This mountable illumination means (2) is provided with: a mounting section (10) capable of being mounted on the rod-shaped portion (510) of a walking cane, etc.; a rotating section (14) connected to the mounting section (10); a main body (70), which is connected to the rotating section (14) and is capable of assuming an closed state of being folded along the rod-shaped portion (510) and an open state of protruding from the rod-shaped portion; a power source (30) built into the main body (70); and illuminating sections (80, 100), which are disposed on the main body (70) and are lit by electricity from the power source (30). The illuminating sections (80, 100) become capable of being turned on when the main body (70) assumes the closed state and are always turned off when the main body (70) assumes the open state. Because this mountable illumination means (2) becomes capable of being turned on when the main body (70) assumes the closed state and is always turned off when the main body (70) assumes the open state, the mountable illumination means can be turned on and turned off by opening or closing the main body itself without operating a small switch.
Provided are a wiring board which can simultaneously achieve the reduction of weight and cost, and an improvement of heat release, and a method for producing the wiring board. A wiring board (1) is provided with an insulation substrate (2) containing resin. The wiring board (1) has wiring patterns (6) formed on the upper surface (3) of the insulation substrate (2), and through-holes (5) which extend through the upper surface (3) of the insulation substrate (2) and the lower surface (4) opposite to the upper surface (3). The wiring patterns (6) are connected to lower wiring patterns (7) by heat-transfer elements (5A) which are provided within the through-holes (5). An insulation layer (8) disposed so as to be in contact with the lower wiring patterns (7), and a metal layer (9) formed so as to be in contact with the insulation layer (8) but not to be in contact with the lower wiring patterns (7), are disposed on the lower surface (4).
Disclosed is a wiring board having good heat dissipation capability, which can endure long time use. Also disclosed is a method for producing a wiring board, which comprises a step wherein a surface of a metal substrate (2) composed of an aluminum plate is coated with a composition (3) containing a substance having a polysiloxane structure and inorganic particles having insulating properties and heat dissipating properties (Fig. 1 (B)), and the composition (3) is cured thereon. After the curing, the method further comprises a step wherein a copper foil (4) is firmly fixed to the cured composition (3A) (Fig. 1 (C)) and a wiring layer (5) isformed by partially removing the copper foil (4) (Fig. 1 (D)).
KANTO GAKUIN UNIVERSITY SURFACE ENGINEERING RESARCH INSTITUTE (Japan)
Inventor
Ono, Kaoru
Watanabe, Mitsuhiro
Abstract
It is intended to not only easily form a resistor without the need to employ a complex production process but also ensure efficient escape of any heat of plane on one side to plane on other side. In the proposed process for producing a wiring board, first, a cladding material consisting of a three layer or more laminate of two or three or more metals containing conductive first metal (11) and second metal (12) is etched so as to form columnar portions (16) on a plate-like member composed of the first metal (11) and second metal (12). Subsequently, insulating resin layer (17) through which each of the columnar portions (16) extends is formed so that the second metal (12) is interposed between the first metal (11) and the insulating resin layer (17). Thereafter, after the formation of the insulating resin layer (17), the first metal (11) is etched so as to provide resistor (5) consisting of the second metal (12) and directly connected to the columnar portions (16).
KANTO GAKUIN UNIVERSITY SURFACE ENGINEERING RESARCH INSTITUTE (Japan)
Inventor
Ono, Kaoru
Watanabe, Mitsuhiro
Abstract
This invention provides a process for producing wiring board and a wiring board that can realize highly efficient heat radiation and the like. In the production process of a wiring board, a clad material comprising two or more layers of two or more types of metals including electrically conductive first and second metals stacked on top of each other is etched to form a columnar part (16) comprising a second metal (12) on a first metal plate part (11). Next, an insulating resin material is stacked on the plate part (11) for covering the columnar part (16) to form an insulating resin layer (17). The surface of the insulating resin layer (17) is then polished so that the front end of the columnar part (16) is exposed from the insulating resin layer (17). A metal layer (18) for a wiring layer formed of an electrically conductive metal connected to the columnar part (16) is provided on the columnar part (16) on its side remote from the plate part (11).
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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