The invention relates to a composition and a process for the deposition of conductive polymers on dielectric substrates. In particular, the invention relates to a composition for the formation of electrically conductive polymers on the surface of a dielectric substrate, the composition comprising at least one polymerizable monomer which is capable to form a conductive polymer, an emulsifier and an acid, characterized in that the composition comprises at least one metal-ion selected from the group consisting of lithium-ions, sodium-ions, aluminum-ions, beryllium-ions, bismuth-ions, boron-ions, indium-ions and alkyl imidazolium-ions. The acid is typically a high molecular weight polymeric acid having molecular weight of at least 500,000 Da including, for example, polystyrene sulfonic acid having a molecular weight of approximately 1,000,000 Da.
C09D 5/44 - Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects producedFilling pastes for electrophoretic applications
C25D 5/56 - Electroplating of non-metallic surfaces of plastics
In electrolytic copper plating, an aqueous composition comprising a source of copper ions and at least one alkylene or polyalkylene glycol monoether which is soluble in the aqueous phase and has molecular weight not greater than about 500 for improving the efficacy of other additives such as, for example, levelers and suppressors; and a related plating method.
An aqueous electrolyte for the deposition of a metal layer on a substrate surface as well as a method for the deposition of a metal layer on a substrate surface by which electrolyte and in which method the formation of airborne emissions above the surface of the electrolyte in a plating tank is significantly reduced or more preferably omitted. The aqueous electrolyte composition according to the invention comprises at least one surfactant in a concentration affecting a dynamic surface tension of the composition of ≤ 35 mN/m.
Compositions and methods for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. Conditioning compositions contain a functional organic compound and preferably a transition metal ion. The functional organic compound, e.g., a purine derivative, is capable of forming a self-assembled monolayer. Adhesion promoting compositions contain an acid, preferably an inorganic acid, and an oxidant. The latter compositions may also contain a corrosion inhibitor and/or a transition metal ion selected from among Zn, Ni, Co, Cu, Ag, Au, Pd or another Pt group metal. The corrosion inhibitor may comprise a nitrogen-containing aromatic heterocyclic compound.
The invention relates to an aqueous stripping composition for the removal of polymeric surface sealants on metal surfaces, said stripping composition comprising an alkalizing agent, a polymer splitting agent, a swelling agent, and a cloud point booster, wherein said polymer splitting agent is at least one gluconate wherein said swelling agent is at least one compound selected from the group consisting of glycol ethers and aliphatic alcohols having 3 to 9 carbon atoms. The inventive aqueous stripping composition is capable to remove polymeric sealants like e.g. polyurethane sealants, polyethylene sealants, polyethylene waxes, polyacrylic sealants, polysilicate sealants, and the like.
Electrolytic plating compositions and electrolytic plating processes for the co-deposition of silver or silver alloy with fluoropolymer nanoparticles are provided. The silver or silver alloy composite coating containing fluoropolymer nanoparticles has enhanced functional properties such as a reduced coefficient of friction. The electrolytic plating composition comprises: (a) a silver ion source comprising silver methane sulfonate (Ag-MSA); (b) a complexing agent comprising a compound comprising a nitrogen-containing heterocyclic ring; (c) a pre-mix dispersion comprising fluoropolymer nanoparticles particles having a mean particle size of from about 10 nm and about 500 nm and a surfactant; and (d) an auxiliary surfactant comprising a cationic fluorosurfactant, wherein the composition has a pH of from about 8 to about 14.
The present invention relates to a pre-etching composition for the treatment of non-conductive substrates in a plating process for the deposition of a metal layer on the substrate surface. More specifically, the invention relates to an aqueous pre-etching composition for a plastic substrate, like e.g. an acrylonitrile butadiene styrene (ABS), a polycarbonate (PC), polyetherimide (PEI), or a blend of an acrylonitrile butadiene styrene (ABS) and a polycarbonate (PC). An aqueous pre-etching composition for the treatment of non-conductive substrates in a plating process for the deposition of a metal layer on a substrate surface is provided, wherein the pre-etching composition contains at least one water soluble solvent and which is characterized in that the composition contains at least one compound selected from the group consisting of terpenes and phenylpropanoides.
The invention disclosed relates to an aqueous activator solution and a method for the electroless deposition of copper on a laser direct structured substrate surface. By the invention, an aqueous activator solution comprising a strong reducing agent is proposed to enhance the catalytic activity of the irradiated surface area of a LDS substrate.
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
C23C 18/20 - Pretreatment of the material to be coated of organic surfaces, e.g. resins
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
The invention as described in the following relates to an apparatus for the electrochemical deposition of a metal on a substrate, which apparatus is capable of refreshing an electrolyte used for the deposition in a continuous way. Furthermore, the invention as described relates to a method of refreshing an electrolyte for the electrochemical deposition of a metal on a substrate.
The present invention generally relates to an aqueous solution for the formation of a passivation layer on a zinc layer or zinc-alloy layer. More particularly, the invention relates to the formation of a black passivation layer on a zinc layer or zinc-alloy layer, which passivation layer is substantially free of hexavalent chromium. Furthermore, the present invention relates to method for the formation of a passivation layer on a zinc layer or zinc-alloy layer, as well as a passivation layer on a zinc layer or zinc-alloy layer itself. The solution used contains trivalent chromium ions, nitrate ions, an organic acid and a dithioglycolate.
C23C 22/53 - Treatment of zinc or alloys based thereon
C23C 22/34 - Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH < 6 containing fluorides or complex fluorides
C25D 5/48 - After-treatment of electroplated surfaces
A process for metalizing a through silicon via feature in a semiconductor integrated circuit device, the process including, during the filling cycle, reversing the polarity of circuit for an interval to generate an anodic potential at said metalizing substrate and desorb leveler from the copper surface within the via, followed by resuming copper deposition by re-establishing the surface of the copper within the via as the cathode in the circuit, thereby yielding a copper filled via feature.
The invention relates to a composition and a process for the deposition of conductive polymers on dielectric substrates. In particular, the invention relates to a composition for the formation of electrically conductive polymers on the surface of a dielectric substrate, the composition comprising at least one polymerizable monomer which is capable to form a conductive polymer, an emulsifier and an acid, characterized in that the composition comprises at least one metal-ion selected from the group consisting of lithium-ions, sodium-ions, aluminum-ions, beryllium-ions, bismuth-ions, boron-ions, indium-ions and alkyl imidazolium-ions.
C08G 61/12 - Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
C25D 5/56 - Electroplating of non-metallic surfaces of plastics
H01B 1/12 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of other non-metallic substances organic substances
A method for metallizing a through silicon via feature in a semiconductor integrated circuit device substrate. The method comprises immersing the semiconductor integrated circuit device substrate into an electrolytic copper deposition composition, wherein the through silicon via feature has an entry dimension between 1 micrometers and 100 micrometers, a depth dimension between 20 micrometers and 750 micrometers, and an aspect ratio greater than about 2:1; and supplying electrical current to the electrolytic deposition composition to deposit copper metal onto the bottom and sidewall for bottom-up filling to thereby yield a copper filled via feature. The deposition composition comprises (a) a source of copper ions; (b) an acid selected from among an inorganic acid, organic sulfonic acid, and mixtures thereof; (c) an organic disulfide compound; (d) a compound selected from the group consisting of a reaction product of benzyl chloride and hydroxyethyl polyethyleneimine, a quaternized dipyridyl compound, and a combination thereof; and (d) chloride ions.
A method and composition is provided for depositing a passivating coating on a surface of a zinc-based layer. The method comprises exposing the surface of the zinc-based layer to a composition suitable for depositing a passivating coating on the surface of the zinc-based layer. The composition comprises a source of Cr3+ ions; a source of NO3- ions; and a source of fluoride ions. The initial concentrations of the source of Cr3+ ions and the source of NO3- ions are such that an initial molar ratio of NO3- ions to Cr3+ ions is at least about 10:1. Exposure of the surface of the zinc-based layer to the composition deposits the passivating coating having a thickness of at least about 20 nm and a resistivity of less than about 100 mΩ per square.
C23C 22/47 - Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH < 6 containing oxalates containing also phosphates
15.
CORROSION-PROTECTIVE WAX COMPOSITION CONTAINING POLYANILINE IN A DOPED FORM AND A LIQUID PARAFFIN
The present invention relates to a corrosion-protective composition containing a wax, an unsubstituted or substituted polyaniline in a doped form and a liquid paraffin, and articles comprising the composition applied on a substrate. It also relates to a process for manufacturing the composition, wherein i) a first dispersion of a polyaniline in a doped form is prepared; and ii) the first dispersion of the polyaniline is combined with a wax component to sufficiently disperse the polyaniline therein, and to the use of the composition as a single layer coating for the protection against corrosion of a substrate in need thereof.
The present invention relates to a method for direct metallization of non-conductive substrates as well as a conductor solution used in such a method. According to the invention, it is proposed to contact a non-conductive substrate surface after activation by a noble metal colloid-containing activator solution with a conductor solution, which comprises a metal that is reducible by a metal of the activator solution, a complexing agent and a reducing agent.
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
A method is provided for depositing a whisker resistant tin-based coating layer on a surface of a copper substrate. The method is useful for preparing an article comprising a copper substrate having a surface; and a tin-based coating layer on the surface of the substrate, wherein the tin-based coating layer has a thickness between 0.5 micrometers and 1.5 micrometers and has a resistance to formation of copper-tin intermetallics, wherein said resistance to formation of copper-tin intermetallics is characterized in that, upon exposure of the article to at least seven heating and cooling cycles in which each cycle comprises subjecting the article to a temperature of at least 217°C followed by cooling to a temperature between about 20°C and about 28°C, there remains a region of the tin coating layer that is free of copper that is at least 0.25 micrometers thick.
The present invention relates to an electrolyte for the electroless deposition of a metal layer on a substrate, wherein the electrolyte is free of heavy metal stabilizers, cyanides, selenium compounds and sulfur compounds comprising sulfur in an oxidation state between -2 and +5, and in which instead a ß-amino acid is used as stabilizer. In particular, the inventive electrolyte can comprise 3-aminopropionic acid, 3-aminobutyric acid, 3-amino-4-methylvaleric acid, and 2-aminoethane-sulfonic acid. Furthermore, the invention is directed to a method for the electroless deposition of metal layers utilizing an inventive electrolyte as well as the use of ß-amino acids as stabilizer in electrolytes for the electroless deposition of metal layers in general.
C23C 18/50 - Coating with alloys with alloys based on iron, cobalt or nickel
C23C 18/36 - Coating with one of iron, cobalt or nickelCoating with mixtures of phosphorus or boron with one of these metals using reducing agents using hypophosphites
19.
ELECTRODEPOSITION OF COPPER IN MICROELECTRONICS WITH DIPYRIDYL-BASED LEVELERS
A method for metallizing a via feature in a semiconductor integrated circuit device substrate, wherein the semiconductor integrated circuit device substrate comprises a front surface, a back surface, and the via feature and wherein the via feature comprises an opening in the front surface of the substrate, a sidewall extending from the front surface of the substrate inward, and a bottom. The method comprises contacting the semiconductor integrated circuit device substrate with an electrolytic copper deposition chemistry comprising (a) a source of copper ions and (b) a leveler compound, wherein the leveler compound is a reaction product of a dipyridyl compound and an alkylating agent; and supplying electrical current to the electrolytic deposition chemistry to deposit copper metal onto the bottom and sidewall of the via feature, thereby yielding a copper filled via feature.
This invention relates to a method for the post-treatment of metal layers, especially for the post-treatment of metal layers deposited on the surface of a substrate. With the invention a method for the post-treatment of a metal surface is proposed, wherein the metal surface is brought into contact with a corrosion resistance increasing solution, characterised in that during the contacting of the metal surface with the corrosion resistance increasing solution a current is applied between the surface and a counter electrode, whereby the surface is anodic contacted and the counter electrode is cathodic contacted.
C25D 9/04 - Electrolytic coating other than with metals with inorganic materials
C09D 5/44 - Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects producedFilling pastes for electrophoretic applications
A process for treating the surface of a metal substrate comprising a constituent metal selected from the group consisting of Cr, Cu, Mn, Mo, Ag, Au, Pt, Pd, Rh, Pb, Sn, Ni, Zn, in some cases Fe, and alloys of these metals. An anodic potential is applied to the metal surface in an electrolytic circuit comprising the metal surface, a cathode, and an electrolytic solution that is in contact with the metal surface and in electrically conductive communication with the cathode. The electrolytic solution may contain an electrolyte comprising anions of phosphate, phosphonate, phosphite, phosphinate, nitrate, borate, silicate, molybdate, tungstate, carboxylate, oxalate and combinations thereof. The anion may comprise a polymer having a pendent moiety selected from the group consisting of phosphate, phosphonate, phosphite, phosphinate, sulfate, sulfonate, carboxylate and combinations thereof. The potential applied to the circuit is such that the substrate is anodically oxidized and reacts with the anion to form a composition that imparts an enhanced property to the metal surface. Preferably, the pH of the electrolytic solution is less than about 6.0, the potential applied is between about 0.5 and about 20 volts, and the current density is between about 0.01 and 2 amps/dm2 of the geometric surface area of metal in contact with the electrolytic solution and is controlled such that nascent cations of said constituent metal produced by anodic oxidation of said constituent metal react with said anions at the metal surface without significant formation of any oxide or hydroxide of said constituent metal.
C25D 11/26 - Anodisation of refractory metals or alloys based thereon
C25D 11/34 - Anodisation of metals or alloys not provided for in groups
C09D 5/44 - Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects producedFilling pastes for electrophoretic applications
The present invention concerns a method for galvanic deposition of a hard chrome layer on a substrate surface at high rates of deposition. According to the invention, the substrate surface being coated makes contact at reduced pressure relative to the ambient pressure with a chromium-containing electrolyte suitable for galvanic deposition and a relative motion between substrate surface and electrolyte is produced during the depositing of the chrome layer on the substrate surface.
A cyanide-free electrolyte composition for the galvanic deposition of a copper layer on substrate surfaces and a method for the deposition of such layers. The electrolyte composition comprises at least copper(II) ions, a hydantoin and/or hydantoin derivative, a di- and/or tricarboxylic acid or salts thereof, and a metalate of an element of the group consisting of molybdenum, tungsten and vanadium and/or a cerium compound.
This invention relates to an electrolyte as well as a method for the deposition of a matte metal layer on a substrate surface, where the matte metal layer is V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ru, Rh, Pd, Ag, In, Sn, Sb, Te, Re, Pt, Au, TI, Bi, or an alloy thereof, and there is a halogenide, sulphate, or sulfonate of an element of the group consisting of sodium, potassium, aluminum, magnesium, or boron to facilitate deposition of a smooth and even layer with much lower deposition metal requirements.
An adhesion promotion composition and method for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The adhesion promotion composition comprises a multi-functional compound comprising a first functional group and a second functional group, wherein the first functional group is an aromatic heterocyclic compound comprising nitrogen and the second functional group is selected from the group consisting of vinyl ether, amide, thiamide, amine, carboxylic acid, ester, alcohol, silane, alkoxy silane, and combinations thereof.
C23C 22/52 - Treatment of copper or alloys based thereon
C23C 28/00 - Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of main groups , or by combinations of methods provided for in subclasses and
C23F 1/18 - Acidic compositions for etching copper or alloys thereof
H05K 3/38 - Improvement of the adhesion between the insulating substrate and the metal
26.
PROCESS FOR THE PREPARATION OF COATINGS EXHIBITING INCREASED CONDUCTIVITY BASED ON POLYTHIOPHENE AND ITS DERIVATIVES
The present invention relates to a process for the preparation of a coating displaying increased conductivity which contains at least one conductive polymer derived from optionally substituted thiophene, optionally together with at least one further conductive polymer, in particular polyaniline, in which process firstly an aqueous or organic dispersion or solution which contains the at least one conductive polymer is applied to a substrate; thereafter the forming or formed layer is dried; and at least one polar solvent is brought into contact with the formed or forming layer during or after the drying. The invention also relates to the preparation of an article in which a coating according to the present invention is applied to the surface of a transparent substrate. Furthermore, the present invention relates to the use of a polar solvent for increasing the conductivity of a coating containing at least one conductive polymer derived from optionally substituted thiophene.
H01B 1/12 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of other non-metallic substances organic substances
C08J 7/02 - Chemical treatment or coating of shaped articles made of macromolecular substances with solvents, e.g. swelling agents
There is provided a method and composition for applying a composite coating having enhanced resistance to tin whisker formation onto a metal surface of an electrical component. The method comprises contacting the metal surface with an electrolytic plating composition comprising (a) a source of tin ions and (b) non-metallic particles, and applying an external source of electrons to the electrolytic plating composition to thereby electrolytically deposit the composite coating onto the metal surface, wherein the composite coating comprises tin metal and the non-metallic particles.
A method is provided for imparting corrosion resistance onto a surface of a substrate. The method comprises contacting the surface of the substrate with an electrolytic plating solution comprising (a) a source of deposition metal ions of a deposition metal selected from the group consisting of zinc, palladium, silver, nickel, copper, gold, platinum, rhodium, ruthenium, chrome, and alloys thereof, (b) a pre-mixed dispersion of non-metallic nano-particles, wherein the non-metallic particles have a pre-mix coating of surfactant molecules thereon; and applying an external source of electrons to the electrolytic plating solution to thereby electrolytically deposit a metal-based composite coating comprising the deposition metal and non-metallic nano-particles onto the surface.
A method is disclosed for enhancing the corrosion resistance of a surface of a copper or copper alloy substrate. The method comprises depositing a metallic surface layer comprising a precious metal on a surface of the copper or copper alloy substrate by immersion displacement plating and exposing the electronic device to an aqueous composition comprising a first organic molecule comprising at least one functional group that interacts with and protects precious metal surfaces and a second organic molecule comprising at least one functional group that interacts with and protects copper surfaces.
C04B 9/02 - Magnesium cements containing chlorides, e.g. Sorel cement
B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
B28B 19/00 - Machines or methods for applying the material to surfaces to form a permanent layer thereon
30.
SELF ASSEMBLED MOLECULES ON IMMERSION SILVER COATINGS
A method for enhancing the corrosion resistance of an article comprising a silver coating deposited on a solderable copper substrate is provided. The method comprises exposing the copper substrate having the immersion-plated silver coating thereon to an anti-corrosion composition comprising: a) a multi-functional molecule comprising at least one organic functional group that interacts with and protects copper surfaces and at least one organic functional group that interacts with and protects silver surfaces; b) an alcohol; and c) a surfactant.
B05D 7/16 - Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies using synthetic lacquers or varnishes
B05D 1/18 - Processes for applying liquids or other fluent materials performed by dipping
C09D 125/00 - Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ringCoating compositions based on derivatives of such polymers
31.
METHOD FOR GALVANOTECHNICAL COATING OF SUBSTRATE SURFACES
The present invention relates to a method for the galvanotechnical treatment of substrate surfaces with a process solution or a cleaning solution. In accordance with the invention it is provided that the dynamic surface tension of the solution is adjusted by the addition of surface active compounds, providing that an optimum wetting result is achieved for the respective substrate surface to be treated.
B05D 5/12 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
C25D 3/56 - ElectroplatingBaths therefor from solutions of alloys
B08B 3/02 - Cleaning by the force of jets or sprays
32.
GALVANIC DEPOSITION OF METAL LAYERS ON MAGNESIUM OR MAGNESIUM ALLOY SURFACES
The present invention relates to a process for the galvanic coating of magnesium or magnesium alloy surfaces. For the deposition of different metal layers on magnesium or magnesium alloy surfaces the process according to the invention proposes to contact the surfaces to be coated exclusively with process solutions and washing solutions having a pH value ≥ pH 7 until a first metal layer has been deposited on the said surfaces. It has shown that metal layers can be deposited on a plurality of magnesium or magnesium alloy surfaces with excellent adhesive strength and with a good deposition result if contacting of the surfaces to be coated with process solutions having a pH value ឬ 7 is avoided.
The invention relates to a coated article which contains (i) at least one electrically non-conducting base layer, (ii) at least one layer of copper and/or a copper alloy, and (iii) a nanoscopic layer 150 nm thick or less, which contains at least 80 wt.-%, relative to layer (iii), at least one precious metal and/or semiprecious metal other than copper, wherein the copper or copper alloy layer (ii) is arranged between layers (i) and (iii). The invention further relates to a process for the production of such a coated article.
A pickling solution for the surface pre-treatment of plastic surfaces in preparation for metallization, the solution comprising a source of Mn(VII) ions; and an inorganic acid; wherein the pickling solution is substantially free of chromium (Vl) ions, alkali ions, and alkaline- earth ions. In particular, the present invention relates to a pickling solution and to a pickling process for pickling ABS plastic surfaces or ABS polymer blend surfaces prior to a subsequent metallization of these surfaces.
A method for metallizing a through silicon via feature in a semiconductor integrated circuit device substrate comprising immersing the semiconductor integrated circuit device substrate into an electrolytic copper deposition composition comprising a source of copper ions, an organic sulfonic acid or inorganic acid, or one or more organic compounds selected from among polarizers and/or depolarizers, and chloride ions.
An electrolytic copper plating composition and method for metallizing a via feature in a semiconductor integrated circuit substrate. The composition comprises a source of copper ions and coated copper nanoparticles.
A method and composition for enhancing corrosion resistance, wear resistance, and contact resistance of a substrate comprising a copper or copper alloy surface. The composition comprises a phosphorus oxide compound selected from the group consisting of a phosphonic acid, a phosphonate salt, a phosphonate ester, a phosphoric acid, a phosphate salt, a phosphate ester, and mixtures thereof; a nitrogen-containing organic compound selected from the group consisting of primary amine, secondary amine, tertiary amine, and aromatic heterocycle comprising nitrogen; and an alcohol.
C23C 22/00 - Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
A method and composition for enhancing corrosion resistance, wear resistance, and contact resistance of a device comprising a copper or copper alloy substrate and at least one metal-based layer on a surface of the substrate. The composition comprises a phosphorus oxide compound selected from the group consisting of a phosphonic acid, a phosphonate salt, a phosphonate ester, a phosphoric acid, a phosphate salt, a phosphate ester, and mixtures thereof; an organic compound comprising a nitrogen-containing functional group; and a solvent having a surface tension less than about 50 dynes/cm as measured at 25°C.
C23F 11/00 - Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
39.
SELF-INITIATED ALKALINE METAL ION FREE ELECTROLESS DEPOSITION COMPOSITION FOR THIN CO-BASED AND NI-BASED ALLOYS
A method and composition for electrolessly depositing a layer of a metal alloy onto a surface of a metal substrate in manufacture of microelectronic devices. The composition comprises a source of metal deposition ions, a borane-based reducing agent, and a two-component stabilizer, wherein the first stabilizer component is a source of hypophosphite and the second stabilizer component is a molybdenum(VI) compound.
An organic solderability preservative (OSP) composition comprising an alkyl cyclic alcohol and an azole compound having enhanced composition stability against crystallization of the azole compound.
C23C 8/00 - Solid state diffusion of only non-metal elements into metallic material surfacesChemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
42.
COPPER DEPOSITION FOR FILLING FEATURES IN MANUFACTURE OF MICROELECTRONIC DEVICES
A method for plating copper onto a semiconductor integrated circuit device substrate by forming an initial metal deposit in the feature which has a profile comprising metal on the bottom of the feature and a segment of the sidewalls having essentially no metal thereon, electrolessly depositing copper onto the initial metal deposit to fill the feature with copper. A method for plating copper onto a semiconductor integrated circuit device substrate by forming a deposit comprising a copper wettable metal in the feature, forming a copper-based deposit on the top-field surface, and depositing copper onto the deposit comprising the copper wettable metal to fill the feature with copper.
A method of preparing an aqueous electroless deposition composition for electrolessly depositing Co or a Co alloy onto a substrate in manufacture of microelectronic devices by treating a composition comprising water or an aqueous electroless deposition composition with a deoxygenating treatment to reduce the oxygen concentration.
C23C 18/36 - Coating with one of iron, cobalt or nickelCoating with mixtures of phosphorus or boron with one of these metals using reducing agents using hypophosphites
44.
CYANIDE-FREE ELECTROLYTE COMPOSITION, AND METHOD FOR THE DEPOSITION OF SILVER OR SILVER ALLOY LAYERS ON SUBSTRATES
The invention relates to a cyanide-free electrolyte composition for depositing a silver or silver alloy layer on a substrate as well as a method for depositing such layers with the help of said cyanide-free electrolyte composition. The electrolyte composition according to the invention comprises at least one silver ion source, a sulfonic acid and/or a sulfonic acid derivative, a wetting agent, and a hydantoin. The silver or silver alloy layers deposited from such an electrolyte composition by means of the method according to the invention are dull and ductile.
The invention relates to a coated article which has (i) at least one electrically non-conducting base layer, (ii) at least one layer of copper and/or a copper alloy, and (iii) a layer which contains at least one electrically conductive polymer, wherein the copper or copper alloy layer (ii) is positioned between the base layer (i) and the layer containing the conductive polymer (iii), and which is characterized in that the layer (iii) contains at least one precious metal or at least one semiprecious metal or a mixture thereof. The invention also relates to a process for its production and also its use for the prevention of corrosion and to preserve the solderability of printed circuit boards.
A process is provided for metallizing a surface of a substrate with electrolytically plated copper metallization, the process comprising electrolytically depositing copper over the electrically conductive polymer by immersing the substrate in an electrolytic composition and applying an external source of electrons, wherein the electrolytic composition comprises a source of copper ions and has a pH between about 0.5 and about 3.5. In another aspect, a process is provided for metallizing a surface of a dielectric substrate with electrolytically plated copper metallization, the process comprising immersing the substrate into a catalyst composition comprising a precursor for forming an electrically conductive polymer on the surface of the dielectric substrate and a source of Mn (II) ions in an amount sufficient to provide an initial concentration of Mn (II) ions of at least about 0.1 g/L to form an electrically conductive polymer on the surface of the dielectric substrate, and electrolytically depositing copper over said electrically conductive polymer.
An electrolytic composition and a method of using the electrolytic composition to deposit palladium or palladium alloy layers is provided which overcomes the problems known from prior art. The electrolytic composition and method of the invention comprises a palladium source, a sulfur-based acid, and a surfactant. To deposit a palladium alloy layer, the electrolytic composition further comprises a source of alloying metal ions. Moreover, the electrolytic composition according to the invention may include additional sulfur- containing amino acids for the deposition of dark palladium layers.
The present invention relates to a method and a device for monitoring and/or controlling the result of the deposition of a metal or metal alloy layer on a substrate surface, and to methods for deposition of a metal or metal alloy layer onto a substrate surface. For example, the invention relates to a method and a device for the determination of the result of the deposition during the treatment of metallic surfaces, including aluminum or magnesium surfaces or surfaces from aluminum or magnesium alloys by means of socalled zincate baths. In one embodiment a zincate bath (5) is prepared in a suitable container (1). The free corrosion potential is determined by electrically connecting a reference electrode (2) and a base material (3) with a measuring device (4).
01 - Chemical and biological materials for industrial, scientific and agricultural use
02 - Paints, varnishes, lacquers
09 - Scientific and electric apparatus and instruments
17 - Rubber and plastic; packing and insulating materials
24 - Textiles and textile goods
Goods & Services
(1) Dispersions and solutions of electrically conductive substances, namely electrically conductive polymers; unprocessed artificial resins and unprocessed plastics, all related to electrically conductive polymers and compositions and goods containing them; electrically conductive polymers and polymer mixtures and plastics containing them; varnishes; lacquers and paints for conductive coatings and for corrosion protection; dispersions containing conductive substances used as antistatic and conductive coatings for corrosion protection for printed circuit board manufacturing and for electrochemical devices.
(2) Dispersions and solutions of electrically conductive substances, namely electrically conductive polymers; unprocessed artificial resins and unprocessed plastics, all related to electrically conductive polymers and compositions and compositions and goods containing them; electrically conductive polymers and polymer mixtures and plastics containing them; varnishes; preservatives against rust; lacquers and paints for conductive coatings and for corrosion protection; dispersions containing conductive substances used as antistatic and conductive coatings for corrosion protection for printed circuit board manufacturing and for electrochemical devices; goods made of plastics containing electrically conductive polymers, namely films, housings, electrical components, optical switches, sensors and membranes for separating gases; flexible pipes, not of metal.
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
(1) Chemicals for use in metal finishing processes, particularly, processes for electroplating or electrodeposition of metals such as nickel on a substrate.
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
(1) Chemicals for use in the electro deposition of metals.
(2) Chemical plating solutions, and addition agents therefor, for use in the electrodeposition of copper.
01 - Chemical and biological materials for industrial, scientific and agricultural use
05 - Pharmaceutical, veterinary and sanitary products
11 - Environmental control apparatus
Goods & Services
(1) Salts and other reagents, used in the forming of electrolytes in the electrodeposition of precious metals, namely, gold salts, silver salts, platinum salts, palladium salts, rhodium salts; mixtures of said precious metal salts with each other and with base metal salts; copper purifiers, nickel salts and copper salts.
01 - Chemical and biological materials for industrial, scientific and agricultural use
06 - Common metals and ores; objects made of metal
07 - Machines and machine tools
09 - Scientific and electric apparatus and instruments
11 - Environmental control apparatus
17 - Rubber and plastic; packing and insulating materials
20 - Furniture and decorative products
22 - Rope, netting, tents, awnings, sails and sacks; padding and stuffing materials
25 - Clothing; footwear; headgear
28 - Games; toys; sports equipment
Goods & Services
(1) Materials for cadmium, nickel, chromium, copper, zinc, brass, white brass, silver and tin electro-plating, namely electrolytes; salts and addition agents therefor; test set solutions; cleaning compounds for electrolytic, soak, spray or general purpose cleaning of metals;anodes for electroplating and formed of brass, white brass, cadmium, copper, nickel, silver, steel, tin, zinc and lead alloy; test sets and testing equipment for use in electroplating including brass, white brass, chromium, cadmium, copper, silver, zinc and tin plating; ventilating equipment for plating apparatus including draft hoods and ductwork; electrical apparatus for use in electroplating including rectifiers, voltage regulators, rheostats, switches and control panels;apparatus for electroplating including automatic and semi-automatic single row,double row, straight line, rotary and return type plating machines, barrel plating machines;auxiliary equipment for such apparatus including automatic loading and unloading equipment, loading stands, motorized cleaning tank units, motorized rinse units, storage and transfer units and catnode rod agitators, baskets;short lengths of sealed tubes for blanketing the bath; tanks; tank linings; chemically resistant plastic materials; namely,pipe,fittings, rods and sheets; and parts for said apparatus
