidone is present on the metallic nanoparticle surfaces. The first solvent has a boiling point of at least 110 °C and a viscosity of at least 10 cP at 25 ºC. The second solvent has a boiling point of at least 200 °C and a viscosity of at least 100 cP at 25 °C. The conductive ink composition contains the metallic nanoparticles in a range of 10 wt % to 75 wt %. The concentration of the second solvent in the conductive ink composition is 11.0 % by volume or greater.

IPC Classes  ?

45.

FLUID PRINTING APPARATUS

      
Application Number IB2019052285
Publication Number 2020/157547
Status In Force
Filing Date 2019-03-20
Publication Date 2020-08-06
Owner XTPL S.A. (Poland)
Inventor
  • Granek, Filip
  • Wiatrowska, Aneta
  • Fijak, Krzysztof
  • Dusza, Michał
  • Cichoń, Przemysław
  • Kowalczewski, Piotr

Abstract

Fluid printing apparatus (100) including substrate (110), print head (104), pneumatic system (106), and print head positioning system (108). The print head (104) ejects fluid in a continuous stream with a micro-structural fluid ejector (200) consisting of output (166), elongate input, and tapering portions between the output (166) and elongate input portions. The output portion (166) consists of an exit orifice of an inner diameter ranging between 0.1 μm and 5 μm and an end face having a surface roughness of less than 0.1 μm. The print head (104) is positioned above the substrate (110) with the output portion (166) of the micro-structural fluid ejector (200) pointing downward. During printing, the print head positioning system (108) maintains a vertical distance between the end face and the printable surface (112) of the substrate (110) within a range of 0 μm to 5 μm and the pneumatic system (106) applies pressure to the fluid in the micro-structural fluid ejector (200) in the range of -50,000 Pa to 1,000,000 Pa.

IPC Classes  ?

  • B41J 2/135 - Nozzles
  • B41J 2/07 - Ink jet characterised by jet control
  • B41J 3/407 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material

46.

METHOD OF PRINTING FLUID

      
Application Number IB2019052287
Publication Number 2020/157548
Status In Force
Filing Date 2019-03-20
Publication Date 2020-08-06
Owner XTPL S.A. (Poland)
Inventor
  • Granek, Filip
  • Wiatrowska, Aneta
  • Fijak, Krzysztof
  • Dusza, Michał
  • Cichoń, Przemysław
  • Kowalczewski, Piotr

Abstract

Method of printing fluid on a printable surface (112) of a substrate (110). The print head (104) that includes a micro-structural fluid ejector (200), which consists of output (166), elongate input, and tapering portions between the output (166) and the elongate input portions. The output portion (166) consists of an exit orifice of an inner diameter ranging between 0.1 μm and 5 μm and an end face having a surface roughness of less than 0.1 μm. The print head (104) is positioned above the substrate (110) with the output portion (166) of the micro-structural fluid ejector (200) pointing downward. During printing, the print head positioning system (108) maintains a vertical distance between the end face and the printable surface (112) of the substrate (110) within a range of 0 μm to 5 μm and the pneumatic system (106) applies pressure to the fluid in the micro-structural fluid ejector (200) in the range of -50,000 Pa to 1,000,000 Pa.

IPC Classes  ?

  • B41J 2/135 - Nozzles
  • B41J 2/07 - Ink jet characterised by jet control
  • B41J 3/407 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material

47.

METHOD OF FORMING A STRUCTURE UPON A SUBSTRATE

      
Application Number EP2019070816
Publication Number 2020/025767
Status In Force
Filing Date 2019-08-01
Publication Date 2020-02-06
Owner XTPL S.A. (Poland)
Inventor
  • Kowalczewski, Piotr
  • Wiatrowska, Aneta
  • Dusza, Michal
  • Granek, Filip

Abstract

A method of forming a structure upon a substrate is disclosed. The method comprises: providing a substrate upon a surface of which a plurality of electrically conductive pads are disposed; depositing fluid containing a dispersion of electrically polarizable nanoparticles onto the substrate such that at least a portion of a first one of the plurality of pads is in contact with the fluid; applying an alternating electric field to the fluid using a first electrode and a second electrode, the first electrode being positioned so as to provide an effective first electrode end position from which the electric field is applied, coincident with the deposited fluid, and spaced apart from the first pad by a distance, and the second electrode being in contact with the first pad, such that a plurality of the nanoparticles are assembled to form a first elongate structure extending along at least part of the distance between the effective first electrode end position and the portion of the first pad.

IPC Classes  ?

  • H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
  • H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material

48.

METHOD FOR REPAIRING CONDUCTOR TRACKS

      
Application Number EP2019064622
Publication Number 2019/234089
Status In Force
Filing Date 2019-06-05
Publication Date 2019-12-12
Owner XTPL S.A. (Poland)
Inventor
  • Kowalczewski, Piotr
  • Wiatrowska, Aneta
  • Dusza, Michal
  • Granek, Filip

Abstract

A method provided for modifying an elongate structure (101). The method comprises: providing a fluid deposited onto the substrate, the fluid containing a dispersion of electrically polarizable nanoparticles and being positioned so that at least the narrow section (103) of the elongate structure (101) is immersed therein; and applying an AC voltage across a portion of the elongate structure (101) that includes the narrow section (103) using a first electrode in contact with the elongate structure (101) at a first end (105A) of the portion and a second electrode in contact with the elongate structure (101) at a second end (105B) of the portion, so as to: cause an alternating electric current to pass through the narrow section (103) such that a break in the elongate structure (101) is formed at the narrow section (103), the break being defined between a first broken end (105A) and a second broken end (105B) of the elongate structure (101), and then cause, when the break is formed, an alternating electric field to be applied to the fluid such that a plurality of the nanoparticles contained in the fluid are assembled to form a continuation of the elongate structure (101) extending from the first broken end (105A) towards the second broken end (105B) so as to join the first (105A) and second (105B) broken ends.

IPC Classes  ?

  • H05K 1/09 - Use of materials for the metallic pattern
  • H05K 3/22 - Secondary treatment of printed circuits
  • H05K 1/02 - Printed circuits Details
  • H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
  • H05K 3/24 - Reinforcing of the conductive pattern
  • B82Y 40/00 - Manufacture or treatment of nanostructures

49.

Bottom-up method for forming wire structures upon a substrate

      
Application Number 16087462
Grant Number 10731268
Status In Force
Filing Date 2017-03-21
First Publication Date 2019-04-11
Grant Date 2020-08-04
Owner XTPL S.A. (Poland)
Inventor
  • Granek, Filip
  • Rozynek, Zbigniew

Abstract

A method is provided for forming structures upon a substrate. The method comprises: depositing fluid onto a substrate so as to define a wetted region, the fluid containing electrically polahzable nanoparticles; applying an alternating electric field to the fluid on the region, using a first electrode and a second electrode, so that a plurality of the nanoparticles are assembled to form an elongate structure extending from the first electrode towards the second electrode; and removing the fluid such that the elongate structure remains upon the substrate.

IPC Classes  ?

  • C25D 13/12 - Electrophoretic coating characterised by the process characterised by the article coated
  • C25D 13/22 - Servicing or operating
  • B82B 3/00 - Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
  • H01L 29/06 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions
  • H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L 21/326 - Application of electric currents or fields, e.g. for electroforming
  • H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
  • H01L 21/66 - Testing or measuring during manufacture or treatment
  • H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
  • G02C 7/04 - Contact lenses for the eyes

50.

XTPL

      
Application Number 017998496
Status Registered
Filing Date 2018-12-11
Registration Date 2019-05-10
Owner XTPL S.A. (Poland)
NICE Classes  ?
  • 02 - Paints, varnishes, lacquers
  • 07 - Machines and machine tools
  • 09 - Scientific and electric apparatus and instruments
  • 40 - Treatment of materials; recycling, air and water treatment,
  • 42 - Scientific, technological and industrial services, research and design

Goods & Services

Colorants, pigments and inks; Typographic ink; Printing pigments; Printing ink containing nanoparticles; Printing ink for 3D printers; Printing ink for 3D printers for electrical circuits; Conductive paints; Toners and toner cartridges, filled, for printers; Emulsions (Silver -) [pigments]; Nano-inks for industrial and laboratory printers; Nano-inks based on silver nanoparticles. Printing machines; Parts and fittings for printing machines and printers; Print heads for nanomaterial printers and printing machines; 3D printers; Printers for 3D printed circuits; Printers for printing multi-layer printed circuit boards; Nanomaterial printers. Scientific, photographic, optical, measuring, signalling, checking (supervision) and control apparatus and instruments; Data processing equipment; Computers; Programs for computers; Controlling software for computer printers; Operating programs for industrial and laboratory printers; Printers for computers; multifunction printers (MFPs); Print heads for multifunctional printers and for computer printers; Replicating apparatus; Precision measuring apparatus; Electric and electronic components; Optical fibers [fibres] [light conducting filaments]; Information technology and audio-visual, multimedia and photographic devices; Semiconductors; Circuit boards for electrical and; Conductive foils for use in electronics and for the production of thin-film photoelectric cells; Apparatus and instruments for controlling electricity; Apparatus and instruments for accumulating electricity; Apparatus and instruments for switching electricity; Apparatus and instruments for transforming electricity; Apparatus and instruments for regulating electricity; Apparatus and instruments for conducting electricity. Printing; Digital printing; 3D printing; Printing of nanomaterials. Scientific and technical services and research and design relating thereto; Industrial analysis and research services; Nanotechnology research; Technical consultancy in connection with the aforesaid services.

51.

XTPL

      
Application Number 017998502
Status Registered
Filing Date 2018-12-11
Registration Date 2019-05-10
Owner XTPL S.A. (Poland)
NICE Classes  ?
  • 02 - Paints, varnishes, lacquers
  • 07 - Machines and machine tools
  • 09 - Scientific and electric apparatus and instruments
  • 40 - Treatment of materials; recycling, air and water treatment,
  • 42 - Scientific, technological and industrial services, research and design

Goods & Services

Colorants, pigments and inks; Typographic ink; Printing pigments; Printing ink containing nanoparticles; Printing ink for 3D printers; Printing ink for 3D printers for electrical circuits; Conductive paints; Toners and toner cartridges, filled, for printers; Emulsions (Silver -) [pigments]; Nano-inks for industrial and laboratory printers; Nano-inks based on silver nanoparticles. Printing machines; Parts and fittings for printing machines and printers; Print heads for nanomaterial printers and printing machines; 3D printers; Printers for 3D printed circuits; Printers for printing multi-layer printed circuit boards; Nanomaterial printers. Scientific, photographic, optical, measuring, signalling, checking (supervision) and control apparatus and instruments; Apparatus and instruments for controlling electricity; Apparatus and instruments for accumulating electricity; Apparatus and instruments for switching electricity; Apparatus and instruments for transforming electricity; Apparatus and instruments for regulating electricity; Apparatus and instruments for conducting electricity; Data processing equipment; Computers; Programs for computers; Controlling software for computer printers; Operating programs for industrial and laboratory printers; Printers for computers; multifunction printers (MFPs); Print heads for multifunctional printers and for computer printers; Replicating apparatus; Precision measuring apparatus; Electric and electronic components; Optical fibers [fibres] [light conducting filaments]; Information technology and audio-visual, multimedia and photographic devices; Semiconductors; Circuit boards for electrical and; Conductive foils for use in electronics and for the production of thin-film photoelectric cells. Printing; Digital printing; 3D printing; Printing of nanomaterials. Scientific and technical services and research and design relating thereto; Industrial analysis and research services; Nanotechnology research; Technical consultancy in connection with the aforesaid services.

52.

BOTTOM-UP METHOD FOR FORMING WIRE STRUCTURES UPON A SUBSTRATE

      
Application Number EP2017056739
Publication Number 2017/162696
Status In Force
Filing Date 2017-03-21
Publication Date 2017-09-28
Owner XTPL S.A. (Poland)
Inventor
  • Granek, Filip
  • Rozynek, Zbigniew

Abstract

A method is provided for forming structures upon a substrate. The method comprises: depositing fluid onto a substrate so as to define a wetted region, the fluid containing electrically polahzable nanoparticles; applying an alternating electric field to the fluid on the region, using a first electrode and a second electrode, so that a plurality of the nanoparticles are assembled to form an elongate structure extending from the first electrode towards the second electrode; and removing the fluid such that the elongate structure remains upon the substrate.

IPC Classes  ?

  • H01L 29/06 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions
  • B82B 3/00 - Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units