The present invention relates to a device (1) for conducting an electrical current, comprising an electrically insulating substrate (3) comprising a first side (3a), a first electrical conductor (4) arranged on the substrate (3) and comprising a first portion (40) protruding from the first side (3a) of the substrate (3), and a metallic layer (2) arranged on the first side (3a) of the substrate (3), wherein said metallic layer (2) comprises a transition region (20) overlapping at least an edge region (400) of said first portion (40) of the first electrical conductor (4). According to the invention, said edge region (400) comprises a beveled or rounded cross-sectional contour in a cross-sectional plane extending orthogonal to the first side (3a) of the substrate (3).
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H05K 3/16 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material by cathodic sputtering
A multi-electrode array device (1) comprises a substrate (10) having a substrate body (100), and a multiplicity of electrodes formed by a multiplicity of needle elements (120) arranged on said substrate body (100) and spaced with respect to each other along a plane (P). The needle elements (120) are formed from a metal layer (12) arranged on said substrate body (100), each needle element (120) comprising a contact section (121) extending along said plane (P) and a needle section (122) extending from said contact section (121) and having a tip (123), wherein said needle section (122) is bent with respect to said contact section (121) such that the needle section (122) with its tip (123) protrudes from said plane (P).
A method for producing an electrically conducting structure (1), wherein the method comprises the steps of: providing an electrically insulating substrate (4) comprising a first side (4a), and sputtering, in a sputtering chamber, a first metal onto the first side (4a) of the substrate (4) to generate a first metallic layer (30) for superconducting an electrical current, and subsequently sputtering a second metal in said sputtering chamber onto the sputtered first metallic layer (31) to generate a second metallic layer.
An ultrasound transducing device comprising a carrier device (1) which has a body (10), said body (10) comprising at least one cavity (2) which is limited by a floor element (13) of the body (10) and comprises an opening (22), wherein a first metal layer (31) is arranged on the floor element (13) and the opening (22) is covered by a flexible membrane element (3) being configured and provided to oscillate in order to transmit and/or receive ultrasound waves (W), said membrane element (3) comprising a second metal layer (32). The membrane element (3) comprises a third metal layer (33), and a piezoelectric foil (30) which is sandwiched between the second and the third metal layer (32, 33).
B06B 1/02 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy
B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
The present invention relates to a device (1), comprising: an electrically conducting member (2) comprising a central portion (20) and an edge portion (21), the central portion (20) being integrally connected to the edge portion (21), wherein the edge portion (21) comprises a bottom side (21a), and a substrate (3) comprising a first side (3a) and a second side (3b) facing away from the first side (3a), wherein the electrically conducting member (2) is arranged on the first side (3a) of the substrate (3), wherein the edge portion (21) of the electrically conducting member (2) is embedded in the first side (3a) of the substrate (3) with the bottom side (21a) first, so that the bottom side (21a) of the edge portion (21) of the electrically conducting member (2) is arranged below a level of an adjacent surface portion (30) of the first side (3a) of the substrate (3).
The present invention relates to a method for encapsulating an electrical component (2) arranged on a circuit board (3), comprising the steps of: providing a circuit board (3) having a first substrate layer (4) comprising or essentially consisting of a thermoplastic LCP material, wherein the first substrate layer (4) forms a top surface area (40) with the electrical component (2) arranged thereon, the electrical component (2) being electrically connected to at least one electrically conducting contact structure (5) of the circuit board (3), wherein a frame structure (6) comprising or essentially consisting of a second thermoplastic material is arranged on the top surface area (40) and particularly connected to the at least one substrate layer (4), so that a recess (60) is formed on the circuit board (3), wherein the electrical component (2) is arranged in the recess (60), and filling a third thermoplastic material in a moldable state into the recess (60) to encapsulate the electrical component in the third thermoplastic material.
A tracking device (3) for tracking a circuit board panel (2) in a production apparatus (1) comprises a detection arrangement (30) operative to interact with a circuit board panel (2) for tracking the circuit board panel (2) in said production apparatus (1), and a processing device (31) for processing signals obtained using said detection arrangement (30) for tracking the circuit board panel (2) in said production apparatus (1). The detection arrangement (30) comprises a magnetic field generating device forming an air gap (304) through which the circuit board panel (2) is movable, the magnetic field generating device being configured to generate a magnetic flux across said air gap (304) and providing a signal indicative of an inductance of the magnetic field generating device, wherein said processing device (31) is operative to process a signal provided by the magnetic field generating device as a result of moving the circuit board panel (2) through said air gap (304).
G06K 19/06 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
G06K 7/08 - Methods or arrangements for sensing record carriers by means detecting the change of an electrostatic or magnetic field, e.g. by detecting change of capacitance between electrodes
8.
REINFORCED TRANSITIONS ON ELECTRICALLY CONDUCTING STRUCTURES
The present invention relates to a device (1) for conducting an electrical current, comprising an electrically insulating substrate (3) comprising a first side (3a), a first electrical conductor (4) arranged on the substrate (3) and comprising a first portion (40) protruding from the first side (3a) of the substrate (3), and a first metallic layer (2) arranged on the first side (3a) of the substrate (3), wherein said first metallic layer (2) comprises a transition region (20) overlapping at least a region of said first portion (40) of the at least one conductor (4). According to the present invention, a second metallic layer (6) is arranged on said transition region (20) of the first metallic layer (2) to reinforce said transition region (20).
H05K 3/16 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material by cathodic sputtering
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
9.
TRANSITION FROM A THIN FILM TO A THICK FILM IN ELECTRICALLY CONDUCTING DEVICES
The present invention relates to a device (1) for conducting an electrical current, comprising an electrically insulating substrate (3) comprising a first side (3a), a first electrical conductor (4) arranged on the substrate (3) and comprising a first portion (40) protruding from the first side (3a) of the substrate (3), and a metallic layer (2) arranged on the first side (3a) of the substrate (3), wherein said metallic layer (2) comprises a transition region (20) overlapping at least an edge region (400) of said first portion (40) of the first electrical conductor (4). According to the invention, said edge region (400) comprises a beveled or rounded cross-sectional contour in a cross-sectional plane extending orthogonal to the first side (3a) of the substrate (3).
H05K 3/16 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material by cathodic sputtering
The present invention relates to an implantable electrode (1) for an implantable medical device, the implantable electrode (1) having a substrate (2) comprising a substrate material (20); an electrode pole (3); and a connecting line (9) extending within the substrate (2), wherein the electrode pole (3) comprises an electrode pole surface (30) that is arranged on a surface of the substrate (2) and a contact line (33) electrically connecting the electrode pole surface (30) with the connecting line (9). According to an aspect of the invention, in a cross section of the implantable electrode (1), the electrode pole surface (30), a first section (31) of the contact line (33), a second section (32) of the contact line (33), and a section of the connecting line (9) at least partially surround a space (10) that is filled with the substrate material (20).
The present invention relates to Lab-on-PCB device (1), comprising a base layer (400), a printed circuit board (200) comprising a substrate (204) with a conductor structure (203), a first electronic component (206) being mounted on said substrate (204), and a first measuring electrode (209) being arranged on said substrate (204) at a sample contact area (208) at a first side of said substrate (204) and being electrically connected to said first electronic component (206) via said conductor structure (203), wherein said printed circuit board (200) is attached to said base layer (400) by means of an adhesion layer (300), and a microfluidic device comprising a first sample reservoir (101), a first channel (102) and a first reaction chamber (103), wherein said first reaction chamber (103) is in fluidic communication with said first sample reservoir (101) via said first channel (102), and said first reaction chamber (103) is in fluidic communication with said first measuring electrode (209), wherein said microfluidic device is formed by a first cover layer (100) arranged on said printed circuit board (200), and said first cover layer (100) comprises a first cavity or recess (101, 102, 103) forming at least partly said first sample reservoir (101), said first channel (102) and said first reaction chamber (103), wherein said substrate (204) comprises one or more through-going recesses (210) which encircles in part said reaction contact area (208), wherein a part of said first cover layer (100) and/or said adhesion layer (300) engages in said one or more through-going recesses (210), particularly in a form-fitting and/or fluid-tight manner.
B01L 3/00 - Containers or dishes for laboratory use, e.g. laboratory glasswareDroppers
B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
B29C 65/18 - Joining of preformed partsApparatus therefor by heating, with or without pressure using heated tool
B32B 3/26 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layerLayered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a layer with cavities or internal voids
B29C 43/36 - Moulds for making articles of definite length, i.e. discrete articles
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 17/10 - Layered products essentially comprising sheet glass, or fibres of glass, slag or the like comprising glass as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
A method for simpler and more cost-effective manufacturing of a medical device, for example an implantable and/or insertable medical device, having at least two longitudinally extending electrical conductors (3, 30, 300) is described. The method comprises the following steps: • Providing a connecting material (4, 40, 400) and the at least two electrical conductors (3, 30, 300) each being individually electrically insulated and having two ends; • Fixing the position of the at least two electrical conductors (3, 30, 300) with respect to one another by establishing a temporary connection of the at least two electrical conductors (3, 30, 300) using the connecting material (4, 40, 400); • Performing at least one assembling step using the connected at least two electrical conductors (3, 30, 300); and • Disconnecting the at least two electrical conductors (3, 30, 300) by removing and/or decomposing the connecting material (4, 40, 400) and/or by modifying the mechanical integrity of the connecting material (4, 40, 400) over at least part of the longitudinal extension of the at least two electrical conductors (3, 30, 300).
A multi-electrode array device (1) comprises a substrate (10) having a substrate body (100), and a multiplicity of electrodes formed by a multiplicity of needle elements (120) arranged on said substrate body (100) and spaced with respect to each other along a plane (P). The needle elements (120) are formed from a metal layer (12) arranged on said substrate body (100), each needle element (120) comprising a contact section (121) extending along said plane (P) and a needle section (122) extending from said contact section (121) and having a tip (123), wherein said needle section (122) is bent with respect to said contact section (121) such that the needle section (122) with its tip (123) protrudes from said plane (P).
A cost-effective method for producing an electronic module of high quality is described, comprising the following steps: providing an electronic circuit board (1) having a first side and an opposing second side and at least one first electrical contact element (2) located at the surface at its first side, a thermoplastic element (3, 30) comprising electrically conducting particles (3.1) or electrically conducting micro-structures (3.2) and an electronic component (4) having a first side and an opposing second side and comprising at least one second electrical contact element (4.1) located at the surface at its second side; arranging the electronic circuit board (1), the thermoplastic element (3, 30) and the electronic component (4) in such a way, that the thermoplastic element (3, 30) is being arranged in between the first electrical contact element (2) and the second electrical contact element (4.1); and thermocompression bonding of the electronic component (4) to the electronic circuit board (1) using the thermoplastic element (3, 30) such that the second side of the electronic component (4) is firmly attached to the first side of the electronic circuit board (1) via the thermoplastic element (3), wherein the thermoplastic element (3, 30) thereby, at the same time, establishes an electrically conductive connection between the at least one first electrical contact element (2) and the at least one second electrical contact element (4.1). Further, a respective electronic module is illustrated and a medical device comprising such electronic module.
H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
The present invention relates to an implantable ultrasonic transducer comprising a first device for generating ultrasound, a second device for receiving ultrasound, and a circuit board, wherein the device for generating ultrasound is formed from a piezoelectric polymer, which is integrated in the circuit board. The invention also relates to a medical device which can be introduced into the body and comprises an ultrasonic transducer of this type.
A61B 8/00 - Diagnosis using ultrasonic, sonic or infrasonic waves
A61B 8/12 - Diagnosis using ultrasonic, sonic or infrasonic waves in body cavities or body tracts, e.g. by using catheters
G01H 11/08 - Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means using piezoelectric devices
16.
Implant comprising embedded conductor track and production method
The disclosure relates to an implant comprising a substrate, a housing, wherein the housing is disposed on the substrate, an electronic circuit disposed on the substrate inside the housing, an electronic component disposed on the substrate outside the housing, and a conductor track, wherein the conductor track connects the electronic circuit to the electronic component. The conductor track is embedded into the substrate at least in sections in such a way that at least one section of the conductor track is completely surrounded by the substrate. Furthermore, a method for creating an implant is disclosed.
Embodiments relate to a test method for testing an unpopulated printed circuit board. The method can involve the steps of: exposing the unpopulated printed circuit board to temperatures of a reflow soldering process in a first step; and testing the electrical connections of the unpopulated printed circuit board. Embodiments also relate to a test device and a method for producing populated printed circuit boards.
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
09 - Scientific and electric apparatus and instruments
10 - Medical apparatus and instruments
42 - Scientific, technological and industrial services, research and design
Goods & Services
Electric and electronic components; electronic circuit
boards; printed circuits; encapsulated electronic devices
and systems. Catheters; encapsulated electronic devices and systems for
medical use; electrodes for medical use. Design and development of electrical and electronic
components, electronic circuit boards, printed circuits and
encapsulated electronic devices and systems; product
development and product design with respect to medical
devices; technological advisory services, particularly in
the field of electrical connection technology and
manufacture of printed circuit boards; research and
development of new products and semi-finished products for
third parties; technological research and consultant
services with respect to medical devices.
09 - Scientific and electric apparatus and instruments
10 - Medical apparatus and instruments
42 - Scientific, technological and industrial services, research and design
Goods & Services
Electric and electronic components, namely, components of electrical mains in the nature of electric wires, connectors, cables and circulators in the nature of electronic components; electronic circuit boards; printed circuits; encapsulated electronic devices and systems, namely, microelectronic systems for implants, sensors and actuators Catheters; encapsulated electronic devices and systems for medical use, namely, electronic medical appliances for use in procedures to treat diseases, ailments, injuries, and illnesses; electrodes for medical use Design and development of electrical and electronic components, electronic circuit boards, printed circuits and encapsulated electronic devices and systems; product development and product design with respect to medical devices; technological advisory services, particularly in the field of electrical connection technology and manufacture of printed circuit boards; research and development of new products and semi-finished products for third parties; technological research and consultant services with respect to medical devices
20.
Implant comprising embedded conductor track and production method
The disclosure related to an implant comprising a substrate, a housing, wherein the housing is disposed on the substrate, an electronic circuit disposed on the substrate inside the housing, an electronic component disposed on the substrate outside the housing, and a conductor track, wherein the conductor track connects the electronic circuit to the electronic component. The conductor track is embedded into the substrate at least in sections in such a way that at least one section of the conductor track is completely surrounded by the substrate. Furthermore, a method for creating an implant is disclosed.
A medical implant includes a first component having a surface and a plurality of electrical contacts and a second component having a surface and a plurality of electrical contacts. Each contact of the first component contacts an assigned contact of the second component in an electrically conducting manner. A seal is disposed between the two surfaces for sealing the contacts. The seal and the two surfaces are formed of a thermoplastic material. The seal is fused to the two surfaces for sealing the contacts and the seal is meltable so as to separate the two components from one another. A method for producing a medical implant is also provided.
A61N 1/375 - Constructional arrangements, e.g. casings
B29C 65/34 - Joining of preformed partsApparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement"
22.
Thermocompression bonding of electronic components
A method for producing an electronic module includes providing a first substrate including at least one first electrical contacting surface, an electronic component including at least one second electrical contacting surface, and a first material layer made of a thermoplastic material including at least one recess extending through the material layer. The first substrate, the electronic component and the first material layer are arranged with the first material layer disposed between the first substrate and the electronic component, and the at least one first electrical contacting surface, the at least one second electrical contacting surface and the at least one recess aligned relative to one another. The first substrate, the electronic component and the material layer are thermocompression bonded. A joint formed between the at least one first electrical contacting surface and the at least one second electrical contacting surface is surrounded or enclosed by the first material layer.
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
The present invention relates to a test method for an unpopulated printed circuit board, comprising the steps of: exposing the unpopulated printed circuit board to temperatures of a reflow soldering process in a first step; and testing the electrical connections of the unpopulated printed circuit board. The present invention further relates to a test device and a method for producing populated printed circuit boards.
A process for producing an electrical conductor structure that involves embedding at least one metallic conductor track and at least one heating conductor in an electrically insulating substrate, and producing an electric current in the heating conductor so that a first layer of the substrate and a second layer of the substrate fuse in an area surrounding the heating conductor, to seal an interface between the two layers. A conductor structure is also disclosed, in particular in the form of an implantable electrode lead.
H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables
A61N 1/375 - Constructional arrangements, e.g. casings
B29C 65/34 - Joining of preformed partsApparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement"
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
B32B 37/06 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
A61N 1/05 - Electrodes for implantation or insertion into the body, e.g. heart electrode
An electronic module on a flexible planar circuit substrate with a conductor configuration on a first substrate surface and a plurality of electronic components on the opposite, second substrate surface, wherein the components have component contacts, which are electrically connected selectively by way of vias in the circuit substrate and the conductor configuration, wherein the circuit substrate is a thermoplastic polymer and the component contacts are melted or thermally pressed into the second substrate surface in the region of the vias.
An electronic assembly, including an encasement joined from at least two casing parts, wherein at least one gap region between two mutually adjoining casing parts is hermetically sealed by a metal layer that is electrodeposited onto the sections of the adjoining casing parts abutting the gap region and bridges the gap region.
H01L 23/10 - ContainersSeals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
H01L 21/50 - Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups or
27.
Method for producing an electrode lead or a catheter, and associated semifinished product
A method for producing a medical electrode lead or a catheter, and also to an associated semifinished product. The semifinished product for this purpose includes a cable having at least one electrical conductor, which is embedded in a sheath made of an electrically insulating, thermoplastic material. It is characterized in that the cable, at least at one cable end, forms a connection point, via which the conductor can be attached permanently and non-detachably to further components, wherein part of the surface of the conductor is exposed in the region of the connection point and forms a contact face, and the sheath has, in the region of the connection point, a recess that is continuous in the longitudinal direction of the cable.
H01R 43/20 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
H02G 1/14 - Methods or apparatus specially adapted for installing, maintaining, repairing, or dismantling electric cables or lines for joining or terminating cables
H01R 43/00 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
H01R 43/24 - Assembling by moulding on contact members
A61B 5/00 - Measuring for diagnostic purposes Identification of persons
A61N 1/05 - Electrodes for implantation or insertion into the body, e.g. heart electrode
An implantable electrode and a process to produce an implantable electrode. To make it possible to produce the implantable electrode in a simple and economical manner, a connection cable of the electrode is at least partly embedded in a sheath of the electrode and the sheath is in the shape of a hollow cylinder.
An implantable electrode having a connection portion. So as to be able to easily stretch the electrode lengthwise, provision is made so that the connection portion is embodied in a coiled manner.
A method for embedding at least one component into a dielectric layer. obtain a good result, it is provided that the method includes the following steps: a) Position and affix the at least one component on a carrier; b) Cast a liquid dielectric around the at least one component, thereby enclosing the at least one component completely; c) Harden the liquid dielectric to form a solid dielectric layer; and d) Apply, in particular by lamination thereon, another layer, in particular an electrically conductive layer. The use of a dielectric layer formed entirely of liquid dielectric, wherein the liquid dielectric is not converted into a solid state until the dielectric is processed.
Implantable sensor system including a sensor which is situated in a housing, the housing having a measurement region which is permeable for the parameters to be detected by the sensor, wherein the measurement region has an erodible protective coating which is permeable for the parameters to be detected by the sensor.
An electronic device, comprising a housing, a functional unit disposed in the housing, a terminal lead electrically connecting the functional unit to the outside of the housing, and a sealed feedthrough in the housing, the feedthrough surrounding the terminal lead and insulating it with respect to the housing, wherein the feedthrough is produced from a liquid crystal polymer.
09 - Scientific and electric apparatus and instruments
Goods & Services
Electronic components, particularly assembled or
non-assembled printed circuits, multichip modules and
substrates for the above products, electronic components
with one or more chip components as well as interposed
components and component mountings for the above products.
