Adtec Engineering Co., Ltd.

Japan

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IPC Class
G03F 7/20 - ExposureApparatus therefor 13
H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or 10
G03F 9/00 - Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically 7
H05K 3/00 - Apparatus or processes for manufacturing printed circuits 5
B29C 70/34 - Shaping by lay-up, i.e. applying fibres, tape or broadsheet on a mould, former or coreShaping by spray-up, i.e. spraying of fibres on a mould, former or core and shaping or impregnating by compression 2
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NICE Class
07 - Machines and machine tools 4
09 - Scientific and electric apparatus and instruments 2
37 - Construction and mining; installation and repair services 2
11 - Environmental control apparatus 1
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Pending 3
Registered / In Force 39

1.

STRUCTURE AND PROCESSING DEVICE

      
Application Number JP2025000802
Publication Number 2025/173446
Status In Force
Filing Date 2025-01-14
Publication Date 2025-08-21
Owner
  • USHIO DENKI KABUSHIKI KAISHA (Japan)
  • ADTEC ENGINEERING CO., LTD. (Japan)
Inventor
  • Senga, Takehito
  • Watanabe, Yoshimitsu

Abstract

A structure according to one embodiment of the present invention comprises a first member, a second member, and an intermediate member. The first member is a plate-shaped member containing carbon fibers and a resin, and has a first main surface and a second main surface facing each other. The second member is disposed facing the first member. The intermediate member is disposed between the first member and the second member, and is connected to each of the second main surface of the first member and the second member. The connection between the second main surface and the intermediate member is achieved by a configuration corresponding to deformation, due to moisture absorption, of a side surface portion of the first member.

IPC Classes  ?

  • B32B 5/28 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous one layer being a fibrous or filamentary layer impregnated with or embedded in a plastic substance

2.

LASER MACHINING METHOD AND LASER MACHINING DEVICE

      
Application Number 18580715
Status Pending
Filing Date 2022-03-15
First Publication Date 2025-03-13
Owner ADTEC ENGINEERING CO., LTD. (Japan)
Inventor Senga, Takehito

Abstract

A laser machining method and a laser machining device according to the present invention include: emitting a beam of laser light in a form of pulse separated from each other; making a plurality of beams of the laser light incident on a light collection optical system that reduces a gap between the beams of the laser light; irradiating the surface to be machined with the plurality of beams of the laser light emitted to form a plurality of focused spots separated from each other, the plurality of focused spots each causing ablation; and moving the light collection optical system and the surface to be machined relative to each other both to simultaneously form a plurality of grooves on the surface to be machined.

IPC Classes  ?

  • B23K 26/364 - Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
  • B23K 26/06 - Shaping the laser beam, e.g. by masks or multi-focusing
  • B23K 26/067 - Dividing the beam into multiple beams, e.g. multi-focusing

3.

STRUCTURE, METHOD OF MANUFACTURING STRUCTURE, AND PROCESSING APPARATUS

      
Application Number 18712955
Status Pending
Filing Date 2022-03-15
First Publication Date 2025-01-02
Owner ADTEC ENGINEERING CO., LTD. (Japan)
Inventor
  • Nakata, Shigenori
  • Watanabe, Yoshimitsu

Abstract

Disclosed herein is a structure (CFRP structure) including a laminated body (CFRP member) having a primary component of carbon fibers; and metallic foils having a primary component of metal, the metallic foils being integrated with the laminated body by thermal compression bonding on a pair of surfaces of the laminated body opposite to each other in a direction of lamination of the laminated body, respectively. Each of the metallic foils has a thickness thinner than a thickness of the laminated body.

IPC Classes  ?

  • B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
  • B29C 70/08 - Fibrous reinforcements only comprising combinations of different forms of fibrous reinforcements incorporated in matrix material, forming one or more layers, with or without non-reinforced layers
  • B29C 70/34 - Shaping by lay-up, i.e. applying fibres, tape or broadsheet on a mould, former or coreShaping by spray-up, i.e. spraying of fibres on a mould, former or core and shaping or impregnating by compression
  • B32B 5/10 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments characterised by a fibrous layer reinforced with filaments
  • B32B 7/03 - Layered products characterised by the relation between layers Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties Layered products characterised by the interconnection of layers with respect to the orientation of features
  • B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
  • B32B 37/10 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using direct action of vacuum or fluid pressure

4.

STRUCTURE AND PROCESSING DEVICE

      
Application Number JP2024014266
Publication Number 2024/241732
Status In Force
Filing Date 2024-04-08
Publication Date 2024-11-28
Owner
  • USHIO DENKI KABUSHIKI KAISHA (Japan)
  • ADTEC ENGINEERING CO., LTD. (Japan)
Inventor
  • Nakata, Shigenori
  • Watanabe, Yoshimitsu

Abstract

A structure according to one embodiment of the present invention comprises a main body part, a first moisture-proof layer, and a second moisture-proof layer. The main body part is constituted by stacking a plurality of sheet-like members that are mainly composed of carbon fibers, and has a first main surface and a second main surface, which are opposite to each other in the stacking direction of the plurality of sheet-like members. The first moisture-proof layer is superposed on the first main surface, and at least a part of the surface thereof on the reverse side from the surface that is superposed on the first main surface is composed of a ceramic material. The second moisture-proof layer is superposed on the second main surface, and is composed of a material that is different from the ceramic material.

IPC Classes  ?

  • B32B 5/28 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous one layer being a fibrous or filamentary layer impregnated with or embedded in a plastic substance
  • B32B 18/00 - Layered products essentially comprising ceramics, e.g. refractory products

5.

STANDARD-LIGHT GENERATOR FOR STRAIGHTNESS MEASUREMENT, METHOD OF PROVIDING A STANDARD FOR STRAIGHTNESS MEASUREMENT, AND STRAIGHTNESS MEASUREMENT APPARATUS

      
Application Number 18630729
Status Pending
Filing Date 2024-04-09
First Publication Date 2024-10-10
Owner ADTEC Engineering Co., Ltd. (Japan)
Inventor
  • Tanaka, Yoneta
  • Gotoh, Manabu

Abstract

A standard-light generator for straightness measurement has a light source, and a light shielding plate disposed at a position irradiated with light from the light source. The light shielding plate has a circular-ring-shaped light transparency slit. The light source is disposed on a slit axis through the center of the circumference of the light transparency slit and perpendicular to the light shielding plate, and directed so that the whole area of the light transparency slit is irradiated with light from the light source. In measuring straightness, observed are irradiances by diffraction light waves from the light transparency slit on a first, second and third observation planes respectively different in distance to to light shielding plate. Each position of each irradiance peak due to interference of the diffraction light waves is specified.

IPC Classes  ?

  • G02B 27/42 - Diffraction optics
  • G01B 11/27 - Measuring arrangements characterised by the use of optical techniques for measuring angles or tapersMeasuring arrangements characterised by the use of optical techniques for testing the alignment of axes for testing the alignment of axes

6.

Carbon fiber reinforced plastic structure and processing apparatus

      
Application Number 18190712
Grant Number 12319034
Status In Force
Filing Date 2023-03-27
First Publication Date 2023-07-27
Grant Date 2025-06-03
Owner Adtec Engineering Co., Ltd. (Japan)
Inventor Tanaka, Yoneta

Abstract

A carbon fiber reinforced plastic structure has a low surface roughness and has reduced deformation due to residual stress, changes in temperature, etc., and a processing apparatus that uses the structure, are disclosed. The carbon fiber reinforced plastic structure (CFRP structure) includes a carbon fiber reinforced plastic member (CFRP member), and a resin layer formed on a first surface of the carbon fiber reinforced plastic member, the resin layer including an opposite surface that is opposite to a surface facing the first surface, the opposite surface having a surface roughness that is less than a surface roughness of the first surface of the carbon fiber reinforced plastic member.

IPC Classes  ?

  • B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
  • B32B 27/38 - Layered products essentially comprising synthetic resin comprising epoxy resins
  • C08J 7/04 - Coating

7.

EXPOSURE METHOD AND EXPOSURE SYSTEM

      
Application Number JP2022034321
Publication Number 2023/105874
Status In Force
Filing Date 2022-09-14
Publication Date 2023-06-15
Owner
  • USHIO DENKI KABUSHIKI KAISHA (Japan)
  • ADTEC ENGINEERING CO., LTD. (Japan)
  • FUKUOKA INDUSTRY, SCIENCE & TECHNOLOGY FOUNDATION (Japan)
Inventor
  • Hashimoto, Kiyoaki
  • Takamatsu, Hirosuke
  • Takahashi, Ryotaro
  • Hiki, Tatsuya
  • Nogita, Kanta

Abstract

The present invention addresses the problem of providing an exposure method and an exposure system which make it possible to suppress a decrease in productivity even if the size of an interposer is increased. An exposure method according to an embodiment of the present invention comprises a first exposure step and a second exposure step. In the first exposure step, a first pattern (P1) is exposed on a resist on a substrate using a first exposure device having first exposure accuracy. In the second exposure step, a second pattern (P2) different from the first pattern is exposed on the resist on which the first pattern (P1) has been exposed using a second exposure device having second exposure accuracy different from the first exposure accuracy.

IPC Classes  ?

  • G03F 9/00 - Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically

8.

STRUCTURE, METHOD FOR MANUFACTURING STRUCTURE, AND PROCESSING DEVICE

      
Application Number JP2022011536
Publication Number 2023/095356
Status In Force
Filing Date 2022-03-15
Publication Date 2023-06-01
Owner
  • USHIO DENKI KABUSHIKI KAISHA (Japan)
  • ADTEC ENGINEERING CO., LTD. (Japan)
Inventor
  • Nakata Shigenori
  • Watanabe Yoshimitsu

Abstract

The present invention discloses a structure that has good characteristics as a material of a frame or the like in a processing device, a method for manufacturing said structure, and a processing device in which said structure is used. This structure (CFRP structure) (10) comprises: a stacked body (CFRP member) (11) having carbon fibers as a main component; and metal foils (12a, 12b) that are subjected to thermal press bonding and thereby respectively integrated onto a pair of surfaces (11a, 11b) that face each other in the stacking direction of the stacked body (11), the metal foils having a metal as a main component. The thicknesses of the metal foils (12a, 12b) are less than the thickness of the stacked body (11).

IPC Classes  ?

  • B32B 5/10 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments characterised by a fibrous layer reinforced with filaments
  • B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
  • B29C 43/20 - Making multilayered or multicoloured articles
  • B29C 70/34 - Shaping by lay-up, i.e. applying fibres, tape or broadsheet on a mould, former or coreShaping by spray-up, i.e. spraying of fibres on a mould, former or core and shaping or impregnating by compression

9.

Core material and structure

      
Application Number 17756026
Grant Number 12226986
Status In Force
Filing Date 2020-07-29
First Publication Date 2022-12-15
Grant Date 2025-02-18
Owner
  • Adtec Engineering Co., Ltd. (Japan)
  • Suzuki Industry Co., Ltd. (Japan)
Inventor Tanaka, Yoneta

Abstract

A honeycomb-like core member that can be easily manufactured is disclosed, and a structure using such core member is disclosed. The core member has a plurality of flat plate members (a plurality of first flat plates and a plurality of second flat plates), each of which includes a comb teeth portion that has a plurality of notches, which are open in the long side of a rectangular shape of the flat plate member and extend parallel to the short side of the rectangular shape of the flat plate member. The notches are engaged with each other so that the plate members cross each other, and thus, a plurality of hexagonal-cylinder-shaped first cylinder portions and a plurality of triangular-cylinder-shaped second cylinder portions are formed by the plate members.

IPC Classes  ?

  • B32B 3/12 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. apertured or formed of separate pieces of material characterised by a layer of regularly-arranged cells whether integral or formed individually or by conjunction of separate strips, e.g. honeycomb structure
  • B32B 5/02 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments
  • B32B 5/26 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous one layer being a fibrous or filamentary layer another layer also being fibrous or filamentary
  • E04C 2/36 - Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by the shape or structure composed of two or more spaced sheet-like parts spaced apart by transversely-placed strip material, e.g. honeycomb panels

10.

Carbon fiber reinforced plastic structure and processing apparatus

      
Application Number 16640215
Grant Number 11701868
Status In Force
Filing Date 2018-08-02
First Publication Date 2020-11-19
Grant Date 2023-07-18
Owner ADTEC ENGINEERING CO., LTD. (Japan)
Inventor Tanaka, Yoneta

Abstract

A carbon fiber reinforced plastic structure has a low surface roughness and has reduced deformation due to residual stress, changes in temperature, etc., and a processing apparatus that uses the structure, are disclosed. The carbon fiber reinforced plastic structure (CFRP structure) includes a carbon fiber reinforced plastic member (CFRP member), and a resin layer formed on a first surface of the carbon fiber reinforced plastic member, the resin layer including an opposite surface that is opposite to a surface facing the first surface, the opposite surface having a surface roughness that is less than a surface roughness of the first surface of the carbon fiber reinforced plastic member.

IPC Classes  ?

  • B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
  • B32B 27/38 - Layered products essentially comprising synthetic resin comprising epoxy resins
  • C08J 7/04 - Coating

11.

FLATNESS MEASUREMENT METHOD AND PIN-HEIGHT ADJUSTMENT METHOD

      
Application Number JP2018006307
Publication Number 2018/180047
Status In Force
Filing Date 2018-02-21
Publication Date 2018-10-04
Owner ADTEC ENGINEERING CO., LTD. (Japan)
Inventor Kaneuchi Nobuaki

Abstract

[Problem] To provide a practical technique that makes it possible to readily measure the flatness of a face such as a virtual face formed by the top ends of a large number of pins. [Solution] A measurement unit 4 in which a level 6 is attached on a measurement plate 5 having flat top and bottom faces and having uniform thickness is mounted on top of three adjacent pins 3 among a large number of pins 3. In this state, the inclinations of the measurement plate 5 with respect to two orthogonal horizontal directions are measured by using the level 6. This step is executed sequentially for individual groups of three pins 3. In the second and subsequent iterations of this step, while again selecting one of the pins 3 that have already been selected, the inclinations of the measurement plate 5 are selected for all the pins 3. From the inclinations of the measurement plate 5, the height difference between a pin 3 having the top end thereof located at the highest position and a pin 3 having the top end thereof located at the lowest position is calculated as the flatness.

IPC Classes  ?

  • G01B 5/28 - Measuring arrangements characterised by the use of mechanical techniques for measuring roughness or irregularity of surfaces
  • G01C 9/00 - Measuring inclination, e.g. by clinometers, by levels

12.

DIRECT IMAGING EXPOSURE DEVICE AND DIRECT IMAGING EXPOSURE METHOD

      
Application Number JP2017040719
Publication Number 2018/088550
Status In Force
Filing Date 2017-11-13
Publication Date 2018-05-17
Owner ADTEC ENGINEERING CO., LTD. (Japan)
Inventor Suzuki Shoji

Abstract

[Problem] To enable resolution to be effectively increased beyond a conventional resolution limit such that the pattern of applied light approaches a designed exposure pattern as much as possible. [Solution] Light in an exposure pattern is applied to an exposure area E by an exposure unit provided with a spatial light modulator that is a DMD, and while an object W is being moved through the exposure area E by a moving mechanism, a photosensitive layer at the surface of the object W is exposed by applying light having a critical exposure amount or more thereto. A point to be exposed of the object W is located at corresponding coordinates G corresponding to a pixel mirror in an on state of the spatial light modulator at multiple times and multiply exposed. The number of times of multiple exposure at an exposure point the distance of which to the boundary of a designed exposure pattern is less than an exposure point pitch is smaller than a maximum number of times set according to the distance to the boundary.

IPC Classes  ?

13.

Pattern drawing apparatus and pattern drawing method

      
Application Number 15231842
Grant Number 10067429
Status In Force
Filing Date 2016-08-09
First Publication Date 2017-11-30
Grant Date 2018-09-04
Owner ADTEC Engineering Co., Ltd. (Japan)
Inventor Nakajima, Eriko

Abstract

A pattern drawing apparatus includes a first image-pickup device for reading an alignment mark and reading a first pattern image for detecting a positional shift, a second image-pickup device for reading the first pattern image and reading a second pattern image for detecting a positional shift drawn by an irradiation light beam from the optical head while carrying out a relative movement between the table and the optical head, and a positional shift detection unit for obtaining a first coordinate difference between a center of a visual field of the first image-pickup device and a center of the first pattern based on a read image by the first image-pickup device and obtaining a second coordinate difference between the center of the first pattern and a specific position of the second pattern based on a read image by the second image-pickup device.

IPC Classes  ?

  • G06K 9/00 - Methods or arrangements for reading or recognising printed or written characters or for recognising patterns, e.g. fingerprints
  • G03F 9/00 - Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
  • G03F 7/20 - ExposureApparatus therefor

14.

LIGHT SOURCE DEVICE, EXPOSURE DEVICE, AND LIGHT SOURCE CONTROL METHOD

      
Application Number JP2016002671
Publication Number 2016/194378
Status In Force
Filing Date 2016-06-02
Publication Date 2016-12-08
Owner ADTEC ENGINEERING CO., LTD. (Japan)
Inventor
  • Hiki, Tatsuya
  • Kimura, Fumio

Abstract

Disclosed are: a light source device capable of outputting, at a desired light quantity ratio, light having a plurality of different wavelengths; an exposure device provided with the light source device; and a light source control method. A light source device (19) is provided with a control unit (10), which generates output control signals for separately controlling an output of a first light emitting element and an output of a second light emitting element, and which outputs thus generated output control signals to the first light emitting element and the second light emitting element, respectively, said output control signals being generated on the basis of: a predetermined light quantity ratio between light having first wavelength characteristics and light having second wavelength characteristics; and light quantity measurement values outputted from a sensor that measures the quantity of the light having the first wavelength characteristics and the quantity of the light having the second wavelength characteristics, said light having the first wavelength characteristics and light having the second wavelength characteristics being included in output light accumulated by means of a light accumulating unit.

IPC Classes  ?

15.

LITHOGRAPHIC DEVICE, LITHOGRAPHIC EXPOSURE DEVICE, RECORDING MEDIUM HAVING PROGRAM RECORDED THEREON, AND LITHOGRAPHIC PROCESS

      
Application Number JP2013081671
Publication Number 2014/155830
Status In Force
Filing Date 2013-11-25
Publication Date 2014-10-02
Owner ADTEC ENGINEERING CO., LTD. (Japan)
Inventor Kikuchi, Hiroaki

Abstract

This lithographic device is provided with: an acquisition unit for acquiring coordinate data indicating first locations constituting the designed locations of a plurality of reference marks furnished on an exposed substrate, coordinate data indicating a lithographic pattern defined on the basis of the first locations, to be produced on the exposed substrate, and coordinate data indicating second locations which are the actual locations of the plurality of reference marks; a derivation unit for deriving a physical quantity indicating the magnitude of strain of the exposed substrate, doing so on the basis of the first locations and the second locations, and for deriving, for each of the plurality of reference marks, a correction level in relation to misalignment of the first locations and the second locations; a reducing unit for reducing, by a greater amount for a greater physical quantity, each of the correction levels derived by the derivation unit; and a correction unit for correcting the coordinate data indicating the lithographic pattern, doing so on the basis of the correction levels reduced by the reducing unit, when the lithographic pattern is produced on the exposed substrate on the basis of the second locations.

IPC Classes  ?

  • G03F 9/00 - Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
  • H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or
  • H05K 3/00 - Apparatus or processes for manufacturing printed circuits

16.

EXPOSURE OPTICS, EXPOSURE HEAD, AND EXPOSURE DEVICE

      
Application Number JP2014053951
Publication Number 2014/129514
Status In Force
Filing Date 2014-02-19
Publication Date 2014-08-28
Owner ADTEC ENGINEERING CO. LTD. (Japan)
Inventor Komori, Kazuki

Abstract

Provided are: exposure optics provided with a microlens array that corrects aberrations in focusing optics; an exposure head; and an exposure device. These exposure optics (100) are provided with the following: a spatial light-modulation element (34) containing an array of pixel units (74) that modulate light (B) from a light source; a microlens array (64) in which microlenses (64a) that concentrate the light modulated by the spatial light-modulation element (34) are arrayed in a single plane; first focusing optics (52) that focus the light (B) modulated by the spatial light-modulation element (34) onto the microlens array (64); and second focusing optics (58) that focus the light (B) concentrated by the microlens array (64) onto a photosensitive material (P). The microlens array (64) contains a plurality of types of microlenses (64a) that have different shapes in accordance with the distances thereof from the optical axis (58c) of the second focusing optics (58).

IPC Classes  ?

  • G03F 7/20 - ExposureApparatus therefor
  • G02B 3/00 - Simple or compound lenses
  • G02B 3/02 - Simple or compound lenses with non-spherical faces
  • G02B 13/18 - Optical objectives specially designed for the purposes specified below with lenses having one or more non-spherical faces, e.g. for reducing geometrical aberration
  • G02B 13/24 - Optical objectives specially designed for the purposes specified below for reproducing or copying at short object distances
  • G02B 27/18 - Optical systems or apparatus not provided for by any of the groups , for optical projection, e.g. combination of mirror and condenser and objective
  • H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or

17.

EXPOSURE/RENDERING DEVICE, EXPOSURE/RENDERING SYSTEM, PROGRAM, AND EXPOSURE/RENDERING METHOD

      
Application Number JP2013072502
Publication Number 2014/050384
Status In Force
Filing Date 2013-08-23
Publication Date 2014-04-03
Owner ADTEC Engineering Co., Ltd. (Japan)
Inventor
  • Ozaki Yukihisa
  • Satou Junichi

Abstract

Provided is an exposure/rendering device that, when rendering an image at both surfaces of a substrate to be exposed, can prevent the rendering of images that do not correspond to each other at each surface. The present invention has: a first rendering means that renders an image to the first surface of a substrate to be exposed by means of exposing the first surface; and a recording means that records first job information (60A), in which exposure condition information and image information of the first surface are associated, second job information (60B), in which exposure condition information and image information of the second surface are associated, and correspondance information of the first job information (60A) and second job information (60B). When rendering the image of the second surface of the substrate to be exposed, to the first surface of which an image has been rendered by means of exposing the first surface under the exposure conditions indicated by the first job information (60A), the image indicated by the second job information (60B) is rendered to the second surface by exposing the second surface at the exposure conditions indicated by the second job information associated with the first job information (60A), used when rendering the image to the first surface, on the basis of the correspondance information.

IPC Classes  ?

  • G03F 7/20 - ExposureApparatus therefor
  • H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or
  • H05K 3/00 - Apparatus or processes for manufacturing printed circuits

18.

EXPOSURE/RENDERING DEVICE, EXPOSURE/RENDERING SYSTEM, PROGRAM, AND EXPOSURE/RENDERING METHOD

      
Application Number JP2013072818
Publication Number 2014/050405
Status In Force
Filing Date 2013-08-27
Publication Date 2014-04-03
Owner ADTEC Engineering Co., Ltd. (Japan)
Inventor
  • Ozaki Yukihisa
  • Satou Junichi

Abstract

Provided are: an exposure/rendering device that, when rendering an image at both surfaces of a substrate to be exposed, can prevent the rendering of images that do not correspond with each other at each surface; an exposure/rendering system; a program; and an exposure/rendering method. By means of exposing a first surface on the basis of first job information (60A) in which are associated exposure condition information and image information indicating the image to render to the first surface of the substrate to be exposed, the image indicated by the first job information (60A) is rendered to the first surface; a plurality of second job information (60B) is recorded in each of which are associated exposure condition information and image information indicating the image to render to the second surface of the substrate to be exposed; and on the basis of second job information (60B) in the plurality of second job information (60A) and having exposure condition information identical to the exposure condition information indicated by the first job information (60A) used in rendering the image to the first surface, the image indicated by the second job information is rendered to the second surface by exposing the second surface of the substrate to be exposed, to the first surface of which the image has been rendered.

IPC Classes  ?

  • G03F 7/20 - ExposureApparatus therefor
  • H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or

19.

DRAWING DEVICE, EXPOSURE DRAWING DEVICE, DRAWING METHOD, AND RECORDING MEDIUM WHEREON PROGRAM IS STORED

      
Application Number JP2013062291
Publication Number 2014/027483
Status In Force
Filing Date 2013-04-25
Publication Date 2014-02-20
Owner ADTEC ENGINEERING CO., LTD. (Japan)
Inventor Kikuchi, Hiroaki

Abstract

In the present invention, coordinate data indicating the first positions in a design of a plurality of reference marks that are provided to a substrate to be exposed, coordinate data indicating a drawing pattern to be drawn on the substrate to be exposed that is set using the first positions as a reference, and coordinate data indicating the actual second positions of each of the plurality of reference marks are acquired, a deviation correction amount for correcting the deviation between the first position and the second position is derived for each of the plurality of reference marks, each of the derived deviation correction amounts is reduced by a preset rate, and when drawing the drawing pattern on the substrate to be exposed in accordance with coordinate data that indicates a drawing pattern in which the coordinate data that indicates the second positions is used as a reference, coordinate data indicating the drawing pattern in accordance with the reduced deviation correction amount is corrected.

IPC Classes  ?

  • G03F 9/00 - Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
  • G03F 7/20 - ExposureApparatus therefor
  • H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or
  • H05K 3/00 - Apparatus or processes for manufacturing printed circuits

20.

DRAWING DEVICE, EXPOSURE DRAWING DEVICE, DRAWING METHOD, AND RECORDING MEDIUM WHEREON PROGRAM IS STORED

      
Application Number JP2013062292
Publication Number 2014/027484
Status In Force
Filing Date 2013-04-25
Publication Date 2014-02-20
Owner ADTEC ENGINEERING CO., LTD. (Japan)
Inventor Kikuchi, Hiroaki

Abstract

In the present invention, the first positions in a design of a plurality of reference marks that are provided to a substrate, a drawing pattern to be drawn on the substrate that is set using the first positions as a reference, and coordinate data indicating the actual second positions of each of the plurality of reference marks are acquired, a deviation correction amount for correcting the deviation between the first position and the second position of each of the plurality of reference marks is rendered as a value in which the deviation correction amount for the reference mark and the deviation correction amount for the reference mark that is closest to said reference mark are averaged, and when drawing a drawing pattern on a substrate to be exposed in accordance with coordinate data indicating a drawing pattern in which the coordinate data indicating the second positions as a reference is used as a reference, coordinate data indicating a drawing pattern in accordance with the averaged deviation correction amount is corrected.

IPC Classes  ?

  • G03F 9/00 - Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
  • G03F 7/20 - ExposureApparatus therefor
  • H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or
  • H05K 3/00 - Apparatus or processes for manufacturing printed circuits

21.

A ADTEC ENGINEERING

      
Application Number 1177605
Status Registered
Filing Date 2013-01-09
Registration Date 2013-01-09
Owner ADTEC Engineering Co., Ltd. (Japan)
NICE Classes  ?
  • 07 - Machines and machine tools
  • 09 - Scientific and electric apparatus and instruments
  • 37 - Construction and mining; installation and repair services

Goods & Services

Exposure machines for printed boards; equipment for manufacturing printed circuits; exposure equipment for manufacturing semiconductor elements; equipment for manufacturing electron elements; equipment for manufacturing semiconductors or printed boards; equipment for peeling off thin coating film used in the process of manufacturing printed circuit boards; semiconductor element manufacturing apparatus and its parts; metal pressing machines; metal molds; metal mold parts; powder pressing/compacting machines; metalworking machines; mine working machines; construction machines; loading and unloading machines; fishing machines; chemical machines; textile machines; food or beverage processing machines; lumbering machines; wood/plywood working machines; pulping, papermaking or paper processing machines; printing machines; bookbinding machines; sewing machines; agricultural machines; shoe machines; leather tanning machines; cigarette making machines; glassware manufacturing machines; painting machines; packaging machines; wrapping machines; potters' wheels; plastic processing machines; rubber processing machines; stone working machines; motors other than for land vehicles; pneumatic or hydraulic machines; adhesive tape dispensers (machines); automatic stamping machines; dishwashers; electric machines and apparatus for wax polishing; electric washing machines; vacuum cleaners; electric food blenders (for household purposes); repairing machines; mechanical parking installations; vehicle washing installations; distributing machines for disinfectants/insecticides/deodorants (not for agricultural use); machine elements (other than for land vehicles); lawnmowers; electrically operated curtain drawing devices; waste compacting machines; waste crushing machines; starters for motors and engines; alternating or direct current motors (not including those for land vehicles but including "parts" for any alternating or direct current motors); alternating generators; direct generators; electrically operated brushes; electric arc welding apparatus; electric metal cutting apparatus; electric welding apparatus. Testing apparatus for testing printed circuit boards and its parts; testing apparatus for testing semiconductors and its parts; measuring apparatus and instruments; electronic instruments and their parts and fittings, as far as included in this class; laboratory apparatus and instruments; electronic publications; photographic apparatus and instruments; cinematographic machines and apparatus; optical apparatus and instruments; electrical distribution or control apparatus; rotary converters; phase modifiers; batteries; electrical and magnetic measuring instruments; electric wires and cables; electrical communication machines and apparatus; magnetic cores; resistance wires; fuel cell electrodes. Repair or maintenance of printed boards and electron elements; repair or maintenance electronic machines and instruments; repair or maintenance of measuring apparatus and instruments; repair or maintenance of integrated circuits manufacturing machines and systems; repair or maintenance of exposure equipment for printed boards; repair or maintenance of exposure equipment for manufacturing semiconductors; repair or maintenance of semiconductor manufacturing machines and systems; installation of exposure equipment for printed boards; installation of exposure equipment for manufacturing semiconductors; construction; repair or maintenance of metal mold machines; repair or maintenance of powder compacting machines; repair or maintenance of metalworking machines and tools; construction consultancy; repair or maintenance of optical machines and instruments; repair or maintenance of photographic machines and apparatus; repair or maintenance of loading-unloading machines; repair or maintenance of office machines and apparatus; repair or maintenance of telecommunication machines; repair or maintenance of consumer electric appliances; repair or maintenance of electric lighting apparatus; repair or maintenance of power distribution or control machines and apparatus; repair or maintenance of power generators; repair or maintenance of electric motors; repair or maintenance of laboratory apparatus and instruments; repair or maintenance of medical machines and apparatus; repair or maintenance of machines and apparatus for lumbering, woodworking, or veneer or plywood making; repair or maintenance of textile machines and apparatus; repair or maintenance of painting machines and apparatus; repair or maintenance of plastic processing machines; repair or maintenance of packing or wrapping machines.

22.

EXPOSURE WRITING DEVICE AND EXPOSURE WRITING METHOD

      
Application Number JP2013050242
Publication Number 2013/145798
Status In Force
Filing Date 2013-01-09
Publication Date 2013-10-03
Owner ADTEC Engineering Co., Ltd. (Japan)
Inventor
  • Hashiguchi, Akihiro
  • Kikuchi, Hiroaki
  • Tsurui, Hironori

Abstract

An exposure writing device is provided with: a first exposure means for writing a circuit pattern on a first face by exposure of the first face of a printed wiring board arranged on a stage; a mark forming means, arranged in a manner so as to be movable with respect to the stage, for forming a plurality of predetermined marks on a second face opposite to the first face during writing of the circuit pattern of the first face on the first face of the printed wiring board; a measurement means for measuring the position of the mark forming means; a detection means for detecting the position of a plurality of marks formed on the second face; and a second exposure means for writing a circuit pattern on the second face by exposure of the second face of the printed wiring board, using as a reference the measured position of the mark forming means and the positions of the plurality of marks that were thus detected.

IPC Classes  ?

  • G03F 9/00 - Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
  • H05K 3/00 - Apparatus or processes for manufacturing printed circuits

23.

EXPOSURE DRAWING DEVICE, RECORDING MEDIUM IN WHICH PROGRAM IS RECORDED, AND EXPOSURE DRAWING METHOD

      
Application Number JP2013054580
Publication Number 2013/145987
Status In Force
Filing Date 2013-02-22
Publication Date 2013-10-03
Owner ADTEC ENGINEERING CO., LTD. (Japan)
Inventor Ozaki, Yukihisa

Abstract

This exposure drawing method is employed in an exposure drawing device provided with an exposure means that draws a circuit pattern by exposing a substrate to be exposed, which has a first surface and a second surface on the opposite side thereof to the first surface. The method comprises: a mark forming step for forming a first mark that forms a reference for an exposure position and is formed in a predetermined position on the second surface of the substrate to be exposed and for forming a second mark that represents identification information for identifying the substrate to be exposed by relative position by making the relative position thereof with respect to the first mark different for each substrate to be exposed; a first control step for controlling the exposure means such that a circuit pattern is drawn on the first surface of the substrate to be exposed; and a storage step for storing information regarding the first surface exposure in a storage means in correspondence with identification information represented by the relative positions.

IPC Classes  ?

  • G03F 7/20 - ExposureApparatus therefor
  • H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or

24.

EXPOSURE WRITING DEVICE AND EXPOSURE WRITING METHOD

      
Application Number JP2013054579
Publication Number 2013/145986
Status In Force
Filing Date 2013-02-22
Publication Date 2013-10-03
Owner ADTEC Engineering Co., Ltd. (Japan)
Inventor
  • Tsurui, Hironori
  • Hashiguchi, Akihiro

Abstract

Provided are an exposure writing device and an exposure writing method whereby degradation of the quality of marks provided for the purpose of positional alignment of the front and rear faces, caused by warping or floating etc. of the end of the substrate to be exposed can be prevented. Specifically, an exposure writing device comprises:- a stage (10) on which a substrate to be exposed is placed, fixing sections (31a to 31d) that, by moving between a predetermined first position and second position, fix, by clamping between themselves and this stage, the ends of the substrate to be exposed, which was placed on said stage in the second position; a writing unit that writes a predetermined circuit pattern onto a first face by exposure of this first face of the substrate to be exposed, in this condition with the ends fixed; and a forming section (51) that forms a predetermined mark on the second face opposite the first face of the substrate to be exposed in this condition with the ends fixed by the fixing sections, by movement linked with the movement of the fixing sections.

IPC Classes  ?

  • G03F 9/00 - Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
  • G03F 7/20 - ExposureApparatus therefor
  • H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment

25.

EXPOSURE/DRAWING DEVICE AND EXPOSURE/DRAWING METHOD

      
Application Number JP2013054816
Publication Number 2013/136959
Status In Force
Filing Date 2013-02-25
Publication Date 2013-09-19
Owner ADTEC Engineering Co., Ltd. (Japan)
Inventor Hashiguchi, Akihiro

Abstract

Disclosed is an exposure/drawing device whereby, when continuously carrying out a plurality of jobs, unnecessary line discontinuance can be suppressed, while avoiding unwanted exposure processing as far as possible. There are provided: exposure processing execution means wherein respective items of substrate information are set, and whereby respective exposure processes are sequentially carried out on a substrate in accordance with a plurality of exposure processing requests for exposure processing; detection means that detects the substrate information of a substrate that is to be subjected to exposure processing; and comparison means that compares the detected substrate information with substrate information during execution that was set in the exposure processing request. If, based on the comparison result, it is found that the detected substrate information of the substrate that is next to be subjected to exposure processing is the same as the information of the substrate whose processing is currently being executed, the exposure processing request that is currently being executed is continued with in respect of the substrate that is next to be subjected to exposure processing. If it is found that the detected substrate information is different from the substrate information that is currently being executed but the substrate information that was set in the next exposure processing request is the same, execution of the next exposure processing request is commenced on termination of the exposure processing request that is currently being executed.

IPC Classes  ?

  • G03F 7/20 - ExposureApparatus therefor
  • H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or

26.

EXPOSURE DRAWING DEVICE AND EXPOSURE DRAWING METHOD

      
Application Number JP2013051481
Publication Number 2013/125289
Status In Force
Filing Date 2013-01-24
Publication Date 2013-08-29
Owner ADTEC Engineering Co., Ltd. (Japan)
Inventor
  • Hashiguchi, Akihiro
  • Kikuchi, Hiroaki
  • Yoshikawa, Takeshi

Abstract

Provided are an exposure drawing device and an exposure drawing method in which it is possible to identify the dust level in the exposure device during an exposure process performed on each substrate to be exposed. This invention is provided with: an exposure means for exposing a substrate to be exposed and thereby drawing a circuit pattern; a counting means for counting the number of microparticles in the exposure drawing device; a determining means for determining whether or not the number of particles counted by the counting means during the exposure process performed by the exposure means is equal to or greater than a threshold value defined on the basis of a size pertaining to the pattern of the circuit pattern; and an adding means for adding information defined in advance with respect to the substrate to be exposed, when it has been determined by the determining means that the number of particles is equal to or greater than the threshold value.

IPC Classes  ?

  • H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or
  • G03F 7/20 - ExposureApparatus therefor
  • H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment

27.

EXPOSURE OPTICAL SYSTEM, EXPOSURE APPARATUS, AND EXPOSURE METHOD

      
Application Number JP2012083720
Publication Number 2013/111499
Status In Force
Filing Date 2012-12-26
Publication Date 2013-08-01
Owner ADTEC Engineering Co., Ltd. (Japan)
Inventor Komori, Kazuki

Abstract

Provided are an exposure apparatus and an exposure method, which suppress, by means of an aperture shape of a microlens, a side lobe in the periphery of a main beam using aperture arrays, and which perform highly fine exposure. A position of a side lobe (Bb) in the vicinity of a focal point position of a microlens (64a) is moved by providing a light blocking section (66b) on the output side of the microlens (64a). A diameter of a main beam (Ba) is approximately 4 μm or less before passing through a second aperture array (68), and the side lobe (Bb) is suppressed to approximately 1/10 in relative intensity, compared with conventional examples, within a range of a diameter of 7.2 μm with the center of the main beam (Ba) at the center. As a result of narrowing a laser beam (B) using the second aperture array (68), the laser beam (B) is formed to have a light intensity distribution wherein the side lobe (Bb) in the periphery of the main beam (Ba) can be ignored.

IPC Classes  ?

  • G03F 7/20 - ExposureApparatus therefor
  • H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or

28.

Multi-core ferrule and optical fiber connection structure

      
Application Number 12491007
Grant Number 08175431
Status In Force
Filing Date 2009-06-24
First Publication Date 2010-06-24
Grant Date 2012-05-08
Owner ADTEC ENGINEERING CO., LTD. (Japan)
Inventor
  • Imada, Yuuki
  • Shimotu, Shinichi

Abstract

2) has a cylindrical shape and is held in a holder made of stainless steel (SUS). The multi-core ferrule has a convex end surface whose curvature radius R2 is at least 18.3 mm and at most 38.7 mm. When the first and second plugs are attached to the adaptor, the singe-core ferrule and the multi-core ferrule are respectively inserted from the opposite ends into the sleeve, and both of the end surfaces of the ferrules are pressed against each other.

IPC Classes  ?

  • G02B 6/32 - Optical coupling means having lens focusing means

29.

Optical device and exposure apparatus

      
Application Number 12112474
Grant Number 07876987
Status In Force
Filing Date 2008-04-30
First Publication Date 2009-12-31
Grant Date 2011-01-25
Owner ADTEC ENGINEERING CO., LTD. (Japan)
Inventor
  • Mukai, Atsushi
  • Sonoda, Shinichiro

Abstract

2 or less, thereby suppressing a reduction in light output which may be caused by fusion.

IPC Classes  ?

30.

Frame data producing apparatus, method and plotting apparatus

      
Application Number 11992391
Grant Number 08035852
Status In Force
Filing Date 2006-09-28
First Publication Date 2009-06-25
Grant Date 2011-10-11
Owner ADTEC ENGINEERING CO., LTD. (Japan)
Inventor Mushano, Mitsuru

Abstract

A micro-mirror unit of data from a plot point formation element unit data to a plot unit of frame data. A micro-mirror unit of data to be sequentially supplied to a plurality of micro-mirrors is produced from an image data corresponding to an image to be formed in a plot screen by use of DMDs each having the plurality of micro-mirrors. An intermediate data is then produced by extracting data change points of the produced micro-mirror unit of data. The data is inverted for each of the data change points in the produced intermediate data, thereby performing the transportation from the micro-mirror unit of data to the DMD unit of frame data.

IPC Classes  ?

  • G06F 15/00 - Digital computers in generalData processing equipment in general

31.

Method and apparatus for driving semiconductor lasers, and method and apparatus for deriving drive current patterns for semiconductor lasers

      
Application Number 12089463
Grant Number 07970029
Status In Force
Filing Date 2006-10-05
First Publication Date 2009-06-04
Grant Date 2011-06-28
Owner ADTEC ENGINEERING CO., LTD. (Japan)
Inventor Teramura, Yuichi

Abstract

Semiconductor lasers are driven such that high output laser beams are stably obtained without a long start up time. The light outputs of a plurality of semiconductor lasers are detected by photodetectors. The semiconductor lasers are driven by automatic power control based on comparison results between the output of the photodetectors and a set value corresponding to a target light output for the semiconductor lasers. A correction pattern that corrects the set value and/or the output of the photodetectors such that the actual light output becomes uniform is generated in advance. The set value and/or the output are varied according to the correction pattern for a predetermined period of time from initiation of drive. A single correction pattern is employed in common with respect to the plurality of semiconductor lasers.

IPC Classes  ?

  • H01S 5/0683 - Stabilisation of laser output parameters by monitoring the optical output parameters

32.

Laser direct imaging apparatus and imaging method

      
Application Number 12191901
Grant Number 08314825
Status In Force
Filing Date 2008-08-14
First Publication Date 2009-04-02
Grant Date 2012-11-20
Owner ADTEC ENGINEERING CO., LTD. (Japan)
Inventor
  • Naito, Yoshitatsu
  • Suzuki, Mitsuhiro
  • Katoh, Tomotsugu

Abstract

A laser beam direct imaging apparatus and an imaging method which can precisely determine a back-surface-side position with respect to a front-surface-side position even if any kind of photosensitive material is used. In the laser direct imaging apparatus, a laser beam is deflected toward a main scanning direction (X-axis direction) while a workpiece mounted on a table is moved in a sub-scanning direction (Y-axis direction) so that a pattern is imaged on the surface of the workpiece. Hollow pins are disposed on the table so that the tips of the hollow pins 20 project over the surface of the table by a predetermined distance. The workpiece is sucked onto the table so that indentations (indentations by the tips of the hollow pins) are formed on the back surface of the workpiece. When a pattern is imaged on the back surface, imaging is performed with reference to the indentations.

IPC Classes  ?

  • B41J 2/47 - Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using the combination of scanning and modulation of light

33.

Laser direct imaging apparatus

      
Application Number 12191684
Grant Number 07969636
Status In Force
Filing Date 2008-08-14
First Publication Date 2009-03-26
Grant Date 2011-06-28
Owner ADTEC ENGINEERING CO., LTD. (Japan)
Inventor
  • Naito, Yoshitatsu
  • Oshida, Yoshitada
  • Suzuki, Mitsuhiro

Abstract

A laser direct imaging apparatus which can expose photosensitive materials having various sensitivities and which can correct an imaging position in accordance with deformation of a workpiece. In the laser direct imaging apparatus, the workpiece is moved in a sub-scanning direction while a cylindrical lens is used to converge a laser beam, which has been modulated based on raster data, in the sub-scanning direction and deflect the laser beam toward a main scanning direction so as to image a desired pattern on the workpiece. The cylindrical axis of the cylindrical lens is designed to be able to rotate horizontally and to be able to change an angle with respect to the main scanning direction.

IPC Classes  ?

  • G02B 26/08 - Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light

34.

Image recording processing circuit, image recording apparatus and image recording method using image recording processing circuit

      
Application Number 11912796
Grant Number 08184333
Status In Force
Filing Date 2006-04-28
First Publication Date 2009-03-19
Grant Date 2012-05-22
Owner ADTEC ENGINEERING CO., LTD. (Japan)
Inventor
  • Sugita, Yukio
  • Okazaki, Yoji
  • Ozaki, Takao

Abstract

Mirror sequential data supplied from an RIP are temporarily stored as divided data in memory banks of an intermediate memory. Thereafter, the stored mirror sequential data are read in blocks. Then, a transposition processor transposes a matrix of the mirror sequential data into frame sequential data, and supplies the frame sequential data to a DMD controller.

IPC Classes  ?

  • G06F 15/00 - Digital computers in generalData processing equipment in general
  • G06F 15/16 - Combinations of two or more digital computers each having at least an arithmetic unit, a program unit and a register, e.g. for a simultaneous processing of several programs
  • B41J 2/435 - Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material

35.

Drawing apparatus

      
Application Number 12033549
Grant Number 08175402
Status In Force
Filing Date 2008-02-19
First Publication Date 2008-10-02
Grant Date 2012-05-08
Owner ADTEC ENGINEERING CO., LTD. (Japan)
Inventor
  • Funatsu, Terunobu
  • Osaka, Yoshihisa
  • Ikegami, Hitoshi

Abstract

A drawing apparatus which can create an exposure pattern rapidly. The drawing apparatus has a raster conversion processing module for converting vector images as wiring patterns into bitmap image data, an image cache module for temporarily storing a predetermined-size cached image supplied from the raster conversion processing module, a first compression module for compressing the cached image stored in the image cache module, a second compression module for compressing the cached image stored in the image cache module in a compression ratio differing from that of the first compression module, a comparison module for comparing data sizes of compressed data generated by the first and second compression modules and selecting one having a smaller data size, a memory access module for writing the compressed data selected by the comparison module, into a storage module, and a cache region control module for controlling a compression status of the cached image.

IPC Classes  ?

  • G06K 9/46 - Extraction of features or characteristics of the image

36.

Substrate exposure apparatus and illumination apparatus

      
Application Number 11839863
Grant Number 07755741
Status In Force
Filing Date 2007-08-16
First Publication Date 2008-04-03
Grant Date 2010-07-13
Owner ADTEC ENGINEERING CO., LTD. (Japan)
Inventor
  • Oshida, Yoshitada
  • Kobayashi, Kazuo

Abstract

An illumination apparatus and an exposure apparatus that achieves higher quality exposure to light and higher operating speed even where the ratio Hx/Hy between the transverse dimension Hx and the longitudinal dimension Hy of the plane of optical modulation of a two-dimensional optical space modulator is 1.5 or above, for instance, are to be provided. The focal distance fx in an x-direction and the focal distance fy in a y-direction of a second optical system that guides light emitted from an integrator to a two-dimensional optical space modulator are made different, in a ratio of fx/fy=1.6, for instance. In this way, the number of rod lenses in the integrator can be made equal between transverse and longitudinal directions and the value of Hx/Hy can be made 2.5 by bringing the aspect ratio dx:dy of rod lenses to 1.6:1, close to 1.

IPC Classes  ?

  • G03B 27/54 - Lamp housingsIlluminating means
  • G03B 27/52 - Projection printing apparatus, e.g. enlarger, copying camera Details
  • G03B 27/72 - Controlling or varying light intensity, spectral composition, or exposure time in photographic printing apparatus

37.

Device for changing pitch between light beam axes, and substrate exposure apparatus

      
Application Number 11755361
Grant Number 08089614
Status In Force
Filing Date 2007-05-30
First Publication Date 2007-12-06
Grant Date 2012-01-03
Owner ADTEC ENGINEERING CO., LTD. (Japan)
Inventor
  • Oshida, Yoshitada
  • Naito, Yoshitatsu
  • Suzuki, Mituhiro
  • Yamaguchi, Tsuyoshi
  • Maruyama, Shigenobu

Abstract

A parallel glass which is a prism having a parallelogram-shaped cross section in an x-y direction, and parallel glasses which are prisms having a parallelogram-shaped cross section in the x-y direction and each include grooves formed in one surface in a z direction perpendicular to the x-y direction, are stacked in direct contact with each other such that the grooves are located on the inside, and light trying to enter the grooves is subjected is total reflection, thereby changing incident parallel beams with a pitch of 13 mm into emergent parallel beams with a pitch of 1 mm.

IPC Classes  ?

  • G03B 27/53 - Automatic registration or positioning of originals with respect to each other or the photosensitive layer

38.

ADTEC Engineering

      
Application Number 910200
Status Registered
Filing Date 2006-03-20
Registration Date 2006-03-20
Owner ADTEC Engineering Co., Ltd. (Japan)
NICE Classes  ?
  • 07 - Machines and machine tools
  • 09 - Scientific and electric apparatus and instruments
  • 11 - Environmental control apparatus
  • 37 - Construction and mining; installation and repair services

Goods & Services

Exposure equipment for printed board, equipment for manufacturing printed circuits, exposure equipment for manufacturing semiconductor element, equipment for manufacturing electron element, equipment for manufacturing semiconductor or printed board, equipment for peeling off thin coating film used in the process of manufacturing printed circuit boards, semiconductor element manufacturing apparatus and its parts, metal pressing machines, metal mold, metal mold parts, powder pressing/compacting machines, metalworking machines, mineworking machines, construction machines, loading and unloading machines, fishing machines, chemical machines, textile machines, food or beverage processing machines, lumbering machines, wood/plywood working machines, pulping, papermaking or paper processing machines, printing machines, bookbinding machines, sewing machines, agricultural machines, shoe making machines, shoe lasts (parts of machines), leather tanning machines, cigarette making machines, glassware manufacturing machines, painting machines, packaging machines, wrapping machines, potters' wheels, plastic processing machines, rubber processing machines, stone working machines, motors other than for land vehicles, pneumatic or hydraulic machines, adhesive tape dispensers, automatic stamping machines, dishwashers, electric machines and apparatus for wax polishing, electric washing machines, vacuum cleaners, electric food blenders (for household purposes), repairing machines, mechanical parking installations, vehicle washing installations, distributors for disinfectants/insecticides/deodorants (not for agricultural use), machine elements (other than for land vehicles), lawnmowers, electrically operated curtain drawers, waste compacting machines, waste crushing machines, starters for motors and engines, alternating or direct current motors (not including those for land vehicles but including "parts" for any alternating or direct current motors), alternating generators, direct generators, electrically operated brushes. Testing apparatus for testing printed circuit boards and its parts, testing apparatus for testing semiconductors and its parts, measuring apparatus and instruments, electron beam exposure equipment, electronic instruments and their parts and fittings, as far as included in this class, laboratory apparatus and instruments, electronic publications, electric arc welding apparatus, electric metal cutting apparatus, electric welding apparatus, photographic apparatus and instruments, cinematographic machines and apparatus, optical apparatus and instruments, electrical distribution or control apparatus, rotary converters, phase modifiers, batteries, electrical and magnetic measuring instruments, electric wires and cables, electrical communication machines and apparatus, magnetic cores, resistance wires, electrodes. Electric lamps, lighting apparatus, drying apparatus, recuperators, steamers, evaporation apparatus, distillers, heat exchangers (not parts of machines), industrial boilers, air-conditioning apparatus, freezers, electric heating articles for household use, gas lamps, oil lamps, lamp chimneys. Repair or maintenance of printed board and electron element; repair or maintenance electronic machines and instruments; repair or maintenance of measuring apparatus and instruments; repair or maintenance of integrated circuits manufacturing machines and systems; repair or maintenance of exposure equipment for printed board; repair or maintenance of exposure equipment for manufacturing semiconductor; repair or maintenance of semiconductor manufacturing machines and systems; installation of exposure equipment for printed board; installation of exposure equipment for manufacturing semiconductor; construction, repair or maintenance of metal mold machines; repair or maintenance of powder compacting machines; repair or maintenance of metalworking machines and tools; construction consultancy; repair or maintenance of optical machines and instruments; repair or maintenance of photographic machines and apparatus; repair or maintenance of loading-unloading machines; repair or maintenance of office machines and apparatus; repair or maintenance of telecommunication machines; repair or maintenance of consumer electric appliances; repair or maintenance of electric lighting apparatus; repair or maintenance of power distribution or control machines and apparatus; repair or maintenance of power generators; repair or maintenance of electric motors; repair or maintenance of laboratory apparatus and instruments; repair or maintenance of medical machines and apparatus; repair or maintenance of machines and apparatus for lumbering, woodworking, or veneer or plywood making; repair or maintenance of textile machines and apparatus; repair or maintenance of painting machines and apparatus; repair or maintenance of plastic processing machines; repair or maintenance of packing or wrapping machines.

39.

Exposure apparatus and exposure method, and method of manufacturing electrical wiring board

      
Application Number 11492790
Grant Number 07839484
Status In Force
Filing Date 2006-07-26
First Publication Date 2007-02-01
Grant Date 2010-11-23
Owner ADTEC ENGINEERING CO., LTD. (Japan)
Inventor
  • Yamaguchi, Yoshihide
  • Kishi, Masakazu

Abstract

This invention provides: an exposure apparatus and exposure method based on a maskless exposure technique which uses a two-dimensional optical modulator, in which maskless exposure technique, the exposure apparatus and exposure method employ a first irradiation source optics for drawing a pattern based on exposure pattern data, and a second irradiation source optics for irradiating an energy ray onto a desired area of space on a region inclusive of a region in which the pattern has been drawn; and a method of manufacturing a wiring Substrate (Board); thus, highly accurate pattern forming based on the exposure pattern data is achieved at high throughput and at low costs.

IPC Classes  ?

  • G03B 27/42 - Projection printing apparatus, e.g. enlarger, copying camera for automatic sequential copying of the same original

40.

AFLX

      
Application Number 892331
Status Registered
Filing Date 2006-03-20
Registration Date 2006-03-20
Owner ADTEC Engineering Co., Ltd. (Japan)
NICE Classes  ? 07 - Machines and machine tools

Goods & Services

Exposure equipment for printed boards, equipment for manufacturing printed circuits, exposure equipment for manufacturing semiconductor elements, equipment for manufacturing electron elements, equipment for manufacturing semiconductors or printed boards, equipment for peeling off thin coating film used in the process of manufacturing printed circuit boards, equipment for manufacturing semiconductors and their parts, metal pressing machines, metal molds, metal mold parts, powder pressing/compacting machines, metalworking machines, mine working machines, construction machines, loading and unloading machines, fish-washing machines, fish grading machines, electromechanical machines for the chemical industry, textile machines, food or beverage processing machines, lumbering machines, wood/plywood working machines, pulping, papermaking or paper processing machines, printing machines, bookbinding machines, sewing machines, agricultural machines, shoe making machines, shoe lasts (parts of machines), leather tanning machines, cigarette making machines, glassware manufacturing machines, painting machines, packaging machines, wrapping machines, potters' wheels, plastic processing machines, rubber processing machines, stone working machines, motors other than for land vehicles, pneumatic or hydraulic machines, adhesive tape dispensers, automatic stamping machines, dishwashers, electric machines and apparatus for wax polishing, electric washing machines, vacuum cleaners, electric food blenders (for household purposes), repairing machines, mechanical parking installations, vehicle washing installations, distributors for disinfectants/insecticides/deodorants (not for agricultural use), machine elements (other than for land vehicles), lawnmowers, electrically-operated curtain drawers, waste compacting machines, waste crushing machines, starters for motors and engines, alternating or direct current motors (not including those for land vehicles but including parts for any alternating or direct current motors), alternating generators, direct generators, electrically-operated brushes.

41.

ADEX

      
Application Number 892332
Status Registered
Filing Date 2006-03-20
Registration Date 2006-03-20
Owner ADTEC Engineering Co., Ltd. (Japan)
NICE Classes  ? 07 - Machines and machine tools

Goods & Services

Exposure equipment for printed boards, equipment for manufacturing printed circuits, exposure equipment for manufacturing semiconductor elements, equipment for manufacturing electron elements, equipment for manufacturing semiconductors or printed boards, equipment for peeling off thin coating film used in the process of manufacturing printed circuit boards, equipment for manufacturing semiconductors and their parts, metal pressing machines, metal molds, metal mold parts, powder pressing/compacting machines, metalworking machines, mine working machines, construction machines, loading and unloading machines, fish-washing machines, fish grading machines, electromechanical machines for the chemical industry, textile machines, food or beverage processing machines, lumbering machines, wood/plywood working machines, pulping, papermaking or paper processing machines, printing machines, bookbinding machines, sewing machines, agricultural machines, shoe making machines, shoe lasts (parts of machines), leather tanning machines, cigarette making machines, glassware manufacturing machines, painting machines, packaging machines, wrapping machines, potters' wheels, plastic processing machines, rubber processing machines, stone working machines, motors other than for land vehicles, pneumatic or hydraulic machines, adhesive tape dispensers, automatic stamping machines, dishwashers, electric machines and apparatus for wax polishing, electric washing machines, vacuum cleaners, electric food blenders (for household purposes), repairing machines, mechanical parking installations, vehicle washing installations, distributors for disinfectants/insecticides/deodorants (not for agricultural use), machine elements (other than for land vehicles), lawnmowers, electrically-operated curtain drawers, waste compacting machines, waste crushing machines, starters for motors and engines, alternating or direct current motors (not including those for land vehicles but including parts for any alternating or direct current motors), alternating generators, direct generators, electrically-operated brushes.

42.

Exposure apparatus and exposing method and method of manufacturing a printed wiring board

      
Application Number 11370044
Grant Number 07760328
Status In Force
Filing Date 2006-03-08
First Publication Date 2006-09-28
Grant Date 2010-07-20
Owner ADTEC ENGINEERING CO., LTD. (Japan)
Inventor
  • Yamaguchi, Yoshihide
  • Oyama, Hiroshi

Abstract

The mask-less exposure apparatus includes: a stage which moves with the substrate having a photosensitive resin layer with sensitivity to ultraviolet radiation formed thereon; a first light source for emitting light containing a wavelength component in the wavelength range of 300 to 410 nm; a first light irradiation optical system for modulating a radiant flux emitted from the first light source based on data of a desired exposure pattern to image a pattern on the photosensitive resin layer; a second light source for emitting light containing a wavelength component in the wavelength range of 450 to 2500 nm; and a second light irradiation optical system for guiding a radiant flux emitted from the second light source to a second light irradiation area that is set so as to include at least a first light irradiation area.

IPC Classes  ?

  • G03B 27/72 - Controlling or varying light intensity, spectral composition, or exposure time in photographic printing apparatus