Ehwa Diamond Industrial Co., Ltd.

Republic of Korea

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        Patent 51
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        United States 25
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Date
2024 December 1
2024 2
2023 3
2022 1
2020 1
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IPC Class
B23D 61/02 - Circular saw blades 8
B28D 1/12 - Saw blades specially adapted for working stone 6
B24B 53/017 - Devices or means for dressing, cleaning or otherwise conditioning lapping tools 5
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting 5
B24D 18/00 - Manufacture of grinding tools, e.g. wheels, not otherwise provided for 4
See more
NICE Class
07 - Machines and machine tools 14
08 - Hand tools and implements 6
Status
Pending 2
Registered / In Force 63

1.

METHOD FOR MEASURING DEPTH OF DAMAGED LAYER AND CONCENTRATION OF DEFECTS IN DAMAGED LAYER, AND SYSTEM FOR PERFORMING SAME METHOD

      
Application Number 18698572
Status Pending
Filing Date 2021-10-05
First Publication Date 2024-12-05
Owner EHWA DIAMOND INDUSTRIAL COMPANY LIMITED (Republic of Korea)
Inventor
  • Choi, Seong Kwon
  • Park, Heedong

Abstract

There is provided a method of determining a depth of a damage layer formed on a back surface of the substrate. The method comprises irradiating the damage layer with first light and second light; detecting the first light and the second light reflected or scattered by defects in the damage layer; determining a first penetration depth of the first light and a second penetration depth of the second light based on a first wavelength of the first light and a second wavelength of the second light; and determining the depth of the damage layer based on the first penetration depth and the second penetration depth.

IPC Classes  ?

  • G01N 21/95 - Investigating the presence of flaws, defects or contamination characterised by the material or shape of the object to be examined
  • G01B 11/22 - Measuring arrangements characterised by the use of optical techniques for measuring depth
  • G01N 21/956 - Inspecting patterns on the surface of objects

2.

DIAMOND DISC AND METHOD FOR MANUFACTURING SAME

      
Application Number 18282287
Status Pending
Filing Date 2022-03-17
First Publication Date 2024-05-30
Owner EHWA DIAMOND INDUSTRIAL COMPANY LIMITED (Republic of Korea)
Inventor
  • Park, Heedong
  • Kwack, Kyoung Kuk
  • Lee, Seh Kwang

Abstract

A diamond disc includes: a shank base; a bonding layer formed on a surface of the shank base; and a plurality of boron-doped diamonds (BDD) disposed in the bonding layer to be exposed. At least some of the plurality of boron-doped diamonds are disposed in the bonding layer in a posture in which an uppermost surface thereof meeting a long axis of the boron-doped diamond is inclined downward from an upper end of the major axis.

IPC Classes  ?

  • B24D 3/10 - Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special natureAbrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic for porous or cellular structure, e.g. for use with diamonds as abrasives
  • B24D 18/00 - Manufacture of grinding tools, e.g. wheels, not otherwise provided for

3.

Grinding pad

      
Application Number 29836031
Grant Number D1004393
Status In Force
Filing Date 2022-04-22
First Publication Date 2023-11-14
Grant Date 2023-11-14
Owner EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
  • Ahn, Jang Hyuk
  • Jeong, Hwa Jin

4.

CMP CONDITIONING DISK, AND METHOD AND DEVICE FOR MANUFACTURING CMP CONDITIONING DISK

      
Application Number KR2023003734
Publication Number 2023/182779
Status In Force
Filing Date 2023-03-21
Publication Date 2023-09-28
Owner EHWA DIAMOND INDUSTRIAL COMPANY LIMITED (Republic of Korea)
Inventor
  • Moon, Yong Sik
  • Lee, Joo Hee
  • Kwack, Kyoung Kuk

Abstract

A device for manufacturing a CMP conditioning disk may comprise: a diamond jig that provides a jig pocket in which a diamond can be seated; a suction unit that selectively provides the jig pocket with a suction force; and a moving unit for fixing the diamond, seated in the jig pocket, to a shank base, wherein the suction unit provides the jig pocket with a suction force when the diamond is seated in the jig pocket, and removes the suction force when the diamond is fixed to the shank base.

IPC Classes  ?

  • B24B 53/017 - Devices or means for dressing, cleaning or otherwise conditioning lapping tools
  • B24D 3/10 - Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special natureAbrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic for porous or cellular structure, e.g. for use with diamonds as abrasives
  • B24D 18/00 - Manufacture of grinding tools, e.g. wheels, not otherwise provided for

5.

METHOD FOR MEASURING DEPTH OF DAMAGED LAYER AND CONCENTRATION OF DEFECTS IN DAMAGED LAYER, AND SYSTEM FOR PERFORMING SAME METHOD

      
Application Number KR2021013634
Publication Number 2023/058784
Status In Force
Filing Date 2021-10-05
Publication Date 2023-04-13
Owner EHWA DIAMOND INDUSTRIAL COMPANY LIMITED (Republic of Korea)
Inventor
  • Choi, Seong Kwon
  • Park, Heedong

Abstract

Provided is a method for determining the depth of a damaged layer formed at the rear surface of a substrate. The method may comprise the steps of: irradiating the damaged layer with first light and second light; detecting the first light and the second light reflected or scattered by defects in the damaged layer; determining a first penetration depth of the first light and a second penetration depth of the second light on the basis of a first wavelength of the first light and a second wavelength of the second light; and determining the depth of the damaged layer by using the first penetration depth and the second penetration depth.

IPC Classes  ?

  • G01N 21/88 - Investigating the presence of flaws, defects or contamination
  • G01N 21/95 - Investigating the presence of flaws, defects or contamination characterised by the material or shape of the object to be examined
  • G01N 21/956 - Inspecting patterns on the surface of objects
  • G01B 11/22 - Measuring arrangements characterised by the use of optical techniques for measuring depth
  • H01L 21/12 - Application of an electrode to the exposed surface of the selenium or tellurium after the selenium or tellurium has been applied to the foundation plate

6.

DIAMOND DISC AND METHOD FOR MANUFACTURING SAME

      
Application Number KR2022003778
Publication Number 2022/197132
Status In Force
Filing Date 2022-03-17
Publication Date 2022-09-22
Owner EHWA DIAMOND INDUSTRIAL COMPANY LIMITED (Republic of Korea)
Inventor
  • Park, Heedong
  • Kwack, Kyoung Kuk
  • Lee, Seh Kwang

Abstract

A diamond disc comprises: a shank base; a bonding layer formed on the surface of the shank base; a plurality of boron-doped diamonds disposed so as to be exposed to the bonding layer, wherein at least some of the plurality of boron-doped diamonds are configured such that a surface disposed at an uppermost end while meeting the long axis of the boron-doped diamonds is disposed on the bonding layer to be inclined downward from the upper end of the long axis.

IPC Classes  ?

  • B24D 3/10 - Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special natureAbrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic for porous or cellular structure, e.g. for use with diamonds as abrasives
  • B24D 18/00 - Manufacture of grinding tools, e.g. wheels, not otherwise provided for
  • B24B 37/30 - Work carriers for single side lapping of plane surfaces
  • B24B 37/10 - Lapping machines or devicesAccessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping

7.

Drill bit for drilling and method for manufacturing same

      
Application Number 16797240
Grant Number 10871038
Status In Force
Filing Date 2020-02-21
First Publication Date 2020-06-18
Grant Date 2020-12-22
Owner EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
  • Kim, Ki-Ho
  • Yun, Jun-Yong

Abstract

Disclosed are a drill bit for drilling and a method for manufacturing same, in which the hardness of a body part of a shank can be selectively improved by performing rapid cooling in a forced cooling method after performing rapid heating selectively only on the body part of the shank in a high-frequency induction heating method after completing infiltration.

IPC Classes  ?

  • E21B 10/46 - Drill bits characterised by wear resisting parts, e.g. diamond inserts
  • E21B 10/55 - Drill bits characterised by wear resisting parts, e.g. diamond inserts the bit being of the rotary drag type, e.g. fork-type bits with preformed cutting elements
  • B23P 5/00 - Setting gems or the like on metal parts, e.g. diamonds on tools
  • C21D 9/22 - Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articlesFurnaces therefor for drillsHeat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articlesFurnaces therefor for milling cuttersHeat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articlesFurnaces therefor for machine cutting tools
  • C22C 38/00 - Ferrous alloys, e.g. steel alloys
  • C22C 38/02 - Ferrous alloys, e.g. steel alloys containing silicon
  • C22C 38/22 - Ferrous alloys, e.g. steel alloys containing chromium with molybdenum or tungsten
  • C22C 38/32 - Ferrous alloys, e.g. steel alloys containing chromium with boron
  • C22C 38/38 - Ferrous alloys, e.g. steel alloys containing chromium with more than 1.5% by weight of manganese
  • E21B 10/02 - Core bits
  • C21D 1/42 - Induction heating

8.

Mining bit and method of manufacturing the bit

      
Application Number 16161555
Grant Number 11136831
Status In Force
Filing Date 2018-10-16
First Publication Date 2019-09-19
Grant Date 2021-10-05
Owner EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
  • Kim, Ki Ho
  • Yun, Jun Yong
  • Park, Hee Dong

Abstract

A mining bit includes: a shank; and cutting tips attached to the shank, each cutting tip having a plurality of layers and a plurality of abrasive particles, wherein the layers have a shape of an arch with flat surfaces in such a manner as to be laminated onto each other in a horizontal direction with respect to a cut surface of each cutting tip, and a distance (D2) between the abrasive particles on the adjacent layers is less than a distance (D1) between the abrasive particles on each layer.

IPC Classes  ?

  • E21B 10/48 - Drill bits characterised by wear resisting parts, e.g. diamond inserts the bit being of core type
  • B22F 5/00 - Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
  • B22F 7/08 - Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder

9.

Preparing conditioning disk for chemical mechanical polishing and chemical mechanical polishing method including the same

      
Application Number 15602256
Grant Number 10525566
Status In Force
Filing Date 2017-05-23
First Publication Date 2018-04-19
Grant Date 2020-01-07
Owner
  • SAMSUNG ELECTRONICS CO., LTD. (Republic of Korea)
  • EHWA Diamond Industrial Co., Ltd. (Republic of Korea)
Inventor
  • Hong, Myung-Ki
  • Kim, Yung-Jun
  • Park, Sung-Oh
  • Lee, Hyo-San
  • Lee, Joo-Han
  • Oh, Kyu-Min
  • Park, Sun-Gyu
  • Lee, Seh-Kwang
  • Yang, Chan-Ki

Abstract

A chemical mechanical polishing (CMP) method includes preparing a polishing pad, determining a first load to be applied to a conditioning disk during conditioning of the polishing pad and a first indentation depth at which tips of the conditioning disk are inserted into the polishing pad when the first load is applied to the conditioning disk, preparing a conditioning disk, and positioning the conditioning disk on the polishing pad and conditioning a surface of the polishing pad by using the conditioning disk while applying the first load to the conditioning disk.

IPC Classes  ?

  • B24B 53/017 - Devices or means for dressing, cleaning or otherwise conditioning lapping tools
  • B24B 37/04 - Lapping machines or devicesAccessories designed for working plane surfaces
  • H01L 21/321 - After-treatment
  • H01L 21/66 - Testing or measuring during manufacture or treatment
  • B24B 37/005 - Control means for lapping machines or devices
  • H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device

10.

Drill bit for drilling and method for manufacturing same

      
Application Number 15521009
Grant Number 10605007
Status In Force
Filing Date 2015-08-28
First Publication Date 2017-09-28
Grant Date 2020-03-31
Owner EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
  • Kim, Ki-Ho
  • Yun, Jun-Yong

Abstract

Disclosed are a drill bit for drilling and a method for manufacturing same, in which the hardness of a body part of a shank can be selectively improved by performing rapid cooling in a forced cooling method after performing rapid heating selectively only on the body part of the shank in a high-frequency induction heating method after completing infiltration.

IPC Classes  ?

  • E21B 10/46 - Drill bits characterised by wear resisting parts, e.g. diamond inserts
  • E21B 10/55 - Drill bits characterised by wear resisting parts, e.g. diamond inserts the bit being of the rotary drag type, e.g. fork-type bits with preformed cutting elements
  • B23P 5/00 - Setting gems or the like on metal parts, e.g. diamonds on tools
  • C21D 9/22 - Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articlesFurnaces therefor for drillsHeat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articlesFurnaces therefor for milling cuttersHeat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articlesFurnaces therefor for machine cutting tools
  • C22C 38/00 - Ferrous alloys, e.g. steel alloys
  • C22C 38/02 - Ferrous alloys, e.g. steel alloys containing silicon
  • C22C 38/22 - Ferrous alloys, e.g. steel alloys containing chromium with molybdenum or tungsten
  • C22C 38/32 - Ferrous alloys, e.g. steel alloys containing chromium with boron
  • C22C 38/38 - Ferrous alloys, e.g. steel alloys containing chromium with more than 1.5% by weight of manganese
  • E21B 10/02 - Core bits
  • C21D 1/42 - Induction heating

11.

GRINDING TOOL

      
Application Number KR2015009584
Publication Number 2016/125973
Status In Force
Filing Date 2015-09-11
Publication Date 2016-08-11
Owner EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor Song, Young-Choul

Abstract

A grinding tool according to the present invention comprises: a plate; a plurality of holders formed on the plate and having sliding grooves formed thereon; shoes coupled to the sliding grooves of the holders; and grinding tips arranged on the shoes. The shoes comprise: a fastening portion fastened to the sliding groove; and an upper plate portion formed on the fastening portion and placed on an upper surface of the holder of an outer side of the sliding groove. The shoes can be fastened to the holder in two or more directions, and the grinding tips may be arranged in two or more arrays in a plan view.

IPC Classes  ?

  • B24D 7/06 - Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front faceBushings or mountings therefor with inserted abrasive blocks, e.g. segmental
  • B24B 7/22 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfacesAccessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain

12.

Grinding tool

      
Application Number 14923433
Grant Number 09925645
Status In Force
Filing Date 2015-10-27
First Publication Date 2016-08-04
Grant Date 2018-03-27
Owner EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
  • Song, Young-Choul
  • Chung, Sung-Hoon
  • Choi, Jong-Suk
  • Hong, Jae-Hyun

Abstract

Disclosed herein is a grinding tool, which includes a plate, a plurality of holders formed on the plate and having sliding grooves, a shoe coupled to the sliding groove of each of the holders, and grinding tips arranged on the shoe. The shoe includes a fastening part fastened to the sliding groove, and an upper plate part formed on the fastening part and located on an upper surface of the holder outside the sliding groove. The shoe can be fastened to the holder in two or more directions, and the grinding tips can be arranged in two or more forms when viewed from the plane.

IPC Classes  ?

  • B24D 7/06 - Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front faceBushings or mountings therefor with inserted abrasive blocks, e.g. segmental
  • B24B 7/18 - Single-purpose machines or devices for grinding floorings, walls, ceilings or the like

13.

ZENESIS

      
Serial Number 87026342
Status Registered
Filing Date 2016-05-05
Registration Date 2016-12-20
Owner EHWA Diamond Industrial Company Limited (Republic of Korea)
NICE Classes  ? 07 - Machines and machine tools

Goods & Services

Diamond-pointed metal-cutting tools; Grinding tools for grinding machines; Power saw blades; Precision machine tools, namely, hard metal tools, high speed steel (HSS) tools, carbide tools, ceramic tools, poly crystalline diamond (PCD) tools, and diamond-coated and diamond-uncoated tools, and hard metal tools, all for use in the cutting and forming of materials by others; Core drilling bits; Metalworking machine tools; Power drill bits; Power-operated grinding wheels; Router bits; Tool bits for machines

14.

DRILL BIT FOR DRILLING AND METHOD FOR MANUFACTURING SAME

      
Application Number KR2015009086
Publication Number 2016/064083
Status In Force
Filing Date 2015-08-28
Publication Date 2016-04-28
Owner EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
  • Kim, Ki-Ho
  • Yun, Jun-Yong

Abstract

Disclosed are a drill bit for drilling and a method for manufacturing same, in which the strength of a body part of a shank can be selectively improved by performing rapid cooling in a forced cooling method after performing rapid heating selectively only on the body part of the shank in a high-frequency induction heating method after completing infiltration.

IPC Classes  ?

  • E21B 10/02 - Core bits
  • E21B 10/46 - Drill bits characterised by wear resisting parts, e.g. diamond inserts
  • B23P 5/00 - Setting gems or the like on metal parts, e.g. diamonds on tools
  • C21D 9/22 - Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articlesFurnaces therefor for drillsHeat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articlesFurnaces therefor for milling cuttersHeat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articlesFurnaces therefor for machine cutting tools

15.

Brazing bond type diamond tool with excellent cuttability and method of manufacturing the same

      
Application Number 14817030
Grant Number 09694512
Status In Force
Filing Date 2015-08-03
First Publication Date 2015-11-26
Grant Date 2017-07-04
Owner EHWA Diamond Industrial Co., Ltd. (Republic of Korea)
Inventor
  • Hong, Jae-Hyun
  • Choi, Jong Suk
  • Song, Young Choul

Abstract

The present disclosure provides a brazing bond type diamond tool having excellent cuttability. The diamond tool includes a shank having a body with a thickness of 2 mm or less and a tip portion formed along an edge of the body, the tip portion being thinner than the body; and a brazing bond layer formed on the tip portion of the shank to secure diamond particles having a particle size of 25 to 50 mesh with a brazing bond, wherein the brazing bond layer has a greater thickness than a difference between half the thickness of the shank body and half the thickness of the shank tip portion, such that some part of the shank body can penetrate into a surface of an object to be cut, and the tip portion of the shank has a curved surface at an end thereof.

IPC Classes  ?

  • B28D 1/12 - Saw blades specially adapted for working stone
  • B23D 61/02 - Circular saw blades
  • B23D 61/04 - Circular saw blades with inserted saw teeth

16.

Scribing wheel having fine structure recess

      
Application Number 14417165
Grant Number 10358375
Status In Force
Filing Date 2013-07-26
First Publication Date 2015-06-25
Grant Date 2019-07-23
Owner EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
  • Jeon, Chang Ho
  • Lee, Sung Hee
  • Kim, Sang Beom
  • Shin, Taek Jung
  • Lee, Seh Kwang
  • Kim, In Sub

Abstract

Disclosed herein is a scribing wheel having a predetermined thickness and a disk shape. The scribing wheel includes: a wheel body configured in such a way that at least a peripheral edge portion thereof is gradually reduced in thickness from the center to the radial outside; and a cutter part including recesses and cutting blade teeth which are alternately arranged along the peripheral edge portion. Each recess is formed by a combination of side recess portions formed in opposite side surfaces of the peripheral edge portion of the wheel body and an edge recess portion formed in the peripheral edge of the wheel body.

IPC Classes  ?

  • C03B 33/10 - Glass-cutting tools, e.g. scoring tools
  • B26D 3/08 - Making a superficial cut in the surface of the work without removal of material, e.g. scoring, incising
  • B28D 1/22 - Working stone or stone-like materials, e.g. brick, concrete, not provided for elsewhereMachines, devices, tools therefor by cutting, e.g. incising
  • B26D 1/00 - Cutting through work characterised by the nature or movement of the cutting memberApparatus or machines thereforCutting members therefor

17.

CMP apparatus

      
Application Number 14405116
Grant Number 09421668
Status In Force
Filing Date 2012-06-07
First Publication Date 2015-05-21
Grant Date 2016-08-23
Owner
  • EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
  • SAMSUNG ELECTRONICS CO., LTD. (Republic of Korea)
Inventor
  • Lee, Seh Kwang
  • Kim, Youn Chul
  • Lee, Joo Han
  • Choi, Jae Kwang
  • Boo, Jae Phil

Abstract

Provided is a chemical mechanical polishing (CMP) apparatus that includes a swing unit installed apart from a platen, on which a CMP pad to be conditioned is placed, at a predetermined interval, a connector installed on an upper end of the swing unit at one end thereof in a perpendicular direction to the swing unit and pivoting around the swing unit above the CMP pad, a rotator rotatably installed on the other end of the connector, a CMP pad conditioner coupled to the rotator and conditioning the CMP pad when rotated, and a vibration meter installed on the connector and detecting vibrations to measure a vibration acceleration of the CMP pad conditioner, thereby predicting a wear rate of the CMP pad based on the vibration acceleration and a state in which the CMP pad conditioner is installed or being used.

IPC Classes  ?

  • B24B 37/00 - Lapping machines or devicesAccessories
  • B24B 49/18 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or workArrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the presence of dressing tools
  • B24B 37/005 - Control means for lapping machines or devices
  • B24B 53/017 - Devices or means for dressing, cleaning or otherwise conditioning lapping tools

18.

CMP pad conditioner

      
Application Number 14233489
Grant Number 10166653
Status In Force
Filing Date 2012-07-16
First Publication Date 2014-06-05
Grant Date 2019-01-01
Owner EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
  • Lee, Seh Kwang
  • Lee, Joo Han

Abstract

The present invention relates to a CMP pad conditioner having a substrate and a cutting tip pattern formed on at least one surface of the substrate, and more particularly to a CMP pad conditioner having cutting tip patterns, in which the cutting tip patterns have an improved structure that can increase the productivity of the CMP pad conditioner and that can sufficiently ensure the strength and safety of the cutting tip patterns.

IPC Classes  ?

  • B24B 53/017 - Devices or means for dressing, cleaning or otherwise conditioning lapping tools
  • B24B 53/12 - Dressing toolsHolders therefor

19.

CMP pad conditioner, and method for producing the CMP pad conditioner

      
Application Number 14117936
Grant Number 09314901
Status In Force
Filing Date 2012-05-15
First Publication Date 2014-04-03
Grant Date 2016-04-19
Owner EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
  • Lee, Seh Kwang
  • Kim, Youn Chul
  • Lee, Joo Han
  • Choi, Jae Kwang
  • Boo, Jae Phil

Abstract

This invention relates to a conditioner for a CMP (Chemical Mechanical Polishing) pad, which is used in a CMP process which is part of the fabrication of a semiconductor device, and more particularly, to a CMP pad conditioner in which the structure of the cutting tips is such that the change in the wear of the polishing pad is not great even when different kinds of slurry are used and when there are changes in pressure of the conditioner, and to a method of manufacturing the same.

IPC Classes  ?

  • B24B 53/017 - Devices or means for dressing, cleaning or otherwise conditioning lapping tools
  • B24B 53/02 - Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
  • B24D 18/00 - Manufacture of grinding tools, e.g. wheels, not otherwise provided for

20.

SCRIBING WHEEL HAVING FINE STRUCTURE GROOVE

      
Application Number KR2013006751
Publication Number 2014/017878
Status In Force
Filing Date 2013-07-26
Publication Date 2014-01-30
Owner EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
  • Jeon, Chang Ho
  • Lee, Sung Hee
  • Kim, Sang Beom
  • Shin, Taek Jung
  • Lee, Seh Kwang
  • Kim, In Sub

Abstract

The present invention relates to a scribing wheel comprising: a wheel-shaped wheel body, the thickness of at least the edge of the circumference of which gradually decreases when progressing radially outward; and a cutter unit having a plurality of grooves and cutter blades alternately formed along the edge of the circumference thereof. Each groove has a side recess region that is set back from both sides of the edge of the circumference of the wheel body, and an edge recess region that is set back from the edge of the circumference of the wheel body, the side recess region and the edge recess region being formed into one groove.

IPC Classes  ?

  • C03B 33/033 - Apparatus for opening score lines in glass sheets
  • C03B 33/10 - Glass-cutting tools, e.g. scoring tools
  • B28D 5/00 - Fine working of gems, jewels, crystals, e.g. of semiconductor materialApparatus therefor
  • B26D 3/08 - Making a superficial cut in the surface of the work without removal of material, e.g. scoring, incising

21.

CMP DEVICE

      
Application Number KR2012004502
Publication Number 2013/183799
Status In Force
Filing Date 2012-06-07
Publication Date 2013-12-12
Owner EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
  • Lee, Seh Kwang
  • Kim, Youn Chul
  • Lee, Joo Han
  • Choi, Jae Kwang
  • Boo, Jae Phil

Abstract

The present invention relates to a CMP device, and more specifically, to a CMP device comprising: a swing part provided at a fixed interval from a surface plate on which a CMP pad is placed to be conditioned; a connection part of which one end is provided to an upper end of the swing part in a vertical direction with respect to the swing part for rotating on the CMP pad in accordance with the swing part; a rotation part provided to the other end of the connection part for rotating; a CMP pad conditioner coupled to the rotation part for conditioning the CMP pad while rotating; and a vibration acceleration measuring part provided to the connection part for measuring vibration acceleration of the CMP pad conditioner by sensing vibration, wherein an abrasion loss of the CMP pad is predicted by the measured vibration acceleration, and a state in which the CMP conditioner is provided or a state in which the CMP conditioner operates can be predicted.

IPC Classes  ?

  • H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting

22.

Reaming shell for mining

      
Application Number 13805816
Grant Number 09115551
Status In Force
Filing Date 2011-02-21
First Publication Date 2013-04-11
Grant Date 2015-08-25
Owner EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
  • Kim, Ki-Ho
  • Chung, Sung-Hoon

Abstract

A reaming shell for mining is provided. The reaming shell has a shank, and a plurality of pads attached at circumferential intervals from each other to extend lengthwise on an outer periphery of the shank. The reaming shell is coupled to a core bit of a diamond drilling tool for mining. The reaming shell includes a water groove of a recessed shape formed respectively between each adjacent pair of the pads, and extending from a leading edge along a length of the shank.

IPC Classes  ?

  • E21B 10/26 - Drill bits with leading portion, i.e. drill bits with a pilot cutterDrill bits for enlarging the borehole, e.g. reamers
  • E21B 10/02 - Core bits
  • E21B 10/60 - Drill bits characterised by conduits or nozzles for drilling fluids

23.

GRINDING TOOL

      
Application Number KR2012004725
Publication Number 2013/032115
Status In Force
Filing Date 2012-06-15
Publication Date 2013-03-07
Owner EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
  • Ahn, Jang-Hyuk
  • Yeom, Jong Kook

Abstract

Disclosed is a grinding tool, which includes a first disk having an installation hole in a center portion thereof such that the grinding tool is installed on a grinder, a second disk forming a discharge passage with partitions on a bottom surface of the first disk, wherein air intaken from a central lower portion of the grinding tool is discharged to an outside thereof through the discharge passage, and a ring-shaped shank disposed under the second disk and including grinding tips to grind a target.

IPC Classes  ?

  • B24D 7/06 - Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front faceBushings or mountings therefor with inserted abrasive blocks, e.g. segmental
  • B24D 7/10 - Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front faceBushings or mountings therefor with cooling provisions

24.

Grinding tool adapted to collect grinding particles

      
Application Number 13524204
Grant Number 09028300
Status In Force
Filing Date 2012-06-15
First Publication Date 2013-02-28
Grant Date 2015-05-12
Owner Ehwa Diamond Industrial Co., Ltd. (Republic of Korea)
Inventor
  • Ahn, Jang-Hyuk
  • Yeom, Jong-Kook

Abstract

Disclosed is a grinding tool, which includes a first disk having an installation hole in a center portion thereof such that the grinding tool is installed on a grinder, a second disk forming a discharge passage with partitions on a bottom surface of the first disk, wherein air intaken from a central lower portion of the grinding tool is discharged to an outside thereof through the discharge passage, and a ring-shaped shank disposed under the second disk and including grinding tips to grind a target.

IPC Classes  ?

  • B24B 55/06 - Dust extraction equipment on grinding or polishing machines
  • B24D 7/06 - Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front faceBushings or mountings therefor with inserted abrasive blocks, e.g. segmental
  • B24D 7/10 - Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front faceBushings or mountings therefor with cooling provisions

25.

CMP PAD CONDITIONER

      
Application Number KR2012005649
Publication Number 2013/012226
Status In Force
Filing Date 2012-07-16
Publication Date 2013-01-24
Owner EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
  • Lee, Seh Kwang
  • Lee, Joo Han

Abstract

The present invention relates to a CMP pad conditioner which comprises a substrate and a cutting tip pattern formed on at least one side of the substrate, and more specifically to a CMP pad conditioner having a cutting tip pattern with a structure which can improve productivity and can sufficiently secure the intensity and stability of a fine cutting tip pattern by improving the structure of the cutting tip pattern.

IPC Classes  ?

  • H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting

26.

CMP PAD CONDITIONER, AND METHOD FOR PRODUCING THE CMP PAD CONDITIONER

      
Application Number KR2012003788
Publication Number 2012/157936
Status In Force
Filing Date 2012-05-15
Publication Date 2012-11-22
Owner EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
  • Lee, Seh Kwang
  • Kim, Youn Chul
  • Lee, Joo Han
  • Choi, Jae Kwang
  • Boo, Jae Phil

Abstract

The present invention relates to a conditioner for a chemical-mechanical polishing (CMP) pad used in a CMP process that is a part of a process for manufacturing a semiconductor device. More particularly, the present invention relates to a CMP pad conditioner in which the structure of a cutting tip has an insignificant variation in the abrasion of a polishing pad even when the type of slurry and pressure of the conditioner vary. The present invention also relates to a method for producing the CMP pad conditioner.

IPC Classes  ?

  • H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting

27.

METHOD FOR MANUFACTURING AN ELECTRODEPOSITED DIAMOND WIRE SAW USING PATTERNED NON-CONDUCTIVE MATERIALS

      
Application Number KR2012001943
Publication Number 2012/138063
Status In Force
Filing Date 2012-03-19
Publication Date 2012-10-11
Owner EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
  • Lee, Seh-Kwang
  • Sung, Rak-Joo
  • Kim, Tae-Bong

Abstract

The present invention relates to an electrodeposited diamond wire saw using patterned non-conductive materials in which non-conductive materials are pre-patterned along the outer circumference of a wire on which diamond grit should not be rubbed, before the diamond grit is upset, in order to efficiently improve the manufacturing process, and to a method for manufacturing same. According to one preferred embodiment of the present invention, the method for manufacturing the electrodeposited diamond wire saw includes: printing a masking solution on the outer circumference of a wire in a plurality of directions when the wire is inserted for patterning; and upsetting diamond grit on the remaining regions of the outer circumference of the wire, with the exception of the patterned region.

IPC Classes  ?

  • C25D 13/00 - Electrophoretic coating characterised by the process
  • C25D 5/02 - Electroplating of selected surface areas
  • B23D 61/18 - Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
  • B24B 27/06 - Grinders for cutting-off

28.

CONDITIONER FOR FRAGILE PAD AND METHOD FOR MANUFACTURING SAME

      
Application Number KR2012001673
Publication Number 2012/121548
Status In Force
Filing Date 2012-03-07
Publication Date 2012-09-13
Owner EHWA DIAMOND INDUSTRIAL. CO., LTD. (Republic of Korea)
Inventor
  • Lee, Seh Kwang
  • Kim, Youn Chul
  • Lee, Joo Han
  • Lee, Jong Jae

Abstract

The present invention relates to a conditioner for a chemical-mechanical planarization (CMP) pad, which is used in a CMP process that is a part of a semiconductor element manufacturing process, and more particularly, to a conditioner for a fragile pad and a method for manufacturing same, the conditioner which can be used in a CMP environment using a slurry having low polishing particle content and/or a porous pad having relatively low hardness and very high porosity.

IPC Classes  ?

  • H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting

29.

METHOD FOR RECYCLING SPENT CMP PAD CONDITIONER AND CMP PAD RECYCLED THEREBY

      
Application Number KR2012001731
Publication Number 2012/121563
Status In Force
Filing Date 2012-03-09
Publication Date 2012-09-13
Owner EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
  • Lee, Seh Kwang
  • Kim, Youn Chul
  • Lee, Joo Han

Abstract

The present invention relates to a CMP pad conditioner, and more particularly, to a method for recycling a spent CMP pad conditioner and a CMP pad conditioner recycled by the method for recycling for saving resources by recycling the spent CMP pad conditioner, which becomes spent when a diamond layer, which is coated on the surface of a CMP pad conditioner substrate having a protruding pattern, is worn down.

IPC Classes  ?

  • H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting

30.

REAMING SHELL FOR MINING

      
Application Number KR2011001112
Publication Number 2012/115287
Status In Force
Filing Date 2011-02-21
Publication Date 2012-08-30
Owner EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
  • Kim, Ki-Ho
  • Chung, Sung-Hoon

Abstract

A reaming shell for mining is provided. The reaming shell has a shank, and a plurality of pads attached at circumferential intervals from each other to extend lengthwise on an outer periphery of the shank. The reaming shell is coupled to a core bit of a diamond drilling tool for mining. The reaming shell includes a water groove of a recessed shape formed respectively between each adjacent pair of the pads, and extending from a leading edge along a length of the shank.

IPC Classes  ?

  • E21B 10/26 - Drill bits with leading portion, i.e. drill bits with a pilot cutterDrill bits for enlarging the borehole, e.g. reamers

31.

Workpiece for frame gang saw, method for cutting the workpiece, and product cut by the method

      
Application Number 13141471
Grant Number 08973566
Status In Force
Filing Date 2009-12-23
First Publication Date 2011-10-20
Grant Date 2015-03-10
Owner Ehwa Diamond Industrial Co., Ltd. (Republic of Korea)
Inventor
  • Park, Hee-Dong
  • Kim, Nam-Kwang

Abstract

There is provided a method of cutting or drilling workpiece including stone such as marble and granite, brick, concrete and asphalt, using a frame gang saw. There are provided a workpiece cut by a frame gang saw that includes one or a plurality of blades having multiple cutting tips or that includes a blade without including a cutting tip; a method of cutting the workpiece by using a frame gang saw; and a product provided by the cutting method. The workpiece is provided to include one or more grooves into which at least a portion of at least one cutting tip among the multiple cutting tips or at least a portion of the blade without a cutting tip is inserted and which is formed in a surface thereof. Here, an initial cutting time on a workpiece may be shortened to greatly improve productivity and the quality of a product and a lifespan of a frame gang saw blade may be improved by significantly decreasing deflection in the blade.

IPC Classes  ?

  • B28D 1/06 - Working stone or stone-like materials, e.g. brick, concrete, not provided for elsewhereMachines, devices, tools therefor by sawing with reciprocating saw blades
  • B32B 3/30 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layerLayered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a layer with cavities or internal voids characterised by a layer formed with recesses or projections, e.g. grooved, ribbed

32.

PDW

      
Application Number 1059734
Status Registered
Filing Date 2010-11-03
Registration Date 2010-11-03
Owner EHWA DIAMOND INDUSTRIAL COMPANY LIMITED (Republic of Korea)
NICE Classes  ? 07 - Machines and machine tools

Goods & Services

Wire saws for metalworking; wire saws for semiconductor processing; wire saws for plastic working; wire saws for stone working; wire saws for woodworking.

33.

PDW

      
Serial Number 79090466
Status Registered
Filing Date 2010-11-03
Registration Date 2011-06-07
Owner EHWA DIAMOND INDUSTRIAL COMPANY LIMITED (Republic of Korea)
NICE Classes  ? 07 - Machines and machine tools

Goods & Services

Wire saws for metalworking; wire saws for semiconductor processing; wire saws for plastic working; wire saws for stone working; wire saws for woodworking

34.

WORKPIECE FOR FRAME GANG SAW, METHOD FOR CUTTING THE WORKPIECE, AND PRODUCT CUT BY THE METHOD

      
Application Number KR2009007734
Publication Number 2010/074513
Status In Force
Filing Date 2009-12-23
Publication Date 2010-07-01
Owner EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
  • Park, Hee-Dong
  • Kim, Nam-Kwang

Abstract

The present invention relates to a method for cutting or drilling a brittle workpiece including stones such as marble and granite, brick, concrete and asphalt, using a frame gang saw, and has as its objective a reduction in the initial cutting time of the workpiece, so that productivity may be markedly enhanced, and also to minimize deformation of the blade so that product quality and the lifetime of the frame gang saw blade may be enhanced. The key points of the invention are a workpiece for a frame gang saw wherein the workpiece is cut by a frame gang saw comprising one or more blades furnished with a plurality of cutting tips or a blade not furnished with a cutting tip, and on the workpiece are formed one or multiple grooves into at least a part of at least one cutting tip out of the cutting tips or at least a part of the blade not furnished with a cutting tip is inserted; a method for cutting the workpiece by using a frame gang saw; and a product that has been cut by the cutting method. According to the invention, not only can productivity be markedly enhanced but also the deformation of the blade can be minimized so that product quality and the lifetime of the frame gang saw are enhanced by providing a workpiece with grooves formed thereon.

IPC Classes  ?

  • B28D 1/06 - Working stone or stone-like materials, e.g. brick, concrete, not provided for elsewhereMachines, devices, tools therefor by sawing with reciprocating saw blades
  • B28D 1/12 - Saw blades specially adapted for working stone
  • B27B 3/10 - Saw frames or guides therefor
  • B23D 61/12 - Straight saw bladesStrap saw blades

35.

TOOL, GRINDING CUP TOOL, PROPELLER FOR GRINDING CUP TOOL AND CORE BIT

      
Application Number KR2009001687
Publication Number 2009/145470
Status In Force
Filing Date 2009-04-02
Publication Date 2009-12-03
Owner EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
  • Kim, Soo-Kwang
  • Choi, Jin-Sun

Abstract

There are provided a tool, a grinding cup tool, a core bit and a propeller used in the grinding cup tool, all of which are used to cut, drill, planarize and grind a brittle workpiece such as stone, brick, concrete, asphalt and the like, and by themselves are able to collect dusts which are generated during the processes. The tool, the grinding cup tool, the core bit and the propeller used in the grinding cup tool, all of which include a core having tips fixed therein, each tip having abrasive particles distributed thereon; and a driving machine for driving the core, include a propeller having at least two wings, the wings being positioned above the tips and rotating with the core to guide dusts, which are generated during the processes, upwards. The tools may be useful to significantly reduce the generation of scattering dusts (particles) without the use of a separate dust-collecting apparatus since they by themselves are able to collect dusts which are generated during the dry process, and to easily collect generated dusts in one collection place and discard the collected dusts, and to improve the machinability of products by removing fine dusts generated during a cutting process.

IPC Classes  ?

  • B24B 23/02 - Portable grinding machines, e.g. hand-guidedAccessories therefor with rotating grinding toolsAccessories therefor

36.

DRILL BIT

      
Application Number KR2009001864
Publication Number 2009/126002
Status In Force
Filing Date 2009-04-10
Publication Date 2009-10-15
Owner EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
  • Hong, Jae-Hyun
  • Choi, Jong-Suk
  • Kim, In-Woo

Abstract

There is provided a drill bit capable of performing a continuous drilling operation on a high-strength workpiece such as a tempered tile and the like. The drill bit comprises a bit body having a receptor portion formed therein, the receptor portion being filled with a cutting oil; a drilling portion extended from one end of the bit body and having a channel formed therethrough and an opening formed in one end thereof, the channel being coupled with a receptor portion of the bit body; a cutting portion provided in the opening of the drilling portion to drill a workpiece; and a channel opening and closing portion disposed inside the receptor portion to open and close the channel, thereby feeding a cutting oil. The drill bit thus configured may be useful to enable a continuous drilling operation on the high-strength workpiece, to enable the refilling of a cutting oil used to cool the high-strength workpiece, to shorten a time for the drilling operation on the high-strength workpiece, and to drill the high-strength workpiece to the maximum extent using the minimum number of drill bits.

IPC Classes  ?

  • B23B 45/00 - Hand-held or like portable drilling machines, e.g. drill gunsEquipment therefor

37.

DRILL BIT

      
Application Number KR2009001867
Publication Number 2009/126004
Status In Force
Filing Date 2009-04-10
Publication Date 2009-10-15
Owner EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
  • Hong, Jae-Hyun
  • Choi, Jong-Suk
  • Hong, Do-Ui

Abstract

There is provided a drill bit capable of performing a continuous drilling operation on a high-strength workpiece such as a tempered tile and the like. The drill bit comprises a bit body having a receptor portion formed therein, the receptor portion being filled with a cutting oil; a drilling portion extended from one end of the bit body and coupled to the receptor portion of the bit body to form a channel in which a capillary phenomenon occurs, and having an opening formed in one end thereof; and a cutting portion provided in the opening of the drilling portion to drill a workpiece. The drill bit thus configured may be useful to enable a continuous drilling operation on the high-strength workpiece, to enable the refilling of a cutting oil used to cool the high-strength workpiece, to shorten a time for the drilling operation on the high-strength workpiece, and to drill the high-strength workpiece to the maximum extent using the minimum number of drill bits.

IPC Classes  ?

38.

Cutting tip of frame saw and frame saw with the cutting tip

      
Application Number 12281004
Grant Number 08656901
Status In Force
Filing Date 2007-02-28
First Publication Date 2009-09-17
Grant Date 2014-02-25
Owner
  • Ehwa Diamond Industrial Co., Ltd. (Republic of Korea)
  • General Tool, Inc. (USA)
Inventor
  • Kim, Soo-Kwang
  • Park, Hee-Dong
  • Kim, Nam-Kwang

Abstract

A cutting tip for a cutting tool used to cut or drill a brittle workpiece such as stone, brick, concrete, or asphalt and a frame saw provided with the cutting tip are disclosed. The swing type cutting tip including abrasive particles has a specific arrangement capable of enhancing the cutting efficiency of the abrasive particles, and thus achieving an enhancement in cutting performance and an increase in lifespan. The cutting tip includes a plurality of abrasive particles to cut a workpiece while swing. At least a part of the abrasive particles are arranged in the form of abrasive particle groups. Each abrasive particle group is constituted by at least two abrasive particles. At least a part of the abrasive particles of the abrasive particle groups are overlapped in a cutting direction.

IPC Classes  ?

  • B28D 1/12 - Saw blades specially adapted for working stone

39.

GLASS COMPOSITION FOR POLISHING WHEEL, POLISHING WHEEL USING SAME AND MANUFACTURING METHOD FOR SAME

      
Application Number KR2009000637
Publication Number 2009/102144
Status In Force
Filing Date 2009-02-11
Publication Date 2009-08-20
Owner EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
  • Lee, Jae-Hee
  • Son, Seung-Kook

Abstract

The present invention relates to a glass composition for a polishing wheel for polishing semiconductor wafers and the like, to a polishing wheel using same, and a manufacturing method for same. An aim of the present invention is to provide a glass composition for producing a polishing wheel with an improved polishing capability, a long lifespan, and improved performance in that said composition generates no scratches even in a super-finishing process adopting a foam glass manufacturing method, a polishing wheel using the glass composition, and a manufacturing method for same. The glass composition for the polishing wheel of the present invention contains: SiO2: 55∼70%, B2O3: 10∼25%, Al2O3: 5∼15%, Na2O: 1∼5%, Li2O: 0.5∼2.5%, CaO: 1∼5%, MgO: 0~3%, and TiO2:0~5% by wt %. The polishing wheel manufactured from the glass composition of the present invention is provided with an improved polishing capability, a long lifespan, and improved performance in that said composition generates no scratches even in a super-finishing process adopting a foam glass manufacturing method.

IPC Classes  ?

  • C03C 3/076 - Glass compositions containing silica with 40% to 90% silica by weight

40.

CONDITIONER FOR CHEMICAL MECHANICAL PLANARIZATION PAD

      
Application Number KR2008007788
Publication Number 2009/091140
Status In Force
Filing Date 2008-12-30
Publication Date 2009-07-23
Owner EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor An, Jung-Soo

Abstract

A CMP pad conditioner is used in global planar izat ion of wafers for high integration of semiconductor devices. The CMP pad conditioner includes a frame fixing abrasive particles to prevent the abrasive particles from being detached from the conditioner, the abrasive particles protruding from the fixing frame at a predetermined height, and a molding material fixing the fixing frame and the abrasive materials to each other. The abrasive particles are placed inside the through-holes, by one abrasive particle in one through-hole, and each of the abrasive particles is partially exposed from the underside surface of the fixing frame. The conditioner can ensure stability of prevent abrasive particles from being detached, realize uniform dressing, excellent dressing efficiency and excellent performance reproducibility, and remarkably remove the probability of scratches.

IPC Classes  ?

41.

NEXXO

      
Application Number 984697
Status Registered
Filing Date 2008-10-14
Registration Date 2008-10-14
Owner EHWA DIAMOND INDUSTRIAL COMPANY LIMITED (Republic of Korea)
NICE Classes  ? 07 - Machines and machine tools

Goods & Services

Metalworking machines; cutting machines for metalworking; diamond-pointed metal-cutting tools; stone-working machines; electric-powered industrial diamond tools for metalworking and stone-working; electric-powered industrial diamond saws for metalworking and stone-working; electric-powered industrial diamond saw blades for metalworking and stone-working; electric-powered industrial diamond cutters for metalworking and stone-working; electric-powered industrial diamond grinding plates for metalworking and stone-working; electric-powered industrial diamond wheels for metalworking and stone-working; electric-powered industrial cubic boron nitride tools for metalworking and stone-working; electric-powered industrial cubic boron nitride saws for metalworking and stone-working; electric-powered industrial cubic boron nitride saw blades for metalworking and stone-working, electric-powered industrial cubic boron nitride cutters for metalworking and stone-working; electric-powered industrial cubic boron nitride grinding plates for metalworking and stone-working; electric-powered industrial cubic boron nitride wheels for metalworking and stone-working; electric-powered industrial diamond tools for grinding and cutting concrete structures; aggregate crushers; ore treating machines; woodworking machines; circular saws; saw blades as parts of machines.

42.

ABRASIVE MATERIAL SUPPLYING APPARATUS FOR MANUFACTURING SEGMENTS OF CUTTING/POLISHING TOOL AND MANUFACTURING METHOD OF SEGMENTS USING THE SAME

      
Application Number KR2008002840
Publication Number 2008/143464
Status In Force
Filing Date 2008-05-21
Publication Date 2008-11-27
Owner EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
  • Kim, Soo Kwang
  • Hong, Jae Hyun
  • Ahn, Jang Hyuk
  • Seo, Jung Yun

Abstract

There is provided an abrasive material supplying apparatus for manufacturing segments of a cutting/polishing tool for stably supplying an abrasive material in a predetermined pattern to enhance a cutting efficiency of the segments of a cutting/polishing tool, maintain constant performances and reduce poor products, and a manufacturing method of segments of a cutting/polishing tool using the same. The abrasive material supplying apparatus includes a body communicating with an air intake apparatus and having a chamber formed thereinside, the chamber having a predetermined size; and an intake plate installed in the body and having a plurality of abrasive material intake ports formed in one surface thereof and guide grooves formed in the other surface thereof, the abrasive material intake ports communicating with the chamber and having a predetermined pattern so that an abrasive material is inhaled by a suction force of the air intake apparatus, and the guide grooves communicating with the respective abrasive material intake ports to guide the intake of the abrasive material. Therefore, the abrasive material supplying apparatus may be useful to improve the cutting performances, cutting efficiency and life span of the cutting/polishing tool by minimizing the difference in the performances between the segments.

IPC Classes  ?

  • B24D 3/00 - Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special natureAbrasive bodies or sheets characterised by their constituents

43.

WIRE SAW CONNECTOR AND DIAMOND WIRE SAW CONNECTED BY THE CONNECTOR

      
Application Number KR2008002607
Publication Number 2008/140217
Status In Force
Filing Date 2008-05-09
Publication Date 2008-11-20
Owner EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor Sung, Kyung Yong

Abstract

There is provided a wire saw connector that is used to cut stones or concrete structures and able to improve the bonding force between a wire rope and a connection shank, and simultaneously facilitate the connection of the wire rope, and a wire saw having both ends coupled through the wire saw connector. The wire saw connector comprises one connection shank including a first wire rope fixing part having an inner portion processed in the form of a screw to fix one end of a wire rope, and a first shank coupling part including a connection part having a first connector pin through hole formed therein; the other connection shank including a second wire rope fixing part having an inner portion processed in the form of a screw to fix the other end of the wire rope, and a second shank coupling part having a second connector pin through hole formed in a position corresponding to the first connector pin through hole; and a connector pin inserted into the second connector pin through hole and the first connector pin through hole to couple the two connection shanks to each other, and the wire saw has both ends coupled through the wire saw connector.

IPC Classes  ?

  • B28D 1/08 - Working stone or stone-like materials, e.g. brick, concrete, not provided for elsewhereMachines, devices, tools therefor by sawing with saw blades of endless cutter-type, e.g. chain saws, strap saws

44.

NEXXO

      
Application Number 141502400
Status Registered
Filing Date 2008-10-20
Registration Date 2010-06-01
Owner EHWA DIAMOND INDUSTRIAL COMPANY LIMITED (Republic of Korea)
NICE Classes  ? 07 - Machines and machine tools

Goods & Services

(1) Metalworking machines; metal cutting machines; diamond-pointed metal-cutting machines; electric-powered diamond tools for metalworking and stone working, namely: diamond saws, diamond saw blades, diamond cutters, diamond grinding plates, diamond wheels, diamond drills, diamond bits, diamond reamers, diamond bites and diamond dressers; electric-powered cubic boron nitride tools for metalworking and stone working, namely: cubic boron nitride saws, cubic boron nitride saw blades, cubic boron nitride cutters, cubic boron nitride grinding plates, cubic boron nitride wheels, cubic boron nitride drills, cubic boron nitride bits, cubic boron nitride reamers, cubic boron nitride bites and cubic boron nitride dressers; die-cutting and tapping machines; lapping machines; milling machines; broaching machines; machines tools, namely: lathes; grinding machines, trueing machines; planing machines; honing machines; drilling machines; parts of machines, namely: drill bits, drill heads, saw blades; stone crushing machines; ore treating machines; stone working machines.

45.

NEXXO

      
Serial Number 79061984
Status Registered
Filing Date 2008-10-14
Registration Date 2009-07-14
Owner EHWA DIAMOND INDUSTRIAL COMPANY LIMITED (Republic of Korea)
NICE Classes  ? 07 - Machines and machine tools

Goods & Services

Metalworking machines; cutting machines for metalworking; diamond-pointed metal-cutting tools; stone-working machines, namely, stone profilers, stone splitters, stone block saws, stone profiling saws, stone CNC milling machines, stone edge shapers and polishers; electric-powered industrial diamond-pointed metal-cutting tools for metalworking and stone-working; electric-powered industrial diamond saw machines for metalworking and stone-working; electric-powered industrial diamond saw blades for metalworking and stone-working; electric-powered industrial diamond cutters for metalworking and stone-working; electric-powered industrial diamond grinding plates for metalworking and stone-working; electric-powered industrial diamond wheels for metalworking and stone-working machines; metalworking machine tools, namely, electric-powered industrial cubic boron nitride tools for metalworking and stone-working; electric-powered industrial cubic boron nitride saws for metalworking and stone-working; electric-powered industrial cubic boron nitride saw blades for metalworking and stone-working; electric-powered industrial cubic boron nitride cutters for metalworking and stone-working; electric-powered industrial cubic boron nitride grinding plates for metalworking and stone-working; electric-powered industrial cubic boron nitride wheels for metalworking and stone-working machines; electric-powered industrial diamond-pointed metal-cutting tools for grinding and cutting concrete structures; aggregate crushers, namely, cone crushers, jaw crushers, impact crushers, hammermill crushers, and crushing plants; ore treating machines, namely, grinding mills; woodworking machines, namely, saw machines; circular saws; power saw blades as parts of machines

46.

Cutting segment for cutting tool and cutting tools

      
Application Number 11910611
Grant Number 07954483
Status In Force
Filing Date 2006-04-19
First Publication Date 2008-08-28
Grant Date 2011-06-07
Owner
  • Ehwa Diamond Industrial Co., Ltd. (Republic of Korea)
  • General Tool, Inc. (USA)
Inventor
  • Kim, Soo-Kwang
  • Park, Hee-Dong
  • Chang, Joon-Ho
  • Kim, Jong-Ho

Abstract

The invention provides a cutting segment for a cutting tool for cutting or drilling a brittle work piece such as stone, bricks, concrete and asphalt, and a cutting tool having the cutting segment. The cutting segment includes a cutting surface for cutting a work piece and a plurality of abrasive particle layers. The abrasive particle layers are disposed perpendicular to a cutting direction. Each of the abrasive layers has a plurality of abrasive particle rows in a width direction of the cutting segment. Each of the abrasive rows has a plurality of abrasive particles arranged in a line. Further, the abrasive layers have a plurality of blank sections therebetween. In the blanks sections, abrasive particles are absent or have a concentration of 70% or less with respect to those in the abrasive rows. In addition, the blank sections include relatively thick blank sections and relatively thin blank sections.

IPC Classes  ?

  • B28D 1/12 - Saw blades specially adapted for working stone

47.

Cutting segment for diamond tool and diamond tool having the segment

      
Application Number 11911798
Grant Number 07661419
Status In Force
Filing Date 2006-04-20
First Publication Date 2008-07-17
Grant Date 2010-02-16
Owner
  • Ehwa Diamond Industrial Co., Ltd. (Republic of Korea)
  • General Tool, Inc. (USA)
Inventor
  • Kim, Soo-Kwang
  • Park, Hee-Dong
  • Kim, Jong-Ho
  • Chang, Joon-Ho

Abstract

The invention relates to a cutting segment of a diamond tool for cutting or drilling a brittle workpiece such as stone, bricks, concrete and asphalt, and a diamond tool having the same. The invention allows superior cutting rate and lengthy useful life without suffering from R wear during cutting. In the cutting segment, a number of diamond particles are arranged in a plurality of plate-shaped layers stacked perpendicular to a cutting direction. Each of the diamond particle layers has a plurality of particle rows on a cutting surface. Further, at least two of the diamond particle layers are superimposed on at least one side of the cutting segment seen from the front of the cutting segment in cutting direction. The invention ensures uniform cutting by significantly reducing R wear that arises during cutting and thus enables superior cutting rate and longer useful life.

IPC Classes  ?

  • B28D 1/12 - Saw blades specially adapted for working stone

48.

Cutting segment, method for manufacturing cutting segment, and cutting tool comprising the same

      
Application Number 11911510
Grant Number 08002858
Status In Force
Filing Date 2006-04-14
First Publication Date 2008-06-26
Grant Date 2011-08-23
Owner
  • EHWA Diamond Industrial Co., Ltd. (Republic of Korea)
  • General Tool, Inc. (USA)
Inventor
  • Kim, Soo-Kwang
  • Park, Hee-Dong

Abstract

A cutting segment for a cutting tool used for cutting or drilling brittle workpieces, such as stone, brick, concrete and asphalt, a method for manufacturing the segment, and a cutting tool comprising the segment are disclosed. The segment comprises layers of diamond particles and two kinds of plate-shaped metal matrix layers comprising soft and hard metal matrix layers having different ductility. The plate-shaped metal matrix layers are arranged perpendicular to a cutting surface while being parallel to a cutting direction, and are alternately stacked perpendicular to the cutting direction. The layers of diamond particles are suitably arranged in the plate-shaped soft and hard metal matrix layers. The segment and the cutting tool comprising the same have excellent cutting ability, and the manufacturing process thereof can be simplified, thereby remarkably enhancing productivity.

IPC Classes  ?

  • B24B 7/00 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfacesAccessories therefor
  • B28D 1/00 - Working stone or stone-like materials, e.g. brick, concrete, not provided for elsewhereMachines, devices, tools therefor

49.

A CUTTING TOOL AND METHOD FOR MANUFACTURING THE CUTTING TOOL

      
Application Number KR2007005176
Publication Number 2008/050978
Status In Force
Filing Date 2007-10-22
Publication Date 2008-05-02
Owner EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
  • Choi, Jong Suk
  • Hong, Jae Hyun
  • Kim, In Woo

Abstract

There are provided a cutting tool for cutting or drilling a brittle work piece such as stone, bricks, concrete and asphalt, and a method for manufacturing the cutting tool. Segments are prevented from abrupt abrasion at edges thereof during cutting of the work piece, thereby ensuring a longer useful life and higher cutting capacity of the cutting tool. The cutting tool including: a shank; and segments welded at predetermined intervals on an outer periphery of the shank, each of the segments having abrasives attached thereto by brazing, wherein the each segment is welded after the abrasives are brazed thereto; wherein the segment has both lateral edges in a cutting direction subjected to machining such as rounding and chamfering, and the machining is performed within 1/2 or less of a thickness of the segment.

IPC Classes  ?

50.

CUTTING TIP OF FRAME SAW AND FRAME SAW WITH THE CUTTING TIP

      
Application Number KR2007001031
Publication Number 2007/100214
Status In Force
Filing Date 2007-02-28
Publication Date 2007-09-07
Owner
  • EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
  • GENERAL TOOL, INC. (USA)
Inventor
  • Kim, Soo-Kwang
  • Park, Hee-Dong
  • Kim, Nam-Kwang

Abstract

A cutting tip for a cutting tool used to cut or drill a brittle workpiece such as stone, brick, concrete, or asphalt and a frame saw provided with the cutting tip are disclosed. The swing type cutting tip including abrasive particles has a specific arrangement capable of enhancing the cutting efficiency of the abrasive particles, and thus achieving an enhancement in cutting performance and an increase in lifespan. The cutting tip includes a plurality of abrasive particles to cut a workpiece while swing. At least a part of the abrasive particles are arranged in the form of abrasive particle groups. Each abrasive particle group is constituted by at least two abrasive particles. At least a part of the abrasive particles of the abrasive particle groups are overlapped in a cutting direction.

IPC Classes  ?

  • B28D 1/06 - Working stone or stone-like materials, e.g. brick, concrete, not provided for elsewhereMachines, devices, tools therefor by sawing with reciprocating saw blades

51.

CUTTING TIP, METHOD FOR MAKING THE CUTTING TIP AND CUTTING TOOL

      
Application Number KR2007000943
Publication Number 2007/097584
Status In Force
Filing Date 2007-02-23
Publication Date 2007-08-30
Owner EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
  • Kim, Tae-Woong
  • Yun, Joong-Cheul
  • Song, Young-Choul
  • Kim, Sang-Beom
  • Park, Jung-Nam
  • Yoo, Suk-Hyun
  • Kim, Tae-Bong

Abstract

The present invention relates to a cutting tip for a cutting tool, which is used in cutting or drilling a brittle workpiece such as stone, bricks, concrete, and asphalt and has an excellent cutting speed and a long lifetime, a method of manufacturing the cutting tip, and a cutting tool including the cutting tip. The cutting tip includes an abrasive material and a sintered bonding material, wherein the bonding material is formed of a metal matrix; the metal matrix includes a phase II and/or pore having a certain size at a certain volume fraction; and the phase II is one of a non-metallic inclusion and ceramic. According to an aspect of the present invention, there is provided a cutting tip having excellent cutting speed and a long lifetime at a much lower price.

IPC Classes  ?

52.

ZENESIS TECHNOLOGY

      
Application Number 895116
Status Registered
Filing Date 2005-07-05
Registration Date 2005-07-05
Owner EHWA DIAMOND INDUSTRIAL COMPANY LIMITED (Republic of Korea)
NICE Classes  ?
  • 07 - Machines and machine tools
  • 08 - Hand tools and implements

Goods & Services

Electric-powered diamond tools for metal and stone working, namely diamond saws, diamond saw blades, diamond cutters, diamond grinding plates, diamond wheels, diamond drills, diamond bits, diamond reamers, diamond dressers; electric-powered cubic boron nitride tools for metal and stone working, namely cubic boron nitride saws, cubic boron nitride saw blades, cubic boron nitride cutters, cubic boron nitride grinding plates, cubic boron nitride wheels, cubic boron nitride drills, cubic boron nitride bits, cubic boron nitride reamers, cubic boron nitride dressers; die cutting and tapping machines; lapping machines; milling machines; broaching machines; lathes (except for woodworking); grinding machines; trueing machines; planing machines; honing machines; drilling machines; drill bits (parts of machines); drill heads (parts of machines); stone crushing machines; ore treating machines; road making machines; stone working machines; saw blades (parts of machines). Dies (hand tools); drills; reamers; milling cutters (hand tools); breast drills; bits (hand tools); taps (hand tools); punches (hand tools); hand drills (hand tools); ratchets (hand tools); vices; scrapers (hand tools); sharpening steels; sharpening wheels (hand tools); files (tools); saws (hand tools).

53.

CUTTING SEGMENT FOR DIAMOND TOOL AND DIAMOND TOOL HAVING THE SEGMENT

      
Application Number KR2006001468
Publication Number 2006/112670
Status In Force
Filing Date 2006-04-20
Publication Date 2006-10-26
Owner
  • EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
  • GENERAL TOOL, INC. (USA)
Inventor
  • Kim, Soo-Kwang
  • Park, Hee-Dong
  • Kim, Jong-Ho
  • Chang, Joon-Ho

Abstract

The invention relates to a cutting segment of a diamond tool for cutting or drilling a brittle workpiece such as stone, bricks, concrete and asphalt, and a diamond tool having the same. The invention allows superior cutting rate and lengthy useful life without suffering from R wear during cutting. In the cutting segment, a number of diamond particles are arranged in a plurality of plate-shaped layers stacked perpendicular to a cutting direction. Each of the diamond particle layers has a plurality of particle rows on a cutting surface. Further, at least two of the diamond particle layers are superimposed on at least one side of the cutting segment seen from the front of the cutting segment in cutting direction. The invention ensures uniform cutting by significantly reducing R wear that arises during cutting and thus enables superior cutting rate and longer useful life.

IPC Classes  ?

54.

EHWA

      
Application Number 895631
Status Registered
Filing Date 2006-02-23
Registration Date 2006-02-23
Owner EHWA DIAMOND INDUSTRIAL COMPANY LIMITED (Republic of Korea)
NICE Classes  ? 07 - Machines and machine tools

Goods & Services

Diamond saw blades (parts of machines), diamond milling cutters, diamond wire saws, diamond core drills, diamond core drill bits, diamond core bites, diamond reamers, diamond bites, diamond dressers, diamond rotary dressers, cubic boron nitride bites.

55.

CUTTING SEGMENT FOR CUTTING TOOL AND CUTTING TOOLS

      
Application Number KR2006001442
Publication Number 2006/112654
Status In Force
Filing Date 2006-04-19
Publication Date 2006-10-26
Owner
  • EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
  • GENERAL TOOL, INC. (USA)
Inventor
  • Kim, Soo-Kwang
  • Park, Hee-Dong
  • Chang, Joon-Ho
  • Kim, Jong-Ho

Abstract

The invention provides a cutting segment for a cutting tool for cutting or drilling a brittle work piece such as stone, bricks, concrete and asphalt, and a cutting tool having the cutting segment. The cutting segment includes a cutting surface for cutting a work piece and a plurality of abrasive particle layers. The abrasive particle layers are disposed perpendicular to a cutting direction. Each of the abrasive layers has a plurality of abrasive particle rows in a width direction of the cutting segment. Each of the abrasive rows has a plurality of abrasive particles arranged in a line. Further, the abrasive layers have a plurality of blank sections therebetween. In the blanks sections, abrasive particles are absent or have a concentration of 70% or less with respect to those in the abrasive rows. In addition, the blank sections include relatively thick blank sections and relatively thin blank sections.

IPC Classes  ?

56.

CUTTING SEGMENT, METHOD FOR MANUFACTURING CUTTING SEGMENT, AND CUTTING TOOL COMPRISING THE SAME

      
Application Number KR2006001382
Publication Number 2006/110010
Status In Force
Filing Date 2006-04-14
Publication Date 2006-10-19
Owner
  • EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
  • GENERAL TOOL, INC. (USA)
Inventor
  • Kim, Soo-Kwang
  • Park, Hee-Dong

Abstract

A cutting segment for a cutting tool used for cutting or drilling brittle workpieces, such as stone, brick, concrete and asphalt, a method for manufacturing the segment, and a cutting tool comprising the segment are disclosed. The segment comprises layers of diamond particles and two kinds of plate-shaped metal matrix layers comprising soft and hard metal matrix layers having different ductility. The plate-shaped metal matrix layers are arranged perpendicular to a cutting surface while being parallel to a cutting direction, and are alternately stacked perpendicular to the cutting direction. The layers of diamond particles are suitably arranged in the plate-shaped soft and hard metal matrix layers. The segment and the cutting tool comprising the same have excellent cutting ability, and the manufacturing process thereof can be simplified, thereby remarkably enhancing productivity.

IPC Classes  ?

57.

DIAMOND TOOL

      
Application Number KR2006000507
Publication Number 2006/088302
Status In Force
Filing Date 2006-02-13
Publication Date 2006-08-24
Owner
  • EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
  • GENERAL TOOL, INC. (USA)
Inventor
  • Kim, Soo-Kwang
  • Kim, Jong-Ho
  • Park, Hee-Dong

Abstract

The invention provides a segment type diamond tool capable of improving cutting rate and reducing the amount of fine debris generated during cutting by properly arranging diamond particles in a cutting segment of the diamond tool. In the invention, the layers of diamond particles are arranged such that cutting grooves formed on a workpiece by trailing layers of diamond particles are arranged between cutting grooves formed thereon by leading layers of diamond particles, respectively, in cutting of the work piece. The cutting segment has high-concentration and low-concentration areas. The high- concentration area shows a concentration higher than an average concentration and the low concentration area shows a concentration lower than the average concentration. Also, at least one low concentration area is formed on the leading and/or trailing section of the cutting segment. The diamond tool of the invention ensures superior cutting rate and reduced amount of fine debris generated during cutting.

IPC Classes  ?

58.

ZENESIS Ehwa Diamond

      
Application Number 883755
Status Registered
Filing Date 2005-11-24
Registration Date 2005-11-24
Owner EHWA DIAMOND INDUSTRIAL COMPANY LIMITED (Republic of Korea)
NICE Classes  ?
  • 07 - Machines and machine tools
  • 08 - Hand tools and implements

Goods & Services

Electric-powered diamond tools for metal and stone-working, namely diamond saws, diamond saw blades, diamond cutters, diamond grinding plates, diamond wheels, diamond drills, diamond bits, diamond reamers, diamond bites and diamond dressers; electric powered cubic boron nitride tools for metal and stone-working, namely cubic boron nitride saws, cubic boron nitride saw blades, cubic boron nitride cutters, cubic boron nitride grinding plates, cubic boron nitride wheels, cubic boron nitride drills, cubic boron nitride bits, cubic boron nitride reamers, cubic boron nitride bites and cubic boron nitride dressers; die-cutting and tapping machines; lapping machines; milling machines; broaching machines; lathes (except for woodworking); grinding machines; trueing machines; planing machines; honing machines; drilling machines; drill bits (parts of machines); drill heads (parts of machines); stone crushing machines; ore treating machines; road making machines; stone working machines; saw blades (parts of machines). Dies (hand tools); drills; reamers; milling cutters (hand tools); breast drills; bits (hand tools); taps (hand tools); punches (hand tools); hand drills (hand tools); ratchets (hand tools); vices; scrapers (hand tools); sharpening steels; sharpening wheels (hand tools); files (tools); saws (hand tools).

59.

CUTTING SEGMENT OF CUTTING TOOL AND CUTTING TOOL

      
Document Number 02591881
Status In Force
Filing Date 2005-12-28
Open to Public Date 2006-07-06
Grant Date 2010-02-23
Owner
  • EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
  • GENERAL TOOL, INC. (USA)
Inventor
  • Kim, Soo-Kwang
  • Chang, Joon-Ho
  • Park, Hee-Dong
  • Kim, Jong-Ho

Abstract

The invention provides a cutting segment of a cutting tool for cutting or drilling a brittle work piece such as stone, bricks, concrete and asphalt, and a cutting tool. The cutting segment includes a cutting surface for cutting a work piece and a number of abrasive particles arranged in a plurality of rows. Each of the abrasive rows includes high-concentration parts and low concentration parts. The high-concentration parts are grouped together to form a high-concentration area on the cutting surface and the low-concentration parts are grouped together to form a low-concentration area on the cutting surface. The invention provides the cutting segment and the cutting tool capable of improving cutting rate and useful life.

IPC Classes  ?

60.

EHWA

      
Application Number 129115100
Status Registered
Filing Date 2006-02-23
Registration Date 2007-02-14
Owner EHWA DIAMOND INDUSTRIAL COMPANY LIMITED (Republic of Korea)
NICE Classes  ? 07 - Machines and machine tools

Goods & Services

(1) Electric-powered industrial diamond and cubic boron nitride tools for stone and metal-working, namely: saws, saw blades, cutters, grinding plates, wheels, drills, bits, reamers, bites and dressers.

61.

ZENESIS EHWA DIAMOND

      
Serial Number 79023654
Status Registered
Filing Date 2005-11-24
Registration Date 2007-01-30
Owner EHWA DIAMOND INDUSTRIAL COMPANY LIMITED (Republic of Korea)
NICE Classes  ?
  • 07 - Machines and machine tools
  • 08 - Hand tools and implements

Goods & Services

ELECTRIC-POWERED DIAMOND TOOLS FOR METAL AND STONE-WORKING ALL PERFORMING CUTTING, DRILLING, BORING, GRINDING, ABRASION, POLISHING, OR SURFACE TREATMENT FUNCTIONS, NAMELY, DIAMOND SAWS, DIAMOND SAW BLADES, DIAMOND CUTTERS, DIAMOND GRINDING PLATES, DIAMOND WHEELS, DIAMOND DRILLS, DIAMOND BITS, DIAMOND REAMERS, DIAMOND BITES AND DIAMOND DRESSERS; ELECTRIC POWERED CUBIC BORON NITRIDE TOOLS FOR METAL AND STONE-WORKING PERFORMING CUTTING, DRILLING, BORING, GRINDING, ABRASION, POLISHING, OR SURFACE TREATMENT FUNCTIONS, NAMELY CUBIC BORON NITRIDE SAWS, CUBIC BORON NITRIDE SAW BLADES, CUBIC BORON NITRIDE CUTTERS, CUBIC BORON NITRIDE GRINDING PLATES, CUBIC BORON NITRIDE WHEELS, CUBIC BORON NITRIDE DRILLS, CUBIC BORON NITRIDE BITS, CUBIC BORON NITRIDE REAMERS, CUBIC BORON NITRIDE BITES AND CUBIC BORON NITRIDE DRESSERS; DIE-CUTTING AND TAPPING MACHINES; LAPPING MACHINES; MILLING MACHINES; BROACHING MACHINES; LATHES EXCLUDING LATHES FOR WOODWORKING; GRINDING MACHINES; TRUEING MACHINES; PLANING MACHINES; HONING MACHINES; DRILLING MACHINES; MACHINE PARTS, NAMELY, DRILL BITS, DRILL HEADS, AND SAW BLADES; STONE CRUSHING MACHINES; ORE TREATING MACHINES; ROAD MAKING MACHINES; STONE WORKING MACHINES HAND TOOLS, NAMELY, DIES, DRILLS, REAMERS, REAMERS, MILLING CUTTERS, BREAST DRILLS; BITS FOR HAND TOOLS, TAPS, PUNCHES, RATCHET WRENCHES, VICES, SCRAPERS, SHARPENING STEELS, MANUALLY-OPERATED SHARPENING WHEELS, FILES, SAWS

62.

ZENESIS EHWA DIAMOND

      
Application Number 128038400
Status Registered
Filing Date 2005-11-22
Registration Date 2007-05-11
Owner EHWA DIAMOND INDUSTRIAL COMPANY LIMITED (Republic of Korea)
NICE Classes  ?
  • 07 - Machines and machine tools
  • 08 - Hand tools and implements

Goods & Services

(1) Electric-powered diamond tools for metal- and stone-working, namely diamond saws, diamond saw blades, diamond cutters, diamond grinding plates, diamond wheels, diamond drills, diamond bits, diamond reamers, diamond bites and diamond dressers; electric-powered cubic boron nitride tools for metal- and stone-working, namely cubic boron nitride saws, cubic boron nitride saw blades, cubic boron nitride cutters, cubic boron nitride grinding plates, cubic boron nitride wheels, cubic boron nitride drills, cubic boron nitride bits, cubic boron nitride reamers, cubic boron nitride bites and cubic boron nitride dressers; die-cutting and tapping machines; lapping machines; milling machines; broaching machines; lathes (machine tools); grinding machines, trueing machines; planing machines; honing machines; drilling machines; drill bits (parts of machines); drill heads (parts of machines), stone crushing machines; ore treating machines; road making machines; stone working machines; saw blades (parts of machines). (2) Dies (hand tools); drills; reamers; milling cutters (hand tools); breast drills; bits (hand tools); taps (hand tools); punches (hand tools); hand drills (hand tools); ratchets (hand tools), vices; scrapers (hand tools); sharpening steels, sharpening wheels (hand tools); files (tools); saws (hand tools).

63.

CUTTING SEGMENT, METHOD OF MANUFACTURING CUTTING SEGMENT, AND CUTTING TOOL

      
Document Number 02526229
Status In Force
Filing Date 2005-02-07
Open to Public Date 2005-11-03
Grant Date 2009-01-13
Owner
  • EHWA DIAMOND INDUSTRIAL CO., LTD (Republic of Korea)
  • GENERAL TOOL, INC. (USA)
Inventor
  • Kim, Soo-Kwang
  • Park, Hee-Dong

Abstract

A cutting segment for a cutting tool used for cutting or drilling a brittle workpiece, such as stone, brick, concrete and asphalt, a method of manufacturing the segment and a cutting tool provided with the segment are disclosed. The segment comprises a plurality of plate-shaped metal matrix layers laminated perpendicular to a cutting surface of the segment while being parallel to a cutting direction of the segment, the plate-shaped metal matrix layers being integrally combined with each other and made of a ferrous or non- ferrous material; and diamond particle layers arranged between the plate- shaped metal matrix layers such that diamond particles can be provided in an array on the cutting surface. The segment has an excellent cutting capability, and can be made by a simplified manufacturing process, thereby remarkably reducing manufacturing costs.

IPC Classes  ?

  • B23D 61/18 - Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
  • B23D 61/00 - Tools for sawing machines or sawing devicesClamping devices for these tools
  • B24D 5/06 - Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their peripheryBushings or mountings therefor with inserted abrasive blocks, e.g. segmental
  • B28D 1/12 - Saw blades specially adapted for working stone

64.

ZENESIS TECHNOLOGY

      
Serial Number 79027588
Status Registered
Filing Date 2005-07-05
Registration Date 2007-08-07
Owner EHWA DIAMOND INDUSTRIAL COMPANY LIMITED (Republic of Korea)
NICE Classes  ?
  • 07 - Machines and machine tools
  • 08 - Hand tools and implements

Goods & Services

ELECTRIC-POWERED DIAMOND TOOLS FOR METAL AND STONE-WORKING, ALL PERFORMANCE CUTTING, DRILLING, BORING, GRINDING, ABRASION, POLISHING, OR SURFACE TREATMENT FUNCTIONS, NAMELY, DIAMOND SAWS, DIAMOND SAW BLADES, DIAMOND CUTTERS, DIAMOND GRINDING PLATES, DIAMOND WHEELS, DIAMOND DRILLS, DIAMOND BITS, DIAMOND REAMERS, DIAMOND BITES AND DIAMOND DRESSERS; ELECTRIC POWERED CUBIC BORON NITRIDE TOOLS FOR METAL AND STONE-WORKING PERFORMANCE CUTTING, DRILLING, BORING, GRINDING, ABRASION, POLISHING, OR SURFACE TREATMENT FUNCTIONS, NAMELY CUBIC BORON NITRIDE SAWS, CUBIC BORON NITRIDE SAW BLADES, CUBIC BORON NITRIDE CUTTERS, CUBIC BORON NITRIDE GRINDING PLATES, CUBIC BORON NITRIDE WHEELS, CUBIC BORON NITRIDE DRILLS, CUBIC BORON NITRIDE BITS, CUBIC BORON NITRIDE REAMERS, CUBIC BORON NITRIDE BITES AND CUBIC BORON NITRIDE DRESSERS; DIE-CUTTING AND TAPPING MACHINES; LAPPING MACHINES; MILLING MACHINES; BROACHING MACHINES; LATHES EXCLUDING LATHES FOR WOODWORKING; GRINDING PLATES; TRUEING MACHINES; PLANING MACHINES; HONING MACHINES; DRILLING MACHINES; MACHINE PARTS, NAMELY, DRILL BITS, DRILL HEADS, AND SAW BLADES; STONE CRUSHING MACHINES; ORE TREATING MACHINES; ROAD MAKING MACHINES; STONE WORKING MACHINES HAND TOOLS, NAMELY, DIES, DRILLS, REAMERS, MILLING CUTTERS, BREAST DRILLS, BITS FOR HAND TOOLS, TAPS, PUNCHES, RATCHET WRENCHES, VICES, SCRAPERS, SHARPENING STEELS, MANUALLY-OPERATED SHARPENING WHEELS, FILES, SAWS

65.

ZENESIS TECHNOLOGY

      
Application Number 126333700
Status Registered
Filing Date 2005-07-04
Registration Date 2006-07-04
Owner EHWA DIAMOND INDUSTRIAL COMPANY LIMITED (Republic of Korea)
NICE Classes  ?
  • 07 - Machines and machine tools
  • 08 - Hand tools and implements

Goods & Services

(1) Electric-powered diamond tools for metal- and stone-working, namely: diamond saws, diamond saw blades, diamond cutters, diamond grinding plates, diamond wheels, diamond drills, diamond bits, diamond reamers, diamond bites and diamond dressers; electric-powered cubic boron nitride tools for metal- and stone-working, namely: cubic boron nitride saws, cubic boron nitride saw blades, cubic boron nitride cutters, cubic boron nitride grinding plates, cubic boron nitride wheels, cubic boron nitride drills, cubic boron nitride bits, cubic boron nitride reamers, cubic boron nitride bites and cubic boron nitride dressers; die-cutting and tapping machines; lapping machines, milling machines; broaching machines; lathes (machines tools); grinding machines; trueing machines; planing machines; honing machines; drilling machines; drill bits (parts of machines); drill heads (parts of machines); stone crushing machines; ore treating machines; road making machines; stone working machines; saw blades (parts of machines). (2) Dies (hand tools); drills; reamers; milling cutters (hand tools); breast drills; bits (hand tools); taps (hand tools); punches (hand tools); hand drills (hand tools); ratchets (hand tools); vices; scrapers (hand tools); sharpening steels; sharpening wheels (hand tools); files (tools); saws (hand tools).