Provided is a bonding process in which: a chip-shaped layer is partially placed on a substrate having metal wiring so as to form a recess; and thereafter, a chip having metal wiring is placed in the recess.
A photocatalyst member according to the present invention comprises a substrate, an underlayer, and a photocatalyst layer formed in contact with the underlayer, in this order. The photocatalyst member is characterized in that the underlayer is constituted by a composite oxide of cerium and zinc, and the photocatalyst layer contains titanium oxide.
This laminate includes: a base material; a first thermoconductive layer provided on the base material, the first thermoconductive layer containing an epoxy resin, an epoxy resin curing agent, and first thermoconductive particles; and a second thermoconductive layer provided on the first thermoconductive layer, the second thermoconductive layer containing a curable component, a curing agent for curing the curable component, second thermoconductive particles, and a low-melting-point metal. The first thermoconductive layer does not contain the low-melting-point metal.
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 15/092 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising epoxy resins
C08G 59/42 - Polycarboxylic acidsAnhydrides, halides, or low-molecular-weight esters thereof
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
H01L 23/36 - Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
4.
THERMALLY CONDUCTIVE COMPOSITION, METHOD FOR PRODUCING LAMINATE, AND LAMINATE
A thermally conductive composition which comprises a curing component, a curing agent, and a metal filler, wherein the metal filler is at least one kind of particles selected from among silver particles, copper particles, silver-coated copper particles, and copper-coated silver particles, the degree of volume filling, in the metal filler, with particles having a particle diameter of 1 μm or smaller is 5 vol% or higher, and the degree of volume filling with the metal filler is 30-90 vol%.
Provided is a transfer sheet. The transfer sheet includes a plurality of linear protrusions extending and arranged side by side on a surface thereof. The plurality of linear protrusions are arranged in a manner that a gradual decrease and a gradual increase in protrusion height are repeated.
Provided is a manufacturing method for a roll mold. The method includes performing a process of forming a linear groove on an outer peripheral surface of a roll base material in a roll axial direction or a direction inclined with respect to the roll axial direction n times, where n is 800 or more. A total of m linear grooves of 1st to mth linear grooves are formed at respective positions that are made up of a position of 0 degrees and at least one position shifted a multiple of (360/m) degrees from the position of 0 degrees, the position of 0 degrees being any position on the outer peripheral surface of the roll base material. In the subsequent cutting processes, linear grooves are formed at respective positions shifted from the positions of the 1st to mth linear grooves in a predetermined direction.
This protective element (1) is provided with: a first fuse element (10); a first terminal (30) and a second terminal (40) that are connected to both ends of the first fuse element (10) in the energization direction; and an insulation case (50) that accommodates parts of the first terminal (30) and second terminal (40) and the first fuse element (10). The first fuse element (10) has a first conductor (11) and a first fusible conductor (12) that are connected in series in the energization direction. The first conductor (11) is provided with a first buffer part (15) that relaxes physical stress. In the insulation case (50), a first buffer space (51) is formed around the first buffer part (15). The protective element (1) further comprises a first filler (71) disposed in the first buffer space (51) so as to surround the first buffer part (15). The insulation case (50) is configured so as to approach or contact a portion other than the periphery of the first buffer part (15) of the first fuse element (10).
H01H 85/143 - Electrical contactsFastening fusible members to such contacts
H01H 37/76 - Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
Provided are: a method for producing a structure that has excellent adhesive strength using a two-part curing adhesive; and an adhesive film. This method for producing a structure uses a two-part curing adhesive that includes a first agent and a second agent, the method comprising: an arrangement step for arranging, between a first component and a second component, a first resin layer and a second resin layer alternately in two or more layers, the first resin layer containing the first agent and having a thickness of not less than 1 μm and less than 5 μm, the second resin layer containing the second agent and having a thickness of not less than 1 μm and less than 5 μm; and a pressing step for pressing the first component and the second component. Consequently, a reaction between the first agent and the second agent is started in the vicinity of the first component and the second component at the time of pressing, and thus excellent adhesive strength can be achieved.
C09J 5/04 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers involving separate application of adhesive ingredients to the different surfaces to be joined
Provided are a protective element capable of improving insulating properties after a fuse element has fused, and a battery pack employing the protective element. A protective element 1 comprises: an insulating substrate 2; a first electrode 11 and a second electrode 12; an intermediate electrode 13 disposed between the first electrode 11 and the second electrode 12; a fuse element 3 which is disposed on a surface of the first electrode 11, the second electrode 12, and the intermediate electrode 13, and which provides electrical connection between the first electrode 11 and the intermediate electrode 12 and between the second electrode 12 and the intermediate electrode 13; and an adhesion preventing portion 5 which is provided between the first electrode 11 and the intermediate electrode 13 and/or between the second electrode 12 and the intermediate electrode 13 to suppress adhesion of molten scattered debris from the fuse element 3.
H01H 85/02 - Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive Details
10.
METHOD OF MANUFACTURING CONNECTION STRUCTURE, CONNECTION STRUCTURE, FILM STRUCTURE, AND METHOD OF MANUFACTURING FILM STRUCTURE
A method of manufacturing a connection structure, connection structure, film structure, and a method of manufacturing a film structure capable of mounting an electronic component having a plurality of terminal rows on a mounting surface by using existing equipment, including: a pasting step of pasting, from a film structure including a tape-shaped base material and a connection film formed thereon, connection films having a unit region of a predetermined length in the length direction of the base material and a predetermined width in the width direction to a first or second electronic component having a plurality of terminal rows; and a connecting step of connecting terminals of the first and second electronic components through the connection films, wherein the film structure includes, in the unit region, in addition to portions corresponding to the plurality of terminal rows, a non-pasting portion in which the connection film is not pasted.
A conductive film according to the present invention includes an insulating high-viscosity resin layer, an insulating low-viscosity resin layer, and conductive particles having an average particle diameter of 13 μm or more. The low-viscosity resin layer is laminated on the high-viscosity resin layer, and the viscosity ratio between the high-viscosity resin layer and the low-viscosity resin layer at 80°C is 7:4 or more. The conductive particles are disposed on the high-viscosity resin layer side from the position at which 2/3 of the particle diameter is on the low-viscosity resin layer side from the boundary between the high-viscosity resin layer and the low-viscosity resin layer.
H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between their connecting locations
H05K 1/14 - Structural association of two or more printed circuits
12.
WIRE GRID POLARIZING ELEMENT, MANUFACTURING METHOD THEREFOR, AND OPTICAL DEVICE
Provided is a wire grid polarizing element comprising: a transparent substrate; and latticed projections which are arrayed, on one-side surface of the transparent substrate, at a pitch shorter than the wavelength of light in a band to be used and extend in a prescribed direction. The latticed projections each include a reflection layer, a dielectric layer, and an absorption layer in the stated order from the transparent substrate side. The reflection layer contains an AlNd alloy.
Provided is a wire-grid polarizer comprising: a transparent substrate; and lattice-shaped protrusions which, on one surface of the transparent substrate, extend in prescribed direction and are arrayed at a pitch which is shorter than the wavelength of light in a band to be used. The lattice-shaped protrusions each include, in order from the transparent substrate side, the following: a reflective layer; a dielectric layer; and an absorption layer. In a prescribed region of the transparent substrate, a region is provided in which the lattice-shaped protrusions are divided.
The present invention addresses the problem of providing a silica aerogel particle dispersion which is capable of forming a self-supporting film without using a nonwoven fabric, and which enables the achievement of a sheet-shaped thermal insulation material that has flexibility. One of the present invention relates to a silica aerogel dispersion in which silica aerogel particles are dispersed in an aqueous solution that contains a polyvinyl alcohol.
This optical laminate includes a transparent substrate; an adhesion layer provided on at least one surface of the transparent substrate; and an optical layer provided on a surface of the adhesion layer on a side opposite to the transparent substrate, wherein the adhesion layer is formed of a metal material, and the metal material has a melting point in a range of 100° C. or more and 700° C. or less.
A latent curing agent includes porous particles retaining an aluminum chelate compound; and a coating on a surface of the porous particles, the coating containing a polyolefin resin, and a silane coupling agent having an isocyanate group.
B01J 13/04 - Making microcapsules or microballoons by physical processes, e.g. drying, spraying
C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
In a semiconductor light receiving element having a light receiving part having a light absorption layer on a first surface side of a semiconductor substrate that is transparent to light with wavelengths in the infrared region for optical communication, a second surface side opposite to the first surface is provided with an inclined portion inclined at a predetermined angle with respect to the first surface in a region where transmitted light that has passed through the light absorption layer of incident light that has entered the light receiving part from the opposite side to the semiconductor substrate reaches, and a rough surface having irregularities with a height equal to or greater than the wavelength of the transmitted light is formed on the inclined portion, thereby reducing re-entry of the transmitted light into the light receiving part.
H01L 31/0304 - Inorganic materials including, apart from doping materials or other impurities, only AIIIBV compounds
H01L 31/105 - Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier or surface barrier the potential barrier being of the PIN type
Provided are: a protective element capable of improving insulation properties after a fuse element has melted; and a battery pack using the protective element. The protective element comprises a case 2, a fuse element 3, a pair of fuse terminals 4a, 4b connected to the fuse element 3, and a melting member 5 that is connected to at least one surface of the fuse element 3 and configured to melt the fuse element 3. The melting member 5 is provided with an insulating substrate 6 and an intermediate electrode 7 that is provided on a surface 6a of the insulating substrate 6 that contacts the fuse element 3 and is connected to the fuse element 3. Between the insulating substrate 6 and at least one of the pair of fuse terminals 4a, 4b, there are spaces 10 above and below the fuse element 3, and in the area where the fuse element 3 and the insulating substrate 6 overlap, there are spaces 11 above and below the fuse element 3 and the insulating substrate 6.
H01H 37/76 - Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
H02H 3/20 - Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal electric working condition, with or without subsequent reconnection responsive to excess voltage
H02H 3/093 - Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal electric working condition, with or without subsequent reconnection responsive to excess current with timing means
H02H 7/18 - Emergency protective circuit arrangements specially adapted for specific types of electric machines or apparatus or for sectionalised protection of cable or line systems, and effecting automatic switching in the event of an undesired change from normal working conditions for batteriesEmergency protective circuit arrangements specially adapted for specific types of electric machines or apparatus or for sectionalised protection of cable or line systems, and effecting automatic switching in the event of an undesired change from normal working conditions for accumulators
H02J 7/00 - Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
ererr < t, and the shortest distance between a region which does not belong to any of a region where the light emission from the light emitting element 12 does not reach an object to be measured and a region where reflected light of the light emission from the object to be measured or scattered light from the object to be measured is not input to the light receiving element 13, and a sensor surface where the reflective optical sensor 10 and the object to be measured are in contact with each other is 0.2 mm or more and 0.3 mm or less.
H01L 31/12 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
20.
WIRE GRID POLARIZING ELEMENT, METHOD FOR MANUFACTURING WIRE GRID POLARIZING ELEMENT, PROJECTION DISPLAY DEVICE, AND VEHICLE
Provided is a wire grid polarizing element excellent in heat dissipation and excellent in transmissivity and polarization splitting properties for oblique incident light at wide-range incident angles. A wire grid polarizing element 1 includes a substrate 10 made of an inorganic material, a grid structural body 20 made of an organic material and including a base part 21 provided on the substrate 10 and a plurality of ridge portions 22, the base part and the ridge portions being integrally formed, and a functional film 30 made of a metal material and covering part of the ridge portion 22. The base part has a thickness (TB) of less than or equal to 0.15 mm. The ridge portion 22 has an upward narrowing shape that narrows in width with distance from the base part 21. The functional film 30 covers and wraps the top of the ridge portion 22, and does not cover a bottom side of the ridge portion 22 and the base part 21. A coverage rate (Rc) of the side surface of the ridge portion 22 obtained by the functional film 30 is more than or equal to 30% and less than or equal to 70%.
Provided are: a method for producing an adhesive film having excellent storage stability, and an adhesive film; and a method for producing a structural body, and a structural body. The present invention involves: a molding step for molding a film layer of a curing agent-free adhesive composition that contains no curing agent; and an arrangement step for transferring a latent curing agent to the film layer from a transfer substrate on which the latent curing agent is disposed, and exposing the latent curing agent from at least one surface of the film layer or bringing the latent curing agent near the at least one surface of the film layer to dispose the latent curing agent. By disposing the latent curing agent after molding the film layer, progress of curing reaction can be suppressed, and excellent storage stability can be obtained. By disposing the latent curing agent on the surface of the film layer, reaction by the curing agent is started, and excellent adhesive strength can be obtained.
Provided is a photocurable adhesive composition that is capable of maintaining light shielding properties after curing, even in high-temperature and high-humidity environments. A photocurable adhesive composition according to the present invention comprises (a) a photocurable radical polymerization component, (b) a photoradical generator, (c) a photoacid generator, (d) a leuco pigment, and (e) a thermal acid generator. A cured product of a photocurable adhesive composition according to the present invention is obtained by curing a photocurable adhesive composition that contains (a) a photocurable radical polymerization component, (b) a photoradical generator, (c) a photoacid generator, (d) a leuco pigment, and (e) a thermal acid generator which has an onium salt structure. In a connection structure according to the present invention, a first member and a second member are connected by means of a cured product of the photocurable adhesive composition.
A protective element includes: a fuse element including a first end portion and a second end portion; an insulating member having an opening or a separation part, the insulating member being disposed in a state proximal to or in contact with the fuse element; a shielding member movable in an insertion direction to be inserted into the opening or the separation part of the insulating member so as to divide the fuse element; a pressing member that press the shielding member; a locking member that is fixed between the insulting case and the shielding member, optionally using a fixing member, and suppresses movement of the shielding member; and a heat-generating body configured to heat the locking member or the fixing member.
A semiconductor light receiving device (1) has a light receiving portion (6) with a light absorbing layer (4) on a first surface (2a) side of a semiconductor substrate (2) transparent to incident light in an infrared range for optical communications, a reflecting portion (11) in a region where light that was incident on the light receiving portion (6) and passed through the light absorbing layer (4) is reached on a second surface (2b) side opposite the first surface (2a) to reflect the light toward the second surface (2b), and end surfaces (2c, 2d) of the semiconductor substrate (2), where light reflected by the reflecting portion (11) and reflected by the second surface (2b) reaches, are formed as a rough surface having roughness with a height equal to or greater than the wavelength of the incident light.
H01L 31/0304 - Inorganic materials including, apart from doping materials or other impurities, only AIIIBV compounds
H01L 31/105 - Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier or surface barrier the potential barrier being of the PIN type
25.
METHOD FOR PRODUCING ADHESIVE FILM, ADHESIVE FILM, SEMI-FINISHED ADHESIVE FILM, AND METHOD FOR PRODUCING CONNECTION STRUCTURE
A method for producing an adhesive film having a base material film and adhesive layers provided linearly in the longitudinal direction of the base material film, the base material film being exposed on both sides of the adhesive layers along the longitudinal direction, the method comprising: a step for forming a plurality of linear adhesive layers at predetermined intervals on one surface of the base material film; and a step for slitting the exposed base material film between adjacent adhesive layers so that the base material film is exposed on both sides of each adhesive layer along the longitudinal direction.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
26.
CONDUCTIVE ADHESIVE FILM, METHOD FOR MANUFACTURING CONDUCTIVE ADHESIVE FILM, CONNECTION BODY, AND METHOD FOR MANUFACTURING CONNECTION BODY
Provided is an conductive adhesive film that can efficiently use conductive particles, supports the miniaturization of the electrode size of an electronic component and fine pitch conversion thereof, and can ensure conduction reliability between connection electrodes and insulation performance between adjacent electrodes. A conductive adhesive film 1 comprises a base material 2 and an adhesive material layer 4, which is provided on one surface of the base material 2 and contains conductive particles 3. The conductive particles 3 contained in the adhesive material layer 4 constitute a particle aggregate 5 in which a plurality of conductive particles are aggregated. In the adhesive material layer 4, array elements 6 each comprising the particle aggregate 5 are arranged in a prescribed arrangement pattern corresponding to an electrode arrangement of an electronic component 10 to which the conductive adhesive film 1 is affixed.
H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
H01B 5/16 - Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between their connecting locations
27.
CONNECTION STRUCTURE MANUFACTURING METHOD, AND CONNECTION STRUCTURE
Provided are: a connection structure manufacturing method that allows solder particles to be efficiently arranged on an electrode and enables obtaining high conduction reliability; and a connection structure. The method includes: a disposition step for disposing a surface mounting component provided with a plurality of terminal rows, on a wiring substrate via a film-like solder connection material having rectangular parts corresponding to the respective terminal rows; and a joining step for joining the surface mounting component to the wiring substrate. The relative standard deviation of the solder thicknesses between terminals of the surface mounting component and terminals of the wiring substrate after the joining step is less than 25%.
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
H05K 1/14 - Structural association of two or more printed circuits
H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
Disclosed an optical laminate in which at least two or more optical function layers with visible light transmittance are laminated, wherein the optical function layers include a first function layer that includes at least cerium oxide, has a refractive index in a range of 1.8 or more and 2.6 or less at a wavelength of 550 nm, and has a film thickness in a range of 60 nm or more and 130 nm or less, and a second function layer that is formed in contact with an upper surface of the first function layer, has a refractive index in a range of 1.4 or more and 1.6 or less at a wavelength of 550 nm, and has a film thickness in a range of 80 nm or more and 100 nm or less.
A thermally conductive composition including a curable component, a curing agent configured to cure the curable component, and a metallic filler is provided. The metallic filler contains thermally conductive particles and low-melting-point metallic particles. A volume average particle diameter of the thermally conductive particles is greater than a volume average particle diameter of the low-melting-point metallic particles. A melting point of the low-melting-point metallic particles is lower than a thermal curing treatment temperature of the thermally conductive composition.
C09K 5/14 - Solid materials, e.g. powdery or granular
C08G 65/26 - Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds
C08K 9/02 - Ingredients treated with inorganic substances
30.
RADIATION SHIELDING MATERIAL, SHIELDING MATERIAL FOR SEMICONDUCTOR DEVICE, PACKAGE FOR SEMICONDUCTOR DEVICE, SHIELDING MATERIAL FOR NUCLEAR REACTOR, NUCLEAR REACTOR CONTAINMENT VESSEL, NUCLEAR REACTOR BUILDING, SHIELDING MATERIAL FOR NUCLEAR FUSION REACTOR, NUCLEAR FUSION REACTOR, AND NUCLEAR FUSION REACTOR BUILDING
A protective element includes: a fuse element including a first end portion and a second end portion; first and second insulating members each having an opening or a separation part, the first and second insulating members being disposed in a state proximal to or in contact with the fuse element; a shielding member movable in a moving direction that allows the shielding member to insert into the opening or the separation part so as to divide the fuse element; a locking member that suppresses movement of the shielding member; a pressing member that press the shielding member; and a heat-generating body configured to heat the locking member or a fixing member of the locking member.
H01H 85/10 - Fusible members characterised by the shape or form of the fusible member with constriction for localised fusing
H01H 37/76 - Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
H01H 85/041 - Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
H01H 85/06 - Fusible members characterised by the fusible material
H01H 85/12 - Two or more separate fusible members in parallel
H01H 85/20 - Bases for supporting the fuseSeparate parts thereof
32.
NEUTRON RADIATION SHIELDING MATERIAL, SHIELDING MATERIAL FOR SEMICONDUCTOR DEVICE, PACKAGE FOR SEMICONDUCTOR DEVICE, SHIELDING MATERIAL FOR NUCLEAR REACTOR, NUCLEAR REACTOR CONTAINMENT VESSEL, NUCLEAR REACTOR BUILDING, SHIELDING MATERIAL FOR NUCLEAR FUSION REACTOR, NUCLEAR FUSION REACTOR, AND NUCLEAR FUSION REACTOR BUILDING
G21F 1/10 - Organic substancesDispersions in organic carriers
G21F 3/00 - Shielding characterised by its physical form, e.g. granules, or shape of the material
H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
33.
NEUTRON RADIATION SHIELDING MATERIAL, SHIELDING MATERIAL FOR SEMICONDUCTOR DEVICE, PACKAGE FOR SEMICONDUCTOR DEVICE, SHIELDING MATERIAL FOR NUCLEAR REACTOR, NUCLEAR REACTOR CONTAINMENT VESSEL, NUCLEAR REACTOR BUILDING, SHIELDING MATERIAL FOR NUCLEAR FUSION REACTOR, NUCLEAR FUSION REACTOR, AND NUCLEAR FUSION REACTOR BUILDING
This neutron radiation shielding material for blocking neutron radiation contains a boride, and the average particle size of said boride is 500 μm or less.
G21F 1/10 - Organic substancesDispersions in organic carriers
G21F 3/00 - Shielding characterised by its physical form, e.g. granules, or shape of the material
H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
34.
NEUTRON RADIATION SHIELDING MATERIAL, SHIELDING MATERIAL FOR SEMICONDUCTOR DEVICE, PACKAGE FOR SEMICONDUCTOR DEVICE, SHIELDING MATERIAL FOR NUCLEAR REACTOR, NUCLEAR REACTOR CONTAINMENT VESSEL, NUCLEAR REACTOR BUILDING, SHIELDING MATERIAL FOR NUCLEAR FUSION REACTOR, NUCLEAR FUSION REACTOR, AND NUCLEAR FUSION REACTOR BUILDING
This neutron radiation shielding material for blocking neutron radiation includes a resin-containing layer and a borohydride-containing layer, wherein one of the resin-containing layer and the borohydride-containing layer is disposed on a side exposed to the radiation source of neutron radiation.
G21F 1/10 - Organic substancesDispersions in organic carriers
G21F 3/00 - Shielding characterised by its physical form, e.g. granules, or shape of the material
H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
35.
NEUTRON RADIATION SHIELDING MATERIAL, SHIELDING MATERIAL FOR SEMICONDUCTOR DEVICE, PACKAGE FOR SEMICONDUCTOR DEVICE, SHIELDING MATERIAL FOR NUCLEAR REACTOR, NUCLEAR REACTOR CONTAINMENT VESSEL, NUCLEAR REACTOR BUILDING, SHIELDING MATERIAL FOR NUCLEAR FUSION REACTOR, NUCLEAR FUSION REACTOR, AND NUCLEAR FUSION REACTOR BUILDING
A neutron radiation shielding material for blocking neutron radiation, wherein the attenuation rate of neutron radiation of 0.5 eV is 1e-2 or less when the thickness of the neutron radiation shielding material is 1 cm.
A protective element includes a fuse element, an insulating case, a first terminal, and a second terminal, and also includes an insulating member disposed close to or in contact with the fuse element and having an opening portion or a separation portion formed therein, a shielding member configured to move downward to divide the fuse element, a pressing unit configured to press the shielding member downward, and a locking member configured to restrain downward the shielding member, wherein the shielding member has a convex portion that protrudes toward the fuse element, the convex portion has a tip end disposed at a lower end portion of the convex portion and extends in a width direction, the tip end has a first inclined blade which extends downward as nearing one side in the width direction, and the first inclined blade overlaps a region half the length of the fuse element in the width direction.
Solder particles containing an oxidized film on the surface thereof, wherein the average film thickness of the oxidized film is 3 nm or greater, and the average surface roughness Ra of the solder particles is 10 nm or greater are provided.
A protective element (11) comprises: an insulating substrate (26); a first electrode (22) and a second electrode (23) provided to the insulating substrate (26) so as to be separated from each other; a heating resistor (24) provided to the insulating substrate (26); an intermediate electrode (21) provided between the first electrode (22) and the second electrode (23); and a fuse element (20) that is provided across the first electrode (22) and the second electrode (23), is fixed to the first electrode (22), the second electrode (23), and the intermediate electrode (21) via a conductive fixing member (28), and is melted when heated to a prescribed temperature or higher by the heating resistor (24). Recesses (60) recessed in the thickness direction from the surface of the fuse element (20) are formed in the fuse element (20). A part of the fixing member (28) is provided in the recesses (60).
H01H 85/10 - Fusible members characterised by the shape or form of the fusible member with constriction for localised fusing
H01H 37/76 - Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
Provided is a film-shaped sealant with which mounting of an electronic component, e.g., a chip, on a substrate can be performed simultaneously with en bloc sealing of the entire electronic component in a reflow step in a solder reflow mounting process. A film-shaped sealant 4 comprises a film-forming component, a thermosetting monomer, and a curing agent or polymerization initiator and has a melt viscosity at 220°C of 25-70 Pa·s. A circuit device 10 includes a component 2 for mounting which has been mounted on a circuit board 1 and sealed with a cured object 4A formed from the film-shaped sealant 4.
An optical laminate 102 comprises in the following order: a transparent base material 11; a hard coat layer 12; an adhesion layer 13 comprising a sputtered film; an optical function layer 14 in which high refractive index layers each comprising a sputtered film and low refractive index layers each having a refractive index lower than that of the high refractive index layer are alternately laminated; and an antifouling layer 15. The hard coat layer 12 contains a silica filler, and the optical laminate satisfies condition 1 and condition 2. Condition 1: The ratio ((A)/(B)) of Martens hardness (A) on the optical laminate antifouling layer side to Martens hardness (B) on a hard coat layer side of a laminate having only the transparent base material and the hard coat layer is 3.6 or less. Condition 2: The difference in contact angle with respect to water between before and after friction is 20° or less in a case where a friction tester using steel wool conforming to JIS L0849 is used to horizontally reciprocate the steel wool 200 times.
B32B 27/20 - Layered products essentially comprising synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
G02B 1/18 - Coatings for keeping optical surfaces clean, e.g. hydrophobic or photo-catalytic films
A protective element includes: an insulating substrate; first and second electrodes provided on the insulating substrate; a heating element formed on the insulating substrate; a heating-element extraction electrode electrically connected to the heating element; a fusible conductor mounted from the first electrode to the second electrode with the heating-element extraction electrode interposed between the first and second electrodes; and an insulating protective layer which covers the heating element and includes a thermally conductive filler.
H01M 50/583 - Devices or arrangements for the interruption of current in response to current, e.g. fuses
H01H 85/00 - Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
H01M 10/653 - Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
An image display device including an image display panel and a front panel that are laminated via a transparent resin layer, when a photocurable material for forming the transparent resin layer is used as a dam agent or a fill agent, the photocurable material includes a component (a), which is a (meth)acrylic acid ester component; a component (b), which is a plasticizer component; and a component (c), which is a photopolymerization initiator component in order to make it difficult to visually recognize a knit line between the dam portion and the fill portion of the transparent resin layer after curing. A difference between the refractive index of the photocured product of the component (a), which is the (meth)acrylic acid ester component and the refractive index of the plasticizer component as the component (b) is 0.02 or less.
A protective element (11) comprises: an insulating substrate (26); terminal parts (22, 23) provided on the insulating substrate (26); a heating resistor (24) provided on the insulating substrate (26); and a fuse element (20) that is joined to the terminal parts (22, 23) by solder (28) using an epoxy-based flux (29) as an auxiliary agent, and that melts when heated to a prescribed temperature or higher by the heating resistor (24).
H01H 37/76 - Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
A protective element (11) is provided with a fuse element (20) via a fixing solder (28) on electrodes (21, 22, 23) on an insulating substrate (26). A solidus temperature (T1) of the fixing solder (28) is greater than a solidus temperature T2 of the fuse element (20) (T2 < T1).
H01H 37/76 - Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
45.
TACKY AGENT-FORMING COMPOSITION AND PRODUCTION METHOD THEREOF, AND TACKY AGENT COMPOSITION
A tacky agent-forming composition includes a polylactic acid structure-including monofunctional (meth)acrylic monomer, a polylactic acid structure-including polyfunctional (meth)acrylic monomer, and a polylactic acid structure-including non-functional compound. A content of the polylactic acid structure-including non-functional compound is 10% by mole or more.
A production method for a resin pattern according to the present invention includes: a step for filling a resin composition into a plate on which a pattern having a recess is formed; a step for using an adhesive tape having a support and an adhesive agent layer to transfer the resin composition to the surface of the adhesive agent layer of the adhesive tape; and a step for transferring the resin composition provided on the surface of the adhesive agent of the adhesive tape to a transfer base material.
Provided is a filler array film which does not require individualization by a laser lift-off method and can be formed by using a simple transfer mold. The filler array film has a filler-retaining insulating resin layer and a filler, wherein recesses and protrusions are formed on one surface of the filler-retaining insulating resin layer, and at least one filler group composed of a plurality of fillers is arranged on the protrusions. The protrusions are preferably regularly arranged. In the filler group, a plurality of fillers are preferably regularly arranged. It is preferable that no filler is disposed in the recesses.
H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between their connecting locations
C08K 3/013 - Fillers, pigments or reinforcing additives
C08L 101/00 - Compositions of unspecified macromolecular compounds
H01B 5/16 - Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
H01R 43/00 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
Provided is a method for repairing a light-emitting device in which a plurality of µLEDs are mounted through a first electroconductive film in which first electroconductive particles are held by a first insulating resin layer, wherein the µLED to be repaired is identified from among the mounted µLEDs, the identified µLED is removed from a translucent substrate by a laser lift-off method, an electroconductive film for repair in which second electroconductive particles are held by a second insulating resin layer is installed in the shape of an individual piece on the portion of the translucent substrate from which the µLED was removed, and next a µLED for repair is installed, after which the µLED for repair is mounted to the translucent substrate by thermocompression bonding, and finally the operation of the light-emitting device is confirmed. In particular, as the second electroconductive particles of the second electroconductive film for repair, particles having a particle diameter larger than that of the first electroconductive particles of the first electroconductive film are used, or particles that are less likely to collapse than the first electroconductive particles of the first electroconductive film are used.
A silicon nitride film is formed on the surface of the semiconductor substrate by supplying a raw material gas containing SiH4, NH3 and N2 into a reaction chamber by a plasma-accelerated chemical vapor deposition method, the ratio of the binding energy of the Si—H bond to the binding energy of the N—H bond in the silicon nitride film is defined as the binding energy ratio, and the ratio of the supply flow rate of NH3 to SiH4 is defined as the supply flow rate ratio, the supply flow rate ratio is set so that the sum of the concentration of the N—H bond multiplied by the binding energy ratio and the concentration of the Si—H bond is minimized.
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between their connecting locations
H01R 43/00 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
51.
FILLER-CONTAINING FILM, JOINED BODY AND METHOD FOR PRODUCING SAME
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between their connecting locations
H01R 43/00 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
121d1ddtdd12tdd is the average particle size [μm] of the filler, L is the distance [μm] in the film thickness direction between the center line X of the core film and the center line Y of the filler; and S is the percentage [%] of displacement of the filler relative to the core film in the film thickness direction. Note that regarding the negative and positive of "L", L is positive toward the insulating base layer side.
H01B 5/16 - Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between their connecting locations
Provided is a method for manufacturing a connection structure in which a second component, such as a μLED finer than a first component, such as a wiring board, is bonded to a predetermined region of the first component. The method comprises: a step A for disposing, between the first component and the second component, a guide film having a through-hole through which the second component can pass; a step B for passing the second component through the through-hole of the guide film to dispose the second component in a predetermined region of the first component; and a step C for bonding the second component to the predetermined region of the first component. In the step C, the second component is bonded to the predetermined region of the first component via a connection material between the predetermined region of the first component and the second component.
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
H05K 3/04 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
54.
FILLER-CONTAINING FILM, CONNECTION STRUCTURE, AND PRODUCTION METHOD FOR SAME
Provided is a novelly-structured filler-containing film that, when used as an anisotropic conductive film, can suppress unnecessary movement of a filler such as conductive particles during anisotropic conductive connection, does not allow disruption of the regular arrangement of the filler, and does not reduce conductivity. The filler-containing film has a structure formed by layering, in order, a first insulation layer, an intermediate layer, and a second insulation layer. The first insulation layer has first recesses on the intermediate layer side, and the intermediate layer has second recesses that have a side wall part and a bottom lid part. The second recesses fit into the first recesses of the first insulation layer, and the filler is retained in the second recesses. The thickness of the bottom lid part of the second recesses of the intermediate layer is no more than 0.5 times the average particle size of the filler.
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
H01B 5/16 - Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between their connecting locations
When a connection structure is manufactured by carrying out anisotropic electroconductive connection of a first electronic component such as an IC chip that is an anisotropic electroconductive connection object to a second electronic component such as a wiring board using an anisotropic electroconductive film, the anisotropic electroconductive film, for which shorts and conduction failures do not occur, has an elastomer layer provided with through-holes, a first electrode formed on the obverse surface of the elastomer layer, and a second electrode formed on the reverse surface thereof. The first electrode and the second electrode are made conductive via an electroconductive layer formed on the inner walls of through-holes in an insulating resin layer of the elastomer layer. The compression hardness of the elastomer layer at 20% compression deformation is 1500-8000 MPa.
H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between their connecting locations
H01R 43/00 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
A protection element includes: a fuse element configured to be energized in a first direction, which is a direction from a first end portion of the fuse element to a second end portion of the fuse element; a shielding member including a plate-shaped part, configured to rotate around a rotation axis extending in a second direction orthogonal to the first direction, wherein the plate-shaped part viewed from the fuse element is divided to a first portion and a second portion at a contact position between the plate-shaped part and the rotation axis, and an area of the first portion and an area of the second portion are different from each other; and a case having therein a housing portion. Pressure elevation in the housing portion due to an arc discharge causes the shielding member to rotate around the rotation axis and the shielding member divides the housing portion.
H01H 85/38 - Means for extinguishing or suppressing arc
H01H 85/00 - Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
H01H 85/06 - Fusible members characterised by the fusible material
H01H 85/10 - Fusible members characterised by the shape or form of the fusible member with constriction for localised fusing
H01H 85/17 - Casings characterised by the casing material
57.
METHOD FOR PRODUCING ELECTRONIC DEVICE, AND COVER GLASS
[Problem] To suppress the generation of an outgas in order to suppress deterioration of the optical characteristics of a cover glass. [Solution] This method for producing an electronic device comprises: a baking step for heating a cover glass on which an antireflective layer that is formed of a cured product of an uncured photocurable resin containing a photopolymerization component is formed; an assembly step for installing the cover glass after the baking step in a position facing a light-receiving surface of a sensor element and assembling a sensor module; and a reflow step for placing the sensor module on a mounting substrate and heating the sensor module at a temperature higher than or equal to 250°C so as to solder the sensor module onto the mounting substrate. The baking step is performed before the reflow step so that, in the reflow step, the generation ratio of an outgas derived from the photopolymerization component among the outgasses generated from the antireflective layer of the cover glass is less than or equal to 0.3% by mass with respect to the mass of the antireflective layer.
C08F 220/28 - Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
G02B 1/118 - Anti-reflection coatings having sub-optical wavelength surface structures designed to provide an enhanced transmittance, e.g. moth-eye structures
58.
LAMINATE, LAMINATE FOR OUTDOOR USE, AND HARD COAT LAYER-FORMING MATERIAL
To provide a laminate including a base, a hard coat layer disposed on the base, and a dry film layer disposed on the hard coat layer. The hard coat layer includes a polysilsesquioxane derivative. An abundance ratio [(Si/C)×100] of silicon atoms Si to carbon atoms C existing at a surface of the hard coat layer facing the dry film layer is 30% or greater.
A reflective optical sensor (1) has first and second cases (11, 21) each equipped with first and second paraboloid mirrors (14, 24) and the symmetry axes (A1, A2) which intersect on the opposite side to the vertice (V1, V2) with respect to the focal points (F1,F2), and the light emitting element (12) is fitted at or near the focal point (F1) so as to face the first paraboloid mirror (14), the light receiving element (22) is fitted at or near the focal point (F2) so as to face the second paraboloid mirror (24), and the first and second cases (11, 21) are filled with sealing resin (2).
An optical laminate, includes: a transparent substrate; at least one hard-coat layer provided on the transparent substrate, the at least one hard-coat layer being made of a resin composition; and at least one metal-oxide layer provided on the hard-coat layer, the at least one metal-oxide layer being made of a metal oxide. A concave/convex structure is formed on the metal-oxide-layer-side surface of the hard-coat layer. A height distribution of a surface of the concave/convex structure satisfies formula (1): A/1.9
A roll manufacturing apparatus includes a rotary device including a rotary encoder, a cutting tool stage that holds a spindle unit, which includes a rotatable cutting blade, reciprocatably in a radial direction of a roll and is movable in the radial direction of the roll, a signal generator that generates, based on signals output from the rotary encoder, a control waveform indicating a movement pattern to reciprocate the cutting blade at positions corresponding to predetermined cutting portions, and a controller that moves the cutting tool stage so that a cutting process of reciprocating the cutting blade in the radial direction of the roll while rotating the cutting blade, according to the control waveform, to perform cutting once or multiple times with the cutting blade at a predetermined cutting depth is performed multiple times.
A thermally conductive sheet including: a cured material of a composition including: a binder resin, an anisotropically thermally conductive filler, and an additional thermally conductive filler other than the anisotropically thermally conductive filler. The thermally conductive sheet satisfies condition 1: a tack force of the thermally conductive sheet is 80 gf or higher; and condition 2: a bleed amount of the binder resin is 0.20 g or less after the thermally conductive sheet, which has a size of 25 mm×25 mm and a thickness of 1 mm, is left standing for 48 hours at 125° C. in a state of being compressed by 40%.
A composite conductive particles capable of suppressing cracking and peeling of metal films to provide excellent adhesion of metal films, and a method for manufacturing a composite conductive particle. The composite conductive particle includes a host particle; and adhesive fine particles arranged on a surface of the host particle and containing oxygen atoms; and conductive fine particles in contact with the adhesive fine particle. By arranging adhesive fine particles containing oxygen atoms on the surface of the host particle and bringing the conductive fine particles into contact with the adhesive fine particles, it is possible to achieve excellent adhesion of the metal film.
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
B23K 35/02 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
B23K 35/30 - Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
B23K 35/36 - Selection of non-metallic compositions, e.g. coatings, fluxesSelection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
H02J 7/00 - Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
H01H 85/11 - Fusible members characterised by the shape or form of the fusible member with applied local area of a metal which, on melting, forms a eutectic with the main material of the fusible member, i.e. M-effect devices
H02H 7/18 - Emergency protective circuit arrangements specially adapted for specific types of electric machines or apparatus or for sectionalised protection of cable or line systems, and effecting automatic switching in the event of an undesired change from normal working conditions for batteriesEmergency protective circuit arrangements specially adapted for specific types of electric machines or apparatus or for sectionalised protection of cable or line systems, and effecting automatic switching in the event of an undesired change from normal working conditions for accumulators
A reflective optical sensor, which detects an object to be detected by detecting light reflected by the object by means of a light emitting element and a light receiving element, has an case of an open box shape in which first and second concave mirrors each having a reflective parabolic surface are formed. These first and second concave mirrors are formed so that the symmetry axes of the first and second concave mirrors intersect with a predetermined intersection angle on opposite side to the apexes of the first and second concave mirrors with respect to first and second focal points of the mirrors. Light emitted by the light emitting element travels through the first concave mirror, the object, the second concave mirror and the light receiving element.
A reflective optical sensor (1A) having a light emitting element (3) and a light receiving element (4) detects an object (OB) to be detected by reflected light reflected by the object (OB), and the sensor(1A) has an case (2) in which first and second concave mirrors (5, 6) are fitted, each of which has a reflective surface comprising a partial concave surface of a rotational ellipse surface rotated around a major axis, one focal point of the first concave mirror (5) and one focal point of the second concave mirror (6) are coincide to be a common focal point (F0), and the light emitting element (3) is fitted at the focal point (F1), the light receiving element is fitted at the focal point (F2).
H01L 31/0232 - Optical elements or arrangements associated with the device
H01L 31/16 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources
A display unit that includes an image display part and a light-transmitting protective part arranged on the image display part. A cured resin layer is arranged between the display part and the protective part. The cured resin layer can have a transmittance of 90% or higher in the visible range and a storage modulus at 25° C. of 1×107 Pa or less. The cured resin layer can be formed from a resin composition that has a cure shrinkage of 5% or less.
C08L 9/00 - Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
C08L 19/00 - Compositions of rubbers not provided for in groups
C08L 45/00 - Compositions of homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic ring systemCompositions of derivatives of such polymers
C08L 51/04 - Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers grafted on to rubbers
C09J 109/00 - Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
C09J 133/06 - Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors
This fuse element (50) comprises: a first element (51) which is formed of silver, copper, or an alloy that is mainly composed of silver or copper; a second element (52) which is formed of silver, copper, or an alloy that is mainly composed of silver or copper, while being connected in series with the first element (51) on a conduction path; and a connection metal (86) which is formed of tin or an alloy that is mainly composed of tin, and which connects an end (51a) of the first element (51) and an end of the second element (52) to each other.
H01H 85/11 - Fusible members characterised by the shape or form of the fusible member with applied local area of a metal which, on melting, forms a eutectic with the main material of the fusible member, i.e. M-effect devices
H01H 37/76 - Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
H01H 85/06 - Fusible members characterised by the fusible material
H01H 85/08 - Fusible members characterised by the shape or form of the fusible member
H01H 85/12 - Two or more separate fusible members in parallel
69.
COPOLYMER, HYDROPHILIC AND OLEOPHOBIC COMPOSITION, HYDROPHILIC AND OLEOPHOBIC FILM, HYDROPHILIC AND OLEOPHOBIC LAMINATE, AND ARTICLE
Provided is a copolymer formed of hydrophilic trialkoxysilane and oleophobic trialkoxysilane. In a preferred mode, a structural unit deriving from the hydrophilic trialkoxysilane constitutes 50 mol%-90 mol% and a structural unit deriving from the oleophobic trialkoxysilane constitutes 10 mol%-50 mol%.
C08G 77/24 - Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen halogen-containing groups
B32B 17/10 - Layered products essentially comprising sheet glass, or fibres of glass, slag or the like comprising glass as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
To provide a resin composition for three-dimensional shaping. The resin composition includes a polyfunctional urethane (meth) acrylate having a molecular weight of 700 or greater and 1,300 or less.
B29C 64/124 - Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
B29K 33/00 - Use of polymers of unsaturated acids or derivatives thereof, as moulding material
[Problem] To reduce fluctuations in the thickness of an uncured resin layer during transfer in imprint molding. [Solution] This optical member manufacturing method comprises: a resin supply step for supplying an uncured resin composition 600 to a surface of a base material 500 of an optical member; and a transfer step for transferring a fine uneven structure of a mold 10 onto the uncured resin composition 600. The mold 10 has a laminate structure in which a mold substrate 12, an adhesive film 14, and a film mold 16 with the fine uneven structure are laminated together in this order. The mold substrate 12 has a thickness of 0.5 mm or more and a shore A hardness of 90 degrees or more. The adhesive film 14 is a film with adhesive properties on both surfaces. The adhesive force of the surface on the film mold 16 side of the adhesive film 14 is smaller than the adhesive force of the surface on the mold substrate 12 side thereof.
B29C 59/04 - Surface shaping, e.g. embossingApparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
B29C 33/38 - Moulds or coresDetails thereof or accessories therefor characterised by the material or the manufacturing process
B29C 59/02 - Surface shaping, e.g. embossingApparatus therefor by mechanical means, e.g. pressing
G02B 1/118 - Anti-reflection coatings having sub-optical wavelength surface structures designed to provide an enhanced transmittance, e.g. moth-eye structures
Provided is a film structure that makes it possible to stick an adhesive layer to an electronic component that has a recess at a mounting surface. A film structure according to the present invention comprises a base material 2 and an adhesive film 3 that is to be stuck to an adherend. The film structure has a sticking part 4 at which the adhesive film 3 is provided to an upper surface and a non-sticking part 5 at which the adhesive film 3 is not provided. The sticking part 4 protrudes further than the non-sticking part 5.
The micro-lens array is a micro-lens array in which a plurality of micro-lenses are arranged in a matrix in a plan view, wherein each of the plurality of micro-lenses has four main sides in a plan view, and each of the four main sides is inclined with respect to a row virtual line parallel to a row direction or a column virtual line parallel to a column direction.
G02B 27/00 - Optical systems or apparatus not provided for by any of the groups ,
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
A fuse element includes a low-melting-point metal plate, a first high-melting-point metal layer, and a second high-melting-point metal layer. The low-melting-point metal plate has a first main surface, a second main surface, a first side surface, and a second side surface. The first main surface and the second main surface face each other. The first side surface and the second side surface face each other and each connect the first main surface and second main surface. The first high-melting-point metal layer is disposed on the first main surface and second main surface. The second high-melting-point metal layer is disposed on the first side surface and second side surface. The fuse element has a cut-out portion in which at least a portion of the second high-melting-point metal layer is cut out.
H01H 85/00 - Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
[Problem] To provide a light-receiving device having a concave mirror and a semiconductor light-receiving element, configured so as to be able to suppress a decrease in light incident on a photodiode. [Solution] A light-receiving device (1) having a semiconductor light-receiving element (10), in which a photodiode (16) is formed on a main surface (12a) side of a first semiconductor substrate (12), and a concave mirror (20), which reflects incident light (I) towards said semiconductor light-receiving element (10), wherein the concave mirror (20) includes: a flat first surface (22a) of a second semiconductor substrate (22), said first surface (22a) being transparent to the incident light (I); a convex surface (22c) which, on the side thereof nearer a second surface (22b) opposite said first surface (22a), is formed so as to be convex in the direction opposite to that of the first surface (22a); and a reflective film (23) which is formed on said convex surface (22c), the incident light (I) incident from the first surface (22a) side being reflected by the reflective film (23) and focussed at a focussing position (F1) close to the first surface (22a), the semiconductor light-receiving element (10) being fixed to the first surface (22a) of the second semiconductor substrate (22) so as to overlap the focussing position (F1) of the concave mirror (20).
H01L 31/0232 - Optical elements or arrangements associated with the device
H01L 31/10 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by at least one potential-jump barrier or surface barrier, e.g. phototransistors
This optical multilayer body comprises a resin base material, a barrier layer and a first layer. The barrier layer is sandwiched between the resin base material and the first layer. The barrier layer contains silicon oxide, while the first layer contains silicon nitride or silicon oxynitride. The film thickness of the barrier layer is 4 nm or more. The oxygen content of the first layer is 40 atm% or less.
[Problem] To provide a photocurable acrylic resin for imprinting that lowers the viscosity of an uncured resin composition and gives a cured resin composition excellent heat resistance. [Solution] A photocurable acrylic resin for imprinting according to the present invention includes a photopolymerization component that includes a resin (A) and a resin (B). The resin (A) is (octahydro-4,7-methano-1H-indenediyl)bis(methylene)diacrylate, and the resin (B) is a difunctional acrylate monomer that has a viscosity of no more than 10 mPa⋅s at 25°C. The resin (A) content relative to the entire photopolymerization component is at least 20 mass% but no more than 40 mass%, and the total resin (A) and resin (B) content relative to the entire photopolymerization component is no more than 70 mass%.
[Problem] To suppress deterioration of a grid structure having a complex relief structure and improve reliability when the grid structure is coated with a thin protective film, while also maintaining the optical characteristics of a wire grid polarization element. [Solution] A wire grid polarization element 1 comprises a substrate 10, a grid structure 20 in which a base part 21 and a plurality of ridge parts 22 are integrally formed, a functional film 30 which partially covers the ridge parts 22, and a protective film 40. The functional film 30 envelops the top parts of the ridge parts 22 but does not cover the base part 21 or the bottom side of the ridge parts 22. The coverage ratio (Rc) thereof is 30-70%. The protective film 40 covers, in a continuous manner, a surface of the functional film 30, a lower side of both side faces of the ridge parts 22, and a surface of the base part 21. When Tt is defined as the thickness of the protective film 40 covering the top part of the functional film 30 and Bt is defined as the thickness of the protective film 40 covering the lower side of both side faces of the ridge parts 22 and the surface of the base part 21, "Bt/Tt≥0.85" is satisfied.
A semiconductor light receiving element in which a photodiode is formed on the main surface side of a first semiconductor substrate, and a cone ave mirror reflecting an incident light toward the light receiving element. The concave mirror comprises a flat first surface of the second semiconductor substrate that is transparent to the incident light, a convex surface formed in a convex shape toward the side opposite to the first surface on the second surface side opposite to the first surface, and a reflective film formed on the convex surface, and the incident light entering from the first surfaceside is reflected by the reflective film to a condensing positionnear the first surface, and the light receiving element was fixed to the first surface so as to overlap the light focusing position of the concave mirror.
H01L 31/0232 - Optical elements or arrangements associated with the device
H01L 31/028 - Inorganic materials including, apart from doping material or other impurities, only elements of Group IV of the Periodic System
H01L 31/0304 - Inorganic materials including, apart from doping materials or other impurities, only AIIIBV compounds
H01L 31/0328 - Inorganic materials including, apart from doping materials or other impurities, semiconductor materials provided for in two or more of groups
80.
LIQUID LEAKAGE REPAIR COMPOSITION AND LIQUID LEAKAGE REPAIR METHOD
Provided is a liquid leakage repair composition that contains rubber, particles, a polymerizable compound, a tackifier, and a photopolymerization initiator. The difference (A-B) between the refractive index A of the particles and the refractive index B of a liquid leakage repair composition that does not contain the particles is no more than ±0.04.
[Problem] To provide a wire grid polarizing element having an excellent heat dissipation characteristic as well as an excellent transmission characteristic for obliquely incident light in a wide range of incidence angles and an excellent polarization splitting characteristic. [Solution] A wire grid polarizing element 1 is provided with: a substrate 10 which comprises an inorganic material; a grid structure 20 which comprises an organic material, and in which a base part 21 provided on the substrate 10 and a plurality of ridges 22 are integrally formed; and a functional film 30 which comprises a metal material and partially covers each of the ridges 22. Each of the ridges 22 has a tapered shape with a width gradually decreasing with increasing distance from the base part 21. The functional film 30 envelops a top part of the ridge 22 and does not cover the bottom side of the ridge 22 and the base part 21. The coverage (Rc) of the side surface of the ridge 22 by the functional film 30 is 30-70% inclusive. At least the portion covered with the functional film 30 of the ridge 22 is inclined at an inclination angle (α) of more than 0° but 15° or less with respect to the normal direction of the substrate 10.
This liquid leakage-repairing method comprises: a first actinic ray-curable resin layer formation step for forming a first actinic ray-curable resin layer in a seamless state on an object to be repaired in such a manner that a portion of the object to be repaired including a liquid leakage site is exposed; and an integration step for integrating the first actinic ray-curable resin layer with a second actinic ray-curable composition by pressing the second actinic ray-curable composition against the exposed portion of the object to be repaired including the liquid leakage site.
This anti-reflection body has, on a substrate having a refractive index of 1.60 to 1.90 at a wavelength of 589 nm, a cured product of a curable composition containing metal oxide nanoparticles, a polymerizable monomer, and a photopolymerization initiator, wherein the cured product has a fine uneven structure.
G02B 1/118 - Anti-reflection coatings having sub-optical wavelength surface structures designed to provide an enhanced transmittance, e.g. moth-eye structures
A mold production method according to the present invention comprises: a signal generation step for generating gradation signals in correspondence with a plurality of cutting holes that constitute an object to be drawn on a mold base material; a control waveform generation step for generating, on the basis of the gradation signals corresponding to the cutting holes, a control waveform that indicates a movement pattern of a cutting blade 12; and a cutting step for moving the cutting blade 12 according to the control waveform and cutting the mold base material. In the control waveform generation step, a control waveform is generated for each group of cutting holes which, from among a plurality of cutting holes arranged in one direction, do not overlap each other and on the basis of gradation signals that correspond to the cutting holes constituting the group. In the cutting step, the cutting blade 12 is moved according to each of a plurality of control waveforms generated for the respective groups and cuts the mold base material to a prescribed depth.
This sheet-like structure comprises a porous structural layer having a surface at which at least a portion of a flow passage of a porous structure through which a fluid can flow is exposed, and a support layer, characterized in that the flow passage includes a separating portion which separates the adjacent flow passage, and which is capable of interrupting the flow of the fluid through the flow passage.
G01N 35/08 - Automatic analysis not limited to methods or materials provided for in any single one of groups Handling materials therefor using a stream of discrete samples flowing along a tube system, e.g. flow injection analysis
B01J 19/00 - Chemical, physical or physico-chemical processes in generalTheir relevant apparatus
B32B 5/18 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by features of a layer containing foamed or specifically porous material
G01N 37/00 - Details not covered by any other group of this subclass
86.
ANTIFOULING COATING COMPOSITION, ANTIFOULING COATING FILM, ANTIFOULING COATING LAMINATE, AND METHODS FOR PRODUCING SAME
An antifouling coating composition according to the present invention contains: an oligomer of a quaternary ammonium salt-type alkoxy silane; and an alkoxy silane having a perfluoropolyether structure.
Provided is an anisotropic conductive film that has high adhesive strength. An anisotropic conductive film according to the present invention comprises: a binder composition containing an epoxy compound and a film formation component; an anionic latent curing agent that cures the epoxy compound; a silane coupling agent which has two or more mercapto groups within the molecule and in which the main chain is an organic chain; and conductive particles.
C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
H01B 5/16 - Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
The testing chip includes a first layer on one surface side and a second layer on another surface side, in which either the first layer or the second layer has a liquid-receiving section A, the first layer has at least a detection-confirming section B, the second layer has at least a liquid-distributing section D adjacent to the detection-confirming section B and a liquid flow path E connected to the liquid-distributing section D, the testing chip is configured such that when the test liquid is dropped onto the liquid-receiving section A, the test liquid distributes in a predetermined order by capillary action to reach the detection-confirming section B, and among surfaces of the first layer and surfaces of the second layer, at least surfaces of material M other than the liquid-receiving section A are sealed with a film.
B01L 3/00 - Containers or dishes for laboratory use, e.g. laboratory glasswareDroppers
G01N 21/78 - Systems in which material is subjected to a chemical reaction, the progress or the result of the reaction being investigated by observing the effect on a chemical indicator producing a change of colour
89.
ANTIFOULING COATING COMPOSITION, ANTIFOULING COATING FILM, ANTIFOULING LAMINATE, AND METHODS FOR PRODUCING SAME
The antifouling coating composition of the present invention contains: a copolymer compound of a fluorinated alkyl alkoxysilane and a quaternary ammonium salt-type alkoxysilane; and an alkoxysilane having a perfluoropolyether structure.
A laminate structure comprises: a first sheet-like structure having a porous structure which serves as a flow path and which is exposed at the surface of the first sheet-like structure; a second sheet-like structure having a porous structure which serves as a flow path and which is exposed at the surface of the second sheet-like structure; and an adhesive layer disposed between the first and second sheet-like structures and contacting a section of the surface of the porous structures, such that the porous structure of the first sheet-like structure and the porous structure of the second sheet-like structure face each other and also such that the first sheet-like structure and the second sheet-like structure do not separate from each other.
G01N 35/08 - Automatic analysis not limited to methods or materials provided for in any single one of groups Handling materials therefor using a stream of discrete samples flowing along a tube system, e.g. flow injection analysis
B81B 1/00 - Devices without movable or flexible elements, e.g. microcapillary devices
B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
G01N 37/00 - Details not covered by any other group of this subclass
91.
ANISOTROPIC CONDUCTIVE FILM, ELECTRONIC COMPONENT MANUFACTURING METHOD, AND CARD LAMINATED BODY
A conductive particle-containing hot melt adhesive sheet 60 that is an anisotropic conductive film for use in joining an IC chip 10 and a base material 30 includes solder particles that are non-eutectic alloy or eutectic alloy and a thermoplastic resin. The conductive particle-containing hot melt adhesive sheet 60 has an area ratio of the solder particles of 8 to 50% and a viscosity of 1000 to 100000 Pa·s at the solidus temperature of the solder particles.
H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between their connecting locations
B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
C22C 11/06 - Alloys based on lead with tin as the next major constituent
This micro-LED device, in which a color conversion layer is disposed directly above a micro-LED that is disposed on a circuit board, is manufactured by: disposing the micro-LED on the circuit board; causing a color conversion layer of a color conversion optical sheet material with said color conversion layer formed on one surface of a light-transmitting sheet base material to face the micro-LED; and emitting laser light from the light-transmitting sheet base material side to the color conversion layer of the color conversion optical sheet material, thereby transferring the color conversion layer to directly above the micro-LED.
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
G09F 9/30 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
G09F 9/33 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
H01L 33/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof
A composition for repairing liquid leakage which contains a (meth)acrylic compound having a weight-average molecular weight of 600 or greater and which is compatible, or a composition for repairing liquid leakage which has a storage modulus G' of 10,000-550,000 Pa inclusive and a loss tangent (tanδ) of greater than 1.
A display device includes a plurality of light emitting elements, a substrate, and a cured resin film. The substrate has the plurality of light emitting elements thereon. The plurality of light emitting elements form an array, each corresponding to a subpixel constituting one picture element. The cured resin film connects the plurality of light emitting elements and the substrate. The cured resin film is composed of a plurality of individual pieces and has an exposed portion in which the substrate is exposed between the plurality of individual pieces.
H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
95.
WIRE GRID POLARIZING ELEMENT, METHOD OF MANUFACTURING WIRE GRID POLARIZING ELEMENT, AND OPTICAL APPARATUS
A wire grid polarizing element is provided that includes: a transparent substrate; and grid-like projections arranged on one surface of the transparent substrate with a pitch shorter than the wavelength of light in a used band, and extending in a predetermined direction. The transparent substrate is transparent to light in the used band. The grid-like projections each have a reflective layer, the dielectric layer, and an absorption layer, and have a surface on at least a part of which an inorganic structure capable of expressing water repellency exists.
[Problem] To provide an optical electric power supply converter that makes it possible to suppress any increase in the temperature of a semiconductor light-receiving element. [Solution] An optical electric power supply converter (1) has: a semiconductor light-receiving element (10) that converts, into electricity, an input light (L1) that has been inputted via an optical fiber cable; and a base (3) for securing the semiconductor light-receiving element (10). In the semiconductor light-receiving element (10), a photodiode (12) is provided on a first surface (11a) side of a semiconductor substrate (11) that is transparent with respect to the input light (L1), the first surface (11a) being secured to the base (3). A heat-conducting member (7) that is in close contact with a second surface (11b) side on the opposite side of the semiconductor substrate (11) from the first surface (11a) is secured to the base (3), the heat-conducting member (7) being transparent with respect to the input light (L1). The input light (L1) passes through the heat-conducting member (7) and enters the semiconductor light-receiving element (10), and part of the heat of the semiconductor light-receiving element (10) is transferred to the base (3) via the heat-conducting member (7).
Provided are a connection material with which it is possible to obtain excellent connection reliability and repairability, a connection structure, and a method for producing a connection structure. The connection material contains an ionically polymerizable compound, an ionic polymerization initiator, and a caprolactone derivative. The content of the caprolactone derivative is 5-40 mass parts per 100 total mass parts of the ionically polymerizable compound and the caprolactone derivative. The glass transition temperature of the cured product can be adjusted thereby, and excellent connection reliability and repairability can be obtained.
A roll mold manufacturing method using a roll mold manufacturing apparatus, the apparatus comprising a rotary device configured to rotate a roll base material having either a tubular shape or a circular-column shape, and a predetermined machining stage comprising multiple cutting blades, the method comprising: a P cutting step of cutting a roll base material surface with a P cutting blade on the machining stage while moving the machining stage in a direction of an orientation P along the roll length direction; subsequently a step of switching from the P cutting blade to an N cutting blade on the machining stage; and subsequently an N cutting step of cutting the roll base material surface with the N cutting blade on the machining stage while moving the machining stage in a direction of another orientation N along the roll length direction.
A protective element includes a base substrate, a fusible conductor, a heater, and a heater-attached substrate. The base substrate has a first electrode and a second electrode formed thereon, the first electrode and the second electrode each being connected to an external circuit. The fusible conductor is supported on a first surface thereof by the base substrate and connected to the first electrode and the second electrode. The heater is configured to fuse the fusible conductor by generating heat. The heater-attached substrate has the heater provided thereon. The fusible conductor has one contact with the heater-attached substrate and the one contact is positioned on a second surface of the fusible conductor, which is an opposite surface to the first surface.
H01H 85/00 - Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
H01H 85/20 - Bases for supporting the fuseSeparate parts thereof
H01M 10/42 - Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
H01M 10/48 - Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte
H01M 50/583 - Devices or arrangements for the interruption of current in response to current, e.g. fuses
H05B 3/26 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
A light receiving device comprises a condensing lens, a lens holder for mounting the condensing lens, a semiconductor light receiving element, and a lens holder, and the light transmitted through the condensing lens enters the semiconductor light receiving element via the optical path section in the lens holder. The condensing lens is a compound eye lens with a plurality of convex lens surfaces on one side, and the lens holder connects the condensing lens to the semiconductor light receiving element, and has a cylindrical reflective surface facing the optical path section formed in such a way that the diameter and a diameter decreasing rate become smaller as it approaches the semiconductor light receiving element.
