Fluorescent rare earth glass frits are suitable for laser marking. A marking composition including fluorescent glass frits is disclosed that is capable of emitting fluorescence under irradiation of ultraviolet rays. A method of forming marks or indicia on a substrate using the fluorescent rare earth glass frits is also disclosed.
C03C 8/02 - Frit compositions, i.e. in a powdered or comminuted form
C03C 8/16 - Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill additions with vehicle or suspending agents, e.g. slip
C03C 4/12 - Compositions for glass with special properties for luminescent glassCompositions for glass with special properties for fluorescent glass
C03C 3/089 - Glass compositions containing silica with 40% to 90% silica by weight containing boron
C03C 3/091 - Glass compositions containing silica with 40% to 90% silica by weight containing boron containing aluminium
C03C 3/064 - Glass compositions containing silica with less than 40% silica by weight containing boron
C03C 1/04 - Opacifiers, e.g. fluorides or phosphatesPigments
B23K 26/352 - Working by laser beam, e.g. welding, cutting or boring for surface treatment
C03C 17/04 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating with glass by fritting glass powder
2.
Cleaning Composition for Post Chemical Mechanical Planarization And Method Of Using The Same
The present invention provides a cleaning composition for post CMP cleaning and method for post CMP cleaning microelectronic device. The cleaning composition according to the invention includes at least one chelating agent, at least one organic solvent, at least one polycarboxylic acid, at least one basic pH adjustor, at least one metal anticorrosive agent, and water. The TMAH-free cleaning composition according to the invention provides improved cleaning efficiency and electrochemical compatibility with both cobalt and copper materials.
LTCC devices are produced from dielectric compositions Include a mixture of precursor materials that, upon firing, forms a dielectric material having a zinc-lithium-titanium oxide or silicon-strontium-copper oxide host.
C04B 35/46 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on titanium oxides or titanates
C04B 35/14 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on silica
C03C 4/14 - Compositions for glass with special properties for electro-conductive glass
C03C 8/18 - Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill additions containing free metals
Fluorescent rare earth glass frits are suitable for laser marking. A marking composition including fluorescent glass frits is disclosed that is capable of emitting fluorescence under irradiation of ultraviolet rays. A method of forming marks or indicia on a substrate using the fluorescent rare earth glass frits is also disclosed.
C09D 11/037 - Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
C09D 11/50 - Sympathetic, colour-changing or similar inks
C03C 8/00 - EnamelsGlazesFusion seal compositions being frit compositions having non-frit additions
C03C 17/00 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating
C04B 41/50 - Coating or impregnating with inorganic materials
C04B 41/85 - Coating or impregnating with inorganic materials
C23C 18/06 - Coating on selected surface areas, e.g. using masks
C23C 18/12 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
B23K 26/06 - Shaping the laser beam, e.g. by masks or multi-focusing
5.
INKJET INK SYSTEM FOR HANDLING HIGH SOLID PARTICLES LOADED INKS
The application describes an ink delivery system for an inkjet printer. The system includes a first ink tank operative to supply ink to at least one inkjet printhead and a second ink tank operative to receive ink flown through at least one printhead and not used by at least one printhead. The ink for printing is drawn by low pressure from a first tank through the printhead to a second ink tank. Each of the ink tanks includes a cylindrical tubular segment and a segment with a frustoconical inner section.
LTCC devices are produced from dielectric compositions include a mixture of precursor materials that, upon firing, forms a dielectric material having a magnesium-silicon oxide host. An associated Ag system for LTCC conductors is also described.
C04B 35/20 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on silicates other than clay rich in magnesium oxide
H01B 3/10 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of inorganic substances metallic oxides
7.
Modified black spinel pigments for glass and ceramic enamel applications
Modified copper chromite spinel pigments exhibit lower coefficients of thermal expansion than unmodified structures. Three methods exist to modify the pigments: (1) the incorporation of secondary modifiers into the pigment core composition, (2) control of the pigment firing profile, including both the temperature and the soak time, and (3) control of the pigment core composition.
Glass frits and enamel compositions from the glass frits for use in automotive application. The enamel composition includes one or more glass frits with reduced amount of bismuth and/or zinc compared to reference enamel compositions available. The glass frits include one or more transition metal oxides. The glass frits exhibit improved chemical durability, reduced glass density, lower L-value, or optimized optical density for an end user depending on the applications.
A resistive composition is provided to form thick film resistors on a substrate. The resistive composition includes platinum particles and ceramic particles. The ceramic particles include alumina particles. An organic vehicle can be included to form an ink or paste for thick film process. After application to the substrate, the resistive composition is fired to form the thick film resistors, which is fully adhered to the substrate.
H01C 17/065 - Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick-film techniques, e.g. serigraphy
H01C 17/30 - Apparatus or processes specially adapted for manufacturing resistors adapted for baking
G01K 7/18 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
10.
COLORED GLASS FRITS AND RELATED METHODS FOR LASER MARKING APPLICATIONS
A marking composition for forming marks or indicia on a substrate is provided for laser marking applications. The composition includes a glass frit, a carrier, and absorber particles. The glass frit includes alkali metal oxides, glass forming oxides, and one or more transition metal oxides. The glass frit is devoid of at least one of bismuth and zinc.
A phosphor in glass (PiG) cover is provided to modulate the color emitted from an LED chip. The PiG cover includes an active layer including glass and phosphor, and a secondary layer including glass and free of phosphor. The active layer is stacked on the secondary layer to form the PiG cover. Alternately the PiG includes an active layer sandwiched between two secondary layers. Two or more active layers can be stacked to each other or disposed side-by-side. An LED chip is arranged under the PiG cover to form an LED package.
LTCC devices are produced from dielectric compositions Include a mixture of precursor materials that, upon firing, forms a dielectric material having a zinc-lithium-titanium oxide or silicon-strontium-copper oxide host.
C04B 35/46 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on titanium oxides or titanates
C04B 35/14 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on silica
C04B 35/30 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on ferrites with nickel oxide as the principal oxide with zinc oxide
A compounded polymer material that can be laser marked is provided. The compounded polymer material includes an enhancer of nitrides, carbides, silicides, or combinations thereof. Upon forming the compounded polymer material into an article and exposing it to laser radiation, the irradiated portion of the compounded polymer material absorbs the laser radiation, increases in temperature, and forms a mark in the article. A lightness value difference (AL) between the mark and the non-irradiated portion of the article has an absolute value of at least 5, and the lightness value difference between the mark and the non-irradiated portion is greater than if the polymer material did not include the enhancer.
B23K 26/18 - Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
B41M 5/28 - Thermography using thermo-chromic compounds or layers containing liquid crystals, microcapsules, bleachable dyes or heat decomposable compounds, e.g. gas liberating
22O, Ag, and at least one metal element selected from Ti, V, Zr, Mn, Cr, Co, and Sn. After firing, the conductive thick film composition exhibit improved sheet resistivity, and improved adhesion with underlying substrate.
H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables
H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
16.
Slurry composition and method of selective silica polishing
An acidic slurry composition for use in chemical-mechanical polishing including an acid pH adjuster and a cationic polishing suppressant comprising a quaternized aromatic heterocycle. The quaternized aromatic heterocycle imparts a polishing selectivity of silica over crystalline silicon of at least 100.
LTCC devices are produced from dielectric compositions include a mixture of precursor materials that, upon firing, forms a dielectric material having a zinc-magnesium-manganese-silicon oxide host.
C03C 8/14 - Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill additions
C04B 35/01 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides
C04B 35/14 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on silica
The present invention is directed to a method for manufacturing a bismuth based pigment having an improved alkaline resistance, the method comprising: i) obtaining a dried bismuth based pigment; ii) encapsulation of the bismuth based pigment using a chelating agent; iii) final processing of the encapsulated pigment; and v) drying of the pigment. In addition, the present invention is directed to a bismuth based pigment encapsulated by a layer of chelating agent.
C04B 14/00 - Use of inorganic materials as fillers, e.g. pigments, for mortars, concrete or artificial stoneTreatment of inorganic materials specially adapted to enhance their filling properties in mortars, concrete or artificial stone
C09C 1/00 - Treatment of specific inorganic materials other than fibrous fillers Preparation of carbon black
C09C 3/08 - Treatment with low-molecular-weight organic compounds
C09C 3/10 - Treatment with macromolecular organic compounds
C09C 3/12 - Treatment with organosilicon compounds
Laser marking enhancers include nitrides, carbides, silicides, or combinations thereof, and are used in marking compositions and in compounded polymer materials. Upon disposing the marking compositions on a substrate and exposing the marking composition to laser radiation, the marking composition forms a mark on the substrate, which has a negative AL dark contrast value of at least -1 compared to a mark formed by the marking composition without the enhancer. Upon exposing the compounded polymer material to laser radiation, the irradiated portion of the compounded polymer material forms a mark in compounded polymer material. A lightness value difference (AL) between the mark and the non-irradiated portion of the compounded polymer material has an absolute value of at least 5, and the lightness value difference between the mark and the non-irradiated portion is greater than if the polymer material did not include the enhancer.
B41M 5/28 - Thermography using thermo-chromic compounds or layers containing liquid crystals, microcapsules, bleachable dyes or heat decomposable compounds, e.g. gas liberating
C08K 3/01 - Use of inorganic substances as compounding ingredients characterised by their specific function
Laser marking enhancers include nitrides, carbides, silicides, or combinations thereof, and are used in marking compositions and in compounded polymer materials. Upon disposing the marking compositions on a substrate and exposing the marking composition to laser radiation, the marking composition forms a mark on the substrate, which has a negative AL dark contrast value of at least -1 compared to a mark formed by the marking composition without the enhancer. Upon exposing the compounded polymer material to laser radiation, the irradiated portion of the compounded polymer material forms a mark in compounded polymer material. A lightness value difference (AL) between the mark and the non-irradiated portion of the compounded polymer material has an absolute value of at least 5, and the lightness value difference between the mark and the non-irradiated portion is greater than if the polymer material did not include the enhancer.
B23K 26/18 - Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
B41M 5/28 - Thermography using thermo-chromic compounds or layers containing liquid crystals, microcapsules, bleachable dyes or heat decomposable compounds, e.g. gas liberating
2, and combinations thereof and combinations thereof. Upon disposing the marking composition on a substrate and exposing the marking composition to laser radiation, the marking composition absorbs the laser radiation, increases in temperature, chemically bonds with the substrate, and when formed on each of a metal, glass, ceramic, stone, and plastic substrates, the mark has a negative ΔL dark contrast value of at least −1 compared to a mark formed by the marking composition without the enhancer.
A compounded polymer material that can be laser marked is provided. The compounded polymer material includes an enhancer of nitrides, carbides, silicides, or combinations thereof. Upon forming the compounded polymer material into an article and exposing it to laser radiation, the irradiated portion of the compounded polymer material absorbs the laser radiation, increases in temperature, and forms a mark in the article. A lightness value difference (ΔL) between the mark and the non-irradiated portion of the article has an absolute value of at least 5, and the lightness value difference between the mark and the non-irradiated portion is greater than if the polymer material did not include the enhancer.
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 23/544 - Marks applied to semiconductor devices, e.g. registration marks, test patterns
B41M 5/24 - Ablative recording, e.g. by burning marksSpark recording
C08L 27/12 - Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogenCompositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
23.
POLYCARBONATE DIOL COATING COMPOSITION FOR CAUSTIC AND UV RESISTANCE
A curable glass coating composition including 5-70 wt% aliphatic polycarbonate diol, 5-60 wt% crosslinker, 1-20 wt% extender, 4-20 wt% fatty alcohol, and 2-30 wt% crystalline or amorphous powder filler material, and optionally 2-20 wt% aliphatic polyester polyol and 2-20 wt% cycloaliphatic epoxy. The coating composition can be applied to a glass substrate and cured to form a decorative cured polyurethane coating layer on the substrate that has improved caustic and UV resistance.
B32B 17/10 - Layered products essentially comprising sheet glass, or fibres of glass, slag or the like comprising glass as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
C09D 169/00 - Coating compositions based on polycarbonatesCoating compositions based on derivatives of polycarbonates
24.
Method of selectively removing tungsten over silicon oxide
Provided is a slurry composition including abrasive particles, halogen oxide, and nitroxide compound. The combination of halogen oxide and nitroxide compound has a synergistic effect to remove a substrate containing tungsten and silicon oxide. Moreover, a use of the slurry composition and a polishing method using the slurry composition are provided.
A curable glass coating composition including 5-70 wt % aliphatic polycarbonate diol, 5-60 wt % crosslinker, 1-20 wt % extender, 4-20 wt % fatty alcohol, and 2-30 wt % crystalline or amorphous powder filler material, and optionally 2-20 wt % aliphatic polyester polyol and 2-20 wt % cycloaliphatic epoxy. The coating composition can be applied to a glass substrate and cured to form a decorative cured polyurethane coating layer on the substrate that has improved caustic and UV resistance.
C03C 17/32 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating with organic material with synthetic or natural resins
C08G 18/28 - Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
26.
Low K dielectric compositions for high frequency applications
C03C 14/00 - Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
C03C 4/16 - Compositions for glass with special properties for dielectric glass
C03C 10/00 - Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
C03C 3/118 - Glass compositions containing silica with 40% to 90% silica by weight containing halogen or nitrogen containing fluorine containing boron containing aluminium
C04B 35/14 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on silica
01 - Chemical and biological materials for industrial, scientific and agricultural use
02 - Paints, varnishes, lacquers
Goods & Services
Iron oxides, in particular yellow iron oxides, red iron oxides, black iron oxides, orange iron oxides and brown iron oxides for use as pigments and in pigment dispersions; iron oxides, in particular yellow iron oxides, red iron oxides, black iron oxides, orange iron oxides, and brown iron oxides, for use as pigments and in pigment dispersions in the manufacture of cosmetics. Ultramarine dyes, in particular ultramarine blue, ultramarine pink, ultramarine violet and ultramarine red for use as pigments and in pigment dispersions; ultramarine dyes, in particular ultramarine blue, ultramarine pink, ultramarine violet and ultramarine red for use as pigments and in pigment dispersions in the manufacture of cosmetics.
A passivation glass coating composition is provided for forming a fired passivation glass layer on a semiconductor substrate having p-n junction. The passivation glass coating composition includes a glass component that is lead free, cadmium free, alkali metal oxides free, and colored transition metal oxides (i.e. metal oxides of V, Fe, Co, Ni, Cr, Cu, Mn) free. The glass component includes bismuth based glasses, and provides a firing temperature range of 500° C. to 900° C., and controlled devitrification. Once fired to a semiconductor device, the fired passivation glass layer provides exceptional device performance including no cracking of the fired passivation glass layer, excellent thermal expansion matching to silicon, good chemical resistance to acid and base, and improved device performance.
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
C03C 4/16 - Compositions for glass with special properties for dielectric glass
C03C 3/066 - Glass compositions containing silica with less than 40% silica by weight containing boron containing zinc
C03C 8/24 - Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metalGlass solders
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
C03C 3/062 - Glass compositions containing silica with less than 40% silica by weight
C03C 3/108 - Glass compositions containing silica with 40% to 90% silica by weight containing lead containing boron
C03C 3/072 - Glass compositions containing silica with less than 40% silica by weight containing lead containing boron
C03C 8/04 - Frit compositions, i.e. in a powdered or comminuted form containing zinc
C03C 8/10 - Frit compositions, i.e. in a powdered or comminuted form containing lead
C03C 8/22 - EnamelsGlazesFusion seal compositions being frit compositions having non-frit additions containing two or more distinct frits having different compositions
A conductive paste is provided for forming conductive traces on substrates. The conductive paste includes a vehicle and conductive material. The vehicle includes a resin, a plasticizer, and a solvent in which the resin is dissolved. After application to a substrate, the conductive paste is cured at ambient temperature by evaporation of the solvent from the paste, to thereby form a conductive trace on the substrate. The conductive trace does not require a curing agent, and attains low resistivity within minutes of application to the substrate.
C09D 129/14 - Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
B41M 3/00 - Printing processes to produce particular kinds of printed work, e.g. patterns
C09D 11/033 - Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
C09D 11/037 - Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
C09D 11/106 - Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
H05K 1/09 - Use of materials for the metallic pattern
H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
additives.
The invention is characterized in that the melting or softening range of the thermoplastic screen printing paste lies at temperatures below 90° C. and the paste is free of bisphenol-A is and free of other substances directly involved in the polymerization itself.
C09D 11/102 - Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
C09D 11/037 - Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
C09D 11/08 - Printing inks based on natural resins
B41M 1/34 - Printing on other surfaces than ordinary paper on glass or ceramic surfaces
C09D 167/00 - Coating compositions based on polyesters obtained by reactions forming a carboxylic ester link in the main chainCoating compositions based on derivatives of such polymers
The present invention is directed to a coated bismuth oxy halide-based pigment having a coating comprising an anti-oxidant, said antioxidant is being a phenol based, a phosphite or phosphonate based, or a thioether based stabilizer, and the coating comprising an inner coating and an outer coating, wherein the outer coating comprises the antioxidant, and wherein the inner coating comprises a first layer consisting of one or more salts, or one or more oxides, heteropolyacids, organic acids, sulphites, sulfides, sulfates, phosphates, pyrophosphates, polyphosphates, hydrates, carbonates, or a combination thereof, selected from the group of alkali-earth metals, metals, non-metals, transition metals or lanthanides. Further, the present invention is directed to a composition comprising a paint, a lacquer, an ink, a cosmetic, a resin, a plastisol or a polymer formulation, and such pigment. In addition, the present invention is directed to a method for manufacturing a coated bismuth oxy halide-based pigment, said method comprising the steps of: —providing a dispersion of a bismuth oxy halide-based pigment, —adding a dispersion of an antioxidant, —mixing and drying.
C09C 1/00 - Treatment of specific inorganic materials other than fibrous fillers Preparation of carbon black
C09D 7/62 - Additives non-macromolecular inorganic modified by treatment with other compounds
C09D 7/48 - Stabilisers against degradation by oxygen, light or heat
C08K 9/04 - Ingredients treated with organic substances
C09D 177/00 - Coating compositions based on polyamides obtained by reactions forming a carboxylic amide link in the main chainCoating compositions based on derivatives of such polymers
A method for manufacturing an azoic pigment is disclosed, according to an illustrative embodiment of the present invention. The method includes producing slurry of the azoic pigment. The slurry includes primary aromatic amine (PAA). The method further includes the derivatization of the residual PAA in the slurry, followed by encapsulation of the slurry. The slurry is acidified or basified. Finally, the slurry is further processed, thereby forming PAA migration free azoic pigment. The derivatization and encapsulation additively or synergistically reduce the PAA content thereby inhibiting migration of PAA from the pigment into a substrate onto which the pigment is loaded.
A CMP slurry composition which provides for a high Ge- or SiGe-to-dielectric material selectivity a low rate of Ge or SiGe recess formation includes an oxidant and a germanium removal rate enhancer including at least one of a methylpyridine compound and a methylpyridine derivative compound. In some examples, the slurry composition also includes an etching inhibitor. In some cases, the slurry composition may include an abrasive, a surfactant, an organic complexant, a chelating agent, an organic or inorganic acid, an organic or inorganic base, a corrosion inhibitor, or a buffer. The slurry composition may be distributed onto a surface of a polishing pad disposed on a platen that is configured to rotate. Additionally, a workpiece carrier configured to house a substrate may bring the substrate into contact with the rotating polishing pad and thereby polish the substrate utilizing the slurry composition.
H01L 29/10 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified, or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
A sintered machinable glass-ceramic is provided. The machinable glass-ceramic is formed by mixing phyllosilicate material having a sheet structure, with a glass fit and firing the mixture at relatively low temperatures to sinter the phyllosilicate, while maintaining the sheet-like morphology of the phyllosilicate and its associated cleaving properties. The sintered machinable glass-ceramic can be machined with conventional metal working tools and includes the electrical properties of the phyllosilicate. Producing the sintered machinable glass-ceramic does not require the relatively high-temperature bulk nucleation and crystallization needed to form sheet phyllosilicate phases in situ.
C03C 4/02 - Compositions for glass with special properties for coloured glass
C03C 14/00 - Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
C03C 8/02 - Frit compositions, i.e. in a powdered or comminuted form
C03C 3/064 - Glass compositions containing silica with less than 40% silica by weight containing boron
C03C 3/066 - Glass compositions containing silica with less than 40% silica by weight containing boron containing zinc
C03C 8/04 - Frit compositions, i.e. in a powdered or comminuted form containing zinc
C03C 10/00 - Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
C04B 35/18 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on silicates other than clay rich in aluminium oxide
The present invention describes a new method for creating hybrid edge seals using metal, alloy, powder coated metal and other conductive surfaces in between two substrates. The methods utilize various materials, seal designs, and geometries of hybrid seals based on polymeric powder coatings and glass powder coatings.
B23K 35/36 - Selection of non-metallic compositions, e.g. coatings, fluxesSelection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
B32B 37/12 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
B23K 35/22 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
C03C 27/04 - Joining glass to metal by means of an interlayer
B23K 35/365 - Selection of non-metallic compositions of coating materials either alone or conjoint with selection of soldering or welding materials
B23K 35/02 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
C03C 27/08 - Joining glass to glass by processes other than fusing with the aid of intervening metal
C03C 27/10 - Joining glass to glass by processes other than fusing with the aid of adhesive specially adapted for that purpose
36.
Forehearth frits, pearls and/or concentrates for fluorescence
The present invention relates to the field of forehearth frits, pearls, and/or concentrates for use in glass compositions. In particular, the present invention provides a system of forehearth frits, pearls, and/or concentrates that is capable of parting a fluorescent effect to a glass composition by adding a fluorescent glass fit, pearl or concentrate in the forehearth of a glass furnace, to form fluorescent glass and a method of using the fluorescent system of forehearth frits, pearls, and/or concentrates.
C03C 3/087 - Glass compositions containing silica with 40% to 90% silica by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal containing calcium oxide, e.g. common sheet or container glass
C03C 8/02 - Frit compositions, i.e. in a powdered or comminuted form
C09K 11/88 - Luminescent, e.g. electroluminescent, chemiluminescent, materials containing inorganic luminescent materials containing selenium, tellurium or unspecified chalcogen elements
C03C 3/091 - Glass compositions containing silica with 40% to 90% silica by weight containing boron containing aluminium
C03B 5/173 - Apparatus for changing the composition of the molten glass in glass furnaces, e.g. for colouring the molten glass
C03C 4/00 - Compositions for glass with special properties
Electronic devices are produced from dielectric compositions comprising a mixture of precursor materials that, upon firing, forms a dielectric material comprising a barium-titanium-tungsten-silicon oxide.
C04B 35/495 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates
C04B 35/622 - Forming processesProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products
C04B 35/626 - Preparing or treating the powders individually or as batches
C04B 35/63 - Preparing or treating the powders individually or as batches using additives specially adapted for forming the products
C04B 35/01 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides
B05D 5/12 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
C03B 19/06 - Other methods of shaping glass by sintering
C03C 4/14 - Compositions for glass with special properties for electro-conductive glass
C03C 8/20 - Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill additions containing titanium compoundsGlass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill additions containing zirconium compounds
C03C 10/00 - Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
H03H 1/00 - Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
H03H 3/00 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
A fired hybrid enamel coating is provided. The hybrid enamel coating is formed by firing an enamel composition on a substrate. The enamel composition includes at least a first glass frit, which is sintered to form the hybrid enamel coating. The hybrid enamel coating can be cleaned using aqualytic or pyrolytic cleaning methods, and does not discolor or lose gloss when subject to typical pyrolytic cleaning methods. The hybrid enamel coating does not require the application of highly caustic cleaners to remove the baked-on soils.
C03C 8/08 - Frit compositions, i.e. in a powdered or comminuted form containing phosphorus
C03C 8/04 - Frit compositions, i.e. in a powdered or comminuted form containing zinc
C03C 8/22 - EnamelsGlazesFusion seal compositions being frit compositions having non-frit additions containing two or more distinct frits having different compositions
C23D 5/00 - Coating with enamels or vitreous layers
C03C 4/00 - Compositions for glass with special properties
C03C 8/14 - Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill additions
F24C 15/00 - DOMESTIC STOVES OR RANGESDETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION Details
C03C 3/062 - Glass compositions containing silica with less than 40% silica by weight
C03C 3/064 - Glass compositions containing silica with less than 40% silica by weight containing boron
C03C 4/02 - Compositions for glass with special properties for coloured glass
39.
Slurry composition and additives and method for polishing organic polymer-based ophthalmic substrates
The present invention provides a slurry composition and method for polishing organic polymer-based ophthalmic substrates. The slurry composition according to the invention includes an aqueous dispersion of abrasive particles and one of a polyvinyl alcohol compound, and a tertiary amide functionalized compound. The abrasive particles can be alumina, zirconia, silica, titania, ceria, spinel or combinations of the foregoing.
B24B 13/00 - Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other workAccessories therefor
C09G 1/02 - Polishing compositions containing abrasives or grinding agents
B24B 37/24 - Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
G02B 1/04 - Optical elements characterised by the material of which they are madeOptical coatings for optical elements made of organic materials, e.g. plastics
40.
SLURRY COMPOSITION AND METHOD OF SELECTIVE SILICA POLISHING
An acidic slurry composition for use in chemical-mechanical polishing including an acid pH adjuster and a cationic polishing suppressant comprising a quaternized aromatic heterocycle. The quaternized aromatic heterocycle imparts a polishing selectivity of silica over crystalline silicon of at least 100.
A passivation glass coating composition is provided for forming a fired passivation glass layer on a semiconductor substrate having p-n junction. The passivation glass coating composition includes a glass component that is lead free, cadmium free, alkali metal oxides free, and colored transition metal oxides (i.e. metal oxides of V, Fe, Co, Ni, Cr, Cu, Mn) free. The glass component includes bismuth based glasses, and provides a firing temperature range of 500°C to 900°C, and controlled devitrification. Once fired to a semiconductor device, the fired passivation glass layer provides exceptional device performance including no cracking of the fired passivation glass layer, excellent thermal expansion matching to silicon, good chemical resistance to acid and base, and improved device performance.
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
C03C 8/24 - Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metalGlass solders
C03C 3/066 - Glass compositions containing silica with less than 40% silica by weight containing boron containing zinc
C03C 3/093 - Glass compositions containing silica with 40% to 90% silica by weight containing boron containing aluminium containing zinc or zirconium
42.
Low-K and mid-K LTCC dielectric compositions and devices
LTCC devices are produced from dielectric compositions comprising a mixture of precursor materials that, upon firing, forms a dielectric material comprising a barium-tungsten-silicon host.
C04B 35/495 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates
C04B 35/626 - Preparing or treating the powders individually or as batches
A conductive paste is provided for forming conductive traces on substrates. The conductive paste includes a vehicle and conductive material. The vehicle includes a resin, a plasticizer, and a solvent in which the resin is dissolved. After application to a substrate, the conductive paste is cured at ambient temperature by evaporation of the solvent from the paste, to thereby form a conductive trace on the substrate. The conductive trace does not require a curing agent, and attains low resistivity within minutes of application to the substrate.
C09D 5/38 - Paints containing free metal not provided for in groups
C09D 129/14 - Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
B05D 5/12 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
01 - Chemical and biological materials for industrial, scientific and agricultural use
02 - Paints, varnishes, lacquers
16 - Paper, cardboard and goods made from these materials
17 - Rubber and plastic; packing and insulating materials
Goods & Services
Chemical substances; chemical materials; chemical preparations; natural elements; ceramic compositions for sintering [granules and powders]; metal oxide powders for industrial purposes; chemical preparations in the form of powders including energy absorbing materials, glass powders, ceramic powders and/or metal oxide powders to allow marking by laser on glass; chemical preparations in the form of powders including energy absorbing materials, glass powders, ceramic powders and/or metal oxide powders to allow marking by laser on ceramic; chemical preparations in the form of powders including energy absorbing materials, glass powders, ceramic powders and/or metal oxide powders to allow marking by laser on metal; chemical preparations in the form of powders including energy absorbing materials, glass powders, ceramic powders and/or metal oxide powders to allow marking by laser on polymer; chemical preparations in the form of powders including energy absorbing materials, glass powders, ceramic powders and/or metal oxide powders to allow marking by laser on composite material surfaces; chemical preparations in the form of powders including energy absorbing materials, glass powders, ceramic powders and/or metal oxide powders to allow marking by laser on sanitary ware; chemical preparations in the form of powders including energy absorbing materials, glass powders, ceramic powders and/or metal oxide powders to allow marking by laser on dinner ware; chemical preparations in the form of powders including energy absorbing materials, glass powders, ceramic powders and/or metal oxide powders to allow marking by laser on automotive parts; chemical preparations in the form of powders including energy absorbing materials, glass powders, ceramic powders and/or metal oxide powders to allow marking by laser on train parts; chemical preparations in the form of powders including energy absorbing materials, glass powders, ceramic powders and/or metal oxide powders to allow marking by laser on aerospace parts; chemical preparations in the form of powders including energy absorbing materials, glass powders, ceramic powders and/or metal oxide powders to allow marking by laser on medical devices; chemical preparations in the form of powders including energy absorbing materials, glass powders, ceramic powders and/or metal oxide powders to allow marking by laser on oil drilling parts; chemical preparations in the form of powders including energy absorbing materials, glass powders, ceramic powders and/or metal oxide powders to allow marking by laser on gas drilling parts; chemical preparations in the form of powders including energy absorbing materials, glass powders, ceramic powders and/or metal oxide powders to allow marking by laser on machine parts; chemical preparations in the form of powders including energy absorbing materials, glass powders, ceramic powders and/or metal oxide powders to allow marking by laser on electronic devices; chemical preparations in the form of powders including energy absorbing materials, glass powders, ceramic powders and/or metal oxide powders to allow marking by laser on semi-conductors; chemical preparations in the form of powders including energy absorbing materials, glass powders, ceramic powders and/or metal oxide powders to allow marking by laser on automotive glass; chemical preparations in the form of powders including energy absorbing materials, glass powders, ceramic powders and/or metal oxide powders to allow marking by laser on architectural glass; chemical preparations in the form of powders including energy absorbing materials, glass powders, ceramic powders and/or metal oxide powders to allow marking by laser on container glass; chemical preparations in the form of powders including energy absorbing materials, glass powders, ceramic powders and/or metal oxide powders to allow marking by laser on pharmaceutical glass; chemical preparations in the form of powders including energy absorbing materials, glass powders, ceramic powders and/or metal oxide powders to allow marking by laser on power tools; chemical preparations in the form of powders including energy absorbing materials, glass powders, ceramic powders and/or metal oxide powders to allow marking by laser on hand tools. Dyes; colorants; pigments; inks; coatings; thermographic ink including chemicals containing energy absorbing enhancers to allow marking by laser on glass; thermographic ink including chemicals containing energy absorbing enhancers to allow marking by laser on ceramic; thermographic ink including chemicals containing energy absorbing enhancers to allow marking by laser on metal; thermographic ink including chemicals containing energy absorbing enhancers to allow marking by laser on polymer; thermographic ink including chemicals containing energy absorbing enhancers to allow marking by laser on composite material surfaces; powder coatings for application by spray; sprayable coating compositions including energy absorbing materials to allow marking by laser; toner contained in cartridges; toner cartridges featuring chemicals containing energy absorbing enhancers to allow marking by laser on glass; toner cartridges featuring chemicals containing energy absorbing enhancers to allow marking by laser on ceramic; toner cartridges featuring chemicals containing energy absorbing enhancers to allow marking by laser on metal; toner cartridges featuring chemicals containing energy absorbing enhancers to allow marking by laser on polymer; toner cartridges featuring chemicals containing energy absorbing enhancers to allow marking by laser on composite material surfaces; filled ink jet cartridges; filled ink jet cartridges featuring chemicals containing energy absorbing enhancers to allow marking by laser of identification markings on surfaces for use on sanitary ware; filled ink jet cartridges featuring chemicals containing energy absorbing enhancers to allow marking by laser of identification markings on surfaces for use on dinner ware; filled ink jet cartridges featuring chemicals containing energy absorbing enhancers to allow marking by laser of identification markings on surfaces for use on automotive parts; filled ink jet cartridges featuring chemicals containing energy absorbing enhancers to allow marking by laser of identification markings on surfaces for use on train parts; filled ink jet cartridges featuring chemicals containing energy absorbing enhancers to allow marking by laser of identification markings on surfaces for use on aerospace parts; filled ink jet cartridges featuring chemicals containing energy absorbing enhancers to allow marking by laser of identification markings on surfaces for use on medical devices; filled ink jet cartridges featuring chemicals containing energy absorbing enhancers to allow marking by laser of identification markings on surfaces for use on oil drilling parts; filled ink jet cartridges featuring chemicals containing energy absorbing enhancers to allow marking by laser of identification markings on surfaces for use on gas drilling parts; filled ink jet cartridges featuring chemicals containing energy absorbing enhancers to allow marking by laser of identification markings on surfaces for use on machine parts; filled ink jet cartridges featuring chemicals containing energy absorbing enhancers to allow marking by laser of identification markings on surfaces for use on electronic consumer devices; filled ink jet cartridges featuring chemicals containing energy absorbing enhancers to allow marking by laser of identification markings on surfaces for use on semi-conductors; filled ink jet cartridges featuring chemicals containing energy absorbing enhancers to allow marking by laser of identification markings on surfaces for use on automotive glass; filled ink jet cartridges featuring chemicals containing energy absorbing enhancers to allow marking by laser of identification markings on surfaces for use on architectural glass; filled ink jet cartridges featuring chemicals containing energy absorbing enhancers to allow marking by laser of identification markings on surfaces for use on container glass; filled ink jet cartridges featuring chemicals containing energy absorbing enhancers to allow marking by laser of identification markings on surfaces for use on pharmaceutical glass; filled ink jet cartridges featuring chemicals containing energy absorbing enhancers to allow marking by laser of identification markings on surfaces for use on power tools; filled ink jet cartridges featuring chemicals containing energy absorbing enhancers to allow marking by laser of identification markings on surfaces for use on hand tools. Paper tapes including chemicals containing energy absorbing materials to allow marking by laser on surfaces for industrial and commercial use. Unprocessed and semi-processed materials included in the class, not specified for use; plastics materials in the form of tapes [semi-finished products]; plastic including chemicals containing energy absorbing materials to allow marking by laser on surfaces for industrial and commercial use; polymer films for use in manufacture; polymer films including chemicals containing energy absorbing enhancers to allow marking by laser of identification markings on glass; polymer films including chemicals containing energy absorbing enhancers to allow marking by laser of identification markings on ceramic; polymer films including chemicals containing energy absorbing enhancers to allow marking by laser of identification markings on metal; polymer films including chemicals containing energy absorbing enhancers to allow marking by laser of identification markings on polymer; polymer films including chemicals containing energy absorbing enhancers to allow marking by laser of identification markings on composite material surfaces; polymer films including chemicals containing energy absorbing enhancers to allow marking by laser of identification markings on sanitary ware; polymer films including chemicals containing energy absorbing enhancers to allow marking by laser of identification markings on dinner ware; polymer films including chemicals containing energy absorbing enhancers to allow marking by laser of identification markings on automotive parts; polymer films including chemicals containing energy absorbing enhancers to allow marking by laser of identification markings on train parts; polymer films including chemicals containing energy absorbing enhancers to allow marking by laser of identification markings on aerospace parts; polymer films including chemicals containing energy absorbing enhancers to allow marking by laser of identification markings on medical devices; polymer films including chemicals containing energy absorbing enhancers to allow marking by laser of identification markings on oil drilling parts; polymer films including chemicals containing energy absorbing enhancers to allow marking by laser of identification markings on gas drilling parts; polymer films including chemicals containing energy absorbing enhancers to allow marking by laser of identification markings on machine parts; polymer films including chemicals containing energy absorbing enhancers to allow marking by laser of identification markings on electronic consumer devices; polymer films including chemicals containing energy absorbing enhancers to allow marking by laser of identification markings on semi-conductors; polymer films including chemicals containing energy absorbing enhancers to allow marking by laser of identification markings on automotive glass; polymer films including chemicals containing energy absorbing enhancers to allow marking by laser of identification markings on architectural glass; polymer films including chemicals containing energy absorbing enhancers to allow marking by laser of identification markings on container glass; polymer films including chemicals containing energy absorbing enhancers to allow marking by laser of identification markings on pharmaceutical glass; polymer films including chemicals containing energy absorbing enhancers to allow marking by laser of identification markings on power tools; polymer films including chemicals containing energy absorbing enhancers to allow marking by laser of identification markings on hand tools.
Electronic devices are produced from dielectric compositions comprising a mixture of precursor materials that, upon firing, forms a dielectric material comprising a barium-strontium-titanium-tungsten-silicon oxide.
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
B05D 5/12 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
C04B 35/00 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products
C04B 35/01 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides
C03B 19/06 - Other methods of shaping glass by sintering
C04B 35/626 - Preparing or treating the powders individually or as batches
C04B 35/63 - Preparing or treating the powders individually or as batches using additives specially adapted for forming the products
C03C 8/20 - Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill additions containing titanium compoundsGlass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill additions containing zirconium compounds
C03C 10/00 - Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
C03C 4/14 - Compositions for glass with special properties for electro-conductive glass
H03H 1/00 - Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
H03H 3/00 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
46.
SINTERING AID GLASSES FOR MACHINABLE PHYLLOSILICATE BASED STRUCTURES
A sintered machinable glass-ceramic is provided. The machinable glass-ceramic is formed by mixing phyllosilicate material having a sheet structure, with a glass frit and firing the mixture at relatively low temperatures to sinter the phyllosilicate, while maintaining the sheet-like morphology of the phyllosilicate and its associated cleaving properties. The sintered machinable glass-ceramic can be machined with conventional metal working tools and includes the electrical properties of the phyllosilicate. Producing the sintered machinable glass-ceramic does not require the relatively high- temperature bulk nucleation and crystallization needed to form sheet phyllosilicate phases in situ.
Modified copper chromite spinel pigments exhibit lower coefficients of thermal expansion than unmodified structures. Three methods exist to modify the pigments: (1 ) the incorporation of secondary modifiers into the pigment core composition, (2) control of the pigment firing profile, including both the temperature and the soak time, and (3) control of the pigment core composition.
C04B 35/49 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on zirconium or hafnium oxides or zirconates or hafnates containing also titanium oxide or titanates
B28B 11/12 - Apparatus or processes for treating or working the shaped articles for removing parts of the articles by cutting
C04B 35/622 - Forming processesProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products
The present invention is directed to a coated bismuth oxy halide-based pigment having a coating comprising an antioxidant, said antioxidant is being a phenol based, a phosphite or phosphonate based, or a thioether based stabilizer, and the coating comprising an inner coating and an outer coating, wherein the outer coating comprises the antioxidant, and wherein the inner coating comprises a first layer consisting of one or more salts, or one or more oxides, heteropolyacids, organic acids, sulphites, sulfides, sulfates, phosphates, pyrophosphates, polyphosphates, hydrates, carbonates, or a combination thereof, selected from the group of alkali-earth metals, metals, non-metals, transition metals or lanthanides. Further, the present invention is directed to a composition comprising a paint, a lacquer, an ink, a cosmetic, a resin, a plastisol or a polymer formulation, and such pigment. In addition, the present invention is directed to a method for manufacturing a coated bismuth oxy halide-based pigment, said method comprising the steps of: - providing a dispersion of a bismuth oxy halide-based pigment, - adding a dispersion of an antioxidant, - mixing and drying.
C09C 1/00 - Treatment of specific inorganic materials other than fibrous fillers Preparation of carbon black
A61K 8/02 - Cosmetics or similar toiletry preparations characterised by special physical form
C09D 5/29 - Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects producedFilling pastes for multicolour effects
A method for manufacturing an azoic pigment is disclosed, according to an illustrative embodiment of the present invention. The method includes producing slurry of the azoic pigment. The slurry includes primary aromatic amine (PAA). The method further includes the derivatization of the residual PAA in the slurry, followed by encapsulation of the slurry. The slurry is acidified or basified. Finally, the slurry is further processed, thereby forming PAA migration free azoic pigment. The derivatization and encapsulation additively or synergistically reduce the PAA content thereby inhibiting migration of PAA from the pigment into a substrate onto which the pigment is loaded.
LTCC devices are produced from dielectric compositions comprising a mixture of precursor materials that, upon firing, forms a dielectric material comprising a matrix of titanates of alkaline earth metals, the matrix doped with at least one selected from rare-earth element, aluminum oxide, silicon oxide and bismuth oxide.
C04B 35/465 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates
C04B 35/626 - Preparing or treating the powders individually or as batches
C04B 35/478 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on titanium oxides or titanates based on titanates based on aluminium titanates
C04B 35/475 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on titanium oxides or titanates based on titanates based on bismuth titanates
C04B 35/468 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates
C04B 35/453 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on zinc, tin or bismuth oxides or solid solutions thereof with other oxides, e.g. zincates, stannates or bismuthates
C04B 35/22 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on silicates other than clay rich in calcium oxide
C04B 35/16 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on silicates other than clay
C04B 35/195 - Alkaline earth aluminosilicates, e.g. cordierite
C04B 35/18 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on silicates other than clay rich in aluminium oxide
C04B 35/622 - Forming processesProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products
A fired hybrid enamel coating is provided. The hybrid enamel coating is formed by firing an enamel composition on a substrate. The enamel composition includes at least a first glass frit, which is sintered to form the hybrid enamel coating. The hybrid enamel coating can be cl3eaned using aqualytic or pyrolytic cleaning methods, and does not discolor or lose gloss when subject to typical pyrolytic cleaning methods. The hybrid enamel coating does not require the application of highly caustic cleaners to remove the baked-on soils
A fired hybrid enamel coating is provided. The hybrid enamel coating is formed by firing an enamel composition on a substrate. The enamel composition includes at least a first glass frit, which is sintered to form the hybrid enamel coating. The hybrid enamel coating can be cl3eaned using aqualytic or pyrolytic cleaning methods, and does not discolor or lose gloss when subject to typical pyrolytic cleaning methods. The hybrid enamel coating does not require the application of highly caustic cleaners to remove the baked-on soils
A CMP slurry composition which provides for a high Ge- or SiGe-to-dielectric material selectivity a low rate of Ge or SiGe recess formation includes an oxidant and a germanium removal rate enhancer including at least one of a methylpyridine compound and a methylpyridine derivative compound. In some examples, the slurry composition also includes an etching inhibitor. In some cases, the slurry composition may include an abrasive, a surfactant, an organic complexant, a chelating agent, an organic or inorganic acid, an organic or inorganic base, a corrosion inhibitor, or a buffer. The slurry composition may be distributed onto a surface of a polishing pad disposed on a platen that is configured to rotate. Additionally, a workpiece carrier configured to house a substrate may bring the substrate into contact with the rotating polishing pad and thereby polish the substrate utilizing the slurry composition.
C09G 1/02 - Polishing compositions containing abrasives or grinding agents
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/306 - Chemical or electrical treatment, e.g. electrolytic etching
Silver pastes including two powders having different physical properties and silver flakes together with glass frits and pigments impart improved thermal stress characteristics to substrates upon firing.
H01B 1/16 - Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
C03C 8/18 - Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill additions containing free metals
C03C 8/04 - Frit compositions, i.e. in a powdered or comminuted form containing zinc
C03C 3/089 - Glass compositions containing silica with 40% to 90% silica by weight containing boron
C03C 3/066 - Glass compositions containing silica with less than 40% silica by weight containing boron containing zinc
C03C 4/14 - Compositions for glass with special properties for electro-conductive glass
C03C 17/04 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating with glass by fritting glass powder
The present invention relates to the field of forehearth frits, pearls, and/or concentrates for use in glass compositions. In particular, the present invention provides a system of forehearth frits, pearls, and/or concentrates that is capable of imparting a fluorescent effect to a glass composition by adding a fluorescent glass frit, pearl or concentrate in the forehearth of a glass furnace, to form fluorescent glass and a method of using the fluorescent system of forehearth frits, pearls, and/or concentrates.
Electronic devices are produced from dielectric compositions comprising a mixture of precursor materials that, upon firing, forms a dielectric material comprising a barium-strontium-titanium-tungsten-silicon oxide.
The invention relates to the field of forehearth frits, pearls, and/or concentrates for use in glass compositions. In particular, the present invention provides a system of forehearth frits, pearls, and/or concentrates that is capable of imparting a brown color to a glass composition for forming colored glass in the forehearth of a glass furnace, and a method of using the colored system of forehearth frits, pearls, and/or concentrates. The invention further provides a glass composition for use in forming the color system or for use directly in a forehearth.
C03C 3/089 - Glass compositions containing silica with 40% to 90% silica by weight containing boron
C03C 3/093 - Glass compositions containing silica with 40% to 90% silica by weight containing boron containing aluminium containing zinc or zirconium
C03C 8/22 - EnamelsGlazesFusion seal compositions being frit compositions having non-frit additions containing two or more distinct frits having different compositions
Electronic devices are produced from dielectric compositions comprising a mixture of precursor materials that, upon firing, forms a dielectric material comprising a barium-titanium-tungsten-silicon oxide.
C04B 35/468 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates
Multilayer ceramic chip capacitors which satisfy COG requirements and which are compatible with reducing atmosphere sintering conditions so that non-noble metals such as nickel and nickel alloys thereof may be used for internal and external electrodes are made in accordance with the invention. The capacitors exhibit desirable dielectric properties (high capacitance, low dissipation factor, high insulation resistance), excellent performance on highly accelerated life testing, and very good resistance to dielectric breakdown. The dielectric layers comprise a barium strontium zirconate matrix doped with other metal oxides such as TiO2, CaO, B2O3, and MgO in various combinations.
C04B 35/49 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on zirconium or hafnium oxides or zirconates or hafnates containing also titanium oxide or titanates
Heavy-metal-free glass enamels are applied to glass and fired. After firing, the coated glass can subsequently be ion exchanged to give a chemically strengthened, decorated glass article.
C03C 21/00 - Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals into the surface
C03C 17/04 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating with glass by fritting glass powder
63.
SLURRY COMPOSITION AND ADDITIVES AND METHOD FOR POLISHING ORGANIC POLYMER-BASED OPHTHALMIC SUBSTRATES
The present invention provides a slurry composition and method for polishing organic polymer-based ophthalmic substrates. The slurry composition according to the invention includes an aqueous dispersion of abrasive particles and one of a polyvinyl alcohol compound, and a tertiary amide functionalized compound. The abrasive particles can be alumina, zirconia, silica, titania, ceria, spinel or combinations of the foregoing.
G02B 1/04 - Optical elements characterised by the material of which they are madeOptical coatings for optical elements made of organic materials, e.g. plastics
Copper oxide particles having particular starting size and surface area characteristics can be processed by heat and milling to achieve sizes and particle size distributions that give the copper oxide properties as an infrared reflective pigment without addition of other metals or oxides.
A chemical mechanical polishing slurry for polishing a stainless steel substrate is provided, which comprises a content 10˜50 wt % of abrasive particles, a content 0.001˜2.0 wt % of a coolant, a content 0.001˜1.0 wt % of an oxidant, a content 10˜5000 ppm of a lubricity improver, and a content 10˜5000 ppm of a foam inhibitor. A particle size of the abrasive particles is in a range of 20˜500 nm. The alkaline polishing slurry according to the present invention is capable of increasing the polishing performance, surface quality, and surface passivation effect after the chemical-mechanical polishing process.
The present disclosure relates to a method of performing a chemical mechanical planarization (CMP) process with a high germanium-to-oxide removal selectivity and a low rate of germanium recess formation. The method is performed by providing a semiconductor substrate having a plurality of germanium compound regions including germanium interspersed between a plurality of oxide regions including an oxide. A slurry is then provided onto the semiconductor substrate. The slurry has an oxidant and an etching inhibitor configured to reduce a removal rate of the germanium relative to the oxide. A CMP process is then performed by bringing a chemical mechanical polishing pad in contact with top surfaces of the plurality of germanium compound regions and the plurality of oxide regions.
LTCC devices are produced from dielectric compositions comprising a mixture of precursor materials that, upon firing, forms a dielectric material comprising a barium-tungsten-silicon host.
C04B 35/495 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates
C04B 35/48 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on zirconium or hafnium oxides or zirconates or hafnates
C04B 35/49 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on zirconium or hafnium oxides or zirconates or hafnates containing also titanium oxide or titanates
C04B 35/491 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on zirconium or hafnium oxides or zirconates or hafnates containing also titanium oxide or titanates based on lead zirconates and lead titanates
The glass composites include glass frit, that when sintered produce a phosphor-containing layer, suitable for use in optical applications. The glass composites can include a crystallizing glass frit, such that phosphor crystals precipitate from the frit composite during sintering, or can include a non-crystallizing glass composition, such that phosphor is added to the frit composite before sintering. The sintering temperatures of the glass are relatively low so that fluorescence of the phosphors will not substantially degrade during sintering. The resulting phosphor-containing layer can be used in various optical applications including those for converting blue light into various color temperatures of white light.
C03C 3/093 - Glass compositions containing silica with 40% to 90% silica by weight containing boron containing aluminium containing zinc or zirconium
C03C 3/095 - Glass compositions containing silica with 40% to 90% silica by weight containing rare earths
C03C 4/12 - Compositions for glass with special properties for luminescent glassCompositions for glass with special properties for fluorescent glass
C03C 8/04 - Frit compositions, i.e. in a powdered or comminuted form containing zinc
C03C 8/14 - Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill additions
C03C 10/00 - Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
C03C 14/00 - Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
H01L 51/52 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED) - Details of devices
70.
GRAIN BOUNDARY HEALING GLASSES AND THEIR USE IN TRANSPARENT ENAMELS, TRANSPARENT COLORED ENAMELS AND OPAQUE ENAMELS
A method of modifying glass frit involves treating the frit with a grain-boundary- healing compound. The method increases transmission and clarity, and reduces haze of a fired enamel coating made from such modified glass frit as compared to a coating not made from such modified glass frit. The grain-boundary-healing compound influences the chemistry at the grain boundaries to prevent haze. The compound burns out to yield a fluxing material that dissolves alkaline carbonates or bicarbonates on the surface of the glass frit. The dissolved species are incorporated into the enamel coating, thereby promoting the fusion of the glass frit and reducing the amount of haze in the enamel coating. The additives also function to prevent the formation of seed crystals on the surface of the glass frit that may inhibit the fusion of the glass frit.
Various laser marking compositions and related methods are described. The laser marking compositions include a molybdenum metal complex, a tungsten metal complex, or combinations thereof. Marks or other indicia formed on a substrate using the compositions and methods exhibit increased contrast and improved substrate bonding.
B32B 3/00 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form
B05D 3/06 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
A multi-layer glass enamel is disclosed. The various layers of the enamel are included to provide certain performance characteristics to the enamel. The components of each layer can be individually adjusted to tailor the performance characteristics influenced by that layer without changing the influence of the remaining layers.
B32B 9/00 - Layered products essentially comprising a particular substance not covered by groups
B32B 17/06 - Layered products essentially comprising sheet glass, or fibres of glass, slag or the like comprising glass as the main or only constituent of a layer, next to another layer of a specific substance
C03C 17/04 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating with glass by fritting glass powder
C03C 3/062 - Glass compositions containing silica with less than 40% silica by weight
C03C 3/066 - Glass compositions containing silica with less than 40% silica by weight containing boron containing zinc
C03C 3/089 - Glass compositions containing silica with 40% to 90% silica by weight containing boron
C03C 8/04 - Frit compositions, i.e. in a powdered or comminuted form containing zinc
C03C 8/06 - Frit compositions, i.e. in a powdered or comminuted form containing halogen
C03C 8/14 - Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill additions
C03C 8/18 - Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill additions containing free metals
C03C 8/20 - Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill additions containing titanium compoundsGlass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill additions containing zirconium compounds
C03C 17/34 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
C23D 5/00 - Coating with enamels or vitreous layers
C03C 17/36 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
High thermal conductivity dielectric materials systems or pastes are useful on aluminum alloy substrates for LED and high power circuitry applications.
H01B 3/08 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of inorganic substances quartzInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of inorganic substances glassInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of inorganic substances glass woolInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of inorganic substances slag woolInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of inorganic substances vitreous enamels
H05K 3/20 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
C03C 3/097 - Glass compositions containing silica with 40% to 90% silica by weight containing phosphorus, niobium or tantalum
C03C 8/08 - Frit compositions, i.e. in a powdered or comminuted form containing phosphorus
C03C 8/14 - Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill additions
The present subject matter provides for a multi-layer conductive trace. The trace can be formed by digital printing the individual layers and firing. The individual layers each impart functional characteristics to the conductive trace and each layer has components that can be adjusted to affect the performance characteristics of that particular layer without detrimentally affecting the performance characteristics of the remaining layers.
H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
A CMP slurry composition which provides for a high Ge- or SiGe-to-dielectric material selectivity a low rate of Ge or SiGe recess formation includes an oxidant and a germanium removal rate enhancer including at least one of a methylpyridine compound and a methylpyridine derivative compound. In some examples, the slurry composition also includes an etching inhibitor. In some cases, the slurry composition may include an abrasive, a surfactant, an organic complexant, a chelating agent, an organic or inorganic acid, an organic or inorganic base, a corrosion inhibitor, or a buffer. The slurry composition may be distributed onto a surface of a polishing pad disposed on a platen that is configured to rotate. Additionally, a workpiece carrier configured to house a substrate may bring the substrate into contact with the rotating polishing pad and thereby polish the substrate utilizing the slurry composition.
H01L 21/302 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
H01L 21/306 - Chemical or electrical treatment, e.g. electrolytic etching
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
Solder can be used to wet and bind glass substrates together to ensure a hermetic seal that superior (less penetrable) than conventional polymeric (thermoplastic or thermoplastic elastomer) seals in electric and electronic applications.
B23K 31/02 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to soldering or welding
B23K 1/00 - Soldering, e.g. brazing, or unsoldering
H01L 23/10 - ContainersSeals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
B23K 1/19 - Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
H01L 51/52 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED) - Details of devices
LTCC devices are produced from dielectric compositions comprising a mixture of precursor materials that, upon firing, forms a dielectric material comprising a matrix of titanates of alkaline earth metals, the matrix doped with at least one selected from rare- earth element, aluminum oxide, silicon oxide and bismuth oxide.
C04B 35/468 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates
A green pigment is a blend of metal oxides including a [124] spinel which can contain certain combinations of lithium, sodium, cobalt, zinc, calcium, magnesium, copper, titanium, manganese, tin, and germanium, and a [134] spinel which can contain certain combinations of lithium, sodium, chromium, boron, iron, manganese aluminum, titanium, tin and germanium. The pigment lacks nickel.
Methods of making multilayer glass structure are described. The method involves providing first and second glass sheets, and a first enamel composition layer and at least one separation layer between the first and second glass sheets, and firing the glass sheets to sinter the first enamel composition to the first glass sheet. The separation layer is a black pigment separation layer, a refractory material separation layer, or an oxidizer separation layer. The separation layer can improve separation of the first and second glass sheets after the firing.
B32B 17/06 - Layered products essentially comprising sheet glass, or fibres of glass, slag or the like comprising glass as the main or only constituent of a layer, next to another layer of a specific substance
B32B 17/10 - Layered products essentially comprising sheet glass, or fibres of glass, slag or the like comprising glass as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
C03B 19/06 - Other methods of shaping glass by sintering
C03C 17/04 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating with glass by fritting glass powder
C03B 23/025 - Re-forming glass sheets by bending by gravity
81.
CONDUCTIVE PASTE WITH IMPROVED PERFORMANCE IN GLASS STRENGTH
Silver pastes including two powders having different physical properties and silver flakes together with glass frits and pigments impart improved thermal stress characteristics to substrates upon firing.
Copper oxide particles having particular starting size and surface area characteristics can be processed by heat and milling to achieve sizes and particle size distributions that give the copper oxide properties as an infrared reflective pigment without addition of other metals or oxides.
01 - Chemical and biological materials for industrial, scientific and agricultural use
02 - Paints, varnishes, lacquers
Goods & Services
Chemicals used in industry, science and photography, as well
as in agriculture, horticulture and forestry; unprocessed
artificial resins, unprocessed plastics; manures; fire
extinguishing compositions; tempering and soldering
preparations; chemical substances for preserving foodstuffs;
tanning substances; adhesives used in industry. Paints, varnishes, lacquers; preservatives against rust and
against deterioration of wood; colorants; mordants; raw
natural resins; metals in foil and powder form for painters,
decorators, printers and artists.
The present subject matter provides a transitional layer and related methods, used to increase the transmission or reflection of light between two mediums having different indices of refraction. The transitional layer is disposed between the two mediums and the transmission or reflection of light is increased by the interaction of light with the transitional layer. The transitional layer has light scattering particles dispersed therein, a single-layer gradient index-of-refraction, a multi-layer gradient index-of-refraction, alternating layers of high and low index-of-refraction, or a combination thereof, in order to increase the transmission or reflectance of light between the two mediums.
C03C 17/00 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating
C03C 17/04 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating with glass by fritting glass powder
C03C 17/34 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
01 - Chemical and biological materials for industrial, scientific and agricultural use
02 - Paints, varnishes, lacquers
Goods & Services
Chemicals used in industry, science and photography, as well
as in agriculture, horticulture and forestry; unprocessed
artificial resins, unprocessed plastics; manures; fire
extinguishing compositions; tempering and soldering
preparations; chemical substances for preserving foodstuffs;
tanning substances; adhesives used in industry. Paints, varnishes, lacquers; preservatives against rust and
against deterioration of wood; colorants; mordants; raw
natural resins; metals in foil and powder form for painters,
decorators, printers and artists.
86.
Chemical mechanical polishing method using slurry composition containing N-oxide compound
The present disclosure relates to a chemical mechanical polishing (CMP) slurry composition that provides for a high metal to dielectric material selectivity along with a low rate of metal recess formation. In some embodiments, the disclosed slurry composition has an oxidant and an etching inhibitor. The oxidant has a compound with one or more oxygen molecules. The etching inhibitor has a nitrogen-oxide compound. The etching inhibitor reduces the rate of metal and dielectric material (e.g., oxide) removal, but does so in a manner that reduces the rate of dielectric material removal by a larger amount, so as to provide the slurry composition with a high metal (e.g., germanium) to dielectric material removal selectivity and with a low rate of metal recess formation.
Various laser marking compositions and related methods are described. The laser marking compositions utilize one or more populations of particles having certain average particle sizes or a range of sizes. Marks or other indicia formed using the compositions and methods exhibit increased contrast, improved substrates bonding, and greater dispersability.
C23C 18/06 - Coating on selected surface areas, e.g. using masks
C23C 18/14 - Decomposition by irradiation, e.g. photolysis, particle radiation
B23K 26/06 - Shaping the laser beam, e.g. by masks or multi-focusing
C23C 18/08 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by thermal decomposition characterised by the deposition of metallic material
C23C 18/12 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
C04B 41/50 - Coating or impregnating with inorganic materials
B23K 26/00 - Working by laser beam, e.g. welding, cutting or boring
Multilayer ceramic chip capacitors which satisfy COG requirements and which are compatible with reducing atmosphere sintering conditions so that non-noble metals such as nickel and nickel alloys may be used for internal and external electrodes are disclosed. The capacitors exhibit desirable dielectric properties (high capacitance, low dissipation factor, high insulation resistance), excellent performance on highly accelerated life testing, and very good resistance to dielectric breakdown. The dielectric layers comprise a strontium zirconate matrix doped with other metal oxides such as TiO2, MgO, B2O3, CaO, MnO, Nd2O3 and Nb2O5 in various combinations.
C04B 35/49 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on zirconium or hafnium oxides or zirconates or hafnates containing also titanium oxide or titanates
High thermal conductivity dielectric materials systems or pastes are useful on aluminum alloy substrates for LED and high power circuitry applications.
H01B 3/08 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of inorganic substances quartzInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of inorganic substances glassInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of inorganic substances glass woolInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of inorganic substances slag woolInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of inorganic substances vitreous enamels
01 - Chemical and biological materials for industrial, scientific and agricultural use
02 - Paints, varnishes, lacquers
03 - Cosmetics and toiletries; cleaning, bleaching, polishing and abrasive preparations
17 - Rubber and plastic; packing and insulating materials
Goods & Services
Chemicals used in industry and general industrial manufacture; chemicals for use in the manufacture of electrical and electronic components; chemicals used in the manufacture of ceramic glazes, porcelain enamels and vitreous enamels; ceramic powders used in manufacturing; basic chrome sulfates; chemical preparations, except pigments, for the manufacture of enamel; color-brightening chemicals for industrial purposes; lead acetate; iron oxides; zinc phosphate; iron phosphate; chromium oxides; wetting agents Organic and inorganic colorants and pigments for use in ceramics, plastics, organic paints and finishes; vitreous enamels; Inks containing metal and/or glass particles for use in producing electronic circuits; glazes; pastes containing metal and/or glass particles for use in producing electronic circuits; synthetic resin colors in the nature of color concentrates suspended in plastic resin vehicles; materials for use in forming surface coatings, namely, porcelain enamels and vitreous enamels for use in forming coatings on metal or glass; porcelain enamels, vitreous enamels; colorants; complex inorganic color pigments; ultramarine blue, zinc ferrite spinel, cobalt oxide, chrome yellow, molybdate orange, zinc molybdate, zinc chromate, bismuth vanadate all for use as pigments; colorants for use in the manufacture of plastic molding compounds; corrosion inhibitants in the nature of a coating; anti-corrosive coatings; thick film pastes in the nature of printable paste for use in the manufacture of electrical and electronic components Industrial chemical abrasives for grinding and polishing glass, plastic or metal Dielectric tapes and powders for use in the manufacture of electrical and electronic components
A liquid ester composition includes aryl polyol esters: (a) a first diester of the formula ArC(O)(OCH2CH2)2O(0)CAr, (b) a triester of the formula ArC(O)(OCH2CH(OC(O) ArCH2O(O)CAr, and (c) a second diester of the formula ArC(O)(OCH(R)CH(R)O)n(0)CAr, wherein (d) Ar represents a phenyl radical, and R represents -CH3 or H wherein only 1 of the groups R is a H atom in the triester, and n is 1 to 3, wherein, the weight ratio of the first diester to the triester is 1:1 to 20:1 and wherein the weight ratio of the first diester to the second diester is 1:1 to 3.5:1.
C07C 69/76 - Esters of carboxylic acids having an esterified carboxyl group bound to a carbon atom of a six-membered aromatic ring
C07C 67/08 - Preparation of carboxylic acid esters by reacting carboxylic acids or symmetrical anhydrides with the hydroxy or O-metal group of organic compounds
C08K 5/103 - EstersEther-esters of monocarboxylic acids with polyalcohols
92.
PLASTICIZER MIXTURE OF EPOXIDIZED FATTY ACID GLYCERIN CARBONATE ESTER AND EPOXIDIZED FATTY ACID ESTERS
A process of transesterifying biobased epoxidized vegetable oils with a dialkyl carbonate produces mixtures of epoxidized fatty acid cyclic glycerin carbonate esters and epoxidized fatty acid alkyl esters.
C07D 301/03 - Synthesis of the oxirane ring by oxidation of unsaturated compounds, or of mixtures of unsaturated and saturated compounds
C07D 301/16 - Synthesis of the oxirane ring by oxidation of unsaturated compounds, or of mixtures of unsaturated and saturated compounds with organic peracids, or salts, anhydrides or esters thereof formed in situ, e.g. from carboxylic acids and hydrogen peroxide
The present subject matter provides for a multi-layer conductive trace. The trace can be formed by digital printing the individual layers and firing. The individual layers each impart functional characteristics to the conductive trace and each layer has components that can be adjusted to affect the performance characteristics of that particular layer without detrimentally affecting the performance characteristics of the remaining layers.
H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
H05K 3/38 - Improvement of the adhesion between the insulating substrate and the metal
A multi-layer glass enamel is disclosed. The various layers of the enamel are included to provide certain performance characteristics to the enamel. The components of each layer can be individually adjusted to tailor the performance characteristics influenced by that layer without changing the influence of the remaining layers.
C03C 8/04 - Frit compositions, i.e. in a powdered or comminuted form containing zinc
C03C 8/18 - Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill additions containing free metals
C03C 8/14 - Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill additions
C03C 8/16 - Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill additions with vehicle or suspending agents, e.g. slip
C03C 3/089 - Glass compositions containing silica with 40% to 90% silica by weight containing boron
C03C 3/093 - Glass compositions containing silica with 40% to 90% silica by weight containing boron containing aluminium containing zinc or zirconium
C03C 17/04 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating with glass by fritting glass powder
Compounds useful as plasticizers and the synthesis thereof are disclosed. In general, the invention includes process of esterifying biobased alcohols to make biobased ester plasticizers and the plasticizers made by such processes.
C07D 303/42 - Acyclic compounds having a chain of seven or more carbon atoms, e.g. epoxidised fats
C07C 67/08 - Preparation of carboxylic acid esters by reacting carboxylic acids or symmetrical anhydrides with the hydroxy or O-metal group of organic compounds
C07C 67/10 - Preparation of carboxylic acid esters by reacting carboxylic acids or symmetrical anhydrides with ester groups or with a carbon-halogen bond
C07C 69/608 - Esters of carboxylic acids having a carboxyl group bound to an acyclic carbon atom and having a ring other than a six-membered aromatic ring in the acid moiety
Various laser marking compositions and related methods are described. The laser marking compositions include a molybdenum metal complex, a tungsten metal complex, or combinations thereof. Marks or other indicia formed on a substrate using the compositions and methods exhibit increased contrast and improved substrate bonding.
B32B 3/20 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. apertured or formed of separate pieces of material characterised by an internal layer formed of separate pieces of material of hollow pieces, e.g. tubesLayered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. apertured or formed of separate pieces of material characterised by an internal layer formed of separate pieces of material of pieces with channels or cavities
B23K 26/18 - Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
Heavy-metal-free glass enamels are applied to glass and fired. After firing, the coated glass can subsequently be ion exchanged to give a chemically strengthened, decorated glass article.
C03C 21/00 - Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals into the surface
C03C 17/04 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating with glass by fritting glass powder
Inkjet compositions that can be applied to glass and/or ceramic substrates to impart various effect to the substrate after firing, including: gloss, matt, contrast gloss (luster), specular reflection (metallic appearance), relief and slipperiness. The inkjet compositions include solvents, additives for dispersion, and inorganic substances, but preferably do not include any color-producing ceramic pigments. The inorganic substances contained in the inkjet compositions are the responsible for the above mentioned effects on the surface of the ceramic article. Depending on the type of effect desired, the inorganic substance may be a specific frit, a crystalline oxide, or a combination of frits and crystalline oxides.
An acrylate-based curable printing medium is disclosed. Acrylates, in the form of monomers, dimers, trimers and oligomers, as well as resins, form an interpenetrating polymer network by crosslinking, which is effected by heat, and optionally peroxide curing agents. Formulations can be tailored to achieve desired properties of the cured polymer including film hardness, burnout properties, and adhesion to glass. Such properties are adjusted by manipulating the relative proportions of the acrylic monomers, oligomers and resins that are used as a ceramic medium or vehicle.
C09D 133/10 - Homopolymers or copolymers of methacrylic acid esters
C08F 290/08 - Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
C08F 283/00 - Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass
C03C 17/04 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating with glass by fritting glass powder
C09D 11/101 - Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
C03C 17/32 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating with organic material with synthetic or natural resins
H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
