A film laminate that can achieve sufficient sterilization effects and does not have the risk of damaging the film surface structure is provided. A film laminate 1 includes a plurality of film-shaped members 2 laminated in a separable manner, and columnar protruding members 5 protruding in the direction of lamination of the film-shaped members 2 and holding the film-shaped members 2 at a predetermined interval, wherein the protruding members 5 have engagement portions on the outer circumference of the protruding members 5 to which the film-shaped members 2 are engaged at the predetermined interval, the film-shaped members 2 have insertion holes 4 through which the protruding members 5 are inserted and removed as desired, and the film-shaped members 2 are held at the predetermined interval and laminated by the protruding members 5 being inserted through the insertion holes 4 and the film-shaped members 2 being engaged with the engagement portions.
A high refractive index curable composition contains a polyfunctional (meth)acrylate compound (A) represented by general formula (1), a monofunctional (meth)acrylate compound (B) having a naphthalene skeleton, and a polymerization initiator.
A high–refractive index curable composition according to the present invention contains a polyfunctional (meth)acrylate compound (A) that is represented by general formula (1), a monofunctional (meth)acrylate compound (B) that has a naphthalene skeleton, inorganic nanoparticles, and a polymerization initiator.
Provided is a cured film having good frost resistance and water resistance. A laminate 1 includes an adherend 2 and a cured film 3 formed on the adherend 2. The cured film 3 is a cured product of a resin composition containing a monofunctional monomer, a polyfunctional monomer, and a radical polymerization initiator. After the laminate 1 is taken out from -40°C to room temperature (25°C, 40% RH), the frost adhesion area on a surface of the cured film 3 is less than 30% when the thickness is 5 μm or more.
C09D 4/00 - Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
C09K 3/18 - Materials not provided for elsewhere for application to surface to minimize adherence of ice, mist or water theretoThawing or antifreeze materials for application to surfaces
F21S 41/275 - Lens surfaces, e.g. coatings or surface structures
F21S 45/00 - Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
G01S 7/481 - Constructional features, e.g. arrangements of optical elements
F21W 102/00 - Exterior vehicle lighting devices for illuminating purposes
The micro-lens array is a micro-lens array in which a plurality of micro-lenses are arranged in a matrix in a plan view, wherein each of the plurality of micro-lenses has four main sides in a plan view, and each of the four main sides is inclined with respect to a row virtual line parallel to a row direction or a column virtual line parallel to a column direction.
G02B 27/00 - Optical systems or apparatus not provided for by any of the groups ,
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
6.
WAVEPLATE, WAVELENGTH SELECTION SWITCH, OPTICAL BRANCH INSERTION DEVICE, AND METHOD FOR MANUFACTURING WAVEPLATE
Provided is a waveplate comprising: a transparent substrate; a pattern layer that is patterned on the transparent substrate; a first cured resin layer that is formed on at least a part of the outer periphery of the pattern layer on the transparent substrate; and a second cured resin layer that is formed in a region on the transparent substrate, said region being further to the inner side than the first cured resin layer where the pattern layer is not formed. The pattern layer has a retardation film.
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
7.
ADHESIVE FILM, AND CONNECTION STRUCTURE AND METHOD FOR PRODUCING SAME
An adhesive film according to the present invention exhibits rapid low-temperature curability, good adhesive strength, and good connection reliability, and can be stably slit into narrow widths and also has good temporary adhesiveness. This adhesive film has a base material film on which a release treatment has been executed, and has an insulating resin layer that is provided on the base material film and that exhibits radical polymerizability and anionic polymerizability. The adhesive film has a film width of not more than 1.0 mm or not more than 0.8 mm, and has a length of at least 5 m. The insulating resin layer contains: a film-forming component containing two types of film components having different molecular weights; a radical-polymerizable component containing a first acrylic compound; an anionic polymerizable component containing an epoxy compound; a radical polymerization initiator containing an organic peroxide having a one-minute half-life temperature of not more than 125°C; and an anionic polymerization curing agent containing an organic acid hydrazide compound that is a solid at ordinary temperatures.
C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between their connecting locations
The present invention provides a protective element which can interrupt a current pathway quickly and reliably using a fusible conductor having a high-melting-point metal layer and a low-melting-point metal layer, and which can also be manufactured through a simple process. A protective element (1) comprises an insulating substrate (2), a heating element (5), first and second electrodes (3, 4), a heating element lead electrode (6), and a fusible conductor (7) that melts, and thus interrupts a current pathway, due to self-heating and/or heating by the heating element (5) caused by application of an overcurrent exceeding the rated current, wherein the fusible conductor (7) has a laminated structure of a high-melting-point metal layer (10) and a second low-melting-point metal layer (12), the fusible conductor (7) is connected on top of the first electrode (3), on top of the second electrode (4), and on top of the heating element lead electrode (6) via the second low-melting-point metal layer (12) in an orientation such that the second low-melting-point metal layer (12) faces the insulating substrate (2), with at least part of the second low-melting-point metal layer (12) being in direct or indirect contact with the insulating substrate (2) in the space between the first electrode (3) and the heating element lead electrode (6) and in the space between the second electrode (4) and the heating element lead electrode (6).
H01H 37/76 - Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
9.
THERMOSETTING ADHESIVE COMPOSITION, THERMOSETTING ADHESIVE SHEET, AND PRINTED WIRING BOARD
Provided is a thermosetting adhesive composition having a low dielectric constant and a low dielectric loss tangent even after thermosetting, a low temperature change rate of a dielectric loss tangent, and favorable bending resistance. The present technique is a thermosetting adhesive composition for bonding substrates, the thermosetting adhesive composition comprising, with respect to 100 parts by mass of the total amount of the thermosetting adhesive composition: 65-90 parts by mass of a styrene-based elastomer; 5-20 parts by mass of (A) a modified polyphenylene ether resin having a radically polymerizable group at the molecular terminal thereof and 4-10 parts by mass of (B) a polybutadiene and/or polyisoprene having a weight-average molecular weight of 10,000-50,000, as crosslinking components; a radical polymerization initiator; and an epoxy resin, wherein the total content of the radical polymerization initiator, the epoxy resin, and an epoxy resin curing agent is at most 10 parts by mass, a styrene-based elastomer having a styrene ratio of less than 67% is contained as the styrene-based elastomer, and the total of the content of the (A) component and the content of the (B) component is at most 25 parts by mass.
Provided is a method for manufacturing a connection structure that makes it possible to mount electronic parts at a high density by using a connection film with insufficient printing (blur) in an adhesive layer. The method for manufacturing a connection structure, in which first terminals 5 of a first electronic part 3 having the first terminals 5 and second terminals 6 of a second electronic part 4 having the second terminals 6 are connected via a cured film 11A obtained by curing an adhesive layer 11 of a connection film 2, involves: a pasting step for pasting the adhesive layer 11 of the connection film 2 to the first electronic part 3; a placement step for placing the second terminals 6 on the first terminals 5 with the adhesive layer 11 therebetween; and a connection step for pressing the second electronic part 4 and curing the adhesive layer 11. The adhesive layer 11 has a body 12 that has a prescribed thickness and tapered inclination parts that are formed on both end sides of the body 12 in the width direction. In the pasting step, the pasting is performed while aligning the body 12 with the first terminals 5 in the width direction of the adhesive layer 11.
H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between their connecting locations
H01R 43/00 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
H05K 1/14 - Structural association of two or more printed circuits
H05K 1/18 - Printed circuits structurally associated with non-printed electric components
A cell culturing method comprising culturing hematopoietic stem cells or hematopoietic progenitor cells, or both the hematopoietic stem cells and the hematopoietic progenitor cells with their undifferentiated state maintained using a device for cell culture. The device includes a base material having a culture section with a plurality of pores, wherein the culture section has a Young's modulus of at least 3 GPa measured according to JIS K 7161-1.
A light receiving device includes a first light-receiving element and a second light-receiving element, each including a semiconductor substrate including a light receiving region, and a support substrate including a supporting surface supporting the first light-receiving element and the second light-receiving element. The semiconductor substrate of the first or second light-receiving element includes a main surface including the light receiving region, a back surface on an opposite side of the main surface in a perpendicular direction, and a recess sunk from the back surface towards the main surface. The other semiconductor substrate of the first light-receiving element or second light-receiving element is disposed inside the recess. An angle θ formed between a side surface of the recess and the supporting surface is 75° or greater and 105° or less, where the side surface is continuous from an opening edge of the recess to a bottom surface of the recess.
H10F 77/14 - Shape of semiconductor bodiesShapes, relative sizes or dispositions of semiconductor regions within semiconductor bodies
H10F 30/22 - Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes
Provided is an apparatus for treating an exhaust gas containing hydrogen sulfide, the apparatus comprising: a combustion furnace configured to combust the hydrogen sulfide contained in the exhaust gas to convert the hydrogen sulfide into sulfur dioxide; and a scrubber configured to convert the sulfur dioxide produced in the combustion furnace into a sulfite by contacting the sulfur dioxide with an alkaline aqueous solution. The combustion furnace comprises a first introduction pipe for introducing the exhaust gas, a second introduction pipe for introducing a combustible gas and a combustion supporting gas, and a combustion chamber connected to the first introduction pipe and the second introduction pipe, and a component constituting the combustion chamber has a surface including quartz glass on an inside of the combustion chamber.
An optical reception module (3) according to the present invention comprises a first substrate (30), a second substrate (40) that is disposed on the first substrate (30), a light-receiving element (50) that is disposed on the second substrate (40) and that converts an optical signal into an electrical signal, and an amplifier (60) that is disposed on the second substrate (40) and that amplifies the electrical signal inputted from the light-receiving element (50). The second substrate (40) is provided with a transmission line (70) that transmits the amplified signal outputted from the amplifier (60) to the first substrate (30), and the light-receiving element (50) is positioned on one side of a center line (C40) on the second substrate (40), said center line (C40) being a virtual line segment passing through the center of the second substrate (40) in plan view. The amplifier (60) is positioned on the center line (C40) or between the center line (C40) and the light-receiving element (50).
Provided is a polarizer comprising: a transparent substrate; and lattice protrusions that are arranged on one surface of the transparent substrate at a pitch shorter than a wavelength of light in an allocated band and that extend in a predetermined direction. The lattice protrusions each comprise, in order from the transparent substrate: a reflective layer; a dielectric layer; and an absorption layer; and a water repellent film on which areas treated with a plurality of different water-repellent treatment agents exist non-uniformly is formed on surfaces of the lattice protrusions and a surface of the transparent substrate on which the lattice protrusions are arranged.
Provided is a polarization element including a transparent substrate and lattice-shaped convex portions, the lattice-shaped convex portions being arranged on one surface of the transparent substrate at a pitch shorter than a wavelength of light in a use band and extending in a predetermined direction and having a reflection layer and an absorption layer, in this order from a side of the transparent substrate; a width of the absorption layer being substantially the same as a width of the reflection layer on a side facing the absorption layer; in a cross-sectional view from a direction in which the lattice-shaped convex portions extend, a central plane passing through a center in a width direction of the absorption layer being spaced apart from a central plane passing through a center in a width direction of the reflection layer by a predetermined distance.
22 as a main component, and an antifouling layer formed on the low-refractive-index layer, the method comprising: a high-refractive-index layer forming step; a low-refractive-index layer forming step for forming a low-refractive-index layer in a dry atmosphere; a plasma treatment step for performing plasma treatment on the low-refractive-index layer; and an antifouling layer forming step for forming an antifouling layer on the surface, wherein in the plasma processing step, the low-refractive-index layer is subjected to plasma treatment at an electrode power density of 4,400 W/m2to 18,000 W/m222 as measured by X-ray photoelectron spectroscopy (ESCA) from the antifouling layer side is 103.25 eV or less.
The present invention provides an infrared sensor cover 7 for covering an infrared sensor that uses infrared rays to measure the distance to an object of measurement, said cover comprising a base material 10 and a microasperity structure 11 which is provided on at least one surface of a base material 19 and which has a plurality of raised parts 12 arranged at a pitch P no greater than the wavelength λ of the infrared rays, wherein the infrared sensor cover 7 is disposed on the infrared sensor so as to allow the infrared rays to be incident on the infrared sensor cover 7 from a direction inclined relative to the surface of the infrared sensor cover 7, and the ratio (H/λ) of the height H of the raised parts 12 to the wavelength λ is 0.5 or greater.
G02B 1/118 - Anti-reflection coatings having sub-optical wavelength surface structures designed to provide an enhanced transmittance, e.g. moth-eye structures
H10F 55/00 - Radiation-sensitive semiconductor devices covered by groups , or being structurally associated with electric light sources and electrically or optically coupled thereto
19.
SURFACE TREATMENT METHOD AND SURFACE-TREATED SUBSTRATE
A surface treatment method according to the present invention comprises: a step for forming a coating film of an organosilicon compound on the surface of a substrate; a step for heating the substrate; a step for bringing the coating film into contact with a medium containing water to form a water-repellent treatment layer; and a step for drying the water-repellent treatment layer.
B05D 7/24 - Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
B05D 3/10 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by other chemical means
C08J 3/16 - Powdering or granulating by coagulating dispersions
The latent curing agent contains porous particles holding a curing catalyst, and the porous particles contain a crosslinkable vinyl polymer and an alpha-olefin copolymer.
C08L 23/00 - Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bondCompositions of derivatives of such polymers
21.
METHOD FOR MANUFACTURING SMART CARD, SMART CARD, AND CONDUCTIVE PARTICLE-CONTAINING HOT-MELT ADHESIVE SHEET
A method for manufacturing a smart card capable of achieving excellent connection reliability and bending resistance, a smart card, and a conductive particle-containing hot-melt adhesive sheet. A conductive particle-containing hot-melt adhesive sheet containing solder particles of a non-eutectic alloy in a binder containing a crystalline polyamide having a carboxyl group is interposed between a card member and an IC chip and subjected to thermocompression bonding. The crystalline polyamide having a carboxyl group improves the solder wettability of the non-eutectic alloy, thereby achieving excellent connection reliability. This effect is considered to be a flux effect due to the carboxyl group present in the crystalline polyamide, and as a result, it is possible to prevent the decrease in the elastic modulus of the adhesive layer which would be caused by the addition of a flux compound and to achieve excellent bending resistance.
B29C 65/00 - Joining of preformed partsApparatus therefor
B29C 65/48 - Joining of preformed partsApparatus therefor using adhesives
B29L 17/00 - Carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records
C09J 5/06 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
C09J 7/10 - Adhesives in the form of films or foils without carriers
H01B 1/20 - Conductive material dispersed in non-conductive organic material
H01B 5/16 - Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
H05K 3/36 - Assembling printed circuits with other printed circuits
23.
MASTER, TRANSFERRED OBJECT, AND METHOD OF PRODUCING MASTER
Provided are a master in which a more complicated microstructure is formed, a transferred object obtained by using the master, and a method of producing the master. A plurality of concave-convex groups each including a plurality of concavities or convexities are provided on a base material apart from each other. Average widths of areas occupied by the concavities or convexities at a surface of the base material are smaller than or equal to a wavelength belonging to a visible light band. Formed lengths of the concavities or convexities from the surface of the base material in each of the concave-convex groups each belong to any of at least two or more groups having different central values.
In a filler-containing film in which fillers are dispersed in a resin layer, an unnecessary flow movement of the fillers due to an unnecessary flow movement of the resin layer is suppressed at the time when the filler-containing film is bonded to an article by pressure bonding. A filler-containing film includes a filler dispersion layer in which fillers are dispersed in a resin layer. In the filler dispersion layer, the surface of the resin layer in the vicinity of the fillers includes inclinations or undulations with respect to a tangent plane to a central portion of the surface of the resin layer between adjacent fillers. The CV value of the particle diameter of these fillers is not greater than 20%.
B32B 27/18 - Layered products essentially comprising synthetic resin characterised by the use of special additives
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
H01B 5/16 - Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between their connecting locations
H01R 43/00 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
Provided are: a structure manufacturing method with which a fine textured structure is easily formed only on a desired portion of a substrate without a curable resin protruding from the periphery thereof; and said structure. The structure manufacturing method comprises: a modification step for forming a non-modified portion 10 and a modified portion 20 on a surface of a substrate 101; an application step for applying a curable resin to the surface; a structure formation step for forming a fine textured structure in the curable resin applied to the substrate 101; a curing step for curing the curable resin; and a removal step for removing a cured product of the curable resin applied to the non-modified portion 10.
G02B 1/118 - Anti-reflection coatings having sub-optical wavelength surface structures designed to provide an enhanced transmittance, e.g. moth-eye structures
B29C 59/02 - Surface shaping, e.g. embossingApparatus therefor by mechanical means, e.g. pressing
A screen is configured to receive and reflect projected light at a light-receiving surface in a state in which the screen is placed upright. The screen includes the light-receiving surface. The light-receiving surface includes a mirror array A in which multiple mirrors A are arranged in a first direction, and a mirror array B that is positioned in a second direction crossing the first direction and in which multiple mirrors B are arranged in the first direction. The mirrors A and the mirrors B are tilted in the same direction at the light-receiving surface.
G03B 21/60 - Projection screens characterised by the nature of the surface
G02B 27/18 - Optical systems or apparatus not provided for by any of the groups , for optical projection, e.g. combination of mirror and condenser and objective
A protective element includes a fuse element having a cut portion between a first end portion and a second end portion and electrified in a first direction from the first end portion toward the second end portion; a movable member, having a projection portion, and a recessed member having a recessed portion allowing the projection portion to be inserted therein, which are disposed facing each other such that the cut portion is sandwiched therebetween; and a pressing means applying a force so as to shorten a relative distance in a direction in which the cut portion is sandwiched between the movable member and the recessed member. The cut portion is cut due to the force of the pressing means at a temperature equal to or higher than a softening temperature of the fuse element. The cut portion of the fuse element has one of or both a penetration hole and a thin portion in at least part thereof.
H01H 85/10 - Fusible members characterised by the shape or form of the fusible member with constriction for localised fusing
H01H 37/76 - Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
H01H 85/36 - Means for applying mechanical tension to fusible member
28.
METHOD FOR MANUFACTURING METAL MEMBER, AND MOLD MEMBER
A method for manufacturing a metal member according to the present disclosure includes: a step for making a laminate, in which a mask layer is formed on a conductive substrate, the mask layer having a groove with a desired shape for exposing the conductive substrate ; a step for plating to form a metal layer, which is made of a prescribed metal, on the laminate by electroplating; and a step for isolating the metal layer, which has been formed in the groove, from the laminate after the plating.
In the present invention, a wire grid polarization element 1 comprises: a substrate 10 made of an inorganic material; a grid structure 20 in which a plurality of projecting strip sections 22 are integrally formed with a base part 21 which is made of an organic material and provided on the substrate 10; and a functional film 30 which is made of a metal material and covers a part of a projecting strip section 22. The organic material is a cured product of a photocurable acrylic resin for imprinting, which contains a photopolymerizable component. The photopolymerizable component contains a resin (A) and a resin (B). The resin (A) is a monofunctional acrylate monomer having a phenyl group and/or a benzyl group. The resin (B) is a difunctional compound. The content of the resin (A) is 20-42 mass% relative to the overall photopolymerizable component. The content of the resin (B) is 43-66 mass% relative to the overall photopolymerizable component.
Provided is a structure with which a water-repellent function can be imparted with ease, optical characteristics of a sensor device can be maintained, and also replacement can be easily performed on the sensor device. Provided is a structure 100, which is attached to the outer surface of a sensor device 400, the outer surface having a curved shape, the structure comprising a base 101 and micro dip/bump-structured layers each arranged on one of the two surfaces of the base 101. The micro dip/bump-structured layers are constituted by a first micro dip/bump-structured layer 102 positioned on the sensor device 400 side, and a second micro dip/bump-structured layer 103 positioned on the opposite side from the sensor device 400 side. The second micro dip/bump-structured layer 103 has water repellency. The structure 100 has a three-dimensional shape following the curved shape of said outer surface.
G02B 1/118 - Anti-reflection coatings having sub-optical wavelength surface structures designed to provide an enhanced transmittance, e.g. moth-eye structures
G02B 1/18 - Coatings for keeping optical surfaces clean, e.g. hydrophobic or photo-catalytic films
32.
WIRE GRID POLARIZING ELEMENT, METHOD FOR MANUFACTURING WIRE GRID POLARIZING ELEMENT, PROJECTION DISPLAY DEVICE, AND VEHICLE
A wire grid polarizing element 1 comprises: a substrate 10; a grid structure 20 in which a base 21 and a plurality of projections 22 are integrally formed; a functional film 30 that covers a portion of the projections 22; and a reinforcement film 51. The reinforcement film 51 is made of an inorganic oxide, is interposed between the functional film 30 and a portion of the projections 33 covered with the functional film 30, and reinforces the projections 22. The reinforcement film 51 envelopes at least tips 22a and the upper sides of both side-surfaces 22b of the projections 22. The functional film 30 envelopes the tops of the projections 22 with the reinforcement film 51 therebetween while not covering the bottom sides of the projections 22 and the base 21, and the coverage (Rc) thereof is 30-70%.
An individualized piece-processed adhesive film, a method for manufacturing a connection structure, and a connection structure capable of improving adhesive strength with respect to a substrate on which a component is mounted. An individualized piece-processed adhesive film includes individualized pieces having, with respect to a substrate on which a component is mounted, an opening to surround the component, the individualized pieces being arranged in the longitudinal direction of a base material film. A method for manufacturing a connection structure is to connect terminals of the first electronic component to terminals of the second electronic component by using an individualized piece with an opening to surround a component with respect to the substrate on which the component is mounted. This improves the adhesive strength.
According to one aspect of the present invention, what is provided is a photocatalyst member in which a photocatalyst layer is formed on a substrate via an underlayer, the underlayer contains at least cerium oxide, and the photocatalyst layer contains at least titanium oxide. Here, the underlayer may be composed solely of the cerium oxide or composed of the cerium oxide and at least one or more other elements at 10 atomic % or less of an elemental cerium proportion. According to the present invention, it is possible to produce a highly productive photocatalyst industrially.
B01J 21/06 - Silicon, titanium, zirconium or hafniumOxides or hydroxides thereof
B01J 23/10 - Catalysts comprising metals or metal oxides or hydroxides, not provided for in group of rare earths
B01J 31/38 - Catalysts comprising hydrides, coordination complexes or organic compounds containing in addition, inorganic metal compounds not provided for in groups of titanium, zirconium or hafnium
B01J 35/30 - Catalysts, in general, characterised by their form or physical properties characterised by their physical properties
A long film capable of maintaining the performance of individualized pieces of adhesive film and a method for manufacturing a connection structure. A long film has a long base material film and individualized pieces of adhesive film arranged in the longitudinal direction of the base material film, and an identification mark is provided on at least one of the predetermined individualized pieces or the base material film on which the predetermined individualized pieces are arranged. This allows defective individualized pieces to be avoided by identifying the identification mark when the individualized pieces are used, thereby maintaining the performance of the adhesive film individualized pieces.
The curable composition contains an oligomer complex. The oligomer complex is obtained by coordinating a ligand to a metal alkoxide oligomer, and the number average molecular weight of the metal alkoxide oligomer is 500 or more.
An optical laminate in which a transparent substrate, a hard coat layer, an optically functional layer, and an antifouling layer are sequentially stacked is provided. The hard coat layer includes fillers, has a thickness of greater than 1.0 μm and less than 3.0 μm, and a 10-point mean roughness Rz of a surface of the optical laminate is equal to or greater than 19 nm and equal to or less than 100 nm.
A protective element includes: a first fuse element part including a first fuse element; a second fuse element part including a second fuse element; an insulating enclosure having a fusing space in which the first fuse element is positioned and a cutting space in which the second fuse element is positioned; and a slider disposed to be movable within the fusing space toward a second fuse element side. The fusing space is divided into a first space and a second space which interpose the slider, the first fuse element being positioned in the first space, and a second space being connected to the cutting space. When a fusion current flows to the first fuse element, and as pressure in the first space rises, the slider is configured to move toward a second fuse element side such that a cutting part of the slider cuts the second fuse element.
H01H 37/76 - Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
H01H 85/041 - Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
H01H 85/06 - Fusible members characterised by the fusible material
Provided is a waveplate comprising: a transparent substrate; a pattern layer that is patterned on the transparent substrate; and a cured resin layer that is formed in a region on the transparent substrate where the pattern layer is not formed. The pattern layer has a retardation film. When the main refractive index of the retardation film is Nx, Ny, and the refractive index of the cured resin layer is Nr, formula Nx > Nr > Ny is satisfied.
This protection element is equipped with: a fuse element which conducts electricity in a first direction from a first end section toward a second end section; a shield member; and a case, the interior of which is provided with a storage section for storing the fuse element and the shield member. The shield member has a plate-shaped part which is positioned in a manner such that a first surface thereof faces the fuse element and a second surface thereof contacts a rotating shaft which extends in a second direction which intersects the first direction. The surface area of the plate-shaped part when viewed from the fuse element is configured in a manner such that a first surface area and a second surface area, which are obtained by dividing at the contact location between the plate-shaped part and the rotating shaft, differ from one another.
H01H 85/38 - Means for extinguishing or suppressing arc
H01H 85/00 - Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
H01H 85/06 - Fusible members characterised by the fusible material
H01H 85/10 - Fusible members characterised by the shape or form of the fusible member with constriction for localised fusing
H01H 85/17 - Casings characterised by the casing material
H01H 85/175 - Casings characterised by the casing shape or form
This protective element comprises a second conductor (312) and a first conductor (211) having at least one first tip portion (211a). The first tip portion (211a) has a shape in which the cross-sectional area decreases from the root toward the tip. At least part of the first tip portion (211a) and at least part of the second conductor (312) are connected to a fusible conductor (13) having a lower fusing temperature than each of the first conductor (211) and the second conductor (312).
This hard coat film comprises a transparent base material and a hard coat layer formed on the transparent base material, wherein the hard coat layer contains a filler and has a black luminance, measured under the following conditions, of less than 5.0 × 10-4cd/m2. (Conditions: The hard coat film is provided adhering to an organic EL display having a light emission angle of 180 degrees and a luminance of 360 cd/m2; a white region and a black region are displayed in a checkerboard pattern at the organic EL display; a shielding plate is provided so as to cover the surface except for the black region of the organic EL display; and the black luminance for the black region is measured by a spectroradiometer provided at a distance of 60 cm from the organic EL display.)
G02B 1/14 - Protective coatings, e.g. hard coatings
B32B 27/20 - Layered products essentially comprising synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
This anisotropic conductive film does not hamper low-temperature rapid curing properties, has a reaction rate that does not fall bellow 80% after anisotropic conductive connection, and does not cause problems with conductive properties or adhesive strength even when an organic peroxide with a one-minute half-life temperature of 120°C or higher is used as a radical polymerization initiator. The anisotropic conductive film has a conductive particle-containing layer containing a film-forming resin, a radical polymerizable compound, a radical polymerization initiator, conductive particles, and a filler. An organic peroxide having a half-life temperature of 132°C or higher is used as the radical polymerization initiator. 5-24 mass% of non-conductive particles having a thermal conductivity of 30 W/m·K or more and an average particle size equal to or less than that of the conductive particles are used in the conductive particle-containing layer as the filler.
H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between their connecting locations
H01B 5/16 - Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
H01R 43/00 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
A protective element includes: an insulating substrate; a heat-generating body disposed on either one face side or the other face side of the insulating substrate; a first electrode and a second electrode disposed on the other face side of the insulating substrate; an extraction electrode disposed between the first electrode and the second electrode and electrically connected to one end side of the heat-generating body; a third electrode electrically connected to the other end side of the heat-generating body; and a fusible conductor disposed on a face of the first electrode, the second electrode, and the extraction electrode. A surface area of the fusible conductor disposed on a face of the extraction electrode is smaller than each of a surface area of the fusible conductor disposed on a face of the first electrode and a surface area of the fusible conductor disposed on a face of the second electrode.
The present invention provides a method for producing an individualized film in which a curing reaction is prevented and which makes it possible to achieve excellent shape precision. The present invention also provides an individualized film, a method for producing a connection structure, and a connection structure. A curable resin film is irradiated with an ultrashort pulse laser beam so as to be subjected to lithography and individualized to an individualized film having a prescribed shape. The pulse width of the ultrashort pulse laser beam is preferably 10-1,000 fs, and the fluence of 1 pulse of the ultrashort pulse laser beam is preferably 0.1-1 J/cm2. This makes it possible to prevent a curing reaction and achieve excellent shape precision.
H01R 43/00 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between their connecting locations
Provided is a protecting device with a built-in heat generator that can handle higher voltages and higher currents and blows the current path more safely and quickly without causing damage inside the device. The protecting device includes: a fuse element 2 and a blowing member 3, and the blowing member 3 includes an insulating substrate 4, a heat generator 5, an insulating layer 6 covering the heat generator 5, a heat-generator lead-out electrode 7 superimposed with the heat generator 5 via the insulating layer 6, and a heat-dissipating portion 8 formed on the front surface 4a side of the insulating substrate 4 at least in an area superimposed with the heat generator 5 and is electrically independent from the heat-generator lead-out electrode 7, a holding electrode 10 formed on the back surface 4b of the insulating substrate 4 and holds the melted conductor 2a of the fuse element 2, and a through-hole 11 connecting the heat-generator lead-out electrode 7 and the holding electrode 10, the fuse element 2 being connected to the holding electrode 10.
H01H 37/76 - Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
H01H 37/34 - Means for transmitting heat thereto, e.g. capsule remote from contact member
H02J 7/00 - Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
49.
METHOD FOR MANUFACTURING MASTER, METHOD FOR MANUFACTURING TRANSFERRED OBJECT, METHOD FOR MANUFACTURING REPLICA MASTER, AND APPARATUS FOR MANUFACTURING MASTER
A pattern of a concave-convex structure having any three-dimensional shape is formed on an outer circumferential surface of a master with high accuracy. Provided is a method for manufacturing a master, including the steps of forming a resist layer on an outer circumferential surface of a base member, dividing an input image in which an object having a three-dimensional shape is two-dimensionally drawn into a plurality of small regions, determining in a stepwise manner an intensity of laser light to be radiated to each of the small regions based on a contrasting density of a partial image of the object in each of the small regions in which the object is included, and generating an exposure control signal corresponding to the object based on a result of the determining of the intensity of the laser light, radiating the laser light to the resist layer based on the exposure control signal, thereby forming a resist pattern that changes in depth in accordance with the contrasting density of the partial image, and forming a concave-convex pattern corresponding to the three-dimensional shape of the object on the outer circumferential surface of the base member using the resist layer as a mask.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
Provided is a wire grid polarizing element excellent in heat dissipation and excellent in transmissivity and polarization splitting properties for oblique incident light at wide-range incident angles. A wire grid polarizing element 1 includes a substrate 10 made of an inorganic material, a grid structural body 20 made of an organic material and including a base part 21 provided on the substrate 10 and a plurality of ridge portions 22, the base part and the ridge portions being integrally formed, and a functional film 30 made of a metal material and covering part of the ridge portion 22. The ridge portion 22 has an upward narrowing shape that narrows in width with distance from the base part 21. The functional film 30 covers and wraps the top of the ridge portion 22, and does not cover a bottom side of the ridge portion 22 and the base part 21. A coverage rate (Rc) of the side surface of the ridge portion 22 obtained by the functional film 30 is more than or equal to 30% and less than or equal to 70%. The organic material is a cured product of a light curing acrylic resin for imprinting containing a photopolymerization component.
A solder particle manufacturing method includes a curing step of curing solder particles such that a hardness K of the solder particles under compressive deformation to 70% is 850 N/mm2 or greater and 1,500 N/mm2 or less, and a classifying step of classifying the solder particles after being cured by forcibly generating an airflow using a classifying device.
A protective element having a fuse element laminated body, an insulating case housing the fuse element laminated body, a first terminal, and a second terminal, wherein the fuse element laminated body includes a plurality of fusible conductor sheets arranged in parallel in a thickness direction and a first insulating member disposed between each of the plurality of fusible conductor sheets, either in proximity to, or in contact with, the fusible conductor sheets; each of the plurality of fusible conductor sheets has a mutually opposing first end section and second end section; one end of the first terminal is connected to the first end section while the other end of the first terminal is exposed outside the insulating case; and one end of the second terminal is connected to the second end section while the other end of the second terminal is exposed outside the insulating case.
A curable composition that includes a polymerizable monomer, an aluminum chelate compound, a silanol compound, and a quaternary boron-containing onium salt.
C08L 35/00 - Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereofCompositions of derivatives of such polymers
A method for manufacturing a connection film achieves high productivity. The method includes printing an adhesive in a predetermined shape on a mold release film, and forming a connection film of a predetermined shape on the mold release film. A plurality of connection films of the predetermined shape are formed in the width direction of the mold release film, the mold release film is cut in the longitudinal direction at a predetermined width, a plurality of mold release films of the predetermined width are connected in the longitudinal direction, and the connected mold release films of the predetermined width are wound around a winding core. This enables high productivity.
A protective element includes: a fuse element including a first end portion and a second end portion; first and second insulating members each having an opening or a separation part, the first and second insulating members being disposed in a state proximal to or in contact with the fuse element; a shielding member movable in a moving direction that allows the shielding member to insert into the opening or the separation part so as to divide the fuse element; a locking member that suppresses movement of the shielding member; a pressing member that press the shielding member; and a heat-generating body configured to heat the locking member or a fixing member of the locking member. The fuse element further includes a cutoff portion for cutting off a current path between the first end portion and the second end portion.
09 - Scientific and electric apparatus and instruments
Goods & Services
Optical scanners; Digital projectors; Video projectors; Projectors particularly projectors for the entertainment industry; LCD projectors; Endoscopy cameras for industrial purposes; Semiconductor wafers; Wafers for integrated circuits; Electro-optical instruments for use in inspection and measurement of industrial components; Recorded computer programs for operating electro-optical instruments for use in inspection and measurement of industrial components; Optical semiconductors; Electronic and optical communications instruments and components, namely, optical transmitters; Electronic and optical communications instruments and components, namely, optical receivers; Optical sensors; Semiconductor devices; Semiconductor chips; Integrated circuits; Light emitting diodes (LEDs); Semiconductor testing apparatus; Semi-conductor memory units; Photodiodes; Electric resistors for telecommunication apparatus; Filters for optical devices; Optical lenses; Cameras
Even when the blowing member generates heat over a long period of time, the fixing state of the blowing member is stabilized and the current path is interrupted safely and quickly. A protecting device 1 includes a case 28, a fuse element 2, a blowing member 3 connected to at least one side of the fuse element 2 to blow the fuse element 2,a fixing member 8 provided on an inner surface of the case 28 and in contact with the blowing member 3 to suppress the wobbling of the blowing member 3, the blowing member 3 has an insulating substrate 4 and a heat generator 5 formed on the insulating 10 substrate 4, and the insulating substrate 4 is connected to the fuse element 2 by a bonding material 9 that is softened by the heat generated by the heat generator 5.
H01H 37/76 - Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
H01M 50/204 - Racks, modules or packs for multiple batteries or multiple cells
H01M 50/583 - Devices or arrangements for the interruption of current in response to current, e.g. fuses
A method of producing a filler-containing film that holds fillers and a fine solid that is made of a material different from that of the filler in an insulating resin layer and in which a predetermined arrangement of the fillers is repeated as viewed in a plan view, where a proportion of (a) a repeat pitch of the fillers after thermocompression bonding under a thermocompression bonding condition with the filler-containing film held between smooth surfaces to (b) a repeat pitch of the fillers before the thermocompression bonding being 300% or less, the method including applying an insulating resin layer-forming composition containing a fine solid to a release substrate to form the insulating resin layer on the release substrate; and pushing the fillers into the insulating resin layer from a surface on a side opposite to the release substrate thereof.
H01L 23/00 - Details of semiconductor or other solid state devices
H01R 4/04 - Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one anotherMeans for effecting or maintaining such contactElectrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
Provided is a bonding process in which: a chip-shaped layer is partially placed on a substrate having metal wiring so as to form a recess; and thereafter, a chip having metal wiring is placed in the recess.
A photocatalyst member according to the present invention comprises a substrate, an underlayer, and a photocatalyst layer formed in contact with the underlayer, in this order. The photocatalyst member is characterized in that the underlayer is constituted by a composite oxide of cerium and zinc, and the photocatalyst layer contains titanium oxide.
This laminate includes: a base material; a first thermoconductive layer provided on the base material, the first thermoconductive layer containing an epoxy resin, an epoxy resin curing agent, and first thermoconductive particles; and a second thermoconductive layer provided on the first thermoconductive layer, the second thermoconductive layer containing a curable component, a curing agent for curing the curable component, second thermoconductive particles, and a low-melting-point metal. The first thermoconductive layer does not contain the low-melting-point metal.
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 15/092 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising epoxy resins
C08G 59/42 - Polycarboxylic acidsAnhydrides, halides, or low-molecular-weight esters thereof
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
H01L 23/36 - Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
63.
THERMALLY CONDUCTIVE COMPOSITION, METHOD FOR PRODUCING LAMINATE, AND LAMINATE
A thermally conductive composition which comprises a curing component, a curing agent, and a metal filler, wherein the metal filler is at least one kind of particles selected from among silver particles, copper particles, silver-coated copper particles, and copper-coated silver particles, the degree of volume filling, in the metal filler, with particles having a particle diameter of 1 μm or smaller is 5 vol% or higher, and the degree of volume filling with the metal filler is 30-90 vol%.
Provided is a transfer sheet. The transfer sheet includes a plurality of linear protrusions extending and arranged side by side on a surface thereof. The plurality of linear protrusions are arranged in a manner that a gradual decrease and a gradual increase in protrusion height are repeated.
Provided is a manufacturing method for a roll mold. The method includes performing a process of forming a linear groove on an outer peripheral surface of a roll base material in a roll axial direction or a direction inclined with respect to the roll axial direction n times, where n is 800 or more. A total of m linear grooves of 1st to mth linear grooves are formed at respective positions that are made up of a position of 0 degrees and at least one position shifted a multiple of (360/m) degrees from the position of 0 degrees, the position of 0 degrees being any position on the outer peripheral surface of the roll base material. In the subsequent cutting processes, linear grooves are formed at respective positions shifted from the positions of the 1st to mth linear grooves in a predetermined direction.
This protective element (1) is provided with: a first fuse element (10); a first terminal (30) and a second terminal (40) that are connected to both ends of the first fuse element (10) in the energization direction; and an insulation case (50) that accommodates parts of the first terminal (30) and second terminal (40) and the first fuse element (10). The first fuse element (10) has a first conductor (11) and a first fusible conductor (12) that are connected in series in the energization direction. The first conductor (11) is provided with a first buffer part (15) that relaxes physical stress. In the insulation case (50), a first buffer space (51) is formed around the first buffer part (15). The protective element (1) further comprises a first filler (71) disposed in the first buffer space (51) so as to surround the first buffer part (15). The insulation case (50) is configured so as to approach or contact a portion other than the periphery of the first buffer part (15) of the first fuse element (10).
H01H 85/143 - Electrical contactsFastening fusible members to such contacts
H01H 37/76 - Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
Provided are: a method for producing a structure that has excellent adhesive strength using a two-part curing adhesive; and an adhesive film. This method for producing a structure uses a two-part curing adhesive that includes a first agent and a second agent, the method comprising: an arrangement step for arranging, between a first component and a second component, a first resin layer and a second resin layer alternately in two or more layers, the first resin layer containing the first agent and having a thickness of not less than 1 μm and less than 5 μm, the second resin layer containing the second agent and having a thickness of not less than 1 μm and less than 5 μm; and a pressing step for pressing the first component and the second component. Consequently, a reaction between the first agent and the second agent is started in the vicinity of the first component and the second component at the time of pressing, and thus excellent adhesive strength can be achieved.
C09J 5/04 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers involving separate application of adhesive ingredients to the different surfaces to be joined
Provided are a protective element capable of improving insulating properties after a fuse element has fused, and a battery pack employing the protective element. A protective element 1 comprises: an insulating substrate 2; a first electrode 11 and a second electrode 12; an intermediate electrode 13 disposed between the first electrode 11 and the second electrode 12; a fuse element 3 which is disposed on a surface of the first electrode 11, the second electrode 12, and the intermediate electrode 13, and which provides electrical connection between the first electrode 11 and the intermediate electrode 12 and between the second electrode 12 and the intermediate electrode 13; and an adhesion preventing portion 5 which is provided between the first electrode 11 and the intermediate electrode 13 and/or between the second electrode 12 and the intermediate electrode 13 to suppress adhesion of molten scattered debris from the fuse element 3.
H01H 85/02 - Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive Details
69.
METHOD OF MANUFACTURING CONNECTION STRUCTURE, CONNECTION STRUCTURE, FILM STRUCTURE, AND METHOD OF MANUFACTURING FILM STRUCTURE
A method of manufacturing a connection structure, connection structure, film structure, and a method of manufacturing a film structure capable of mounting an electronic component having a plurality of terminal rows on a mounting surface by using existing equipment, including: a pasting step of pasting, from a film structure including a tape-shaped base material and a connection film formed thereon, connection films having a unit region of a predetermined length in the length direction of the base material and a predetermined width in the width direction to a first or second electronic component having a plurality of terminal rows; and a connecting step of connecting terminals of the first and second electronic components through the connection films, wherein the film structure includes, in the unit region, in addition to portions corresponding to the plurality of terminal rows, a non-pasting portion in which the connection film is not pasted.
A conductive film according to the present invention includes an insulating high-viscosity resin layer, an insulating low-viscosity resin layer, and conductive particles having an average particle diameter of 13 μm or more. The low-viscosity resin layer is laminated on the high-viscosity resin layer, and the viscosity ratio between the high-viscosity resin layer and the low-viscosity resin layer at 80°C is 7:4 or more. The conductive particles are disposed on the high-viscosity resin layer side from the position at which 2/3 of the particle diameter is on the low-viscosity resin layer side from the boundary between the high-viscosity resin layer and the low-viscosity resin layer.
H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between their connecting locations
H05K 1/14 - Structural association of two or more printed circuits
71.
WIRE GRID POLARIZING ELEMENT, MANUFACTURING METHOD THEREFOR, AND OPTICAL DEVICE
Provided is a wire grid polarizing element comprising: a transparent substrate; and latticed projections which are arrayed, on one-side surface of the transparent substrate, at a pitch shorter than the wavelength of light in a band to be used and extend in a prescribed direction. The latticed projections each include a reflection layer, a dielectric layer, and an absorption layer in the stated order from the transparent substrate side. The reflection layer contains an AlNd alloy.
Provided is a wire-grid polarizer comprising: a transparent substrate; and lattice-shaped protrusions which, on one surface of the transparent substrate, extend in prescribed direction and are arrayed at a pitch which is shorter than the wavelength of light in a band to be used. The lattice-shaped protrusions each include, in order from the transparent substrate side, the following: a reflective layer; a dielectric layer; and an absorption layer. In a prescribed region of the transparent substrate, a region is provided in which the lattice-shaped protrusions are divided.
The present invention addresses the problem of providing a silica aerogel particle dispersion which is capable of forming a self-supporting film without using a nonwoven fabric, and which enables the achievement of a sheet-shaped thermal insulation material that has flexibility. One of the present invention relates to a silica aerogel dispersion in which silica aerogel particles are dispersed in an aqueous solution that contains a polyvinyl alcohol.
This optical laminate includes a transparent substrate; an adhesion layer provided on at least one surface of the transparent substrate; and an optical layer provided on a surface of the adhesion layer on a side opposite to the transparent substrate, wherein the adhesion layer is formed of a metal material, and the metal material has a melting point in a range of 100° C. or more and 700° C. or less.
A latent curing agent includes porous particles retaining an aluminum chelate compound; and a coating on a surface of the porous particles, the coating containing a polyolefin resin, and a silane coupling agent having an isocyanate group.
B01J 13/04 - Making microcapsules or microballoons by physical processes, e.g. drying, spraying
C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
In a semiconductor light receiving element having a light receiving part having a light absorption layer on a first surface side of a semiconductor substrate that is transparent to light with wavelengths in the infrared region for optical communication, a second surface side opposite to the first surface is provided with an inclined portion inclined at a predetermined angle with respect to the first surface in a region where transmitted light that has passed through the light absorption layer of incident light that has entered the light receiving part from the opposite side to the semiconductor substrate reaches, and a rough surface having irregularities with a height equal to or greater than the wavelength of the transmitted light is formed on the inclined portion, thereby reducing re-entry of the transmitted light into the light receiving part.
H01L 31/0304 - Inorganic materials including, apart from doping materials or other impurities, only AIIIBV compounds
H01L 31/105 - Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier or surface barrier the potential barrier being of the PIN type
Provided are: a protective element capable of improving insulation properties after a fuse element has melted; and a battery pack using the protective element. The protective element comprises a case 2, a fuse element 3, a pair of fuse terminals 4a, 4b connected to the fuse element 3, and a melting member 5 that is connected to at least one surface of the fuse element 3 and configured to melt the fuse element 3. The melting member 5 is provided with an insulating substrate 6 and an intermediate electrode 7 that is provided on a surface 6a of the insulating substrate 6 that contacts the fuse element 3 and is connected to the fuse element 3. Between the insulating substrate 6 and at least one of the pair of fuse terminals 4a, 4b, there are spaces 10 above and below the fuse element 3, and in the area where the fuse element 3 and the insulating substrate 6 overlap, there are spaces 11 above and below the fuse element 3 and the insulating substrate 6.
H01H 37/76 - Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
H02H 3/20 - Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal electric working condition, with or without subsequent reconnection responsive to excess voltage
H02H 3/093 - Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal electric working condition, with or without subsequent reconnection responsive to excess current with timing means
H02H 7/18 - Emergency protective circuit arrangements specially adapted for specific types of electric machines or apparatus or for sectionalised protection of cable or line systems, and effecting automatic switching in the event of an undesired change from normal working conditions for batteriesEmergency protective circuit arrangements specially adapted for specific types of electric machines or apparatus or for sectionalised protection of cable or line systems, and effecting automatic switching in the event of an undesired change from normal working conditions for accumulators
H02J 7/00 - Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
ererr < t, and the shortest distance between a region which does not belong to any of a region where the light emission from the light emitting element 12 does not reach an object to be measured and a region where reflected light of the light emission from the object to be measured or scattered light from the object to be measured is not input to the light receiving element 13, and a sensor surface where the reflective optical sensor 10 and the object to be measured are in contact with each other is 0.2 mm or more and 0.3 mm or less.
H01L 31/12 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
79.
WIRE GRID POLARIZING ELEMENT, METHOD FOR MANUFACTURING WIRE GRID POLARIZING ELEMENT, PROJECTION DISPLAY DEVICE, AND VEHICLE
Provided is a wire grid polarizing element excellent in heat dissipation and excellent in transmissivity and polarization splitting properties for oblique incident light at wide-range incident angles. A wire grid polarizing element 1 includes a substrate 10 made of an inorganic material, a grid structural body 20 made of an organic material and including a base part 21 provided on the substrate 10 and a plurality of ridge portions 22, the base part and the ridge portions being integrally formed, and a functional film 30 made of a metal material and covering part of the ridge portion 22. The base part has a thickness (TB) of less than or equal to 0.15 mm. The ridge portion 22 has an upward narrowing shape that narrows in width with distance from the base part 21. The functional film 30 covers and wraps the top of the ridge portion 22, and does not cover a bottom side of the ridge portion 22 and the base part 21. A coverage rate (Rc) of the side surface of the ridge portion 22 obtained by the functional film 30 is more than or equal to 30% and less than or equal to 70%.
Provided are: a method for producing an adhesive film having excellent storage stability, and an adhesive film; and a method for producing a structural body, and a structural body. The present invention involves: a molding step for molding a film layer of a curing agent-free adhesive composition that contains no curing agent; and an arrangement step for transferring a latent curing agent to the film layer from a transfer substrate on which the latent curing agent is disposed, and exposing the latent curing agent from at least one surface of the film layer or bringing the latent curing agent near the at least one surface of the film layer to dispose the latent curing agent. By disposing the latent curing agent after molding the film layer, progress of curing reaction can be suppressed, and excellent storage stability can be obtained. By disposing the latent curing agent on the surface of the film layer, reaction by the curing agent is started, and excellent adhesive strength can be obtained.
Provided is a photocurable adhesive composition that is capable of maintaining light shielding properties after curing, even in high-temperature and high-humidity environments. A photocurable adhesive composition according to the present invention comprises (a) a photocurable radical polymerization component, (b) a photoradical generator, (c) a photoacid generator, (d) a leuco pigment, and (e) a thermal acid generator. A cured product of a photocurable adhesive composition according to the present invention is obtained by curing a photocurable adhesive composition that contains (a) a photocurable radical polymerization component, (b) a photoradical generator, (c) a photoacid generator, (d) a leuco pigment, and (e) a thermal acid generator which has an onium salt structure. In a connection structure according to the present invention, a first member and a second member are connected by means of a cured product of the photocurable adhesive composition.
A protective element includes: a fuse element including a first end portion and a second end portion; an insulating member having an opening or a separation part, the insulating member being disposed in a state proximal to or in contact with the fuse element; a shielding member movable in an insertion direction to be inserted into the opening or the separation part of the insulating member so as to divide the fuse element; a pressing member that press the shielding member; a locking member that is fixed between the insulting case and the shielding member, optionally using a fixing member, and suppresses movement of the shielding member; and a heat-generating body configured to heat the locking member or the fixing member.
A semiconductor light receiving device (1) has a light receiving portion (6) with a light absorbing layer (4) on a first surface (2a) side of a semiconductor substrate (2) transparent to incident light in an infrared range for optical communications, a reflecting portion (11) in a region where light that was incident on the light receiving portion (6) and passed through the light absorbing layer (4) is reached on a second surface (2b) side opposite the first surface (2a) to reflect the light toward the second surface (2b), and end surfaces (2c, 2d) of the semiconductor substrate (2), where light reflected by the reflecting portion (11) and reflected by the second surface (2b) reaches, are formed as a rough surface having roughness with a height equal to or greater than the wavelength of the incident light.
H01L 31/0304 - Inorganic materials including, apart from doping materials or other impurities, only AIIIBV compounds
H01L 31/105 - Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier or surface barrier the potential barrier being of the PIN type
84.
METHOD FOR PRODUCING ADHESIVE FILM, ADHESIVE FILM, SEMI-FINISHED ADHESIVE FILM, AND METHOD FOR PRODUCING CONNECTION STRUCTURE
A method for producing an adhesive film having a base material film and adhesive layers provided linearly in the longitudinal direction of the base material film, the base material film being exposed on both sides of the adhesive layers along the longitudinal direction, the method comprising: a step for forming a plurality of linear adhesive layers at predetermined intervals on one surface of the base material film; and a step for slitting the exposed base material film between adjacent adhesive layers so that the base material film is exposed on both sides of each adhesive layer along the longitudinal direction.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
85.
CONDUCTIVE ADHESIVE FILM, METHOD FOR MANUFACTURING CONDUCTIVE ADHESIVE FILM, CONNECTION BODY, AND METHOD FOR MANUFACTURING CONNECTION BODY
Provided is an conductive adhesive film that can efficiently use conductive particles, supports the miniaturization of the electrode size of an electronic component and fine pitch conversion thereof, and can ensure conduction reliability between connection electrodes and insulation performance between adjacent electrodes. A conductive adhesive film 1 comprises a base material 2 and an adhesive material layer 4, which is provided on one surface of the base material 2 and contains conductive particles 3. The conductive particles 3 contained in the adhesive material layer 4 constitute a particle aggregate 5 in which a plurality of conductive particles are aggregated. In the adhesive material layer 4, array elements 6 each comprising the particle aggregate 5 are arranged in a prescribed arrangement pattern corresponding to an electrode arrangement of an electronic component 10 to which the conductive adhesive film 1 is affixed.
H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
H01B 5/16 - Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between their connecting locations
86.
CONNECTION STRUCTURE MANUFACTURING METHOD, AND CONNECTION STRUCTURE
Provided are: a connection structure manufacturing method that allows solder particles to be efficiently arranged on an electrode and enables obtaining high conduction reliability; and a connection structure. The method includes: a disposition step for disposing a surface mounting component provided with a plurality of terminal rows, on a wiring substrate via a film-like solder connection material having rectangular parts corresponding to the respective terminal rows; and a joining step for joining the surface mounting component to the wiring substrate. The relative standard deviation of the solder thicknesses between terminals of the surface mounting component and terminals of the wiring substrate after the joining step is less than 25%.
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
H05K 1/14 - Structural association of two or more printed circuits
H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
Disclosed an optical laminate in which at least two or more optical function layers with visible light transmittance are laminated, wherein the optical function layers include a first function layer that includes at least cerium oxide, has a refractive index in a range of 1.8 or more and 2.6 or less at a wavelength of 550 nm, and has a film thickness in a range of 60 nm or more and 130 nm or less, and a second function layer that is formed in contact with an upper surface of the first function layer, has a refractive index in a range of 1.4 or more and 1.6 or less at a wavelength of 550 nm, and has a film thickness in a range of 80 nm or more and 100 nm or less.
A thermally conductive composition including a curable component, a curing agent configured to cure the curable component, and a metallic filler is provided. The metallic filler contains thermally conductive particles and low-melting-point metallic particles. A volume average particle diameter of the thermally conductive particles is greater than a volume average particle diameter of the low-melting-point metallic particles. A melting point of the low-melting-point metallic particles is lower than a thermal curing treatment temperature of the thermally conductive composition.
C09K 5/14 - Solid materials, e.g. powdery or granular
C08G 65/26 - Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds
C08K 9/02 - Ingredients treated with inorganic substances
89.
RADIATION SHIELDING MATERIAL, SHIELDING MATERIAL FOR SEMICONDUCTOR DEVICE, PACKAGE FOR SEMICONDUCTOR DEVICE, SHIELDING MATERIAL FOR NUCLEAR REACTOR, NUCLEAR REACTOR CONTAINMENT VESSEL, NUCLEAR REACTOR BUILDING, SHIELDING MATERIAL FOR NUCLEAR FUSION REACTOR, NUCLEAR FUSION REACTOR, AND NUCLEAR FUSION REACTOR BUILDING
A protective element includes: a fuse element including a first end portion and a second end portion; first and second insulating members each having an opening or a separation part, the first and second insulating members being disposed in a state proximal to or in contact with the fuse element; a shielding member movable in a moving direction that allows the shielding member to insert into the opening or the separation part so as to divide the fuse element; a locking member that suppresses movement of the shielding member; a pressing member that press the shielding member; and a heat-generating body configured to heat the locking member or a fixing member of the locking member.
H01H 85/10 - Fusible members characterised by the shape or form of the fusible member with constriction for localised fusing
H01H 37/76 - Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
H01H 85/041 - Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
H01H 85/06 - Fusible members characterised by the fusible material
H01H 85/12 - Two or more separate fusible members in parallel
H01H 85/20 - Bases for supporting the fuseSeparate parts thereof
91.
NEUTRON RADIATION SHIELDING MATERIAL, SHIELDING MATERIAL FOR SEMICONDUCTOR DEVICE, PACKAGE FOR SEMICONDUCTOR DEVICE, SHIELDING MATERIAL FOR NUCLEAR REACTOR, NUCLEAR REACTOR CONTAINMENT VESSEL, NUCLEAR REACTOR BUILDING, SHIELDING MATERIAL FOR NUCLEAR FUSION REACTOR, NUCLEAR FUSION REACTOR, AND NUCLEAR FUSION REACTOR BUILDING
G21F 1/10 - Organic substancesDispersions in organic carriers
G21F 3/00 - Shielding characterised by its physical form, e.g. granules, or shape of the material
H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
92.
NEUTRON RADIATION SHIELDING MATERIAL, SHIELDING MATERIAL FOR SEMICONDUCTOR DEVICE, PACKAGE FOR SEMICONDUCTOR DEVICE, SHIELDING MATERIAL FOR NUCLEAR REACTOR, NUCLEAR REACTOR CONTAINMENT VESSEL, NUCLEAR REACTOR BUILDING, SHIELDING MATERIAL FOR NUCLEAR FUSION REACTOR, NUCLEAR FUSION REACTOR, AND NUCLEAR FUSION REACTOR BUILDING
This neutron radiation shielding material for blocking neutron radiation contains a boride, and the average particle size of said boride is 500 μm or less.
G21F 1/10 - Organic substancesDispersions in organic carriers
G21F 3/00 - Shielding characterised by its physical form, e.g. granules, or shape of the material
H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
93.
NEUTRON RADIATION SHIELDING MATERIAL, SHIELDING MATERIAL FOR SEMICONDUCTOR DEVICE, PACKAGE FOR SEMICONDUCTOR DEVICE, SHIELDING MATERIAL FOR NUCLEAR REACTOR, NUCLEAR REACTOR CONTAINMENT VESSEL, NUCLEAR REACTOR BUILDING, SHIELDING MATERIAL FOR NUCLEAR FUSION REACTOR, NUCLEAR FUSION REACTOR, AND NUCLEAR FUSION REACTOR BUILDING
This neutron radiation shielding material for blocking neutron radiation includes a resin-containing layer and a borohydride-containing layer, wherein one of the resin-containing layer and the borohydride-containing layer is disposed on a side exposed to the radiation source of neutron radiation.
G21F 1/10 - Organic substancesDispersions in organic carriers
G21F 3/00 - Shielding characterised by its physical form, e.g. granules, or shape of the material
H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
94.
NEUTRON RADIATION SHIELDING MATERIAL, SHIELDING MATERIAL FOR SEMICONDUCTOR DEVICE, PACKAGE FOR SEMICONDUCTOR DEVICE, SHIELDING MATERIAL FOR NUCLEAR REACTOR, NUCLEAR REACTOR CONTAINMENT VESSEL, NUCLEAR REACTOR BUILDING, SHIELDING MATERIAL FOR NUCLEAR FUSION REACTOR, NUCLEAR FUSION REACTOR, AND NUCLEAR FUSION REACTOR BUILDING
A neutron radiation shielding material for blocking neutron radiation, wherein the attenuation rate of neutron radiation of 0.5 eV is 1e-2 or less when the thickness of the neutron radiation shielding material is 1 cm.
A protective element includes a fuse element, an insulating case, a first terminal, and a second terminal, and also includes an insulating member disposed close to or in contact with the fuse element and having an opening portion or a separation portion formed therein, a shielding member configured to move downward to divide the fuse element, a pressing unit configured to press the shielding member downward, and a locking member configured to restrain downward the shielding member, wherein the shielding member has a convex portion that protrudes toward the fuse element, the convex portion has a tip end disposed at a lower end portion of the convex portion and extends in a width direction, the tip end has a first inclined blade which extends downward as nearing one side in the width direction, and the first inclined blade overlaps a region half the length of the fuse element in the width direction.
Solder particles containing an oxidized film on the surface thereof, wherein the average film thickness of the oxidized film is 3 nm or greater, and the average surface roughness Ra of the solder particles is 10 nm or greater are provided.
A protective element (11) comprises: an insulating substrate (26); a first electrode (22) and a second electrode (23) provided to the insulating substrate (26) so as to be separated from each other; a heating resistor (24) provided to the insulating substrate (26); an intermediate electrode (21) provided between the first electrode (22) and the second electrode (23); and a fuse element (20) that is provided across the first electrode (22) and the second electrode (23), is fixed to the first electrode (22), the second electrode (23), and the intermediate electrode (21) via a conductive fixing member (28), and is melted when heated to a prescribed temperature or higher by the heating resistor (24). Recesses (60) recessed in the thickness direction from the surface of the fuse element (20) are formed in the fuse element (20). A part of the fixing member (28) is provided in the recesses (60).
H01H 85/10 - Fusible members characterised by the shape or form of the fusible member with constriction for localised fusing
H01H 37/76 - Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
Provided is a film-shaped sealant with which mounting of an electronic component, e.g., a chip, on a substrate can be performed simultaneously with en bloc sealing of the entire electronic component in a reflow step in a solder reflow mounting process. A film-shaped sealant 4 comprises a film-forming component, a thermosetting monomer, and a curing agent or polymerization initiator and has a melt viscosity at 220°C of 25-70 Pa·s. A circuit device 10 includes a component 2 for mounting which has been mounted on a circuit board 1 and sealed with a cured object 4A formed from the film-shaped sealant 4.
An optical laminate 102 comprises in the following order: a transparent base material 11; a hard coat layer 12; an adhesion layer 13 comprising a sputtered film; an optical function layer 14 in which high refractive index layers each comprising a sputtered film and low refractive index layers each having a refractive index lower than that of the high refractive index layer are alternately laminated; and an antifouling layer 15. The hard coat layer 12 contains a silica filler, and the optical laminate satisfies condition 1 and condition 2. Condition 1: The ratio ((A)/(B)) of Martens hardness (A) on the optical laminate antifouling layer side to Martens hardness (B) on a hard coat layer side of a laminate having only the transparent base material and the hard coat layer is 3.6 or less. Condition 2: The difference in contact angle with respect to water between before and after friction is 20° or less in a case where a friction tester using steel wool conforming to JIS L0849 is used to horizontally reciprocate the steel wool 200 times.
B32B 27/20 - Layered products essentially comprising synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
G02B 1/18 - Coatings for keeping optical surfaces clean, e.g. hydrophobic or photo-catalytic films
A protective element includes: an insulating substrate; first and second electrodes provided on the insulating substrate; a heating element formed on the insulating substrate; a heating-element extraction electrode electrically connected to the heating element; a fusible conductor mounted from the first electrode to the second electrode with the heating-element extraction electrode interposed between the first and second electrodes; and an insulating protective layer which covers the heating element and includes a thermally conductive filler.
H01M 50/583 - Devices or arrangements for the interruption of current in response to current, e.g. fuses
H01H 85/00 - Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
H01M 10/653 - Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
