An assembly for carrying out electrical testing of a component (5), the assembly comprising: a pickup-head (2) having a hat portion (4) and configured to pick up and hold said component (5) by vacuum; a testing station (3) that comprises electrical contacts (16a,16b); and a pusher element (19) having one or more feet portions (27a,27b), and wherein the pusher element (19) is configured to be moveable by the pickup-head (2) wherein the pusher element (19) moves the one or more feet portions (27a,27b) from a first position wherein the one or more feet portions (27a,27b) do not touch the electrical contacts (15a,15b) of the component (5), to a second position wherein the one or more feet portions (27a,27b) hold the electrical contacts (15a,15b) of the component (5) between the one or more feet portions (27a,27b) and the electrical contacts (16a,16b) of the testing station (3); a controller (10) which is configured to selectively operate the assembly to move the pickup-head (2) so that the hat portion (4) contacts the pusher element (19) so that the one or more feet portions (27a,27b) move from the first position to the second position, and to carry out a predefined electrical test on the component (5) while the one or more feet portions (27a,27b) are in the second position. There is further provided a method of testing a component using the assembly.
According to the present invention there is provided a method of removing a die (2) from a foil (3), comprising the steps of, (a) providing a foil (3) which has a first surface (3a) and a second, opposite surface (3b) wherein the foil (3) has one or more die (2) attached to the first surface (3a); (b) aligning a vibration member (6) with a die (2) which is to be removed from the foil; (c) while maintaining said alignment moving the vibration member (6) to bring it into contact with the second surface (3b) of the foil (3); (d) continuing to move the vibration member (6) from a start position, a predefined distance in a direction towards the foil (3); (e) vibrating the vibration member (6), to generate vibrations in the foil (3) which loosen the die (2) from the first surface (3a) of the foil (3); (f) picking the loosened die (2) from the first surface (3a) of the foil (3).There is further provided a corresponding assembly (1) which can be used to perform the method.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
An alignment mechanism is disclosed which includes a mount, a beam having a first end affixed to the mount and a second end. The beam is an order of magnitude more rigid along its longitudinal axis than along an axis orthogonal to its longitudinal axis. The second end of the beam is affixed to a first device having a surface configured to contact a second device. The beam applies a normal force component to the second device through the first device and allows movement at the second end in directions orthogonal to the normal force component.
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
H01L 23/427 - Cooling by change of state, e.g. use of heat pipes
H01L 23/46 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids
H01L 23/467 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing gases, e.g. air
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
4.
A SENSOR ASSEMBLY, A COMPONENT HANDLING ASSEMBLY, AND A METHOD OF DELIVERING A COMPONENT
Sensor assembly comprising, inductive sensor which can be arranged at a fixed position within the sensor assembly; a carrier assembly, comprising an anchor member which can be arranged at a fixed position within the carrier assembly; a moveable member which is moveable with respect to the anchor member, wherein the moveable member comprises a foot portion suitable for cooperating with a pick-up head assembly, a metallic head portion which can interact with a magnetic field generated by the inductive sensor; and a spring member which is arranged so that when the foot portion is moved towards the anchor member the spring is compressed between the anchor member and the foot portion; and wherein the inductive sensor is operable to provide an output, wherein the value of said output depends on the distance between a reference point and the metallic head member, so that the output is representative of the magnitude the spring member is compressed between the anchor member and the foot portion.
A method for controlling temperature in a temperature control system. The method includes providing a temperature control system including a controller, a first contactor assembly having a first channel system, a plurality of first contacts, each of the first contacts including a portion that is disposed within the first channel system, and one or more of a first exhaust valve or a first inlet valve, and a second contactor assembly having a second channel system, a plurality of second contacts, each of the second contacts including a portion that is disposed within the second channel system, and one or more of a second exhaust valve or a second inlet valve. The method also includes receiving, by the first contactor assembly, a fluid at a first temperature. The method also includes receiving, by the second contactor assembly, the fluid at the first temperature.
A method for controlling temperature in a temperature control system. The method includes providing a temperature control system including a controller, a first contactor assembly having a first channel system, a plurality of first contacts, each of the first contacts including a portion that is disposed within the first channel system, and one or more of a first exhaust valve or a first inlet valve, and a second contactor assembly having a second channel system, a plurality of second contacts, each of the second contacts including a portion that is disposed within the second channel system, and one or more of a second exhaust valve or a second inlet valve. The method also includes receiving, by the first contactor assembly, a fluid at a first temperature. The method also includes receiving, by the second contactor assembly, the fluid at the first temperature.
A system includes a plurality of thermally-coupled zones and a plurality of thermal control devices, each controllable to thermally control one of the plurality of zones, and a plurality of temperature sensors, each configured to measure temperature of one of the plurality of zones. The system includes a control circuit configured to receive a temperature measurement for each of the plurality of zones, collect the temperature measurements in a temperature vector in a real coordinate system, and transform the temperature vector to a normal coordinate system that provides a plurality of uncoupled equations. The control circuit is configured to determine, based on the plurality of uncoupled equations and a desired temperature gradient, a desired power vector in the normal coordinate system, transform the desired power vector to the real coordinate system to generate a power vector, and control the plurality of heaters in accordance with the power vector.
A system includes a plurality of thermally-coupled zones and a plurality of thermal control devices, each controllable to thermally control one of the plurality of zones, and a plurality of temperature sensors, each configured to measure temperature of one of the plurality of zones. The system includes a control circuit configured to receive a temperature measurement for each of the plurality of zones, collect the temperature measurements in a temperature vector in a real coordinate system, and transform the temperature vector to a normal coordinate system that provides a plurality of uncoupled equations. The control circuit is configured to determine, based on the plurality of uncoupled equations and a desired temperature gradient, a desired power vector in the normal coordinate system, transform the desired power vector to the real coordinate system to generate a power vector, and control the plurality of heaters in accordance with the power vector.
According to the present invention there is provided an assembly which comprises, at least a first and second wafer holder each of which can hold a wafer which comprises semiconductor components; a carrier which is selectively operable carry one of said wafer holders to move said wafer holder; an picking station wherein the picking station comprises means to pick semiconductor components from a wafer on the wafer holder; a loading station, wherein the loading station comprises means to load a wafer having semiconductor components onto a wafer holder; an intermediate rest station which comprises an area in which a wafer holder can be parked; a transfer means which is selectively operable to move a wafer holder from the intermediate rest station to the loading station; a controller which is configured to operate said carrier and the transfer means, so that, the carrier moves the second wafer holder from the loading station to the picking station, wherein at the picking station semiconductor components on a wafer held on the second wafer holder can be picked from the wafer; the transfer means moves the first wafer holder from the intermediate rest station to the loading station, after the carrier moves the second wafer holder from the loading station, so that a wafer comprising semiconductor components which are to be picked, is loaded onto the first wafer holder while the semiconductor components on a wafer held on the second wafer holder are picked from the wafer. There is further provided a corresponding method of handling semiconductor wafers.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
10.
A METHOD OF HANDLING COMPONENTS AND A COMPONENT HANDLING ASSEMBLY
According to the present invention there is provided a method of handling components comprising the steps of, rotating a turret 'n' number of iterations so that a first subset of component handling heads comprising 'n' number of component handling heads, each carrying a respective component, are positioned over respective 'n' number of stations, without delivering any of the components held on the 'n' number of component handling heads in the first subset to any of the 'n' stations between any of said 'n' turret iterations, and wherein each of the 'n' stations can support more than one component, and wherein 'n' is greater than '1'; then simultaneously delivering the components held on the 'n' number of component handling heads in the first subset to the 'n' stations. There is further provided a component handling assembly which can be used to carry out the method of the present invention.
A module for selectively attaching to a rotatable turret, comprising, an arm which comprises a first end which can be fixed to a rotatable turret, and a second free end; a tip holder which is configured such that it can hold a tip member, wherein said tip member is tubular, and wherein the tip holder further comprises a inlet which can be fluidly connected to a vacuum generator, wherein said inlet is fluidly connected to the tip member when the tip holder holds said tip member; a shaft member which is arranged such that it can be moved linearly along an axis which is parallel to an longitudinal axis of said shaft member, wherein the shaft member comprises a first end to which an actuator can apply a force to move the shaft member along linearly along said axis, and a second opposite end, a force sensor which is located between said tip holder and the second end of said shaft member. There is further provided an assembly which comprises said module; and a method of determining the force applied to a component when the component is delivered onto a surface.
A feeding assembly and a method of feeding components comprising a track along which components can be moved, said track comprising a sloped surface and a ledge, wherein said sloped surface slopes in a direction perpendicular to the direction which the components move along the track so that the components maintain a tilted orientation as they move along the track, a pickup platform comprising a pocket which can receive components from said track, and a pivot on which the pickup platform can be selectively rotated between a first position and second position. In the first position, the pocket is aligned with the track and the pocket is parallel with the sloped surface of the track, so that a component can move from the track into the pocket of the pickup platform. In the second position the pocket is in a horizontal orientation.
B65G 47/14 - Devices for feeding articles or materials to conveyors for feeding articles from disorderly-arranged article piles or from loose assemblages of articles arranging or orientating the articles by mechanical or pneumatic means during feeding
B65G 47/256 - Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles removing incorrectly orientated articles
An alignment mechanism is disclosed which includes a mount, a beam having a first end affixed to the mount and a second end. The beam is an order of magnitude more rigid along its longitudinal axis than along an axis orthogonal to its longitudinal axis. The second end of the beam is affixed to a first device having a surface configured to contact a second device. The beam applies a normal force component to the second device through the first device and allows movement at the second end in directions orthogonal to the normal force component.
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
H01L 23/46 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids
H01L 23/467 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing gases, e.g. air
H01L 23/427 - Cooling by change of state, e.g. use of heat pipes
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
An integrated circuit device testing system includes a socket configured to receive an integrated circuit device, wherein the socket comprises at least one conductive trace made of a material with a resistivity that is a function of temperature, and wherein the socket is configured such that, when the integrated circuit device is located in the socket, the at least one conductive trace extends along a surface of the integrated circuit device. The integrated circuit device testing system further includes a controller or active circuit configured to determine a temperature at the surface of the integrated circuit device based on a measured resistance of the at least one conductive trace.
According to the present invention there is provided a component handling assembly which comprises, a transport system which comprises a track, and a plurality of shuttles, wherein each of said shuttles can be driven individually and independently of one another along the track; and wherein each of said shuttles comprise a pick-up-head which can hold a component; a plurality of stations located proximate to the track, said plurality of stations comprising, a picking station at which the pickup head on a shuttle can pick components from a tray located in said picking station; at least one vision inspection station, which comprises one or more cameras, at which a component which has been picked from the picking station and transported to the vision inspection station can be inspected; and at least one of, a placing station at which the pickup head on a shuttle can place a component onto a tray, and/or, a tape station at which the pickup head on a shuttle can place a component into a pocket of a tape.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
16.
Assembly and sub-assembly for thermal control of electronic devices
An assembly for controlling the temperature of a device includes: a heat sink configured to be maintained at a temperature below a desired set point temperature; a heater element having a surface configured to be thermally coupled to a surface of the device; and a thermally conductive pedestal interposed between the heat sink and the heater element. The heater is configured to apply heat to the device when the temperature of the device falls below the set point temperature, and heat is transferable to the heat sink through the pedestal and heater element when the temperature of the device is above the set point temperature.
An assembly (50) for controlling the temperature of a device includes: a heat sink (56) configured to be maintained at a temperature below a desired set point temperature; a heater element (62) having a surface (64) configured to be thermally coupled to a surface of the device; and a thermally conductive pedestal (54) interposed between the heat sink and the heater element. The heater is configured to apply heat to the device when the temperature of the device falls below the set point temperature, and heat is transferable to the heat sink through the pedestal and heater element when the temperature of the device is above the set point temperature.
According to the present invention there is provided a feeding assembly comprising, a track along which components can be moved, said track comprising a sloped surface and a ledge, wherein said sloped surface slopes in a direction which is perpendicular to the direction which the components move along the track so that the components are maintained in a tilted orientation as they move along the track; a pickup platform which comprises a pocket which can receive components from said track; wherein the feeding assembly further comprise a pivot on which the pickup platform can be selectively rotated between a first position and second position, wherein in its first position the pocket is aligned with the track and the pocket is parallel with the sloped surface of the track, so that a component can move from the track into the pocket of the pickup platform, and in its second position the pocket is in a horizontal orientation. There is further provided a corresponding method of feeding components and a component handing assembly which uses the feeding assembly.
B65G 47/14 - Devices for feeding articles or materials to conveyors for feeding articles from disorderly-arranged article piles or from loose assemblages of articles arranging or orientating the articles by mechanical or pneumatic means during feeding
B65G 47/256 - Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles removing incorrectly orientated articles
B65G 47/248 - Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles by turning over or inverting them
B65G 47/26 - Devices influencing the relative position or the attitude of articles during transit by conveyors arranging the articles, e.g. varying spacing between individual articles
A thermal control method and assembly uses an expansion chamber structured to receive liquid nitrogen and expand the liquid to nitrogen gas having a first temperature. The nitrogen gas having the first temperature is provided to a system. A pump is configured to receive the nitrogen gas at a second temperature and a second pressure from the system. The pump is further configured to pump the nitrogen gas at a third temperature and third pressure. A sump is structured to receive the nitrogen gas at the third temperature and the third pressure from the pump, and recirculate at least a portion of the nitrogen gas to the expansion chamber.
F25B 9/02 - Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point using Joule-Thompson effectCompression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point using vortex effect
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
A thermal control method and assembly uses an expansion chamber structured to receive liquid nitrogen and expand the liquid to nitrogen gas having a first temperature. The nitrogen gas having the first temperature is provided to a system. A pump is configured to receive the nitrogen gas at a second temperature and a second pressure from the system. The pump is further configured to pump the nitrogen gas at a third temperature and third pressure. A sump is structured to receive the nitrogen gas at the third temperature and the third pressure from the pump, and recirculate at least a portion of the nitrogen gas to the expansion chamber.
A system includes: a bottom contactor assembly; a top contactor assembly; and a contactor vision alignment system located separate from a test site of an integrated circuit device testing system. The contactor vision alignment system includes: a downward-looking camera, an upward-looking camera, an adjustment mechanism configured to move the top contactor assembly, and a controller configured to: determine a first offset between a bottom side integrated circuit device contact array and a bottom contactor contact array, cause the adjustment mechanism to align the bottom side integrated circuit device contact array with the bottom contactor contact array based on the determined first offset, determine a second offset between the top contactor contact array and a top side integrated circuit device contact array, and cause the adjustment mechanism to align the top contactor with respect to the top side device contact array based on the determined second offset.
According to the present invention there is provided feeder assembly (1, 100) a hopper (3, 103) which can receive components to be fed, said hopper having a mouth (3a, 103a) through which said components can be expelled from the hopper; a sorting means (18, 180) which comprises at least a first mesh and a second mesh having different sized openings, wherein the size of the openings in one of the first or second meshes is larger than the size of the openings in the other mesh, so that the mesh with the larger sized openings can separate good components from malformed components and particles which are larger than the size of a good component, and the mesh with the smaller sized openings can separate good components from malformed components and particles which are smaller than the size of a good component; a first track (9a) which can receive good components from the sorting means; a first vibration means (11a), for vibrating the first track (9a) so as to move said good components along the first track (9a); one or more baffles (13) positioned along the first track (9a), which can cooperate with said good components which move along the first track (9a) to move said good components into a predefined orientation. There is further provided a corresponding method of feeding and a component handling assembly which comprises said feeder assembly.
B07B 15/00 - Combinations of apparatus for separating solids from solids by dry methods applicable to bulk material, e.g. loose articles fit to be handled like bulk material
B65G 47/14 - Devices for feeding articles or materials to conveyors for feeding articles from disorderly-arranged article piles or from loose assemblages of articles arranging or orientating the articles by mechanical or pneumatic means during feeding
B65G 47/24 - Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles
B65G 47/256 - Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles removing incorrectly orientated articles
23.
A TESTING ASSEMBLY AND METHOD FOR TESTING ELECTRICAL COMPONENTS
A method of testing a transistor component, the method comprising the step of, (a) capturing a first image of the transistor component which is to be positioned into a nest for testing; (b) identifying from the first image the locations of the source and gate of the transistor component; (c) holding the transistor component using a component handling head on a rotatable turret, (d) using an alignment device to move the transistor component into a position on the component handling head such that the component handling head can deliver the component into a position on the nest wherein all of said plurality of electrical contacts on the base-plate of nest will make electrical contact with the drain of the transistor component, and a portion of the plurality of electrical contacts on the cover-plate of nest will make electrical contact with the gate of the transistor component and the remaining electrical contacts on the cover-plate of nest will make electrical contact with the source of the transistor component, when the cover is moved to close the nest; (e) delivering the transistor component to the nest so that all of said plurality of electrical contacts on the base-plate of nest make electrical contact with the drain of the transistor component; (f) moving the nest cover-plate to overlay the base-plate to close the nest and a portion of the plurality of electrical contacts on the cover-plate of nest will make electrical contact with the gate of the transistor component and the remaining electrical contacts on the cover-plate of nest will make electrical contact with the source of the transistor component; (g) performing testing of the transistor component. There is further provided a corresponding testing assembly.
A thermal control head for a semiconductor device handler includes: a heater configured to heat a semiconductor device; a cold manifold; and a cooling mass that is movable between: a first position at which a first surface of the cooling mass contacts a surface of the cold manifold, and a second position at which the first surface of the cooling mass is separated from the cold manifold, and a second surface of the cooling mass contacts a surface of the heater.
According to the present invention there is provided a method of inspecting a component (10), using an assembly comprising a camera (3) with a fixed position, and a moveable stage (5), wherein the moveable stage is configured such that it can rotate about a rotation axis (7), and, can move linearly along two linear axes (9a, 9b) wherein said two linear axes are perpendicular to one another and wherein both of said two linear axes are each perpendicular to the rotation axis, the method comprising the steps of, (a) providing a first component into a predefined orientation on the stage, such that a first side of the component is facing a camera; (b) moving the stage linearly along one or more of said two linear axes so as to bring the first side of the first component into focus of the camera; (c) capturing an image of the first side of the first component after it has been brought into focus of the camera. An assembly according to the above comprising additionally a processor which is configured to determine whether the image of the component is in-focus of the camera, and if not, to determine a movement of the moveable stage and to initiate the moveable stage to undergo said determined movement so as to bring the component into focus is also provided.
An integrated circuit device testing system includes a socket configured to receive an integrated circuit device, wherein the socket comprises at least one conductive trace made of a material with a resistivity that is a function of temperature, and wherein the socket is configured such that, when the integrated circuit device is located in the socket, the at least one conductive trace extends along a surface of the integrated circuit device. The integrated circuit device testing system further includes a controller or active circuit configured to determine a temperature at the surface of the integrated circuit device based on a measured resistance of the at least one conductive trace.
An integrated circuit device testing system includes a socket configured to receive an integrated circuit device, wherein the socket comprises at least one conductive trace made of a material with a resistivity that is a function of temperature, and wherein the socket is configured such that, when the integrated circuit device is located in the socket, the at least one conductive trace extends along a surface of the integrated circuit device. The integrated circuit device further includes a controller or active circuit configured to determine a temperature at the surface of the integrated circuit device based on a measured resistance of the at least one conductive trace.
An offline vision assisted calibration system includes: a bottom side socket assembly that is mountable in an integrated circuit device handler and comprises: a socket plate that comprises a hole grid array; and a top contactor assembly that is mountable in an integrated circuit device handler and comprises: a guide plate, a plurality of fiducials located on a lower side surface of the guide plate, a contact holder plate comprising a top contactor contact array, and a plurality of adjustment actuators configured to move the contact holder plate with respect to the guide plate; and a calibration jig comprising an array of contacts on a bottom side thereof, wherein the calibration jig is configured to be placed in the socket plate such that the contacts engage with the hole grid array of the socket plate.
A test head for a semiconductor device handler includes a plunger; and a funnel insert attached to the plunger via a funnel insert spring, the funnel insert having a channel extending axially therethrough, and the funnel insert including a plurality of sloped inner walls that are sloped outwardly in a distal direction of the funnel insert and configured to contact upper edges of a semiconductor device to center the semiconductor device in the funnel insert. The plunger includes a projecting portion that extends through the channel of the funnel insert. When the spring is in an uncompressed state, a distal end of the funnel insert extends past a distal end of the projecting portion of the plunger.
A system for detecting a status of a pocket of a tray includes a tray having a plurality of pockets that hold an integrated circuit device, a vision mechanism, a light line generator, a reflective device, and a controller. The vision mechanism images the tray along a first optical axis. The light line generator emits a light line along a second optical axis. The reflective device reflects the light line onto the tray along a third optical axis. The third optical axis has a different angle relative to the first optical axis than an angle between the first optical axis and the second optical axis. The controller receives an image of the tray from the vision mechanism, detects the light line reflected onto the tray along the third optical axis, and determines a status of a pocket based on the detected light line along the third optical axis.
G01S 17/02 - Systems using the reflection of electromagnetic waves other than radio waves
G01S 17/46 - Indirect determination of position data
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
31.
Light line imager-based IC tray pocket detection system
A system for detecting a status of a pocket of a tray includes a tray having a plurality of pockets that hold an integrated circuit device, a vision mechanism, a light line generator, a reflective device, and a controller. The vision mechanism images the tray along a first optical axis. The light line generator emits a light line along a second optical axis. The reflective device reflects the light line onto the tray along a third optical axis. The third optical axis has a different angle relative to the first optical axis than an angle between the first optical axis and the second optical axis. The controller receives an image of the tray from the vision mechanism, detects the light line reflected onto the tray along the third optical axis, and determines a status of a pocket based on the detected light line along the third optical axis.
G01S 17/46 - Indirect determination of position data
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
G01N 21/88 - Investigating the presence of flaws, defects or contamination
G01N 21/956 - Inspecting patterns on the surface of objects
A vision alignment system for a test handler system includes a transfer mechanism that transfers a device from an input side to a test side, a contactor array positioned at the test side, and a pick- and-place device that moves the device from the transfer mechanism to the contactor array. An engagement mechanism on the pick-and-place device engages with alignment devices on the transfer mechanism and contactor array. To avoid positioning the vision alignment system in the test side, a first vision mechanism is positioned away from the test socket and determines the position of the device in a common local coordinate system, a second vision mechanism is positioned at an output side and determines a position of the contactor array in the local coordinate system, and the correction mechanism corrects a position of the device based on an offset between the positions in the coordinate system.
According to the present invention there is provided a method of handling components on a carrier, the method comprising the steps of, providing a carrier having a plurality of components supported thereon; testing the plurality of components to identify good components and bad components, wherein good components are those components which successfully pass testing and bad components are those components which fail testing; defining a first good components to be picked from the carrier; defining an integer number of components to be a jump value; locating a pickup head, which is operable to pick components from the carrier, above a first reference position on the carrier; identifying one or more good components, which are within the jump value from the first reference position; moving the pickup head or the carrier so that the pickup head is centered above at least one of the one or more good components; moving the pickup head or the carrier, so that the pickup head is moved from above said at least one of the one or more good components to above the defined first good component to be picked without picking said at least one of the one or more good components; centering the pickup head above the first good components to be picked; picking the first good components to be picked. There is further provided a corresponding component handling apparatus.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
34.
IC device-in-pocket detection with angular mounted lasers and a camera
An apparatus includes a device holder including a device placement area configured to hold an electronic device, and a shoulder extending peripherally around the device placement area; a laser line generator configured to generate a laser line that includes (i) a device placement area laser line portion, and (ii) a shoulder area laser line portion; a camera configured to obtain an image of at least the laser line; and a processor configured to: receive the image from the camera, determine (i) an angle of the device placement area laser line portion, and/or (ii) an offset between the location of the device placement area laser line portion and the location of the shoulder area laser line portion, and determine whether an electronic device is positioned in the device placement area or positioned incorrectly in the device holder.
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
G01S 17/46 - Indirect determination of position data
G01B 11/27 - Measuring arrangements characterised by the use of optical techniques for measuring angles or tapersMeasuring arrangements characterised by the use of optical techniques for testing the alignment of axes for testing the alignment of axes
35.
IC DEVICE-IN-POCKET DETECTION WITH ANGULAR MOUNTED LASERS AND A CAMERA
An apparatus includes a device holder including a device placement area configured to hold an electronic device, and a shoulder extending peripherally around the device placement area; a laser line generator configured to generate a laser line that includes (i) a device placement area laser line portion, and (ii) a shoulder area laser line portion; a camera configured to obtain an image of at least the laser line; and a processor configured to: receive the image from the camera, determine (i) an angle of the device placement area laser line portion, and/or (ii) an offset between the location of the device placement area laser line portion and the location of the shoulder area laser line portion, and determine whether an electronic device is positioned in the device placement area or positioned incorrectly in the device holder.
G01S 17/46 - Indirect determination of position data
G01B 11/25 - Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. moiré fringes, on the object
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
According to the present invention there is provided method of handling components, the method comprising the steps of: (a) aligning a component into a predefined orientation using an alignment means; (b) placing the component onto a predefined position on a boat which is located in a loading area; (c) capturing a first image of the component after it has been placed on the boat with a first camera; (d) using the first image to identify if the component is in a predefined orientation on the boat; (e) if the component is not in said predefined orientation on the boat, then picking the component from the boat and aligning the component again using said alignment means. There is further provided a corresponding assembly for handling components.
A temperature control system for controlling a temperature of an electronic device during testing of the electronic device includes a thermal head having a device contact face configured to contact the electronic device during testing; a fluidic thermal interface material (TIM) dispenser configured to dispense a fluidic TIM to a location between a face of the electronic device and the device contact face of the thermal head; and a fluidic TIM dispenser controller configured to control the TIM dispenser such that the TIM dispenser dispenses the fluidic TIM during a test cycle of the electronic device.
A cooling system for at least one thermal unit includes a tank assembly that includes: a sump chamber, a purge chamber that is located above the sump chamber, and a reservoir chamber that is located above the purge chamber; a cooling circuit that includes a pump, a heat exchanger, and conduits, the cooling circuit being configured to circulate a liquid coolant through the at least one thermal unit, the sump chamber, the pump, the heat exchanger, and the reservoir chamber; a first valve located externally of the tank assembly and configured such that, when the first valve is open, (i) the liquid coolant is flowable from the purge chamber to the sump chamber via the first valve, and (ii) air is simultaneously flowable from the sump chamber to the purge chamber via the first valve; and a second valve located externally of the tank assembly and configured such that, when the second valve is open, (i) the liquid coolant is flowable from the reservoir chamber to the purge chamber via the second valve, and (ii) air is simultaneously flowable from the purge chamber to the reservoir chamber via the second valve.
A cooling system for at least one thermal unit includes a tank assembly that includes: a sump chamber, a purge chamber that is located above the sump chamber, and a reservoir chamber that is located above the purge chamber; a cooling circuit that includes a pump, a heat exchanger, and conduits, the cooling circuit being configured to circulate a liquid coolant through the at least one thermal unit, the sump chamber, the pump, the heat exchanger, and the reservoir chamber; a first valve located externally of the tank assembly and configured such that, when the first valve is open, (i) the liquid coolant is flowable from the purge chamber to the sump chamber via the first valve, and (ii) air is simultaneously flowable from the sump chamber to the purge chamber via the first valve; and a second valve located externally of the tank assembly and configured such that, when the second valve is open, (i) the liquid coolant is flowable from the reservoir chamber to the purge chamber via the second valve, and (ii) air is simultaneously flowable from the purge chamber to the reservoir chamber via the second valve.
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
40.
COMPONENT HANDLING ASSEMBLY AND METHOD OF ADJUSTING A COMPONENT HANDLING ASSEMBLY
According the present invention there is provided a method for adjusting a component handling assembly, the component handling assembly comprising, a plurality of stations at least some of which have a nest which can receive a component, and a rotatable turret having a plurality of component handling heads, and wherein the turret can rotate to transport components between the plurality of stations, the method comprising the steps of, capturing a first image of a reference element located at a first station, using a camera which is located on the rotatable turret; identifying the position in the first image of the centre of the reference element; rotating the turret so that the camera on the turret is in a position where it can capture a second image of nest of a second station; capturing a second image of the nest of the second station, using said camera; identifying the position in the second image of the centre of the nest of the second station; superimposing a marker on the second image at the same position as the position of the centre of the reference element in the first image; adjusting the second station until the position in the second image of the centre of the nest of the second station is aligned with the marker. There is further provided a corresponding component handling assembly.
According to the present invention there is provided a bowl feeder section (20a; 20b) which is optimized for use to feed components with a predefined characteristic from a bowl feeder (1). There is also provided a bowl feeder component to which the bowl feeder section can be removably attached. When the bowl feeder section is removably attached to the bowl feeder component collectively they define a bowl feeder which is optimized for feeding components which have the predefined characteristic. There is further provide a corresponding assembly which comprises a bowl feeder component and a plurality of bowl feeder sections each of which is optimized for use to feed component with a different predefined characteristic. There is also provided a corresponding method for providing a bowl feeder optimized for feeding components having a predefined characteristic.
B65G 47/14 - Devices for feeding articles or materials to conveyors for feeding articles from disorderly-arranged article piles or from loose assemblages of articles arranging or orientating the articles by mechanical or pneumatic means during feeding
42.
AN ASSEMBLY AND METHOD FOR TESTING OPTICAL DEVICES
According to the present invention there is provided an assembly for testing optical devices, the assembly comprising, a light integrating sphere (5a); a mask member (160) defining an inlet window (51) for the light integrating sphere (5a); and a plurality of inlet adaptor members (170), each of which can be selectively arranged to cooperate with the mask member (160) so as to modify the amount of the inlet window (51 ) through which light can pass into the light integrating sphere (5a), and wherein each the plurality of inlet adaptor members (170) comprise openings (171) having different shapes and/or dimensions. There is further provided a corresponding method for testing parameters of a group of optical devices using the assembly.
According to the present invention there is provided a method for testing electrical and optical parameters of a group of light-emitting devices, the method comprising the steps of, bringing the group of devices to a test position wherein light emitted by the devices in the group can be received into an integrating sphere; performing, electrical testing of the devices in the group in parallel, so that electrical parameters of each of the devices in the group can be determined; performing, in a sequential device-by-device manner, optical testing of the devices in the group, so that optical parameters of each of the devices in the group can be determined. There is further provided a corresponding assembly.
An testing device (1) for measuring the light characteristics of an electronic component (3), the testing device (1) comprising, an inlet (5) at one end at which an electronic component (3) can be presented for testing; a shutter (7) located at the inlet, wherein the shutter (7) is configured to be moveable between a first open position in which an electronic component (3) to be tested can be received into the inlet (5), and a second closed position in which the shutter (7) can overlay at least the majority of a nest (9) on which said electronic component (3) is supported, so that the shutter can prevent light emitted by the electronic component (3) from being diverted away from the testing device (1) by at least the majority of the nest (9) wherein the shutter (7) comprises at least one sliding door (15a, 15b9 which can be slid to move the shutter into its first open position, and slid to move the shutter (7) into its second closed position, and wherein the at least one sliding door (15a,15b) comprises a cut out portion (17) which defines said opening (11) when the shutter (7) is in its second closed position. There is further provided an assembly which include the testing device (1).
A vision alignment system for an integrated circuit device testing handler includes a head guiding ring configured to be attached to a pick-and-place device, the head guiding ring having an opening in which a device-under-test having a device contact array is locatable; a socket apparatus including: a fixed mounting frame, a moveable socket guiding ring, and a plurality of actuators configured to move the moveable socket guiding ring relative to the fixed mounting frame; and a visualization device configured to provide data relating to a position of the device contact array relative to the contactor pin array. The socket apparatus is configured to adjust a position of the head guiding ring by moving the moveable socket guiding ring while the head guiding ring is located in an opening of the moveable socket guiding ring to align the device contact array to the contactor pin array.
According to the present invention there is provided a socket (20) suitable for receiving an electronic component for testing of the electronic component (50), the socket (20) comprising, a PCB board (21); a blade holder (22) which is mounted on PCB board (21), the blade holder (22) comprising one or more through-holes (27) each of which is configured to receive one or more blades (28); one or more blades (28) provided in each of the one or more through-holes (27), wherein each blade (28) comprises a contact tip (29) which is connected to an anchoring element (30),and wherein said blades (28) are arranged in the one or more through holes (27) so that the anchoring element (30) of each blade (28) abuts the PCB board (21) on which the blade holder (22) is mounted, and wherein the anchoring element (30) of each blade (28) is configured so that a portion (30a) of the anchoring element (30) extends above the blade holder (22); and a cover (23) which is mounted on the blade holder (22) to abut the portion (30a) of the anchoring element (30) of each blade (28) which extends above the blade holder (22), thereby holding the one or more blades (28) in position. There is further provided a corresponding method of manufacturing a socket (20).
The invention relates to a force-limiting device (1) for limiting the force exerted by a linear actuator on a gripper of an electronic component, including: a first element (4, 7, 40, 41) arranged so as to be attached to said actuator so as to be linearly movable by said actuator; a second element (5, 6, 23, 50) arranged so as to be connected to said gripper so as to linearly move said gripper; an elastically compressible spring (3) arranged between the first element (4, 7, 40) and the second element (5, 6, 23, 50) in order to transmit and limit the force exerted by the first element on the second element; an electrical contact arranged so as to be in a first state when said spring (3) limits the force exerted on the second element, and in a second state when said spring does not limit the force exerted on the second element.
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
According to the present invention there is provided an assembly for testing performance of a component, the assembly comprising, a rotatable turret which comprises a plurality of component handling heads each of which can hold a component; a rotatable head assembly, the rotatable head assembly comprising, a rotatable head, wherein the rotatable head comprises one or more nests, each of which has an electrical contact, and each of which is suitable for receiving a component such that the component can electrically connect to the electrical contact of that nest; wherein the nest is further configured such that it can hold a component such that the component remains electrically connected to the electrical contact, as the rotatable head rotates; wherein the rotatable head is arranged to be adjacent the turret so that a component can be passed directly from a component handling head on the rotatable turret to a nest on the rotatable head; a processor which is arranged in electrical communication with the electrical contact(s) of the one or more nests on the rotatable head such that the processor can, both, send command signals to a component held in a nest which cause the component to operate in a predefined manner, and receive response signals from the component which are generated by the component when the component operates in the predefined manner, while the component is rotated by the rotatable head, and wherein the processor is configured to determine the performance of the component from the response signals it receives. There is further provided a corresponding method.
A component handling head comprising a recess defined therein, wherein the recess is configured such that a volume of liquid can be held in cooperation with the handling head by capillary force and such that a meniscus of the volume of liquid can extend outside of the recess so the volume of liquid can adhere to an electronic component by capillary force so that the electronic component can be held on the component handling head by capillary force. There is further provided a component handling assembly which comprises the component handling head, and a corresponding method of handling an electrical component comprising the step of holding an electrical component on a handling head by means of capillary force.
According to the present invention there is provided a device for sorting components, the device comprising, a conveyor which is configured to receive components from a turret; two or more bins positioned along the conveyor, wherein the two or more bins are independent of one another; a displacement means, which is configured such that it is operable to displace components from the conveyor; a controller, which can be arranged in operable communication with a identification means for categorising a component according to one or more characteristics of said component, wherein the controller is operable to allocate a component category to each of the two or more bins,wherein, using the categorization of the components provided by the identification means, the controller controls the displacement means so that the displacement means operates to displace each component from the conveyor into bins to which a corresponding component category has been allocated, so that each component can be sorted into a bin which was allocated to the category of the component,wherein the controller is further operable to reallocate a component category of a first bin to second bin, when the first bin is full. There is further provided a corresponding method of sorting and an assembly.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B07C 5/00 - Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or featureSorting by manually actuated devices, e.g. switches
B07C 5/344 - Sorting according to other particular properties according to electric or electromagnetic properties
A pusher suitable for applying a force to a component to ensure the component establishes electrical contact with an apparatus, wherein the pusher is arrangable to be part of a component handling assembly which comprises two or more processing stations and a turret which is rotated to transport the components between the two or more processing stations in the component handling assembly, and wherein the pusher is configured such that it is independent of the turret. The present invention further provides a corresponding method of arranging a component so that said component establishes electrical contact with an apparatus and to a component handling assembly.
According to the present invention there is provided a component handling assembly 1 comprising, a feeder 3 which is configured to move rectangular components 5 along a path 7, wherein each of the rectangular components 5 comprise a longitudinal axis 9, a dispensing track 11 along which rectangular components 5 can be moved, wherein the dispensing track 11 comprises at least one linear portion 13, wherein the said linear portion 13 of the dispensing track 11 is arranged to cooperate with the feeder 3 such that it can receive rectangular components 5 from the feeder 3, wherein the dispensing track 11 is arranged such that the linear portion 13 of the dispensing track is perpendicular to a tangent 15 to the path 7 at the position where the linear portion 13 of the dispensing track cooperates with the feeder 3, so that a rectangular component 5 can be presented to the linear portion 13 of the dispending track 11 in an orientation in which the longitudinal axis 9 of the rectangular component 5 is perpendicular to the linear portion 13 of the dispensing track 11. There is further provided a corresponding method of handling rectangular components.
B65G 47/12 - Devices for feeding articles or materials to conveyors for feeding articles from disorderly-arranged article piles or from loose assemblages of articles
A nest (1) comprising, a fix part (3), and a movable part (5), wherein the fix (part 3) and movable part (5) are configured to cooperate so as to define a (pocket 7) which can receive at least a part of an electrical component (25), wherein the movable part (5) is moveable between a first position and a second position, wherein in the first position the pocket (7) is open so that at least part of the electrical component can be moved into the pocket (7), and in the second position the pocket (7) is closed so that the at least part of the electrical component (25) positioned in the pocket is secured within the pocket, wherein the nest (1) further comprises a biasing means (9) which is arranged to bias the movable part (5) towards its second position. There is further provided a nest assembly, a component handling assembly, and a table comprising said nest.
According to the present invention there is provided a component handling assembly, comprising, an index table which comprises one or more nests each of which is configured to cooperate with a component to hold the component as the index table is indexed, wherein the one or more nests are configured such that a component which cooperates with a nest is supported above the nest so that the one or more nests can cooperate with components of various sizes, and an alignment means operable to move a component into a predefined orientation before a component co-operates with a nest on the index table. There is further provided a corresponding method of handling a component.
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
55.
Pick and place handler with a floating lock device
A semiconductor handler subassembly is provided. The semiconductor handler subassembly includes an adjustment apparatus with a floating lock that is configured to adjust and lock in place to a desired position, and a tip attached to the floating lock and configured to engage a part.
According to the invention, there is provided a clamping test contacting setup, suitable for clamping a component so that the component is held in a fixed position while being processed, the clamp comprising, a first finger which is pivotally mounted at a first pivot point and the second finger which is pivotally mounted at a second pivot point, so that the first finger and a second finger can each pivot towards a central plane; wherein the first finger and a second finger each comprise a surface suitable for cooperating with a component to be clamped, wherein the first finger and a second finger each comprise a stop means which is suitable for cooperating with a component to be clamped to restrict movement of the component with respect to the respective finger, so that applying a force to the component will cause the first and second fingers to clamp the component. There is further provided a processing station which comprises such a clamp and a corresponding method of clamping a component and method of processing a component.
G01R 31/319 - Tester hardware, i.e. output processing circuits
G11C 29/56 - External testing equipment for static stores, e.g. automatic test equipment [ATE]Interfaces therefor
G01R 1/04 - HousingsSupporting membersArrangements of terminals
H01R 12/88 - Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures acting manually by rotating or pivoting connector housing parts
According to the present invention there is provided an inspection device (1), suitable for use when inspecting a component (5) for defects (35), the inspection device (1) comprising, a cluster of lights (9, 17, 19, 21) which are arranged into two or more groups (11a, lib, 11c, lid) of lights, wherein the cluster of lights is configured such that each group (11a, lib, 11c, lid) of lights can be operated asynchronously to the other group (s) of lights so that light can be directed asynchronously at a component (5), from different directions; an image capturing means (camera 7) which is configured to capture an image of a component (5) when each of the groups of lights are lit, to provide a plurality of images, each image showing the component (5) lit from a different direction; a processing means (23) configured to perform arithmetic computation using the images, so as to provide a single image in which defects in the component can be more easily identified. There is further provided a corresponding method of inspecting a component and a lighting arrangement with a dome and a diffuser.
H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
H01B 1/04 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of carbon-silicon compounds, carbon, or silicon
C09K 5/14 - Solid materials, e.g. powdery or granular
B82Y 30/00 - Nanotechnology for materials or surface science, e.g. nanocomposites
An acceleration device includes an actuator configured to displace a mass in a reciprocating motion at a desired frequency, a mount configured to hold a device, such as an accelerometer device, and at least one spring connecting the mount to the mass. The actuator is used to apply a force to achieve resonance. The actuator may comprise a voice coil motor, wherein the voice coil motor includes a permanent magnet and an armature and wherein said armature comprises part of said mass. The actuator applies a periodic force to the mass. The periodic force may be a sinusoidal force. Preferably, the applied force is aligned with a resulting velocity of the mass. The mount may include a test socket to which the device is electrically connected. The spring may comprises one or more flexure elements. The acceleration device may be used with a handler device to connect and disconnect the device to and from the mount. Optionally, the handler device includes an environmental chamber surrounding the mount.
According to the present invention there is provided an electrical contact comprising three or more blades so as to facilitate the establishment of an electrical connection between at least two of the three or more blades by an electrical contact of a component. There is further provided a testing platform suitable for receiving an electrical component to be tested, wherein the testing platform comprising one or more of the aforementioned electrical contacts. There is further provided a test machine component, comprising a holder member which comprises any one of the aforementioned electrical contacts, wherein the test machine component is configured such that it can co¬ operate with a test machine.
An acceleration device includes an actuator configured to displace a mass in a reciprocating motion at a desired frequency, a mount configured to hold a device, such as an accelerometer device, and at least one spring connecting the mount to the mass. The actuator is used to apply a force to achieve resonance. The actuator may comprise a voice coil motor, wherein the voice coil motor includes a permanent magnet and an armature and wherein said armature comprises part of said mass. The actuator applies a periodic force to the mass. The periodic force may be a sinusoidal force. Preferably, the applied force is aligned with a resulting velocity of the mass. The mount may include a test socket to which the device is electrically connected. The spring may comprises one or more flexure elements. The acceleration device may be used with a handler device to connect and disconnect the device to and from the mount. Optionally, the handler device includes an environmental chamber surrounding the mount.
A method of pick-and-place alignment comprises (a) determining a pick location of a device from a tray of devices; (b) determining place location of the device using an up-looking camera; and (c) determining offset error for the device by comparing the pick location and the place location. The method may further comprise repeating steps (a)-(c) for additional devices on the tray of devices; and generating an offset map for alignment of devices on the tray. The method further uses the offset map to make pick and place corrections during runtime.
H04N 7/18 - Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
G06K 9/00 - Methods or arrangements for reading or recognising printed or written characters or for recognising patterns, e.g. fingerprints
G06F 19/00 - Digital computing or data processing equipment or methods, specially adapted for specific applications (specially adapted for specific functions G06F 17/00;data processing systems or methods specially adapted for administrative, commercial, financial, managerial, supervisory or forecasting purposes G06Q;healthcare informatics G16H)
An alignment mechanism is disclosed which includes a mount, a beam having a first end affixed to the mount and a second end. The beam is an order of magnitude more rigid along its longitudinal axis than along an axis orthogonal to its longitudinal axis. The second end of the beam is affixed to a first device having a surface configured to contact a second device. The beam applies a normal force component to the second device through the first device and allows movement at the second end in directions orthogonal to the normal force component.
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
H01L 23/46 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
H01L 23/467 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing gases, e.g. air
64.
SIDE GRIPPING MECHANISM AND DEVICE HANDLERS HAVING SAME
An apparatus comprises a cavity coupled to a pneumatic controller configured to control pressure in the cavity; a piston configured to be pulled into the cavity when pressure in the cavity is below atmospheric pressure and to be pushed outward when pressure in the cavity is greater than atmospheric pressure; and a gripper arm mechanically coupled to the piston. The gripper arm may be configured to support a device under test. The gripper arm may be coupled to the piston through a pusher bar. The apparatus may further comprise a pneumatic control port; and a pneumatic bleed port. The pneumatic control port is coupled to the cavity, and the pneumatic bleed port is configured to bleed pneumatic pressure to atmosphere if the piston over-travels a predetermined position.
Method and devices are provided that integrate various internal channels and inlet and outlet ports, configured to operate with air or fluidics, with electrical circuitry. The devices comprise internal channels and outlet/inlet ports that are integrated into multiple layers of printed circuit boards. A multi-layer printed circuit board assembly is produced by laminating the plurality of layers together. The multi-layer printed circuit board assembly can accommodate a variety of off-the-shelf components, as well as electrical circuits and electronic components.
An apparatus comprises a cavity coupled to a pneumatic controller configured to control pressure in the cavity; a piston configured to be pulled into the cavity when pressure in the cavity is below atmospheric pressure and to be pushed outward when pressure in the cavity is greater than atmospheric pressure; and a gripper arm mechanically coupled to the piston. The gripper arm may be configured to support a device under test. The gripper arm may be coupled to the piston through a pusher bar. The apparatus may further comprise a pneumatic control port; and a pneumatic bleed port. The pneumatic control port is coupled to the cavity, and the pneumatic bleed port is configured to bleed pneumatic pressure to atmosphere if the piston over-travels a predetermined position.
According to the present invention there is provided a wafer handler comprising: a wafer loading station (3) for loading a wafer (1) mounted on a tack film (2); a tensioner (30) for tensioning the tacky film; a picking module (66) for successively picking a plurality of devices from said wafer; a vision system (5, 50) with one or several cameras (50) for capturing a first image of said wafer or of portions of said wafer, said first image comprising a plurality of devices, wherein said vision system is arranged for determining from said first image the individual position of a plurality of devices, and wherein the wafer handle further comprises an additional camera (63) positioned proximate to said picking module (66) and arranged for capturing an second image of a device to be picked, wherein the second image is used for fine adjustment of the wafer so that the device to be picked is centered under the picking module.
H01L 21/00 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid-state devices, or of parts thereof
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
68.
Temperature measurement using a diode with saturation current cancellation
Various embodiments provide systems and methods measuring the temperature of a device using a semiconductor temperature sensor, such as a diode. This invention allows the use of an uncalibrated diode to be used as a temperature sensor by applying a sinusoidally varying forcing current to the diode and measuring the rate of change of the voltage across the diode. Embodiments advantageously provide for a rapid, responsive temperature measuring, substantially eliminating the effect of lead resistance associated with the temperature sensor.
G01K 7/01 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using semiconducting elements having PN junctions
69.
Arrangement and method for handling electronic components
Arrangement (1) for processing electronic components, including a plurality of processing stations (3) for processing electronic component, at least some processing stations including an electrical actuator (8); a conveyor (2), such as a turret, for transporting components from one processing station to the next; and a central processing unit (5) for commanding the processing stations. At least some processing stations (3) include a local processing unit (7) for generating command signals (74) for the electric actuators (8). The central processing unit (5) is connected to the local processing units (7) over an electronic bus (6). Digital command instructions (75) are transferred on the electronic bus (6) between the central processing unit (5) and the local processing units (7).
G06F 19/00 - Digital computing or data processing equipment or methods, specially adapted for specific applications (specially adapted for specific functions G06F 17/00;data processing systems or methods specially adapted for administrative, commercial, financial, managerial, supervisory or forecasting purposes G06Q;healthcare informatics G16H)
Method and apparatus for aligning a small-size component with vacuum pick-up nozzles within turrets used with electronic components or assembly equipments. The method comprises the steps of picking-up the component with a pick-up nozzle; measuring a position of the component in respect to a defined value; bringing the component held by the pick-up nozzle in contact with a aligning device; holding the component with the aligning device and; moving the aligning device in order to align the component based on the position measurement.
B65G 1/133 - Storage devices mechanical with article supports or holders movable in a closed circuit to facilitate insertion or removal of articles the circuit being confined in a horizontal plane
71.
METHOD AND DEVICE FOR FILLING CARRIER TAPES WITH ELECTRONIC COMPONENTS
A method for filling a carrier tape (10) with electronic components (12) and for removing and replacing defective electronic components (13) from the carrier tape, comprising the steps of: at a filling station (1), loading an electronic component in a pocket (11) of the carrier tape (10), moving said carrier tape (10) forward, automatically detecting that said electronic component which is defective, moving said carrier tape backward, and unloading the defective electronic component (13) from the carrier tape (10), at said filling station (1), filling said packet with a new electronic component.
A semiconductor handler subassembly is provided. The semiconductor handler subassembly includes an adjustment apparatus with a floating lock that is configured to adjust and lock in place to a desired position, and a tip attached to the floating lock and configured to engage a part.
A device for the automatic coiling and/or uncoiling on reels (28) of a flexible tape carrier of electronic components (60), the device comprising a coiling location (80) where a reel (28) can be connected to a rotation actuator, and retractable tape guides (35), consisting of articulated jaws (35) that can be closed together forming a channel to guide the flexible tape (60) and connect a free end of the flexible (60) tape (60) to a hub (29) of the reel (28), the device further having a stopper element (87) that engages with the slot in the reel hub, in order to stop the reel in a position in which the slot is aligned with the tape guide.
A vision alignment system and method is provided. The vision alignment system includes one or more grouped alignment plates with guiding inserts configured to receive multiple devices, and groups of three actuators, configured to actuate the alignment plates to correct the position offsets of multiple devices as a group. The position offsets between the device and contactor are determined by a device-view camera during runtime and a contactor-view camera during calibration time. The vision alignment system also includes a pick-and-place handler, configured to transport devices.
A guiding plate based vision alignment system for a test handler includes cameras, configured to view the position difference between a tested device and the corresponding contactor. A pick-and-place handler is configured to move the device. A guiding plate is configured to actuate guiding plate with one translation alignment feature and one rotation alignment feature to correct the position offset between the tested device and the corresponding contactor.
A vision alignment system and method is provided. The vision alignment system includes one or more grouped alignment plates with guiding inserts configured to receive multiple devices, and groups of three actuators, configured to actuate the alignment plates to correct the position offsets of multiple devices as a group. The position offsets between the device and contactor are determined by a device-view camera during runtime and a contactor- view camera during calibration time. The vision alignment system also includes a pick-and- place handler, configured to transport devices.
A detection method and apparatus is provided. The detection apparatus includes at least two angular mounted lasers, a surface for receiving laser lines emitted by the angular mounted lasers, a camera for detecting a laser pattern formed by the laser lines on the surface, and a processor for analyzing the laser pattern. The lasers emit orthogonal laser lines on a surface of the device. The camera detects a laser pattern on the surface of the device and the processor analyzes the laser pattern to determine whether the position of the device is in pocket based on the analysis and position algorithms.
Arrangement (1) for processing electronic components, comprising: - a plurality of processing stations (3) for processing electronic components, at least some processing stations comprising an electrical actuator (8); - a conveyor (2), such as a turret, for transporting components from one processing station to the next; - a central processing unit (5) for commanding said processing stations; wherein -at least some processing stations (3) comprise a local processing unit (7) for generating command signals (74) for said electric actuators (8), -in that said central processing unit (5) is connected to said local processing units (7) over an electronic bus (6), -and in that digital command instructions (75) are transferred on said electronic bus (6) between said central processing unit (5) and said local processing units (7).
Method and apparatus for aligning a small-size component with vacuum pick-up nozzles within turrets used with electronic components or assembly equipments. The method comprises the steps of picking-up the component with a pick-up nozzle; measuring a position of the component in respect to a defined value; bringing the component held by the pick-up nozzle in contact with a aligning device; holding the component with the aligning device and; moving the aligning device in order to align the component based on the position measurement.
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/00 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid-state devices, or of parts thereof
80.
A TEST STATION FOR TESTING LEAKAGE CURRENT THROUGH THE INSULATING PACKAGE OF POWER ELECTRONIC COMPONENTS, AND A CORRESPONDING METHOD
A test station (6) for testing leakage current through the insulating package (42) of power electronic components (3), said test station comprising: first contact portions (36) for applying a first test voltage on one or more pins (40) of said tested components, second contact portions (24, 37, 370, 25, 26) for applying a second test voltage on several external faces of said insulating package of said tested components, characterized in that said second contact portions are arranged for contacting several mutually orthogonal faces of said power electronic components (3).
An apparatus for isolating electronic components, comprising: a feeder track for moving a row of electronic components (6) to be isolated along a path, an abutment (71) at the end of said path, arranged for preventing displacement of the leading component in said row further than a predefined abutment position, a movable stop element (72, 74) at a fixed position along said path, for separating the leading component on one side of said stop element from all the components on the other side of said stop element, a carriage (70) for translating the electronic component (6) separated by said stop element (72, 74) at a predefined removal position where it can be gripped.
A method for soaking a device in an automated testing system, includes setting a temperature control device to a first temperature, exposing the device to the temperature control device, and driving the temperature control device to a second temperature. The temperature transition rate from the first temperature to the second temperature is derived from a first natural decay rate. The first natural decay rate is based on a first-order thermal response of the device when the device is suspended in free air. The second temperature of the temperature control device is relative to a set point temperature so that when the device is socketed for testing, the temperature of the device settles at the set point temperature.
A method for soaking a device in an automated testing system, includes setting a temperature control device to a first temperature, exposing the device to the temperature control device, and driving the temperature control device to a second temperature. The temperature transition rate from the first temperature to the second temperature is derived from a first natural decay rate. The first natural decay rate is based on a first-order thermal response of the device when the device is suspended in free air. The second temperature of the temperature control device is relative to a set point temperature so that when the device is socketed for testing, the temperature of the device settles at the set point temperature.
A system and method for cleaning a contactor device is presented. The cleaning system includes an automated testing handler and a handler controller for controlling the operation of the handler and facilitating user interaction with the handler. The handler further includes a contactor having a plurality of pins for establishing an electrical connection with one or more input devices. The handler is configured to house one or more input devices and one or more surrogate cleaning devices. The surrogate cleaning devices are configured to clean the pins of the contactor. A pick and place mechanism positioned in the handler is configured to transport both the input devices and the surrogate cleaning devices to the contactor.
Device for inverting electronic components, comprising a turntable (1) for driving the electronic components to be inverted in succession between the following stationary locations: a location (A) for loading them on the turntable; a start-of-inversion location (B); an end-of-inversion location (C); and a location (D) for discharging the components from the turntable. An inverting device (2) actuated by a fixed rotating motor (21), not linked to said turntable, allows the electronic components to be inverted between the start-of-inversion position and the end-of-inversion position.
A method of automatically carrying IC-chips, on a planar array of vacuum nozzles, to a variable target in a chip tester uses a set of laser distance sensors to align the vacuum nozzles with the target. Alignment occurs when certain combinations of distance and distance changes are sensed.
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
87.
CAMERA BASED PIN GRID ARRAY (PGA) INSPECTION SYSTEM WITH PIN BASE MASK AND LOW ANGLE LIGHTING
An inspection system (1), for inspecting pin grid arrays (15) on integrated circuit devices (10) includes a pin base mask (30) configured to receive a device having a pin grid array (15) . A dark-field, low-angle lighting system (40) emits light onto the pin grid array (15) . The pin base mask (30) and low-angle lighting system (40) provide for a clear and definitive image of the pin grid array (15) . A camera (50) captures the image of the pin grid array (15). A processor (90) , coupled to the camera (50) , analyzes the images captured by the camera (50) . Based on the captured image, the processor (90) determines whether any pins on the pin grid array (15) are bent (13, 14) or missing, or whether there are extra pins present.
A machine vision alignment system (1) for aligning a device to be tested (60) includes an alignment camera (50) positioned above an alignment portion (2) of the alignment system (1) . A lighting system (80) for emitting light onto the device to be tested (60) is located in proximity to the alignment camera (50) . An alignement (10) target is used to define an alignement (10) target coordinate system. Three actuators (30) are positioned in a testing portion (3) of the vision alignment system(l) , for correcting an offset (70) between the alignement (10) target and the device to be tested (60) . A pick and place handler (100) transports the alignement target (10) and the device to be tested (60) between the testing portion(3) and the alignment portion(2).
H01L 21/66 - Testing or measuring during manufacture or treatment
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
G01R 31/26 - Testing of individual semiconductor devices
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
B23Q 3/18 - Devices holding, supporting, or positioning, work or tools, of a kind normally removable from the machine for positioning only
G01B 11/27 - Measuring arrangements characterised by the use of optical techniques for measuring angles or tapersMeasuring arrangements characterised by the use of optical techniques for testing the alignment of axes for testing the alignment of axes
89.
APPARATUS AND METHOD FOR CONTROLLING DIE FORCE IN A SEMICONDUCTOR DEVICE TESTING ASSEMBLY
A semiconductor device test assembly includes a heat sink having a surface configured to support a device under test, an inner bellow, an outer bellow at least partially surrounding the inner bellow, and a fluid channel within the inner bellow for providing a fluid to the heat sink. The semiconductor device test assembly can further include an air adjustment unit for adjusting an air pressure in the outer bellow, so as to adjust a contact force between the heat sink and the device under test.
A machine vision based scanner system for an offline binning handler including a line scan camera capable of scanning a full tray- width image of a media tray, a camera controller operatively connected to the line scan camera, a tray transport mechanism positioned below the line scan camera, a tray transport mechanism controller operatively connected to the tray transport mechanism and the camera controller and processing software for using the images captured by the line scan camera to identify and sort a plurality of semiconductor devices.
A method for sorting devices (21) in automated handling equipment, including placing a plurality of input trays containing a plurality of devices and a plurality of empty trays into a handler (30) ; sorting the plurality of devices in the plurality of input trays into the plurality of empty trays according to a category of each of the plurality of devices, dynamically assigning categories (7-14) to each of the plurality of empty trays for each category of the plurality of devices, dynamically assigning categories to the plurality of input trays and placing the sorted plurality of devices into the plurality of input trays, removing the empty trays housing the plurality of sorted devices from the handler (30) and determining whether the sorting is completed.
A LED lighting system for reading multiple data matrix codes on device populated transport media with a line scan camera, includes a light housing, a plurality of LED circuit bars, having a plurality of LEDs, mounted to an inner surface of the light housing arranged to provide high angle lighting and low angle lighting and a light controller operatively connected to the light housing to selectively control the light intensity, the light distribution and the angle of the LEDs on each of the plurality of LED array bars, whereby the LED lighting system can reduce texture noise and detect contrast in color or contrast in texture on the device populated transport media. The LED lighting system includes a device cooling system having an air compressor for cooling the LEDs such that they can operate at an optimal level.
G06K 7/10 - Methods or arrangements for sensing record carriers by electromagnetic radiation, e.g. optical sensingMethods or arrangements for sensing record carriers by corpuscular radiation
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