A breakseal providing desired compliance characteristics for a reliable seal between the fitment of a liquid dispenser and the breakseal. A compliant material is provided on the non-wetted face of the breakseal, enabling compliance of the breakseal on a wetted face for sealing between the breakseal and the mating component. The breakseal may also include raised features on segments that are separated after rupturing that prevent or mitigate scoring of O-ring seals upon probe insertion. A wiping feature that provides redundant sealing between the breakseal and a mating cap or other mating connection may also be incorporated into the breakseal. The breakseal can also include a flat on an outer perimeter that may serve as a gate for injection molding, so that any gate vestige from the molding process will not protrude beyond the outer diameter of the breakseal to cause unwanted interference between the breakseal and the mating connection.
Compositions and methods for selectively removing unreacted metal material (e.g., unreacted nickel) relative to metal germanide (e.g., NiGe) from microelectronic devices having same thereon. The compositions are substantially compatible with other materials present on the microelectronic device such as low-k dielectrics and silicon nitride.
A method for treating a relatively unstretched portion of a blow molded container, the method including, after initial blow molding, heating the unstretched portion to cause crystallization of the material located at the unstretched portion. In one embodiment, heating the unstretched portion may involve heating the unstretched portion with infrared wavelengths, directly contacting the unstretched portion with a heating element, or heating the unstretched portion with a heating element positioned near, but not in contact with, the unstretched portion. In still another embodiment, heating the unstretched portion may involve indirectly heating the unstretched portion. Indirectly heating the unstretched portion may include conductively heating the unstretched portion using an intermediate material positioned generally adjacent to the unstretched portion, the intermediate material absorbing heat energy from a light source emitting radiation toward the intermediate material and transferring at least some of the heat energy to the unstretched portion.
A cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions are substantially devoid of amines and ammonium-containing salts. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.
A direct contact pressure dispensing apparatus including a skimmer arranged to float on liquid within a container and defining at least one liquid extraction opening positioned below an upper level of liquid in the container, and a material extraction hose coupled between the skimmer and an outlet port of the container. Withdrawal of liquid proximate to a gas/liquid interface reduces or inhibits saturation of liquid with pressurization gas. The skimmer can translate along a vertical support rod. A pressurizable reservoir can be arranged between the pressure dispensing container and a locus of use for the liquid.
A dip tube assembly having a tubular portion and a coupler portion, the coupler configured for removable coupling with the mouth of a container storing contents therein. The coupler portion comprises a first end for connection with a tubular portion; a second end for connection with a connector assembly, wherein the connector assembly provides a pressure to the container; an outer surface and an inner surface with a thickness therebetween, wherein the inner surface defines a lumen that allows the chemical fluid to be conveyed from the chamber through the tubular portion to the connector assembly; and at least one pressure relief feature on the outer surface.
A liner-based pressure dispensing container includes a connector-mounted probe arranged to seat a dip tube against an inner surface of a liner fitment for sealing utility. A dip tube and probe may include increased and/or matched flow area. A reverse flow prevention element can be arranged proximate to a liquid extraction opening to inhibit reverse flow of liquid from a dip tube into a container. A liner-less container may include a reduce diameter lower portion arranged to receive a dip tube, with at least one associated sensor to sense a condition indicative of depletion of liquid from the lower portion. A shipping cap can be included for removing headspace gas from the liner. In one embodiment, the shipping cap is suitable for direct connection to a dispensing process.
B67D 7/02 - Apparatus or devices for transferring liquids from bulk storage containers or reservoirs into vehicles or into portable containers, e.g. for retail sale purposes for transferring liquids other than fuel or lubricants
Compositions useful for the selective removal of titanium nitride and/or photoresist etch residue materials relative to insulating materials from a microelectronic device having same thereon. The removal compositions contain at least one oxidant, one etchant, and one activator to enhance the etch rate of titanium nitride.
Compositions useful for the selective removal of titanium nitride and/or photoresist etch residue materials relative to metal conducting, e.g., tungsten, and insulating materials from a microelectronic device having same thereon. The removal compositions are low pH and contain at least one oxidizing agent and at least one etchant as well as corrosion inhibitors to minimize metal erosion and passivating agents to protect dielectric materials.
Compositions useful for the selective removal of titanium nitride and/or photoresist etch residue materials relative to metal conducting, e.g., tungsten, and insulating materials from a microelectronic device having same thereon. The removal compositions contain at least one oxidant and one etchant, may contain various corrosion inhibitors to ensure selectivity.
A shippable liquid storage and dispensing apparatus includes a collapsible liner arranged within a container, with a dispense head coupled to the container, suitable for handling oxygen- and moisture-sensitive materials. The dispense head includes a pressurization gas passage, a pressurization gas valve, a liquid passage, a liquid valve, a liner gas passage, and a liner gas valve, wherein each valve may have an associated quick connect fitting. The dispense head remains attached to the container during inert gas purging, liner filling, container shipment, and liquid dispensing. Pressurized inert gas may be maintained in the liner overlying liquid-containing material during shipment of the coupled dispense head and container. The container may have an extended chime to provide a protective zone that contains the entirety of the dispense head.
Compositions useful for the selective removal of titanium nitride and/or photoresist etch residue materials relative to metal conducting, e.g., cobalt, ruthenium and copper, and insulating materials from a microelectronic device having same thereon. The removal compositions contain at least one oxidant and one etchant, may contain various corrosion inhibitors to ensure selectivity.
A method for folding a liner for packaging and/or insertion into an overpack. The method may include providing a liner comprising a substantially tubular body portion and a closed top and bottom, and a fitment formed in or affixed to the top of the liner, forming a gusset in the bottom panel of the liner, forming a gusset in the body portion of the liner, and fan-folding the liner. In some embodiments, the top of the liner may be a substantially circular top panel and the bottom of the liner may be a substantially circular bottom panel, with the top panel being attached to one end of the tubular body portion and the bottom panel being attached to an opposite end of the tubular body portion. In other embodiments, the liner may be a flexible, blow molded liner, thereby having no weld seams.
A removal composition and process for cleaning post-chemical mechanical polishing (CMP) contaminants and ceria particles from a microelectronic device having said particles and contaminants thereon. The removal compositions include at least one surfactant. The composition achieves highly efficacious removal of the ceria particles and CMP contaminant material from the surface of the microelectronic device without compromising the low-k dielectric, silicon nitride, or tungsten-containing materials.
A cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions include corrosion inhibitor(s) and surfactant(s). The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.
An indicator configured for connection to a container and substantially difficult removal from the container once connected. The indicator may include a material that in a first state, prior to coming into contact with contents stored within the container, indicates that the container has not been used previously to dispense its contents. The material, in a second state, after coming into contact with the contents stored within the container, indicates the container has been previously used for dispense. In one embodiment, the material may be or include a first color in the first state and a second color in the second state. The material may be configured to substantially remain in the second state once in the second state.
Semi-aqueous compositions useful for the selective removal of titanium nitride and/or photoresist etch residue materials relative to metal conducting, e.g., tungsten and copper, and insulating materials from a microelectronic device having same thereon. The semi-aqueous compositions contain at least one oxidant, at least one etchant, and at least one organic solvent, may contain various corrosion inhibitors to ensure selectivity.
The present disclosure relates to an integrated liner-based system having an overpack and a liner provided within the overpack, the liner comprising a mouth and a liner wall forming an interior cavity of the liner and having a thickness such that the liner is substantially self-supporting in an expanded state, but is collapsible at a pressure of less than about 20 psi. The liner and overpack may be made by blow molding the liner and the overpack at the same time using nested preforms.
B67D 7/02 - Apparatus or devices for transferring liquids from bulk storage containers or reservoirs into vehicles or into portable containers, e.g. for retail sale purposes for transferring liquids other than fuel or lubricants
A blow molded container having a plurality of predetermined fold lines in one or more container walls, allowing the container walls to flex along the fold lines to an at least partially collapsed state and unfold along the fold lines to a shape of predetermined volume. The container includes four side walls, a top surface connected to one end of each of the four side walls and defining a square or rectangular pyramid, and a bottom surface connected to the opposite end of each of the four side walls and defining a square or rectangular pyramid. A fitment may be positioned at the apex of the top surface. Two opposing side walls of the four side walls may each have a plurality of fold lines radially extending from a central region of the respective side wall. In one embodiment, the central region has a stress relief limiter.
A dip tube assembly having a tubular body portion and a coupler overmolded to a first end of the tubular body portion, the coupler configured for removable coupling with the mouth of a container storing contents therein. Also disclosed are a method of making the overmolded dip tube assembly and a container system including the overmolded dip tube assembly. In some embodiments, the tubular body portion and/or the coupler may include retention features molded into a surface thereof at an overmold interface between the tubular body portion and the coupler.
B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
21.
LINER RETAINER FOR LINER-BASED STORAGE AND DISPENSING SYSTEM
A liner-based assembly including an overpack having a mouth, a liner disposed within the overpack, the liner including a liner neck, and a retainer ring removably securable about the liner neck for securing the liner at the mouth of the overpack. The retainer ring may include a first half portion and a second half portion, joined at one end thereof by a hinge permitting the other ends thereof to open and close in a clam-shell manner about the hinge to removably secure to the liner neck. The retainer ring generally secures the vertical position of the liner neck within the overpack mouth.
A breakseal, and a method for making a breakseal, having a first layer of extruded MDPE or LDPE/LLDPE film in a flat washer shape defining a central opening therein and a second layer of PTFE film heat laminated to a first side of the first layer. The second layer is exposed and rupturable through the central opening of the first layer. In some embodiments, the first layer is made up of two sub-layers of MDPE or LDPE/LLDPE film in flat washer shapes bonded together by heat lamination. In another embodiment, a breakseal comprises a single component, molded structure including an outer rim portion having a first thickness and defining a central opening therein, and a central seal portion having a second thickness being smaller than the first thickness, wherein the central seal portion spans the central opening and is integrally formed with the outer rim portion.
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
A supply vessel for dispensing of ultra-high purity chemical reagents, comprising a metal container defining an enclosable interior volume including interior surface structure, wherein the interior surface structure is coated with an ultra-high purity effective polyperfluoroalkoxyethylene coating. Such supply vessel may for example be utilized for storage and dispensing of ultra-high purity chemical reagent to a semiconductor manufacturing tool, or a tool for manufacturing of flat-panel displays, or solar panels.
The present disclosure relates to novel and advantageous connector assemblies for use with a liner-based assembly. In one embodiment, a connector assembly for use with a liner-based assembly can include a pressure port, a dispense port, a headspace removal port, and a locking mechanism. The pressure port can be adapted for connection to a pressure source. The dispense port can be adapted for fluid communication with a source of material to be dispensed from the liner-based assembly. The headspace removal port may be configured for removing a gas from the liner-based assembly. The locking mechanism may be used for locking the connector to the liner-based assembly when contents therein are under pressure. In some embodiments, the dispense port and headspace removal port may be operably coupled providing a flow path for recirculation of the contents within a liner of the liner-based assembly.
B65D 35/28 - Pliable tubular containers adapted to be permanently deformed to expel contents, e.g. collapsible tubes for toothpaste or other plastic or semi-liquid materialHolders therefor with auxiliary devices for expelling contents
B65D 83/62 - Containers for dispensing liquid or semi-liquid contents by internal gaseous pressure, i.e. aerosol containers comprising propellant with contents and propellant separated by membranes, bags or the like
B65D 77/06 - Liquids or semiliquids enclosed in flexible containers disposed within rigid containers
B67D 7/02 - Apparatus or devices for transferring liquids from bulk storage containers or reservoirs into vehicles or into portable containers, e.g. for retail sale purposes for transferring liquids other than fuel or lubricants
B65D 83/00 - Containers or packages with special means for dispensing contents
26.
CARBON ADSORBENT FOR HYDROGEN SULFIDE REMOVAL FROM GASES CONTAINING SAME, AND REGENERATION OF ADSORBENT
A durable carbon pyrolyzate adsorbent having reversible sorptive affinity for hydrogen sulfide, and including the following characteristics: (a) a bulk density as measured by ASTM D2854 in a range of from 0.55 g/cc adsorbent to 1.25 g/cc adsorbent; (b) an H2S capacity in a range of from 140 cc H2S/g adsorbent to 250 cc H2S/g adsorbent, at normal conditions (1 atm, 293.15°K); (c) an H2S capacity in a range of from 1.0 cc H2S/g adsorbent to 15.0 cc H2S/g adsorbent, at partial pressure of 0.76 torr (101.3 Pa) (1000ppm) of H2S at 293.15°K; and (d) a single pellet radial crush strength in a range of from 7 kilopond (kP) to 40 kilopond (kP) as measured by ASTM D4179. Such adsorbent is usefully employed for capture of hydrogen sulfide from gases containing same, such as H2S-containing gas associated with flowable hydrocarbonaceous material in refining operations, biogas produced by biomass digesters, gas mixtures produced by fluid catalytic cracking (FCC) units, and effluents from power plants gasifying sulfur-containing coal in an integrated gasification combined cycle (IGCC) process.
B01J 20/02 - Solid sorbent compositions or filter aid compositionsSorbents for chromatographyProcesses for preparing, regenerating or reactivating thereof comprising inorganic material
B01D 53/02 - Separation of gases or vapoursRecovering vapours of volatile solvents from gasesChemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases or aerosols by adsorption, e.g. preparative gas chromatography
B01J 20/20 - Solid sorbent compositions or filter aid compositionsSorbents for chromatographyProcesses for preparing, regenerating or reactivating thereof comprising inorganic material comprising free carbonSolid sorbent compositions or filter aid compositionsSorbents for chromatographyProcesses for preparing, regenerating or reactivating thereof comprising inorganic material comprising carbon obtained by carbonising processes
27.
SOURCE REAGENT-BASED DELIVERY OF FLUID WITH HIGH MATERIAL FLUX FOR BATCH DEPOSITION
Systems, reagent support trays, particle suppression devices, and methods are disclosed. In one aspect, a system includes a vaporizer vessel having one or more interior walls enclosing an interior volume and a plurality of reagent support trays configured to be vertically stackable within the interior volume. Each of the plurality of reagent support trays is configured to be vertically stackable within the interior volume to form a stack of reagent support trays. One or more of the plurality of reagent support trays is configured to redirect a flow of a gas passing between adjacent reagent support trays in the stack of reagent support trays to cause the flow of gas to interact with the source reagent material in a particular reagent support tray before passing into a next of the plurality of reagent support trays in the stack of reagent support trays.
C23C 16/44 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
C23C 16/458 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
28.
SILICON PRECURSORS FOR LOW TEMPERATURE ALD OF SILICON-BASED THIN-FILMS
A silicon precursor composition is described, including a silylene compound selected from among: silylene compounds of the formula: wherein each of R and R1 is independently selected from organo substituents; amidinate silylenes; and bis(amidinate) silylenes. The silylene compounds are usefully employed to form high purity, conformal silicon-containing films of Si02, Si3N4, SiC and doped silicates in the manufacture of microelectronic device products, by vapor deposition processes such as CVD, pulsed CVD, ALD and pulsed plasma processes. In one implementation, such silicon precursors can be utilized in the presence of oxidant, to seal porosity in a substrate comprising porous silicon oxide by depositing silicon oxide in the porosity at low temperature, e.g., temperature in a range of from 50°C to 200°C.
C07F 7/10 - Compounds having one or more C—Si linkages containing nitrogen
C23C 16/18 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds
29.
AQUEOUS CLEAN SOLUTION WITH LOW COPPER ETCH RATE FOR ORGANIC RESIDUE REMOVAL IMPROVEMENT
A cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions include at least one quaternary base, at least one amine, at least one corrosion inhibitor, and at least one solvent. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device while being compatible with barrier layers.
H01L 21/302 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
30.
MANUFACTURING METHOD FOR GENERALLY CYLINDRICAL THREE-DIMENSIONAL CONFORMAL LINERS
A method for manufacturing a liner, the method including forming a tubular body portion having a top circumferential edge, a bottom circumferential edge, and a weld seam or seams extending from the top circumferential edge to the bottom circumferential edge; stretching the tubular body near the top circumferential edge and welding a top liner sheet portion along the stretched top circumferential edge, the top liner sheet portion having a fitment welded thereto; and stretching the tubular body near the bottom circumferential edge and welding a bottom liner sheet portion along the stretched bottom circumferential edge. The weld between the tubular body portion and the top liner sheet portion may be effected with the inner wetted surfaces of each portion in contact. Similarly, the weld between the tubular body portion and the bottom liner sheet portion is effected with the inner wetted surfaces of each portion in contact.
A carbon adsorbent adapted for adsorptive storage and subsequent desorptive release of a decomposition-susceptible gas is described. Such carbon adsorbent comprises porosity in which mesopore volume is less than 0.25 cm3/gm of carbon adsorbent, in which the porosity comprises at least 80% by volume micropores, and at least 65% by volume of the micropores have pore diameter in a range of from 0.3 to 0.72 nm. The carbon adsorbent has a nitrogen adsorption BET surface area greater than 800 m2/g of carbon adsorbent, measured at 77°K, and a bulk density that is greater than 0.55 g/cc of carbon adsorbent. The carbon adsorbent can be utilized in gas storage and dispensing packages of varying type, to provide a safe and reliable source of decomposition- susceptible gas, e.g., acetylene for applications such as gas welding/cutting applications, atomic absorption spectroscopy applications, chemical synthesis and microelectronic products manufacturing.
B01D 53/04 - Separation of gases or vapoursRecovering vapours of volatile solvents from gasesChemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases or aerosols by adsorption, e.g. preparative gas chromatography with stationary adsorbents
30Si, and may include a supplemental gas including at least one of a co-species gas and a diluent gas. Dopant gas supply apparatus for providing such silicon dopant compositions to an ion implanter are described, as well as ion implantation systems including such dopant gas supply apparatus.
A method of forming a GST device structure including a substrate having a hole therein bounded at one end by a bottom electrode. The method includes: depositing in the hole, under conditions effective therefor, GST material of crystalline character, so that the GST material of crystalline character grows adhesively and selectively over the bottom electrode and thereafter depositing in the hole, over the GST material of crystalline character therein, a GST material of amorphous character, so that the hole contains a total GST material comprising the GST material of crystalline character and the GST material of amorphous character, wherein the GST material of crystalline character constitutes from 25% to 90% of volume of the total GST material in the hole. Such method is usefully applied to form GST phase change memory cell structures and GST phase change memory devices in which voids, gaps, and seams in the GST material are minimized.
H01L 21/205 - Deposition of semiconductor materials on a substrate, e.g. epitaxial growth using reduction or decomposition of a gaseous compound yielding a solid condensate, i.e. chemical deposition
A cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions achieve highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.
H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
A fluid supply system adapted for vacuum and pressure cycling of fluid, including a transfer vessel adapted to supply a process canister with fluid drawn from a bulk canister under a vacuum, wherein delivery of fluid from the transfer vessel to the process canister is accomplished with positive pressure. A method is also disclosed of delivering fluid, including drawing fluid under vacuum from a bulk canister and pressurizing the transfer vessel to effect dispensing of the fluid into a process canister for delivery to a location of use.
F17C 9/00 - Methods or apparatus for discharging liquefied or solidified gases from vessels not under pressure
B67D 7/00 - Apparatus or devices for transferring liquids from bulk storage containers or reservoirs into vehicles or into portable containers, e.g. for retail sale purposes
F17C 7/00 - Methods or apparatus for discharging liquefied, solidified, or compressed gases from pressure vessels, not covered by another subclass
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
The present disclosure relates to a liner for storing a material, the liner including at least two layers, wherein a layer that is in contact with the material is an active layer. The active layer may be made active by incorporating a scavenger into the layer. At least one layer of the liner may comprise a polymer or a fluoropolymer. In some embodiments, the active layer may be configured for removing microbridging components in photoresists. In some embodiments, the active layer may be made active by coating the interior of the layer with an inert material, such as glass. In further embodiments, the liner may be positioned within a stainless steel canister. The present disclosure also relates to a liner-based assembly for storing a material, an overpack within which the liner is positioned, and a purifying packet positioned between the liner and the overpack.
B65D 81/24 - Adaptations for preventing deterioration or decay of contentsApplications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants
B65D 85/84 - Containers, packaging elements or packages, specially adapted for particular articles or materials for corrosive chemicals
37.
CARBON DOPANT GAS AND CO-FLOW FOR IMPLANT BEAM AND SOURCE LIFE PERFORMANCE IMPROVEMENT
Ion implantation processes and systems are described, in which carbon dopant source materials are utilized to effect carbon doping. Various gas mixtures are described, including a carbon dopant source material, as well as co-flow combinations of gases for such carbon doping. Provision of in situ cleaning agents in the carbon dopant source material is described, as well as specific combinations of carbon dopant source gases, hydride gases, fluoride gases, noble gases, oxide gases and other gases.
H01L 21/265 - Bombardment with wave or particle radiation with high-energy radiation producing ion implantation
H01J 37/317 - Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. ion implantation
38.
ALTERNATE MATERIALS AND MIXTURES TO MINIMIZE PHOSPHORUS BUILDUP IN IMPLANT APPLICATIONS
Systems and processes for utilizing phosphorus fluoride in place of, or in combination with, phosphine as a phosphorus dopant source composition, to reduce buildup of unwanted phosphorus deposits in ion implanter systems. The phosphorus fluoride may comprise PF3 and/or PF5. Phosphorus fluoride and phosphine may be co-flowed to the ion implanter, or each of such phosphorus dopant source materials can be alternatingly and sequentially flowed separately to the ion implanter, to achieve reduction in unwanted buildup of phosphorus solids in the implanter, relative to a corresponding process system utilizing only phosphine as the phosphorus dopant source material.
H01L 21/265 - Bombardment with wave or particle radiation with high-energy radiation producing ion implantation
H01J 37/317 - Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. ion implantation
A polymer-based multilayer film including a combination of desirable properties, such as relatively high chemical resistance and relatively good gas barrier properties. Specifically, in various embodiments, a multilayer film may include at least one layer having relatively high chemical resistance and at least one other layer having relatively good gas barrier properties. In one particular embodiment, the present disclosure relates to a multilayer film structure having a core layer of a fluoropolymer containing chlorine and a fluoropolymer containing chlorine and oxygen and an outer layer operably bonded on one side of the core layer and comprising a perfluorinated fluoropolymer. The core layer may be a blended layer of the fluoropolymer containing chlorine and the fluoropolymer containing chlorine and oxygen, or the core layer may be a sandwiched structure having at least one layer of the fluoropolymer containing chlorine and at least one layer of the fluoropolymer containing chlorine and oxygen.
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 37/02 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
A method for folding a liner for packaging and/or insertion into an overpack. The method may include providing a liner comprising a substantially tubular body portion and a closed top and bottom, and a fitment formed in or affixed to the top of the liner, forming a gusset in the bottom panel of the liner, forming a gusset in the body portion of the liner, and fan-folding the liner. In some embodiments, the top of the liner may be a substantially circular top panel and the bottom of the liner may be a substantially circular bottom panel, with the top panel being attached to one end of the tubular body portion and the bottom panel being attached to an opposite end of the tubular body portion. In other embodiments, the liner may be a flexible, blow molded liner, thereby having no weld seams.
Systems are described for delivery of a wide variety of materials in which liquid and gas or vapor states are concurrently present, from a package preferably including a fluid-containing collapsible liner. Headspace gas is removed from a pressure dispensing package prior to liquid dispensation therefrom, and ingress gas is removed thereafter during dispensation operation. At least one sensor senses presence of gas or a gas-liquid interface in a reservoir or gas-liquid separation region. A gas removal system including an integral reservoir, at least one sensor, and at least one flow control elements may be included within a connector adapted to mate with a pressure dispensing package, for highly efficient removal of gas from the liquid being dispensed from the container.
B65D 83/62 - Containers for dispensing liquid or semi-liquid contents by internal gaseous pressure, i.e. aerosol containers comprising propellant with contents and propellant separated by membranes, bags or the like
B67D 7/02 - Apparatus or devices for transferring liquids from bulk storage containers or reservoirs into vehicles or into portable containers, e.g. for retail sale purposes for transferring liquids other than fuel or lubricants
B67D 7/76 - Arrangements of devices for purifying liquids to be transferred, e.g. of filters, of air or water separators
The present disclosure, in one embodiment, relates to a liner-based assembly having an overpack and a liner disposed within the overpack. The liner may be formed by blow molding a liner preform within the overpack to form a blow molded liner substantially conforming to the interior of the overpack and generally forming an interface with an interior of the overpack. The present disclosure, in another embodiment, relates to a liner-based assembly including a blow-molded overpack comprised of polyethylene terephthalate, a blow-molded liner disposed within the overpack, the liner comprised of a polymer material, wherein the overpack and liner have a combined wall thickness of about 0.3 mm or less, and a base cup configured to at least partially surround an exterior of the overpack. In some embodiments, the liner has a volume of up to about 4.7 liters and an empty weight of between about 260-265 grams.
Apparatuses and processes for recycling printed wire boards, wherein electronic components, precious metals and base metals may be collected for reuse and recycling. The apparatuses generally include a mechanical solder removal module and/or a thermal module, a chemical solder removal module, and a precious metal leaching module, wherein the modules are attached for continuous passage of the e-waste from module to module.
B09B 3/00 - Destroying solid waste or transforming solid waste into something useful or harmless
B09B 5/00 - Operations not covered by a single other subclass or by a single other group in this subclass
B29B 17/02 - Separating plastics from other materials
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
[Problem] The purpose of the present invention is to provide an etching agent for a process for etching copper or a copper alloy from an electronic substrate that includes both nickel, and copper or a copper alloy, wherein said etching agent foams little during use and can highly selectively etch copper or a copper alloy. [Solution] An etching agent used in a process for selectively etching copper or a copper alloy from an electronic substrate that includes both nickel, and copper or a copper alloy, said etching agent for copper or a copper alloy having as essential components: a chain-like alkanolamine (A); a chelating agent (B) having an acid group in the molecules thereof; and hydrogen peroxide (C).
A method for removing headspace gas from a liner-based assembly. The liner-based assembly may generally include an overpack, a liner positioned within the overpack and containing a material and headspace gas, and a closure for sealing the liner. The method may include providing a one-way valve in fluid communication with the interior of the liner and permitting flow in a direction out of the interior of the liner, and applying a vacuum to the one-way valve to evacuate headspace gas from the interior of the liner. In some embodiments, The liner-based assembly may also include a port in fluid communication with an annular space between the overpack and liner, and the method may include capping the port, for example, during application of the vacuum to the one-way valve.
A cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions are substantially devoid of amine and ammonium-containing compounds, e.g., quaternary ammonium bases. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.
A reaction system and method for preparing compounds or intermediates from solid reactant materials is provided. In a specific aspect, a reaction system and methods are provided for preparation of boron-containing precursor compounds useful as precursors for ion implantation of boron in substrates. In another specific aspect, a reactor system and methods are provided for manufacture of boron precursors such as B2F4.
A. liner-based assembly including an overpack, a liner disposed within the overpack, and a filling connector securable to at least one of the overpack and the liner and ineloding a membrane for substantially aseptic filling. The membrane may be an elastomeric stopper, which may be configured, for re-sealing with or without the assistance of heat The !iner-based assembly may further include a dispense connector that is operably connected with the overpack and/or the li.oer. The dispense connector may comprise or be operably connected to a one-way valve, the one-way valve having. -an elastomeric portion defining an opening and generally operably coupled with a plug member positioned within the- opening. In a closed position, the elastomeric portion may be sealed against the plug member, and when a pressure is applied against the elastomeric portion, the elastomeric portion may flex in a manner configured -to permit only one- way flow through the opening.
B65D 77/06 - Liquids or semiliquids enclosed in flexible containers disposed within rigid containers
B65D 25/18 - Linings or internal coatings spaced appreciably from container wall
B65D 83/00 - Containers or packages with special means for dispensing contents
B65D 83/76 - Containers or packages with special means for dispensing contents for dispensing fluent contents by means of a piston
B67D 7/02 - Apparatus or devices for transferring liquids from bulk storage containers or reservoirs into vehicles or into portable containers, e.g. for retail sale purposes for transferring liquids other than fuel or lubricants
49.
Liner-based liquid storage and dispensing systems with empty detection capability
Fluid supply systems for storage and dispensing of chemical reagents and compositions, e.g., high purity liquid reagents and chemical mechanical polishing compositions used to manufacture microelectronic device products, having capability for detection of an empty or near-empty condition when the contained liquid is at or approaching depletion during dispensing operation. Fluid delivery systems employing empty detect arrangements are described, including pressure transducer monitoring of dispensed material intermediate the supply package and a servo-hydraulic dispense pump, or monitoring of dispenser chamber replenishment times in a dispenser being replenished on a cyclic schedule to flow material from the dispenser to a downstream tool utilizing the dispensed material.
A system and process for generating and packaging phosphine gas, in which the process includes: reacting water and aluminum phosphide to generate phosphine, and providing the phosphine in a gas mixture at a phosphine concentration below a lower explosive limit; adsorptively removing phosphine from the gas mixture; and packaging the removed phosphine in a fluid storage and dispensing vessel.
The present disclosure relates to a blow-molded, rigid collapsible container that can be suitable for storage and dispensing systems of practically any size. The rigid collapsible container may be a stand-alone container. The container may be blow-molded as a unitary piece that may include folds or pre-folds that allows the container to collapse into a relatively flat position. In an expanded state, the container may have a generally trapezoidal prism shape.
B67D 7/02 - Apparatus or devices for transferring liquids from bulk storage containers or reservoirs into vehicles or into portable containers, e.g. for retail sale purposes for transferring liquids other than fuel or lubricants
52.
METHOD FOR THE RECOVERY OF LITHIUM COBALT OXIDE FROM LITHIUM ION BATTERIES
A method of recovering lithium cobalt oxide from spent lithium ion batteries, wherein said method is more environmentally friendly than the methods presently known in the art. The method includes a froth flotation step using renewable and biodegradable solvents such as terpenes and formally hydrated terpenes. The method can also include a relithiation step to return the Li:Co ratio back to about 1:1 for use in second-life applications.
H01M 4/525 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of nickel, cobalt or iron of mixed oxides or hydroxides containing iron, cobalt or nickel for inserting or intercalating light metals, e.g. LiNiO2, LiCoO2 or LiCoOxFy
B09B 3/00 - Destroying solid waste or transforming solid waste into something useful or harmless
53.
HIGH-K PEROVSKITE MATERIAL AND METHODS OF MAKING AND USING THE SAME
High-k materials and devices, e.g., DRAM capacitors, and methods of making and using the same. Various methods of forming perovskite films are described, including methods in which perovskite material is deposited on the substrate by a pulsed vapor deposition process involving contacting of the substrate with perovskite material-forming metal precursors. In one such method, the process is carried out with doping or alloying of the perovskite material with a higher mobility and/or higher volatility metal species than the metal species in the perovskite material- forming metal precursors. In another method, the perovskite material is exposed to elevated temperature for sufficient time to crystallize or to enhance crystallization of the perovskite material, followed by growth of the perovskite material under pulsed vapor deposition conditions. Various perovskite compositions are described, including: (Sr, Pb)TiO3; SrRuO3 or SrTiO3, doped with Zn, Cd or Hg; Sr(Sn,Ru)O3; and Sr(Sn,Ti)O3.
H01L 21/31 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to form insulating layers thereon, e.g. for masking or by using photolithographic techniquesAfter-treatment of these layersSelection of materials for these layers
H01L 21/205 - Deposition of semiconductor materials on a substrate, e.g. epitaxial growth using reduction or decomposition of a gaseous compound yielding a solid condensate, i.e. chemical deposition
54.
COMPOSITIONS AND METHODS FOR SELECTIVELY ETCHING SILICON NITRIDE
Compositions useful for the selective removal of silicon nitride materials relative to silicon oxide materials from a microelectronic device having same thereon. The removal compositions include at least one alkoxysilane, at least one etchant, at least one oxidizing agent, at least one organic solvent, and water.
C09K 13/00 - Etching, surface-brightening or pickling compositions
C09K 13/06 - Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material
C09K 13/08 - Etching, surface-brightening or pickling compositions containing an inorganic acid containing a fluorine compound
H01L 21/302 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
A fluid delivery system adapted to isolate an ampoule and/or process line during purge, including an inlet control valve connecting a source of pressurized gas to a refillable ampoule, an outlet control valve connecting the refillable ampoule to a location of use, a process control valve connecting a process line to the refillable ampoule, a process isolation valve, and a purge supply valve, e.g., a three-way purge supply valve, arranged between the process isolation valve and the process control valve. A method of purging a fluid delivery system is also disclosed, including closing a process isolation valve, connecting a process line to a refillable ampoule, supplying a purge gas through a purge supply valve, e.g., a three-way purge supply valve, and cycling open and close at least once a process control valve coupled to the process line. A manifold for use in refilling an ampoule and purging a fluid supply system is also described.
Removal compositions and processes for removing at least one metal impurity from a substrate (e.g., a silicon-containing substrate) having same thereon. Advantageously, the compositions remove metal impurities, e.g., iron, from silicon-containing substrates used as semiconductor devices and solar cell devices.
A carbon adsorbent having the characteristics of: a nitrogen micropore volume at 77°K, measured as liquid capacity, that is greater than 0.30 mL/g; a neopentane capacity measured at 273°K and 1 bar, measured as liquid capacity, that is less than 7% of the nitrogen micropore volume, measured as liquid capacity; and an access pore size in a range of from 0.50 to 0.62 nm. Such adsorbent is usefully employed for contacting with hydrocarbon mixtures to adsorb low-octane, linear and mono- or di-substituted alkanes therefrom, and thereby increase octane rating, e.g., of an isomerization naphtha raffinate. Adsorption processes and apparatus are also described, in which the carbon adsorbent can be utilized for production of higher octane rating hydrocarbon mixtures.
B01J 20/20 - Solid sorbent compositions or filter aid compositionsSorbents for chromatographyProcesses for preparing, regenerating or reactivating thereof comprising inorganic material comprising free carbonSolid sorbent compositions or filter aid compositionsSorbents for chromatographyProcesses for preparing, regenerating or reactivating thereof comprising inorganic material comprising carbon obtained by carbonising processes
C10G 61/06 - Treatment of naphtha by at least one reforming process and at least one process of refining in the absence of hydrogen plural serial stages only the refining step being a sorption process
C10G 25/00 - Refining of hydrocarbon oils, in the absence of hydrogen, with solid sorbents
58.
OXIC GERMANIUM-ANTIMONY-TELLURIUM MATERIAL AND PHASE CHANGE MEMORY COMPRISING SAME
A GST material selected from among: (a) GST materials having oxygen incorporated therein at concentration of from 0.10 to 10 atomic %, based on atomic weight of the GST material; and (b) GST materials having a reset current of less than 0.1 milliamps when the GST material is comprised in a GST phase change random access memory device. The GST material can be formed by vapor deposition processes, and utilized in phase change memory devices of varied types to provide devices having reset current values of 0.1 milliamps and lower.
The present disclosure relates to storage, transportation, and/or dispense packaging systems, and particularly container-based or liner-based storage, transportation, and/or dispensing systems, such as but not limited to bottle systems, drum systems, bag-in-bottle (BIB) systems, bag-in-drum systems, or the like for use in any suitable dispense application.
An ion implantation method, in which a dopant source composition is ionized to form dopant ions, and the dopant ions are implanted in a substrate. The dopant source composition includes cluster phosphorus or cluster arsenic compounds, for achieving P- and/or As-doping, in the production of doped articles of manufacture, e.g., silicon wafers or precursor structures for manufacturing microelectronic devices.
The present disclosure relates to an integrated liner-based system having an oveipack and a liner provided within the overpack, the liner comprising a mouth and a liner wall forming an interior cavity of the liner and having a thickness such that the liner is substantially self-supporting in an expanded state, but is collapsible at a pressure of less than about 20 psi. The liner and overpack may be made by blow molding the liner and the overpack at the same time using nested preforms.
09 - Scientific and electric apparatus and instruments
42 - Scientific, technological and industrial services, research and design
Goods & Services
Bioreactors for cell culturing; cell culture apparatus for
laboratory use, namely, cell culture chambers. Scientific and technological services and related research
and design services in the field of biotechnology, namely,
design of lines of cells, identifying clones of cells,
protein engineering, developing high production cell lines;
industrial analysis and research services in the field of
biotechnology, namely, design of lines of cells, identifying
clones of cells, protein engineering, developing high
production cell lines.
63.
CARBON PYROLYZATE ADSORBENT HAVING UTILITY FOR CO2 CAPTURE AND METHODS OF MAKING AND USING THE SAME
A particulate form carbon pyrolyzate adsorbent, having the following characteristics: (a) CO2 capacity greater than 105 cc/gram at one bar pressure and temperature of 273° Kelvin; (b) CO2 Working Capacity greater than 7.0 weight percent; (c) CO2 heats of adsorption and desorption each of which is in a range of from 10 to 50 kJ/mole; and (d) a CO2/N2 Henry's Law Separation Factor greater than 5. The carbon pyrolyzate material can be formed from a polyvinylidene chloride-based polymer or copolymer, or other suitable resin material, to provide an adsorbent that is useful for carbon dioxide capture applications, e.g., in treatment of flue gases from coal-fired power generation plants.
B01J 20/02 - Solid sorbent compositions or filter aid compositionsSorbents for chromatographyProcesses for preparing, regenerating or reactivating thereof comprising inorganic material
B01J 19/26 - Nozzle-type reactors, i.e. the distribution of the initial reactants within the reactor is effected by their introduction or injection through nozzles
B01D 53/04 - Separation of gases or vapoursRecovering vapours of volatile solvents from gasesChemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases or aerosols by adsorption, e.g. preparative gas chromatography with stationary adsorbents
64.
FORMULATIONS FOR THE REMOVAL OF PARTICLES GENERATED BY CERIUM- CONTAINING SOLUTIONS
Compositions and methods for removing lanthanoid-containing solids and/or species from the surface of a microelectronic device or microelectronic device fabrication hardware. Preferably, the lanthanoidcontaining solids and/or species comprise cerium. The composition is preferably substantially devoid of fluoride ions.
H01L 21/302 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
H01L 21/265 - Bombardment with wave or particle radiation with high-energy radiation producing ion implantation
65.
GENERALLY CYLINDRICALLY-SHAPED LINER FOR USE IN PRESSURE DISPENSE SYSTEMS AND METHODS OF MANUFACTURING THE SAME
A liner having a tubular body portion with a top circumferential edge and a bottom circumferential edge, a generally circular bottom portion sealed to the tubular body portion along the bottom circumferential edge, and a generally circular top portion sealed to the tubular body portion along the top circumferential edge. The top portion may include a fitment sealed thereto. The tubular body portion may include at least one weld seam extending from the top circumferential edge to the bottom circumferential edge. In a particular embodiment, the tubular body portion may include two sheets welded together to form a tubular body, the tubular body portion thus having two weld seams extending from the top circumferential edge to the bottom circumferential edge.
Systems and methods for delivering fluid-containing feed materials to process equipment are disclosed. A liner-based pressure dispensing vessel is subjected to filling by application of vacuum between the liner and overpack. Multiple feed material flow controllers of different calibrated flow ranges may be selectively operated in parallel for a single feed material. Feed material blending and testing for scale-up may be performed with feed materials supplied by multiple liner-based pressure dispensing containers. A gravimetric system may be used to determine concentration of at least one component of a multi-component solution or mixture.
G01F 11/00 - Apparatus requiring external operation adapted at each repeated and identical operation to measure and separate a predetermined volume of fluid or fluent solid material from a supply or container, without regard to weight, and to deliver it
B01F 3/08 - Mixing, e.g. dispersing, emulsifying, according to the phases to be mixed liquids with liquids; Emulsifying
B67D 7/02 - Apparatus or devices for transferring liquids from bulk storage containers or reservoirs into vehicles or into portable containers, e.g. for retail sale purposes for transferring liquids other than fuel or lubricants
67.
ION IMPLANTER SYSTEM INCLUDING REMOTE DOPANT SOURCE, AND METHOD COMPRISING SAME
Dopant source gas supply arrangements and methods are described, wherein one or more dopant source gas supply vessels is contained inside an outer enclosure of an ion implantation system, e.g., in a gas box within such enclosure. In one implementation, a dopant source gas supply vessel is positioned in remote relationship to the gas box of the ion implantation system, with a dopant source gas local vessel in the gas box, and a supply line interconnecting the dopant source gas supply vessel in supply relationship to the dopant source gas local vessel, in which the supply line is adapted to flow dopant source gas from the supply vessel to the local vessel only when the ion implantation system is in a non-operational state, and to be evacuated or filled with an inert pressurized gas when the ion implantation system is in an operational state.
The present disclosure relates to novel and advantageous disposable dispensers. The dispenser may include a dispense assembly comprising an outlet channel in fluid communication with a terminal apparatus, and a pressure source providing a limited supply of fluid or gas, and also includes a collapsible liner that contains a material to be dispensed, the liner detachably secured to the dispense assembly with the outlet channel in fluid communication with an interior of the liner, wherein the material in the liner is dispensed out the liner and through the outlet channel to the terminal apparatus.
The present disclosure, in one embodiment, relates to a dispenser including a dispense assembly having a head assembly, and also including a collapsible liner that contains a material to be dispensed, the liner detachably secured to the dispense assembly with the head assembly in fluid communication with the liner, wherein the material in the liner is dispensed out the liner and through the head assembly.
B05B 7/24 - Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas with means, e.g. a container, for supplying liquid or other fluent material to a discharge device
B65D 83/14 - Containers for dispensing liquid or semi-liquid contents by internal gaseous pressure, i.e. aerosol containers comprising propellant
B65D 25/18 - Linings or internal coatings spaced appreciably from container wall
B05B 15/00 - Details of spraying plant or spraying apparatus not otherwise provided forAccessories
The present disclosure relates to a liner for storing a material, the liner including at least two layers, wherein a layer that is in contact with the material is an active layer. The active layer may be made active by incorporating a scavenger into the layer. At least one layer of the liner may comprise a polymer or a fluoropolymer. In some embodiments, the active layer may be configured for removing microbridging components in photoresists. In some embodiments, the active layer may be made active by coating the interior of the layer with an inert material, such as glass. In further embodiments, the liner may be positioned within a stainless steel canister. The present disclosure also relates to a liner-based assembly including a liner for storing a material, an overpack within which the liner is positioned, and a purifying packet positioned between the liner and the overpack.
B65D 81/24 - Adaptations for preventing deterioration or decay of contentsApplications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants
B65D 85/84 - Containers, packaging elements or packages, specially adapted for particular articles or materials for corrosive chemicals
The present disclosure relates to a blow-molded, rigid collapsible liner that can be suitable particularly for smaller storage and dispensing systems. The rigid collapsible liner may be a stand-alone liner, e.g., used without an outer container, and may be dispensed from a fixed pressure dispensing can. Folds in the rigid collapsible liner may be substantially eliminated, thereby substantially reducing or eliminating the problems associated with pinholes, weld tears, and overflow. The present disclosure also relates to systems and liners, including the liners just mentioned, that may be used as alternatives to, or replacements for, simple rigid- wall containers, such as those made of glass. Such advantageous systems and liners may replace simple rigid-wall containers in a system for delivering a high purity material to a semiconductor process substantially without modification to an end user's existing pump dispense or pressure dispense systems.
The present disclosure relates to novel and advantageous connector assemblies for use with a liner-based assembly. In one embodiment, a connector assembly for use with a liner-based assembly can include a pressure port, a dispense port, a headspace removal port, and a locking mechanism. The pressure port can be adapted for connection to a pressure source. The dispense port can be adapted for fluid communication with a source of material to be dispensed from the liner-based assembly. The headspace removal port may be configured for removing a gas from the liner-based assembly. The locking mechanism may be used for locking the connector to the liner-based assembly when contents therein are under pressure. In some embodiments, the dispense port and headspace removal port may be operably coupled providing a flow path for recirculation of the contents within a liner of the liner-based assembly.
B65D 85/84 - Containers, packaging elements or packages, specially adapted for particular articles or materials for corrosive chemicals
B65D 47/06 - Closures with discharging devices other than pumps with pouring spouts or tubesClosures with discharging devices other than pumps with discharge nozzles or passages
B65D 77/04 - Articles or materials enclosed in two or more containers disposed one within another
Cleaning compositions and processes for cleaning residue from a microelectronic device having said residue thereon. The composition comprises at least one amine, at least one oxidizing agent, water, and at least one borate species and achieves highly efficacious cleaning of the residue material, including post-ash residue, post-etch residue, post-CMP residue, particles, organic contaminants, metal ion contaminants, and combinations thereof from the microelectronic device while simultaneously not damaging the titanium nitride layers and low-k dielectric materials also present on the device.
A removal composition and process for selectively removing a first metal gate material (e.g., titanium nitride) relative to a second metal gate material (e.g., tantalum nitride) from a microelectronic device having said material thereon. The removal composition can include fluoride or alternatively be substantially devoid of fluoride. The substrate preferably comprises a high-k/metal gate integration scheme.
An apparatus is described, as including a reaction region for contacting a reactant gas with a reactive solid under conditions effective to form an intermediate product, and an opening for allowing an unreacted portion of the gaseous reagent and the intermediate product to exit the reaction region. The apparatus can be beneficially employed to form a final product as a reaction product of the intermediate product and the reactant gas. The reaction of the reactant gas and reactive solid can be conducted in a first reaction zone, with the reaction of the reactant gas and intermediate product conducted in a second reaction zone. In a specific implementation, the reaction of the reactant gas and intermediate product is reversible, and the reactant gas and intermediate product are flowed to the second reaction zone at a controlled rate or in a controlled manner, to suppress back reaction forming the reactive solid.
Methods of reducing the capillary forces experienced by fragile high aspect ratio structures during drying to substantially prevent damage to said high aspect ratio structures during drying. They include modifying the surface of the high aspect ratio structures such that the forces are sufficiently minimized and as such less than 10% of the high aspect ratio features will have bent or collapsed during drying of the structure having said features thereon.
H01L 21/302 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
77.
ISOTOPICALLY-ENRICHED BORON-CONTAINING COMPOUNDS, AND METHODS OF MAKING AND USING SAME
An isotopically-enriched, boron-containing compound comprising two or more boron atoms and at least one fluorine atom, wherein at least one of the boron atoms contains a desired isotope of boron in a concentration or ratio greater than a natural abundance concentration or ratio thereof. The compound may have a chemical formula of B2F4. Synthesis methods for such compounds, and ion implantation methods using such compounds, are described, as well as storage and dispensing vessels in which the isotopically-enriched, boron-containing compound is advantageously contained for subsequent dispensing use.
Processes for recycling electronic components removed from printed wire boards, whereby precious metals and base metals are extracted from the electronic components using environmentally friendly compositions. At least gold, silver and copper ions can be extracted from the electronic components and reduced to their respective metals using the processes and compositions described herein.
A solution for selectively etching copper or a copper alloy from a microelectronic device, wherein the device simultaneously includes copper or a copper alloy and nickel-containing material, the solution being an etching solution for copper or a copper alloy comprising a chelating agent having an acid group in a molecule, hydrogen peroxide, and a surfactant having an oxyethylene chain in a molecule.
Cleaning compositions and processes for cleaning post-plasma etch residue from a microelectronic device having said residue thereon. The composition achieves highly efficacious cleaning of the residue material, including titanium-containing, copper-containing, tungsten-containing, and/or cobalt-containing post-etch residue from the microelectronic device while simultaneously not damaging the interlevel dielectric, metal interconnect material, and/or capping layers also present thereon.
H01L 21/302 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
H01L 21/28 - Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups
A method of forming a dielectric material, comprising doping a zirconium oxide material, using a dopant precursor selected from the group consisting of Ti(NMe2)4; Ti(NMeEt)4; Ti(NEt2)4; TiCl4; tBuN=Nb(NEt2)3; tBuN=Nb(NMe2)3; t-BuN=Nb(NEtMe)3; t- AmN=Nb(NEt2)3; t-AmN=Nb(NEtMe)3; t-AmN=Nb(NMe2)3; t-AmN=Nb(OBu-t)3; Nb-13; Nb(NEt2)4; Nb(NEt2)5; Nb(N(CH3)2)5; Nb(OC2H5)5; Nb(thd)(OPr-i)4; SiH(OMe)3; SiCU; Si(NMe2)4; (Me3Si)2NH; GeRax(ORb)4.x wherein x is from 0 to 4, each Ra is independently selected from H or C1-C8 alkyl and each Rb is independently selected from C1-C8 alkyl; GeCl4; Ge(NRa2)4 wherein each Ra is independently selected from H and C1-C8 alkyl; and (Rb3Ge)2NH wherein each Rb is independently selected from C1-C8 alkyl; bis(N,N'-diisopropyl-1,3-propanediamide) titanium; and tetrakis(isopropylmethylamido) titanium; wherein Me is methyl, Et is ethyl, Pr-i is isopropyl, t-Bu is tertiary butyl, t-Am is tertiary amyl, and thd is 2,2,6,6-tetramethyl-3,5-heptanedionate. Doped zirconium oxide materials of the present disclosure are usefully employed in ferroelectric capacitors and dynamic random access memory (DRAM) devices.
H01L 21/8242 - Dynamic random access memory structures (DRAM)
H01L 27/108 - Dynamic random access memory structures
H01L 21/205 - Deposition of semiconductor materials on a substrate, e.g. epitaxial growth using reduction or decomposition of a gaseous compound yielding a solid condensate, i.e. chemical deposition
A system and method for recovering high value gas from a process stream, material or environment containing same, e.g., xenon by contacting gas from the process stream, material or environment with a carbon adsorbent effective to sorptively capture same, free of or with reduced concentration of fluid species present with the high value gas in the high value gas-containing gas in the process stream, material or environment. Other aspects of the disclosure include a radon detection method and product.
B01D 53/02 - Separation of gases or vapoursRecovering vapours of volatile solvents from gasesChemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases or aerosols by adsorption, e.g. preparative gas chromatography
B01J 20/20 - Solid sorbent compositions or filter aid compositionsSorbents for chromatographyProcesses for preparing, regenerating or reactivating thereof comprising inorganic material comprising free carbonSolid sorbent compositions or filter aid compositionsSorbents for chromatographyProcesses for preparing, regenerating or reactivating thereof comprising inorganic material comprising carbon obtained by carbonising processes
B01J 20/28 - Solid sorbent compositions or filter aid compositionsSorbents for chromatographyProcesses for preparing, regenerating or reactivating thereof characterised by their form or physical properties
Apparatus and method for determining endpoint of a fluid supply vessel in which fluid flow is controlled through a flow passage disposed in an interior volume of the fluid supply vessel with a static flow restricting device and a selectively actuatable valve element upon establishing fluid flow. The endpoint determination can be employed to terminate fluid supply from the fluid supply vessel and/or to switch from a fluid-depleted supply vessel to a fresh vessel for continuity or renewal of fluid supply operation. The apparatus and method are suitable for use with fluidutilizing apparatus such as ion implanters.
A chalcogenide alloy composition, having an atomic composition comprising from 34 to 45 % Ge, from 2 to 16 % Sb, from 48 to 55 % Te, from 3 to 15 % carbon and from 1 to 10 % nitrogen, wherein all atomic percentages of all components of the film total to 100 atomic %. Material of such composition is useful to form phase change films, e.g., as conformally coated on a phase change memory device substrate to fabricate a phase change random access memory cell.
C23C 16/44 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
85.
METHOD FOR RECYCLING OF OBSOLETE PRINTED CIRCUIT BOARDS
Processes for recycling printed wire boards using environmentally-friendly compositions, wherein electronic components, precious metals and base metals may be collected for reuse and recycling.
A cap for a container (e.g., container fitment) includes a neck portion and a lip portion that extends laterally outward from the neck portion. A gasket is provided between the cap and a rim of a container fitment. The neck portion is conical or frustoconical in shape, and an interior surface of a container port or fitment may be correspondingly tapered, to guide the cap into concentric alignment with the gasket and rim during insertion of the neck portion of the cap into the fitment. Such alignment promotes positive sealing engagement between the cap, gasket, and fitment. In one embodiment, the cap defines an externally accessible recess that optionally includes a handle, such as at least one segmenting wall, for grasping by a user to facilitate manipulation of the cap. The cap may be affixed to a fitment of a flexible liner.
B65D 39/16 - Closures arranged within necks or pouring openings or in discharge apertures, e.g. stoppers with handles or other special means facilitating manual actuation
B65D 39/04 - Cup-shaped plugs or like hollow flanged members
B65D 81/32 - Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents for packaging two or more different materials which must be maintained separate prior to use in admixture
B65D 25/08 - Partitions with provisions for removing or destroying, e.g. to facilitate mixing of contents
Phase change memory (PCM) device structures are described, in which the phase change material is seamless, thereby obviating void issues that are associated with decreased device performance. Such PCM device structures can be readily formed by a trench technique in which phase change material is conformally deposited on trench side wall and bottom surfaces, followed by removal of the phase change material from the bottom surface, deposition of a dielectric passivation layer and thereafter oxide and/or nitride material, followed by CMP to remove dielectric and oxide/nitride material, and expose top surfaces of the phase change material. A top electrode then is formed in contact with the exposed top surfaces of the phase change material to provide a top electrode/PCM device structure including the seamless PCM material.
Germanium antimony telluride materials are described, e.g., material of the formula GexSbyTezCmNn, wherein x is about 0.1-0.6, y is about 0-0.7, z is about 0.2-0.9, m is about 0.02-0.20, and n is about 0.2-0.20. One specific composition includes from 0 to 50% Sb, from 50 to 80% Te, from 20 to 50% Ge, from 3 to 20% N and from 2 to 15% carbon, wherein all atomic percentages of all components of the film total to 100 atomic %. Another specific composition includes from 10 to 50% Sb, from 50 to 80% Te, from 10 to 50% Ge, from 3 to 20% N and from 3 to 20% carbon, and wherein all atomic percentages of all components of the film total to 100 atomic %. Material of such composition is useful to form phase change films, e.g., as conformally coated on a phase change memory device substrate to fabricate a phase change random access memory cell.
C23C 16/30 - Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
H01L 45/00 - Solid state devices specially adapted for rectifying, amplifying, oscillating, or switching without a potential-jump barrier or surface barrier, e.g. dielectric triodes; Ovshinsky-effect devices; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof
G11C 13/00 - Digital stores characterised by the use of storage elements not covered by groups , , or
89.
Fluid storage and dispensing systems and processes
Fluid storage and dispensing systems and processes involving various structures methods for fluid storage and dispensing, including, pre-connect verification couplings that are usefully employed with fluid storage and dispensing packages to ensure proper coupling and avoid fluid contamination issues, empty detect systems (e.g., monitoring pressure of dispensed liquid medium to detect pressure droop conditions) useable with fluid storage and dispensing packages incorporating liners that are pressure-compressed in the fluid dispensing operation, ergonomically enhanced structures for facilitating removal of a dispense connector from a capped vessel, cap integrity assurance systems for preventing misuse of vessel caps, and keycoding systems for ensuring coupling of proper dispense assemblies and vessels. Fluid storage and dispensing systems achieve zero or near-zero headspace character, and prevent or ameliorate solubilization effects in liquid dispensing from liners in overpack vessels.
B67D 7/02 - Apparatus or devices for transferring liquids from bulk storage containers or reservoirs into vehicles or into portable containers, e.g. for retail sale purposes for transferring liquids other than fuel or lubricants
B67D 7/32 - Arrangements of safety or warning devicesMeans for preventing unauthorised delivery of liquid
B67D 7/34 - Means for preventing unauthorised delivery of liquid
90.
Closure/connector for liner-based dispense containers
The present disclosure relates to novel and advantageous closure/connector assemblies for use with a dispense assembly. The closure/connector includes a closure body as well as a cap seat adaptor for operable connection to the closure body. The cap seat adapter has a proximal end and a distal end and is configured for fluid communication with a source of material to be dispensed. The closure/connector also has a cap for connection to the distal end of the cap seat adaptor. A pressurizing gas inlet fitting adapted for connection to a pressure source is also included as a part of the closure/connector. The closure/connector assembly, in conjunction with the dispense assembly, is configured for the secure transport and dispense of the material to be dispensed.
G01F 11/00 - Apparatus requiring external operation adapted at each repeated and identical operation to measure and separate a predetermined volume of fluid or fluent solid material from a supply or container, without regard to weight, and to deliver it
91.
METHOD AND APPARATUS FOR ENHANCED LIFETIME AND PERFORMANCE OF ION SOURCE IN AN ION IMPLANTATION SYSTEM
An ion implantation system and process, in which the performance and lifetime of the ion source of the ion implantation system are enhanced, by utilizing isotopically enriched dopant materials, or by utilizing dopant materials with supplemental gas(es) effective to provide such enhancement.
A cleaning agent for a microelectronic device provided with metal wiring, which has an excellent ability to remove polishing particle residues derived from a polishing agent and an excellent ability to remove metallic residues on an insulating film, and has excellent anticorrosiveness to the metal wiring. The cleaning agent is used at a step subsequent to chemical mechanical polishing in a manufacturing process of a microelectronic device in which a metal wiring, e.g., copper or tungsten, is formed.
A ventilation gas management system and process for an enclosure adapted to contain fluid supply vessel(s) and through which ventilation gas is flowed to provide safe operation in the event of leakage of fluid from a vessel. Ventilation gas flow is modulated to accommodate various hazard levels associated with the deployment and operation of such enclosure containing fluid supply vessel(s), e.g., a gas box or gas cabinet in a semiconductor manufacturing facility, thereby achieving reduction in ventilation gas requirements otherwise required for such deployment and operation.
A dispensing assembly for a pressure dispense package includes a connector having separate and distinct liquid and extraction conduits, and having a pressurization gas conduit. A liner fitment adapter may include a longitudinal bore to receive a probe portion of a connector defining a liquid extraction conduit, and may include a lateral bore to enable removal of gas. Insertion of a connector into a dispensing assembly simultaneously makes fluidic connections between (a) a gas extraction conduit and a dispensing volume; (b) a liquid extraction conduit and the dispensing volume, and (c) a pressurization gas conduit and a space to be pressurized within a pressure dispense vessel. Presence of fluid or change in phase of flowing fluid within a fluid circuit may be sensed by comparing outputs of first and second temperature sensing elements, with one sensing element including a heater to increase temperature of the sensing element in exposure to gas but not in exposure to liquid. A system and method for fluid dispensing includes a first pressure dispense apparatus and a sensing element arranged to sense a condition correlative of approach to gas saturation of dispensed fluid, and in response to such sensed condition initiates dispensation by a second pressure dispense apparatus for combining pressure dispensed fluid flows supplied to a point of use.
B05B 7/24 - Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas with means, e.g. a container, for supplying liquid or other fluent material to a discharge device
B01J 4/00 - Feed devicesFeed or outlet control devices
B65D 81/00 - Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
95.
CONFIGURABLE PORT FITMENT, KIT, AND RELATED METHODS
A configurable port fitment includes an adapter for forming a locking engagement with a connector associated with a vessel. A kit and related methods may use the configurable port fitment.
A61J 1/14 - Containers specially adapted for medical or pharmaceutical purposes DetailsAccessories therefor
B65D 47/06 - Closures with discharging devices other than pumps with pouring spouts or tubesClosures with discharging devices other than pumps with discharge nozzles or passages
Methods for removing a masking material, for example, a photoresist, and electronic devices formed by removing a masking material are presented. For example, a method for removing a masking material includes contacting the masking material with a solution comprising cerium and at least one additional oxidant. The cerium may be comprised in a salt. The salt may be cerium ammonium nitrate. The at least one additional oxidant may be a manganese, ruthenium, and/or osmium-containing compound.
An ion implantation system and method, providing cooling of dopant gas in the dopant gas feed line, to combat heating and decomposition of the dopant gas by arc chamber heat generation, e.g., using boron source materials such as B2F4 or other alternatives to BF3. Various arc chamber thermal management arrangements are described, as well as modification of plasma properties, specific flow arrangements, cleaning processes, power management, eqillibrium shifting, optimization of extraction optics, detection of deposits in flow passages, and source life optimization, to achieve efficient operation of the ion implantation system.
H01J 37/317 - Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. ion implantation
H01L 21/265 - Bombardment with wave or particle radiation with high-energy radiation producing ion implantation
98.
METHODS OF TEXTURING SURFACES FOR CONTROLLED REFLECTION
Novel methods for the texturing of photovoltaic cells is described, wherein texturing minimizes reflectance losses and hence increases solar cell efficiency. In one aspect, a microstamp with the mirror inverse of the optimum surface structure is described. The photovoltaic cell substrate to be etched and the microstamp are immersed in a bath and pressed together to yield the optimum surface structure. In another aspect, nanoscale structures are introduced to the surface of a photovoltaic cell by depositing nanoparticles or introducing metal induced pitting to a substrate surface. In still another aspect, remote plasma source (RPS) or reactive ion etching (RIE), is used to etch nanoscale features into a silicon-containing substrate.
The present disclosure relates to systems and methods which include a material receiving chamber for receiving a material (e.g., fluid containing medium) and an evacuable chamber configured to have vacuum applied thereto, and are configured to eliminate or at least reduce microbubble formation, eliminate or at least reduce unwanted diffusion of gas into the fluid containing medium being stored/dispensed, and/or remove at least a portion of gas or air bubbles entrained or dissolved in the fluid containing medium. Also disclosed are methods for controlling or reducing the concentration of gas in the material which may be subjected to external pressure during storage and/or dispensing.
An apparatus for use in material processing takes the form of a vessel including a wall at least partially formed of a flexible film. The film includes at least two layers having an anti-static agent and sandwiching an intermediate layer. Related methods are also disclosed.
