A selective audio source enhancement system includes a processor and a memory, and a pre-processing unit configured to receive audio data including a target audio signal, and to perform sub-band domain decomposition of the audio data to generate buffered outputs, in addition, the system includes a target source detection unit configured to receive the buffered outputs, and to generate a target presence probability corresponding to the target audio signal, as well as a spatial filter estimation unit configured to receive the target presence probability, and to transform frames buffered in each sub-band into a higher resolution frequency-domain. The system also includes a spectral filtering unit configured to retrieve a multichannel image of the target audio signal and noise signals associated with the target audio signal, and an audio synthesis unit configured to extract an enhanced mono signal corresponding to the target audio signal from the multichannel image.
There is provided a semiconductor stud bump wafer level package (110, 201, 301) and a manufacturing method thereof, comprising a semiconductor die (112, 212a, 212b, 312a, 312b) having a plurality of bond pads (130) on a top surface thereof, a plurality of metallic (e.g. copper) stud bumps (120, 220, 320) mechanically and electrically coupled to said plurality of bond pads (130), a plurality of solder balls (160, 260, 360) mechanically and electrically coupled to said plurality of metallic stud bumps (120, 220, 320) and a mould compound (140, 240, 340) encapsulating the plurality of metallic stud bumps (120, 220, 320) while exposing a top surface of each of the plurality of metallic stud bumps (120, 220, 320). In one embodiment, singulation of the wafer (101) is performed after connecting the solder balls (160) to the stud bumps (120) and subsequent testing of die proper functionality and die marking. In another embodiment, singulation of the wafer is performed before forming the mould compound (240), wherein singulated dies (212a, 212b) are mounted on a substrate (215) and subsequently encapsulated. In still another embodiment, singulated dies (312a, 312b) are mounted on a substrate (315) and bond pads (330a, 330b) at die perimeter are wire-bonded to the substrate (315), advantageously during the same manufacturing step as when the stud bumps (360) are formed, after which the moulded compound (340) is formed. Advantageously, the metallic stud bumps (120, 220, 320) may be provided using standard wirebonding equipment by directly bonding to a die bond pad (130), for example having a single aluminium finish, avoiding the conventional wafer level package requirement for photolithography and deposition steps to provide a multi-layer metallic routing structure to an array of under bump metal (UBM) pads. As a result, reduced cycle times, lower cost, and reduced complexity may be provided.
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H01L 23/485 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
3.
SPOT PLATED LEADFRAME AND IC BOND PAD VIA ARRAY DESIGN FOR COPPER WIRE
There is provided a system and method for a spot plated leadframe and an IC bond pad via array design for copper wire. There is provided a semiconductor package comprising a leadframe (130) having a pre-plated finish (133) and a spot plating (134) on said pre-plated finish (133), a semiconductor die (140) including a bond pad (144) on a top surface thereof, and a copper wire (122) bonded to said spot plating (134) and to said bond pad (144). Optionally, a novel corner via array design (246) may be provided under the bond pad (243) for improved package performance while maintaining the integrity of the copper wire bond- The semiconductor package may provide several advantages including high MSL ratings, simplified assembly cycles, avoidance of tin whisker issues, and low cost compared to conventional packages using gold wire bonds.
H01L 23/485 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
H01L 23/49 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of soldered or bonded constructions wire-like
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
Presented is a method and associated system for suppression of linear and nonlinear echo. The method includes dividing an input signal into several frequency bands in each of a several of time frames. The input signal may include an echo signal. The method further includes multiplying the input signal in each of the several frequency bands by a corresponding echo suppression signal. Calculating the corresponding echo suppression signal may include estimating a power of the echo signal in a particular frequency band as a sum of several component echo powers, each of the several component echo powers due to an excitation from a far-end signal in a corresponding one of the several frequency bands. Calculating the corresponding echo suppression signal may further include subtracting the power of the echo signal in the particular frequency band from a power of the input signal in the particular frequency band.
H04B 3/21 - Reducing echo effects or singingOpening or closing transmitting pathConditioning for transmission in one direction or the other using a set of bandfilters
CONEXANT SYSTEMS, INC., A DELAWARE CORPORATION (USA)
Inventor
Jonsson, Ragnar, H.
Olafsson, Sverrir
Thormundsson, Trausti
Abstract
[068] Acoustic echoes in communications systems are distracting and undesirable. Acoustic echoes occur in communications systems where sound produced by a speaker is picked up by a microphone in a communications system. In a stereo playback environment, echo cancellation techniques become more complicated. Echo cancellation can be performed by performing echo cancellation on a center signal, which is the sum of a left channel signal and the right channel signal, or left signal and a difference signal, which is the difference of the right channel signal and the left channel signal. The adaptation rates of the two echo cancellers meet certain constraints to prevent degeneracies in the echo cancellation system.
H04B 3/23 - Reducing echo effects or singingOpening or closing transmitting pathConditioning for transmission in one direction or the other using a replica of transmitted signal in the time domain, e.g. echo cancellers
H04M 9/08 - Two-way loud-speaking telephone systems with means for conditioning the signal, e.g. for suppressing echoes for one or both directions of traffic
6.
SYSTEMS AND METHODS FOR IMPROVED HEAT DISSIPATION IN SEMICONDUCTOR PACKAGES
Today's high speed semiconductor chips offer high performance at the expense of increase heat generation. A heat spreader can be build into a mold compound covering a semiconductor die in a semiconductor package by forming holes in the mold compound and filling the holes with a thermally conductive material such as thermally conductive adhesive. This heat dissipation capability can further be enhanced by a layer of thermally conductive material on the surface of the mold compound and optionally by an external metal layer or heat sink.
A system for controlling a touch screen. A touch screen element having a plurality of contacts, such as one contact electrode at each of four corners. A multiplexer coupled to the touch screen element for forming a plurality of connections, such as various combinations of the contact electrodes to allow measurements to be made of the impedance of the touch screen element from the left side to the right side, from the top to the bottom, and do forth. A touch screen processor coupled to the touch screen element for determining an oscillation frequency of the touch screen element as a function of the electrode connections.
CONEXANT SYSTEMS, INC., A DELAWARE CORPORATION (USA)
Inventor
Larsen, Christian
Komanduru, Gomathi
Crespi, Lorenzo
Abstract
A circuit for providing a reference voltage can be widely used in audio applications. However, at startup an abrupt start in the reference signal can cause undesirable audible artifacts. A circuit employing feedback of a reference voltage to control the charging of a capacitor which provides the reference voltage can be used to provide a smooth startup to the reference voltage. The circuit contains a differential pair for steering a fixed current source from one path to another as the reference voltage increases. The steered current can then be mirrored into one ore more current mirrors where the newly mirrored current can be squeezed to zero when the difference between a desired reference voltage and the reference voltage approaches zero. This newly mirrored current can be used to charge a capacitor which is used to provide the reference voltage.
CONEXANT SYSTEMS, INC., A DELAWARE CORPORATION (USA)
Inventor
Jonsson, Ragnar, H.
Walton, Derek, T.
Thormundsson, Trausti
Abstract
A system and method for defringing chromatic aberrations that occur in imaging devices such as scanners. The system comprises shift filters to shift lines in the various color planes together. In addition in each color plane, a spread filter is used to compensate for the unequal point spread functions of each color. Furthermore, the results can be enhanced by filtering in the luminance-chrominance space.
The addition of thermal conduits by bonding bond wires to bond pads either in a wire loop configuration or a pillar configuration can improve thermal dissipation of a fabricated die. The thermal conduits can be added as part of the normal packaging process of a semiconductor die and are electrically decoupled from the circuitry fabricated on the fabricated die. In an alternative, a dummy die is affixed to the fabricated die and the thermal conduits are affixed to the dummy die. Additionally, thermal conduits can be used in conjunction with a heat spreader.
CONEXANT SYSTEM, INC. A DELAWARE CORPORATION (USA)
Inventor
Jonsson, Ragnar H.
Walton, Derek T.
Abstract
A system for halftone processing is provided. The system includes a programmable halftone segmentation system having one or more programmable parameters to accommodate different input image parameters, such as different printer or scanner parameters, and configured to generate output control data as a function of image input data. A programmable output processor receives the output control data and the image input data and generates image output data that compensates for halftone regions in the image input data.
A system and apparatus for constructing a displacement model across a frequency range for a loudspeaker is disclosed. The resultant displacement model is centered around the distortion point. Once a distortion model is constructed it can be incorporated into an audio driver to prevent distortion by incorporating the model and a distortion compensation unit with a conventional audio driver. Various topologies can be used to incorporate a distortion model and distortion compensation unit into an audio driver. Furthermore, a wide variety of distortion compensation techniques can be employed to avoid distortion in such an audio driver.
Peak reduction and power limitations are used to prevent distortion and protect components. In a cellular telephone, peak reduction can be based on battery power level to prevent electrical distortion from saturation. In addition peak reduction can be used to prevent mechanical distortion such as rub and buzz. Dynamic range compression can be used for peak reduction. In another application dynamic range compression can be used to control the power output to protect a speaker from damage. One example of a dynamic range compressor/peak limiter comprises a look-ahead buffer and an analysis engine. For example, the look-ahead buffer holds a window of samples of a signal. The analysis engine selects a gain envelope function on the basis of the samples, for example, by selecting the Pth sample in the buffer whenever that sample exceeds a given threshold.
CONEXANT SYSTEMS, INC., A DELAWARE CORPORATION (USA)
Inventor
Jonsson, Ragnar, H.
Thormundsson, Trausti
Lau, Harry, K.
Abstract
In many audio playback systems, frequencies below a given cut off frequency are suppressed either due to speaker constraints or safety constraints. For example, some speakers are only capable of generating signals above a certain frequency. Prolonged low frequency sound can cause damage to speakers or other components. An audio driver can be equipped with a phantom bass module which by doubling, tripling and/or quadrupling frequencies below a cutoff frequency can simulate the bass experience. The doubling, tripling and quadrupling methods disclosed provide a low complexity formulation of a frequency doubling, tripling and quadrupling. In addition, the frequency doubling, tripling and quadrupling formulations are easily adapted to multi-rate processing, where computational savings can be very high.
CONEXANT SYSTEMS, INC., A DELAWARE CORPORATION (USA)
Inventor
Larsen, Christian
Crespi, Lorenzo
Abstract
A grounding switch is described which operates properly even in the presence of negative voltages on a signal line. The grounding switch uses isolated field effect transistors that have their substrates tied to different voltages. The isolated field effect transistor has a gate voltage and substrate voltage which can be pulled down to a negative voltage when the signal line has a negative voltage allowing the switch to remain open even with a negative voltage.
H03F 1/30 - Modifications of amplifiers to reduce influence of variations of temperature or supply voltage
H03G 3/34 - Muting amplifier when no signal is present
H02H 9/04 - Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage
H03K 17/68 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components by the use, as active elements, of semiconductor devices the devices being bipolar transistors specially adapted for switching AC currents or voltages
H03K 17/687 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components by the use, as active elements, of semiconductor devices the devices being field-effect transistors
H03F 3/181 - Low-frequency amplifiers, e.g. audio preamplifiers
H01L 27/02 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
16.
SYSTEMS AND METHODS FOR REDUCING RUB AND BUZZ DISTORTION IN A LOUDSPEAKER
An audio driver with reduced rub and buzz distortion that includes a digital processing module. A digital to audio converter (DAC) operable to receive a digital audio signal supplied by the digital processing module. One or more analog driver stages operable to receive an analog audio signal supplied by the DAC. A peak amplitude compressor.
Direct current (DC) offset in and audio driver can cause a constant drain on power even when there is no sound. Furthermore it can cause an audible pop when the audio driver is enabled. A scaled replica output stage can be employed to perform DC offset cancellation offline during a sampling phase. Once DC offset cancellation is achieved, the audio driver uses a full scale output stage during the operation phase.
Adequate heat dissipation is essential for semiconductor devices. When a device exceeds a specified junction temperature, the device can be damaged, not perform correctly, or can have a reduced operating life. Semiconductor packages must dissipate heat from the chip to the external environment (i.e. to the PCB, air, etc) to keep the semiconductor device below a certain temperature threshold. For most devices, the most efficient way to dissipate the heat is through the package external I/O connections and into the PCB that it is mounted to. For Ball Grid Array (BGA) packages, the external I/Os are solder balls. Variable pitch packages pose advantages in heat dissipation without introducing significant costs.
H01L 23/36 - Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
H01L 23/488 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of soldered or bonded constructions
Many speakers, especially small speakers are susceptible to distortion if too much power is applied in certain vulnerable frequency bands. The distortion can be prevented by applying equalization to the audio signal driving the speaker. An equalizer can be configured to suppress the audio signal in the vulnerable frequency bands. The equalizer monitors the power in the vulnerable frequency bands and suppresses those vulnerable frequency bands only when they have sufficient power to distort. In this fashion, undesired audio effects due to the equalization can be avoided.
In today's environment class-D amplifiers are used to provide an integrated solution for applications such as powered audio devices due to their advantages in power consumption and size over more traditional analog amplifiers. Due to power output requirements, the output stages of power drivers such as class-D amplifiers require a supply voltage in excess of the technologically allowed voltage for the switches in the output stage. A level shifter is used to ensure voltages supplied to the output switches do not exceed the technological limits. An ideal level shifter should provide the optimal voltage swing to output switches under all process, supply voltage and temperature (PVT) variations. The ideal level shifter should also provide fast transitions when the control signal changes from high to low and low to high.
Disclosed herein are systems and methods for sending and receiving facsimile transmissions in a voice-over-IP system. In certain embodiments, a facsimile machine includes a network interface and a call set up protocol client configured to interface with a call set up protocol server. The call set up protocol client communicates with the call set up protocol server using the network interface to establish a communication channel with the public switched telephone network. The call set up protocol client operates according to the session initiation protocol. The facsimile machine is configured to send and receive facsimile transmissions according to the T.30 protocol. In alternative embodiments, the facsimile machine is configured to send and receive facsimile transmissions according to the T.38 protocol.
A micro electro-mechanical sensor is provided. The micro electro-mechanical sensor includes a substrate, and a conducting plane disposed on the substrate. A conducting via is disposed on the substrate, such as adjacent to the conducting plane. A plurality of ribbon conductors are disposed over the conducting plane and electrically connected to the conducting via, such that the plurality of ribbon conductors form a transducer array in combination with the conducting plane, such as through capacitive coupling that changes in response to changes in the physical shape of the plurality of ribbons.
G01L 1/14 - Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
G01L 9/00 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elementsTransmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
G01D 5/24 - Mechanical means for transferring the output of a sensing memberMeans for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for convertingTransducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance
G01P 15/125 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by capacitive pick-up
In a semiconductor chip, a thermal adhesive is used to bond an internal heat spreader to an active functional die. In an alternative embodiment a dummy die is place directly on top of the active functional die and a thermal adhesive is used to bond an internal heat spreader to the dummy die. This provides a direct and relatively low thermal conductivity path from the heat source, i.e., the functional device to the top of the package, that is, the internal metal heat spreader which is also exposed to the air.
Included are embodiments for network allocation. More specifically, one embodiment of a method includes receiving, at a first communications device, without a prior RTS signal being sent, a first clear to send (CTS) signal from a second communications device, addressed to the first communications device, the CTS signal indicating a data exchange duration and sending a second CTS signal, from the first communications device, to the second communications device.
Included are embodiments for utilizing a scanning threshold. More specifically, one embodiment of a method includes entering a standby mode, wherein in the standby mode, at least one component of a communications device is shutdown, and wherein in the standby mode, at least one channel is scanned to determine potential interference and monitoring exchanged traffic with the communications device. Some embodiments include determining a relative volume of the exchanged traffic, compared to a predetermined threshold and based on the determination of the relative volume of the exchanged traffic and the predetermined threshold, entering a power save standby mode, wherein in the power save standby mode, scanning of the at least one channel is terminated.
Included are embodiments for back channel communication. At least one embodiment of a method includes receiving data at customer premises equipment and determining at least one error in the received data. Some embodiments include formatting the determined error for communication to a central office and sending the formatted error to the central office via a back channel.
Included are embodiments for facilitating communication. At least one embodiment of a method includes receiving first communication data from a communications device and creating an acknowledgment indicating receipt of the first communication data. Some embodiments include determining whether second communication data has been received for the communications device and in response to determining that data has been received for the communications device, combining the second communication data with the acknowledgement in a single data packet.
An embodiment of an interface system including, among others, an aggregation device comprising a plurality of ports, a first device comprising a plurality of ports, and one or more links that link the entire plurality of ports of the aggregation device and first device, the one or more links fewer in quantity than the entire plurality of ports.
Systems and methods for coexistence of WLAN and Bluetooth networks are described. At least one embodiment includes a method for operating a wireless device in both a 802.11 network and a Bluetooth network. In accordance with some embodiments, the method comprises monitoring transmission of Synchronous Connection Oriented (SCO) slots over the Bluetooth network, informing an access point (AP) in the 802.11 network not to transmit to the device before the end of an SCO slot, transmitting a power save trigger to the AP to retrieve buffered data from the AP, and transmitting data to the AP.
H04J 3/16 - Time-division multiplex systems in which the time allocation to individual channels within a transmission cycle is variable, e.g. to accommodate varying complexity of signals, to vary number of channels transmitted
30.
SYSTEMS AND METHODS FOR MANAGEMENT OF WIRELESS CLIENTS
Systems and methods for band hopping and power conservation in a wireless network are described. At least one embodiment is directed a method of hopping channels by a device within a wireless network. The method comprises hopping from a first channel to a target channel, resetting a virtual carrier sense after hopping to the target channel to enable service on the target channel, waiting for a pre-determined period of time, and setting a virtual carrier sense on the target channel after expiration of the pre¬ determined period of time and prior to hopping to a next target channel.
Included are embodiments for sending data in an environment with a plurality of protocols. At least one embodiment of a method includes receiving, at a Communications device, an indication to send first data to an access point in a first Communications protocol and determining that second data is being communicated in a second communications protocol. Some embodiments include determining a period of silence from data communication in the second communications protocol and sending the first data in the first communications protocol during the period of silence.
Included are embodiments for communicating data using a plurality of formats. At least one embodiment of a method includes transmitting a plurality of first format data frames with a predetermined time period between transmitted first format data frames and determining a duration of the time period between the transmitted first format data frames. Similarly, some embodiments include fragmenting a second format data frame into a plurality of second format subframes such that the second format subframes may be transmitted during the time period between the transmitted first format data frames.
Systems and methods for performing single-end line testing (SELT) are described. At least one embodiment includes a method for SELT to determine loop characteristics for a loop. The method for performing SELT comprises generating a test signal through a loop to be tested and receiving an echo response. The method further comprises subtracting predetermined near end echo response from the received echo to derive a far end echo response, performing time-dependent scaling on the far end echo response to compensate for loop attenuation, comparing the time-scaled far end echo response to a set of predefined templates, and providing an estimate of loop characteristics by identifying a matching template within the set of predefined templates, wherein the matching template contains information relating to loop characteristics comprising loop length and loop termination.
Systems and methods for implementing a temperature compensated two-stage ring oscillator are described. At least one embodiment includes a system for generating a clock signal comprising a self-starting oscillator comprising two delay stages in a ring configuration. The two-stage ring oscillator is configured to generate the clock signal, wherein the delay stages are configured such that the two-stage ring oscillator has a single right-half plane (RHP) pole in each of the two delay stages where feedback is always positive. For some embodiments, the system further comprises a compensation module configured to sense temperature and process variations and adjust a supply voltage for the two-stage ring oscillator to compensate for temperature and process variations in order to maintain a constant frequency clock signal. For such embodiments, the compensation module comprises a replica circuit configured to mirror operation of the n-channel devices within the two-stage ring oscillator. The compensation module further comprises a constant gm circuit configured to provide a biasing current to the replica circuit, wherein the replica circuit receives the biasing current to generate a reference voltage. The compensation module further comprises a voltage regulator configured to receive the reference voltage from the replica circuit, wherein the voltage regulator is further configured to provide a supply voltage to the two-stage ring oscillator.
H03L 7/085 - Details of the phase-locked loop concerning mainly the frequency- or phase-detection arrangement including the filtering or amplification of its output signal
35.
SYSTEMS AND METHODS FOR MIMO PRECODING IN AN XDSL SYSTEM
The system and method for off-diagonal MIMO precoders for generating precoded signals to increasing system performance for plurality of users in an xDSL system (130), comprising, an initialization module (170) configured to learn characteristics of channels located within the xDSL system associated with the plurality of users to derive an initial ODMP; a tracking module (172) configured to converge towards an optimum OPDM from the initial ODMP to reduce downstream self-induced far end crosstalk (self-FEXT) by executing a least means square (LMS) adaptive algorithm, wherein the tracking.
H04B 1/38 - Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
Systems and methods for a memory structure are described for increasing the throughput of double precision operations. Broadly, the present invention utilizes a novel memory system to process double precision data in a single memory access. In accordance with one embodiment, a method for increasing throughput of arithmetic operations on double precision data by reducing the number of memory accesses comprising: retrieving a double precision value from a memory, wherein the double precision value is comprised of a high word and a low word, wherein the double precision value is retrieved in a single memory access; selecting a word within the double precision value, wherein the portion selected is a single precision value; multiplying the word with a single precision operand to generate a single precision product; adding the product to a double precision operand to produce a double precision result; and forwarding the double precision result back to memory for storage.
G06F 7/38 - Methods or arrangements for performing computations using exclusively denominational number representation, e.g. using binary, ternary, decimal representation
Embodiments of AP polling systems and methods are disclosed. One method embodiment, among others, comprises soliciting by a station a response from an access point (AP), and determining whether data for the station is stored at the AP based on the response.
A satellite signal demodulator is configured to use frequency-based channel scanning to sense the presence of a channel and to obtain the frequency profile of the channel. Once the channel is identified and the profile is obtained, channel extraction is used to identify the frequency parameters for a given channel. A coarse parameter estimation is performed to obtain a coarse estimate of the symbol rate (SR) and the center frequency (fc) of the channel. The coarse estimation can then be followed by a fine estimation of the symbol rate and center frequency (f0), using a bit tracking loop (BTL) lock indicator.
An erasures assisted block code decoder and related method are provided. The erasures assisted block code decoder comprises a first block decoder, an erasures processor, and a second block code decoder. The first block decoder, for example, a Reed-Solomon decoder, is configured to decode blocks of data elements, e.g., bytes, that were previously affected by bursty errors. The first block decoder is also configured to identify those of such blocks it is unable to decode. The erasures processor is configured to identify, as erasures, data elements in the un-decodable blocks by utilizing, in the erasures identification process, data elements in the decoded blocks that were corrected by the first block decoder. The second block decoder, e.g., the same or different Reed-Solomon decoder, is configured to decode one or more of the un-decodable blocks by utilizing, in the decoding, the erasures identified by the erasures processor.
H03M 13/29 - Coding, decoding or code conversion, for error detection or error correctionCoding theory basic assumptionsCoding boundsError probability evaluation methodsChannel modelsSimulation or testing of codes combining two or more codes or code structures, e.g. product codes, generalised product codes, concatenated codes, inner and outer codes
A comb filter system that utilizes host memory ('CFSHM') is disclosed. The CFSHM may include a comb filter, an allocated host memory, and an interface in signal communication with the comb filter and allocated host memory.
H04N 9/78 - Circuits for processing the brightness signal and the chrominance signal relative to each other, e.g. adjusting the phase of the brightness signal relative to the colour signal, correcting differential gain or differential phase for separating the brightness signal or the chrominance signal from the colour television signal, e.g. using comb filter
Systems and methods for transmission announcement indication (760) are disclosed. A transmission announcement indication is provided (1010) for use inside a communications frame addressed to a destination as an indication that another transmission for that same destination will follow.
Various embodiments of symmetric transmit opportunity (TXOP) truncation (STT) systems and methods are disclosed. One method embodiment, among others, comprises receiving a frame that truncates a TXOP around a first station, and responsive to receiving the frame, sending a second frame that truncates the TXOP around a second station. Others system and method embodiments are disclosed.
Various embodiments of systems and methods that provide more power save multi-poll (MPSMP) indication solutions to improve both the channel access efficiency and power saving capability In one embodiment, for each address destination, a PSMP frame (310a) (the multi-poll frame) provides a time interval during which the client station (210) is to receive traffic (downlink time or DLT) and the time interval during which this client station (210) can transmit (uplink time or ULT) At any other time, such a client station (210) may go to sleep and save power, until the next PSMP arrives The ULT's are scheduled after the DLT's, for specific efficiency reasons One embodiment of an MPSMP indication method enables the PSMP frame (310a) to indicate whether another PSMP frame (310b) is to follow at the end of the uplink and downlink periods as described in the current PSMP frame, through an MPSMP indication
Various embodiments of the present disclosure provide dual CTS protection (DCTS) systems and methods. One method embodiment, among others, comprises receiving a first frame of a transmit opportunity (TXOP), and sending a short frame with a modulation that depends on whether the first frame is an extended range or normal range frame.
Various embodiments of decoding systems and methods are disclosed. One system embodiment, among others, comprises a macroblock decode module configured to decode a plurality of context adaptive binary arithmetic coding (CABAC) encoded symbols corresponding to a slice without processor intervention.
H03M 7/00 - Conversion of a code where information is represented by a given sequence or number of digits to a code where the same information is represented by a different sequence or number of digits
46.
SYSTEMS AND METHODS FOR IMPROVED BIT-LOADING FOR DISCRETE MULTI-TONE MODULATED MULTIPLE LATENCY APPLICATIONS
Systems and methods for performing bit loading in a dual latency data transmission system. In a computer network, such as an XDSL-based network, carrier channels are allocated between two latency paths. Error sensitive information is transmitted over a latency path employing one or more forward error correction techniques. Latency sensitive information that is relatively more tolerant of errors is transmitted over the other latency path. Rather than employing the lowest coding gain for carrier channels having the two different latency paths, the highest coding gain for each path is used by applying different target S-N-R margins for carrier channels having different latency paths.
Disclosed herein are various embodiments of collision avoidance systems and methods. One method embodiment, among others, comprises a client sending an end of transmission (EOT) request to an access point (AP), and responsive to the EOT request, the AP responding with an EOT frame.
A method for adjusting the signal to noise ratio of a receiver comprises measuring the peak power for an RF signal and determining, based on the measured peak power, whether the RF signal power is within a desired operating range. The method further includes adjusting an RF attenuation for the receiver, when it is determined that the RF signal power is not within the desired operating range. The method further comprises measuring a peak power for an IF signal, determining based on the measured peak power, whether the IF signal power is within a desired operating range, and adjusting an IF attenuation for the receiver, when it is determined that the IF signal peak power is not within the desired operating range.
patents