EHWA DIAMOND INDUSTRIAL COMPANY LIMITED (Republic of Korea)
Inventor
Choi, Seong Kwon
Park, Heedong
Abstract
There is provided a method of determining a depth of a damage layer formed on a back surface of the substrate. The method comprises irradiating the damage layer with first light and second light; detecting the first light and the second light reflected or scattered by defects in the damage layer; determining a first penetration depth of the first light and a second penetration depth of the second light based on a first wavelength of the first light and a second wavelength of the second light; and determining the depth of the damage layer based on the first penetration depth and the second penetration depth.
EHWA DIAMOND INDUSTRIAL COMPANY LIMITED (Republic of Korea)
Inventor
Park, Heedong
Kwack, Kyoung Kuk
Lee, Seh Kwang
Abstract
A diamond disc includes: a shank base; a bonding layer formed on a surface of the shank base; and a plurality of boron-doped diamonds (BDD) disposed in the bonding layer to be exposed. At least some of the plurality of boron-doped diamonds are disposed in the bonding layer in a posture in which an uppermost surface thereof meeting a long axis of the boron-doped diamond is inclined downward from an upper end of the major axis.
B24D 3/10 - Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special natureAbrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic for porous or cellular structure, e.g. for use with diamonds as abrasives
B24D 18/00 - Manufacture of grinding tools, e.g. wheels, not otherwise provided for
EHWA DIAMOND INDUSTRIAL COMPANY LIMITED (Republic of Korea)
Inventor
Moon, Yong Sik
Lee, Joo Hee
Kwack, Kyoung Kuk
Abstract
A device for manufacturing a CMP conditioning disk may comprise: a diamond jig that provides a jig pocket in which a diamond can be seated; a suction unit that selectively provides the jig pocket with a suction force; and a moving unit for fixing the diamond, seated in the jig pocket, to a shank base, wherein the suction unit provides the jig pocket with a suction force when the diamond is seated in the jig pocket, and removes the suction force when the diamond is fixed to the shank base.
B24B 53/017 - Devices or means for dressing, cleaning or otherwise conditioning lapping tools
B24D 3/10 - Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special natureAbrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic for porous or cellular structure, e.g. for use with diamonds as abrasives
B24D 18/00 - Manufacture of grinding tools, e.g. wheels, not otherwise provided for
5.
METHOD FOR MEASURING DEPTH OF DAMAGED LAYER AND CONCENTRATION OF DEFECTS IN DAMAGED LAYER, AND SYSTEM FOR PERFORMING SAME METHOD
EHWA DIAMOND INDUSTRIAL COMPANY LIMITED (Republic of Korea)
Inventor
Choi, Seong Kwon
Park, Heedong
Abstract
Provided is a method for determining the depth of a damaged layer formed at the rear surface of a substrate. The method may comprise the steps of: irradiating the damaged layer with first light and second light; detecting the first light and the second light reflected or scattered by defects in the damaged layer; determining a first penetration depth of the first light and a second penetration depth of the second light on the basis of a first wavelength of the first light and a second wavelength of the second light; and determining the depth of the damaged layer by using the first penetration depth and the second penetration depth.
G01N 21/88 - Investigating the presence of flaws, defects or contamination
G01N 21/95 - Investigating the presence of flaws, defects or contamination characterised by the material or shape of the object to be examined
G01N 21/956 - Inspecting patterns on the surface of objects
G01B 11/22 - Measuring arrangements characterised by the use of optical techniques for measuring depth
H01L 21/12 - Application of an electrode to the exposed surface of the selenium or tellurium after the selenium or tellurium has been applied to the foundation plate
EHWA DIAMOND INDUSTRIAL COMPANY LIMITED (Republic of Korea)
Inventor
Park, Heedong
Kwack, Kyoung Kuk
Lee, Seh Kwang
Abstract
A diamond disc comprises: a shank base; a bonding layer formed on the surface of the shank base; a plurality of boron-doped diamonds disposed so as to be exposed to the bonding layer, wherein at least some of the plurality of boron-doped diamonds are configured such that a surface disposed at an uppermost end while meeting the long axis of the boron-doped diamonds is disposed on the bonding layer to be inclined downward from the upper end of the long axis.
B24D 3/10 - Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special natureAbrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic for porous or cellular structure, e.g. for use with diamonds as abrasives
B24D 18/00 - Manufacture of grinding tools, e.g. wheels, not otherwise provided for
B24B 37/30 - Work carriers for single side lapping of plane surfaces
B24B 37/10 - Lapping machines or devicesAccessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
7.
Drill bit for drilling and method for manufacturing same
EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
Kim, Ki-Ho
Yun, Jun-Yong
Abstract
Disclosed are a drill bit for drilling and a method for manufacturing same, in which the hardness of a body part of a shank can be selectively improved by performing rapid cooling in a forced cooling method after performing rapid heating selectively only on the body part of the shank in a high-frequency induction heating method after completing infiltration.
E21B 10/46 - Drill bits characterised by wear resisting parts, e.g. diamond inserts
E21B 10/55 - Drill bits characterised by wear resisting parts, e.g. diamond inserts the bit being of the rotary drag type, e.g. fork-type bits with preformed cutting elements
B23P 5/00 - Setting gems or the like on metal parts, e.g. diamonds on tools
C21D 9/22 - Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articlesFurnaces therefor for drillsHeat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articlesFurnaces therefor for milling cuttersHeat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articlesFurnaces therefor for machine cutting tools
EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
Kim, Ki Ho
Yun, Jun Yong
Park, Hee Dong
Abstract
A mining bit includes: a shank; and cutting tips attached to the shank, each cutting tip having a plurality of layers and a plurality of abrasive particles, wherein the layers have a shape of an arch with flat surfaces in such a manner as to be laminated onto each other in a horizontal direction with respect to a cut surface of each cutting tip, and a distance (D2) between the abrasive particles on the adjacent layers is less than a distance (D1) between the abrasive particles on each layer.
E21B 10/48 - Drill bits characterised by wear resisting parts, e.g. diamond inserts the bit being of core type
B22F 5/00 - Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
B22F 7/08 - Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
9.
Preparing conditioning disk for chemical mechanical polishing and chemical mechanical polishing method including the same
EHWA Diamond Industrial Co., Ltd. (Republic of Korea)
Inventor
Hong, Myung-Ki
Kim, Yung-Jun
Park, Sung-Oh
Lee, Hyo-San
Lee, Joo-Han
Oh, Kyu-Min
Park, Sun-Gyu
Lee, Seh-Kwang
Yang, Chan-Ki
Abstract
A chemical mechanical polishing (CMP) method includes preparing a polishing pad, determining a first load to be applied to a conditioning disk during conditioning of the polishing pad and a first indentation depth at which tips of the conditioning disk are inserted into the polishing pad when the first load is applied to the conditioning disk, preparing a conditioning disk, and positioning the conditioning disk on the polishing pad and conditioning a surface of the polishing pad by using the conditioning disk while applying the first load to the conditioning disk.
EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
Kim, Ki-Ho
Yun, Jun-Yong
Abstract
Disclosed are a drill bit for drilling and a method for manufacturing same, in which the hardness of a body part of a shank can be selectively improved by performing rapid cooling in a forced cooling method after performing rapid heating selectively only on the body part of the shank in a high-frequency induction heating method after completing infiltration.
E21B 10/46 - Drill bits characterised by wear resisting parts, e.g. diamond inserts
E21B 10/55 - Drill bits characterised by wear resisting parts, e.g. diamond inserts the bit being of the rotary drag type, e.g. fork-type bits with preformed cutting elements
B23P 5/00 - Setting gems or the like on metal parts, e.g. diamonds on tools
C21D 9/22 - Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articlesFurnaces therefor for drillsHeat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articlesFurnaces therefor for milling cuttersHeat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articlesFurnaces therefor for machine cutting tools
EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
Song, Young-Choul
Abstract
A grinding tool according to the present invention comprises: a plate; a plurality of holders formed on the plate and having sliding grooves formed thereon; shoes coupled to the sliding grooves of the holders; and grinding tips arranged on the shoes. The shoes comprise: a fastening portion fastened to the sliding groove; and an upper plate portion formed on the fastening portion and placed on an upper surface of the holder of an outer side of the sliding groove. The shoes can be fastened to the holder in two or more directions, and the grinding tips may be arranged in two or more arrays in a plan view.
B24D 7/06 - Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front faceBushings or mountings therefor with inserted abrasive blocks, e.g. segmental
B24B 7/22 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfacesAccessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
Song, Young-Choul
Chung, Sung-Hoon
Choi, Jong-Suk
Hong, Jae-Hyun
Abstract
Disclosed herein is a grinding tool, which includes a plate, a plurality of holders formed on the plate and having sliding grooves, a shoe coupled to the sliding groove of each of the holders, and grinding tips arranged on the shoe. The shoe includes a fastening part fastened to the sliding groove, and an upper plate part formed on the fastening part and located on an upper surface of the holder outside the sliding groove. The shoe can be fastened to the holder in two or more directions, and the grinding tips can be arranged in two or more forms when viewed from the plane.
B24D 7/06 - Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front faceBushings or mountings therefor with inserted abrasive blocks, e.g. segmental
B24B 7/18 - Single-purpose machines or devices for grinding floorings, walls, ceilings or the like
Diamond-pointed metal-cutting tools; Grinding tools for grinding machines; Power saw blades; Precision machine tools, namely, hard metal tools, high speed steel (HSS) tools, carbide tools, ceramic tools, poly crystalline diamond (PCD) tools, and diamond-coated and diamond-uncoated tools, and hard metal tools, all for use in the cutting and forming of materials by others; Core drilling bits; Metalworking machine tools; Power drill bits; Power-operated grinding wheels; Router bits; Tool bits for machines
14.
DRILL BIT FOR DRILLING AND METHOD FOR MANUFACTURING SAME
EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
Kim, Ki-Ho
Yun, Jun-Yong
Abstract
Disclosed are a drill bit for drilling and a method for manufacturing same, in which the strength of a body part of a shank can be selectively improved by performing rapid cooling in a forced cooling method after performing rapid heating selectively only on the body part of the shank in a high-frequency induction heating method after completing infiltration.
E21B 10/46 - Drill bits characterised by wear resisting parts, e.g. diamond inserts
B23P 5/00 - Setting gems or the like on metal parts, e.g. diamonds on tools
C21D 9/22 - Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articlesFurnaces therefor for drillsHeat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articlesFurnaces therefor for milling cuttersHeat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articlesFurnaces therefor for machine cutting tools
15.
Brazing bond type diamond tool with excellent cuttability and method of manufacturing the same
EHWA Diamond Industrial Co., Ltd. (Republic of Korea)
Inventor
Hong, Jae-Hyun
Choi, Jong Suk
Song, Young Choul
Abstract
The present disclosure provides a brazing bond type diamond tool having excellent cuttability. The diamond tool includes a shank having a body with a thickness of 2 mm or less and a tip portion formed along an edge of the body, the tip portion being thinner than the body; and a brazing bond layer formed on the tip portion of the shank to secure diamond particles having a particle size of 25 to 50 mesh with a brazing bond, wherein the brazing bond layer has a greater thickness than a difference between half the thickness of the shank body and half the thickness of the shank tip portion, such that some part of the shank body can penetrate into a surface of an object to be cut, and the tip portion of the shank has a curved surface at an end thereof.
EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
Jeon, Chang Ho
Lee, Sung Hee
Kim, Sang Beom
Shin, Taek Jung
Lee, Seh Kwang
Kim, In Sub
Abstract
Disclosed herein is a scribing wheel having a predetermined thickness and a disk shape. The scribing wheel includes: a wheel body configured in such a way that at least a peripheral edge portion thereof is gradually reduced in thickness from the center to the radial outside; and a cutter part including recesses and cutting blade teeth which are alternately arranged along the peripheral edge portion. Each recess is formed by a combination of side recess portions formed in opposite side surfaces of the peripheral edge portion of the wheel body and an edge recess portion formed in the peripheral edge of the wheel body.
C03B 33/10 - Glass-cutting tools, e.g. scoring tools
B26D 3/08 - Making a superficial cut in the surface of the work without removal of material, e.g. scoring, incising
B28D 1/22 - Working stone or stone-like materials, e.g. brick, concrete, not provided for elsewhereMachines, devices, tools therefor by cutting, e.g. incising
B26D 1/00 - Cutting through work characterised by the nature or movement of the cutting memberApparatus or machines thereforCutting members therefor
EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
SAMSUNG ELECTRONICS CO., LTD. (Republic of Korea)
Inventor
Lee, Seh Kwang
Kim, Youn Chul
Lee, Joo Han
Choi, Jae Kwang
Boo, Jae Phil
Abstract
Provided is a chemical mechanical polishing (CMP) apparatus that includes a swing unit installed apart from a platen, on which a CMP pad to be conditioned is placed, at a predetermined interval, a connector installed on an upper end of the swing unit at one end thereof in a perpendicular direction to the swing unit and pivoting around the swing unit above the CMP pad, a rotator rotatably installed on the other end of the connector, a CMP pad conditioner coupled to the rotator and conditioning the CMP pad when rotated, and a vibration meter installed on the connector and detecting vibrations to measure a vibration acceleration of the CMP pad conditioner, thereby predicting a wear rate of the CMP pad based on the vibration acceleration and a state in which the CMP pad conditioner is installed or being used.
B24B 37/00 - Lapping machines or devicesAccessories
B24B 49/18 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or workArrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the presence of dressing tools
B24B 37/005 - Control means for lapping machines or devices
B24B 53/017 - Devices or means for dressing, cleaning or otherwise conditioning lapping tools
EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
Lee, Seh Kwang
Lee, Joo Han
Abstract
The present invention relates to a CMP pad conditioner having a substrate and a cutting tip pattern formed on at least one surface of the substrate, and more particularly to a CMP pad conditioner having cutting tip patterns, in which the cutting tip patterns have an improved structure that can increase the productivity of the CMP pad conditioner and that can sufficiently ensure the strength and safety of the cutting tip patterns.
EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
Lee, Seh Kwang
Kim, Youn Chul
Lee, Joo Han
Choi, Jae Kwang
Boo, Jae Phil
Abstract
This invention relates to a conditioner for a CMP (Chemical Mechanical Polishing) pad, which is used in a CMP process which is part of the fabrication of a semiconductor device, and more particularly, to a CMP pad conditioner in which the structure of the cutting tips is such that the change in the wear of the polishing pad is not great even when different kinds of slurry are used and when there are changes in pressure of the conditioner, and to a method of manufacturing the same.
EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
Jeon, Chang Ho
Lee, Sung Hee
Kim, Sang Beom
Shin, Taek Jung
Lee, Seh Kwang
Kim, In Sub
Abstract
The present invention relates to a scribing wheel comprising: a wheel-shaped wheel body, the thickness of at least the edge of the circumference of which gradually decreases when progressing radially outward; and a cutter unit having a plurality of grooves and cutter blades alternately formed along the edge of the circumference thereof. Each groove has a side recess region that is set back from both sides of the edge of the circumference of the wheel body, and an edge recess region that is set back from the edge of the circumference of the wheel body, the side recess region and the edge recess region being formed into one groove.
EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
Lee, Seh Kwang
Kim, Youn Chul
Lee, Joo Han
Choi, Jae Kwang
Boo, Jae Phil
Abstract
The present invention relates to a CMP device, and more specifically, to a CMP device comprising: a swing part provided at a fixed interval from a surface plate on which a CMP pad is placed to be conditioned; a connection part of which one end is provided to an upper end of the swing part in a vertical direction with respect to the swing part for rotating on the CMP pad in accordance with the swing part; a rotation part provided to the other end of the connection part for rotating; a CMP pad conditioner coupled to the rotation part for conditioning the CMP pad while rotating; and a vibration acceleration measuring part provided to the connection part for measuring vibration acceleration of the CMP pad conditioner by sensing vibration, wherein an abrasion loss of the CMP pad is predicted by the measured vibration acceleration, and a state in which the CMP conditioner is provided or a state in which the CMP conditioner operates can be predicted.
EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
Kim, Ki-Ho
Chung, Sung-Hoon
Abstract
A reaming shell for mining is provided. The reaming shell has a shank, and a plurality of pads attached at circumferential intervals from each other to extend lengthwise on an outer periphery of the shank. The reaming shell is coupled to a core bit of a diamond drilling tool for mining. The reaming shell includes a water groove of a recessed shape formed respectively between each adjacent pair of the pads, and extending from a leading edge along a length of the shank.
EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
Ahn, Jang-Hyuk
Yeom, Jong Kook
Abstract
Disclosed is a grinding tool, which includes a first disk having an installation hole in a center portion thereof such that the grinding tool is installed on a grinder, a second disk forming a discharge passage with partitions on a bottom surface of the first disk, wherein air intaken from a central lower portion of the grinding tool is discharged to an outside thereof through the discharge passage, and a ring-shaped shank disposed under the second disk and including grinding tips to grind a target.
B24D 7/06 - Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front faceBushings or mountings therefor with inserted abrasive blocks, e.g. segmental
B24D 7/10 - Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front faceBushings or mountings therefor with cooling provisions
24.
Grinding tool adapted to collect grinding particles
Ehwa Diamond Industrial Co., Ltd. (Republic of Korea)
Inventor
Ahn, Jang-Hyuk
Yeom, Jong-Kook
Abstract
Disclosed is a grinding tool, which includes a first disk having an installation hole in a center portion thereof such that the grinding tool is installed on a grinder, a second disk forming a discharge passage with partitions on a bottom surface of the first disk, wherein air intaken from a central lower portion of the grinding tool is discharged to an outside thereof through the discharge passage, and a ring-shaped shank disposed under the second disk and including grinding tips to grind a target.
B24B 55/06 - Dust extraction equipment on grinding or polishing machines
B24D 7/06 - Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front faceBushings or mountings therefor with inserted abrasive blocks, e.g. segmental
B24D 7/10 - Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front faceBushings or mountings therefor with cooling provisions
EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
Lee, Seh Kwang
Lee, Joo Han
Abstract
The present invention relates to a CMP pad conditioner which comprises a substrate and a cutting tip pattern formed on at least one side of the substrate, and more specifically to a CMP pad conditioner having a cutting tip pattern with a structure which can improve productivity and can sufficiently secure the intensity and stability of a fine cutting tip pattern by improving the structure of the cutting tip pattern.
EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
Lee, Seh Kwang
Kim, Youn Chul
Lee, Joo Han
Choi, Jae Kwang
Boo, Jae Phil
Abstract
The present invention relates to a conditioner for a chemical-mechanical polishing (CMP) pad used in a CMP process that is a part of a process for manufacturing a semiconductor device. More particularly, the present invention relates to a CMP pad conditioner in which the structure of a cutting tip has an insignificant variation in the abrasion of a polishing pad even when the type of slurry and pressure of the conditioner vary. The present invention also relates to a method for producing the CMP pad conditioner.
EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
Lee, Seh-Kwang
Sung, Rak-Joo
Kim, Tae-Bong
Abstract
The present invention relates to an electrodeposited diamond wire saw using patterned non-conductive materials in which non-conductive materials are pre-patterned along the outer circumference of a wire on which diamond grit should not be rubbed, before the diamond grit is upset, in order to efficiently improve the manufacturing process, and to a method for manufacturing same. According to one preferred embodiment of the present invention, the method for manufacturing the electrodeposited diamond wire saw includes: printing a masking solution on the outer circumference of a wire in a plurality of directions when the wire is inserted for patterning; and upsetting diamond grit on the remaining regions of the outer circumference of the wire, with the exception of the patterned region.
C25D 13/00 - Electrophoretic coating characterised by the process
C25D 5/02 - Electroplating of selected surface areas
B23D 61/18 - Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
EHWA DIAMOND INDUSTRIAL. CO., LTD. (Republic of Korea)
Inventor
Lee, Seh Kwang
Kim, Youn Chul
Lee, Joo Han
Lee, Jong Jae
Abstract
The present invention relates to a conditioner for a chemical-mechanical planarization (CMP) pad, which is used in a CMP process that is a part of a semiconductor element manufacturing process, and more particularly, to a conditioner for a fragile pad and a method for manufacturing same, the conditioner which can be used in a CMP environment using a slurry having low polishing particle content and/or a porous pad having relatively low hardness and very high porosity.
EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
Lee, Seh Kwang
Kim, Youn Chul
Lee, Joo Han
Abstract
The present invention relates to a CMP pad conditioner, and more particularly, to a method for recycling a spent CMP pad conditioner and a CMP pad conditioner recycled by the method for recycling for saving resources by recycling the spent CMP pad conditioner, which becomes spent when a diamond layer, which is coated on the surface of a CMP pad conditioner substrate having a protruding pattern, is worn down.
EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
Kim, Ki-Ho
Chung, Sung-Hoon
Abstract
A reaming shell for mining is provided. The reaming shell has a shank, and a plurality of pads attached at circumferential intervals from each other to extend lengthwise on an outer periphery of the shank. The reaming shell is coupled to a core bit of a diamond drilling tool for mining. The reaming shell includes a water groove of a recessed shape formed respectively between each adjacent pair of the pads, and extending from a leading edge along a length of the shank.
Ehwa Diamond Industrial Co., Ltd. (Republic of Korea)
Inventor
Park, Hee-Dong
Kim, Nam-Kwang
Abstract
There is provided a method of cutting or drilling workpiece including stone such as marble and granite, brick, concrete and asphalt, using a frame gang saw. There are provided a workpiece cut by a frame gang saw that includes one or a plurality of blades having multiple cutting tips or that includes a blade without including a cutting tip; a method of cutting the workpiece by using a frame gang saw; and a product provided by the cutting method. The workpiece is provided to include one or more grooves into which at least a portion of at least one cutting tip among the multiple cutting tips or at least a portion of the blade without a cutting tip is inserted and which is formed in a surface thereof. Here, an initial cutting time on a workpiece may be shortened to greatly improve productivity and the quality of a product and a lifespan of a frame gang saw blade may be improved by significantly decreasing deflection in the blade.
B28D 1/06 - Working stone or stone-like materials, e.g. brick, concrete, not provided for elsewhereMachines, devices, tools therefor by sawing with reciprocating saw blades
B32B 3/30 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layerLayered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a layer with cavities or internal voids characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
Wire saws for metalworking; wire saws for semiconductor
processing; wire saws for plastic working; wire saws for
stone working; wire saws for woodworking.
Wire saws for metalworking; wire saws for semiconductor processing; wire saws for plastic working; wire saws for stone working; wire saws for woodworking
34.
WORKPIECE FOR FRAME GANG SAW, METHOD FOR CUTTING THE WORKPIECE, AND PRODUCT CUT BY THE METHOD
EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
Park, Hee-Dong
Kim, Nam-Kwang
Abstract
The present invention relates to a method for cutting or drilling a brittle workpiece including stones such as marble and granite, brick, concrete and asphalt, using a frame gang saw, and has as its objective a reduction in the initial cutting time of the workpiece, so that productivity may be markedly enhanced, and also to minimize deformation of the blade so that product quality and the lifetime of the frame gang saw blade may be enhanced. The key points of the invention are a workpiece for a frame gang saw wherein the workpiece is cut by a frame gang saw comprising one or more blades furnished with a plurality of cutting tips or a blade not furnished with a cutting tip, and on the workpiece are formed one or multiple grooves into at least a part of at least one cutting tip out of the cutting tips or at least a part of the blade not furnished with a cutting tip is inserted; a method for cutting the workpiece by using a frame gang saw; and a product that has been cut by the cutting method. According to the invention, not only can productivity be markedly enhanced but also the deformation of the blade can be minimized so that product quality and the lifetime of the frame gang saw are enhanced by providing a workpiece with grooves formed thereon.
B28D 1/06 - Working stone or stone-like materials, e.g. brick, concrete, not provided for elsewhereMachines, devices, tools therefor by sawing with reciprocating saw blades
B28D 1/12 - Saw blades specially adapted for working stone
EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
Kim, Soo-Kwang
Choi, Jin-Sun
Abstract
There are provided a tool, a grinding cup tool, a core bit and a propeller used in the grinding cup tool, all of which are used to cut, drill, planarize and grind a brittle workpiece such as stone, brick, concrete, asphalt and the like, and by themselves are able to collect dusts which are generated during the processes. The tool, the grinding cup tool, the core bit and the propeller used in the grinding cup tool, all of which include a core having tips fixed therein, each tip having abrasive particles distributed thereon; and a driving machine for driving the core, include a propeller having at least two wings, the wings being positioned above the tips and rotating with the core to guide dusts, which are generated during the processes, upwards. The tools may be useful to significantly reduce the generation of scattering dusts (particles) without the use of a separate dust-collecting apparatus since they by themselves are able to collect dusts which are generated during the dry process, and to easily collect generated dusts in one collection place and discard the collected dusts, and to improve the machinability of products by removing fine dusts generated during a cutting process.
EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
Hong, Jae-Hyun
Choi, Jong-Suk
Kim, In-Woo
Abstract
There is provided a drill bit capable of performing a continuous drilling operation on a high-strength workpiece such as a tempered tile and the like. The drill bit comprises a bit body having a receptor portion formed therein, the receptor portion being filled with a cutting oil; a drilling portion extended from one end of the bit body and having a channel formed therethrough and an opening formed in one end thereof, the channel being coupled with a receptor portion of the bit body; a cutting portion provided in the opening of the drilling portion to drill a workpiece; and a channel opening and closing portion disposed inside the receptor portion to open and close the channel, thereby feeding a cutting oil. The drill bit thus configured may be useful to enable a continuous drilling operation on the high-strength workpiece, to enable the refilling of a cutting oil used to cool the high-strength workpiece, to shorten a time for the drilling operation on the high-strength workpiece, and to drill the high-strength workpiece to the maximum extent using the minimum number of drill bits.
EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
Hong, Jae-Hyun
Choi, Jong-Suk
Hong, Do-Ui
Abstract
There is provided a drill bit capable of performing a continuous drilling operation on a high-strength workpiece such as a tempered tile and the like. The drill bit comprises a bit body having a receptor portion formed therein, the receptor portion being filled with a cutting oil; a drilling portion extended from one end of the bit body and coupled to the receptor portion of the bit body to form a channel in which a capillary phenomenon occurs, and having an opening formed in one end thereof; and a cutting portion provided in the opening of the drilling portion to drill a workpiece. The drill bit thus configured may be useful to enable a continuous drilling operation on the high-strength workpiece, to enable the refilling of a cutting oil used to cool the high-strength workpiece, to shorten a time for the drilling operation on the high-strength workpiece, and to drill the high-strength workpiece to the maximum extent using the minimum number of drill bits.
Ehwa Diamond Industrial Co., Ltd. (Republic of Korea)
General Tool, Inc. (USA)
Inventor
Kim, Soo-Kwang
Park, Hee-Dong
Kim, Nam-Kwang
Abstract
A cutting tip for a cutting tool used to cut or drill a brittle workpiece such as stone, brick, concrete, or asphalt and a frame saw provided with the cutting tip are disclosed. The swing type cutting tip including abrasive particles has a specific arrangement capable of enhancing the cutting efficiency of the abrasive particles, and thus achieving an enhancement in cutting performance and an increase in lifespan. The cutting tip includes a plurality of abrasive particles to cut a workpiece while swing. At least a part of the abrasive particles are arranged in the form of abrasive particle groups. Each abrasive particle group is constituted by at least two abrasive particles. At least a part of the abrasive particles of the abrasive particle groups are overlapped in a cutting direction.
EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
Lee, Jae-Hee
Son, Seung-Kook
Abstract
The present invention relates to a glass composition for a polishing wheel for polishing semiconductor wafers and the like, to a polishing wheel using same, and a manufacturing method for same. An aim of the present invention is to provide a glass composition for producing a polishing wheel with an improved polishing capability, a long lifespan, and improved performance in that said composition generates no scratches even in a super-finishing process adopting a foam glass manufacturing method, a polishing wheel using the glass composition, and a manufacturing method for same. The glass composition for the polishing wheel of the present invention contains: SiO2: 55∼70%, B2O3: 10∼25%, Al2O3: 5∼15%, Na2O: 1∼5%, Li2O: 0.5∼2.5%, CaO: 1∼5%, MgO: 0~3%, and TiO2:0~5% by wt %. The polishing wheel manufactured from the glass composition of the present invention is provided with an improved polishing capability, a long lifespan, and improved performance in that said composition generates no scratches even in a super-finishing process adopting a foam glass manufacturing method.
EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
An, Jung-Soo
Abstract
A CMP pad conditioner is used in global planar izat ion of wafers for high integration of semiconductor devices. The CMP pad conditioner includes a frame fixing abrasive particles to prevent the abrasive particles from being detached from the conditioner, the abrasive particles protruding from the fixing frame at a predetermined height, and a molding material fixing the fixing frame and the abrasive materials to each other. The abrasive particles are placed inside the through-holes, by one abrasive particle in one through-hole, and each of the abrasive particles is partially exposed from the underside surface of the fixing frame. The conditioner can ensure stability of prevent abrasive particles from being detached, realize uniform dressing, excellent dressing efficiency and excellent performance reproducibility, and remarkably remove the probability of scratches.
Metalworking machines; cutting machines for metalworking;
diamond-pointed metal-cutting tools; stone-working machines;
electric-powered industrial diamond tools for metalworking
and stone-working; electric-powered industrial diamond saws
for metalworking and stone-working; electric-powered
industrial diamond saw blades for metalworking and
stone-working; electric-powered industrial diamond cutters
for metalworking and stone-working; electric-powered
industrial diamond grinding plates for metalworking and
stone-working; electric-powered industrial diamond wheels
for metalworking and stone-working; electric-powered
industrial cubic boron nitride tools for metalworking and
stone-working; electric-powered industrial cubic boron
nitride saws for metalworking and stone-working;
electric-powered industrial cubic boron nitride saw blades
for metalworking and stone-working, electric-powered
industrial cubic boron nitride cutters for metalworking and
stone-working; electric-powered industrial cubic boron
nitride grinding plates for metalworking and stone-working;
electric-powered industrial cubic boron nitride wheels for
metalworking and stone-working; electric-powered industrial
diamond tools for grinding and cutting concrete structures;
aggregate crushers; ore treating machines; woodworking
machines; circular saws; saw blades as parts of machines.
42.
ABRASIVE MATERIAL SUPPLYING APPARATUS FOR MANUFACTURING SEGMENTS OF CUTTING/POLISHING TOOL AND MANUFACTURING METHOD OF SEGMENTS USING THE SAME
EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
Kim, Soo Kwang
Hong, Jae Hyun
Ahn, Jang Hyuk
Seo, Jung Yun
Abstract
There is provided an abrasive material supplying apparatus for manufacturing segments of a cutting/polishing tool for stably supplying an abrasive material in a predetermined pattern to enhance a cutting efficiency of the segments of a cutting/polishing tool, maintain constant performances and reduce poor products, and a manufacturing method of segments of a cutting/polishing tool using the same. The abrasive material supplying apparatus includes a body communicating with an air intake apparatus and having a chamber formed thereinside, the chamber having a predetermined size; and an intake plate installed in the body and having a plurality of abrasive material intake ports formed in one surface thereof and guide grooves formed in the other surface thereof, the abrasive material intake ports communicating with the chamber and having a predetermined pattern so that an abrasive material is inhaled by a suction force of the air intake apparatus, and the guide grooves communicating with the respective abrasive material intake ports to guide the intake of the abrasive material. Therefore, the abrasive material supplying apparatus may be useful to improve the cutting performances, cutting efficiency and life span of the cutting/polishing tool by minimizing the difference in the performances between the segments.
B24D 3/00 - Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special natureAbrasive bodies or sheets characterised by their constituents
43.
WIRE SAW CONNECTOR AND DIAMOND WIRE SAW CONNECTED BY THE CONNECTOR
EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
Sung, Kyung Yong
Abstract
There is provided a wire saw connector that is used to cut stones or concrete structures and able to improve the bonding force between a wire rope and a connection shank, and simultaneously facilitate the connection of the wire rope, and a wire saw having both ends coupled through the wire saw connector. The wire saw connector comprises one connection shank including a first wire rope fixing part having an inner portion processed in the form of a screw to fix one end of a wire rope, and a first shank coupling part including a connection part having a first connector pin through hole formed therein; the other connection shank including a second wire rope fixing part having an inner portion processed in the form of a screw to fix the other end of the wire rope, and a second shank coupling part having a second connector pin through hole formed in a position corresponding to the first connector pin through hole; and a connector pin inserted into the second connector pin through hole and the first connector pin through hole to couple the two connection shanks to each other, and the wire saw has both ends coupled through the wire saw connector.
B28D 1/08 - Working stone or stone-like materials, e.g. brick, concrete, not provided for elsewhereMachines, devices, tools therefor by sawing with saw blades of endless cutter-type, e.g. chain saws, strap saws
Ehwa Diamond Industrial Co., Ltd. (Republic of Korea)
General Tool, Inc. (USA)
Inventor
Kim, Soo-Kwang
Park, Hee-Dong
Chang, Joon-Ho
Kim, Jong-Ho
Abstract
The invention provides a cutting segment for a cutting tool for cutting or drilling a brittle work piece such as stone, bricks, concrete and asphalt, and a cutting tool having the cutting segment. The cutting segment includes a cutting surface for cutting a work piece and a plurality of abrasive particle layers. The abrasive particle layers are disposed perpendicular to a cutting direction. Each of the abrasive layers has a plurality of abrasive particle rows in a width direction of the cutting segment. Each of the abrasive rows has a plurality of abrasive particles arranged in a line. Further, the abrasive layers have a plurality of blank sections therebetween. In the blanks sections, abrasive particles are absent or have a concentration of 70% or less with respect to those in the abrasive rows. In addition, the blank sections include relatively thick blank sections and relatively thin blank sections.
Ehwa Diamond Industrial Co., Ltd. (Republic of Korea)
General Tool, Inc. (USA)
Inventor
Kim, Soo-Kwang
Park, Hee-Dong
Kim, Jong-Ho
Chang, Joon-Ho
Abstract
The invention relates to a cutting segment of a diamond tool for cutting or drilling a brittle workpiece such as stone, bricks, concrete and asphalt, and a diamond tool having the same. The invention allows superior cutting rate and lengthy useful life without suffering from R wear during cutting. In the cutting segment, a number of diamond particles are arranged in a plurality of plate-shaped layers stacked perpendicular to a cutting direction. Each of the diamond particle layers has a plurality of particle rows on a cutting surface. Further, at least two of the diamond particle layers are superimposed on at least one side of the cutting segment seen from the front of the cutting segment in cutting direction. The invention ensures uniform cutting by significantly reducing R wear that arises during cutting and thus enables superior cutting rate and longer useful life.
EHWA Diamond Industrial Co., Ltd. (Republic of Korea)
General Tool, Inc. (USA)
Inventor
Kim, Soo-Kwang
Park, Hee-Dong
Abstract
A cutting segment for a cutting tool used for cutting or drilling brittle workpieces, such as stone, brick, concrete and asphalt, a method for manufacturing the segment, and a cutting tool comprising the segment are disclosed. The segment comprises layers of diamond particles and two kinds of plate-shaped metal matrix layers comprising soft and hard metal matrix layers having different ductility. The plate-shaped metal matrix layers are arranged perpendicular to a cutting surface while being parallel to a cutting direction, and are alternately stacked perpendicular to the cutting direction. The layers of diamond particles are suitably arranged in the plate-shaped soft and hard metal matrix layers. The segment and the cutting tool comprising the same have excellent cutting ability, and the manufacturing process thereof can be simplified, thereby remarkably enhancing productivity.
EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
Choi, Jong Suk
Hong, Jae Hyun
Kim, In Woo
Abstract
There are provided a cutting tool for cutting or drilling a brittle work piece such as stone, bricks, concrete and asphalt, and a method for manufacturing the cutting tool. Segments are prevented from abrupt abrasion at edges thereof during cutting of the work piece, thereby ensuring a longer useful life and higher cutting capacity of the cutting tool. The cutting tool including: a shank; and segments welded at predetermined intervals on an outer periphery of the shank, each of the segments having abrasives attached thereto by brazing, wherein the each segment is welded after the abrasives are brazed thereto; wherein the segment has both lateral edges in a cutting direction subjected to machining such as rounding and chamfering, and the machining is performed within 1/2 or less of a thickness of the segment.
EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
GENERAL TOOL, INC. (USA)
Inventor
Kim, Soo-Kwang
Park, Hee-Dong
Kim, Nam-Kwang
Abstract
A cutting tip for a cutting tool used to cut or drill a brittle workpiece such as stone, brick, concrete, or asphalt and a frame saw provided with the cutting tip are disclosed. The swing type cutting tip including abrasive particles has a specific arrangement capable of enhancing the cutting efficiency of the abrasive particles, and thus achieving an enhancement in cutting performance and an increase in lifespan. The cutting tip includes a plurality of abrasive particles to cut a workpiece while swing. At least a part of the abrasive particles are arranged in the form of abrasive particle groups. Each abrasive particle group is constituted by at least two abrasive particles. At least a part of the abrasive particles of the abrasive particle groups are overlapped in a cutting direction.
B28D 1/06 - Working stone or stone-like materials, e.g. brick, concrete, not provided for elsewhereMachines, devices, tools therefor by sawing with reciprocating saw blades
51.
CUTTING TIP, METHOD FOR MAKING THE CUTTING TIP AND CUTTING TOOL
EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
Inventor
Kim, Tae-Woong
Yun, Joong-Cheul
Song, Young-Choul
Kim, Sang-Beom
Park, Jung-Nam
Yoo, Suk-Hyun
Kim, Tae-Bong
Abstract
The present invention relates to a cutting tip for a cutting tool, which is used in cutting or drilling a brittle workpiece such as stone, bricks, concrete, and asphalt and has an excellent cutting speed and a long lifetime, a method of manufacturing the cutting tip, and a cutting tool including the cutting tip. The cutting tip includes an abrasive material and a sintered bonding material, wherein the bonding material is formed of a metal matrix; the metal matrix includes a phase II and/or pore having a certain size at a certain volume fraction; and the phase II is one of a non-metallic inclusion and ceramic. According to an aspect of the present invention, there is provided a cutting tip having excellent cutting speed and a long lifetime at a much lower price.
EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
GENERAL TOOL, INC. (USA)
Inventor
Kim, Soo-Kwang
Park, Hee-Dong
Kim, Jong-Ho
Chang, Joon-Ho
Abstract
The invention relates to a cutting segment of a diamond tool for cutting or drilling a brittle workpiece such as stone, bricks, concrete and asphalt, and a diamond tool having the same. The invention allows superior cutting rate and lengthy useful life without suffering from R wear during cutting. In the cutting segment, a number of diamond particles are arranged in a plurality of plate-shaped layers stacked perpendicular to a cutting direction. Each of the diamond particle layers has a plurality of particle rows on a cutting surface. Further, at least two of the diamond particle layers are superimposed on at least one side of the cutting segment seen from the front of the cutting segment in cutting direction. The invention ensures uniform cutting by significantly reducing R wear that arises during cutting and thus enables superior cutting rate and longer useful life.
EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
GENERAL TOOL, INC. (USA)
Inventor
Kim, Soo-Kwang
Park, Hee-Dong
Chang, Joon-Ho
Kim, Jong-Ho
Abstract
The invention provides a cutting segment for a cutting tool for cutting or drilling a brittle work piece such as stone, bricks, concrete and asphalt, and a cutting tool having the cutting segment. The cutting segment includes a cutting surface for cutting a work piece and a plurality of abrasive particle layers. The abrasive particle layers are disposed perpendicular to a cutting direction. Each of the abrasive layers has a plurality of abrasive particle rows in a width direction of the cutting segment. Each of the abrasive rows has a plurality of abrasive particles arranged in a line. Further, the abrasive layers have a plurality of blank sections therebetween. In the blanks sections, abrasive particles are absent or have a concentration of 70% or less with respect to those in the abrasive rows. In addition, the blank sections include relatively thick blank sections and relatively thin blank sections.
EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
GENERAL TOOL, INC. (USA)
Inventor
Kim, Soo-Kwang
Park, Hee-Dong
Abstract
A cutting segment for a cutting tool used for cutting or drilling brittle workpieces, such as stone, brick, concrete and asphalt, a method for manufacturing the segment, and a cutting tool comprising the segment are disclosed. The segment comprises layers of diamond particles and two kinds of plate-shaped metal matrix layers comprising soft and hard metal matrix layers having different ductility. The plate-shaped metal matrix layers are arranged perpendicular to a cutting surface while being parallel to a cutting direction, and are alternately stacked perpendicular to the cutting direction. The layers of diamond particles are suitably arranged in the plate-shaped soft and hard metal matrix layers. The segment and the cutting tool comprising the same have excellent cutting ability, and the manufacturing process thereof can be simplified, thereby remarkably enhancing productivity.
EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
GENERAL TOOL, INC. (USA)
Inventor
Kim, Soo-Kwang
Kim, Jong-Ho
Park, Hee-Dong
Abstract
The invention provides a segment type diamond tool capable of improving cutting rate and reducing the amount of fine debris generated during cutting by properly arranging diamond particles in a cutting segment of the diamond tool. In the invention, the layers of diamond particles are arranged such that cutting grooves formed on a workpiece by trailing layers of diamond particles are arranged between cutting grooves formed thereon by leading layers of diamond particles, respectively, in cutting of the work piece. The cutting segment has high-concentration and low-concentration areas. The high- concentration area shows a concentration higher than an average concentration and the low concentration area shows a concentration lower than the average concentration. Also, at least one low concentration area is formed on the leading and/or trailing section of the cutting segment. The diamond tool of the invention ensures superior cutting rate and reduced amount of fine debris generated during cutting.
EHWA DIAMOND INDUSTRIAL CO., LTD. (Republic of Korea)
GENERAL TOOL, INC. (USA)
Inventor
Kim, Soo-Kwang
Chang, Joon-Ho
Park, Hee-Dong
Kim, Jong-Ho
Abstract
The invention provides a cutting segment of a cutting tool for cutting or drilling a brittle work piece such as stone, bricks, concrete and asphalt, and a cutting tool. The cutting segment includes a cutting surface for cutting a work piece and a number of abrasive particles arranged in a plurality of rows. Each of the abrasive rows includes high-concentration parts and low concentration parts. The high-concentration parts are grouped together to form a high-concentration area on the cutting surface and the low-concentration parts are grouped together to form a low-concentration area on the cutting surface. The invention provides the cutting segment and the cutting tool capable of improving cutting rate and useful life.
EHWA DIAMOND INDUSTRIAL CO., LTD (Republic of Korea)
GENERAL TOOL, INC. (USA)
Inventor
Kim, Soo-Kwang
Park, Hee-Dong
Abstract
A cutting segment for a cutting tool used for cutting or drilling a brittle workpiece, such as stone, brick, concrete and asphalt, a method of manufacturing the segment and a cutting tool provided with the segment are disclosed. The segment comprises a plurality of plate-shaped metal matrix layers laminated perpendicular to a cutting surface of the segment while being parallel to a cutting direction of the segment, the plate-shaped metal matrix layers being integrally combined with each other and made of a ferrous or non- ferrous material; and diamond particle layers arranged between the plate- shaped metal matrix layers such that diamond particles can be provided in an array on the cutting surface. The segment has an excellent cutting capability, and can be made by a simplified manufacturing process, thereby remarkably reducing manufacturing costs.
B23D 61/18 - Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
B23D 61/00 - Tools for sawing machines or sawing devicesClamping devices for these tools
B24D 5/06 - Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their peripheryBushings or mountings therefor with inserted abrasive blocks, e.g. segmental
B28D 1/12 - Saw blades specially adapted for working stone