Hangzhou First Applied Material Co., Ltd.

China

Back to Profile

1-38 of 38 for Hangzhou First Applied Material Co., Ltd. Sort by
Query
Aggregations
IP Type
        Patent 35
        Trademark 3
Jurisdiction
        World 22
        United States 15
        Europe 1
Date
2025 May 1
2025 (YTD) 3
2024 8
2023 8
2022 5
See more
IPC Class
H01L 31/048 - Encapsulation of modules 24
C09J 7/10 - Adhesives in the form of films or foils without carriers 15
C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition 12
C09J 123/08 - Copolymers of ethene 10
C09J 11/06 - Non-macromolecular additives organic 9
See more
Status
Pending 10
Registered / In Force 28

1.

ENCAPSULATING COMPOSITION, COMPOSITION, ENCAPSULATING GLUE FILM, ELECTRONIC COMPONENT AND SOLAR CELL ASSEMBLY

      
Application Number 19026169
Status Pending
Filing Date 2025-01-16
First Publication Date 2025-05-15
Owner HANGZHOU FIRST APPLIED MATERIAL CO., LTD. (China)
Inventor
  • Tang, Guodong
  • Hou, Hongbing
  • Zhou, Xinrui
  • Lan, Songqing
  • Wang, Long
  • Wei, Mengjuan
  • Zhou, Guangda

Abstract

An encapsulating composition, a composition, an encapsulating glue film, an electronic component and a solar cell assembly are provided. The encapsulating composition includes polyolefin resin, polyethylene glycol dimethacrylate and organic peroxide, and the structural formula of the polyethylene glycol dimethacrylate is represented by a formula (I). When the polyolefin resin is heated and melted, the ethylene glycol dimethacrylate is delaminated and aggregated in the polyolefin resin. A polymer network structure that has a three-dimensional network structure and that has several ester groups and ether bonds is formed in situ in a polyolefin resin matrix, and the polymer network structure may adsorb residual metal ions in the polyolefin resin.

IPC Classes  ?

  • C09J 7/38 - Pressure-sensitive adhesives [PSA]
  • C09J 7/10 - Adhesives in the form of films or foils without carriers
  • C09J 11/08 - Macromolecular additives
  • H10F 19/80 - Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells

2.

Encapsulation Adhesive Film

      
Application Number 18713689
Status Pending
Filing Date 2022-01-26
First Publication Date 2025-01-30
Owner HANGZHOU FIRST APPLIED MATERIAL CO., LTD. (China)
Inventor
  • Chen, Xiang
  • Wu, Haiyun

Abstract

The present disclosure discloses an encapsulation adhesive film 100, comprising an adhesive film body and a surface pattern provided on at least one surface of the adhesive film body, and the surface pattern comprising a first pattern extending basically along a first direction and a second pattern extending basically along a second direction, the first direction intersecting the second direction at a predetermined angle α, the predetermined angle α being greater than 0° and less than 180°; the surface pattern comprising at least one of the first pattern and at least one of the second pattern. The surface pattern on the surface of the encapsulation adhesive film 100 effectively solves the technical problems in the prior art, achieving the enhancement of the adhesion of the encapsulation adhesive film 100 on the photovoltaic substrate, and reducing the displacement problem during the process of laying the photovoltaic modules.

IPC Classes  ?

3.

Encapsulation Adhesive Film and a Photovoltaic Module

      
Application Number 18714423
Status Pending
Filing Date 2022-07-26
First Publication Date 2025-01-16
Owner HANGZHOU FIRST APPLIED MATERIAL CO., LTD. (China)
Inventor
  • Wei, Mengjuan
  • Peng, Ruiqun
  • Hou, Hongbing
  • Lin, Weihong

Abstract

Provided in the present disclosure are an encapsulation adhesive film and a photovoltaic module. The encapsulation adhesive film includes an infrared high-transmittance adhesive film layer, and an infrared high-reflection adhesive film layer, which is stacked on the infrared high-transmittance adhesive film layer. The light transmittance of the infrared high-transmittance adhesive film layer for light within a wavelength range of 700-1100 nm is greater than 55%; the light transmittance of the infrared high-transmittance adhesive film layer for light within a wavelength range of 400-700 nm is less than 2%; and the reflectivity of the infrared high-reflection adhesive film layer for the light within the wavelength range of 700-1100 nm is greater than 75%. By using the encapsulation adhesive film as an encapsulation adhesive film on a back side of a cell piece, black exterior appearance of the photovoltaic module can be realized so as to reduce light pollution.

IPC Classes  ?

  • C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
  • C09J 7/10 - Adhesives in the form of films or foils without carriers
  • C09J 11/06 - Non-macromolecular additives organic
  • H01L 31/048 - Encapsulation of modules

4.

An Ink Composition for OLED Packaging and An Application thereof

      
Application Number 18689060
Status Pending
Filing Date 2022-07-01
First Publication Date 2024-11-07
Owner HANGZHOU FIRST APPLIED MATERIAL CO., LTD. (China)
Inventor
  • Hong, Haibing
  • Shen, Xin
  • Yang, Chufeng
  • Wang, Shihao

Abstract

Provided are a Polyhedral Oligomeric Silsesquioxane (POSS) structure-containing ink composition and an application thereof. The ink composition includes, by weight percentage, 20-40% of a POSS structure-containing monomer, 50-70% of a photocuring monomer, and 1-10% of a photoinitiator; and the POSS structure-containing monomer includes a repeating unit as shown in a general formula (R—SiO1.5)n, where at least one R group is selected from a structure having acryloyloxy or methacryloyloxy. By introducing the POSS structure into the ink composition for Organic Light-Emitting Diode (OLED) packaging, the ink composition has a better packaging effect, and an organic packaging layer prepared by the ink has a good and extremely-low Water Vapor Transmission Rate (WVTR) and Oxygen Transmission Rate (OTR), such that the service life of an OLED device can be effectively prolonged. In addition, the ink composition can effectively reduce the preparation cost and process difficulty of an OLED packaging thin film.

IPC Classes  ?

  • C09D 11/38 - Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
  • C09D 11/101 - Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
  • H10K 50/84 - PassivationContainersEncapsulations
  • H10K 85/40 - Organosilicon compounds, e.g. TIPS pentacene
  • H10K 102/00 - Constructional details relating to the organic devices covered by this subclass

5.

LIGHT CONVERSION FILM COMPOSITION, LIGHT CONVERSION FILM, AND PHOTOVOLTAIC MODULE

      
Application Number CN2023142487
Publication Number 2024/207829
Status In Force
Filing Date 2023-12-27
Publication Date 2024-10-10
Owner HANGZHOU FIRST APPLIED MATERIAL CO., LTD. (China)
Inventor
  • Liu, Jin
  • Hu, Xiaobo
  • Yang, Chufeng
  • Hou, Hongbing
  • Zhou, Guangda

Abstract

The present invention provides a light conversion film composition, a light conversion film, and a photovoltaic module. The light conversion film composition comprises, in percentage by weight, 80-99.98% of matrix resin, 0.01-10% of a light conversion agent, and 0.01-10% of an auxiliary agent. The light conversion agent is a benzotriazole derivative. The structural general formula of the benzotriazole derivative is as follows: formula (I), wherein the R substituent is of formula (a), there is at least one R substituent in sites 4 and 7 of the benzotriazole derivative, and there is at least one R substituent in sites 5 and 6 of the benzotriazole derivative. The light conversion film obtained from the light conversion film composition expands the absorption range of a material in an ultraviolet light area, thereby improving the solubility and the light conversion efficiency of the light conversion film, and obtaining a wider absorption range while ensuring the light stability of the light conversion film, so that the corresponding light conversion film can provide better protection and gain effects for battery assemblies.

IPC Classes  ?

  • C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
  • C09J 7/10 - Adhesives in the form of films or foils without carriers
  • C09J 123/08 - Copolymers of ethene
  • C09J 11/06 - Non-macromolecular additives organic
  • C09J 11/08 - Macromolecular additives
  • H01L 31/048 - Encapsulation of modules
  • H01L 31/055 - Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means where light is absorbed and re-emitted at a different wavelength by the optical element directly associated or integrated with the PV cell, e.g. by using luminescent material, fluorescent concentrators or up-conversion arrangements
  • C09K 11/06 - Luminescent, e.g. electroluminescent, chemiluminescent, materials containing organic luminescent materials
  • C07D 249/18 - Benzotriazoles
  • C07D 249/20 - Benzotriazoles with aryl radicals directly attached in position 2

6.

A Bridging Agent, A Composition, A Masterbatch, An Encapsulating Glue Film and AnElectronic Component

      
Application Number 18283221
Status Pending
Filing Date 2021-11-05
First Publication Date 2024-06-06
Owner HANGZHOU FIRST APPLIED MATERIAL CO.,LTD. (China)
Inventor
  • Tang, Guodong
  • Li, Bogeng
  • Zhou, Guangda
  • Hou, Hongbing
  • Mei, Yunxiao
  • Wei, Mengjuan

Abstract

The disclosure provides a bridging agent, a composition, a masterbatch, an encapsulating glue film and an electronic component. The bridging agent has a cyclic structure with the following general structural formula: R1xR2y[CH3SiO]n, wherein n is an even number and 4≤n≤10; R1 and R2 are both connected to Si atoms, and x+y is equal to the n; R1s are in pairwise alignment. R2s are in pairwise alignment, the R1s in pairwise alignment are the same, the R2s in pairwise alignment are the same, the R1s that are not in alignment are either the same or different, and the R2s that are not in alignment are either the same or different. The bridging agent of the present disclosure reduces the probability of migration in a polyolefin resin, thereby the creep resistance of the polyolefin resin is improved, and the service life of the electronic component is prolonged.

IPC Classes  ?

  • C09J 11/06 - Non-macromolecular additives organic
  • C07F 7/08 - Compounds having one or more C—Si linkages
  • C09J 7/10 - Adhesives in the form of films or foils without carriers
  • C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
  • C09J 123/08 - Copolymers of ethene

7.

PACKAGING ADHESIVE FILM AND PHOTOVOLTAIC ASSEMBLY

      
Application Number CN2022130783
Publication Number 2024/055403
Status In Force
Filing Date 2022-11-09
Publication Date 2024-03-21
Owner HANGZHOU FIRST APPLIED MATERIAL CO., LTD. (China)
Inventor
  • Zheng, Jiongzhou
  • Wei, Mengjuan
  • Hou, Hongbing

Abstract

The present application belongs to the technical field of photovoltaics. Disclosed in the present application is a packaging adhesive film. The packaging adhesive film comprises a cell layer, wherein the cell rate of the cell layer is S1. A lamination treatment is performed on the packaging adhesive film for 10-20 min at a temperature of 120-160ºC and a pressure of 101 kPa. After lamination, the cell rate is S2, and the ratio S2/S1 of the cell rate S2 after lamination to the cell rate S1 before lamination is 0.1%-90%. Further disclosed in the present application is a photovoltaic assembly. The photovoltaic assembly comprises a front-layer substrate, a first packaging adhesive film layer, a battery string, a second packaging adhesive film layer and a rear-layer substrate, wherein at least one of the first packaging adhesive film layer and the second packaging adhesive film layer is selected from the packaging adhesive film. In the present application, by means of controlling the cell rate, the cell size, the cell retention rate and the cell size retention rate of a packaging adhesive film, when the hardness of the packaging adhesive film and the hidden-crack rate of a battery piece are reduced, the mechanical properties and pass rate of the packaging adhesive film are ensured, and the mechanical properties and packaging pass rate of the whole photovoltaic assembly, which has been subjected to a lamination treatment, are also ensured.

IPC Classes  ?

  • C09J 7/00 - Adhesives in the form of films or foils
  • C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
  • C09J 123/08 - Copolymers of ethene
  • C09J 123/06 - Polyethene
  • C09J 123/12 - Polypropene
  • C09J 123/16 - Ethene-propene or ethene-propene-diene copolymers
  • C09J 11/04 - Non-macromolecular additives inorganic
  • C09J 11/08 - Macromolecular additives
  • C08J 9/06 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent
  • C08J 9/12 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent
  • C08L 23/08 - Copolymers of ethene
  • C08L 23/06 - Polyethene
  • C08L 23/12 - Polypropene
  • C08L 23/16 - Ethene-propene or ethene-propene-diene copolymers
  • H01L 31/048 - Encapsulation of modules

8.

An Encapsulating composition, a composition, an encapsulating glue film, an electronic component and a solar cell assembly

      
Application Number 18268244
Status Pending
Filing Date 2021-06-29
First Publication Date 2024-02-22
Owner HANGZHOU FIRST APPLIED MATERIAL CO., LTD. (China)
Inventor
  • Tang, Guodong
  • Hou, Hongbing
  • Zhou, Xinrui
  • Lan, Songqing
  • Wang, Long
  • Wei, Mengjuan
  • Zhou, Guangda

Abstract

The present disclosure provides an encapsulating composition, a composition, an encapsulating glue film, an electronic component and a solar cell assembly. The encapsulating composition comprises polyolefin resin, polyethylene glycol dimethacrylate and organic peroxide, and the structural formula of the polyethylene glycol dimethacrylate is represented by a formula (I). When the polyolefin resin is heated and melted, the ethylene glycol dimethacrylate is delaminated and aggregated in the polyolefin resin. A polymer network structure that has a three-dimensional network structure and that has several ester groups and ether bonds is formed in situ in a polyolefin resin matrix, and the polymer network structure may adsorb residual metal ions in the polyolefin resin, thereby reducing the mobility of the metal ions, so as to improve the dry insulation resistance of the polyolefin resin. In addition, said composition has simple components, readily available raw materials and low costs.

IPC Classes  ?

9.

A Patterned Adhesive Film and a Photovoltaic Assembly

      
Application Number 18039723
Status Pending
Filing Date 2021-05-11
First Publication Date 2024-01-25
Owner HANGZHOU FIRST APPLIED MATERIAL CO., LTD. (China)
Inventor
  • Deng, Wei
  • Yang, Chufeng
  • Wu, Qian

Abstract

Provided are a patterned adhesive film and a photovoltaic assembly. The patterned adhesive film includes a bottom-layer adhesive film and a patterned coating layer arranged on the surface of the bottom-layer adhesive film, the minimum torque value ML of the bottom-layer adhesive film at 100° C. is 0.2-2.5 dN·m, and the elongation at break of the patterned coating layer is ≥20%. Therefore, while laminating is performed on the photovoltaic assembly including the patterned adhesive film, the bottom-layer adhesive film has relatively low fluidity, and the elongation at break of the patterned coating layer may be matched with the bottom-layer adhesive film having the relatively low fluidity, such that the cracking problem of the patterned adhesive film is avoided in the laminating process of the photovoltaic assembly.

IPC Classes  ?

  • H01L 31/0216 - Coatings
  • H01L 31/0236 - Special surface textures
  • H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof

10.

LIQUID RUBBER PHOTOVOLTAIC ENCAPSULATION COMPOSITION, ENCAPSULATION METHOD AND PHOTOVOLTAIC MODULE

      
Application Number CN2023076254
Publication Number 2024/016650
Status In Force
Filing Date 2023-02-15
Publication Date 2024-01-25
Owner HANGZHOU FIRST APPLIED MATERIAL CO., LTD. (China)
Inventor
  • Xu, Li
  • Tang, Guodong
  • Hou, Hongbing
  • Zhou, Guangda
  • Lin, Jianhua

Abstract

Provided in the present invention are a liquid rubber photovoltaic encapsulation composition, an encapsulation method and a photovoltaic module. The liquid rubber photovoltaic encapsulation composition comprises: 100 parts by mass of a conjugated diene-based liquid rubber, 0.01-15 parts by mass of a cross-linking agent, and 0.1-8 parts by mass of a tackifier, wherein the viscosity of the conjugated diene-based liquid rubber at 25°C is 20-20,000 mPa·s, and the glass transition temperature of the conjugated diene-based liquid rubber is not higher than -70°C. The conjugated diene-based liquid rubber obtained by homopolymerizing a conjugated diene itself or copolymerizing a conjugated diene with other monomers has good fluidity at room temperature. When the conjugated diene-based liquid rubber is applied to a photovoltaic encapsulation material, a battery sheet does not easily break during curing compared with a solid encapsulation method, it is also relatively convenient to eliminate bubbles, the operation can be simplified, and the product yield is further improved.

IPC Classes  ?

  • C09J 109/00 - Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
  • C09J 115/00 - Adhesives based on rubber derivatives

11.

INK COMPOSITION, PACKAGING STRUCTURE, AND SEMICONDUCTOR DEVICE

      
Application Number CN2023094582
Publication Number 2024/007741
Status In Force
Filing Date 2023-05-16
Publication Date 2024-01-11
Owner HANGZHOU FIRST APPLIED MATERIAL CO., LTD. (China)
Inventor
  • Hong, Haibing
  • Yang, Chufeng
  • Shen, Xin
  • Wang, Shihao
  • Deng, Wei

Abstract

The present invention provides an ink composition, a packaging structure, and a semiconductor device. The ink composition comprises: a photocurable silicon-containing monomer component, a reactive diluent component and a photoinitiator component, wherein the photocurable silicon-containing monomer component comprises any one or more of compounds represented by the following structural formula (I). By applying the technical solution of the present invention, a fluorine-substituted silicon-containing monomer is used in conjunction with the reactive diluent-containing component, and a free radical curing system can be formed. The free radical curing system can effectively reduce the dielectric constant and improve the curing speed, and since the fluorine-substituted silicon-containing monomer in the ink composition of the present application has a relatively high boiling point and is not prone to experiencing volatilization, ink holes are prevented from being blocked during the use process, and the requirements for ink-jet printing in the prior art can be better satisfied. In addition, the fluorine-substituted silicon-containing monomer of the present application is simple to prepare, raw materials are cheap and readily available, and the production cost is relatively low, such that popularization and application are facilitated.

IPC Classes  ?

  • C09D 11/101 - Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
  • C09D 11/30 - Inkjet printing inks
  • C09D 11/36 - Inkjet printing inks based on non-aqueous solvents
  • C09D 183/04 - Polysiloxanes
  • H01L 33/56 - Materials, e.g. epoxy or silicone resin
  • C08L 83/04 - Polysiloxanes
  • H01B 3/46 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances plasticsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances resinsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances waxes silicones

12.

ENCAPSULATION ADHESIVE FILM AND APPLICATION THEREOF

      
Application Number CN2023072426
Publication Number 2023/236539
Status In Force
Filing Date 2023-01-16
Publication Date 2023-12-14
Owner HANGZHOU FIRST APPLIED MATERIAL CO., LTD. (China)
Inventor
  • Wang, Long
  • Wei, Mengjuan
  • Sang, Yan
  • Hou, Hongbing
  • Zhou, Guangda

Abstract

Provided by the provided by the present invention is an encapsulation adhesive film, having at least two layers. The encapsulation adhesive film comprises an ultraviolet light absorption layer and an ultraviolet light conversion layer; the ultraviolet light absorption layer comprises a matrix resin and an ultraviolet light absorption agent; and the ultraviolet light conversion layer comprises a matrix resin and an ultraviolet light conversion agent. The content of ultraviolet light absorption agent in the ultraviolet light absorption layer is 0.1g/m2-10g/m2. and the content of ultraviolet light conversion agent in the ultraviolet light conversion layer is 0.1g/m2-10g/m2. The ultraviolet light absorption agent in the ultraviolet light absorption layer may absorb ultraviolet light with wavelengths in the range of 200-400 nm, and the light conversion agent in the ultraviolet light conversion layer may convert ultraviolet light with wavelengths between 280-380 nm into visible light. The encapsulation adhesive film of the present invention comprises a multi-layer composite structure, the ultraviolet light absorption agent and the ultraviolet light conversion agent being dispersed in different layers, mutually non-interfering yet synergistically working together to achieve high ultraviolet cutoff and high visible light transmittance. Different ultraviolet absorption agents and ultraviolet light conversion agents may be appropriately combined according to their corresponding wavelengths, to achieve a desired effect.

IPC Classes  ?

  • C09J 7/10 - Adhesives in the form of films or foils without carriers
  • C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
  • C09J 123/08 - Copolymers of ethene
  • C09J 11/06 - Non-macromolecular additives organic
  • C09J 11/04 - Non-macromolecular additives inorganic
  • H01L 31/048 - Encapsulation of modules
  • H01L 31/055 - Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means where light is absorbed and re-emitted at a different wavelength by the optical element directly associated or integrated with the PV cell, e.g. by using luminescent material, fluorescent concentrators or up-conversion arrangements
  • C03C 27/12 - Laminated glass

13.

A packaging adhesive film and a photovoltaic module

      
Application Number 18016452
Status Pending
Filing Date 2021-05-08
First Publication Date 2023-08-31
Owner HANGZHOU FIRST APPLIED MATERIAL CO.,LTD. (China)
Inventor
  • Cao, Mingjie
  • Zhou, Guangda

Abstract

The disclosure provides a packaging adhesive film and a photovoltaic module. The packaging adhesive film includes a planar base layer and a buffer layer, the buffer layer is arranged on a surface of the planar base layer, and the buffer layer includes a plurality of buffer parts arranged at intervals, each one of the buffer part includes a long strip-shaped protrusion, and the long strip-shaped protrusion is arranged in a position corresponding to a photovoltaic ribbon, or arranged in a position corresponding to a cell piece gap in a photovoltaic module, or arranged in a position corresponding to a position of a depression of a lap portion of a laminated photovoltaic module, or arranged in a position corresponding to a position of a depression of a lap portion of a stacked tile photovoltaic module. The packaging adhesive film is simple in structure, and as the disclosure only aims at thickening the part of the packaging adhesive film corresponding to the position where a cell piece is prone to a micro-crack, a fracture and grating breakage, compared with the thickening of the whole packaging adhesive film in the prior art, the packaging adhesive film of the disclosure solves the probability of the reliability problems such as a micro-crack, a fracture and grating breakage occur to the cell piece in the packaging and laminating process of the photovoltaic module, as well as greatly reduces the production cost.

IPC Classes  ?

14.

Anti-PID encapsulation adhesive film, photovoltaic module, and photovoltaic module manufacturing method

      
Application Number 18011193
Grant Number 11987734
Status In Force
Filing Date 2021-05-20
First Publication Date 2023-07-27
Grant Date 2024-05-21
Owner HANGZHOU FIRST APPLIED MATERIAL CO., LTD. (China)
Inventor
  • Wang, Haonan
  • Cao, Mingjie
  • Sang, Yan
  • Hou, Hongbing
  • Deng, Wei
  • Mei, Yunxiao
  • Jin, Dayue
  • Yang, Chufeng

Abstract

The present disclosure provides an anti-PID encapsulation adhesive film, a photovoltaic module, and a photovoltaic module manufacturing method. The anti-PID encapsulation adhesive film includes a base adhesive film layer, an insulating layer, and a conductive layer. The insulating layer is located on one side surface of the base adhesive film layer. The insulating layer has a grid structure. The grid structure includes grid lines and a plurality of hollow portions defined by the grid lines. The grid lines have a structure corresponding to gaps between cell pieces. The conductive layer includes a plurality of conductive portions. The conductive portions are arranged in the hollow portions in one-to-one correspondence. The volume resistivity of the conductive portions is less than 100 Ω·cm.

IPC Classes  ?

  • H01L 31/048 - Encapsulation of modules
  • C09J 7/29 - Laminated material
  • H01L 31/02 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof - Details
  • H01L 31/05 - Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
  • H02S 40/38 - Energy storage means, e.g. batteries, structurally associated with PV modules

15.

ENCAPSULATION FILM AND PHOTOVOLTAIC MODULE

      
Application Number CN2022108006
Publication Number 2023/115943
Status In Force
Filing Date 2022-07-26
Publication Date 2023-06-29
Owner HANGZHOU FIRST APPLIED MATERIAL CO., LTD. (China)
Inventor
  • Wei, Mengjuan
  • Peng, Ruiqun
  • Hou, Hongbing
  • Lin, Weihong

Abstract

Provided in the present invention are an encapsulation film and a photovoltaic module. The encapsulation film comprises an infrared high-transmittance film layer and an infrared high-reflection film layer, which is stacked on the infrared high-transmittance film layer, wherein the light transmittance of the infrared high-transmittance film layer for light within a wavelength range of 700-1100 nm is greater than 55%; the light transmittance of the infrared high-transmittance film layer for light within a wavelength range of 400-700 nm is less than 2%; and the reflectivity of the infrared high-reflection film layer for light within the wavelength range of 700-1100 nm is greater than 75%. By means of using the encapsulation film as an encapsulation film on the back face of a cell piece, a black exterior appearance of the photovoltaic module can be realized so as to reduce light pollution, and sunlight can also be utilized to the maximum extent, such that the overall photoelectric conversion efficiency of the photovoltaic module is improved, thereby improving the efficiency and the service life of a solar cell. Furthermore, by means of applying the encapsulation film to building-integrated photovoltaics (BIPV), both the aesthetics of a building and the efficiency of the photovoltaic module can be taken into consideration.

IPC Classes  ?

  • C09J 7/10 - Adhesives in the form of films or foils without carriers
  • C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
  • H01L 31/048 - Encapsulation of modules

16.

Adhesive film, composition for forming same and electronic device

      
Application Number 17927685
Status Pending
Filing Date 2020-08-17
First Publication Date 2023-06-08
Owner HANGZHOU FIRST APPLIED MATERIAL CO.,LTD. (China)
Inventor
  • Tang, Guodong
  • Wang, Long
  • Sang, Yan
  • Zhou, Guangda
  • Hou, Hongbing
  • Lin, Jianhua

Abstract

Provided are an adhesive film, a composition for forming the same and an electronic device. The composition includes: a thermoplastic polymeric resin and an antistatic agent, the antistatic agent is an amide organic compound represented by Formula (I). The above antistatic agent contains a strong-polarity amide group and an optional polar group. The amide group may form an intramolecular hydrogen bond, which has a shorter bond length, and a dipole electric field generated by positive and negative ions formed after ionization is strong and a voltage generated by an external electrostatic field may be counteracted, such that the antistatic agent has a better antistatic property. The optional polar group may improve the above antistatic property: The thermoplastic polymeric resin has good thermal processability, and after it and the antistatic agent are subjected to melt extrusion, the adhesive film with the better antistatic property and processability may be formed. Provided are an adhesive film, a composition for forming the same and an electronic device. The composition includes: a thermoplastic polymeric resin and an antistatic agent, the antistatic agent is an amide organic compound represented by Formula (I). The above antistatic agent contains a strong-polarity amide group and an optional polar group. The amide group may form an intramolecular hydrogen bond, which has a shorter bond length, and a dipole electric field generated by positive and negative ions formed after ionization is strong and a voltage generated by an external electrostatic field may be counteracted, such that the antistatic agent has a better antistatic property. The optional polar group may improve the above antistatic property: The thermoplastic polymeric resin has good thermal processability, and after it and the antistatic agent are subjected to melt extrusion, the adhesive film with the better antistatic property and processability may be formed.

IPC Classes  ?

  • C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
  • C09J 7/10 - Adhesives in the form of films or foils without carriers
  • C09J 11/06 - Non-macromolecular additives organic
  • C08K 5/20 - Carboxylic acid amides
  • C08K 5/5425 - Silicon-containing compounds containing oxygen containing at least one C=C bond
  • C08F 210/02 - Ethene
  • C08F 210/14 - Monomers containing five or more carbon atoms
  • B29C 48/00 - Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired formApparatus therefor
  • B29C 48/395 - Means for plasticising or homogenising the moulding material or forcing it through the nozzle or die using screws surrounded by a cooperating barrel, e.g. single screw extruders
  • B29C 48/08 - Flat, e.g. panels flexible, e.g. films
  • H01L 31/048 - Encapsulation of modules

17.

ENCAPSULATION ADHESIVE FILM

      
Application Number CN2022073956
Publication Number 2023/092857
Status In Force
Filing Date 2022-01-26
Publication Date 2023-06-01
Owner HANGZHOU FIRST APPLIED MATERIAL CO., LTD. (China)
Inventor
  • Chen, Xiang
  • Wu, Haiyun

Abstract

Disclosed is an encapsulation adhesive film 100, comprising an adhesive film body and surface patterns arranged on at least one surface of the adhesive film body. The surface patterns comprise first patterns extending in a first direction and second patterns extending in a second direction, the first direction intersects with the second direction at a preset angle α, and the preset angle α is greater than 0° and smaller than 180°; the surface patterns comprise at least one first pattern and at least one second pattern. In the present application, surface patterns are arranged on a surface of the encapsulation adhesive film 100, so that the technical problem in the prior art is effectively solved, the adhesive force of the encapsulation adhesive film 100 on a photovoltaic substrate is increased, and deviation occurring in a laying process of a photovoltaic module is reduced.

IPC Classes  ?

18.

Film and electronic device comprising same

      
Application Number 17614574
Grant Number 11905398
Status In Force
Filing Date 2020-08-17
First Publication Date 2023-03-30
Grant Date 2024-02-20
Owner HANGZHOU FIRST APPLIED MATERIAL CO., LTD. (China)
Inventor
  • Wei, Mengjuan
  • Tang, Guodong
  • Hou, Hongbing
  • Zhou, Guangda

Abstract

Provided are a film and an electric device comprising the same. The film comprises at least one modified polyolefin resin layer. A resin forming the modified polyolefin resin layer comprises 1-100% of modified polyolefin resin. A main chain in the modified polyolefin resin is an ethylene-α-olefin copolymer. A grafted branched chain in the modified polyolefin resin is selected from a compound formed by a vinyl monomer comprising one or more of anhydride group, hydroxyl, ester group, carbonyl, acylamino, pyridyl, epoxy, pyrrolidonyl and glycidyl. A molecular weight of the grafted branched chain is 150-8000 g/mol. The film prepared from the modified POE layer with the main chain and the grafted branched chain has excellent anti-PID performance. The layers have a better adhesive property without a laminated interface therebetween. The co-extruded film further has an excellent water vapor barrier property, a relatively high insulating property and a relatively high light transmittance.

IPC Classes  ?

  • C09J 11/08 - Macromolecular additives
  • C09J 123/08 - Copolymers of ethene
  • C09J 151/06 - Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bondsAdhesives based on derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
  • C09J 7/10 - Adhesives in the form of films or foils without carriers
  • H01L 31/048 - Encapsulation of modules
  • B32B 17/10 - Layered products essentially comprising sheet glass, or fibres of glass, slag or the like comprising glass as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
  • C08J 5/18 - Manufacture of films or sheets
  • C08L 23/08 - Copolymers of ethene

19.

BRIDGING AGENT, COMPOSITION, MASTERBATCH, PACKAGING FILM AND ELECTRONIC COMPONENT

      
Application Number CN2021129110
Publication Number 2023/024267
Status In Force
Filing Date 2021-11-05
Publication Date 2023-03-02
Owner HANGZHOU FIRST APPLIED MATERIAL CO., LTD. (China)
Inventor
  • Tang, Guodong
  • Li, Bogeng
  • Zhou, Guangda
  • Hou, Hongbing
  • Mei, Yunxiao
  • Wei, Mengjuan

Abstract

The present invention provides a bridging agent, a composition, a masterbatch, a packaging film and an electronic component. The bridging agent has a cyclic structure with the following general structural formula: R1xxR2y3nn, where n is an even number and 4≤n≤10; both R1and R2are connected to Si atoms, and R1is a group having a terminal double bond; R2is a linear alkyl group or a branched alkyl group having 4 to 14 carbon atoms; x is an even number greater than 1 and less than n, and x+y is equal to n; R1s are in pairwise alignment, R2s are in pairwise alignment, R1s in pairwise alignment are the same, R2s in pairwise alignment are the same, R1s that are not aligned are either the same or different, and R2s that are not in alignment are either the same or different. The bridging agent of the present application reduces the probability of migration in a polyolefin resin, thereby improving the creep resistance of the polyolefin resin, and further prolonging the service life of an electronic component.

IPC Classes  ?

  • C09J 123/08 - Copolymers of ethene
  • C09J 123/06 - Polyethene
  • C09J 11/06 - Non-macromolecular additives organic
  • C09J 7/10 - Adhesives in the form of films or foils without carriers
  • C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
  • H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material

20.

Adhesive film, anti-PID encapsulation adhesive film, composition forming adhesive film, and photovoltaic module and laminated glass

      
Application Number 17775271
Status Pending
Filing Date 2020-08-17
First Publication Date 2022-12-08
Owner HANGZHOU FIRST APPLIED MATERIAL CO.,LTD. (China)
Inventor
  • Wei, Mengjuan
  • Zhou, Guangda
  • Wang, Fucheng
  • Hou, Hongbing
  • Sang, Yan
  • Du, Ganhong
  • Liu, Ting
  • Wang, Haonan

Abstract

Disclosed are an adhesive film, an anti-PID encapsulation adhesive film, a composition forming the adhesive film, and a photovoltaic module and laminated glass. The composition includes: an ethylene copolymer matrix resin, an amide organic compound, a metal oxide and/or metal hydroxide, the metal oxide is selected from one or more of the components aluminum oxide, calcium oxide, zinc oxide, banum oxide, magnesium oxide, zirconium oxide, titanium oxide, tin oxide, vanadium oxide, antimony oxide, tantalum oxide, niobium oxide, layered transition metal oxide, or ZnO-doped Al2O3, CaO/SiO2-doped Al2O3, MgO-doped Al2O3, SiO2-doped ZrO2, and TiO2-doped ZrO2, and the metal hydroxide is selected from one or more of the components calcium hydroxide, magnesium hydroxide, zinc hydroxide, aluminum hydroxide, iron hydroxide and barium hydroxide. Alternatively, the composition includes: a matrix resin, a metal ion trapping agent and an organic co-crosslinker. The adhesive film has a better anti-PID effect, photoelectric conversion efficiency and encapsulation performance.

IPC Classes  ?

  • C09J 7/38 - Pressure-sensitive adhesives [PSA]
  • C09J 11/06 - Non-macromolecular additives organic
  • C09J 11/04 - Non-macromolecular additives inorganic
  • C09J 4/06 - Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups
  • C09J 7/10 - Adhesives in the form of films or foils without carriers

21.

PATTERNED ADHESIVE FILM AND PHOTOVOLTAIC ASSEMBLY

      
Application Number CN2021093105
Publication Number 2022/134431
Status In Force
Filing Date 2021-05-11
Publication Date 2022-06-30
Owner HANGZHOU FIRST APPLIED MATERIAL CO., LTD. (China)
Inventor
  • Deng, Wei
  • Yang, Chufeng
  • Wu, Qian

Abstract

The present invention provides a patterned adhesive film and a photovoltaic assembly. The patterned adhesive film comprises a bottom-layer adhesive film and a patterned coating provided on the surface of the bottom-layer adhesive film, the minimum torque value ML of the bottom-layer adhesive film at 100°C being 0.2-2.5 dN·m, and the elongation at break of the patterned coating being greater than or equal to 20%. Therefore, when laminating is performed on the photovoltaic assembly comprising the patterned adhesive film, the bottom-layer adhesive film has relatively low fluidity, and the elongation at break of the patterned coating can be matched with the bottom-layer adhesive film having low fluidity, such that the cracking problem of the patterned adhesive film is avoided in the laminating process of the photovoltaic assembly.

IPC Classes  ?

22.

ENCAPSULATING COMPOSITION, COMPOSITION, ENCAPSULATING GLUE FILM, ELECTRONIC COMPONENT AND SOLAR CELL ASSEMBLY

      
Application Number CN2021103007
Publication Number 2022/127070
Status In Force
Filing Date 2021-06-29
Publication Date 2022-06-23
Owner HANGZHOU FIRST APPLIED MATERIAL CO., LTD. (China)
Inventor
  • Tang, Guodong
  • Hou, Hongbing
  • Zhou, Xinrui
  • Lan, Songqing
  • Wang, Long
  • Wei, Mengjuan
  • Zhou, Guangda

Abstract

The present invention provides an encapsulating composition, a composition, an encapsulating glue film, an electronic component and a solar cell assembly. The encapsulating composition comprises polyolefin resin, polyethylene glycol dimethacrylate and organic peroxide, and the structural formula of the polyethylene glycol dimethacrylate is represented by formula (I), wherein n is an integer of 2-5. Polar ethylene glycol dimethacrylate and non-polar polyolefin resin are thermodynamically incompatible, and when the polyolefin resin is heated and melted, the ethylene glycol dimethacrylate is delaminated and aggregated in the polyolefin resin. Meanwhile, a polymer network structure that has a three-dimensional network structure and that has several ester groups and ether bonds is formed in situ in a polyolefin resin matrix by curing, and the polymer network structure may adsorb residual metal ions in the polyolefin resin, thereby reducing the mobility of the metal ions, so as to improve the dry insulation resistance of the polyolefin resin. In addition, said composition has simple components, readily available raw materials and low costs.

IPC Classes  ?

  • C09J 4/02 - Acrylmonomers
  • C09J 7/10 - Adhesives in the form of films or foils without carriers
  • C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
  • C09J 123/00 - Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bondAdhesives based on derivatives of such polymers
  • C09J 123/08 - Copolymers of ethene
  • C09J 151/06 - Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bondsAdhesives based on derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
  • H01L 31/048 - Encapsulation of modules

23.

PACKAGING ADHESIVE FILM AND PHOTOVOLTAIC MODULE

      
Application Number CN2021092477
Publication Number 2022/012125
Status In Force
Filing Date 2021-05-08
Publication Date 2022-01-20
Owner HANGZHOU FIRST APPLIED MATERIAL CO., LTD. (China)
Inventor
  • Cao, Mingjie
  • Zhou, Guangda

Abstract

The present invention provides a packaging adhesive film and a photovoltaic module. The packaging adhesive film comprises a flat base layer and a buffer layer. The buffer layer is arranged on a surface of the flat base layer. The buffer layer comprises multiple buffer portions arranged at intervals. Each buffer portion comprises an elongated protrusion. The elongated protrusion is arranged in a position corresponding to a photovoltaic solder ribbon, or in a position corresponding to a cell gap in a photovoltaic module, or in a position corresponding to a position of a laminated photovoltaic module recessed relative to a lapping portion, or in a position corresponding to a position of a shingled photovoltaic module recessed relative to a lapping portion. The packaging adhesive film has a simple structure. In addition, in the present application, only portions of the packaging adhesive film corresponding to positions of the cell where a micro-crack, a fracture, a broken gate, etc., are prone to occur are thickened. Therefore, compared with the prior art in which the entire packaging adhesive film is thickened, the packaging adhesive film of the present application resolves the issue in which a micro-crack, a fracture, a gate rupture, etc., occur in the cell during packaging and lamination of the photovoltaic module and therefore cause unreliability, and greatly reduces production costs.

IPC Classes  ?

24.

ANTI-PID ENCAPSULATION ADHESIVE FILM, PHOTOVOLTAIC MODULE, AND PHOTOVOLTAIC MODULE MANUFACTURING METHOD

      
Application Number CN2021094955
Publication Number 2022/001467
Status In Force
Filing Date 2021-05-20
Publication Date 2022-01-06
Owner HANGZHOU FIRST APPLIED MATERIAL CO., LTD. (China)
Inventor
  • Wang, Haonan
  • Cao, Mingjie
  • Sang, Yan
  • Hou, Hongbing
  • Deng, Wei
  • Mei, Yunxiao
  • Jin, Dayue
  • Yang, Chufeng

Abstract

The present invention provides an anti-PID encapsulation adhesive film, a photovoltaic module, and a photovoltaic module manufacturing method. The anti-PID encapsulation adhesive film comprises a base adhesive film layer, an insulating layer, and a conductive layer; the insulating layer is located on one side surface of the base adhesive film layer; the insulating layer has a grid structure; the grid structure comprises grid lines and a plurality of hollow portions defined by the grid lines; the grid lines have a structure corresponding to gaps between cell pieces; the conductive layer comprises a plurality of conductive portions; the conductive portions are arranged in the hollow portions in one-to-one correspondence; the volume resistivity of the conductive portions is less than 100 Ω•cm. According to the encapsulation adhesive film, in actual assembly, the conductive portions are disposed in the hollow portions in one-to-one correspondence, and thus, after the assembly is completed, the cell pieces and the conductive portions correspond in structure and are arranged in one-to-one correspondence; the grid lines are correspondingly arranged below the gaps between the cell pieces. Ions or charges enriched on the surfaces of the cell pieces or passing through the adhesive film can be delivered away by means of the conductive portions, thereby directly eliminating charges causing failure of the passivation layer.

IPC Classes  ?

25.

ADHESIVE FILM, COMPOSITION FOR FORMING SAME AND ELECTRONIC DEVICE

      
Application Number CN2020109633
Publication Number 2021/253611
Status In Force
Filing Date 2020-08-17
Publication Date 2021-12-23
Owner HANGZHOU FIRST APPLIED MATERIAL CO., LTD. (China)
Inventor
  • Tang, Guodong
  • Wang, Long
  • Sang, Yan
  • Zhou, Guangda
  • Hou, Hongbing
  • Lin, Jianhua

Abstract

Provided are an adhesive film, a composition for forming same and an electronic device. The composition comprises: a thermoplastic polymeric resin and an antistatic agent, wherein the antistatic agent is an amide organic substance as represented by formula (I). The antistatic agent contains a strong-polarity amido and an optional polar group. The amido can form an intramolecular hydrogen bond, which has a shorter bond length, and a dipole electric field generated by positive and negative ions formed after ionization is strong and a voltage generated by an external electrostatic field can be counteracted, such that the antistatic agent has a better antistatic property. The optional polar group can further improve the antistatic property. The thermoplastic polymeric resin has good thermal processability, and after the thermoplastic polymeric resin and the antistatic agent as represented by formula (I) are subjected to melt extrusion, an adhesive film with a better antistatic property and processability can be formed.

IPC Classes  ?

  • C09J 7/10 - Adhesives in the form of films or foils without carriers
  • C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
  • C09J 4/06 - Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups
  • C09J 4/02 - Acrylmonomers
  • C09J 123/00 - Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bondAdhesives based on derivatives of such polymers
  • H01L 31/048 - Encapsulation of modules
  • H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material

26.

ADHESIVE FILM AND ELECTRONIC DEVICE COMPRISING SAME

      
Application Number CN2020109634
Publication Number 2021/253612
Status In Force
Filing Date 2020-08-17
Publication Date 2021-12-23
Owner HANGZHOU FIRST APPLIED MATERIAL CO., LTD. (China)
Inventor
  • Wei, Mengjuan
  • Tang, Guodong
  • Hou, Hongbing
  • Zhou, Guangda

Abstract

Provided are an adhesive film and an electronic device comprising same. The adhesive film comprises at least one modified polyolefin resin layer, wherein the resins for forming the modified polyolefin resin layer comprise 1%-100% of a modified polyolefin resin, wherein the main chain of the modified polyolefin resin is an ethylene-α-olefin copolymer, a grafted branch chain is selected from a compound formed by vinyl monomers containing one or more of an anhydride group, a hydroxyl group, an ester group, a carbonyl group, an amido group, a pyridyl group, an epoxy group, a pyrrolidone group and a glycidyl group, and the molecular weight of the grafted branch chain is 150-8000 g/mol. An adhesive film prepared by selecting and using a modified POE layer with the main chain and the grafted branch chain described above has excellent PID resistance; when the modified POE layer and an EVA layer form a co-extrusion adhesive film, the layers have a good bonding performance, there is no lamination interface, and the co-extrusion adhesive film further has an excellent water vapor barrier performance, relatively high insulation performance and relatively high light transmittance.

IPC Classes  ?

  • C09J 7/10 - Adhesives in the form of films or foils without carriers
  • C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
  • C09J 123/08 - Copolymers of ethene
  • C09J 151/06 - Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bondsAdhesives based on derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
  • C09J 11/08 - Macromolecular additives
  • H01L 31/048 - Encapsulation of modules

27.

REFLECTIVE PACKAGING ADHESIVE FILM AND SOLAR CELL MODULE COMPRISING SAME

      
Application Number CN2020109373
Publication Number 2021/227283
Status In Force
Filing Date 2020-08-14
Publication Date 2021-11-18
Owner HANGZHOU FIRST APPLIED MATERIAL CO., LTD. (China)
Inventor
  • Cao, Mingjie
  • Deng, Wei
  • Yang, Chufeng
  • Zhou, Guangda

Abstract

A reflective packaging adhesive film and a solar cell module comprising same. The reflective packaging adhesive film comprises: a transparent adhesive film layer (10), provided with a flat surface portion (11) and a protruding portion which are integrally provided, the protruding portion being provided on the flat surface portion (11) to form a groove, the groove being used for placing a solar cell unit (03), the area of the groove being equal to or greater than that of the solar cell unit (03), the protruding portion comprising two first protruding strips (121) and/or two second protruding strips (122) which are parallel to each other, the two first protruding strips (121) being provided to correspond to the outer sides of two long edges of the solar cell unit (03), and the two second protruding strips (122) being provided to correspond to the outer sides of two short edges of the solar cell unit (03); and a reflective adhesive film layer (20), provided on the surface of the protruding portion. In the laminating process, as the cell unit (03) is provided in the groove, the cell is not easily subjected to a relatively large stress, and the area of the groove is equal to or greater than that of the solar cell unit (03), the laminated reflective packaging adhesive film will not shield the edges of the cell, and is not easy to deviate, wrinkle and crack.

IPC Classes  ?

  • H01L 31/048 - Encapsulation of modules
  • H01L 31/056 - Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means the light-reflecting means being of the back surface reflector [BSR] type

28.

DOUBLE-SIDED CELL ASSEMBLY STRUCTURE

      
Application Number CN2020110079
Publication Number 2021/120655
Status In Force
Filing Date 2020-08-19
Publication Date 2021-06-24
Owner HANGZHOU FIRST APPLIED MATERIAL CO., LTD. (China)
Inventor
  • Cao, Mingjie
  • Wang, Haonan
  • Deng, Wei
  • Yang, Chufeng

Abstract

A double-sided cell assembly structure. The double-sided cell assembly structure comprises at least one cell series (100) formed by connecting multiple cell plates (10). The double-sided cell assembly structure also comprises gate lines provided on the surfaces of the cell plates (10). In a same series of battery series (100), the surfaces of adjacent cell plates (10) on which the gate lines are provided are located at a same plane; moreover, in the direction of extension of the cell series (100), the gate line on any preceding cell plate (10) is connected to the gate line on the subsequent cell plate (10). The gate lines of adjacent cell plates (10) in the described provision are located on a same plane, parts such as a solder ribbon do not need to pass through the area between adjacent cell plates (10) to implement the connection of the two, thus implementing the full utilization of the area of the assembly by reducing the interval between the two or adjoining the cell plates (10).

IPC Classes  ?

  • H01L 31/05 - Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells

29.

ADHESIVE FILM, ANTI-PID ENCAPSULATION ADHESIVE FILM, COMPOSITION FORMING ADHESIVE FILM, AND PHOTOVOLTAIC MODULE AND LAMINATED GLASS

      
Application Number CN2020109635
Publication Number 2021/098299
Status In Force
Filing Date 2020-08-17
Publication Date 2021-05-27
Owner HANGZHOU FIRST APPLIED MATERIAL CO., LTD. (China)
Inventor
  • Wei, Mengjuan
  • Zhou, Guangda
  • Wang, Fucheng
  • Hou, Hongbing
  • Sang, Yan
  • Du, Ganhong
  • Liu, Ting
  • Wang, Haonan

Abstract

232232322222 which have undergone a doping treatment, and the metal hydroxide is selected from one or more of the components calcium hydroxide, magnesium hydroxide, zinc hydroxide, aluminum hydroxide, iron hydroxide and barium hydroxide. Alternatively, the composition comprises: a matrix resin, a metal ion trapping agent and an organic co-crosslinker. The adhesive film has a good anti-PID effect, photoelectric conversion efficiency and encapsulation performance.

IPC Classes  ?

  • C09J 4/06 - Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups
  • C09J 11/04 - Non-macromolecular additives inorganic
  • H01L 31/048 - Encapsulation of modules

30.

High light transmittance photovoltaic encapsulating material

      
Application Number 16630465
Grant Number 11525043
Status In Force
Filing Date 2018-03-20
First Publication Date 2021-04-22
Grant Date 2022-12-13
Owner HANGZHOU FIRST APPLIED MATERIAL CO., LTD. (China)
Inventor
  • Wei, Mengjuan
  • Sang, Yan
  • Zhou, Guangda
  • Xiong, Xi
  • Hou, Hongbing
  • Lin, Jianhua

Abstract

The present disclosure relates to a high light transmittance photovoltaic encapsulating material, which is prepared by the following process: subjecting 100 mass parts of a photovoltaic encapsulating material matrix resin or a graft-modified matrix resin, 0.001 to 5 mass parts of an oxygen- or sulfur-containing compound, 0.01 to 10 mass parts of a reactive plasticize 0.01 to 1.5 mass parts of an initiator, 0.01 to 10 mass parts of an assistant cross-linker, 0.1 to 3.0 mass parts of a silane coupling agent, 0.1 to 0.4 mass parts of an ultraviolet light absorber, and 0.1 to 1.0 mass part of light stabilizer to pre-mixing, melt extrusion, film casting, cooling, slitting, and coiling. The light transmittance of the photovoltaic encapsulating material is improved, and the refractive indexes of glass/front-layer encapsulating material/cell match each other, thereby increasing the sunlight utilization ratio of a module, and optimizing the photoelectric conversion efficiency of the module.

IPC Classes  ?

  • C08J 5/18 - Manufacture of films or sheets
  • C08J 3/24 - Crosslinking, e.g. vulcanising, of macromolecules
  • C08K 5/07 - AldehydesKetones
  • C08K 5/3435 - Piperidines
  • C08K 5/39 - Thiocarbamic acidsDerivatives thereof, e.g. dithiocarbamates
  • C08K 5/5425 - Silicon-containing compounds containing oxygen containing at least one C=C bond
  • H01L 31/048 - Encapsulation of modules

31.

Low-water-vapor-permeability polyolefin-elastomer film and method for preparing the same

      
Application Number 16607361
Grant Number 11578196
Status In Force
Filing Date 2018-03-19
First Publication Date 2020-11-05
Grant Date 2023-02-14
Owner HANGZHOU FIRST APPLIED MATERIAL CO., LTD (China)
Inventor
  • Wang, Long
  • Xiong, Xi
  • Tang, Guodong
  • Hou, Hongbing
  • Zhou, Guangda
  • Lin, Jianhua

Abstract

The present disclosure discloses a low-water-vapor-permeability polyolefin-elastomer film and its preparation method. The film comprises: 50-100 mass parts of a matrix resin, 0-40 mass parts of a modified resin, 0.001-2 mass parts of an activator, 0.1-3 mass parts of an organic peroxide, 0.02-5 mass parts of an assistant cross-linker, 0.02-2 mass parts of a silane coupling agent, 0.005-2 mass parts of a light stabilizer, and 0-20 mass parts of a water blocking filler. In the present disclosure, by adding the modified resin and the activator that have an active group, a cross-linking degree and a cross-linking density of the film are improved, and a water-vapor permeability is reduced; by adding the water blocking filler, the water blocking property of the film is further improved, thereby ensuring reliability of the assembly, and prolonging service life of the assembly.

IPC Classes  ?

  • C08L 23/08 - Copolymers of ethene
  • C08K 3/013 - Fillers, pigments or reinforcing additives
  • C08K 5/00 - Use of organic ingredients
  • C08K 5/14 - Peroxides
  • C08K 5/54 - Silicon-containing compounds
  • C08L 23/14 - Copolymers of propene
  • C08L 23/18 - Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
  • C08L 23/28 - Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bondCompositions of derivatives of such polymers modified by chemical after-treatment by reaction with halogens or halogen-containing compounds
  • C08L 23/32 - Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bondCompositions of derivatives of such polymers modified by chemical after-treatment by reaction with compounds containing phosphorus or sulfur
  • C08L 23/36 - Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bondCompositions of derivatives of such polymers modified by chemical after-treatment by reaction with nitrogen-containing compounds, e.g. by nitration

32.

FRST

      
Application Number 018304931
Status Registered
Filing Date 2020-09-10
Registration Date 2020-12-29
Owner HANGZHOU FIRST APPLIED MATERIAL CO., LTD. (China)
NICE Classes  ? 17 - Rubber and plastic; packing and insulating materials

Goods & Services

Self-adhesive tapes, other than stationery and not for medical or household purposes; Synthetic resins, semi-processed; Plastic substances, semi-processed; Filtering materials of semi-processed films of plastic; Plastic film, other than for wrapping; Plastic films for electronic insulation; Adhesive bands, other than stationery and not for medical or household purposes; Flexible plastic films, other than for packaging; Polymer film used for manufacturing electronic circuits; Insulating materials.

33.

LOW FLUIDITY ENCAPSULANT FILM

      
Application Number CN2019094773
Publication Number 2020/011105
Status In Force
Filing Date 2019-07-05
Publication Date 2020-01-16
Owner HANGZHOU FIRST APPLIED MATERIAL CO., LTD. (China)
Inventor
  • Peng, Ruiqun
  • Mu, Danhua
  • Hou, Hongbing
  • Xiong, Xi
  • Zhou, Guangda
  • Lin, Jianhua
  • Sang, Yan

Abstract

Disclosed in the present invention is a low fluidity encapsulant film, obtained by evenly mixing 100 parts by weight of base material having a melt index of 0.2-9 g/10 min, 0.1-5 parts by weight of peroxide-based crosslinking agent, 0.1-5 parts by weight of auxiliary crosslinking agent, 0.1-3 parts by weight of tackifying agent, 0-5 parts by weight of hindered amine light stabiliser, 0-2 parts by weight of ultraviolet light absorbing agent, and 0-40 parts by weight of pigment, adding same to an extruder, and extruding into a film by means of a T-shaped flat mould. The encapsulant film can reduce the risk of a cell of a photovoltaic module shifting during a laminating process, and prevent the layer of pigment-containing encapsulant film on the back of the module from covering the front surface of the cell during high-temperature lamination as a result of good fluidity. Due to the use of a thermal pre-crosslinking method, the acid content of the encapsulant film is significantly reduced compared to using a radiation crosslinking method, and there is less corrosion of the solder strips, bus bar, and cells of the module, so that the high power generation performance of the photovoltaic module can be maintained for longer.

IPC Classes  ?

  • C09J 7/10 - Adhesives in the form of films or foils without carriers
  • C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
  • C09J 123/08 - Copolymers of ethene
  • C09J 123/06 - Polyethene
  • C09J 11/04 - Non-macromolecular additives inorganic
  • C09J 11/06 - Non-macromolecular additives organic
  • C09J 4/02 - Acrylmonomers
  • C09J 4/06 - Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups
  • C08L 23/08 - Copolymers of ethene
  • C08L 23/06 - Polyethene
  • H01L 31/048 - Encapsulation of modules

34.

POLYOLEFIN ELASTOMER ADHESIVE FILM WITH LOW WATER VAPOR PERMEABILITY AND PREPARATION METHOD THEREFOR

      
Application Number CN2018079449
Publication Number 2019/136823
Status In Force
Filing Date 2018-03-19
Publication Date 2019-07-18
Owner HANGZHOU FIRST APPLIED MATERIAL CO., LTD. (China)
Inventor
  • Wang, Long
  • Xiong, Xi
  • Tang, Guodong
  • Hou, Hongbing
  • Zhou, Guangda
  • Lin, Jianhua

Abstract

Disclosed are a polyolefin elastomer adhesive film with a low water vapor permeability and a preparation method therefor. The adhesive film comprises 50-100 parts by mass of a matrix resin, 0-40 parts by mass of a modified resin, 0.001-2 parts by mass of an activator, 0.1-3 parts by mass of an organic peroxide, 0.02-5 parts by mass of a co-crosslinking agent, 0.02-2 parts by mass of a silane coupling agent, 0.005-2 parts by mass of a light stabilizer, and 0-20 parts by mass of a water-blocking filler. By means of the addition of the modified resin with an active group and the activator, the crosslinking degree and crosslinking density of the adhesive film are improved, thereby reducing the water vapor permeability rate; and by means of the addition of the water-blocking filler, the water-blocking performance of the adhesive film is further improved, the reliability of an assembly is ensured and the service life of the assembly is prolonged.

IPC Classes  ?

  • H01L 31/048 - Encapsulation of modules
  • H01L 31/049 - Protective back sheets
  • C08K 3/22 - OxidesHydroxides of metals
  • C08K 5/29 - Compounds containing carbon-to-nitrogen double bonds
  • B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
  • B32B 27/28 - Layered products essentially comprising synthetic resin comprising copolymers of synthetic resins not wholly covered by any one of the following subgroups
  • B32B 27/32 - Layered products essentially comprising synthetic resin comprising polyolefins
  • C09J 7/00 - Adhesives in the form of films or foils
  • C09J 123/08 - Copolymers of ethene
  • C09J 11/04 - Non-macromolecular additives inorganic
  • C09J 11/06 - Non-macromolecular additives organic
  • C08J 5/18 - Manufacture of films or sheets

35.

PHOTOVOLTAIC ENCAPSULATION MATERIAL WITH HIGH LIGHT TRANSMITTANCE

      
Application Number CN2018079509
Publication Number 2019/136825
Status In Force
Filing Date 2018-03-20
Publication Date 2019-07-18
Owner HANGZHOU FIRST APPLIED MATERIAL CO., LTD. (China)
Inventor
  • Wei, Mengjuan
  • San, Yan
  • Zhou, Guangda
  • Xiong, Xi
  • Hou, Hongbing
  • Lin, Jianhua

Abstract

The present invention relates to a photovoltaic encapsulation material with a high light transmittance. According to the present invention, 100 parts by mass of a photovoltaic encapsulation material matrix resin or a graft modified matrix resin, 0.001-5 parts by mass of an oxygen-containing or sulfur-containing compound, 0.01-10 parts by mass of a reactive plasticizer, 0.01-1.5 parts by mass of an initiator, 0.01-10 parts by mass of a co-crosslinking agent, 0.1-3.0 parts by mass of a silane coupling agent, 0.1-0.4 part by mass of an ultraviolet light absorber, and 0.1-1.0 part by mass of a light stabilizer are subjected to processes such as premixing, melt extrusion, film casting, cooling, slitting and rolling-up to prepare the photovoltaic encapsulation material with a high light transmittance. According to the present invention, the light transmittance of the photovoltaic encapsulation material is improved, so that better matching in the refractive index between a piece of glass/the front layer encapsulation material/a battery piece is achieved, the utilization rate of sunlight of a module is increased, and the photoelectric conversion efficiency of the module is optimized and improved.

IPC Classes  ?

  • C08L 23/08 - Copolymers of ethene
  • C08L 51/06 - Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
  • C08K 5/00 - Use of organic ingredients
  • C08K 5/39 - Thiocarbamic acidsDerivatives thereof, e.g. dithiocarbamates
  • C08K 5/5425 - Silicon-containing compounds containing oxygen containing at least one C=C bond
  • C08K 5/07 - AldehydesKetones
  • C08K 5/3435 - Piperidines
  • C08J 5/18 - Manufacture of films or sheets
  • C08J 3/24 - Crosslinking, e.g. vulcanising, of macromolecules

36.

HIGHLY REFLECTIVE GAIN TYPE PHOTOVOLTAIC PACKAGING ADHESIVE FILM AND USAGE

      
Application Number CN2017114440
Publication Number 2018/157640
Status In Force
Filing Date 2017-12-04
Publication Date 2018-09-07
Owner HANGZHOU FIRST APPLIED MATERIAL CO., LTD. (China)
Inventor
  • Lin, Weihong
  • Li, Bogeng
  • Hou, Hongbing
  • Wang, Liang
  • Sang, Yan
  • Xiong, Xi
  • Zhou, Guangda
  • Lin, Jianhua

Abstract

A highly reflective gain type photovoltaic packaging adhesive film and usage are provided. The packaging adhesive film is composed of an packaging layer and a reflecting layer, wherein the packaging layer has a thickness of 200 to 500 μm, and is made by mixing a first primary resin, a modified auxiliary, an ultraviolet auxiliary, an anti-thermal oxidation ageing agent and an initiator and melting and coat casting the same at 60° C to 200° C to form a film; and the reflecting layer has a thickness of 5 to 200 μm and is made by mixing a second primary resin, an auxiliary resin, a first filler, a second filler, modified auxiliary, a diluent and an ultraviolet auxiliary, an anti-thermal oxidation ageing agent and an initiator and coating the same on the surface of the packaging layer and curing the same at 30°C to 150°C. With a simple preparation process, a low cost, and an excellent product performance, the packaging film not only provides an effective gain effect for a double-sided crystal silicon battery module, but also provides a basis for optimizing the cost of the gain-type packaging material for a single-sided crystal silicon battery module, and at the same time, providing a guarantee for reliability of crystal silicon photovoltaic modules in long-term outdoor application.

IPC Classes  ?

  • H01L 31/048 - Encapsulation of modules
  • H01L 31/054 - Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means

37.

Firsteva

      
Application Number 1079952
Status Registered
Filing Date 2011-02-22
Registration Date 2011-02-22
Owner HANGZHOU FIRST APPLIED MATERIAL CO., LTD. (China)
NICE Classes  ? 17 - Rubber and plastic; packing and insulating materials

Goods & Services

Plastic film for solar battery, not for wrapping; plastic film, not for wrapping; artificial resins, semi-finished; threads of plastic materials, not for textile use; plastic substances, semi-processed; adhesive tapes other than stationery and not for medical or household purposes; self-adhesive tapes, other than stationery and not for medical or household purposes.

38.

FIRSTEVA

      
Serial Number 79098383
Status Registered
Filing Date 2011-02-22
Registration Date 2012-02-28
Owner HANGZHOU FIRST APPLIED MATERIAL CO., LTD (China)
NICE Classes  ? 17 - Rubber and plastic; packing and insulating materials

Goods & Services

Plastic film for solar battery not for wrapping, namely, semi-finished plastic films and sheets to be used in solar or photovoltaic modules; plastic film not for wrapping, namely, plastic film for commercial and industrial use; [ artificial resins, semi-finished; threads of plastic materials not for textile use, namely, plastic soldering threads; ] plastic substances, semi-processed [ ; adhesive tapes other than stationery and not for medical or household purposes, namely, adhesive tape for industrial and commercial use ]